[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

CN102468423B - 压电元件的制造方法 - Google Patents

压电元件的制造方法 Download PDF

Info

Publication number
CN102468423B
CN102468423B CN201110309740.XA CN201110309740A CN102468423B CN 102468423 B CN102468423 B CN 102468423B CN 201110309740 A CN201110309740 A CN 201110309740A CN 102468423 B CN102468423 B CN 102468423B
Authority
CN
China
Prior art keywords
piezoelectrics
piezoelectric element
burning till
till
polarization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110309740.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN102468423A (zh
Inventor
大西孝生
植谷政之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of CN102468423A publication Critical patent/CN102468423A/zh
Application granted granted Critical
Publication of CN102468423B publication Critical patent/CN102468423B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/04Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
    • H10N30/045Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/05Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/06Forming electrodes or interconnections, e.g. leads or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/08Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/082Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041Beam type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047Membrane type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/88Mounts; Supports; Enclosures; Casings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0603Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a piezoelectric bender, e.g. bimorph
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0688Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0688Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
    • B06B1/0696Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF with a plurality of electrodes on both sides
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00Actuating devices; Operating means; Releasing devices
    • F16K31/004Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
    • F16K31/005Piezoelectric benders
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H2003/022Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the cantilever type
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H2003/023Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the membrane type
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H2003/027Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the microelectro-mechanical [MEMS] type
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/178Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of a laminated structure of multiple piezoelectric layers with inner electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/08Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/42Piezoelectric device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49005Acoustic transducer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49156Manufacturing circuit on or in base with selective destruction of conductive paths
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49789Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798Dividing sequentially from leading end, e.g., by cutting or breaking

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Micromachines (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
CN201110309740.XA 2010-11-11 2011-10-10 压电元件的制造方法 Expired - Fee Related CN102468423B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-253013 2010-11-11
JP2010253013A JP5676216B2 (ja) 2010-11-11 2010-11-11 圧電素子の製造方法

Publications (2)

Publication Number Publication Date
CN102468423A CN102468423A (zh) 2012-05-23
CN102468423B true CN102468423B (zh) 2015-09-30

Family

ID=45047567

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110309740.XA Expired - Fee Related CN102468423B (zh) 2010-11-11 2011-10-10 压电元件的制造方法

Country Status (4)

Country Link
US (1) US9246081B2 (ja)
EP (1) EP2453495A3 (ja)
JP (1) JP5676216B2 (ja)
CN (1) CN102468423B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8981627B2 (en) * 2012-06-04 2015-03-17 Tdk Corporation Piezoelectric device with electrode films and electroconductive oxide film
JP5860980B2 (ja) * 2013-02-01 2016-02-16 株式会社村田製作所 押圧センサ付き表示パネル、および押圧入力機能付き電子機器
CN104069674B (zh) * 2014-06-11 2015-07-15 温州宇丰化纤机械有限公司 一种cpf-pt系列熔体过滤器的清洗方法
CN107078714B (zh) * 2014-10-17 2021-04-20 株式会社村田制作所 压电器件、压电器件的制造方法
WO2016158743A1 (ja) * 2015-03-30 2016-10-06 株式会社村田製作所 マザーの圧電素子及び積層型圧電素子並びに積層型圧電素子の製造方法
US10069061B2 (en) * 2016-06-02 2018-09-04 eLux Inc. Fabrication and harvest of piezoelectric plates
CN109427958A (zh) * 2017-09-05 2019-03-05 王开安 薄膜极化承载组件及薄膜极化设备
CN110467456A (zh) * 2019-09-16 2019-11-19 桂林电子科技大学 一种具有可逆热光调制特性的材料及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1630117A (zh) * 2003-12-16 2005-06-22 松下电器产业株式会社 压电体薄膜装置和压电体薄膜装置的驱动方法
EP1693907A1 (en) * 2005-02-21 2006-08-23 Brother Kogyo Kabushiki Kaisha Piezoelectric actuator and method of producing the same
CN101213680A (zh) * 2005-06-29 2008-07-02 日本碍子株式会社 压电/电致伸缩元件的制造方法
WO2008102481A1 (ja) * 2007-02-21 2008-08-28 Murata Manufacturing Co., Ltd. 圧電共振子の製造方法及び圧電共振子

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5492307A (en) * 1977-12-29 1979-07-21 Sony Corp Driving circuit of electrostrictive converter
DE3585938D1 (de) * 1984-09-26 1992-06-04 Terumo Corp Ultraschallwandler und verfahren zur herstellung desselben.
JPS6484675A (en) * 1987-09-28 1989-03-29 Fuji Rubber Co Ltd Manufacture of piezoelectric element
JP2001068751A (ja) 1999-08-25 2001-03-16 Murata Mfg Co Ltd 圧電アクチュエータ
JP3613140B2 (ja) * 1999-08-26 2005-01-26 株式会社村田製作所 圧電磁器組成物およびそれを用いた圧電セラミック素子
US6953977B2 (en) * 2000-02-08 2005-10-11 Boston Microsystems, Inc. Micromechanical piezoelectric device
JP2004296783A (ja) 2003-03-27 2004-10-21 Kyocera Corp 圧電磁器の分極法及び分極装置
JP2005203750A (ja) * 2003-12-16 2005-07-28 Matsushita Electric Ind Co Ltd 圧電体薄膜装置および圧電体薄膜装置の駆動方法
JP2006203304A (ja) * 2005-01-18 2006-08-03 Hitachi Media Electoronics Co Ltd 圧電薄膜共振器及びそれを用いた発振器並びにそれを内蔵した半導体集積回路
JP2006261656A (ja) * 2005-02-21 2006-09-28 Brother Ind Ltd 圧電アクチュエータおよびその製造方法
EP1865311A4 (en) 2005-03-18 2012-03-14 Ngk Insulators Ltd PIEZOELECTRIC ELEMENT INSPECTION METHOD, INSPECTION DEVICE, AND POLARIZATION PROCESSING METHOD
EP1909340B1 (en) 2005-06-29 2012-10-24 NGK Insulators, Ltd. Piezoelectric/electrostriction film type element
JP4858546B2 (ja) * 2006-12-27 2012-01-18 株式会社村田製作所 圧電バルブ
US8375538B2 (en) * 2009-03-27 2013-02-19 Ngk Insulators, Ltd. Method for manufacturing piezoelectric actuator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1630117A (zh) * 2003-12-16 2005-06-22 松下电器产业株式会社 压电体薄膜装置和压电体薄膜装置的驱动方法
EP1693907A1 (en) * 2005-02-21 2006-08-23 Brother Kogyo Kabushiki Kaisha Piezoelectric actuator and method of producing the same
CN101213680A (zh) * 2005-06-29 2008-07-02 日本碍子株式会社 压电/电致伸缩元件的制造方法
WO2008102481A1 (ja) * 2007-02-21 2008-08-28 Murata Manufacturing Co., Ltd. 圧電共振子の製造方法及び圧電共振子

Also Published As

Publication number Publication date
EP2453495A3 (en) 2014-01-22
EP2453495A2 (en) 2012-05-16
US20120117769A1 (en) 2012-05-17
US9246081B2 (en) 2016-01-26
CN102468423A (zh) 2012-05-23
JP5676216B2 (ja) 2015-02-25
JP2012104715A (ja) 2012-05-31

Similar Documents

Publication Publication Date Title
CN102468423B (zh) 压电元件的制造方法
JP4735840B2 (ja) 圧電体積層体、表面弾性波素子、薄膜圧電共振子および圧電アクチュエータ
EP2579347B1 (en) Piezoelectric device and method of manufacturing piezoelectric device
US10608162B2 (en) Stacked film, electronic device substrate, electronic device, and method of fabricating stacked film
JP5413386B2 (ja) 液体噴射ヘッド、及びこれを備えた記録装置
JP5241087B2 (ja) 圧電体、圧電素子、圧電素子を用いた液体吐出ヘッド、液体吐出装置及び圧電素子の製造方法
JP2014187094A (ja) 圧電体薄膜積層基板、圧電体薄膜素子、およびそれらの製造方法
JP2007088446A (ja) 圧電体、圧電素子、圧電素子を用いた液体吐出ヘッドおよび液体吐出装置
JP2008042191A (ja) 圧電体素子、インクジェットヘッド及び圧電体素子の製造方法
US9240544B2 (en) Method of manufacturing piezoelectric element
JP2009256182A (ja) 圧電/電歪磁器組成物の製造方法
CN107094004A (zh) 声波滤波器和制造该声波滤波器的方法
JP4771649B2 (ja) 積層型電子部品の製造方法
JP4875827B2 (ja) 圧電薄膜及びその製造方法、並びにその圧電薄膜を備えた圧電素子、並びにその圧電素子を用いたインクジェットヘッド、並びにそのインクジェットヘッドを備えたインクジェット式記録装置
CN103155191A (zh) 层叠型压电致动器以及压电振动装置
JP2008028285A (ja) 圧電体薄膜素子、インクジェットヘッドおよびインクジェット式記録装置
JP5436549B2 (ja) 薄板状焼成圧電体の製造方法
US10211043B2 (en) Stacked film, electronic device substrate, electronic device, and method of fabricating stacked film
JP2004119703A (ja) 圧電素子の製造方法及びインクジェットヘッドの製造方法
JP6360362B2 (ja) 積層圧電素子
JP6809818B2 (ja) 圧電アクチュエータ
CN113162461B (zh) 三维多层共烧压电陶瓷智能结构与可程控多振动模态激励方法
JP4576631B2 (ja) 積層型圧電アクチュエータの製造方法
JPWO2020004269A1 (ja) 圧電アクチュエータ
JP2005353876A (ja) 圧電体積層構造、圧電素子、圧電体デバイスおよび液体吐出ヘッド

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150930

Termination date: 20161010