CN101415769A - 辐射固化橡胶粘合剂/密封剂 - Google Patents
辐射固化橡胶粘合剂/密封剂 Download PDFInfo
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- CN101415769A CN101415769A CNA2006800540643A CN200680054064A CN101415769A CN 101415769 A CN101415769 A CN 101415769A CN A2006800540643 A CNA2006800540643 A CN A2006800540643A CN 200680054064 A CN200680054064 A CN 200680054064A CN 101415769 A CN101415769 A CN 101415769A
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- C08L2312/00—Crosslinking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2003/1034—Materials or components characterised by specific properties
- C09K2003/1062—UV-curable materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0607—Rubber or rubber derivatives
- C09K2200/061—Butyl rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09K2200/0617—Polyalkenes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0642—Copolymers containing at least three different monomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Optics & Photonics (AREA)
- Sealing Material Composition (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electroluminescent Light Sources (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2006/011442 WO2007111607A1 (en) | 2006-03-29 | 2006-03-29 | Radiation-curable rubber adhesive/sealant |
Publications (1)
Publication Number | Publication Date |
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CN101415769A true CN101415769A (zh) | 2009-04-22 |
Family
ID=37487588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2006800540643A Pending CN101415769A (zh) | 2006-03-29 | 2006-03-29 | 辐射固化橡胶粘合剂/密封剂 |
Country Status (6)
Country | Link |
---|---|
US (2) | US20100155247A1 (zh) |
EP (1) | EP2004746B1 (zh) |
JP (1) | JP2009531516A (zh) |
CN (1) | CN101415769A (zh) |
TW (1) | TWI349026B (zh) |
WO (1) | WO2007111607A1 (zh) |
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CN103492504A (zh) * | 2011-04-27 | 2014-01-01 | 汉高公司 | 具有低温密封能力的可固化的弹性体组合物 |
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CN104342041A (zh) * | 2013-08-09 | 2015-02-11 | 日东电工株式会社 | 粘合剂组合物、粘合带或粘合片 |
CN104584257A (zh) * | 2012-05-02 | 2015-04-29 | 汉高美国知识产权有限责任公司 | 可固化封装剂及其用途 |
CN104945574A (zh) * | 2015-05-19 | 2015-09-30 | 北京化工大学 | 一种弹性体材料的制备方法 |
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CN109641997A (zh) * | 2016-09-06 | 2019-04-16 | 三键有限公司 | 固化性树脂组合物、使用该固化性树脂组合物的燃料电池和密封方法 |
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- 2006-03-29 CN CNA2006800540643A patent/CN101415769A/zh active Pending
- 2006-03-29 WO PCT/US2006/011442 patent/WO2007111607A1/en active Application Filing
- 2006-03-29 EP EP06739912.1A patent/EP2004746B1/en not_active Not-in-force
- 2006-03-29 JP JP2009502736A patent/JP2009531516A/ja active Pending
- 2006-03-29 US US12/293,719 patent/US20100155247A1/en not_active Abandoned
- 2006-06-30 TW TW095123697A patent/TWI349026B/zh not_active IP Right Cessation
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2012
- 2012-08-03 US US13/565,952 patent/US20140190736A1/en not_active Abandoned
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Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103492504A (zh) * | 2011-04-27 | 2014-01-01 | 汉高公司 | 具有低温密封能力的可固化的弹性体组合物 |
CN104584257A (zh) * | 2012-05-02 | 2015-04-29 | 汉高美国知识产权有限责任公司 | 可固化封装剂及其用途 |
CN104584257B (zh) * | 2012-05-02 | 2017-06-20 | 汉高知识产权控股有限责任公司 | 可固化封装剂及其用途 |
CN107275511A (zh) * | 2012-05-02 | 2017-10-20 | 汉高知识产权控股有限责任公司 | 可固化封装剂及其用途 |
CN104968690A (zh) * | 2013-02-04 | 2015-10-07 | 株式会社普利司通 | 光固化性弹性体组合物、密封材料、硬盘驱动器用垫片、硬盘驱动器和装置 |
US9388267B2 (en) | 2013-02-04 | 2016-07-12 | Bridgestone Corporation | Photocurable elastomer composition, seal material, gasket for hard disc drive, hard disc drive and apparatus |
CN104342041A (zh) * | 2013-08-09 | 2015-02-11 | 日东电工株式会社 | 粘合剂组合物、粘合带或粘合片 |
CN106029808B (zh) * | 2014-02-25 | 2018-09-18 | 琳得科株式会社 | 粘接剂组合物、粘接片和电子装置 |
CN106029808A (zh) * | 2014-02-25 | 2016-10-12 | 琳得科株式会社 | 粘接剂组合物、粘接片和电子装置 |
CN103820042A (zh) * | 2014-02-27 | 2014-05-28 | 深圳市友联亨达光电有限公司 | 一种热固化型光学透明热熔胶膜(toca)及贴合方法 |
CN107428891A (zh) * | 2015-03-24 | 2017-12-01 | 施敏打硬株式会社 | 固化性组合物 |
CN104945574A (zh) * | 2015-05-19 | 2015-09-30 | 北京化工大学 | 一种弹性体材料的制备方法 |
CN109071901A (zh) * | 2016-02-11 | 2018-12-21 | 汉高知识产权控股有限责任公司 | 用于燃料电池的可热固化密封剂 |
CN109641997A (zh) * | 2016-09-06 | 2019-04-16 | 三键有限公司 | 固化性树脂组合物、使用该固化性树脂组合物的燃料电池和密封方法 |
US11165072B2 (en) | 2016-09-06 | 2021-11-02 | Threebond Co., Ltd. | Curable resin composition, fuel cell using same, and sealing method using same |
CN109641997B (zh) * | 2016-09-06 | 2021-12-28 | 三键有限公司 | 固化性树脂组合物、使用该固化性树脂组合物的燃料电池和密封方法 |
CN110114406A (zh) * | 2016-12-29 | 2019-08-09 | 汉高股份有限及两合公司 | 可阳离子固化的密封剂组合物 |
Also Published As
Publication number | Publication date |
---|---|
TW200736358A (en) | 2007-10-01 |
US20140190736A1 (en) | 2014-07-10 |
EP2004746B1 (en) | 2018-08-01 |
WO2007111607A1 (en) | 2007-10-04 |
JP2009531516A (ja) | 2009-09-03 |
US20100155247A1 (en) | 2010-06-24 |
EP2004746A1 (en) | 2008-12-24 |
TWI349026B (en) | 2011-09-21 |
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