CN101162686B - 热处理装置 - Google Patents

热处理装置 Download PDF

Info

Publication number: CN101162686B
Authority: CN; China
Prior art keywords: limiting part; lid; fire door; contact limiting; container handling
Prior art date: 2006-10-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

CN200710152463XA

Other languages

English (en)

Chinese (zh)

Other versions

CN101162686A (zh

Inventor

高桥喜一

佐瀬雄一郎

佐藤泉

高桥清彦

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tokyo Electron Ltd

Original Assignee

Tokyo Electron Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-10-13

Filing date

2007-10-12

Publication date

2011-02-09

2007-10-12 Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd

2008-04-16 Publication of CN101162686A publication Critical patent/CN101162686A/zh

2011-02-09 Application granted granted Critical

2011-02-09 Publication of CN101162686B publication Critical patent/CN101162686B/zh

Status Active legal-status Critical Current

2027-10-12 Anticipated expiration legal-status Critical

Images

Landscapes

Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

CN200710152463XA 2006-10-13 2007-10-12 热处理装置 Active CN101162686B (zh)

Applications Claiming Priority (9)

Application Number	Priority Date	Filing Date	Title
JP2006280082		2006-10-13
JP2006280082		2006-10-13
JP2006-280082		2006-10-13
JP2006-346363		2006-12-22
JP2006346363		2006-12-22
JP2006346363		2006-12-22
JP2007213492		2007-08-20
JP2007-213492		2007-08-20
JP2007213492A JP5144990B2 (ja)	2006-10-13	2007-08-20	熱処理装置

Publications (2)

Publication Number	Publication Date
CN101162686A CN101162686A (zh)	2008-04-16
CN101162686B true CN101162686B (zh)	2011-02-09

Family

ID=39704298

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN200710152463XA Active CN101162686B (zh)	2006-10-13	2007-10-12	热处理装置

Country Status (3)

Country	Link
JP (1)	JP5144990B2 (ja)
CN (1)	CN101162686B (ja)
TW (1)	TWI445059B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5441779B2 (ja) *	2010-03-24	2014-03-12	光洋サーモシステム株式会社	縦型熱処理炉のシャッタ装置
JP5882167B2 (ja)	2012-09-13	2016-03-09	東京エレクトロン株式会社	熱処理装置
JP2014081096A (ja) *	2012-10-15	2014-05-08	Ebara Corp	真空加熱炉
JP5960028B2 (ja) *	2012-10-31	2016-08-02	東京エレクトロン株式会社	熱処理装置
KR101557016B1 (ko) *	2013-10-17	2015-10-05	주식회사 유진테크	기판 처리장치
JP6812237B2 (ja) *	2016-03-29	2021-01-13	Ｓｐｐテクノロジーズ株式会社	プラズマ処理装置
JP6515905B2 (ja) *	2016-11-11	2019-05-22	トヨタ自動車株式会社	真空二重構造
US11326256B2 (en)	2018-12-10	2022-05-10	Applied Materials, Inc.	Dome stress isolating layer
JP6824947B2 (ja) *	2018-12-12	2021-02-03	株式会社Ｓｃｒｅｅｎホールディングス	処理チャンバおよび基板処理装置
TWI836257B (zh) *	2020-09-23	2024-03-21	日商國際電氣股份有限公司	密封構造、基板處理裝置及半導體裝置之製造方法
CN112414107B (zh) *	2020-11-04	2023-01-17	北京北方华创微电子装备有限公司	立式热处理设备及其炉体装卸方法和转运装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5207573A (en) *	1991-02-19	1993-05-04	Tokyo Electron Sagami Limited	Heat processing apparatus
US5252062A (en) *	1992-10-15	1993-10-12	International Business Machines Corporation	Thermal processing furnace
US5368648A (en) *	1991-02-26	1994-11-29	Tokyo Electron Sagami Kabushiki Kaisha	Sealing apparatus
US6283175B1 (en) *	1998-08-19	2001-09-04	Tokyo Electron Limited	Enveloping device and vertical heat-treating apparatus for semiconductor process system
US6709525B2 (en) *	2001-07-10	2004-03-23	Samsung Electronics Co., Ltd.	Low pressure chemical vapor deposition apparatus of vertical type for fabricating semiconductor devices
US6988886B2 (en) *	2003-03-28	2006-01-24	Asahi Glass Company, Limited	Thermal treatment system for semiconductors

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3278011B2 (ja) *	1993-08-19	2002-04-30	東京エレクトロン株式会社	熱処理装置

2007
- 2007-08-20 JP JP2007213492A patent/JP5144990B2/ja active Active
- 2007-10-12 TW TW96138315A patent/TWI445059B/zh not_active IP Right Cessation
- 2007-10-12 CN CN200710152463XA patent/CN101162686B/zh active Active

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5207573A (en) *	1991-02-19	1993-05-04	Tokyo Electron Sagami Limited	Heat processing apparatus
US5368648A (en) *	1991-02-26	1994-11-29	Tokyo Electron Sagami Kabushiki Kaisha	Sealing apparatus
US5252062A (en) *	1992-10-15	1993-10-12	International Business Machines Corporation	Thermal processing furnace
US6283175B1 (en) *	1998-08-19	2001-09-04	Tokyo Electron Limited	Enveloping device and vertical heat-treating apparatus for semiconductor process system
US6709525B2 (en) *	2001-07-10	2004-03-23	Samsung Electronics Co., Ltd.	Low pressure chemical vapor deposition apparatus of vertical type for fabricating semiconductor devices
US6988886B2 (en) *	2003-03-28	2006-01-24	Asahi Glass Company, Limited	Thermal treatment system for semiconductors

Also Published As

Publication number	Publication date
CN101162686A (zh)	2008-04-16
JP5144990B2 (ja)	2013-02-13
TW200839852A (en)	2008-10-01
JP2008177524A (ja)	2008-07-31
TWI445059B (zh)	2014-07-11

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Legal Events

Date	Code	Title
2008-04-16	C06	Publication
2008-04-16	PB01	Publication
2009-08-26	C10	Entry into substantive examination
2009-08-26	SE01	Entry into force of request for substantive examination
2011-02-09	C14	Grant of patent or utility model
2011-02-09	GR01	Patent grant