CN100370629C - 具有荧光多层结构的发光二极管装置 - Google Patents
具有荧光多层结构的发光二极管装置 Download PDFInfo
- Publication number
- CN100370629C CN100370629C CNB2004100420837A CN200410042083A CN100370629C CN 100370629 C CN100370629 C CN 100370629C CN B2004100420837 A CNB2004100420837 A CN B2004100420837A CN 200410042083 A CN200410042083 A CN 200410042083A CN 100370629 C CN100370629 C CN 100370629C
- Authority
- CN
- China
- Prior art keywords
- light
- fluorescent
- led
- emitting
- multilayer structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (2)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR27546/03 | 2003-04-30 | ||
KR1020030027546A KR100691143B1 (ko) | 2003-04-30 | 2003-04-30 | 다층 형광층을 가진 발광 다이오드 소자 |
KR27546/2003 | 2003-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1542991A CN1542991A (zh) | 2004-11-03 |
CN100370629C true CN100370629C (zh) | 2008-02-20 |
Family
ID=33095652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100420837A Expired - Fee Related CN100370629C (zh) | 2003-04-30 | 2004-04-30 | 具有荧光多层结构的发光二极管装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20040217692A1 (zh) |
EP (1) | EP1480278B1 (zh) |
JP (1) | JP2004363564A (zh) |
KR (1) | KR100691143B1 (zh) |
CN (1) | CN100370629C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7872273B2 (en) | 2008-03-28 | 2011-01-18 | Industrial Technology Research Institute | Light emitting device |
CN101551077B (zh) * | 2008-04-03 | 2011-11-30 | 财团法人工业技术研究院 | 发光装置与应用其的背光装置及其组装方法 |
CN102569593A (zh) * | 2010-12-22 | 2012-07-11 | 展晶科技(深圳)有限公司 | 发光二极管 |
CN103931005A (zh) * | 2011-09-14 | 2014-07-16 | 玛太克司马特股份有限公司 | Led制造方法、led制造设备和led |
Families Citing this family (92)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6995402B2 (en) * | 2003-10-03 | 2006-02-07 | Lumileds Lighting, U.S., Llc | Integrated reflector cup for a light emitting device mount |
JP4654670B2 (ja) * | 2003-12-16 | 2011-03-23 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
US20080231170A1 (en) * | 2004-01-26 | 2008-09-25 | Fukudome Masato | Wavelength Converter, Light-Emitting Device, Method of Producing Wavelength Converter and Method of Producing Light-Emitting Device |
EP1718715B1 (en) * | 2004-02-20 | 2010-09-08 | Lumination, LLC | Rules for efficient light sources using phosphor converted leds |
JP2006114854A (ja) * | 2004-10-18 | 2006-04-27 | Sharp Corp | 半導体発光装置、液晶表示装置用のバックライト装置 |
JP2006135002A (ja) * | 2004-11-04 | 2006-05-25 | Koito Mfg Co Ltd | 発光デバイス及び車両用灯具 |
KR100781924B1 (ko) * | 2004-12-02 | 2007-12-04 | 주식회사 에스티앤아이 | 2개의 형광체를 이용한 고출력 백색 발광 다이오드 소자 |
US8044572B2 (en) | 2004-12-17 | 2011-10-25 | Ube Industries, Ltd. | Light conversion structure and light-emitting device using the same |
TWI239671B (en) * | 2004-12-30 | 2005-09-11 | Ind Tech Res Inst | LED applied with omnidirectional reflector |
JP2006278980A (ja) * | 2005-03-30 | 2006-10-12 | Sanyo Electric Co Ltd | 半導体発光装置 |
DE102005019376A1 (de) * | 2005-04-26 | 2006-11-02 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Lumineszenzkonversions-LED |
KR100682874B1 (ko) * | 2005-05-02 | 2007-02-15 | 삼성전기주식회사 | 백색 led |
JP4800669B2 (ja) * | 2005-06-07 | 2011-10-26 | セイコーインスツル株式会社 | 照明装置およびそれを用いた表示装置 |
JP4004514B2 (ja) * | 2005-06-20 | 2007-11-07 | ローム株式会社 | 白色半導体発光素子 |
JP2006352036A (ja) * | 2005-06-20 | 2006-12-28 | Rohm Co Ltd | 白色半導体発光素子 |
WO2006137359A1 (ja) * | 2005-06-20 | 2006-12-28 | Rohm Co., Ltd. | 白色半導体発光素子およびその製法 |
US7598663B2 (en) * | 2005-08-04 | 2009-10-06 | Taiwan Oasis Technology Co., Ltd. | Multi-wavelength LED provided with combined fluorescent materials positioned over and underneath the LED component |
US7329907B2 (en) | 2005-08-12 | 2008-02-12 | Avago Technologies, Ecbu Ip Pte Ltd | Phosphor-converted LED devices having improved light distribution uniformity |
DE102006020529A1 (de) * | 2005-08-30 | 2007-03-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
KR100649704B1 (ko) | 2005-09-05 | 2006-11-27 | 삼성전기주식회사 | 발광 다이오드 패키지 및 그 제조방법 |
JP3979424B2 (ja) * | 2005-09-09 | 2007-09-19 | 松下電工株式会社 | 発光装置 |
JP2007088261A (ja) * | 2005-09-22 | 2007-04-05 | Sanyo Electric Co Ltd | 発光装置 |
JP2007103512A (ja) * | 2005-09-30 | 2007-04-19 | Kyocera Corp | 発光装置 |
US8441179B2 (en) * | 2006-01-20 | 2013-05-14 | Cree, Inc. | Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources |
CN100411210C (zh) * | 2006-03-03 | 2008-08-13 | 中山大学 | 一种白光led的封装方法 |
DE102006024165A1 (de) * | 2006-05-23 | 2007-11-29 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Optoelektronischer Halbleiterchip mit einem Wellenlängenkonversionsstoff sowie optoelektronisches Halbleiterbauelement mit einem solchen Halbleiterchip und Verfahren zur Herstellung des optoelektronischen Halbleiterchips |
JP5033558B2 (ja) * | 2006-09-28 | 2012-09-26 | 三洋電機株式会社 | 発光装置 |
KR101008762B1 (ko) * | 2006-10-12 | 2011-01-14 | 파나소닉 주식회사 | 발광 장치 및 그 제조 방법 |
US8157730B2 (en) | 2006-12-19 | 2012-04-17 | Valencell, Inc. | Physiological and environmental monitoring systems and methods |
US8652040B2 (en) | 2006-12-19 | 2014-02-18 | Valencell, Inc. | Telemetric apparatus for health and environmental monitoring |
KR101258228B1 (ko) * | 2006-12-28 | 2013-04-25 | 서울반도체 주식회사 | 복수개의 파장변환 물질층들을 갖는 발광 소자 |
WO2008085411A2 (en) * | 2006-12-27 | 2008-07-17 | Valencell, Inc. | Multi-wavelength optical devices and methods of using same |
TWI326923B (en) * | 2007-03-07 | 2010-07-01 | Lite On Technology Corp | White light emitting diode |
JP4753904B2 (ja) | 2007-03-15 | 2011-08-24 | シャープ株式会社 | 発光装置 |
US7687816B2 (en) * | 2007-03-20 | 2010-03-30 | International Business Machines Corporation | Light emitting diode |
JP5089212B2 (ja) * | 2007-03-23 | 2012-12-05 | シャープ株式会社 | 発光装置およびそれを用いたledランプ、発光装置の製造方法 |
JP5044329B2 (ja) * | 2007-08-31 | 2012-10-10 | 株式会社東芝 | 発光装置 |
DE102007057710B4 (de) * | 2007-09-28 | 2024-03-14 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierendes Bauelement mit Konversionselement |
JP2009094199A (ja) * | 2007-10-05 | 2009-04-30 | Sharp Corp | 発光装置、面光源、表示装置と、その製造方法 |
US8251903B2 (en) | 2007-10-25 | 2012-08-28 | Valencell, Inc. | Noninvasive physiological analysis using excitation-sensor modules and related devices and methods |
JP2009153712A (ja) * | 2007-12-26 | 2009-07-16 | Olympus Corp | 光源装置およびそれを備えた内視鏡装置 |
JP2009245981A (ja) * | 2008-03-28 | 2009-10-22 | Toyota Central R&D Labs Inc | Led発光装置 |
DE102008021666A1 (de) * | 2008-04-30 | 2009-11-05 | Ledon Lighting Jennersdorf Gmbh | Lichtemittierende Vorrichtung und Verfahren zur Herstellung einer lichtemittierenden Vorrichtung |
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EP2164302A1 (de) | 2008-09-12 | 2010-03-17 | Ilford Imaging Switzerland Gmbh | Optisches Element und Verfahren zu seiner Herstellung |
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US8788002B2 (en) | 2009-02-25 | 2014-07-22 | Valencell, Inc. | Light-guiding devices and monitoring devices incorporating same |
EP2400884B1 (en) | 2009-02-25 | 2018-03-07 | Valencell, Inc. | Light-guiding devices and monitoring devices incorporating same |
US9750462B2 (en) | 2009-02-25 | 2017-09-05 | Valencell, Inc. | Monitoring apparatus and methods for measuring physiological and/or environmental conditions |
EP2412038B1 (en) | 2009-03-19 | 2019-01-02 | Philips Lighting Holding B.V. | Illumination device with remote luminescent material |
KR101172143B1 (ko) * | 2009-08-10 | 2012-08-07 | 엘지이노텍 주식회사 | 백색 발광다이오드 소자용 시온계 산화질화물 형광체, 그의 제조방법 및 그를 이용한 백색 led 소자 |
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WO2011028033A2 (ko) | 2009-09-02 | 2011-03-10 | 엘지이노텍주식회사 | 형광체, 형광체 제조방법 및 백색 발광 소자 |
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US8888701B2 (en) | 2011-01-27 | 2014-11-18 | Valencell, Inc. | Apparatus and methods for monitoring physiological data during environmental interference |
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US9427191B2 (en) | 2011-07-25 | 2016-08-30 | Valencell, Inc. | Apparatus and methods for estimating time-state physiological parameters |
EP4461222A3 (en) | 2011-08-02 | 2025-01-22 | Yukka Magic LLC | Systems and methods for variable filter adjustment by heart rate metric feedback |
CN102916114B (zh) * | 2011-08-05 | 2016-04-20 | 赛恩倍吉科技顾问(深圳)有限公司 | 发光二极管 |
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CN103375708B (zh) * | 2012-04-26 | 2015-10-28 | 展晶科技(深圳)有限公司 | 发光二极管灯源装置 |
EP2789672B1 (en) * | 2012-05-01 | 2016-12-14 | National Institute for Materials Science | Optical material and production method therefor, and light emitting diode, optical isolator, and optical processing apparatus which use said optical material |
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CN103337584A (zh) * | 2013-06-06 | 2013-10-02 | 河北神通光电科技有限公司 | 一种白光led及其封装方法 |
JP2016154062A (ja) * | 2013-06-21 | 2016-08-25 | パナソニックIpマネジメント株式会社 | 光源、及び光源を具備する車両用ヘッドランプ |
CN103996787A (zh) * | 2014-02-19 | 2014-08-20 | 浙江英特来光电科技有限公司 | 一种高显指高光效白光led结构 |
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US9538921B2 (en) | 2014-07-30 | 2017-01-10 | Valencell, Inc. | Physiological monitoring devices with adjustable signal analysis and interrogation power and monitoring methods using same |
EP3178118B1 (en) * | 2014-08-06 | 2022-05-18 | CreeLED, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
KR20160017849A (ko) * | 2014-08-06 | 2016-02-17 | 서울바이오시스 주식회사 | 고출력 발광 장치 및 그 제조 방법 |
EP4360552A3 (en) | 2014-08-06 | 2024-07-10 | Yukka Magic LLC | Optical physiological sensor modules with reduced signal noise |
CN104409602A (zh) * | 2014-09-04 | 2015-03-11 | 郑榕彬 | 一种高显色指数的led灯 |
US9794653B2 (en) | 2014-09-27 | 2017-10-17 | Valencell, Inc. | Methods and apparatus for improving signal quality in wearable biometric monitoring devices |
WO2017070463A1 (en) | 2015-10-23 | 2017-04-27 | Valencell, Inc. | Physiological monitoring devices and methods that identify subject activity type |
US10945618B2 (en) | 2015-10-23 | 2021-03-16 | Valencell, Inc. | Physiological monitoring devices and methods for noise reduction in physiological signals based on subject activity type |
CN105449078A (zh) * | 2015-12-21 | 2016-03-30 | 华中科技大学 | 一种白光led及其制备方法 |
US10966662B2 (en) | 2016-07-08 | 2021-04-06 | Valencell, Inc. | Motion-dependent averaging for physiological metric estimating systems and methods |
JP6772621B2 (ja) * | 2016-07-27 | 2020-10-21 | 日亜化学工業株式会社 | 発光装置 |
KR102362004B1 (ko) * | 2017-03-24 | 2022-02-15 | 엘지이노텍 주식회사 | 반도체 소자 패키지 |
TWI757315B (zh) * | 2017-07-28 | 2022-03-11 | 晶元光電股份有限公司 | 發光裝置以及其製造方法 |
TWI717674B (zh) * | 2019-01-04 | 2021-02-01 | 友達光電股份有限公司 | 發光裝置及照明模組 |
CN115799433B (zh) * | 2023-01-09 | 2024-09-10 | 四川世纪和光科技发展有限公司 | 一种红光封装结构、红光led光源及封装方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1289456A (zh) * | 1998-11-30 | 2001-03-28 | 通用电气公司 | 含有磷光体组合物的发光器件 |
WO2001024283A1 (en) * | 1999-09-27 | 2001-04-05 | Lumileds Lighting, U.S., Llc | Light emitting diode comprising a thin phosphor-conversion film |
US20030038295A1 (en) * | 2001-08-22 | 2003-02-27 | Nichia Corporation | Light emitting device with fluorescent member excited by semiconductor light emitting element |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2949014A (en) * | 1958-06-02 | 1960-08-16 | Whirlpool Co | Thermoelectric air conditioning apparatus |
US3602758A (en) * | 1969-06-20 | 1971-08-31 | Westinghouse Electric Corp | Phosphor blend lamps which reduce the proportions of the costlier phosphors |
JPS579319U (zh) * | 1980-06-14 | 1982-01-18 | ||
US4536198A (en) * | 1982-11-15 | 1985-08-20 | Hydro-Dri Systems, Inc. | Moisture control device |
US4700550A (en) * | 1986-03-10 | 1987-10-20 | Rhodes Barry V | Enthalpic heat pump desiccant air conditioning system |
US4654057A (en) * | 1986-04-01 | 1987-03-31 | Rhodes Barry V | Dehumidifier |
US4879492A (en) * | 1988-09-30 | 1989-11-07 | North American Philips Corp. | Fluorescent lamp having a multi-layer phosphor optimized for lumen output, color rendering and cost |
US5373704A (en) * | 1990-04-17 | 1994-12-20 | Arthur D. Little, Inc. | Desiccant dehumidifier |
US5230719A (en) * | 1990-05-15 | 1993-07-27 | Erling Berner | Dehumidification apparatus |
JP3149444B2 (ja) * | 1991-01-30 | 2001-03-26 | 東芝ライテック株式会社 | 低圧水銀蒸気放電灯 |
US5297398A (en) * | 1991-07-05 | 1994-03-29 | Milton Meckler | Polymer desiccant and system for dehumidified air conditioning |
US5661983A (en) * | 1995-06-02 | 1997-09-02 | Energy International, Inc. | Fluidized bed desiccant cooling system |
US5799728A (en) * | 1996-04-30 | 1998-09-01 | Memc Electric Materials, Inc. | Dehumidifier |
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
US5817167A (en) * | 1996-08-21 | 1998-10-06 | Des Champs Laboratories Incorporated | Desiccant based dehumidifier |
US5813753A (en) * | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
US6379435B1 (en) * | 1997-06-30 | 2002-04-30 | Sanyo Electric Co., Ltd. | Adsorbing device, method of deodorizing therewith, and method of supplying high concentration oxygen |
US6580097B1 (en) * | 1998-02-06 | 2003-06-17 | General Electric Company | Light emitting device with phosphor composition |
US6501091B1 (en) | 1998-04-01 | 2002-12-31 | Massachusetts Institute Of Technology | Quantum dot white and colored light emitting diodes |
JP3486345B2 (ja) | 1998-07-14 | 2004-01-13 | 東芝電子エンジニアリング株式会社 | 半導体発光装置 |
KR20000007067A (ko) * | 1999-11-23 | 2000-02-07 | 김창태 | 형광물질을 가진 엘이디 패키지 제조방법 |
KR20010068371A (ko) * | 2000-01-05 | 2001-07-23 | 박종만 | 형광 물질을 이용한 복합 파장의 빛을 내는 발광 반도체소자 |
KR100372834B1 (ko) * | 2000-05-25 | 2003-02-19 | 에이프로시스템즈 (주) | 형광 물질을 이용한 복합 파장의 광을 발생시키는 발광반도체 소자 |
US6434942B1 (en) * | 2001-09-20 | 2002-08-20 | Walter T. Charlton | Building, or other self-supporting structure, incorporating multi-stage system for energy generation |
EP1433831B1 (en) * | 2002-03-22 | 2018-06-06 | Nichia Corporation | Nitride phosphor and method for preparation thereof, and light emitting device |
-
2003
- 2003-04-30 KR KR1020030027546A patent/KR100691143B1/ko not_active Expired - Fee Related
-
2004
- 2004-04-23 JP JP2004128298A patent/JP2004363564A/ja active Pending
- 2004-04-28 US US10/833,053 patent/US20040217692A1/en not_active Abandoned
- 2004-04-29 EP EP04252504.8A patent/EP1480278B1/en not_active Expired - Lifetime
- 2004-04-30 CN CNB2004100420837A patent/CN100370629C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1289456A (zh) * | 1998-11-30 | 2001-03-28 | 通用电气公司 | 含有磷光体组合物的发光器件 |
WO2001024283A1 (en) * | 1999-09-27 | 2001-04-05 | Lumileds Lighting, U.S., Llc | Light emitting diode comprising a thin phosphor-conversion film |
US20030038295A1 (en) * | 2001-08-22 | 2003-02-27 | Nichia Corporation | Light emitting device with fluorescent member excited by semiconductor light emitting element |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7872273B2 (en) | 2008-03-28 | 2011-01-18 | Industrial Technology Research Institute | Light emitting device |
US8227827B2 (en) | 2008-03-28 | 2012-07-24 | Industrial Technology Research Institute | Light emitting device |
CN101551077B (zh) * | 2008-04-03 | 2011-11-30 | 财团法人工业技术研究院 | 发光装置与应用其的背光装置及其组装方法 |
CN102569593A (zh) * | 2010-12-22 | 2012-07-11 | 展晶科技(深圳)有限公司 | 发光二极管 |
CN103931005A (zh) * | 2011-09-14 | 2014-07-16 | 玛太克司马特股份有限公司 | Led制造方法、led制造设备和led |
Also Published As
Publication number | Publication date |
---|---|
EP1480278A2 (en) | 2004-11-24 |
CN1542991A (zh) | 2004-11-03 |
EP1480278A3 (en) | 2006-08-16 |
EP1480278B1 (en) | 2013-06-19 |
US20040217692A1 (en) | 2004-11-04 |
KR100691143B1 (ko) | 2007-03-09 |
JP2004363564A (ja) | 2004-12-24 |
KR20040093609A (ko) | 2004-11-06 |
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