CN109972094B

CN109972094B - Evaporation source and evaporation device

Info

Publication number: CN109972094B
Application number: CN201811070879.1A
Authority: CN
Inventors: 风间良秋; 佐藤聪
Original assignee: Canon Tokki Corp
Current assignee: Canon Tokki Corp
Priority date: 2017-12-27
Filing date: 2018-09-14
Publication date: 2022-09-06
Anticipated expiration: 2038-09-14
Also published as: JP2019116663A; KR102380987B1; KR20190079472A; JP6570012B2; CN109972094A

Abstract

The invention provides an evaporation source and a vapor deposition apparatus capable of improving cooling efficiency. An evaporation source (10) is provided with: a crucible (100) for accommodating a material to be deposited on a substrate; a heating body (200) that is provided so as to surround the crucible (100) and heats the crucible (100); and a reflector (300) that is provided so as to surround the heating body (200) and blocks heat, wherein the evaporation source (10) comprises: a cooling liquid chamber (311) which is provided inside the reflector body (310) so as to be along the inner wall surface of the reflector body (310) and through which the cooling liquid flows; and a drain pipe (340) which is provided in the cooling liquid chamber (311) and discharges the cooling liquid from the lower part of the cooling liquid chamber (311).

Description

Evaporation source and evaporation device

Technical Field

The present invention relates to an evaporation source and a vapor deposition apparatus used for vacuum vapor deposition.

Background

The evaporation source has a structure for blocking heat from a heating body for heating the crucible. As a conventional structure, a structure is known in which a pipe-shaped pipe is wound around a crucible and cooling water is made to flow through the pipe (see patent document 1).

However, in the case of such a structure, the contact area of the pipe through which the cooling water flows with respect to the crucible or the like is small, and therefore, the cooling efficiency is low.

Patent document 1: japanese laid-open patent publication No. 6-10118

Disclosure of Invention

Problems to be solved by the invention

The invention aims to provide an evaporation source and a vapor deposition device which can improve cooling efficiency.

Means for solving the problems

In order to solve the above problems, the present invention adopts the following technical means.

That is, the evaporation source of the present invention includes:

a crucible for accommodating a material of a substance to be deposited on a substrate;

a heating body disposed in a manner to surround the crucible, heating the crucible; and

a heat shielding structure provided so as to surround the heating body and shielding heat,

it is characterized in that the preparation method is characterized in that,

the evaporation source includes:

a coolant chamber provided inside the heat shielding structure so as to extend along an inner wall surface of the heat shielding structure, and through which coolant flows; and

and a drain pipe provided in the coolant chamber and configured to discharge the coolant from below the coolant chamber.

ADVANTAGEOUS EFFECTS OF INVENTION

As described above, according to the present invention, the cooling efficiency can be improved.

Drawings

Fig. 1 is a schematic configuration diagram of a vapor deposition device according to embodiment 1 of the present invention.

Fig. 2 is a plan view of an evaporation source according to embodiment 1 of the present invention.

Fig. 3 is a side view of an evaporation source in embodiment 1 of the present invention.

Fig. 4 is a schematic cross-sectional view of an evaporation source of embodiment 1 of the present invention.

Fig. 5 is a top view of the reflector of embodiment 1 of the present invention.

Fig. 6 is a schematic configuration diagram of the internal structure of the reflector according to example 1 of the present invention.

Fig. 7 is a top view of the reflector of embodiment 2 of the present invention.

Fig. 8 is a schematic configuration diagram of the internal structure of the reflector according to example 2 of the present invention.

Fig. 9 is a schematic configuration diagram of the internal structure of the reflector according to example 2 of the present invention.

Fig. 10 is a top view of the reflector of embodiment 3 of the present invention.

Fig. 11 is a schematic configuration diagram of the internal structure of the reflector according to example 3 of the present invention.

Detailed Description

Hereinafter, a mode for carrying out the present invention will be described in detail by way of example based on the examples with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention to these components unless otherwise specified.

(example 1)

An evaporation source and a vapor deposition device according to embodiment 1 of the present invention will be described with reference to fig. 1 to 6. Fig. 1 is a schematic configuration diagram of a vapor deposition device according to embodiment 1 of the present invention. Fig. 2 is a plan view of an evaporation source according to embodiment 1 of the present invention. Fig. 3 is a side view of an evaporation source according to example 1 of the present invention, showing the side view of the evaporation source in a state of being arranged in a deposition apparatus. Fig. 4 is a schematic sectional view of an evaporation source according to example 1 of the present invention, which corresponds to a sectional view a 1-a 2 in fig. 2. Fig. 5 is a plan view of the reflector according to example 1 of the present invention, showing a state in which the lid portion is removed. Fig. 6 is a schematic configuration diagram of the internal structure of the reflector in example 1 of the present invention, and the internal structure of the reflector is shown in a schematic sectional view. In fig. 1, 3, 4, and 6, the upper side in the drawings corresponds to the upper side in the vertical direction when the vapor deposition device is used, and the lower side in the drawings corresponds to the lower side in the vertical direction when the vapor deposition device is used.

[ vapor deposition apparatus ]

Referring to fig. 1, a vapor deposition device 1 is briefly described. The vapor deposition device 1 includes: a chamber 20 having an inside in a state close to vacuum by a vacuum pump 30; and an evaporation source 10 disposed inside the chamber 20. The evaporation source 10 functions to evaporate or sublimate a material of a substance to be deposited on the substrate 70 by heating the material. The substance evaporated or sublimated by the evaporation source 10 adheres to the substrate 70 provided inside the chamber 20, whereby a thin film is formed on the substrate 70.

The vapor deposition device 1 further includes: a1 st pipe 50 for supplying the evaporation source 10 with a coolant supplied from a coolant pump 40 provided outside the chamber 20; and a2 nd pipe 60 for discharging the coolant from the evaporation source 10 to the outside of the chamber 20.

[ Evaporation Source ]

Particularly, the overall structure of the evaporation source 10 of the present embodiment will be described with reference to fig. 2 to 4. The evaporation source 10 includes: a crucible 100 for accommodating a material to be deposited on the substrate 70; a heating body 200 disposed in a manner to surround the crucible 100, heating the crucible 100; and a reflector 300 which is a heat shielding structure surrounding the heating body 200 and shielding heat. The manner of heating the crucible 100 may take various configurations. For example, when the electric heating method is adopted, the heating body 200 corresponds to a wire to which electricity is applied. In the case of the high-frequency induction heating method, the heating body 200 corresponds to a heating coil.

The reflector 300 includes a cylindrical reflector body 310, a bottom plate 320 provided below the reflector body 310, and a lid 330 provided above the reflector body 310. The reflector 300 is mounted on the mounting table 350.

When the reflector 300 is disposed in the chamber 20, a tilt adjusting mechanism for adjusting the tilt of the reflector 300 with respect to the table 350 is provided. The tilt adjusting mechanism is composed of a plurality of screw parts 360 for adjusting the distance between the mounting table 350 and the reflector 300 at respective positions. The inclination of the reflector 300 with respect to the mounting table 350 can be adjusted by adjusting the distance between the mounting table 350 and the reflector 300 at the respective positions by the plurality of screw parts 360.

A cylindrical reflector 410 that reflects heat from the heating body 200 is provided between the inner wall surface 312 of the reflector body 310 and the heating body 200. Further, a plate-shaped reflector 420 that reflects heat from the heating body 200 is provided between the heating body 200 and the bottom plate portion 320. The plate-shaped reflector 420 is formed of a disk-shaped member having a hole in the center. In the present embodiment, the cylindrical reflector 410 is separated from the plate reflector 420, but they may be connected. The cylindrical reflector 410 and the plate-shaped reflector 420 may be fixed to various members constituting the reflector 300. Further, a coolant chamber 311, through which the coolant L flows, is provided inside the reflector body 310 of the reflector 300 so as to extend along the inner wall surface 312 of the reflector body 310. The inner wall surface 312 of the reflector body 310 of the present embodiment functions as a reflecting surface for reflecting heat from the heating body 200. Further, the coolant chamber 311 of the present embodiment is formed by a cylindrical space. The cooling liquid chamber 311 is provided with a drain pipe 340 for discharging the cooling liquid L from below the cooling liquid chamber 311.

The bottom plate portion 320 of the reflector 300 is provided with a supply passage 321 that is provided from the bottom surface of the reflector 300 to the inside of the coolant chamber 311 and supplies the coolant L. The bottom plate portion 320 is provided with a discharge passage 322 that is provided from the inside of the coolant chamber 311 to the bottom surface of the reflector 300 and discharges the coolant L. One end of the drain pipe 340 is positioned above the coolant chamber 311, and the other end is connected to the drain passage 322. The opening provided in the end surface of the drain pipe 340 on the one end side is configured to face upward.

The 1 st pipe 50 is inserted into the 1 st insertion hole 21 formed in the chamber 20 and the 3 rd insertion hole 351 formed in the stage 350. One end side of the 1 st pipe 50 is connected to the supply passage 321. An annular gap between the 1 st pipe 50 and the 1 st insertion hole 21 is sealed by a1 st gasket 26 made of an elastic material, and an annular gap is designed to be secured between the 1 st pipe 50 and the 3 rd insertion hole 351.

The 2 nd pipe 60 is inserted into the 2 nd insertion hole 22 formed in the chamber 20 and the 4 th insertion hole 352 formed in the stage 350. One end side of the 2 nd pipe 60 is connected to a discharge passage 322. An annular gap between the 2 nd pipe 60 and the 2 nd insertion hole 22 is sealed by a2 nd gasket 27 made of an elastic material, and an annular gap is designed to be secured between the 2 nd pipe 60 and the 4 th insertion hole 352. As for the 1 st gasket 26 and the 2 nd gasket 27, various known technologies such as an O-ring having a circular cross-sectional shape and a square ring having a rectangular cross-sectional shape can be applied.

When the inclination of the reflector 300 with respect to the stage 350 is changed by the inclination adjustment mechanism, the inclination of the 1 st pipe 50 and the 2 nd pipe 60 with respect to the chamber 20 and the stage 350 is changed. In this case, since the 1 st pipe 50 and the 3 rd insertion hole 351 are designed to secure an annular gap therebetween, the change in the inclination of the 1 st pipe 50 with respect to the mounting table 350 is not hindered. Further, since the 1 st gasket 26 is made of an elastic body, even if the inclination of the 1 st pipe 50 with respect to the chamber 20 changes, the state in which the annular gap between the 1 st pipe 50 and the 1 st insertion hole 21 is sealed is maintained. The same applies to the relationship between the 2 nd pipe 60 and the mounting table 350 and the relationship between the 2 nd pipe 60 and the chamber 20.

[ flow pattern of Cooling liquid ]

The flow pattern of the coolant L will be described with reference to fig. 4 to 6. Fig. 5 is a plan view schematically showing the reflector 300 with the cover 330 removed. In fig. 6, members related to the flow pattern of the cooling liquid L are schematically shown in the internal structure of the reflector 300 in order to facilitate recognition of the flow pattern of the cooling liquid L.

The coolant L supplied from the 1 st pipe 50 is sent into the coolant chamber 311 through the supply passage 321. As the supply of the coolant L increases, the liquid level of the coolant L gradually rises within the coolant chamber 311 (see solid-line arrow marks in fig. 6). When the liquid level of the coolant L exceeds the upper end position H of the drain pipe 340, the coolant L enters the drain pipe 340 through the opening at the upper end (end surface on one end side) of the drain pipe 340, and falls by gravity (see the broken-line arrow mark in fig. 6). Thereafter, the coolant L passes through the discharge passage 322 and is discharged from the 2 nd pipe 60 to the outside of the chamber 20.

[ advantages of the Evaporation Source of the present example ]

According to the evaporation source 10 of the present embodiment, the cooling liquid chamber 311 is provided inside the reflector 300 (inside the reflector body 310) as a heat shielding structure so as to extend along the inner wall surface 312 of the reflector body 310. Therefore, the cooling efficiency can be improved as compared with the case where the cooling liquid is made to flow by the pipe-like tube.

Further, according to the evaporation source 10 of the present embodiment, the supply passage 321 is provided from the bottom surface of the reflector 300 into the cooling liquid chamber 311. Therefore, the coolant L is supplied from below in the coolant chamber 311.

The bottom plate 320 provided below the reflector body 310 includes a supply passage 321 and a discharge passage 322. Thereby, the 1 st pipe 50 and the 2 nd pipe 60 can be connected to the lower side of the reflector 300. In other words, it is not necessary to connect the pipe to the side surface side or the upper surface side of the reflector 300. Therefore, the entire device can be miniaturized.

One end of the drain pipe 340 provided in the cooling liquid chamber 311 is positioned above the cooling liquid chamber 311, and the other end is connected to the discharge passage 322. This allows the coolant L to be discharged from above the inside of the coolant chamber 311 to below the reflector 300 through the drain pipe 340. Therefore, the circulation direction of the coolant can be adjusted to the temperature distribution required for the crucible 100 in accordance with the coolant L being supplied from below in the coolant chamber 311. That is, if the upper side of the crucible 100 is cooled too much, the evaporated or sublimated substance adheres to the upper portion of the crucible 100 and is solidified. Therefore, it is preferable to prevent the upper side of the crucible 100 from being cooled too much while blocking heat from the heating body 200 by the coolant L flowing through the coolant chamber 311. In the present embodiment, the coolant L circulates so as to flow upward from below the coolant chamber 311 and be discharged from the drain pipe 340. Further, since the coolant L rises as the temperature of the coolant L increases, the temperature of the coolant L in the coolant chamber 311 has a temperature distribution in which the temperature increases from below toward above. Therefore, the upper side of the crucible 100 is suppressed from being cooled too much.

In the present embodiment, the opening provided in the end surface on one end side of the drain pipe 340 is configured to face upward. Thus, when the liquid level of the coolant L exceeds the upper end position H of the drain pipe 340, the coolant L enters the drain pipe 340 through the opening of the upper end (end surface on one end side) of the drain pipe 340, and falls by gravity. Therefore, the coolant L can be efficiently discharged from the drain pipe 340 without providing a power source or the like for discharging the coolant L.

Further, in the present embodiment, the cooling liquid chamber 311 is formed by a cylindrical space. This allows heat to be uniformly blocked around the heating body 200.

In the present embodiment, the heat from the heating body 200 is reflected by the cylindrical reflector 410 and the plate reflector 420, and the heat is also reflected by the reflector main body 310 of the reflector 200 as the heat shielding structure. Therefore, the heating efficiency of the crucible 100 can be improved, and the heat from the heating body 200 can be blocked. Further, since the cylindrical reflector 410 and the plate-shaped reflector 420 are provided, the reflector body 310 is prevented from being heated, and the cooling efficiency by the coolant L can be improved.

(example 2)

Fig. 7 to 9 show embodiment 2 of the present invention. In the present example, a structure of a reflector as a heat shielding structure is different from that of the case of example 1. Since the structure other than the reflector can be applied to the structure described in embodiment 1, only the structure of the reflector will be described in this embodiment.

Fig. 7 is a schematic plan view of the reflector 300X with the lid portion removed. In fig. 8 and 9, members related to the flow pattern of the cooling liquid L are schematically shown in the internal structure of the reflector 300X in order to facilitate recognition of the flow pattern of the cooling liquid L. Fig. 8 schematically shows a section B1-B2 in fig. 7, and fig. 9 schematically shows a section C1-C2 in fig. 7.

The reflector 300X of the present embodiment includes: a1 st and 2 nd reflector bodies 310XX, 310XY that are cylindrical; and a bottom plate portion 320X provided below the 2 nd reflector body 310 XY. The reflector 300X of the present embodiment also includes a partition 315X provided between the 1 st reflector body 310XX and the 2 nd reflector body 310 XY.

In the reflector 300X of the present embodiment, a lid is also provided above the 1 st reflector body 310. However, the lid portion is the same as that described in embodiment 1, and therefore, illustration and detailed description thereof are omitted. The same description as in embodiment 1 above is also applied to the point that the reflector 300X of the present embodiment is mounted on the mounting table and can be adjusted in tilt with respect to the mounting table, and therefore the description thereof is omitted. In this embodiment, the 1 st pipe 50 and the 2 nd pipe 60 shown in the above embodiment 1 are also connected to the reflector 300X. In the case of this embodiment, two 1 st pipes 50 and two 2 nd pipes 60 are connected.

In the 1 st reflector body 310XX of the reflector 300X, a coolant chamber 311XX that is provided so as to extend along an inner wall surface 312XX of the 1 st reflector body 310XX and through which the coolant L flows is provided. The inner wall surface 312XX of the 1 st reflector body 310XX functions as a reflection surface for reflecting heat from a heating body (not shown). Further, the cooling liquid chamber 311XX of the present embodiment is formed by a cylindrical space.

Further, a coolant chamber 311XY, which is provided along the inner wall surface 312XY of the 2 nd reflector body 310XY and through which the coolant L flows, is also provided inside the 2 nd reflector body 310 XY. The inner wall surface 312XY of the 2 nd reflector body 310XY functions as a reflecting surface for reflecting heat from the heating body (not shown). Further, the cooling liquid chamber 311XY of the present embodiment is also formed by a cylindrical space.

As such, in the reflector 300X of the present embodiment, the cooling liquid chambers 311XX, 311XY are provided so as to be divided in the up-down direction.

In the case of the present embodiment, a supply pipe 370X for supplying the cooling liquid L to the cooling liquid chamber 311XX of the 1 st reflector body 310XX is provided so as to pass through the cooling liquid chamber 311XY of the 2 nd reflector body 310 XY. Further, a drain pipe 340XX for discharging the coolant L from below the coolant chamber 311XX is provided in the coolant chamber 311XX of the 1 st reflector body 310 XX. The drain pipe 340XX is provided to pass through the cooling liquid chamber 311XY of the 2 nd reflector body 310 XY.

Further, a supply passage 321XX through which the cooling liquid L is supplied and a discharge passage 322XX through which the cooling liquid L is discharged are provided in the bottom plate portion 320X of the reflector 300X. Further, one end of the drain pipe 340XX is positioned above the inside of the cooling liquid chamber 311XX of the 1 st reflector body 310XX, and the other end is connected to the drain passage 322 XX. The opening provided in the end surface on one end side of the drain pipe 340XX is configured to face upward.

Further, the cooling liquid chamber 311XY of the 2 nd reflector body 310XY is provided with a drain pipe 340XY for discharging the cooling liquid L from below the cooling liquid chamber 311 XY.

The bottom plate portion 320X of the reflector 300X is provided with a supply passage 321XY that is provided from the bottom surface of the reflector 300X to the inside of the cooling liquid chamber 311XY of the 2 nd reflector body 310XY and that supplies the cooling liquid L. Further, the bottom plate portion 320X is provided with a discharge passage 322XY which is provided from the inside of the cooling liquid chamber 311XY of the 2 nd reflector body 310XY to the bottom surface of the reflector 300X and through which the cooling liquid L is discharged. One end of the drain pipe 340XY is positioned above the cooling liquid chamber 311XY, and the other end is connected to the drain passage 322 XY. The opening provided in the end surface of one end side of the drain pipe 340XY is configured to face upward.

As described above, the cooling liquid chambers 311XX, 311XY are provided on the 1 st reflector body 310XX and the 2 nd reflector body 310XY, respectively. Further, the 1 st reflector body 310XX and the 2 nd reflector body 310XY are provided with supply passages 321XX, 321XY, discharge passages 322XX, 322XY, and drain pipes 340XX, 340XY, respectively. The 1 st pipe 50 is connected to the supply passages 321XX, 321XY, respectively, and the 2 nd pipe 60 is connected to the discharge passages 322XX, 322XY, respectively. The structure and connection structure of the 1 st pipe 50 and the 2 nd pipe 60 are the same as those described in embodiment 1 above, and therefore, the illustration and detailed description thereof are omitted.

The flow patterns of the coolant L in the reflector 300X configured as described above will be described as the 1 st reflector body 310XX and the 2 nd reflector body 310XY, respectively.

(about the 1 st reflector body 310XX)

As shown in fig. 8, the coolant L is supplied from the supply passage 321XX into the coolant chamber 311XX through the supply tube 370X. Then, as the coolant L increases, the liquid surface of the coolant L gradually rises in the coolant chamber 311XX (see the solid arrow mark in fig. 8). When the liquid level of the coolant L exceeds the upper end position H1 of the drain pipe 340XX, the coolant L enters the drain pipe 340XX through an opening at the upper end (end face on one end side) of the drain pipe 340XX and falls by gravity (see the broken-line arrow mark in fig. 8). Thereafter, the coolant L passes through the discharge passage 322XX and is discharged to the outside of the chamber 20.

(about the 2 nd reflector body 310XY)

As shown in fig. 9, the coolant L is supplied from the supply passage 321XY into the coolant chamber 311 XY. Further, as the coolant L increases, the liquid level of the coolant L gradually rises in the coolant chamber 311XY (see solid arrow marks in fig. 9). When the liquid level of the coolant L exceeds the upper end position H2 of the drain pipe 340XY, the coolant L enters the drain pipe 340XY through the opening at the upper end (end surface on one end side) of the drain pipe 340XY and falls down by gravity (see the broken-line arrow mark in fig. 9). Thereafter, the coolant L passes through the discharge passage 322XY and is discharged to the outside of the chamber 20.

Even when the reflector 300X of the present embodiment configured as described above is applied to an evaporation source, the same effects as those in the case of embodiment 1 can be obtained. Further, in the case of the present embodiment, the cooling liquid chambers 311XX, 311XY are provided so as to be divided in the up-down direction. Therefore, by changing the temperature of the coolant L supplied to the coolant chambers 311XX and 311XY, the degree of cooling can be changed in the vertical direction of the reflector 300X. That is, as described above, it is preferable that the upper side of the crucible is not cooled too much. In the case of embodiment 1 described above, the temperature of the coolant L in the coolant chamber 311 can also be formed in a temperature distribution in which the temperature increases from below toward above. However, when the temperature at the upper side is further increased and the temperature at the lower side is decreased, it is effective to use the reflector 300X of the present embodiment.

In addition, although the embodiment has been described as the case where the coolant chamber is divided into 2 sections in the vertical direction, the coolant chamber may be divided into 3 sections or more in the vertical direction. In this embodiment, as in the case of embodiment 1, it is also preferable to provide the cylindrical reflector 410 and the plate-shaped reflector 420.

(example 3)

Embodiment 3 of the present invention is shown in fig. 10 and 11. The present embodiment shows a configuration in which the structure of the reflector serving as the heat shielding structure is different from that in the case of embodiment 1. Since the structure described in embodiment 1 can be applied to the structure other than the reflector, only the structure of the reflector will be described in this embodiment.

Fig. 10 is a schematic plan view of the reflector 300Y with the lid portion removed. In fig. 11, members related to the flow pattern of the coolant L are schematically shown in the internal structure of the reflector 300Y in order to facilitate recognition of the flow pattern of the coolant L. Fig. 11 corresponds to a diagram schematically showing the cross-section D1-D2 in fig. 10, and also corresponds to a diagram schematically showing the cross-section E1-E2 in fig. 10.

The reflector 300Y of the present embodiment includes a1 st reflector body 310YX and a2 nd reflector body 310YY each having a semi-cylindrical shape (a shape in which a cylindrical shape is cut on a surface including a central axis of the cylinder). Since the 1 st reflector body 310YX and the 2 nd reflector body 310YY have the same configuration, the description will be given below centering on the 1 st reflector body 310YX, and the description of the 2 nd reflector body 310YY will be omitted as appropriate.

The reflector 300Y of the present embodiment also includes a bottom plate 320Y below the 1 st reflector body 310 YX. The reflector 300Y of the present embodiment also includes a lid portion above the 1 st reflector body 310. However, the shape of the lid portion is different from that of the reflector body, but the basic configuration is the same as that of example 1, and therefore, the illustration and the detailed description are omitted. Note that the reflector 300Y of the present embodiment is the same as that described in embodiment 1 above in that it is placed on the mounting table and can be adjusted in tilt with respect to the mounting table, and therefore the description thereof is omitted. In this embodiment, the 1 st pipe 50 and the 2 nd pipe 60 shown in the above embodiment 1 are also connected to the reflector 300Y. In the case of this embodiment, two 1 st pipes 50 and two 2 nd pipes 60 are connected. In other words, the 1 st and 2

nd pipes

50 and 60 are connected to the 1 st and 2 nd reflector bodies 310YX and 310YY, respectively.

The reflector 300Y has a coolant chamber 311Y provided along the inner wall surface 312Y of the 1 st reflector body 310YX and through which the coolant L flows, inside the 1 st reflector body 310 YX. The inner wall surface 312Y of the 1 st reflector body 310YX functions as a reflecting surface for reflecting heat from a heating body (not shown). Further, the coolant chamber 311Y of the present embodiment is formed by a semi-cylindrical space.

As described above, the 2 nd reflector body 310YY has the same structure as the 1 st reflector body 310 YX. Thus, in the present embodiment, the reflector 300Y as the heat shielding structure is provided so as to be divided in the circumferential direction, and the cooling liquid chambers 311Y are provided inside the 1 st reflector body 310YX and the 2 nd reflector body 310YY, respectively.

In this embodiment, as in the case of the above-described embodiment 1, the drain pipe 340Y for discharging the coolant L from below the coolant chamber 311Y is provided in the coolant chamber 311Y of the 1 st reflector body 310 YX.

The bottom plate portion 320Y of the reflector 300Y is provided with a supply passage 321Y that is provided from the bottom surface of the reflector 300Y into the coolant chamber 311Y and that supplies the coolant L. The bottom plate portion 320Y is provided with a discharge passage 322Y that is provided from the inside of the coolant chamber 311Y to the bottom surface of the reflector 300Y and discharges the coolant L. One end of the drain pipe 340Y is positioned above the coolant chamber 311Y, and the other end is connected to the discharge passage 322Y. The opening provided in the end surface of one end side of the drain pipe 340Y is configured to face upward.

As described above, the 2 nd reflector body 310YY has the same structure as the 1 st reflector body 310 YX. Thus, the cooling liquid chambers 311Y are provided in the 1 st reflector body 310YX and the 2 nd reflector body 310YY, respectively. Further, the 1 st reflector body 310YX and the 2 nd reflector body 310YY are provided with a supply passage 321Y, a discharge passage 322Y, and a discharge pipe 340Y, respectively. The 1 st pipe 50 is connected to each supply passage 321Y, and the 2 nd pipe 60 is connected to each discharge passage 322Y. The structure and connection structure of the 1 st pipe 50 and the 2 nd pipe 60 are the same as those described in embodiment 1 above, and therefore, the illustration and detailed description thereof are omitted.

The flow pattern of the coolant L in the reflector 300Y configured as described above will be described.

As shown in fig. 11, in the 1 st reflector body 310YX, the coolant L is supplied from the supply passage 321Y into the coolant chamber 311Y. Then, the liquid level of the coolant L gradually rises in the coolant chamber 311Y as the coolant L increases (see the solid arrow mark in fig. 11). When the liquid level of the coolant L exceeds the upper end position H of the drain pipe 340Y, the coolant L enters the drain pipe 340Y from the opening portion of the upper end (end surface on one end side) of the drain pipe 340Y, and falls by gravity (see the broken-line arrow mark in fig. 11). Thereafter, the coolant L passes through the discharge passage 322Y and is discharged to the outside of the chamber. The same applies to the 2 nd reflector body 310 YY.

Even when the reflector 300X of the present embodiment configured as described above is applied to an evaporation source, the same effects as those in the case of embodiment 1 can be obtained. In the case of this embodiment, as a heating method for heating the crucible, a high-frequency induction heating method is effective. The reason for this will be described below.

In the case of using the high-frequency induction heating method, as in the above-described examples 1 and 2, when the cylindrical reflector body is used and the reflector body is made of a conductive material, eddy current is generated in the reflector body even when current flows through the heating coil. In contrast, in the case of the reflector 300Y of the present embodiment, since the reflector is divided in the circumferential direction, no eddy current is generated in the reflector 300Y even if a current flows through the heating coil. In the illustrated example, a gap is provided between the 1 st reflector body 310YX and the 2 nd reflector body 310 YY. However, a configuration may be adopted in which the 1 st reflector body 310YX and the 2 nd reflector body 310YY are connected with a member made of a non-conductive material provided in the gap.

Although the reflector 300Y is divided into 2 segments in the circumferential direction in the present embodiment, the reflector may be divided into 3 segments or more in the circumferential direction. In addition to the structure in which the reflector is divided in the circumferential direction as in the present embodiment, a structure in which the coolant chamber is divided into a plurality of sections in the vertical direction as described in embodiment 2 above may be employed. In this embodiment, as in the case of the above-described embodiment 1, it is preferable that a reflector for reflecting heat from a heating body (not shown) is provided between the inner wall surface 312Y of the reflector main body (the 1 st reflector main body 310YX and the 2 nd reflector main body 310YY) and the heating body (not shown). In order to prevent the generation of eddy current, it is also preferable to use a reflector made of a semi-cylindrical member. Further, a plate-shaped reflector for reflecting heat from the heating body is preferably provided between the heating body and the bottom plate portion 320Y. The plate-like reflector is also preferably shaped so as not to generate eddy current.

(others)

As described in example 3, when the high-frequency induction heating system is employed, if a cylindrical reflector body is employed and the reflector body is made of a conductive material, eddy current is generated in the reflector body even when current flows through the heating coil. In order to prevent this, a reflector body having a shape in which slits extending in the axial direction are provided in 1 circumferential portion with respect to the cylindrical shape may be used. In this case, the reflector body and the coolant chamber have a C-shape when viewed from above.

The cylindrical reflector 410 and the plate-shaped reflector 420 shown in example 1 can be provided not only as one reflector but also as a plurality of reflectors. The same applies to examples 2 and 3. Further, a configuration may be adopted in which only the cylindrical reflector 410 is provided and the plate reflector 420 is not provided. In the above embodiments, the heat shielding structure is constituted by the reflector. However, when a cylindrical reflector or a plate-shaped reflector is provided, the heat shielding structure may not be a reflector. In other words, the heat shielding structure may not have a heat reflection function. In addition, when the heat shielding structure is a reflector, a structure in which the cylindrical reflector and the plate-shaped reflector are not provided may be employed.

Description of reference numerals

1. An evaporation device; 10. an evaporation source; 20. a chamber; 70. a substrate; 100. a crucible; 200. a heating body; 300. 300X, 300Y, reflector; 310. 310XX, 310XY, 310YX, 310YY, reflector body; 311. 311XX, 311XY, 311Y, a coolant chamber; 312. 312XX, 312XY, 312Y, inner wall surface; 320. 320X, 320Y, a bottom plate portion; 321. 321XX, 321XY, 321Y, supply path; 322. 322XX, 322XY, 322Y, discharge path; 330. a cover portion; 340. 340XX, 340XY, 340Y, a drain pipe; 350. a mounting table; 360. a threaded part; l, cooling liquid.

Claims

1. An evaporation source is provided with:

a crucible for accommodating a material to be vapor-deposited on a substrate;

it is characterized in that the preparation method is characterized in that,

the evaporation source includes:

a coolant chamber which is provided inside the heat shield structure so as to be along an inner wall surface of the heat shield structure and through which coolant flows; and

2. The evaporation source according to claim 1,

the evaporation source includes a supply passage that is provided from the bottom surface of the heat shield structure to the cooling liquid chamber and supplies the cooling liquid.

3. An evaporation source according to claim 1 or 2,

the evaporation source includes a discharge passage which is provided from the cooling liquid chamber to the bottom surface of the heat shield structure and discharges the cooling liquid,

one end of the liquid discharge pipe is positioned above the inside of the cooling liquid chamber, and the other end of the liquid discharge pipe is connected to the discharge passage.

4. An evaporation source according to claim 1 or 2,

an opening portion provided in an end surface of one end side of the drain pipe faces upward.

5. An evaporation source according to claim 1 or 2,

the coolant chamber is formed by a cylindrical space.

6. An evaporation source according to claim 1 or 2,

the plurality of cooling liquid chambers are provided so as to be divided in the vertical direction.

7. An evaporation source according to claim 1 or 2,

the heat shield structure is provided in plurality so as to be divided in the circumferential direction, and each of the heat shield structures has a coolant chamber therein.

8. An evaporation source according to claim 1 or 2,

a reflector for reflecting heat from the heating body is provided between the heat shield structure and the heating body.

9. A vapor deposition apparatus is characterized in that,

the vapor deposition device is provided with:

an evaporation source according to any one of claims 1 to 8; and

a chamber in which the evaporation source is disposed.

10. The deposition apparatus according to claim 9,

the vapor deposition device is provided with:

a mounting table of the heat shield structure;

a tilt adjustment mechanism that adjusts a tilt of the heat shield structure with respect to the mounting table;

a1 st pipe which is provided so as to be inserted into a1 st insertion hole formed in the chamber and through which the cooling liquid supplied into the cooling liquid chamber flows;

a1 st gasket made of an elastic material for sealing an annular gap between the 1 st pipe and the 1 st insertion hole;

a2 nd pipe which is provided so as to be inserted into a2 nd insertion hole formed in the chamber and through which the cooling liquid discharged from the cooling liquid chamber flows; and

the 2 nd gasket made of an elastic material seals an annular gap between the 2 nd pipe and the 2 nd insertion hole.

11. The deposition apparatus according to claim 10,

the tilt adjusting mechanism is composed of a plurality of screw members for adjusting the distance between the mounting table and the heat shielding structure at respective positions.