CN104114664A - 形成成型研磨颗粒 - Google Patents
形成成型研磨颗粒 Download PDFInfo
- Publication number
- CN104114664A CN104114664A CN201280069786.1A CN201280069786A CN104114664A CN 104114664 A CN104114664 A CN 104114664A CN 201280069786 A CN201280069786 A CN 201280069786A CN 104114664 A CN104114664 A CN 104114664A
- Authority
- CN
- China
- Prior art keywords
- silk screen
- release
- band
- blade
- abrasive grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0063—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by extrusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
- B01J2/20—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic by expressing the material, e.g. through sieves and fragmenting the extruded length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
- B01J2/26—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic on endless conveyor belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B13/00—Feeding the unshaped material to moulds or apparatus for producing shaped articles; Discharging shaped articles from such moulds or apparatus
- B28B13/02—Feeding the unshaped material to moulds or apparatus for producing shaped articles
- B28B13/0205—Feeding the unshaped material to moulds or apparatus for producing shaped articles supplied to the moulding device in form of a coherent mass of material, e.g. a lump or an already partially preshaped tablet, pastil or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B13/00—Feeding the unshaped material to moulds or apparatus for producing shaped articles; Discharging shaped articles from such moulds or apparatus
- B28B13/04—Discharging the shaped articles
- B28B13/06—Removing the shaped articles from moulds
- B28B13/062—Removing the shaped articles from moulds by elastically deforming the mould, e.g. bending flexible moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B5/00—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping
- B28B5/02—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping on conveyors of the endless-belt or chain type
- B28B5/021—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping on conveyors of the endless-belt or chain type the shaped articles being of definite length
- B28B5/025—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping on conveyors of the endless-belt or chain type the shaped articles being of definite length the moulds or the moulding surfaces being divided by separating walls and being continuously fed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B7/00—Moulds; Cores; Mandrels
- B28B7/24—Unitary mould structures with a plurality of moulding spaces, e.g. moulds divided into multiple moulding spaces by integratable partitions, mould part structures providing a number of moulding spaces in mutual co-operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract
本发明提供一种形成成型研磨颗粒的方法,所述方法包括在施加区内挤出混合物到丝网中的开口中,和平移丝网和带至释放区并分离丝网和带以在带上形成前体成型研磨颗粒,其中所述丝网和带在至少约15°并且不大于约45°的释放角下分离,其中所述释放角定义为丝网的表面与带的表面之间的角度。
Description
技术领域
下文涉及成型研磨颗粒,更具体而言,涉及形成成型研磨颗粒的丝网印刷方法和所得的颗粒。
背景技术
引入了研磨颗粒的研磨制品可用于各种材料移除操作,包括研磨、精整、抛光等。取决于研磨材料的类型,此类研磨颗粒可能在物品的制造中各种材料的成型或研磨中有用。迄今已配制了具有特定几何形状的某些类型研磨颗粒例如三角形形状研磨颗粒和引入了此类物体的研磨制品。参见例如美国专利第5,201,916号、第5,366,523号和第5,984,988号。
先前,已采用三种基本的技术来生产具有指定形状的研磨颗粒,其为熔合、烧结和化学陶瓷。在熔合方法中,研磨颗粒可通过其面可经或可未经雕刻的冷却辊、向其中灌注熔融材料的模具或浸没在氧化铝熔体中的吸热材料来成型。参见例如美国专利第3,377,660号。在烧结方法中,研磨颗粒可自粒度为至多10微米直径的难熔粉末形成。可与润滑剂和合适的溶剂一起向粉末中加入粘结剂以形成可成型为各种长度和直径的片状物或棒的混合物。参见例如美国专利第3,079,242号。化学陶瓷技术涉及将胶态分散体或水溶胶(有时称为溶胶)转化为凝胶或将约束组分的活动性的任何其它物理状态、干燥并烧制来获得陶瓷材料。参见例如美国专利第4,744,802号和第4,848,041号。
工业继续需要改进的研磨材料和研磨制品。
发明内容
根据一个方面,形成成型研磨颗粒的方法包括在施加区内挤出混合物到丝网中的开口中,和平移丝网和带至释放区并分离丝网和带以在带上形成前体成型研磨颗粒,其中所述丝网和带在至少约15°并且不大于约45°的释放角下分离,其中所述释放角定义为丝网的表面与带的表面之间的角度。
在又一个方面,形成成型研磨颗粒的方法包括在施加区内挤出混合物通过模头的模头开口并到模头开口下面的丝网的开口中,和在与模头的表面一体地形成的刀刃下平移丝网的同时迫使至少一部分混合物进入到开口中。
在再一个方面,用于形成成型研磨颗粒的系统包括模头和刀刃,所述模头具有构造为容纳混合物的贮存器和构造为使混合物通过其中的模头开口,所述刀刃与模头一体地形成并包含易受侵蚀材料。
根据一个特定的方面,用于形成成型研磨颗粒的系统包括具有模头开口的模头、施加区内模头开口下面的丝网、施加区内丝网下面的带和用于改变丝网与带之间的释放角的部件,其中所述释放角定义为释放区中丝网的表面与带的表面之间的角度或由释放区中带的曲率限定的带的释放半径。
附图说明
通过参考附图,可更好地理解本发明,并且其众多特征和优势将是本领域技术人员显而易见的。
图1示出了根据一个实施例的用于形成成型研磨颗粒的系统的示意图。
图2示出了根据一个实施例的图1系统的一部分的示意。
图3示出了根据一个实施例的用于形成成型研磨颗粒的系统的示意。
图4示出了根据一个实施例的用于形成成型研磨颗粒的系统的一部分的示意。
图5示出了根据一个实施例的丝网的一部分。
图6A到6C示出了根据一个实施例的成型研磨颗粒的透视示意图。
图7示出了根据一个实施例的包含成型研磨颗粒的涂覆磨料。
图8示出了根据一个实施例的包含成型研磨颗粒的粘结磨料。
图9A和9B示出了根据丝网印刷方法形成的前体成型研磨颗粒的图。
图10A和10B示出了根据本文中的一个实施例的丝网印刷方法形成的前体成型研磨颗粒的图。
具体实施方式
本文中的系统和方法可用于形成成型研磨颗粒。所述成型研磨颗粒可用在各种应用中,包括例如涂覆磨料、粘结磨料、游离磨料以及它们的组合。成型研磨颗粒还可得到各种其它使用。
图1示出了根据一个实施例的用于形成成型研磨颗粒的系统的示意。如图所示,系统100可包括丝网151,其构造为在辊170和171之间平移。应理解,丝网151可在更大数量的辊或其它装置(如果如此需要的话)上平移。如图所示,系统100可包括带109,其构造为在辊172和173上方沿方向116平移。应理解,带109可在更大数量的辊或其它装置(如果如此需要的话)上方平移。
如图所示,系统100可还包括模头103,其构造为进行容纳在模头103的贮存器102内的混合物101的挤出。形成成型研磨颗粒的过程可通过形成包含陶瓷材料和液体的混合物101来开始。特别地,混合物101可为由陶瓷粉末材料和液体形成的凝胶,其中所述凝胶可表征为甚至在生坯(即,未烧制)状态也具有保持给定形状的能力的形状稳定材料。根据一个实施例,所述凝胶可由呈离散颗粒的一体化网络的陶瓷粉末材料形成。
混合物101可形成为具有特定含量的固体材料如陶瓷粉末材料。例如,在一个实施例中,混合物101可具有混合物101的总重量的至少约25重量%、例如至少约35重量%或甚至至少约42重量%的固体含量。此外,在至少一个非限制性实施例中,混合物101的固体含量还可不大于约75重量%,例如不大于约70重量%、不大于约65重量%或甚至不大于约55重量%。应理解,混合物101中固体材料的含量可在任意上面提及的最小百分数和最大百分数之间的范围内。
根据一个实施例,陶瓷粉末材料可包括氧化物、氮化物、碳化物、硼化物、碳氧化物、氮氧化物以及它们的组合。在特定的情况下,陶瓷材料可包括氧化铝。更具体而言,陶瓷材料可包括勃姆石材料,其可为α氧化铝的前体。术语“勃姆石”在本文中通常用来指氧化铝水合物,包括通常为Al2O3·H2O并具有大约15%的含水量的矿物勃姆石以及具有高于15%、例如20-38重量%的含水量的拟勃姆石。应指出,勃姆石(包括拟勃姆石)具有特定的并可识别的晶体结构和因此独特的X-射线衍射图案,并因此不同于其它含铝材料,包括其它水合氧化铝如ATH(氢氧化铝),本文中为勃姆石微粒材料的制备而使用的一种常用前体材料。
此外,混合物101可形成为具有特定含量的液体材料。一些合适的液体可包括有机材料,如水。根据一个实施例,混合物101可形成为具有小于混合物101的固体含量的液体含量。在更特定的情况下,混合物101可具有混合物101的总重量的至少约25重量%的液体含量。在其它情况下,混合物101内液体的量可更大,例如至少约35重量%、至少约45重量%、至少约50重量%或甚至至少约58重量%。此外,在至少一个非限制性实施例中,混合物的液体含量还可不大于约75重量%,例如不大于约70重量%、不大于约65重量%、不大于约60重量%或甚至不大于约55重量%。应理解,混合物101中液体的含量可在任意上面提及的最小百分数和最大百分数之间的范围内。
此外,为促进根据本文中的实施例的成型研磨颗粒的加工和形成,混合物101可具有特定的储能模量。例如,混合物101可具有至少约1×104Pa、例如至少约4×104Pa或甚至至少约5×104Pa的储能模量。然而,在至少一个非限制性实施例中,混合物101可具有不大于约1×107Pa、例如不大于约1×106Pa的储能模量。应理解,混合物101的储能模量可在任意上面提及的最小值和最大值之间的范围内。储能模量可使用具有Peltier板温度控制系统的ARES或AR-G2旋转流变仪经由平行板系统测量。对于测试,混合物101可在设置为彼此分开大约8mm的两个板之间的间隙内挤出。在向间隙中挤出凝胶后,使限定间隙的两个板之间的距离减至2mm直至混合物101完全填充板之间的间隙。在擦去过量的混合物后,将间隙减小0.1mm并开始测试。所述测试为振荡应变扫描测试,以应变范围介于01%至100%之间的仪器设置在6.28rad/s(1Hz)下使用25-mm平行板进行并且记录的每十倍频率的点(points per decade)为10。在测试完成后1小时内,再次将间隙减小0.1mm并重复测试。测试可重复至少6次。第一次测试可不同于第二和第三次测试。对于每个试样,仅应报告来自第二和第三次测试的结果。粘度可通过用储能模量值除以6.28s-1来计算。
此外,为促进根据本文中的实施例的成型研磨颗粒的加工和形成,混合物101可具有特定的粘度。例如,混合物101可具有至少约4×103Pa s、至少约5×103Pa s、至少约6×103Pa s、至少约8×103Pa s、至少约10×103Pas、至少约20×103Pa s、至少约30×103Pa s、至少约40×103Pa s、至少约50×103Pa s、至少约60×103Pa s或甚至至少约65×103Pa s的粘度。在至少一个非限制性实施例中,混合物101可具有不大于约1×106Pa s、不大于约5×105Pa s、不大于约3×105Pa s或甚至不大于约2×105Pa s的粘度。应理解,混合物101的粘度可在任意上面提及的最小值和最大值之间的范围内。粘度可以与如上所述储能模量相同的方式测量。
此外,混合物101可形成为具有特定含量的有机材料,包括例如可与所述液体不同的有机添加剂,以促进根据本文中的实施例的成型研磨颗粒的加工和形成。一些合适的有机添加剂可包括稳定剂、粘结剂(如果糖、蔗糖、乳糖、葡萄糖)、可UV固化树脂等。
显著的是,本文中的实施例可采用与常规带材流延操作中所用浆料不同的混合物101。例如,与混合物101内的其它组分相比,混合物101内有机材料(特别是任何上述有机添加剂)的含量可为少数量。在至少一个实施例中,混合物101可形成为具有不大于混合物101的总重量的约30重量%的有机材料。在其它情况下,有机材料的量可更小,例如不大于约15重量%、不大于约10重量%或甚至不大于约5重量%。此外,在至少一个非限制性实施例中,混合物101内有机材料的量还可为混合物101的总重量的至少约0.5重量%。应理解,混合物101中有机材料的量可在任意上面提及的最小值和最大值之间的范围内。
此外,混合物101可形成为具有特定含量的不同于所述液体的酸或碱,以促进根据本文中的实施例的成型研磨颗粒的加工和形成。一些合适的酸或碱可包括硝酸、硫酸、柠檬酸、氯酸、酒石酸、磷酸、硝酸铵、柠檬酸铵。根据一个特定的实施例,使用柠檬酸添加剂,混合物101可具有小于约5、更特别地在约2和约4之间的范围内的pH。
看图1和2,混合物101可在模头103的内部内提供并构造为通过位于模头103的一端处的模头开口105挤出。如图进一步所示,挤出可包括在混合物101上施加力180(或压力)以促进混合物101挤出通过模头开口105。根据一个实施例,挤出过程中可采用特定的压力。例如,所述压力可为至少约10kPa,例如至少约500kPa。此外,在至少一个非限制性实施例中,挤出过程中采用的压力还可不大于约4MPa。应理解,用以挤出混合物101的压力可在任意上面提及的最小值和最大值之间的范围内。
在特定的情况下,混合物101可通过靠近丝网151的模头103端部处的模头开口105挤出。根据一个实施例,丝网151可在特定的速率下沿方向153平移以促进合适的加工。显著的是,丝网151可平移通过包括模头开口105在内的施加区183以促进前体成型研磨颗粒的形成。丝网151可在至少约3cm/s的速率下平移通过施加区。在其它实施例中,丝网151的平移速率可更大,例如至少约4cm/s、至少约6cm/s、至少约8cm/s或甚至至少约10cm/s。此外,在至少一个非限制性实施例中,丝网151还可在不大于约5m/s、例如不大于约1m/s或甚至不大于约0.5m/s的速率下沿方向153平移。应理解,丝网151可在任意上面提及的最小值和最大值之间的范围内的速率下平移。
另外,带109可在特定的速率下沿方向116平移以促进合适的加工。例如,带109可在至少约3cm/s的速率下平移。在一个实施例中,带109的平移速率可更大,例如至少约4cm/s、至少约6cm/s、至少约8cm/s或甚至至少约10cm/s。此外,在至少一个非限制性实施例中,带109还可在不大于约5m/s、例如不大于约1m/s或甚至不大于约0.5m/s的速率下沿方向116平移。应理解,带109可在任意上面提及的最小值和最大值之间的范围内的速率下平移。
根据一个特定的实施例,丝网151可在与带109的平移速率相比特定的速率下平移。例如,在施加区183内,丝网151可在与带109的平移基本相同的速率下平移。也就是说,基于丝网151的平移速率计,丝网和带之间平移速率的差异可不大于约5%,例如不大于约3%或甚至不大于约1%。
如图所示,系统100可包括施加区183,施加区183包括模头103的模头开口105。在施加区183内,混合物101可自模头103挤出并直接挤出到丝网151上。更特别地,混合物101的一部分可自模头开口105挤出,并进一步挤出通过丝网151中的一个或多个开口而到下面的带109上。
简要地看图5,其示意了丝网151的一部分。如图所示,丝网151可包括开口152,更特别地,包括多个开口152。开口可延伸通过丝网151的体积以促进混合物101通过开口并到带109上。根据一个实施例,开口152可具有二维形状,如在由丝网的长度(1)和宽度(w)所限定的平面中所观察到。虽然开口152示意为具有三角形二维形状,但也涵盖其它形状。例如,开口152可具有二维形状如多边形、椭圆形、数字、希腊字母表字母、拉丁字母表字母、俄语字母表字符、包括多边形形状的组合的复杂形状以及它们的组合。在特定的情况下,开口152可具有二维多边形形状如三角形、矩形、四边形、五边形、六边形、七边形、八边形、九边形、十边形以及它们的组合。此外,丝网151可形成为包括具有多种不同的二维形状的开口152的组合。
再看图1,在迫使混合物101通过模头开口105以及一部分混合物101通过丝网151中的开口152后,前体成型研磨颗粒153可被印刷在设置于丝网151之下的带109上。根据一个特定的实施例,前体成型研磨颗粒153可具有基本上复制开口152的形状的形状。
在挤出混合物101到丝网151的开口152中后,可将带109和丝网151平移到释放区185,在其中,带109和丝网151可分离以促进前体成型研磨颗粒的形成。根据一个实施例,丝网151和带109可在释放区185内于特定的释放角155下彼此分离。根据特定的实施例,释放角155可为丝网151的下表面154与带109的上表面156之间的角度的量度。
根据一个实施例,释放角155可经特别控制以促进成型研磨颗粒的合适形成。例如,根据一个实施例,释放角可为至少约15°并且不大于约45°。在更特定的情况下,释放角155可为至少约18°,例如至少约20°、至少约22°、至少约24°或甚至至少约26°。然而,此外,释放角还可不大于约42°,例如不大于约40°、不大于约38°或甚至不大于约36°。应理解,释放角可在任意上面提及的最小值和最大值之间的范围内。
显著的是,可以快速方式迫使混合物101通过丝网151,以便混合物101在开口152内的平均停留时间可小于约2分钟、小于约1分钟、小于约40秒或甚至小于约20秒。在特定的非限制性实施例中,混合物101可在印刷过程中随其行进通过丝网开口152时基本不变,从而在组分的量方面不经历改变,并可在丝网151的开口152中不经历可感知的干燥。
图2示出了根据一个实施例的图1系统的一部分。如图所示,系统200可包括模头103,模头103具有含混合物101的贮存器102。根据一个实施例,在加工过程中,可将混合物101置于沿方向180的压力下以促进混合物101沿方向191挤出通过模头开口105。根据一个实施例,丝网151可沿相对于挤出方向191成角度的方向153平移。如图所示,丝网151的平移方向153与挤出方向191之间的角度可为基本正交(90°)。然而,在其它实施例中,所述角度可不同,例如为锐角或者钝角。
如图进一步所示,丝网151下面的带109可相对于挤出方向191沿特定的方向116平移。根据本文中的一个实施例,带109可沿一定的方向平移以使得平移方向116与挤出方向191之间的角度包括上面关于丝网151提及的任何那些实施例。
如图进一步所示,在施加区183内挤出的过程中,丝网151可与带109的一部分直接接触。此外,在施加区183内挤出的过程中,混合物101可被挤出通过模头开口105并可经由刀刃107被迫使进入丝网151内的开口152中。模头103可具有与模头103的本体一体地形成的刀刃107。在特定的情况下,刀刃107可定位在模头103上以在从模头开口105挤出混合物101时促进啮合混合物101。根据一个实施例,刀刃107可定位为使得其构造为啮合丝网151的上表面158。因此,在挤出过程中,混合物101可经由刀刃107被迫使进入丝网151的开口152中。
在特定的情况下,刀刃107可与模头103一体地形成。因此,刀刃107可由与模头103的材料相同的材料制成。在其它实施例中,刀刃107可由与模头103的材料相比不同的材料制成。
根据一个实施例,刀刃107可促进刀刃107与丝网151之间的力的初始平衡,并因此促进合适的加工参数。刀刃107可构造为在使用的过程中磨损以便系统100中力平衡。在更特定的情况下,刀刃107形成为使得刀刃107的表面的至少一部分可在与丝网151接触的同时磨损。
刀刃可包括易受侵蚀表面,更特别地包括与丝网151的上表面158接触的表面。包含易受侵蚀材料、更特别地包括与丝网151接触的易受侵蚀材料的刀刃107的使用可促进加工过程中刀刃107的合适磨损。用于刀刃107的一些合适的材料可包括聚合物材料。更特别地,所述聚合物材料可为氟化聚合物,例如聚四氟乙烯(PTFE)。根据一个实施例,刀刃107可基本上由PTFE构成。
如图进一步所示,刀刃107可形成为具有特定的尺寸。例如,刀刃107可延伸至少约0.5mm、例如至少约1mm或甚至至少约2mm的高度。
此外,刀刃107可形成为具有特定的接触表面176。接触表面176可为已因接触丝网141而磨平的刀刃107的区域并可具有基本上平面的轮廓。此外,接触表面176可具有特定的尺寸以促进根据本文中的实施例的成型研磨颗粒的加工和形成。例如,接触表面176可具有至少约0.01mm、例如至少约0.05mm、至少约0.08mm、至少约0.1mm、至少约0.4mm、至少约0.8mm或甚至至少约1mm的宽度178。此外,刀刃107的接触表面176的宽度178还可不大于约20mm,例如不大于约10mm或甚至不大于约3mm。应理解,接触表面176的宽度178可在任意上面提及的最小值和最大值之间的范围内。
如图进一步所示,混合物101可被挤出通过模头开口105并可经由刀刃107被迫使进入丝网151中的开口152中。随着丝网151平移到施加区中,丝网151中的开口152可基本上是打开并且未填充的。然而,在丝网151在模头开口105和刀刃107之下通过后,开口152可被填充以混合物101。如应理解,丝网151与带109一分离,开口152内的混合物101即可保留在带109上,从而使得形成前体成型研磨颗粒。
图3示出了根据一个实施例的用于形成成型研磨颗粒的系统的示意。如图所示,该系统可包括施加区183,施加区183包括模头103,混合物101可在其中施加到丝网151和带109。如图进一步所示,系统300可包括定位在释放区185内的定向适配器186。定向适配器186可构造为接触带109的表面并可改变带109相对于丝网151的位置。在某些情况下,定向适配器186可接触带109的上表面156。根据一个实施例,定向适配器186可在释放区185内至少第一位置和第二位置之间致动和移动。显著的是,定向适配器186可由用户致动。或者,定向适配器186可以是计算机控制的并设置为根据用户参数调节带109的路径。
根据一个实施例,定向适配器186可沿各种方向移动,包括沿方向188横向地、沿方向187纵向地以及它们的组合。定向适配器186可移动到各种位置中以调节带109的路径。调节带的路径可用来促进丝网151和带109之间释放角155的改变。此外,定向适配器186可在至少第一位置和第二位置之间移动以改变释放半径。释放半径可由释放区185内带109的曲率限定。释放半径将在本文中更详细地描述。
如图进一步所示,系统300可包括定位在施加区183内的台137。如图所示,带109可在施加区183内在台103上方延伸,更特别地,可在施加区183内直接接触台137的表面138。根据一个实施例,台137可以是可移动的以促进系统300的加工条件的改变,并且显著的是,改变丝网151和带109之间的关系。根据一个实施例,台137可由用户移动,或作为替代方案,可以是计算机控制的并可根据用户参数移动。
根据一个实施例,台137可以是可在至少第一位置和第二位置之间移动的。例如,台137可沿横向方向145、纵向方向144以及它们的组合移动。因此,在某些情况下,可移动台137以改变施加区183内带109的纵向位置。或者,也可在第一位置和第二位置之间移动台137以促进施加区183内带109的横向位置的改变。因此,可致动台137以促进丝网151和带109之间释放角155的控制和改变。或者及此外,可移动台137以促进带109的释放半径的改变。
图4示出了根据一个实施例的用于形成成型研磨颗粒的系统的一部分的示意。如图所示,该系统可包括丝网151和丝网151下面的带109。如图进一步所示,带109正在释放区185内自丝网151释放以促进前体成型研磨颗粒123自丝网151内的开口152的释放以及所得成型研磨颗粒的合适成型。在特定的实施例中,带109可在特定的半径403下自丝网151分离,半径403限定带109的曲率半径,所述曲率半径由点401和402之间带的弧量度。应理解,点401和402限定带在不再限定曲率半径403的线性路径上延伸的点。根据一个实施例,释放区内带109可具有不大于约6英寸的释放半径403。在其它实施例中,释放半径403可更小,例如不大于约5.8英寸、不大于约5.4英寸、不大于约4.8英寸、不大于约4.4英寸、不大于约4英寸、不大于约3.8英寸、不大于约3.4英寸、不大于约3英寸、不大于约2.8英寸或甚至不大于约2.4英寸。此外,在至少一个非限制性实施例中,带109还可具有至少0.2英寸、例如至少约0.5英寸、至少约0.8英寸或甚至至少约1英寸的释放半径403。应理解,带109的释放半径403可在任意上面提及的最小值和最大值之间的范围内。
如应理解,在彼此释放丝网151和带109后,可使前体成型研磨颗粒123沿带109平移以进一步加工。应理解,进一步加工可包括成型、施加掺杂材料、干燥、烧结等。事实上,可使前体成型研磨颗粒123平移通过成型区,在其中,颗粒的至少一个外表面可被成型。成型可包括通过一个或多个过程如压印、辊压、切割、雕刻、图案化、拉伸、扭曲以及它们的组合来改变前体成型研磨颗粒123的轮廓。在一个特定的实施例中,成型的过程可包括使具有特定纹理的成型结构接触前体成型研磨颗粒123的外表面以向所述颗粒的外表面赋予所述纹理。应理解,成型结构可呈各种形式,包括例如在其表面上具有各种特征的辊。
另外,可使前体成型研磨颗粒123平移通过施加区131,其中可向颗粒的至少一个外表面施加掺杂材料。在施加区131内,可采用各种方法施加掺杂材料,所述方法包括例如喷射、浸渍、沉积、注入、转移、冲孔、切割、压制、压碎以及它们的任意组合。在特定的情况下,施加区可采用喷射嘴或喷射嘴的组合以向前体成型研磨颗粒123上喷射掺杂材料。
根据一个实施例,施加掺杂材料可包括施加特定的材料如盐,所述盐可为包含待引入到最终形成的成型研磨颗粒中的掺杂材料的前体盐材料。例如,金属盐可包含为掺杂材料的元素或化合物。应理解,盐材料可呈液体形式,例如呈包含所述盐和液体载体的分散体。所述盐可包含氮,更特别地可包含硝酸盐。在一个实施例中,所述盐可包含金属硝酸盐,更特别地基本上由金属硝酸盐构成。
在一个实施例中,掺杂材料可包含元素或化合物如碱元素、碱土元素、稀土元素、铪、锆、铌、钽、钼、钒或它们的组合。在一个特定的实施例中,掺杂材料包含元素或包含元素如锂、钠、钾、镁、钙、锶、钡、钪、钇、镧、铯、镨、铌、铪、锆、钽、钼、钒、铬、钴、铁、锗、锰、镍、钛、锌以及它们的组合的化合物。
并且此外,可使前体成型研磨颗粒123在带109上平移通过后成形区125。可在后成形区125中进行各种过程,包括例如加热、固化、振动、注入、掺杂以及它们的组合。在一个实施例中,后成形区125包括加热过程,前体成型研磨颗粒123可在其中干燥。干燥可包括特定含量的材料包括挥发物如水的移除。根据一个实施例,干燥过程可在不大于约300℃、例如不大于约280℃或甚至不大于约250℃的干燥温度下进行。此外,在一个非限制性实施例中,干燥过程还可在至少约50℃的干燥温度下进行。应理解,干燥温度可在任意上面提及的最小温度和最大温度之间的范围内。
在前体成型研磨颗粒123平移通过后成形区125后,可从带109移除所述颗粒。可将前体成型研磨颗粒123收集在箱柜127中以进一步加工。
根据一个实施例,形成成型研磨颗粒的过程可还包括烧结过程。对于某些过程,烧结可在自带109收集前体成型研磨颗粒123之后进行。或者,烧结可为当前体成型研磨颗粒123在带上的同时进行的过程。可采用前体成型研磨颗粒123的烧结以使通常呈生坯状态的颗粒致密化。在特定的情况下,烧结过程可促进陶瓷材料的高温相的形成。例如,在一个实施例中,前体成型研磨颗粒123可烧结为使得形成氧化铝的高温相,例如α氧化铝。在一种情况下,成型研磨颗粒可包含颗粒的总重量的至少约90重量%的α氧化铝。在其它情况下,α氧化铝的含量可更大,使得成型研磨颗粒可基本上由α氧化铝构成。
此外,可对丝网进行其它过程如清洁以便于定期及反复的加工。例如,可在挤出混合物后对丝网进行清洁,更特别地在平移丝网151通过释放区185后清洁丝网151的开口152。
另外,带109可经历其它过程以促进加工的效率。例如,带109可在挤出混合物后经历干燥过程,更特别地在平移带109通过释放区185后。另外,可清洁带109使得其准备好以便连续使用。根据一个实施例,带109可在挤出过程后经历清洁,更特别地在释放区185内自丝网151分离后。显著的是,带109的清洁可在前体成型研磨颗粒123自带109释放和移除后进行。
本文中的实施例的成型研磨颗粒可具有特定的尺寸,如由本体的长度所量度。例如,成型研磨颗粒可具有不大于约5mm的中值粒度。或者,中值粒度可更小,例如不大于约4mm、不大于约3mm、不大于约2mm或甚至不大于约1.5mm。在又一个方面,成型研磨颗粒的中值粒度可为至少约10微米、至少约100微米、至少约200微米、至少约400微米、至少约600微米或甚至至少约800微米。应理解,成型研磨颗粒的中值粒度可在任意上面的最小值和最大值之间的范围内。
本文中的实施例的成型研磨颗粒可具有特定的晶粒尺寸,特别是对于α氧化铝的晶粒来说。例如,成型研磨颗粒可具有不大于约500微米、例如不大于约250微米或甚至不大于约100微米、不大于约50微米、不大于约20微米或甚至不大于约1微米的平均晶粒尺寸。在另一个方面,平均晶粒尺寸可为至少约0.01微米,例如至少约0.05微米、至少约0.08微米或甚至至少约0.1微米。应理解,成型研磨颗粒的平均晶粒尺寸可在任意上面的最小值和最大值之间的范围内。
本文中的实施例的成型研磨颗粒可包含掺杂材料,所述掺杂材料可包含元素或化合物如碱元素、碱土元素、稀土元素、铪、锆、铌、钽、钼、钒或它们的组合。在一个特定的实施例中,掺杂材料包含元素或包含元素如锂、钠、钾、镁、钙、锶、钡、钪、钇、镧、铯、镨、铌、铪、锆、钽、钼、钒以及它们的组合的化合物。
在某些情况下,成型研磨颗粒可形成为具有特定含量的掺杂材料。例如,成型研磨颗粒的本体可包含不大于所述本体的总重量的约12重量%的掺杂材料。在其它情况下,掺杂材料的量可更小,例如不大于所述本体的总重量的约11重量%、不大于约10重量%、不大于约9重量%、不大于约8重量%、不大于约7重量%、不大于约6重量%或甚至不大于约5重量%。在至少一个非限制性实施例中,掺杂材料的量可为所述本体的总重量的至少约0.5重量%,例如至少约1重量%、至少约1.3重量%、至少约1.8重量%、至少约2重量%、至少约2.3重量%、至少约2.8重量%或甚至至少约3重量%。应理解,成型研磨颗粒的本体内掺杂材料的量可在任意上面提及的最小百分数或最大百分数之间的范围内。
图5A示出了根据一个实施例的成型研磨颗粒的透视示意图。本文中的实施例的成型研磨颗粒可具有由长度(1)、宽度(w)和厚度(t)限定的本体,长度(1)可为成型研磨颗粒的任何侧的最长维度,宽度(w)定义为通过成型研磨颗粒的中点的成型研磨颗粒的最长维度,厚度(t)定义为沿垂直于长度和宽度的方向延伸的成型研磨颗粒的最短维度。在特定的情况下,长度可比宽度大或与宽度相等。此外,宽度可比厚度大或与厚度相等。
另外,成型研磨颗粒的本体可具有特定的二维形状。例如,所述本体可具有如在由长度和宽度所限定的平面中所观察到的二维形状,所述二维形状具有多边形形状、椭圆形形状、数字、希腊字母表字符、拉丁字母表字符、俄语字母表字符、采用多边形形状的组合的复杂形状以及它们的组合。特定的多边形形状包括三角形、矩形、四边形、五边形、六边形、七边形、八边形、九边形、十边形、它们的任意组合。
图6A示出了根据一个实施例的成型研磨颗粒的透视示意图。如图所示,成型研磨颗粒可具有角被截的三角形形状。特别地,成型研磨颗粒的本体601可具有长度(1)、延伸通过本体601的中点602的宽度(w)和厚度(t)。根据一个实施例,本体601可具有定义为长度∶宽度的比率的第一纵横比。在某些情况下,本体601的第一纵横比可为至少约1.2∶1,例如至少约1.5∶1、至少约2∶1、至少约3∶1或甚至至少约4∶1。此外,第一纵横比还可不大于约100∶1。应理解,本体601的第一纵横比可在任意上面提及的最小比率和最大比率之间的范围内。
此外,本体601可具有由长度∶厚度的比率所定义的第二纵横比。在某些情况下,本体601的第二纵横比可为至少约1.2∶1,例如至少约1.5∶1、至少约2∶1、至少约3∶1、至少约4∶1、至少约5∶1或甚至至少约10∶1。此外,在至少一个非限制性实施例中,本体601还可具有不大于约100∶1的第二纵横比。应理解,第二纵横比可在任意上面提供的最小比率和最大比率之间的范围内。
此外,本文中的实施例的成型研磨颗粒可具有由宽度∶厚度的比率所定义的第三纵横比。在某些情况下,本体601的第三纵横比可为至少约1.2∶1,例如至少约1.5∶1、至少约2∶1、至少约3∶1、至少约4∶1、至少约5∶1或甚至至少约10∶1。此外,在至少一个非限制性实施例中,本体601还可具有不大于约100∶1的第三纵横比。应理解,第三纵横比可在任意上面提供的最小比率和最大比率之间的范围内。
图6B示出了根据一个实施例形成的成型研磨颗粒的透视示意图。显著的是,本体605可具有大体四边形形状。然而,在一个特定的实施例中,本体605可为角被截的四边形,更特别地为角被截的平行四边形或梯形形状。特别地,成型研磨颗粒的本体605可具有长度(1)、延伸通过本体605的中点606的宽度(w)和厚度(t)。本体605可具有本文中的实施例中描述的任何成型研磨颗粒的任何特征。
图6C示出了根据一个实施例形成的成型研磨颗粒的透视示意图。显著的是,本体607可具有大体多边形形状,更特别地具有如由长度(1)和宽度(w)所限定的平面中所观察到的三角形二维形状。特别地,成型研磨颗粒的本体607可具有长度(1)、延伸通过本体607的中点608的宽度(w)和厚度(t)。本体607可具有本文中的实施例中描述的任何成型研磨颗粒的任何特征。
图7示出了根据一个实施例的引入了研磨微粒材料的涂覆研磨制品的横截面示意。如图所示,涂覆磨料700可包括基材701和覆盖基材701的表面的构成涂层(make coat)703。涂覆磨料700可还包括研磨微粒材料706。研磨微粒材料706可包括第一类型的包括成型研磨颗粒705的颗粒和第二类型的呈稀释剂研磨颗粒形式的研磨微粒材料707。稀释剂研磨颗粒可具有无规的形状,并可不必为成型研磨颗粒。涂覆磨料700可还包括覆盖并粘结到研磨微粒材料705、706、707以及构成涂层704的胶料涂层(size coat)704。
根据一个实施例,基材701可包含有机材料、无机材料以及它们的组合。在某些情况下,基材701可包含织造材料。然而,基材701可由非织造材料制成。特别合适的基材材料可包含有机材料,包括聚合物,特别地聚酯、聚氨酯、聚丙烯、聚酰亚胺如来自DuPont的KAPTON、纸。一些合适的无机材料可包括金属、金属合金和特别地铜、铝、钢以及它们的组合的箔。
构成涂层703可在单一过程中施加到基材701的表面,或作为替代方案,可将研磨微粒材料705、706、707与构成涂层703的材料组合并以混合物施加到基材701的表面。构成涂层703的合适材料可包括有机材料,特别地聚合物材料,包括例如聚酯、环氧树脂、聚氨酯、聚酰胺、聚丙烯酸酯、聚甲基丙烯酸酯、聚氯乙烯、聚乙烯、聚硅氧烷、有机硅、醋酸纤维素、硝化纤维素、天然橡胶、淀粉、虫漆以及它们的混合物。在一个实施例中,构成涂层703可包含聚酯树脂。然后可将经涂覆基材加热以使树脂和研磨微粒材料固化到基材。通常,在此固化过程中,可将经涂覆基材701加热到约100℃至低于约250℃之间的温度。
研磨微粒材料706可包括根据本文中的实施例的成型研磨颗粒。在特定的情况下,研磨微粒材料706可包括不同类型的成型研磨颗粒。如本文中的实施例中所述,不同类型的成型研磨颗粒可在组成、二维形状、三维形状、尺寸以及它们的组合方面彼此不同。如图所示,涂覆磨料700可包括具有大体三角形二维形状的成型研磨颗粒705。
研磨颗粒707的其他类型可为不同于成型研磨颗粒705的稀释剂颗粒。例如,稀释剂颗粒可在组成、二维形状、三维形状、尺寸以及它们的组合方面与成型研磨颗粒705不同。例如,研磨颗粒707可为具有无规的形状的常规压碎研磨用砂粒。研磨颗粒707可具有小于成型研磨颗粒705的中值粒度的中值粒度。
在充分形成具有研磨微粒材料706的构成涂层703后,可形成胶料涂层704以覆盖并粘结研磨微粒材料706于适当的位置。胶料涂层704可包含有机材料,可基本上由聚合物材料构成,并且显著的是,可使用聚酯、环氧树脂、聚氨酯、聚酰胺、聚丙烯酸酯、聚甲基丙烯酸酯、聚氯乙烯、聚乙烯、聚硅氧烷、有机硅、醋酸纤维素、硝化纤维素、天然橡胶、淀粉、虫漆以及它们的混合物。
图8示出了根据一个实施例的引入了研磨微粒材料的粘结研磨制品的示意。如图所示,粘结磨料800可包含粘结材料801、含在粘结材料中的研磨微粒材料802以及粘结材料801内的孔隙808。在特定的情况下,粘结材料801可包含有机材料、无机材料以及它们的组合。合适的有机材料可包括聚合物,例如环氧树脂、树脂、热固性材料、热塑性材料、聚酰亚胺、聚酰胺以及它们的组合。某些合适的无机材料可包括金属、金属合金、玻璃相材料、结晶相材料、陶瓷以及它们的组合。
在一些情况下,粘结磨料800的研磨微粒材料802可包括成型研磨颗粒803。在特定的情况下,成型研磨颗粒803可为不同类型的颗粒,如本文中的实施例中所述,这些颗粒可在组成、二维形状、三维形状、尺寸以及它们的组合方面彼此不同。或者,粘结研磨制品可包含单一类型的成型研磨颗粒。
粘结磨料800可包含为稀释剂研磨颗粒的一类研磨微粒材料807,稀释剂研磨颗粒可在组成、二维形状、三维形状、尺寸以及它们的组合方面与成型研磨颗粒803不同。
粘结材料800的孔隙808可为开放的孔隙、封闭的孔隙以及它们的组合。基于粘结磨料800的本体的总体积计,孔隙808可以多数量(体积%)存在。或者,基于粘结磨料800的本体的总体积计,孔隙808可以少数量(体积%)存在。基于粘结磨料800的本体的总体积计,粘结材料801可以多数量(体积%)存在。或者,基于粘结磨料800的本体的总体积计,粘结材料801可以少数量(体积%)存在。另外,基于粘结磨料800的本体的总体积计,研磨微粒材料802可以多数量(体积%)存在。或者,基于粘结磨料800的本体的总体积计,研磨微粒材料802可以少数量(体积%)存在。
实例
实例1
使用如下面详述的丝网印刷方法形成前体成型研磨颗粒的第一样品(CS1)。首先制得包含35-40重量%可以未加晶种的Disperal自SasolCorporation商购获得的勃姆石的呈凝胶形式的混合物。该混合物还包含水、硝酸和有机材料。将该混合物在8-10psi的压力下挤出通过模头开口并通过具有等边三角形形状的开口的丝网,所述开口的边长为2-2.5mm。所述开口的深度为大约0.8mm。丝网和带在大约10cm/sec的速率下移动。显著的是,在释放区内,带限定大约8英寸的释放半径。通过该方法形成的前体成型研磨颗粒示意于图9A和9B中。
实例2
通过根据本文中的一个实施例的丝网印刷方法形成前体成型研磨颗粒的第二样品(S1)。显著的是,产生样品S1的方法与实例1中相同,不同的是带释放半径减至大约1.7英寸。样品S1的前体(即未经热处理的)成型研磨颗粒示意于图10A和10B中。在样品CS1和S1的前体成型研磨颗粒的比较中很明显,通过实例2的方法形成的颗粒(S1)具有较小的侧壁坡度、较少的混合物留在丝网开口中并且S1的颗粒比样品CS1的颗粒展示出改进的“形状正确性”。术语“形状正确性”为与开口的形状相比前体成型研磨颗粒的形状的复制精确性的估计。
本申请与现有技术相偏离。虽然工业已认识到成型研磨颗粒可通过方法如模制和丝网印刷形成,但本文中的实施例的方法与此类方法截然不同。显著的是,本文中的实施例包括促进具有特定特征的成型研磨颗粒的批料的形成的过程特征的组合。此外,本文中的实施例的成型研磨颗粒可具有与其它颗粒截然不同的特征的特定组合,所述特征包括但不限于纵横比、组成、添加剂、二维形状、三维形状以及它们的组合。并且事实上,在固着磨料如粘结磨料或涂覆磨料的情况下,这样的组合物可促进改进的研磨性能。
上面公开的主题应视为示意性的而非限制性的,并且附随的权利要求意在涵盖所有此类改变、增强和其它实施例,所述改变、增强和其它实施例将落在本发明的真实范围内。因此,在法律允许的最大程度上,本发明的范围应由下面的权利要求及它们的等价物的最广义的许可解释决定而不应受前面的具体实施方式所约束或限制。
本发明的摘要为符合专利法而提供并在了解其将不被用来解释或限制权利要求的范围或含义的前提下提交。此外,在前面的具体实施方式中,就简化本发明的目的而言,可将各种特征集合在一起或在单个实施例中描述。本发明不应理解为反映所要求保护的实施例比每项权利要求中所明确述及的需要更多特征的意图。相反,如下面的权利要求所反映,本发明的主题可指向小于任意所公开的实施例的所有特征。因此,下面的权利要求被结合到具体实施方式中,每项权利要求独立地限定单独地要求保护的主题。
Claims (72)
1.一种形成成型研磨颗粒的方法,所述方法包括:
在施加区内挤出混合物到丝网中的开口中;和
平移所述丝网和带至释放区并分离所述丝网和带及在所述带上形成前体成型研磨颗粒,其中所述丝网和带在至少约15°并且不大于约45°的释放角下分离,其中所述释放角定义为所述丝网的表面与所述带的表面之间的角度。
2.一种形成成型研磨颗粒的方法,所述方法包括:
在施加区内挤出混合物通过模头的模头开口并到所述模头开口下面的丝网的开口中,和
在与所述模头的表面一体地形成的刀刃下平移所述丝网的同时迫使至少一部分所述混合物进入到所述开口中。
3.根据权利要求1所述的方法,其中所述释放角为至少约18°。
4.根据权利要求1所述的方法,其中所述释放角不大于约42°。
5.根据权利要求2所述的方法,其中所述丝网在至少约15°并且不大于约45°的释放角下自所述丝网下面的带分离。
6.根据权利要求2所述的方法,其中所述丝网在至少约18°并且不大于约42°的释放角下自所述丝网下面的带分离,并且其中所述释放角定义为所述丝网的下表面与所述带的上表面之间的角度。
7.根据权利要求1所述的方法,所述方法还包括不大于约6英寸的释放半径,其中所述释放半径由所述释放区中所述带的曲率限定。
8.根据权利要求1所述的方法,所述方法还包括至少约0.2英寸的释放半径,其中所述释放半径由所述释放区中所述带的曲率限定。
9.根据权利要求2所述的方法,所述方法还包括至少约0.2英寸的释放半径,其中所述释放半径由释放区中带的曲率限定。
10.根据权利要求2所述的方法,所述方法还包括不大于约6英寸的释放半径,其中所述释放半径由释放区中带的曲率限定。
11.根据权利要求1所述的方法,所述方法还包括在联结至所述带的表面的定向适配器上方移动所述带。
12.根据权利要求11所述的方法,其中所述定向适配器构造为改变所述释放角。
13.根据权利要求11所述的方法,其中所述定向适配器构造为改变所述释放半径。
14.根据权利要求2所述的方法,其中还包括在联结至所述带的表面的定向适配器上方移动带。
15.根据权利要求14所述的方法,其中所述定向适配器构造为改变所述释放角。
16.根据权利要求14所述的方法,其中所述定向适配器构造为改变所述释放半径。
17.根据权利要求1所述的方法,所述方法还包括在所述施加区内的台上方移动所述带。
18.根据权利要求17所述的方法,其中所述带在所述施加区内直接接触所述台的表面,并且其中所述台可在第一位置和第二位置之间移动。
19.根据权利要求17所述的方法,其中所述台构造为可在第一位置和第二位置之间改变以改变所述带的纵向位置、释放半径和所述释放角中的至少之一。
20.根据权利要求2所述的方法,所述方法还包括在所述施加区内的台上方移动所述带。
21.根据权利要求20所述的方法,其中所述带在所述施加区内直接接触所述台的表面,并且其中所述台可在第一位置和第二位置之间移动。
22.根据权利要求20所述的方法,其中所述台构造为可在第一位置和第二位置之间改变以改变所述带的纵向位置、释放半径和所述释放角中的至少之一。
23.根据权利要求1和2中任一项所述的方法,其中所述混合物包括凝胶。
24.根据权利要求1和2中任一项所述的方法,其中所述混合物包含陶瓷材料和液体。
25.根据权利要求1和2中任一项所述的方法,其中所述凝胶为形状稳定的材料。
26.根据权利要求1和2中任一项所述的方法,其中所述凝胶包含呈离散颗粒的一体化网络的陶瓷粉末材料。
27.根据权利要求1和2中任一项所述的方法,其中所述混合物包含所述混合物的总重量的至少约25重量%并且不大于约75重量%的量的陶瓷材料。
28.根据权利要求1和2中任一项所述的方法,其中所述混合物包含所述混合物的总重量的至少约25重量%并且不大于约75重量%的量的液体。
29.根据权利要求1和2中任一项所述的方法,其中所述混合物包含不大于所述凝胶的总重量的约30重量%的有机材料。
30.根据权利要求1和2中任一项所述的方法,其中所述混合物包含至少约1×104Pa并且不大于约1×107Pa的储能模量。
31.根据权利要求1和2中任一项所述的方法,其中所述混合物包含选自氧化物、氮化物、碳化物、硼化物、碳氧化物、氮氧化物以及它们的组合的陶瓷材料。
32.根据权利要求1和2中任一项所述的方法,其中所述陶瓷材料包含勃姆石。
33.根据权利要求1和2中任一项所述的方法,其中所述丝网沿相对于挤出方向成角度的方向平移。
34.根据权利要求1和2中任一项所述的方法,其中所述丝网沿相对于挤出方向成角度的方向平移,并且其中所述角度为基本上直角。
35.根据权利要求1和2中任一项所述的方法,其中所述丝网在所述施加区内在与带的平移速率基本上相似的速率下平移。
36.根据权利要求1和2中任一项所述的方法,其中所述开口具有如由所述丝网的长度和宽度所限定的平面中所观察到的二维形状,所述二维形状选自多边形、椭圆形、数字、希腊字母表字符、拉丁字母表字符、俄语字母表字符、具有多边形形状的组合的复杂形状以及它们的组合。
37.根据权利要求1和2中任一项所述的方法,其中所述开口包括如由所述丝网的长度和宽度维度所限定的平面中所观察到的多边形形状,其中所述开口包括选自三角形、矩形、四边形、五边形、六边形、七边形、八边形、九边形、十边形以及它们的组合的多边形形状。
38.根据权利要求1所述的方法,其中所述前体成型研磨颗粒具有基本上对应于所述开口的所述二维形状的二维形状。
39.根据权利要求1所述的方法,所述方法还包括与模头一体地形成并构造为在从所述模头开口挤出所述混合物时啮合所述混合物的刀刃。
40.根据权利要求39所述的方法,其中所述刀刃在挤出过程中毗邻所述丝网的一部分。
41.根据权利要求39所述的方法,其中所述刀刃包括具有至少约0.01mm并且不大于约20mm的宽度的接触表面。
42.根据权利要求39所述的方法,其中所述刀刃包含不同于所述模头的材料。
43.根据权利要求39所述的方法,其中所述刀刃包含聚合物材料。
44.根据权利要求39所述的方法,其中所述刀刃包含氟化聚合物。
45.根据权利要求39所述的方法,其中所述刀刃包括易受侵蚀表面。
46.根据权利要求39所述的方法,其中所述刀刃自所述模头的底表面延伸。
47.根据权利要求39所述的方法,其中所述刀刃具有至少约0.5mm的高度。
48.根据权利要求1和2中任一项所述的方法,所述方法还包括沿带平移成型研磨颗粒和用掺杂材料喷射所述成型研磨颗粒。
49.根据权利要求1和2中任一项所述的方法,所述方法还包括在形成所述前体成型研磨颗粒后成型前体成型研磨颗粒的至少一个外表面。
50.根据权利要求2所述的方法,其中所述刀刃在挤出过程中毗邻所述丝网的一部分。
51.根据权利要求2所述的方法,其中所述刀刃包括具有至少约0.01mm并且不大于约20mm的宽度的接触表面。
52.根据权利要求2所述的方法,其中所述刀刃包含不同于所述模头的材料。
53.根据权利要求2所述的方法,其中所述刀刃包含聚合物材料。
54.根据权利要求2所述的方法,其中所述刀刃包含氟化聚合物。
55.根据权利要求2所述的方法,其中所述刀刃基本上由聚四氟乙烯(PTFE)构成。
56.根据权利要求2所述的方法,其中所述刀刃包括易受侵蚀表面。
57.根据权利要求2所述的方法,其中所述刀刃具有至少约0.5mm的高度。
58.一种用于形成成型研磨颗粒的系统,所述系统包括:
模头,所述模头具有构造为容纳混合物的贮存器和构造为使所述混合物通过其中的模头开口;和
刀刃,所述刀刃与所述模头一体地形成并包含易受侵蚀材料。
59.根据权利要求58所述的系统,其中所述刀刃构造为在使用的过程中磨损。
60.根据权利要求58所述的系统,其中所述刀刃构造为接触所述模头下面的表面并磨损直至所述刀刃和表面之间的力平衡。
61.根据权利要求58所述的系统,其中所述刀刃包括具有至少约0.01mm并且不大于约20mm的宽度的接触表面。
62.根据权利要求58所述的系统,其中所述刀刃包含不同于所述模头的材料。
63.根据权利要求58所述的系统,其中所述刀刃包含聚合物材料。
64.根据权利要求58所述的系统,其中所述刀刃基本上由聚四氟乙烯(PTFE)构成。
65.一种用于形成成型研磨颗粒的系统,所述系统包括:
模头,所述模头具有模头开口;
丝网,所述丝网在施加区内所述模头开口下面;
带,所述带在所述施加区内所述丝网下面;和
用于改变以下中的至少之一的部件:
所述丝网和带之间的释放角,其中所述释放角定义为释放区中所述丝网的表面与所述带的表面之间的角度;和
所述带的释放半径,所述释放半径由所述释放区中所述带的曲率限定。
66.根据权利要求65所述的系统,其中所述部件包括联结至所述带的表面的定向适配器。
67.根据权利要求66所述的系统,其中所述定向适配器可在第一位置和第二位置之间移动。
68.根据权利要求65所述的系统,其中所述定向适配器可在第一位置和第二位置之间移动并且构造为在第一位置和第二位置之间改变所述带的位置。
69.根据权利要求65所述的系统,其中所述定向适配器构造为改变所述释放角、所述释放半径以及它们的组合。
70.根据权利要求65所述的系统,其中所述部件包括所述施加区内的台。
71.根据权利要求70所述的系统,其中所述台可在第一位置和第二位置之间移动。
72.根据权利要求70所述的系统,其中所述台构造为可在第一位置和第二位置之间改变以改变所述带的纵向位置、释放半径和所述释放角中的至少之一。
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EP2798032A4 (en) | 2015-12-23 |
JP2015503462A (ja) | 2015-02-02 |
CA2862453A1 (en) | 2013-07-04 |
US20130186005A1 (en) | 2013-07-25 |
WO2013102176A4 (en) | 2013-08-29 |
CN104114664B (zh) | 2016-06-15 |
BR112014016159A2 (pt) | 2017-06-13 |
AU2012362173A1 (en) | 2014-08-07 |
WO2013102176A1 (en) | 2013-07-04 |
BR112014016159A8 (pt) | 2017-07-04 |
KR20140106737A (ko) | 2014-09-03 |
EP2798032A1 (en) | 2014-11-05 |
US8753558B2 (en) | 2014-06-17 |
AU2012362173B2 (en) | 2016-02-25 |
JP5847331B2 (ja) | 2016-01-20 |
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