MX2021004502A - Componentes electronicos sobremoldeados para tarjetas de transaccion y metodos para su fabricacion. - Google Patents
Componentes electronicos sobremoldeados para tarjetas de transaccion y metodos para su fabricacion.Info
- Publication number
- MX2021004502A MX2021004502A MX2021004502A MX2021004502A MX2021004502A MX 2021004502 A MX2021004502 A MX 2021004502A MX 2021004502 A MX2021004502 A MX 2021004502A MX 2021004502 A MX2021004502 A MX 2021004502A MX 2021004502 A MX2021004502 A MX 2021004502A
- Authority
- MX
- Mexico
- Prior art keywords
- making
- methods
- electronic components
- transaction cards
- overmolded electronic
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/006—Memory cards, chip cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Un proceso para la fabricación de una tarjeta de transacción, que incluye formar de una abertura en el cuerpo de la tarjeta de transacción; insertar un componente electrónico en la abertura; y moldear un material de moldeo alrededor del componente electrónico. La tarjeta de transacción incluye un componente electrónico moldeado.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662367362P | 2016-07-27 | 2016-07-27 | |
US16/164,322 US10406734B2 (en) | 2016-07-27 | 2018-10-18 | Overmolded electronic components for transaction cards and methods of making thereof |
PCT/US2019/056704 WO2020081790A1 (en) | 2016-07-27 | 2019-10-17 | Overmolded electronic components for transaction cards and methods of making thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2021004502A true MX2021004502A (es) | 2021-06-08 |
Family
ID=61016710
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2019001144A MX2019001144A (es) | 2016-07-27 | 2017-07-26 | Componentes electronicos sobremoldeados para tarjetas de transaccion y metodos para hacer los mismos. |
MX2021004502A MX2021004502A (es) | 2016-07-27 | 2019-10-17 | Componentes electronicos sobremoldeados para tarjetas de transaccion y metodos para su fabricacion. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2019001144A MX2019001144A (es) | 2016-07-27 | 2017-07-26 | Componentes electronicos sobremoldeados para tarjetas de transaccion y metodos para hacer los mismos. |
Country Status (16)
Country | Link |
---|---|
US (5) | US11267172B2 (es) |
EP (3) | EP3491584B1 (es) |
JP (3) | JP7247086B2 (es) |
KR (2) | KR102286490B1 (es) |
CN (2) | CN109564634A (es) |
AU (1) | AU2019361988B2 (es) |
BR (1) | BR112021007410A2 (es) |
CA (1) | CA3116226C (es) |
CO (1) | CO2021005273A2 (es) |
DK (1) | DK3491584T3 (es) |
ES (1) | ES2928212T3 (es) |
MX (2) | MX2019001144A (es) |
NZ (1) | NZ774730A (es) |
PL (1) | PL3491584T3 (es) |
SG (1) | SG11202103590TA (es) |
WO (2) | WO2018022755A1 (es) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102286490B1 (ko) | 2016-07-27 | 2021-08-04 | 컴포시큐어 엘엘씨 | 트랜잭션 카드들을 위한 오버몰딩된 전자 컴포넌트 및 이를 제조하는 방법 |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
US10868444B2 (en) | 2016-12-09 | 2020-12-15 | Nucurrent, Inc. | Method of operating a system having a substrate configured to facilitate through-metal energy transfer via near field magnetic coupling |
JP7223748B2 (ja) | 2017-09-07 | 2023-02-16 | コンポセキュア,リミティド ライアビリティ カンパニー | 電子部品が埋め込まれた取引カード及び製造プロセス |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
EP3698280B1 (en) | 2017-10-18 | 2022-07-27 | Composecure, LLC | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
EP3895070A4 (en) * | 2018-12-11 | 2022-08-17 | Giesecke+Devrient Mobile Security GmbH | IDENTIFICATION CARD HAVING A GLASS SUBSTRATE, IDENTIFICATION CARD HAVING A CERAMIC SUBSTRATE AND METHODS OF MAKING THEM |
SG11202112785YA (en) * | 2019-05-31 | 2021-12-30 | Composecure Llc | Rfid device |
US11347993B2 (en) | 2019-08-12 | 2022-05-31 | Federal Card Services, LLC | Dual interface metal cards and methods of manufacturing |
US20210049431A1 (en) | 2019-08-14 | 2021-02-18 | Federal Card Services, LLC | Metal-containing dual interface smartcards |
US11113593B2 (en) | 2019-08-15 | 2021-09-07 | Federal Card Services; LLC | Contactless metal cards with fingerprint sensor and display |
US11416728B2 (en) | 2019-08-15 | 2022-08-16 | Federal Card Services, LLC | Durable dual interface metal transaction cards |
US11455507B2 (en) | 2019-10-13 | 2022-09-27 | Federal Card Services, LLC | Metal transaction cards containing ceramic having selected coloring and texture |
KR20220083800A (ko) | 2019-10-25 | 2022-06-20 | 컴포시큐어 엘엘씨 | 생체 인식 피처들을 갖는 금속 카드 |
US11341385B2 (en) | 2019-11-16 | 2022-05-24 | Federal Card Services, LLC | RFID enabled metal transaction card with shaped opening and shaped slit |
US10810475B1 (en) | 2019-12-20 | 2020-10-20 | Capital One Services, Llc | Systems and methods for overmolding a card to prevent chip fraud |
MX2022008803A (es) | 2020-01-24 | 2022-08-11 | Composecure Llc | Tarjeta de transaccion de metal, ceramica o recubrimiento de ceramica con ventana o patron de ventana y luz de fondo opcional. |
USD1032613S1 (en) * | 2020-02-02 | 2024-06-25 | Federal Card Services, LLC | Smart card |
TWI804805B (zh) * | 2020-02-07 | 2023-06-11 | 美商坎柏斯庫爾有限責任公司 | 雙接口金屬交易裝置及其製程 |
USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
CN115734882A (zh) | 2020-06-01 | 2023-03-03 | 安全创造有限责任公司 | 具有不连续金属芯层的交易卡 |
EP4334103A1 (en) * | 2021-05-07 | 2024-03-13 | Microsoft Technology Licensing, LLC | Forming complex geometries using insert molding |
US12122077B2 (en) | 2021-05-07 | 2024-10-22 | Microsoft Technology Licensing, Llc | Forming complex geometries using insert molding |
WO2023034642A1 (en) | 2021-09-06 | 2023-03-09 | Metaland Llc | Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card |
Family Cites Families (177)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3802101A (en) | 1972-02-03 | 1974-04-09 | Transaction Technology Inc | Coded identification card |
DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
JPS61222715A (ja) | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | 樹脂成形体の製造方法 |
FR2579799B1 (fr) * | 1985-03-28 | 1990-06-22 | Flonic Sa | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
JPS6372596A (ja) * | 1986-09-17 | 1988-04-02 | 大日本印刷株式会社 | Icカ−ドの製造方法 |
FR2609821B1 (fr) | 1987-01-16 | 1989-03-31 | Flonic Sa | Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede |
JPS63185688A (ja) * | 1987-01-29 | 1988-08-01 | 大日本印刷株式会社 | Icカ−ドの製造方法 |
JPH0633020B2 (ja) * | 1988-03-04 | 1994-05-02 | シチズン時計株式会社 | 樹脂封止方法 |
JPH0255198A (ja) * | 1988-08-19 | 1990-02-23 | Mitsubishi Electric Corp | Icカード |
CA2027823C (en) | 1989-10-31 | 1994-11-08 | Tomoshige Oka | Ic card having an integrated circuit module and air discharge opening |
JP2913190B2 (ja) | 1989-11-25 | 1999-06-28 | 日立マクセル株式会社 | 半導体カードならびにその製造方法 |
DE4038126C2 (de) * | 1990-11-27 | 1993-12-16 | Mannesmann Ag | Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte |
JP3290986B2 (ja) | 1991-05-10 | 2002-06-10 | ゲーアーオー ゲゼルシャフト フュア アウトマツィオーン ウント オルガニザツィオーン ミット ベシュレンクテル ハフツング | 壁面の厚さを部分的に薄くしたプラスチック成形物の製造方法及び製造装置 |
JP3024838B2 (ja) | 1991-09-06 | 2000-03-27 | 大日本印刷株式会社 | 貴金属封入カード |
FR2684235B1 (fr) * | 1991-11-25 | 1999-12-10 | Gemplus Card Int | Carte a circuit integre comprenant des moyens de protection du circuit integre. |
DE4142409A1 (de) | 1991-12-20 | 1993-07-01 | Gao Ges Automation Org | Verfahren zum bedrucken von karten mit sacklochfoermiger aussparung und vorrichtung zur ausfuehrung des verfahrens |
US6817532B2 (en) | 1992-02-12 | 2004-11-16 | Lenscard U.S., Llc | Wallet card with built-in light |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
JP3205197B2 (ja) | 1994-12-14 | 2001-09-04 | キヤノン株式会社 | 液晶表示装置 |
DE4446369A1 (de) | 1994-12-23 | 1996-06-27 | Giesecke & Devrient Gmbh | Datenträger mit einem elektronischen Modul |
JPH08276459A (ja) * | 1995-04-06 | 1996-10-22 | Dainippon Printing Co Ltd | 非接触icカード及びその製造方法 |
FR2735714B1 (fr) * | 1995-06-21 | 1997-07-25 | Schlumberger Ind Sa | Procede pour imprimer un graphisme sur une carte a memoire |
JPH09315058A (ja) | 1996-05-30 | 1997-12-09 | Mitsubishi Electric Corp | Icカード |
JPH09315053A (ja) | 1996-05-31 | 1997-12-09 | Yushi Seihin Kk | 識別体及びその製造方法 |
DE19632113C1 (de) * | 1996-08-08 | 1998-02-19 | Siemens Ag | Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte |
WO1998009252A1 (de) | 1996-08-26 | 1998-03-05 | Tomas Meinen | Verfahren zur herstellung von chipkarten |
EP0931295B1 (de) * | 1996-10-09 | 2001-12-12 | PAV Card GmbH | Verfahren und verbindungsanordnung zum herstellen einer chipkarte |
US5835497A (en) | 1996-10-30 | 1998-11-10 | Mci Communications Corporation | Call record broadcast via an interface in a telecommunications network |
DE19703122C1 (de) | 1997-01-29 | 1998-05-20 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung von Datenträgern |
JPH10291392A (ja) | 1997-04-18 | 1998-11-04 | Dainippon Printing Co Ltd | Icカード |
JPH1111056A (ja) | 1997-06-23 | 1999-01-19 | Nec Yamagata Ltd | Icカード |
JPH1134553A (ja) * | 1997-07-18 | 1999-02-09 | Rohm Co Ltd | Icモジュール、およびその製造方法、ならびにこれを備えたicカード |
DE19848193C1 (de) * | 1998-10-20 | 1999-11-11 | Orga Kartensysteme Gmbh | Trägerkarte für Miniaturchipkarte |
DE19848712A1 (de) * | 1998-10-22 | 2000-04-27 | Henkel Kgaa | Komponentenschicht für Smart Cards aus Schmelzklebstoffen |
DE19934434B4 (de) | 1999-07-22 | 2006-10-05 | Bundesdruckerei Gmbh | Wert- und Sicherheitserzeugnis mit Mikrokanälen |
US6492717B1 (en) | 1999-08-03 | 2002-12-10 | Motorola, Inc. | Smart card module and method of assembling the same |
FR2811109B1 (fr) | 2000-06-29 | 2002-12-27 | A S K | Objet portable sans contact comportant un ou plusieurs dispositifs peripheriques sans contact |
US6923378B2 (en) * | 2000-12-22 | 2005-08-02 | Digimarc Id Systems | Identification card |
FR2826154B1 (fr) | 2001-06-14 | 2004-07-23 | A S K | Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux |
DE10132893B4 (de) | 2001-07-06 | 2014-02-27 | Giesecke & Devrient Gmbh | Verfahren zum Einbau eines Displayelements |
US6629969B2 (en) | 2001-07-26 | 2003-10-07 | Durect Corporation | Catheter for modification of agent formulation |
JP2003061000A (ja) | 2001-08-10 | 2003-02-28 | Fujitsu Ltd | 制御装置、およびプログラム |
JP2003087044A (ja) * | 2001-09-12 | 2003-03-20 | Mitsubishi Materials Corp | Rfid用アンテナ及び該アンテナを備えたrfidシステム |
JP2003234615A (ja) | 2002-02-06 | 2003-08-22 | Nec Corp | スロットアンテナ及び無線lanカード |
US20050087609A1 (en) | 2002-04-30 | 2005-04-28 | Tagsys, A Corporation Of France | Contactless label and method for its manufacture |
JP2004094561A (ja) | 2002-08-30 | 2004-03-25 | Toppan Printing Co Ltd | Icカード |
US7588184B2 (en) | 2003-01-03 | 2009-09-15 | American Express Travel Related Services Company, Inc. | Metal-containing transaction card and method of making the same |
US7823777B2 (en) | 2003-01-03 | 2010-11-02 | American Express Travel Related Services Company, Inc. | Metal-containing transaction card and method of making same |
US7597250B2 (en) | 2003-11-17 | 2009-10-06 | Dpd Patent Trust Ltd. | RFID reader with multiple interfaces |
US7762470B2 (en) | 2003-11-17 | 2010-07-27 | Dpd Patent Trust Ltd. | RFID token with multiple interface controller |
USD507298S1 (en) | 2004-06-03 | 2005-07-12 | American Express Travel Related Services Company, Inc. | Card with an antenna and a rectangle |
US7237724B2 (en) * | 2005-04-06 | 2007-07-03 | Robert Singleton | Smart card and method for manufacturing a smart card |
EP1882229B1 (en) | 2005-04-27 | 2014-07-23 | Privasys, Inc. | Electronic cards and methods for making same |
JP4715348B2 (ja) | 2005-07-14 | 2011-07-06 | 凸版印刷株式会社 | カード |
EP1760828A1 (en) | 2005-08-31 | 2007-03-07 | Incard SA | Contactless integrated circuit device |
US7309007B2 (en) | 2005-10-04 | 2007-12-18 | First Data Corporation | Systems and methods for personalizing transaction cards |
US8786510B2 (en) | 2006-01-24 | 2014-07-22 | Avery Dennison Corporation | Radio frequency (RF) antenna containing element and methods of making the same |
JP5034371B2 (ja) | 2006-02-10 | 2012-09-26 | 富士通株式会社 | Rfidタグの製造方法およびrfidタグ |
JP5059854B2 (ja) | 2006-06-19 | 2012-10-31 | ナグライデ・エス アー | 電子モジュールおよび中間製品を含むカードの製造方法 |
US20070290048A1 (en) * | 2006-06-20 | 2007-12-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
JP2008009881A (ja) | 2006-06-30 | 2008-01-17 | Fujitsu Ltd | Rfidタグ製造方法およびrfidタグ |
JP4855849B2 (ja) | 2006-06-30 | 2012-01-18 | 富士通株式会社 | Rfidタグの製造方法、およびrfidタグ |
JP5027481B2 (ja) | 2006-11-06 | 2012-09-19 | 株式会社日立製作所 | Icタグ |
PL2132684T3 (pl) | 2007-02-09 | 2013-03-29 | Nagravision Sa | Sposób produkcji kart elektronicznych zawierających co najmniej jeden nadrukowany wzór |
WO2008105582A1 (en) | 2007-02-27 | 2008-09-04 | Gk Power Co., Ltd. | Credit card combined with decorations |
ES2491515T3 (es) | 2007-03-19 | 2014-09-08 | Nagravision S.A. | Tarjeta que incorpora una visualización electrónica |
DE102007016777B4 (de) * | 2007-04-04 | 2018-11-22 | Bundesdruckerei Gmbh | Sicherheits- oder Wertdokument |
US8174454B2 (en) | 2007-05-07 | 2012-05-08 | Infineon Technologies Ag | Dual-band antenna |
MY159909A (en) | 2007-09-14 | 2017-02-15 | Toppan Printing Co Ltd | Antenna sheet, transponder and book form |
JP5037286B2 (ja) | 2007-09-28 | 2012-09-26 | 富士通株式会社 | Rfidタグおよびrfidタグの製造方法 |
US8226013B2 (en) | 2007-10-26 | 2012-07-24 | Mastercard International, Inc. | Method and apparatus for use in providing an identification token |
US8141786B2 (en) | 2008-01-18 | 2012-03-27 | Texas Instruments Incorporated | Thin smart card module having strap on carrier |
DE102008027771A1 (de) * | 2008-06-11 | 2009-12-17 | Giesecke & Devrient Gmbh | Verfahren zum Einbauen eines Chipmoduls in einen Chipkartenkörper |
DE102008053582B3 (de) | 2008-10-28 | 2010-04-22 | Giesecke & Devrient Gmbh | Datenträger und Verfahren zu dessen Herstellung |
DE102009015579A1 (de) | 2009-03-30 | 2010-10-07 | Soheil Hamedani | Münze mit integrierter RFID-Identifiziervorrichtung und Verfahren zu dessen Herstellung |
EP2424041B1 (en) | 2009-04-21 | 2018-11-21 | Murata Manufacturing Co., Ltd. | Antenna apparatus and resonant frequency setting method of same |
FR2948796A1 (fr) * | 2009-07-28 | 2011-02-04 | Ask Sa | Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication |
US8725589B1 (en) | 2009-07-30 | 2014-05-13 | Jpmorgan Chase Bank, N.A. | Methods for personalizing multi-layer transaction cards |
EP2302567B1 (en) | 2009-09-17 | 2015-11-11 | Nxp B.V. | Surface-tolerant RFID transponder device |
US8128000B2 (en) | 2009-09-25 | 2012-03-06 | Avery Dennison Corporation | Method, system and apparatus for manufacturing a radio frequency identification device |
DE102009043587A1 (de) | 2009-09-30 | 2011-05-19 | Smartrac Ip B.V. | Funktionelles Laminat |
FR2959581B1 (fr) | 2010-04-28 | 2012-08-17 | Arjowiggins Security | Insert fibreux constitue en une seule couche et equipe d'un dispositif electronique a communication sans contact. |
US8544755B2 (en) * | 2010-06-28 | 2013-10-01 | United Test And Assembly Center Ltd. | Subscriber identity module (SIM) card |
FR2963139B1 (fr) | 2010-07-20 | 2012-09-14 | Oberthur Technologies | Dispositif a microcircuit comprenant des moyens d'amplification du gain d'une antenne |
US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
US20150235122A1 (en) | 2012-08-30 | 2015-08-20 | David Finn | Dual interface card with metallized layer |
JP4831587B1 (ja) | 2010-08-23 | 2011-12-07 | パナソニック株式会社 | レーザ光源装置 |
KR101275983B1 (ko) * | 2010-09-01 | 2013-06-14 | 현대카드 주식회사 | 메탈 결제카드 및 그 제작 방법 |
WO2012071078A1 (en) | 2010-11-23 | 2012-05-31 | X-Card Holdings, Llc | One-time password card for secure transactions |
WO2011150879A2 (zh) | 2011-06-22 | 2011-12-08 | 华为终端有限公司 | 半导体器件封装方法及其结构 |
JP5777096B2 (ja) | 2011-07-21 | 2015-09-09 | 株式会社スマート | 万能icタグとその製造法、及び通信管理システム |
US10733494B2 (en) | 2014-08-10 | 2020-08-04 | Féinics Amatech Teoranta | Contactless metal card constructions |
US9390364B2 (en) | 2011-08-08 | 2016-07-12 | Féinics Amatech Teoranta | Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags |
US9836684B2 (en) | 2014-08-10 | 2017-12-05 | Féinics Amatech Teoranta | Smart cards, payment objects and methods |
US9251458B2 (en) | 2011-09-11 | 2016-02-02 | Féinics Amatech Teoranta | Selective deposition of magnetic particles and using magnetic material as a carrier medium to deposit nanoparticles |
US9960476B2 (en) | 2014-08-10 | 2018-05-01 | Féinics Amatech Teoranta | Smart card constructions |
US9475086B2 (en) | 2013-01-18 | 2016-10-25 | Féinics Amatech Teoranta | Smartcard with coupling frame and method of increasing activation distance of a transponder chip module |
US9812782B2 (en) | 2011-08-08 | 2017-11-07 | Féinics Amatech Teoranta | Coupling frames for RFID devices |
US9634391B2 (en) | 2011-08-08 | 2017-04-25 | Féinics Amatech Teoranta | RFID transponder chip modules |
US9622359B2 (en) | 2011-08-08 | 2017-04-11 | Féinics Amatech Teoranta | RFID transponder chip modules |
US9798968B2 (en) | 2013-01-18 | 2017-10-24 | Féinics Amatech Teoranta | Smartcard with coupling frame and method of increasing activation distance of a transponder chip module |
US9489613B2 (en) | 2011-08-08 | 2016-11-08 | Féinics Amatech Teoranta | RFID transponder chip modules with a band of the antenna extending inward |
US20150269474A1 (en) | 2011-08-08 | 2015-09-24 | David Finn | Rfid transponder chip modules |
US20150129665A1 (en) | 2013-11-13 | 2015-05-14 | David Finn | Connection bridges for dual interface transponder chip modules |
US10518518B2 (en) | 2013-01-18 | 2019-12-31 | Féinics Amatech Teoranta | Smart cards with metal layer(s) and methods of manufacture |
US9697459B2 (en) | 2014-08-10 | 2017-07-04 | Féinics Amatech Teoranta | Passive smart cards, metal cards, payment objects and smart jewelry |
MX2014008936A (es) | 2012-01-23 | 2015-06-02 | Feinics Amatech Teoranta | Protección de compensacion y acoplamiento mejorado en tarjetas inteligentes metalizadas. |
CN105977613B (zh) * | 2012-02-01 | 2019-11-22 | 株式会社村田制作所 | 天线装置及通信终端装置 |
JP5924006B2 (ja) * | 2012-02-02 | 2016-05-25 | 株式会社村田製作所 | アンテナ装置 |
EP2644376B1 (fr) | 2012-03-26 | 2015-03-04 | Nagravision S.A. | Carte incorporant un objet de valeur visible et son procédé de fabrication |
US9122968B2 (en) | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
US9439334B2 (en) | 2012-04-03 | 2016-09-06 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
US20130299593A1 (en) | 2012-05-14 | 2013-11-14 | Robert Mason Glidden III | Parallel stage power output rectifier for radio-frequency identification (rfid) devices, and related components and methods |
US10032099B2 (en) | 2012-07-20 | 2018-07-24 | CPI Card Group—Colorado, Inc. | Weighted transaction card |
WO2014033626A1 (en) | 2012-08-28 | 2014-03-06 | Tagsys | Object identification device with rfid tag of small size |
US10552722B2 (en) | 2014-08-10 | 2020-02-04 | Féinics Amatech Teoranta | Smartcard with coupling frame antenna |
US20150269477A1 (en) * | 2012-08-30 | 2015-09-24 | David Finn | Dual-interface hybrid metal smartcard with a booster antenna or coupling frame |
US9099789B1 (en) | 2012-09-05 | 2015-08-04 | Amazon Technologies, Inc. | Dual-band inverted slot antenna |
EP2722193A1 (en) | 2012-10-19 | 2014-04-23 | Gemalto SA | Secure data carrier and method of production of said secure data carrier |
US20140158773A1 (en) * | 2012-12-06 | 2014-06-12 | Black Card Llc | Transaction cards and associated methods |
US20190156073A1 (en) | 2017-11-21 | 2019-05-23 | David Finn | Smartcard constuctions |
US10193211B2 (en) | 2014-08-10 | 2019-01-29 | Féinics Amatech Teoranta | Smartcards, RFID devices, wearables and methods |
US10599972B2 (en) | 2013-01-18 | 2020-03-24 | Féinics Amatech Teoranta | Smartcard constructions and methods |
US20140279555A1 (en) | 2013-03-14 | 2014-09-18 | Nagraid Security, Inc. | Dynamically allocated security code system for smart debt and credit cards |
US20170243104A1 (en) | 2013-03-14 | 2017-08-24 | X-Card Holdings, Llc | Information carrying card for displaying one time passcodes, and method of making the same |
WO2014149926A1 (en) | 2013-03-15 | 2014-09-25 | X-Card Holdings, Llc | Methods of making a core layer for an information carrying card, and resulting products |
US9147295B2 (en) | 2013-06-21 | 2015-09-29 | X-Card Holdings, Llc | Inductive coupling activation systems and methods |
WO2015026612A2 (en) | 2013-08-21 | 2015-02-26 | X-Card Holdings, Llc | Apparatus and method for making information carrying cards through radiation curing, and resulting products |
US20150097040A1 (en) | 2013-10-09 | 2015-04-09 | Infineon Technologies Ag | Booster antenna structure |
WO2015071086A1 (en) | 2013-11-13 | 2015-05-21 | Féinics Amatech Teoranta | Connection bridges for dual interface transponder chip modules |
EP3547225B1 (en) | 2013-11-13 | 2024-10-23 | Féinics AmaTech Teoranta | Smartcard with coupling frame and method of increasing activation distance of a transponder chip module |
KR102287869B1 (ko) | 2013-11-18 | 2021-08-09 | 컴포시큐어 엘엘씨 | 금속 층 및 안테나를 가진 카드 |
US9569718B2 (en) | 2013-12-19 | 2017-02-14 | Composecure, Llc | Card with metal layer and electrostatic protection |
US20150206047A1 (en) | 2014-01-20 | 2015-07-23 | John Herslow | Metal card with radio frequency (rf) transmission capability |
WO2015144261A1 (en) | 2014-03-26 | 2015-10-01 | Féinics Amatech Teoranta | Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags |
US10922601B2 (en) | 2014-05-22 | 2021-02-16 | Composecure, Llc | Transaction and ID cards having selected texture and coloring |
US20170244437A1 (en) | 2014-08-04 | 2017-08-24 | Fabrizio Alieri | Social Network and Apps Card |
WO2016046184A1 (en) | 2014-09-22 | 2016-03-31 | Féinics Amatech Teoranta | Passive smart cards, metal cards, payment objects and smart jewelry |
DE102014015275A1 (de) | 2014-10-16 | 2016-04-21 | Giesecke & Devrient Gmbh | Datenträger mit flächiger Lichtquelle |
DE102014015277A1 (de) | 2014-10-16 | 2016-04-21 | Giesecke & Devrient Gmbh | Datenträger mit einer Lichtquelle und einem graphischen Element |
JP6889111B2 (ja) | 2014-11-03 | 2021-06-18 | コンポセキュア,リミティド ライアビリティ カンパニー | セラミックス含有取引カード |
US10783422B2 (en) | 2014-11-03 | 2020-09-22 | Composecure, Llc | Ceramic-containing and ceramic composite transaction cards |
WO2016106251A2 (en) | 2014-12-23 | 2016-06-30 | Composecure, Llc | Smart metal card with radio frequency (rf) transmission capability |
US20160232438A1 (en) | 2015-02-06 | 2016-08-11 | American Express Travel Related Services Company, Inc. | Ceramic-containing transaction cards |
US9390363B1 (en) | 2015-03-05 | 2016-07-12 | Composecure, Llc | Cards with special texture and color |
US9760316B2 (en) | 2015-03-27 | 2017-09-12 | Konica Minolta Laboratory U.S.A., Inc. | Method and system for managing software version compatibility amongst devices in a multi-device network environment |
ES2982667T3 (es) | 2015-07-08 | 2024-10-17 | Composecure Llc | Tarjeta inteligente de metal con capacidad de interfaz dual |
CN105024162B (zh) | 2015-07-08 | 2018-06-26 | 深圳市信维通信股份有限公司 | 一种带有金属后壳的nfc天线 |
AU2015390919B2 (en) * | 2015-07-08 | 2017-04-06 | Composecure, Llc | Metal smart card with dual interface capability |
US9390366B1 (en) | 2015-07-08 | 2016-07-12 | Composecure, Llc | Metal smart card with dual interface capability |
CN108027892B (zh) | 2015-09-18 | 2021-04-09 | X卡控股有限公司 | 用于信息携带卡的自定心嵌体和芯层、过程以及得到的产品 |
CA3001334C (en) | 2015-10-14 | 2024-01-09 | Capital One Services, Llc | Molded pocket in transaction card construction |
WO2017090891A1 (ko) | 2015-11-25 | 2017-06-01 | (주)바이오스마트 | 안테나를 내장한 비접촉식 금속카드 |
KR101798104B1 (ko) | 2015-11-25 | 2017-12-13 | (주)바이오스마트 | 안테나를 내장한 비접촉식 금속카드 |
TWI582703B (zh) | 2015-12-31 | 2017-05-11 | 太思科技股份有限公司 | 用於安裝先進智慧卡的輔助安裝結構 |
CN205721902U (zh) | 2016-04-11 | 2016-11-23 | 深圳市高福科技有限公司 | 一种可以射频通讯与支付的金属芯片卡 |
KR101754985B1 (ko) * | 2016-04-21 | 2017-07-19 | 주식회사 아이씨케이 | 비접촉식 카드 기능을 갖는 메탈 카드 및 그 제조 방법 |
DE102016107982A1 (de) | 2016-04-29 | 2017-11-02 | Infineon Technologies Ag | Chipkartenmodul, Chipkarte und Verfahren zum Bilden eines Chipkartenmoduls |
GB201608070D0 (en) | 2016-05-09 | 2016-06-22 | Polar Oled Ltd | Substrate with OLED display |
WO2017205176A1 (en) | 2016-05-23 | 2017-11-30 | X-Card Holdings, Llc | Multiple interface electronic card |
US9836687B1 (en) | 2016-05-25 | 2017-12-05 | American Express Travel Related Services Company, Inc. | Ceramic-containing transaction cards and methods of making the same |
US9760816B1 (en) | 2016-05-25 | 2017-09-12 | American Express Travel Related Services Company, Inc. | Metal-containing transaction cards and methods of making the same |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
KR102286490B1 (ko) | 2016-07-27 | 2021-08-04 | 컴포시큐어 엘엘씨 | 트랜잭션 카드들을 위한 오버몰딩된 전자 컴포넌트 및 이를 제조하는 방법 |
USD812137S1 (en) | 2016-11-04 | 2018-03-06 | Isaac S. Daniel | Electronic card |
USD797188S1 (en) | 2016-12-14 | 2017-09-12 | Chaya Coleena Hendrick | Smart card with a chip and finger-print sensor |
AU2018208477B2 (en) | 2017-01-11 | 2022-09-15 | Composecure, Llc | Metal dual interface card |
FR3062503B1 (fr) | 2017-01-27 | 2019-04-05 | Oberthur Technologies | Dispositif rfid et procede de fabrication |
US10583683B1 (en) | 2017-02-03 | 2020-03-10 | Federal Card Services, LLC | Embedded metal card and related methods |
WO2018178314A1 (en) * | 2017-03-29 | 2018-10-04 | Féinics Amatech Teoranta | Contactless metal card constructions |
AU2018262628B2 (en) | 2017-05-03 | 2022-06-02 | Féinics Amatech Teoranta | Smart cards with metal layer(s) and methods of manufacture |
KR20170120524A (ko) | 2017-05-08 | 2017-10-31 | 주식회사 아이씨케이 | 비접촉식 카드 기능을 갖는 메탈 카드 및 그 제조 방법 |
JP6372596B1 (ja) | 2017-07-07 | 2018-08-15 | 積水ハウス株式会社 | 断熱構造、断熱工法、断熱材および筋かい断熱カバー |
CA3128530A1 (en) | 2017-08-07 | 2019-02-14 | X-Card Holdings, Llc | Card having metallic core layer and systems and methods for card manufacturing |
US10695609B2 (en) | 2017-08-22 | 2020-06-30 | Joseph P. Anastasi | Pull up accessory |
US11842257B2 (en) | 2017-12-27 | 2023-12-12 | Marlabs Incorporated | System and method for predicting and scoring a data model |
US10839274B2 (en) | 2018-04-09 | 2020-11-17 | Giesecke+Devrient Mobile Security Gmbh | Portable dual-interface data carrier with metal frame |
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- 2021-01-13 JP JP2021003355A patent/JP7280899B2/ja active Active
- 2021-01-18 US US17/151,390 patent/US11247371B2/en active Active
- 2021-04-23 CO CONC2021/0005273A patent/CO2021005273A2/es unknown
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