Ryningen et al., 2020 - Google Patents
Capillary forces as a limiting factor for sawing of ultrathin silicon wafers by diamond multi-wire sawRyningen et al., 2020
View HTML- Document ID
- 17184546055348427689
- Author
- Ryningen B
- Tetlie P
- Johnsen S
- Dalaker H
- Publication year
- Publication venue
- Engineering Science and Technology, an International Journal
External Links
Snippet
Succeeding with ultrathin silicon wafer sawing by diamond multi-wire saw, is not only a matter of optimization; the challenges of thin wafer production and the capability limit have not yet been fully understood. In this work, we have seen that regular pairing of wires occurs …
- 235000012431 wafers 0 title abstract description 87
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