Wallburg et al., 2022 - Google Patents
A material removal coefficient for diamond wire sawing of siliconWallburg et al., 2022
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- 16774060921813655782
- Author
- Wallburg F
- Kuna M
- Budnitzki M
- Schoenfelder S
- Publication year
- Publication venue
- Wear
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Snippet
Diamond wire sawing (DWS) of silicon wafers has replaced loose abrasive sawing (LAS) within a very short time, mainly due to the enormous cost pressure in the photovoltaic industry. However, the LAS process is still much better investigated and understood from a …
- 239000000463 material 0 title abstract description 59
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