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WO2023084595A1 - Four de traitement de gaz et dispositif de traitement de gaz d'échappement l'utilisant - Google Patents

Four de traitement de gaz et dispositif de traitement de gaz d'échappement l'utilisant Download PDF

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Publication number
WO2023084595A1
WO2023084595A1 PCT/JP2021/041172 JP2021041172W WO2023084595A1 WO 2023084595 A1 WO2023084595 A1 WO 2023084595A1 JP 2021041172 W JP2021041172 W JP 2021041172W WO 2023084595 A1 WO2023084595 A1 WO 2023084595A1
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WO
WIPO (PCT)
Prior art keywords
gas
furnace
exhaust gas
furnace body
gas processing
Prior art date
Application number
PCT/JP2021/041172
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English (en)
Japanese (ja)
Inventor
啓志 今村
Original Assignee
カンケンテクノ株式会社
北京康肯▲環▼保▲設▼▲備▼有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by カンケンテクノ株式会社, 北京康肯▲環▼保▲設▼▲備▼有限公司 filed Critical カンケンテクノ株式会社
Priority to PCT/JP2021/041172 priority Critical patent/WO2023084595A1/fr
Priority to TW111133190A priority patent/TWI850754B/zh
Publication of WO2023084595A1 publication Critical patent/WO2023084595A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/46—Removing components of defined structure
    • B01D53/54—Nitrogen compounds
    • B01D53/56—Nitrogen oxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/46—Removing components of defined structure
    • B01D53/68—Halogens or halogen compounds
    • B01D53/70—Organic halogen compounds

Definitions

  • the present invention relates to a gas treatment furnace suitable for abatement treatment of semiconductor manufacturing exhaust gas containing persistent PFCs (perfluoro compounds), N 2 O, etc., and an exhaust gas treatment apparatus using the same.
  • fluorine compound gases are used as cleaning gases, etching gases, and the like in the manufacturing processes of semiconductor devices and liquid crystal displays.
  • fluorine compounds are called "PFCs " , and typical ones are perfluorocarbons such as CF4 , C2F6 , C3F8 , C4F8 , C5F8 , CHF3 and inorganic fluorine-containing compounds such as SF6 and NF3 .
  • N 2 O (nitrous oxide) or the like is used as a material gas when manufacturing a nitride film.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2002-188810 discloses a harmful exhaust gas with an inlet scrubber. After removing the dust contained in the exhaust gas, the exhaust gas is thermally decomposed in a gas processing furnace equipped with an electric heater, and the decomposed gas is detoxified by gas-liquid contact with a wet outlet scrubber. .
  • the above prior art has the following problems. That is, if the PFCs in the exhaust gas are mainly composed of persistent CF 4 , the electric heater must be used at a very high temperature of 1500 ° C or higher. The physical properties of the heating element material are also close to the limit, and there is a problem that continuous operation over a long period of time is difficult. In addition, when the substance to be removed in the exhaust gas is N 2 O, there is also a problem that a large amount of NOx is by-produced after thermal decomposition. In addition, the “2030 Agenda for Sustainable Development” was adopted at the United Nations Summit in September 2015, and since then various discussions and studies have been conducted regarding the efficient use of energy in the future. Under these circumstances, there is an increasing need for higher efficiency and energy saving associated with the exhaust gas treatment apparatus equipped with the above-mentioned conventional electric heater, which consumes a relatively large amount of electric power for heating. It can easily be expected to come.
  • the main object of the present invention is to maintain the advantages of a conventional gas treatment furnace employing an electric heater and to achieve more efficient use of electric energy.
  • a gas treatment furnace capable of remarkably improving the removal efficiency of semiconductor manufacturing exhaust gas containing various kinds of substances to be removed such as N 2 O and an exhaust gas treatment apparatus using the same. .
  • the present invention has a gas processing furnace configured as follows for thermally decomposing exhaust gas E discharged from a semiconductor manufacturing process. That is, a closed cylindrical furnace body 12 in which a gas processing space 12a is formed and a gas inlet 12b is provided at the bottom, and an electric heater 14 for heating the gas processing space 12a inside the furnace body 12.
  • the furnace main body 12 has a reducing gas source supply means 16 for supplying at least one of ammonia water and urea water as a reducing gas source S toward the vicinity of the gas inlet 12b in the gas processing space 12a. be provided.
  • the present invention has, for example, the following effects.
  • at least one of ammonia water and urea water is supplied as the reducing gas source S toward the vicinity of the gas introduction port 12b in the gas processing space 12a.
  • the surrounding area is filled with reducing gas derived from ammonia water or urea water, that is, ammonia (NH 3 ). Therefore, the exhaust gas E introduced into the gas processing space 12a in the furnace body 12 from the gas inlet 12b is mixed with the reducing gas, and heated in such a state, resulting in the action of the radicalized reducing gas.
  • PFCs and N 2 O in the exhaust gas E are thermally decomposed very efficiently.
  • the reducing gas mixed during thermal decomposition of the exhaust gas E is in the form of an aqueous solution called a reducing gas source S consisting of ammonia water and/or urea water.
  • one end is attached to the inner bottom surface of the furnace body 12 so as to surround the periphery of the gas inlet 12b, and the other end is attached to the ceiling surface of the furnace body 12.
  • the exhaust gas E introduced into the furnace main body 12 that is, the gas processing space 12a
  • the gas inlet 12b flows through the furnace main body 12, so that the exhaust gas E does not stay in the gas processing space 12a. A long time can be taken, and the heat generated by the electric heater 14 can be sufficiently received.
  • a second aspect of the present invention is an exhaust gas treatment apparatus using the above gas treatment furnace, and any of the above gas treatment furnaces and an exhaust gas E to be treated to be introduced into the gas treatment furnace is previously washed with liquid. and at least one of an outlet scrubber 22 for cooling and washing the exhaust gas E thermally decomposed in the gas treatment furnace.
  • the present invention it is possible to have the advantages of a gas treatment furnace employing a conventional electric heater as it is, and to use electric energy more efficiently, for example, CF 4 and N 2 O It is possible to provide a gas treatment furnace and an exhaust gas treatment apparatus using the same that can remarkably improve the efficiency of abatement of semiconductor manufacturing exhaust gas, which consists of various kinds of substances to be abated.
  • FIG. 1 is an explanatory diagram showing an example of an exhaust gas treatment apparatus X using a gas treatment furnace 10 of one embodiment of the present invention.
  • This exhaust gas treatment apparatus X is an apparatus for thermally decomposing and detoxifying an exhaust gas E containing PFCs, N 2 O, and the like discharged from an emission source (semiconductor manufacturing process) (not shown). , an inlet scrubber 20 and an outlet scrubber 22 .
  • the gas treatment furnace 10 is a device for thermally decomposing PFCs, N 2 O, etc. in the exhaust gas E using an electric heater 14, and generally includes a furnace body 12, an electric heater 14, a reducing gas source supply means 16, and an inner cylinder. 18.
  • the furnace body 12 is a closed cylindrical (closed cylindrical in the illustrated embodiment) container whose inner surface is at least made of a refractory material such as castable and in which a gas processing space 12a is formed.
  • the furnace main body 12 is erected so that the plane portion (of the furnace main body 12) faces the top and bottom when in use, and a gas inlet 12b is drilled in the center of the bottom surface.
  • the inner cylinder 18 is attached so as to surround the gas inlet 12b, and the gas processing space 12a inside the furnace body 12 is provided at a position spaced apart from the gas inlet 12b on the bottom surface of the furnace body 12.
  • a gas discharge port 12c is provided for discharging the exhaust gas E thermally decomposed in .
  • the ceiling of the furnace body 12 is provided with a plurality of heater insertion openings 12d for inserting the electric heaters 14, and a nozzle insertion opening 12e into which the supply nozzle 16b of the reducing gas source supply means 16 is inserted. be done.
  • the furnace body 12 is formed in a sealed cylindrical shape, but the shape of the furnace body 12 may be any shape as long as it is a cylindrical shape with both ends sealed. It may be in the shape of a square tube or the like.
  • the electric heater 14 serves as a heat source for heating the gas processing space 12a in the furnace body 12, and has a long rod-shaped heating element 14a.
  • the heating element 14a has corrosion resistance to HF (hydrogen fluoride) produced by thermal decomposition of PFCs in the exhaust gas E to be treated, and is capable of generating heat at a high temperature.
  • Ceramics such as silicon carbide (SiC), molybdenum disilicide (MoSi 2 ) and lanthanum chromite (LaCrO 3 ), ceramics such as alumina, or metals such as Hastelloy (registered trademark of Haynes)
  • a metal wire such as a Nichrome wire or a Kanthal (registered trademark of Sandvik AB) wire, which serves as a heating resistor, is spirally wound inside the protective tube.
  • the electric heater 14 is detachably attached by inserting the heating element 14 a into the inner space of the furnace body 12 through a heater insertion port 12 d provided at a predetermined position on the ceiling of the furnace body 12 . Therefore, the electric heater 14 is vertically installed from the ceiling of the furnace body 12 . In the illustrated embodiment, two electric heaters 14 are installed vertically, but the number of electric heaters 14 installed in the furnace body 12 is not limited to this. It may be three or more.
  • the reducing gas source supply means 16 is a device that supplies at least one of ammonia water and urea water as the reducing gas source S toward the vicinity of the gas inlet 12b in the gas processing space 12a.
  • the reducing gas source S supplied by the reducing gas source supply means 16 it is preferable to use general-purpose ammonia water (ammonium hydroxide) and/or urea water with a concentration of 10 to 35%, for example.
  • the supply flow rate of the reducing gas source S supplied into the gas processing space 12a via the flow control device 16d depends on the type and ratio of the components to be removed in the exhaust gas E, the flow rate of the exhaust gas E, the reducing property It is appropriately determined according to the amount of reducing gas (specifically, ammonia) in the gas source S and the like.
  • the inner cylinder 18 is a cylindrical member that is made of a refractory material such as castable, or a metal material such as Hastelloy (registered trademark of Haynes) or stainless steel, and that is open at both ends in the longitudinal direction.
  • One longitudinal end of the inner cylinder 18 is attached to the inner bottom surface of the furnace body 12 so as to surround the gas introduction port 12b.
  • the inner cylinder 18 extends across the gas processing space 12 a of the furnace body 12 , and the other end in the longitudinal direction is arranged at a position close to the ceiling surface of the furnace body 12 .
  • this inner cylinder 18 is installed as needed.
  • the case where the inner cylinder 18 is formed in a cylindrical shape is shown, but the shape of the inner cylinder 18 may be any shape as long as it is a cylinder with both ends opened, for example, a rectangular shape. There may be. Further, in this embodiment, the case where the electric heater 14 is vertically installed from the ceiling of the furnace body 12 is shown. may be embedded.
  • the gas processing furnace 10 configured as described above is equipped with temperature measuring means such as a thermocouple for detecting the temperature of the gas processing space 12a. temperature signal) is supplied to control means comprising a CPU [Central Processing Unit], a memory, an input device, a display device, etc., via a signal line.
  • control means comprising a CPU [Central Processing Unit], a memory, an input device, a display device, etc., via a signal line.
  • the control means is also connected to the flow control device 16d of the reducing gas source supply means 16 and a power supply unit (not shown), and these various devices are controlled by the control means.
  • the surface of the gas processing furnace 10 is covered with a jacket made of a heat insulating material, a refractory material, or the like, if necessary.
  • the gas processing furnace 10 of this embodiment configured as described above is erected on a storage tank 32 to be described later via the communication pipe 24 .
  • the inlet scrubber 20 is a wet scrubber that removes dust and water-soluble components contained in the exhaust gas E introduced into the gas treatment furnace 10, and has a straight pipe scrubber body 20a and a scrubber body 20a near the top inside the scrubber body 20a. It is composed of a spray nozzle 20b that is installed and sprays a chemical solution such as water in the form of a spray, and a filler 20c that promotes gas-liquid contact between the chemical solution sprayed from the spray nozzle 20b and the exhaust gas E.
  • the inlet scrubber 20 is provided in the middle of the inflow piping system 26 and is erected on a storage tank 32 that stores chemical liquid such as water (see FIG. 1) or (not shown) separately from the storage tank 32 . , and both are connected by a pipe so that the waste liquid is sent to the storage tank 32 .
  • a circulation pump 34 is installed between the spray nozzle 20b and the storage tank 32 to lift the liquid chemical W stored in the storage tank 32 to the spray nozzle 20b.
  • reference numeral 32a in FIG. 1 denotes a “partition wall” that prevents the exhaust gas E that has been liquid-washed in the inlet scrubber 20 from flowing into the outlet scrubber 22 without passing through the gas treatment furnace 10 .
  • the outlet scrubber 22 is a wet scrubber that cools the exhaust gas E that has passed through the gas treatment furnace 10 and is thermally decomposed, and finally removes dust, water-soluble components, and the like generated by the thermal decomposition from the exhaust gas E.
  • a straight pipe type scrubber body 22a communicating with a gas discharge port 12c provided on the bottom surface of the furnace body 12 of the gas treatment furnace 10 via a discharge pipe 28, and a A downward spray nozzle 22b for spraying a chemical solution such as water from above so as to face the flow direction of the exhaust gas E, and a spray nozzle 22b for promoting gas-liquid contact between the chemical solution sprayed from the spray nozzle 22b and the exhaust gas E. It is composed of a filler 22c.
  • the outlet scrubber 22 is provided at the upstream end of the atmospheric release piping system 30 and is erected on a storage tank 32 that stores chemical liquid such as water so that waste water is sent to the storage tank 32 .
  • a circulation pump 34 is installed between the spray nozzle 22b and the storage tank 32, similarly to the inlet scrubber 20 described above, and the liquid chemical stored in the storage tank 32 is lifted to the spray nozzle 22b.
  • the spray nozzle 22b may be supplied not with the chemical liquid stored in the storage tank 32 but with a new chemical liquid such as fresh water.
  • An exhaust fan 36 for releasing the treated exhaust gas E into the atmosphere is connected to the air release piping system 30 near the top outlet of the outlet scrubber 22 .
  • the operation switch (not shown) of the exhaust gas treatment apparatus X is turned on to turn on the gas.
  • the electric heater 14 of the processing furnace 10 is operated to start heating the inside of the gas processing furnace 10 .
  • the exhaust fan 36 is activated to start introducing the exhaust gas E into the exhaust gas processing apparatus X.
  • the flow control device 16d of the reducing gas source supply means 16 operates to supply a predetermined amount of the reducing gas source S into the gas processing space 12a.
  • the exhaust gas E passes through the inlet scrubber 20, the gas treatment furnace 10, and the outlet scrubber 22 in this order, and the components to be removed (that is, PFCs, N 2 O, etc.) in the exhaust gas E are removed. Further, the amount of electric power supplied to the electric heater 14 of the gas processing furnace 10 is controlled by control means (not shown) so that the temperature in the gas processing space 12a is maintained at a predetermined temperature.
  • the exhaust gas treatment apparatus X of the present embodiment in the furnace main body 12, at least one of ammonia water and urea water is supplied as the reducing gas source S toward the vicinity of the gas introduction port 12b in the gas treatment space 12a. Therefore, around the gas inlet 12b of the gas processing space 12a, the water content of the reducing gas source S evaporates (separates), and the reducing gas derived from ammonia water or urea water, that is, ammonia (NH 3 ) is filled. Become. Therefore, the exhaust gas E introduced into the gas processing space 12a in the furnace body 12 through the gas inlet 12b is mixed with the reducing gas, and further heated in such a state to produce radicalized reducing gas.
  • the exhaust gas E containing N 2 O Due to the action, PFCs, N 2 O, etc. in the exhaust gas E are thermally decomposed very efficiently.
  • the exhaust gas E and the reducing gas NH 3 are mixed around the gas inlet 12b, which is a relatively low-temperature region.
  • the reducing gas mixed during thermal decomposition of the exhaust gas E is in the form of an aqueous solution called a reducing gas source S made of ammonia water and/or urea water.
  • an inner cylinder 18 is provided in the furnace body 12 of the gas treatment furnace 10, and a gas discharge port 12c is drilled at a position spaced apart from the gas introduction port 12b on the bottom surface of the furnace body 12. Therefore, the exhaust gas E introduced into the gas processing space 12a of the furnace main body 12 from the gas inlet 12b flows through the furnace main body 12, and the heat generated by the electric heater 14 is sufficiently absorbed. be able to receive. In other words, it is possible to maximize the utilization efficiency of the heat generated by the electric heater 14 .
  • the exhaust gas treatment apparatus X of the present embodiment includes the inlet scrubber 20 and the outlet scrubber 22, the exhaust gas E to be introduced into the gas treatment furnace 10 is preliminarily washed with liquid to prevent clogging of the inflow piping system 26.
  • the gas treatment furnace 10 can be operated continuously in a more stable manner, and the cleanliness of the treated exhaust gas E after thermal decomposition can be improved.
  • the exhaust gas treatment device X includes both the inlet scrubber 20 and the outlet scrubber 22.
  • the inlet scrubber 20 and the outlet scrubber 22 are provided as necessary, Only one of them may be provided.
  • the exhaust gas E flowing through the inflow piping system 26 is supplied into the gas treatment furnace 10 without any treatment through the communication piping 24 connected to its downstream end.
  • a heat exchanger (not shown) is provided between the communication pipe 24 and the discharge pipe 28. You may make it preheat by giving to the waste gas E which flows. In this case, more efficient use of energy can be achieved.
  • various modifications can be made within the scope that a person skilled in the art can imagine.
  • 10 gas processing furnace
  • 12 furnace body
  • 12a gas processing space
  • 12b gas inlet
  • 12c gas outlet
  • 14 electric heater
  • 16 reducing gas source supply means
  • 18 inner cylinder
  • 20 Inlet scrubber
  • 22 outlet scrubber
  • E exhaust gas
  • S reducing gas source.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Treating Waste Gases (AREA)
  • Incineration Of Waste (AREA)

Abstract

La présente invention concerne un four de traitement de gaz qui effectue une thermolyse sur un gaz d'échappement (E) évacué à partir d'une étape de fabrication de semi-conducteurs, le four de traitement de gaz comprenant : un corps de four cylindrique fermé (12) ayant un espace de traitement de gaz (12a) formé dans son sein, et ayant un orifice d'introduction de gaz (12b) percé à travers sa surface inférieure ; et un dispositif de chauffage électrique (14) qui chauffe l'espace de traitement de gaz (12a) à l'intérieur du corps de four (12). La présente invention est caractérisée en ce qu'un moyen d'alimentation en source de gaz réducteur (16), pour fournir au moins l'une de l'eau d'ammoniac ou de l'eau d'urée en tant que source de gaz réducteur (S) vers la périphérie de l'orifice d'introduction de gaz (12b) à l'intérieur de l'espace de traitement de gaz (12a), est disposé sur le corps de four (12).
PCT/JP2021/041172 2021-11-09 2021-11-09 Four de traitement de gaz et dispositif de traitement de gaz d'échappement l'utilisant WO2023084595A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2021/041172 WO2023084595A1 (fr) 2021-11-09 2021-11-09 Four de traitement de gaz et dispositif de traitement de gaz d'échappement l'utilisant
TW111133190A TWI850754B (zh) 2021-11-09 2022-09-01 氣體處理爐及使用此氣體處理爐之廢氣處理裝置

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PCT/JP2021/041172 WO2023084595A1 (fr) 2021-11-09 2021-11-09 Four de traitement de gaz et dispositif de traitement de gaz d'échappement l'utilisant

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025104916A1 (fr) * 2023-11-17 2025-05-22 カンケンテクノ株式会社 Dispositif de détoxication et procédé de détoxication pour gaz

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JP2000342931A (ja) * 1998-06-18 2000-12-12 Kanken Techno Co Ltd パーフルオロカーボンガスの除去方法及び除去装置
JP2002188810A (ja) * 2000-10-10 2002-07-05 Kanken Techno Co Ltd 半導体排ガス処理装置の排ガス処理塔と該処理塔用の電熱ヒータ
JP2002326016A (ja) * 2001-05-08 2002-11-12 Ebara Corp ガス化溶融炉施設における脱硝方法及び脱硝装置
US20030161774A1 (en) * 2001-07-11 2003-08-28 Battelle Memorial Institute Processes and apparatuses for treating halogen-containing gases
JP2004349442A (ja) * 2003-05-22 2004-12-09 Sony Corp 排ガスの除害方法及び排ガスの除害装置
JP2008509328A (ja) * 2004-08-06 2008-03-27 スカニア シーブイ アクチボラグ（パブル） 内燃機関の排気ガス導管内に媒体を供給するための装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025104916A1 (fr) * 2023-11-17 2025-05-22 カンケンテクノ株式会社 Dispositif de détoxication et procédé de détoxication pour gaz

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