Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/02—Contact members
  • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
  • H01R13/035—Plated dielectric material
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
  • H01B1/20—Conductive material dispersed in non-conductive organic material
  • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
  • H01B1/20—Conductive material dispersed in non-conductive organic material
  • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/66—Structural association with built-in electrical component
  • H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
  • H01R13/7197—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters with filters integral with or fitted onto contacts, e.g. tubular filters
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
  • H01R13/6461—Means for preventing cross-talk
  • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
  • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
  • H01R13/6598—Shield material
  • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
  • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
  • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Definitions

• One or more embodiments of the subject matter described herein generally relate to the deposition of dielectric and/or polymer materials onto a conductive substrate to form composite assemblies for electrical connectors.
• capacitive elements may be included along or near the signal path in the connector and/or at a mating interface between the connector and another mating connector.
• some known connectors are mounted onto circuit boards with capacitors mounted onto the printed circuit board adjacent to the connectors and along the signal path extending from the connector and through the circuit board. Adding discrete capacitors to circuit boards, however, consumes additional real estate of the limited available surface area on the circuit board.
• Other known connectors include a separate, discrete capacitor that is coupled to the signal paths in the connectors using known manufacturing methods, such as solder. Joining a separate capacitor to the signal path, however, may lead to problems in matching the electrical impedance of the signal path with the impedance through the capacitor and circuit board. Additionally, solder may introduce risks of reliability concerns as the joint between the solder and the signal path of the connectors can be brittle and easy to break. Additional methods to attach a discrete capacitor to the connector, such as epoxy application, present problems with adhesion, leading to fracture and cracking of the joint.
• Some known capacitive elements are created by covering a conductive tape with a thin film of dielectric material. Adhesion of the dielectric material to the conductive tape is generally poor, thereby resulting in delamination of the dielectric material from the conductive tape. Additionally, the dispersion of the dielectric material on the tape may be uneven, resulting in an inhomogeneous dispersion of the dielectric material on the tape. This may result in non-uniform signal integrity across the connector.
• Other capacitive elements may be created using processing techniques that involve relatively expensive processes and relatively high processing temperatures in order to get dielectric materials with relatively high dielectric constants to adhere to conductive bodies.
• processing techniques that involve relatively expensive processes and relatively high processing temperatures in order to get dielectric materials with relatively high dielectric constants to adhere to conductive bodies.
• traditional high Dk materials and/or precursors - such as barium titanate, strontium titanate, tantalum oxides, and lead-based metal oxides - may require annealing temperatures well above the anneal temperature of the base metal of the connector. These processes may also result in relatively poor adhesion between the dielectric materials and the conductive bodies.
• a contact assembly for an electrical connector includes a conductive substrate, a composite layer, and a conductive layer.
• the conductive substrate is configured to form a conductive path of the electrical connector.
• the composite layer is engaged to the conductive substrate and includes a dielectric material with a conductive filler material dispersed within the dielectric material at a concentration that is lower than a percolation threshold concentration of the composite layer.
• the conductive layer is engaged to the composite layer.
• the conductive substrate, the composite layer, and the conductive layer form a capacitive element through which a signal propagation path between the conductive substrate and a mating contact that mates with the conductive layer passes.
• Figure 1 is a perspective view of an electrical connector in accordance with an example of one embodiment.
• Figure 2 is a perspective view of a contact assembly shown in Figure 1 in accordance with one embodiment.
• Figure 3 is a cross- sectional view the contact assembly shown in Figure 2 along line 3-3 in Figure 2.
• Figure 4 illustrates a cross-sectional view of the contact assembly shown in Figure 1 mated with a mating contact in accordance with one embodiment.
• FIG. 5 is a diagram of an electrodepositing system in accordance with one embodiment.
• Figure 6 is a representation of an electrical conductivity characteristic ( ⁇ ) of a composite layer shown in Figure 2 for different concentrations [c] of a filler material shown in Figure 5 in accordance with one embodiment.
• Figure 7 is a representation of one example of a rate of change in the electrical conductivity characteristic (er/[c]) for different concentrations [c] of the filler material shown in Figure 5 in a composite layer shown in Figure 2.
• Figure 8 is a flowchart of a method for providing a composite layer on a conductive substrate in accordance with one embodiment.
• Figure 9 is an illustration of a connector that includes one or more contacts that include capacitive elements formed in accordance with one or more embodiments described herein.
• Figure 1 is a perspective view of an electrical connector 100 having composite assemblies as contact assemblies 102 in accordance with an example of one embodiment.
• the connector 100 is used to illustrate merely one example of a wide variety of devices that may incorporate one or more embodiments of the subject matter described herein.
• the connector 100 depicted in Figure 1 is not intended to limit all embodiments described herein to the connector 100.
• the connector 100 includes several contact assemblies 102.
• the contact assemblies 102 include conductive materials and provide conductive paths for the connector 100 to convey electric current.
• the contact assemblies 102 may be signal contacts that communicate electronic data signals with a circuit board (not shown) or another connector, ground contacts that electrically join an electromagnetic shield of the connector 100 with a ground reference, power contacts that transmit electric power to and/or from the connector 100, and the like.
• the contact assemblies 102 are capacitive contacts.
• FIG 2 is a perspective view of one of the contact assemblies 102 in accordance with one embodiment.
• Figure 3 is a cross-sectional view of the contact assembly 102 shown in Figure 2 along line 3-3 in Figure 2.
• the contact assemblies 102 may be multi-layered capacitive contacts formed from capacitive assemblies 200.
• the contact assemblies 102 may have integrated or inherent capacitive members formed by conductive and composite layers or bodies.
• the capacitive assembly 200 includes a conductive substrate 202 ("Base Metal” in Figure 3) and a conductive layer 206 ("Top Electrode” in Figure 3) separated by a composite layer 204 ("High Dk Film” in Figure 3).
• the conductive substrate 202 and/or conductive layer 206 include or are formed from conductive materials such as a metal, metal alloy, or conductive carbon-based materials.
• the conductive substrates 202 may be formed from copper (Cu) or a copper alloy.
• the conductive substrates 202 and/or conductive layer 206 may be formed from one or more other conductive bodies.
• the composite layer 204 is provided on the conductive substrate 202, and the conductive layer 206 is provided on the composite layer 204.
• the composite layer 204 may be or include a material that has a relatively high dielectric constant (Dk).
• the composite layer 204 can include or be formed from one or more materials having a dielectric constant (Dk) that is greater than 3.0.
• the dielectric constant (Dk) of the material(s) in the composite layer 204 may be at least 4.2.
• the dielectric constant (Dk) of the material(s) in the composite layer 204 may be at least 100.
• the composite layer 204 can include or be formed from one or more conductive materials and one or more dielectric materials. Such materials may be referred to herein as "high-dielectric materials.”
• the composite layers 204 may have materials with lower dielectric constant (Dk).
• the composite layers 204 may have a dielectric constant (Dk) of 3.0 or less.
• the composite layers 204 include a dielectric material with a conductive filler material dispersed therein.
• the concentration of the conductive filler material can be varied in the dielectric material in order to control the overall dielectric constant (Dk) of the composite layer 204.
• the concentration of the conductive filler material is below a percolation threshold concentration, as described below.
• the composite layer 204 can be applied to the conductive substrate 202 in one or more ways.
• the composite layer 204 is electrodeposited, or "electrocoated” or "e-coated,” onto one or more of the conductive substrate 202.
• the composite layer 204 may be deposited on the conductive substrates 202 by electro depositing the dielectric material onto the conductive substrate 202 or by co-electrodepositing the dielectric material and a filler material onto the conductive substrate 202.
• the composite layer 204 is deposited by a chemical reaction of the reactive precursor materials. The reactive precursor materials react on or at the surface of the conductive substrate 202. The reaction causes the composite layer 204 to be deposited on the conductive substrate 202.
• the composite layer 204 may be provided in a fluid or liquid state in a suspension, mixture, or solution, and the conductive substrate 202 may be dip-coated with the composite layer 204.
• the conductive substrate 202 may be entirely or partially submerged in a fluid bath of the materials used to form the composite layer 204.
• the conductive substrate 202 may be removed from the bath then allowed to cure, dry, harden, or otherwise change states to a solid state as the composite layer 204 on the conductive substrate 202.
• the composite layer 204 may be laminated onto the conductive substrate 202.
• the composite layer 204 may be formed as a sheet, tube, or other shape that is adhered to the outer surface of the conductive substrate 202.
• An adhesive material may be applied between the composite layer 204 and the conductive substrate 202 and/or the composite layer 204 may be heated to assist with adhering the composite layer 204 to the conductive substrate 202.
• the composite layer 204 may be screen printed onto the conductive substrate 202.
• the composite layer 204 may be provided in a fluid or liquid state in a suspension, mixture, or solution and printed onto the outer surface of the conductive substrate 202. The composite layer 204 is then allowed to cure, dry, harden, or otherwise change states to a solid state on the conductive substrate 202.
• the composite layer 204 may be extruded or molded into a shape that fits over the conductive substrate 202, or that the conductive substrate 202 fits into.
• the composite layer 204 can be formed as a solid body, such as a tube, that defines an interior chamber. The conductive substrate 202 can then be inserted into the interior chamber.
• the composite layer 204 is extruded or molded into a shape that engages the outer surface of the conductive substrate 202, such as by having an interior chamber that snap fits or has a very close fit to the outer surface of the conductive substrate 202.
• the composite layer 204 may be provided in a fluid or liquid state (e.g., molten), and the materials of the composite layer 204 may be sprayed onto the conductive substrate 202.
• the conductive substrate 202 may be sprayed with an aerosol or other dispersion of the materials used to form the composite layer 204.
• the materials of the composite layer 204 may be removed from the bath or aerosol medium to allow the material to cure, dry, harden, or otherwise change states to a solid state to form the composite layer 204 on the conductive substrate 202.
• the composite layer 204 may be spin coated onto the conductive substrate 202.
• the composite layer 204 may be applied to a portion of the conductive substrate 202 when the materials forming the composite layer 204 are in a fluid state.
• the conductive substrate 202 may be moved (e.g., spun) to cause the fluid materials of the composite layer 204 to move on and coat at least a portion of the conductive substrate 202.
• the fluid materials may then cure, dry, harden, or otherwise change states to a solid state to form the composite layer 204 on the conductive substrate 202.
• the composite layer 204 may be provided on the conductive substrate 202 using physical vapor deposition (PVD).
• PVD physical vapor deposition
• the materials that form the composite layer 204 may be provided in a vaporized form inside a chamber.
• the conductive substrate 202 may be loaded into the chamber so that the vaporized materials coat at least a portion of the conductive substrate 202.
• the materials may then cure, dry, harden, or otherwise change states to a solid state to form the composite layer 204 on the conductive substrate 202.
• the conductive layer 206 may be provided on the composite layer 204 by depositing conductive material (e.g., metal, metal alloys, or conductive carbon) onto the composite layer 204.
• conductive material e.g., metal, metal alloys, or conductive carbon
• the conductive layer 206 can be sputtered onto or electrodeposited onto the composite layer 204.
• another technique may be used.
• Figure 4 illustrates a cross-sectional view of the contact assembly 102 mated with a mating contact 400 in accordance with one embodiment.
• the mating contact 400 can represent a conductive body, such as a conductive female contact or a conductive via, that receives the contact assembly 102 to communicate data signals between the mating contact 400 and the contact assembly 102.
• the mating contact 400 engages the conductive layer 206 of the contact assembly 102 to electrically couple the mating contact 400 and the contact assembly 102.
• Data signals may be communicated from the contact assembly 102 to the mating contact 400 along a signal propagation path 402 that extends through the composite layer 204 of the contact assembly 102 from the conductive layer 206 to the conductive substrate 202.
• data signals may be communicated in an opposite direction from the mating contact 400 to the contact assembly 102 and across the composite layer 204.
• the data signals flow through the composite layer 204 of the contact assembly 102 between the conductive layer 206 and the conductive substrate 202 such that the data signals pass through a capacitive element formed by the conductive substrate 202, the composite layer 204, and the conductive layer 206.
• the capacitive element may filter the data signals such that the contact assembly 102 both communicates data signals of certain frequencies and filters the data signals of other certain frequencies or DC (e.g., direct current).
• the contact assembly 102 may filter out (e.g., block communication of) noise and/or DC signals from relatively high speed signals that are communicated along the signal propagation path 402.
• the contact assembly 102 may act as a high pass filter that filters out signals communicated at a frequency below a cutoff frequency of the contact assembly 102.
• the contact assembly 102 may permit the signals communicated at frequencies above the cutoff frequency to be communicated along the signal propagation path 402 while preventing signals transmitted at lower frequencies or DC from passing along the signal propagation path 402.
• the contact assembly 102 may act as a low pass filter that filters out signals communicated at a frequency above a cutoff frequency of the contact assembly 102.
• the contact assembly 102 may permit the signals communicated at frequencies below the cutoff frequency to be communicated along the signal propagation path 402 while preventing signals transmitted at higher frequencies to pass along the signal propagation path 402.
• FIG. 5 is a diagram of an electro depositing system 500 in accordance with one embodiment.
• the electrodepositing system 500 is used to "electrocoat” or "e-coat” at least a portion of a conductive substrate 202.
• a fluid bath 504 is provided in a container 506.
• the fluid bath 504 may be a liquid bath formed from one or more dielectric materials 514 and/or one or more filler materials 508, and may be incorporated into a solvent medium.
• the fluid bath 504 is formed from fluid or liquid monomers or polymers that may or may not be partially cured such as epoxy and/or acrylic materials.
• the dielectric material includes a molten thermoplastic polymer or polymer which may be partially cross-linked.
• the fluid bath 504 includes filler material suspended in the fluid bath 504. The filler material 508 and the dielectric material 514 may be separately suspended in the fluid bath 504.
• the filler material 508 and the dielectric material 514 may be separately suspended in the fluid bath 504.
• the fluid bath 504 may be a gaseous bath that includes the filler material 508 dispersed in gaseous form.
• the fluid bath 504 may be a gas in a chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD) or other type of vapor deposition chamber.
• the filler material 508 is a conductive filler material, such as conductive particles of a metal, metal alloy, or conductive carbon (e.g., carbon black, graphene, carbon nanotubes, and the like).
• the filler material 508 in the fluid bath 504 may have a relatively high conductivity characteristic.
• the filler material 508 may conduct electric current with lower resistance than the dielectric material of the fluid bath 504.
• the filler material 508 has an electrical conductivity characteristic of at least 6.30x10 7 Siemens per meter (S/m) at 20 degrees Celsius.
• the filler material 508 may have a different electrical conductivity characteristic, such as at least 5.96xl0 7 S/m, 5.80xl0 7 S/m, 4.10xl0 7 S/m, and the like, at 20 degrees Celsius.
• the filler material 508 may be particles or flakes of conductive carbon material.
• the filler material 508 may include relatively small paiticles (e.g., having an average or median diameter of no greater than 30 nanometers) of carbon black.
• the filler material 508 may include larger paiticles.
• the dielectric material 514 of the fluid bath 504 may have an electrical conductivity characteristic that is relatively small.
• the conducitivity of the dielectric material 514 may be no greater than lxl 0 "8 to lxl 0 "12 S/m at 20 degrees Celsius.
• the dielectric material of the fluid bath 504 may have another electrical conductivity characteristic.
• the conductive substrate 202 is at least partially inserted into the bath 504.
• the conductive substrate 202 may be lowered into the bath 504.
• the conductive substrate 202 may be placed into the container 506 that houses the gaseous bath.
• the conductive substrate 202 is electrically coupled with a power source 510, such as a battery or electrical power supply.
• a conductive counter electrode 512 also is at least partially inserted into the bath 504.
• the counter electrode 512 is electrically coupled with the power source 510.
• the power source 510 applies a current across the conductive substrate 202 and the counter electrode 512.
• the power source 510 applies a positive charge to the counter electrode 512 and a negative charge to the conductive substrate 202.
• a negative charge may be applied to the counter electrode 512 while a positive charge is applied to the conductive substrate 202.
• the voltage potential between the conductive substrate 202 and the counter electrode 512 and/or bath 504 causes the dielectric material 514 and the filler material 508 dispersed therein to be electrodeposited onto the conductive substrate 202.
• the dielectric material 14 and filler material 508 are shown in the bath 504 as charged paiticles (e.g., by being shown by the symbols "+").
• the negatively charged conductive substrate 202 attracts the dielectric material of the bath 504(e.g., the polymer materials) and the filler material 508 toward the conductive substrate 202.
• both the dielectric material of the bath 504 and the filler material 508 are co-electrodeposited onto the conductive substrate 202 as an electrodeposited composite layer 204:
• the dielectric material of the bath 504 and the conductive filler material 506 may be simultaneously or concurrently deposited on the conductive substrate 202.
• the electrodeposition of the composite layer 204 onto the conductive substrate 202 may provide improved adhesion of the dielectric material of the bath 504 and the filler material 508 when compared to other techniques for applying the composite layer 204 to the conductive substrate 202. Additionally, the electrodeposition of the composite layer 204 may result in an approximately uniform or even distribution of the dielectric materials and filler material 406 throughout the composite layer 204. For example, the dispersion or distribution of the dielectric material of the bath 504 and the filler material 508 in the composite layer 204 may be approximately homogeneous.
• Electrodeposition of the composite layer 204 also allows for relatively tight or close control over thicknesses of the composite layer 204. For example, by varying the current used to deposit the composite layer 204 and/or the time period over which the current is applied, the distance between electrodes (e.g., between the substrate 202 and the counter electrode 512, the concentration of the dielectric material 514 and filler particles 508 in the bath 504, and/or the temperature of the bath 504, the thickness of the composite layer 204 can be relatively closely controlled.
• one or more additional conductive layers such as the conductive layer 206 (shown in Figure 2), may be deposited on the composite layer 204.
• the conductive substrate 202 and composite layer 204 are placed into another bath (not shown) having a solution that includes a conductive material, such as metal or metal alloy ion or particles.
• a current may be applied between the conductive substrate 202 and the counter electrode 512 in order to electro deposit the conductive layer 206 onto the composite layer 204.
• the electrodeposition of alternating conductive layers and composite layers 204 may be repeated to form multi-layered structures with alternating layers of composite layers 204 and conductive layers 206.
• Figure 6 is a representation 600 of an electrical conductivity characteristic (a) of the composite layer 204 (shown in Figure 2) for different concentrations [c] of the filler material 508 (shown in Figure 5) in accordance with one embodiment.
• the representation 600 is shown alongside a horizontal axis 602 representative of concentration of the filler material 508 in the composite layer 204 and a vertical axis 604 representative of the electrical conductivity of the composite layer 204.
• the representation 600 is provided as one example and is not intended to be limiting on all embodiments and or all materials that may be used for the filler material 508.
• the conductivity of the composite layer 204 is relatively low for low concentrations of the filler material 508 (shown in Figure 5) in the composite layer 204, and increases to a potential upper limit or assymtote 606 at larger concentrations of the filler material 508.
• the composite layer 204 may become more conductive when more filler material 508 is added to the composite layer 204.
• increasing the concentration of the filler material 508 in the fluid bath 504 (shown in Figure 5) may increase the conductivity of the composite layer 204.
• the concentiation of the filler material 508 is reduced so that the conductivity of the composite layer 204 is not at the upper limit 606, In one embodiment, the concentration of the filler material 508 is reduced below a percolation threshold concentration.
• Figure 7 is a representation 700 of one example of a rate of change in the electrical conductivity characteristic (ff/[c]) for different concentrations [c] of the filler material 508 (shown in Figure 5) in the composite layer 204 (shown in Figure 2).
• the representation 700 may be a mathematical derivative of the representation 600 shown in Figure 6.
• the representation 700 may have a different shape.
• the representation 700 shown in Figure 7 is not intended to be limiting on all embodiments of the presently described subject matter.
• different materials for the filler material 506 and/or the dielectric material of the fluid bath 504 (shown in Figure 5) may have different representations 600 and/or 700.
• the representation 700 is shown alongside a horizontal axis 702 representative of concentration of the filler material 508 (shown in Figure 5) in the composite layer 204 (shown in Figure 2) and a vertical axis 704 representative of the effective dielectric constant (Dkcir) of the composite layer 204 or the capacitance of the composite assembly 200 that includes the composite layer 204.
• the rate of change in the conductivity of the composite layer 204 increases to an upper limit 706 at lower concentrations of the filler material and then decreases for greater concentrations of the filler materiaI508.
• the concentration of the filler material 508 that corresponds to the upper limit 706 of the rate of change of conductivity may be referred to as a percolation threshold concentration 708.
• the percolation threshold concentration 708 can represent the concentration of the filler material 506 (shown in Figure 5) in the composite layer 204 (shown in Figure 2) that, any increase or decrease in filler concentration from the concentration at the maximum derivative to another increased or decreased concentration will yield a substantial change (e.g., the most dramatic change relative to other concentrations of the filler material 506) in conductivity.
• the composite layer 204 can block the flow of a direct current (DC) that is applied across the composite layer 204, such as when the DC is applied across the conductive layer 206 and the conductive substrate 202.
• DC direct current
• the composite layer 204 acts as a conductor and conducts the DC current between the conductive layer 206 and the conductive substrate 202.
• the percolation threshold concentration 708 may be the concentration of the filler material 508 at a greater derivative value of the representation 600 than one or more other derivative values.
• the percolation threshold concentration 708 may occur at the maximum derivative of the representation 600 of conductivity versus concentration.
• the percolation threshold concentration 708 may occur at a different concentration.
• the concentration of the filler material 508 (shown in Figure 5) in the fluid bath 504 (shown in Figure 5) may be established so that the concentration of the filler material 508 in the composite layer 204 (shown in Figure 2) is slightly below the percolation threshold concentration 708.
• concentration of the filler material 506 will be within a relatively small amount of the percolation threshold concentration 708, such as within 1%, 3%, 5%, 7%, 10%, 14%, 17%, or the like.
• the concentration of the filler material 508 is lower than and within 10% of the percolation threshold concentration 708.
• the composite layers 204 formed in accordance with one or more embodiments described herein are found to exhibit relatively high effective dielectric constants (Dk), such as effective dielectric constants (Dk) that are at least 4.0.
• the effective dielectric constants (Dk) may be at least 3.0.
• Dk effective dielectric constants
• the concentration of a conductive filler material is increased, the expectation may be that the composite layer would become more conductive and act more as a conductor than a dielectric layer of a capacitive element and, as a result, cause a decrease in the dielectric constant (Dk) of the composite layer to below 3.0.
• the high effective dielectric constants (Dk) that are achieved by increasing the concentration of the filler material 508 up to a point just below the percolation threshold concentration 608 in accordance with one or more embodiments described herein are unexpected.
• the capacitance of a capacitive assembly 200 (shown in Figure 2) having a copper conductive substrate 202 and conductive layer 206, and a composite layer 204 (shown in Figure 2) formed from 86% epoxy or acrylic material and 14% carbon black particles as the filler material 508 (have an average or median size of no less than 10 and no greater than 30 nanometers) is found to be unexpectedly larger than the capacitance of capacitive assemblies 200 having larger or smaller concentrations of the filler material 506.
• the capacitance of a capacitive assembly 200 having a copper conductive substrate 202 and conductive layer 206, and a composite layer 204 formed from 83.3% epoxy or acrylic material and 16.7% carbon black particles as the filler material 506 (have an average or median size of no less than 10 and no greater than 30 nanometers) is found to be unexpectedly larger than the capacitance of capacitive assemblies 200 having concentrations of the filler material 506 other than 14%.
• the capacitance of a capacitive assembly 200 having a copper conductive substrate 202 and conductive layer 206, and a composite layer 204 formed from 84 to 85% epoxy or acrylic material and 15 to 16% carbon black particles as the filler material 506 (have an average or median size of no less than 10 and no greater than 30 nanometers) is found to be unexpectedly larger than the capacitance of capacitive assemblies 200 having concentrations of the filler material 506 other than 14% or 16.7%.
• the capacitance of a capacitive assembly 200 having a copper conductive substrate 202 and conductive layer 206, and a composite layer 204 formed from 83 to 86% epoxy or acrylic material and 14 to 17% carbon black particles as the filler material 506 (have an average or median size of no less than 10 and no greater than 30 nanometers) is found to be unexpectedly larger than the capacitance of capacitive assemblies 200 having concentrations of the filler material 506 other than 14%, 16.7%, or 15 to 16%.
• the capacitance of a capacitive assembly 200 having a copper conductive substrate 202 and conductive layer 206, and a composite layer 204 formed from 81 to 88% epoxy or acrylic material and 6 to 19% carbon black particles as the filler material 406 (have an average or median size of no less than 10 and no greater than 30 nanometers) is found to be unexpectedly larger than the capacitance of capacitive assemblies 200 having concentrations of the filler material 506 other than 14%, 16.7%, 15 to 16%, or 14 to 17%.
• a conductive material other than carbon black may be used as the filler material 508 (shown in Figure 5).
• particles of gold, silver, platinum, and the like may be used as the filler material 508.
• a metal oxide may be used as the filler material 508.
• Figure 8 is a flowchart of a method 800 for providing a composite layer on a conductive substrate in accordance with one embodiment.
• the method 800 may be used in connection with manufacturing a composite assembly for an electrical connector, such as the composite assembly 200 (shown in Figure 2).
• the fluid bath includes a dielectric material in a liquid or fluid state or as dielectric particles in a suspension.
• the fluid bath may include or be formed from a liquid epoxy or acrylic material as well as a molten or partially cured or otherwise modified polymer.
• a filler material is added to the fluid bath.
• the filler material may be a conductive material, such as silver, gold, platinum, carbon black, and the like.
• the filler material can be provided in relatively small particles or flakes, such as particles that are no larger than 30 nanometers in average diameter.
• the filler material can be added to the fluid bath until the concentration of the filler material is within a designated range of the percolation threshold concentration of the fluid bath.
• the filler material can be added to the fluid bath until the concentration of the filler material is lower than the percolation threshold concentration, but is within 5% of the percolation threshold concentration.
• the filler material can be provided at another concentration that is lower than the percolation threshold concentration.
• the fluid bath with the filler material is applied to an outer surface of a conductive substrate or body.
• the fluid bath and filler material may be electrodeposited onto, molded onto, extruded into a shape that surrounds, laminated onto, sprayed onto, or printed onto the conductive substrate 202, as described above.
• the fluid bath and filler material cures, dries, or otherwise changes into a solid state to form a composite layer on the conductive substrate.
• the fluid bath and filler material may form the composite layer 204 (shown in Figure 2).
• a conductive layer is provided on the composite layer.
• the conductive layer 206 (shown in Figure 2) may be deposited onto a side of the composite layer 204 (shown in Figure 2) that is opposite of the side of the composite layer 204 that engages the conductive body 202 (shown in Figure 2).
• the conductive bodies e.g., the conductive substrate 202 and the conductive layer 206 are on opposite sides of the composite layer 204 and are separated by the composite layer 204 so as to form a capacitive element. Electric current can flow into the contact assembly 102 (shown in Figure 1) that includes the composite layer 204 from the conductive layer 206 and across the composite layer 204 to the conductive substrate 202, as described above.
• FIG 9 is an illustration of a connector 900 that may include one or more contacts 902, 904 that include capacitive elements formed in accordance with one or more embodiments described herein.
• the connector 900 is illustrated as the conductive components of a backplane connector, such as the conductive signal traces in a chicklet of the connector 100 shown in Figure 1.
• the connector 900 may be another type of connector.
• the contacts 902, 904 also are shown in Figure 9 in corresponding insets 906, 908.
• the contacts 902 are shown as pins having a conductive body or core 910 and a composite layer 912 forming a coating on the body 910.
• the composite layer 912 may be similar to the composite layer 204 (shown in Figure 2) described above.
• a conductive layer 914 may be formed onto the composite layer 912, similar to the conductive layer 206 (shown in Figure 2). The sequential layering of the composite layer 912 and the conductive layer 914 onto the body 910 creates a pin that includes a capacitive element.
• Signals that are communicated through the contact 902 travel through the body 910 and across the composite layer 912 to the conductive layer 914 to to another conductive body (e.g., a receptacle) to which the contact 902 is mated, or travel through the conductive layer 914 and across the composite layer 912 to the body 910 from the conductive body to which the contact 902 is mated.
• another conductive body e.g., a receptacle
• the contacts 904 are shown as opposing arms 916 that receive a mating contact (e.g., a pin) therebetween.
• Each of the arms 916 includes a conductive body or core 918 and a composite layer 920 forming a coating on the body 918.
• the composite layer 920 may be similar to the composite layer 204 (shown in Figure 2).
• a conductive layer 922 may be formed onto the composite layer 920, similar to the conductive layer 206 (shown in Figure 2). Similar to the contact 902, the layering of the composite layer 920 and the conductive layer 922 onto the body 918 creates capacitive elements.
• Signals that are communicated through the contact 904 can travel through the body 918 and across the composite layer 920 to the conductive layer 922 to a pin that is received between and engaged with the amis 916, or travel from the pin through the conductive layer 922 and across the composite layer 920 to the body 918.
• forming the capacitive elements as part of the contact 902, 904 through which signals propagate can provide a capacitor or capacitive-like element for the signal propagation path without adding additional components (e.g., capacitors) that are external to the contact.

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• Physics & Mathematics (AREA)
• Chemical & Material Sciences (AREA)
• Dispersion Chemistry (AREA)
• Spectroscopy & Molecular Physics (AREA)
• Parts Printed On Printed Circuit Boards (AREA)
• Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
• Laminated Bodies (AREA)

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• 2013
  • 2013-01-30 CN CN201380020587.6A patent/CN104247159B/zh active Active
  • 2013-01-30 JP JP2014557670A patent/JP6339942B2/ja active Active
  • 2013-01-30 EP EP13703497.1A patent/EP2815463A1/en not_active Withdrawn
  • 2013-01-30 WO PCT/US2013/023760 patent/WO2013122740A1/en active Application Filing

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