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WO2013119737A3 - Processing flexible glass with a carrier - Google Patents

Processing flexible glass with a carrier Download PDF

Info

Publication number
WO2013119737A3
WO2013119737A3 PCT/US2013/025035 US2013025035W WO2013119737A3 WO 2013119737 A3 WO2013119737 A3 WO 2013119737A3 US 2013025035 W US2013025035 W US 2013025035W WO 2013119737 A3 WO2013119737 A3 WO 2013119737A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
thin sheet
desired part
flexible glass
bonded area
Prior art date
Application number
PCT/US2013/025035
Other languages
French (fr)
Other versions
WO2013119737A2 (en
Inventor
Anatoli Anatolyevich Abramov
Robert Alan Bellman
Dana Craig Bookbinder
Ta-Ko Chuang
Jeffrey John Domey
Darwin Gene Enicks
Linda GASKILL
Kiat Chyai Kang
Marvin William Kemmerer
Kuan-Ting Kuo
Jen-Chieh Lin
Robert George MANLEY
John Christopher Thomas
Pei-Lien TSENG
Jian-Zhi Jay Zhang
Original Assignee
Corning Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Incorporated filed Critical Corning Incorporated
Priority to CN201380017841.7A priority Critical patent/CN104541365B/en
Priority to KR1020147025429A priority patent/KR20140129153A/en
Priority to JP2014556641A priority patent/JP2015515431A/en
Publication of WO2013119737A2 publication Critical patent/WO2013119737A2/en
Publication of WO2013119737A3 publication Critical patent/WO2013119737A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

A method of removing a desired part of a thin sheet (20) from a thin sheet bonded to a carrier (10) by a bonded area (40) that surrounds a non-bonded area (50), wherein the method includes forming a perimeter vent (60) defining a perimeter of the desired part (56), wherein the perimeter vent is disposed within the non-bonded area and has a depth ≥ 50% of the thickness (22) of the thin sheet. Prior to removing the desired part, a device may be processed onto the thin sheet. In some processes, the carrier is diced so it may be processed in smaller sizes, yet maintains a hermetically sealed edge. After dicing, an additional part of the device may be processed onto the thin sheet, and the desired part is removed by removing a desired part of the thin sheet from the carrier.
PCT/US2013/025035 2012-02-08 2013-02-07 Processing flexible glass with a carrier WO2013119737A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201380017841.7A CN104541365B (en) 2012-02-08 2013-02-07 Flexible glass of the processing with carrier
KR1020147025429A KR20140129153A (en) 2012-02-08 2013-02-07 Processing flexible glass with a carrier
JP2014556641A JP2015515431A (en) 2012-02-08 2013-02-07 Processing flexible glass with carrier

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261596727P 2012-02-08 2012-02-08
US61/596,727 2012-02-08

Publications (2)

Publication Number Publication Date
WO2013119737A2 WO2013119737A2 (en) 2013-08-15
WO2013119737A3 true WO2013119737A3 (en) 2014-02-27

Family

ID=47741305

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2013/025035 WO2013119737A2 (en) 2012-02-08 2013-02-07 Processing flexible glass with a carrier

Country Status (5)

Country Link
JP (2) JP2015515431A (en)
KR (1) KR20140129153A (en)
CN (2) CN104541365B (en)
TW (2) TW201725125A (en)
WO (1) WO2013119737A2 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10543662B2 (en) * 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
IN2014DN10473A (en) 2012-06-09 2015-08-21 Johnson Contr Automotive Elect
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
TWI617437B (en) 2012-12-13 2018-03-11 康寧公司 Facilitated processing for controlling bonding between sheet and carrier
US20150059411A1 (en) * 2013-08-29 2015-03-05 Corning Incorporated Method of separating a glass sheet from a carrier
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
KR102151247B1 (en) * 2013-11-11 2020-09-03 삼성디스플레이 주식회사 Method of manufacturing flexible display panel and method of manufacturing flexible display apparatus
CN103606535B (en) * 2013-11-26 2016-01-06 深圳市华星光电技术有限公司 The manufacture method of flexible display assembly and the flexible display assembly of making thereof
TWI523218B (en) 2013-11-28 2016-02-21 群創光電股份有限公司 Organic light emitting diode display panel and method for manufacturing the same
US9260337B2 (en) 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
WO2015112958A1 (en) * 2014-01-27 2015-07-30 Corning Incorporated Articles and methods for controlled bonding of thin sheets with carriers
JP2017506204A (en) * 2014-01-27 2017-03-02 コーニング インコーポレイテッド Articles and methods for controlled bonding of polymeric surfaces to carriers
KR20160145062A (en) * 2014-04-09 2016-12-19 코닝 인코포레이티드 Device modified substrate article and methods for making
WO2016007695A1 (en) * 2014-07-09 2016-01-14 Corning Incorporated Methods for separating a glass sheet
WO2016187186A1 (en) 2015-05-19 2016-11-24 Corning Incorporated Articles and methods for bonding sheets with carriers
FR3038128B1 (en) 2015-06-26 2018-09-07 Commissariat A L'energie Atomique Et Aux Energies Alternatives METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE
EP3313799B1 (en) 2015-06-26 2022-09-07 Corning Incorporated Methods and articles including a sheet and a carrier
KR20170096242A (en) * 2015-12-29 2017-08-24 주식회사 이오테크닉스 Laser processing apparatus and laser processing method
KR20180099761A (en) * 2015-12-30 2018-09-05 코닝 인코포레이티드 Method and apparatus for clamping a cover substrate with a van der Waals force in a vacuum coating process
TW202216444A (en) 2016-08-30 2022-05-01 美商康寧公司 Siloxane plasma polymers for sheet bonding
TWI810161B (en) 2016-08-31 2023-08-01 美商康寧公司 Articles of controllably bonded sheets and methods for making same
CN115925234A (en) * 2017-08-10 2023-04-07 Ａｇｃ株式会社 Glass substrate for TFT
WO2019036710A1 (en) 2017-08-18 2019-02-21 Corning Incorporated Temporary bonding using polycationic polymers
US11331692B2 (en) 2017-12-15 2022-05-17 Corning Incorporated Methods for treating a substrate and method for making articles comprising bonded sheets
CN109592892A (en) * 2018-11-26 2019-04-09 武汉华工激光工程有限责任公司 A kind of laser processing of glass
JP7298161B2 (en) * 2019-01-18 2023-06-27 Ａｇｃ株式会社 SUBSTRATE WITH FUNCTIONAL LAYER AND MANUFACTURING METHOD THEREOF
KR20200106755A (en) * 2019-03-05 2020-09-15 코닝 인코포레이티드 Processing apparatus for glass laminate substrate, method of processing and cutting using the same
CN113910709A (en) * 2020-07-07 2022-01-11 海南大学 Vacuum glass and manufacturing method thereof
KR20220062192A (en) * 2020-11-06 2022-05-16 삼성디스플레이 주식회사 Substrate stacking structure and substrate cutting method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060278619A1 (en) * 2005-06-13 2006-12-14 Jenoptik Automatisierungstechnik Gmbh Arrangement for severing a flat workpiece of brittle material multiple times by means of a laser
US20090194517A1 (en) * 2008-02-01 2009-08-06 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Laser cutting device
US20100068483A1 (en) * 2008-09-15 2010-03-18 Industrial Technology Research Institute Substrate structures applied in flexible electrical devices and fabrication method thereof
US20110027551A1 (en) * 2009-08-03 2011-02-03 Industrial Technology Research Institute Substrate structures applied in flexible electrical devices and fabrication method thereof
CN102176435A (en) * 2010-12-27 2011-09-07 友达光电股份有限公司 Flexible substrate structure and manufacturing method thereof

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US6814833B2 (en) 2001-10-26 2004-11-09 Corning Incorporated Direct bonding of articles containing silicon
JP2007251080A (en) * 2006-03-20 2007-09-27 Fujifilm Corp Fixing method for plastic substrate, circuit substrate, and manufacturing method therefor
CN101327536A (en) * 2008-07-29 2008-12-24 扬州大学 Composite synchronous superaudio vibrating micro electrolytic machining method
DE102008037404A1 (en) * 2008-09-30 2010-04-01 Schott Solar Ag Process for the chemical treatment of a substrate
US8357974B2 (en) 2010-06-30 2013-01-22 Corning Incorporated Semiconductor on glass substrate with stiffening layer and process of making the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060278619A1 (en) * 2005-06-13 2006-12-14 Jenoptik Automatisierungstechnik Gmbh Arrangement for severing a flat workpiece of brittle material multiple times by means of a laser
US20090194517A1 (en) * 2008-02-01 2009-08-06 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Laser cutting device
US20100068483A1 (en) * 2008-09-15 2010-03-18 Industrial Technology Research Institute Substrate structures applied in flexible electrical devices and fabrication method thereof
US20110027551A1 (en) * 2009-08-03 2011-02-03 Industrial Technology Research Institute Substrate structures applied in flexible electrical devices and fabrication method thereof
CN102176435A (en) * 2010-12-27 2011-09-07 友达光电股份有限公司 Flexible substrate structure and manufacturing method thereof
US20120164408A1 (en) * 2010-12-27 2012-06-28 Keh-Long Hwu Flexible substrate structure and method of fabricating the same

Also Published As

Publication number Publication date
TW201343403A (en) 2013-11-01
CN107097004A (en) 2017-08-29
KR20140129153A (en) 2014-11-06
JP2015515431A (en) 2015-05-28
TWI605948B (en) 2017-11-21
JP2018020957A (en) 2018-02-08
WO2013119737A2 (en) 2013-08-15
CN104541365A (en) 2015-04-22
TW201725125A (en) 2017-07-16
CN104541365B (en) 2018-02-02

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