[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2010085113A3 - 신규 연성 금속박 적층판 및 그 제조방법 - Google Patents

신규 연성 금속박 적층판 및 그 제조방법 Download PDF

Info

Publication number
WO2010085113A3
WO2010085113A3 PCT/KR2010/000422 KR2010000422W WO2010085113A3 WO 2010085113 A3 WO2010085113 A3 WO 2010085113A3 KR 2010000422 W KR2010000422 W KR 2010000422W WO 2010085113 A3 WO2010085113 A3 WO 2010085113A3
Authority
WO
WIPO (PCT)
Prior art keywords
metal foil
producing
polyimide layer
foil laminate
same
Prior art date
Application number
PCT/KR2010/000422
Other languages
English (en)
French (fr)
Other versions
WO2010085113A2 (ko
Inventor
박영석
백은송
김양섭
양동보
Original Assignee
주식회사 두산
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 두산 filed Critical 주식회사 두산
Priority to CN2010800128683A priority Critical patent/CN102361753A/zh
Priority to JP2011547782A priority patent/JP5814127B2/ja
Priority to US13/145,959 priority patent/US20120018197A1/en
Publication of WO2010085113A2 publication Critical patent/WO2010085113A2/ko
Publication of WO2010085113A3 publication Critical patent/WO2010085113A3/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y10T428/24975—No layer or component greater than 5 mils thick
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

본 발명은 (a) 제 1면상에 제 1 폴리이미드층이 형성된 제 1 도전성 금속박; 및 (b) 제 1면상에 제 2 폴리이미드층이 형성된 제 2 도전성 금속박을 포함하며, 상기 제 1 폴리이미드층과 제 2 폴리이미드층이 에폭시 접착제에 의해 서로 접합되어 있는 것이 특징인 연성 금속박 적층판 및 이의 제조방법을 제공한다. 본 발명에서는 종래 연성 2층 양면 동박 적층판의 내열성 및 굴곡성 특성과 대등하게 발휘되면서도, 제조공정이 단순하고 간편하여 생산성 및 경제성을 높일 수 있다.
PCT/KR2010/000422 2009-01-23 2010-01-22 신규 연성 금속박 적층판 및 그 제조방법 WO2010085113A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2010800128683A CN102361753A (zh) 2009-01-23 2010-01-22 一种新型挠性金属箔层叠板及其制造方法
JP2011547782A JP5814127B2 (ja) 2009-01-23 2010-01-22 新規な軟性金属箔積層板およびその製造方法
US13/145,959 US20120018197A1 (en) 2009-01-23 2010-01-22 Novel ductile metal foil laminate and method for producing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090006195A KR101102180B1 (ko) 2009-01-23 2009-01-23 신규 연성 금속박 적층판 및 그 제조방법
KR10-2009-0006195 2009-01-23

Publications (2)

Publication Number Publication Date
WO2010085113A2 WO2010085113A2 (ko) 2010-07-29
WO2010085113A3 true WO2010085113A3 (ko) 2010-11-04

Family

ID=42356341

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/000422 WO2010085113A2 (ko) 2009-01-23 2010-01-22 신규 연성 금속박 적층판 및 그 제조방법

Country Status (5)

Country Link
US (1) US20120018197A1 (ko)
JP (1) JP5814127B2 (ko)
KR (1) KR101102180B1 (ko)
CN (1) CN102361753A (ko)
WO (1) WO2010085113A2 (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101064816B1 (ko) * 2009-04-03 2011-09-14 주식회사 두산 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판
KR101237410B1 (ko) 2011-05-24 2013-02-27 송민화 에프씨씨엘 및 이의 제조방법과 상기 에프씨씨엘을 이용한 안테나
CN102630126B (zh) * 2012-04-01 2014-04-16 松扬电子材料(昆山)有限公司 复合式双面铜箔基板及其制造方法
CN102825861B (zh) * 2012-08-16 2015-07-22 新高电子材料（中山）有限公司 导热双面挠性覆铜板及其制作方法
CN103514988B (zh) * 2012-12-14 2016-01-20 上海空间电源研究所 一种扁平式双层功率信号传输电缆及其形成方法
KR101579645B1 (ko) * 2013-04-10 2015-12-22 코오롱인더스트리 주식회사 폴리이미드 커버기판
US20150122532A1 (en) * 2013-11-04 2015-05-07 Teledyne Technologies Incorporated High temperature multilayer flexible printed wiring board
KR101582398B1 (ko) * 2014-01-06 2016-01-05 주식회사 두산 수지 이중층 부착 동박, 이를 포함하는 다층 인쇄 회로 기판 및 그 제조 방법
CN103963386B (zh) * 2014-03-05 2016-05-11 金安国纪科技股份有限公司 金属基覆铜板及其制备方法
CN103963381B (zh) * 2014-03-05 2016-02-17 金安国纪科技股份有限公司 金属基覆铜板及其制备方法
KR102056500B1 (ko) * 2014-10-24 2019-12-16 주식회사 두산 커버레이용 금속박 적층체 및 커버레이 비포함 다층 연성 인쇄회로기판
KR101705078B1 (ko) 2015-02-09 2017-02-10 도레이첨단소재 주식회사 양면 금속적층 필름의 제조방법 및 그로부터 제조되는 양면 금속적층 필름
TWI585245B (zh) * 2015-04-09 2017-06-01 柏彌蘭金屬化研究股份有限公司 單面薄型金屬基板之製造方法
TWI564145B (zh) * 2015-06-17 2017-01-01 長興材料工業股份有限公司 金屬被覆積層板及其製造方法
KR101890036B1 (ko) * 2016-11-21 2018-08-22 에스디플렉스(주) 4층 구조의 연성 동박적층판의 제조 방법
US11021606B2 (en) * 2017-09-13 2021-06-01 E I Du Pont De Nemours And Company Multilayer film for electronic circuitry applications
JP7446741B2 (ja) * 2018-09-28 2024-03-11 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板
KR102329838B1 (ko) * 2019-04-30 2021-11-22 도레이첨단소재 주식회사 연성 금속박 적층 필름, 이를 포함하는 물품 및 상기 연성 금속박 적층 필름의 제조방법
WO2021040289A1 (ko) * 2019-08-27 2021-03-04 주식회사 두산 연성 금속 적층판, 커버레이 필름, 이를 구비하는 연성 금속복합기판

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010105375A (ko) * 1999-03-12 2001-11-28 센타니 마이클 에이. 다중-층 인쇄 회로를 위한 적층
KR20010110698A (ko) * 1999-03-26 2001-12-13 센타니 마이클 에이. 다층 적층 및 이를 생성하는 방법
JP2005162878A (ja) * 2003-12-02 2005-06-23 Toyobo Co Ltd ポリイミドフィルム、その製造方法およびそれを用いたベース基板
JP2008130784A (ja) * 2006-11-21 2008-06-05 Toyobo Co Ltd 多層回路基板

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3717543A (en) * 1971-01-13 1973-02-20 Rexham Corp Laminations of polyimide films to like films and/or to metal foils
US4975484A (en) * 1985-05-10 1990-12-04 E. I. Du Pont De Nemours And Company Acrylic copolymer composition and adhesive coatings therefrom
US4626474A (en) * 1985-06-21 1986-12-02 Stauffer Chemical Company Polyimide film/metal foil lamination
JPS62179583A (ja) * 1986-01-31 1987-08-06 Japan Synthetic Rubber Co Ltd 接着性組成物
JPH01166944A (ja) * 1987-12-24 1989-06-30 Hitachi Chem Co Ltd 両面フレキシブル金属張積層板の製造方法
JPH02301186A (ja) * 1989-05-15 1990-12-13 Nitsukan Kogyo Kk フレキシブル印刷配線基板およびカバーレイフィルム
JPH03133634A (ja) * 1989-10-19 1991-06-06 Toyobo Co Ltd 耐熱性積層体およびその製法
US5103293A (en) * 1990-12-07 1992-04-07 International Business Machines Corporation Electronic circuit packages with tear resistant organic cores
JP3994696B2 (ja) * 2000-10-02 2007-10-24 宇部興産株式会社 線膨張係数を制御したポリイミドフィルム及び積層体
US6794031B2 (en) * 2001-09-28 2004-09-21 Ube Industries, Ltd. Cover-lay film and printed circuit board having the same
JP4543314B2 (ja) * 2003-09-01 2010-09-15 東洋紡績株式会社 ポリアミドイミド樹脂、樹脂組成物及びそれを用いた金属張積層体
JP4947976B2 (ja) * 2003-09-10 2012-06-06 ユニチカ株式会社 フレキシブルプリント配線板用基板及びその製造方法
JP4672505B2 (ja) * 2005-04-13 2011-04-20 信越化学工業株式会社 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板
TWI298334B (en) * 2005-07-05 2008-07-01 Chang Chun Plastics Co Ltd Polyamic acid resin composition modified with laminate nanometer silica sheet and polyimide prepared therefrom
JP4987374B2 (ja) * 2006-07-19 2012-07-25 株式会社有沢製作所 接着シート用樹脂組成物、並びに該組成物を用いたフレキシブルプリント配線板用接着シート
JP2008030329A (ja) * 2006-07-28 2008-02-14 Kitano:Kk 金属箔張積層板の製造方法及びそれにより得られる金属箔張積層板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010105375A (ko) * 1999-03-12 2001-11-28 센타니 마이클 에이. 다중-층 인쇄 회로를 위한 적층
KR20010110698A (ko) * 1999-03-26 2001-12-13 센타니 마이클 에이. 다층 적층 및 이를 생성하는 방법
JP2005162878A (ja) * 2003-12-02 2005-06-23 Toyobo Co Ltd ポリイミドフィルム、その製造方法およびそれを用いたベース基板
JP2008130784A (ja) * 2006-11-21 2008-06-05 Toyobo Co Ltd 多層回路基板

Also Published As

Publication number Publication date
JP2012515671A (ja) 2012-07-12
CN102361753A (zh) 2012-02-22
KR20100086786A (ko) 2010-08-02
JP5814127B2 (ja) 2015-11-17
KR101102180B1 (ko) 2012-01-02
US20120018197A1 (en) 2012-01-26
WO2010085113A2 (ko) 2010-07-29

Similar Documents

Publication Publication Date Title
WO2010085113A3 (ko) 신규 연성 금속박 적층판 및 그 제조방법
MY163173A (en) Manufacturing method of multilayer printed wiring board
JP2014175425A5 (ko)
EP2412519A4 (en) FILM WITH METAL LAYER USED THEREFOR FOR ELECTRONIC COMPONENTS, METHOD FOR THE PRODUCTION THEREOF AND APPLICATIONS THEREOF
GB201112376D0 (en) Boding of metal components
JP2013008880A5 (ko)
EP2716793A4 (en) PRIMING LAYER FOR A PLATING METHOD, COATING FOR A PCB AND METHOD OF MANUFACTURING THEREOF, AND MULTILAYER CONDUCTOR PLATE AND METHOD OF MANUFACTURING THEREOF
MY157604A (en) Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board
JP2014110390A5 (ko)
WO2012087058A3 (en) Printed circuit board and method for manufacturing the same
WO2012085286A3 (en) A photovoltaic element
WO2012087059A3 (en) Printed circuit board and method for manufacturing the same
TW200601924A (en) Un-symmetric circuit board and method for fabricating the same
TW200709751A (en) Polyimide copper foil laminate and method of producing the same
WO2008117711A1 (ja) 金属張り積層板と多層積層板並びにその製造方法
CN104701443A (zh) 一种适用于简单线路cob封装形式的led基板及制备方法
WO2014167344A3 (en) Improvements relating to business cards
JP2013111980A5 (ko)
WO2014134650A3 (en) The invention relates to a method for producing a printed circuit board with multilayer sub-areas in sections
WO2012060657A3 (ko) 신규 인쇄회로기판 및 이의 제조방법
WO2014053574A3 (fr) Electrode transparente et procede de fabrication associe
WO2014026675A3 (de) Verfahren zur herstellung von hohlkörpern, insbesondere von kühlern, und hohlkörper bzw. kühler enthaltende elektrische oder elektronische baugruppen
WO2009034834A1 (ja) セラミック多層基板及びその製造方法
FI20115863A (fi) Komposiittilevy, menetelmä sen valmistamiseksi sekä komposiittilevy-yhdistelmä
WO2012150777A3 (en) The printed circuit board and the method for manufacturing the same

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080012868.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10733666

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2011547782

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 13145959

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 10733666

Country of ref document: EP

Kind code of ref document: A2