WO2010073640A1

WO2010073640A1 - Cleaving device and cleaving method for manufacturing electronic components

Info

Publication number: WO2010073640A1
Application number: PCT/JP2009/007148
Authority: WO
Inventors: 日比貴昭; 北川康之; 岡本純
Original assignee: Ｔｏｗａ株式会社
Priority date: 2008-12-26
Filing date: 2009-12-22
Publication date: 2010-07-01
Also published as: TW201024011A; JP2010149165A; CN102256739A; JP5261168B2; SG172318A1; KR20110110238A

Abstract

The issue is to control the adhesion of dross and the occurrence of cracking and chipping of ceramic substrates when cleaving a sealed substrate containing a ceramic substrate or metal substrate with a laser. Disclosed is a cleaving method used when manufacturing multiple electronic components by forming a sealed substrate (1) by sealing chips (3) that have been variously mounted on multiple areas (7) disposed on a circuit board (2) in resin, and then cleaving the sealed substrate (1) along the boundary lines (6) of the multiple areas (7), which cleaving method comprises a step, in which the sealed substrate (1) is affixed to a table (9), and an irradiation step, in which first and second laser lights (12, 18) are irradiated from an irradiation head (10) toward the sealed substrate (1), while the irradiation head (10) and/or sealed substrate (1) are moved relative to one another. In the irradiation step, after perforation holes (17) are formed on the boundary lines (6) by irradiating the first laser light (12), the sealed substrate (1) is cleaved by irradiating the second laser light (18) onto the boundary lines (6).

Description

Cutting apparatus and method for manufacturing electronic parts

The present invention relates to a cutting apparatus and a cutting method for manufacturing an electronic component used when a plurality of electronic components are manufactured by cutting a sealed substrate having a plurality of regions for each region.

The following method is one of the methods conventionally used for the purpose of efficiently producing a plurality of electronic components. That is, a plurality of chip capacitors, LED chips, semiconductor chips, etc. (hereinafter referred to as “chips”) mounted on a circuit board are collectively sealed with a resin to form a sealed substrate. In this method, a plurality of electronic components are manufactured by cutting into individual pieces (see, for example, Patent Document 1). According to Patent Document 1, a dicing saw can be used when cutting a sealed substrate, or it can be cut with a laser. An individual electronic component obtained by dividing a sealed substrate is often called a package.

By the way, according to Patent Document 1, a glass epoxy substrate can be used as a circuit board, and an epoxy resin, a phenol resin, or a silicone resin can be used as a sealing resin used for resin sealing. From this, it can be said that the circuit board and the sealing resin are made of the same material, that is, a resin material. Therefore, no major problem has occurred when using either a dicing saw using a rotary blade or a laser.

In recent years, as a circuit board, in addition to a resin substrate typified by a glass epoxy substrate, a substrate made of ceramic (hereinafter referred to as “ceramic substrate”) and a substrate made of metal (hereinafter referred to as “metal substrate”). Began to be used. Ceramic substrates and metal substrates have excellent heat dissipation characteristics, and are used for optoelectronic components such as LEDs and semiconductor lasers, power semiconductor elements, and the like.

However, the base material of the ceramic substrate and the metal substrate has different properties from the sealing resin. As a result, when a sealed substrate having a ceramic substrate or a metal substrate is cut at a virtual cutting line using a laser, the following problem occurs.

The first problem is that the dross formed by melting the material constituting the circuit board is likely to adhere to the package, resulting in a decrease in yield in terms of appearance quality. The second problem is a problem when a ceramic substrate is used as a circuit board. This is a problem that internal stress is generated by thermal shock applied to the ceramic substrate, and cracking or chipping of the ceramic substrate due to the internal stress occurs particularly at the end of cutting at one cutting line. is there.

JP 09-036151 (page 3, FIG. 2)

The problem to be solved by the present invention is that dross adheres to a sealed substrate when a sealed substrate including a circuit board made of a ceramic substrate or a metal substrate is cut by a laser, and internal stress It is to prevent the ceramic substrate from cracking or chipping.

Numerals / symbols in parentheses in the following description indicate reference numerals in the drawings, and are described for the purpose of facilitating the comparison of the terms in the description and the components shown in the drawings. Further, these numbers do not mean “interpreting the terms in the description limited to the components shown in the drawings”.

In order to solve the above-described problems, a cutting apparatus for manufacturing an electronic component according to the present invention includes resin-sealing chips (3) mounted in a plurality of regions (7) provided on a circuit board (2). Used to manufacture a plurality of electronic components by forming a sealed substrate (1) and cutting the sealed substrate (1) at the boundary line (6) of the plurality of regions (7). The fixing means (8) for fixing the sealed substrate (1), the laser light generating means (11) for generating the laser light (12, 18), the sealed substrate (1) and / or the laser light ( 12, 18) a cutting device for manufacturing an electronic component comprising a moving means (9) for moving relative to each other,
The first laser beam (12) for the laser beam generating means (11) to form the perforated holes (17, 19) at the boundary line (6) and the perforated holes (17, 19) The second laser beam (18) for cutting the sealed substrate (1) is generated at the formed boundary line (6).

In one embodiment, the cutting device for manufacturing an electronic component according to the present invention is such that the first laser beam (12) is pulsed and the second laser beam (18) is continuous. It is characteristic.

Also, the cutting device for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the laser light generating means (11) includes a fiber laser oscillator or a YAG laser oscillator.

Moreover, the cutting device for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the perforated holes (17, 19) are through holes (17).

Moreover, the cutting device for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the perforated holes (17, 19) are blind holes (19).

Also, the cutting device for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the base material of the circuit board (2) is ceramic or metal.

Moreover, the cutting device for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the electronic component is an optoelectronic component or a power semiconductor component.

Moreover, the cutting method for manufacturing an electronic component according to the present invention provides a sealed substrate by resin-sealing the chip (3) mounted on each of the plurality of regions (7) provided on the circuit board (2). Formed (1) and used in manufacturing a plurality of electronic components by cutting the sealed substrate (1) along the boundary line (6) of the plurality of regions (7), and the sealed substrate The step (1) is fixed, and the sealed substrate (1) and / or the laser beam (12, 18) are made relative to each other while irradiating the laser beam (12, 18) toward the sealed substrate (1). A cutting method for manufacturing an electronic component comprising an irradiation step of automatically moving,
In the irradiation step, a perforated hole (17, 19) is formed in the boundary line (6) by irradiating the first laser beam (12) toward the sealed substrate (1), and then the boundary The sealed substrate (1) is cut by irradiating the second laser beam (18) toward the line (6).

In one embodiment, the cutting method for manufacturing an electronic component according to the present invention is such that the first laser beam (12) is pulsed and the second laser beam (18) is continuous. It is characteristic.

In one embodiment, the cutting method for manufacturing an electronic component according to the present invention includes, in the above-described irradiation step, a first laser beam (12) and a second laser beam (18) by a fiber laser oscillator or a YAG laser oscillator. ).

Also, the cutting method for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the perforated holes (17, 19) are through holes (17).

Further, the cutting method for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the perforated holes (17, 19) are blind holes (19).

Moreover, the cutting method for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the base material of the circuit board (2) is ceramic or metal.

Moreover, the cutting method for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the electronic component is an optoelectronic component or a power semiconductor component.

According to the present invention, after forming the perforated holes (17, 19) using the first laser light at the boundary line (6) of the sealed substrate (1), the second laser light is formed. Is used to cut (full cut) the sealed substrate (1). At this time, the sum of the volume of the part removed when forming the perforated holes (17, 19) and the volume of the part removed by the subsequent cutting (full cut) is one time as in the conventional case. It is equal to the volume of the part to be removed when the sealed substrate (1) is cut at a stroke (full cut) by laser light irradiation. In other words, the volume of each part removed from the sealed substrate (1) by each of the two irradiations in the present invention is the same as that when the sealed substrate (1) is cut by the conventional one irradiation. All are small compared with the volume of the part removed from the sealed substrate (1). As described above, in the present invention, since the volume of the portion removed by the laser irradiation per time is small, the amount of dross generated by each irradiation is small. In particular, the amount of dross generated when the second laser beam is irradiated is small. By being small, the amount of dross that finally adheres to the cut portion is small. If the amount of dross generated by each laser irradiation is small, the dross can be easily removed by gas injection or the like during laser irradiation. Therefore, adhesion of dross to the sealed substrate 1 when cutting the sealed substrate (1) is suppressed, and a good cutting quality at the cut surface is obtained.

Further, according to the present invention, when the sealed substrate (1) includes a ceramic substrate, the sealed substrate in which the perforated holes (17, 19) are formed using the first laser beam. (1) is cut using the second laser beam. By forming perforated holes (17, 19) in advance at the location to be cut in this way, the cutting can be completed in a relatively short time during cutting. Further, the surface area near the cut portion is large due to the perforated holes (17, 19), and heat generated by laser irradiation is easily released. As a result, heat hardly accumulates in the vicinity of the perforated holes (17, 19), and thermal stress generated by irradiation with the second laser light is relieved. This reduces the stress that the sealed substrate (1) receives in the vicinity of the perforated holes (17, 19), particularly the stress that the ceramic substrate receives. Therefore, the generation of cracks and chipping of the ceramic substrate due to internal stress is suppressed.

FIG. 1 is a cross-sectional view illustrating a state in which the cutting device for manufacturing an electronic component according to the first embodiment forms a perforated hole in a sealed substrate. 2 (1) shows a state in which the cutting device for manufacturing electronic components according to the first embodiment forms through holes, which are perforated holes, in the sealed substrate, and FIG. 2 (2) shows a perforated shape. FIG. 2C is a cross-sectional view showing a state in which the sealed substrate is cut, and FIG. FIG. 3 (1) shows a state in which the cutting device for manufacturing an electronic component according to the second embodiment forms a blind hole which is a perforated hole in the sealed substrate, and FIG. 3 (2) shows a perforated shape. FIG. 3C is a cross-sectional view showing a state where the sealed substrate is cut, and FIG. 4 (1) shows a state in which the cutting apparatus for manufacturing an electronic component according to Example 3 forms a groove in the sealing resin, and FIG. 4 (2) shows a perforated through hole formed in the circuit board. FIG. 4 (3) is a cross-sectional view showing a state where the cutting device is cutting the sealed substrate.

In the cutting method for manufacturing an electronic component according to the present invention, the sealed substrate (1) is formed by resin-sealing the chip (3) mounted on each of the plurality of regions (7) provided on the circuit board (2). A cutting method used in manufacturing a plurality of electronic components by cutting the sealed substrate (1) along the boundary line (6) of the plurality of regions (7), The step of fixing the sealed substrate (1) to the table (9) and the first laser beam (12) or the second laser beam (18) from the irradiation head (10) toward the sealed substrate (1). ), And an irradiation step of moving the irradiation head (10) and / or the sealed substrate (1) relative to each other. In the irradiation step, a perforated hole (17) is formed in the boundary line (6) by irradiating the first laser light (12), and then the second laser light ( 18), the sealed substrate (1) is cut.

Embodiment 1 of a cutting apparatus for manufacturing an electronic component according to the present invention will be described with reference to FIG. FIG. 1 is a schematic cross-sectional view showing a state in which a cutting device for manufacturing an electronic component according to the present embodiment forms a perforated hole in a sealed substrate. The cutting device shown in FIG. 1 is a cutting device that separates a sealed substrate 1 into a plurality of electronic components. In addition, in order to make it easy to understand, any figure included in this application document is schematically omitted or exaggerated as appropriate. Here, the “perforated hole” means a hole provided at a predetermined interval and includes both a through hole and a blind hole.

As shown in FIG. 1, the sealed substrate 1 is formed so as to cover the circuit board 2, the plurality of chips 3 mounted on the circuit board 2, and the plurality of chips 3 together. And a sealing resin 4. In FIG. 1, a ceramic substrate or a metal substrate is used as the circuit board 2, a translucent silicone resin is used as the sealing resin 4, and an LED chip is used as the chip 3. Therefore, it can be said that the sealed substrate 1 is a composite material composed of a ceramic substrate or a metal substrate and plastic. The metal substrate includes a metal core substrate, a metal base substrate, and a hollow substrate.

The sealing resin 4 has lens portions 5 corresponding to the chips 3 respectively. The sealed substrate 1 is divided into a plurality of regions 7 by lattice-like boundary lines 6. Thus, each boundary line 6 is composed of line segments. Therefore, the shape of each region 7 is a rectangle (including a square). FIG. 1 shows an example in which one chip 3 is attached to each of a plurality of regions 7.

FIG. 1 shows an example in which the lens unit 5 constitutes a convex lens, and the lens unit 5 and the chip 3 correspond one-to-one. Not only this but the lens part 5 should just have the function to converge light, the function to make parallel light, or the function to diffuse. The lens unit 5 may have a plurality of lenses, and may be a Fresnel lens or the like.

The sealed substrate 1 is fixed to the table 9 via an adhesive tape 8. The table 9 is provided so as to be movable in the X direction, the Y direction, and the Z direction shown in the drawing and to be rotatable in the θ direction. An irradiation head 10 is disposed above the sealed substrate 1. A laser oscillator 11 is optically connected to the irradiation head 10. The irradiation head 10 irradiates the laser beam generated by the laser oscillator 11 toward the sealed substrate 1 as the first laser beam 12. The irradiation head 10 can also irradiate the laser beam generated by the laser oscillator 11 toward the sealed substrate 1 as a second laser beam (described later). Here, the laser oscillator 11 can generate the first laser beam 12 and the second laser beam. The first laser beam 12 is pulsed, and the second laser beam is continuous.

The irradiation head 10 is provided with a pipe 13, and the assist gas 14 is supplied into the irradiation head 10 through the pipe 13. A nozzle 15 is provided below the irradiation head 10. The first laser beam 12 is irradiated from the opening of the nozzle 15 toward the irradiated portion 16 of the sealed substrate 1 and the assist gas 14 is injected.

Hereinafter, the operation of the cutting apparatus for manufacturing an electronic component according to the present embodiment will be described with reference to FIG. 1 and FIG. 2 (1) shows a state in which the cutting device for manufacturing an electronic component according to the present embodiment forms a perforated through hole in the sealed substrate, and FIG. 2 (2) shows a perforated through hole. FIG. 2C is a cross-sectional view showing a state where the sealed substrate is cut, and FIG.

First, as shown in FIGS. 1 and 2 (1), the table 9 is applied to the irradiation head 10 while irradiating the pulsed first laser beam 12 toward the boundary line 6 of the sealed substrate 1. Is moved in the + X direction in the figure. In addition, the first laser beam 12 is irradiated toward the boundary line 6 of the sealed substrate 1 and the assist gas 14 is injected. By injecting the assist gas 14, the generated dross can be blown off and removed. The irradiation condition of the first laser beam 12 is set in advance so that a through hole can be formed in the sealed substrate 1 that is a composite material. Thereby, as shown in FIG. 2 (2), a perforated hole 17 consisting of a through hole can be formed in one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1. it can.

Next, perforated holes 17 made of through holes are formed in all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1. As a result, perforated holes 17 including through holes are formed in all the boundary lines 6 along the X direction among the boundary lines 6.

Next, a perforated hole 17 made of a through hole is opened at the boundary line 6 along the Y direction among the lattice-like boundary lines 6. Specifically, the table 9 is moved in the + Y (or -Y) direction of the drawing with respect to the irradiation head 10 while irradiating the first laser beam 12 toward one boundary line 6 along the Y direction. . Subsequently, perforated holes 17 including through holes are formed in all the remaining boundary lines 6 along the Y direction among the boundary lines 6 of the sealed substrate 1. Through the steps so far, the perforated holes 17 including the through holes are formed in all the boundary lines 6 of the sealed substrate 1.

Next, as shown in FIG. 2 (3), the table 9 is placed on the irradiation head 10 while irradiating the continuous second laser beam 18 toward the boundary line 6 of the sealed substrate 1. Move in + X direction. Further, the second laser beam 18 is irradiated toward the boundary line 6 of the sealed substrate 1 and the assist gas 14 (see FIG. 1) is injected. The irradiation condition of the second laser beam 18 is set in advance so that the sealed substrate 1 in which the perforated hole 17 including the through hole is formed can be completely cut. Thereby, the sealed substrate 1 can be completely cut (full cut) at one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1.

Next, the sealed substrate 1 is completely cut at all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1.

Next, the sealed substrate 1 is completely cut at all the boundary lines 6 along the Y direction among the lattice-shaped boundary lines 6. Specifically, the table 9 is moved in the + Y (or -Y) direction of the figure with respect to the irradiation head 10 while irradiating the second laser beam 18 toward one boundary line 6 along the Y direction. . Subsequently, the sealed substrate 1 is cut at all the remaining boundary lines 6 along the Y direction among the boundary lines 6 of the sealed substrate 1. Through the steps so far, the sealed substrate 1 can be cut at all the boundary lines 6. Therefore, the sealed substrate 1 is separated into a plurality of packages respectively corresponding to the plurality of regions 7.

According to this embodiment, the following effects can be obtained. The first effect is that the occurrence of dross is suppressed when the sealed substrate 1 is cut. In this embodiment, the volume of each part removed from the sealed substrate 1 by each of the two irradiations is removed from the sealed substrate when the sealed substrate is cut by one irradiation. Both are small compared with the volume of the part to be. Thereby, the melted portion of the sealed substrate 1 by each of the two irradiations is easily removed by the assist gas. Therefore, adhesion of dross to the sealed substrate 1 when cutting the sealed substrate 1 is suppressed.

The second effect is that a good cutting quality at the cut surface can be obtained. As described above, the melted portion of the sealed substrate 1 by each of the two irradiations is easily removed by the assist gas. Therefore, a good cutting quality can be obtained at the cut surface of the manufactured electronic component.

The third effect is that when a ceramic substrate is used as the circuit board 2, the occurrence of cracking and chipping of the ceramic substrate due to internal stress is suppressed. In this embodiment, the sealed substrate 1 in which the perforated holes 17 are formed using a pulsed laser is cut using a continuous laser. Thus, thermal stress generated by continuous laser irradiation in the vicinity of the perforated hole 17 is alleviated. As a result, the stress received by the sealed substrate 1 in the vicinity of the perforated hole 17, particularly the stress received by the circuit board 2 made of a ceramic substrate, is reduced. Therefore, the occurrence of cracking and chipping of the circuit board 2 due to internal stress is suppressed.

In this embodiment, the diameter of the perforated holes 17 and the interval between the hole centers (inter-center pitch) are determined by the irradiation condition of the first laser beam 12. The irradiation conditions include, for example, the type of laser, energy, frequency, duty ratio, irradiation diameter, moving speed of the table 9, the type and pressure of the assist gas 14. Further, the diameter of the perforated holes 17 and the distance between the hole centers can completely cut the sealed substrate 1 on which the perforated holes 17 are formed by the irradiation of the second laser light 18. As such, it is set in advance. Further, in this embodiment, by appropriately setting the diameter of the perforated holes 17 and the distance between the hole centers according to the material, thickness and the like of the sealing resin 4 and the circuit board 2, various specifications can be obtained. Applicable to the circuit board 2.

In the present invention, a YAG laser (for example, wavelength 1064 nm), a fiber laser (for example, wavelength 1070 nm) or the like is used to irradiate the first laser beam 12. Also, the energy is 200 W for the pulsed laser light irradiation condition, the moving speed of the table 9 is 300 mm / sec, the energy is 300 W for the continuous laser light irradiation condition, and the moving speed of the table 9 is 150 mm / sec. . Energy (continuous laser light energy)> (pulsed laser light energy), and table 9 moving speed (moving speed with continuous laser light) <(moving with pulsed laser light) By setting the speed), a good cross-sectional quality can be obtained at the cut portion.

Embodiment 2 of a cutting apparatus for manufacturing electronic parts according to the present invention will be described with reference to FIG. 3 (1) shows a state in which the cutting apparatus for manufacturing electronic components according to this embodiment forms a perforated blind hole in the sealed substrate, and FIG. 3 (2) shows a perforated blind hole. FIG. 3C is a cross-sectional view showing a state where the sealed substrate is cut, and FIG.

In this embodiment, first, as shown in FIG. 3A, the irradiation head 10 is irradiated while irradiating the pulsed first laser light 12 toward the boundary line 6 of the sealed substrate 1. The table 9 is moved in the + X direction in the figure. The irradiation condition of the first laser beam 12 is set in advance so that a blind hole can be formed in the sealed substrate 1 that is a composite material. As a result, as shown in FIG. 3B, a perforated hole 19 made of a blind hole is formed in one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1. Can do.

Next, perforated holes 19 made of blind holes are formed in all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1. As a result, perforated holes 19 formed of blind holes are formed in all of the boundary lines 6 along the X direction.

Next, perforated holes 19 made of blind holes are formed in all the boundary lines 6 along the Y direction among the lattice-shaped boundary lines 6.

Next, as shown in FIG. 3 (3), the table 9 is moved to the irradiation head 10 while irradiating the continuous second laser beam 18 toward the boundary line 6 of the sealed substrate 1. Move in + X direction. Thereby, the sealed substrate 1 can be completely cut (full cut) at one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1.

Next, the sealed substrate 1 is completely cut at all the boundary lines 6 along the Y direction among the lattice-shaped boundary lines 6. Through the steps so far, the sealed substrate 1 can be cut at all the boundary lines 6. Therefore, the sealed substrate 1 is separated into a plurality of packages respectively corresponding to the plurality of regions 7.

A feature of the present embodiment is that a perforated hole 19 formed of a blind hole is formed by irradiating the pulsed first laser light 12 toward the boundary line 6 of the sealed substrate 1. . These perforated holes 19 have an opening on the sealing resin 4 side and an inner bottom surface in the circuit board 2. In other words, the perforated hole 19 is formed from the sealing resin 4 side to the middle of the circuit board 2 in the thickness direction of the sealed substrate 1. As in the first embodiment, the diameter and depth of the perforated holes 19 and the distance between the hole centers (inter-center pitch) are determined by the irradiation condition of the first laser beam 12. . The diameter and depth of the perforated holes 19 and the distance between the hole centers are such that the sealed substrate 1 on which the perforated holes 19 are formed is completely cut by irradiation with the second laser light 18. It is set in advance so that it can be performed.

According to the present embodiment, the same effect as in the first embodiment can be obtained. In addition, according to the present embodiment, the diameter and depth of the perforated holes 19 and the interval between the hole centers are appropriately set according to the material and thickness of the sealing resin 4 and the circuit board 2. It becomes applicable to the circuit board 2 of various specifications.

Embodiment 3 of a cutting apparatus for manufacturing electronic parts according to the present invention will be described with reference to FIG. 4 (1) shows a state in which the cutting device for manufacturing electronic components according to this embodiment forms a groove in the sealing resin of the sealed substrate, and FIG. 4 (2) shows a perforated through hole. FIG. 4 (3) is a cross-sectional view showing a state where the circuit board is formed, and FIG. 4 (3) is a state where the cutting device is cutting the sealed substrate.

In the present embodiment, first, as shown in FIG. 4A, a groove is formed in the sealing resin 4 of the sealed substrate using the rotary blade 20. FIG. 4 (1) shows a state in which a groove (not shown) is formed on the left side of the rotary blade 20 by moving the table 9 in the −X direction (left direction). In FIG. 4, the rotary blade 20 is shown small for easy understanding.

Next, as shown in FIG. 4 (2), the first laser beam 12 is irradiated to the circuit board 2 at one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1. As a result, a perforated hole 21 made of a through hole is formed in the circuit board 2. Subsequently, perforated holes 21 made of through holes are formed in the circuit board 2 at all the boundary lines 6 of the sealed substrate 1.

Next, as shown in FIG. 4 (3), the irradiation head 10 (FIG. 1) is irradiated while irradiating the continuous second laser light 18 toward the circuit board 2 at the boundary line 6 of the sealed substrate 1. The table 9 is moved in the + X direction in the figure. Thereby, the sealed substrate 1 can be completely cut (full cut) at one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1. Thereafter, the sealed substrate 1 is completely cut at all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1. Subsequently, the sealed substrate 1 is completely cut at all the boundary lines 6 along the Y direction among the boundary lines 6 of the sealed substrate 1.

According to the present embodiment, the same effects as those of the first and second embodiments can be obtained. Further, according to the present embodiment, a rotary blade suitable for this is used for cutting the sealing resin 4, and a type of laser and irradiation conditions suitable for this are used for cutting the circuit board 2. it can. Therefore, the efficiency of the process of cutting the sealed substrate 1 is improved.

In this embodiment, both the rotary blade 20 and the laser oscillator 11 (see FIG. 1) for irradiating the first laser beam 12 and the second laser beam 18 are provided in one cutting device. An example was explained. Not limited to this, after a groove is formed in the sealing resin 4 of the sealed substrate 1 using a cutting device having the rotary blade 20, the sealing device having the laser oscillator 11 (see FIG. 1) is sealed. The substrate 1 may be transported.

In this embodiment, the groove may be formed in the sealing resin 4 of the sealed substrate 1 by using laser light instead of the rotary blade 20. In this case, it is preferable to use laser light that is easily absorbed by the sealing resin 4, for example, laser light from a CO ₂ laser oscillator.

Further, the groove provided in the sealing resin 4 in this embodiment may be formed in the resin sealing step. In this case, grooves can be formed in the sealing resin 4 by providing thin plate-like protrusions in a lattice shape in the cavity of the mold for resin sealing.

Further, in the groove provided in the sealing resin 4 in this embodiment, the surface of the circuit board 2 may be exposed without the resin 4 being present at all. Further, the sealing resin 4 may be present at the bottom of the groove. In the present embodiment, it is sufficient that the thickness of the sealing resin 4 is reduced at the boundary line 6.

In each of the embodiments described so far, the

perforated holes

17 and 19 are formed in all the boundary lines 6 along the X direction, and then the perforated holes 17 are formed in all the boundary lines 6 along the Y direction. , 19 was formed. Then, after sealing the sealed substrate 1 at all the boundary lines 6 along the X direction, the sealed substrate 1 was cut at all the boundary lines 6 along the Y direction.

In the present invention, after the sealed substrate 1 is cut into large blocks, each block may be cut into a plurality of regions 7 units. Specifically, first, perforated holes 17 are formed in all the boundary lines 6 of the sealed substrate 1. Next, the sealed substrate 1 is cut at the boundary line 6 near the center line in the X direction and the Y direction of the sealed substrate 1. Thereby, the sealed substrate 1 is equally divided into four blocks. Next, each of the four blocks is cut into a plurality of area 7 units. According to this method, when the deformation (warping, waviness, deflection, etc.) in the sealed substrate 1 is large, the perforated holes 17 are formed in all the boundary lines 6, thereby causing the deformation. Stress is reduced. Therefore, it is possible to suppress adverse effects caused by the deformation when the sealed substrate 1 is cut.

Also, the following may be used. First, perforated holes 17 are formed in the boundary line 6 near the center line in the X direction and the Y direction of the sealed substrate 1. Next, the sealed substrate 1 is cut at the boundary line 6. Thereby, the sealed substrate 1 is equally divided into four blocks. Next, perforated holes 17 are formed in all the boundary lines 6 for each of the four blocks. Next, the sealed substrate 1 is cut along all the boundary lines 6 for each of the four blocks. Also by this method, when the sealed substrate 1 is cut, adverse effects caused by deformation such as warpage, undulation, and bending can be suppressed.

Further, in each of the examples so far, the sealed substrate 1 having the LED chip as the chip 3 and the translucent silicone resin as the sealing resin 4 has been described. Not limited to this, a laser diode chip can be used as the chip 3. Further, by using a power semiconductor chip as the chip 3 and an epoxy resin or the like as the sealing resin 4, the present invention can be applied when manufacturing a power semiconductor component.

In addition, a plurality of chips 3 may be mounted in one area 7. For example, one area 7 to which a plurality of LED chips are attached can function as a surface light source by being separated into pieces. Further, the plurality of chips 3 attached to one region 7 may not have the same function. For example, when the light emitting element and the light receiving element are mounted on one area 7, the one area 7 can be functioned as an optical sensor by being separated into pieces.

In each of the embodiments so far, the table 9 is applied to the irradiation head 10 while irradiating the first laser beam 12 or the second laser beam 18 toward the boundary 6 of the sealed substrate 1. It was decided to move in the X direction or the Y direction. Not limited to this, the irradiation head 10 may be moved in the X direction or the Y direction in the figure with respect to the table 9. Further, both the table 9 and the irradiation head 10 may be moved in the X direction or the Y direction in the figure. In short, the table 9 and the irradiation head 10 may be moved relative to each other in the X or Y direction in the figure.

In addition to this, for example, by changing the irradiation angle of the first laser beam 12 and the second laser beam 18 irradiated from the irradiation head 10 to the sealed substrate 1, The irradiation position may be moved, and thereby the laser beam and the sealed substrate 1 may be moved relative to each other. At this time, the sealed substrate 1 and the irradiation head 10 need not be moved, but may be moved relative to each other in the same manner as described above.

Further, in each of the embodiments so far, the case where the boundary line 6 is constituted by line segments has been described. The present invention is not limited to this, and the present invention is applied to a case where the boundary line 6 includes a curved line or a broken line in which a plurality of line segments are combined. Therefore, the present invention is also applied to the case where a package (for example, a certain type of memory card) in which a sealed substrate is cut to include a curved line or a broken line in a part of the outer shape is manufactured. In this case, the

perforated holes

17 and 19 are formed side by side in a curved line or a polygonal line.

Further, in each of the examples so far, the sealed substrate 1 is fixed to the table 9 via the adhesive tape 8. Not limited to this, the sealed substrate 1 may be fixed to the table 9 by suction. In this case, it is preferable to provide a groove in a portion that overlaps each boundary line 6 on the surface of the table 9. As a result, dross generated in both the process of forming the

perforated holes

17 and 19 in the sealed substrate 1 and the process of completely cutting the sealed substrate 1 (particularly the latter process) It becomes easy to be removed through the groove.

In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.

DESCRIPTION OF SYMBOLS 1 Sealed board | substrate 2 Circuit board 3 Chip | tip 4 Sealing resin 5 Lens part 6 Boundary line 7 Area 8 Adhesive tape (fixing means)
9 Table (moving means)
10 Irradiation Head 11 Laser Oscillator (Laser Light Generation Means)
12 First laser beam (laser beam)
13 Piping 14 Assist gas 15 Nozzle 16

Irradiated part

17, 21 Perforated hole (through hole)
18 Second laser beam (laser beam)
19 Perforated hole (blind hole)
20 Rotating blade

Claims

A sealed substrate is formed by resin-sealing chips respectively mounted in a plurality of regions provided on the circuit board, and a plurality of substrates are cut by cutting the sealed substrate at boundary lines of the plurality of regions. Used when manufacturing electronic components, fixing means for fixing the sealed substrate, laser light generating means for generating laser light, and moving the sealed substrate and / or the laser light relative to each other A cutting device for manufacturing an electronic component comprising moving means for causing
The laser light generating means cuts the sealed substrate at the boundary line where the perforated hole is formed, and the first laser light for forming the perforated hole at the boundary line. A cutting apparatus for manufacturing an electronic component, wherein the second laser beam is generated.
In the cutting device for electronic component manufacture described in Claim 1,
The cutting apparatus for manufacturing an electronic component, wherein the first laser beam is pulsed and the second laser beam is continuous.
In the cutting device for electronic component manufacture described in Claim 1 or 2,
The laser beam generating means includes a fiber laser oscillator or a YAG laser oscillator.
The cutting device for manufacturing an electronic component according to any one of claims 1 to 3,
The cutting device for manufacturing an electronic component, wherein the perforated hole is a through hole.
The cutting device for manufacturing an electronic component according to any one of claims 1 to 3,
The cutting device for manufacturing electronic parts, wherein the perforated hole is a blind hole.
The cutting device for manufacturing an electronic component according to any one of claims 1 to 5,
The substrate for the circuit board is made of ceramic or metal.
The cutting device for manufacturing an electronic component according to any one of claims 1 to 6,
A cutting apparatus for manufacturing an electronic component, wherein the electronic component is an optoelectronic component or a power semiconductor component.
Forming a sealed substrate by resin-sealing chips mounted in a plurality of regions provided on the circuit board, and cutting the sealed substrate along a boundary line of the plurality of regions; Used in manufacturing a plurality of electronic components, the step of fixing the sealed substrate, and the sealed substrate and / or the laser beam to each other while irradiating the sealed substrate with laser light A cutting method for manufacturing an electronic component comprising an irradiation step of relatively moving,
In the irradiation step, a perforated hole is formed in the boundary line by irradiating the first laser beam toward the sealed substrate, and then a second laser beam is irradiated toward the boundary line. A cutting method for manufacturing an electronic component, wherein the sealed substrate is cut.
In the cutting method for electronic component manufacture described in Claim 8,
The cutting method for manufacturing an electronic component, wherein the first laser beam is pulsed and the second laser beam is continuous.
In the cutting method for electronic component manufacture described in Claim 8 or 9,
In the irradiation step, the first laser beam and the second laser beam are generated by a fiber laser oscillator or a YAG laser oscillator.
A cutting method for manufacturing an electronic component according to any one of claims 8 to 10,
The cutting method for manufacturing an electronic component, wherein the perforated hole is a through hole.
A cutting method for manufacturing an electronic component according to any one of claims 8 to 10,
The cutting method for manufacturing an electronic component, wherein the perforated hole is a blind hole.
A cutting method for manufacturing an electronic component according to any one of claims 8 to 12,
The substrate for the circuit board is made of ceramics or metal.
A cutting method for manufacturing an electronic component according to any one of claims 8 to 13,
A cutting method for manufacturing an electronic component, wherein the electronic component is an optoelectronic component or a power semiconductor component.