JPS62234686A - Cutting method for working material - Google Patents

Abstract

PURPOSE:To improve cutting quality by moving an impulsive high energy beam on a processing line at the speed satisfying specific conditions to form plural pieces of holes, then cutting the working material along holes. CONSTITUTION:The working material 1 such as printed circuit board is set on a processing table 16 and the table 16 is driven by a driving motor 17 so that the impulsive high energy beam 11 is made movable relatively with the material 1. The relative moving speed (v) of the beam 11 is so set as to satisfy the conditions expressed by the formula with respect to the diameter (d) of the processed holes and pulse frequency (f), then boring by the beam 11 is executed. Since the beam moving speed (v) is controlled by the equation, the adjacent holes of the bored holes 2 connect to each other to form a perforation line. The material is then cut along the perforation line. The cutting is executed without contacting and the deterioration in the material quality at the cutting point is prevented. The cutting quality and workability are thus improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cutting method for cutting processed materials such as printed circuit boards without contact.

[Conventional technology]

Figures 5, 6, and 7 are diagonal diagrams showing conventional cutting methods for processed materials, and Figure 5 shows a sample of processed paulownia material that has been machined with grooves as parting lines by a mechanical method. Fig. 6 shows (1) the entire processed material that has been subjected to groove processing, and Fig. 7 shows (2) the processed material that has been cut and separated after groove processing. In the figure, (1) is a processed material such as a printed circuit board, and (2) is a groove processed by machining.

(4) is ■A fractured surface cut along groove (2), (5)
is the printed circuit board after separation.

Conventionally, when separating a printed circuit board into small pieces, mechanically cut the parts of the surface of the printed circuit board (1) to be separated and cut, that is, along the processing line, into the V-groove (9). (2) The printed circuit board was cut along the lines to the required dimensions.

[Problem that the invention seeks to solve]

In the conventional processing method, as described above, the grooves were mechanically processed using a cutter or the like. However, for example, printed circuit boards are often made of glass fiber-reinforced epoxy resin laminates, and because of the glass fibers, tools such as canter blades are subject to rapid wear and tear, and produce chips.

There was a problem in that workability was poor due to the generation of dust.

In addition, there is a problem that conventional methods cannot process the external shape of complex shapes, and although punching with a press is used to process complex shapes, it cannot be processed in subsequent processes such as after mounting the parts. There was a problem.

This invention was made to solve the above-mentioned problems by performing non-contact processing.

The overall purpose of the present invention is to provide a method for cutting workpieces that does not cause the problem of tool wear, does not generate chips, and allows post-processing such as after mounting parts.

[Means for solving problems]

The method for cutting a processed material according to the present invention includes the steps of forming a plurality of holes on a processing line using a pulsed high-density energy beam so that the center of the hole moves along the processing line; This process involves cutting the processed material along holes formed on a line.

[Effect]

The method of cutting the material to be processed in this invention uses a pulsed high-density energy beam to make holes one by one in pulses, and by adjusting the pulse frequency and the relative movement speed of the material to be processed and the beam, perforations are made. Since the hole is machined, there is almost no change in the quality of the beam irradiation area (and by applying force, it can easily be broken into a hole in the shape of a millimeter).

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a part of the workpiece processed by one step of the workpiece cutting method according to an embodiment of the present invention, and FIG. 2 shows the entire workpiece shown in FIG. 1. The perspective view and FIG. 3 are perspective views showing a laser processing apparatus according to an embodiment of the present invention.

In the figure, H is a pulsed laser beam SH, Ql) is a pulsed laser beam, a'a is a laser beam Ql
041 is a nozzle that injects assist gas coaxially with the focused laser beam, (151 is This is the entrance of the assist gas to the nozzle α.Also, αe is a processing table for moving the printed circuit board, and αη is a processing table driving motor.

A laser beam αB taken out from a laser oscillator Q (I) is bent by a bend mirror 02 and focused onto the processing line of a printed circuit board (1+) by a condensing lens αJ.

Printed circuit board (1) A desired pattern can be processed by moving the entire processing table σG.

In this case, if the laser beam σB is a continuous output beam, the printed circuit board (1) will be heated too much and the cut surface will become black, making it impossible to obtain a high quality product.

Regarding general laser cutting, please refer to the Welding Society Journal No. 43.
Volume (+974) No. 8, pages 82-89.

Therefore, the laser beam αD is pulsed as shown in Figure 4, and by appropriately selecting the pulse frequency, the moving speed of the printed circuit board, and the laser output, it is possible to machine perforated holes as shown in Figure 1. A plurality of holes (3) are formed on the machining assembly, with the center of the hole shifting.

FIG. 4 is a characteristic diagram showing the pulse waveform of a laser beam according to an embodiment of the present invention. The output varies depending on the thickness of the processed material, but in this case, the output power is 500 W for a printed circuit board with a thickness of 1 mm. Those with laser output are used.

As a result, one hole (3) is opened by the − pulse, and the diameter of the hole on the 1 surface side (laser beam receiving surface side) is 'kd(+u+φ)
Assuming that the pulse frequency kf (H2) and the moving speed of the printed circuit board are V (f/5ec), the holes come into contact with each other on the surface of the printed circuit board at v-d e f .

v) d・f When , there is a gap between the holes.

V(d-f When , the holes begin to overlap.

When cutting perforated holes as shown in Figure 2, if there is a gap between the perforated holes, the printed circuit board (11'8f: A great deal of force is required.

Also, the larger the overlap between holes, the more the printed circuit board (1
1'(rThe force required to split is smaller, but the printed circuit board (1)
It is not possible to increase the overlap because the carbides generated by thermal decomposition of the components adhere.

That is, good processing quality can be obtained by processing under the condition of V:;a-f, that is, under the condition that adjacent holes are connected to each other on one surface of the processed forest material.

By the way, in practical terms, v/d does not cause the above-mentioned problems.
The appropriate range for −f is 0.8≦d and f≦1.1.

In addition, by injecting assist gas coaxially with the laser beam from nozzle I, it is possible not only to prevent carbide from adhering to the printed circuit board surface and contaminating the condenser lens α, but also to cool the As a result, it is possible to achieve even higher quality.

Compressed air is suitable as the assist gas, but other gases such as nitrogen gas, oxygen gas, and argon gas may also be used.

Further, the assist gas does not necessarily need to be injected coaxially with the laser beam, and may be injected from the side.

Furthermore, the processing material may be a composite material such as a fiber-reinforced resin board in addition to a printed circuit board.

Further, in the above embodiment, the case where the printed circuit board is moved has been described, but the same effect can be obtained even if the laser beam is moved.

Further, similar processing can be performed using an electron beam instead of a laser beam.

〔Effect of the invention〕

As described above, according to the present invention, a step of forming a plurality of holes in the processing staple using a pulsed high-density energy beam so that the center of the hole moves along the processing line; And since the processing material is cut by applying a process of cutting the processing material by healing the hole formed on the processing line, it is possible to cut the processing material without contact and with higher quality than workability. be. Furthermore, since cutting can be performed in post-processes such as after component mounting, production efficiency is improved.

[Brief explanation of drawings]

1 and 2 are perspective views respectively showing a part and the whole of a processed material processed by one step of a method for cutting a processed material according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. 4 is a characteristic diagram showing the pulse waveform of a laser beam according to an embodiment of the present invention, and FIGS. 5, 6, and 7 are a perspective view showing a laser processing apparatus according to an embodiment of the present invention, and FIG. 5, FIG. 6, and FIG. FIG. 2 is a perspective view showing a cutting method. (1) is the processing material, (3) is the hole, Or5 is the laser oscillator, an is the laser beam, and fi41 is the nozzle. In addition, in FIG. 9, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Claims] (1) A step of forming a plurality of holes on the processing line using a pulsed high-density energy beam so that the center of the hole moves along the processing line, and the processing A method of cutting a processed material that involves cutting the processed material along a hole formed on a line. (2) The method for cutting a processed material according to claim 1, wherein the holes formed along the processing line connect adjacent holes on one surface of the processed material. (3) The relative moving speed of the high-density energy beam is v,
When the hole diameter is d and the pulse frequency is f, the above v, d,
The method for cutting a processed material according to claim 1 or 2, wherein f satisfies the following relationship. 0.8≦v/d·f≦1.1 (4) The method for cutting a processed material according to any one of claims 1 to 3, wherein the high-density energy beam is a laser beam. (5) A method for cutting a processed material according to claim 4, in which an assist gas is blown onto the processed portion at the same time as the laser beam is irradiated. (6) The method for cutting a processed material according to any one of claims 1 to 3, wherein the high-density energy beam is an electron beam.