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WO2009063670A1 - レーザ加工装置およびレーザ加工方法 - Google Patents

レーザ加工装置およびレーザ加工方法 Download PDF

Info

Publication number
WO2009063670A1
WO2009063670A1 PCT/JP2008/065191 JP2008065191W WO2009063670A1 WO 2009063670 A1 WO2009063670 A1 WO 2009063670A1 JP 2008065191 W JP2008065191 W JP 2008065191W WO 2009063670 A1 WO2009063670 A1 WO 2009063670A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
laser light
laser
laser machining
phase
Prior art date
Application number
PCT/JP2008/065191
Other languages
English (en)
French (fr)
Inventor
Naoya Matsumoto
Takashi Inoue
Norihiro Fukuchi
Haruyasu Ito
Yuu Takiguchi
Original Assignee
Hamamatsu Photonics K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics K.K. filed Critical Hamamatsu Photonics K.K.
Priority to JP2009541063A priority Critical patent/JP5216019B2/ja
Priority to DE112008003101T priority patent/DE112008003101T5/de
Priority to CN2008801160640A priority patent/CN101861228B/zh
Priority to US12/742,491 priority patent/US8324529B2/en
Publication of WO2009063670A1 publication Critical patent/WO2009063670A1/ja
Priority to US13/678,006 priority patent/US8575514B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/22—Processes or apparatus for obtaining an optical image from holograms
    • G03H1/2294—Addressing the hologram to an active spatial light modulator
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/0005—Adaptation of holography to specific applications
    • G03H2001/0094—Adaptation of holography to specific applications for patterning or machining using the holobject as input light distribution
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H2225/00—Active addressable light modulator
    • G03H2225/30—Modulation
    • G03H2225/32—Phase only

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Holo Graphy (AREA)

Abstract

　レーザ加工装置１は、レーザ光源１０、空間光変調器２０、制御部２２、集光光学系３０および遮蔽部材４０を備える。位相変調型の空間光変調器２０は、レーザ光源１０から出力されたレーザ光を入力し、２次元配列された複数の画素それぞれにおいてレーザ光の位相を変調するホログラムを呈示して、その位相変調後のレーザ光を出力する。制御部２２は、空間光変調器２０に複数のホログラムを順次に呈示させ、空間光変調器２０から出力されたレーザ光を、集光光学系３０により一定数であるＭ個の集光位置に集光させ、これらＭ個の集光位置のうちＮ個の集光位置を加工領域９１に選択的に配置させて、加工対象物９０を加工する。
PCT/JP2008/065191 2007-11-14 2008-08-26 レーザ加工装置およびレーザ加工方法 WO2009063670A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009541063A JP5216019B2 (ja) 2007-11-14 2008-08-26 レーザ加工装置およびレーザ加工方法
DE112008003101T DE112008003101T5 (de) 2007-11-14 2008-08-26 Laser-Bearbeitungsvorrichtung und Laser-Bearbeitungsverfahren
CN2008801160640A CN101861228B (zh) 2007-11-14 2008-08-26 激光加工装置以及激光加工方法
US12/742,491 US8324529B2 (en) 2007-11-14 2008-08-26 Laser machining device with a converged laser beam and laser machining method
US13/678,006 US8575514B2 (en) 2007-11-14 2012-11-15 Light irradiation device and light irradiation method irradiating converged light with an object

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-295931 2007-11-14
JP2007295931 2007-11-14

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/742,491 A-371-Of-International US8324529B2 (en) 2007-11-14 2008-08-26 Laser machining device with a converged laser beam and laser machining method
US13/678,006 Continuation US8575514B2 (en) 2007-11-14 2012-11-15 Light irradiation device and light irradiation method irradiating converged light with an object

Publications (1)

Publication Number Publication Date
WO2009063670A1 true WO2009063670A1 (ja) 2009-05-22

Family

ID=40638524

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065191 WO2009063670A1 (ja) 2007-11-14 2008-08-26 レーザ加工装置およびレーザ加工方法

Country Status (5)

Country Link
US (2) US8324529B2 (ja)
JP (2) JP5216019B2 (ja)
CN (1) CN101861228B (ja)
DE (1) DE112008003101T5 (ja)
WO (1) WO2009063670A1 (ja)

Cited By (7)

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US20120188620A1 (en) * 2009-06-10 2012-07-26 Easy Laser, S.L. Laser image projection system applicable to the marking of objects and method for generating holograms
JP2012226268A (ja) * 2011-04-22 2012-11-15 Hamamatsu Photonics Kk 光変調制御方法、制御プログラム、制御装置、及びレーザ光照射装置
CN102896421A (zh) * 2012-07-30 2013-01-30 沈明亚 采用lcos的激光微加工系统及其加工方法
US9383597B2 (en) 2012-09-13 2016-07-05 Hamamatsu Photonics K.K. Optical modulation control method, control program, control device, and laser light irradiation device
CN107533246A (zh) * 2015-05-15 2018-01-02 浜松光子学株式会社 调制图案计算装置、光控制装置、调制图案计算方法、调制图案计算程序以及存储介质
JP2021529349A (ja) * 2018-07-02 2021-10-28 ウニベルシタ デ バルセローナ プログラム可能な多点照明器、共焦点フィルタ、共焦点顕微鏡、および共焦点顕微鏡を操作する方法
WO2023135860A1 (ja) * 2022-01-14 2023-07-20 パナソニックＩｐマネジメント株式会社 レーザ溶接装置及びレーザ溶接方法

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KR20140036593A (ko) * 2012-09-17 2014-03-26 삼성디스플레이 주식회사 레이저 가공 장치
JP5993738B2 (ja) * 2012-12-25 2016-09-14 浜松ホトニクス株式会社 パターン化干渉光生成装置
KR102215918B1 (ko) 2013-03-27 2021-02-16 하마마츠 포토닉스 가부시키가이샤 레이저 가공 장치 및 레이저 가공 방법
WO2014156689A1 (ja) 2013-03-27 2014-10-02 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
DE112014001696B4 (de) 2013-03-27 2024-06-06 Hamamatsu Photonics K.K. Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren
US9902017B2 (en) 2013-03-27 2018-02-27 Hamamatsu Photonics K.K. Laser machining device and laser machining method
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JP6290697B2 (ja) * 2014-04-22 2018-03-07 浜松ホトニクス株式会社 波形計測装置およびパルス光生成装置
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JP6768444B2 (ja) * 2016-10-14 2020-10-14 浜松ホトニクス株式会社 レーザ加工装置、及び、動作確認方法
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JP5438176B2 (ja) 2014-03-12
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US20100270277A1 (en) 2010-10-28
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US20130068742A1 (en) 2013-03-21
DE112008003101T5 (de) 2010-10-14

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