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WO2008126681A1 - 電気・電子機器用銅合金およびその製造方法 - Google Patents

電気・電子機器用銅合金およびその製造方法 Download PDF

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Publication number
WO2008126681A1
WO2008126681A1 PCT/JP2008/055785 JP2008055785W WO2008126681A1 WO 2008126681 A1 WO2008126681 A1 WO 2008126681A1 JP 2008055785 W JP2008055785 W JP 2008055785W WO 2008126681 A1 WO2008126681 A1 WO 2008126681A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper alloy
electrical
producing
electronic device
same
Prior art date
Application number
PCT/JP2008/055785
Other languages
English (en)
French (fr)
Inventor
Ryosuke Matsuo
Tatsuhiko Eguchi
Kuniteru Mihara
Hiroshi Kaneko
Kiyoshige Hirose
Original Assignee
The Furukawa Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Furukawa Electric Co., Ltd. filed Critical The Furukawa Electric Co., Ltd.
Priority to CN200880017586A priority Critical patent/CN101680057A/zh
Priority to US12/593,024 priority patent/US20100193092A1/en
Priority to EP08722882A priority patent/EP2143810A4/en
Publication of WO2008126681A1 publication Critical patent/WO2008126681A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C5/00—Separating dispersed particles from liquids by electrostatic effect
    • B03C5/005—Dielectrophoresis, i.e. dielectric particles migrating towards the region of highest field strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C5/00—Separating dispersed particles from liquids by electrostatic effect
    • B03C5/02—Separators
    • B03C5/022—Non-uniform field separators
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Conductive Materials (AREA)

Abstract

　ニッケル（Ｎｉ）を１．５～５．０質量％、ケイ素（Ｓｉ）を０．４～１．５質量％含有し、ニッケル（Ｎｉ）／ケイ素（Ｓｉ）の質量比が２以上７以下で、残部が銅（Ｃｕ）と不可避不純物とからなり、平均結晶粒径が２μｍ以上２０μｍ以下で、かつ、その結晶粒径の標準偏差が１０μｍ以下である電気・電子機器用銅合金。
PCT/JP2008/055785 2007-03-26 2008-03-26 電気・電子機器用銅合金およびその製造方法 WO2008126681A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880017586A CN101680057A (zh) 2007-03-26 2008-03-26 电气电子设备用铜合金及其制造方法
US12/593,024 US20100193092A1 (en) 2007-03-26 2008-03-26 Copper alloy for electrical/electronic device and method for producing the same
EP08722882A EP2143810A4 (en) 2007-03-26 2008-03-26 COPPER ALLOY FOR ELECTRICAL / ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-080266 2007-03-26
JP2007080266 2007-03-26
JP2008079256A JP5170881B2 (ja) 2007-03-26 2008-03-25 電気・電子機器用銅合金材およびその製造方法
JP2008-079256 2008-03-25

Publications (1)

Publication Number Publication Date
WO2008126681A1 true WO2008126681A1 (ja) 2008-10-23

Family

ID=39863792

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055785 WO2008126681A1 (ja) 2007-03-26 2008-03-26 電気・電子機器用銅合金およびその製造方法

Country Status (5)

Country Link
US (1) US20100193092A1 (ja)
EP (1) EP2143810A4 (ja)
JP (1) JP5170881B2 (ja)
CN (1) CN101680057A (ja)
WO (1) WO2008126681A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012224898A (ja) * 2011-04-18 2012-11-15 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金、Ｃｕ−Ｃｏ−Ｓｉ系合金及びその製造方法
CN103140591A (zh) * 2010-09-29 2013-06-05 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si类铜合金及其制备方法
US20140305551A1 (en) * 2012-11-09 2014-10-16 Poongsan Corporation Copper alloy material for electrical and electronic components and method of preparing the same
US9499885B2 (en) 2010-04-14 2016-11-22 Jx Nippon Mining & Metals Corporation Cu—Si—Co alloy for electronic materials, and method for producing same

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101981214B (zh) * 2008-03-31 2015-12-09 古河电气工业株式会社 电气电子设备用铜合金材料及电气电子零件
JP5009849B2 (ja) * 2008-03-31 2012-08-22 日本精線株式会社 高強度ばね用の銅合金線、及び該銅合金線を用いた銅合金ばね
WO2009123159A1 (ja) * 2008-03-31 2009-10-08 古河電気工業株式会社 電気電子機器用銅合金材料および電気電子部品
JP5261161B2 (ja) * 2008-12-12 2013-08-14 Ｊｘ日鉱日石金属株式会社 Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4708485B2 (ja) * 2009-03-31 2011-06-22 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP5140045B2 (ja) * 2009-08-06 2013-02-06 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金板又は条
KR20120054099A (ko) * 2009-09-28 2012-05-29 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ-Ｃｏ 계 구리 합금 및 그 제조 방법
US9005521B2 (en) * 2010-04-02 2015-04-14 Jx Nippon Mining & Metals Corporation Cu—Ni—Si alloy for electronic material
JP4672804B1 (ja) 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP4834781B1 (ja) * 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
JP5522692B2 (ja) * 2011-02-16 2014-06-18 株式会社日本製鋼所 高強度銅合金鍛造材
US9514856B2 (en) 2011-08-04 2016-12-06 Kobe Steel, Ltd. Copper alloy
JP6246454B2 (ja) * 2011-11-02 2017-12-13 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP6222885B2 (ja) * 2011-11-10 2017-11-01 Ｊｘ金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金
JP5773929B2 (ja) 2012-03-28 2015-09-02 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性に優れる電気電子部品用銅合金板
JP5501495B1 (ja) * 2013-03-18 2014-05-21 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
CN104178660B (zh) * 2014-08-29 2016-11-02 河南科技大学 一种高强度Cu-Ni-Si合金及其制备方法
JP6821290B2 (ja) * 2015-03-19 2021-01-27 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金
CN104928527A (zh) * 2015-07-13 2015-09-23 苏州科茂电子材料科技有限公司 一种电缆用导电铜材料及其制备方法
JP6879971B2 (ja) * 2018-03-30 2021-06-02 Ｊｘ金属株式会社 銅合金材料、電子部品、電子機器及び銅合金材料の製造方法
JP6830135B2 (ja) * 2019-08-06 2021-02-17 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06184680A (ja) 1992-12-21 1994-07-05 Kobe Steel Ltd 曲げ加工性が優れた銅合金
JPH1060562A (ja) * 1996-08-14 1998-03-03 Furukawa Electric Co Ltd:The 電子機器用銅合金及びその製造方法
JPH11222641A (ja) * 1998-01-30 1999-08-17 Furukawa Electric Co Ltd:The 導電性ばね用銅合金及及びその製造方法
JP2002038228A (ja) * 2000-07-25 2002-02-06 Furukawa Electric Co Ltd:The 電子電気機器部品用銅合金材
WO2002053790A1 (fr) * 2000-12-28 2002-07-11 Nippon Mining & Metals Co., Ltd. Alliage de cuivre haute resistance ayant une excellente aptitude au pliage et son procede de fabrication, terminal et connecteur comportant cet alliage
JP2004052008A (ja) * 2002-07-16 2004-02-19 Yamaha Metanikusu Kk チタン銅合金材及びその製造方法
JP2005089843A (ja) 2003-09-18 2005-04-07 Kobe Steel Ltd 高強度銅合金板および高強度銅合金板の製造方法
JP2006089763A (ja) 2004-09-21 2006-04-06 Dowa Mining Co Ltd 銅合金およびその製造法
JP2006200042A (ja) * 2006-03-23 2006-08-03 Kobe Steel Ltd 曲げ加工性に優れた銅合金板からなる電子部品
JP2007314847A (ja) * 2006-05-26 2007-12-06 Kobe Steel Ltd 高強度、高導電率および曲げ加工性に優れた銅合金およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3739214B2 (ja) * 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
JP2005133185A (ja) * 2003-10-31 2005-05-26 Nippon Mining & Metals Co Ltd 析出型銅合金の熱処理方法と析出型銅合金および素材
JP4809602B2 (ja) * 2004-05-27 2011-11-09 古河電気工業株式会社 銅合金
JP4566020B2 (ja) * 2005-02-14 2010-10-20 株式会社神戸製鋼所 異方性の小さい電気電子部品用銅合金板
JP4566048B2 (ja) * 2005-03-31 2010-10-20 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP4357536B2 (ja) * 2007-02-16 2009-11-04 株式会社神戸製鋼所 強度と成形性に優れる電気電子部品用銅合金板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06184680A (ja) 1992-12-21 1994-07-05 Kobe Steel Ltd 曲げ加工性が優れた銅合金
JPH1060562A (ja) * 1996-08-14 1998-03-03 Furukawa Electric Co Ltd:The 電子機器用銅合金及びその製造方法
JPH11222641A (ja) * 1998-01-30 1999-08-17 Furukawa Electric Co Ltd:The 導電性ばね用銅合金及及びその製造方法
JP2002038228A (ja) * 2000-07-25 2002-02-06 Furukawa Electric Co Ltd:The 電子電気機器部品用銅合金材
WO2002053790A1 (fr) * 2000-12-28 2002-07-11 Nippon Mining & Metals Co., Ltd. Alliage de cuivre haute resistance ayant une excellente aptitude au pliage et son procede de fabrication, terminal et connecteur comportant cet alliage
JP2004052008A (ja) * 2002-07-16 2004-02-19 Yamaha Metanikusu Kk チタン銅合金材及びその製造方法
JP2005089843A (ja) 2003-09-18 2005-04-07 Kobe Steel Ltd 高強度銅合金板および高強度銅合金板の製造方法
JP2006089763A (ja) 2004-09-21 2006-04-06 Dowa Mining Co Ltd 銅合金およびその製造法
JP2006200042A (ja) * 2006-03-23 2006-08-03 Kobe Steel Ltd 曲げ加工性に優れた銅合金板からなる電子部品
JP2007314847A (ja) * 2006-05-26 2007-12-06 Kobe Steel Ltd 高強度、高導電率および曲げ加工性に優れた銅合金およびその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2143810A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9499885B2 (en) 2010-04-14 2016-11-22 Jx Nippon Mining & Metals Corporation Cu—Si—Co alloy for electronic materials, and method for producing same
CN103140591A (zh) * 2010-09-29 2013-06-05 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si类铜合金及其制备方法
JP2012224898A (ja) * 2011-04-18 2012-11-15 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金、Ｃｕ−Ｃｏ−Ｓｉ系合金及びその製造方法
US20140305551A1 (en) * 2012-11-09 2014-10-16 Poongsan Corporation Copper alloy material for electrical and electronic components and method of preparing the same

Also Published As

Publication number Publication date
US20100193092A1 (en) 2010-08-05
JP2008266783A (ja) 2008-11-06
JP5170881B2 (ja) 2013-03-27
EP2143810A1 (en) 2010-01-13
EP2143810A4 (en) 2012-06-27
CN101680057A (zh) 2010-03-24

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