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WO2005104026A1 - Carte à circuit intégré et procédé pour la fabrication de celui-ci - Google Patents

Carte à circuit intégré et procédé pour la fabrication de celui-ci Download PDF

Info

Publication number
WO2005104026A1
WO2005104026A1 PCT/JP2005/007294 JP2005007294W WO2005104026A1 WO 2005104026 A1 WO2005104026 A1 WO 2005104026A1 JP 2005007294 W JP2005007294 W JP 2005007294W WO 2005104026 A1 WO2005104026 A1 WO 2005104026A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheet member
layer
card
delamination
chip
Prior art date
Application number
PCT/JP2005/007294
Other languages
English (en)
Japanese (ja)
Inventor
Ryoji Hattori
Original Assignee
Konica Minolta Photo Imaging, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Photo Imaging, Inc. filed Critical Konica Minolta Photo Imaging, Inc.
Publication of WO2005104026A1 publication Critical patent/WO2005104026A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
    • G06K19/0739—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering the incapacitated circuit being part of an antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an IC card suitable for being applied to a non-contact electronic card that stores personal information or the like that requires security (security) such as forgery and falsification prevention, and a manufacturing method thereof.
  • Patent Document 1 JP 2003-108958 A
  • ID cards identification cards
  • credit cards credit cards
  • magnetic cards allow data to be rewritten relatively easily, preventing data from being tampered with, and being magnetically affected by external influences and improper protection of data.
  • problems such as a small capacity for recording.
  • IC cards with built-in IC chips have begun to spread.
  • An IC card reads and writes data from and to an external device via an electrical contact provided on a surface or a loop antenna inside the card.
  • IC cards have a larger storage capacity than magnetic cards, and security is greatly improved.
  • non-contact IC cards that have built-in antennas for exchanging information between the IC chip and the outside inside the card and do not have electrical contacts outside the card are more suitable for contact IC cards that have electrical contacts on the card surface. It is superior in security, and is being used for applications that require high data confidentiality and anti-counterfeiting like ID cards.
  • an IC card for example, there is a card in which a first sheet member and a second sheet member are bonded via an adhesive, and an IC module having an IC chip and an antenna is sealed in the adhesive layer.
  • an IC chip concealing layer between the support and the adhesive as described in Patent Document 1 to prevent forgery and alteration.
  • the present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide an IC card which can prevent chip removal due to card destruction, thereby preventing alteration, and a method of manufacturing the same. .
  • the IC card of the present invention uses an electronic component in which an IC chip and an antenna are integrated between a first sheet member and a second sheet member via an adhesive. And at least two regions having a strong and a weak region for delamination between the first sheet member and the Z or second sheet member and the adhesive layer.
  • At least one of the first sheet member and the second sheet member has a delamination adjusting layer.
  • the region having a strong delamination force overlaps at least a part of the region where the IC chip and the antenna are located.
  • the peel strength in a region where the delamination force is strong is 1700 gZ25 mm or more
  • the peel strength in a region where the peel force is weak V ⁇ is 1000 gZ25 mm to 1500 gZ25 mm.
  • the peel strength is 1700gZ25mm or more, a more abrupt load is generated when the peeling is performed, and the IC chip is damaged, the antenna or the joint is disconnected, and the sheet member is damaged.
  • the peel strength is 1500gZ25mn! Due to the presence of an area of ⁇ 1000gZ25mm, a load is generated at the time of peeling.
  • the delamination adjusting layer is formed by a printing method.
  • the invention of the method for manufacturing an IC card includes an image receiving layer forming step of forming an image receiving layer on one surface of the first sheet member, and a writing layer of forming a writing layer on one surface of the second sheet member.
  • the delamination force of the sheet member is adjusted on the surface of the first sheet member opposite to the side having the image receiving layer and on the surface of the Z or second sheet member opposite to the side having the writing layer.
  • an area where the first sheet member and the Z or second sheet member have a strong delamination force is overlapped with at least a part of an area where the IC chip and the antenna are.
  • FIG. 1 is a diagram showing an example of a front surface, a front surface appearance, and a rear surface appearance of an IC card.
  • FIG. 2 is a diagram showing an example of an IC module using a printed board, and using a nonwoven fabric as the board.
  • FIG. 3 is a diagram showing the positional relationship between the arrangement of the delamination adjusting layer and the arrangement of the IC modules on the inner surface of the IC card, and a diagram showing the inner surface of the IC card having no delamination adjusting layer.
  • FIG. 4 is a cross-sectional view of an IC card using the IC module shown in FIGS. 2 (a) and 2 (b).
  • FIG. 5 is a view showing an IC card base material manufacturing apparatus.
  • FIG. 6 is a diagram showing an example of an IC card creation device.
  • FIG. 7 is a diagram showing another example of an IC card creation device.
  • the IC card of the present invention includes an electronic component in which an IC chip and an antenna are integrated between a first sheet member and a second sheet member with an adhesive therebetween.
  • the delamination force of the Z or second sheet member is at least strong and weak in the long side direction of the card. Also has two regions.
  • the delamination force is obtained by cutting a sheet member integrally formed into a 25 mm width, with the cut-side surface facing downward, using FUDO RHEO METER NRM-2002J manufactured by Fudo Kogyo Co., Ltd.
  • the upper portion is fixed and the lower portion is pulled to obtain the maximum strength required for peeling. If it is out of the measurement range, reduce the width of the sheet to be cut and measure it.
  • a delamination adjustment layer is formed on at least one selected from a first sheet member and a second sheet member on a substrate provided with an electronic component in which an IC chip and an antenna are integrated. Being preferred to be. Particularly, in order that the delamination force is strong and the area overlaps with at least a part of the area where the IC chip and the antenna are provided, it may be formed on at least one of the first sheet member and the second sheet member. Like,.
  • the delamination adjusting layer is not particularly limited as long as it is located in one of the areas where the IC chip and the antenna are present, but at least overlaps with an area of 5% or more with respect to the area of the IC chip part and has a strong delamination force. It is preferred to have a region and a weak region, preferably in a ratio of 95: 5 to 5:95.
  • the delamination force is strong !, the area is weak, and the difference in peel strength between the areas is large!
  • the more preferable strength, the more preferable the peel strength of the area is 1700gZ25mm or more.
  • Weak, peel strength of the area is 1000gZ25mn! ⁇ / 500gZ preferably in the range of 25mm! / ,.
  • the delamination test was performed by forming the delamination adjustment layer alone and measuring the delamination force.
  • an IC card processed into a use form is referred to as an IC card
  • a raw card before processing or a card having a constituent layer for kamitsu is referred to as an IC card substrate.
  • the card encompasses all of these.
  • FIG. 1 shows an example of an embodiment of an IC card.
  • 1 (a) is a front view of the IC card base material
  • FIG. 1 (b) is a front view of the IC card
  • FIG. 1 (c) is a back view of the IC card.
  • Fig. 1 (a) On the surface of the IC card substrate shown, a format 100 such as employee ID and name characters is recorded by printing. The face image, name, ID number 101, etc. are recorded on the front side of this IC card base as shown in Fig. 1 (b), and on the back side, a blue line and an emergency call are displayed as shown in Fig. 1 (c). Record the bibliographic information 102, etc., and create an IC card.
  • an identification card By describing personal information such as a face image, address, name, and date of birth on the IC card base material, an identification card, passport, alien registration card, library use card, cash card, tail card can be used. It can be used for licenses such as automobile licenses, employee IDs, employee IDs, membership IDs, medical cards and student IDs.
  • FIG. 2 shows an example of an embodiment of an IC module provided in an IC card.
  • FIG. 2A is a schematic diagram showing an embodiment using a printed circuit board
  • FIG. 2B is a schematic diagram showing an embodiment using a nonwoven fabric as a substrate of an IC module.
  • an electronic component in which a printed pattern of an antenna 3c is formed on a printed circuit board 2a, and an IC chip 3a is bonded to the antenna 3c by bonding or the like and integrally formed. are doing.
  • 3b is a reinforcing plate that covers at least one side of the IC chip 3a by 50% or more (see Fig. 4).
  • an antenna 3c is formed on a nonwoven fabric sheet 2b, and an electronic component in which an IC chip 3a is bonded to the antenna 3c by bonding or the like is integrally formed.
  • a commercially available IC card sheet “FT series” manufactured by Hitachi Maxell, Ltd. can be used.
  • a porous resin sheet such as the nonwoven fabric sheet 2b, the adhesiveness between the members becomes superior because the impregnating property of the adhesive during the heat bonding is improved.
  • These IC modules can be larger or smaller than the IC card size.
  • FIGS. 3 (a) to 3 (g) show the inner surface of the IC card and show the positional relationship between the delamination adjusting layer and the IC module.
  • a region 4al having a strong delamination force and a region 4a2 having a weak delamination force are provided in the form of a thin line in the short side direction of the card as the delamination adjusting layer 4a.
  • a region 4al having a strong delamination force and a region 4a2 having a low delamination force are provided in a cut shape.
  • the delamination force is strong! The thick and spline-shaped delamination force and the region 4al are provided at the position of the IC chip 3a.
  • a region 4al having a strong delamination force and a region 4a2 having a weak delamination force are provided in a plurality of elliptical rings.
  • a region 4al having a strong delamination force and a weak delamination force !, and a region 4a2 are provided in the short side direction of the card in a narrow, spline-like and thick, spline-like manner.
  • a region 4al having a strong delamination force is provided on the outer periphery.
  • a region 4al having a strong delamination force and a region 4a2 having a weak delamination force are provided at the center so that both-side forces are gradually reduced.
  • a region 4al having a strong delamination force and a region 4a2 having a weak delamination force are provided in the short side direction of the card in the form of a thin V, a spline shape, a thick shape, and a spline shape.
  • a thick and spline-shaped region 4a1 having a strong delamination force is provided at the position of the IC chip 3a, and a region 4a3 having a strong delamination force as a different delamination adjusting layer is provided in a thick spline shape.
  • FIG. 3 (h) shows a comparative example in which no delamination adjusting layer was provided.
  • Materials for the delamination adjusting layer include “lithographic printing technology”, “new printing technology overview”, “offset printing technology”, and “engraving and printing encyclopedia” published by Japan Printing Technology Association. It can be formed using the general inks described, and examples thereof include photocurable inks, oil-soluble inks, and solvent-based inks.
  • the delamination force adjusting layer is a force IC chip that can be provided by a method such as gravure coating, dipping, screen printing, resin letterpress printing, offset printing, silk printing, flexographic printing, screen gravure printing, or the like.
  • a printing method such as oil relief printing, offset printing, silk printing, flexo printing, or screen gravure printing.
  • FIG. 4 shows a cross-sectional view of the IC card of this embodiment.
  • the embodiment of FIG. 4A uses the IC module of FIG. 2A
  • the embodiment of FIG. 4B uses the IC module of FIG. 2B. .
  • the IC chip 3a and the antenna 3c are connected between the first sheet member 5a and the second sheet member 5b via the adhesives 6a and 6b.
  • This is an IC card with electronic components.
  • a bump 3a1 is provided on the non-circuit side of the IC chip 3a, and the bump 3a1 is It is connected to the antenna 3c of the printed circuit board 2a by the conductive adhesive 3a2.
  • a reinforcing plate 3b is provided on the circuit surface side of the IC chip 3a, and an adhesive 3a3 is provided between the reinforcing plate 3b and the printed board 2a so as to surround the IC chip 3a.
  • the first sheet member 5a has an image receiving layer 5al that receives a sublimation or heat diffusible dye image and a heat fusible ink image by a thermal transfer recording method. Various information is described on the image receiving layer 5al. Protected by layer 5a2.
  • the second sheet member 5b has a writing layer 5bl.
  • a reinforcing plate 3b is provided on the side other than the circuit surface of the IC chip 3a, and the reinforcing plate 3b is provided on the nonwoven fabric 2b.
  • a bump 3al is provided on the circuit surface side of the IC chip 3a, and the bump 3al is connected to the antenna 3c.
  • polyester resin such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate Z isophthalate copolymer, polyolefin resin such as polyethylene, polypropylene, and polymethylpentene;
  • Polyfluorinated resins such as vinyl chloride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene tetrafluoroethylene copolymer, polyamides such as nylon 6, nylon 6.6, polychlorinated vinyl, and salt
  • the first sheet member and the second sheet member may be the same or different.
  • These sheet members can be easily formed by forming a layer of a coupling agent, a latex, a hydrophilic resin or the like, which can be subjected to an easy contacting treatment, or a corona treatment or a plasma treatment. Fold. Further, an annealing treatment or the like may be performed to reduce heat shrinkage.
  • a hot-melt adhesive a reactive hot-melt adhesive such as a light-curable adhesive, a moisture-curable adhesive, or an elastic epoxy adhesive can be used.
  • hot melt adhesive examples include an ethylene-vinyl acetate copolymer (EVA) -based, polyester-based, polyamide-based, thermoplastic elastomer-based, and polyolefin-based adhesive, and a thermoplastic elastomer-based hot-melt adhesive is preferred.
  • EVA ethylene-vinyl acetate copolymer
  • polyester-based polyester-based
  • polyamide-based polyamide-based
  • thermoplastic elastomer-based thermoplastic elastomer-based hot-melt adhesive
  • a thermoplastic elastomer-based hot-melt adhesive is preferred.
  • photocurable adhesive examples include those described in JP-A-10-316959, JP-A-11-5964, JP-A-11-161762, and the like. It can be used after being cured with a light source such as a mercury lamp, UV lamp, or xenon at an exposure of 100 to 500 mj.
  • a light source such as a mercury lamp, UV lamp, or xenon at an exposure of 100 to 500 mj.
  • moisture-curable adhesive examples include those described in JP-A-2000-036026, JP-A-2000-219855, and JP-A-2000- 211278.
  • the elastic epoxy adhesive examples include those described in JP-A-63-63716, JP-A-10-120764, JP-A-2000-229927, JP-A-6-87190, JP-A-5-295272, etc. Is received.
  • Cemedine Co., Ltd. Cemedine EP-001, Three Bond Co., Ltd., 3950 Series, 3950, 3951, 3952, Koshi Co., Ltd. Bond MOS Series, MOS07, MOS10, Toho-Daisei Industrial Co., Ltd. It is preferable to use the 1500 series, Ulti-T 15 40, and the like.
  • the thickness of the adhesive layer including the electronic component is preferably 100 to 600 ⁇ m, more preferably 200 to 600 ⁇ m, and still more preferably 250 to 600 ⁇ m.
  • a coil made of copper winding a coil printed with a conductive paste such as silver paste on an insulating substrate in a spiral shape, or a coil etched with a metal foil such as a copper foil is used. Used. From the viewpoint of communication, it is preferable to use a coil formed by copper winding, and the coil may be covered with a resin, an insulating layer, or the like.
  • thermoplastic film such as polyester is used, and when heat resistance is required, polyimide is advantageous.
  • the bonding between the IC chip and the antenna pattern can be performed using a conductive adhesive such as silver paste, copper paste, or carbon paste, a method using an anisotropic conductive film, or a method using solder bonding or ACF bonding. Good.
  • an adhesive layer is formed on a sheet member in advance, and the module is placed and sealed.
  • the electronic component it is preferable to form the electronic component on a substrate made of a porous resin film, a porous foamed resin film, a flexible resin sheet, a porous resin sheet, or a nonwoven sheet.
  • the total thickness of the electronic component is preferably from 10 to 500 m, more preferably from 10 to 450 111, and even more preferably from 10 to 350 m! / ⁇ .
  • a hot melt adhesive is applied to the front and back sheets with an applicator to a predetermined thickness.
  • a coating method a usual method such as a roller method, a T-die method, and a die method is used.
  • the applied adhesive may be preheated by a heater or the like before mounting the IC module.
  • the sheet with the IC module mounted between the upper and lower sheets is pressed by a press heated to the bonding temperature of the adhesive for a predetermined time, or the sheet is transported in a constant temperature layer at a predetermined temperature instead of rolling by the press. While rolling with pressure May be extended. Further, vacuum pressing may be performed to prevent air bubbles from entering during bonding.
  • a vertical press method in which it is preferable to perform heating and pressurization in order to improve the surface smoothness of the IC card and improve the adhesion between the first sheet member and the second sheet member by incorporating electronic components, and a laminate. It is preferable to manufacture by a method, a kyatumble method or the like.
  • the heating temperature is preferably from 10 to 120 ° C, more preferably from 30 to: LOO.
  • Pressure, from the point of view to avoid the damage of the IC chip, more preferably preferred tool is 0. 05 ⁇ 300kgfZcm 2 0.
  • the heating and pressurizing time is preferably from 0.1 to 180 sec, more preferably from 0.1 to 120 sec.
  • the laminated sheet or roll is allowed to stand for a time corresponding to a predetermined curing time of the adhesive, or after a curing reaction for a predetermined time when a reactive adhesive is used as the adhesive, is subjected to authentication identification. Images and bibliographic items may be recorded, and then molded into a predetermined card size.
  • a punching method, a cutting method, and the like can be selected.
  • the thickness of the card produced is between 300 and 1000 / ⁇ , preferably between 300 and 900 ⁇ m.
  • the first sheet member is preferably provided with an image receiving layer.
  • an image containing gradation information is formed on the image receiving layer by a sublimation type thermal transfer method and a character information containing image is formed by a sublimation type heat transfer method or a fusion type heat transfer method
  • the dyeing property of a sublimable dye or The adhesiveness of the hot-melt ink must be good as well as the dyeability of the flower pigment.
  • the types of the binder and various additives and the amounts thereof are appropriately adjusted.
  • binder for the image receiving layer a commonly known binder for the sublimation type thermal transfer recording image receiving layer can be appropriately used.
  • a metal ion-containing compound that reacts with the sublimated dye compound to form a chelate For example, Ni 2 +, Cu 2+, Co 2+, complex represented by the following general formula containing Cr 2+ ⁇ beauty Zn 2+ is preferably used. [0050] [M (Ql) k (Q2) m (Q3) n] p + p (L ”)
  • M represents a metal ion
  • Ql, Q2, and Q3 each represent a coordination compound capable of coordinating with the metal ion represented by M
  • L represents a counter ion capable of forming a complex.
  • k represents an integer of 1, 2, or 3
  • m represents 1, 2, or 0,
  • n represents 1 or 0,
  • p represents 1, 2, or 3.
  • the release agent is preferably one that is compatible with the binder, prevents fusion with the ink sheet, and does not hinder the secondary workability of the image receiving layer.
  • the secondary processability of the image receiving layer refers to writability with magic ink, laminating properties that are a problem when protecting the formed image, and the like.
  • the thickness of the image receiving layer is generally 1 to 50 m, preferably 2 to about LO / z m.
  • a cushion layer or a Norr layer may be provided between the sheet member and the image receiving layer. By providing the cushion layer, it is possible to transfer and record an image corresponding to image information with high reproducibility with little noise.
  • the second sheet member may be provided with a writing layer so that writing can be performed on the back surface of the IC card as needed.
  • the writing layer can be formed with a binder and various additives.
  • the thickness of the writing layer is preferably 1 to 50 ⁇ m, more preferably 1 to 40 ⁇ m.
  • an adhesive layer may be provided for improving the adhesion to the sheet member, or a cushion layer may be provided for improving the writing property, and there is no particular limitation.
  • the writing layer preferably has a fine surface and an uneven surface on the surface in order to improve writability.
  • An information carrier layer formed by format printing can be provided on the image receiving layer or the writing layer. To be more specific, it shows the blue line, company name, card name, notes, issuer phone number, etc.
  • Format printing may employ permeability printing, holograms, fine prints, etc. to prevent forgery by visual inspection.
  • printed materials, holograms, bar codes, mat patterns may be used as a forgery / alteration prevention layer.
  • Fine pattern, ground pattern, uneven pattern, etc. visible light absorbing color material, ultraviolet light absorbing material, infrared light absorbing material, fluorescent brightening material, glass vapor deposition layer, bead layer, optical change element layer, pearl ink layer, flake It is also possible to provide a pigment layer, IC hiding layer, permeability printing layer, etc. by printing or the like.
  • the formation of the information carrier consisting of the format printing is performed by “lithographic printing technology”, “new printing technology introduction”, “offset printing technology”, and “plate making” printing published by the Japan Printing Technology Association. It is formed of a general photocurable ink, oil-soluble ink, solvent-based ink, etc. described in "Kankan”.
  • authentication identification images such as face images and attribute information images such as bibliographic items are generally formed.
  • the face image is usually a full-color image having gradation (gradation information-containing image), and is created by, for example, a sublimation thermal transfer recording method or an ink jet method.
  • the character information-containing image is a binary image, and is created by, for example, a fusion type thermal transfer recording method, a sublimation type thermal transfer recording method, an ink jet method, or the like.
  • an authentication identification image such as a face image is formed by a sublimation type thermal transfer recording method, and an attribute information image is recorded by a fusion type thermal transfer recording method.
  • the ink layer side of the sublimation type thermal transfer recording ink sheet and the image receiving layer side of the IC card base material are overlapped, and the image is formed from the ink sheet side.
  • the thermal energy is applied wisely to transfer the thermal diffusible dye in the ink layer to the image receiving layer side.
  • a thermal head is generally used, and in addition, a known one such as a laser beam, an infrared flash, and a hot pen can be used.
  • a heat treatment may be performed using a thermal head, a heat roller, an infrared flash lamp, or the like for the purpose of improving image storability.
  • the heat-meltable ink layer side of the ink sheet for fusion-type thermal transfer recording and the image receiving layer side of the IC card substrate are brought into close contact, and a thermal pulse is applied from the ink sheet side by the thermal head. Then, the heat-meltable ink layer corresponding to the desired transfer pattern is heated and transferred to the image receiving layer surface.
  • the formation of the character information-containing image may be performed prior to the formation of the gradation information-containing image, or may be performed after the formation of the gradation information-containing image.
  • the character information-containing image can also be formed using the sublimation type thermal transfer recording ink sheet.
  • the ink jet method for example, a printer having a resolution of about 400 dpi by a bubble jet (registered trademark) method is used.
  • the face image can be multi-graded by a printer using a shear mode head.
  • inks described in JP-A-9-71743, JP-A-2000-297237, JP-A-2000-85236, JP-A-5-1254 and the like can be used.
  • the post-heating, post-exposure, etc. may be performed after writing the character information, face image, etc. by the ink jet as post-processing, and there is no particular restriction on the type of ink and the image forming method.
  • the IC card of the present invention may be provided with a surface protective layer, and is preferably made of a photocurable resin.
  • the surface protective layer may be provided by applying a resin solution or using a transfer foil.
  • An optical change element such as a hologram may be provided on the transfer foil for the purpose of preventing forgery and falsification.
  • a coating solution for forming the first image receiving layer and a coating solution for forming the second image receiving layer having the following compositions are respectively provided in this order.
  • Methylcellulose (Shin-Etsu-Dagaku Kogyo Co., Ltd .: SM15) 0.1 part
  • a delamination adjusting layer shown in FIG. 3 was provided on the back side of the image receiving layer on the support by an offset printing method using a UV printing ink described as a preparation example in the table below. UV illumination during printing The irradiation conditions were equivalent to 200 mj with a high-pressure mercury lamp.
  • the ink of Formulation Example 4 also serves as the printing ink.
  • Format printing (employee identification, name) was performed on the image receiving layer using UV black ink by offset printing. Further, a transparent UV-curable OP varnish (FD-O dry coat varnish, manufactured by Naruto Ink Co., Ltd.) was provided by offset printing except for the sublimation thermal transfer image recording area.
  • the UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.
  • a first sheet member 2 was produced in the same manner as the first sheet member 1 except that a white, 188 m-thick U2L98W non-adhesive layer treated product of Teijin DuPont Films Co., Ltd. was used.
  • a coating solution for forming a writing layer having the following composition was sequentially coated and dried, and each had a thickness of 5 / ⁇ , 15 ⁇ ⁇ , 0.2 ⁇ m writing layer was formed.
  • Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts
  • Polyester resin (Toyobo Co., Ltd .: Vironal MD 1200) 4 parts
  • an interlayer release adjusting layer shown in FIG. 3 was provided by an offset printing method using the UV printing ink described in Table 1 above.
  • the UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.
  • Format printing (line, issuer name, issuer telephone number) was performed on the writing layer surface by offset printing.
  • the printing ink used was UV black ink, and the UV irradiation conditions during printing were equivalent to 200 mj using a high-pressure mercury lamp.
  • a second sheet member 2 was produced in the same manner as the second sheet member 1 except that a white, 188 ⁇ m-thick U2L98W product without an easy-adhesion layer treatment manufactured by Teijin Dupont Films Co., Ltd. was used.
  • FIG. 5 is a schematic configuration diagram showing an IC card base material manufacturing apparatus 80.
  • a second sheet member 5b back sheet, not shown
  • Cut into a sheet on which a plurality of cards are arranged is provided on the right hand side of the apparatus, and a long sheet-like first sheet member is provided downstream.
  • Sheet member 5a top sheet
  • the melted adhesive is supplied from the adhesive dissolution supply section 81 to the sheet bonding adhesive supply section 82b, and is applied to the second sheet member 5b supplied by the second sheet member supply section 83 by a T-die coating method.
  • the IC module having the electronic components shown in FIG. 2 on the formed adhesive layer 6b of the second sheet member 5b conveyed by the sheet conveying member 85 corresponds to the card arrangement from the ICZ fixing member supply unit 84. And placed.
  • the first sheet member 5a is also supplied with the melted adhesive from the sheet bonding adhesive supply section 82a by a T-die coating method.
  • the second sheet member 5b on which the adhesive is applied and on which the IC module is arranged is conveyed by the sheet conveying member 85, and is bonded to the first sheet member 5b by the heating Z pressure roll 86 to form a film.
  • An IC card base material having a thickness adjusted by the thickness control roll 87 is created, and is conveyed to the next cutting step (not shown) by the card base conveyance member 87.
  • Macroplast QR3460 manufactured by Hitachi Chemical Co., Ltd.
  • the IC card sheet “FT series” manufactured by Hitachi Maxell, Ltd. is laminated on the support, and the second sheet member is melted at 130 ° C on the support side of Sekisui Chemical Co., Ltd. Esdyne 2013MK was applied and bonded at 60 ° C while applying a pressure of 0.2 kg / cm 2 .
  • the IC card base material with the first sheet member cut in accordance with the second sheet member is further stored at 23 ° C. 55% for 10 days, and then cut with a roll cutter to make a 55 mm X 85 mm size IC card.
  • a substrate was obtained.
  • ID information was recorded on the image receiving layer side of the IC card substrate using an apparatus schematically shown in FIG. 6 or FIG.
  • the card base material supply unit 10 and the information recording unit 20 are arranged at an upper position, and the resin application unit 60 is arranged at a lower position.
  • a plurality of card base materials 50 that have been cut in a sheet shape in advance for writing personal information of the card user are used to receive a face photograph (authentication identification image).
  • a face photograph authentication identification image
  • the card base material 50 is automatically supplied one by one at a predetermined timing.
  • a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 for sublimation-type thermal transfer recording are arranged.
  • An image area having a gradation such as a face photograph of a card user is recorded in a predetermined area of the image receiving layer by thermal recording synchronized with the transport of the card base material 50.
  • a fusion type thermal transfer recording character ribbon cassette 31 and a thermal head 32 are arranged, and attribute information such as a name and a date of card issuance is recorded by thermal transfer to form an image recording layer.
  • a transfer foil cassette 61 is arranged in the resin application section 60, and a heat roller 62 is arranged corresponding to the transfer foil cassette 61.
  • a cured resin transfer foil 66 for forming a surface protective layer is set in the transfer foil cassette 61, and the transfer foil 66 is transferred to the transfer layer containing the cured protective layer. Is provided.
  • the card base material supply unit 10 and the information recording unit 20 have the same configuration, but the surface protective layer and the Z or optical change element transfer layer providing unit Z or the resin layer providing unit After that, the transparent protective layer and the Z or optical change element transfer layer providing section Z or the resin layer providing section 70 are further disposed.
  • a transfer foil cassette 71 is provided, and a heat roller 72 is provided corresponding to the transfer foil cassette 71. I have.
  • the optical change element transfer foils 43 and Z or the surface protection transfer foil 64 and the cured resin type transfer foil 66 are transferred to provide an optical change element transfer layer, a Z transparent protection transfer layer, and a transfer layer containing a cured type protection layer.
  • a coating liquid for forming an ink layer of the following composition to a thickness of 2 ⁇ m, dried and slit to obtain an ink ribbon.
  • Ethylene vinyl acetate copolymer [Mitsui DuPont Chemical: EV40Y] 1 part Carbon black 3 parts
  • the ink side of the melt-type thermal transfer recording ink ribbon is superimposed on the image receiving layer surface, and output from the ink ribbon side using a thermal head 0.5 WZ dots, pulse width 1. Om seconds, dot density 16 dots Heat at Zmm Thus, character information was formed on the image receiving layer.
  • the following transfer foil was prepared, and transferred by applying heat at a pressure of 150 kgZcm 2 for 1.2 seconds using a heat roller having a diameter of 5 cm and a rubber hardness of 85 heated to a surface temperature of 200 ° C.
  • the release layer was dried under the conditions of 90 ° C. and 30 ° C. after coating.
  • the actinic ray-curable compound after application is dried at 90 ° C for 30 sec.
  • Tuftex M 1913 (Asahi Kasei Corporation) 3 parts
  • the curing agent was cured at 50 ° C. for 24 hours.
  • An electronic component in which an IC chip and an antenna are integrated and has at least two areas of a strong area and a weak area between the first sheet member and / or the second sheet member and the adhesive layer. Therefore, it is possible to prevent the chip from being taken out due to the destruction of the card, thereby preventing the alteration.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Une carte à circuit intégré dans laquelle est fourni un composant électronique, dans lequel sont intégrées une puce à circuit intégré et une antenne, avec un agent adhésif entre celles-ci, entre un premier élément de feuille et un deuxième élément de feuille. La carte à circuit intégré a au moins deux régions dans lesquelles la force de séparation intercouche entre le premier élément de feuille et/ou le deuxième élément de feuille et l’agent adhésif est respectivement forte et faible.
PCT/JP2005/007294 2004-04-23 2005-04-15 Carte à circuit intégré et procédé pour la fabrication de celui-ci WO2005104026A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004129065 2004-04-23
JP2004-129065 2004-04-23

Publications (1)

Publication Number Publication Date
WO2005104026A1 true WO2005104026A1 (fr) 2005-11-03

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008067830A1 (fr) * 2006-12-05 2008-06-12 Hueck Folien Ges.M.B.H. Antenne rfid à manipulation sûre
WO2012159871A3 (fr) * 2011-05-24 2013-08-22 Leonhard Kurz Stiftung & Co. Kg Procédé et dispositif d'estampage à chaud

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS626763Y2 (fr) * 1981-06-11 1987-02-17
JPH10171962A (ja) * 1996-12-10 1998-06-26 Mitsubishi Chem Corp 非接触型ｉｃカード
JP2000105806A (ja) * 1998-09-29 2000-04-11 Toshiba Chem Corp ラベル状の非接触データキャリア
WO2003098545A1 (fr) * 2002-05-15 2003-11-27 Lintec Corporation Etiquette electronique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS626763Y2 (fr) * 1981-06-11 1987-02-17
JPH10171962A (ja) * 1996-12-10 1998-06-26 Mitsubishi Chem Corp 非接触型ｉｃカード
JP2000105806A (ja) * 1998-09-29 2000-04-11 Toshiba Chem Corp ラベル状の非接触データキャリア
WO2003098545A1 (fr) * 2002-05-15 2003-11-27 Lintec Corporation Etiquette electronique

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008067830A1 (fr) * 2006-12-05 2008-06-12 Hueck Folien Ges.M.B.H. Antenne rfid à manipulation sûre
WO2012159871A3 (fr) * 2011-05-24 2013-08-22 Leonhard Kurz Stiftung & Co. Kg Procédé et dispositif d'estampage à chaud
US9511619B2 (en) 2011-05-24 2016-12-06 Leonhard Kurz Stiftung & Co. Kg Method and device for hot stamping
EP3287296A1 (fr) * 2011-05-24 2018-02-28 Leonhard Kurz Stiftung & Co. KG Procédé et dispositif d'estampage à chaud

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