WO2000025358A1 - Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes - Google Patents
Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes Download PDFInfo
- Publication number
- WO2000025358A1 WO2000025358A1 PCT/FR1999/002613 FR9902613W WO0025358A1 WO 2000025358 A1 WO2000025358 A1 WO 2000025358A1 FR 9902613 W FR9902613 W FR 9902613W WO 0025358 A1 WO0025358 A1 WO 0025358A1
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- WO
- WIPO (PCT)
- Prior art keywords
- preforms
- bores
- gripping
- module
- balls
- Prior art date
Links
- 238000003860 storage Methods 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 46
- 239000011159 matrix material Substances 0.000 claims abstract description 34
- 238000000151 deposition Methods 0.000 claims description 12
- 239000012530 fluid Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 claims 1
- 238000012546 transfer Methods 0.000 description 29
- 230000005484 gravity Effects 0.000 description 13
- 230000008569 process Effects 0.000 description 9
- 239000011324 bead Substances 0.000 description 8
- 210000004027 cell Anatomy 0.000 description 7
- 230000006870 function Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
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- 230000009471 action Effects 0.000 description 1
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- 239000006071 cream Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 210000000352 storage cell Anatomy 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01073—Tantalum [Ta]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01094—Plutonium [Pu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0379—Stacked conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
Definitions
- the present invention finds its application in the field of electronics for the manufacture or repair of components having their inputs / outputs distributed on the lower and or upper surface of said component.
- the interconnections of these components in fact consist of spherical caps generally produced from spherical preforms or balls of tin-lead alloy. DESCRIPTION OF THE PRIOR ART
- the spherical caps constituting the interconnections are produced according to the following production range:
- the first operation in the transfer phase consists in placing the balls in an orderly manner in order to be able to deposit them collectively on the substrate, that is to say to have a ball opposite each reception area.
- Three families of techniques are used to order the balls correspondingly to the arrangement of the reception areas of the component (s):
- - Vacuum technique It consists in taking by suction by means of a gripper the balls which are arranged in bulk in a tray. When all the available positions have sucked up a ball, they are transferred simultaneously by means of said gripper to said substrate.
- Gravity-filled imprint technique This consists of filling cells corresponding to the design of the substrate to be billed. As soon as each cell has a ball, the transfer operation is carried out.
- the direct modes in which the transfer operation is carried out by a transfer device such as a bulk storage module associated with a stencil distributing the preforms directly on the substrate, or such as a preform storage device making passages over storage cells so that a preform is placed in each cell, the substrate facing the filled cells so that the preforms adhere to the reception areas provided for this purpose
- a transfer device such as a bulk storage module associated with a stencil distributing the preforms directly on the substrate, or such as a preform storage device making passages over storage cells so that a preform is placed in each cell, the substrate facing the filled cells so that the preforms adhere to the reception areas provided for this purpose
- indirect modes such as the technique of the suction gripping means described above which is inserted between the bulk storage module and the substrate.
- the storage module does not constitute an element of a transfer module but a module independent of the gripping module.
- a device for direct transfer of the preforms is described in international application No. WO 98/43307, the latter consisting of a module for storing the preforms associated with a module for positioning the substrate.
- a guide and positioning means is interposed between the storage module and the positioning module so that, when the transfer module is turned upside down, the first balls guided and positioned by the positioning module come into contact with the reception areas provided on the substrate.
- Another direct reporting device is described in Japanese document No. 9-97793. This device consists for its part of a preform storage module associated with a transfer module of the parallel stencil type below which the substrate to be billed is positioned.
- This transfer device is remarkable in that a means for guiding and positioning the preforms is interposed between the loose balls and the transfer stencil module.
- this interposition of a device solves part of the problems of routing the balls to the transfer module, the problem of micro-chips is still present due to the vibration imparted to cause the balls to descend (gravity, being the force bringing the balls to the level of stencils).
- the gain in duration in the cycle time is not significant in comparison with a cycle time of a device using the parallel stencil technique. Beyond a certain rate all the balls do not fall into the cells because they undergo lateral stresses, which affects the quality.
- An indirect transfer device is described in Japanese patent no. 6-7254.
- This device consists of a storage matrix along three axes of preforms whose positions along two first axes correspond to the position of the receiving areas of the substrate and define the coordinates of the axes of storage bores formed in said matrix in which are rows the preforms.
- the gripping module adopting suction holes resuming the positioning of the reception areas, comes opposite with the high end of said matrix to ensure the taking of the preforms which are in the stowed position to then transfer them to a substrate.
- the main characteristic of this device for providing balls in the form of collective storage is that it is associated with a step-by-step thrust module for the balls consisting of rods inserted into the bores at the end. bottom of said matrix.
- this device makes it possible to propose in the context of an indirect mode an intermediate collective storage phase of the preforms, the provision of said preforms at the level of the gripping module, that is to say at the level of the upper end of the matrix, is not particularly effective.
- the number of preforms per bore varies.
- the height of the columns of preforms in each bore varies which has the consequence that the first intake of preforms by the gripping module may not be complete since certain ends of the columns formed by the preforms will not reach the upper end of the matrix so that the upper ball is made available to the gripping module.
- the thrust module ensuring the provision is constituted by rods which press the balls onto the module gripping to make them available to the latter causing a constraint mechanical on the latter, a constraint which may constitute the cause of the creation of micro-chips or of the deformation of the balls.
- Such a deformation would have the effect of shifting the stroke made by the rods and the stroke necessary to make the balls of the same layer available.
- the implementation of metal rods adopting a translational movement step by step (the pitch corresponding to the diameter of the balls) is all the more difficult as the diameter of the balls decreases.
- such a device may not be applicable for certain diameters.
- the tolerances for positioning the rods inside the bores and those corresponding to the length of the latter, lengths of bores relative to the diameter of the balls make such a thrust module difficult to enforce.
- the storage matrix does not constitute an independent device because the latter comprises the same openings at the top and bottom ends requiring the presence of the push module, ie rods at the lower end of bores.
- This characteristic obliges the thrust module to wait until the matrix with which it is associated is filled to enter into action, the filling thus becoming a series operation compared to the provisioning operation which decreases the rate of the process of manufacturing using such a device.
- this device implements an indirect mode method, it does not allow operations to be carried out in hidden time.
- an object of the invention is to propose, within the framework of a method according to an indirect mode, a device allowing the performance of certain operations in hidden time and in particular the operation consisting in passing the preforms from a state bulk storage to a stored storage state.
- Another object of the invention is to propose, always within the framework of a method according to an indirect mode, an optimal solution for carrying out the collective and simultaneous passage of a group of preforms, from an ordered and stable state to the interior of a storage matrix in an orderly, stable and available state for a gripping module.
- the invention relates to a device making it possible to implement a method of depositing on a substrate beads or interconnection preforms of the type ensuring that the following phases:
- This device is remarkable in that it consists of at least one storage matrix along three axes of preforms whose positions along two first axes correspond to the position of the receiving areas of the substrate and define the coordinates of the axes of bores storage arranged in said matrix in which are stored said preforms, said bores being open on a first end so as to allow the passage of said preforms and comprising a closure means on their second end not allowing the passage of the balls so that a bulk preform storage module can punctually face to face with the open ends of said bores so as to fill the latter, said preforms abutting on said closure means at said second end of said bores.
- This device and the matrix characterizing it make it possible to interpose between the bulk storage operations and the gripping, an independent collective storage operation of the preforms corresponding to a plurality of substrates so that the gripper only performs the operation. movement and removal and no longer the storage operation.
- the ability to make this transition from a bulk storage state to a stored storage state independent has the advantage of allowing this operation to be carried out in hidden time.
- the Applicant has endeavored to physically decompose the operations, in accordance with a process according to an indirect mode, and to add an operation to an already known process not only so that the gripper simply performs the gripping operation and not the storage operation but also that this added operation does not strike but on the contrary decreases the cycle time.
- the result of such a breakdown of functions is that the storage and arrangement operations are prepared in advance and the gripper only implements a gripping and depositing operation and no longer a gripping operation / storage and removal. Since the gripping / storage operation constituted 90% of the cycle time of the preform transfer phase, the breakdown of functions by the interposition of an independent collective storage phase corresponding to a plurality of substrates makes it possible to reduce considerably the time necessary for a good grip, the gripper can thus achieve its gripping and depositing movement very quickly.
- This device therefore makes it possible to use the maximum laying potential of the transfer machines and to order the balls in masked time, which makes it possible to overcome the positioning hazards and the additional cycle time that this implies.
- the device of the invention therefore constitutes the perfect match for the optimization in parallel of the qualitative and quantitative aspects of a process for depositing interconnection preforms on a substrate.
- FIG. 1 represents a technique of the prior art for transferring beads onto a substrate in direct mode according to the method of parallel stencils
- - Figure 2 shows another technique of the prior art for transferring beads onto a substrate in indirect mode according to the vacuum gripping method
- - Figure 3 shows another technique of the prior art for transferring beads onto a substrate in direct mode using the gravity-filled imprint method
- - Figure 4 is a sectional view of an embodiment of the collective storage device, object of the present invention during the filling phase
- - Figure 5 shows another possibility of implementation of the device according to this invention, particularly suitable for reballing components during repairs,
- - Figure 6a is a sectional view of another embodiment of the device of the invention in the filling phase
- - Figure 6b is a sectional view of the embodiment of the device of Figure 6a in the filling phase available balls
- FIG. 7a is a top view of another embodiment of the device for providing balls of the invention in the filling phase
- FIG. 7b is a sectional view of the embodiment of FIG. 7a in the phase of making available the balls
- FIG. 8a is a top view of another embodiment of the device for providing the ball
- - Figure 8b is a sectional view of the embodiment of Figure 8a
- Figure 8c is another sectional view of the embodiment of Figure 8a illustrating another possibility of this embodiment.
- FIG. 1 is shown the implementation of the transfer operation of balls or preforms 1 according to the previous method of parallel stencils.
- the reception areas 3 of the substrate 2 have previously been subject to fluxing or depositing of soldering cream.
- the preforms 1 are placed in bulk in a container 6 and under the effect of gravity, the openings 8 of the first stencil 4 which are opposite the reception areas 3 will admit a ball.
- the second stencil 5 is displaced in the direction E by the value of half an interconnection pitch, so that its openings 7 are aligned with the reception areas 3 and the openings 8.
- the balls 1 previously in the housings 8 will fall on the reception areas 3.
- the stencil 4 is shifted by the value of half a step in the direction opposite to E and the substrate 2 ball is removed by replacing it with a new substrate 2 and so on.
- FIG. 2 is shown the implementation of the ball transfer operation by indirect mode according to the vacuum gripping method, as practiced in the prior art.
- FIG. 3 the implementation of the ball transfer operation is shown according to the method of imprints filled by gravity such that 'it is practiced in the prior art.
- a slide 12 having housings 13 which correspond to the receiving areas of the substrate is positioned in the initial state of such so that the housings 13 are located below the container 6 filled with loose balls 1.
- the slide is moved in the direction opposite to F so that the filled housing is found in front of the substrate to be billed which has been previously fluxed.
- the balls present in the housings 13 are removed by an alternating movement G then the operation is repeated for a new substrate.
- Figure 4 is a sectional representation of a device 14 according to the present invention in the loading phase from a container 6 of loose beads.
- the device 14 is a matrix whose positions X and Y correspond to the reception areas of the substrate to be billed. Each of these positions corresponds to a bore 15 perpendicular to the plane X Y and which is parallel to the plane of the substrate to be billed. As illustrated, the device consists of a matrix, the depth of the bores 15 of which allows the storage of a plurality of preforms.
- the bores 15 have a diameter corresponding to the diameter of the balls plus an operating clearance which allows the balls to slide freely along the Z axis but sufficiently small so that the balls remain stacked on each other.
- the balls are filled in the device 14 by gravity from the container 6, the underside 17 of the matrix constituting the device 14 being closed. When the device is filled, the full device 14 is replaced by another empty device. Indeed, it must be understood that the containing 6 constituting the storage module comes punctually above the device 14 and dissociates from it as soon as the matrix is filled unlike the devices of the prior art implementing direct transfer methods whose main characteristics reside in particular in the permanent association of a matrix to the storage module or to devices implementing indirect transfer methods, the main characteristics of which reside in particular in the permanent association of a matrix with a thrust module.
- each device can be assimilated to a refillable packaging making it possible to bill N substrates, N being the number of balls that can be stacked in the device.
- the filling operation can be done on an autonomous station which can supply several transfer machines.
- the device 14 consists of at least one matrix whose depth of the bores 15 allows the storage of a plurality of preforms 1, said bores 15 comprising a first open end with which faces each other, the gripping zones of said gripper 9 and a second end comprising a module for pushing said preforms 1 towards the gripping zone, said module thrust being constituted by an inlet of compressed fluid ensuring a push at least punctually on the preforms 1 rows so that all of the preforms 1 rows in each bore 15, is driven by a translational movement bringing into contact the preform 1 closest to the first end with the corresponding gripping zone of the gripper 9 when this d ernier is presented in front to present successive layers of preforms 1 as they are gripped.
- this embodiment also makes it possible to make available a layer of preforms at the first end regardless of the number of preforms 1 present in the bores 15 and therefore whatever the height formed by the preforms. This characteristic makes it possible to no longer take account of the minimum tolerance required in the case of a stepwise advance of the preforms, which facilitates and reduces the cost of the thrust module.
- the bores 15 of the devices 14 are filled by gravity by their free ends by means of a storage module 6.
- each device 14 is associated at the second ends of the bores 15, a thrust chamber 20 supplied by a nozzle 21.
- a jet of fluid for example (example of air) is produced at the level of the nozzle 21 linked to the chamber 20 situated below the die with which the gripper came opposite, which allows the gripper to have punctually at its gripping housings of a preform 1 regardless of the number of preforms present in each bore.
- the device 14 is advantageously constituted by:
- At least one filling station provided by a tank 6 for bulk storage of the preforms 1 coming opposite with the first ends of the bores 15 of the dies passing below,
- the plate 22 ensuring an angular rotation step by step so as to pass the empty dies at the filling station and the filled dies at the gripping station.
- the closure means is constituted by bores whose second ends end in throttles allowing air to pass but not the balls
- said plate 22 is associated with a fixed disc which comes, during the rotation of the rotating disc, to close the second end of the bores 15 thus constituting a total sealing means during the filling phase and partial during the gripping phase in order to put in correspondence, said second ends with said chambers 20 and allow a fluid to come punctually to raise the preforms 1 inside their storage bore 15 so as to make the preforms available to the gripper coming opposite the first ends as they are gripped.
- a fixed storage module 6 is placed at 180 ° from the gripping station.
- said fixed plate can be preformed with windows allowing the balls to pass through the second end, thus creating a phase of purging of the dies that have just been used in gripping mode, this phase purging is all the more important that the user of the device may consider for safety to carry out n gripping of the available layers of preforms in the matrix, n corresponding to a number less than N the number of layers capable of being received so optimal by the matrix.
- FIG. 5 illustrates another form of implementation of the device 14 according to the invention which is particularly suitable for reballing components in the context of repair.
- the implementation shown in FIG. 5 is a combination of the vacuum technique and the gravity technique both described above.
- the device 14 which is the subject of the invention, whose bores 15 in this case have a first open end with which the gripping zones of said gripper face each other and a second non-gripping end. opening, has bores 15 not opening on one of the two faces and which contains preforms 1.
- the function the sealing means is here ensured by the fact that the bores have been produced without passing through the die. The same function could have been achieved by a matrix pierced right through and closed at one end by a plate as illustrated in FIG. 4.
- the device 14 is filled by gravity from a container of loose beads 6. When the collective storage device 14 is completely filled, the container 6 and the excess of beads which are on the open surface of the device are removed.
- FIG. 7a and 7b Another embodiment of the device of the invention adopting a formed matrix of bores 15 closed at least partially at one end, is illustrated in Figures 7a and 7b.
- the device 14 consists of a plurality of dies, the depth of the bores 15 of which allows them to store a single preform 1 per bore 15.
- This embodiment has the advantage of avoiding all the devices and methods necessary for the constant availability of the preforms stored inside a bore such as the thrust module mentioned above. Storage by means of a passage of the storage module 6 on the devices 14 for the purpose of filling the said bores 15 which can only contain a preform can only be envisaged from the moment when the operation of gripping and removal is carried out by another independent module authorizing the performance of said operation in hidden time.
- the device 14 is here remarkable in that it is constituted by a plate 22 comprising a plurality of dies arranged according to a plan mark and by a filling module 6 covering several dies by its surface in contact with said plate 22 and passing above of the latter so as to fill them, a gripping module then coming to ensure the gripping of the preforms 1 according to a movement corresponding to the arrangement mark of said dies.
- a bulk storage module 6 for preforms 1 is applied above a device 14 comprising a plurality of dies, the filling being carried out by gravity.
- a gripper 9 comes to take the preforms already stored for the purpose of depositing the latter on a substrate.
- This embodiment in fact constitutes the horizontal development of the previous embodiment describing bores 15 capable of containing N preforms.
- the device 14 consists of N matrices but solves the aforementioned drawbacks and does not affect the cycle time since the filling operations are carried out in hidden time and the movements of the gripping module 9 are conventionally programmable and extremely rapid.
- the second end of said bores 15 is closed so as to retain said preforms 1 while allowing the passage of air.
- this embodiment does not require the use of a thrust module, the passage of air allows the preform to be sucked by the gripping means while the absence of any opening at the second end could result in the creation of a vacuum in the bore without gripping the preform 1.
- the embodiment of the device adopting the turntable can be adapted and is illustrated in Figures 8a and 8c.
- the applicant does not want to limit itself to a single type of preforms and provides that the device and the method can be adapted to all types, in particular cylindrical preforms.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU63468/99A AU6346899A (en) | 1998-10-27 | 1999-10-27 | Device for providing balls or preforms for making flip-chip connections |
KR1020017005187A KR20010080904A (ko) | 1998-10-27 | 1999-10-27 | 플립 칩 결합을 형성하는 볼 또는 프리폼 공급장치 |
JP2000578846A JP2002528912A (ja) | 1998-10-27 | 1999-10-27 | フリップチップ接続を形成するためのボールまたはプリホームを供給する装置 |
EP99950846A EP1125325A1 (fr) | 1998-10-27 | 1999-10-27 | Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes |
CA002348724A CA2348724A1 (fr) | 1998-10-27 | 1999-10-27 | Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes |
US09/830,201 US6533160B1 (en) | 1998-10-27 | 1999-10-27 | Device for providing balls or preforms for making flip-chip connections |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR98/13424 | 1998-10-27 | ||
FR9813424A FR2785140B1 (fr) | 1998-10-27 | 1998-10-27 | Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000025358A1 true WO2000025358A1 (fr) | 2000-05-04 |
Family
ID=9532013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR1999/002613 WO2000025358A1 (fr) | 1998-10-27 | 1999-10-27 | Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes |
Country Status (8)
Country | Link |
---|---|
US (1) | US6533160B1 (fr) |
EP (1) | EP1125325A1 (fr) |
JP (1) | JP2002528912A (fr) |
KR (1) | KR20010080904A (fr) |
AU (1) | AU6346899A (fr) |
CA (1) | CA2348724A1 (fr) |
FR (1) | FR2785140B1 (fr) |
WO (1) | WO2000025358A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2844733A1 (fr) * | 2002-09-25 | 2004-03-26 | Novatec Sa Soc | Procede de mise a disposition de billes ou preformes en vue de leur prehension et depose de facon individuelle |
US7032306B1 (en) | 1999-02-05 | 2006-04-25 | Societe Novatec S.A. | Method for producing module |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6268275B1 (en) | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
JP3803556B2 (ja) * | 2001-03-26 | 2006-08-02 | 日本電気株式会社 | ボール転写装置およびボール整列装置 |
KR100683450B1 (ko) * | 2005-03-29 | 2007-02-20 | 치엔 흐신-펭 | 전자 부품을 파지하기 위한 파지 장치 |
JP4560682B2 (ja) * | 2005-04-28 | 2010-10-13 | 澁谷工業株式会社 | 導電性ボール搭載装置 |
US7946470B2 (en) * | 2005-12-30 | 2011-05-24 | Semx Corporation | Method for depositing solder material on an electronic component part using separators |
JP4503053B2 (ja) * | 2007-07-24 | 2010-07-14 | 新光電気工業株式会社 | 導電性ボールの搭載装置および搭載方法 |
JP2010212659A (ja) * | 2009-02-10 | 2010-09-24 | Hioki Ee Corp | 球状体吸着装置、球状体搭載装置、球状体吸着方法、球状体搭載方法、球状体搭載済基板および電子部品搭載済基板 |
JP5997136B2 (ja) * | 2010-05-03 | 2016-09-28 | ア レイモン エ シーA. Raymond Et Cie | 基板まで接着要素を運ぶために摘んで接合する方法及び装置 |
US8955735B2 (en) * | 2013-05-17 | 2015-02-17 | Zen Voce Corporation | Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuit |
US9120170B2 (en) * | 2013-11-01 | 2015-09-01 | Zen Voce Corporation | Apparatus and method for placing and mounting solder balls on an integrated circuit substrate |
CN104174956B (zh) * | 2014-06-26 | 2016-04-20 | 京东方科技集团股份有限公司 | 一种电子器件焊接过程中的对位机构及焊接装置 |
JP6567290B2 (ja) * | 2015-02-20 | 2019-08-28 | Aiメカテック株式会社 | 基板処理装置、基板処理システム、及び基板処理方法 |
US10369648B2 (en) * | 2017-01-13 | 2019-08-06 | Horng Terng Automation Co., Ltd. | Guiding board for a ball placement machine |
SG10201701738VA (en) * | 2017-03-03 | 2018-10-30 | Aurigin Tech Pte Ltd | Apparatus And Method For Filling A Ball Grid Array |
CN107601050B (zh) * | 2017-10-10 | 2023-06-23 | 深圳孔雀科技开发有限公司 | 一种用于真空玻璃支撑柱定位排布的装置及方法 |
CN110534451A (zh) * | 2018-05-25 | 2019-12-03 | 唐虞企业股份有限公司 | 一种导电端子置件设备及其导电端子置件方法 |
KR20210101357A (ko) * | 2020-02-07 | 2021-08-19 | 삼성전자주식회사 | 볼 배치 시스템 및 기판 상에 볼을 배치하는 방법 |
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EP0588609A1 (fr) * | 1992-09-15 | 1994-03-23 | Texas Instruments Incorporated | Contact à billes pour dispositifs à puces inversées |
EP0603623A2 (fr) * | 1992-12-23 | 1994-06-29 | International Business Machines Corporation | Jonction de couches et circuit imprimé multicouche |
JPH0997793A (ja) * | 1995-09-29 | 1997-04-08 | Matsushita Electric Ind Co Ltd | 導電性ボールの搭載装置および搭載方法およびバンプの形成方法 |
WO1998043307A2 (fr) * | 1997-03-21 | 1998-10-01 | Siemens Aktiengesellschaft | Dispositif permettant d'implanter des composants bga par des globules de brasage |
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JPH067254A (ja) | 1992-06-23 | 1994-01-18 | Murata:Kk | 連続焼物器の温度制御装置 |
JPH07212023A (ja) | 1994-01-26 | 1995-08-11 | Matsushita Electric Works Ltd | 半田ボール供給方法及びその半田ボール供給方法に用いる半田ボール供給治具 |
US6253992B1 (en) * | 1998-03-18 | 2001-07-03 | Tessera, Inc. | Solder ball placement fixtures and methods |
US6325272B1 (en) * | 1998-10-09 | 2001-12-04 | Robotic Vision Systems, Inc. | Apparatus and method for filling a ball grid array |
JP3283026B2 (ja) * | 1999-04-30 | 2002-05-20 | 新光電気工業株式会社 | ボール状端子の吸着装置及びボール状端子の搭載方法 |
-
1998
- 1998-10-27 FR FR9813424A patent/FR2785140B1/fr not_active Expired - Fee Related
-
1999
- 1999-10-27 AU AU63468/99A patent/AU6346899A/en not_active Abandoned
- 1999-10-27 EP EP99950846A patent/EP1125325A1/fr not_active Withdrawn
- 1999-10-27 US US09/830,201 patent/US6533160B1/en not_active Expired - Fee Related
- 1999-10-27 CA CA002348724A patent/CA2348724A1/fr not_active Abandoned
- 1999-10-27 KR KR1020017005187A patent/KR20010080904A/ko not_active Application Discontinuation
- 1999-10-27 JP JP2000578846A patent/JP2002528912A/ja active Pending
- 1999-10-27 WO PCT/FR1999/002613 patent/WO2000025358A1/fr not_active Application Discontinuation
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EP0588609A1 (fr) * | 1992-09-15 | 1994-03-23 | Texas Instruments Incorporated | Contact à billes pour dispositifs à puces inversées |
US5849132A (en) * | 1992-09-15 | 1998-12-15 | Texas Instruments Incorporated | Ball contact for flip-chip devices |
EP0603623A2 (fr) * | 1992-12-23 | 1994-06-29 | International Business Machines Corporation | Jonction de couches et circuit imprimé multicouche |
JPH0997793A (ja) * | 1995-09-29 | 1997-04-08 | Matsushita Electric Ind Co Ltd | 導電性ボールの搭載装置および搭載方法およびバンプの形成方法 |
WO1998043307A2 (fr) * | 1997-03-21 | 1998-10-01 | Siemens Aktiengesellschaft | Dispositif permettant d'implanter des composants bga par des globules de brasage |
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PATENT ABSTRACTS OF JAPAN vol. 097, no. 008 29 August 1997 (1997-08-29) * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7032306B1 (en) | 1999-02-05 | 2006-04-25 | Societe Novatec S.A. | Method for producing module |
FR2844733A1 (fr) * | 2002-09-25 | 2004-03-26 | Novatec Sa Soc | Procede de mise a disposition de billes ou preformes en vue de leur prehension et depose de facon individuelle |
Also Published As
Publication number | Publication date |
---|---|
FR2785140B1 (fr) | 2007-04-20 |
KR20010080904A (ko) | 2001-08-25 |
CA2348724A1 (fr) | 2000-05-04 |
EP1125325A1 (fr) | 2001-08-22 |
FR2785140A1 (fr) | 2000-04-28 |
AU6346899A (en) | 2000-05-15 |
US6533160B1 (en) | 2003-03-18 |
JP2002528912A (ja) | 2002-09-03 |
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