TWI733546B - 基板處理裝置 - Google Patents
基板處理裝置 Download PDFInfo
- Publication number
- TWI733546B TWI733546B TW109126762A TW109126762A TWI733546B TW I733546 B TWI733546 B TW I733546B TW 109126762 A TW109126762 A TW 109126762A TW 109126762 A TW109126762 A TW 109126762A TW I733546 B TWI733546 B TW I733546B
- Authority
- TW
- Taiwan
- Prior art keywords
- mentioned
- substrate processing
- piping
- liquid
- processing apparatus
- Prior art date
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- 238000012545 processing Methods 0.000 title claims abstract description 468
- 239000000758 substrate Substances 0.000 title claims abstract description 342
- 239000007788 liquid Substances 0.000 claims abstract description 628
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 240
- 239000003814 drug Substances 0.000 claims abstract description 214
- 239000002245 particle Substances 0.000 claims description 186
- 238000000034 method Methods 0.000 claims description 25
- 238000001514 detection method Methods 0.000 claims description 21
- 238000004891 communication Methods 0.000 claims description 15
- 238000012546 transfer Methods 0.000 claims description 15
- 238000007599 discharging Methods 0.000 claims description 13
- 125000004122 cyclic group Chemical group 0.000 claims description 11
- 230000002159 abnormal effect Effects 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 190
- 208000028659 discharge Diseases 0.000 description 61
- 239000000243 solution Substances 0.000 description 58
- 238000012423 maintenance Methods 0.000 description 56
- 238000010586 diagram Methods 0.000 description 46
- 238000007872 degassing Methods 0.000 description 23
- 238000005259 measurement Methods 0.000 description 23
- 239000012530 fluid Substances 0.000 description 22
- 230000007704 transition Effects 0.000 description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 230000032258 transport Effects 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 239000002585 base Substances 0.000 description 8
- 238000011010 flushing procedure Methods 0.000 description 8
- 239000008155 medical solution Substances 0.000 description 8
- 238000011109 contamination Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000011148 porous material Substances 0.000 description 6
- 230000007480 spreading Effects 0.000 description 6
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- 230000008859 change Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 230000000717 retained effect Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 238000011068 loading method Methods 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
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- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- DKAGJZJALZXOOV-UHFFFAOYSA-N hydrate;hydrochloride Chemical compound O.Cl DKAGJZJALZXOOV-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000007562 laser obscuration time method Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
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- 238000001179 sorption measurement Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D36/00—Filter circuits or combinations of filters with other separating devices
- B01D36/001—Filters in combination with devices for the removal of gas, air purge systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0031—Degasification of liquids by filtration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/11—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with bag, cage, hose, tube, sleeve or like filtering elements
- B01D29/31—Self-supporting filtering elements
- B01D29/35—Self-supporting filtering elements arranged for outward flow filtration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
- B01D35/02—Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019172455A JP7312656B2 (ja) | 2019-09-24 | 2019-09-24 | 基板処理装置 |
| JP2019-172455 | 2019-09-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202114099A TW202114099A (zh) | 2021-04-01 |
| TWI733546B true TWI733546B (zh) | 2021-07-11 |
Family
ID=75156351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109126762A TWI733546B (zh) | 2019-09-24 | 2020-08-07 | 基板處理裝置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7312656B2 (ja) |
| KR (1) | KR102391794B1 (ja) |
| CN (1) | CN112619272B (ja) |
| TW (1) | TWI733546B (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI853611B (zh) * | 2022-09-21 | 2024-08-21 | 日商斯庫林集團股份有限公司 | 基板處理裝置 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6994438B2 (ja) | 2018-07-11 | 2022-01-14 | 信越化学工業株式会社 | 架橋型有機ケイ素樹脂及びその製造方法、ならびに化粧料 |
| WO2022215497A1 (ja) * | 2021-04-08 | 2022-10-13 | 株式会社Ｓｃｒｅｅｎホールディングス | 処理液流通方法、及び、処理液供給装置 |
| AU2021455544A1 (en) * | 2021-07-13 | 2023-10-26 | Chiyoda Corporation | Management system, management method, and management program |
| KR20230038866A (ko) * | 2021-09-13 | 2023-03-21 | 세메스 주식회사 | 기판 처리 방법 및 기판 처리 장치 |
| KR102657375B1 (ko) * | 2021-12-30 | 2024-04-12 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
| JP2023141806A (ja) | 2022-03-24 | 2023-10-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 循環装置、循環装置の制御方法 |
| JP2023142369A (ja) | 2022-03-25 | 2023-10-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 循環装置、循環装置の制御方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200411078A (en) * | 2002-12-19 | 2004-07-01 | Dainippon Screen Mfg | Plating apparatus and plating method |
| TW200741839A (en) * | 2005-11-21 | 2007-11-01 | Dainippon Screen Mfg | Substrate treating apparatus |
| TW201911400A (zh) * | 2017-07-28 | 2019-03-16 | 日商斯庫林集團股份有限公司 | 處理液除電方法、基板處理方法以及基板處理系統 |
| TW201936274A (zh) * | 2017-11-15 | 2019-09-16 | 日商斯庫林集團股份有限公司 | 基板處理方法及基板處理裝置 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH597894A5 (ja) * | 1975-11-24 | 1978-04-14 | Charles Doucet | |
| US5239861A (en) * | 1988-12-23 | 1993-08-31 | Kabushiki Kaisha Komatsu Seisakusho | Device for indicating contamination degree of hydraulic circuit and method of judging the contamination degree |
| JPH04192524A (ja) * | 1990-11-27 | 1992-07-10 | Nec Yamagata Ltd | 半導体装置の製造装置 |
| KR0141059B1 (ko) * | 1993-09-20 | 1998-06-01 | 코사이 아키오 | 액체공급시스템 액체공급방법 |
| JPH10184961A (ja) * | 1996-12-19 | 1998-07-14 | Sony Corp | 液体処理装置 |
| JP2003215002A (ja) * | 2002-01-17 | 2003-07-30 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
| EP1520612A1 (en) * | 2003-09-30 | 2005-04-06 | PTI Technologies, Inc. | Hydraulic filter assembly with priority valve |
| JP4377295B2 (ja) * | 2004-07-28 | 2009-12-02 | 東京エレクトロン株式会社 | 処理方法及び処理システム |
| CN100483621C (zh) * | 2006-03-22 | 2009-04-29 | 大日本网目版制造株式会社 | 基板处理装置和基板处理方法 |
| JP2008080193A (ja) * | 2006-09-26 | 2008-04-10 | Fujitsu Ltd | 濾過システム及び濾過方法 |
| JP5977058B2 (ja) * | 2012-03-28 | 2016-08-24 | 株式会社Ｓｃｒｅｅｎホールディングス | 処理液供給装置および処理液供給方法 |
| GB2515533A (en) * | 2013-06-27 | 2014-12-31 | Vetco Gray Controls Ltd | Monitoring a hydraulic fluid filter |
| JP5893592B2 (ja) * | 2013-08-23 | 2016-03-23 | 東京エレクトロン株式会社 | 液処理装置 |
| JP6385714B2 (ja) * | 2014-05-16 | 2018-09-05 | 東京エレクトロン株式会社 | 基板液処理装置、基板液処理装置の洗浄方法及び記憶媒体 |
| JP6223906B2 (ja) * | 2014-05-19 | 2017-11-01 | 東京エレクトロン株式会社 | 処理液交換方法および液処理装置 |
| JP2016189386A (ja) * | 2015-03-30 | 2016-11-04 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| JP6959743B2 (ja) * | 2017-02-22 | 2021-11-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| JP6916633B2 (ja) * | 2017-02-24 | 2021-08-11 | 株式会社Ｓｃｒｅｅｎホールディングス | 処理液供給装置、基板処理装置、および処理液供給方法 |
| JP6817860B2 (ja) * | 2017-03-21 | 2021-01-20 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP6861553B2 (ja) * | 2017-03-24 | 2021-04-21 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| CN110520965B (zh) * | 2017-04-06 | 2023-06-02 | 东京毅力科创株式会社 | 供液装置和供液方法 |
| JP6983008B2 (ja) * | 2017-08-28 | 2021-12-17 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
-
2019
- 2019-09-24 JP JP2019172455A patent/JP7312656B2/ja active Active
-
2020
- 2020-08-07 TW TW109126762A patent/TWI733546B/zh active
- 2020-08-17 CN CN202010823739.8A patent/CN112619272B/zh active Active
- 2020-09-04 KR KR1020200112959A patent/KR102391794B1/ko active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200411078A (en) * | 2002-12-19 | 2004-07-01 | Dainippon Screen Mfg | Plating apparatus and plating method |
| TW200741839A (en) * | 2005-11-21 | 2007-11-01 | Dainippon Screen Mfg | Substrate treating apparatus |
| TW201911400A (zh) * | 2017-07-28 | 2019-03-16 | 日商斯庫林集團股份有限公司 | 處理液除電方法、基板處理方法以及基板處理系統 |
| TW201936274A (zh) * | 2017-11-15 | 2019-09-16 | 日商斯庫林集團股份有限公司 | 基板處理方法及基板處理裝置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI853611B (zh) * | 2022-09-21 | 2024-08-21 | 日商斯庫林集團股份有限公司 | 基板處理裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021052038A (ja) | 2021-04-01 |
| JP7312656B2 (ja) | 2023-07-21 |
| KR20210035738A (ko) | 2021-04-01 |
| KR102391794B1 (ko) | 2022-04-28 |
| CN112619272A (zh) | 2021-04-09 |
| CN112619272B (zh) | 2022-12-20 |
| TW202114099A (zh) | 2021-04-01 |
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