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TWI518195B - 陰極 - Google Patents

陰極 Download PDF

Info

Publication number
TWI518195B
TWI518195B TW100142792A TW100142792A TWI518195B TW I518195 B TWI518195 B TW I518195B TW 100142792 A TW100142792 A TW 100142792A TW 100142792 A TW100142792 A TW 100142792A TW I518195 B TWI518195 B TW I518195B
Authority
TW
Taiwan
Prior art keywords
base material
target
main surface
backing plate
disposed
Prior art date
Application number
TW100142792A
Other languages
English (en)
Chinese (zh)
Other versions
TW201241212A (en
Inventor
佐藤善勝
大野哲宏
大空弘樹
佐藤重光
Original Assignee
愛發科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 愛發科股份有限公司 filed Critical 愛發科股份有限公司
Publication of TW201241212A publication Critical patent/TW201241212A/zh
Application granted granted Critical
Publication of TWI518195B publication Critical patent/TWI518195B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H01J37/3429—Plural materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
TW100142792A 2011-04-15 2011-11-22 陰極 TWI518195B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011091188 2011-04-15

Publications (2)

Publication Number Publication Date
TW201241212A TW201241212A (en) 2012-10-16
TWI518195B true TWI518195B (zh) 2016-01-21

Family

ID=47009003

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100142792A TWI518195B (zh) 2011-04-15 2011-11-22 陰極

Country Status (5)

Country Link
JP (1) JP5721817B2 (ja)
KR (1) KR101515048B1 (ja)
CN (1) CN103314129B (ja)
TW (1) TWI518195B (ja)
WO (1) WO2012140804A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7362327B2 (ja) * 2019-07-18 2023-10-17 東京エレクトロン株式会社 ターゲット構造体及び成膜装置
KR20220148254A (ko) * 2020-09-17 2022-11-04 가부시키가이샤 아루박 스퍼터 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4049341B2 (ja) * 1996-12-18 2008-02-20 大日本印刷株式会社 スパッタ装置
JP3898318B2 (ja) * 1997-12-25 2007-03-28 松下電器産業株式会社 スパッタリング装置
JP4071520B2 (ja) * 2002-03-29 2008-04-02 キヤノンアネルバ株式会社 スパッタリング装置
JP2006233240A (ja) * 2005-02-22 2006-09-07 Canon Inc スパッタ用カソード及びスパッタ装置

Also Published As

Publication number Publication date
WO2012140804A1 (ja) 2012-10-18
KR20130109218A (ko) 2013-10-07
JPWO2012140804A1 (ja) 2014-07-28
TW201241212A (en) 2012-10-16
JP5721817B2 (ja) 2015-05-20
CN103314129A (zh) 2013-09-18
KR101515048B1 (ko) 2015-04-24
CN103314129B (zh) 2015-05-20

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