TWI432305B - A method for dividing a brittle material substrate with resin - Google Patents

Description

Method for dividing a brittle material substrate with resin

The present invention relates to a method of dividing a brittle material substrate, and more particularly to a method of dividing a ceramic substrate followed by a resin.

A substrate for brittle materials (including main surfaces) composed of ceramics and other brittle materials such as LTCC (Low Temperature Co-fired Ceramics) or HTCC (High Temperature Co-fired Ceramics) There are various methods for dividing and cutting out a plurality of divided single pieces, or a substrate in which an electric circuit or the like is formed. For example, there is a well-known form in which a scribing wheel is used to form a scribe line equal to a predetermined position of the brittle material substrate, whereby a vertical crack is formed along the scribe line in the thickness direction of the brittle material substrate, and then, by applying an external force (load The vertical crack is stretched in the thickness direction of the brittle material substrate, thereby breaking the brittle material substrate (for example, refer to Patent Document 1). In this case, the vertical crack formed along the scribe line extends in the thickness direction of the brittle material substrate and reaches the back surface, thereby breaking the brittle material substrate. Alternatively, in the manufacturing process of the brittle material substrate, a V-shaped groove (referred to as a V-groove or the like) may be formed in advance at a predetermined division position, and the V-groove may be divided. In general, the V-groove is formed at the stage of the ceramic precursor (the laminate of the ceramic green sheets).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-173251

In the brittle material substrate, in order to protect the circuit formed on the main surface, a brittle material substrate (a brittle material substrate having a resin) to which a thermosetting resin such as glass epoxy is adhered to the main surface is provided. When the resin-containing brittle material substrate is separated from the brittle material substrate side by the above method, the vertical crack does not extend to the resin portion or the resin portion is not penetrated because the material of the brittle material substrate and the resin are different. . Alternatively, there are cases where the crack does not extend vertically to cause a split crack called a barb.

Further, in the process of attaching the thermosetting resin, warpage of the brittle material substrate causes a problem that the dimensional accuracy (flatness) of the divided single piece cut by the cutting is poor. This problem is more pronounced in the case where a V-grooved brittle material substrate is not formed.

The present invention has been made in view of the above problems, and it is an object of the invention to provide a method for dividing a brittle material substrate having a higher reliability than that of the prior art and having improved dimensional accuracy.

In order to solve the above problems, the invention of claim 1 is a method for dividing a substrate of a brittle material having a resin, which is characterized in that a resin-based brittle material substrate is adhered to a main surface of a brittle material substrate. a method of vertically dividing a face, comprising: a groove forming step of forming a groove portion at a predetermined predetermined position on a resin side of the resin-containing brittle material substrate; and a scribing forming step of the brittle material having the resin brittle material substrate A predetermined line is formed on the substrate side to form a scribe line; and a breaking step is performed to divide the resin-containing brittle material substrate along the scribe line.

The invention of claim 2 is the method for dividing a substrate of a brittle material having a resin according to claim 1, wherein the step of breaking is a step of: breaking a specific force member against a main surface of the brittle material substrate and opposing Positions on the extension line of the thickness direction of the brittle material substrate at two positions symmetrical at a predetermined position on the side of the brittle material substrate and the main surface of the resin side and the vertical crack formed along the scribe line The force is divided into the above-mentioned substrate having a brittle material having a resin.

The invention of claim 3, wherein the scribing step is formed by forming the scribing layer on the brittle material substrate along the scribing line to form the brittleness The step of extending a vertical crack in the thickness direction of the material substrate, wherein the breaking step is a step of dividing the resin-containing brittle material substrate by extending the vertical crack to the groove portion.

The method of dividing a brittle material substrate having a resin according to any one of claims 1 to 3, wherein the step of forming the groove portion is a step of forming the groove portion by a cutter.

A method of dividing a brittle material substrate having a resin according to any one of claims 1 to 4, wherein the brittle material substrate is LTCC or HTCC.

According to the inventions of claims 1 to 5, the brittle material substrate having the resin can be divided with a predetermined predetermined position perpendicular to the main surface thereof and with excellent dimensional accuracy.

<brittle material substrate with resin>

Fig. 1 is a schematic view showing a resin-containing brittle material substrate 10 to be divided in the present embodiment. In the resin-based brittle material substrate 10, a thermosetting resin (hereinafter, simply referred to as a resin) 2 such as a glass epoxy is attached to LTCC (Low Temperature Co-fired Ceramics) or HTCC (High Temperature Co-fired Ceramics). And one of the main surfaces 1a of the brittle material substrate 1 composed of ceramics and other brittle materials. Further, in the present embodiment, the brittle material substrate 1 includes a substrate on which an electric circuit or the like is formed on the main surface or inside. The resin 2 is provided, for example, to protect a circuit formed on the main surface. In addition, FIG. 1 shows that the brittle material substrate 10 having a resin is flat in the horizontal direction (the horizontal direction when viewed from the drawing), but actually, there is a case where the compressive stress acts on the shrinkage of the resin 2 when it is hardened. The main surface 1a of the brittle material substrate 1 is warped on the brittle material substrate 1 so as to be convex upward as viewed from the drawing.

Further, in Fig. 1, a predetermined dividing line L indicating a predetermined division position of the brittle material substrate 10 having a resin is indicated by a broken line. In the present embodiment, the predetermined division position is set to be perpendicular to the principal faces 1a and 1b of the brittle material substrate 1. Further, the end portion (the intersection with the main surface 1b) on the brittle material substrate 1 side of the predetermined line L is particularly referred to as a predetermined division position P1, and the end portion on the resin 2 side (the intersection with the main surface 2a) is called To divide the predetermined position P2. In this case, the divided predetermined position P1 and the divided predetermined position P2 are straight lines extending in a direction perpendicular to the plane of the paper.

Further, the size of the brittle material substrate 1 and the resin 2 in Fig. 1 or the adhesion form of the resin 2 are merely exemplified. Both the brittle material substrate 1 and the resin 2 can be appropriately sized for their respective purposes. Although not particularly limited, it may be as follows: for example, the thickness of the brittle material substrate 10 having a resin is about 0.3 to 3 mm, the thickness of the brittle material substrate 1 is about 0.1 to 2 mm, and the thickness of the resin 2 is 0.1 to 0.1. 2 mm or so. Further, in Fig. 1 (the same applies to the following drawings), the five predetermined division positions (five division planned lines L) are shown, but this is merely an example.

<Segmentation of material substrate with resin>

Fig. 2 is a view showing a processing procedure for dividing the brittle material substrate 10 having a resin in the present embodiment. Hereinafter, details of the division processing of the resin-containing brittle material substrate of the present embodiment will be described in the order shown in FIG. 2.

First, a brittle material substrate 10 having a resin is prepared (step S1). As shown in FIG. 1, the predetermined brittle material substrate 10 has a predetermined predetermined position perpendicular to the main faces 1a and 1b of the brittle material substrate 1. Then, the groove forming process is performed on the predetermined predetermined position P2 on the resin 2 side of the prepared brittle material substrate 10 (step S2). The groove forming process can be performed by selecting an appropriate processing mechanism from a dicer, a laser beam, and other known processing mechanisms.

FIG. 3 is a schematic view showing a state in which the groove forming process is performed using the cutter 100. Fig. 4 is a view showing a resin-containing brittle material substrate 10 in which a groove portion G is formed by the groove portion forming process.

When the groove forming process is performed using the cutter 100, first, the main surface 1b of the brittle material substrate 1 is placed on the brittle material substrate 10 having the resin so that the main surface 2a of the resin 2 is the surface to be processed. The surface is fixed to the platform 101 of the cutting machine 100. Then, the outer peripheral portion is made of diamond or the like, and the blade 102 having the blade edge for grinding is adjusted to a height position commensurate with the depth of the groove portion G. Then, the blade 102 is rotated about the shaft 102a as indicated by an arrow AR1 by a drive mechanism (not shown), and the stage 101 is moved as indicated by an arrow AR2 or the blade 102 is moved along the divided predetermined position P2. The movement is performed as indicated by an arrow AR3, thereby forming the groove portion G. Fig. 4 shows a state in which all the divided predetermined positions P2 are subjected to the same processing.

The depth of the groove portion G can be appropriately set depending on the material, hardness, thickness, and the like of the brittle material substrate 1 and the resin 2. Although not particularly limited, for example, the depth of the groove portion G may be about 30 to 90% of the thickness of the resin 2. Further, in FIG. 4, the groove portion G is formed in a rectangular shape when viewed in cross section, but the cross-sectional shape of the groove portion G is not necessarily limited to a rectangular shape.

Since the groove portion G is formed, the compressive stress acting on the main surface 1a of the brittle material substrate 1 is alleviated in the resin-containing brittle material substrate 10. Thereby, the warpage of the brittle material substrate 10 having the resin can be reduced.

After the formation of the groove portion G is completed, the predetermined predetermined position P1 on the brittle material substrate 1 side of the resin brittle material substrate 10 is subjected to scribing (step S3).

Fig. 5 is a view showing a scribing device 200 for performing scribing. 6 is a view showing a resin-containing brittle material substrate 10 in which a scribe line SL is formed by scribing, and a vertical crack SC extending in the thickness direction of the brittle material substrate is formed along the scribe line SL.

The scribing device 200 mainly includes a stage 201 for placing and fixing a workpiece, and the stage 201 is movably guided to a pair of guide rollers 202 in a direction perpendicular to the plane of the paper; a cutting head 204 of the cutter wheel 203; and a sliding portion 206 which is provided with the cutting head 204 as shown by an arrow AR4, and is slidably attached to the guide rod in a left-right direction as viewed from the arrow AR5. Made up of 205.

The cutter wheel 203 is a disk-shaped member having a circular cross section in a circumferential portion. Further, the cutter wheel 203 supports the center axis of the disk-shaped portion on the cutting head 204, thereby being rotatable by an external force. The cutter wheel 203 is made of, for example, a cemented carbide, sintered diamond, SUS, SKH (tool steel), sapphire or the like.

When the scribe line device 200 performs the scribing process of the resin-based brittle material substrate 10, first, the resin-containing brittle material substrate 10 is used to make the main surface 1b of the brittle material substrate 1 into a processed surface. The main surface 2a of 2 is placed and fixed on the stage 201 of the scribing device 200 as a mounting surface. In this state, if the cutter wheel 203 is brought into contact with the division predetermined position P1 and the slide portion 206 is moved from left to right or from right to left when viewed on the drawing, the scribe line SL is formed at the division predetermined position P1. The vertical crack SC is stretched in the thickness direction of the brittle material substrate 1 along the scribe line SL. Fig. 6 shows a state in which all of the divided predetermined positions P1 are processed in the same manner.

As shown in FIG. 6, the resin-containing brittle material substrate 10 after the scribing process is in a state in which the groove portion G is formed on the same dividing line L as the scribe line SL and the vertical crack SC.

The sum of the depths of the scribe line SL and the vertical crack SC depends on the material, hardness, thickness, or depth of the groove portion G of the brittle material substrate 1 and the resin 2, but is preferably at least 10% of the thickness of the brittle material substrate 1. Left and right. In this case, the brittle material substrate 10 having the resin can be appropriately divided in the subsequent stage.

After the scribe line SL and the vertical crack SC are formed, the breaking process of breaking the brittle material substrate 10 having the resin along the scribe line SL and the vertical crack SC is performed (step S4).

Fig. 7 is a schematic cross-sectional view showing the state of the breaking device 300 for performing the breaking process. Fig. 8 is a view showing the resin-containing brittle material substrate 10 after the breaking process.

The breaking device 300 mainly includes a frame 302 that horizontally opens and holds the elastic film 301 to which the workpiece is adhered and fixed to the edge portion thereof, and two upper branch bars that move up and down with respect to the upper side of the workpiece. 303 (303a, 303b); and one lower branching bar 304 that moves up and down in comparison with the workpiece. The two upper dividing bars 303a and 303b are horizontally oriented (the left and right direction when viewed from the drawing) ) separately configured. Preferably, the separation distance between the two can be adjusted. Further, the lower break bar 304 is disposed at a position equidistant from the two upper split bars 303a and 303b in the horizontal direction.

When the breaking device 300 is used to break the resin-containing brittle material substrate 10, first, the main surface 2a of the resin 2 is used as a fixing surface, and the resin-containing brittle material substrate 10 is adhered and fixed to the elastic film 301. Face 301a. Then, the elastic film 301 is opened on the frame 302 with the adhesive surface 301a being placed upward.

Then, the lower branching bar 304 is placed at a position on the extension line of the planned dividing line L (hereinafter referred to as the target dividing line) of the dividing target in a state of being separated from the elastic film 301. Then, the two upper split bars 303a and 303b are arranged at a predetermined interval so as to be symmetrical with respect to the dividing line L in a state of being separated from the brittle material substrate 1. In this state, the two upper split bars 303 are lowered, the respective front ends 303e are brought into contact with the main surface 1b of the brittle material substrate 1, and the lower split bars 304 are raised to have their front ends 304e passed through the elastic film 301. It is in contact with the main surface 2a of the resin 2. Thereby, the resin-containing brittle material substrate 10 is biased downward by the upper split bar 303, and is biased upward by the lower split bar 304. Then, on the resin-containing brittle material substrate 10, the bending stress at three points acts on the position of the object division planned line. When the stress acts, the cracks along the predetermined line of division of the object are generated by the vertical cracks SC formed along the scribe lines SL at the position, and the vertical cracks CR reaching the groove portions G directly below are formed. The division of the position of the object division planned line is completed by the formation of the crack CR.

In addition, in FIG. 7, the front end 303e of the upper side breaking bar 303 and the front end 304e of the lower side breaking bar 304 are formed at an acute angle when viewed in cross section, and are in line contact with the brittle material substrate 1 or the elastic film 301 (FIG. In the cross section shown in Fig. 7, the contact is not required. However, the front end 303e and the front end 304e may be formed in a rectangular shape when viewed in cross section, and may be in surface contact with the brittle material substrate 1 or the elastic film 301.

Fig. 8 shows a state in which all of the division planned lines L are subjected to the same processing. In the case of using the dividing method of the present embodiment, the crack CR is perpendicular to the groove portion G of the resin 2 along the dividing line L along the vertical crack SC formed by the scribe line SL provided on the brittle material substrate 1 and It is stretched (reproducibly). Further, after the breaking process, as shown in FIG. 8, the plurality of divided individual pieces 11 are in a state of being substantially in contact with each other at the crack CR, but of course, each of the divided pieces 11 is physically different from each other, and can be performed. Individual treatment.

Fig. 9 is a view showing a state after the breaking process of the resin-containing brittle material substrate 10 which has been processed in the same order as described above except for the groove forming process. In this case, as shown in FIG. 9, there is a case where a crack is generated in the resin 2 by forming a skew crack (fracture CR1 or crack CR2) deviated from the dividing line L, or only A crack (fracture CR3 or crack CR4) that extends to the middle of the resin 2, or a crack (fracture CR5) that extends only within the range of the brittle material substrate 1. Further, even if a good division has been performed, it is necessary to impart a greater force to the brittle material substrate 10 having a resin than to the present embodiment at the time of breaking. This means that the groove portion G is formed in advance on the resin 2 as described in the present embodiment, and the brittle material substrate 10 having the resin can be effectively separated.

Further, in the present embodiment, as described above, the warpage is reduced by the formation of the groove portion G, and the brittle material substrate 10 having the resin is divided. Therefore, the warpage is also reduced for each of the divided single pieces 11. Split the single piece. In other words, the divided single piece 11 can be made into a divided single piece which is more excellent in dimensional accuracy (flatness) than before.

As described above, according to the present embodiment, the groove portion is formed at a predetermined position on the resin side, and the scribing process and the breaking process are performed, whereby the reliability and the superiorness can be improved as compared with the prior art. The dimensional accuracy is such that the resin-containing brittle material substrate is divided at a predetermined predetermined position perpendicular to the main surface thereof.

<Modification>

The form of the breaking process is not limited to the above embodiment. For example, the configuration may be such that the lower breaking bar has the same configuration as the above-described breaking device 300, but the upper dividing bar is provided as a supporting member, which has a relatively wide and brittle material substrate. The main surface 1b of 1 has a shape in which the elastic film 301 is in contact with a sufficient contact area, and the contact surface with the main surface 1b contains an elastic member such as rubber. In the state in which the support member is brought into contact with the main surface 1b on which the scribe line SL is formed in advance, the lower side of the extension line disposed on the extension line of the target division line passes through the elastic film 301 to the resin. The main surface 2a of the side is in line contact, and the brittle material substrate 10 having the resin is biased, thereby achieving the breaking.

Alternatively, instead of the breaking device that is broken by the breaking rod, a breaking device of the following form may be used: the main surface 2a of the resin 2 side is pressed by a roller, thereby causing the vertical crack to be a brittle material having a resin. The substrate 10 is stretched in the thickness direction. Alternatively, the resin-containing brittle material substrate 10 in which the scribe line SL and the vertical crack SC are formed may be broken by a human hand without using a breaking device.

1. . . Brittle material substrate

1a, 1b. . . Main surface (brittle material substrate)

2. . . Resin

10. . . Brittle material substrate with resin

11. . . Split single piece

100. . . Cutting Machine

101. . . platform

102. . . blade

200. . . Scribing device

201. . . Loading platform

202. . . Guide rollers

203. . . Knife wheel

204. . . Cutting head

205. . . Guide rod

206. . . Sliding portion

300. . . Breaking device

301. . . Elastic film

301a. . . Adhesive surface

302. . . frame

303 (303a, 303b). . . Upper side break bar

303e. . . Front end (upper side breaking rod)

304. . . Lower side break bar

304e. . . front end

CR, CR1~CR5. . . crack

G. . . Groove

L. . . Split line

P1. . . (the side of the brittle material substrate) is divided into predetermined positions

P2. . . (resin side) split predetermined position

SC. . . Vertical crack

SL. . . Cross-line

Fig. 1 is a schematic view showing a resin-containing brittle material substrate 10 to be divided in the present embodiment.

Fig. 2 is a view showing a processing procedure for dividing the brittle material substrate 10 having a resin in the present embodiment.

FIG. 3 is a schematic view showing a state in which the groove forming process is performed using the cutter 100.

4 is a view showing a resin-containing brittle material substrate 10 in which a groove portion G is formed by a groove portion forming process.

Fig. 5 is a view showing a scribing device 200 for performing scribing.

Fig. 6 is a view showing a resin-containing brittle material substrate 10 in which a scribe line SL and a vertical crack SC are formed by scribing.

Fig. 7 is a schematic cross-sectional view showing the state of the breaking device 300 for performing the breaking process.

Fig. 8 is a view showing the resin-containing brittle material substrate 10 after the breaking process.

Fig. 9 is a view showing a state after the breaking process of the resin-containing brittle material substrate 10 in which the groove portion forming process is not performed.

1. . . Brittle material substrate

2. . . Resin

10. . . Brittle material substrate with resin

G. . . Groove

P1. . . (the side of the brittle material substrate) is divided into predetermined positions

Claims (7)

A method for dividing a substrate of a brittle material having a resin, characterized in that it is a method for vertically dividing a main surface of a resin-containing brittle material substrate to which a resin is adhered to one main surface of a brittle material substrate, and comprising: a groove a portion forming step of forming a groove portion at a predetermined predetermined position on the resin side of the resin brittle material substrate; and a scribing forming step of dividing the brittle material substrate side of the resin-containing brittle material substrate on which the groove portion is formed The position is formed by causing the cutter wheel to abut and move to form a scribe line, and the vertical crack is extended from the scribe line; and the breaking step, the resin-containing brittle material substrate is divided along the scribe line. The method for dividing a substrate of a brittle material having a resin according to claim 1, wherein the breaking step is a step of dividing a main surface of the brittle material substrate with respect to the side of the brittle material substrate by a specific biasing member. The brittle material substrate having the resin is divided by two positions which are symmetrical at a predetermined position, and a position on the main surface of the resin side and the extension line of the scribe line. A method of dividing a substrate having a resin brittle material according to claim 1, wherein said breaking step is a step of dividing said resin-containing brittle material substrate by extending a crack from said vertical crack to said groove portion. A method for dividing a substrate of a brittle material having a resin according to claim 2, wherein said breaking step is performed by causing a crack from said vertical crack to said groove The step of stretching and dividing the substrate of the brittle material having the resin described above. The method for dividing a substrate of a brittle material having a resin according to any one of claims 1 to 4, wherein the step of forming the groove portion is a step of forming the groove portion by a cutter. The method for dividing a substrate of a brittle material having a resin according to any one of claims 1 to 4, wherein the brittle material substrate is LTCC or HTCC. A method of dividing a substrate of a brittle material having a resin according to claim 5, wherein the brittle material substrate is LTCC or HTCC.