TWI322754B - Method for expelling gas positioned between a substrate and a mold - Google Patents

Description

1322754 IX. Invention Description: [Interactive information on the relevant Shenjing case] This application claims US Provisional Application No. 6〇/8〇1,265, and the application is May 18, 2006, the name is, data storage Substrate holding method for substrate 5 and method ', and US Provisional Application No. 60/827,128, filed on September 27, 2006, entitled "Double Side Imprinting, Priority, and U.S. Patent Application Serial No. 11/565,393, filed on Nov. 30, 2006, entitled "Study of the Method for Discharging Gas Between Substrate and Mold", continuation of the continuation case It is the priority of the US Provisional Application No. 10 60/748,380, and the application is 12, December 8, 2005, the name, and the method and apparatus for pre-formed stencil and/or photocurable liquid imprinting. And U.S. Patent Application Serial No. 11/389,731, the application of which is the continuation of the "imprinting lithography substrate process tool for adjusting the shape of the substrate", the US patent The application is US Patent Application No. 10/293,224 15 and is currently Patent No. 7,019,819, filed November 13, 2002, entitled "Adjusting the shape of the substrate with the clamping system" to continue the case, to combine all the euphemistically incorporated by reference. [Ming/genus 3] Field of the Invention 20 The present invention relates to nanofabrication of a structure. More particularly, the present invention relates to a method and system for discharging gas between a substrate and a mold. BACKGROUND OF THE INVENTION 5 Nanofabrication involves the fabrication of very small structures, for example having features that are nano or smaller. One of the areas in which nanofabrication has a considerable impact is in the process of integrated circuits. Nanofabrication is becoming increasingly important as the semiconductor process industry continues to focus on mass production and the addition of circuits that form the cell area on a substrate. Nanomanufacturing provides better process control while allowing the minimum feature size of the resulting structure to be reduced. Other areas of nanofabrication that have been developed include biotechnology, optical technology, and mechanical systems. An example of a nanofabrication technique is typically an imprint lithography technique. The exemplified embossing lithography process is described in detail in a number of published materials, for example, U.S. Patent Application Publication No. 2004/0065,976, entitled "S. A method and a module of the features"; U.S. Patent Application Publication No. 20 (M/0065252, U.S. Patent Application Serial No. 1/264,926, entitled, a method of forming a film layer on a substrate to facilitate the measurement and measurement standard); No. 6,936,194 'the designation of the embossing lithography process", all of which are assigned to the assignee of the present disclosure. The disclosures of the above-identified U.S. Patent Application Publications The imprint lithography technique comprises forming a relief pattern on a polymerizable film layer, and transferring a pattern corresponding to the relief pattern into an underlying substrate. The substrate can be positioned on a moving stage to achieve a desired position. It can be assisted in patterning. For this purpose, a template can be arranged spaced apart from the substrate to form a formable liquid between the template and the substrate. The liquid is solidified a cured layer having a pattern recorded therein that conforms to the shape of the surface of the mold in contact with the liquid. The template is then separated from the cured layer such that the template is spaced from the substrate. The substrate and the cured layer are further processed by the lion, and a relief image corresponding to the pattern in the cured layer is transferred into the substrate. For this purpose, a gas may appear in the template and the substrate. Between the materials and in the formable liquid, this may result in, in particular, distortion of the pattern of the cured layer, low accuracy of features formed on the cured layer, and inconsistent thickness of the residual layer on the cured layer. It is not good. Therefore, for this reason, there is a need to provide a method and system for discharging a gas between a substrate and a mold. [Item] 'Inner Solution 1 Simple Description FIG. 1 is a A simplified side view of a lithography system having a patterning device spaced from a substrate, the patterning device comprising a template and a mold; and Figure 2 is a elevational view of the substrate as shown in Figure 1 Have The inner, middle and outer diameters; FIG. 3 is a side view of the substrate coupled to a substrate clamping seat as shown in FIG. 1, and the substrate 4 is the substrate clamping seat as shown in FIG. From bottom to top ten-sided SI · garden, Figure 5 is a bottom view of the template coupled with a mold as shown in Figure 1; Figure 6 is the template is attached to a template as shown in Figure 1 Side view of the seat; Figure 7 is the bottom-up plane 1322754 of the template lost seat as shown in Figure 6; Figure 8 is a view showing the embossed material positioned on an area of the substrate as shown in Figure 丨a bottom view of the droplet array; Figure 9 is a simplified side view of the substrate as shown in Figure 1, having a picture: 5 a layer on which it is placed; _· Figure 10 is shown in the first embodiment, A flowchart of a method of forming a pattern on a substrate as shown in Fig. 1; φ Fig. 11 is a side view showing the shape of the pattern device as shown in Fig. 1; 10 Fig. 12, Fig. 11 a side view of the device in contact with a portion of the droplets of the imprint material shown in Fig. 8; Figs. 13-15 are views showing the compression of the droplets shown in Fig. 8. a view, which is provided with a template having a shape changed as shown in Fig. 8; Fig. 16 is a flow chart showing a method of forming a pattern of a region of a substrate as shown in Fig. 8 in the second embodiment; Figure 17 is a side view showing the changed shape of the substrate as shown in Figure 1; Figure 18 is a side view showing a pin applied to the pattern device shown in Fig. 1 to change its shape; - Figure 19 is a side view of the system as shown in Figure 1 with a gas guide 20 between the patterning device and the mold. [Embodiment 3] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT As shown in Figs. 1 and 2, a system 10 for forming a relief pattern on a substrate 12 is shown. Substrate 12 can have a circular shape; however, in another embodiment, substrate 12 can have any geometrical gorge. In the present example, 12 may have a disk shape having an inner diameter η. Further, defined between the inner diameter ri and the outer diameter r2 is - the middle half ~ the intermediate radius r3 is located at an equal distance from the inner diameter ri and the outer diameter (10). : As shown in Fig. 1, the substrate 12 can be lightly attached to the substrate-bonding seat. As shown in the figure, the substrate is sandwiched into a vacuum-clamping seat, (9), and the substrate clamping seat μ can be any clamping seat, including but not limited to, vacuum, pin, slot, or electromagnetic For example, American Na, 873, (10) 7, the name is, high precision guide alignment for embossing lithography process and _ (four) steps, as described herein. The substrate 12 and the substrate holder 14 can be supported at the first stage. Further, the substrate 12, the substrate holder 14' and the stage are positioned on a base (not shown). The stage 16 can have movements of the first and second axes that are perpendicular to each other, i.e., to the x-axis. 15 As shown in Figures 1, 3 and 4, the substrate holder μ includes first and second opposing sides 18 and 20. One side or rim surface 2 2 extends between the first side sill 8 and the second side 2 。. The first side 18 includes a first recess 20, a second recess 22, and a third recess 24 defining first, second, third and fourth spaced support regions 26, 28, 30, 32. The first support region 26 surrounds the second, third and fourth 20th floor regions, and the first, second and third recesses 2, 22, 24. The second support region 28 surrounds the third and fourth support regions 30, 32, and the second and third recesses 22, 24. The third support region 3 turns around the fourth support region 32 and the third recess 24. The third recess 24 surrounds the fourth support region 32. In another embodiment, the first, second, third, and fourth support regions 26, 28, 30, 32 are formed from a compliant material. First, second, third and fourth support areas 26, 28, 30, 32

+C S may have a circular shape; however, in other embodiments the 'first, second, third and fourth support regions 26, 28, 30, 32 may comprise any desired geometry. Channels 34 and 36 are formed in the substrate holder 14 however, the substrate holder 5 can include any number of channels. The passage 34 places the first and third recesses 2 and 24 in fluid communication with the side surface 22, however, in another embodiment, it must be understood that the passage 34 allows the first and third recesses 20 and 24 to be clamped to the substrate. Any surface of the seat 14 is in fluid communication. The passage 36 places the second recess 22 in fluid communication with the side surface 22, however, in another embodiment, it must be understood that the passage 36 10 can cause the second recess 22 to be in fluid communication with any surface of the substrate holder 14. In addition, the passages 34 are for assisting in the first and third recesses 20 and 24, and the passages 36 are for assisting in fluid communication of the second recess 22 with a pressure control system, such as a pump system 38. Pump system 38 may include one or more pumps' to control the pressure of the first, second, and fifth third recesses 20, 22, and 24. For this purpose, when the substrate 12 is coupled to the substrate holder 14, the substrate 12 rests on the first, second, third and fourth branch regions 26, 28, 30 and 32, covering First, second and third recesses 20, 22 and 24. The first recess 2 is overlapped with a portion 40a of the substrate 12 to define a first chamber 42. The second recess 22 overlaps a portion 40b of the substrate 12, 20 defining a second chamber 44. The third recess 24 overlaps a portion 40c of the substrate 12 to define a third chamber 46. Pump system 38 is actuatable to control the pressure within first, second, and third chambers 42, 44, and 46. As shown in Figs. 1 and 5, a pattern device 48 is provided spaced apart from the substrate 12. The patterning device 48 includes a stencil 50 having a projection 52 extending therefrom 1322754 toward the substrate 12 having a patterned surface 54 thereon. Further, the boss 52 can be regarded as a mold 52. In another embodiment, the template 50 can be substantially free of the mold 52. The material forming the template 50 and/or the mold 52 may include, but is not limited to, fused silica, quartz, ruthenium, an organic polymer, a siloxane polymer, a borate glass, a fluorocarbon polymer, a metal, and a hardened sapphire. As shown, the pattern surface 54 includes features defined by a plurality of spaced apart recesses 56 and projections 58. However, in another embodiment, the pattern surface 54 can be substantially smooth and/or flat. The pattern surface 54 can define an original pattern that is the forming basis required for the pattern to be formed on the substrate 12. 15 As shown in Figures 1, 6 and 7, the template 5A can be coupled to a template clamping seat 60, which can be any misaligned seat, including but not limited to, vacuum, pin, Slotted, or electromagnetic, as described in U.S. Patent No. 6,873,87, entitled High Precision Guided Alignment and Gap Control Stage for Embossing lithography processes. The formwork holder 60 includes first and second opposing sides 62,64. A side or edge surface 66 extends between the first side 62 and the second side material. The first side 62 includes a -th recess 72, a second recess 7, and a third recess 72, and the first, second, and third branch regions 74, 76, 78 spaced apart from each other. The first fulcrum region 74 surrounds the second and third cleave regions _78, and the first, second and 20th concave phases, 7G, 72. The first-branch area % surrounds the third support area and the first and the first concave. P70, 72 ° second selected area 78 surrounds third recess 72. In another embodiment, the 'the second' and the second and third subscript regions 74, 76, 78 may be opened/formed by the coffin shell, and the second and third support regions Αν may have a circular shape; In another example, the first, second, and third support regions 74, 76, 78 can be of any desired geometry. 11 1322754 Forms 8〇 and 82 are formed in the template misalignment seat 60, however, the formwork mount 6〇 may include any number of channels. The passage (10) causes the first and third recesses 2 and 72 to be in fluid communication with the second side 64. However, in another embodiment, it must be understood that the passage (10) allows the first and third recesses 68 and 72 to be clamped to the template. Any surface of the seat, 60 is in fluid communication ^ Tongtao makes the second concave (four) and the second test

(d) «' However, 'in another embodiment' it is to be understood that the lion can have the second recess 70 in fluid communication with any surface of the formwork holder 6〇. In addition, the passage 8G is for assisting in the first and third recesses 72, and the passages 10 82 are for facilitating fluid communication of the second recess 7 〇 with a force control system, such as a pump system 84.

The system 84 can include - or a plurality of pumps to control the pressure of the first, second, and third recesses 68'7G'72. For this purpose, when #template 5() is attached to the template central seating 60, the template 5 is placed on the first, second and third support regions 74'76 and 78 to 'cover the first and second The third recesses 68 7 and 72. The first 15 recess 68 overlaps a portion 86a of the template 50 to define a first chamber 88. The second recess 70 overlaps a portion 86b of the template 50 to define a second chamber 92. The third recess 72 overlaps a portion 86c of the stencil 50 to define a third chamber 96. Pump system 84 is actuatable to control the pressure within first, second, and third chambers 88, 92, 96. Further, the template holder 6 can be coupled to an imprint head 20 97 ' to facilitate movement of the patterning device 48. As shown in FIG. 1, system 10 further includes a fluid dispensing system 98. Fluid dispensing system 98 can be in fluid communication with substrate 12 to deposit polymeric material 100 thereon. A plurality of dispensing units can be included within the fluid dispensing system 98. It is to be understood that the polymeric material 10 can be deposited using any conventional technique, such as droplet dispensing 12, spin coating, immersion coating, chemical vapor deposition (CVD), physical vapor deposition (PVD), thin film deposition, Thick film deposition, etc. In general, polymeric material 100 is disposed on substrate 12 prior to defining a desired volume between mold 52 and substrate 12. However, the polymeric material may be filled in the volume after the desired volume has been obtained. As shown in Fig. 8, a polymeric material 1 〇〇 can be deposited on the substrate 12 as a number of spaced apart droplets 1 〇 2 to define a matrix array 1 〇 4. For example, each droplet of droplet 102 can have a unit volume of about 1 〇 picoliter. The droplets 102 can be disposed on the substrate 12 in any two-dimensional configuration. As shown in Figures 1 and 9, system 10 further includes a source 106 of energy 108 that is lightly coupled to direct energy 1 〇 8 along a path 11 。. The embossing head 97 and the step ^ are configured to dispose the mold 52 and the substrate 12 so as to overlap and be disposed on the path 110. One or both of the embossing head 97 or the stage 16 can vary the distance between the mold 52 and the substrate 12 to define the desired capacity therebetween for filling of the polymeric material 100. After the desired volume is filled with the polymeric material, the source 106 produces an energy of 1 〇 8, such as broadband ultraviolet light, which causes the polymeric material to cure and/or crosslink 'to fit a surface 112 of the substrate 12 with The shape of the pattern surface 54 is defined to define a pattern layer 114 on the substrate 12. The pattern layer 114 can include a residual layer 116 and a plurality of features that are shown as protrusions U8 and recesses 120. The control of the process can be adjusted by a processor 122 that communicates with the stage 16, the pump systems 38 and 84, the imprint head 97, the fluid dispensing system 98, and the source 106, in a memory. The computer readable program in the body 124 operates. As shown in Fig. 1, the system 10 further includes a pin 126 coupled to the stage M. The pin 126 is movable on a third axis that is perpendicular to the first and second axes, i.e., 1322754 along the 2 axis. Thereby, the pin I26 can contact the mold & to change its shape, as will be further explained below. Pin 126 can be any conventional force or displacement actuator, including, inter alia, pneumatic, piezoelectric, magnetostrictive, linear, and voice coils. In another embodiment, the pin 126 can be a high resolution pressure regulator and a clean series air piston, the -*5 center pin including -vacuum source' can exhaust air between the interface 48 and the interface of the substrate 12. As shown in Figures 8 and 9, as mentioned above, the distance φ between the mold 52 and the substrate 12 can be varied so that the desired volume can be defined for the polymeric material 100 to fill. In addition, after curing, the polymeric material 100 will conform to the shape of the surface 10 U2 of the substrate 12 and the pattern surface 54 to define a patterned layer 114 on the substrate 12. For this purpose, gas is present in the volume defined between the droplets 1〇2 of the matrix array 104, and the droplets 1〇2 in the matrix array 104 are distributed over the substrate 12, if not prevented, It is avoided that gas and/or air pockets are trapped between the substrate 12 and the mold 52 and in the pattern layer ι14. The gases and/or air pockets may be, without limitation, air, nitrogen, carbon dioxide, and helium. The gas and/or cavitation between the substrate 12 and the mold 52 and in the pattern layer U4 may, in particular, cause distortion of the pattern of features formed on the pattern layer 114, and low precision of features formed on the pattern layer 114, And the thickness of the residual layer us on the pattern layer 1丨4 is not good, and these are not preferable. For this purpose, a method and system will be described below for minimizing gas and/or gas pockets between the substrate 丨2 and the mold 52 and in the pattern layer 114 if not prevented. As shown in the first and third embodiments, in the first embodiment, a method of discharging the gas between the substrate 12 and the scale mold 52 is shown. More specifically, in step 200, as described above, by droplet dispensing method, spin coating, immersion coating, 14 1322754 chemical vapor deposition (CVD), physical vapor deposition (PVD), thin film deposition, thick Film deposition or the like 'positions the polymeric material 1 于 on the substrate 12. In another embodiment, polymeric material 100 can be positioned on mold 52. As shown in Figures 6, 7, 10 and 11, in step 202, the patterning device 48

5 shape can be changed. More specifically, the shape of the patterning device 48 can be varied such that the distance di' defined between the mold 52 and the substrate 12 at the intermediate radius η of the substrate 12 is as shown in Fig. 2 The other portion of the prayer pattern 52 is less defined by the distance between the substrate 52 and the substrate 12. For example, the distance from the mountain is less than one

The distance 4 is defined by an edge of the mold 52. In another embodiment 10, the distance mountain can be defined by any desired location of the mold 52. The shape of the patterning device 48 can be varied by controlling the pressure in the first and third chambers 68 and 72. More specifically, as mentioned above, pump system 84 is actuatable to control the pressure in first and third chambers 68 and 72. To this end, the pump system 84 can create a vacuum in the first and third chambers 68 and 72 via the passage 80 such that portions 86a and 86c of the template 50 can be bowed away from the substrate 12 and bowed toward the formwork clamping seat. 60 ° Since the portions 86a and 86c of the template 50 are away from the bow of the substrate 12, the portion 86b of the mold & 50 bows toward the substrate 12 away from the template holder 60. 2, as shown in Figures 10, 12 and 13, in step 204', as described above, reference to the first print head 97 (as shown in Figure 1) or one or both of the steps 16 to deviate from the mountain, such as As shown in Fig. 11, so that a portion of the mold 52 can touch the primary portion of the night drop 102. As shown, before the other portions of the mold 52 contact the remaining droplets of the droplets 102, the portion of the mold 52 that overlaps the intermediate radius of the substrate 12, as shown in FIG. 2, will first contact the droplets 102 once. However, in another embodiment, any portion of the mold 52 may contact the droplet 1〇2 prior to the other portions of the mold 15 1322754 52. To this end, as shown, the mold 52 can substantially simultaneously contact all of the droplets 102 that overlap the intermediate radius η of the substrate 12, as shown in FIG. This causes the droplets 丨〇2 to diffuse and produce a liquid sheet 13 of a continuous polymeric material 100. The edge 132 _* 5 of the liquid sheet 13 界定 defines a liquid gaseous interface 134 that functions to push gas within the volume 128 toward the edge 136 of the substrate 12. The volume 128 between the droplets 102 defines an airway through which gas can be pushed to the edge 136. Thereby, the liquid-gas interface 134 is combined with the air passage φ, so that if it cannot be prevented, the gas is trapped in the liquid sheet 13〇. As shown in Figures 7, 10 and 14, at step 206, the shape of the patterning device 48 can be altered to define the desired volume between the mold 52 and the substrate 12 for filling of the polymeric material 100, as above. The reference is shown in Figure 1. More specifically, the change in shape of the patterning device 48 can be controlled by combining the pressures in the first and third chambers 88 and 96 with the stamping head 97 (as shown in FIG. 1) and/or the stage 16 The force applied due to contact with the polymeric material 1 and the mold 52. More preferably, the pump system 84 is actuatable to control the pressure in the first and third chambers φ chambers 88 and 96. To this end, the pump system 84 can reduce the amount of vacuum created in the first and third chambers 88 and 96 via the passage 8 to an intermediate radius η with the droplets 10 around the substrate 12 (as in Figure 2). The subsequent sets of associated polymeric materials 100 shown are diffused into inclusion in the continuous liquid sheet 20 130 as shown in FIG. The shape of the patterning device 48 continues to be altered so that the mold 52 will then contact other droplets 102 such that the polymeric material 100 associated therewith will diffuse into the continuous sheet 130, as shown in FIG. As can be seen, the interface 134 has moved to the edge 136, so that the gas in the other residual volume 128, as shown in Figure 8, has a clear path for movement. 16 1322754 Thus, the gas within the volume 128, as shown in Fig. 8, can run out of the mold 136 between the mold 52 and the substrate 12. In this manner, if the gas and/or air pockets trapped between the substrate 12 and the mold 52 and in the pattern layer 114 are not prevented, as shown in Fig. 9, the lowest can be achieved. In another embodiment, the shape of the patterning device 48 5 can be varied while reducing the distance mountain, as described above with reference to FIG. As shown in Figures 7 and 12, in another embodiment, to promote a change in the shape of the patterning device 48, the pressure in the second chamber 92 can be controlled. More specifically, as mentioned above, the pump system 84 is actuatable to control the pressure in the second chamber 92. To this end, the pump system 84 can form a pressure in the second chamber 92 via the passage 82 such that the portion 86c of the template 50 can be bowed toward the substrate 12 and bowed away from the mold clamping seat 60. Further, the pressure in the second chamber 92 can be formed simultaneously with the vacuum conditions of the first and third chambers 88 and 96 as mentioned above. As shown in Figures 1 and 10, in step 208, as indicated above with reference to Figure 1, the polymeric material 100 can then be cured and/or crosslinked to define the pattern layer 114, as shown in Figure 9. Next, in step 210, the mold 52 can be separated from the pattern layer 114 as shown in FIG. As shown in Figures 1 and 16, another embodiment of the present invention is shown. More specifically, in step 300, similar to the above described with respect to step 200, as shown in FIG. 1020, polymeric material 100 can be positioned on substrate 12 or mold 52. As shown in Figures 3, 4, 16 and 17, in step 302' similar to that described above with respect to step 202, as shown in Fig. 10, the shape of pattern device 48 can be changed. Further, the shape of the substrate 12 can be changed while the shape of the patterning device 48 is changed. More specifically, the shape of the substrate 12 can be varied by controlling the pressure in the first 17 / i: 1322754 and the third chambers 42 and 46. More specifically, as noted above, pump system 38 is actuatable to control the pressure in first and third chambers 42 and 46. To this end, the pump system 38 can create a vacuum in the first and third chambers 42 and 46 via the passage 36 such that portions 40a and 40c of the substrate 12 can be bowed. 5 away from the substrate clamping seat 14 and bow Bend to mold 52 as shown in Figure 17. Since the portions 40a and 40c of the substrate 12 are away from the bow of the substrate holder 14, the portion 40b of the substrate 12 is bowed toward the mold 52 away from the substrate holder 14. As shown in Figures 11, 13 and 16, in step 304 'similar to the above with respect to step 204, as shown in Fig. 10, one or both of the imprint head 97 or the stage 16 can change 10 distance mountains, As shown in Fig. 11, so that a portion of the mold 52 can contact the primary portion of the droplet 102 overlapping the intermediate radius η of the substrate 12, as shown in Fig. 2, 'to continuously manufacture the continuous liquid sheet of the polymeric material 100 at substantially the same time. Body 丨 3 〇. As shown in Figures 4, 12 and 16, at step 306, similar to the above described with respect to step 206, as shown in Figure 1, the shape of the patterning device 48 can be modified to cause the mold 52 and the substrate 12 to be Define the required volume, which can be filled with polymer material • 100. Further, the shape of the substrate 12 can be changed while changing the shape of the patterning device 48. More specifically, as mentioned above, pump system 38 is actuatable to control the pressure in first and third chambers 42 and 46. For this purpose, the pump system 38 can be reduced in the first and third chambers via the passage 36 while at step 2〇4 as described in the above, while changing the shape of the patterning device 48 as shown in FIG. The vacuum is formed by 42 and 46 so that the polymeric material 1 相关 associated with the intermediate radius Γ3 (as shown in Fig. 2) of the droplet 1 around the substrate 12 is diffused into a continuous liquid sheet. 130, as shown in Figure 14. The shape of the substrate q can be further changed while changing the shape of the patterning device 48, so that the mold 52 is connected to the other liquid m〇2 so that the associated polymeric material is diffused into the inclusion. In the continuous film (four), as shown in Figure 15. The volume 128 (d) of gas, as shown in Fig. 8, can be substantially ran out of the edge between the mold 52 and the substrate 12 in substantially the same manner as shown in Fig. 206, as shown in Fig. 1. • As shown in Figures 3 and 4, to promote a change in the shape of the substrate 12, the pressure in the second chamber 44 can be controlled. More specifically, as mentioned above, the pump system Lu 38 can be actuated to control the pressure in the second chamber 44. For this purpose, the spring system 38 can form a pressure in the second chamber via the passage 34 to cause the template 5 The 〇 part 1 〇 4 〇 b can be bowed to the mold 52 and bowed away from the substrate clamping seat 14. Further, the pressure in the first chamber 44 can be formed simultaneously with the vacuum conditions of the first and third chambers and 46 as mentioned above. As shown in FIGS. 1 and 10, in step 308, as described above with reference to the figures, the polymeric material 1 can be cured and/or crosslinked to define the patterned layer 15 U4, as shown in FIG. Show. Next, in step 310, the mold 52 can be separated from the pattern layer 丨14, as shown in FIG. 9 as shown in FIGS. 6 and 18. In another embodiment, in order to facilitate the shape change of the pattern device 48, Set a pin 26. More specifically, the pin 26 can be applied to the patterning device 48, which in this embodiment is applied to the 20-piece portion 86c of the template 50. Thereby, the patterning device 48 can include the shape to be changed as described above, and can be implemented by any of the methods described above. A pin 126 may also be provided to facilitate separation of the mold 52 from the substrate 12, as described above with respect to steps 2〇8 and 3〇8, as shown in Figures 1 and 16. Moreover, after the pattern layer 114 is formed, as shown in Fig. 9, the pin 126 can be moved away from the patterning device 48 such that the pattern 19 device 48 can be substantially flat. The pin 126 can be in communication with the processor 122 such that the pin 126 can use a force feedback technique to determine the force

As shown in Fig. 19, in order to further promote the separation of the mold 52 from the substrate 12, the gas 148 is drawn between the substrate 12 and the mold 52 by the pin 126. More specifically, the beta pin 126 can include a passage 150 having a bore 152 in fluid communication with a pressure control system, such as a spring system 38. In another embodiment, the pin I26 can include any number of holes. The aperture 152 can be positioned to introduce a gas 148 between the drain 52 and the substrate 12. The gas 148 is applied to force the mold 52 and the substrate 12 λ* to push the mold 52 in the direction away from the substrate 12 and to push the substrate 12 in a direction away from the dies 52. As shown, when the pin 126 is adjacent to the template 5, gas 148 can be introduced between the mold 52 and the substrate 12; however, in another embodiment, the gas 148 can be at the pin 126. It is introduced between the mold 52 and the substrate I2 at any position.

The above embodiments of the present invention are for illustration. Many changes and modifications may be made to the above disclosures without departing from the scope of the invention. Therefore, the present invention is not limited to the above, but must be determined with reference to the following claims, as well as the equivalents thereof, and the equivalents thereof. FIG. 1 is a simplified side view of a lithography system. Having a pattern device spaced apart from the substrate, the pattern device comprising a template and a mold; FIG. 2 is a bottom view of the substrate as shown in the second drawing, the substrate having an inner, a middle and an outer diameter; VIII, FIG. 3X, as shown in FIG. 1, the substrate is coupled to the side of a substrate clamping seat. FIG. 4 is a bottom-up plan view of the substrate as shown in FIG. Figure 1 is a bottom view of the template coupled to a mold as shown in Figure 1; Figure 6 is a side view of the template as shown in Figure 1 in a template holder; Figure 7 is the same 6 is a bottom-up plane fpt| of the template holder, and FIG. 8 is a elevational view showing an array of droplets of the imprint material positioned on an area of the substrate as shown in FIG. 1; Figure 9 is a simplified side view of the substrate as shown in Figure 1 with a patterned layer thereon; Figure 10 is A flowchart of a method of forming a pattern of a substrate as shown in FIG. 1 in the first embodiment; FIG. 11 is a side view of the shape of the pattern device shown in FIG. Figure is a side view of the patterning device as shown in Figure 11 in contact with a portion of the droplets of the imprinting material shown in Figure 8; Figures 13-15 are graphs showing the compression of the droplets shown in Figure 8. A tilt view of the situation 'which is set as a template having a changed shape as shown in FIG. 8; FIG. 16 is a flow chart showing a method of forming a pattern of a region of the substrate as shown in FIG. 1 in the second embodiment. The second drawing is a side view of the changed shape of the substrate as shown in Fig. 1; 1322754 Fig. 18 is a side view showing a pin applying a force to the pattern device shown in Fig. 1 to change its shape; Figure 19 is a side elevational view of the system as shown in Figure 1 with gas introduced between the patterning device and the mold. [Main component symbol description]

10...system 56,58···recess, convex part 12...level 60...template clamping seat 14...substrate inflammation seat 62,64...first, two sides 16...stage 66···side surface 18, 20...first, two sides 68,70,72...first, second, and third recesses 22···side surfaces 74,76,78···first, second, and third floor areas 20, 22, 24... One, two, three recesses 80, 82... channels 26, 28... first, two support areas 84... pump systems 30, 32... third, four-story area 86^8613, 86 (: ... part of the template 34, 36 ...channels 88, 92, 96. · first, second, three chambers 38... pump system 97... imprint heads 4 〇Μ (^, 40 ο... part 98 of the substrate... fluid distribution system 42, 44, 46... First, second, three chambers 100...polymeric material 48...patterning device 102...droplet 50...template 104...matrix array 52...mold (boss) 106...source 54...pattern surface 108...energy 22 1322754 110...path 130··· Liquid sheet 112...surface 132...edge 114...pattern layer 134...liquid gas interface 116...residual layer 136...edge 118,120...convex, recess 148...gas 122.·processor 150...channel 124 Memory 1 52···孔洞 126...pin 128.··Volume / έ h •· cS9 ^ 23

Claims (1)

1322754 X. Patent Application Range: 1. A method for discharging a gas between a substrate and a mold assembly, the substrate and the mold assembly further having a liquid therebetween, the method comprising the steps of: 5 positioning the mold An assembly and the substrate such that the mold assembly is adjacent to the substrate, the mold assembly has a first region, a second region, and a third region, the second region surrounding the first region and the second region a third region surrounding the first and second regions; changing a shape of the mold assembly by bending the first and third regions 10 away from the substrate such that the second region bows toward the substrate To reduce a gap defined between the second region of the mold assembly and the substrate; and to contact a primary portion of the liquid with the second region of the mold assembly such that the gas can be from the substrate The mold assembly is discharged between the mold and the 15 liquid can fill the volume defined between the mold assembly and the substrate. 2. The method of claim 1, wherein the step of changing the shape further comprises forming a first pressure difference between a first chamber and a second chamber, and forming a second a second pressure difference between the chamber and a third chamber, the first chamber being defined by a portion of the clamping seat coupled to the 20 mold assembly and the first region of the mold assembly Between the second chamber is defined between a portion of the clamping seat and the second region of the mold assembly, the third chamber is defined by a clamping seat coupled to the mold assembly. A portion is between the third region of the mold assembly. The method of claim 1, wherein the step of changing the shape further comprises the step of forming a first chamber and an additional chamber into a vacuum state, the first chamber being defined in one a portion of the clamping seat coupled to the mold assembly and a first region of the mold assembly, the outer chamber 5 being defined by a portion of the clamping seat coupled to the mold assembly and the mold Between the third areas of the assembly. 4. The method of claim 1, wherein the step of contacting the sub-portion further comprises the step of contacting a region of the liquid that overlaps the second region of the mold assembly. The method of claim 1, further comprising applying a pressure between the substrate and the mold assembly to overlap the first region of the mold assembly to assemble the mold assembly The liquid is separated from the substrate. 6. The method of claim 1, further comprising the step of impinging actinic energy on the liquid to cure it. 15 7. A method for discharging a gas between a substrate and a mold assembly, the substrate and the mold assembly further having a liquid therebetween, the method comprising the steps of: positioning the mold assembly and the substrate So that the mold assembly is adjacent to the substrate, the mold assembly has a first area, a second area, and a 20 third area, the second area surrounds the first area and the third area surrounds the First and second regions; changing a shape of the mold assembly by bending the first and third regions away from the substrate such that the second region bows toward the substrate to reduce the total mold a gap between the second region and the substrate defined by a gap of 13 1322754, the first region being bowed by applying a force to the surface of the mold assembly facing the substrate; and the liquid a primary portion is in contact with the second region of the mold assembly such that the gas can be discharged between the substrate and the mold assembly and the 5 liquid can be filled between the mold assembly and the substrate. Volume. 8. The method of claim 7, wherein the step of changing the shape further comprises forming a first pressure difference between a first chamber and a second chamber, and forming a second a second pressure difference between the chamber and a third chamber, the first chamber being defined by a portion of the clamping seat coupled to the 10 mold assembly and the first region of the mold assembly Between the second chamber is defined between a portion of the clamping seat and the second region of the mold assembly, the third chamber is defined by a clamping seat coupled to the mold assembly. A portion is between the third region of the mold assembly. The method of claim 7, wherein the step of changing the shape further comprises the step of forming a first chamber and an additional chamber into a vacuum state, the first chamber being defined by a coupling Between a portion of the clamping seat of the mold assembly and a first region of the mold assembly, the additional chamber is defined by a portion of the clamping seat coupled to the mold assembly and the 20 mold total Between the third areas. 10. The method of claim 7, wherein the step of contacting the sub-portion further comprises the step of contacting a region of the liquid that overlaps the second region of the mold assembly. 11. The method of claim 7, further comprising applying a 26 The pressure overlaps the first region of the mold assembly between the substrate and the laminate to separate the bristle assembly from the wire. 12. The method of claim 7, wherein the step of impinging on the liquid to cure it is carried out. • “Chemical 5 13·- a method of arranging a gas between a substrate and a mold assembly, the substrate and the cast _ money-step having (4) located at (4), the method comprising the following steps: 10 15 20 positioning a scale die assembly and the substrate such that __ is adjacent to the substrate, the mold assembly has a - region, a second region, and a third region surrounding the first region and The third region surrounds the first and second regions; changing the base (four) position such that the substrate overlaps with the first region of the mode assembly bow to the mold assembly; changing the mold assembly a shape that causes the first and third regions to bow away from the substrate such that the second region bows toward the substrate to reduce the overlap of the second region of the mold assembly with the substrate a gap defined between the regions; and contacting a primary portion of the liquid with the second region of the mold assembly to allow the gas to be discharged between the substrate and the mold assembly and the liquid body Filling the volume defined between the mold assembly and the substrate. 14. As claimed in claim 13 The method of claim 1, wherein the step of modifying the shape of the substrate further comprises: creating a first volume defined between a portion of the substrate holder coupled to the substrate and the region of the substrate The method of claim 13, wherein the step of modifying the shape of the substrate further comprises: coupling a part of the substrate clamping seat coupled to the substrate with the substrate; a first volume defined between the regions of the substrate, and a second portion defined between a portion of the substrate clamping seat that is lightly attached to the substrate and a 5 additional region of the substrate The step of creating a pressure difference between the volumes, the applied region is surrounding the region. The method of claim 13, wherein the step of changing the shape of the step further comprises forming a first cavity in the first cavity a first pressure difference between the chamber and a second chamber, and a second pressure difference between the second chamber and a third chamber, the first chamber being defined in one a part of the yoke seat coupled to the 鹄 鹄 mold assembly and the mold Between the first regions, the second chamber is defined between a portion of the clamping seat and a second region of the mold assembly, the third chamber being defined to be coupled to the mold assembly The method of changing the shape further includes the step of the first chamber and the method of the third region of the front mold assembly. An additional chamber forming a vacuum state, the first chamber being defined between a portion of the clamping seat coupled to the mold assembly and a first region of the mold assembly, the additional 2 cavity The chamber is defined between a portion of the clamping seat coupled to the mold assembly and a third region of the scalar assembly. 18. The method of claim 13, wherein contacting the portion The step of further comprising the step of contacting the liquid in a region overlapping the region of the substrate with a second region of the mold assembly. The method of claim 13, further comprising applying a pressure between the substrate and the mold assembly to overlap the first region of the mold assembly to total the mold The liquid from the substrate is separated. 20. The method of claim 13, further comprising the step of effecting actinic 5 on the liquid to cure it.