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TW527328B - Method and device for manufacturing brittle substrates - Google Patents

Method and device for manufacturing brittle substrates Download PDF

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Publication number
TW527328B
TW527328B TW090123554A TW90123554A TW527328B TW 527328 B TW527328 B TW 527328B TW 090123554 A TW090123554 A TW 090123554A TW 90123554 A TW90123554 A TW 90123554A TW 527328 B TW527328 B TW 527328B
Authority
TW
Taiwan
Prior art keywords
substrate
fragile
fragile substrate
scribing
platform
Prior art date
Application number
TW090123554A
Other languages
Chinese (zh)
Inventor
Ikuyoshi Takamatsu
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Application granted granted Critical
Publication of TW527328B publication Critical patent/TW527328B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)

Abstract

To solve such a problem that a fragile substrate must be inverted when breaking the scribed fragile substrate in a conventional machining system. A closed space covering a region including a scribe line formed on an upper face of the fragile substrate at the center and having a predetermined width is created, and the pressure in the closed space is reduced to break the fragile substrate by curving it slightly into a reverse V shape.

Description

527328 -—----- ---B7 __ 五、發明說明（I ) 〔技術領域〕 本發明係關於爲將形成有劃線之脆性基板沿其劃線切 斷之斷裂裝置。 脆性基板係包含半導體晶圓、玻璃基板 '貼合玻璃基 板和陶瓷基板等等。 〔先前技術〕 圖1顯示單板型的脆性基板之切斷系統。利用劃線裝 置1，對平台2上的脆性基板3，在施加了既定切深壓力的 狀態下藉由刀輪片4的轉動，來在脆性基板表面形成劃線 S 〇 隔著緩衝板7，將翻轉後的脆性基板3夾在斷裂裝置5 的平台6上並固定住。位於脆性基板下面之劃線S的上方 ，係設有延伸於劃線方向之棒狀斷裂棒8，利用汽缸9的 驅動來降下該斷裂棒8而從上方緊壓脆性基板3，以在彈 性體製的緩衝片7上使脆性基板3稍撓曲成V字形，藉以 使劃線S的裂痕(有助於切斷之直垂成份的裂痕)延伸而將 脆性基板3沿著劃線S切斷。 圖2係顯示對液晶面板般的貼合玻璃基板之斷裂方法 〇 1. 利用劃線裝置，對貼合玻璃基板3 ’的A面(圖中A面 爲上側的玻璃基板)進行劃線。 2. 在斷裂裝置中，對翻轉後的貼合玻璃基板的B面， 將斷裂棒S緊壓以使下側的A面斷裂。 3 本紙張尺度綱f關家群（CNS)A4規格（210 X 297公爱了 — — (請先閱讀背面之注意事項再填寫本頁> 裝 訂-· 527328 A7 _____B7 _ 五、發明說明（/ ) 3·將該貼合玻璃基板3’移送至第2劃線裝置(或送回前 述劃線裝置），對B面實施劃線（由於液晶面板是在玻璃邊 的一端形成端子，故A面和B面上的劃線位置彼此錯開） 〇 4·接著在第2斷裂裝置(或前述斷裂裝置）中，對再度翻 轉後之貼合玻璃基板3’的A面，將斷裂棒8緊壓以使下側 的B面斷裂。 〔發明所要解決的課題〕 然而，如上所述，將已劃線的脆性基板3從劃線裝置 搬送往斷裂裝置時，脆性基板3之翻轉步驟是絕對必須的 。在進行該翻轉時，如圖3所示，將已劃線的脆性基板用 機械手臂10等暫時擺置於別的架台11等，再將該脆性基 板3用機械手臂從下方撐起(亦即換拿)並固定在斷裂裝置 的平台6上。因此，不僅需要翻轉機構，且其作業效率不 佳。 又以往，由於劃線及斷裂時分別必須使用專用的翻轉 裝置，故其系統變得大型化且成本變高。 本發明係爲解決上述課題而成者，其目的係提供一斷 裂方法及斷裂裝置，可將劃線後須進行之脆性基板翻轉步 驟取同時在一平台上進行脆性基板之劃線及斷裂。 〔用以解決課題之手段〕 本發明之特徵在於，針對形成於脆性基板上面之劃線 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） —·--------* 裝--------訂--------- (請先閱讀背面之注意事項再填寫本頁) 527328 A7 -----— B7 ____ 五、發明說明（；）） -->--------I --- (請先閱讀背面之注意事項再填寫本頁) ’以將該劃線包含於中央的方式作出涵蓋既定幅寬的封閉 空間，藉由將該封閉空間減壓，來將脆性基板稍彎曲成倒 V字形以進行斷裂。 〔發明之實施形態〕 圖4係顯示使用本發明的斷裂方法之斷裂棒25的組裝 圖。如上圖所示般，係使用鋁材製的柱狀長方體21。其尺 寸，按照加工對象的不同，長度、寬度、厚度分別可取 300mm〜1000mm、10〜30mm、10〜50mm的範圍。在柱狀長 方體21的上面中央，沿柱方向形成有寬6mm、深0.5mm 之槽21a。 其次如中圖所示般，在槽21a的兩端和分別從兩端算 起既定長度的內側處，埋設有合計4個彈性體構成的隔片 22。各隔片22的厚度和槽21a的深度相同。利用這些隔片 22，沿柱方向將槽21a區分成3個區間。在各區間中，分 別形成有從槽底面貫通到柱狀長方體21下面之吸引孔23 〇 又如下圖所示般，在柱狀長方體21的上面接合彈性體 構成的厚5mm之吸引板24。藉此而在槽21a上形成3個 封閉區間。又，對應於這3個封閉區間，在吸引板24上分 別形成貫通到下面之切口 24a。如此以製得斷裂棒25。在 此的切口 24a，係對應於前述3個封閉區間而切成3條， 但形成1條連續狀的切口亦可。 作爲吸引板24及隔片22，係使用經年劣化少、高發 5 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 527328 A7 _ ___B7______ 五、發明說明（1)() 泡矽酮海綿片（彈簧硬度試驗（日本橡膠協會標準規格： SRIS 0101 - 1968)爲5〜30者），但只要是具有適當的彈性 係數之材質即可。 斷裂時如圖5所示般，係將吸引板24的面抵接於脆性 基板3來使用。在吸引孔23的開口部所設之管塞26上， 連接著爲進行抽真空用之管子。 圖5係斷裂棒長度和脆性基板3的劃線S長度大致相 等的情形，這時，是從3個管塞26同時進行抽真空，但如 圖6所示般，當脆性基板的劃線長度比斷裂棒長度爲短 時，則藉由中央的管塞26進行抽真空。 圖4係說明封閉區間爲3個的情形，但較佳爲配合脆 性基板的切斷條件來設置4〜20個封閉區間，而對各個區間 的真空壓力實施個別控制。 圖7係顯示圖5(圖6也是同樣的)的管塞26處之垂直 截面圖。讓脆性基板3的劃線S和切口 24a的線大致呈一 致。在此應注意的是，劃線S不在脆性基板3的下面而是 上面，又在脆性基板3和平台6之間並不需要緩衝板。 接著如圖8所示般，從管塞26進行抽真空，吸引板 24將稍變形成倒V字形，追隨於此而使脆性基板3變形， 利用該變形，而使劃線S的裂痕向下成長進而切斷脆性基 板3。藉由在吸引板24上形成切口 24a，如圖7所示般， 在斷裂棒25因其本身重量而呈抵接於脆性基板3的狀態下 ，將兩者的接合面上微量存在的空隙部中所殘留的空氣吸 出，藉以增加兩者間的吸引力。取代該切口 24a，設置排 6 ------------I --- (請先閱讀背面之注意事項再填寫本頁) 訂· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 527328 A7 _____B7___ 五、發明說明（< ) ---.--------I --- (請先閱讀背面之注意事項再填寫本頁) 成一列的小孔亦可，又當脆性基板3和吸引板24的密合性 良好時，就算不具備這種切口也能大致獲得所期待的吸引 力。 圖9係顯示使用上述斷裂棒25之斷裂裝置30的一實 施形態之立體圖。平台6能移動於Y方向且能作90度及 Θ旋轉，將脆性基板3吸引固定在其平台面上。跨設於平 台6上的橋部31，係由兩側的支持板、和被支持板支撐之 延伸於水平X方向之頂板31a所構成。 在頂板31a的中央設置汽缸32，從汽缸32向下延伸 之汽缸軸33的下端部，係支撐住斷裂棒25之上面中央部 。利用該汽缸32的驅動來使斷裂棒25上下移動，在下降 時爲了使斷裂棒25不致衝撞脆性基板3，如局部放大圖所 示般係具備止動機構37，其由固定於汽缸軸33之卡止片 .34、一端固定於頂板31a之L字形止動構件25、螺合於卡 止片34上所設的螺孔且下端部抵接於止動構件35水平部 上方之螺絲36所構成。透過頂板31a上所設的孔Q來轉 動該螺絲36等，藉以對應於玻璃板3的板厚來調整斷裂棒 25的下降位置。又，取代該止動機構37，而具備能使斷裂 棒25緩慢下降之適當的制動機構亦可。 斷裂棒25，爲使其昇降時能平行移動而設有導棒38 。在3個管塞26中，中央管塞係透過閥VI連接於真空泵 ，兩端2個管塞26則透過閥V2連接於真空泵。圖5所示 般之斷裂時，閥VI、V2同時呈打開，圖6所示般之斷裂 時，僅閥VI呈打開。 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 527328 A7 _ B7_ 五、發明說明（γ ) (請先閱讀背面之注意事項再填寫本頁) 抽真空時的真空壓力，能在表壓—1.33 X 102Pa( -ImmHg)〜-8·64 X 104Pa( - 650mmHg)的範圍內作調整，另 一方面，爲將脆性基板3吸引固定在平台6上之真空壓力 爲-1.33X10 Pa( - ImrnHg)以下’平台6上所形成的吸引 孔爲直徑2mm。只要將玻璃板固定用的真空壓力設成比斷 裂用的真空壓力爲小（更接近大氣壓），就算在劃線的正下 方形成吸引孔也不會妨礙斷裂的進行。 圖1〇係顯示採用上述斷裂裝置30之脆性基板加工的 系統圖。藉由供材搬送機等來將貼合玻璃基板3’固定在劃 線裝置S1的平台上，對上側的A面進行劃線。關於劃線 裝置的機構是用圖11來描述。 A面已劃線之貼合玻璃基板3’，係由搬送機以A面在 上側的方式直接固定在A面斷裂裝置(圖9所示之斷裂 裝置）的平台上，依據本發明的斷裂方法來進行A面的斷裂 〇 該貼合玻璃基板經翻轉機將表裏翻轉後固定在第2导 面劃線裝置S2之平台(當系統僅由劃線裝置S1及斷裂裝置 B1構成時則送回劃線裝置S1)。接著對位於上側之B面進 f了劃線。 B面已劃線之貼合玻璃基板，係由搬送機以B面在上 側的方式直接固定在第2B面斷裂裝置B2(或前述斷裂裝置 B1)的平台上，並進行B面的斷裂。如此即完成貼合玻璃 基板之加工，用移材搬送機搬往下一製程。 圖11係顯示脆性基板的劃線裝置同時能進行斷裂之劃 8 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐一 527328 A7 ____B7______ 五、發明說明（\ ) 線兼斷裂裝置40的1實施形態。跨設於平台6上之橋部 41，係由兩側的支持柱和延伸於X方向之導棒42所構成 '，該導棒42上，係設有延相同方向之導件42a。劃線頭43 設置成能透過支持具支撐體44來沿著導件42a移動，在劃 線頭43的下部，係設有用來將刀.牖片45保持成轉動自如 之片支持具46。 在以上要素所構成之劃線機構的背後，係設有圖9所 說明之包含橋部的斷裂機構。 在斷裂機構的背後，係具備用來辨識脆性基板3上所 標記之對準標記之一對攝影機51、52 ’被攝影機捕捉的影 像顯示於監視器53、54，同時藉影像辨識裝置來進行對準 標記的影像辨識，並運算其位置資料。 如前述般，依據本發明，在劃線後不須翻轉脆性基板 即可進行斷裂，且斷裂裝置中不需要圖1所示的緩衝板7 ，因此在進行劃線的平台上也能進行斷裂。接著，在平台 上，用氣流或刷子來除去切下後的粉末狀碎玻璃。 圖I2係顯示採用上述劃線兼斷裂裝置40之貼合玻璃 基板的加工系統圖。藉由供材搬送機等將貼合玻璃基板3, 固定在劃線兼斷裂裝置SB1的平台上，對上側的A面實施 劃線後，接著進行斷裂。 A面已完成劃線及斷裂之貼合玻璃基板3’，經表裏翻 轉後固定在第2劃線兼斷裂裝置SB2的平台上(當系統僅由 劃線兼斷裂裝置SB1構成時，則送回劃線兼斷裂裝置SB1) 。接著，對位於上側之B面進行劃線及斷裂，搬往下一製 9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --.--------^_w I --------訂· I ------- (請先閱讀背面之注意事項再填寫本頁) 527328 A7 ^___ B7______ 五、發明說明（g ) 程。 爲了將單板型的脆性基板及貼合脆性基板完全切斷， 按照切斷條件及下個行程之生產方式所附帶的條件，複數 個斷裂裝置是必要的。例如單板型的脆性基板之斷裂中， 在第1方向的斷裂及與第1方向隔90°之第2方向的斷裂 上，分別個別的使用本發明之斷裂裝置。又，將貼合脆性 基板切割成短柵狀再送往下一行程時，在送達下一行程前 ，係對脆性基板的表裏面分別個別的使用本發明之斷裂裝 置。 又，本實施形態所採用之槽21a和吸引板24(圖4)的 尺寸只是一個例子，本發明的實施所適用的尺寸如下所示 〇 槽寬：3mm〜10mm 槽深：0.1 mm〜1mm 板厚：1mm〜8mm 〔發明之效果〕 如以上所說明般，本發明由於不須翻轉劃線後的脆性 基板（即劃線位於上側）即可進行斷裂，故可縮小脆性基板 的加工系統形態，又因不須翻轉步驟，故能縮短整個加工 所需的作業時間。又在斷裂時，由於在脆性基板和平台間 的緩衝材是不需要的，故在劃線裝置的平台上能一倂進行 斷裂，這情形下，將已劃線的脆性基板從劃線裝置送往斷 裂裝置之搬送機構也變得不需要，而能縮短系統尺寸及加 10 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） f請先閱讀背面之注意事項再填寫本頁) 裝· 527328 ΚΙ _Β7___ 五、發明說明（' ) 工作業時間。 (請先閱讀背面之注意事項再填寫本頁) 〔圖式之簡單說明〕 圖1係顯示對單板型的脆性基板之以往的劃線及斷裂 〇 圖2係顯示對貼合玻璃基板之以往的劃線及斷裂。 圖3係顯示將脆性基板的表裏翻轉之翻轉步驟。 圖4係顯示本發明的斷裂棒之組裝圖。 圖5係顯示圖4的斷裂棒之進行斷裂時的樣子。 圖6係顯示脆性基板爲小尺寸時之斷裂的樣子。 圖7係圖5的管塞之縱截面圖。 圖8係顯示圖5之進行斷裂時的樣子。 圖9係顯示採用上述斷裂棒之斷裂裝置的1實施形態 之立體圖。 圖10係使用上述斷裂裝置所構成之脆性基板的加工系 統圖。 圖11係顯示在以往的劃線裝置中具備圖9的斷裂機構 而成的劃線兼斷裂裝置的1實施形態之立體圖。 圖12係使用上述劃線兼斷裂裝置所構成之脆性基板的 加工系統圖。 〔符號說明〕 3…脆性基板 6…平台 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 527328 A7 _B7 五、發明說明（\Ό) 21a…槽 (請先閱讀背面之注意事項再填寫本頁) 22…隔片 23…吸引孔 24…吸引板 24a·.·切口 25…斷裂棒 26…管塞 30…斷裂裝置 31…橋部 32…汽缸 33…汽缸軸 34----^止片 35…止動構件 3 6…螺絲 37…止動機構 40…劃線兼斷裂裝置 41…橋部 42…導棒 43…劃線頭 44…支持具支撐體 45…刀輪片 46…片支持具 S…劃線 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）527328 -------------- B7 __ V. Description of the Invention (I) [Technical Field] The present invention relates to a breaking device for cutting a brittle substrate with a scribe line formed along the scribe line. Brittle substrates include semiconductor wafers, glass substrates, 'bonded glass substrates, ceramic substrates, and more. [Prior Art] FIG. 1 shows a cutting system of a single-plate type brittle substrate. The scribing device 1 is used to form a scribing line S on the surface of the fragile substrate 3 on the surface of the fragile substrate 3 under the pressure of a predetermined depth of cut by applying a predetermined cutting depth pressure. The flipped brittle substrate 3 is clamped on the platform 6 of the breaking device 5 and fixed. Located above the scribe line S below the fragile substrate, a rod-shaped breaking rod 8 extending in the scribe direction is provided. The fracturing rod 8 is lowered by the driving of the cylinder 9 and the fragile substrate 3 is pressed tightly from above to form a flexible system. The fragile substrate 3 is slightly deflected into a V-shape on the buffer sheet 7 so as to extend the crack of the scribe line S (a crack that contributes to cutting of the perpendicular component) and cut the fragile substrate 3 along the scribe line S. Fig. 2 shows a method for breaking a bonded glass substrate like a liquid crystal panel. 1. Using a scribing device, the A surface of the bonded glass substrate 3 '(the A surface in the figure is the upper glass substrate) is scribed. 2. In the breaking device, press the breaking rod S on the B surface of the bonded bonded glass substrate after the inversion to break the A surface on the lower side. 3 This paper's standard outline f Guan Jiaqun (CNS) A4 specifications (210 X 297 public love — — (Please read the precautions on the back before filling out this page> Binding-· 527328 A7 _____B7 _ V. Description of the invention (/) 3 · Transfer this bonded glass substrate 3 'to the second scribing device (or return to the scribing device), and scribing the B surface (Since the LCD panel forms terminals on one end of the glass side, the A surface and B The positions of the scribe lines on the surfaces are staggered from each other.) 4) Next, in the second breaking device (or the above-mentioned breaking device), the A surface of the glass substrate 3 'bonded to the glass substrate 3' after being turned over again is pressed against the broken rod 8 so that The B surface on the side is broken. [Problems to be Solved by the Invention] However, as described above, when the scribed fragile substrate 3 is transferred from the scribing device to the breaking device, the step of inverting the fragile substrate 3 is absolutely necessary. During this reversal, as shown in FIG. 3, the scribed fragile substrate robot arm 10, etc. is temporarily placed on another stand 11, etc., and then the fragile substrate 3 is lifted from below by the robot arm (that is, exchanged for replacement) ) And fixed on the platform 6 of the breaking device. Therefore, not only The turning mechanism has poor operation efficiency. In the past, a dedicated turning device had to be used for scribing and breaking, so the system became larger and more expensive. The present invention was made to solve the above problems, The purpose is to provide a breaking method and a breaking device, which can take the fragile substrate flipping step to be performed after scribing and simultaneously perform the scribing and breaking of the fragile substrate on a platform. [Means for Solving the Problems] Features of the invention The reason is that for the scribe line 4 formed on the brittle substrate, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) — · -------- * Packing ------- -Order --------- (Please read the notes on the back before filling out this page) 527328 A7 -----— B7 ____ V. Description of the invention (;))-> ---- ---- I --- (Please read the precautions on the back before filling this page) 'Make the enclosed space with a predetermined width by including the line in the center, and by decompressing the enclosed space, Let's bend the brittle substrate slightly into an inverted V shape to break it. [Embodiment of the Invention] Fig. 4 shows The assembly diagram of the breaking rod 25 using the breaking method of the present invention is shown. As shown in the figure above, the columnar rectangular parallelepiped 21 made of aluminum is used. The size, depending on the processing object, can be taken from 300mm to 300mm ~ 1000mm, 10 ~ 30mm, 10 ~ 50mm. In the center of the upper surface of the columnar rectangular parallelepiped, grooves 21a with a width of 6mm and a depth of 0.5mm are formed along the column direction. Next, as shown in the figure, at both ends of the groove 21a A spacer 22 composed of a total of four elastomers is embedded at the inner side of a predetermined length from both ends. The thickness of each spacer 22 is the same as the depth of the groove 21a. With these spacers 22, the groove 21a is divided into three sections in the column direction. In each section, suction holes 23 penetrating from the bottom surface of the groove to the bottom of the rectangular parallelepiped 21 are formed. As shown in the figure below, a suction plate 24 having a thickness of 5 mm is formed by joining an elastic body to the upper surface of the rectangular parallelepiped 21. Thereby, three closed sections are formed in the groove 21a. Corresponding to these three closed sections, notches 24a are formed in the suction plate 24 and penetrate to the lower surface. In this way, a breaking rod 25 is prepared. The incisions 24a here are cut into three corresponding to the aforementioned three closed sections, but one continuous incision may be formed. As the suction plate 24 and the separator 22, it is used with little deterioration over the years, and has a high incidence. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 527328 A7 _ ___B7______ 5. Description of the invention (1) () Foam silicone sponge sheet (spring hardness test (Japanese Rubber Association Standard Specification: SRIS 0101-1968) is 5 ~ 30), but it only needs to be a material with an appropriate elastic coefficient. At the time of breaking, as shown in Fig. 5, the surface of the suction plate 24 is used in contact with the fragile substrate 3. A pipe plug 26 provided in an opening portion of the suction hole 23 is connected to a pipe for vacuuming. Fig. 5 shows the case where the length of the broken rod and the length of the scribe line S of the brittle substrate 3 are substantially equal. At this time, the vacuum is simultaneously evacuated from the three plugs 26, but as shown in Fig. 6, when the scribe length ratio of the brittle substrate is When the length of the breaking rod is short, vacuum is evacuated by the central plug 26. Fig. 4 illustrates a case where there are three closed sections, but it is preferable to set 4 to 20 closed sections in accordance with the cutting conditions of the fragile substrate, and individually control the vacuum pressure of each section. Fig. 7 is a vertical cross-sectional view of the plug 26 of Fig. 5 (the same is true of Fig. 6). The scribe line S of the fragile substrate 3 and the line of the cutout 24a are made substantially the same. It should be noted here that the scribe line S is not underneath but rather above the brittle substrate 3, and there is no need for a buffer plate between the brittle substrate 3 and the platform 6. Next, as shown in FIG. 8, a vacuum is evacuated from the plug 26, and the suction plate 24 is slightly changed into an inverted V shape. Following this, the fragile substrate 3 is deformed. With this deformation, the crack of the scribe line S is directed downward. Growing further cuts the fragile substrate 3. By forming the cutout 24a in the suction plate 24, as shown in FIG. 7, in a state where the breaking rod 25 comes into contact with the fragile substrate 3 due to its own weight, a small amount of voids exist on the joint surface of the two. Residual air is sucked out to increase the attraction between the two. Instead of this cutout 24a, set row 6 ------------ I --- (Please read the precautions on the back before filling this page) Order · This paper size applies to China National Standard (CNS) A4 Specifications (210 X 297 mm) 527328 A7 _____B7___ V. Description of the invention (<) ---.-------- I --- (Please read the notes on the back before filling this page) In a row It is also possible to make small holes, and when the adhesion between the fragile substrate 3 and the suction plate 24 is good, even if such a cutout is not provided, the expected attractive force can be obtained. Fig. 9 is a perspective view showing an embodiment of the breaking device 30 using the breaking rod 25 described above. The platform 6 can be moved in the Y direction and can be rotated by 90 degrees and Θ to attract and fix the fragile substrate 3 on the platform surface. The bridge portion 31 spanning the platform 6 is composed of support plates on both sides and a top plate 31a extending in the horizontal X direction supported by the support plates. A cylinder 32 is provided in the center of the top plate 31a. The lower end portion of the cylinder shaft 33 extending downward from the cylinder 32 supports the upper center portion of the breaking rod 25. The driving of the cylinder 32 is used to move the breaking rod 25 up and down. In order to prevent the breaking rod 25 from colliding with the brittle substrate 3 when it is lowered, a stopper mechanism 37 is provided as shown in a partially enlarged view, which is fixed to the cylinder shaft 33. The locking piece. 34, an L-shaped stopper member 25 with one end fixed to the top plate 31a, a screw 36 screwed into a screw hole provided in the stopper piece 34, and a lower end portion abutting on a horizontal portion of the stopper member 35 above the screw 36 . The screw 36 and the like are rotated through a hole Q provided in the top plate 31a, and the lowering position of the breaking rod 25 is adjusted according to the thickness of the glass plate 3. Instead of the stopper mechanism 37, an appropriate braking mechanism capable of slowly lowering the breaking rod 25 may be provided. The breaking bar 25 is provided with a guide bar 38 so that it can move in parallel when it is raised and lowered. Among the three plugs 26, the central plug is connected to the vacuum pump through the valve VI, and the two plugs 26 at both ends are connected to the vacuum pump through the valve V2. When the general fracture is shown in Fig. 5, valves VI and V2 are opened at the same time, and when the general fracture is shown in Fig. 6, only valve VI is opened. 7 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 527328 A7 _ B7_ V. Description of the invention (γ) (Please read the precautions on the back before filling this page) Vacuum pressure during evacuation Can be adjusted within the range of gauge pressure -1.33 X 102Pa (-ImmHg) ~ -8 · 64 X 104Pa (-650mmHg). On the other hand, the vacuum pressure for attracting and fixing the fragile substrate 3 on the platform 6 is- 1.33 × 10 Pa (-ImrnHg) The suction hole formed on the platform 6 has a diameter of 2 mm. As long as the vacuum pressure for fixing the glass plate is smaller than the vacuum pressure for breaking (closer to atmospheric pressure), even if the suction hole is formed just below the scribe line, the fracture will not be prevented. Fig. 10 is a system diagram showing the processing of a brittle substrate using the above-mentioned breaking device 30. The bonded glass substrate 3 'is fixed to the stage of the scribe device S1 by a material transfer machine or the like, and the upper surface A is scribed. The mechanism of the scribing device is described with reference to FIG. 11. The laminated glass substrate 3 'on the A side is directly fixed on the platform of the A-side breaking device (the breaking device shown in Fig. 9) by the conveyor with the A side on the upper side, and the breaking method according to the present invention The surface A is broken. The laminated glass substrate is reversed by the turning machine and fixed on the platform of the second guide line scribing device S2 (when the system is only composed of the scribing device S1 and the breaking device B1, it will be returned to the plan.线 装置 S1). Then, the B plane on the upper side is underlined. The bonded glass substrate on which the B surface is scribed is directly fixed on the platform of the second B surface breaking device B2 (or the aforementioned breaking device B1) by the conveyor so that the B surface is on the upper side, and the B surface is broken. In this way, the processing of laminating the glass substrate is completed, and it is moved to the next process with a material transfer machine. Figure 11 shows that the scribing device of a fragile substrate can be broken at the same time. 8 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm-1 527328 A7 ____B7______) 5. Description of the invention (\) Line and fracture device The first embodiment of 40. The bridge portion 41 spanning the platform 6 is composed of support pillars on both sides and a guide rod 42 extending in the X direction. The guide rod 42 is provided with a rod extending in the same direction. Guide 42a. The scribe head 43 is provided to be able to move along the guide 42a through the supporter support body 44. A lower part of the scribe head 43 is provided with a piece for holding the knife. 46. Behind the scribing mechanism composed of the above elements, there is a fracture mechanism including a bridge portion as illustrated in Fig. 9. Behind the fracture mechanism, an alignment for identifying a mark on the brittle substrate 3 is provided. One of the markers is a pair of cameras 51 and 52. The images captured by the cameras are displayed on the monitors 53 and 54. At the same time, the image recognition device is used to perform image recognition of the alignment mark and calculate its position data. As mentioned above, according to the present invention, No need to turn after marking Fragmentation can be performed by turning the brittle substrate, and the breaking device 7 shown in FIG. 1 is not required in the breaking device, so it can be broken even on the platform where the scribing is performed. Next, on the platform, the airflow or brush is used to remove the cut. The powdery broken glass is shown in Fig. I2, which shows a processing system of a laminated glass substrate using the above-mentioned scribing and breaking device 40. The laminating glass substrate 3 is fixed to the scribing and breaking device by a material conveyor or the like. On the platform of SB1, the A surface on the upper side is scribed and then fractured. The bonded glass substrate 3 'that has been scribed and fractured on the A surface is fixed on the second scribing and breaking device SB2 after the surface is reversed. On the platform (when the system consists only of the scribing and breaking device SB1, the scribing and breaking device SB1 is returned.) Then, the B surface on the upper side is scribed and broken, and moved to the next 9-paper scale Applicable to China National Standard (CNS) A4 specification (210 X 297 mm) --.-------- ^ _ w I -------- Order · I ------- (Please (Please read the notes on the back before filling this page) 527328 A7 ^ ___ B7______ V. Description of Invention (g) Process. The plate-type fragile substrate and the bonded fragile substrate are completely cut. According to the cutting conditions and the conditions attached to the production method of the next stroke, a plurality of breaking devices are necessary. For example, in the breaking of a single-plate type brittle substrate, The fracture in the first direction and the fracture in the second direction separated by 90 ° from the first direction are respectively used by the fracture device of the present invention. When the bonded brittle substrate is cut into a short grid shape and then sent to the next stroke Before the next stroke, the fracture device of the present invention is used separately on the front and back of the fragile substrate. The dimensions of the groove 21a and the suction plate 24 (FIG. 4) used in this embodiment are only examples. The dimensions applicable to the implementation of the invention are as follows: slot width: 3mm ~ 10mm slot depth: 0.1mm ~ 1mm plate thickness: 1mm ~ 8mm [Effect of the invention] As explained above, the present invention does not The fragile substrate (that is, the scribe line is located on the upper side) can be broken, so the processing system shape of the fragile substrate can be reduced, and the operation time required for the entire processing can be shortened because no turning step is required. At the time of the fracture, since the buffer material between the brittle substrate and the platform is unnecessary, the fracture can be performed on the platform of the scribing device at a time. In this case, the scribed brittle substrate is sent from the scribing device. The transport mechanism to the breaking device also becomes unnecessary, and the system size can be shortened and 10 papers can be added. The paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). F Please read the precautions on the back before filling in this Page) Equipment · 527328 ΚΙ _Β7 ___ V. Description of invention (') Working time. (Please read the precautions on the back before filling in this page) [Simplified description of the diagram] Figure 1 shows the past scribing and breaking of single-plate type fragile substrates. Figure 2 shows the past of laminating glass substrates. Line and break. FIG. 3 shows the inversion steps of flipping the front and back surfaces of the fragile substrate. Fig. 4 is an assembly view showing a breaking rod of the present invention. FIG. 5 shows how the fractured rod of FIG. 4 is fractured. FIG. 6 shows how the brittle substrate is broken when the substrate is small. FIG. 7 is a longitudinal sectional view of the pipe plug of FIG. 5. Fig. 8 shows how the fracture of Fig. 5 is performed. Fig. 9 is a perspective view showing an embodiment of a breaking device using the above-mentioned breaking rod. Fig. 10 is a processing system diagram of a brittle substrate using the above-mentioned breaking device. Fig. 11 is a perspective view showing an embodiment of a scribing and scoring device including a scoring mechanism of Fig. 9 in a conventional scribing device. Fig. 12 is a processing system diagram of a brittle substrate using the scribing and breaking device. [Explanation of Symbols] 3 ... Fragile substrate 6 ... Platform This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 527328 A7 _B7 V. Description of the invention (\ Ό) 21a ... Slot (please read the back first Note: Please fill in this page again) 22 ... Separator 23 ... Suction hole 24 ... Suction plate 24a ... Cutout 25 ... Breaking rod 26 ... Pipe plug 30 ... Breaking device 31 ... Bridge 32 ... Cylinder 33 ... Cylinder shaft 34-- -^ Stop piece 35 ... Stop member 3 6 ... Screw 37 ... Stop mechanism 40 ... Scribe and break device 41 ... Bridge 42 ... Guide bar 43 ... Scratch head 44 ... Bearing support 45 ... Cutter wheel 46 ... sheet support with S ... scribe This paper is sized for China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

527328527328 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 1、 一種脆性基板之製造方法，其特徵在於··係以將脆 性基板上所形成的劃線包含於大致中央的方式作出涵蓋既 定幅寬的封閉空間，藉由將該封閉空間減壓，來使脆性基 板彎曲並斷裂，藉以製造出複數個脆性基板。 2、 一種脆性基板之製造裝置，係具備封閉空間形成機 構(以將脆性基板上所形成的劃線包含於大致中央的方式形 成涵蓋既定幅寬的封閉空間）、以及將前述封閉空間減壓之 減壓機構；其特徵在於： 藉由將前述封閉空間減壓，來使脆性基板彎曲並斷裂 ，藉以製造出複數個脆性基板。 3、 如申請專利範圍第2項之脆性基板之製造裝置，其 中前述封閉空間形成機構，係沿劃線方向具有凹狀槽之封 閉構件。 4、 如申請專利範圍第3項之脆性基板之製造裝置，其 中前述槽係具備複數個能個別進行減壓之區域。 5、 如申請專利範圍第3或第_4項之脆性基板之製造裝 置，其中前述封閉構件朝脆性基板的抵接面上，係貼附有 氣密保持用的吸引板。 6、 如申請專利範圍第5項之脆性基板之製造裝置，其 中前述吸引板上，沿劃線方向形成有貫通該吸引板厚度方 向之切口。 7 ' —種脆性基板之製造裝置，其具備劃線機構，該劃 線機構係具備： 至少能移動於Y方向及0方向之平台， 1 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 x 297公釐） — "" —^-----------------訂—-------- (請先閱讀背面之注意事項再填寫本頁) 527328 經濟部智慧財產局員工消費合作社印製 §88 C8 D8 -- ' _ _ 六、申請專利範圍 位於前述平台上方之延X方向延伸的導棒， 設成能沿前述導棒移動之劃線頭，以及 以能上下動及擺動的方式設在前述劃線頭下部之片支 持具； 1=1 藉由前述劃線機構之劃線、及使用封閉空間形成機構 和減壓機構來使脆性基板彎曲並斷裂，以製造出複數個脆 性基板。 8、 如申請專利範圍第7項之脆性基板之製造裝置，係 進一步具備將脆性基板翻轉後搬送之翻轉搬送裝置； 前述平台上所裝載之脆性基板爲貼合脆性基板； 對前述貼合脆性基板的上側之第1脆性基板進行劃線 及斷裂後，用前述翻轉搬送機構將貼合脆性基板的表裏翻 轉後裝載於平台上，對前述貼合脆性基板的上側之第2脆 性基板進行劃線及斷裂，藉以製造出複數個貼合脆性基板 〇 9、 如申請專利範圍第1項之脆性基板之製造方法，係 具備劃線機構，該劃線機構係具備·· 至少能移動於Y方向及0方向之平台， 位於前述平台上方之延X方向延伸的導棒， 設成能沿前述導棒移動之劃線頭，以及 以能上下動及擺動的方式設在前述劃線頭下部之片支 持具丨 並具備：藉由前述劃線機構對平台上所裝載的脆性基 板進行劃線之步驟，以及 2 _ (請先閱讀背面之注意事項再填寫本頁) 裝 訂--------- Φ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 527328 A8 B8 C8 D8 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 六、申請專利範圍 使用封閉空間形成機構和減壓機構將封閉空間減壓， 而進行斷裂之步驟。 a 10、 如申請專利範圍第9項之脆性基板之製造方法， 係進一步具備將脆性基板翻轉後搬送之翻轉搬送裝置； 前述平台上所裝載之脆性基板爲貼合脆性基板； 並具備：對前述貼合脆性基板的上側之第1脆性基丰反 進行劃線及斷裂之步驟， & 用前述翻轉搬送機構將貼合脆性基板的表裏翻轉後裝 載於平台上之步驟，以及 對即述貼合脆性基板的上側之第2脆性基板進行晝[j,綠 及斷裂之步驟。 S π 11、 如申請專利範圍第7項之脆性基板之製造裝置， 係進一步具備將脆性基板翻轉後搬送之翻轉搬送裝置、至 少1台前述劃線機構、至少1台斷裂機構； 前述劃線機構之平台上所裝載之脆性基板爲貼合脆性 基板； 對前述貼合脆性基板的上側之第1脆性基板進行劃線 及斷裂後， 、 里"7 用前述翻轉搬送機構將貼合脆性基板的表裏翻轉後裝 載於劃線機構之平台上， 衣 對前述貼合脆性基板的上側之第2脆性基板進行劃線 及斷裂， 里、 藉以製造出複數個貼合脆性基板。 12、 如申請專利範圍第9項之貼合脆性基板之製造方 !,-------丨！！訂---------參 (請先閱讀背卧之注意事項再填寫本頁) 527328 A8 B8 C8 D8 t、申請專利範圍 法，係進一步具備將脆性基板翻轉後搬送之翻轉搬送裝置 、至少1台前述劃線機構、至少1台斷裂機構； (請先閱讀背面之注意事項再填寫本頁) 前述劃線機構之平台上所裝載之脆性基板爲貼合脆性 基板； 並具備：對前述貼合脆性基板的上側之第1脆性基板 進行劃線及斷裂之步驟， 用前述翻轉搬送機構將貼合脆性基板的表裏翻轉後裝 載於劃線機構之平台上之步驟，以及 對前述貼合脆性基板的上側之第2脆性基板進行劃線 及斷裂之步驟。 經濟部智慧財產局員工消費合作社印製 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 6. Scope of Patent Application 1. A method for manufacturing a fragile substrate, which is characterized by covering the predetermined width by including the scribe line formed on the fragile substrate in the approximate center. The wide closed space reduces the pressure of the closed space to bend and break the brittle substrate, thereby manufacturing a plurality of brittle substrates. 2. A manufacturing device for a fragile substrate is provided with a closed space forming mechanism (a closed space covering a predetermined width is formed by including a scribe line formed on the fragile substrate at substantially the center), and a pressure reducing method for the aforementioned closed space is provided. The decompression mechanism is characterized in that a plurality of brittle substrates are manufactured by bending and breaking the brittle substrate by decompressing the closed space. 3. For a manufacturing device for a brittle substrate according to item 2 of the scope of patent application, wherein the aforementioned closed space forming mechanism is a closed member having a concave groove along the scribe direction. 4. For the manufacturing device of brittle substrate according to item 3 of the patent application range, wherein the aforementioned grooves are provided with a plurality of regions capable of individually reducing pressure. 5. For the manufacturing device of a brittle substrate according to item 3 or _4 of the scope of application for a patent, wherein the abutment surface of the aforementioned sealing member facing the brittle substrate is attached with a suction plate for airtight maintenance. 6. The manufacturing device for a fragile substrate according to item 5 of the patent application, wherein the suction plate is formed with a cutout in the thickness direction of the suction plate through the thickness direction of the suction plate. 7 '— A fragile substrate manufacturing device with a scribing mechanism, the scribing mechanism is equipped with: a platform that can move at least in the Y direction and 0 direction, 1 This paper size applies the Chinese National Standard (CNS) A4 specification (21 〇x 297 mm) — " " — ^ ----------------- Order —-------- (Please read the notes on the back before filling (This page) 527328 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs §88 C8 D8-'_ _ VI. The patent application guide is located above the platform and extends in the X direction. It is set to move along the guide. Scribing head, and a sheet support provided in the lower part of the scribing head in a manner capable of moving up and down and swinging; 1 = 1 The scribing line of the scribing mechanism described above, and the use of a closed space forming mechanism and a pressure reducing mechanism are used. The fragile substrate is bent and broken to produce a plurality of fragile substrates. 8. The brittle substrate manufacturing device such as the scope of patent application No. 7 is further equipped with a reversing conveying device that transfers the brittle substrate after being flipped; the brittle substrate loaded on the aforementioned platform is a bonded brittle substrate; the aforementioned bonded brittle substrate is After the first fragile substrate on the upper side is scribed and broken, the front and back surfaces of the bonded fragile substrate are reversed by the reversing conveying mechanism, and then loaded on the platform, and the second fragile substrate on the upper side of the fragile substrate is scribed and broken. It is broken to produce a plurality of bonded brittle substrates. 9. The method for manufacturing a brittle substrate such as the first patent application scope is provided with a scribing mechanism. The scribing mechanism is capable of moving at least in the Y direction and 0 The platform in the direction, a guide rod extending in the X direction above the platform, is provided with a scribe head capable of moving along the guide rod, and a sheet support provided under the scribe head in a manner capable of moving up and down.丨 It also has the steps of scribing the fragile substrate loaded on the platform by the aforementioned scribing mechanism, and 2 _ (Please read the precautions on the back first (Fill in this page again) Binding --------- Φ This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 527328 A8 B8 C8 D8 6. Scope of patent application The closed space forming mechanism and decompression mechanism are used to decompress the closed space to perform the breaking step. a 10. The method for manufacturing a fragile substrate according to item 9 of the scope of the patent application, further comprising a reversing conveying device for reversing and conveying the fragile substrate; the fragile substrate loaded on the aforementioned platform is a bonded fragile substrate; and having: The first fragile substrate on the upper side of the bonded fragile substrate is subjected to the steps of scribing and breaking, & the step of turning the front and back of the bonded fragile substrate on the platform using the above-mentioned reversing conveying mechanism, and bonding to the platform The second fragile substrate on the upper side of the fragile substrate is subjected to the day [j, green, and fracture steps. S π 11. The manufacturing device for a fragile substrate, such as item 7 of the scope of patent application, is further provided with a reversing conveying device that transfers the fragile substrate after being turned over, at least one of the aforementioned scribing mechanism, and at least one breaking mechanism; The fragile substrate mounted on the platform is a bonded fragile substrate. After the first fragile substrate on the upper side of the fragile bonded substrate is scribed and broken, the " 7 will be used to mount the fragile substrate bonded by the above-mentioned reversing transfer mechanism. After the surface is flipped, it is mounted on the platform of the scribing mechanism, and the clothing scribes and breaks the second fragile substrate on the upper side of the above-mentioned bonded fragile substrate, thereby manufacturing a plurality of bonded fragile substrates. 12, such as the application of the patent scope of the manufacturer of the bonding of fragile substrate !, ------- 丨! !! Order --------- Refer to (Please read the precautions for back lying first and then fill out this page) 527328 A8 B8 C8 D8 t, Patent Application Scope Law, which is further equipped with a flipping device for flipping brittle substrates 1. At least one of the aforementioned scribing mechanism and at least one breaking mechanism; (Please read the precautions on the back before filling this page) The brittle substrate loaded on the platform of the aforementioned scribing mechanism is a laminating substrate; and it has: The step of scribing and breaking the first fragile substrate on the upper side of the bonded fragile substrate, a step of loading the fragile substrate on the surface of the fragile substrate on the platform of the scribing mechanism by using the reversing transfer mechanism, and bonding The second fragile substrate on the fragile substrate is subjected to scribing and breaking steps. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
TW090123554A 2000-10-02 2001-09-25 Method and device for manufacturing brittle substrates TW527328B (en)

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JP2002103295A (en) 2002-04-09
CN1238167C (en) 2006-01-25
HK1048280A1 (en) 2003-03-28
KR100573207B1 (en) 2006-04-24
CN1348850A (en) 2002-05-15
JP3787489B2 (en) 2006-06-21

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