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TW202306009A - Loading device and method for prefabricated wafer carry tray can respectively stack and assemble the wafer ring, the wafer and the cover, precisely move and secure them in different positions on the carry tray - Google Patents

Loading device and method for prefabricated wafer carry tray can respectively stack and assemble the wafer ring, the wafer and the cover, precisely move and secure them in different positions on the carry tray Download PDF

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TW202306009A
TW202306009A TW110126135A TW110126135A TW202306009A TW 202306009 A TW202306009 A TW 202306009A TW 110126135 A TW110126135 A TW 110126135A TW 110126135 A TW110126135 A TW 110126135A TW 202306009 A TW202306009 A TW 202306009A
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wafer
loading
assembly
ring
assembled
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TW110126135A
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TWI819334B (en
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宋茂炎
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總督科技股份有限公司
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Priority to US17/812,187 priority patent/US20230016132A1/en
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Abstract

A loading device and a method for a prefabricated wafer carry tray are configured to have a wafer ring loading mechanism, a wafer loading mechanism, a cover loading mechanism and a robotic arm on the periphery of a first displacement mechanism. The first displacement mechanism has a first seat. There are a plurality of assembled-member carrying parts arranged on a carry tray, and a plurality of clamps arranged on the periphery of each assembled-member carrying part. A moving end of the robotic arm is disposed with an image capturing component and a loading-unloading mechanism. The wafer ring loading mechanism is configured to place a wafer ring on the first seat, the wafer loading mechanism is configured to place a wafer in the wafer ring, and the cover loading mechanism is configured to stack a cover on the wafer to form an assembled member. A robotic-arm correctable loading and unloading mechanism is configured to be correctly correspondent to the pending assembled-member carrying part on the carry tray. The loading-unloading mechanism releases each clamp, moves the assembled member from the first seat onto the pending assembled-member carrying part, and then locks each clamp to secure the assembled member on the carry tray.

Description

預治式晶圓載盤之置載裝置及其方法Mounting device and method for precured wafer carrier

本發明是有關預治式晶圓載盤之置載裝置及其方法,尤指一種利用簡單機構及操作,可分別將晶圓環、晶圓、遮蓋疊置組合,並精確移置固定於一載盤上不同位置之置載裝置及其方法。The present invention relates to a loading device and method for a precured wafer carrier, in particular to a wafer ring, a wafer, and a cover that can be stacked and combined with a simple mechanism and operation, and can be accurately displaced and fixed on a carrier. Mounting device and method for different positions on a disc.

一般的積體電路(integrated circuit, IC)製造過程主要可分為:矽晶圓製造、積體電路製作以及積體電路封裝等三大部分;當矽晶棒切割成晶圓後,還需要經過黃光、長晶、蝕刻、機械研磨等多道手續繁雜的流程,方能完成積體電路的製作,而在上述的製造過程中,晶圓在進行測試、清洗、蒸鍍、乾燥或浸泡有機溶劑等流程時,為能有效固定晶圓以便於加工,且能同時處理大量晶圓以增進加工效率,大多會將多個晶圓固定於一大面積的載盤上,由該載盤同時承載各晶圓進行上述各流程的加工作業。The general integrated circuit (integrated circuit, IC) manufacturing process can be divided into three parts: silicon wafer manufacturing, integrated circuit manufacturing, and integrated circuit packaging. Yellow light, crystal growth, etching, mechanical grinding and other complicated procedures can complete the production of integrated circuits. In the above-mentioned manufacturing process, wafers are tested, cleaned, evaporated, dried or soaked in organic In solvent and other processes, in order to effectively fix the wafers for processing, and to process a large number of wafers at the same time to improve processing efficiency, most wafers are fixed on a large-area carrier, and the carrier is simultaneously carried Each wafer performs the processing operations of the above-mentioned processes.

常見的載盤基本結構,乃為一大面積的凸(或凹)弧面狀盤體結構,於該載盤上設有多個可供收容晶圓之鏤空部,且於各鏤空部周側設有多個可固定晶圓之夾具,當各晶圓受夾具固定於該鏤空部的上方(凸弧面的外凸表面或凹弧面的內凹表面),可使各晶圓經由該鏤空部對外顯露待加工之部位,因此利用該載盤可容置多個晶圓並同時移至各不同的加工程序,以有效增加晶圓整體加工之效率。The basic structure of a common carrier plate is a large-area convex (or concave) arc-shaped disc structure. There are multiple hollow parts on the carrier plate that can accommodate wafers, and on the sides of each hollow part There are multiple fixtures that can fix the wafer. When each wafer is fixed above the hollow part by the fixture (the convex surface of the convex arc surface or the concave surface of the concave arc surface), each wafer can pass through the hollow The part to be processed is exposed outside, so multiple wafers can be accommodated and moved to different processing programs at the same time by using the carrier plate, so as to effectively increase the efficiency of the overall processing of wafers.

而隨著自動化機械加工逐漸普及,利用各種自動機械執行晶圓在載盤上的取放作業,不但可節省大量人力,並可降低生產成本、增進加工效率,已為必然的趨勢,但由於晶圓本身極為脆弱,且對於加工精密度的要求極高,因此,不但對於相關移置機構取放晶圓時的作業精確度有極高的要求,且在利用多個移置機構分別執行晶圓及相關組件的組合或疊置作業時,各移置機構之間亦必須具有精準的銜接,否則,極易影響整體移置的組合精度及成品品質,甚至於造成半成品毀損之情形;故而,如何有效校準各移置機構,使其不但在單一移置機構進行不同物件移置動作時保持極佳準確性,亦可使不同移置機構之間形成極佳的相對活動關聯性,以確保各移置機構在移置相同物件的作業連結精確度,乃為各相關業者所亟待努力的一主要課題。With the gradual popularization of automated mechanical processing, it is an inevitable trend to use various automatic machines to perform pick-and-place operations of wafers on the tray, which can not only save a lot of manpower, but also reduce production costs and improve processing efficiency. The circle itself is extremely fragile and has extremely high requirements for processing precision. Therefore, not only does it have extremely high requirements for the operation accuracy of the relevant displacement mechanism when picking and placing the wafer, but also when using multiple displacement mechanisms to perform wafer processing separately. When combining or stacking related components, there must be a precise connection between the displacement mechanisms, otherwise, it is very easy to affect the combination accuracy of the overall displacement and the quality of the finished product, and even cause damage to the semi-finished product; therefore, how to Effectively calibrate each displacement mechanism, so that it not only maintains excellent accuracy when a single displacement mechanism performs different object displacement actions, but also forms an excellent relative activity correlation between different displacement mechanisms to ensure that each displacement mechanism The operation link accuracy of the placement mechanism in the displacement of the same object is a major issue that all related businesses need to work on urgently.

有鑑於習見將晶圓移置至載盤上之移置機構有上述應用需求,發明人乃針對該些需求研究改進之道,終於有本發明產生。In view of the above-mentioned application requirements of the conventional displacement mechanism that transfers the wafer to the carrier, the inventor researched an improvement method for these requirements, and finally produced the present invention.

本發明之主要目的在於提供一種預治式晶圓載盤之置載裝置及其方法,係於一第一位移機構的周側設有晶圓環置載機構、晶圓置載機構、遮蓋置載機構及第二位移機構,且於該第一位移機構、第二位移機構之間設有一機械臂;該第一位移機構具有一可往復位移之第一座體,該第一座體上設有一晶圓預治部,該第二位移機構上設有一可活動之載盤,該載盤上設有複數組合件承載部,各組合件承載部周緣設有複數夾具,該機械臂的活動端上設有一影像攫取組件及一裝卸機構;該晶圓環置載機構係能將一晶圓環置於該晶圓預治部內,由該晶圓置載機構將一晶圓置於該晶圓環內,再由該遮蓋置載機構將一遮蓋置於該晶圓環內並疊置於該晶圓上形成一組合件,使該晶圓之周側被穩固夾持在該晶圓環及遮蓋的周緣之間,以令該晶圓能在組合件中維持良好的平整度,該機械臂能帶動裝卸機構、影像攫取組件分別校正其裝卸作業面及取像面,使該裝卸機構可正向且準確對應於該載盤上一待組裝位置之待組裝的組合件承載部,該裝卸機構可先解鎖各夾具,再將該組合件由該第一座體移置於該待組裝的組合件承載部上,然後該裝卸機構鎖掣各夾具,將該組合件固定於該待組裝的組合件承載部上,且該載盤轉動,使另一組合件承載部移至該待組裝位置,藉由上述結構簡單、成本低廉之結構,配合規劃合理且順暢之動作流程,可有效降低設備的建置成本,並提升組裝效率之功效。The main purpose of the present invention is to provide a loading device and method for a pre-cured wafer carrier, which is equipped with a wafer ring loading mechanism, a wafer loading mechanism, a cover loading mechanism, and a surrounding side of a first displacement mechanism. mechanism and a second displacement mechanism, and a mechanical arm is provided between the first displacement mechanism and the second displacement mechanism; the first displacement mechanism has a first seat that can move backwards, and a In the wafer pretreatment part, a movable carrier plate is provided on the second displacement mechanism, and a plurality of assembly bearing parts are arranged on the carrier plate, and a plurality of clamps are arranged on the periphery of each assembly carrier part, and the movable end of the mechanical arm is An image capture unit and a loading and unloading mechanism are provided; the wafer ring loading mechanism can place a wafer ring in the wafer pretreatment section, and a wafer is placed on the wafer ring by the wafer loading mechanism Inside, a cover is placed in the wafer ring by the cover loading mechanism and stacked on the wafer to form an assembly, so that the peripheral side of the wafer is firmly clamped on the wafer ring and the cover Between the periphery of the wafer, so that the wafer can maintain a good flatness in the assembly, the mechanical arm can drive the loading and unloading mechanism, and the image capture component to correct the loading and unloading operation surface and the image pickup surface respectively, so that the loading and unloading mechanism can be positive And accurately corresponding to the assembly bearing part to be assembled at a position to be assembled on the tray, the loading and unloading mechanism can unlock each clamp first, and then move the assembly from the first seat to the assembly to be assembled Then the loading and unloading mechanism locks the clamps to fix the assembly on the loading portion of the assembly to be assembled, and the tray rotates to move the loading portion of the other assembly to the position to be assembled. The above structure with simple structure and low cost, combined with a rationally planned and smooth operation process, can effectively reduce the construction cost of equipment and improve the efficiency of assembly.

本發明之另一目的在於提供一種預治式晶圓載盤之置載裝置及其方法,其於裝卸機構周側設有複數測距元件,當該裝卸機構以一預設裝卸基準值之方向及角度接近該待組裝的組合件承載部後,可調整該裝卸機構位置,使各測距元件量測該待組裝的組合件承載部周側之距離為等長,藉以校正該裝卸機構的裝卸作業面之傾斜角度,使該裝卸機構能平行(具有相同之傾斜角度)對應於該待組裝的組合件承載部;而該影像攫取組件可以相同於該校正後裝卸作業面之方向及傾斜角度接近該待組裝的組合件承載部並直接取像,再調整該影像攫取組件位置,使其正向準確對應於該待組裝的組合件承載部,藉以校正該影像攫取組件之取像面的位置,同時利用該校正後取像面之位置的資訊修正該裝卸機構的位置,以使其裝卸作業面可正向且精確的對應於該待組裝的組合件承載部及其周邊組件。Another object of the present invention is to provide a loading device and method for a pre-cured wafer carrier, which is provided with a plurality of distance measuring elements on the periphery of the loading and unloading mechanism. After the angle is close to the bearing part of the assembly to be assembled, the position of the loading and unloading mechanism can be adjusted so that the distances measured by the distance measuring elements on the sides of the bearing part of the assembly to be assembled are equal, so as to correct the loading and unloading operation of the loading and unloading mechanism The inclination angle of the surface enables the loading and unloading mechanism to be parallel (with the same inclination angle) corresponding to the assembly bearing part to be assembled; and the image capture component can be close to the The assembly bearing part to be assembled is directly captured, and then the position of the image capturing component is adjusted so that its positive direction corresponds to the bearing part of the assembly component to be assembled, so as to correct the position of the image capturing surface of the image capturing component, and at the same time The position of the loading and unloading mechanism is corrected by using the information of the corrected position of the image-taking surface, so that the loading and unloading operation plane can be positively and accurately correspond to the assembly bearing part and its peripheral components to be assembled.

本發明之又一目的在於提供一種預治式晶圓載盤之置載裝置及其方法,該第一座體頂面於晶圓預治部周側設有具背光表面且可相對位移之夾套滑座,於各夾套滑座朝向該晶圓預治部一側分別設有凹弧部,且於該第一位移機構旁側設有一取像單元,當該取像單元取得移至該晶圓環上方之晶圓影像,可配合該等夾套滑座相互靠合使各凹弧部組合成一具背光效果之孔,可使該晶圓易於被導正對應該晶圓環,以利於後續將該晶圓準確置入該晶圓環內之作業的進行。Another object of the present invention is to provide a pre-cured wafer carrier loading device and its method. The top surface of the first base is provided with a backlight surface and a relative displacement jacket on the side of the wafer pre-cured part. Sliding seats, concave arcs are respectively provided on the side of each jacket sliding seat facing the wafer pretreatment part, and an imaging unit is provided on the side of the first displacement mechanism, when the imaging unit is moved to the wafer The wafer image on the top of the ring can be combined with the jacket slides to make the concave arcs form a hole with a backlight effect, so that the wafer can be easily guided to correspond to the wafer ring, which is beneficial to the follow-up The operation of placing the wafer into the wafer ring accurately.

為達成上述目的及功效,本發明所採行的技術手段包括:一種預治式晶圓載盤之置載裝置,包括:一第一位移機構,係連結並受一控制模組驅動,該第一位移機構具有一能往復移動之第一座體,於該第一座體上設有一晶圓預治部;一設置於該第一位移機構旁側之晶圓環置載機構,係連結並受驅動於該控制模組,該晶圓環置載機構具有一承托晶圓環的晶圓環供料座,於該晶圓環供料座旁側設有一晶圓環移置組件,該晶圓環移置組件能攜取及釋放該晶圓環,且該晶圓環移置組件能攜帶該晶圓環於該晶圓環供料座與該第一座體之晶圓預治部之間進行活動;一設置於該第一位移機構旁側之晶圓置載機構,係連結並受驅動於該控制模組,該晶圓置載機構具有一承托晶圓之晶圓供料座,於該晶圓供料座旁側設有一晶圓移置組件,該晶圓移置組件具有一晶圓托架,且該晶圓托架能受該晶圓移置組件帶動而能攜帶該晶圓於該晶圓供料座與該第一座體之晶圓預治部之間進行活動;一設置於該第一位移機構旁側之遮蓋置載機構,係連結並受驅動於該控制模組,該遮蓋置載機構具有一承托遮蓋的遮蓋供料座,於該遮蓋供料座旁側設有一遮蓋移置組件,該遮蓋移置組件能攜取及釋放該遮蓋,且於該遮蓋供料座與該第一座體之晶圓預治部之間進行活動;一載盤,表面上設有至少一組合件承載部,於各組合件承載部周側分別設有複數夾具;一機械臂,係連結並受驅動於該控制模組,該機械臂具有一能移動於該第一座體與該載盤之間的活動端,於該活動端上設有一裝卸機構。In order to achieve the above-mentioned purpose and effect, the technical means adopted by the present invention include: a pre-cured wafer carrier loading device, including: a first displacement mechanism, connected and driven by a control module, the first The displacement mechanism has a first seat body capable of reciprocating movement, on which a wafer pretreatment part is arranged; a wafer ring loading mechanism arranged on the side of the first displacement mechanism is connected and received Driven by the control module, the wafer ring loading mechanism has a wafer ring feeding seat for supporting the wafer ring, and a wafer ring displacement component is arranged beside the wafer ring feeding seat. The ring displacement component can carry and release the wafer ring, and the wafer ring displacement component can carry the wafer ring between the wafer ring feeding base and the wafer pretreatment part of the first base activities between them; a wafer loading mechanism arranged on the side of the first displacement mechanism is connected to and driven by the control module, and the wafer loading mechanism has a wafer feeding seat for supporting wafers A wafer displacement assembly is provided beside the wafer feeding seat, the wafer displacement assembly has a wafer bracket, and the wafer bracket can be driven by the wafer displacement assembly to carry the wafer The wafer moves between the wafer feeding seat and the wafer pretreatment part of the first seat; a cover loading mechanism arranged on the side of the first displacement mechanism is connected and driven by the control In the module, the cover loading mechanism has a cover material supply seat for supporting the cover, and a cover displacement component is arranged beside the cover supply seat, and the cover displacement component can carry and release the cover, and the cover displacement component can carry and release the cover. Covering the movement between the feeding seat and the wafer pre-processing part of the first seat body; a carrier plate with at least one assembly carrying part on the surface, and a plurality of clamps are respectively provided on the periphery of each assembly carrying part; A mechanical arm is connected to and driven by the control module. The mechanical arm has a movable end capable of moving between the first seat and the carrier, and a loading and unloading mechanism is arranged on the movable end.

依上述結構,其中該機械臂之活動端上另設有一能取得影像之影像攫取組件;該裝卸機構上分別設有可相對開合以夾持該組合件之夾持組件、複數對應並解鎖各夾具之夾具操作組件及複數可量測距離之測距元件。According to the above structure, the movable end of the mechanical arm is provided with an image capture unit capable of obtaining images; the loading and unloading mechanism is respectively provided with a clamping unit that can be opened and closed relatively to clamp the assembly, and a plurality of corresponding and unlocking components. The clamp operation component of the clamp and a plurality of distance-measuring components that can measure the distance.

依上述結構,其中該複數測距元件為可產生測距雷射光束之雷射光源,且係分別設置於該裝卸機構周側至少三點。According to the above structure, the plurality of distance measuring elements are laser light sources capable of generating distance measuring laser beams, and are respectively arranged at at least three points around the loading and unloading mechanism.

依上述結構,其中該第一位移機構旁側設有一連結並受該控制模組驅動之第二位移機構,該第二位移機構具有一可往復位移之第二座體,該於該第二座體上設有能承置該載盤之樞轉組件。According to the above structure, a second displacement mechanism connected and driven by the control module is provided beside the first displacement mechanism, and the second displacement mechanism has a second seat body that can move backwards. The body is provided with a pivoting assembly capable of bearing the tray.

依上述結構,其中該晶圓預治部係為一鏤空孔,該鏤空孔內設有一承托座,於該承托座頂面上凹設有一凹槽道,於該凹槽道二旁側設有複數能抽吸空氣之吸氣孔;該承托座底部設有一承托座升降組件,該承托座升降組件能帶動該承托座進行升降之動作。According to the above structure, wherein the wafer pretreatment part is a hollow hole, a support seat is provided in the hollow hole, a groove is recessed on the top surface of the support seat, and on both sides of the groove A plurality of suction holes capable of sucking air are provided; a support base lifting assembly is provided at the bottom of the support base, and the support base lifting assembly can drive the support base to perform lifting movements.

依上述結構,其中該第一座體係設置於複數平行延伸之第一導軌上,該第一座體頂面於該晶圓預治部周側設有複數可相對往復位移之夾套滑座,各夾套滑座頂側具有背光表面,於各夾套滑座朝向該晶圓預治部之一側設有凹弧部;且於該第一導軌旁側上方設有一可攫取影像之取像單元。According to the above structure, wherein the first seat system is arranged on a plurality of first guide rails extending in parallel, and the top surface of the first seat body is provided with a plurality of jacket slide seats that can move relatively reciprocally on the periphery of the wafer pre-processing part, The top side of each jacket slide has a backlight surface, and a concave arc is provided on the side of each jacket slide facing the wafer pre-processing part; and an image capture that can grab an image is provided above the side of the first guide rail unit.

依上述結構,其中該晶圓供料座上方設有一噴氣頭,該噴氣頭具有可朝下噴出空氣之噴氣孔,該晶圓托架頂面設有複數可抽吸空氣之抽氣孔。According to the above structure, an air spray head is arranged above the wafer feeding seat, and the air spray head has an air spray hole capable of ejecting air downward, and a plurality of air suction holes capable of sucking air are provided on the top surface of the wafer carrier.

依上述結構,其中該晶圓環供料座下方設有一晶圓環升降組件,該晶圓環升降組件係能帶動該晶圓環供料座進行升降之動作,該晶圓環移置組件具有一可升降之晶圓環移置滑座,於該晶圓環移置滑座上設有一能向往復位移之晶圓環移置導軌,於該晶圓環移置導軌上設有一能夾持該晶圓環之夾合組件;該晶圓供料座下方設有一晶圓升降組件,該晶圓升降組件係能帶動該晶圓供料座進行升降之動作,該晶圓移置組件具有複數平行於該第一導軌之晶圓移置導軌,以及一設置於各該晶圓移置導軌上且可往復位移之晶圓移置滑座,於該晶圓移置滑座上設有一可垂直升降之伸縮組件,該晶圓托架係設置於該伸縮組件之活動端;該遮蓋供料座下方設有一遮蓋升降組件,該遮蓋升降組件係能帶動該遮蓋供料座進行升降之動作,該遮蓋移置組件具有一可升降之遮蓋移置滑座,於該遮蓋移置滑座上設有一可橫向往復位移之遮蓋移置導軌,於該遮蓋移置導軌上設有一能夾持該遮蓋之夾爪組。According to the above structure, a wafer ring lifting assembly is arranged below the wafer ring feeding seat, and the wafer ring lifting assembly can drive the wafer ring feeding seat to lift and lower, and the wafer ring displacement assembly has A liftable wafer ring displacement slide seat, a wafer ring displacement guide rail capable of moving forward is provided on the wafer ring displacement slide seat, and a wafer ring displacement guide rail capable of clamping is provided on the wafer ring displacement guide rail The clamping component of the wafer ring; a wafer lifting component is arranged under the wafer feeding base, and the wafer lifting component can drive the wafer feeding base to lift. The wafer displacement component has a plurality of Wafer displacement guide rails parallel to the first guide rails, and a wafer displacement slide seat that is arranged on each of the wafer displacement guide rails and can move back and forth, and a vertically movable slide seat is provided on the wafer displacement slide seat. The telescopic assembly for lifting and lowering, the wafer bracket is set at the movable end of the telescopic assembly; a cover lifting assembly is provided under the cover feeding base, and the cover lifting assembly can drive the cover feeding base to lift and lower. The cover displacement assembly has a cover displacement slide seat that can be raised and lowered, and a cover displacement guide rail that can move horizontally and backwards is provided on the cover displacement slide seat, and a cover displacement guide rail that can hold the cover is provided on the cover displacement guide rail Gripper set.

依上述結構,其中該晶圓環之外周緣環設有一外環凸緣,該晶圓環之內周緣環設有一內環凸緣;該遮蓋中央設有一環凸部;該晶圓供料座上設置有能間隔收容晶圓之晶圓匣。According to the above structure, wherein the outer peripheral ring of the wafer ring is provided with an outer ring flange, the inner peripheral ring of the wafer ring is provided with an inner ring flange; the cover center is provided with a ring protrusion; the wafer feeding seat Wafer cassettes capable of accommodating wafers at intervals are provided on the top.

本發明所採行的技術手段另包括:一種應用前述之置載裝置的置載方法,包括:一「載盤、晶圓環、晶圓、遮蓋分別置於定位」程序,係將一空的載盤設置於預設之組裝定位,並將各晶圓環、晶圓、遮蓋分別置於預設供料定位;一「晶圓環置載機構將一晶圓環移置於第一位移機構中」程序,係由該晶圓環置載機構將一晶圓環由該供料定位移置並承托於該第一座體之晶圓預治部中;一「晶圓置載機構將一晶圓移置於該晶圓環中」程序,係由該晶圓置載機構將一晶圓移至該第一位移機構上進行導正,再將該晶圓置於該晶圓環中;一「遮蓋置載機構將一遮蓋疊置於該晶圓環中之晶圓上,形成一組合件」程序,係由該遮蓋置載機構將一遮蓋移置於該晶圓環中,並疊置於該晶圓上,藉以使該晶圓環、晶圓、遮蓋疊置形成一組合件;一「裝卸機構校正裝卸作業面」程序,係由該控制模組驅動該機械臂上之裝卸機構調整位置,使各測距元件量測該載盤上一待組裝位置之待組裝的組合件承載部周側之距離為等長,該裝卸機構得以一預設之裝卸作業面正向且平行對應該待組裝的組合件承載部,藉以校正該裝卸機構之裝卸作業面的傾斜角度,並由該控制模組儲存該校正後裝卸作業面之資訊;一「影像攫取組件檢視載盤上待組裝的組合件承載部周緣之影像,並校正取像面」程序,係由該控制模組驅動該機械臂上之影像攫取組件,依前述該校正後裝卸作業面之傾斜角度及方向檢視該待組裝的組合件承載部周緣及各夾具之影像,並調整該影像攫取組件至以一預設之取像面正確對應於該待組裝的組合件承載部及各夾具之位置,藉以校正該影像攫取組件之取像面的位置,且由該控制模組儲存該校正後取像面之資訊,同時該控制模組利用該校正後取像面之資訊進一步修正該裝卸作業面之相對位置,使該裝卸作業面可準確地對應於該待組裝的組合件承載部及各夾具的位置;一「裝卸機構將該組合件移置並鎖固於該待組裝的組合件承載部上」程序,係由該控制模組驅動該機械臂上之裝卸機構將該組合件由第一座體移置並鎖固於該待組裝的組合件承載部上。The technical means adopted by the present invention also include: a loading method using the aforementioned loading device, including: a program of "positioning the carrier plate, the wafer ring, the wafer, and the cover respectively", which is to place an empty carrier The tray is set at the preset assembly position, and each wafer ring, wafer, and cover are respectively placed at the preset feeding position; a "wafer ring loading mechanism moves a wafer ring into the first displacement mechanism "Procedure, a wafer ring is displaced from the feeding position by the wafer ring loading mechanism and supported in the wafer pre-processing part of the first seat; a "wafer loading mechanism places a The wafer is placed in the wafer ring" procedure, which is to move a wafer to the first displacement mechanism by the wafer loading mechanism for alignment, and then place the wafer in the wafer ring; A procedure of "stacking a cover on the wafer in the wafer ring by the cover placement mechanism to form an assembly" is that the cover placement mechanism transfers a cover to the wafer ring and stacks Placed on the wafer, so that the wafer ring, wafer, and cover are stacked to form an assembly; a "loading and unloading mechanism corrects the loading and unloading work surface" program, which is driven by the control module. The loading and unloading mechanism on the robotic arm Adjust the position so that the distances measured by each distance-measuring element on the side of the mounting part of the assembly to be assembled at a position to be assembled on the tray are equal in length, and the loading and unloading mechanism can be positively and parallel to a preset loading and unloading work surface The loading part of the assembly to be assembled is used to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism, and the information of the corrected loading and unloading operation surface is stored by the control module; The image of the periphery of the loading part of the assembly, and the correction of the image-taking surface" program is that the control module drives the image capture component on the robotic arm, and inspects the object to be assembled according to the inclination angle and direction of the corrected loading and unloading work surface. The image of the periphery of the assembly bearing part and each fixture, and adjust the image capture component to a preset image capture surface that corresponds to the position of the assembly load bearing part and each clamp to be assembled, so as to correct the image capture component The position of the image-taking surface, and the information of the corrected image-taking surface is stored by the control module, and at the same time, the control module uses the information of the corrected image-taking surface to further correct the relative position of the loading and unloading operation surface, so that the loading and unloading operation The surface can accurately correspond to the position of the loading part of the assembly to be assembled and the positions of the fixtures; a procedure of "displacing and locking the assembly on the loading part of the assembly to be assembled by the loading and unloading mechanism" is controlled by the The module drives the loading and unloading mechanism on the mechanical arm to displace the assembly from the first seat and lock it on the bearing part of the assembly to be assembled.

依上述方法,其中該「裝卸機構校正裝卸作業面」程序,具有:一「機械臂帶動裝卸機構以預設裝卸基準值接近載盤,並以測距元件量測與待組裝的組合件承載部邊緣之距離」步驟,係由該控制模組驅動該機械臂上之裝卸機構,以預設裝卸基準值之方向及角度移至該載盤上方;並利用各測距元件偵測至該待組裝的組合件承載部周側之距離;一「控制模組調整裝卸機構位置,使各測距元件之量測距離為等長,藉以校正其裝卸作業面之傾斜角度」步驟,係由該控制模組驅動該機械臂上之裝卸機構調整位置,使各測距元件偵測至該待組裝的組合件承載部周側之距離為等長,以確保該裝卸機構之裝卸作業面正向且平行地對應該待組裝的組合件承載部,藉以校正該裝卸機構之裝卸作業面的傾斜角度;且該控制模組儲存該校正後裝卸作業面之資訊;該「影像攫取組件檢視載盤上待組裝的組合件承載部周緣之影像,並校正取像面」程序,具有:一「機械臂帶動影像攫取組件以相同於該校正後裝卸作業面之傾斜角度接近載盤,並取得該待組裝的組合件承載部及各夾具之位置影像」步驟,係由該控制模組驅動該機械臂上之影像攫取組件,以相同於該校正後裝卸作業面之方向及傾斜角度移至該待組裝的組合件承載部上方,利用該影像攫取組件取得該待組裝的組合件承載部周邊的影像,藉以確認該待組裝的組合件承載部及各夾具之位置;一「控制模組調整影像攫取組件位置,使其正確對應該待組裝的組合件承載部,藉以校正其取像面之位置,且利用該校正後取像面之資訊修正該裝卸作業面,使其正向且準確對應該待組裝的組合件承載部」步驟,係由該控制模組驅動該機械臂上之影像攫取組件調整位置,使該影像攫取組件保持正確地對應該待組裝的組合件承載部及各夾具,藉以校正該影像攫取組件之取像面的位置;且該控制模組儲存該校正後取像面之資訊,並可計算出該裝卸機構的修正位置資訊,以便於再經由該機械臂帶動該裝卸機構移至位於正向準確且平齊地對應該待組裝的組合件承載部的位置。According to the above method, the program of "loading and unloading mechanism correcting the loading and unloading operation surface" includes: a "mechanical arm drives the loading and unloading mechanism to approach the carrier plate with a preset loading and unloading reference value, and uses the distance measuring element to measure the loading part of the assembly to be assembled The step of "distance from the edge" is that the control module drives the loading and unloading mechanism on the robotic arm to move to the top of the carrier in the direction and angle of the preset loading and unloading reference value; The distance between the sides of the bearing part of the assembly; a step of "controlling the module to adjust the position of the loading and unloading mechanism so that the measurement distances of each distance measuring element are equal in length, so as to correct the inclination angle of the loading and unloading work surface" is performed by the control module Drive the loading and unloading mechanism on the mechanical arm to adjust the position, so that the distances detected by each distance measuring element to the side of the bearing part of the assembly to be assembled are equal in length, so as to ensure that the loading and unloading work surface of the loading and unloading mechanism is positive and parallel Corresponding to the loading part of the assembly to be assembled, so as to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism; and the control module stores the information of the corrected loading and unloading operation surface; The image of the periphery of the loading part of the assembly, and the correction of the image surface" program has: a "mechanical arm drives the image capture component to approach the carrier plate at the same inclination angle as the corrected loading and unloading work surface, and obtain the assembly to be assembled The position image of the carrying part and each fixture" step is that the control module drives the image capture component on the robotic arm to move to the assembly to be assembled in the same direction and inclination angle as the corrected loading and unloading work surface. Above the part, use the image capture component to obtain the image around the component bearing part to be assembled, so as to confirm the position of the component load bearing part to be assembled and each fixture; a "control module adjusts the position of the image capture component to make it Correctly correspond to the bearing part of the assembly to be assembled, so as to correct the position of its image-taking surface, and use the information of the corrected image-taking surface to correct the loading and unloading operation surface, so that it is positively and accurately corresponding to the bearing of the assembly to be assembled "Part" step, the control module drives the image capture component on the mechanical arm to adjust its position, so that the image capture component is kept correctly corresponding to the assembly bearing part and each fixture to be assembled, so as to correct the image capture component The position of the image-taking surface; and the control module stores the information of the calibrated image-taking surface, and can calculate the corrected position information of the loading and unloading mechanism, so that the loading and unloading mechanism can be driven by the mechanical arm to move to the correct position in the positive direction. And flushly correspond to the position of the bearing part of the assembly to be assembled.

依上述方法,其中該「裝卸機構將該組合件移置並鎖固於該待組裝的組合件承載部上」程序,具有:一「裝卸機構解鎖各夾具」步驟,先由該控制模組驅動該機械臂上之裝卸機構移至該待組裝的組合件承載部上方,利用各夾具操作組件鬆開各夾具;一「裝卸機構將該組合件移置於該待組裝的組合件承載部上」步驟,係由該控制模組驅動該機械臂上之裝卸機構移至該第一座體之晶圓預治部上方,利用該夾持組件夾持該組合件,再將該組合件移至該待組裝的組合件承載部上;一「裝卸機構鎖掣各夾具,藉以固定該組合件」步驟,係由各夾具操作組件鎖掣各夾具,使該組合件得以被固定於該待組裝的組合件承載部上。According to the above method, the procedure of "moving and locking the assembly by the loading and unloading mechanism on the bearing part of the assembly to be assembled" includes: a step of "unlocking each clamp by the loading and unloading mechanism", which is first driven by the control module The loading and unloading mechanism on the mechanical arm moves to the top of the loading part of the assembly to be assembled, and uses each clamp to operate the components to loosen each clamp; a "loading and unloading mechanism moves the assembly to the loading part of the assembly to be assembled" The step is to drive the loading and unloading mechanism on the mechanical arm by the control module to move above the wafer pretreatment part of the first seat, use the clamping component to clamp the assembly, and then move the assembly to the On the bearing part of the assembly to be assembled; a step of "locking the clamps of the loading and unloading mechanism to fix the assembly" is to use the clamps to operate the components to lock the clamps so that the assembly can be fixed on the assembly to be assembled on the part carrier.

依上述方法,其中該「裝卸機構鎖掣各夾具,藉以固定該組合件」步驟之後另設有一「裝卸機構脫離組合件,且載盤轉動」步驟,係於各夾持組件鬆脫該組合件之後,由該控制模組驅動該樞轉組件帶動該載盤樞轉,使該已固定該組合件之組合件承載部樞轉移動至一旁側位置,且另一旁側空置的組合件承載部移至原待組裝位置形成另一待組裝的組合件承載部。According to the above method, the step of "the loading and unloading mechanism locks the clamps to fix the assembly" is followed by a step of "the loading and unloading mechanism disengages the assembly and the tray rotates", which is to release the assembly after each clamping assembly Afterwards, the control module drives the pivoting assembly to drive the tray to pivot, so that the assembly carrying portion that has fixed the assembly pivots to move to a side position, and the assembly carrying portion that is vacant on the other side moves To the original to-be-assembled position to form another to-be-assembled assembly bearing part.

依上述方法,其中該「晶圓置載機構將一晶圓移置於該晶圓環中」程序,具有:一「晶圓置載機構將該晶圓移置於該第一位移機構上,並導正該晶圓」步驟,係由該晶圓托架將該晶圓移至該第一座體之晶圓預治部上方,利用該取像單元取得該晶圓的影像,藉以檢視該晶圓之位置是否正確外,配合該二具有背光表面之夾套滑座相互靠合,使二凹弧部結合成一對應於該晶圓預治部之圓孔,再由該控制模組經由該晶圓移置組件帶動該晶圓托架修正位置,可使該晶圓被導正於正確對應該晶圓環中央之位置;一「該第一位移機構將該晶圓移至該晶圓環內」步驟,係使二夾套滑座分離,再由該承托座升降組件帶動該承托座上升,使該晶圓托架於凹槽道內脫離該晶圓;然後該晶圓移置組件帶動該晶圓托架移出該第一座體上方;再由該承托座升降組件帶動該承托座下降,使該晶圓下移於該晶圓環內。According to the above method, wherein the procedure of "moving a wafer into the wafer ring by the wafer loading mechanism" includes: a "moving the wafer by the wafer loading mechanism on the first displacement mechanism, and straighten the wafer" step is to move the wafer above the wafer pre-processing part of the first seat by the wafer carrier, and use the imaging unit to obtain the image of the wafer, so as to view the Whether the position of the wafer is correct or not, cooperate with the two jacket slides with backlight surfaces to be close to each other, so that the two concave arcs are combined into a round hole corresponding to the wafer pre-processing part, and then the control module passes through the The wafer displacement component drives the wafer bracket to correct the position, so that the wafer can be guided to a position corresponding to the center of the wafer ring; a "first displacement mechanism moves the wafer to the wafer ring The "inner" step is to separate the two jacket slides, and then the support base lifting assembly drives the support base to rise, so that the wafer bracket is separated from the wafer in the groove; then the wafer is displaced The component drives the wafer bracket to move out of the first seat; the support base lifting component drives the support base down, so that the wafer moves down in the wafer ring.

依上述方法,其中該「晶圓置載機構將一晶圓移置於該晶圓環中」程序,具有:一「晶圓置載機構承載一晶圓,並於移置過程中導平該晶圓」步驟,係由該控制模組驅動該晶圓移置組件帶動該晶圓托架由該晶圓供料座上承托一晶圓,將該晶圓接近該噴氣頭,利用該噴氣頭之噴氣孔噴出空氣吹拂於該晶圓上,可導平該晶圓,使其平穩地保持在晶圓托架上正確的位置;一「晶圓置載機構將該晶圓移置於該第一位移機構上,並導正該晶圓」步驟,係由該晶圓托架將該晶圓移至該第一座體之晶圓預治部上方,利用該取像單元取得該晶圓的影像,藉以檢視該晶圓之位置是否正確,配合該二具有背光表面之夾套滑座相互靠合,使二凹弧部結合成一對應於該晶圓預治部之圓孔,再由該控制模組經由該晶圓移置組件帶動該晶圓托架修正位置,可使該晶圓被導正於正確對應該晶圓環中央之位置;一「該第一位移機構將該晶圓移至該晶圓環內」步驟,係使二夾套滑座分離,再由該承托座升降組件帶動該承托座上升,使該晶圓托架於凹槽道內脫離該晶圓;然後該晶圓移置組件帶動該晶圓托架移出該第一座體上方;再由該承托座升降組件帶動該承托座下降,使該晶圓下移於該晶圓環內。According to the above method, wherein the procedure of "moving a wafer into the wafer ring by the wafer loading mechanism" includes: a "wafer loading mechanism carries a wafer, and guides the wafer during the displacement process." Wafer" step, is that the control module drives the wafer shifting assembly to drive the wafer bracket to support a wafer from the wafer feeding seat, and the wafer is close to the air nozzle, and the air injection head is used to The jet hole of the head sprays air on the wafer, which can guide the wafer and keep it stably in the correct position on the wafer carrier; a "wafer loading mechanism" moves the wafer to the On the first displacement mechanism, and guide the wafer" step is to move the wafer above the wafer pre-processing part of the first seat by the wafer carrier, and use the imaging unit to obtain the wafer The image of the wafer is used to check whether the position of the wafer is correct, and the two jacket slides with backlight surfaces are close to each other, so that the two concave arcs are combined into a round hole corresponding to the wafer pretreatment part, and then the The control module drives the wafer carrier to correct the position through the wafer displacement component, so that the wafer can be guided to a position corresponding to the center of the wafer ring; a "first displacement mechanism moves the wafer Into the wafer ring" step is to separate the two jacket slides, and then drive the support base up by the support base lifting assembly, so that the wafer bracket is separated from the wafer in the groove; and then The wafer shifting component drives the wafer bracket to move out of the first seat; the supporting base lifting component drives the supporting base down, so that the wafer moves down in the wafer ring.

為使本發明的上述目的、功效及特徵可獲致更具體的瞭解,茲依下列附圖說明如下:In order to obtain a more specific understanding of the above-mentioned purpose, effect and characteristics of the present invention, the following drawings are hereby described as follows:

請參第1至3圖所示,可知本發明之主要結構包括:第一位移機構1、晶圓環置載機構2、晶圓置載機構3、遮蓋置載機構4、第二位移機構5及機械臂6等部份;其中該第一位移機構1係連結並受一控制模組(可為一具運算功能之電腦,未繪出)驅動,該第一位移機構1具有複數平行延伸之第一導軌11,以及一設置於各該第一導軌11上且可往復位移之第一座體12,於該第一座體12上設有一晶圓預治部121(可為一鏤空孔),於該晶圓預治部121內設有一承托座13,該承托座13係受一承托座升降組件133帶動而可進行升降之動作,於該承托座13頂面凹設有一凹槽道131,於該凹槽道131二旁側設有複數能抽吸空氣之吸氣孔132。Please refer to Figures 1 to 3, it can be seen that the main structure of the present invention includes: a first displacement mechanism 1, a wafer ring loading mechanism 2, a wafer loading mechanism 3, a cover loading mechanism 4, and a second displacement mechanism 5 and mechanical arm 6 etc. parts; wherein the first displacement mechanism 1 is connected and driven by a control module (which can be a computer with computing function, not shown), the first displacement mechanism 1 has a plurality of parallel extending The first guide rails 11, and a first base body 12 that is arranged on each of the first guide rails 11 and can move back and forth, and a wafer pretreatment part 121 (which can be a hollow hole) is provided on the first base body 12 , a support seat 13 is provided in the wafer pre-treatment section 121, and the support seat 13 is driven by a support seat lifting assembly 133 to perform lifting actions. The groove track 131 is provided with a plurality of suction holes 132 capable of sucking air on both sides of the groove track 131 .

在一個可行的實施例中,該第一座體12頂面於該晶圓預治部121周側設有複數可相對往復位移之夾套滑座15,各夾套滑座15頂側具有背光表面,且於各夾套滑座15朝向該晶圓預治部121之一邊側設有凹弧部151;另於該第一導軌11上方設有一可攫取影像之取像單元16。In a feasible embodiment, the top surface of the first base body 12 is provided with a plurality of jacket slides 15 on the peripheral side of the wafer pretreatment part 121, and the top side of each jacket slide 15 has a backlight. surface, and a concave arc portion 151 is provided on one side of each jacket slide seat 15 facing the wafer pre-treatment portion 121; and an image capturing unit 16 capable of capturing images is provided above the first guide rail 11.

該晶圓環置載機構2設於該第一導軌11之一旁側,係連結並受該控制模組(未繪出)驅動,該晶圓環置載機構2具有一可供承托複數疊置之晶圓環2a的晶圓環供料座21,以及一支撐於該晶圓環供料座21下方之晶圓環升降組件22,該晶圓環升降組件22係可帶動該晶圓環供料座21進行升降之動作,於該晶圓環供料座21旁側設有一晶圓環移置組件23,該晶圓環移置組件23具有一可升降之晶圓環移置滑座232,於該晶圓環移置滑座232上設有一可橫向往復位移之晶圓環移置導軌231,於該晶圓環移置導軌231上設有一組可相對開合之夾合組件233。The wafer ring loading mechanism 2 is arranged on one side of the first guide rail 11, and is connected to and driven by the control module (not shown). The wafer ring feeding seat 21 of the wafer ring 2a, and a wafer ring lifting assembly 22 supported under the wafer ring feeding seat 21, the wafer ring lifting assembly 22 can drive the wafer ring The feeding seat 21 moves up and down, and a wafer ring displacement assembly 23 is provided beside the wafer ring supply seat 21. The wafer ring displacement assembly 23 has a wafer ring displacement slide seat that can be raised and lowered. 232, on the wafer ring displacement slide 232, a wafer ring displacement guide rail 231 that can move laterally back and forth is provided, and a set of clamping components 233 that can be opened and closed relatively is provided on the wafer ring displacement guide rail 231 .

在一個可行的實施例中,該晶圓環2a之外周緣上方環設有一外環凸緣21a,該晶圓環2a之內周緣下方環設有一內環凸緣22a。In a feasible embodiment, an outer ring flange 21a is provided on the upper ring of the outer periphery of the wafer ring 2a, and an inner ring flange 22a is provided on the lower ring of the inner peripheral edge of the wafer ring 2a.

該晶圓置載機構3設於該第一導軌11之一旁側,係連結並受該控制模組(未繪出)驅動,該晶圓置載機構3具有一可供承托複數晶圓3a之晶圓供料座31,以及一支撐於該晶圓供料座31下方之晶圓升降組件32,該晶圓升降組件32係可帶動該晶圓供料座31進行升降之動作,於該晶圓供料座31上方設有一噴氣頭35,該噴氣頭35具有可朝下噴出空氣之噴氣孔351;另於該晶圓供料座31旁側設有一晶圓移置組件33,該晶圓移置組件33具有複數平行於該第一導軌11之晶圓移置導軌331,以及一設置於各該晶圓移置導軌331上且可往復位移之晶圓移置滑座332,於該晶圓移置滑座332上設有一可垂直升降之伸縮組件333,於該伸縮組件333之活動端設有一晶圓托架34,於該晶圓托架34頂面設有複數可抽吸空氣之抽氣孔341。The wafer loading mechanism 3 is arranged on one side of the first guide rail 11, is connected and driven by the control module (not shown), the wafer loading mechanism 3 has a plurality of wafers 3a for supporting The wafer feeding base 31, and a wafer lifting assembly 32 supported under the wafer feeding base 31, the wafer lifting assembly 32 can drive the wafer feeding base 31 to move up and down. Wafer feeding seat 31 top is provided with an air spray head 35, and this air spray head 35 has the air spray hole 351 that can spray air downward; The circle displacement assembly 33 has a plurality of wafer displacement guide rails 331 parallel to the first guide rail 11, and a wafer displacement slide 332 that is arranged on each of the wafer displacement guide rails 331 and can move back and forth. A telescopic assembly 333 that can be vertically lifted is provided on the wafer displacement slide 332, and a wafer bracket 34 is provided at the movable end of the telescopic assembly 333, and a plurality of suckable air is provided on the top surface of the wafer bracket 34. The exhaust hole 341.

在一個可行的實施例中,該晶圓3a之外徑略小於該晶圓環2a之內徑,且可將預設固定數量之晶圓3a預先間隔收容於一晶圓匣30a內,再將該晶圓匣30a置於該晶圓供料座31上,以便於移置各晶圓3a。In a feasible embodiment, the outer diameter of the wafer 3a is slightly smaller than the inner diameter of the wafer ring 2a, and a preset fixed number of wafers 3a can be stored in a wafer cassette 30a at intervals in advance, and then the The wafer cassette 30a is placed on the wafer feeding base 31 for easy displacement of each wafer 3a.

該遮蓋置載機構4設於該第一導軌11之一旁側,係連結並受該控制模組(未繪出)驅動,該遮蓋置載機構4具有一可供承托複數疊置之遮蓋4a的遮蓋供料座41,以及一支撐於該遮蓋供料座41下方之遮蓋升降組件42,該遮蓋升降組件42係可帶動該遮蓋供料座41進行升降之動作,於該遮蓋供料座41旁側設有一遮蓋移置組件43,該遮蓋移置組件43具有一可升降之遮蓋移置滑座432,於該遮蓋移置滑座432上設有一可橫向往復位移之遮蓋移置導軌431,於該遮蓋移置導軌431上設有一組可相對開合之夾爪組433。The cover loading mechanism 4 is arranged on one side of the first guide rail 11, is connected and driven by the control module (not shown), the cover loading mechanism 4 has a cover 4a that can support multiple stacks The cover feed seat 41, and a cover lifting assembly 42 supported under the cover feed seat 41, the cover lift assembly 42 can drive the cover feed seat 41 to move up and down, and the cover feed seat 41 A cover displacement assembly 43 is provided on the side, and the cover displacement assembly 43 has a cover displacement slide seat 432 that can be lifted and lowered, and a cover displacement guide rail 431 that can move horizontally and backwards is provided on the cover displacement slide seat 432. A set of jaw sets 433 that can be opened and closed relatively is provided on the covering displacement guide rail 431 .

在一個可行的實施例中,該遮蓋4a係為一外徑趨近於該晶圓3a外徑之片狀體,於該遮蓋4a中央設有一可受該夾爪組433夾持之環凸部41a。In a feasible embodiment, the cover 4a is a sheet with an outer diameter close to the outer diameter of the wafer 3a, and a ring protrusion that can be clamped by the jaw set 433 is provided in the center of the cover 4a 41a.

該第二位移機構5係橫向設置於該第一導軌11一端部旁側,係連結並受該控制模組(未繪出)驅動,該第二位移機構5具有複數平行延伸之第二導軌51,以及一設置於各該第二導軌51上且可往復位移之第二座體52,於該第二座體52上設有一樞轉組件53,該樞轉組件53上可供結合放置一載盤50。The second displacement mechanism 5 is arranged laterally beside one end of the first guide rail 11, connected and driven by the control module (not shown), the second displacement mechanism 5 has a plurality of second guide rails 51 extending in parallel , and a second base body 52 that is arranged on each of the second guide rails 51 and can move back and forth. A pivot assembly 53 is provided on the second base body 52, and a load can be placed on the pivot assembly 53. Plate 50.

在一個可行的實施例中,該載盤50係為一具凸弧面之盤狀結構體,於該載盤50表面設有複數組合件承載部501(可為一鏤空部),於各組合件承載部501(鏤空部)周側分別設有複數夾具502。In a feasible embodiment, the carrier plate 50 is a disc-shaped structure with a convex arc surface, and a plurality of assembly bearing parts 501 (which can be a hollow part) are arranged on the surface of the carrier plate 50. A plurality of clamps 502 are respectively provided on the peripheral side of the part carrying part 501 (hollow part).

該機械臂6係設置於該第一位移機構1、第二位移機構5之間,係連結並受該控制模組(未繪出)驅動,於該機械臂6之活動端設有一影像攫取組件61及一裝卸機構62;該影像攫取組件61具有一可攫取影像之取像組件611,該裝卸機構62具有二可相對開合之夾持組件622、複數對應於各夾具502之夾具操作組件623及複數測距元件621,該複數測距元件621係可為分別設置於該裝卸機構62周側至少三點,且能產生測距雷射光束6211之雷射光源。The mechanical arm 6 is arranged between the first displacement mechanism 1 and the second displacement mechanism 5, is connected and driven by the control module (not shown), and an image capturing component is arranged at the movable end of the mechanical arm 6 61 and a loading and unloading mechanism 62; the image capture component 61 has an image capturing component 611 that can capture images, the loading and unloading mechanism 62 has two clamping components 622 that can be opened and closed relatively, and a plurality of clamp operating components 623 corresponding to each clamp 502 And a plurality of distance-measuring elements 621, the plurality of distance-measuring elements 621 can be respectively arranged at least three points around the loading and unloading mechanism 62, and can generate laser light sources for distance-measuring laser beams 6211.

請參第4圖所示,可知本發明之操作方法包括:一「載盤、晶圓環、晶圓、遮蓋分別置於定位」P1程序、一「晶圓環置載機構將一晶圓環移置於第一位移機構中」P2程序、一「晶圓置載機構將一晶圓移置於該晶圓環中」P3程序、一「遮蓋置載機構將一遮蓋疊置於該晶圓環中之晶圓上,形成一組合件」P4程序、一「裝卸機構校正裝卸作業面」P5程序、一「影像攫取組件檢視載盤上待組裝的組合件承載部周緣之影像,並校正取像面」P6程序、一「裝卸機構將該組合件移置並鎖固於該待組裝的組合件承載部上」P7程序;其中:Please refer to Figure 4, it can be seen that the operation method of the present invention includes: a P1 program of "positioning the carrier plate, wafer ring, wafer, and cover respectively", and a "wafer ring setting mechanism to place a wafer ring Transfer to the first displacement mechanism" P2 procedure, a "wafer placement mechanism to place a wafer in the wafer ring" P3 procedure, a "cover placement mechanism to place a cover on the wafer On the wafer in the ring, a P4 program of an assembly is formed, a P5 program of "loading and unloading mechanism corrects the loading and unloading operation surface", and an "image capture component inspects the image of the periphery of the assembly bearing part to be assembled on the carrier plate, and corrects the image taken Image plane" P6 program, a "loading and unloading mechanism to displace and lock the assembly on the bearing part of the assembly to be assembled" P7 program; wherein:

該「載盤、晶圓環、晶圓、遮蓋分別置於定位」P1程序,係將一空的載盤50設置於預設之組裝定位,並將各晶圓環2a、晶圓3a、遮蓋4a分別置於預設之供料定位;其依序具有:「載盤於第二位移機構上移至作業定位」S11步驟、「收容晶圓之晶圓匣置於晶圓置載機構上;晶圓環、遮蓋分別置於晶圓環置載機構、遮蓋置載機構上」S12步驟、「晶圓置載機構帶動晶圓匣樞轉,使其開口朝向第一位移機構」S13步驟。The P1 procedure of "positioning the carrier plate, wafer ring, wafer, and cover separately" is to set an empty carrier plate 50 at the preset assembly position, and place each wafer ring 2a, wafer 3a, and cover 4a They are respectively placed in the preset feeding position; it has in sequence: "the tray is moved to the operation position on the second displacement mechanism" step S11, "the wafer cassette containing the wafer is placed on the wafer placement mechanism; the wafer The ring and the cover are respectively placed on the wafer ring loading mechanism and the cover loading mechanism” step S12, and the “wafer loading mechanism drives the wafer cassette to pivot so that its opening faces the first displacement mechanism” step S13.

該「晶圓環置載機構將一晶圓環移置於第一位移機構中」P2程序,係由該控制模組驅動該晶圓環置載機構2將一晶圓環2a由該供料定位移置並承托於該第一座體12之晶圓預治部121中;其具有:「晶圓環置載機構將一晶圓環移置並定位於第一位移機構中」S21步驟。The "wafer ring loading mechanism moves a wafer ring into the first displacement mechanism" P2 program is that the control module drives the wafer ring loading mechanism 2 to move a wafer ring 2a from the feeding Positioning, displacement and support in the wafer pretreatment part 121 of the first seat 12; it has: "the wafer ring loading mechanism displaces and positions a wafer ring in the first displacement mechanism" step S21 .

該「晶圓置載機構將一晶圓移置於該晶圓環中」P3程序,係由該控制模組驅動該晶圓置載機構3將一晶圓3a移至該第一位移機構1上進行導正,再將該晶圓3a置於該晶圓環2a中;其依序具有:「晶圓置載機構承載一晶圓,並於移置過程中導平該晶圓」S31步驟、「晶圓置載機構將該晶圓移置於該第一位移機構上,並導正該晶圓」S32步驟、「該第一位移機構將該晶圓移至該晶圓環內」S33步驟。The "wafer placement mechanism moves a wafer into the wafer ring" P3 procedure is that the control module drives the wafer placement mechanism 3 to move a wafer 3a to the first displacement mechanism 1 Then, the wafer 3a is placed in the wafer ring 2a; it has the sequence of: "the wafer loading mechanism carries a wafer, and guides the wafer during the displacement process" S31 step , "The wafer placement mechanism moves the wafer on the first displacement mechanism, and guides the wafer" S32 step, "The first displacement mechanism moves the wafer into the wafer ring" S33 step.

該「遮蓋置載機構將一遮蓋疊置於該晶圓環中之晶圓上,形成一組合件」P4程序,係由該控制模組驅動該遮蓋置載機構4將一遮蓋4a移置於該晶圓環2a中,並疊置於該晶圓3a上,藉以使該晶圓環2a、晶圓3a、遮蓋4a疊置形成一組合件20a,使該晶圓3a之周側被穩固夾持在該晶圓環2a及遮蓋4a的周緣之間,以令該晶圓3a能在組合件20a中維持良好的平整度;其具有:「遮蓋置載機構將一遮蓋移置於該晶圓環內,並疊置於該晶圓上形成一組合件」S41步驟。The P4 procedure of "the cover placement mechanism stacks a cover on the wafer in the wafer ring to form an assembly" is that the control module drives the cover placement mechanism 4 to move a cover 4a to the The wafer ring 2a is stacked on the wafer 3a, so that the wafer ring 2a, the wafer 3a, and the cover 4a are stacked to form an assembly 20a, and the peripheral side of the wafer 3a is clamped firmly. It is held between the periphery of the wafer ring 2a and the cover 4a so that the wafer 3a can maintain a good flatness in the assembly 20a; it has: "a cover placement mechanism transfers a cover to the wafer ring, and stacked on the wafer to form an assembly" S41 step.

該「裝卸機構校正裝卸作業面」P5程序,係由該控制模組驅動該機械臂6上之裝卸機構62調整位置,使各測距元件621量測該載盤50上一待組裝位置之待組裝的組合件承載部501周側之距離為等長,使該裝卸機構62得以平行(具有相同傾斜角度)正向對應該待組裝的組合件承載部501,藉以校正該裝卸機構62之裝卸作業面的傾斜角度,並由該控制模組儲存該校正後裝卸作業面之資訊;其依序具有:「機械臂帶動裝卸機構以預設裝卸基準值接近載盤,並以測距元件量測與待組裝的組合件承載部邊緣之距離」S51步驟、「控制模組調整裝卸機構位置,使各測距元件之量測距離為等長,藉以校正其裝卸作業面之傾斜角度」S52步驟。The "Loading and Unloading Mechanism Corrects the Loading and Unloading Operation Surface" P5 program is that the control module drives the loading and unloading mechanism 62 on the mechanical arm 6 to adjust its position, so that each distance measuring element 621 measures the position of a position to be assembled on the carrier plate 50. The distances between the sides of the assembly carrying part 501 to be assembled are equal, so that the loading and unloading mechanism 62 can be paralleled (with the same inclination angle) and positively correspond to the assembly carrying part 501 to be assembled, so as to correct the loading and unloading operation of the loading and unloading mechanism 62 The inclination angle of the surface, and the information of the corrected loading and unloading operation surface is stored by the control module; it has in sequence: "The mechanical arm drives the loading and unloading mechanism to approach the loading plate with the preset loading and unloading reference value, and uses the distance measuring element to measure and The distance between the edge of the loading part of the assembly to be assembled" step S51, "the control module adjusts the position of the loading and unloading mechanism so that the measuring distances of each distance measuring element are equal, so as to correct the inclination angle of the loading and unloading work surface" S52 step.

該「影像攫取組件檢視載盤上待組裝的組合件承載部周緣之影像,並校正取像面」P6程序,係由該控制模組驅動該機械臂6上之影像攫取組件61依前述校正後裝卸作業面之傾斜角度及方向檢視待組裝的組合件承載部501周緣及各夾具502之影像,並調整該影像攫取組件61正確對應於該待組裝的組合件承載部501及其夾具502的位置,藉以校正該影像攫取組件61之取像面的位置,且由該控制模組儲存該校正後取像面之資訊,同時該控制模組利用該校正後取像面之資訊進一步修正該裝卸作業面之相對位置,使該裝卸作業面可準確地對應於該待組裝的組合件承載部501及其夾具502的位置;其依序具有:「機械臂帶動影像攫取組件以相同於該校正後裝卸作業面之傾斜角度接近載盤,並取得該待組裝的組合件承載部及各夾具之位置影像」S61步驟、「控制模組調整影像攫取組件位置,使其正確對應該待組裝的組合件承載部,藉以校正其取像面之位置,且利用該校正後取像面之資訊修正該裝卸作業面,使其正向且準確對應該待組裝的組合件承載部」S62步驟。The P6 program of "the image capture unit checks the image of the periphery of the assembly bearing part to be assembled on the tray, and corrects the image capture surface" is driven by the control module to drive the image capture unit 61 on the mechanical arm 6 after the aforementioned calibration The inclination angle and direction of the loading and unloading work surface Check the image of the periphery of the assembly carrying part 501 and each clamp 502 to be assembled, and adjust the position of the image capture component 61 to correctly correspond to the assembly carrying part 501 and its clamps 502 , so as to correct the position of the image capturing surface of the image capturing component 61, and store the information of the corrected image capturing surface by the control module, and at the same time, the control module uses the information of the corrected image capturing surface to further correct the loading and unloading operation The relative position of the surface makes the loading and unloading work surface accurately correspond to the position of the assembly bearing part 501 and its clamp 502 to be assembled; it has in sequence: "the mechanical arm drives the image capture assembly to be the same as the corrected loading and unloading The inclination angle of the work surface is close to the carrier plate, and the image of the position of the assembly bearing part and each fixture to be assembled is obtained." Step S61, "The control module adjusts the position of the image capture component so that it correctly corresponds to the assembly load to be assembled part, so as to correct the position of the image-taking surface, and use the information of the corrected image-taking surface to correct the loading and unloading operation surface, so that it is positively and accurately corresponding to the assembly carrying part to be assembled" Step S62.

該「裝卸機構將該組合件移置並鎖固於該待組裝的組合件承載部上」P7程序,係由該控制模組驅動該機械臂6上之裝卸機構62將該組合件20a移置並鎖固於該待組裝的組合件承載部501上;其依序具有:「裝卸機構解鎖各夾具」S71步驟、「裝卸機構將該組合件移置於該待組裝的組合件承載部上」S72步驟、「裝卸機構鎖掣各夾具,藉以固定該組合件」S73步驟、「裝卸機構脫離組合件,且載盤轉動」S74步驟。The "loading and unloading mechanism displaces and locks the assembly on the bearing part of the assembly to be assembled" P7 procedure is that the control module drives the loading and unloading mechanism 62 on the mechanical arm 6 to displace the assembly 20a And locked on the assembly carrying part 501 to be assembled; it has in sequence: "the loading and unloading mechanism unlocks each clamp" S71 step, "the loading and unloading mechanism moves the assembly to the assembly carrying part to be assembled" Step S72, "the loading and unloading mechanism locks the clamps so as to fix the assembly" step S73, "the loading and unloading mechanism disengages the assembly, and the tray rotates" S74 step.

以下即配合第5至33圖,分別說明上述各步驟,並形成一實際可行之應用實施例:The following is to cooperate with Figures 5 to 33 to illustrate the above steps respectively and form a practical and feasible application example:

首先,該「載盤於第二位移機構上移至作業定位」S11步驟,係先由該控制模組驅動該第二位移機構5,使第二座體52移至各第二導軌51遠離該第一位移機構1之一端,以便於將一空的載盤50置於該第二座體52上(如第5圖所示);再由該第二座體52承載該載盤50沿各第二導軌51移至接近第一位移機構1的預設作業定位(如第6圖所示)。Firstly, in the step S11 of "moving the tray to the working position on the second displacement mechanism", the second displacement mechanism 5 is driven by the control module, so that the second seat body 52 is moved to each second guide rail 51 away from the One end of the first displacement mechanism 1, so that an empty tray 50 is placed on the second base 52 (as shown in Figure 5); The second guide rail 51 moves to a preset working position close to the first displacement mechanism 1 (as shown in FIG. 6 ).

該「收容晶圓之晶圓匣置於晶圓置載機構上;晶圓環、遮蓋分別置於晶圓環置載機構、遮蓋置載機構上」S12步驟,係將複數晶圓環2a疊置於該晶圓環置載機構2之晶圓環供料座21(即該晶圓環2a之供料定位)上,而複數內部容納間隔設置之晶圓3a的晶圓匣30a置於該晶圓置載機構3之晶圓供料座31(即該晶圓3a之供料定位)上,且複數遮蓋4a疊置於該遮蓋置載機構4之遮蓋供料座41(即該遮蓋4a之供料定位)上;然後該第一座體12可依需要移至各第一導軌11接近該晶圓環置載機構2旁側之位置(如第5圖所示)。The step S12 of "place the wafer cassette containing the wafer on the wafer loading mechanism; place the wafer ring and the cover on the wafer ring loading mechanism and the cover loading mechanism respectively" is to stack the plurality of wafer rings 2a Placed on the wafer ring feeding seat 21 of the wafer ring loading mechanism 2 (that is, the feeding position of the wafer ring 2a), and a plurality of wafer cassettes 30a containing wafers 3a arranged at intervals are placed on the wafer ring On the wafer feeding seat 31 of the wafer loading mechanism 3 (that is, the feeding position of the wafer 3a), and a plurality of coverings 4a are stacked on the covering feeding seat 41 of the covering loading mechanism 4 (that is, the covering 4a Then the first base body 12 can be moved to the position where each first guide rail 11 is close to the side of the wafer ring loading mechanism 2 (as shown in FIG. 5 ).

該「晶圓置載機構帶動晶圓匣樞轉,使其開口朝向第一位移機構」S13步驟,係使該晶圓供料座31依需要將各晶圓匣30a之開口轉至朝向該第一位移機構1之一側(如第6圖所示)。The "wafer loading mechanism drives the wafer cassette to pivot so that its opening faces the first displacement mechanism" step S13, which is to make the wafer feeding seat 31 turn the opening of each wafer cassette 30a to face the first displacement mechanism as required. One side of a displacement mechanism 1 (as shown in Figure 6).

該「晶圓環置載機構將一晶圓環移置並定位於第一位移機構中」S21步驟,係由該控制模組驅動該晶圓環置載機構2,使該晶圓環移置組件23之夾合組件233夾持該晶圓環供料座21上之一晶圓環2a,並隨該晶圓環移置滑座232升降及晶圓環移置導軌231橫向滑動,可將該晶圓環2a移至該第一座體12之晶圓預治部121內(如第7、8、9圖所示);然後,該夾合組件233脫離該晶圓環2a,使該晶圓環2a可利用外環凸緣21a搭靠於該晶圓預治部121邊緣(如第10圖所示)形成定位。In step S21 of the "wafer ring loading mechanism displacing and positioning a wafer ring in the first displacement mechanism", the control module drives the wafer ring loading mechanism 2 to displace the wafer ring The clamping assembly 233 of the assembly 23 clamps a wafer ring 2a on the wafer ring feeding seat 21, and moves up and down with the wafer ring displacement slide seat 232 and slides laterally with the wafer ring displacement guide rail 231. The wafer ring 2a is moved into the wafer pretreatment part 121 of the first seat 12 (as shown in Figures 7, 8, and 9); then, the clamping component 233 is separated from the wafer ring 2a, so that the The wafer ring 2a can use the outer ring flange 21a to lean against the edge of the wafer pre-processing part 121 (as shown in FIG. 10 ) to form a position.

在實際應用時,該晶圓環升降組件22可配合帶動該晶圓環供料座21升降,以便於該晶圓環移置組件23更易於夾持適當位置之晶圓環2a。In actual application, the wafer ring lifting component 22 can cooperate to drive the wafer ring feeding seat 21 to lift up and down, so that the wafer ring displacement component 23 can more easily clamp the wafer ring 2a at a proper position.

該「晶圓置載機構承載一晶圓,並於移置過程中導平該晶圓」S31步驟,係由該控制模組驅動該晶圓置載機構3,使該晶圓移置組件33之晶圓移置滑座332移動,配合該伸縮組件333伸長,使該晶圓托架34可伸入一晶圓匣30a內承托一晶圓3a(如第11圖所示),再將該晶圓3a移出晶圓匣30a(如第12圖所示)並接近該噴氣頭35,利用該噴氣頭35之噴氣孔351噴出空氣吹拂於該晶圓3a(如第13、14圖所示)上,可導平該晶圓3a,然後各抽氣孔341抽氣,使該晶圓3a可平穩地定位在晶圓托架34上正確的位置且避免翹曲。In the step S31 of "carrying a wafer by the wafer loading mechanism and leveling the wafer during the displacement process", the control module drives the wafer loading mechanism 3 to make the wafer displacement assembly 33 The wafer displacement slide 332 moves, and the telescopic component 333 is extended, so that the wafer bracket 34 can extend into a wafer cassette 30a to support a wafer 3a (as shown in Figure 11), and then The wafer 3a moves out of the wafer cassette 30a (as shown in Figure 12) and approaches the air spray head 35, and uses the air spray hole 351 of the air spray head 35 to spray air on the wafer 3a (as shown in Figures 13 and 14). ), the wafer 3a can be leveled, and then the exhaust holes 341 are pumped, so that the wafer 3a can be stably positioned at the correct position on the wafer carrier 34 and avoid warping.

在實際應用時,該晶圓升降組件32可配合帶動該晶圓供料座31升降,以便於該晶圓托架34更易於承托適當位置之晶圓匣30a中的晶圓3a。In actual application, the wafer lifting assembly 32 can cooperate to drive the wafer feeding base 31 to lift, so that the wafer bracket 34 can more easily support the wafer 3 a in the wafer cassette 30 a at a proper position.

該「晶圓置載機構將該晶圓移置於該第一位移機構上,並導正該晶圓」S32步驟,係由該控制模組驅動該晶圓置載機構3,使該晶圓移置組件33帶動該晶圓托架34將該晶圓3a移至該第一座體12之晶圓預治部121上方(如第15圖所示),利用該取像單元16取得該晶圓3a的影像,可藉以檢視該晶圓3a之位置是否正確,另可配合該二具有背光表面之夾套滑座15相互靠合,使二凹弧部151結合成一對應於該晶圓預治部121之圓孔(如第16圖所示),再由該晶圓移置組件33帶動該晶圓托架34修正位置,使該晶圓3a被導正而位於正確對應該二夾套滑座15之凹弧部151中央(即晶圓環2a中央)之位置。The "wafer loading mechanism moves the wafer on the first displacement mechanism, and guides the wafer" step S32, which is to drive the wafer loading mechanism 3 by the control module to make the wafer The displacement component 33 drives the wafer carrier 34 to move the wafer 3a to the top of the wafer pretreatment part 121 of the first seat 12 (as shown in FIG. 15 ), and the image pickup unit 16 is used to obtain the wafer The image of the circle 3a can be used to check whether the position of the wafer 3a is correct. In addition, the two jacket slides 15 with backlight surfaces can be combined to make the two concave arcs 151 combine to form a pair corresponding to the pre-treatment of the wafer. 121 of the round hole (as shown in Figure 16), and then the wafer displacement assembly 33 drives the wafer holder 34 to correct the position, so that the wafer 3a is guided and positioned correctly on the slide of the two jackets. The center of the concave arc portion 151 of the seat 15 (that is, the center of the wafer ring 2a).

該「該第一位移機構將該晶圓移至該晶圓環內」S33步驟,係使二夾套滑座15分離,再由該承托座升降組件133帶動該承托座13上升,同時各吸氣孔132抽氣,使該晶圓3a得以被吸附於該承托座13上,此時該晶圓托架34之各抽氣孔341停止抽氣,且該晶圓托架34於凹槽道131內脫離該晶圓3a底面(如第17圖所示);然後該伸縮組件333收縮,使該晶圓托架34移出該第一座體12上方(如第18圖所示);再由該承托座升降組件133帶動該承托座13下降,使該晶圓3a下移於該晶圓環2a內周緣之內環凸緣22a上(如第19圖所示),且該晶圓3a保持受該承托座13吸附的狀態。The step S33 of "moving the wafer into the wafer ring by the first displacement mechanism" is to separate the two jacket slides 15, and then the support base 13 is driven up by the support base lifting assembly 133, and at the same time Each suction hole 132 pumps air so that the wafer 3a can be adsorbed on the support seat 13. At this time, each suction hole 341 of the wafer carrier 34 stops pumping air, and the wafer carrier 34 is in the concave position. The groove 131 is separated from the bottom surface of the wafer 3a (as shown in FIG. 17); then the telescopic assembly 333 shrinks, so that the wafer carrier 34 moves out of the top of the first seat 12 (as shown in FIG. 18); Then, the support base lifting assembly 133 drives the support base 13 down, so that the wafer 3a moves down on the inner ring flange 22a of the inner periphery of the wafer ring 2a (as shown in Figure 19), and the wafer 3a The wafer 3 a is held in a state of being sucked by the holder 13 .

該「遮蓋置載機構將一遮蓋移置於該晶圓環內,並疊置於該晶圓上形成一組合件」S41步驟,係可依需要先使該第一座體12沿第一導軌11移至接近該遮蓋置載機構4旁側之位置(如第20圖所示);再由該控制模組驅動該遮蓋置載機構4,使該遮蓋移置組件43之夾爪組433夾持該遮蓋供料座41上一遮蓋4a之環凸部41a(如第21、22圖所示),並隨該遮蓋移置滑座432升降及遮蓋移置導軌431橫向滑動,可將該遮蓋4a移至該晶圓預治部121內並疊置於該晶圓3a上(如第23、24圖所示);然後,該夾爪組433鬆脫該環凸部41a(如第25圖所示),使該疊置之晶圓環2a、晶圓3a、遮蓋4a形成一組合件20a(如第26圖所示)。In the step S41 of "moving a cover in the wafer ring by the cover loading mechanism, and stacking it on the wafer to form an assembly", the first seat 12 can be moved along the first guide rail as required. 11 Move to a position close to the side of the cover loading mechanism 4 (as shown in Figure 20); and then drive the cover loading mechanism 4 by the control module, so that the jaw set 433 of the cover displacement component 43 clamps Hold the ring convex part 41a of a cover 4a on the cover material supply seat 41 (as shown in Figures 21 and 22), and move up and down with the cover displacement slide seat 432 and slide laterally on the cover displacement guide rail 431, the cover can be 4a is moved into the wafer pretreatment part 121 and superimposed on the wafer 3a (as shown in Figures 23 and 24); then, the jaw set 433 releases the ring protrusion 41a (as shown in Figure 25 shown), so that the stacked wafer ring 2a, wafer 3a, and cover 4a form an assembly 20a (as shown in Figure 26).

在實際應用時,該遮蓋升降組件42可配合帶動該遮蓋供料座41升降,以便於該遮蓋移置組件43更易於夾持適當位置之遮蓋4a。In actual application, the cover lifting component 42 can cooperate to drive the cover feeding base 41 to lift, so that the cover displacement component 43 can more easily clamp the cover 4a at a proper position.

該「機械臂帶動裝卸機構以預設裝卸基準值接近載盤,並以測距元件量測與待組裝的組合件承載部邊緣之距離」S51步驟,係由該控制模組驅動該機械臂6上之裝卸機構62以預設裝卸基準值之方向及角度移至該載盤50上的一待組裝位置;並利用各測距元件621偵測與該待組裝位置之待組裝的組合件承載部501周側之距離(如第27圖所示)。In the step S51 of "the mechanical arm drives the loading and unloading mechanism to approach the carrier plate with a preset loading and unloading reference value, and uses the distance measuring element to measure the distance from the edge of the mounting part of the assembly to be assembled", the control module drives the mechanical arm 6 The upper loading and unloading mechanism 62 moves to a position to be assembled on the carrier plate 50 with the direction and angle of the preset loading and unloading reference value; 501 side distance (as shown in Figure 27).

在一個可行的實施例中,該測距元件621係為一雷射光源,可經由雷射光束6211分別投射於該待組裝的組合件承載部501周側,藉以偵測距離。In a feasible embodiment, the distance-measuring element 621 is a laser light source, which can be respectively projected on the peripheral side of the assembly bearing part 501 to be assembled through the laser beam 6211, so as to detect the distance.

該「控制模組調整裝卸機構位置,使各測距元件之量測距離為等長,藉以校正其裝卸作業面之傾斜角度」S52步驟,係由該控制模組依各測距元件621所偵測之距離(即雷射光束6211投射長度)差異而驅動該機械臂6上之裝卸機構62調整位置,使各測距元件621(雷射光源)偵測該待組裝的組合件承載部501周側之距離(雷射光束6211)為等長,藉以校正該裝卸機構62之裝卸作業面的傾斜角度,並確保該裝卸機構62底側之表面(即裝卸作業面)平行地對應該待組裝的組合件承載部501;且該控制模組可儲存該校正後裝卸作業面之資訊。The "control module adjusts the position of the loading and unloading mechanism so that the measuring distances of each distance measuring element are equal in length, so as to correct the inclination angle of the loading and unloading operation surface" S52 step is detected by the control module according to each distance measuring element 621 The difference in the measured distance (that is, the projected length of the laser beam 6211) drives the loading and unloading mechanism 62 on the mechanical arm 6 to adjust its position, so that each distance measuring element 621 (laser light source) detects the circumference of the assembly bearing part 501 to be assembled. The side distance (laser beam 6211) is equal in length, so as to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism 62, and ensure that the surface of the bottom side of the loading and unloading mechanism 62 (ie, the loading and unloading operation surface) is parallel to the to-be-assembled The assembly carrying part 501; and the control module can store the information of the corrected loading and unloading operation surface.

該「機械臂帶動影像攫取組件以相同於該校正後裝卸作業面之傾斜角度接近載盤,並取得該待組裝的組合件承載部及各夾具之位置影像」S61步驟,係由該控制模組驅動該機械臂6上之影像攫取組件61以相同於該校正後裝卸作業面之傾斜角度及方向移至該待組裝的組合件承載部501上方,利用該取像組件611取得該待組裝的組合件承載部501周邊之影像(如第28圖所示),藉以確認該待組裝的組合件承載部501及各夾具502之位置。The step S61 of "the manipulator drives the image capturing component to approach the tray at the same inclination angle as the calibrated loading and unloading work surface, and obtains the position images of the loading part and each fixture of the assembly to be assembled" is controlled by the control module Drive the image capturing component 61 on the mechanical arm 6 to move to the top of the component bearing part 501 to be assembled at the same inclination angle and direction as the corrected loading and unloading work surface, and use the image capturing component 611 to obtain the component to be assembled The image of the periphery of the component carrying portion 501 (as shown in FIG. 28 ) is used to confirm the positions of the component carrying portion 501 and each jig 502 to be assembled.

該「控制模組調整影像攫取組件位置,使其正確對應該待組裝的組合件承載部,藉以校正其取像面之位置,且利用該校正後取像面之資訊修正該裝卸作業面,使其正向且準確對應該待組裝的組合件承載部」S62步驟,係由該控制模組依上述取得該待組裝的組合件承載部501的影像位置差異,而驅動該機械臂6上之影像攫取組件61調整位置,藉以校正該影像攫取組件61之取像面,並確保該影像攫取組件61正確地對應該待組裝的組合件承載部501及各夾具502;且該控制模組可儲存該校正後取像面之資訊(如第28圖所示)。The "control module adjusts the position of the image capturing component so that it correctly corresponds to the bearing part of the assembly to be assembled, so as to correct the position of its image capturing surface, and uses the information of the corrected image capturing surface to correct the loading and unloading operation surface, so that It is positively and accurately corresponding to the assembly carrying part to be assembled. In step S62, the control module obtains the image position difference of the assembly carrying part 501 to be assembled according to the above, and drives the image on the mechanical arm 6. Grabbing component 61 to adjust the position, so as to correct the image capturing surface of the image capturing component 61, and ensure that the image capturing component 61 correctly corresponds to the assembly carrying part 501 and each fixture 502 to be assembled; and the control module can store the The information of the captured image surface after correction (as shown in Figure 28).

在一個可行的實施例中,各夾具502周側於預設部位設有定位標示(未繪出,可為十字刻度或其它具標示性的結構),且於該影像攫取組件61之取像組件611的鏡頭上可設置相對應之相對標示(未繪出,可為十字刻度或其它具標示性的結構);當該影像攫取組件61調整位置,使該相對標示與該定位標示相重合,即可達到校正該影像攫取組件61之取像面位置的功效。In a feasible embodiment, each fixture 502 is provided with a positioning mark (not shown, it can be a cross scale or other marked structure) at a predetermined position on the periphery of each fixture 502, and the image capturing component of the image capturing component 61 A corresponding relative mark can be set on the lens of 611 (not shown, it can be a cross scale or other marked structure); when the image capturing component 61 adjusts its position, the relative mark coincides with the positioning mark, that is The effect of correcting the position of the image capturing surface of the image capturing component 61 can be achieved.

由於該影像攫取組件61係以相同於該校正後裝卸作業面之傾斜角度及方向進行取像,因此在校正該取像面之位置後,該控制模組可利用該校正後取像面之位置計算並儲存該裝卸機構62所需再次修正之位置資訊,使該控制模組可直接且迅速地再次經由該機械臂6帶動該裝卸機構62移至位於正向準確地對應該待組裝的組合件承載部501的位置。Since the image capture unit 61 captures images at the same inclination angle and direction as the corrected loading and unloading surface, after correcting the position of the image capturing surface, the control module can use the corrected position of the image capturing surface Calculate and store the position information that needs to be corrected again by the loading and unloading mechanism 62, so that the control module can directly and quickly drive the loading and unloading mechanism 62 to move to the positive direction and accurately correspond to the assembly to be assembled again through the mechanical arm 6 The position of the bearing part 501.

該「裝卸機構解鎖各夾具」S71步驟,係先由該控制模組驅動該機械臂6上之裝卸機構62移至該待組裝的組合件承載部501上方,利用各夾具操作組件623鬆開各夾具502(如第29圖所示)。In the step S71 of "unlocking the clamps by the loading and unloading mechanism", the control module first drives the loading and unloading mechanism 62 on the mechanical arm 6 to move to the top of the loading part 501 of the assembly to be assembled, and uses the clamp operating components 623 to loosen each clamp. Fixture 502 (as shown in Figure 29).

該「裝卸機構將該組合件移置於該待組裝的組合件承載部上」S72步驟,係由該控制模組驅動該機械臂6上之裝卸機構62移至該第一座體12之晶圓預治部121上方,利用該夾持組件622夾持該組合件20a(此時各吸氣孔132停止吸氣,該承托座13解除對晶圓3a之吸附狀態,如第30圖所示),再將該組合件20a移至上述待組裝的組合件承載部501上(如第31、32圖所示)。The step S72 of "moving the assembly by the loading and unloading mechanism to the loading part of the assembly to be assembled" is that the control module drives the loading and unloading mechanism 62 on the mechanical arm 6 to move to the crystal of the first base 12. Above the round pretreatment part 121, use the clamping component 622 to clamp the assembly 20a (at this time, each suction hole 132 stops suction, and the support seat 13 releases the state of adsorption to the wafer 3a, as shown in Figure 30 shown), and then move the assembly 20a to the above-mentioned assembly bearing part 501 to be assembled (as shown in Figures 31 and 32).

該「裝卸機構鎖掣各夾具,藉以固定該組合件」S73步驟,係由該控制模組驅動各夾具操作組件623鎖掣各夾具502,使該組合件20a得以被固定於該待組裝的組合件承載部501上(如第32圖所示)。In the step S73 of "locking the clamps of the loading and unloading mechanism to fix the assembly", the control module drives the clamp operating components 623 to lock the clamps 502, so that the assembly 20a can be fixed on the assembly to be assembled on the part carrying part 501 (as shown in Fig. 32).

該「裝卸機構脫離組合件,且載盤轉動」S74步驟,係於各夾持組件622鬆脫該組合件20a之後,由該控制模組驅動該樞轉組件53帶動該載盤50樞轉,使已固定該組合件20a之組合件承載部501樞轉移動至一旁側位置,且另一旁側空置的組合件承載部501移至原待組裝位置形成另一待組裝的組合件承載部501(如第33圖所示),以便於重覆以上各工序,將各組合件20a分別固定於該載盤50之各待組裝的組合件承載部501上。The "loading and unloading mechanism disengages the assembly, and the tray rotates" step S74, after each clamping assembly 622 releases the assembly 20a, the control module drives the pivoting assembly 53 to drive the tray 50 to pivot, The assembly carrying portion 501 that has fixed the assembly 20a is pivotally moved to a side position, and the empty assembly carrying portion 501 on the other side is moved to the original position to be assembled to form another assembly carrying portion 501 to be assembled ( As shown in FIG. 33 ), in order to repeat the above steps, each assembly 20a is respectively fixed on each assembly bearing portion 501 to be assembled of the tray 50 .

綜合以上所述,本發明預治式晶圓載盤之置載裝置及其方法確可達成利用簡單機構及操作,分別將晶圓環、晶圓、遮蓋組合,並精確移置固定於一載盤上不同位置之功效,實為一具新穎性及進步性之發明,爰依法提出申請發明專利;惟上述說明之內容,僅為本發明之較佳實施例說明,舉凡依本發明之技術手段與範疇所延伸之變化、修飾、改變或等效置換者,亦皆應落入本發明之專利申請範圍內。Based on the above, the pre-cured wafer carrier mounting device and method of the present invention can indeed achieve the use of simple mechanisms and operations to separately assemble the wafer ring, wafer, and cover, and accurately shift and fix them on a carrier The effects of different positions above are actually a novel and progressive invention, and I have filed an application for an invention patent in accordance with the law; but the content of the above description is only a description of the preferred embodiment of the present invention. Changes, modifications, changes or equivalent replacements extended by the scope should also fall within the scope of the patent application of the present invention.

1:第一位移機構1: The first displacement mechanism

11:第一導軌11: The first rail

12:第一座體12: The first body

121:晶圓預治部121:Wafer pretreatment department

13:承托座13: Support seat

131:凹槽道131: Groove channel

132:吸氣孔132: suction hole

133:承托座升降組件133: Support seat lift assembly

15:夾套滑座15: Jacket sliding seat

151:凹弧部151: Concave arc

16:取像單元16: Image acquisition unit

2:晶圓環置載機構2: Wafer ring loading mechanism

21:晶圓環供料座21: Wafer ring feeding seat

22:晶圓環升降組件22:Wafer Ring Lifting Assembly

23:晶圓環移置組件23: Wafer Ring Displacement Assembly

231:晶圓環移置導軌231: Wafer ring displacement guide rail

232:晶圓環移置滑座232: Wafer ring displacement slide seat

233:夾合組件233: clamping components

2a:晶圓環2a: wafer ring

20a:組合件20a: Assemblies

21a:外環凸緣21a: Outer ring flange

22a:內環凸緣22a: Inner ring flange

3:晶圓置載機構3: Wafer loading mechanism

31:晶圓供料座31:Wafer feeding seat

32:晶圓升降組件32:Wafer Lifting Assembly

33:晶圓移置組件33:Wafer displacement assembly

331:晶圓移置導軌331: Wafer displacement guide rail

332:晶圓移置滑座332: Wafer displacement slider

333:伸縮組件333: telescopic components

34:晶圓托架34:Wafer carrier

341:抽氣孔341: Air extraction hole

35:噴氣頭35: jet head

351:噴氣孔351: fumarole

3a:晶圓3a: Wafer

30a:晶圓匣30a: Wafer Cassette

4:遮蓋置載機構4: Cover the loading mechanism

41:遮蓋供料座41: Covering the feeding seat

42:遮蓋升降組件42: Cover lift assembly

43:遮蓋移置組件43: Cover displacement components

431:遮蓋移置導軌431: cover displacement guide

432:遮蓋移置滑座432: cover displacement slide

433:夾爪組433: Gripper set

4a:遮蓋4a: Covering

41a:環凸部41a: ring convex part

5:第二位移機構5: The second displacement mechanism

51:第二導軌51: Second guide rail

52:第二座體52:Second body

53:樞轉組件53:Pivot assembly

50:載盤50: carrier disk

501:組合件承載部501: Assembly bearing part

502:夾具502: fixture

6:機械臂6: Mechanical arm

61:影像攫取組件61:Image capture component

611:取像組件611: image acquisition component

62:裝卸機構62: Loading and unloading mechanism

621:測距元件621: Ranging element

6211:雷射光束6211: laser beam

622:夾持組件622: clamping components

623:夾具操作組件623: Fixture operation components

A:第1圖之影像攫取組件及裝卸機構部位A: The image capture component and loading and unloading mechanism in Figure 1

P1:載盤、晶圓環、晶圓、遮蓋分別置於定位P1: The tray, wafer ring, wafer, and cover are placed in position

P2:晶圓環置載機構將一晶圓環移置於第一位移機構中P2: The wafer ring placement mechanism moves a wafer ring into the first displacement mechanism

P3:晶圓置載機構將一晶圓移置於該晶圓環中P3: The wafer placement mechanism moves a wafer into the wafer ring

P4:遮蓋置載機構將一遮蓋疊置於該晶圓環中之晶圓上,形成一組合件P4: The cover placement mechanism stacks a cover on the wafer in the wafer ring to form an assembly

P5:裝卸機構校正裝卸作業面P5: The loading and unloading mechanism corrects the loading and unloading work surface

P6:影像攫取組件檢視載盤上待組裝的組合件承載部周緣之影像,並校正取像面P6: The image capture component checks the image around the carrier part of the assembly to be assembled on the carrier plate, and corrects the image capture surface

P7:裝卸機構將該組合件移置並鎖固於該待組裝的組合件承載部上P7: The loading and unloading mechanism displaces and locks the assembly on the bearing portion of the assembly to be assembled

S11:載盤於第二位移機構上移至作業定位S11: The tray moves to the working position on the second displacement mechanism

S12:收容晶圓之晶圓匣置於晶圓置載機構上;晶圓環、遮蓋分別置於晶圓環置載機構、遮蓋置載機構上S12: The wafer cassette containing the wafers is placed on the wafer loading mechanism; the wafer ring and cover are respectively placed on the wafer ring loading mechanism and the cover loading mechanism

S13:晶圓置載機構帶動晶圓匣樞轉,使其開口朝向第一位移機構S13: The wafer loading mechanism drives the wafer cassette to pivot so that its opening faces the first displacement mechanism

S21:晶圓環置載機構將一晶圓環移置並定位於第一位移機構中S21: The wafer ring placement mechanism displaces and positions a wafer ring in the first displacement mechanism

S31:晶圓置載機構承載一晶圓,並於移置過程中導平該晶圓S31: The wafer placement mechanism carries a wafer, and guides the wafer during the displacement process

S32:晶圓置載機構將該晶圓移置於該第一位移機構上,並導正該晶圓S32: the wafer loading mechanism moves the wafer on the first displacement mechanism, and guides the wafer

S33:該第一位移機構將該晶圓移至該晶圓環內S33: the first displacement mechanism moves the wafer into the wafer ring

S41:遮蓋置載機構將一遮蓋移置於該晶圓環內,並疊置於該晶圓上形成一組合件S41: the cover placement mechanism moves a cover into the wafer ring, and stacks it on the wafer to form an assembly

S51:機械臂帶動裝卸機構以預設裝卸基準值接近載盤,並以測距元件量測與待組裝的組合件承載部邊緣之距離S51: The mechanical arm drives the loading and unloading mechanism to approach the carrier plate with a preset loading and unloading reference value, and uses the distance measuring element to measure the distance from the edge of the assembly to be assembled.

S52:控制模組調整裝卸機構位置,使各測距元件之量測距離為等長,藉以校正其裝卸作業面之傾斜角度S52: The control module adjusts the position of the loading and unloading mechanism so that the measuring distances of each ranging element are equal in length, so as to correct the inclination angle of the loading and unloading operation surface

S61:機械臂帶動影像攫取組件以相同於該校正後裝卸作業面之傾斜角度接近載盤,並取得該待組裝的組合件承載部及各夾具之位置影像S61: The robotic arm drives the image capture component to approach the carrier at the same inclination angle as the calibrated loading and unloading work surface, and obtains the position images of the loading part and each fixture of the assembly to be assembled.

S62:控制模組調整影像攫取組件位置,使其正確對應該待組裝的組合件承載部,藉以校正其取像面之位置,且利用該校正後取像面之資訊修正該裝卸作業面,使其正向且準確對應該待組裝的組合件承載部S62: The control module adjusts the position of the image capturing component so that it correctly corresponds to the bearing part of the assembly to be assembled, so as to correct the position of its image capturing surface, and use the information of the corrected image capturing surface to correct the loading and unloading operation surface, so that It is positive and exactly corresponds to the carrier part of the assembly to be assembled

S71:裝卸機構解鎖各夾具S71: The loading and unloading mechanism unlocks each fixture

S72:裝卸機構將該組合件移置於該待組裝的組合件承載部上S72: The loading and unloading mechanism displaces the assembly on the bearing part of the assembly to be assembled

S73:裝卸機構鎖掣各夾具,藉以固定該組合件S73: The loading and unloading mechanism locks each fixture to fix the assembly

S74:裝卸機構脫離組合件,且載盤轉動S74: The loading and unloading mechanism breaks away from the assembly, and the tray rotates

第1圖係本發明之整體結構及相關組件立體分解圖。Figure 1 is a three-dimensional exploded view of the overall structure and related components of the present invention.

第2圖係本發明之局部結構示意圖;其揭示了第一座體及相關承托座等部位的結構。Figure 2 is a schematic diagram of the partial structure of the present invention; it reveals the structure of the first seat body and related supporting seats and other parts.

第3圖係第1圖之A部位局部放大圖;其揭示了組設於機械臂上之影像攫取組件及裝卸機構的結構。Figure 3 is a partial enlarged view of part A in Figure 1; it reveals the structure of the image capture component and the loading and unloading mechanism assembled on the robotic arm.

第4圖係本發明之操作流程圖。Fig. 4 is the operation flowchart of the present invention.

第5圖係本發明將晶圓環、晶圓及遮蓋分別置於供料位置之狀態示意圖。Fig. 5 is a schematic diagram of the state where the wafer ring, wafer and cover are respectively placed at the feeding position according to the present invention.

第6圖係本發明之晶圓置載機構驅動各晶圓匣朝向第一位移機構方向樞轉的動作圖。Fig. 6 is an action diagram of the wafer loading mechanism of the present invention driving each wafer cassette to pivot toward the direction of the first displacement mechanism.

第7圖係本發明之晶圓環移置組件移置晶圓環的動作圖(一)。Figure 7 is the action diagram (1) of the wafer ring displacement assembly of the present invention for displacing the wafer ring.

第8圖係本發明之晶圓環移置組件移置晶圓環的動作圖(二)。Figure 8 is the action diagram (2) of the wafer ring displacement component of the present invention for displacing the wafer ring.

第9圖係本發明之晶圓環移置組件移置晶圓環的動作圖(三)。Figure 9 is the action diagram (3) of the wafer ring displacement component of the present invention for displacing the wafer ring.

第10圖係本發明之晶圓環移置組件移置晶圓環的動作圖(四)。Fig. 10 is the movement diagram (4) of the wafer ring displacement assembly of the present invention for displacing the wafer ring.

第11圖係本發明之晶圓移置組件移置晶圓的動作圖(一)。Fig. 11 is an operation diagram (1) of the wafer shifting unit of the present invention for shifting wafers.

第12圖係本發明之晶圓移置組件移置晶圓的動作圖(二)。Fig. 12 is the movement diagram (2) of the wafer displacement unit of the present invention for displacing wafers.

第13圖係本發明利用噴氣頭噴氣使晶圓被導平於晶圓托架上的動作圖。Fig. 13 is an action diagram of the present invention using air injection from the air injection head to guide the wafer flat on the wafer carrier.

第14圖係本發明之晶圓移置組件移置晶圓的動作圖(三)。Fig. 14 is the movement diagram (3) of the wafer displacement unit of the present invention for displacing wafers.

第15圖係本發明之晶圓移置組件移置晶圓的動作圖(四)。Fig. 15 is an operation diagram (4) of the wafer displacement unit of the present invention for displacing wafers.

第16圖係本發明利用取像單元檢視第一座體上的晶圓,並藉由二夾套滑座導正晶圓位置的動作圖。Fig. 16 is an action diagram of the present invention using the imaging unit to inspect the wafer on the first seat, and guiding the wafer position through the two jacket slides.

第17圖係本發明之承托座上升以支撐晶圓的動作圖。Fig. 17 is an action diagram of the raising of the support seat of the present invention to support the wafer.

第18圖係本發明之晶圓托架移出的動作圖。Figure 18 is an action diagram of moving out the wafer carrier of the present invention.

第19圖係本發明之承托座下降,使晶圓置於晶圓環內的動作圖。Fig. 19 is an action diagram of lowering the supporting seat of the present invention to place the wafer in the wafer ring.

第20圖係本發明之第一座體位移至遮蓋置載機構旁側位置的動作圖。Fig. 20 is an action diagram of the displacement of the first seat body of the present invention to the side position of the cover loading mechanism.

第21圖係本發明之遮蓋移置組件移置遮蓋的動作圖(一)。Fig. 21 is an action diagram (1) of the covering displacement assembly of the present invention for displacing and covering.

第22圖係本發明之遮蓋移置組件移置遮蓋的動作圖(二)。Fig. 22 is the action diagram (2) of the cover displacement assembly of the present invention for displacement and cover.

第23圖係本發明之遮蓋移置組件移置遮蓋的動作圖(三)。Fig. 23 is the action diagram (3) of the cover displacement assembly of the present invention for displacement and cover.

第24圖係本發明之遮蓋移置組件移置遮蓋的動作圖(四)。Fig. 24 is the action diagram (4) of the cover displacement assembly of the present invention for displacement and cover.

第25圖係本發明之遮蓋移置組件的夾爪組脫離遮蓋的動作圖。Fig. 25 is an action diagram of the jaw group of the cover displacement assembly of the present invention detaching from the cover.

第26圖係本發明於遮蓋移置組件完成遮蓋置放,且機械臂尚未動作的狀態示意圖。Fig. 26 is a schematic diagram of the present invention when the cover displacement component has completed cover placement and the mechanical arm has not yet moved.

第27圖係本發明之裝卸機構利用測距元件對正於載盤上待組裝的組合件承載部,藉以校準裝卸作業面之傾斜角度的動作圖。Fig. 27 is an action diagram of the loading and unloading mechanism of the present invention using the distance-measuring element to align with the loading part of the assembly to be assembled on the carrier plate, thereby calibrating the inclination angle of the loading and unloading work surface.

第28圖係本發明利用影像攫取組件取得待組裝的組合件承載部之的影像,並藉以校正取像面之位置的動作圖。Fig. 28 is an action diagram of the present invention using the image capturing component to obtain the image of the loading part of the assembly to be assembled, and thereby correct the position of the image capturing surface.

第29圖係本發明利用裝卸機構解鎖待組裝的組合件承載部周側各夾具之動作圖。Figure 29 is an action diagram of the present invention using the loading and unloading mechanism to unlock the clamps around the bearing part of the assembly to be assembled.

第30圖係本發明利用裝卸機構將晶圓環由第一座體上移置於待組裝的組合件承載部之動作圖(一)。Fig. 30 is the action diagram (1) of the present invention using the loading and unloading mechanism to move the wafer ring from the first seat to the loading part of the assembly to be assembled.

第31圖係本發明利用裝卸機構將晶圓環由第一座體上移置於待組裝的組合件承載部之動作圖(二)。Fig. 31 is the action diagram (2) of the present invention using the loading and unloading mechanism to move the wafer ring from the first seat to the loading part of the assembly to be assembled.

第32圖係本發明利用裝卸機構鎖掣待組裝的組合件承載部周側各夾具之動作圖。Figure 32 is an action diagram of the present invention using the loading and unloading mechanism to lock and lock the clamps around the bearing part of the assembly to be assembled.

第33圖係本發明之裝卸機構脫離載盤後,載盤樞轉的動作圖。Fig. 33 is an action diagram of the pivoting action of the loading and unloading mechanism of the present invention after the loading and unloading mechanism is detached from the loading tray.

1:第一位移機構 1: The first displacement mechanism

11:第一導軌 11: The first rail

12:第一座體 12: The first body

15:夾套滑座 15: Jacket sliding seat

16:取像單元 16: Image acquisition unit

2:晶圓環置載機構 2: Wafer ring loading mechanism

21:晶圓環供料座 21: Wafer ring feeding seat

22:晶圓環升降組件 22:Wafer Ring Lifting Assembly

23:晶圓環移置組件 23: Wafer Ring Displacement Assembly

231:晶圓環移置導軌 231: Wafer ring displacement guide rail

232:晶圓環移置滑座 232: Wafer ring displacement slide seat

2a:晶圓環 2a: wafer ring

21a:外環凸緣 21a: Outer ring flange

22a:內環凸緣 22a: Inner ring flange

3:晶圓置載機構 3: Wafer loading mechanism

31:晶圓供料座 31:Wafer feeding seat

32:晶圓升降組件 32:Wafer Lifting Assembly

33:晶圓移置組件 33:Wafer displacement assembly

34:晶圓托架 34:Wafer carrier

341:抽氣孔 341: Air extraction hole

3a:晶圓 3a: Wafer

30a:晶圓匣 30a: Wafer Cassette

4:遮蓋置載機構 4: Cover the loading mechanism

41:遮蓋供料座 41: Covering the feeding seat

42:遮蓋升降組件 42: Cover lift assembly

43:遮蓋移置組件 43: Cover displacement components

4a:遮蓋 4a: Covering

41a:環凸部 41a: ring convex part

5:第二位移機構 5: The second displacement mechanism

51:第二導軌 51: Second guide rail

52:第二座體 52:Second body

53:樞轉組件 53: Pivot assembly

50:載盤 50: carrier disk

501:組合件承載部 501: Assembly bearing part

502:夾具 502: fixture

6:機械臂 6: Mechanical arm

61:影像攫取組件 61:Image capture component

611:取像組件 611: image acquisition component

62:裝卸機構 62: Loading and unloading mechanism

A:第1圖之影像攫取組件及裝卸機構部位 A: The image capture component and loading and unloading mechanism in Figure 1

Claims (23)

一種預治式晶圓載盤之置載裝置,包括: 一第一位移機構,係連結並受一控制模組驅動,該第一位移機構具有一能往復移動之第一座體,於該第一座體上設有一晶圓預治部; 一設置於該第一位移機構旁側之晶圓環置載機構,係連結並受驅動於該控制模組,該晶圓環置載機構具有一承托晶圓環的晶圓環供料座,於該晶圓環供料座旁側設有一晶圓環移置組件,該晶圓環移置組件能攜取及釋放該晶圓環,且該晶圓環移置組件能攜帶該晶圓環於該晶圓環供料座與該第一座體之晶圓預治部之間進行活動; 一設置於該第一位移機構旁側之晶圓置載機構,係連結並受驅動於該控制模組,該晶圓置載機構具有一承托晶圓之晶圓供料座,於該晶圓供料座旁側設有一晶圓移置組件,該晶圓移置組件具有一晶圓托架,且該晶圓托架能受該晶圓移置組件帶動而能攜帶該晶圓於該晶圓供料座與該第一座體之晶圓預治部之間進行活動; 一設置於該第一位移機構旁側之遮蓋置載機構,係連結並受驅動於該控制模組,該遮蓋置載機構具有一承托遮蓋的遮蓋供料座,於該遮蓋供料座旁側設有一遮蓋移置組件,該遮蓋移置組件能攜取及釋放該遮蓋,且於該遮蓋供料座與該第一座體之晶圓預治部之間進行活動; 一載盤,表面上設有至少一組合件承載部,於各組合件承載部周側分別設有複數夾具; 一機械臂,係連結並受驅動於該控制模組,該機械臂具有一能移動於該第一座體與該載盤之間的活動端,於該活動端上至少設有一裝卸機構。 A loading device for a pre-cured wafer carrier, comprising: A first displacement mechanism, which is connected and driven by a control module, the first displacement mechanism has a first base body capable of reciprocating movement, and a wafer pretreatment part is arranged on the first base body; A wafer ring loading mechanism arranged on the side of the first displacement mechanism is connected to and driven by the control module. The wafer ring loading mechanism has a wafer ring feeding seat for supporting the wafer ring , a wafer ring displacement component is provided beside the wafer ring feeding seat, the wafer ring displacement component can carry and release the wafer ring, and the wafer ring displacement component can carry the wafer The ring moves between the wafer ring feeding seat and the wafer pretreatment part of the first seat; A wafer loading mechanism arranged on the side of the first displacement mechanism is connected to and driven by the control module. The wafer loading mechanism has a wafer feeding seat for supporting the wafer. A wafer displacement assembly is arranged on the side of the round feeding seat, and the wafer displacement assembly has a wafer bracket, and the wafer bracket can be driven by the wafer displacement assembly to carry the wafer on the Movement between the wafer feeding seat and the wafer pre-processing part of the first seat; A cover loading mechanism arranged on the side of the first displacement mechanism is connected to and driven by the control module. The cover loading mechanism has a cover supply seat for supporting the cover, and is next to the cover supply seat. A cover displacement component is provided on the side, and the cover displacement component can carry and release the cover, and move between the cover feeding seat and the wafer pretreatment part of the first base; A carrier plate, with at least one assembly bearing part on the surface, and a plurality of clamps are respectively arranged on the periphery of each assembly bearing part; A mechanical arm is connected to and driven by the control module. The mechanical arm has a movable end capable of moving between the first seat and the carrier, and at least one loading and unloading mechanism is provided on the movable end. 如請求項1所述之預治式晶圓載盤之置載裝置,其中該機械臂之活動端上另設有一能取得影像之影像攫取組件;該裝卸機構上分別設有可相對開合以夾持該組合件之夾持組件、複數對應並解鎖各夾具之夾具操作組件及複數可量測距離之測距元件。The loading device of the pre-cured wafer carrier as described in claim 1, wherein the movable end of the mechanical arm is provided with an image capture component capable of obtaining images; A clamping component holding the assembly, a plurality of clamp operating components corresponding to and unlocking each clamp, and a plurality of distance-measuring components capable of measuring distances. 如請求項2所述之預治式晶圓載盤之置載裝置,其中該複數測距元件為可產生測距雷射光束之雷射光源,且係分別設置於該裝卸機構周側至少三點。The precured wafer carrier loading device as described in Claim 2, wherein the plurality of distance-measuring elements are laser light sources capable of generating distance-measuring laser beams, and are respectively arranged at least three points on the periphery of the loading and unloading mechanism . 如請求項2所述之預治式晶圓載盤之置載裝置,其中該第一位移機構旁側設有一連結並受該控制模組驅動之第二位移機構,該第二位移機構具有一可往復位移之第二座體,該於該第二座體上設有能承置該載盤之樞轉組件。The loading device of the pre-cured wafer carrier as described in claim 2, wherein a second displacement mechanism connected and driven by the control module is provided beside the first displacement mechanism, and the second displacement mechanism has a movable The second base body that moves back and forth is provided with a pivoting assembly capable of bearing the tray on the second base body. 如請求項1所述之預治式晶圓載盤之置載裝置,其中該晶圓預治部係為一鏤空孔,該鏤空孔內設有一承托座,於該承托座頂面上凹設有一凹槽道,於該凹槽道二旁側設有複數能抽吸空氣之吸氣孔;該承托座底部設有一承托座升降組件,該承托座升降組件能帶動該承托座進行升降之動作。The loading device of the pre-cured wafer carrier as described in claim 1, wherein the wafer pre-treatment part is a hollow hole, and a support seat is arranged in the hollow hole, and the top surface of the support seat is concave There is a groove channel, and a plurality of suction holes capable of sucking air are provided on the second side of the groove channel; a support base lifting component is provided at the bottom of the support base, and the support base lifting component can drive the support The seat moves up and down. 如請求項2所述之預治式晶圓載盤之置載裝置,其中該晶圓預治部係為一鏤空孔,該鏤空孔內設有一承托座,於該承托座頂面上凹設有一凹槽道,於該凹槽道二旁側設有複數能抽吸空氣之吸氣孔;該承托座底部設有一承托座升降組件,該承托座升降組件能帶動該承托座進行升降之動作。The loading device of the pre-treatment type wafer carrier as described in claim 2, wherein the wafer pre-treatment part is a hollow hole, and a support seat is arranged in the hollow hole, and the top surface of the support seat is concave There is a groove channel, and a plurality of suction holes capable of sucking air are provided on the second side of the groove channel; a support base lifting component is provided at the bottom of the support base, and the support base lifting component can drive the support The seat moves up and down. 如請求項1所述之預治式晶圓載盤之置載裝置,其中該第一座體係設置於複數平行延伸之第一導軌上,該第一座體頂面於該晶圓預治部周側設有複數可相對往復位移之夾套滑座,各夾套滑座頂側具有背光表面,於各夾套滑座朝向該晶圓預治部之一側設有凹弧部;且於該第一導軌旁側上方設有一可攫取影像之取像單元。The loading device of the pre-cured wafer carrier as described in claim 1, wherein the first seat system is arranged on a plurality of first guide rails extending in parallel, and the top surface of the first seat is around the wafer pre-treatment part There are a plurality of jacket slides on the side that can move relative to each other. The top side of each jacket slide has a backlight surface, and a concave arc is provided on the side of each jacket slide facing the wafer pre-processing part; and on the side of the jacket slide An imaging unit capable of capturing images is arranged above the side of the first guide rail. 如請求項2所述之預治式晶圓載盤之置載裝置,其中該第一座體係設置於複數平行延伸之第一導軌上,該第一座體頂面於該晶圓預治部周側設有複數可相對往復位移之夾套滑座,各夾套滑座頂側具有背光表面,於各夾套滑座朝向該晶圓預治部之一側設有凹弧部;且於該第一導軌旁側上方設有一可攫取影像之取像單元。The loading device of the pre-cured wafer carrier as described in claim 2, wherein the first base system is arranged on a plurality of first guide rails extending in parallel, and the top surface of the first base is around the wafer pre-treatment part There are a plurality of jacket slides on the side that can move relative to each other. The top side of each jacket slide has a backlight surface, and a concave arc is provided on the side of each jacket slide facing the wafer pre-processing part; and on the side of the jacket slide An imaging unit capable of capturing images is arranged above the side of the first guide rail. 如請求項6所述之預治式晶圓載盤之置載裝置,其中該第一座體係設置於複數平行延伸之第一導軌上,該第一座體頂面於該晶圓預治部周側設有複數可相對往復位移之夾套滑座,各夾套滑座頂側具有背光表面,於各夾套滑座朝向該晶圓預治部之一側設有凹弧部;且於該第一導軌旁側上方設有一可攫取影像之取像單元。The loading device of the pre-cured wafer carrier as described in claim 6, wherein the first seat system is arranged on a plurality of first guide rails extending in parallel, and the top surface of the first seat is around the wafer pre-treatment part There are a plurality of jacket slides on the side that can move relative to each other. The top side of each jacket slide has a backlight surface, and a concave arc is provided on the side of each jacket slide facing the wafer pre-processing part; and on the side of the jacket slide An imaging unit capable of capturing images is arranged above the side of the first guide rail. 如請求項7所述之預治式晶圓載盤之置載裝置,其中該晶圓供料座上方設有一噴氣頭,該噴氣頭具有可朝下噴出空氣之噴氣孔,該晶圓托架頂面設有複數可抽吸空氣之抽氣孔。The loading device of the pre-cured wafer carrier as described in claim 7, wherein an air spray head is arranged above the wafer feeding seat, and the air spray head has an air spray hole that can spray air downward, and the top of the wafer carrier The surface is equipped with a plurality of suction holes that can suck air. 如請求項8所述之預治式晶圓載盤之置載裝置,其中該晶圓供料座上方設有一噴氣頭,該噴氣頭具有可朝下噴出空氣之噴氣孔,該晶圓托架頂面設有複數可抽吸空氣之抽氣孔。The loading device of the pre-cured wafer carrier as described in claim 8, wherein an air spray head is arranged above the wafer feeding seat, and the air spray head has an air spray hole that can spray air downwards, and the top of the wafer carrier The surface is equipped with a plurality of suction holes that can suck air. 如請求項9所述之預治式晶圓載盤之置載裝置,其中該晶圓供料座上方設有一噴氣頭,該噴氣頭具有可朝下噴出空氣之噴氣孔,該晶圓托架頂面設有複數可抽吸空氣之抽氣孔。The loading device of the pre-cured wafer carrier as described in claim 9, wherein an air spray head is arranged above the wafer feeding seat, and the air spray head has an air spray hole that can spray air downward, and the top of the wafer bracket The surface is equipped with a plurality of suction holes that can suck air. 如請求項1或2或3所述之預治式晶圓載盤之置載裝置,其中該晶圓環供料座下方設有一晶圓環升降組件,該晶圓環升降組件係能帶動該晶圓環供料座進行升降之動作,該晶圓環移置組件具有一可升降之晶圓環移置滑座,於該晶圓環移置滑座上設有一能向往復位移之晶圓環移置導軌,於該晶圓環移置導軌上設有一能夾持該晶圓環之夾合組件;該晶圓供料座下方設有一晶圓升降組件,該晶圓升降組件係能帶動該晶圓供料座進行升降之動作,該晶圓移置組件具有複數平行於該第一導軌之晶圓移置導軌,以及一設置於各該晶圓移置導軌上且可往復位移之晶圓移置滑座,於該晶圓移置滑座上設有一可垂直升降之伸縮組件,該晶圓托架係設置於該伸縮組件之活動端;該遮蓋供料座下方設有一遮蓋升降組件,該遮蓋升降組件係能帶動該遮蓋供料座進行升降之動作,該遮蓋移置組件具有一可升降之遮蓋移置滑座,於該遮蓋移置滑座上設有一可橫向往復位移之遮蓋移置導軌,於該遮蓋移置導軌上設有一能夾持該遮蓋之夾爪組。The loading device of the pre-cured wafer carrier as described in claim 1, 2 or 3, wherein a wafer ring lifting assembly is provided under the wafer ring feeding seat, and the wafer ring lifting assembly can drive the wafer The ring feeding seat performs lifting action. The wafer ring displacement assembly has a wafer ring displacement slide seat that can be raised and lowered. A wafer ring that can move forward is arranged on the wafer ring displacement slide seat. Displacing the guide rail, a clamping assembly capable of clamping the wafer ring is provided on the wafer ring displacement guide rail; a wafer lifting assembly is provided below the wafer feeding seat, and the wafer lifting assembly can drive the wafer ring. The wafer feeding seat moves up and down. The wafer displacement assembly has a plurality of wafer displacement guide rails parallel to the first guide rail, and a wafer that is arranged on each wafer displacement guide rail and can move back and forth. The displacement slide seat is provided with a telescopic assembly that can be vertically lifted on the wafer displacement slide seat, and the wafer bracket is arranged at the movable end of the telescopic assembly; a cover lift assembly is provided under the cover feed seat, The cover lifting assembly can drive the cover feeding seat to lift. The cover displacement assembly has a cover displacement sliding seat that can be lifted and lowered. Set the guide rail, on the cover displacement guide rail, a jaw group capable of clamping the cover is provided. 如請求項1或2或3所述之預治式晶圓載盤之置載裝置,其中該晶圓環之外周緣環設有一外環凸緣,該晶圓環之內周緣環設有一內環凸緣;該遮蓋中央設有一環凸部;該晶圓供料座上設置有能間隔收容晶圓之晶圓匣。The loading device of the precured wafer carrier as described in claim 1, 2 or 3, wherein the outer peripheral ring of the wafer ring is provided with an outer ring flange, and the inner peripheral ring of the wafer ring is provided with an inner ring A flange; a ring protrusion is provided in the center of the cover; a wafer cassette capable of accommodating wafers at intervals is provided on the wafer feeding seat. 一種應用前述請求項1所述之置載裝置的置載方法,包括: 一「載盤、晶圓環、晶圓、遮蓋分別置於定位」程序,係將一空的載盤設置於預設之組裝定位,並將各晶圓環、晶圓、遮蓋分別置於預設供料定位; 一「晶圓環置載機構將一晶圓環移置於第一位移機構中」程序,係由該晶圓環置載機構將一晶圓環由該供料定位移置並承托於該第一座體之晶圓預治部中; 一「晶圓置載機構將一晶圓移置於該晶圓環中」程序,係由該晶圓置載機構將一晶圓移至該第一位移機構上進行導正,再將該晶圓置於該晶圓環中; 一「遮蓋置載機構將一遮蓋疊置於該晶圓環中之晶圓上,形成一組合件」程序,係由該遮蓋置載機構將一遮蓋移置於該晶圓環中,並疊置於該晶圓上,藉以使該晶圓環、晶圓、遮蓋疊置形成一組合件; 一「裝卸機構將該組合件移置並鎖固於該待組裝的組合件承載部上」程序,係由該控制模組驅動該機械臂上之裝卸機構將該組合件由第一座體移置並鎖固於該待組裝的組合件承載部上。 A loading method using the loading device described in claim 1 above, comprising: 1. The procedure of "positioning trays, wafer rings, wafers, and covers respectively" is to set an empty tray at the preset assembly position, and place each wafer ring, wafer, and covers respectively at the preset supply positioning; A procedure of "moving a wafer ring into the first displacement mechanism by the wafer ring loading mechanism", is that the wafer ring loading mechanism displaces a wafer ring from the feeding position and supports it on the In the wafer preparation department of the first seat; A procedure of "moving a wafer into the wafer ring by the wafer loading mechanism" is that the wafer loading mechanism moves a wafer to the first displacement mechanism for alignment, and then the wafer is The circle is placed in the wafer ring; A procedure of "stacking a cover on the wafer in the wafer ring by the cover placement mechanism to form an assembly" is that the cover placement mechanism transfers a cover to the wafer ring and stacks placed on the wafer so that the wafer ring, wafer, and cover are stacked to form an assembly; A "loading and unloading mechanism to move and lock the assembly on the bearing part of the assembly to be assembled" procedure, the control module drives the loading and unloading mechanism on the mechanical arm to move the assembly from the first seat Place and lock on the bearing part of the assembly to be assembled. 一種應用前述請求項4所述之置載裝置的置載方法,包括: 一「載盤、晶圓環、晶圓、遮蓋分別置於定位」程序,係將一空的載盤設置於預設之組裝定位,並將各晶圓環、晶圓、遮蓋分別置於預設供料定位; 一「晶圓環置載機構將一晶圓環移置於第一位移機構中」程序,係由該晶圓環置載機構將一晶圓環由該供料定位移置並承托於該第一座體之晶圓預治部中; 一「晶圓置載機構將一晶圓移置於該晶圓環中」程序,係由該晶圓置載機構將一晶圓移至該第一位移機構上進行導正,再將該晶圓置於該晶圓環中; 一「遮蓋置載機構將一遮蓋疊置於該晶圓環中之晶圓上,形成一組合件」程序,係由該遮蓋置載機構將一遮蓋移置於該晶圓環中,並疊置於該晶圓上,藉以使該晶圓環、晶圓、遮蓋疊置形成一組合件; 一「裝卸機構校正裝卸作業面」程序,係由該控制模組驅動該機械臂上之裝卸機構調整位置,使各測距元件量測該載盤上一待組裝位置之待組裝的組合件承載部周側之距離為等長,該裝卸機構得以一預設之裝卸作業面正向且平行對應該待組裝的組合件承載部,藉以校正該裝卸機構之裝卸作業面的傾斜角度,並由該控制模組儲存該校正後裝卸作業面之資訊; 一「影像攫取組件檢視載盤上待組裝的組合件承載部周緣之影像,並校正取像面」程序,係由該控制模組驅動該機械臂上之影像攫取組件,依前述該校正後裝卸作業面之傾斜角度及方向檢視該待組裝的組合件承載部周緣及各夾具之影像,並調整該影像攫取組件至以一預設之取像面正確對應於該待組裝的組合件承載部及各夾具之位置,藉以校正該影像攫取組件之取像面的位置,且由該控制模組儲存該校正後取像面之資訊,同時該控制模組利用該校正後取像面之資訊進一步修正該裝卸作業面之相對位置,使該裝卸作業面可準確地對應於該待組裝的組合件承載部及各夾具的位置; 一「裝卸機構將該組合件移置並鎖固於該待組裝的組合件承載部上」程序,係由該控制模組驅動該機械臂上之裝卸機構將該組合件由第一座體移置並鎖固於該待組裝的組合件承載部上。 A loading method using the loading device described in claim 4 above, comprising: 1. The procedure of "positioning trays, wafer rings, wafers, and covers respectively" is to set an empty tray at the preset assembly position, and place each wafer ring, wafer, and covers respectively at the preset supply positioning; A procedure of "moving a wafer ring into the first displacement mechanism by the wafer ring loading mechanism", is that the wafer ring loading mechanism displaces a wafer ring from the feeding position and supports it on the In the wafer preparation department of the first seat; A procedure of "moving a wafer into the wafer ring by the wafer loading mechanism" is that the wafer loading mechanism moves a wafer to the first displacement mechanism for alignment, and then the wafer is The circle is placed in the wafer ring; A procedure of "stacking a cover on the wafer in the wafer ring by the cover placement mechanism to form an assembly" is that the cover placement mechanism transfers a cover to the wafer ring and stacks placed on the wafer so that the wafer ring, wafer, and cover are stacked to form an assembly; A "loading and unloading mechanism calibration loading and unloading work surface" program is that the control module drives the loading and unloading mechanism on the mechanical arm to adjust the position, so that each distance measuring element measures the loading of the assembly to be assembled at a position to be assembled on the carrier The distance between the sides of the loading and unloading mechanism is equal, and the loading and unloading mechanism can have a preset loading and unloading work surface facing forward and parallel to the loading part of the assembly to be assembled, so as to correct the inclination angle of the loading and unloading work surface of the loading and unloading mechanism, and by the The control module stores the information of the corrected loading and unloading operation surface; A procedure of "the image capture component inspects the image around the periphery of the assembly bearing part to be assembled on the tray, and corrects the image capture surface", is that the control module drives the image capture component on the mechanical arm, and loads and disassembles it according to the aforementioned calibration The inclination angle and direction of the working surface inspect the images of the periphery of the component bearing part to be assembled and the images of each fixture, and adjust the image capture component to correctly correspond to the component bearing part and the preset image capturing surface The position of each fixture is used to correct the position of the image capturing surface of the image capture component, and the information of the corrected image capturing surface is stored by the control module, and the control module uses the information of the corrected image capturing surface to further correct The relative position of the loading and unloading operation surface enables the loading and unloading operation surface to accurately correspond to the position of the loading part of the assembly to be assembled and the positions of each fixture; A "loading and unloading mechanism to move and lock the assembly on the bearing part of the assembly to be assembled" procedure, the control module drives the loading and unloading mechanism on the mechanical arm to move the assembly from the first seat Place and lock on the bearing part of the assembly to be assembled. 一種應用前述請求項9所述之置載裝置的置載方法,包括: 一「載盤、晶圓環、晶圓、遮蓋分別置於定位」程序,係將一空的載盤設置於預設之組裝定位,並將各晶圓環、晶圓、遮蓋分別置於預設供料定位; 一「晶圓環置載機構將一晶圓環移置於第一位移機構中」程序,係由該晶圓環置載機構將一晶圓環由該供料定位移置並承托於該第一座體之晶圓預治部中; 一「晶圓置載機構將一晶圓移置於該晶圓環中」程序,係由該晶圓置載機構將一晶圓移至該第一位移機構上進行導正,再將該晶圓置於該晶圓環中; 一「遮蓋置載機構將一遮蓋疊置於該晶圓環中之晶圓上,形成一組合件」程序,係由該遮蓋置載機構將一遮蓋移置於該晶圓環中,並疊置於該晶圓上,藉以使該晶圓環、晶圓、遮蓋疊置形成一組合件; 一「裝卸機構校正裝卸作業面」程序,係由該控制模組驅動該機械臂上之裝卸機構調整位置,使各測距元件量測該載盤上一待組裝位置上之待組裝的組合件承載部周側之距離為等長,該裝卸機構得以一預設之裝卸作業面正向且平行對應該待組裝的組合件承載部,藉以校正該裝卸機構之裝卸作業面,並由該控制模組儲存該校正後裝卸作業面之資訊; 一「影像攫取組件檢視載盤上待組裝的組合件承載部周緣之影像,並校正取像面」程序,係由該控制模組驅動該機械臂上之影像攫取組件,依前述該校正後裝卸作業面之傾斜角度及方向檢視該待組裝的組合件承載部周緣及各夾具之影像,並調整該影像攫取組件至以一預設之取像面正確對應於該待組裝的組合件承載部及各夾具之位置,藉以校正該影像攫取組件之取像面的位置,且由該控制模組儲存該校正後取像面之資訊,同時該控制模組利用該校正後取像面之資訊進一步修正該裝卸作業面之相對位置,使該裝卸作業面可準確地對應於該待組裝的組合件承載部及各夾具的位置; 一「裝卸機構將該組合件移置並鎖固於該待組裝的組合件承載部上」程序,係由該控制模組驅動該機械臂上之裝卸機構將該組合件由第一座體移置並鎖固於該待組裝的組合件承載部上。 A loading method using the loading device described in claim 9 above, comprising: 1. The procedure of "positioning trays, wafer rings, wafers, and covers respectively" is to set an empty tray at the preset assembly position, and place each wafer ring, wafer, and covers respectively at the preset supply positioning; A procedure of "moving a wafer ring into the first displacement mechanism by the wafer ring loading mechanism", is that the wafer ring loading mechanism displaces a wafer ring from the feeding position and supports it on the In the wafer preparation department of the first seat; A procedure of "moving a wafer into the wafer ring by the wafer loading mechanism" is that the wafer loading mechanism moves a wafer to the first displacement mechanism for alignment, and then the wafer is The circle is placed in the wafer ring; A procedure of "stacking a cover on the wafer in the wafer ring by the cover placement mechanism to form an assembly" is that the cover placement mechanism transfers a cover to the wafer ring and stacks placed on the wafer so that the wafer ring, wafer, and cover are stacked to form an assembly; A "loading and unloading mechanism correction loading and unloading work surface" program, the control module drives the loading and unloading mechanism on the mechanical arm to adjust the position, so that each distance measuring element measures the assembly to be assembled at a to-be-assembled position on the carrier The distance between the sides of the loading and unloading mechanism is equal, so that a preset loading and unloading operation surface of the loading and unloading mechanism is positive and parallel to the loading and unloading section of the assembly to be assembled, so as to correct the loading and unloading operation surface of the loading and unloading mechanism, and the control module The group stores the information of the corrected loading and unloading operation surface; A procedure of "the image capture component inspects the image around the periphery of the assembly bearing part to be assembled on the tray, and corrects the image capture surface", is that the control module drives the image capture component on the mechanical arm, and loads and disassembles it according to the aforementioned calibration The inclination angle and direction of the working surface inspect the images of the periphery of the component bearing part to be assembled and the images of each fixture, and adjust the image capture component to correctly correspond to the component bearing part and the preset image capturing surface The position of each fixture is used to correct the position of the image capturing surface of the image capture component, and the information of the corrected image capturing surface is stored by the control module, and the control module uses the information of the corrected image capturing surface to further correct The relative position of the loading and unloading operation surface enables the loading and unloading operation surface to accurately correspond to the position of the loading part of the assembly to be assembled and the positions of each fixture; A "loading and unloading mechanism to move and lock the assembly on the bearing part of the assembly to be assembled" procedure, the control module drives the loading and unloading mechanism on the mechanical arm to move the assembly from the first seat Place and lock on the bearing part of the assembly to be assembled. 一種應用前述請求項12所述之置載裝置的置載方法,包括: 一「載盤、晶圓環、晶圓、遮蓋分別置於定位」程序,係將一空的載盤設置於預設之組裝定位,並將各晶圓環、晶圓、遮蓋分別置於供料定位; 一「晶圓環置載機構將一晶圓環移置於第一位移機構中」程序,係由該晶圓環置載機構將一晶圓環由該供料定位移置並承托於該第一座體之晶圓預治部中; 一「晶圓置載機構將一晶圓移置於該晶圓環中」程序,係由該晶圓置載機構將一晶圓移至該第一位移機構上進行導正,再將該晶圓置於該晶圓環中; 一「遮蓋置載機構將一遮蓋疊置於該晶圓環中之晶圓上,形成一組合件」程序,係由該遮蓋置載機構將一遮蓋移置於該晶圓環中,並疊置於該晶圓上,藉以使該晶圓環、晶圓、遮蓋疊置形成一組合件; 一「裝卸機構校正裝卸作業面」程序,係由該控制模組驅動該機械臂調整該裝卸機構之位置,使各測距元件量測該載盤上一待組裝位置上之待組裝的組合件承載部周側之距離為等長,使該裝卸機構得以正向且平行對應該待組裝的組合件承載部,藉以校正該裝卸機構之裝卸作業面,並由該控制模組儲存該裝卸作業面之資訊; 一「影像攫取組件檢視載盤上待組裝的組合件承載部周緣之影像,並校正取像面」程序,係由該控制模組驅動該機械臂上之影像攫取組件,依前述該校正後裝卸作業面之傾斜角度及方向檢視該待組裝的組合件承載部周緣及各夾具之影像,並調整該影像攫取組件至以一預設之取像面正確對應於該待組裝的組合件承載部及各夾具之位置,藉以校正該影像攫取組件之取像面的位置,且由該控制模組儲存該校正後取像面之資訊,同時該控制模組利用該校正後取像面之資訊進一步修正該裝卸作業面之相對位置,使該裝卸作業面可準確地對應於該待組裝的組合件承載部及各夾具的位置; 一「裝卸機構將該組合件移置並鎖固於該待組裝的組合件承載部上」程序,係由該該控制模組驅動機械臂上之裝卸機構將該組合件由第一座體移置並鎖固於該待組裝的組合件承載部上。 A loading method using the loading device described in claim 12 above, comprising: 1. The procedure of "positioning the tray, wafer ring, wafer, and cover separately" is to set an empty carrier tray at the preset assembly position, and place each wafer ring, wafer, and cover separately on the feeding position; A procedure of "moving a wafer ring into the first displacement mechanism by the wafer ring loading mechanism", is that the wafer ring loading mechanism displaces a wafer ring from the feeding position and supports it on the In the wafer preparation department of the first seat; A procedure of "moving a wafer into the wafer ring by the wafer loading mechanism" is that the wafer loading mechanism moves a wafer to the first displacement mechanism for alignment, and then the wafer is The circle is placed in the wafer ring; A procedure of "stacking a cover on the wafer in the wafer ring by the cover placement mechanism to form an assembly" is that the cover placement mechanism transfers a cover to the wafer ring and stacks placed on the wafer so that the wafer ring, wafer, and cover are stacked to form an assembly; A "loading and unloading mechanism calibration loading and unloading work surface" program is that the control module drives the mechanical arm to adjust the position of the loading and unloading mechanism, so that each distance measuring element measures the assembly to be assembled at a position to be assembled on the carrier The distance between the sides of the loading part is equal, so that the loading and unloading mechanism can be positively and parallel to the loading part of the assembly to be assembled, so as to correct the loading and unloading working surface of the loading and unloading mechanism, and store the loading and unloading working surface by the control module the information of A procedure of "the image capture component inspects the image around the periphery of the assembly bearing part to be assembled on the tray, and corrects the image capture surface", is that the control module drives the image capture component on the mechanical arm, and loads and disassembles it according to the aforementioned calibration The inclination angle and direction of the working surface inspect the images of the periphery of the component bearing part to be assembled and the images of each fixture, and adjust the image capture component to correctly correspond to the component bearing part and the preset image capturing surface The position of each fixture is used to correct the position of the image capturing surface of the image capture component, and the information of the corrected image capturing surface is stored by the control module, and the control module uses the information of the corrected image capturing surface to further correct The relative position of the loading and unloading operation surface enables the loading and unloading operation surface to accurately correspond to the position of the loading part of the assembly to be assembled and the positions of each fixture; A "loading and unloading mechanism displaces and locks the assembly on the bearing part of the assembly to be assembled" procedure, the control module drives the loading and unloading mechanism on the mechanical arm to move the assembly from the first seat Place and lock on the bearing part of the assembly to be assembled. 如請求項16所述之預治式晶圓載盤之置載方法,其中該「裝卸機構校正裝卸作業面」程序,具有: 一「機械臂帶動裝卸機構以預設裝卸基準值接近載盤,並以測距元件量測與待組裝的組合件承載部邊緣之距離」步驟,係由該控制模組驅動該機械臂上之裝卸機構,以預設裝卸基準值之方向及角度移至該載盤上方;並利用各測距元件偵測至該待組裝的組合件承載部周側之距離; 一「控制模組調整裝卸機構位置,使各測距元件之量測距離為等長,藉以校正其裝卸作業面之傾斜角度」步驟,係由該控制模組驅動該機械臂上之裝卸機構調整位置,使各測距元件偵測至該待組裝的組合件承載部周側之距離為等長,以確保該裝卸機構之裝卸作業面正向且平行地對應該待組裝的組合件承載部,藉以校正該裝卸機構之裝卸作業面的傾斜角度;且該控制模組儲存該校正後裝卸作業面之資訊; 該「影像攫取組件檢視載盤上待組裝的組合件承載部周緣之影像,並校正取像面」程序,具有: 一「機械臂帶動影像攫取組件以相同於該校正後裝卸作業面之傾斜角度接近載盤,並取得該待組裝的組合件承載部及各夾具之位置影像」步驟,係由該控制模組驅動該機械臂上之影像攫取組件,以相同於該校正後裝卸作業面之方向及傾斜角度移至該待組裝的組合件承載部上方,利用該影像攫取組件取得該待組裝的組合件承載部周邊的影像,藉以確認該待組裝的組合件承載部及各夾具之位置; 一「控制模組調整影像攫取組件位置,使其正確對應該待組裝的組合件承載部,藉以校正其取像面之位置,且利用該校正後取像面之資訊修正該裝卸作業面,使其正向且準確對應該待組裝的組合件承載部」步驟,係由該控制模組驅動該機械臂上之影像攫取組件調整位置,使該影像攫取組件保持正確地對應該待組裝的組合件承載部及各夾具,藉以校正該影像攫取組件之取像面的位置;且該控制模組儲存該校正後取像面之資訊,並可計算出該裝卸機構的修正位置資訊,以便於再經由該機械臂帶動該裝卸機構移至位於正向準確且平齊地對應該待組裝的組合件承載部的位置。 The loading method of the precured wafer carrier as described in claim 16, wherein the "loading and unloading mechanism corrects the loading and unloading operation surface" program has: A step of "the mechanical arm drives the loading and unloading mechanism to approach the carrier plate with a preset loading and unloading reference value, and uses the distance measuring element to measure the distance from the edge of the assembly to be assembled", which is driven by the control module. The loading and unloading mechanism moves to the top of the loading tray in the direction and angle of the preset loading and unloading reference value; and uses each distance measuring element to detect the distance to the surrounding side of the loading part of the assembly to be assembled; 1. The step of "controlling the module to adjust the position of the loading and unloading mechanism so that the measuring distances of the distance measuring components are equal in length, thereby correcting the inclination angle of the loading and unloading work surface", is that the control module drives the loading and unloading mechanism on the mechanical arm to adjust Position, so that the distance from each distance measuring element to the surrounding side of the assembly bearing part to be assembled is equal, so as to ensure that the loading and unloading operation surface of the loading and unloading mechanism is positively and parallelly corresponding to the assembly bearing part to be assembled, In order to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism; and the control module stores the information of the corrected loading and unloading operation surface; The "image capturing component checks the image of the periphery of the carrier part of the assembly to be assembled on the tray, and corrects the image capturing surface" program has: A step of "the robotic arm drives the image capture component to approach the carrier plate at the same inclination angle as the corrected loading and unloading work surface, and obtains the position image of the loading part of the assembly to be assembled and each fixture" is driven by the control module The image capture component on the mechanical arm is moved to the top of the assembly bearing part to be assembled in the same direction and inclination angle as the corrected loading and unloading work surface, and the periphery of the assembly load bearing part to be assembled is obtained by using the image capture component image, so as to confirm the position of the bearing part of the assembly to be assembled and each fixture; A "control module adjusts the position of the image capturing component so that it correctly corresponds to the bearing part of the assembly to be assembled, so as to correct the position of its image capturing surface, and uses the information of the corrected image capturing surface to correct the loading and unloading operation surface, so that In the step of "directly and accurately corresponding to the bearing part of the assembly to be assembled", the control module drives the image capture component on the mechanical arm to adjust its position, so that the image capture component remains correctly aligned with the assembly to be assembled The carrying part and each fixture are used to correct the position of the image capturing surface of the image capture component; and the control module stores the information of the corrected image capturing surface, and can calculate the corrected position information of the loading and unloading mechanism, so that it can be passed through The mechanical arm drives the loading and unloading mechanism to move to a position that is exactly and parallel to the bearing part of the assembly to be assembled. 如請求項16所述之預治式晶圓載盤之置載方法,其中該「裝卸機構將該組合件移置並鎖固於該待組裝的組合件承載部上」程序,具有: 一「裝卸機構解鎖各夾具」步驟,先由該控制模組驅動該機械臂上之裝卸機構移至該待組裝的組合件承載部上方,利用各夾具操作組件鬆開各夾具; 一「裝卸機構將該組合件移置於該待組裝的組合件承載部上」步驟,係由該控制模組驅動該機械臂上之裝卸機構移至該第一座體之晶圓預治部上方,利用該夾持組件夾持該組合件,再將該組合件移至該待組裝的組合件承載部上; 一「裝卸機構鎖掣各夾具,藉以固定該組合件」步驟,係由各夾具操作組件鎖掣各夾具,使該組合件得以被固定於該待組裝的組合件承載部上。 The loading method of the precured wafer carrier as described in claim 16, wherein the procedure of "moving and locking the assembly by the loading and unloading mechanism on the loading part of the assembly to be assembled" has: 1. The step of "unlocking the clamps by the loading and unloading mechanism". First, the control module drives the loading and unloading mechanism on the mechanical arm to move above the loading part of the assembly to be assembled, and releases the clamps by using the clamp operating components; A step of "loading and unloading mechanism to move the assembly on the loading part of the assembly to be assembled" is that the control module drives the loading and unloading mechanism on the mechanical arm to move to the wafer pretreatment part of the first seat Above, the assembly is clamped by the clamping assembly, and then the assembly is moved to the bearing part of the assembly to be assembled; A step of "locking the clamps of the loading and unloading mechanism to fix the assembly" is to use the clamps to operate the components to lock the clamps so that the assembly can be fixed on the bearing part of the assembly to be assembled. 如請求項20所述之預治式晶圓載盤之置載方法,其中該「裝卸機構鎖掣各夾具,藉以固定該組合件」步驟之後另設有一「裝卸機構脫離組合件,且載盤轉動」步驟,係於各夾持組件鬆脫該組合件之後,由該控制模組驅動該樞轉組件帶動該載盤樞轉,使該已固定該組合件之組合件承載部樞轉移動至一旁側位置,且另一旁側空置的組合件承載部移至原待組裝位置形成另一待組裝的組合件承載部。The loading method of the pre-cured wafer carrier as described in claim 20, wherein after the step of "the loading and unloading mechanism locks the clamps to fix the assembly", there is another step of "the loading and unloading mechanism disengages the assembly, and the carrier rotates ” step, after the clamping components are released from the assembly, the control module drives the pivoting assembly to drive the tray to pivot, so that the assembly carrying part that has fixed the assembly pivots and moves aside side position, and the vacant assembly carrying part on the other side is moved to the original to-be-assembled position to form another assembly-carrying part to be assembled. 如請求項17所述之預治式晶圓載盤之置載方法,其中該「晶圓置載機構將一晶圓移置於該晶圓環中」程序,具有: 一「晶圓置載機構將該晶圓移置於該第一位移機構上,並導正該晶圓」步驟,係由該晶圓托架將該晶圓移至該第一座體之晶圓預治部上方,利用該取像單元取得該晶圓的影像,藉以檢視該晶圓之位置是否正確外,配合該二具有背光表面之夾套滑座相互靠合,使二凹弧部結合成一對應於該晶圓預治部之圓孔,再由該控制模組經由該晶圓移置組件帶動該晶圓托架修正位置,可使該晶圓被導正於正確對應該晶圓環中央之位置; 一「該第一位移機構將該晶圓移至該晶圓環內」步驟,係使二夾套滑座分離,再由該承托座升降組件帶動該承托座上升,使該晶圓托架於凹槽道內脫離該晶圓;然後該晶圓移置組件帶動該晶圓托架移出該第一座體上方;再由該承托座升降組件帶動該承托座下降,使該晶圓下移於該晶圓環內。 The method for placing a precured wafer carrier as described in claim 17, wherein the procedure of "moving a wafer into the wafer ring by the wafer placing mechanism" has: A step of "moving the wafer on the first displacement mechanism by the wafer loading mechanism and guiding the wafer" is to move the wafer to the wafer of the first seat by the wafer carrier. Above the round pretreatment part, use the imaging unit to obtain the image of the wafer, so as to check whether the position of the wafer is correct, cooperate with the two jacket slides with backlight surface to be close together, so that the two concave arcs are combined Form a hole corresponding to the wafer pre-processing part, and then the control module drives the wafer carrier to correct the position through the wafer displacement component, so that the wafer can be guided to the correct corresponding wafer ring central location; A step of "moving the wafer into the wafer ring by the first displacement mechanism" is to separate the two jacket slides, and then the support base lifting assembly drives the support base to rise, so that the wafer support The frame is separated from the wafer in the groove; then the wafer displacement component drives the wafer bracket to move out of the first base; The circle moves down within the wafer ring. 如請求項18所述之預治式晶圓載盤之置載方法,其中該「晶圓置載機構將一晶圓移置於該晶圓環中」程序,具有: 一「晶圓置載機構承載一晶圓,並於移置過程中導平該晶圓」步驟,係由該控制模組驅動該晶圓移置組件帶動該晶圓托架由該晶圓供料座上承托一晶圓,將該晶圓接近該噴氣頭,利用該噴氣頭之噴氣孔噴出空氣吹拂於該晶圓上,可導平該晶圓,使其平穩地保持在晶圓托架上正確的位置; 一「晶圓置載機構將該晶圓移置於該第一位移機構上,並導正該晶圓」步驟,係由該晶圓托架將該晶圓移至該第一座體之晶圓預治部上方,利用該取像單元取得該晶圓的影像,藉以檢視該晶圓之位置是否正確,配合該二具有背光表面之夾套滑座相互靠合,使二凹弧部結合成一對應於該晶圓預治部之圓孔,再由該控制模組經由該晶圓移置組件帶動該晶圓托架修正位置,可使該晶圓被導正於正確對應該晶圓環中央之位置; 一「該第一位移機構將該晶圓移至該晶圓環內」步驟,係使二夾套滑座分離,再由該承托座升降組件帶動該承托座上升,使該晶圓托架於凹槽道內脫離該晶圓;然後該晶圓移置組件帶動該晶圓托架移出該第一座體上方;再由該承托座升降組件帶動該承托座下降,使該晶圓下移於該晶圓環內。 The method for placing a precured wafer carrier as described in Claim 18, wherein the procedure of "moving a wafer into the wafer ring by the wafer placing mechanism" has: A step of "carrying a wafer by the wafer loading mechanism and leveling the wafer during the displacement process" is that the control module drives the wafer displacement component to drive the wafer carrier to be supplied by the wafer A wafer is supported on the material seat, and the wafer is approached to the jet head, and the jet hole of the jet head is used to blow air on the wafer, so that the wafer can be leveled and kept on the wafer holder stably the correct position on the shelf; A step of "moving the wafer on the first displacement mechanism by the wafer loading mechanism and guiding the wafer" is to move the wafer to the wafer of the first seat by the wafer carrier. Above the round pre-curing part, use the imaging unit to obtain the image of the wafer, so as to check whether the position of the wafer is correct, cooperate with the two jacket slides with backlight surface to be close to each other, so that the two concave arcs are combined into one Corresponding to the round hole of the wafer pre-processing part, the control module drives the wafer carrier to correct the position through the wafer displacement component, so that the wafer can be guided to the center of the wafer ring the location of A step of "moving the wafer into the wafer ring by the first displacement mechanism" is to separate the two jacket slides, and then the support base lifting assembly drives the support base to rise, so that the wafer support The frame is separated from the wafer in the groove; then the wafer displacement component drives the wafer bracket to move out of the first base; The circle moves down within the wafer ring.
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