CN115621174A

CN115621174A - Device and method for loading pre-treatment type wafer carrying disc

Info

Publication number: CN115621174A
Application number: CN202110802138.3A
Authority: CN
Inventors: 宋茂炎
Original assignee: Kingtek Co ltd
Current assignee: Kingtek Co ltd
Priority date: 2021-07-15
Filing date: 2021-07-15
Publication date: 2023-01-17

Abstract

The invention provides a pre-treatment type wafer carrying disc carrying device and a method thereof, wherein a wafer ring carrying mechanism, a wafer carrying mechanism, a covering carrying mechanism and a mechanical arm are arranged on the periphery of a first displacement mechanism; the first displacement mechanism is provided with a first seat body, a plurality of assembly bearing parts are arranged on a carrying disc, a plurality of clamps are arranged at the periphery of each assembly bearing part, and the movable end of the mechanical arm is provided with an image capture assembly and a loading and unloading mechanism; the wafer ring loading mechanism is used for placing a wafer ring on the first seat body, the wafer loading mechanism is used for placing a wafer in the wafer ring, the covering loading mechanism is used for overlapping a covering on the wafer to form a combined piece, the mechanical arm is used for correcting the loading and unloading mechanism so as to correctly correspond to a bearing part of the combined piece to be assembled on the carrying disc, the loading and unloading mechanism is used for unlocking each clamp, the combined piece is moved from the first seat body to the bearing part of the combined piece to be assembled, and then each clamp is locked so as to fix the combined piece on the carrying disc.

Description

Device and method for loading pre-treatment type wafer carrying disc

Technical Field

The present invention relates to a pre-treatment type wafer carrier and a method thereof, and more particularly, to a carrier and a method thereof, which can respectively assemble a wafer ring, a wafer, and a cover in an overlapping manner and precisely move and fix the wafer ring, the wafer, and the cover at different positions on a carrier.

Background

A general Integrated Circuit (IC) manufacturing process can be mainly divided into: silicon wafer manufacturing, integrated circuit packaging and the like; in the manufacturing process, when the wafer is subjected to testing, cleaning, evaporation, drying or soaking in organic solvents, in order to effectively fix the wafer for processing and simultaneously process a large number of wafers to improve the processing efficiency, most of the wafers are fixed on a large-area carrier disc, and the carrier disc simultaneously carries the wafers to perform the processing operation of each process.

The common carrying disc is a large-area convex (or concave) arc-shaped disc body structure, a plurality of hollow parts for accommodating wafers are arranged on the carrying disc, a plurality of clamps capable of fixing the wafers are arranged on the periphery of each hollow part, and when each wafer is fixed above the hollow part (an outer convex surface of a convex arc surface or an inner concave surface of a concave arc surface) by the clamps, each wafer can be exposed to the outside through the hollow part to be processed, so that the carrying disc can accommodate a plurality of wafers and move to different processing procedures simultaneously, and the overall processing efficiency of the wafer is effectively improved.

With the gradual popularization of automatic mechanical processing, various automatic machines are utilized to execute the picking and placing operation of wafers on a carrying disc, which not only can save a large amount of manpower, but also can reduce the production cost and improve the processing efficiency, which is a necessary trend, but because the wafers are extremely fragile and have extremely high requirements on the processing precision, the high requirements on the operation precision of picking and placing the wafers by related displacement mechanisms are met, and when a plurality of displacement mechanisms are utilized to respectively execute the combination or superposition operation of the wafers and related components, the displacement mechanisms must be accurately connected, otherwise, the combination precision and the finished product quality of the whole displacement are extremely easily influenced, and even the semi-finished products are damaged; therefore, how to effectively calibrate each displacement mechanism so that not only the accuracy of the displacement mechanism is maintained when a single displacement mechanism performs the displacement of different objects, but also the relative motion relationship between different displacement mechanisms is formed to ensure the connection accuracy of the displacement mechanisms in the operation of displacing the same object is a major issue to be urgently sought by related practitioners.

Disclosure of Invention

In view of the above-mentioned application requirements of the conventional wafer transferring mechanism to the carrier plate, the inventors of the present invention have studied improvement to these requirements, and finally have produced the present invention.

In order to achieve the purpose, the invention adopts the technical scheme that:

a device for loading a pre-treatment type wafer carrying disc is characterized by comprising:

a first displacement mechanism connected to and driven by a control module, the first displacement mechanism having a first seat capable of reciprocating, the first seat being provided with a wafer pre-treating portion;

the wafer ring carrying mechanism is arranged beside the first displacement mechanism and is connected with and driven by the control module, the wafer ring carrying mechanism is provided with a wafer ring feeding seat for supporting a wafer ring, a wafer ring displacement component is arranged beside the wafer ring feeding seat and can carry and release the wafer ring, and the wafer ring displacement component can carry the wafer ring to move between the wafer ring feeding seat and the wafer pre-treatment part of the first seat body;

the wafer carrying mechanism is arranged beside the first displacement mechanism and is connected with and driven by the control module, the wafer carrying mechanism is provided with a wafer feeding seat for supporting a wafer, a wafer displacement component is arranged beside the wafer feeding seat, the wafer displacement component is provided with a wafer bracket, and the wafer bracket can be driven by the wafer displacement component to carry the wafer to move between the wafer feeding seat and the wafer pre-treatment part of the first seat body;

the covering and carrying mechanism is arranged beside the first displacement mechanism and is connected with and driven by the control module, the covering and carrying mechanism is provided with a covering and feeding seat for supporting covering, a covering and displacement component is arranged beside the covering and feeding seat, and the covering and displacement component can carry and release the covering and can move between the covering and feeding seat and the wafer pre-treatment part of the first seat body;

a carrying disc, the surface of which is provided with at least one assembly bearing part, and the periphery of each assembly bearing part is respectively provided with a plurality of clamps;

the mechanical arm is connected with and driven by the control module and is provided with a movable end capable of moving between the first seat body and the carrying disc, and the movable end is at least provided with a loading and unloading mechanism.

The device for loading the pre-treatment type wafer loading disc comprises: the movable end of the mechanical arm is also provided with an image capture component capable of obtaining images; the assembling and disassembling mechanism is respectively provided with a clamping component which can be opened and closed relatively to clamp the assembly, a plurality of clamp operating components which correspond to and unlock each clamp, and a plurality of distance measuring elements which can measure the distance.

The device for loading the pre-treatment type wafer loading disc comprises: the plurality of distance measuring elements are laser light sources capable of generating distance measuring laser beams and are respectively arranged at least three points on the peripheral side of the assembling and disassembling mechanism.

The device for loading the pre-treatment type wafer loading disc comprises: the second displacement mechanism is connected with and driven by the control module and provided with a second seat body capable of reciprocating displacement, and the second seat body is provided with a pivoting component capable of bearing the carrying disc.

The device for loading the pre-treatment type wafer loading disc comprises: the wafer pre-treatment part is a hollow hole, a bearing seat is arranged in the hollow hole, a concave channel is concavely arranged on the top surface of the bearing seat, and a plurality of air suction holes capable of sucking air are arranged at two sides of the concave channel; the bottom of the bearing seat is provided with a bearing seat lifting component which can drive the bearing seat to lift.

The device for loading the pre-treatment type wafer loading disc is characterized in that: the first seat body is arranged on a plurality of first guide rails extending in parallel, a plurality of jacket slide seats capable of relatively reciprocating displacement are arranged on the top surface of the first seat body on the periphery of the wafer pre-treatment part, a backlight surface is arranged on the top side of each jacket slide seat, and a concave arc part is arranged on one side of each jacket slide seat facing the wafer pre-treatment part; and an image capturing unit capable of capturing images is arranged above the first guide rail.

The device for loading the pre-treatment type wafer loading disc comprises: an air nozzle is arranged above the wafer feeding seat, the air nozzle is provided with air nozzles capable of downwards spraying air, and the top surface of the wafer bracket is provided with a plurality of air suction holes capable of sucking air.

The device for loading the pre-treatment type wafer loading disc comprises: a wafer ring lifting assembly is arranged below the wafer ring feeding seat, the wafer ring lifting assembly can drive the wafer ring feeding seat to perform lifting action, the wafer ring displacement assembly is provided with a wafer ring displacement sliding seat capable of lifting, a wafer ring displacement guide rail capable of being reset is arranged on the wafer ring displacement sliding seat, and a clamping assembly capable of clamping the wafer ring is arranged on the wafer ring displacement guide rail; a wafer lifting component is arranged below the wafer feeding seat, the wafer lifting component can drive the wafer feeding seat to lift, the wafer displacement component is provided with a plurality of wafer displacement guide rails parallel to the first guide rail and a wafer displacement sliding seat which is arranged on each wafer displacement guide rail and can be displaced in a reciprocating manner, a telescopic component capable of lifting vertically is arranged on the wafer displacement sliding seat, and the wafer bracket is arranged at the movable end of the telescopic component; the covering and feeding seat is provided with a covering and lifting component below, the covering and lifting component can drive the covering and feeding seat to move up and down, the covering and moving component is provided with a covering and moving slide seat capable of moving up and down, a covering and moving guide rail capable of transversely reciprocating and moving is arranged on the covering and moving slide seat, and a clamping jaw group capable of clamping the covering is arranged on the covering and moving guide rail.

The device for loading the pre-treatment type wafer loading disc comprises: the outer peripheral ring of the wafer ring is provided with an outer ring flange, and the inner peripheral ring of the wafer ring is provided with an inner ring flange; the center of the cover is provided with a ring convex part; the wafer supply seat is provided with wafer cassettes capable of accommodating wafers at intervals.

A method for loading a pre-treatment type wafer carrying disc is applied to a loading device of the pre-treatment type wafer carrying disc, and is characterized by comprising the following steps:

a procedure of respectively arranging the carrying disc, the wafer rings, the wafers and the covers in positioning, namely arranging an empty carrying disc in preset assembly positioning, and respectively arranging the wafer rings, the wafers and the covers in preset feeding positioning;

a process that a wafer ring is moved in the first displacement mechanism by the wafer ring loading mechanism, and a wafer ring is positioned and displaced from the material supply and is supported in the wafer pre-treatment part of the first seat body by the wafer ring loading mechanism;

a procedure of moving a wafer into the wafer ring by the wafer loading mechanism, wherein the wafer loading mechanism moves a wafer onto the first displacement mechanism for guiding, and then the wafer is placed into the wafer ring;

a procedure of "a cover is overlapped on the wafer in the wafer ring by the cover loading mechanism to form an assembly", a cover is moved in the wafer ring by the cover loading mechanism and is overlapped on the wafer, so that the wafer ring, the wafer and the cover are overlapped to form an assembly;

and a procedure that the assembly is moved and locked on the bearing part of the assembly to be assembled by a loading and unloading mechanism, the control module drives the loading and unloading mechanism on the mechanical arm to move and lock the assembly on the bearing part of the assembly to be assembled from the first base body.

A method for loading a pre-treatment type wafer carrying disc is applied to a device for loading the pre-treatment type wafer carrying disc, and is characterized by comprising the following steps:

a procedure of 'covering and loading mechanism overlapping a covering on the wafer in the wafer ring to form an assembly', the covering and loading mechanism moves a covering in the wafer ring and overlaps on the wafer, so that the wafer ring, the wafer and the covering are overlapped to form an assembly;

a procedure of 'loading and unloading mechanism correcting loading and unloading operation surface', the loading and unloading mechanism on the mechanical arm is driven by the control module to adjust the position, so that each distance measuring element measures the distance of the peripheral side of the bearing part of the assembly to be assembled at the position to be assembled on the loading disc to be equal, the loading and unloading mechanism is forwardly and parallelly corresponding to the bearing part of the assembly to be assembled by a preset loading and unloading operation surface, thereby correcting the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism, and the control module stores the information of the corrected loading and unloading operation surface;

a "image capture component detects the image of the periphery of the bearing part of the assembly to be assembled on the bearing disc and corrects the image taking surface" program, the control module drives the image capture component on the mechanical arm to detect the images of the periphery of the bearing part of the assembly to be assembled and each clamp according to the inclination angle and direction of the corrected assembling and disassembling operation surface, and adjusts the image capture component to a preset image taking surface which correctly corresponds to the positions of the bearing part of the assembly to be assembled and each clamp so as to correct the position of the image taking surface of the image capture component, the control module stores the information of the image taking surface after correction, and simultaneously the control module further corrects the relative position of the assembling and disassembling operation surface by using the information of the corrected image taking surface so that the assembling and disassembling operation surface can accurately correspond to the positions of the bearing part of the assembly to be assembled and each clamp;

The method for loading the pre-treatment type wafer loading disc comprises the following steps: the procedure of displacing and locking the assembly on the bearing part of the assembly to be assembled by the assembling and disassembling mechanism comprises the following steps:

a step of unlocking each clamp by a loading and unloading mechanism, wherein the control module drives the loading and unloading mechanism on the mechanical arm to move to the upper part of the bearing part of the assembly to be assembled, and each clamp is loosened by each clamp operating component;

a step of moving the assembly on the bearing part of the assembly to be assembled by a loading and unloading mechanism, wherein the control module drives the loading and unloading mechanism on the mechanical arm to move to the upper part of the wafer pre-treating part of the first seat body, the assembly is clamped by the clamping component, and then the assembly is moved on the bearing part of the assembly to be assembled;

a step of locking each clamp by a loading and unloading mechanism so as to fix the assembly, wherein each clamp is locked by each clamp operating component so that the assembly can be fixed on the bearing part of the assembly to be assembled.

The method for loading the pre-treatment type wafer loading disc comprises the following steps: the step of locking each clamp by the loading and unloading mechanism so as to fix the assembly is followed by the step of separating the loading and unloading mechanism from the assembly and rotating the carrying disc, after each clamping assembly loosens the assembly, the control module drives the pivoting assembly to drive the carrying disc to pivot so that the bearing part of the assembly fixed with the assembly is pivoted and moved to a side position, and the bearing part of the assembly with the other side vacant position is moved to the original position to be assembled to form another bearing part of the assembly to be assembled.

The method for loading the pre-treatment type wafer loading disc comprises the following steps: the program for correcting the loading and unloading operation surface of the loading and unloading mechanism comprises:

a step that the mechanical arm drives the loading and unloading mechanism to approach the carrying disc according to a preset loading and unloading reference value and measures the distance between the loading and unloading mechanism and the edge of a bearing part of a combined piece to be assembled by using a distance measuring element, wherein the control module drives the loading and unloading mechanism on the mechanical arm to move to the position above the carrying disc according to the direction and the angle of the preset loading and unloading reference value; and detecting the distance to the peripheral side of the bearing part of the assembly to be assembled by utilizing each distance measuring element;

a step of adjusting the position of the loading and unloading mechanism by the control module to enable the measuring distance of each distance measuring element to be equal in length so as to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism, wherein the control module drives the loading and unloading mechanism on the mechanical arm to adjust the position so as to enable each distance measuring element to detect that the distance to the peripheral side of the bearing part of the assembly to be assembled is equal in length so as to ensure that the loading and unloading operation surface of the loading and unloading mechanism corresponds to the bearing part of the assembly to be assembled in a positive and parallel manner so as to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism; the control module stores the information of the corrected unloading operation surface;

the procedure of the image capture component for detecting the image of the periphery of the bearing part of the assembly to be assembled on the bearing disc and correcting the image capture surface comprises the following steps:

a step of driving the image-taking component by the mechanical arm to approach the carrying tray at the same inclination angle as the corrected loading and unloading operation surface and obtaining the position images of the bearing part of the assembly to be assembled and each clamp, wherein the control module drives the image-taking component on the mechanical arm to move to the upper part of the bearing part of the assembly to be assembled in the same direction and the same inclination angle as the corrected loading and unloading operation surface, and the image-taking component is used for obtaining the image of the periphery of the bearing part of the assembly to be assembled so as to confirm the positions of the bearing part of the assembly to be assembled and each clamp;

a step of adjusting the position of the image capture component by the control module to make the image capture component correctly correspond to the bearing part of the assembly to be assembled so as to correct the position of the image capture surface of the assembly, and correcting the assembling and disassembling operation surface by utilizing the information of the image capture surface after correction so as to make the assembling and disassembling operation surface positively and accurately correspond to the bearing part of the assembly to be assembled, wherein the control module drives the image capture component on the mechanical arm to adjust the position so that the image capture component keeps correctly corresponding to the bearing part of the assembly to be assembled and each clamp so as to correct the position of the image capture surface of the image capture component; the control module stores the information of the corrected image taking surface and can calculate the corrected position information of the assembling and disassembling mechanism, so that the mechanical arm drives the assembling and disassembling mechanism to move to the position which is positioned on the bearing part of the assembly to be assembled and accurately and in parallel.

The method for loading the pre-treatment type wafer loading disc comprises the following steps: the procedure of "the wafer loading mechanism moves a wafer into the wafer ring" includes:

a step of moving the wafer on the first displacement mechanism by a wafer carrying mechanism and guiding the wafer, wherein the wafer is moved to the upper part of a wafer pre-treatment part of the first seat body by the wafer bracket, an image of the wafer is obtained by the image capturing unit so as to inspect whether the position of the wafer is correct or not, two concave arc parts are combined into a round hole corresponding to the wafer pre-treatment part by matching with the mutual leaning of two jacket sliding seats with backlight surfaces, and then the wafer bracket is driven by the control module through the wafer displacement component to correct the position, so that the wafer is guided to the position correctly corresponding to the center of the wafer ring;

a step of moving the wafer into the wafer ring by the first displacement mechanism, in which the two jacket sliding seats are separated, and the supporting seat is driven by the supporting seat lifting component to lift up, so that the wafer bracket is separated from the wafer in the concave groove channel; then the wafer displacement assembly drives the wafer bracket to move out of the upper part of the first seat body; then, the supporting base is driven by the supporting base lifting component to descend, so that the wafer moves downwards in the wafer ring.

a step of 'the wafer loading mechanism bears a wafer and guides and flattens the wafer in the displacement process', the control module drives the wafer displacement component to drive the wafer bracket to support a wafer from the wafer feeding seat, the wafer is close to the air nozzle, air ejected by the air nozzle of the air nozzle is blown to the wafer, and the wafer can be guided and flattened so as to be stably kept at the correct position on the wafer bracket;

a step of moving the wafer on the first displacement mechanism by a wafer carrying mechanism and guiding the wafer, wherein the wafer is moved to the upper part of a wafer pre-treatment part of the first seat body by the wafer bracket, an image of the wafer is obtained by the image capturing unit so as to inspect whether the position of the wafer is correct, two concave arc parts are combined into a round hole corresponding to the wafer pre-treatment part by matching with the mutual leaning of two jacket sliding seats with backlight surfaces, and then the control module drives the wafer bracket to correct the position by the wafer displacement component, so that the wafer is guided to the position correctly corresponding to the center of the wafer ring;

a step of moving the wafer into the wafer ring by the first displacement mechanism, in which the two jacket sliding seats are separated, and the supporting seat is driven by the supporting seat lifting component to lift up, so that the wafer bracket is separated from the wafer in the concave groove channel; then the wafer displacement assembly drives the wafer bracket to move out of the upper part of the first seat body; the supporting base is then driven by the supporting base lifting component to descend, so that the wafer moves downwards in the wafer ring.

The invention has the main advantages that the invention provides a pre-treatment type device and a method for loading a wafer loading disc, wherein a wafer ring loading mechanism, a wafer loading mechanism, a covering loading mechanism and a second displacement mechanism are arranged on the peripheral side of a first displacement mechanism, and a mechanical arm is arranged between the first displacement mechanism and the second displacement mechanism; the first displacement mechanism is provided with a first seat body capable of reciprocating displacement, a wafer pre-treatment part is arranged on the first seat body, a movable carrying disc is arranged on the second displacement mechanism, a plurality of assembly bearing parts are arranged on the carrying disc, a plurality of clamps are arranged on the periphery of each assembly bearing part, and an image capture component and a loading and unloading mechanism are arranged at the movable end of the mechanical arm; the wafer ring loading mechanism can place a wafer ring in the wafer pre-treatment part, the wafer loading mechanism places a wafer in the wafer ring, the covering loading mechanism places a covering in the wafer ring and the covering is superposed on the wafer to form a combined piece, the peripheral side of the wafer is firmly clamped between the wafer ring and the covering periphery, so that the wafer can maintain good flatness in the combined piece, the mechanical arm can drive the loading and unloading mechanism and the image capture component to respectively correct the loading and unloading operation surface and the image capture surface, the loading and unloading mechanism can positively and accurately correspond to a bearing part of the combined piece to be assembled at a position to be assembled on the carrying disc, the loading and unloading mechanism can unlock each clamp firstly, then the combined piece is moved to the bearing part to be assembled from the first seat body, then the loading and unloading mechanism locks each clamp, the combined piece is fixed on the bearing part of the combined piece to be assembled, the carrying disc rotates, the other bearing part of the combined piece is moved to the position to be assembled, the combined flow path of simple structure, reasonable structure and low cost and effective assembly efficiency can be improved.

Another advantage of the present invention is to provide a pre-treatment wafer carrier plate loading device and method thereof, wherein a plurality of distance measuring elements are disposed around the loading/unloading mechanism, and when the loading/unloading mechanism approaches the assembly carrying portion to be assembled in a direction and at an angle corresponding to a predetermined loading/unloading reference value, the position of the loading/unloading mechanism can be adjusted to make the distance between the distance measuring elements and the circumference of the assembly carrying portion to be assembled equal, so as to correct the inclination angle of the loading/unloading operation surface of the loading/unloading mechanism, and make the loading/unloading mechanism parallel (having the same inclination angle) to the assembly carrying portion to be assembled; the image capture component can approach the bearing part of the assembly to be assembled in the same direction and inclination angle as the corrected assembling and disassembling operation surface and directly capture images, the position of the image capture component is adjusted to enable the forward direction of the image capture component to accurately correspond to the bearing part of the assembly to be assembled so as to correct the position of the image capturing surface of the image capture component, and meanwhile, the position of the assembling and disassembling mechanism is corrected by utilizing the information of the position of the corrected image capturing surface so that the assembling and disassembling operation surface can positively and accurately correspond to the bearing part of the assembly to be assembled and the peripheral components of the assembly.

Another advantage of the present invention is to provide a pre-treatment type wafer carrier and a method thereof, wherein jacket slides having a backlight surface and capable of moving relatively are disposed on the periphery of the wafer pre-treatment portion on the top surface of the first base, concave arc portions are respectively disposed on one side of each jacket slide facing the wafer pre-treatment portion, and an image capturing unit is disposed beside the first moving mechanism, so that when the image capturing unit captures a wafer image moving above the wafer ring, the jacket slides can be engaged with each other to combine the concave arc portions into a hole having a backlight effect, so that the wafer can be easily aligned with the wafer ring, thereby facilitating the subsequent operation of accurately placing the wafer into the wafer ring.

In order to make the aforementioned objects, functions and features of the present invention more comprehensible, the following description is given with reference to the accompanying drawings:

drawings

Fig. 1 is an exploded perspective view of the overall structure and associated components of the present invention.

FIG. 2 is a schematic view of a portion of the present invention; the structure of the first seat and the related bearing seat are disclosed.

FIG. 3 is a partially enlarged view of the portion A of FIG. 1; the structure of the image capture assembly and the attachment and detachment mechanism assembled to the robotic arm is disclosed.

Fig. 4 is a flow chart of the operation of the present invention.

FIG. 5 is a schematic view of the present invention showing the wafer ring, the wafer and the lid in the feeding positions.

Fig. 6 is a diagram illustrating the operation of the wafer loading mechanism driving each wafer cassette to pivot toward the first displacement mechanism according to the present invention.

Fig. 7 is a first operation diagram of the wafer ring displacing assembly displacing the wafer ring according to the present invention.

Fig. 8 is a second operation diagram of the wafer ring displacing assembly displacing the wafer ring according to the present invention.

Fig. 9 is a third operation diagram of the wafer ring displacing assembly displacing the wafer ring according to the present invention.

Fig. 10 is a diagram (four) illustrating the wafer ring displacement assembly of the present invention displacing a wafer ring.

FIG. 11 is a first operation diagram of the wafer displacement assembly of the present invention displacing the wafer.

Fig. 12 is a second operation diagram of the wafer displacement assembly of the present invention displacing the wafer.

FIG. 13 is a diagram illustrating the operation of the present invention in which a wafer is translated on a wafer carrier using a showerhead jet.

Fig. 14 is an operation diagram (three) of the wafer displacement assembly of the present invention displacing the wafer.

Fig. 15 is a diagram (four) illustrating the wafer displacement operation of the wafer displacement assembly of the present invention.

FIG. 16 is a diagram illustrating an operation of inspecting a wafer on a first base by an image-capturing unit and guiding the wafer by a two-collet slide according to the present invention.

Figure 17 is a schematic diagram of the present invention with the support pedestal raised to support a wafer.

FIG. 18 is a diagram illustrating the movement of the wafer carrier out of the present invention.

Figure 19 is an illustration of the invention with the support pedestal lowered to place the wafer within the wafer ring.

Fig. 20 is an operation diagram of the first seat being displaced to the side of the covering and loading mechanism according to the present invention.

FIG. 21 is an action diagram (one) of the present invention for the cover displacement assembly to displace the cover.

FIG. 22 is an action diagram (two) of the mask displacement assembly of the present invention displacing the mask.

FIG. 23 is an action diagram (III) of the cover displacement assembly of the present invention displacing the cover.

FIG. 24 is a diagram (IV) of the movement of the cover displacement assembly displacement cover of the present invention.

Fig. 25 is an action view of the jaw set of the cover displacement assembly of the present invention shown removed from the cover.

FIG. 26 is a schematic view of the present invention after the cover displacement assembly has been placed and the robot arm has not yet been actuated.

FIG. 27 is a diagram showing the operation of the loading and unloading mechanism of the present invention for calibrating the inclination angle of the loading and unloading work surface by aligning the assembly receiving portion to be assembled on the tray with the distance measuring device.

FIG. 28 is a diagram illustrating the operation of the present invention for capturing the image of the assembly carrier to be assembled by the image capture assembly and correcting the position of the image capture surface.

Fig. 29 is an operation diagram for unlocking the clamps on the peripheral side of the bearing part of the assembly to be assembled by the attaching and detaching mechanism according to the present invention.

Fig. 30 is a schematic diagram (one) of the wafer ring being moved from the first base to the assembly supporting portion to be assembled by the mounting and dismounting mechanism according to the present invention.

Fig. 31 is a second operation diagram of the present invention using the loading/unloading mechanism to move the wafer ring from the first base to the assembly supporting portion to be assembled.

FIG. 32 is a view showing the operation of the present invention to lock the clamps around the bearing portion of the assembly to be assembled by the attaching and detaching mechanism.

Fig. 33 is an operation diagram of the carriage plate pivoting after the attachment/detachment mechanism of the present invention is detached from the carriage plate.

Description of reference numerals: 1a first displacement mechanism; 11 a first guide rail; 12 a first seat body; 121 a wafer pre-treatment part; 13 a support bracket; 131 concave channels; 132 a suction hole; 133 bearing seat lifting components; 15 jacket slide; 151 concave arc portion; 16 an image capturing unit; 2a wafer ring loading mechanism; 21a wafer ring feeding seat; 22a wafer ring lifting assembly; 23 a wafer ring displacement assembly; 231 wafer ring displacement guide rails; 232 a wafer ring displacement slide seat; 233 a clamping assembly; 2a wafer ring; 20a assembly; 21a outer annular flange; 22a an inner ring flange; 3a wafer loading mechanism; 31 a wafer supply seat; 32 a wafer lift assembly; 33 a wafer displacement assembly; 331 a wafer displacement guide rail; 332 wafer displacement slide; 333 telescoping components; 34 a wafer carrier; 341 air exhaust holes; 35 an air jet head; 351 air injection holes; 3a wafer; 30a wafer cassette; 4 covering the loading mechanism; 41 covering the feeding seat; 42 covering the lifting assembly; 43 covering the displacement assembly; 431 covering the displacement guide; 432 cover the displacement slide; 433 a clamping jaw set; 4a covering; 41a ring protrusion; 5 a second displacement mechanism; 51 a second guide rail; 52 a second seat; 53 a pivoting assembly; 50 carrying discs; 501 assembly carrier; 502, a clamp; 6, a mechanical arm; 61 an image capture component; 611 image capture component; 62 a loading and unloading mechanism; 621 a ranging element; 6211 a laser beam; 622 clamping the assembly; 623 a clamp operating assembly; a the image capture assembly and the loading/unloading mechanism of FIG. 1; the P1 carrying disc, the wafer ring, the wafer and the cover are respectively positioned; the P2 wafer ring loading mechanism moves a wafer ring into the first displacement mechanism; p3, the wafer loading mechanism moves a wafer into the wafer ring; p4 covering and loading mechanism overlaps a covering on the wafer in the wafer ring to form an assembly; the P5 loading and unloading mechanism corrects a loading and unloading operation surface; the P6 image capture component detects the image of the periphery of the bearing part of the assembly to be assembled on the bearing disc and corrects the image taking surface; the P7 assembling and disassembling mechanism displaces and locks the assembly on the bearing part of the assembly to be assembled; s11, moving the carrying disc to an operation location on a second displacement mechanism; s12, placing a wafer cassette for accommodating wafers on the wafer loading mechanism; the wafer ring and the cover are respectively arranged on the wafer ring loading mechanism and the cover loading mechanism; s13, the wafer loading mechanism drives the wafer cassette to pivot, so that the opening of the wafer cassette faces the first displacement mechanism; s21, the wafer ring carrying mechanism displaces and positions a wafer ring in the first displacement mechanism; s31, the wafer loading mechanism bears a wafer and guides and flattens the wafer in the displacement process; s32, the wafer loading mechanism moves the wafer on the first displacement mechanism and guides the wafer; s33, the first displacement mechanism moves the wafer into the wafer ring; s41, the covering and carrying mechanism moves a covering into the wafer ring and superposes the covering and carrying mechanism on the wafer to form an assembly; s51, the mechanical arm drives the loading and unloading mechanism to approach the carrying disc according to a preset loading and unloading reference value, and a distance measuring element is used for measuring the distance between the mechanical arm and the edge of the bearing part of the assembly to be assembled; s52, the control module adjusts the position of the loading and unloading mechanism to enable the measuring distances of all the distance measuring elements to be equal, so that the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism is corrected; s61, the mechanical arm drives the image capture component to approach the carrying tray at the same inclination angle as the corrected loading and unloading operation surface, and position images of the bearing part of the assembly to be assembled and each clamp are obtained; s62, the control module adjusts the position of the image capture component to ensure that the image capture component correctly corresponds to the bearing part of the assembly to be assembled so as to correct the position of the image capture surface of the image capture component, and the information of the corrected image capture surface is used for correcting the assembling and disassembling operation surface so that the assembling and disassembling operation surface positively and accurately corresponds to the bearing part of the assembly to be assembled; s71, unlocking each clamp by the assembling and disassembling mechanism; s72, the assembly and disassembly mechanism moves the assembly on the bearing part of the assembly to be assembled; s73, locking each clamp by a loading and unloading mechanism so as to fix the assembly; s74, the assembling and disassembling mechanism is separated from the assembly, and the carrying disc rotates.

Detailed Description

Referring to fig. 1 to 3, it can be seen that the main structure of the present invention includes: a first displacement mechanism 1, a wafer ring loading mechanism 2, a wafer loading mechanism 3, a covering loading mechanism 4, a second displacement mechanism 5 and a mechanical arm 6; the first displacement mechanism 1 is connected to and driven by a control module (which may be a computer with an operation function, not shown), the first displacement mechanism 1 has a plurality of first guide rails 11 extending in parallel, and a first seat 12 disposed on each of the first guide rails 11 and capable of reciprocating, a wafer pre-treating portion 121 (which may be a hollow hole) is disposed on the first seat 12, a supporting seat 13 is disposed in the wafer pre-treating portion 121, the supporting seat 13 is driven by a supporting seat lifting component 133 to lift, a concave channel 131 is concavely disposed on the top surface of the supporting seat 13, and a plurality of suction holes 132 capable of sucking air are disposed beside the two concave channels 131.

In one possible embodiment, the top surface of the first base 12 is provided with a plurality of jacket sliders 15 capable of relatively reciprocating, around the wafer preparation portion 121, the top side of each jacket slider 15 has a backlight surface, and a concave arc portion 151 is provided at one side of each jacket slider 15 facing the wafer preparation portion 121; an image capturing unit 16 is disposed above the first guide rail 11 for capturing images.

The wafer ring loading mechanism 2 is disposed beside the first guide rail 11, connected to and driven by the control module (not shown), the wafer ring loading mechanism 2 has a wafer ring feeding base 21 for supporting a plurality of stacked wafer rings 2a, and a wafer ring lifting assembly 22 supported below the wafer ring feeding base 21, the wafer ring lifting assembly 22 can drive the wafer ring feeding base 21 to move up and down, a wafer ring displacing assembly 23 is disposed beside the wafer ring feeding base 21, the wafer ring displacing assembly 23 has a wafer ring displacing slide base 232 capable of moving up and down, a wafer ring guide rail 231 capable of moving back and forth in a transverse direction is disposed on the wafer ring displacing slide base 232, and a group of clamping assemblies 233 capable of opening and closing relatively is disposed on the wafer ring displacing guide rail 231.

In one possible embodiment, an outer annular flange 21a is annularly disposed above the outer periphery of the wafer ring 2a, and an inner annular flange 22a is annularly disposed below the inner periphery of the wafer ring 2a.

The wafer loading mechanism 3 is disposed beside the first guide rail 11, connected to and driven by the control module (not shown), the wafer loading mechanism 3 has a wafer feeding seat 31 for supporting a plurality of wafers 3a, and a wafer lifting assembly 32 supported below the wafer feeding seat 31, the wafer lifting assembly 32 can drive the wafer feeding seat 31 to move up and down, a gas nozzle 35 is disposed above the wafer feeding seat 31, and the gas nozzle 35 has a gas nozzle 351 capable of ejecting air downward; besides, a wafer displacement assembly 33 is disposed beside the wafer feeding seat 31, the wafer displacement assembly 33 has a plurality of wafer displacement rails 331 parallel to the first rail 11, and a wafer displacement slide carriage 332 disposed on each wafer displacement rail 331 and capable of reciprocating displacement, a telescopic assembly 333 capable of vertically lifting is disposed on the wafer displacement slide carriage 332, a wafer bracket 34 is disposed at a movable end of the telescopic assembly 333, and a plurality of pumping holes 341 capable of pumping air are disposed on a top surface of the wafer bracket 34.

In one possible embodiment, the outer diameter of the wafer 3a is slightly smaller than the inner diameter of the wafer ring 2a, and a predetermined fixed number of wafers 3a can be accommodated in a wafer cassette 30a at intervals in advance, and then the wafer cassette 30a is placed on the wafer feeding base 31 so as to displace the wafers 3a.

The covering and carrying mechanism 4 is disposed beside the first guide rail 11, connected to and driven by the control module (not shown), the covering and carrying mechanism 4 has a covering and feeding seat 41 for supporting a plurality of overlapped covering devices 4a, and a covering and lifting assembly 42 supported below the covering and feeding seat 41, the covering and lifting assembly 42 can drive the covering and feeding seat 41 to move up and down, a covering and displacing assembly 43 is disposed beside the covering and feeding seat 41, the covering and displacing assembly 43 has a liftable covering and displacing slide carriage 432, a covering and displacing guide rail 431 capable of transversely reciprocating and displacing is disposed on the covering and displacing slide carriage 432, and a group of clamping jaws 433 capable of relatively opening and closing is disposed on the covering and displacing guide rail 431.

In one possible embodiment, the cover 4a is a plate with an outer diameter close to the outer diameter of the wafer 3a, and a ring protrusion 41a capable of being clamped by the clamping jaw set 433 is disposed at the center of the cover 4a.

The second displacement mechanism 5 is transversely disposed beside one end of the first guide rail 11, connected to and driven by the control module (not shown), the second displacement mechanism 5 has a plurality of second guide rails 51 extending in parallel, and a second base 52 disposed on each of the second guide rails 51 and capable of reciprocating, a pivot assembly 53 is disposed on the second base 52, and a tray 50 can be placed on the pivot assembly 53 in combination.

In one possible embodiment, the tray 50 is a disc-shaped structure with a convex arc surface, a plurality of assembly carrying portions 501 (may be hollow portions) are disposed on the surface of the tray 50, and a plurality of clamps 502 are disposed around each assembly carrying portion 501 (hollow portion).

The mechanical arm 6 is disposed between the first displacement mechanism 1 and the second displacement mechanism 5, connected to and driven by the control module (not shown), and an image capture assembly 61 and a loading and unloading mechanism 62 are disposed at the movable end of the mechanical arm 6; the image capturing device 61 has an image capturing device 611 for capturing images, the assembling and disassembling mechanism 62 has two clamping devices 622 capable of opening and closing relatively, a plurality of clamp operating devices 623 corresponding to each clamp 502, and a plurality of distance measuring devices 621, wherein the plurality of distance measuring devices 621 can be laser light sources respectively disposed at least three points around the assembling and disassembling mechanism 62 and capable of generating distance measuring laser beams 6211.

Referring to fig. 4, it can be seen that the operation method of the present invention includes: a ' loading disc, a wafer ring, a wafer, a cover are respectively arranged in a positioning ' P1 program, a ' wafer ring placing mechanism moves a wafer ring in a first displacement mechanism ' P2 program, a ' wafer placing mechanism moves a wafer in the wafer ring ' P3 program, a ' cover placing mechanism overlaps a cover on the wafer in the wafer ring to form a assembly ' P4 program, a ' loading and unloading mechanism corrects a loading and unloading operation surface ' P5 program, an ' image capture assembly detects the image of the periphery of a bearing part of the assembly to be assembled on the loading disc, and corrects a ' P6 program ' of the image capture surface, a ' loading and unloading mechanism displaces and locks the assembly on the bearing part of the assembly to be assembled ' P7 program; wherein:

the procedure "the carrier disc, the wafer ring, the wafer and the cover are respectively positioned" P1 is to arrange an empty carrier disc 50 in a preset assembly position, and to arrange each wafer ring 2a, wafer 3a and cover 4a in a preset feeding position; which comprises in order: s11, moving the carrying disc to the operation positioning on the second displacement mechanism, and placing the wafer box for accommodating the wafer on the wafer carrying mechanism; the wafer ring and the cover are respectively arranged on the wafer ring loading mechanism and the cover loading mechanism S12, and the wafer loading mechanism drives the wafer box to pivot so that the opening of the wafer box faces the first displacement mechanism S13.

The "wafer ring placing mechanism moves a wafer ring into the first displacement mechanism" P2 procedure, the control module drives the wafer ring placing mechanism 2 to move a wafer ring 2a from the feeding position and support the wafer ring in the wafer pre-treatment part 121 of the first seat 12; it has the following components: the wafer ring placing mechanism displaces and positions a wafer ring in the first displacement mechanism S21.

The "wafer loading mechanism moves a wafer into the wafer ring" P3 procedure, the control module drives the wafer loading mechanism 3 to move a wafer 3a onto the first displacement mechanism 1 for guiding, and then the wafer 3a is placed into the wafer ring 2 a; which comprises in order: the "wafer loading mechanism carries a wafer and levels the wafer during the displacement" S31 step, "the wafer loading mechanism moves the wafer on the first displacement mechanism and corrects the wafer" S32 step, "the first displacement mechanism moves the wafer into the wafer ring" S33 step.

The covering and carrying mechanism overlaps a covering on the wafer in the wafer ring to form a combined part P4 program, the control module drives the covering and carrying mechanism 4 to move a covering 4a in the wafer ring 2a and overlap the wafer 3a, so that the wafer ring 2a, the wafer 3a and the covering 4a are overlapped to form a combined part 20a, the peripheral side of the wafer 3a is stably clamped between the peripheral edges of the wafer ring 2a and the covering 4a, and the wafer 3a can maintain good flatness in the combined part 20 a; it has the following components: the "cover loading mechanism moves a cover into the wafer ring and stacks it on the wafer to form an assembly" S41.

The program "loading and unloading mechanism corrects loading and unloading operation surface" P5, the control module drives the loading and unloading mechanism 62 on the mechanical arm 6 to adjust the position, so that each distance measuring element 621 measures the distance of the peripheral side of the bearing part 501 of the assembly to be assembled at the position to be assembled on the loading tray 50 to be equal, the loading and unloading mechanism 62 is enabled to be parallel (with the same inclination angle) to the bearing part 501 of the assembly to be assembled in the forward direction, thereby correcting the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism 62, and the control module stores the information of the corrected loading and unloading operation surface; which comprises in order: step S51, the mechanical arm drives the loading and unloading mechanism to approach the carrying disc according to a preset loading and unloading reference value, and the distance between the loading and unloading mechanism and the edge of the bearing part of the assembly to be assembled is measured by the distance measuring element, step S52, the control module adjusts the position of the loading and unloading mechanism to enable the measuring distance of each distance measuring element to be equal, and therefore the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism is corrected.

The image-capturing component detects the image of the periphery of the bearing part of the assembly to be assembled on the vision carrying tray and corrects the image-capturing plane P6 program, the control module drives the image-capturing component 61 on the mechanical arm 6 to detect the images of the periphery of the bearing part 501 and the clamps 502 of the assembly to be assembled according to the inclination angle and the direction of the corrected assembling and disassembling operation plane, and adjusts the position of the image-capturing component 61 correctly corresponding to the bearing part 501 and the clamps 502 of the assembly to be assembled so as to correct the position of the image-capturing plane of the image-capturing component 61, the control module stores the information of the corrected image-capturing plane, and the control module further corrects the relative position of the assembling and disassembling operation plane by using the information of the corrected image-capturing plane so that the assembling and disassembling operation plane can accurately correspond to the positions of the bearing part 501 and the clamps 502 of the assembly to be assembled; which comprises in order: the mechanical arm drives the image capture component to approach the carrying disc at the same inclination angle as the corrected assembling and disassembling operation surface and obtain the position images of the bearing part of the assembly to be assembled and the clamps S61, the control module adjusts the position of the image capture component to make the image capture component correctly correspond to the bearing part of the assembly to be assembled so as to correct the position of the image taking surface, and the information of the corrected image taking surface is used for correcting the assembling and disassembling operation surface so as to make the assembling and disassembling operation surface correctly correspond to the bearing part of the assembly to be assembled S62.

The procedure "the assembly and disassembly mechanism displaces and locks the assembly on the assembly bearing part to be assembled" P7, the control module drives the assembly and disassembly mechanism 62 on the mechanical arm 6 to displace and lock the assembly 20a on the assembly bearing part 501 to be assembled; which comprises in order: step S71, unlocking each clamp by a loading and unloading mechanism, step S72, moving the assembly on the bearing part of the assembly to be assembled by the loading and unloading mechanism, step S73, locking each clamp by the loading and unloading mechanism so as to fix the assembly, step S74, separating the loading and unloading mechanism from the assembly and rotating the carrying disc.

The following steps are described with reference to fig. 5 to 33, and form a practical embodiment:

firstly, the step S11 of moving the tray to the operation position on the second displacement mechanism is to drive the second displacement mechanism 5 by the control module, so that the second base 52 is moved to one end of each second guide rail 51 far away from the first displacement mechanism 1, so as to place an empty tray 50 on the second base 52 (as shown in fig. 5); the second base 52 carries the carrier tray 50 and moves along the second guide rails 51 to a predetermined operation position (as shown in fig. 6) close to the first displacement mechanism 1.

The wafer cassette for accommodating the wafers is arranged on the wafer loading mechanism; a step S12 in which a wafer ring and a cover are respectively placed on the wafer ring loading mechanism and the cover loading mechanism, wherein a plurality of wafer rings 2a are stacked on a wafer ring feeding seat 21 (i.e., the feeding and positioning of the wafer rings 2 a) of the wafer ring loading mechanism 2, a plurality of wafer cassettes 30a containing wafers 3a arranged at intervals are placed on a wafer feeding seat 31 (i.e., the feeding and positioning of the wafers 3 a) of the wafer loading mechanism 3, and a plurality of covers 4a are stacked on a cover feeding seat 41 (i.e., the feeding and positioning of the covers 4 a) of the cover loading mechanism 4; the first base 12 can be moved to a position where each first guide rail 11 is close to the side of the wafer ring loading mechanism 2 (as shown in fig. 5) as required.

The step S13 of "the wafer loading mechanism drives the wafer cassette to pivot so that the opening faces the first displacement mechanism" makes the wafer feeding base 31 transfer the opening of each wafer cassette 30a to the side facing the first displacement mechanism 1 as required (as shown in FIG. 6).

The step S21 of the wafer ring placing mechanism displacing and positioning a wafer ring in the first displacement mechanism is that the control module drives the wafer ring placing mechanism 2 to make the clamping component 233 of the wafer ring displacing component 23 clamp a wafer ring 2a on the wafer ring feeding seat 21, and move the wafer ring 2a into the wafer pre-treating portion 121 of the first seat 12 along with the lifting of the wafer ring displacing slide seat 232 and the transverse sliding of the wafer ring displacing guide rail 231 (as shown in fig. 7, 8 and 9); the clamp assembly 233 is then disengaged from the wafer ring 2a, such that the wafer ring 2a can be positioned with the outer ring flange 21a against the edge of the wafer pre-treatment portion 121 (as shown in FIG. 10).

In practical applications, the wafer ring lifting assembly 22 can cooperate with the wafer ring feeding base 21 to lift, so that the wafer ring displacing assembly 23 can more easily clamp the wafer ring 2a at a proper position.

The "wafer loading mechanism carries a wafer and guides the wafer during the displacement" S31 step, the control module drives the wafer loading mechanism 3 to move the wafer displacement slide 332 of the wafer displacement assembly 33, and the retractable assembly 333 extends to make the wafer carrier 34 extend into a wafer cassette 30a to support a wafer 3a (as shown in fig. 11), then move the wafer 3a out of the wafer cassette 30a (as shown in fig. 12) and close to the showerhead 35, and blow air through the air holes 351 of the showerhead 35 onto the wafer 3a (as shown in fig. 13 and 14) to guide the wafer 3a, and then each air hole 341 is evacuated to smoothly position the wafer 3a on the wafer carrier 34 at the correct position and avoid warpage.

In practice, the wafer lift assembly 32 is adapted to lift the wafer supply seat 31 so that the wafer carrier 34 can more easily hold the wafer 3a in the wafer cassette 30 a.

The wafer placing mechanism moves the wafer onto the first displacement mechanism and guides the wafer S32, the control module drives the wafer placing mechanism 3, so that the wafer displacement assembly 33 drives the wafer bracket 34 to move the wafer 3a to a position above the wafer pre-treatment portion 121 of the first base 12 (as shown in fig. 15), the image capturing unit 16 is used to obtain an image of the wafer 3a, so as to check whether the position of the wafer 3a is correct, and the two jacket sliders 15 with backlight surfaces are matched to each other, so that the two concave arc portions 151 are combined to form a circular hole corresponding to the wafer pre-treatment portion 121 (as shown in fig. 16), and the wafer displacement assembly 33 drives the wafer bracket 34 to correct the position, so that the wafer 3a is guided to be correctly positioned corresponding to the center of the concave arc portion 151 of the two jacket sliders 15 (i.e., the center of the wafer ring 2 a).

The step S33 of moving the wafer into the wafer ring by the first displacement mechanism is to separate the two jacketed slide holders 15, and then the support base 13 is lifted by the support base lifting device 133, and the wafer 3a is sucked onto the support base 13 by the suction holes 132, at this time, the suction holes 341 of the wafer carrier 34 stop sucking air, and the wafer carrier 34 is separated from the bottom surface of the wafer 3a in the groove 131 (as shown in FIG. 17); the retractable assembly 333 then retracts, causing the wafer carrier 34 to move out of the position above the first base 12 (as shown in fig. 18); the support base 13 is then driven by the support base lifting component 133 to descend, so that the wafer 3a moves down on the inner ring flange 22a on the inner periphery of the wafer ring 2a (as shown in fig. 19), and the wafer 3a is kept in a state of being adsorbed by the support base 13.

The step S41 of placing a cover into the wafer ring by the cover loading mechanism and stacking the cover on the wafer to form an assembly, can move the first base 12 to a position close to the side of the cover loading mechanism 4 along the first guide rail 11 as required (as shown in fig. 20); then, the control module drives the cover loading mechanism 4 to make the clamping jaw set 433 of the cover displacement assembly 43 clamp the annular protrusion 41a of a cover 4a on the cover feeding base 41 (as shown in fig. 21 and 22), and move up and down along with the cover displacement slide carriage 432 and laterally slide along the cover displacement guide rail 431, so as to move the cover 4a into the wafer pre-treating portion 121 and stack the cover on the wafer 3a (as shown in fig. 23 and 24); then, the clamping jaw set 433 releases the ring protrusion 41a (as shown in fig. 25), so that the stacked wafer ring 2a, wafer 3a, and lid 4a form an assembly 20a (as shown in fig. 26).

In practice, the cover lifting assembly 42 can cooperate with the cover feeding base 41 to lift, so that the cover displacement assembly 43 can more easily hold the cover 4a in place.

The robot arm drives the loading and unloading mechanism to approach the carrying disc with a preset loading and unloading reference value, and measures the distance from the edge of the bearing part of the assembly to be assembled with a distance measuring element in step S51, the control module drives the loading and unloading mechanism 62 on the robot arm 6 to move to a position to be assembled on the carrying disc 50 in the direction and at an angle of the preset loading and unloading reference value; and each distance measuring device 621 is used to detect the distance from the peripheral side of the assembly supporting portion 501 to be assembled at the position to be assembled (as shown in fig. 27).

In one possible embodiment, the distance measuring device 621 is a laser light source, which can be projected on the periphery of the assembly supporting portion 501 to be assembled through a laser beam 6211, respectively, so as to detect the distance.

The control module adjusts the position of the loading and unloading mechanism to make the measuring distance of each distance measuring element equal, so as to correct the inclination angle of the loading and unloading operation surface thereof S52, the control module drives the loading and unloading mechanism 62 on the mechanical arm 6 to adjust the position according to the difference of the distances (i.e. the projection lengths of the laser beams 6211) detected by each distance measuring element 621, so that the distance (i.e. the laser beam 6211) of each distance measuring element 621 detecting the peripheral side of the assembly bearing part 501 to be assembled is equal, so as to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism 62, and ensure that the surface (i.e. the loading and unloading operation surface) of the bottom side of the loading and unloading mechanism 62 is parallel to the assembly bearing part 501 to be assembled; and the control module can store the information of the corrected loading and unloading operation surface.

The robot arm drives the image capturing component to approach the carrier plate at the same inclination angle as the corrected loading/unloading operation surface and obtain the position images of the assembly carrying part and each fixture S61. The control module drives the image capturing component 61 on the robot arm 6 to move to the position above the assembly carrying part 501 to be assembled at the same inclination angle and direction as the corrected loading/unloading operation surface, and the image capturing component 611 is used to obtain the image of the periphery of the assembly carrying part 501 to be assembled (as shown in fig. 28), thereby confirming the positions of the assembly carrying part 501 and each fixture 502 to be assembled.

The step S62 of the control module adjusting the position of the image capturing component to make it correctly correspond to the bearing part of the assembly to be assembled so as to correct the position of the image capturing surface of the assembly, and using the information of the corrected image capturing surface to correct the assembling and disassembling operation surface so as to make it correctly correspond to the bearing part of the assembly to be assembled, the control module drives the image capturing component 61 on the mechanical arm 6 to adjust the position according to the difference of the image positions of the bearing part 501 of the assembly to be assembled so as to correct the image capturing surface of the image capturing component 61, and ensures that the image capturing component 61 correctly corresponds to the bearing part 501 of the assembly to be assembled and each clamp 502; and the control module can store the information of the corrected image taking surface (as shown in fig. 28).

In one possible embodiment, a positioning mark (not shown, may be a cross scale or other marking structure) is disposed at a predetermined position around each of the clamps 502, and a corresponding relative mark (not shown, may be a cross scale or other marking structure) may be disposed on the lens of the image capturing assembly 611 of the image capturing assembly 61; when the image capturing component 61 is adjusted to the position, the relative mark is overlapped with the positioning mark, so as to achieve the effect of correcting the image capturing surface position of the image capturing component 61.

Since the image capturing component 61 captures images in the same inclination angle and direction as the corrected loading and unloading operation surface, after the position of the image capturing surface is corrected, the control module can calculate and store the position information of the loading and unloading mechanism 62 to be corrected again by using the position of the corrected image capturing surface, so that the control module can directly and rapidly drive the loading and unloading mechanism 62 to move to the position which is exactly corresponding to the assembly bearing part 501 to be assembled in the positive direction through the mechanical arm 6 again.

The "detaching mechanism unlocks each jig" S71 is to drive the detaching mechanism 62 on the robot arm 6 by the control module to move to above the assembly carrying portion 501 to be assembled, and to release each jig 502 by each jig operating element 623 (as shown in fig. 29).

The assembling and disassembling mechanism moves the assembly to the assembly supporting portion S72, the control module drives the assembling and disassembling mechanism 62 on the robot arm 6 to move to the position above the wafer preparation portion 121 of the first base 12, the assembly 20a is clamped by the clamping component 622 (at this time, the suction holes 132 stop sucking, the supporting base 13 releases the suction state of the wafer 3a, as shown in fig. 30), and the assembly 20a is moved to the assembly supporting portion 501 to be assembled (as shown in fig. 31 and 32).

The "loading and unloading mechanism locks each clip to fix the assembly" S73, the control module drives each clip operating component 623 to lock each clip 502, so that the assembly 20a can be fixed on the assembly bearing part 501 to be assembled (as shown in fig. 32).

The step S74 of "the loading and unloading mechanism is separated from the assembly unit, and the tray rotates" is that after each clamping component 622 loosens the assembly unit 20a, the control module drives the pivoting component 53 to drive the tray 50 to pivot, so that the assembly unit bearing part 501, which has fixed the assembly unit 20a, is pivoted to a side position, and the other side vacant assembly unit bearing part 501 is moved to the original assembly position to form another assembly unit bearing part 501 to be assembled (as shown in fig. 33), so as to repeat the above steps, and fix each assembly unit 20a on each assembly unit bearing part 501 to be assembled of the tray 50, respectively.

In summary, the pre-treatment wafer carrier and the method thereof of the present invention can achieve the effect of combining the wafer ring, the wafer and the cover respectively and precisely displacing and fixing the wafer ring, the wafer and the cover to different positions on a carrier by using a simple mechanism and operation.

Claims

1. A device for loading a pre-treatment type wafer carrying disc is characterized by comprising:

a wafer ring carrying mechanism arranged beside the first displacement mechanism, connected with and driven by the control module, wherein the wafer ring carrying mechanism is provided with a wafer ring feeding seat for supporting a wafer ring, a wafer ring displacement component is arranged beside the wafer ring feeding seat, the wafer ring displacement component can carry and release the wafer ring, and the wafer ring displacement component can carry the wafer ring to move between the wafer ring feeding seat and the wafer pre-treatment part of the first seat body;

the wafer loading mechanism is arranged beside the first displacement mechanism and is connected with and driven by the control module, the wafer loading mechanism is provided with a wafer feeding seat for bearing a wafer, a wafer displacement component is arranged beside the wafer feeding seat, the wafer displacement component is provided with a wafer bracket, and the wafer bracket can be driven by the wafer displacement component to carry the wafer to move between the wafer feeding seat and the wafer pre-treatment part of the first seat body;

2. The apparatus of claim 1, wherein: the movable end of the mechanical arm is also provided with an image capture component capable of obtaining images; the assembling and disassembling mechanism is respectively provided with a clamping component which can be opened and closed relatively to clamp the assembly, a plurality of clamp operating components which correspond to and unlock each clamp, and a plurality of distance measuring elements which can measure the distance.

3. The apparatus of claim 2, wherein: the plurality of distance measuring elements are laser light sources capable of generating distance measuring laser beams and are respectively arranged at least three points on the peripheral side of the assembling and disassembling mechanism.

4. The apparatus of claim 2, wherein: the second displacement mechanism is connected with and driven by the control module and provided with a second seat body capable of reciprocating displacement, and a pivoting component capable of bearing the carrying disc is arranged on the second seat body.

5. The apparatus of claim 1, wherein: the wafer pre-treatment part is a hollow hole, a bearing seat is arranged in the hollow hole, a concave channel is concavely arranged on the top surface of the bearing seat, and a plurality of air suction holes capable of sucking air are arranged at two sides of the concave channel; the bottom of the bearing seat is provided with a bearing seat lifting component which can drive the bearing seat to lift.

6. The apparatus of claim 2, wherein: the wafer pre-treatment part is a hollow hole, a bearing seat is arranged in the hollow hole, a concave channel is concavely arranged on the top surface of the bearing seat, and a plurality of air suction holes capable of sucking air are arranged at two sides of the concave channel; the bottom of the bearing seat is provided with a bearing seat lifting component which can drive the bearing seat to lift.

7. The apparatus of claim 1, wherein: the first seat body is arranged on a plurality of first guide rails extending in parallel, a plurality of jacket slide seats capable of relatively reciprocating displacement are arranged on the top surface of the first seat body on the periphery of the wafer pre-treatment part, a backlight surface is arranged on the top side of each jacket slide seat, and a concave arc part is arranged on one side of each jacket slide seat facing the wafer pre-treatment part; and an image capturing unit capable of capturing images is arranged above the first guide rail.

8. The apparatus of claim 2, wherein: the first seat body is arranged on a plurality of first guide rails extending in parallel, a plurality of jacket slide seats capable of relatively reciprocating displacement are arranged on the top surface of the first seat body on the periphery of the wafer pre-treatment part, a backlight surface is arranged on the top side of each jacket slide seat, and a concave arc part is arranged on one side of each jacket slide seat facing the wafer pre-treatment part; and an image capturing unit capable of capturing images is arranged above the first guide rail.

9. The apparatus of claim 6, wherein: the first seat body is arranged on a plurality of first guide rails extending in parallel, a plurality of jacket slide seats capable of relatively reciprocating displacement are arranged on the top surface of the first seat body on the periphery of the wafer pre-treatment part, a backlight surface is arranged on the top side of each jacket slide seat, and a concave arc part is arranged on one side of each jacket slide seat facing the wafer pre-treatment part; and an image capturing unit capable of capturing images is arranged above the side of the first guide rail.

10. The apparatus of claim 7, wherein: an air nozzle is arranged above the wafer feeding seat, the air nozzle is provided with air nozzles capable of downwards spraying air, and the top surface of the wafer bracket is provided with a plurality of air suction holes capable of sucking air.

11. The apparatus of claim 8, wherein: an air nozzle is arranged above the wafer feeding seat, the air nozzle is provided with air nozzles capable of downwards spraying air, and the top surface of the wafer bracket is provided with a plurality of air suction holes capable of sucking air.

12. The apparatus of claim 9, wherein: an air nozzle is arranged above the wafer feeding seat, the air nozzle is provided with air nozzles capable of downwards spraying air, and the top surface of the wafer bracket is provided with a plurality of air suction holes capable of sucking air.

13. The apparatus of claim 1, 2 or 3, wherein: a wafer ring lifting assembly is arranged below the wafer ring feeding seat, the wafer ring lifting assembly can drive the wafer ring feeding seat to perform lifting action, the wafer ring displacement assembly is provided with a wafer ring displacement sliding seat capable of lifting, a wafer ring displacement guide rail capable of being reset is arranged on the wafer ring displacement sliding seat, and a clamping assembly capable of clamping the wafer ring is arranged on the wafer ring displacement guide rail; a wafer lifting component is arranged below the wafer feeding seat, the wafer lifting component can drive the wafer feeding seat to lift, the wafer displacement component is provided with a plurality of wafer displacement guide rails parallel to the first guide rail and a wafer displacement sliding seat which is arranged on each wafer displacement guide rail and can be displaced in a reciprocating manner, a telescopic component capable of lifting vertically is arranged on the wafer displacement sliding seat, and the wafer bracket is arranged at the movable end of the telescopic component; the covering and feeding seat is provided with a covering and lifting component below, the covering and lifting component can drive the covering and feeding seat to move up and down, the covering and moving component is provided with a covering and moving slide seat capable of moving up and down, a covering and moving guide rail capable of transversely reciprocating and moving is arranged on the covering and moving slide seat, and a clamping jaw group capable of clamping the covering is arranged on the covering and moving guide rail.

14. The apparatus of claim 1, 2 or 3, wherein: the outer peripheral ring of the wafer ring is provided with an outer ring flange, and the inner peripheral ring of the wafer ring is provided with an inner ring flange; the center of the cover is provided with a ring convex part; the wafer supply seat is provided with wafer cassettes capable of accommodating wafers at intervals.

15. A method for loading a pre-processed wafer carrier, using the apparatus of claim 1, comprising:

16. A method for loading a pre-processed wafer carrier, using the apparatus of claim 4, comprising:

a procedure of 'loading and unloading mechanism correcting loading and unloading operation surface', the control module drives the loading and unloading mechanism on the mechanical arm to adjust the position, so that each distance measuring element measures the distance of the peripheral side of the bearing part of the assembly to be assembled at the position to be assembled on the loading disc to be equal, the loading and unloading mechanism is forwardly and parallelly corresponding to the bearing part of the assembly to be assembled by a preset loading and unloading operation surface so as to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism, and the control module stores the information of the corrected loading and unloading operation surface;

17. The method of claim 16, wherein the process of moving and locking the assembly on the assembly carrier by the loading and unloading mechanism comprises:

a step of locking each clamp by a loading and unloading mechanism so as to fix the assembly, wherein each clamp is locked by each clamp operating component, so that the assembly can be fixed on the bearing part of the assembly to be assembled.

18. The method as claimed in claim 17, wherein the step of "loading and unloading mechanism locking the clamps to fix the assembly" is followed by a step of "loading and unloading mechanism releasing the assembly", and the step of "carrier rotating" is performed such that after the assembly is released from the clamps, the pivot assembly is driven by the control module to drive the carrier to pivot, so that the assembly carrying portion with the fixed assembly is pivotally moved to a side position, and the assembly carrying portion with the other side being empty is moved to the original assembly position to form another assembly carrying portion to be assembled.

19. The method of claim 16, wherein the "loader/unloader calibrate a loading/unloading plane" procedure comprises:

a step that the mechanical arm drives the loading and unloading mechanism to approach the carrying disc according to a preset loading and unloading reference value and measures the distance between the loading and unloading mechanism and the edge of a bearing part of an assembly to be assembled by using a distance measuring element, wherein the control module drives the loading and unloading mechanism on the mechanical arm to move above the carrying disc according to the direction and the angle of the preset loading and unloading reference value; and detecting the distance to the peripheral side of the bearing part of the assembly to be assembled by utilizing each distance measuring element;

a step of adjusting the position of the loading and unloading mechanism by the control module to enable the measuring distance of each distance measuring element to be equal to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism, wherein the control module drives the loading and unloading mechanism on the mechanical arm to adjust the position to enable each distance measuring element to detect that the distance to the peripheral side of the bearing part of the assembly to be assembled is equal to ensure that the loading and unloading operation surface of the loading and unloading mechanism corresponds to the bearing part of the assembly to be assembled in a positive and parallel way so as to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism; the control module stores the information of the corrected unloading operation surface;

a step that the mechanical arm drives the image capture component to approach the carrying tray at the same inclination angle as the corrected loading and unloading operation surface and acquire the position images of the bearing part of the assembly to be assembled and each clamp, the control module drives the image capture component on the mechanical arm to move to the upper part of the bearing part of the assembly to be assembled in the same direction and the same inclination angle as the corrected loading and unloading operation surface, and the image capture component is used for acquiring the images of the periphery of the bearing part of the assembly to be assembled so as to confirm the positions of the bearing part of the assembly to be assembled and each clamp;

a step of adjusting the position of the image capturing component by the control module to ensure that the image capturing component correctly corresponds to the bearing part of the assembly to be assembled so as to correct the position of the image capturing surface of the assembly, and correcting the assembling and disassembling operation surface by utilizing the information of the corrected image capturing surface so that the assembling and disassembling operation surface positively and accurately corresponds to the bearing part of the assembly to be assembled, wherein the control module drives the image capturing component on the mechanical arm to adjust the position so that the image capturing component keeps correctly corresponding to the bearing part of the assembly to be assembled and each clamp so as to correct the position of the image capturing surface of the image capturing component; and the control module stores the information of the corrected image taking surface and can calculate the corrected position information of the assembling and disassembling mechanism, so that the mechanical arm drives the assembling and disassembling mechanism to move to a position which is positioned on the bearing part of the assembly to be assembled accurately and flatly.

20. A method of loading a pre-processed wafer carrier, using the apparatus as claimed in claim 9, comprising:

a procedure of 'loading and unloading mechanism correcting loading and unloading operation surface', the loading and unloading mechanism on the mechanical arm is driven by the control module to adjust the position, so that each distance measuring element measures the distance of the peripheral side of the bearing part of the assembly to be assembled on the position to be assembled on the loading disc to be equal, the loading and unloading mechanism is forwardly and parallelly corresponding to the bearing part of the assembly to be assembled by a preset loading and unloading operation surface, so as to correct the loading and unloading operation surface of the loading and unloading mechanism, and the control module stores the information of the corrected loading and unloading operation surface;

21. The method of claim 20, wherein: the procedure of "the wafer loading mechanism moves a wafer into the wafer ring" includes:

22. A method of loading a pre-processed wafer carrier, using the apparatus of claim 12, comprising:

a procedure of respectively placing the carrying disc, the wafer rings, the wafers and the covers in positioning, namely, placing an empty carrying disc in preset assembly positioning, and respectively placing the wafer rings, the wafers and the covers in feeding positioning;

a procedure of 'loading and unloading mechanism correcting loading and unloading operation surface', the control module drives the mechanical arm to adjust the position of the loading and unloading mechanism, so that each distance measuring element measures the distance of the peripheral side of the bearing part of the assembly to be assembled on the position to be assembled on the carrying disc to be equal, the loading and unloading mechanism can be forwardly and parallelly corresponding to the bearing part of the assembly to be assembled, the loading and unloading operation surface of the loading and unloading mechanism is corrected, and the control module stores the information of the loading and unloading operation surface;

the control module drives the loading and unloading mechanism on the mechanical arm to displace and lock the assembly from the first seat body on the bearing part of the assembly to be assembled.

23. The method of claim 22, wherein: the procedure of "the wafer loading mechanism moves a wafer into the wafer ring" includes:

a step of moving the wafer into the wafer ring by the first displacement mechanism, in which the two jacket sliding seats are separated, and the supporting seat is driven by the supporting seat lifting component to lift up, so that the wafer bracket is separated from the wafer in the concave slot; then the wafer displacement assembly drives the wafer bracket to move out of the upper part of the first seat body; then, the supporting base is driven by the supporting base lifting component to descend, so that the wafer moves downwards in the wafer ring.