CN216250660U - Device for placing and unloading wafer carrier disc in pre-treatment mode - Google Patents

Abstract

The utility model provides a pre-treatment type wafer carrying disc placing and unloading device, which is characterized in that a wafer ring placing and unloading mechanism, a wafer placing and unloading mechanism, a covering and placing and unloading mechanism and a mechanical arm are arranged on the peripheral side of a first displacement mechanism; the movable end of the mechanical arm is provided with a loading and unloading mechanism; the wafer ring loading and unloading mechanism, the wafer loading and unloading mechanism and the covering and unloading mechanism sequentially stack the wafer ring, the wafer and the covering on the first displacement mechanism to form an assembly, and the mechanical arm drives the loading and unloading mechanism to displace and lock the assembly on an assembly bearing part preset on a carrying disc so as to facilitate subsequent processing; after each wafer is processed, the mechanical arm drives the loading and unloading mechanism to move the assembly back to the first displacement mechanism, and the covering and unloading mechanism, the wafer loading and unloading mechanism and the wafer ring loading and unloading mechanism sequentially disassemble and recycle the covering, the wafer and the wafer ring.

Description

Device for placing and unloading wafer carrier disc in pre-treatment mode

Technical Field

The utility model relates to a pre-treatment type wafer carrying disc loading and unloading device, in particular to a loading and unloading device which can respectively superpose and combine a wafer ring, a wafer and a cover into a combined piece by using a simple mechanism and operation, accurately move and fix the combined piece on a carrying disc at different positions, move the combined piece on the carrying disc back after the wafer is processed, and respectively decompose and recycle the cover, the wafer and the wafer ring.

Background

A general Integrated Circuit (IC) manufacturing process can be mainly divided into: silicon wafer manufacturing, integrated circuit packaging and the like; in the manufacturing process, when the wafer is subjected to testing, cleaning, evaporation, drying or soaking in organic solvents, in order to effectively fix the wafer for processing and simultaneously process a large number of wafers to improve the processing efficiency, most of the wafers are fixed on a large-area carrier disc, and the carrier disc simultaneously carries the wafers to perform the processing operation of each process.

The common carrying disc is a large-area convex (or concave) arc-shaped disc body structure, a plurality of hollow parts for accommodating wafers are arranged on the carrying disc, a plurality of clamps capable of fixing the wafers are arranged on the periphery of each hollow part, and when each wafer is fixed above the hollow part (an outer convex surface of a convex arc surface or an inner concave surface of a concave arc surface) by the clamps, each wafer can be exposed to the outside through the hollow part to be processed, so that the carrying disc can accommodate a plurality of wafers and move to different processing procedures simultaneously, and the overall processing efficiency of the wafer is effectively improved.

With the gradual popularization of automatic mechanical processing, various automatic machines are utilized to execute the picking and placing operation of wafers on a carrying disc, which not only can save a large amount of manpower, but also can reduce the production cost and improve the processing efficiency, which is a necessary trend, but because the wafers are extremely fragile and have extremely high requirements on the processing precision, the high requirements on the operation precision of picking and placing the wafers by related displacement mechanisms are met, and when a plurality of displacement mechanisms are utilized to respectively execute the assembling and disassembling operation of the wafers and related components, the displacement mechanisms must be accurately connected, otherwise, the combination precision and the finished product quality of the whole displacement are extremely easily influenced, and even the semi-finished products are damaged; therefore, how to effectively calibrate each displacement mechanism so that not only the accuracy of the displacement mechanism is maintained when a single displacement mechanism performs the displacement of different objects, but also the relative motion relationship between different displacement mechanisms is formed to ensure the connection accuracy of the operation when each displacement mechanism displaces the same object is a major issue to be urgently required by each related industry.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned application requirements of the displacement of the wafer and the related components on the carrier plate and the disassembly and recycling of the assembly on the carrier plate, the present invention is finally developed by the utility model designers aiming at these requirements.

In order to achieve the purpose, the utility model adopts the technical scheme that:

a pre-treatment type wafer carrying disc placing and unloading device is characterized by comprising:

the first displacement mechanism is connected and driven by a control module and is provided with a first seat body capable of reciprocating, and a pre-treatment unloading part is arranged on the first seat body;

the wafer ring unloading mechanism is arranged beside the first displacement mechanism and is connected with and driven by the control module, the wafer ring unloading mechanism is provided with a wafer ring material placing seat for bearing a wafer ring, a wafer ring displacement component is arranged beside the wafer ring material placing seat, and the wafer ring displacement component can carry and release the wafer ring and can move between the wafer ring material placing seat and the pre-treatment unloading part of the first seat body;

the wafer unloading mechanism is arranged beside the first displacement mechanism and is connected with and driven by the control module, the wafer unloading mechanism is provided with a wafer material placing seat for bearing a wafer, a wafer displacement component is arranged beside the wafer material placing seat, the wafer displacement component is provided with a wafer bracket, and the wafer bracket can be driven by the wafer displacement component to carry the wafer to move between the wafer material placing seat and the pre-treatment unloading part of the first seat body;

the covering unloading mechanism is arranged beside the first displacement mechanism and is connected with and driven by the control module, the covering unloading mechanism is provided with a covering material placing seat for supporting covering, a covering displacement component is arranged beside the covering material placing seat, and the covering displacement component can carry and release the covering and can move between the covering material placing seat and the pre-treatment unloading part of the first seat body;

a carrying disc, the surface of which is provided with at least one assembly bearing part, and the periphery of each assembly bearing part is respectively provided with a plurality of clamps;

the mechanical arm is connected with and driven by the control module and is provided with a movable end capable of moving between the first seat body and the carrying disc, and at least one loading and unloading mechanism is arranged on the movable end.

The device for loading and unloading the pre-treatment type wafer carrying disc is characterized in that: the assembling and disassembling mechanism is respectively provided with a clamping component which can be opened and closed relatively to clamp the assembly, a plurality of clamp operating components which correspond to and unlock each clamp, and a plurality of distance measuring elements which can measure the distance.

The device for loading and unloading the pre-treatment type wafer carrying disc is characterized in that: the plurality of distance measuring elements are laser light sources capable of generating distance measuring laser beams and are respectively arranged at least three points on the peripheral side of the assembling and disassembling mechanism.

The device for loading and unloading the pre-treatment type wafer carrying disc is characterized in that: the movable end of the mechanical arm is also provided with an image capture component capable of obtaining images.

The device for loading and unloading the pre-treatment type wafer carrying disc is characterized in that: the pre-treatment unloading part is a hollow hole, a bearing seat is arranged in the hollow hole, a concave channel is concavely arranged on the top surface of the bearing seat, and a plurality of air suction holes capable of sucking air are arranged at the two sides of the concave channel; the bottom of the bearing seat is provided with a bearing seat lifting component which can drive the bearing seat to lift.

The device for loading and unloading the pre-treatment type wafer carrying disc is characterized in that: the first seat body is arranged on a plurality of first guide rails extending in parallel, a plurality of jacket slide seats capable of relatively reciprocating displacement are arranged on the top surface of the first seat body on the periphery of the pre-treatment unloading part, a backlight surface is arranged on the top side of each jacket slide seat, and a concave arc part is arranged on one side of each jacket slide seat facing the pre-treatment unloading part; and an image capturing unit capable of capturing images is arranged above the side of the first guide rail.

The device for loading and unloading the pre-treatment type wafer carrying disc is characterized in that: an air nozzle is arranged above the wafer material placing seat, the air nozzle is provided with air nozzles capable of downwards spraying air, and the top surface of the wafer bracket is provided with a plurality of air suction holes capable of sucking air.

The device for loading and unloading the pre-treatment type wafer carrying disc is characterized in that: a wafer ring lifting assembly is arranged below the wafer ring material placing seat, the wafer ring lifting assembly can drive the wafer ring material placing seat to perform lifting action, the wafer ring displacement assembly is provided with a wafer ring displacement sliding seat capable of lifting, a wafer ring displacement guide rail capable of being reset is arranged on the wafer ring displacement sliding seat, and a clamping assembly capable of clamping the wafer ring is arranged on the wafer ring displacement guide rail; a wafer lifting component is arranged below the wafer material placing seat, the wafer lifting component can drive the wafer material placing seat to perform lifting action, the wafer displacement component is provided with a plurality of wafer displacement guide rails parallel to the first guide rail and a wafer displacement sliding seat which is arranged on each wafer displacement guide rail and can perform reciprocating displacement, a telescopic component capable of vertically lifting is arranged on each wafer displacement sliding seat, and the wafer bracket is arranged at the movable end of the telescopic component; the covering and placing base is provided with a covering and lifting component below, the covering and lifting component can drive the covering and placing base to move up and down, the covering and moving component is provided with a covering and moving slide seat capable of moving up and down, a covering and moving guide rail capable of transversely reciprocating and moving is arranged on the covering and moving slide seat, and a clamping jaw group capable of clamping the covering is arranged on the covering and moving guide rail.

The device for loading and unloading the pre-treatment type wafer carrying disc is characterized in that: the second displacement mechanism is connected with and driven by the control module and provided with a second seat body capable of reciprocating displacement, and a pivoting component capable of bearing the carrying disc is arranged on the second seat body.

The device for loading and unloading the pre-treatment type wafer carrying disc is characterized in that: the outer peripheral ring of the wafer ring is provided with an outer ring flange, and the inner peripheral ring of the wafer ring is provided with an inner ring flange; the center of the cover is provided with a ring convex part.

The main advantage of the present invention is to provide a pre-treatment wafer loading/unloading device, which comprises a wafer ring loading/unloading mechanism, a wafer loading/unloading mechanism, a covering loading/unloading mechanism and a second displacement mechanism disposed on the periphery of a first displacement mechanism, wherein a mechanical arm is disposed between the first displacement mechanism and the second displacement mechanism; the first displacement mechanism is provided with a first seat body capable of reciprocating displacement, a pre-treatment unloading part is arranged on the first seat body, a movable carrying disc is arranged on the second displacement mechanism, a plurality of assembly bearing parts are arranged on the carrying disc, and a loading and unloading mechanism is arranged at the movable end of the mechanical arm; the wafer ring loading and unloading mechanism can place a wafer ring in the pre-treatment unloading part, the wafer loading and unloading mechanism places a wafer in the wafer ring, the covering and unloading mechanism places a covering part in the wafer ring and superposes the covering part on the wafer to form a combined part, so that the peripheral side of the wafer is stably clamped between the wafer ring and the covered periphery, the wafer can maintain good flatness in the combined part, and the mechanical arm can drive the loading and unloading mechanism to move and lock the combined part on a bearing part of the combined part to be assembled on the carrying disc from the first seat body so as to facilitate subsequent processing; after each wafer is processed, the mechanical arm drives the loading and unloading mechanism to move the assembly on the carrying disc back to the first seat body, and the covering and unloading mechanism, the wafer loading and unloading mechanism and the wafer ring loading and unloading mechanism sequentially disassemble and recover the covering, the wafer and the wafer ring.

Another advantage of the present invention is to provide a pre-treatment wafer carrier placing and unloading device, wherein an image capturing component capable of capturing images is further disposed at the movable end of the robot arm, and a plurality of distance measuring elements are disposed around the loading and unloading mechanism, the loading and unloading mechanism is used to approach the assembly carrying portion to be assembled in a direction and at an angle of a preset loading and unloading reference value, and the position of the loading and unloading mechanism can be adjusted to make the distance of each distance measuring element to the periphery of the assembly carrying portion to be assembled equal, so as to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism, and make the loading and unloading mechanism parallel (having the same inclination angle) correspond to the assembly carrying portion to be assembled; the image-taking component can approach the bearing part of the assembly to be assembled in the same direction and inclined angle as the corrected assembling and disassembling operation surface and directly take images, then the position of the image-taking component is adjusted to ensure that the forward direction of the image-taking component accurately corresponds to the bearing part of the assembly to be assembled so as to correct the position of the image-taking surface of the image-taking component, and meanwhile, the position of the assembling and disassembling mechanism is corrected by utilizing the information of the position of the corrected image-taking surface so that the assembling and disassembling operation surface can positively and accurately correspond to the bearing part of the assembly to be assembled and the peripheral components thereof.

Another advantage of the present invention is to provide an unloading device for a pre-processed wafer carrier, wherein the top surface of the first base has jacket slides with backlight surfaces and capable of moving relatively around the pre-processed unloading portion, the jacket slides have concave arcs respectively at one side facing the pre-processed unloading portion, and a capturing unit is disposed beside the first moving mechanism.

Another advantage of the present invention is to provide a pre-treatment wafer loading/unloading device, wherein a second displacement mechanism driven by the control module is disposed beside the first displacement mechanism, the second displacement mechanism can drive the loading tray to perform reciprocating and pivoting movements, so that the loading tray can be moved from an easy-to-place position to a position close to the first displacement mechanism for displacement and positioning, and each assembly on the loading tray can be moved to a position to be displaced close to the range of motion of the robot arm, thereby improving the overall operating efficiency.

In order to make the aforementioned objects, functions and features of the present invention more comprehensible, several embodiments accompanied with figures are described below.

Drawings

Fig. 1 is an exploded perspective view of the overall structure and associated components of the present invention.

FIG. 2 is a schematic view of a portion of the present invention; the structure of the first seat and the related bearing seat are disclosed.

FIG. 3 is a partial enlarged view of portion A of FIG. 1; the structure of the image capture assembly and the attachment and detachment mechanism assembled to the robotic arm is disclosed.

FIG. 4 is a schematic view of the wafer ring, the wafer and the lid being placed in the feeding position respectively according to the present invention.

Fig. 5 is a diagram illustrating the wafer unloading mechanism of the present invention driving each wafer cassette to pivot toward the first displacement mechanism.

Fig. 6 is a diagram (one) illustrating the wafer ring displacement assembly displacing the wafer ring according to the present invention.

Fig. 7 is a diagram illustrating the operation of the wafer ring displacement assembly of the present invention in displacing a wafer ring.

FIG. 8 is a diagram (one) illustrating the wafer displacement of the wafer displacement assembly of the present invention.

FIG. 9 is a diagram of the wafer displacement assembly of the present invention displacing a wafer (two).

FIG. 10 is a diagram illustrating the operation of the present invention in which a wafer is indexed flat on a wafer carrier using a showerhead jet.

FIG. 11 is a third operation of the wafer displacement assembly of the present invention to displace a wafer.

FIG. 12 is a diagram illustrating the operation of inspecting the wafer on the first base by the image-capturing unit and guiding the position of the wafer by the two-jacket slide according to the present invention.

Figure 13 is a schematic diagram of the present invention with the support pedestal raised to support the wafer.

FIG. 14 is a diagram illustrating the operation of the present invention in removing the wafer carrier.

Figure 15 is an illustration of the utility model with the support pedestal lowered to place the wafer within the wafer ring.

Fig. 16 is a diagram illustrating the movement of the first seat to the side position of the cover unloading mechanism according to the present invention.

FIG. 17 is a diagram (one) of the action of the cover displacement assembly of the present invention in displacing the cover.

FIG. 18 is a diagram of the action of the cover displacement assembly of the present invention in displacing the cover.

FIG. 19 is a schematic view of the present invention after the cover displacement assembly has been placed on the cover, and the robot arm is not yet in motion.

FIG. 20 is a diagram showing the operation of the loading and unloading mechanism of the present invention for calibrating the inclination angle of the loading and unloading work surface by aligning the assembly receiving portion to be assembled on the tray with the distance measuring device.

FIG. 21 is a diagram illustrating the operation of the present invention for capturing the image of the assembly carrier to be assembled by the image capture assembly and correcting the position of the image capture surface.

Fig. 22 is an operation diagram for unlocking the clamps on the peripheral side of the bearing part of the assembly to be assembled by the assembling and disassembling mechanism according to the present invention.

Fig. 23 is a schematic diagram (one) of the assembly moving from the first base to the assembly supporting portion to be assembled by the mounting and dismounting mechanism according to the present invention.

Fig. 24 is a second operation diagram of the present invention, in which the assembly is moved from the first seat to the assembly supporting portion to be assembled by the assembling and disassembling mechanism.

FIG. 25 is a view showing the operation of the present invention for locking the clamps around the bearing portion of the assembly to be assembled by the attaching and detaching mechanism.

Fig. 26 is an operation diagram of the carrier tray pivoting after the attachment/detachment mechanism of the present invention is detached from the carrier tray.

FIG. 27 is a view of the second base of the present invention moving the tray on which the assembly is mounted to the outside; or the loading tray after the wafer processing is arranged on the second base body.

Fig. 28 is a diagram illustrating the second base driving the carrier tray to move to the displacement position according to the present invention.

FIG. 29 is a diagram of the loading and unloading mechanism of the present invention using a distance measuring device to align the assembly to be unloaded on the carrier plate to calibrate the tilt angle of the loading and unloading operation surface.

FIG. 30 is a diagram showing the image capture assembly of the present invention capturing the image of the assembly to be unloaded and correcting the position of the image capture surface.

Fig. 31 is an operation diagram for unlocking the jig on the assembly peripheral side to be unloaded by the attaching and detaching mechanism of the present invention.

Fig. 32 is a schematic diagram (i) showing the movement of the assembly to be unloaded from the carrying tray onto the first base by the loading and unloading mechanism according to the present invention.

Fig. 33 is a second action diagram of the present invention using the loading and unloading mechanism to move the assembly to be unloaded from the carrying tray onto the first seat.

FIG. 34 is an illustration of the action of the cover displacement assembly of the present invention in displacing the cover.

FIG. 35 is an action view of the jaw set of the cover displacement assembly of the present invention shown removed from the cover.

FIG. 36 is a diagram illustrating the wafer displacement assembly of the present invention displacing the wafer.

FIG. 37 is a second diagram of the wafer displacement assembly of the present invention displacing a wafer.

Fig. 38 is an operation diagram (three) of the wafer displacement assembly of the present invention displacing the wafer.

FIG. 39 is a diagram (IV) illustrating the wafer displacement operation of the wafer displacement assembly of the present invention.

Fig. 40 is a diagram (one) illustrating the wafer ring displacement assembly of the present invention displacing a wafer ring.

Fig. 41 is a diagram illustrating the operation of the wafer ring displacement assembly of the present invention in displacing a wafer ring.

Description of reference numerals: 1a first displacement mechanism; 11 a first guide rail; 12 a first seat body; 121 a pre-treatment unloading part; 13 a bearing seat; 131 concave channels; 132 a suction hole; 133 bearing the base lifting assembly; 15 jacket slide; 151 concave arc portion; 16 an image capturing unit; 2 placing and unloading mechanism for wafer ring; 21a wafer ring material placing seat; 22a wafer ring lifting assembly; 23 a wafer ring displacement assembly; 231 wafer ring displacement guide rails; 232 wafer ring displacement slide seat; 233 a clamping assembly; 2a wafer ring; 20a assembly; 21a outer annular flange; 22a inner ring flange; 3, a wafer loading and unloading mechanism; 31 a wafer loading seat; 32 a wafer lift assembly; 33 a wafer displacement assembly; 331 a wafer displacement guide rail; 332 wafer displacement slide; 333 telescoping components; 34 a wafer carrier; 341 air exhaust holes; 35 an air jet head; 351 air injection holes; 3a wafer; 30a wafer cassette; 4 covering the unloading mechanism; 41 covering the material placing seat; 42 covering the lifting assembly; 43 covering the displacement assembly; 431 covering the displacement guide; 432 cover the displacement slide; 433 a clamping jaw set; 4a covering; 41a ring protrusion; 5 a second displacement mechanism; 51 a second guide rail; 52 a second seat; 53 a pivoting assembly; 50 carrying discs; 501 assembly carrier; 502, a clamp; 6, a mechanical arm; 61 an image capture component; 611 image capture component; 62 a loading and unloading mechanism; 621 a ranging element; 6211 ranging laser beam; 622 clamping the assembly; 623 a clamp operating assembly; a the image capture assembly and the attachment/detachment mechanism portion of FIG. 1.

Detailed Description

Referring to fig. 1 to 3, it can be seen that the main structure of the present invention includes: a first displacement mechanism 1, a wafer ring position unloading mechanism 2, a wafer position unloading mechanism 3, a covering position unloading mechanism 4, a second displacement mechanism 5, a mechanical arm 6 and the like; the first displacement mechanism 1 is connected to and driven by a control module (which may be a computer with an operation function, not shown), the first displacement mechanism 1 has a plurality of first guide rails 11 extending in parallel, and a first base 12 disposed on each of the first guide rails 11 and capable of reciprocating, a pre-treatment unloading part 121 (which may be a hollow hole) is disposed on the first base 12, a bearing seat 13 is disposed in the pre-treatment unloading part 121, the bearing seat 13 is driven by a bearing seat lifting component 133 to perform a lifting action, a concave channel 131 is concavely disposed on the top surface of the bearing seat 13, and a plurality of suction holes 132 capable of sucking air are disposed beside the two concave channels 131.

In a possible embodiment, a plurality of jacket sliders 15 capable of relatively reciprocating are disposed on the top surface of the first seat 12 around the pre-unloading portion 121, a backlight surface is disposed on the top side of each jacket slider 15, and a concave arc portion 151 is disposed on one side of each jacket slider 15 facing the pre-unloading portion 121; an image capturing unit 16 is disposed above the first guide rail 11 for capturing images.

The wafer ring placement and unloading mechanism 2 is disposed beside the first guide rail 11, connected to and driven by the control module (not shown), the wafer ring placement and unloading mechanism 2 has a wafer ring placement seat 21 for supporting a plurality of stacked wafer rings 2a, and a wafer ring lifting assembly 22 supported below the wafer ring placement seat 21, the wafer ring lifting assembly 22 can drive the wafer ring placement seat 21 to move up and down, a wafer ring displacement assembly 23 is disposed beside the wafer ring placement seat 21, the wafer ring displacement assembly 23 has a wafer ring displacement slide 232 capable of moving up and down, a wafer ring displacement guide rail capable of moving back and forth in a transverse direction is disposed on the wafer ring displacement slide 232, and a group of clamping assemblies 233 capable of opening and closing relatively is disposed on the wafer ring displacement guide rail 231.

In one possible embodiment, an outer annular flange 21a is annularly disposed above the outer periphery of the wafer ring 2a, and an inner annular flange 22a is annularly disposed below the inner periphery of the wafer ring 2 a.

The wafer loading and unloading mechanism 3 is disposed on a side of the first guide rail 11, connected to and driven by the control module (not shown), the wafer loading and unloading mechanism 3 has a wafer loading seat 31 for supporting a plurality of wafers 3a, and a wafer lifting assembly 32 supported below the wafer loading seat 31, the wafer lifting assembly 32 can drive the wafer loading seat 31 to move up and down, a gas nozzle 35 is disposed above the wafer loading seat 31, and the gas nozzle 35 has a gas nozzle 351 capable of ejecting air downwards; besides, a wafer displacement assembly 33 is disposed beside the wafer loading seat 31, the wafer displacement assembly 33 has a plurality of wafer displacement rails 331 parallel to the first rail 11, and a wafer displacement slide carriage 332 disposed on each wafer displacement rail 331 and capable of reciprocating displacement, a telescopic assembly 333 capable of vertically lifting is disposed on the wafer displacement slide carriage 332, a wafer bracket 34 is disposed at a movable end of the telescopic assembly 333, and a plurality of pumping holes 341 capable of pumping air are disposed on a top surface of the wafer bracket 34.

In one possible embodiment, the outer diameter of the wafer 3a is slightly smaller than the inner diameter of the wafer ring 2a, and a predetermined fixed number of wafers 3a can be accommodated in a wafer cassette 30a at intervals in advance, and then the wafer cassette 30a is placed on the wafer placing seat 31 so as to displace each wafer 3 a.

The covering and unloading mechanism 4 is disposed beside the first guide rail 11, connected to and driven by the control module (not shown), the covering and unloading mechanism 4 has a covering and material-holding seat 41 for holding a plurality of stacked covering devices 4a, and a covering and lifting assembly 42 supported below the covering and material-holding seat 41, the covering and lifting assembly 42 can drive the covering and material-holding seat 41 to move up and down, a covering and displacing assembly 43 is disposed beside the covering and material-holding seat 41, the covering and displacing assembly 43 has a liftable covering and displacing slide carriage 432, a covering and displacing guide rail 431 capable of moving transversely and reciprocally is disposed on the covering and displacing slide carriage 432, and a group of clamping jaws 433 capable of opening and closing relatively is disposed on the covering and displacing guide rail 431.

In one possible embodiment, the cover 4a is a plate with an outer diameter close to the outer diameter of the wafer 3a, and a ring protrusion 41a capable of being clamped by the clamping jaw set 433 is disposed at the center of the cover 4 a.

The second displacement mechanism 5 is transversely disposed beside one end of the first guide rail 11, connected to and driven by the control module (not shown), the second displacement mechanism 5 has a plurality of second guide rails 51 extending in parallel, and a second base 52 disposed on each of the second guide rails 51 and capable of reciprocating, a pivot assembly 53 is disposed on the second base 52, and a tray 50 can be placed on the pivot assembly 53 in combination.

In one possible embodiment, the tray 50 is a disc-shaped structure with a convex arc surface, a plurality of assembly supporting portions 501 (may be hollow portions) are disposed on the surface of the tray 50, and a plurality of clamps 502 are disposed around each assembly supporting portion 501 (hollow portion).

The mechanical arm 6 is disposed between the first displacement mechanism 1 and the second displacement mechanism 5, connected to and driven by the control module (not shown), and an image capture assembly 61 and a loading and unloading mechanism 62 are disposed at the movable end of the mechanical arm 6; the image capturing device 61 has an image capturing device 611 for capturing images, the assembling and disassembling mechanism 62 has two clamping devices 622 capable of opening and closing relatively, a plurality of clamp operating devices 623 corresponding to each clamp 502, and a plurality of distance measuring devices 621, wherein the plurality of distance measuring devices 621 can be laser light sources respectively disposed at least three points around the assembling and disassembling mechanism 62 and capable of generating distance measuring laser beams 6211.

Referring to fig. 4 to 41, it can be seen that the above structure of the present invention is operated: firstly, the control module drives the second displacement mechanism 5 to move the second base 52 to one end of each second guide rail 51 far away from the first displacement mechanism 1, so as to place an empty tray 50 on the second base 52; meanwhile, a plurality of wafer rings 2a are stacked on a wafer ring material placing seat 21 (i.e. the material feeding position of the wafer ring 2 a) of the wafer ring material placing and unloading mechanism 2, a plurality of wafer cassettes 30a containing wafers 3a arranged at intervals inside are placed on a wafer material placing seat 31 (i.e. the material feeding position of the wafers 3a) of the wafer material placing and unloading mechanism 3, and a plurality of covers 4a are stacked on a cover material placing seat 41 (i.e. the material feeding position of the cover 4 a) of the cover material placing and unloading mechanism 4; the first base 12 can then be moved to a position where each first guide rail 11 is close to the side of the wafer ring loading/unloading mechanism 2 (as shown in fig. 4) as required.

Then, the wafer placing base 31 transfers the opening of each wafer cassette 30a to the side facing the first displacement mechanism 1 as required, and the second base 52 carries the carrier plate 50 and moves to a predetermined operation position close to the first displacement mechanism 1 along each second guide rail 51 (as shown in fig. 5).

Then the control module drives the wafer ring loading and unloading mechanism 2 to make the clamping component 233 of the wafer ring displacement component 23 clamp a wafer ring 2a on the wafer ring loading seat 21, and move along with the lifting of the wafer ring displacement slide seat 232 and the transverse sliding of the wafer ring displacement guide rail 231, so as to move the wafer ring 2a into the pre-treatment unloading part 121 of the first seat body 12 (as shown in fig. 6 and 7); then, the clamping assembly 233 is separated from the wafer ring 2a, so that the wafer ring 2a can be positioned by the outer ring flange 21a abutting against the edge of the pre-unloading part 121.

In practical applications, the wafer ring lifting assembly 22 can cooperate with the wafer ring loading base 21 to lift, so that the wafer ring displacing assembly 23 can more easily clamp the wafer ring 2a at a proper position.

The control module drives the wafer unloading and loading mechanism 3 to move the wafer-displacing slide 332 of the wafer-displacing assembly 33, and in conjunction with the extension of the retractable assembly 333, the wafer carrier 34 can be inserted into a wafer cassette 30a to support a wafer 3a (as shown in fig. 8), the wafer 3a can be moved out of the wafer cassette 30a (as shown in fig. 9) and close to the showerhead 35, air is blown onto the wafer 3a (as shown in fig. 10) by the air holes 351 of the showerhead 35 to flatten the wafer 3a, and then the air is pumped through the air holes 341 to smoothly position the wafer 3a at the correct position on the wafer carrier 34 and avoid warpage.

In practice, the wafer lifting assembly 32 is adapted to drive the wafer placing base 31 to lift, so that the wafer carrier 34 can more easily hold the wafer 3a in the wafer cassette 30a in the proper position.

The control module drives the wafer loading and unloading mechanism 3, so that the wafer displacement assembly 33 drives the wafer carrier 34 to move the wafer 3a to a position above the pre-treatment unloading part 121 of the first base 12 (as shown in fig. 11), the image capturing unit 16 is used to obtain an image of the wafer 3a, so as to inspect whether the position of the wafer 3a is correct, and the wafer displacement assembly 33 drives the wafer carrier 34 to correct the position so that the wafer 3a is guided to be located at a position correctly corresponding to the center of the concave arc part 151 of the two jacket slide bases 15 (i.e. the center of the wafer ring 2 a) by matching with the two jacket slide bases 15 with backlight surfaces to combine the two concave arc parts 151 into a circular hole corresponding to the pre-treatment unloading part 121 (as shown in fig. 12).

Separating the two jacket sliders 15, driving the support base 13 to ascend by the support base elevating component 133, and simultaneously sucking the air through the air sucking holes 132 to make the wafer 3a adsorbed on the support base 13, at this time, the air sucking through the air sucking holes 341 of the wafer bracket 34 is stopped, and the wafer bracket 34 is separated from the bottom surface of the wafer 3a in the groove 131 (as shown in fig. 13); the retractable assembly 333 then retracts, causing the wafer carrier 34 to move out of the position above the first base 12 (as shown in fig. 14); the support base 13 is then driven by the support base lifting component 133 to descend, so that the wafer 3a moves down on the inner ring flange 22a on the inner periphery of the wafer ring 2a (as shown in fig. 15), and the wafer 3a is kept in a state of being adsorbed by the support base 13.

First, the first seat 12 is moved to a position close to the side of the cover unloading mechanism 4 along the first guide rail 11 (as shown in fig. 16) as required; the control module drives the cover unloading mechanism 4 to make the clamping jaw set 433 of the cover displacement assembly 43 clamp the annular protrusion 41a of a cover 4a on the cover loading base 41 (as shown in fig. 17), and move the cover 4a into the pre-treatment unloading part 121 and overlap the wafer 3a (as shown in fig. 18) along with the lifting and cover displacement slide carriage 432 and the transverse sliding of the cover displacement guide rail 431; then, the clamping jaw set 433 releases the ring protrusion 41a, so that the stacked wafer ring 2a, wafer 3a, and lid 4a form an assembly 20a (as shown in fig. 19).

In practical applications, the cover lifting assembly 42 can cooperate with the cover stocker 41 to lift and lower, so that the cover displacement assembly 43 can more easily hold the cover 4a in place.

The control module drives the loading and unloading mechanism 62 on the mechanical arm 6 to move to a position to be assembled on the carrying disc 50 in the direction and at an angle of a preset loading and unloading reference value; and each distance measuring device 621 is used to detect the distance from the peripheral side of the assembly supporting portion 501 to be assembled at the position to be assembled (as shown in fig. 20).

In one possible embodiment, the distance measuring device 621 is a laser light source, and can detect the distance by projecting a distance measuring laser beam 6211 onto the periphery of the assembly supporting portion 501 to be assembled.

The control module drives the assembly and disassembly mechanism 62 on the mechanical arm 6 to adjust the position according to the difference of the distances (i.e. the projection lengths of the ranging laser beams 6211) detected by the ranging elements 621, so that the distances (ranging laser beams 6211) of the ranging elements 621 (laser light sources) detecting the peripheral sides of the assembly bearing part 501 to be assembled are equal in length, thereby correcting the inclination angle of the assembly and disassembly operation surface of the assembly and disassembly mechanism 62 and ensuring that the surface (i.e. the assembly and disassembly operation surface) of the bottom side of the assembly and disassembly mechanism 62 corresponds to the assembly bearing part 501 to be assembled in parallel; and the control module can store the information of the corrected loading and unloading operation surface.

The control module drives the image capturing component 61 on the robot 6 to move to the position above the assembly supporting portion 501 to be assembled at the same inclination angle and direction as the corrected loading/unloading operation surface, and the image capturing component 611 is used to obtain the image of the periphery of the assembly supporting portion 501 to be assembled (as shown in fig. 21), so as to confirm the positions of the assembly supporting portion 501 and the jigs 502 to be assembled.

Then, the control module drives the image-capturing component 61 on the mechanical arm 6 to adjust the position according to the obtained image position difference of the bearing part 501 of the assembly to be assembled, so as to correct the image-capturing surface of the image-capturing component 61 and ensure that the image-capturing component 61 correctly corresponds to the bearing part 501 of the assembly to be assembled and each clamp 502; and the control module can store the information of the corrected image taking surface (as shown in fig. 21).

In one possible embodiment, a positioning mark (not shown, may be a cross scale or other marking structure) is disposed at a predetermined position around each of the clamps 502, and a corresponding relative mark (not shown, may be a cross scale or other marking structure) may be disposed on the lens of the image capturing assembly 611 of the image capturing assembly 61; when the image capturing component 61 is adjusted to the position, the relative mark is overlapped with the positioning mark, so as to achieve the effect of correcting the image capturing surface position of the image capturing component 61.

Since the image capturing component 61 captures images in the same inclination angle and direction as the corrected loading and unloading operation surface, after the position of the image capturing surface is corrected, the control module can calculate and store the position information of the loading and unloading mechanism 62 to be corrected again by using the position of the corrected image capturing surface, so that the control module can directly and rapidly drive the loading and unloading mechanism 62 to move to the position which is exactly corresponding to the assembly bearing part 501 to be assembled in the positive direction through the mechanical arm 6 again.

The control module drives the handling mechanism 62 on the robot arm 6 to move above the assembly support 501 to be assembled, and releases the grippers 502 by means of the gripper operating elements 623 (see fig. 22).

The control module drives the loading and unloading mechanism 62 on the robot 6 to move to above the pre-treatment unloading part 121 of the first seat 12, and uses the clamping component 622 to clamp the assembly 20a (at this time, the suction holes 132 stop sucking air, and the supporting seat 13 releases the suction state of the wafer 3a, as shown in fig. 23), and then moves the assembly 20a to the assembly carrying part 501 of the tray 50 to be assembled (as shown in fig. 24 and 25).

The control module drives each clamp operation component 623 to lock each clamp 502, so that the assembly 20a can be fixed on the assembly bearing part 501 to be assembled (as shown in fig. 25).

After each clamping element 622 releases the assembly 20a, the control module drives the pivoting element 53 to drive the carrier tray 50 to pivot, so that the assembly carrying portion 501, to which the assembly 20a is fixed, is moved to a side position, and the other assembly carrying portion 501, to which the side is vacant, is moved to the original assembly position to form another assembly carrying portion 501 to be assembled (as shown in fig. 26), so as to repeat the above steps, and fix each assembly 20a on each assembly carrying portion 501 to be assembled of the carrier tray 50.

Finally, after the above-mentioned operations of fixing the assemblies 20a on the carrier plate 50 are completed, the control module drives the second base 52 of the second displacement mechanism 5 to move to one end (as shown in fig. 27) of each second guide rail 51 far away from the first displacement mechanism 1, so as to take down the carrier plate 50, and then perform various subsequent processing operations on the wafer 3 a.

After each assembly 20a (wafer 3a) on the boat 50 is finished, the control module can drive the second seat 52 of the second displacement mechanism 5 to move to one end of each second guide rail 51 away from the first displacement mechanism 1, so as to place the boat 50 with each assembly 20a (wafer 3a) finished on the pivot assembly 53 of the second displacement mechanism 5 (as shown in fig. 27); the control module drives the second seat 52 of the second displacement mechanism 5 to drive the carrier plate 50 to move to a position close to the displacement operation of the first displacement mechanism 1 (as shown in fig. 28).

Then, the control module drives the loading and unloading mechanism 62 on the mechanical arm 6 to move to a position to be displaced on the carrying disc 50 in the direction and at an angle of a preset loading and unloading reference value; and the distance to the peripheral side of the assembly 20a to be unloaded at the position to be displaced is detected by each distance measuring element 621 (as shown in fig. 29).

The control module drives the assembly and disassembly mechanism 62 on the mechanical arm 6 to adjust the position according to the difference of the distances (i.e. the projection lengths of the laser beams 6211) detected by the distance measuring elements 621, so that the distances (the laser beams 6211) of the distance measuring elements 621 (the laser light sources) detecting the peripheral sides of the assembly 20a to be unloaded are equal in length, thereby correcting the inclination angle of the assembly and disassembly operation surface of the assembly and disassembly mechanism 62 and ensuring that the assembly and disassembly operation surface corresponds to the assembly 20a to be unloaded in parallel; and the control module can store the information of the corrected loading and unloading operation surface.

The control module drives the image capturing component 61 on the robot arm 6 to move above the assembly 20a to be unloaded at the same inclination angle and direction as the corrected loading/unloading operation surface, and the image capturing component 611 is used to obtain an image of the periphery of the assembly 20a to be unloaded (as shown in fig. 30), so as to confirm the position and state of the assembly 20a to be unloaded and the clamps 502.

The control module drives the image capturing component 61 on the mechanical arm 6 to adjust the position according to the obtained image position difference of the assembly 20a to be unloaded, so as to correct the position of the image capturing surface of the image capturing component 61, thereby ensuring that the image capturing component 61 correctly and flatly corresponds to the assembly 20a to be unloaded; and the control module can store the information of the corrected image taking surface (as shown in fig. 30).

In one possible embodiment, a positioning mark (not shown, may be a cross scale or other marking structure) is disposed at a predetermined position around each of the clamps 502, and a corresponding relative mark (not shown, may be a cross scale or other marking structure) may be disposed on the lens of the image capturing assembly 611 of the image capturing assembly 61; when the image capturing component 61 is adjusted to the position, the relative mark is overlapped with the positioning mark, so as to achieve the effect of correcting the image capturing surface position of the image capturing component 61.

Since the image capturing component 61 captures images in the same inclination angle and direction as the corrected loading/unloading operation surface, after the position of the image capturing surface is corrected, the control module can calculate and store the position information of the loading/unloading mechanism 62 to be corrected again by using the position of the corrected image capturing surface, so that the control module can directly and rapidly drive the loading/unloading mechanism 62 on the robot arm 6 again to move to the position which is located at the position corresponding to the assembly 20a to be unloaded accurately in the positive direction.

The control module drives the handling mechanism 62 on the robot arm 6 to move over the assembly to be unloaded 20a, releasing the grippers 502 (as shown in figure 31) by means of the gripper operating elements 623.

The control module drives the loading and unloading mechanism 62 on the robot arm 6 to clamp the assembly 20a to be unloaded by the clamping component 622, and then the assembly 20a to be unloaded is moved to the pre-unloading part 121 (hollow hole) of the first seat 12 (as shown in fig. 32 and 33); at this time, the control module drives the supporting base lifting component 133 of the first displacement mechanism 1 to drive the supporting base 13 to lift up, so as to pass through the pre-treatment unloading part 121 (hollow hole) and support the wafer 3a, and make each air suction hole 132 suck air to adsorb and fix the wafer 3a, thereby avoiding the wafer 3a from displacement or damage and fracture in the subsequent displacement process.

After the holding member 622 displaces and releases the assembly 20a to be unloaded, the pivoting member 53 of the second displacement mechanism 5 driven by the control module pivots the tray 50, so that the assembly carrying portion 501 of the displaced assembly 20a is pivotally moved to a side position, and the other side assembly 20a is moved to the original position to be displaced to form another assembly 20a to be unloaded (as shown in fig. 33), so as to sequentially and repeatedly displace each assembly 20a to the pre-unloading portion 121 of the first seat 12.

The control module drives the covering displacement assembly 43 of the covering unloading mechanism 4 to drive the clamping jaw set 433 to approach to the upper part of the pre-treatment unloading part 121 of the first seat 12; the ring-shaped protrusion 41a of the top cover 4a of the assembly 20a to be unloaded is held by the clamping jaw set 433 (as shown in fig. 34), and the cover 4a is moved onto the cover placement base 41 by the cover displacement slide 432 ascending and descending and the cover displacement guide 431 sliding laterally; then, the clamping jaw set 433 releases the ring protrusion 41a (as shown in fig. 35), so that the cover 4a is placed on the cover placement seat 41; at this time, the wafer ring 2a and the wafer 3a remain in the preliminary unloading unit 121.

In practical applications, the cover lifting assembly 42 can cooperate with the cover placing base 41 to lift, so that the cover displacement assembly 43 can displace the cover 4a on the cover placing base 41 more easily.

First, the first base 12 is moved along the first guide rail 11 to a position close to the side of the wafer ring loading and unloading mechanism 2 (or the wafer loading and unloading mechanism 3) as required; then, the control module drives the supporting base lifting component 133 of the first displacement mechanism 1 to drive the supporting base 13 to support the wafer 3a to ascend, so that the concave channel 131 of the supporting base 13 is exposed to the outside (as shown in fig. 36); meanwhile, the control module drives the wafer unloading mechanism 3 to drive the wafer moving slide 332 of the wafer moving assembly 33 to move, so that the wafer carrier 34 extends into the concave channel 131 of the supporting base 13 to support the wafer 3a in cooperation with the extension of the telescopic assembly 333, and simultaneously each air-extracting hole 341 extracts air to adsorb and fix the wafer 3a (as shown in fig. 37); then, the suction holes 132 stop sucking air, and the holder lift assembly 133 lowers the holder 13 to separate from the wafer 3a (see fig. 38); the wafer carrier 34 can stably displace the wafer 3a from the wafer cassette 30a (as shown in FIG. 39) by moving the wafer displacement slide 332 of the wafer displacement assembly 33 in conjunction with the extension of the retractable assembly 333; at this time, the wafer ring 2a remains in the preliminary unloading section 121.

In practice, the wafer lifting assembly 32 is adapted to lift the wafer placing base 31 so that the wafer carrier 34 can more easily displace the wafer 3a to a proper height in the wafer cassette 30 a.

The control module drives the wafer ring placing and unloading mechanism 2 to make the wafer ring displacing assembly 23 drive the clamping assembly 233 to approach the upper part of the pre-treatment unloading part 121 of the first seat 12; clamping the wafer ring 2a on the pre-unloading part 121 by the clamping assembly 233 (as shown in FIG. 40); and the wafer ring 2a can be moved to the wafer ring placing base 21 by the lifting of the wafer ring moving slide 232 and the transverse sliding of the wafer ring moving guide rail 231 (as shown in fig. 41); then, the clamping assembly 233 releases the wafer ring 2a, so that the wafer ring 2a is placed on the wafer ring placing base 21.

In practical applications, the wafer ring lifting assembly 22 can cooperate with the wafer ring loading base 21 to lift, so that the wafer ring displacement assembly 23 can displace the wafer ring 2a on the wafer ring loading base 21 more easily.

By means of the unloading device, each processed assembly 20a on the carrier 50 can be decomposed into a cover 4a, a processed wafer 3a, a wafer ring 2a and other components one by one, and the components are respectively moved on the cover material placing seat 41, the wafer material placing seat 31 and the wafer ring material placing seat 21, so as to form a mechanical automatic unloading and recycling mechanism.

In summary, the pre-treatment wafer loading and unloading device of the present invention can achieve the effects of respectively combining the wafer ring, the wafer and the cover by using a simple mechanism and operation, precisely moving and fixing the wafer ring, the wafer and the cover on different positions of a loading disc, and then decomposing the processed assembly into the wafer ring, the wafer and the cover for respectively recycling.

Claims (24)

1. A pre-treatment type wafer carrying disc placing and unloading device is characterized by comprising:

the first displacement mechanism is connected and driven by a control module and is provided with a first seat body capable of reciprocating, and a pre-treatment unloading part is arranged on the first seat body;

the wafer ring unloading mechanism is arranged beside the first displacement mechanism and is connected with and driven by the control module, the wafer ring unloading mechanism is provided with a wafer ring material placing seat for bearing a wafer ring, a wafer ring displacement component is arranged beside the wafer ring material placing seat, and the wafer ring displacement component can carry and release the wafer ring and can move between the wafer ring material placing seat and the pre-treatment unloading part of the first seat body;

the wafer unloading mechanism is arranged beside the first displacement mechanism and is connected with and driven by the control module, the wafer unloading mechanism is provided with a wafer material placing seat for bearing a wafer, a wafer displacement component is arranged beside the wafer material placing seat, the wafer displacement component is provided with a wafer bracket, and the wafer bracket can be driven by the wafer displacement component to carry the wafer to move between the wafer material placing seat and the pre-treatment unloading part of the first seat body;

the covering unloading mechanism is arranged beside the first displacement mechanism and is connected with and driven by the control module, the covering unloading mechanism is provided with a covering material placing seat for supporting covering, a covering displacement component is arranged beside the covering material placing seat, and the covering displacement component can carry and release the covering and can move between the covering material placing seat and the pre-treatment unloading part of the first seat body;

a carrying disc, the surface of which is provided with at least one assembly bearing part, and the periphery of each assembly bearing part is respectively provided with a plurality of clamps;

the mechanical arm is connected with and driven by the control module and is provided with a movable end capable of moving between the first seat body and the carrying disc, and at least one loading and unloading mechanism is arranged on the movable end.

2. The apparatus of claim 1, wherein: the assembling and disassembling mechanism is respectively provided with a clamping component which can be opened and closed relatively to clamp the assembly, a plurality of clamp operating components which correspond to and unlock each clamp, and a plurality of distance measuring elements which can measure the distance.

3. The apparatus of claim 2, wherein: the plurality of distance measuring elements are laser light sources capable of generating distance measuring laser beams and are respectively arranged at least three points on the peripheral side of the assembling and disassembling mechanism.

4. The apparatus of claim 1, 2 or 3, wherein: the movable end of the mechanical arm is also provided with an image capture component capable of obtaining images.

5. The apparatus of claim 1, 2 or 3, wherein: the pre-treatment unloading part is a hollow hole, a bearing seat is arranged in the hollow hole, a concave channel is concavely arranged on the top surface of the bearing seat, and a plurality of air suction holes capable of sucking air are arranged at the two sides of the concave channel; the bottom of the bearing seat is provided with a bearing seat lifting component which can drive the bearing seat to lift.

6. The apparatus of claim 4, wherein: the pre-treatment unloading part is a hollow hole, a bearing seat is arranged in the hollow hole, a concave channel is concavely arranged on the top surface of the bearing seat, and a plurality of air suction holes capable of sucking air are arranged at the two sides of the concave channel; the bottom of the bearing seat is provided with a bearing seat lifting component which can drive the bearing seat to lift.

7. The apparatus of claim 1, 2 or 3, wherein: the first seat body is arranged on a plurality of first guide rails extending in parallel, a plurality of jacket slide seats capable of relatively reciprocating displacement are arranged on the top surface of the first seat body on the periphery of the pre-treatment unloading part, a backlight surface is arranged on the top side of each jacket slide seat, and a concave arc part is arranged on one side of each jacket slide seat facing the pre-treatment unloading part; and an image capturing unit capable of capturing images is arranged above the side of the first guide rail.

8. The apparatus of claim 4, wherein: the first seat body is arranged on a plurality of first guide rails extending in parallel, a plurality of jacket slide seats capable of relatively reciprocating displacement are arranged on the top surface of the first seat body on the periphery of the pre-treatment unloading part, a backlight surface is arranged on the top side of each jacket slide seat, and a concave arc part is arranged on one side of each jacket slide seat facing the pre-treatment unloading part; and an image capturing unit capable of capturing images is arranged above the side of the first guide rail.

9. The apparatus of claim 5, wherein: the first seat body is arranged on a plurality of first guide rails extending in parallel, a plurality of jacket slide seats capable of relatively reciprocating displacement are arranged on the top surface of the first seat body on the periphery of the pre-treatment unloading part, a backlight surface is arranged on the top side of each jacket slide seat, and a concave arc part is arranged on one side of each jacket slide seat facing the pre-treatment unloading part; and an image capturing unit capable of capturing images is arranged above the side of the first guide rail.

10. The apparatus of claim 6, wherein: the first seat body is arranged on a plurality of first guide rails extending in parallel, a plurality of jacket slide seats capable of relatively reciprocating displacement are arranged on the top surface of the first seat body on the periphery of the pre-treatment unloading part, a backlight surface is arranged on the top side of each jacket slide seat, and a concave arc part is arranged on one side of each jacket slide seat facing the pre-treatment unloading part; and an image capturing unit capable of capturing images is arranged above the side of the first guide rail.

11. The apparatus of claim 1, 2 or 3, wherein: an air nozzle is arranged above the wafer material placing seat, the air nozzle is provided with air nozzles capable of downwards spraying air, and the top surface of the wafer bracket is provided with a plurality of air suction holes capable of sucking air.

12. The apparatus of claim 4, wherein: an air nozzle is arranged above the wafer material placing seat, the air nozzle is provided with air nozzles capable of downwards spraying air, and the top surface of the wafer bracket is provided with a plurality of air suction holes capable of sucking air.

13. The apparatus of claim 5, wherein: an air nozzle is arranged above the wafer material placing seat, the air nozzle is provided with air nozzles capable of downwards spraying air, and the top surface of the wafer bracket is provided with a plurality of air suction holes capable of sucking air.

14. The apparatus of claim 6, wherein: an air nozzle is arranged above the wafer material placing seat, the air nozzle is provided with air nozzles capable of downwards spraying air, and the top surface of the wafer bracket is provided with a plurality of air suction holes capable of sucking air.

15. The apparatus of claim 7, wherein: an air nozzle is arranged above the wafer material placing seat, the air nozzle is provided with air nozzles capable of downwards spraying air, and the top surface of the wafer bracket is provided with a plurality of air suction holes capable of sucking air.

16. The apparatus of claim 9, wherein: an air nozzle is arranged above the wafer material placing seat, the air nozzle is provided with air nozzles capable of downwards spraying air, and the top surface of the wafer bracket is provided with a plurality of air suction holes capable of sucking air.

17. The apparatus of claim 1, 2 or 3, wherein: a wafer ring lifting assembly is arranged below the wafer ring material placing seat, the wafer ring lifting assembly can drive the wafer ring material placing seat to perform lifting action, the wafer ring displacement assembly is provided with a wafer ring displacement sliding seat capable of lifting, a wafer ring displacement guide rail capable of being reset is arranged on the wafer ring displacement sliding seat, and a clamping assembly capable of clamping the wafer ring is arranged on the wafer ring displacement guide rail; a wafer lifting component is arranged below the wafer material placing seat, the wafer lifting component can drive the wafer material placing seat to perform lifting action, the wafer displacement component is provided with a plurality of wafer displacement guide rails parallel to the first guide rail and a wafer displacement sliding seat which is arranged on each wafer displacement guide rail and can perform reciprocating displacement, a telescopic component capable of vertically lifting is arranged on each wafer displacement sliding seat, and the wafer bracket is arranged at the movable end of the telescopic component; the covering and placing base is provided with a covering and lifting component below, the covering and lifting component can drive the covering and placing base to move up and down, the covering and moving component is provided with a covering and moving slide seat capable of moving up and down, a covering and moving guide rail capable of transversely reciprocating and moving is arranged on the covering and moving slide seat, and a clamping jaw group capable of clamping the covering is arranged on the covering and moving guide rail.

18. The apparatus of claim 1, 2 or 3, wherein: the second displacement mechanism is connected with and driven by the control module and provided with a second seat body capable of reciprocating displacement, and a pivoting component capable of bearing the carrying disc is arranged on the second seat body.

19. The apparatus of claim 4, wherein: the second displacement mechanism is connected with and driven by the control module and provided with a second seat body capable of reciprocating displacement, and a pivoting component capable of bearing the carrying disc is arranged on the second seat body.

20. The apparatus of claim 5, wherein: the second displacement mechanism is connected with and driven by the control module and provided with a second seat body capable of reciprocating displacement, and a pivoting component capable of bearing the carrying disc is arranged on the second seat body.

21. The apparatus of claim 7, wherein: the second displacement mechanism is connected with and driven by the control module and provided with a second seat body capable of reciprocating displacement, and a pivoting component capable of bearing the carrying disc is arranged on the second seat body.

22. The apparatus of claim 9, wherein: the second displacement mechanism is connected with and driven by the control module and provided with a second seat body capable of reciprocating displacement, and a pivoting component capable of bearing the carrying disc is arranged on the second seat body.

23. The apparatus of claim 11, wherein: the second displacement mechanism is connected with and driven by the control module and provided with a second seat body capable of reciprocating displacement, and a pivoting component capable of bearing the carrying disc is arranged on the second seat body.

24. The apparatus of claim 1, 2 or 3, wherein: the outer peripheral ring of the wafer ring is provided with an outer ring flange, and the inner peripheral ring of the wafer ring is provided with an inner ring flange; the center of the cover is provided with a ring convex part.

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