TW202128796A - Adhesive composition, laminate and manufacturing method thereof, manufacturing method of electronic parts, and polymer wherein the adhesive composition has heat resistance and can form an adhesive layer having excellent adhesion to the substrate or the support - Google Patents

Abstract

The present invention provides an adhesive composition for bonding a support and a substrate, which contains a polymer (P1) having a constituent unit (p1) represented by the following general formula (p1-1), where Ru11-Ru14 independently represent an organic group or a hydrogen atom having 1-30 carbon atoms, and at least one of the Ru11-Ru14 is an organic group containing an alkoxysilane group. n1 is an integer of 0 to 2. In the aforementioned polymer (P1), relative to all the constituent units of the polymer (P1) (100 moles), the proportion of the constituent unit (p1) is 3-30 moles.

Description

Adhesive composition, laminate and manufacturing method thereof, manufacturing method of electronic parts, and polymer

The present invention relates to an adhesive composition, a laminate, a method of manufacturing the same, a method of manufacturing an electronic component, and a polymer. This case claims priority based on Special Application No. 2019-199078 filed in Japan on October 31, 2019, and its content is used here.

In conductor packages (electronic parts) containing semiconductor components, there are various forms according to the corresponding size, such as WLP (Wafer Level Package), PLP (Panel Level Package), etc. . As semiconductor packaging technology, fan-in technology and fan-out technology can be cited. As a semiconductor package of the fan-in technology, there is known a fan-in WLP (Fan-in Wafer Level Package) in which the terminals at the end of the bare chip are rearranged in the chip area. As a semiconductor package of fan-out technology, a fan-out WLP (Fan-out Wafer Level Package) in which the terminal is relocated outside the chip area is known.

In recent years, in particular, fan-out technology, as a fan-out PLP (Fan-out Panel Level Package), etc. applied to semiconductor components on the panel and packaged, can achieve higher levels in semiconductor packaging. Methods of integration, thinning, and miniaturization have attracted attention.

In order to achieve the miniaturization of the semiconductor package, it is important to reduce the thickness of the substrate in the integrated device. However, if the thickness of the substrate is reduced, its strength is reduced, and damage to the substrate is likely to occur during the manufacture of a semiconductor package. In this regard, a laminate in which a support body is attached to a substrate is used.

Here, when bonding a substrate and a support, conventionally, from the viewpoint of excellent light transmittance, an adhesive containing a polymer having a cycloolefin structure has been widely used. Patent Document 1 discloses an adhesive composition containing a polymer having a cycloolefin structure and a (meth)acrylate monomer compatible with the polymer. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2014-105316 A

[The problem to be solved by the invention]

However, during the manufacture of semiconductor packages, after bonding the substrate and the support with an adhesive, high-temperature treatments such as sealing, film formation, and firing are applied. In the conventional adhesive composition, due to the influence of the aforementioned high temperature treatment, for example, the position of the substrate may be shifted before and after the sealing operation. It is also considered to use a high-temperature resistant adhesive composition, but the high-temperature resistant adhesive composition may have insufficient adhesion to the substrate or support.

The present invention was completed in view of the above circumstances, and the subject is to provide an adhesive composition, a laminate using the same, a method of manufacturing the same, a method of manufacturing an electronic component, and a polymer used in the aforementioned adhesive composition. The adhesive composition for bonding the support and the substrate can form an adhesive layer having heat resistance and excellent adhesion to the substrate or the support. [Means to solve the problem]

In order to solve the above-mentioned problems, the present invention adopts the following configuration. That is, the first aspect of the present invention is an adhesive composition, which is an adhesive composition for bonding a support and a substrate, and contains A polymer (P1) having a structural unit (p1) represented by the following general formula (p1-1);

[式中，R^u11 ~R^u14 各自獨立地表示碳數1~30的有機基或氫原子；惟，R^u11 ~R^u14 之至少1個係含有烷氧基矽烷基的有機基；n¹ 為0~2之整數]。

[In the formula, R ^u11 ~ R ^u14 each independently represent an organic group with 1 to 30 carbon atoms or a hydrogen atom; ^{however , at least one of R u11} ~ R u14 is an organic group containing an alkoxysilyl group; n ¹ is Integer of 0~2].

The second aspect of the present invention is a laminate in which a support and a substrate are bonded through an adhesive layer, wherein the adhesive layer includes a first adhesive formed using the adhesive composition of the first aspect Composition layer.

The third aspect of the present invention is a method for manufacturing a laminate, which is a method for manufacturing a laminate in which a support body and a substrate are bonded through an adhesive layer, which has: at least one of the support or the substrate, An adhesive layer forming step of forming the adhesive layer including the first adhesive composition layer formed using the adhesive composition of the first aspect; and, bonding the adhesive layer formed through the adhesive layer forming step The bonding step of the support and the substrate.

The fourth aspect of the present invention is a method of manufacturing an electronic component, which, after obtaining a laminate by the method of manufacturing a laminate of the third aspect, includes: irradiating light to the separation through the support base A step of separating the support base from the substrate of the laminated body by altering the quality of the separation layer; and, after the separation step, removing the adhesive layer attached to the substrate.

The fifth aspect of the present invention is a polymer, which is a polymer used for an adhesive composition for bonding a support and a substrate, and has a structural unit (p1) represented by the following general formula (p1-1) );

[式中，R^u11 ~R^u14 各自獨立地表示碳數1~30的有機基或氫原子；惟，R^u11 ~R^u14 之至少1個係含有烷氧基矽烷基的有機基；n為0~2之整數]。 [發明的效果]

[In the formula, R ^u11 ~ R ^u14 each independently represent an organic group with 1 to 30 carbon atoms or a hydrogen atom; ^{however , at least one of R u11} ~ R u14 is an organic group containing an alkoxysilyl group; n is 0 ~2 integer]. [Effects of the invention]

According to the present invention, it is possible to provide an adhesive composition, a laminate using the same, a method of manufacturing the same, a method of manufacturing an electronic component, and a polymer used in the aforementioned adhesive composition, the adhesive composition being used for bonding a support and The adhesive composition of the substrate can form an adhesive layer having heat resistance and excellent adhesion to the substrate or the support.

[The form of implementing the invention]

In this specification and the scope of the patent application, the term "aliphatic" refers to the concept of aromatics, and is defined as meaning groups, compounds, etc. that do not have aromaticity. "Alkyl" includes linear, branched, and cyclic monovalent saturated hydrocarbon groups unless otherwise specified. The same applies to the alkyl group in the alkoxy group. The "alkylene group" includes linear, branched, and cyclic divalent saturated hydrocarbon groups unless otherwise specified. The "halogenated alkyl group" is a group in which part or all of the hydrogen atoms of the alkyl group are substituted with a halogen atom. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. "Fluorinated alkyl group" or "fluorinated alkylene group" refers to a group in which part or all of the hydrogen atoms of an alkyl group or alkylene group are replaced by fluorine atoms. The so-called "structural unit" means the monomer unit (monomer unit) constituting the polymer compound (resin, polymer, copolymer). When it is described as "may have a substituent" or "may have a substituent", it includes the case where the hydrogen atom (-H) is substituted with a monovalent group and the case where the methylene group (-CH ₂ -) is substituted with a divalent group Both. "Exposure" is a concept that encompasses the entire exposure of radiation.

The so-called "structural unit derived from styrene" means a structural unit formed by cleavage of the ethylenic double bond of styrene. The so-called "structural unit derived from a styrene derivative" means a structural unit formed by cleavage of the ethylenic double bond of the styrene derivative. The so-called "styrene derivative" refers to the concept that the hydrogen atom at the α-position of styrene is substituted with other substituents such as alkyl groups and halogenated alkyl groups, and the concept including these derivatives. Examples of their derivatives include those in which the hydrogen atom at the α-position can be replaced by a substituent in the hydroxy group of styrene with an organic group; and benzene in which the hydrogen atom at the α-position can be replaced by a substituent. The benzene ring of ethylene has a substituent other than the hydroxyl group bonded thereto. Furthermore, the so-called α-position (a carbon atom at the α-position), unless otherwise specified, refers to the carbon atom to which the benzene ring is bonded. Examples of the substituent that replaces the hydrogen atom at the α-position of styrene include the same as those exemplified as the substituent at the α-position in the aforementioned α-substituted acrylate.

The alkyl group as the substituent at the α-position is preferably a linear or branched alkyl group. Specifically, an alkyl group having 1 to 5 carbon atoms (methyl, ethyl, propyl, Isopropyl, n-butyl, isobutyl, tertiary butyl, pentyl, isopentyl, neopentyl) and the like. In addition, the halogenated alkyl group as the substituent at the α-position specifically includes a group in which part or all of the hydrogen atoms of the above-mentioned "alkyl group as the substituent at the α-position" are substituted with halogen atoms. As this halogen atom, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, etc. are mentioned, A fluorine atom is especially preferable. In addition, the hydroxyalkyl group as the substituent at the α-position specifically includes a group in which part or all of the hydrogen atoms of the above-mentioned "alkyl group as the substituent at the α-position" are substituted with hydroxy groups. The number of hydroxyl groups in the hydroxyalkyl group is preferably 1 to 5, most preferably 1.

(Adhesive composition) The adhesive composition of the first aspect of the present invention is used for bonding a support and a substrate. The adhesive composition of this embodiment contains a polymer component (P). This polymer component (P) contains at least the polymer (P1).

Fig. 1 shows an embodiment of the laminate to which the present invention is applied. The laminated body 10 shown in FIG. 1 includes a separation layer 2 and an adhesive layer 3 between a support base 1 and a substrate 4, and the separation layer 2, the adhesive layer 3, and the substrate 4 are sequentially laminated on the support base 1. The support base 1 is made of a light-transmitting material. In the laminated body 10, the separation layer 2 is irradiated with light from the support base 1 side, and the separation layer 2 is deteriorated and decomposed, so the support base 1 is separated from the substrate 4. In this laminated body 10, the support 12 and the substrate 4 are bonded to each other through the adhesive layer 3. This adhesive layer 3 can be formed using the adhesive composition of this embodiment.

＜Polymer component (P)＞ In this embodiment, the polymer component (P) (hereinafter also referred to as "(P) component") contains at least the polymer (P1). The (P) component system may contain polymers other than these in addition to the polymer (P1). In addition to the polymer, the polymer component (P) in the present embodiment may also contain a monomer that can become a matrix constituting the adhesive layer, for example, a curable monomer described later.

≪Polymer (P1)≫ In this embodiment, the polymer (P1) (hereinafter also referred to as "(P1) component") has at least a structural unit (p1).

[Construction Unit (p1)] The structural unit (p1) is a structural unit represented by the following general formula (p1-1). Since the polymer (P1) has the structural unit (p1), it is possible to form an adhesive layer with high adhesion to the substrate.

[式中，R^u11 ~R^u14 各自獨立地表示碳數1~30的有機基或氫原子；惟，R^u11 ~R^u14 之至少1個係含有烷氧基矽烷基的有機基；n為0~2之整數]。

[In the formula, R ^u11 ~ R ^u14 each independently represent an organic group with 1 to 30 carbon atoms or a hydrogen atom; ^{however , at least one of R u11} ~ R u14 is an organic group containing an alkoxysilyl group; n is 0 ~2 integer].

In the aforementioned formula (p1-1), ^{examples of the organic groups in R u11} to R u14 include alkyl, alkenyl, alkynyl, alkylene, aryl, aralkyl, alkaryl, cycloalkane Group, an organic group having a carboxyl group, an organic group having a heterocyclic ring. The alkyl group in R ^u11 to R ^u14 is preferably an alkyl group having 1 to 10 carbon atoms, for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, and Dibutyl, tertiary butyl, pentyl, neopentyl, hexyl, heptyl, octyl, nonyl, decyl. ^Examples of alkenyl groups in R ^u11 to R u14 include allyl, pentenyl, and vinyl. ^Examples of the alkynyl group in R ^u11 to R u14 include vinyl group. ^Examples of the alkylene group in R ^u11 to R u14 include a methylene group and an ethylene group. ^Examples of the aryl group in R ^u11 to R u14 include a phenyl group, a naphthyl group, and an anthryl group. ^Examples of the aralkyl group in R ^u11 to R u14 include a benzyl group and a phenethyl group. Examples of alkylaryl groups in R ^u11 to R ^{u14 include tolyl and xylyl. Examples} of the cycloalkyl in R ^u11 to R u14 include adamantyl, cyclopentyl, cyclohexyl, and cyclooctyl. ^Examples of the organic group having a heterocyclic ring in R ^u11 to R u14 include an organic group having an epoxy group and an organic group having an oxetanyl group.

The organic group in R ^u11 to R ^u14 is preferably an alkyl group from the viewpoint of further improving solubility in a hydrocarbon solvent and synthesis. In addition, from the viewpoint of easy maintenance of a high glass transition point, an alkyl group having 1 to 8 carbon atoms is more preferable, and an alkyl group having 2 to 6 carbon atoms is particularly preferable.

The organic groups in R ^u11 ~ R ^u14 can be substituted by halogen atoms with more than one hydrogen atom. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

At least one of R ^u11 to R ^u14 is an organic group containing an alkoxysilyl group. Alkoxysilyl is a group represented by -Si(OR ¹ ) _m (R ² ) _3-m (R ¹ and R ² are each independently an alkyl group with 1 to 30 carbon atoms; m is an integer of 1 to 3) . As ^{the alkyl group of R 1} and R ² , the same as those exemplified as the alkyl group in ^{R u11} to R ^u14 mentioned above can be mentioned. From the viewpoint of improving the adhesion to the substrate ^{, the alkyl group of R 1} and R ² preferably has a carbon number of 1 to 8, more preferably a carbon number of 1 to 6, particularly preferably a carbon number of 1 to 3, particularly preferably a carbon number of 1 or 2 . The organic group containing an alkoxysilyl group is preferably a group represented by -Y-Si(OR ¹ ) _m (R ² ) _3-m (Y is a single bond or a divalent linking group with 1 to 20 carbon atoms; R ¹ , R ² , and m are the same as described above). Examples of the divalent linking group in Y include alkyl, alkenyl, alkynyl, alkylene, aryl, aralkyl, alkaryl, cycloalkyl, divalent linking groups having carboxyl groups, and heterocyclic groups. The divalent linking group of the ring, etc. Y is preferably a single bond or an alkylene group. In Y, the alkylene group preferably has 1 to 10 carbons, more preferably 1 to 5 carbons, particularly preferably 1 to 3 carbons, particularly preferably 1 or 2 carbons. Among them, Y is preferably a single bond. m is an integer of 1 to 3, preferably 2 or 3, more preferably 3.

Alkoxy group-containing organic silicon group may be all of R ^u11 ~ R ^u14, any R ^u11 ~ R ^u14 are also three, any one of R ^u11 ~ R ^u14 are also be 2, or may be Any one of R ^u11 ~ R ^u14. From the viewpoint of synthesis, it is ^{preferable that any one of R u11} to R u14 is an organic group containing an alkoxysilyl group.

From the viewpoint of improving the permeability of the adhesive layer formed using the adhesive composition, it is ^preferable that any one or more of ^{R u11} to R u14 is a hydrogen atom.

Among the above, ^{the organic group in R u11} to R ^u14 is preferably a combination of an alkoxysilyl group and an alkyl group and a hydrogen atom, or a combination of an alkoxysilyl group and a hydrogen atom, and more preferably an alkoxy group. Combination of base silyl group and hydrogen atom. Among them, ^{any one of R u11} to R ^u14 is an alkoxysilyl group, and the remaining 3 are hydrogen atoms.

In the aforementioned formula (p1-1), n is an integer of 0-2, preferably 0 or 1, and more preferably 0.

Below, specific examples of the structural unit (p1) are shown.

(P1) The structural unit (p1) possessed by the component may be one type or two or more types. The ratio of the structural unit (p1) in the (P1) component can be set to 3 mol% or more with respect to the total (100 mol%) of all the structural units constituting the (P1) component. If it is more than the aforementioned lower limit, the adhesion of the adhesive layer to the substrate is further improved. (P1) The ratio of the structural unit (p1) in the component is preferably 5 mol% or more, more preferably 8 mol% relative to the total (100 mol%) of all the structural units constituting the (P1) component Above, more preferably 10 mol% or more, particularly preferably 12 mol% or more, and particularly preferably 14 mol% or more. (P1) The upper limit of the ratio of the structural unit (p1) in the component is not particularly limited, but from the viewpoint of solubility, it is relative to the total (100 mol%) of all the structural units constituting the (P1) component. It is preferably 30 mol% or less, more preferably 25 mol% or less, particularly preferably 20 mol% or less, and particularly preferably 17 mol% or less. (P1) The ratio of the structural unit (p1) in the component, for example, relative to the total (100 mol%) of all the structural units constituting the component (P1), can be set to 3-30 mol%, 5-25 mol% %, 8-20 mol% or 14-17 mol%, etc.

[Other building blocks] (P1) The component system may have other structural units in addition to the structural unit (p1). As other structural units, for example, structural units (p2) derived from cycloolefins (except those equivalent to structural units (p1)) and structural units derived from monomers containing a maleimide skeleton (p3).

・Construction unit (p2) The structural unit (p2) is a structural unit derived from a cycloolefin (except for the structural unit (p1)). The polymer (P1) preferably has a structural unit (p2) in addition to the structural unit (p1). By using a resin having a cycloolefin, that is, an unsaturated aliphatic hydrocarbon ring composed of carbon atoms, an adhesive composition can be easily obtained, which can form an adhesive layer that is easily dissolved in a hydrocarbon solvent and removed.

As a preferable structural unit (p2), the structural unit represented by the following general formula (p1-2) is mentioned, for example.

[式中，R^u21 ~R^u24 各自獨立地表示碳數1~30的有機基(惟，含有烷氧基矽烷基者除外)或氫原子；n² 為0~2之整數]。

[In the formula, R ^u21 ~ R ^u24 each independently represent an organic group with 1 to 30 carbon atoms (except for those containing an alkoxysilyl group) or a hydrogen atom; n ² is an integer of 0 to 2].

In the formula (P2-1), as R ^u21 ~ R ^u24 organic group include the same as those in the formula (p1-1) R ^u11 ~ R ^u14 organic group exemplified. However, ^{the organic groups in R u21} ~ R ^u24 do not include alkoxysilyl groups. The organic group in R ^u21 to R ^u24 is preferably an alkyl group from the viewpoint of improving solubility in hydrocarbon solvents and synthesis. In addition, from the viewpoint of easy maintenance of a high glass transition point, an alkyl group having 1 to 8 carbon atoms is more preferable, and an alkyl group having 2 to 6 carbon atoms is particularly preferable.

The organic groups in R ^u21 ~ R ^u24 can be replaced by halogen atoms with more than one hydrogen atom. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

From the viewpoint of improving the permeability of the adhesive layer formed using the adhesive composition, it is ^preferable that any one or more of ^{R u21} to R u24 is a hydrogen atom. Among the above, ^{the organic group in R u21} to R ^u24 is preferably a combination of an alkyl group and a hydrogen atom, more preferably ^{any one of R u21} to R ^u24 is an alkyl group, and the remaining 3 are hydrogen atoms .

In the aforementioned formula (p2-2), n ² is an integer of 0-2, preferably 0 or 1, and more preferably 0.

Below, specific examples of the structural unit (p2) are shown.

(P1) The structural unit (p2) possessed by the component may be one type or two or more types. (P1) The ratio of the structural unit (p2) in the component, relative to the total (100 mol%) of all the structural units constituting the component (P1), is preferably 10 to 95 mol%, more preferably 20 to 90 Mole%, particularly preferably 30~88 mole%, particularly preferably 40~86 mole%. If the ratio of the structural unit (p2) is more than the lower limit of the aforementioned preferable range, the solubility in the hydrocarbon-based solvent is likely to increase. If it is less than the upper limit of the aforementioned preferable range, it is easy to achieve a balance with other constituent units.

・Construction unit (p3) The structural unit (p3) is a structural unit derived from a monomer containing a maleimine skeleton. The polymer (P1) may have a structural unit (p3) in addition to the structural unit (p1). By having the structural unit (p3), the glass transition temperature becomes higher, and the heat resistance of the adhesive layer can be improved. As a preferable structural unit (p3), the structural unit represented by the following general formula (p3-1) is mentioned, for example.

[式中，R^u10 表示碳數1~30的有機基]。

[In the formula, ^Ru10 represents an organic group with 1 to 30 carbon atoms].

In the aforementioned formula (p3-1), ^Ru10 represents an organic group having 1 to 30 carbon atoms. The organic group in R ^u10 may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. The aliphatic hydrocarbon group means a hydrocarbon group that does not have aromaticity. In addition, the aliphatic hydrocarbon group may be saturated or unsaturated, but saturated is usually preferred. For example, as ^{an organic group in Ru10} , the cyclic group which may have a substituent, the chain alkyl group which may have a substituent, or the chain alkenyl group which may have a substituent are mentioned.

Cyclic groups that may have substituents: The cyclic group is preferably a cyclic hydrocarbon group, and the cyclic hydrocarbon group may be an aromatic hydrocarbon group or an aliphatic hydrocarbon group.

^{The aromatic hydrocarbon group in Ru10} is a hydrocarbon group having an aromatic ring. The carbon number of the aromatic hydrocarbon group is preferably 3-30, more preferably 5-30, particularly preferably 5-20, particularly preferably 6-15, most preferably 6-10. However, this carbon number does not include the carbon number in the substituent. Specific examples of the aromatic ring of the aromatic hydrocarbon group in R ^u10 include benzene, sulphur, naphthalene, anthracene, phenanthrene, biphenyl, or these, where part of the carbon atoms constituting the aromatic ring is substituted by a heteroatom The aromatic heterocyclic ring and so on. Examples of the hetero atom in the aromatic heterocyclic ring include an oxygen atom, a sulfur atom, and a nitrogen atom. Specific examples of the aromatic hydrocarbon group in R ^u10 include a group obtained by removing one hydrogen atom from the aforementioned aromatic ring (aryl group: for example, a phenyl group, a naphthyl group, etc.), and a hydrogen atom of the aforementioned aromatic ring 1 A group substituted by an alkylene group (e.g., benzyl, phenethyl, 1-naphthylmethyl, 2-naphthylmethyl, 1-naphthylethyl, 2-naphthylethyl, etc. Base, etc.) and so on. The number of carbon atoms in the aforementioned alkylene (the alkyl chain in the arylalkyl group) is preferably 1 to 4, more preferably 1 to 2, and particularly preferably 1.

The ^{cycloaliphatic hydrocarbon group in Ru10} includes an aliphatic hydrocarbon group containing a ring in the structure. As the aliphatic hydrocarbon group containing a ring in the structure, an alicyclic hydrocarbon group (a group obtained by removing one hydrogen atom from an aliphatic hydrocarbon ring), a hydrogen atom of an aliphatic hydrocarbon ring and an alkyl group Substituted groups, etc. The carbon number of this alkylene group is preferably 1-4. The carbon number of the aliphatic hydrocarbon ring system is preferably 3-20, more preferably 3-12. The aforementioned aliphatic hydrocarbon ring may be polycyclic or monocyclic. As a monocyclic aliphatic hydrocarbon ring, one having 3 to 8 carbon atoms is preferred, and specific examples include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, etc. Cyclopentane and cyclohexane are preferred. As the polycyclic aliphatic hydrocarbon ring, one having 7 to 30 carbon atoms is preferred, and specifically, adamantane, nortersane, isotane, tricyclodecane, tetracyclododecane and the like are more preferred. A polycycloalkane with a polycyclic skeleton of a bridged ring system; a polycycloalkane with a polycyclic skeleton of a condensed ring system, such as a ring with a steroid skeleton.

Among them, ^{the cyclic aliphatic hydrocarbon group in R u10} is preferably a group obtained by removing one or more hydrogen atoms from a monocycloalkane or polycycloalkane, and more preferably a group obtained by removing one or more hydrogen atoms from a monocycloalkane The group is particularly preferably a group obtained by removing one hydrogen atom from a monocycloalkane, and particularly preferably a group obtained by removing one hydrogen atom from cyclopentane or cyclohexane.

^Examples of the substituent in the cyclic group of R u10 include an alkyl group, a halogen atom, and a halogenated alkyl group. The alkyl group as the substituent is preferably an alkyl group having 1 to 5 carbon atoms, and more preferably a methyl group, an ethyl group, a propyl group, an n-butyl group, and a tertiary butyl group. Examples of the halogen atom of the substituent include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, etc., and a fluorine atom is preferred. Examples of the halogenated alkyl group of the substituent include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, propyl, n-butyl, tertiary butyl, etc., where part or all of the hydrogen atoms are passed through the aforementioned halogen atoms. The substituted group.

Substitutable chain alkyl group: The chain alkyl group of R ^u10 may be linear or branched. As the linear alkyl group, the number of carbon atoms is preferably 1-20, more preferably 1-15, and particularly preferably 1-12. Specifically, methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, tridecyl, isotenyl Three bases, fourteen bases, fifteen bases, sixteen bases, different sixteen bases, seventeen bases, eighteen bases, nineteen bases, twenty bases, twenty-one bases, twenty-two bases, etc. As the branched alkyl group, the carbon number is preferably 3-20, more preferably 3-15, and particularly preferably 3-10. Specifically, 1-methylethyl, 1-methylpropyl, 2-methylpropyl, 1-methylbutyl, 2-methylbutyl, 3-methylbutyl, 1- Ethylbutyl, 2-ethylbutyl, 1-methylpentyl, 2-methylpentyl, 3-methylpentyl, 4-methylpentyl and the like.

The chain alkenyl group which may have a substituent: As the chain alkenyl group of R ^u10 , it can be either linear or branched. The carbon number is preferably 2 to 10, more preferably 2 to 5 , Particularly preferred is carbon number 2~4, particularly preferred is carbon number 3. As a linear alkenyl group, a vinyl group, a propenyl group (allyl), a butynyl group, etc. are mentioned, for example. Examples of branched alkenyl groups include 1-methylvinyl, 2-methylvinyl, 1-methpropenyl, and 2-methpropenyl. As the chain alkenyl group, among the above, a straight chain alkenyl group is preferred, a vinyl group and a propenyl group are more preferred, and a vinyl group is particularly preferred.

Examples of the substituent in the chain alkyl group or alkenyl group of R ^{u10 include a halogen atom, a halogenated alkyl group, the cyclic group in the above-mentioned R u10} , and the like.

Among the above, R ^{u10 is} preferably a cyclic group that may have a substituent, more preferably a cyclic hydrocarbon group that may have a substituent, and particularly preferably a cyclic aliphatic hydrocarbon group that may have a substituent.

Below, specific examples of the structural unit (p3) are shown.

(P1) The structural unit (p3) possessed by the component may be one type or two or more types. (P1) The ratio of the structural unit (p3) in the component, relative to the total (100 mol%) of all the structural units constituting the component (P1), is preferably 0 to 90 mol%, more preferably 0 to 70 Mole%, preferably 0-50 mole%. If the ratio of the structural unit (u21) is more than the lower limit of the aforementioned preferable range, the glass transition temperature becomes higher, and the heat resistance of the adhesive layer further improves. If it is less than the upper limit of the aforementioned preferable range, it is easy to achieve a balance with other constituent units.

In the adhesive composition of this embodiment, (P1) component may be used individually by 1 type, and may use 2 or more types together. The aforementioned component (P1), from the viewpoint of improving the adhesion to the substrate and forming an adhesive layer that can be easily dissolved in a hydrocarbon solvent and removed, a polymer having a structural unit (p1) and a structural unit (p2) is preferable .

Hereinafter, preferred specific examples of the component (P1) are shown.

The weight average molecular weight (Mw) of the polymer (P1) (polystyrene conversion standard of gel permeation chromatography (GPC)), for example, can be set in the range of 5.0×10 ⁴ to 1.0×10 ⁶ , preferably 8.0 The range of ×10 ⁴ to 9.0×10 ⁵ is more preferably the range of 1.0×10 ⁵ to 8.0×10 ^{5, and} the range of 2.0×10 ⁵ to 6.0×10 ⁵ is particularly preferable. If the weight average molecular weight of the polymer (P1) is more than the lower limit of the aforementioned preferable range, the heat resistance will change well. If it is less than the upper limit of the aforementioned preferable range, an adhesive composition can be easily obtained that can form an adhesive layer that is easily dissolved in a hydrocarbon solvent and removed.

The degree of dispersion (Mw/Mn) of the polymer (P1) can be set in the range of, for example, 1.5 to 9.0, preferably in the range of 2.5 to 7.0, more preferably in the range of 3.5 to 5.5, and particularly preferably in the range of 4.0 to 5.0. The degree of dispersion indicates the width of the molecular weight distribution. Mn represents the number average molecular weight.

Weight average molecular weight (Mw), number average molecular weight (Mn), and molecular weight distribution (Mw/Mn), for example, using polystyrene conversion values obtained from a calibration curve of standard polystyrene (PS) measured by GPC . The measurement conditions of the GPC measurement are, for example, as follows. Tosoh Corporation Gel Permeation Chromatography Apparatus HLC-8320GPC Column: TSK-GEL Supermultipore HZ-M manufactured by Tosoh Corporation Detector: RI detector for liquid chromatography Measuring temperature: 40℃ Solvent: THF Sample concentration: 2.0mg/ml

The content ratio of (P1) component occupied by (P) component relative to the total amount (100 mass%) of (P) component can be 50% by mass or more, 60% by mass or more, or 70% by mass or more, 80% by mass or more, 90% by mass or more, or 100% by mass. When the content ratio of the component (P1) is more than the lower limit of the aforementioned preferable range, the heat resistance and the adhesion to the substrate are further improved. The component (P1) can be synthesized by the method described in the item of <Production of Polymer> in (Polymer) described later.

≪Polymer (P2)≫ The (P) component system may contain another polymer (P2) (hereinafter also referred to as "(P2) component") in addition to the (P1) component. As the (P2) component, for example, a hydrocarbon-based polymer can be mentioned. The hydrocarbon-based polymer may be an aliphatic hydrocarbon-based polymer or an aromatic hydrocarbon-based polymer. As the component (P2), from the point of view of imparting heat resistance or flexibility, for example, elastomers, cycloolefin polymers (except those equivalent to polymer (P1)), acrylic resins, and constituents can be mentioned. Subsequent to the hardenable monomer of the matrix of the layer, etc.

[Elastomer] (P2) The elasticity in the component can be suitably mentioned, for example, as a structural unit of the main chain, a structural unit derived from styrene or a structural unit derived from a styrene derivative (these are collectively referred to as "styrene unit ")By. The elastomer is preferably a styrene-based thermoplastic elastomer, and more preferably a hydrogenated styrene-based thermoplastic elastomer.

As the elastomer in the component (P2), for example, polystyrene-poly(ethylene/propylene)) block copolymer (SEP), styrene-isoprene-styrene) block copolymer (SIS ), styrene-butadiene-styrene) block copolymer (SBS), styrene-butadiene-butylene-styrene) block copolymer (SBBS) or these hydrogenated products; styrene- Ethylene-butylene-styrene) block copolymer (SEBS) (Septon 8004 (manufactured by KURARAY Co., Ltd.)), styrene-ethylene-propylene-styrene) block copolymer (styrene-isoprene- Styrene) block copolymer) (SEPS), styrene-ethylene-ethylene-propylene-styrene) block copolymer (SEEPS), styrene-ethylene-ethylene-propylene whose styrene block is a reactive cross-linked type -Styrene) block copolymer (Septon V9461 (manufactured by KURARAY Co., Ltd.), Septon V9475 (manufactured by KURARAY Co., Ltd.)), styrene-ethylene-butylene-styrene whose styrene block is a reactive crosslinking type ) Block copolymer (Septon V9827 (manufactured by KURARAY Co., Ltd.) and the like with a reactive polystyrene hard block.

In the elastomer of component (P2), the content ratio of styrene units relative to all the constituent units (100 mol%) constituting the elastomer is preferably 10 to 70 mol%, more preferably 20 to 60 mol% Ear%, 25-50 mol% is particularly preferred, and 30-45 mol% is particularly preferred. If the content ratio of the styrene unit is more than the lower limit of the above-mentioned preferred range, the adhesion to the support and the substrate or the grinding property will not be reduced, and the process of thinning, mounting, and the like will be facilitated. If it is less than the upper limit of the said preferable range, the chemical resistance of the adhesive layer formed by the adhesive composition can be maintained suitably.

(P2) The weight average molecular weight of the elastic system in the component is preferably in the range of 20,000 to 200,000, more preferably in the range of 50,000 to 150,000, and particularly preferably in the range of 80,000 to 1,200,000. If the weight average molecular weight of the elastomer is within the aforementioned preferred range, it is easy to obtain an adhesive composition which can form an adhesive layer that is easily dissolved in a hydrocarbon solvent and removed. In addition, since the weight average molecular weight of the elastomer is within the aforementioned preferred range, the chemical resistance of the adhesive layer formed by the adhesive composition is improved.

(P2) The elastomer in the component may be one type or two or more types.

(P2) The elastomer in the component is more preferably a hydride in the elastomer. If it is a hydride, the stability to heat is improved, and deterioration such as decomposition or polymerization is less likely to occur. In addition, it is also better from the viewpoint of solubility in hydrocarbon solvents and resistance to resist solvents. In addition, among the elastomers, a block polymer in which both ends are made of styrene is more preferable. By blocking both ends with styrene with high thermal stability, it is easy to obtain higher heat resistance. More specifically, the elastomer is more preferably a hydrogenated product of a block copolymer of styrene and a conjugated diene. Thereby, the stability to heat is improved, and deterioration such as decomposition or polymerization is less likely to occur. In addition, by blocking both ends with styrene with high thermal stability, higher heat resistance is exhibited. Furthermore, it is more preferable from the viewpoint of solubility in hydrocarbon-based solvents and resistance to resist solvents.

Commercial products of elastomers that can be used as component (P2) include, for example, "Septon (trade name)" manufactured by KURARAY Co., Ltd., "Hybrar (trade name)" manufactured by KURARAY Co., Ltd., and Asahi Kasei Co., Ltd. "Tuftec (trade name)" manufactured by the company, "Dynaron (trade name)" manufactured by JSR Corporation, etc.

The component (P) preferably contains an elastomer as the component (P2). By containing the elastomer, the adhesion of the adhesive layer to the substrate is improved. The ratio of the elastomer contained in the component (P) relative to the total amount (100% by mass) of the component (P) is preferably 1% by mass or more, more preferably 3% by mass or more, and particularly preferably 5% by mass %above. The upper limit of the content ratio of the elastomer contained in the component (P) is preferably 50% by mass or less, more preferably 30% by mass or less, from the viewpoint of the balance with the aforementioned (P1) component It is 20% by mass or less, and more preferably 10% by mass or less. The range of the content ratio of the elastomer contained in the component (P) can be, for example, 0-50% by mass, preferably 1-40% by mass, more preferably 3-30% by mass, and particularly preferably 3-25 % By mass, particularly preferably 5-20% by mass or 5-10% by mass.

[Cyclic Olefin Polymer] As the cycloolefin polymer, for example, a ring-opened polymer containing a monomer component of a cycloolefin monomer, and an addition polymer of a monomer component containing a cycloolefin monomer by addition polymerization can be suitably used. However, those equivalent to the aforementioned polymer (P1) are excluded.

Examples of cycloolefin monomers include bicyclics such as nortzene and nortzadiene, tricyclics such as dicyclopentadiene and hydroxydicyclopentadiene, and four such as tetracyclododecene. Rings, pentacyclics such as cyclopentadiene trimers, heptacyclics such as tetracyclopentadiene, or alkyl groups of these polycyclics (methyl, ethyl, propyl, butyl, etc.) Monomers such as substituents, alkenyl (vinyl, etc.) substituents, alkylene (ethylene, etc.) substituents, or aryl (phenyl, tolyl, naphthyl, etc.) substituents.

Among the above, particularly preferred is a polymer derived from a constituent unit of a monomer having a nortzene structure selected from the group consisting of nortzene, tetracyclododecene and these alkyl substituents. . By using a cycloolefin polymer having such a nortzene structure, for example, it becomes easy to obtain an adhesive composition that is easily soluble in hydrocarbon solvents while having high chemical resistance to resist solvents. And the adhesive layer is removed.

The cycloolefin polymer may have a monomer copolymerizable with the aforementioned cycloolefin monomer as a monomer unit. As this copolymerizable monomer, for example, an alkene monomer can be suitably mentioned. The alkene monomer may be linear or branched. Examples include alkene monomers with 2 to 10 carbon atoms. For example, ethylene, propylene, 1-butene, isobutylene, 1-hexene, etc. are preferred. Among these α-olefins, it is more preferable to use ethylene as the monomer unit.

In the cycloolefin polymer in the component (P2), the content ratio of the cycloolefin monomer unit is preferably 10-100 mol% relative to all the constituent units (100 mol%) constituting the cycloolefin polymer, More preferably, it is 20-100 mol%.

(P2) The weight average molecular weight of the cycloolefin polymer in the component is preferably in the range of 10,000 to 2,000,000, more preferably in the range of 30,000 to 1,500,000. If the weight average molecular weight of the cycloolefin polymer is more than the lower limit of the aforementioned preferred range, it is easy to control the softening temperature of the polymer to a temperature suitable for bonding the support and the substrate. If it is less than the upper limit of the aforementioned preferable range, an adhesive composition can be easily obtained that can form an adhesive layer that is easily dissolved in a hydrocarbon solvent and removed.

(P2) The cycloolefin polymer in the component may be one type or two or more types.

Cycloolefin polymer is, for example, a polymer formed by polymerizing monomer components composed of cycloolefin monomer and olefin monomer, and a polymer without polar groups, from the point of suppressing the generation of gas at high temperature It's better to look at. There are no particular restrictions on the polymerization method, polymerization conditions, and the like when the monomer components are polymerized, as long as they are appropriately set in accordance with common methods.

Commercial products of cycloolefin polymers that can be used as component (P2) include, for example, "TOPAS (trade name)" manufactured by POLYPLASTICS Co., Ltd., "APEL (trade name)" manufactured by Mitsui Chemicals Co., Ltd., "ZEONOR (trade name)" manufactured by ZEON Co., Ltd., "ZEONEX (trade name)" manufactured by ZEON Co., Ltd., "ARTON (trade name)" manufactured by JSR Co., Ltd., etc.

The content ratio of the cycloolefin polymer in the component (P) is preferably 0-50% by mass, more preferably 0-30% by mass relative to the total amount (100% by mass) of the component (P) It is 0-25% by mass, particularly preferably 0-20% by mass or less.

[Acrylic] (P2) The component may contain acrylic resin. Since the component (P2) contains acrylic resin, the adhesion between the support and the substrate can be further improved. Examples of acrylic resins include resins (homopolymers, copolymers) polymerized using (meth)acrylate as a monomer. The so-called "(meth)acrylic acid" means at least one of acrylic acid or methacrylic acid.

Examples of (meth)acrylates include alkyl (meth)acrylates having a chain structure, (meth)acrylates having an aliphatic ring, and (meth)acrylic acid having an aromatic ring. ester. Among these, it is preferable to use (meth)acrylate having an aliphatic ring.

As the (meth)acrylic acid alkyl ester having a chain structure, for example, an acrylic acid-based alkyl ester having an alkyl group having 1 to 20 carbon atoms can be cited. The alkyl group with 1-20 carbon atoms mentioned here may be linear or branched, such as methyl, ethyl, propyl, butyl, 2-ethylhexyl, isooctyl, iso Nonyl, isodecyl, dodecyl, lauryl, thirteen, pentadecyl, hexadecyl, seventeen, octadecyl (stearyl), nonadecyl, two The decayl group and the like are preferably acrylic acid-based alkyl esters having an alkyl group having 15 to 20 carbon atoms.

Examples of (meth)acrylates having an aliphatic ring include cyclohexyl (meth)acrylate, cyclopentyl (meth)acrylate, 1-adamantyl (meth)acrylate, and (meth) Norbornyl acrylate, isobornyl (meth)acrylate, tricyclodecyl (meth)acrylate, tetracyclododecyl (meth)acrylate, dicyclopentyl (meth)acrylate, and the like. Among these, 1-adamantyl (meth)acrylate, isobornyl (meth)acrylate, and dicyclopentyl (meth)acrylate are preferable.

In (meth)acrylates having an aromatic ring, examples of the aromatic ring include phenyl, benzyl, tolyl, xylyl, biphenyl, naphthyl, anthryl, and phenoxy. Methyl, phenoxyethyl, etc. This aromatic ring may have a substituent, and may have a linear or branched alkyl group having 1 to 5 carbon atoms.

Among acrylic resins, the above-mentioned (meth)acrylates may be used singly or in combination of two or more kinds.

The acrylic resin is preferably selected from the group consisting of alkyl (meth)acrylate having a chain structure, (meth)acrylate having an aliphatic ring, and (meth)acrylate having an aromatic ring Group of one or more resins formed by polymerization. Among them, a resin obtained by polymerizing an alkyl (meth)acrylate and a (meth)acrylate having an aliphatic ring is more preferred.

The acrylic resin may be a resin formed by polymerizing a (meth)acrylate monomer and other monomers that can be polymerized. Examples of the polymerizable monomer include styrene, styrene derivatives, and maleimide group-containing monomers. The styrene derivative here is the same as the above-mentioned "styrene derivative". The maleimide group-containing monomer here includes the same monomers from which the above-mentioned structural unit (u21) is derived.

In addition, among acrylic resins, a resin obtained by polymerizing a (meth)acrylate monomer and styrene is preferable. Since the acrylic resin has styrene units, the heat resistance of the acrylic resin increases. In addition, the compatibility with other resins and the solubility in hydrocarbon solvents are improved. Among them, the acrylic resin is particularly preferably a resin obtained by polymerizing an alkyl (meth)acrylate having a chain structure, a (meth)acrylate having an aliphatic ring, and styrene.

The solubility parameter (SP value) of the acrylic resin is preferably 6 or more and 10 or less, more preferably 6.5 or more and 9.5 or less. Since the SP value is within the aforementioned preferred range, the compatibility of the acrylic resin with other resins is improved, and a more stable adhesive composition can be easily obtained.

The weight average molecular weight of the acrylic resin is preferably 2,000 to 100,000, more preferably 5,000 to 50,000. Since the weight average molecular weight of the acrylic resin is within the aforementioned preferred range, for example, an adhesive composition having thermal fluidity suitable for bonding the substrate and the support can be easily provided.

Acrylic resin can also be used in combination of 2 or more types. The content ratio of the acrylic resin occupied in the component (P) can be set to 0-50% by mass relative to the total amount (100% by mass) of the component (P), preferably 0-30% by mass, more preferably 0-25% by mass, more preferably 0-20% by mass or less, particularly preferably 0-10% by mass.

[Curing monomer] (P2) The component may contain a curable monomer. Since the component (P2) contains a curable monomer, the heat resistance of the adhesive layer can be further improved. The curable monomer is preferably a monomer that is polymerized by radical polymerization, and typically includes a multifunctional curable monomer, and particularly preferably a multifunctional (meth)acrylate monomer.

Examples of polyfunctional (meth)acrylate monomers include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, and tetraethylene glycol di(meth) Acrylate, propylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexane Glycol di(meth)acrylate, 1,4-cyclohexanedimethanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, 9,9-bis[4-( 2-(Meth)acryloyloxyethoxy)phenyl)Phen, propoxylated bisphenol A di(meth)acrylate, 1,3-adamantanediol di(meth)acrylate, 5-hydroxy-1,3-adamantanediol di(meth)acrylate, 1,3,5-adamantanetriol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate , Glycerol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol six (Meth)acrylate, 2-hydroxy-3-(meth)acryloxypropyl (meth)acrylate, ethylene glycol diglycidyl ether di(meth)acrylate, diethylenedi Alcohol diglycidyl ether di(meth)acrylate, diglycidyl phthalate di(meth)acrylate, glycerol tri(meth)acrylate, glycerol polyglycidyl ether (Meth)acrylate, urethane (meth)acrylate (ie, toluene diisocyanate), trimethylhexamethylene diisocyanate and hexamethylene diisocyanate and base (meth)acrylic acid 2 -Reactants of hydroxyethyl ester, etc.

These polyfunctional (meth)acrylates may be used individually by 1 type, and may be used in combination of 2 or more types. The sclerosing monomer preferably includes a cyclic structure, and more preferably includes a polycyclic aliphatic structure. Since the curable monomer contains preferably a cyclic structure, more preferably a polycyclic aliphatic structure, the compatibility with the cycloolefin polymer can be further improved. In addition, by polymerizing the curable monomer used in combination with the cycloolefin polymer, the heat resistance of the adhesive layer can be further improved.

Among the curable monomers, (meth)acrylate monomers having a cyclic group are particularly preferred, and more preferred are selected from the group consisting of tricyclodecane dimethanol di(meth)acrylate and 1,3-adamantine Alkylene glycol di(meth)acrylate, 5-hydroxy-1,3-adamantanediol di(meth)acrylate, 1,3,5-adamantantriol tri(meth)acrylate, 1 ,4-Cyclohexanedimethanol bis(meth)acrylate, 9,9-bis[4-(2-(meth)propenyloxyethoxy)phenyl]sulfonate and propoxylated bisphenol At least one of the group of A di(meth)acrylate, particularly preferably tricyclodecane dimethanol di(meth)acrylate.

The content ratio of the curable monomer in the component (P) is preferably 0-20% by mass, more preferably 0-15% by mass relative to the total amount (100% by mass) of the component (P).

In the adhesive composition of this embodiment, the content of the (P) component may be adjusted according to the thickness of the adhesive layer to be formed, the type of each resin, and the like.

＜Optional ingredients＞ The adhesive composition of this embodiment may further contain components (optional components) other than the above-mentioned (P) component. Examples of this optional component include the following polymerization inhibitors, polymerization initiators, solvent components, plasticizers, adhesive adjuvants, stabilizers, colorants, surfactants, and the like.

≪Polymerization inhibitor≫ The adhesive composition of this embodiment may further contain a polymerization inhibitor. The polymerization inhibitor refers to a component that has the function of preventing free radical polymerization caused by heat or light. The polymerization inhibitor system shows high reactivity to free radicals. Therefore, for example, when a cycloolefin polymer is used as the component (P2), the reaction system between the polymerization inhibitor and the radical proceeds more preferentially than the reaction between the cycloolefin polymer and the radical, and the cycloolefin polymer is prevented from polymerizing with each other. Thereby, the adhesive layer formed by heating improves the chemical resistance of the adhesive layer.

As the polymerization inhibitor, those having a phenol skeleton are preferred. For example, in the polymerization inhibitor, hindered phenol-based antioxidants can be used, such as gallic phenol, benzoquinone, hydroquinone, methylene blue, tert-butylcatechol, monobenzyl ether, methylhydroquinone, pentanol Quinone, pentoxyhydroquinone, n-butylphenol, phenol, hydroquinone monopropyl ether, 4,4'-(1-methylethylene)bis(2-methylphenol), 4,4'- (1-methylethylene)bis(2,6-dimethylphenol), 4,4'-[1-[4-(1-(4-hydroxyphenyl)-1-methylethyl) Phenyl]ethylene]bisphenol, 4,4',4"-ethylene ginseng (2-methylphenol), 4,4',4"-ethylenetriphenol, 1,1,3- Ginseng (2,5-dimethyl-4-hydroxyphenyl)-3-phenylpropane, 2,6-di-tert-butyl-4-methylphenol, 2,2'-methylenebis(4 -Methyl-6-tertiary butylphenol), 4,4'-butylene bis(3-methyl-6-tertiary butylphenol), 4,4'-thiobis(3-methyl- 6-tert-butylphenol), 3,9-bis[2-(3-(3-tert-butyl-4-hydroxy-5-methylphenyl)-propionyloxy)-1,1- Dimethylethyl)-2,4,8,10-tetraoxaspiro(5,5)undecane, triethylene glycol-bis-3-(3-tertiarybutyl-4-hydroxy-5 -Methylphenyl) propionate, n-octyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate, pentaerythritol tetrakis[3-(3,5-di-third Butyl-4-hydroxyphenyl)propionate] (trade name IRGANOX 1010, manufactured by BASF), ginseng (3,5-di-tert-butylhydroxybenzyl) isocyanurate, thiodiethylene Base bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] and the like.

A polymerization inhibitor may be used individually by 1 type, and may be used in combination of 2 or more types. The content of the polymerization inhibitor may be appropriately determined according to the type of resin component, the application of the adhesive composition and the use environment, for example, it is preferably 0.1-10 parts by mass relative to 100 parts by mass of the (P) component. As long as the content of the polymerization inhibitor is within the above-mentioned preferred range, the effect of inhibiting polymerization can be exhibited well, and the chemical resistance of the adhesive layer can be improved even after high-temperature processing.

≪Polymerization initiator≫ The adhesive composition of this embodiment may further contain a polymerization initiator. The polymerization initiator refers to a component having a function of accelerating the polymerization reaction of the above-mentioned curable monomer. Examples of the polymerization initiator include thermal polymerization initiators, photopolymerization initiators, and the like. Examples of the thermal polymerization initiator include peroxides and azo polymerization initiators.

Examples of peroxides in the thermal polymerization initiator include ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, peroxyesters, and the like. Specific examples of such peroxides include acetyl peroxide, dicumyl peroxide, t-butyl peroxide, t-butyl cumyl peroxide, and propylene peroxide. Base, benzyl peroxide (BPO), 2-chlorobenzyl peroxide, 3-chlorobenzyl peroxide, 4-chlorobenzyl peroxide, 2,4-dichloro peroxide Benzoyl, 4-bromomethylbenzyl peroxide, lauryl peroxide, potassium persulfate, diisopropyl peroxycarbonate, tetralin hydroperoxide, 1-phenyl-2- Methyl propyl-1-hydroperoxide, tert-butyl pertriphenylacetate, tertiary butyl hydroperoxide, tertiary butyl performate, tertiary butyl peracetate, tertiary perbenzoic acid Butyl ester, tertiary butyl perphenylacetate, tertiary butyl per-4-methoxyacetate, tertiary butyl per N-(3-tolyl)carbamate, etc.

Among the aforementioned peroxides, for example, the product name "Percumyl (registered trademark)", the product name "Perbutyl (registered trademark)", the product name "Peroyl (registered trademark)" and the product name " Perocta (registered trademark)" and other commercial vendors.

As the azo polymerization initiator in the thermal polymerization initiator, for example, 2,2'-azobispropane, 2,2'-dichloro-2,2'-azobispropane, 1, 1'-Azo(methylethyl)diacetate, 2,2'-Azobis(2-carboxamidinopropane) hydrochloride, 2,2'-Azobis(2-aminopropane) ) Nitrate, 2,2'-azobisisobutane, 2,2'-azobisisobutylamide, 2,2'-azobisisobutyronitrile, 2,2'-azobis Methyl-2-methylpropionate, 2,2'-dichloro-2,2'-azobisbutane, 2,2'-azobis-2-methylbutyronitrile, 2,2'- Dimethyl azobisisobutyrate, 1,1'-azobis(1-methylbutyronitrile-3-sulfonate sodium), 2-(4-methylphenylazo)-2-methyl Malononitrile 4,4'-azobis-4-cyanovaleric acid, 3,5-dihydroxymethylphenylazo-2-allylmalononitrile, 2,2'-azobis- 2-methylvaleronitrile, 4,4'-azobis-4-cyanovaleric acid dimethyl ester, 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'- Azobicyclohexanenitrile, 2,2'-azobis-2-propylbutyronitrile, 1,1'-azobicyclohexanenitrile, 2,2'-azobis-2-propylbutyronitrile , 1,1'-azobis-1-chlorophenylethane, 1,1'-azobis-1-cyclohexanecarbonitrile, 1,1'-azobis-1-cycloheptane nitrile , 1,1'-azobis-1-phenylethane, 1,1'-azobismethane, 4-nitrophenylazobenzyl cyanoacetate, phenylazobisphenyl Methane, phenylazotriphenylmethane, 4-nitrophenylazotriphenylmethane, 1,1'-azobis-1,2-diphenylethane, poly(bisphenol A-4 ,4'-Azobis-4-cyanovalerate), poly(tetraethylene glycol-2,2'-azobisisobutyrate), etc.

As the photopolymerization initiator, for example, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, 1-[4-(2-hydroxyethoxy (Yl)phenyl)-2-hydroxy-2-methyl-1-propane-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane-1-one, 1 -(4-Dodecylphenyl)-2-hydroxy-2-methylpropane-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one, bis( 4-dimethylaminophenyl) ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1-one, 2-benzyl-2-di Methylamino-1-(4-morpholinylphenyl)-butan-1-one, ethyl ketone 1-[9-ethyl-6-(2-methylbenzyl)-9H-carb (Azol-3-yl)-1-(o-acetyloxime), 2,4,6-trimethylbenzyldiphenylphosphine oxide, 4-benzyl-4'-methylbis Methyl sulfide, 4-dimethylaminobenzoic acid, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, butyl 4-dimethylaminobenzoate , 4-Dimethylamino-2-ethylhexylbenzoic acid, 4-dimethylamino-2-isopentylbenzoic acid, benzyl-β-methoxyethyl acetal, benzyldimethyl Ketal, 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime, methyl phthalate, 2,4-diethylthioxanthone, 2 -Chlorothioxanthone, 2,4-Dimethylthioxanthone, 1-chloro-4-propoxythioxanthone, thioxanthone, 2-chlorothioxanthone, 2,4-Diethylthioxanthone, 2 -Methylthioxanthene, 2-isopropylthioxanthene, 2-ethylanthraquinone, octamethylanthraquinone, 1,2-benzoanthraquinone, 2,3-diphenylanthraquinone, azobisiso Butyronitrile, benzyl peroxide, cumene peroxide, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole, 2-(o-chlorophenyl)-4 ,5-Diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis(methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5- Diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenylimidazole Dimer, 2,4,5-triaryl imidazole dimer, diphenyl ketone, 2-chlorodiphenyl ketone, 4,4'-bis dimethylamino diphenyl ketone (ie, Miqi Ketone), 4,4'-bisdiethylamino diphenyl ketone (ie, ethyl Michel ketone), 4,4'-dichlorodiphenyl ketone, 3,3-dimethyl- 4-Methoxy diphenyl ketone, diphenyl ethylene dione, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, Benzoin isobutyl ether, benzoin tertiary butyl ether, acetophenone, 2,2-diethoxyacetophenone, p-dimethyl acetophenone, p-dimethylaminopropiophenone, Dichloroacetophenone, trichloroacetophenone, p-tert-butylacetophenone, p-dimethylaminoacetophenone, p-tert-butyl trichloroacetophenone, p-tert-butyl dichlorobenzene Ethyl ketone, α,α-dichloro -4-phenoxyacetophenone, thioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, dibenzocycloheptanone, pentyl-4-dimethylaminobenzyl Ester, 9-phenylacridine, 1,7-bis-(9-acridinyl)heptane, 1,5-bis-(9-acridinyl)pentane, 1,3-bis-(9 -Acridinyl)propane, p-methoxytris, 2,4,6-ginseng (trichloromethyl)-s-tris, 2-methyl-4,6-bis(trichloromethyl)- s-tris, 2-[2-(5-methylfuran-2-yl)vinyl]-4,6-bis(trichloromethyl)-s-tris, 2-[2-(furan- 2-yl)vinyl]-4,6-bis(trichloromethyl)-s-tris, 2-[2-(4-diethylamino-2-methylphenyl)vinyl]- 4,6-bis(trichloromethyl)-s-tris, 2-[2-(3,4-dimethoxyphenyl)vinyl]-4,6-bis(trichloromethyl)- s-tris, 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-s-tris, 2-(4-ethoxystyryl)-4,6 -Bis(trichloromethyl)-s-tris, 2-(4-n-butoxyphenyl)-4,6-bis(trichloromethyl)-s-tris, 2,4-bis- Trichloromethyl-6-(3-bromo-4-methoxy)phenyl-s-tris, 2,4-bis-trichloromethyl-6-(2-bromo-4-methoxy) Phenyl-s-tris, 2,4-bis-trichloromethyl-6-(3-bromo-4-methoxy)styrylphenyl-s-tris, 2,4-bis-tris Chloromethyl-6-(2-bromo-4-methoxy)styrylphenyl-s-tri𠯤 and so on.

Among the aforementioned photopolymerization initiators, for example, "IRGACURE OXE02", "IRGACURE OXE01", "IRGACURE 369", "IRGACURE 651", "IRGACURE 907" (all trade names, manufactured by BASF) and "NCI- 831" (trade name, manufactured by ADEKA Co., Ltd.), etc.

A polymerization initiator may be used individually by 1 type, and may be used in combination of 2 or more types. As the polymerization initiator, a thermal polymerization initiator is preferred, and a peroxide is more preferred. The polymerization initiator is preferably used in combination with a curable monomer. The usage amount of this polymerization initiator is preferably adjusted according to the usage amount of the curable monomer. For example, in the adhesive composition of this embodiment, the content ratio of the polymerization initiator is preferably 0.1-10 parts by mass, more preferably 0.5-5 parts by mass relative to 100 parts by mass of the curable monomer.

≪Solvent composition≫ The adhesive composition system of this embodiment can be prepared by dissolving the (P) component and optional components as needed in the solvent component. Among the solvent components, for example, those capable of dissolving each component for the adhesive composition into a uniform solution may be used, and may be used singly or in combination of two or more kinds.

Examples of solvent components include hydrocarbon solvents and petroleum solvents. In addition, the hydrocarbon solvent and the petroleum solvent are also collectively referred to as "(S1) component" below. Solvent components other than the (S1) component are also referred to as "(S2) components".

Examples of hydrocarbon solvents include linear, branched, or cyclic hydrocarbons, such as hexane, heptane, octane, nonane, methyl octane, decane, undecane, and dodecane. , Tridecane and other straight chain hydrocarbons; isooctane, isononane, isododecane and other branched chain hydrocarbons; p-menthane, o-menthane, m-menthane, diphenyl menthane, 1, 4-terpine, 1,8-terpine, campane, norbornane, pinane, thumberane, carane, phyllene, α-terpinene, β-terpinene, γ-terpinene , Α-pinene, β-pinene, α-thujone, β-thujone, cyclohexane, cycloheptane, cyclooctane, indene, pentene, indane, tetrahydroindene, naphthalene, Cyclic hydrocarbons such as tetralin and decalin.

The petroleum-based solvent is a solvent purified from heavy oil, and examples thereof include kerosene, paraffin-based solvents, and isoparaffin-based solvents.

In addition, as the component (S2), terpene solvents having polar groups such as an oxygen atom, a carbonyl group, or an acetoxy group can be cited. Examples include geraniol, nerol, linalol, citral, and citronella. Alcohol, menthol, isomenthol, neomenthol, α-terpineol, β-terpineol, γ-terpineol, terpinen-1-ol, terpinen-4-ol, dihydroacetic acid Terpineol, 1,4-cineole, 1,8-cineole, camphor, carvone, ionone, thujone, camphor, etc.

Also, as the (S2) component, lactones such as γ-butyrolactone; acetone, methyl ethyl ketone, cyclohexanone (CH), methyl n-pentyl ketone, methyl isopentyl Ketones such as ketones and 2-heptanone; polyols such as ethylene glycol, diethylene glycol, propylene glycol, and dipropylene glycol; ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoethyl Among the compounds having ester bonds such as acid esters or dipropylene glycol monoacetate, the monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether, etc. of the aforementioned polyols or the aforementioned compounds having ester bonds Derivatives of polyols such as compounds having ether bonds such as monoalkyl ethers or monophenyl ethers (among these, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl Ether (PGME)); cyclic ethers such as dioxane; methyl lactate, ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate, methoxypropyl Esters such as methyl ester, ethyl ethoxypropionate, etc.; anisole, ethyl benzyl ether, cresolyl methyl ether, diphenyl ether, dibenzyl ether, phenyl ethyl ether, butyl phenyl Aromatic organic solvents such as ethers.

The content of the solvent component in the adhesive composition of this embodiment may be appropriately adjusted according to the thickness of the adhesive layer to be formed. For example, it is preferably 20 relative to the total amount (100% by mass) of the adhesive composition. ~90% by mass. That is, the concentration of the solid content of the adhesive composition system of the present embodiment (the total amount of compounding components other than the solvent component) is preferably in the range of 10 to 80% by mass. If the content of the solvent component is within the aforementioned preferable range, the viscosity adjustment becomes easier.

The adhesive composition system of this embodiment can be prepared by mixing other components in a solvent component, and dissolving or dispersing them. Among the solvent components, from the viewpoint of the solubility of the component (P), it is preferable to use a solvent containing a hydrocarbon, and it is more preferable to use a solvent containing a branched hydrocarbon or a cyclic hydrocarbon. Since the solvent component contains a branched or cyclic hydrocarbon solvent, it is easy to prevent clouding that may occur when the adhesive composition is stored in a liquid state (especially at a low temperature), and the storage stability can be further improved.

Moreover, among the solvent components, it is preferable to use one containing a condensed polycyclic hydrocarbon or a branched hydrocarbon as a hydrocarbon solvent. In this case, the solvent component may be selected only from the group consisting of condensed polycyclic hydrocarbons and branched hydrocarbons, and may also include other components such as saturated aliphatic hydrocarbons, for example. The content of the solvent component selected from the group consisting of condensed polycyclic hydrocarbons and branched hydrocarbons is preferably 40 parts by mass or more, more preferably 60 parts by mass or more relative to 100 parts by mass of the entire hydrocarbon solvent , Particularly preferably at least 80 parts by mass. If it is 40 parts by mass or more of the entire hydrocarbon solvent, the solubility of the component (P) will change well.

When a polymerization initiator is used, the polymerization initiator may be blended by a well-known method immediately before using the adhesive composition. In addition, the polymerization initiator or polymerization inhibitor may be blended in the form of a solution dissolved in the above-mentioned (S2) component in advance. The amount of (S2) component used may be appropriately adjusted according to the type of polymerization initiator or polymerization inhibitor, etc., for example, relative to 100 parts by mass of (S1) component, preferably 1-50 parts by mass, more preferably 5 ~30 parts by mass. If the amount of (S2) component used is within the aforementioned preferred range, the polymerization initiator or polymerization inhibitor can be sufficiently dissolved.

In the adhesive composition of the present embodiment described above, since the component (P) contains the component (P1), it is possible to form an adhesive layer with high heat resistance and improved adhesion to the substrate. Thereby, the adhesive layer formed by the adhesive composition of the present embodiment is less likely to cause positional deviation of the substrate before and after the sealing operation due to the influence of high-temperature processing during the manufacturing of the semiconductor package.

Furthermore, the adhesive layer formed by the adhesive composition of this embodiment has high gas barrier properties and can be used as a gas barrier layer. When a resin-containing sealing substrate is used, the moisture in the resin vaporizes to generate gas. For example, as shown in FIG. 6A, when a conventional adhesive composition (for example, an elastic system adhesive) is used to bond the support 12 and the sealing substrate 5, the adhesive layer 3'formed by the adhesive composition cannot The migration of gas from the sealing substrate 5 is suppressed, and voids (bubbles) are generated between the sealing substrate 5 and the support 12. The void is a cause of peeling between the sealing substrate 5 and the support 12. On the other hand, the adhesive layer formed by the adhesive composition of the present embodiment has high gas barrier properties and good adhesion to the sealing substrate 5, so it can effectively block the gas generated from the sealing substrate 5. Therefore, as shown in FIG. 6B, by forming the adhesive layer 3 including the first adhesive composition layer 3-1 formed of the adhesive composition of this embodiment between the sealing substrate 5 and the support 12, 1 Adhesive composition layer 3-1 can serve as a gas barrier layer to suppress the occurrence of voids. The adhesive composition system of this embodiment may be used alone or in combination with other adhesive compositions (adhesive compositions not containing the (P1) component). Other adhesive compositions can be used to form the second adhesive composition layer 3-2, and form the adhesive layer 3 formed by the first adhesive composition layer 3-1 and the second adhesive composition layer 3-2. When used in combination with other adhesive compositions, as shown in FIG. 6B, it is preferable to form a sealing substrate 5, a first adhesive bonding layer 3-1, a second adhesive bonding layer 3-2, and a support layer sequentially laminated 12 of the layered body. By arranging the sealing substrate 5 and the first adhesive bonding layer 3-1 adjacent to each other, the first adhesive bonding layer 3-1 becomes a gas barrier layer, and the generation of voids from the sealing substrate 5 can be effectively suppressed.

Furthermore, the adhesive layer formed by the adhesive composition of the present embodiment can be used as a protective layer because it is less prone to position shift. For example, in order to form a rewiring layer, a thin film is formed on the adhesive layer. Fig. 7A shows an example in which a conventional adhesive composition is used, an adhesive layer 3'is formed on the support 12, and a thin film 6 is formed on the adhesive layer 3'. At this time, if the heat resistance of the adhesive layer 3'is low, the adhesive layer 3'may flow due to the high-temperature treatment, and cracks or wrinkles may occur in the film 6. On the other hand, the adhesive layer formed by this embodiment has high heat resistance and is not easy to flow due to high-temperature processing. Therefore, as shown in FIG. 7B, by forming the adhesive layer 3 including the first adhesive composition layer 3-1 formed of the adhesive composition of this embodiment between the support 12 and the film 6, the first The adhesive composition layer 3-1 can serve as a protective layer to prevent cracks or wrinkles in the film 6 from occurring. Furthermore, since the first adhesive composition layer has high adhesion to the film 6, peeling of the film 6 does not easily occur. The adhesive composition of this embodiment may be used alone or in combination with other adhesive compositions. Other adhesive compositions can be used to form the second adhesive composition layer 3-2, and the adhesive layer 3 formed by the first adhesive composition layer 3-1 and the second adhesive composition layer 3-2 is formed. When used in combination with other adhesives, as shown in FIG. 7B, it is preferable to form a support 12, a second adhesive composition layer 3-2, a first adhesive composition layer 3-1, and a film 6 laminated in this order. The multi-layered body. By arranging the film 6 adjacent to the adhesive layer 3-1, the first adhesive composition layer 3-1 becomes a protective layer, and cracks, wrinkles, peeling, and the like of the film 6 can be effectively suppressed.

Also, for example, die bonding is performed on bump substrates. FIG. 8A is an example in which a conventional adhesive composition is used, the support 12 and the bump substrate 4 are bonded together, and die bonding is performed on the bump substrate 4. At this time, if the heat resistance of the adhesive layer 3'formed by the conventional adhesive composition is low, the adhesive layer 3'sinks and the bump contacts the support 12 during die bonding, and the bump deforms. On the other hand, the adhesive layer formed by this embodiment has high heat resistance and is less likely to re-sink of the sticky crystal. Therefore, as shown in FIG. 8B, by forming the adhesive layer 3 including the first adhesive composition layer 3-1 formed of the adhesive composition of this embodiment between the support 12 and the bump substrate 4, The first adhesive composition layer 3-1 serves as a protective layer and can suppress contact between the bumps and the support 12 during die bonding. Furthermore, since the first adhesive composition layer 3-1 has high adhesion to the bump substrate 4, peeling of the bump substrate 4 is unlikely to occur. The adhesive composition of this embodiment may be used alone or in combination with other adhesive compositions. Other adhesive compositions can be used to form the second adhesive composition layer 3-2, and form the adhesive layer 3 formed by the first adhesive composition layer 3-1 and the second adhesive composition layer 3-2. When used in combination with other adhesive compositions, as shown in FIG. 8B, it is preferable to form a support 12, a second adhesive composition layer 3-2, a first adhesive composition layer 3-1, and Laminated body of bump substrate 4. By arranging the bump substrate 4 adjacent to the first adhesive composition layer 3-1, the first adhesive composition layer 3-1 becomes a gas barrier layer, which can effectively suppress the bump substrate from sinking.

In the foregoing, examples of other adhesive compositions include elastic system adhesive compositions, cycloolefin-based adhesive compositions, maleimide-based adhesive compositions, and the like.

In FIGS. 6 to 8, the support 12 may be composed of a light-transmitting support base and a separation layer provided on the aforementioned support base.

(Layered body) The build-up system of the second aspect of the present invention bonds the support and the substrate through the adhesive layer. As shown in FIG. 1, the laminate 10 of this embodiment is one in which the support 12 and the substrate 4 are bonded through the adhesive layer 3, that is, the support 123 provided with the adhesive layer and the support 123 provided in the adhesive layer Next, the substrate 4 is arranged on the surface 3s of the layer 3 opposite to the support 12 side.

＜Support body＞ The support 12 in FIG. 1 includes a support base 1 and a separation layer 2 provided on the support base 1.

≪Support base body≫ The support matrix has the characteristics of light transmission. The support base system supports the components of the substrate and is attached to the substrate through the adhesive layer. Therefore, as a support base, it is preferable to have the necessary strength to prevent damage or deformation of the substrate during the thinning of the sealing body, the transportation of the substrate, the mounting to the substrate, and the like. In addition, the support base is preferably one that penetrates light of a wavelength that can change the quality of the separation layer. As the material of the support base, for example, glass, silicon, acrylic resin, etc. can be used. As the shape of the support base, for example, a rectangle, a circle, etc. can be given, but it is not limited thereto. In addition, as the support base, in order to further increase the density of the integration or increase the production efficiency, a large-scale panel having a rectangular shape in plan view by increasing the size of the circular support base can also be used.

≪Separation layer≫ The separation layer is adjacent to the adhesive layer, and is altered by light irradiation, and the layer of the support base can be separated from the substrate attached to the support. This separation layer can be formed using the composition for forming a separation layer described later, for example, by firing the components contained in the composition for forming the separation layer, or by a chemical vapor deposition (CVD) method. The separation layer is appropriately degraded by absorbing the light irradiated through the support base. Furthermore, the separation layer is preferably formed only of a material that absorbs light, but within a range that does not impair the essential characteristics of the present invention, it may be a layer blended with a material that does not have a structure that absorbs light.

The "deterioration" of the separation layer refers to a state in which the separation layer can be destroyed by external force, or a phenomenon in which the adhesion of the layer in contact with the separation layer is reduced. The separation layer becomes brittle by absorbing light and loses its strength or adhesion before being irradiated by light. The deterioration of the separation layer is caused by the decomposition of the absorbed light energy, the change of the three-dimensional configuration, the dissociation of the functional group, and the like.

The thickness of the separation layer is preferably in the range of 0.05 μm or more and 50 μm or less, and more preferably in the range of 0.3 μm or more and 1 μm or less, for example. If the thickness of the separation layer is within the range of 0.05 μm or more and 50 μm or less, the separation layer can be altered as desired by irradiation of short-time light and low-energy light. In addition, the thickness of the separation layer is particularly preferably within a range of 1 μm or less from the viewpoint of productivity.

It is preferable that the surface of the separation layer on the side contacting the adhesive layer is flat (no unevenness is formed), so that the formation of the adhesive layer is easy, and the support base and the substrate are easily attached uniformly.

[Composition for Formation of Separation Layer] The composition for forming the separation layer of the material for forming the separation layer, for example, includes fluorocarbon, a polymer having a repeating unit containing a light-absorbing structure, an inorganic substance, a compound having an infrared-absorbing structure, and infrared Absorbents, reactive polysilsesquioxanes, or resin components with a phenol skeleton. In addition, the composition for forming a separation layer may also contain fillers, plasticizers, thermal acid generator components, photoacid generator components, organic solvent components, surfactants, sensitizers, components that can improve the separation of the support matrix, etc. As an optional ingredient.

・Fluorocarbon The separation layer system may contain fluorocarbon. The separation layer made of fluorocarbon is deteriorated by absorbing light, and as a result, it loses its strength or adhesiveness before being irradiated with light. Therefore, by slightly applying an external force (for example, lifting the support, etc.) to break the separation layer, the support and the substrate can be easily separated. The fluorocarbon system constituting the separation layer can be suitably formed into a film by the plasma CVD method. Fluorocarbon absorbs light with a wavelength within a specific range depending on its type. By irradiating the separation layer with light of a wavelength in the range absorbed by the fluorocarbon for the separation layer, the fluorocarbon can be appropriately modified. The light absorption rate of the separation layer is preferably 80% or more.

As the light irradiated to the separation layer, as long as the fluorocarbon can absorb the wavelength, for example _{, solid lasers such as YAG lasers, ruby lasers, glass lasers, YVO 4} lasers, LD lasers, fiber lasers, etc. are suitably used. Liquid lasers such as pigment lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers and other gas lasers, semiconductor lasers, free electron lasers, etc. laser light or non-laser light That's it. As the wavelength capable of modifying the fluorocarbon, for example, a wavelength in the range of 600 nm or less can be used.

・Polymers with repeating units containing light-absorbing structures The separation layer may also contain a polymer, which has a repeating unit including a light-absorbing structure. The polymer is irradiated by light and deteriorated. The structure having light absorption includes, for example, a substituted or unsubstituted benzene ring, a condensed ring, or a heterocyclic ring and an atomic group containing a conjugated π-electron system. A structure with light absorption, more specifically, a cardo structure, or a diphenyl ketone structure, a diphenyl sulfide structure, and a diphenyl sulfide structure existing in the side chain of the polymer (Biphenyl sulfide structure), diphenyl structure or diphenylamine structure. The above-mentioned light-absorbing structure can absorb light having a wavelength in a desired range according to its type. For example, the wavelength of light that can be absorbed by the light-absorbing structure is preferably in the range of 100 to 2000 nm, and more preferably in the range of 100 to 500 nm.

The above-mentioned light-absorbing structure can absorb light, for example, a high-pressure mercury lamp (wavelength 254nm or more, 436nm or less), KrF excimer laser (wavelength 248nm), ArF excimer laser (wavelength 193nm), F ₂ excimer Light emitted by laser (wavelength 157nm), XeCl laser (wavelength 308nm), XeF laser (wavelength 351nm) or solid UV laser (wavelength 355nm), or g-line (wavelength 436nm), h-line (wavelength 405nm) Or i-line (wavelength 365nm) and so on.

・The inorganic separation layer can also be composed of inorganic substances. The inorganic substance may be modified by absorbing light. For example, one or more types selected from the group consisting of metals, metal compounds, and carbon can be suitably used. The "metal compound" refers to a compound containing metal atoms, and examples thereof include metal oxides and metal nitrides. As such an inorganic substance, one or more types selected from the group consisting of gold, silver, copper, iron, nickel, aluminum, titanium, chromium, SiO ₂ , SiN, Si ₃ N _{4, TiN, and carbon can be cited.} Furthermore, the so-called carbon refers to the concept of allotropes that can also include carbon, such as diamonds, fullerenes, diamond-like carbon, carbon nanotubes, and so on. The above-mentioned inorganic substance absorbs light with a wavelength within a specific range according to its kind.

As the light irradiated to the separation layer made of inorganic substances, as long as the above-mentioned inorganic substances can absorb the wavelength, it is suitable to use YAG laser, ruby laser, glass laser, YVO ₄ laser, LD laser, fiber laser, etc. Liquid lasers such as solid lasers, pigment lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers and other gas lasers, semiconductor lasers, free electron lasers, etc. It can be illuminated or non-laser. The separation layer made of an inorganic substance can be formed on the support substrate by well-known techniques such as sputtering, chemical vapor deposition (CVD), plating, plasma CVD, spin coating, and the like.

・The compound separation layer with infrared absorbing structure can also contain compounds with infrared absorbing structure. This compound with an infrared-absorbing structure is deteriorated by absorbing infrared. Examples of compounds having infrared absorbing structures or compounds having such structures include alkanes and alkenes (vinyl, trans, cis, vinylidene, tri-substituted, tetra-substituted, conjugated, alkylene, cyclic) , Alkynes (monosubstituted, disubstituted), monocyclic aromatics (benzene, monosubstituted, disubstituted, trisubstituted), alcohols or phenols (free OH, intramolecular hydrogen bonds, intermolecular hydrogen bonds, saturated secondary, Saturated tertiary, unsaturated secondary, unsaturated tertiary), acetals, ketals, aliphatic ethers, aromatic ethers, vinyl ethers, ethylene oxide cyclic ethers, peroxide ethers, ketones, dialkylcarbonyl , Aromatic carbonyl, 1,3-diketone enol, o-hydroxyaryl ketone, dialkyl aldehyde, aromatic aldehyde, carboxylic acid (dimer, carboxylic anion), formate, acetate, Conjugated esters, non-conjugated esters, aromatic esters, lactones (β-, γ-, δ-), aliphatic acid chlorides, aromatic acid chlorides, acid anhydrides (conjugated, non-conjugated, cyclic, Acyclic), primary amine, secondary amine, internal amine, primary amine (aliphatic, aromatic), secondary amine (aliphatic, aromatic), tertiary amine (aliphatic, aromatic), Primary amine salt, secondary amine salt, tertiary amine salt, ammonium ion, aliphatic nitrile, aromatic nitrile, carbodiimide, aliphatic isonitrile, aromatic isonitrile, isocyanate, thiocyanate, aliphatic isocyanate Thiocyanate, aromatic isothiocyanate, aliphatic nitro compound, aromatic nitro compound, nitroamine, nitrosoamine, nitrate, nitrite, nitroso bond (aliphatic, aromatic Groups, monomers, dimers), sulfur compounds such as thiols or thiophenols or thiol acids, thiocarbonyl, sulphurous acid, sulphonate, sulfonate chloride, primary sulfonamide, secondary sulfonamide, sulfuric acid ester, Carbon-halogen bond, Si-A ¹ bond (A ¹ is H, C, O, or halogen), PA ² bond (A ² is H, C, or O), or Ti-O bond.

As the structure containing the above-mentioned carbon-halogen bond, for example, -CH ₂ Cl, -CH ₂ Br, -CH ₂ I, -CF ₂ -, -CF ₃ , -CH=CF ₂ , -CF=CF ₂ , Fluorinated aryl or aryl chloride, etc.

Examples of the structure containing the above-mentioned Si-A ¹ bond include SiH, SiH ₂ , SiH ₃ , Si-CH ₃ , Si-CH ₂ -, Si-C ₆ H ₅ , SiO-aliphatic, Si-OCH ₃ , Si-OCH ₂ CH ₃ , Si-OC ₆ H ₅ , Si-O-Si, Si-OH, SiF, SiF ₂ or SiF ₃ and so on. As the structure contains Si-A ^l bond, particularly preferably formed with a silicon or siloxane backbone sesquicarbonate silicon skeleton by alumoxane.

As the structure containing the PA ² bond, for example, PH, PH ₂ , P-CH ₃ , P-CH ₂ -, PC ₆ H ₅ , A ³ ₃ -PO (A ³ is an aliphatic group or an aromatic group) ), (A ⁴ O) ₃ -PO (A ⁴ is an alkyl group), P-OCH ₃ , P-OCH ₂ CH ₃ , P-OC ₆ H ₅ , POP, P-OH or O=P-OH, etc.

As the compound containing the aforementioned Ti-O bond, for example, (i) titanium tetraisopropoxide, titanium tetra-n-butoxide, titanium tetra-(2-ethylhexyloxy), or titanium isopropoxy octene Titanium alkoxide such as glycolate; (ii) Chelated titanium such as diisopropoxy, bis(acetylacetonate) titanium or propanedioxytitanium bis(ethyl acetylacetate); (iii) iC ₃ H ₇ O-[-Ti(OiC ₃ H ₇ ) ₂ -O-] _n -iC ₃ H ₇ or nC ₄ H ₉ O-[-Ti(OnC ₄ H ₉ ) ₂ -O-] _n -nC ₄ H ₉ and other titanium polymers; (iv) tri-n-butoxy titanium monostearate, titanium stearate, diisopropoxy titanium diisostearate or (2-n-butyl (V) Water-soluble titanium compounds such as di-n-butoxy and bis(triethanolamine) titanium. Among them, as a compound containing a Ti-O bond, di-n-butoxy·bis(triethanolamine) titanium (Ti(OC ₄ H ₉ ) ₂ [OC ₂ H ₄ N(C ₂ H ₄ OH)) is more preferable ₂ ] ₂ ).

The above-mentioned infrared absorbing structure is selected according to its type, and can absorb infrared light having a wavelength in a desired range. Specifically, the wavelength of the infrared ray that can be absorbed by the above-mentioned infrared absorbing structure is, for example, in the range of 1 to 20 μm, and can more suitably be absorbed in the range of 2 to 15 μm. Furthermore, when the above-mentioned structure is a Si-O bond, Si-C bond or Ti-O bond, it is preferably in the range of 9-11 μm.

Moreover, the wavelengths of infrared rays that can be absorbed by the above-mentioned structures can be easily understood by those skilled in the art. For example, as the absorption band of each structure, you can refer to the non-patent literature: SILVERSTEIN·BASSLER·MORRILL "Spectral Identification Method of Organic Compounds (5th Edition)-Combination of MS, IR, NMR, and UV -" (issued in 1992 ) Records on pages 146 to 151.

As a compound with an infrared absorbing structure used in the formation of the separation layer, among the compounds with the above-mentioned structure, there is nothing special as long as it is soluble in a solvent for coating and can be cured to form a cured layer. limited. However, in order to effectively change the quality of the compound in the separation layer and facilitate the separation of the support base and the substrate, it is preferable that the separation layer has a large infrared absorption, that is, the one that has a low infrared transmittance when the infrared rays are irradiated to the separation layer . Specifically, the infrared transmittance of the separation layer is preferably less than 90%, and the infrared transmittance is more preferably less than 80%.

・Infrared absorbing material The separation layer may also contain infrared absorbing substances. The infrared absorbing material may be modified by absorbing light. For example, carbon black, iron particles, or aluminum particles can be suitably used. Infrared-absorbing substances absorb light with a unique range of wavelengths according to their types. By irradiating light of a wavelength in the absorption range of the infrared absorbing substance used in the separation layer to the separation layer, the infrared absorbing substance can be appropriately changed in quality.

・Reactive polysilsesquioxane The separation layer can be formed by polymerizing reactive polysilsesquioxane. The separation layer formed by this has high chemical resistance and high heat resistance.

The so-called "reactive polysilsesquioxane" refers to a polysilsesquioxane having a silanol group at the end of the polysilsesquioxane skeleton or a functional group capable of forming a silanol group due to hydrolysis. By condensing the silanol groups or functional groups capable of forming silanol groups, they can be polymerized with each other. In addition, as long as the reactive polysilsesquioxane has a silanol group or a functional group that can form a silanol group, it can adopt a random structure, a cage structure, a trapezoidal structure, etc., which has the reactivity with a silsesquioxane skeleton. Polysilsesquioxane.

The siloxane content of the reactive polysilsesquioxane is preferably 70-99 mol%, more preferably 80-99 mol%. If the siloxane content of the reactive polysilsesquioxane is within the above-mentioned preferred range, it can be formed that can be suitably deteriorated by irradiating infrared rays (preferably far infrared rays, more preferably light with a wavelength of 9 to 11 μm) Separation layer.

The weight average molecular weight (Mw) of the reactive polysilsesquioxane is preferably 500 to 50,000, more preferably 1,000 to 10,000. If the weight average molecular weight (Mw) of the reactive polysilsesquioxane is within the aforementioned preferred range, it can be appropriately dissolved in a solvent and can be suitably applied to a support plate.

Examples of commercially available products that can be used as reactive polysilsesquioxanes include SR-13, SR-21, SR-23 or SR-33 (trade name) manufactured by Konishi Chemical Industry Co., Ltd. .

・Resin component with phenol skeleton The separation layer may contain a resin component having a phenol skeleton. Since it has a phenolic skeleton, it is easily deteriorated (oxidized, etc.) by heating, etc., and has high photoreactivity. The term "having a phenol skeleton" as used here means that it contains a hydroxybenzene structure. The resin component having a phenol skeleton has film-forming ability, and the molecular weight is preferably 1,000 or more. Since the molecular weight of the resin component is 1000 or more, the film-forming ability increases. The molecular weight of the resin component is more preferably 1,000 to 30,000, particularly preferably 1,500 to 20,000, particularly preferably 2,000 to 15,000. Since the molecular weight of the resin component is below the upper limit of the above-mentioned preferred range, the solubility of the composition for forming a separation layer in the solvent can be improved. Furthermore, as the molecular weight of the resin component, the weight average molecular weight (Mw) in terms of polystyrene measured by GPC (gel permeation chromatography) was used.

As the resin component having a phenol skeleton, for example, novolak-type phenol resin, resol-type phenol resin, hydroxystyrene resin, hydroxyphenyl silsesquioxane resin, hydroxybenzyl silsesquioxane resin, containing Acrylic resin having a phenol skeleton, resin having a repeating unit represented by the general formula (P2) described later, and the like. Among these, novolac type phenol resin and resol type phenol resin.

＜Adhesive layer＞ The adhesive layer 3 is a layer for bonding the support 12 and the substrate 4, and can be formed using the adhesive composition of the first aspect.

The adhesive layer 3 includes a first adhesive composition layer formed using the adhesive composition of the first aspect. In addition, the adhesive layer 3 may include a second adhesive composition layer formed using another adhesive composition in addition to the aforementioned first adhesive composition layer. At this time, the first adhesive composition layer is preferably adjacent to the substrate 4. Since the first adhesive composition layer is arranged adjacent to the substrate 4, the adhesion between the adhesive layer 3 and the substrate 4 can be further improved. The adhesive composition forming the second adhesive composition layer is an adhesive composition containing no polymer (P1). The adhesive composition system is not particularly limited, but, for example, an elastic system adhesive composition, a cycloolefin-based adhesive composition, a maleimide-based adhesive composition, and the like can be mentioned.

When the adhesive layer 3 has a first adhesive composition layer and a second adhesive composition layer, the thickness of the first adhesive composition layer is, for example, preferably within a range of 0.1 μm or more and 50 μm or less, and more preferably 5 μm Within the range above and below 40 μm, more preferably within the range above 10 μm and below 30 μm, and particularly preferably within the range above 15 μm and below 25 μm. If the thickness of the first adhesive composition layer is more than the lower limit of the above-mentioned preferred range, the gas barrier performance or the protection performance of the substrate, etc. are further improved. In addition, since the thickness of the first adhesive composition layer is below the upper limit of the above-mentioned preferred range, the subsequent removal step is not hindered. When the adhesive layer 3 has a first adhesive composition layer and a second adhesive composition layer, the thickness of the second adhesive composition layer is, for example, preferably within a range of 0.1 μm or more and 100 μm or less, and more preferably 1 μm Within the range of above and below 50 μm, particularly preferably within the range of above 10 μm and below 40 μm. If the thickness of the second adhesive layer is within the aforementioned preferable range, the support and the substrate can be bonded more well.

When the adhesive layer 3 is composed of only the first adhesive composition layer, the thickness of the adhesive layer 3 is preferably within a range of 0.1 μm or more and 50 μm or less, and more preferably within a range of 1 μm or more and 10 μm or less. If the thickness of the adhesive layer 3 is within the range of 0.1 μm or more and 50 μm or less, the support base 1 and the substrate 4 can be bonded to each other more satisfactorily. In addition, since the thickness of the adhesive layer is 1 μm or more, the substrate can be sufficiently fixed to the support base, and since the thickness of the adhesive layer is 10 μm or less, the adhesive layer can be easily removed in the subsequent removal step.

＜Substrate＞ The substrate 4 is supported by the support 12 for thinning, mounting and other processes. On the substrate 4, for example, a structure such as an integrated circuit or a metal bump is mounted. As the substrate 4, a silicon wafer substrate is typically used, but it is not limited to this, and ceramic substrates, thin film substrates, flexible substrates, etc. may also be used.

In this embodiment, the device is a semiconductor device or other device, and may have a single-layer or multiple-layer structure. Furthermore, when the element is a semiconductor element, the electronic component obtained by cutting the sealing substrate becomes a semiconductor device.

Since the laminate of this embodiment is provided with an adhesive layer using the composition for forming an adhesive layer of the first aspect, it has high heat resistance and good adhesion to the substrate. As a result, during semiconductor packaging manufacturing, the position of the substrate before and after the sealing operation is unlikely to be shifted due to the influence of high temperature processing. Furthermore, the peeling of the substrate is unlikely to occur.

In the laminated body of the above-mentioned embodiment, the support base 1 and the separation layer 2 are adjacent to each other, but it is not limited to this, and another layer may be further formed between the support base 1 and the separation layer 2. In this case, the other layers may be made of light-transmitting materials. Therefore, the incidence of light into the separation layer 2 is not hindered, and a layer capable of providing better properties and the like can be added to the laminated body 10 as appropriate. Depending on the type of material constituting the separation layer 2, the wavelength of the usable light is different. Therefore, it is not necessary for the material constituting the other layer to transmit light of all wavelengths, and may be appropriately selected from materials that transmit light of a wavelength capable of deteriorating the material constituting the separation layer 2.

In other embodiments, the present invention may be a support for an adhesive layer. The support of the adhesive layer includes a support to which a substrate is bonded, and an adhesive layer formed on the support using the adhesive composition of the first aspect. The support body and the adhesive layer are the same as those described above.

Moreover, in other embodiments, the present invention may be a film with an adhesion layer. The film of the adhesive layer includes a film, and an adhesive layer formed on the film using the adhesive composition of the first aspect. By using this adhesive film, an adhesive layer can be suitably formed on the support. Compared with the case where the adhesive composition is directly coated on the support to form an adhesive layer, an adhesive layer with good film thickness uniformity and surface smoothness can be easily formed.

As the film, for example, the adhesive layer formed on the film can be easily peeled off from the film, and it is preferably a release film that can transfer the adhesive layer to the processed surface of a support or the like. Specific examples of the film include synthetic resin films such as polyethylene terephthalate, polyethylene, polypropylene, polycarbonate, or polyvinyl chloride, and films having flexibility are preferred. For the above-mentioned film, it is preferable to perform a mold release treatment as necessary to facilitate transfer. The thickness of the film may be appropriately set, for example, 15 to 125 μm.

Such an adhesive film can be manufactured by forming an adhesive layer on the film. The adhesive layer system is the same as the laminate of the aforementioned embodiment, and may include a first adhesive composition layer, or may include a first adhesive composition layer and a second adhesive composition layer. For example, a method of coating the adhesive composition on the film so that the dry film thickness of the adhesive layer becomes 10 to 1000 μm is used. At that time, a well-known method can be suitably used according to the desired film thickness or uniformity of the adhesive layer.

In addition, the adhesive film may be protected by covering the exposed surface of the adhesive layer with a protective film. The protective film is not limited as long as it can be peeled from the adhesive layer. For example, a polyethylene terephthalate film, a polypropylene film, and a polyethylene film are preferable. In addition, in order to be easily peeled from the adhesive layer, each protective film is preferably coated with silicone or burned.

The method of using the next film, for example, when using a protective film, after peeling it off, overlap the exposed adhesive layer on the surface of the support, and use the film (the backside of the surface where the adhesive layer is formed) A method in which the heating roller is moved and the adhesive layer is thermally compressed to the surface of the support. In addition, the protective film peeled from the adhesive film can be reused if it is wound into a roll on a roll such as a take-up roll in sequence.

(Method of manufacturing laminate) The third aspect of the present invention is a method of manufacturing a laminate in which a support body and a substrate are bonded through an adhesive layer, which has an adhesive layer forming step and a bonding step.

<The first embodiment> The manufacturing method of the laminated body of 1st Embodiment has the process of manufacturing a support body, an adhesive layer formation process, and a bonding process. Fig. 2 is a schematic step diagram illustrating an embodiment of a method of manufacturing a laminate. FIG. 2A is a diagram illustrating the steps of making the support, FIG. 2B is a diagram illustrating the subsequent layer forming steps, and FIG. 2C is a diagram illustrating the bonding step. In the manufacturing method of the laminated body of this embodiment, what contains fluorocarbon is used as the composition for separation layer formation. In addition, as the composition for forming an adhesive layer, an adhesive layer including the first adhesive composition layer was formed using a component containing the (P1) component of the first aspect.

≪Steps to make the support body≫ The step of making a support in the embodiment is a step of forming a separation layer using the composition for forming a separation layer on one side of the support base to obtain a support. In FIG. 2A, on the support base 1, the separation layer 2 is formed by the composition (containing fluorocarbon) for forming the separation layer (that is, the support base with the separation layer is produced).

The method of forming the separation layer 2 on the support substrate 1 is not particularly limited. Examples include spin coating, dipping, roll coating, spray coating, slit coating, chemical vapor growth (CVD), etc. . For example, in the step of making the support, the solvent component is removed from the coating layer of the separation layer forming composition coated on the support base 1 under a heating environment or a reduced pressure environment to form a film, or A film is formed on the support base 1 by a vapor deposition method to obtain a support.

≪Adhesive layer formation steps≫ The step of forming an adhesive layer in the embodiment is a step of forming an adhesive layer on one side of the support. The aforementioned adhesive layer includes a first adhesive composition layer formed using the composition for forming an adhesive layer of the first aspect. In FIG. 2B, on the surface of the separation layer 2 side of the support 12, an adhesive layer 3 including a first adhesive composition layer formed using the adhesive composition of the first aspect is formed (that is, an adhesive layer is produced的Support 123).

The method for forming the adhesive layer 3 on the support 12 is not particularly limited, and examples include methods such as spin coating, dipping, roll coating, spray coating, and slit coating. Then, on the support 12, the adhesive composition is applied and heated, or the solvent component contained in the adhesive composition is removed under a reduced pressure environment.

Then, when the adhesive layer contains a curable monomer and a thermal polymerization initiator, it is preferable to polymerize the curable monomer by heating. The conditions for heating the adhesive layer 3 may be appropriately set based on the 1-minute half-life temperature and the 1-hour half-life temperature of the thermal polymerization initiator. For example, it is preferably a temperature in the range of 50 to 300°C under vacuum Or under an inert gas environment such as nitrogen, more preferably under an inert gas environment.

In addition, when the adhesive layer contains a curable monomer and a photopolymerization initiator, it is preferable to polymerize the curable monomer by exposure to an inert gas atmosphere such as nitrogen. The conditions of exposure may be appropriately set according to the kind of photopolymerization initiator and the like.

The adhesive layer 3 may include a second adhesive composition layer formed using another adhesive composition. The other adhesive composition is an adhesive composition that does not contain the (P1) component. At this time, on the surface of the separation layer 2 side of the support 12, another adhesive composition is used to form the second adhesive composition layer, and then, on the second adhesive composition layer, the first form is used. Such an adhesive composition can form the first adhesive composition layer, and the adhesive layer 3 can be formed.

[Fitting Steps] The bonding step in the embodiment is a step of bonding the support and the substrate through the bonding layer formed in the bonding layer forming step. In FIG. 2C, the support base 1 (support 12) on which the separation layer 2 is formed and the substrate 4 on which the separation layer 2 is not formed are laminated through the adhesive layer 3 to obtain the support substrate 1, the separation layer 2, the adhesive layer 3, The laminated body 10 is stacked in order of the substrate 4.

The method of bonding the support 12 and the substrate 4 through the adhesive layer 3 is by arranging the substrate 4 at a designated position on the adhesive layer 3, and heating it under vacuum (for example, about 100°C) while using a die bonder The supporting body 12 and the substrate 4 are pressure-bonded and the like is performed.

According to the manufacturing method of the laminate of the first embodiment, since the adhesive layer including the first adhesive composition layer formed using the adhesive layer forming composition of the first aspect is provided, the heat resistance of the adhesive layer is high, and The adhesion of the substrate is good. Therefore, for example, before and after the sealing operation, the position of the substrate is not easily shifted, and the peeling of the substrate is not likely to occur.

In the manufacturing method of the laminated body of this embodiment described above, the separation layer 2 is formed on the support base 1, but the separation layer 2 is not limited to this, and the separation layer 2 may be formed on the substrate 4. In addition, the separation layer 2 can also be formed on the support base 1 and the substrate 4. In this case, the support base 1 and the substrate 4 are bonded through the separation layer 2, the adhesive layer 3 and the separation layer 2.

In the above-mentioned method of manufacturing a laminate of the present embodiment, the adhesive layer 3 is formed on the separation layer 2, but it is not limited to this, and the adhesive layer 3 may be formed on the substrate 4. When the adhesive layer 3 includes a second adhesive composition layer in addition to the first adhesive composition layer, the first adhesive composition is formed by using the first aspect of the adhesive composition on the substrate 4 Next, on the first adhesive composition layer, another adhesive composition is used for the second adhesive composition layer to form the adhesive layer 3.

<The second embodiment> Fig. 3 is a schematic step diagram illustrating another embodiment of the method of manufacturing a laminate. FIG. 3A is a diagram showing the laminate manufactured by the manufacturing method of the first embodiment, and FIG. 3B is a diagram illustrating the sealing step. The manufacturing method of the laminated body of this other embodiment further has a sealing step in addition to the step of manufacturing a support body, a subsequent layer formation step, and a bonding step.

[Sealing step] The sealing step in the embodiment is a step of sealing the substrate bonded to the support through the adhesive layer with a sealing material after the bonding step to produce a sealed body. In FIG. 3B, a sealing body 20 (laminated body) in which the entire substrate 4 arranged on the adhesive layer 3 is sealed with a sealing material is obtained.

In the sealing step, for example, a sealing material heated to 130~170°C is supplied to the adhesive layer 3 while maintaining a high viscosity while covering the substrate 4, and is formed on the adhesive layer 3 by compression molding The sealing body 20 (layered body) of the sealing material layer 5 is provided. At that time, the temperature condition was 130 to 170°C, for example. The pressure applied to the substrate 4 is, for example, 50 to 500 N/cm ² .

As the sealing material, for example, a composition containing epoxy resin or silicone resin can be used. It is preferable that the sealing material layer 5 is not provided on each substrate 4 but is provided in such a way as to cover all the substrate 4 on the adhesive layer 3.

According to the manufacturing method of the laminate of the second embodiment, since the adhesive layer forming composition of the above embodiment is used to provide the adhesive layer, the heat resistance can be further improved. For example, the substrate position shift is less likely to occur before and after the sealing operation. .

<The third embodiment> Fig. 4 is a schematic step diagram explaining another embodiment of the method of manufacturing a laminate. 4A is a diagram showing a sealing body manufactured by the manufacturing method of the second embodiment, FIG. 4B is a diagram illustrating a grinding step, and FIG. 4C is a diagram illustrating a rewiring forming step. The manufacturing method of the laminated body of this other embodiment further has a grinding step and a redistribution step in addition to the step of making the support body, the subsequent layer forming step, the bonding step, and the sealing step.

≪Grinding step≫ The grinding step in the embodiment is a grinding step in which the sealing material part (sealing material layer 5) in the sealing body 20 is ground after the aforementioned sealing step so that a part of the substrate 4 is exposed. The grinding of the sealing material portion is performed by grinding the sealing material layer 5 until the thickness is almost the same as that of the substrate 4 as shown in FIG. 4B, for example.

≪Rewiring forming step≫ The rewiring forming step in the embodiment is a step of forming the rewiring layer 6 on the exposed substrate 4 after the grinding step. The redistribution layer is also referred to as RDL (Redistribution Layer), and is a wiring body that constitutes a thin film that connects the wiring of the element, and may have a single-layer or multiple-layer structure. For example, the rewiring layer can be on a dielectric (silicon oxide (SiO _x ), photosensitive resin such as photosensitive epoxy resin, etc.), with conductors (aluminum, copper, titanium, nickel, gold, silver, etc.) Metal, silver-tin alloy, etc.) forming wiring, but not limited to this.

As a method of forming the rewiring layer 6, first _{, a dielectric layer of silicon oxide (SiO x} ), photosensitive resin, or the like is formed on the sealing material layer 5. The dielectric layer made of silicon oxide can be formed by, for example, a sputtering method, a vacuum evaporation method, or the like. The dielectric layer made of photosensitive resin can be formed by coating photosensitive resin on the sealing material layer 5 by a method such as spin coating, dipping, roll coating, spray coating, and slit coating, for example.

Next, on the dielectric layer, wiring is formed with a conductor such as metal. As a method of forming wiring, for example, well-known semiconductor processing techniques such as photolithography (resist lithography) and the like, etching treatment, and the like can be used. Examples of such lithography processing include lithography processing using a positive type resist material and lithography processing using a negative type resist material.

In this way, when performing photolithography processing and etching processing, the sealing body 20 (laminated body) is exposed to acids such as hydrofluoric acid, alkalis such as tetramethylammonium hydroxide (TMAH), or a resist for dissolving resist materials. In the solvent, it is processed at high temperature at the same time. However, by forming the adhesive layer including the first adhesive composition layer formed using the adhesive layer forming composition of the first aspect, the adhesive layer has high heat resistance. Therefore, the rewiring layer 6 can be suitably formed on the sealing material layer 5.

According to the manufacturing method of the laminate of the third embodiment, it is possible to stably manufacture the laminate in the order of the support base 1, the separation layer 2, the adhesive layer 3, the sealing material layer 5 covering the substrate 4, and the rewiring layer 6体30. The laminated body 30 is a laminated body produced in a process based on a fan-out technology in which the terminals provided on the substrate 4 are mounted on the rewiring layer 6 expanded to the outside of the wafer area.

In the method of manufacturing the laminate of this embodiment, bump formation or component mounting can be further performed on the rewiring layer 6. The mounting of the components on the rewiring layer 6 can be performed using, for example, a wafer mounter or the like.

(Method of manufacturing electronic parts) The manufacturing method of the electronic component according to the fourth aspect of the present invention has a separation step and a removal step after the multilayer body is obtained by the above-mentioned third aspect of the multilayer body manufacturing method.

Fig. 5 is a schematic step diagram illustrating an embodiment of a method of manufacturing a semiconductor package (electronic component). FIG. 5A is a diagram showing a laminate manufactured by the manufacturing method of the third embodiment, FIG. 5B is a diagram illustrating the separation step, and FIG. 5C is a diagram illustrating the removal step.

≪Separation step≫ The separation step in the embodiment is a step of irradiating the separation layer 2 with light (arrow) through the support substrate 1 to change the quality of the separation layer 2 to separate the support substrate 1 from the substrate 4 included in the laminate 30.

As shown in FIG. 5A, in the separation step, light (arrow) is irradiated to the separation layer 2 by passing through the support substrate 1, so that the separation layer 2 is deteriorated. As a wavelength which can change the quality of the separation layer 2, the range of 600 nm or less is mentioned, for example. The type and wavelength of the irradiated light can be appropriately selected according to the transmittance of the support substrate 1 and the material of the separation layer 2. For example, YAG laser, ruby laser, glass laser, YVO ₄ laser, LD laser can be used. , Fiber lasers and other solid lasers, pigment lasers and other liquid lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers and other gas lasers, semiconductor lasers, free electrons Laser light, non-laser light such as laser. Thereby, the quality of the separation layer 2 is changed, and the support base 1 and the substrate 4 can be brought into a state in which they can be easily separated.

When irradiating laser light, as an example of laser light irradiation conditions, the following conditions can be cited. The average output value of the laser light is preferably 1.0W or more and 5.0W or less, more preferably 3.0W or more and 4.0W or less. The repetition frequency of the laser light is preferably above 20 kHz and below 60 kHz, more preferably above 30 kHz and below 50 kHz. The scanning speed of the laser light is preferably above 100 mm/s and below 10000 mm/s.

After the separation layer 2 is irradiated with light (arrow) to change the quality of the separation layer 2, the support base 1 is separated from the substrate 4 as shown in FIG. 5B. For example, by applying force in a direction in which the support base 1 and the substrate 4 are separated from each other, the support base 1 and the substrate 4 are separated. Specifically, in a state where one of the support base 1 or the substrate 4 side (rewiring layer 6) is fixed to the stage, the other side is sucked and held while being lifted by a separation plate having an absorption pad such as a bellows pad As a result, the support base 1 and the substrate 4 can be separated. The force applied to the layered body 30 is not limited as long as it is appropriately adjusted according to the size of the layered body 30. For example, if it is a layered body with a diameter of about 300mm, a force of about 0.1~5kgf (0.98~49N) can be applied. , The support base 1 and the substrate 4 can be appropriately separated.

≪Removal procedure≫ The removal step in the embodiment is a step of removing the adhesive layer 3 attached to the substrate 4 after the aforementioned separation step. In FIG. 5B, after the separation step, the adhesive layer 3 and the separation layer 2 are attached to the substrate 4. In this embodiment, in the removing step, the adhesive layer 3 and the separation layer 2 attached to the substrate 4 are removed to obtain the electronic component 40.

As a method of removing the adhesive layer 3 and the like attached to the substrate 4, for example, a method of using a cleaning solution to remove residues of the adhesive layer 3 and the separation layer 2 can be cited. In the cleaning solution, it is advisable to use a cleaning solution containing organic solvents. As the organic solvent in this cleaning solution, it is preferable to use an organic solvent blended in the composition for forming a separation layer or a solvent component blended in the composition for forming an adhesive layer. The adhesive layer formed using the composition for forming an adhesive layer of the above-mentioned embodiment has improved solubility in a hydrocarbon-based solvent. Therefore, in the embodiment, the cleaning and removability of the adhesive layer is good.

In the method of manufacturing an electronic component of this embodiment, after the above-mentioned removal step, the electronic component 40 may be further subjected to processes such as solder ball formation, dicing, or oxide film formation.

(polymer) The polymer of the fifth aspect of the present invention has a structural unit (p1) represented by the following general formula (p1-1).

[式中，R^u11 ~R^u14 各自獨立地表示碳數1~30的有機基或氫原子；惟，R^u11 ~R^u14 之至少1個係含有烷氧基矽烷基的有機基；n為0~2之整數]。

[In the formula, R ^u11 ~ R ^u14 each independently represent an organic group with 1 to 30 carbon atoms or a hydrogen atom; ^{however , at least one of R u11} ~ R u14 is an organic group containing an alkoxysilyl group; n is 0 ~2 integer].

The polymer of this embodiment is the same polymer as the aforementioned polymer (P1).

＜Manufacturing of polymers＞ The polymer of this embodiment can be synthesized as follows, for example.

≪Aggregation step (process S1)≫ First, as a monomer, a monomer from which the constituent unit (p1) is derived is prepared. As said monomer, the monomer represented by the following general formula (p1-1m) is mentioned.

[式中，R^u11 ~R^u14 及n係與前述通式(p1-1)中的R^u11 ~R^u14 及n同樣]。

[Wherein, R ^u11 ~ R ^u14, and n R ^u11 ~ R ^u14 and n lines of the general formula (P1-1) is likewise].

When the polymer of this embodiment has other structural units in addition to the structural unit (p1), the monomers from which the other structural units are derived are also prepared. For example, when the polymer of this embodiment has the above-mentioned structural unit (p2), the cycloolefin monomer from which the structural unit (p2) is derived is prepared. In addition, when the polymer of this embodiment has the above-mentioned structural unit (p3), it is prepared to derive the monomer containing the maleimide skeleton of the structural unit (p3).

Next, each of the prepared monomers is added and polymerized to obtain a polymer. For example, by coordination polymerization, addition polymerization is performed.

In this embodiment, after dissolving the above-mentioned monomers and the organometallic catalyst in a solvent, the solution polymerization can be performed by heating for a predetermined time. At this time, the heating temperature can be set to 30°C to 120°C, for example. Moreover, the heating time can be set to 0.1 hour to 100 hours, for example. It is more preferable to perform solution polymerization after removing dissolved oxygen in the solvent by bubbling nitrogen or chlorine gas.

In the polymerization step, a molecular weight regulator, a chain transfer agent, etc. can be used as necessary. As the chain transfer agent, for example, alkylsilane compounds such as trimethylsilane, triethylsilane, and tributylsilane; and triethylaluminum, tributylaluminum, MAO (methylaluminoxane), etc. The organic aluminum and so on. The chain transfer agent system may be used individually by 1 type, and may be used in combination of 2 or more types.

As the solvent used in the polymerization reaction, for example, ketones such as methyl ethyl ketone (MEK); ethers such as propylene glycol monomethyl ether, diethyl ether, tetrahydrofuran (THF), etc.; toluene; ethyl acetate, acetic acid Esters such as butyl ester; and one or more of alcohols such as methanol, ethanol, and isopropanol.

As the aforementioned organometallic catalyst, it is not particularly limited as long as the addition polymerization proceeds. For example, a palladium complex or a nickel complex, such as a phosphine-based or diimine-based ligand, can be used as a cationic catalyst. Complexes and relative anions formed, etc. The organometallic catalyst system may be used individually by 1 type, and may use 2 or more types together. As the aforementioned palladium complexes, for example, (acetate-κ0) (acetonitrile) bis [reference (1-methylethyl) phosphine] palladium (I) tetra (2,3,4,5,6-penta (Fluorophenyl) borate, π-allyl palladium chloride dimer and other allyl palladium complexes; palladium acetate, propionate, maleate, naphthoate, etc. of palladium Organic carboxylate; palladium acetate triphenylphosphine complex, palladium acetate tris(m-tolyl)phosphine complex, palladium acetate tricyclohexylphosphine complex, etc. Palladium organic carboxylic acid complex Materials; Palladium dibutyl phosphite, p-toluenesulfonate and other organic sulfonates of palladium; bis(acetylacetonate) palladium, bis(hexafluoroacetone acetonate) palladium, bis(ethyl ethyl) Β-diketone compound of palladium such as acetate) palladium, bis(phenylacetate) palladium; dichlorobis(triphenylphosphine)palladium, bis[tris(m-tolylphosphine)]palladium , Palladium halide complexes such as dibromobis[tris(m-tolylphosphine)]palladium, acetonyltriphenylphosphonium complexes, etc.

Examples of the ligands of the phosphine system include triphenylphosphine, dicyclohexylphenylphosphine, cyclohexyldiphenylphosphine, tricyclohexylphosphine, and the like.

As the aforementioned relative anion, for example, triphenylcarbonium tetrakis(pentafluorophenyl) borate, triphenylcarbonium tetrakis[3,5-bis(trifluoromethyl)phenyl]borate, triphenylcarbonium Carbonium tetrakis(2,4,6-trifluorophenyl) borate, triphenylcarbonium tetraphenyl borate, tributylammonium tetrakis(pentafluorophenyl) borate, N,N-dimethyl Anilinonium tetrakis(pentafluorophenyl) borate, N,N-diethylanilinium tetrakis(pentafluorophenyl) borate, N,N-diphenylanilinium tetrakis(pentafluorophenyl) borate , Lithium tetrakis (pentafluorophenyl) borate, etc.

≪Washing step (Process S2)≫ The reaction liquid containing the polymer obtained in the foregoing polymerization step is added to an organic solvent to precipitate the polymer. Examples of the aforementioned organic solvent for precipitation include ketones such as acetone and methyl ethyl ketone; alcohols such as methanol, ethanol, and isopropanol. Next, the polymer was collected by filtration, washed with an organic solvent, and then dried. Examples of the organic solvent for washing include ketones such as acetone and methyl ethyl ketone; alcohols such as methanol, ethanol, and isopropanol.

The polymer of this embodiment can be synthesized in this way, for example. [Example]

Hereinafter, the present invention will be explained in more detail with examples, but the present invention is not limited by these examples.

＜Synthesis of polymers＞ (Preparation of catalyst solution) In a glass container in a nitrogen environment after removing moisture in advance, add 0.274 g (0.00075 mol) of allyl palladium (II) chloride (dimer), 0.403 g (0.0015 mol) of diphenylcyclohexyl phosphine, and 200 g of dehydrated toluene was stirred and dissolved at room temperature for 1 hour. Next, 1.502 g (0.0019 mol) of N,N-dimethylanilinium tetrakis (pentafluorophenyl) borate was added to the aforementioned dissolved substance, and the mixture was further stirred for 30 minutes. The resulting solution was filtered under a nitrogen stream to become a catalyst solution.

(Synthesis of polymer (P1-1)) Measure and put 5-butylbicyclo[2.2.1]hept-2-ene (1,982g, 13.2mol) into a reaction vessel of appropriate size equipped with a stirrer and cooling tube , [Bicyclo[2.2.1]hept-5-en-2-yl]triethoxysilane (434g, 1.80mol) and triethylsilane (1.0g, 0.009mol), add 8,000g of dehydrated toluene and make It is dissolved in dehydrated toluene. For this solution, nitrogen bubbling is performed to remove the dissolved oxygen in the system. Then, the above-mentioned solution was warmed while stirring, and at the time when it reached 60°C, the catalyst solution prepared as described above was added under a nitrogen stream. The reaction was carried out for 3 hours under the condition of 60°C while keeping the internal temperature. Thereby, a polymer having [bicyclo[2.2.1]hept-5-en-2-yl]triethoxysilane and 5-butylbicyclo[2.2.1]hept-2-ene was obtained. Next, the aforementioned solution was cooled to room temperature, and after reprecipitation using a large amount of methyl ethyl ketone, the precipitate was collected by filtration. The filtrate was washed with a large amount of methyl ethyl ketone, and the polymer was taken out by solid-liquid separation. It was dried with a vacuum dryer to obtain 1,550 g of a white powder polymer (P1-2). The weight average molecular weight (Mw) of the polymer (P1-1) thus obtained was 400,000, and the degree of dispersion (Mw/Mn) was 4.5.

(Synthesis of polymer (P1-2)) Except that the ratio of the structural unit (p1) to the total structural unit (100 mol%) of the polymer (P1-2) becomes 10% (l/m=90/10), 5-butyl is used Except for bicyclo[2.2.1]hept-2-ene and [bicyclo[2.2.1]hept-5-en-2-yl]triethoxysilane, the same as the synthesis of the above polymer (P1-1) , Synthetic polymer (P1-2). As a result, 1,620 g of a white powder polymer (P1-2) was obtained. The weight average molecular weight (Mw) of the polymer (P1-2) thus obtained was 390,000, and the degree of dispersion (Mw/Mn) was 4.4.

(Synthesis of polymer (P1-3)) Except that the ratio of the constituent unit (p1) to all the constituent units (100 mol%) of the constituent polymer (P1-3) is 14% (l/m=86/14), 5-butyl is used Except for bicyclo[2.2.1]hept-2-ene and [bicyclo[2.2.1]hept-5-en-2-yl]triethoxysilane, it is the same as the synthesis of the above polymer (P1-1) , Synthetic polymer (P1-3). As a result, 1,450 g of a white powder polymer (P1-3) was obtained. The weight average molecular weight (Mw) of the polymer (P1-3) thus obtained was 420,000, and the degree of dispersion (Mw/Mn) was 4.7.

(Synthesis of polymer (P2-1)) In a reaction vessel of appropriate size equipped with a stirrer and a cooling tube, measure and put in 5-butylbicyclo[2.2.1]hept-2-ene (2,252g, 15.0mol), triethylsilane (1.0g, 0.009mol) ), 8,000 g of dehydrated toluene was added and dissolved in dehydrated toluene. For this solution, nitrogen bubbling is performed to remove the dissolved oxygen in the system. Then, the above-mentioned solution was warmed while stirring, and at the time when it reached 60°C, the catalyst solution prepared as described above was added under a nitrogen stream. The reaction was carried out for 4 hours while keeping the internal temperature at 60°C. In this way, poly5-butylbicyclo[2.2.1]hept-2-ene was obtained. Next, the aforementioned solution was cooled to room temperature, and after reprecipitation using a large amount of methyl ethyl ketone, the precipitate was collected by filtration. The filtrate was washed with a large amount of methyl ethyl ketone, and the homopolymer was taken out by solid-liquid separation. It was dried with a vacuum dryer to obtain 1,800 g of a white powder homopolymer (P2-1). The weight average molecular weight (Mw) of the homopolymer (P2-1) thus obtained was 450,000, and the degree of dispersion (Mw/Mn) was 4.2.

(Examples 1 to 3, Comparative Example 1) The components shown in Table 1 were mixed and dissolved, and the adhesive composition of each example (resin component concentration 20% by mass) was prepared.

In Table 1, each abbreviation has the following meaning. The value in [] is the blending amount (parts by mass).

(P1)-1: The aforementioned polymer (P1-1). (P1)-2: The aforementioned polymer (P1-2). (P1)-3: The aforementioned polymer (P1-3). (P2)-1: The aforementioned polymer (P2-1). (P2)-2: Acrylic resin represented by the following formula (P2-2). The weight average molecular weight (Mw) is 10,000, and the degree of dispersion (Mw/Mn) is 3.3.

(P2)-3: SEBS resin Septon 8004 (KURARAY Co., Ltd.). The weight average molecular weight (Mw) is 100,000.

＜Evaluation of Adhesion of Adhesive Layer (1)＞ On a silicon substrate (size 6 inches, thickness 675 μm), the adhesive composition of each example was applied by spin coating at 1000 rpm while rotating. Next, the support body coated with the adhesive composition of each example was preliminarily heated at 90° C. for 4 minutes to form an adhesive layer with a thickness of 35 μm. Next, a cutter is used to cut the adhesive layer linearly. The cut line of the adhesive layer formed above traverses the silicon substrate. The peeled distance of the adhesive layer was measured from the aforementioned cutting line, and the adhesiveness of the adhesive layer was evaluated. The result is regarded as "adhesion (1)" and shown in Table 2. The shorter the peeling distance, the better the adhesion of the adhesive layer to the silicon substrate.

＜Evaluation of Adhesion of Adhesive Layer (2)＞ On a substrate with bumps (size 12 inches, thickness 775 μm, bump height 30 μm), the adhesive composition of each example was applied by a spin coating method while rotating at 1000 rpm. Next, the support coated with the adhesive composition of each example was preheated at 90°C for 4 minutes, then heated at 160°C for 4 minutes, and heated at 220°C for 4 minutes to form an adhesive with a thickness of 35μm. Floor. The formed adhesive layer was observed with a microscope (VHX-5000 manufactured by KEYENCY), and the ratio of the area where the adhesive layer was peeled from the bumped substrate was evaluated based on the following evaluation criteria. The result is regarded as "adhesion (2)", and is shown in Table 2. Evaluation criteria ⊚: The peeling area is 0%. ○: The peeling area is less than 5%. ×: The peeling area is 5% or more.

From the results shown in Table 2, it can be confirmed that the adhesive compositions of Examples 1 to 7 have better adhesion to silicon substrates and bumped substrates than the adhesive compositions of Comparative Example 1.

1: Support base 2: separation layer 3: Next layer 4: substrate 5: Sealing material layer 6: Redistribution layer 10: Laminated body 12: Support 20: Sealing body 30: Laminated body 40: Electronic parts 123: Adhesive layer support

[Fig. 1] is a model diagram showing an embodiment of a laminate to which the present invention is applied. [Fig. 2] A schematic step diagram explaining an embodiment of a method of manufacturing a laminate. FIG. 2A is a diagram illustrating the steps of making the support, FIG. 2B is a diagram illustrating the subsequent layer forming steps, and FIG. 2C is a diagram illustrating the bonding step. Fig. 3 is a schematic step diagram explaining another embodiment of the method of manufacturing a laminate. FIG. 3A is a diagram showing a laminate manufactured by the manufacturing method of the first embodiment, and FIG. 3B is a diagram explaining the sealing step. [Fig. 4] A schematic step diagram explaining another embodiment of the manufacturing method of the laminate. 4A is a diagram showing the sealing body by the manufacturing method of the second embodiment, FIG. 4B is a diagram illustrating the grinding step, and FIG. 4C is a diagram illustrating the rewiring forming step. [FIG. 5] A schematic step diagram for explaining an embodiment of a method of manufacturing a semiconductor package (electronic component). FIG. 5A is a diagram showing a laminate manufactured by the manufacturing method of the third embodiment, FIG. 5B is a diagram illustrating the separation step, and FIG. 5C is a diagram illustrating the removal step. Fig. 6 is a diagram illustrating an example of the method of using the adhesive composition of the present invention. Fig. 7 is a diagram illustrating an example of the method of using the adhesive composition of the present invention. Fig. 8 is a diagram illustrating an example of the method of using the adhesive composition of the present invention.

1: Support base

2: separation layer

3: Next layer

4: substrate

10: Laminated body

12: Support

123: Adhesive layer support

3s: noodles

Claims (17)

An adhesive composition, which is an adhesive composition for bonding a support and a substrate, and contains a polymer (P1) having a structural unit (p1) represented by the following general formula (p1-1);

[In the formula, R ^u11 ~ R ^u14 each independently represent an organic group with 1 to 30 carbon atoms or a hydrogen atom; ^{however , at least one of R u11} ~ R u14 is an organic group containing an alkoxysilyl group; n ¹ is Integer of 0~2]. Such as the adhesive composition of claim 1, wherein in the aforementioned polymer (P1), the ratio of the aforementioned constituent unit (p1) is 3~ 30 mol%. The adhesive composition of claim 1 or 2, wherein the aforementioned polymer (P1) has a structural unit (p2) represented by the following general formula (p2-1);

[In the formula, R ^u21 ~ R ^u24 each independently represent an organic group with 1 to 30 carbon atoms (except for those containing an alkoxysilyl group) or a hydrogen atom; n ² is an integer of 0 to 2]. Such as the adhesive composition of any one of claims 1 to 3, wherein the weight average molecular weight of the aforementioned polymer (P1) is 5.0×10 ⁴ to 1.0×10 ⁶ . A laminated body, which is a laminated body in which a support body and a substrate are bonded through an adhesive layer, wherein The aforementioned adhesive layer includes a first adhesive composition layer formed using the adhesive composition of any one of claims 1 to 4. The laminate of claim 5, wherein the adhesive layer further includes a second adhesive composition layer formed of an adhesive composition not containing the polymer (P1). The laminate of claim 6, wherein the first adhesive composition layer is adjacent to the substrate. Such as the layered body of any one of claims 5~7, where The support body is provided with a light-transmitting support base body and a separation layer provided on the support base body, The separation layer is adjacent to the adhesive layer and is altered by light irradiation, and the layer of the support base can be separated from the substrate attached to the support. A method for manufacturing a laminated body, which is a method for manufacturing a laminated body in which a support body and a substrate are bonded through an adhesive layer, and has: On at least one of the support or the substrate, an adhesive layer including the first adhesive composition layer formed using the adhesive composition of any one of claims 1 to 4 is formed. Steps, and The bonding step of bonding the support and the substrate through the bonding layer formed through the bonding layer forming step. For example, the manufacturing method of the laminated body of claim 9, which further has: After the bonding step, the substrate is bonded to the support through the adhesive layer, and sealed with a sealing material to produce a sealing step of the sealing body. For example, the manufacturing method of the laminated body of claim 10, which further has: After the sealing step, the grinding step of grinding the sealing material part in the sealing body in such a way that a part of the substrate is exposed, and After the grinding step, a rewiring forming step of rewiring is formed on the exposed substrate. The method for manufacturing a laminate according to any one of claims 9 to 11, which further has a step of forming a separation layer that is altered by light irradiation on a light-transmitting support base, and manufacturing the aforementioned support. A manufacturing method of electronic parts, which is obtained by the manufacturing method of the multilayer body as in claim 12, and has: The separation step of separating the support base from the substrate provided in the laminated body by irradiating light to the separation layer through the support base to alter the quality of the separation layer, and After the separation step, the removal step of removing the adhesive layer attached to the substrate. A polymer, which is a polymer used in an adhesive composition for bonding a support and a substrate, and has a structural unit (p1) represented by the following general formula (p1-1);

[In the formula, R ^u11 ~ R ^u14 each independently represent an organic group with 1 to 30 carbon atoms or a hydrogen atom; ^{however , at least one of R u11} ~ R u14 is an organic group containing an alkoxysilyl group; n is 0 ~2 integer]. Such as the polymer of claim 14, wherein the ratio of the aforementioned structural unit (p1) is 3-30 mol% relative to all the structural units (100 mol%) constituting the aforementioned polymer. Such as the polymer of claim 14 or 15, which further has a structural unit (p2) represented by the following general formula (p2-1);

[In the formula, R ^u21 ~ R ^u24 each independently represent an organic group with 1 to 30 carbon atoms (except for those containing an alkoxysilyl group) or a hydrogen atom; n ² is an integer of 0 to 2]. For example, the polymer of any one of claims 14-16 has a weight average molecular weight of 5.0×10 ⁴ to 1.0×10 ⁶ .

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