TWI636884B - Method for treatment - Google Patents

Abstract

An object of the present invention is to separate a first support from a laminate without dissolving the second adhesive layer.

As a solution, the processing method is included on the surface of the separation layer (14) on which the first support plate (13) is disposed, the first attachment process of the substrate (11) is attached, and then, the substrate is attached to the back surface. (11) The surface of the first support plate (13) is attached to the second attachment plate of the second support plate (23) and the second attachment process, and then the light is irradiated through the separation layer (14). The separation layer (14) is degraded to separate the separation of the first support plate (13) from the substrate (11).

Description

Approach

The present invention relates to a method of treatment.

In recent years, electronic device products have been required to be compact, lightweight, and high-performance. The flip chip mounting technology, which is one of the wafer connection technologies, has been expanded and utilized as a key technology for miniaturization, high performance, and low cost.

Patent Document 1 discloses an adhesive composition for use in attachment of a semiconductor wafer, polishing of a wafer back surface, and formation of a film-like adhesive during flip chip bonding, and use of the adhesive composition A method of manufacturing a semiconductor device.

Further, Patent Document 2 discloses a method of manufacturing a semiconductor device which is suitable for use in manufacturing a semiconductor device having a CHIP-ON-CHIP structure using a through electrode. More specifically, it is disclosed that the semiconductor wafer is mounted on the first surface of the semiconductor substrate, and the semiconductor wafer is mounted on the first surface of the semiconductor substrate, and the semiconductor wafer is covered with the semiconductor wafer. Engineering of the sexual support, and the aforementioned semiconductor On the second surface side of the substrate, a process for specifying a process, and a method of manufacturing a semiconductor device in which a semiconductor wafer is cut out from the semiconductor substrate and the wafer is diced is used.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Laid-Open Patent Publication No. 2011-146731 (published on July 28, 2011)

[Patent Document 2] Japanese Laid-Open Patent Publication No. 2008-130704 (published on June 5, 2008)

The inventors of the present invention are the laminates in which the first support, the first adhesive layer, the wafer substrate, the second adhesive layer, and the second support are laminated in this order for flip chip mounting. The technology is independently reviewed. That is, first, the wafer substrate is bonded to the first support via the first adhesive layer, and the wafer substrate is polished and thinned. Thereafter, the second support is bonded to the surface to be polished of the wafer substrate via the second adhesive layer to form the laminate. Then, it is reviewed that the first support is separated from the laminate, and the remaining portion is used for flip chip mounting.

Here, when the first support is separated from the laminate, a solvent is used to dissolve the first adhesive layer, and the second support is also dissolved. The second adhesive layer of the body has the problem of separating the second support at the same time.

The present invention has been made in view of the above problems, and provides a laminate in which the first support, the first adhesive layer, the wafer substrate, the second adhesive layer, and the second support are laminated in this order. When the substrate is processed, the second support is not separated from the laminate, and the first support is separated from the first to the last.

In order to solve the above problems, the processing method of the present invention includes a surface on which the first separation layer of the separation layer which is modified by irradiation of light is provided, and the substrate is attached via the first adhesive layer. After the attachment process and the first attachment process, the second attachment of the second support is attached to the surface of the first support surface facing the substrate, with the second adhesive layer interposed therebetween And after the second attachment process, the separation layer is characterized by the irradiation of the light, the separation layer is separated, and the separation of the first support from the substrate is characterized.

According to the present invention, the layered body is laminated in this order from the first support, the first adhesive layer, the wafer substrate, the second adhesive layer, and the second support, so that the second support is not separated. The first support is separated from beginning to end.

11‧‧‧Substrate

12‧‧‧First adhesive layer

13‧‧‧First Support Board (First Support)

14‧‧‧Separation layer

22‧‧‧Second Adhesive Layer

23‧‧‧Second support board (second support)

100‧‧‧Layer

Fig. 1 is a schematic view showing a process of removing the first adhesive layer included in the treatment method according to the embodiment of the present invention, so that the outer peripheral portion is removed.

Fig. 2 is a schematic view showing a process in which the outer peripheral portion of the first adhesive layer included in the treatment method according to the embodiment of the present invention is removed.

Fig. 3 is a schematic view showing a laminate formed by a processing method according to an embodiment of the present invention.

Fig. 4 is a schematic view showing a separation process included in a processing method according to an embodiment of the present invention.

The processing method of the present invention is included in a surface of the separation layer provided with the first separation layer provided by the irradiation of light, and a first attachment process for attaching the substrate via the first adhesive layer, and After the first attachment process, a second attachment process to which the second support is attached, and a second attachment are attached to the surface of the first support surface facing the substrate, with the second adhesive layer interposed therebetween After the process, the separation layer is transformed by the irradiation light, and the separation process of the first support and the substrate is separated.

Thereby, the layered body is laminated in this order from the first support, the first adhesive layer, the wafer substrate, the second adhesive layer, and the second support, so that the second support can be separated without a support from beginning to end To separate.

That is, according to the present invention, in the separation layer, the separation layer is deteriorated by irradiation of light, and the first support and the substrate are separated, and the second adhesive layer is not dissolved, and the second adhesive layer is not dissolved. The first support and the substrate can be separated by applying excessive force. For this reason, when the first support is separated from the laminate, the second support can be prevented from being separated from the substrate.

Therefore, in the processing method of the present invention, in the process after the processing method of the present invention, flip chip mounting can be performed on the substrate as appropriate.

[Approach]

The processing method according to an embodiment of the present invention will be described in more detail with reference to Figs. 1 to 4 . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an adhesive layer included in a treatment method according to an embodiment of the present invention, and a peripheral portion removing process 2. Fig. 2 is a schematic view showing a process after the outer peripheral portion removal process 2 of the adhesive layer included in the treatment method according to the embodiment of the present invention.

As shown in Fig. 1, the treatment method relating to one embodiment includes a first adhesive coating process (Fig. 1 (a) and (b)), and an adhesive peripheral peripheral removal process 1 (Fig. 1 (c). )), the first separation layer forming process ((d) and (e) of Fig. 1), the first attachment process (Fig. 1 (f)), and the outer peripheral part of the adhesive layer removal process 2 (Fig. 1 (g)).

Moreover, as shown in FIG. 2, the processing side of an embodiment In addition to the works shown in (a) to (g) of Figure 1, the system includes a thinning project (Fig. 2 (a)), a second adhesive coating project (Fig. 2 (b)), and an adhesive. The outer peripheral part is removed from the work 3 (Fig. 2 (c)), the second separated layer forming work (Fig. 2 (d) and (e)), the second attached work (Fig. 2 (f)), and the adhesion The outer peripheral portion of the agent layer is removed from the work 4 ((g) of Fig. 2).

As shown in FIG. 1 and FIG. 2, the processing method according to an embodiment is included in the surface of the separation layer 14 of the first support plate (first support) 13 which is provided with the separation layer 14 which is modified by the irradiation of light, and is interposed. The first adhesive layer 12, the first attachment process to which the substrate 11 is attached, and the first attachment process are placed on the surface of the first support plate 13 facing away from the substrate 11 with the second surface interposed therebetween. After the adhesive layer 22 is attached to the second attachment process of the second support plate (second support) 23 and the second attachment process, the separation layer 14 is deteriorated by the irradiation light on the separation layer 14 to separate the first layer. The separation of the support plate 13 from the substrate 11 is performed.

[First Adhesive Coating Engineering]

In the processing method according to the embodiment, the first adhesive agent is applied to at least one of the first support plate 13 and the substrate 11 to form the first adhesive of the first adhesive layer 12 before the first attachment process. Coating engineering.

Thereby, the substrate 11 can be fixed to the first support plate 13. Therefore, in the subsequent work, the damage of the substrate 11 can be prevented.

First, as shown in (a) and (b) of FIG. 1, the first adhesive is applied to the surface of the circuit on which the substrate 11 is formed to form the first adhesive. The agent layer 12. The method of applying the first adhesive to the substrate 11 is not particularly limited, and examples thereof include a spin coating method, a dipping method, a roll knife method, a spray method, and a slit coating method. However, in the present embodiment, the first adhesive layer 12 is formed on the substrate 11, but the present invention is not limited thereto, and the first adhesive is applied to the separation layer 14 formed on the first support plate 13 to form a first adhesive. The first adhesive layer 12 can also be used.

(substrate 11)

The substrate 11 is attached to the first support plate 13 via the first adhesive layer 12, and is attached to the second support plate 23 via the second adhesive layer 22. As the substrate 11, for example, any substrate such as a wafer substrate, a ceramic substrate, a shallow film substrate, or a flexible substrate can be used. Further, in one embodiment, an electric circuit is formed on the surface of the first adhesive layer 12 on the laminated substrate 11.

(first adhesive layer 12)

The first adhesive layer 12 is a substrate 11 to which the first support plate 13 and the separation layer 14 are adhered and fixed. Further, the first adhesive layer 12 can protect the surface of the coated substrate 11.

As a method of forming the first adhesive layer 12, an adhesive may be applied to the substrate 11, or an adhesive tape to which the adhesive is applied to both surfaces may be attached to the substrate 11. The coating method of the adhesive is not particularly limited, and examples thereof include a spin coating method, a dipping method, a roller knife method, a doctor blade method, a spray method, and a slit nozzle method. Also, after applying the adhesive, Drying by heating is also possible. Further, instead of applying the adhesive directly to the substrate 11, the adhesive may be applied to the film on both sides (so-called double-sided tape) in advance, and may be attached to the substrate 11.

The thickness of the first adhesive layer 12 may be set according to the type of the substrate 11 and the first support plate 13 to be attached, and the substrate 11 to be attached, and the like may be appropriately set. It is in the range of 10 to 150 μm, more preferably in the range of 15 to 100 μm.

As the adhesive, various adhesives known in the art such as acrylic, phenolic, naphthoquinone, hydrocarbon, polyimide, elastomer, etc. can be used as the first composition of the present invention. The adhesive of the adhesive layer 12 is used. Hereinafter, the composition of the resin containing the first adhesive layer 12 of the embodiment of the present embodiment will be described.

The resin containing the first adhesive layer 12 may be an adhesive, and examples thereof include a hydrocarbon resin, an acrylic-styrene resin, a maleic amine resin, an elastomer resin, and the like. Combiners and so on.

The glass transition temperature (Tg) of the adhesive varies depending on the type or molecular weight of the above-mentioned resin, and the complex of the plasticizer of the adhesive. The type or molecular weight of the resin to be contained in the above-mentioned adhesive may be appropriately selected depending on the type of the substrate and the support, and the Tg of the resin used in the adhesive is preferably -60 ° C or more and 200 ° C or less. It is preferably in the range of -25 ° C or more and 150 ° C or less. By the range of -25 ° C or more and 150 ° C or less, the adhesion of the first adhesive layer 12 can be appropriately reduced without requiring excessive energy for cooling. Also, the first adhesive layer 12 The Tg system can be adjusted in accordance with a plasticizer or a low-polymerization resin.

The glass transition temperature (Tg) can be measured, for example, using a well-known differential scanning calorimeter (DSC).

(hydrocarbon resin)

The hydrocarbon resin has a hydrocarbon skeleton and is a resin obtained by polymerizing a monolith composition. Examples of the hydrocarbon resin include a resin selected from the group consisting of a cycloolefin polymer (hereinafter referred to as "resin (A)") and a terpene resin, a rosin resin, and a petroleum resin (hereinafter referred to as "a resin"). It is "resin (B)"), etc., but it is not limited to this.

The resin (A) may be a resin obtained by polymerizing a monomer component containing a cycloolefin-based monomer. Specifically, a ring-opening (co)polymer containing a monomer component of a cycloolefin type monomer, and a resin which adds (co)polymerizes a monomer component of a cycloolefin type monomer, etc. are mentioned.

As the above-mentioned one-component body component constituting the resin (A) Examples of the cycloolefin-based monomer include a bicyclic ring such as norbornene and norbornadiene, a tricyclic ring such as dicyclopentadiene or dihydrooxypentadiene, and tetracyclododecene. a heptacyclic ring such as a tetracycline or a cyclopentadiene triad or a heptacycline such as tetracyclopentadiene; or an alkyl group of such a polycyclic ring (methyl, ethyl, propyl, butyl, etc.) a substitution body, an alkenyl group (vinyl group, etc.) substitution product, an alkylene group (such as an ethylene group), a aryl group (phenyl group, a tolyl group, a naphthyl group, etc.), or the like. Among these, a norbornene-based monomer in which a group of norbornene, tetracyclododecene or an alkyl group-substituted body selected from the group is preferable is preferable.

The monomer component constituting the resin (A) contains a ring which can be combined with the above ring Other monomers in which the olefin monomer is copolymerized may also be preferred, for example, those containing an olefin monomer. Examples of the olefin monomer include ethylene, propylene, 1-butene, isobutylene, 1-hexene, and α-olefin. The olefin monomer may be linear or branched.

Moreover, it is contained as a single component of the resin (A). The cycloolefin monomer is preferably from the viewpoint of high heat resistance (low thermal decomposition, thermal weight reduction). The ratio of the cycloolefin monomer which constitutes the entire single component of the resin (A) is preferably 5 mol% or more, more preferably 10 mol% or more, and still more preferably 20 mol% or more. In addition, the ratio of the cycloolefin monomer which constitutes the entire single component of the resin (A) is not particularly limited, and is preferably 80 mol% or less from the viewpoint of solubility and stability of the solution. More preferably, it is 70% or less.

Moreover, it is contained as a single component of the resin (A). A linear or branched olefin monomer may also be used. The ratio of the cycloolefin monomer which constitutes the monolithic component of the resin (A) as a whole is preferably from 10 to 90 mol%, preferably from 20 to 85 mol%, from the viewpoint of solubility and flexibility. More preferably 30 to 80% by mole.

However, the resin (A) is, for example, a polymerized cycloolefin monomer and an alkene. The resin formed by the monomer component of the hydrocarbon monomer is preferably a resin which does not have a polar group and which suppresses the generation of gas at a high temperature.

A polymerization method or a polymerization strip for polymerizing a single body component The parts and the like are not particularly limited and can be appropriately set according to a usual method.

It can be used as a commercial product for the resin (A), for example, Polyplastics Co., Ltd. "TOPAS", Mitsui Chemicals "APEL" manufactured by the company, "ZEONOR" and "ZEONEX" manufactured by Japan ZEON Co., Ltd., and "ARTON" manufactured by JSR Co., Ltd.

The glass transition temperature (Tg) of the resin (A) is preferably 60 ° C or higher, and more preferably 70 ° C or higher. When the glass transition temperature of the resin (A) is 60 ° C or more, when the laminate is exposed to a high temperature environment, the softening of the first adhesive layer can be further suppressed.

The resin (B) is a resin selected from at least one of a group consisting of a terpene resin, a rosin resin, and a petroleum resin. Specifically, examples of the terpene-based resin include a terpene resin, a terpene phenol resin, a modified terpene resin, a hydrogenated terpene resin, and a hydrogenated terpene phenol resin. Examples of the rosin-based resin include rosin, rosin ester, hydrogenated rosin, hydrogenated rosin ester, polymerized rosin, polymerized rosin ester, and modified rosin. Examples of the petroleum resin include aliphatic or aromatic petroleum resins, hydrogenated petroleum resins, modified petroleum resins, alicyclic petroleum resins, benzofuran-indene petroleum resins, and the like. Among them, a hydrogenated terpene resin and a hydrogenated petroleum resin are more preferable.

The softening point of the resin (B) is not particularly limited, and is preferably 80 to 160 °C. When the softening point of the resin (B) is 80 ° C or more, when the laminate is exposed to a high temperature environment, softening can be suppressed, and adhesion failure does not occur. On the other hand, when the softening point of the resin (B) is 160 ° C or less, the peeling speed at the time of peeling the laminated body becomes favorable.

The weight average molecular weight of the resin (B) is not particularly limited, and is preferably from 300 to 3,000. When the weight average molecular weight of the resin (B) is 300 or more, heat resistance is sufficient, and in a high temperature environment, the amount of outgassing will be Fewer. On the other hand, when the weight average molecular weight of the resin (B) is 3,000 or less, the peeling speed at the time of peeling the laminated body becomes favorable. However, the weight average molecular weight of the resin (B) of the present embodiment means a polystyrene-equivalent molecular weight measured by a gel permeation chromatography (GPC).

However, as the resin, it is also possible to use the mixed resin (A) and the resin (B). Through mixing, heat resistance and peeling speed become good. For example, the mixing ratio of the resin (A) and the resin (B) is (A): (B) = 80: 20 to 55: 45 (mass ratio), and is heat resistance and softness at a peeling speed and a high temperature environment. It is better for sex to be excellent.

(acrylic-styrene resin)

Examples of the acrylic-styrene-based resin include a resin obtained by polymerizing a derivative of styrene or styrene, and a (meth) acrylate.

Examples of the (meth) acrylate include a (meth)acrylic acid alkyl ester, a (cyclo)alkyl group having an aliphatic ring, and a (meth) acrylate having an aromatic ring. Examples of the (meth)acrylic acid alkyl ester to be a chain structure include an acrylic long-chain alkyl ester having an alkyl group having 15 to 20 carbon atoms, and an acrylic alkyl group having an alkyl group having 1 to 14 carbon atoms. Base ester and the like. As the acrylic long-chain alkyl ester, the alkyl group is n-pentadecyl, n-hexadecyl, n-heptadecyl, n-octadecyl, n-nonadecyl, An alkyl ester of acrylic acid or methacrylic acid such as n-eicosyl group. However, the alkyl group may be branched.

An acrylic alkyl group having an alkyl group having 1 to 14 carbon atoms The ester may, for example, be a known acrylic alkyl ester used in an existing acrylic pressure-sensitive adhesive. For example, the alkyl group may, for example, be methyl, ethyl, propyl, butyl, 2-ethylhexyl, isooctyl, isodecyl, isodecyl, dodecyl, lauryl or tridecyl. An alkyl ester of acrylic acid or methacrylic acid.

Examples of the (meth) acrylate having an aliphatic ring include cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, 1-adamantyl (meth) acrylate, and norbornane. (meth) acrylate, isobornyl alkyl (meth) acrylate, tricyclodecenyl (meth) acrylate, tetracyclodecenyl (meth) acrylate, dicyclopentyl (methyl) An acrylate or the like is more preferably an isobornyl methacrylate or a dicyclopentyl (meth) acrylate.

The (meth) acrylate having an aromatic ring is not particularly limited, and examples of the aromatic ring include a phenyl group, a benzyl group, a tolyl group, a xylyl group, a bisphenyl group, a naphthyl group, and an anthracene. Base, phenoxymethyl, phenoxyethyl and the like. Further, the aromatic ring system may have a chain or branched alkyl group having 1 to 5 carbon atoms. Specifically, phenoxyethyl acrylate is preferred.

(Malayian amide resin)

As the maleic amine-based resin, for example, as a monomer, a polymerization of N-methyl maleimide, N-ethyl maleimide, Nn-propyl maleimide, N-isopropylmaleimide, Nn-butylmaleimide, N-isobutylmaleimide, N-sec-butylmaleimide, N-tert-butyl Kamalimide, Nn-pentylmaleimide, Nn-hexylmaleimide, Nn-heptylmaleimide, Nn-octylmaleimide, N-twelve An alkyl maleimide, an N-octadecyl maleimide or the like having an alkyl group, a maleimide, an N-cyclopropyl maleimide, an N-cyclobutyl mala Anthracene, N-cyclopentylmaleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N-cyclooctylmaleimide, etc. Hydrocarbon-based maleimide, N-phenylmaleimide, Nm-methylphenylmaleimide, No-methylphenylmaleimide, Np-methylphenyl A resin obtained by aromatic arylamine or the like having an aryl group such as melamine.

For example, a repeating unit represented by the following chemical formula (1) and a cyclic olefin oligomer of a repeating unit of the following chemical formula (2) can be used as a resin of an adhesive component.

(In the chemical formula (2), n is 0 or an integer of 1 to 3).

As such a cyclic olefin oligomer, APL 8008T, APL 8009T, and APL 6013T (all manufactured by Mitsui Chemicals, Inc.) and the like can be used.

(elastomer)

It is preferable that the elastic system is composed of a styrene unit as a constituent unit of the main chain, and the "styrene unit" may have a substituent group. Examples of the substituent group include an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxyalkyl group having 1 to 5 carbon atoms, an ethoxylated group, and a carboxylic acid group. Further, the content of the styrene unit is more preferably in the range of 14% by weight or more and 50% by weight or less. Further, the weight average molecular weight of the elastic system is preferably in the range of 10,000 or more and 200,000 or less.

When the content of the styrene unit is in the range of 14% by weight or more and 50% by weight or less, and the weight average molecular weight of the elastomer is in the range of 10,000 or more and 200,000 or less, it is easily dissolved in a solvent of a hydrocarbon-based solvent to be described later. The first adhesive layer is easily and quickly removed. Further, the content of the styrene unit and the weight average molecular weight are within the above range, and the resist solvent (for example, PGMEA, PGME, etc.), acid (hydrofluoric acid, etc.) exposed to the wafer during the photoresist reduction process, Alkali (TMAH, etc.) provides excellent durability.

However, in the elastomer, the above (meth) acrylate may be further mixed.

Further, the content of the styrene unit is more preferably 17% by weight or more, still more preferably 40% by weight or less.

A more preferable range of the weight average molecular weight is 20,000 or more, and a more preferable range is 150,000 or less.

When the content of the styrene unit is in the range of 14% by weight or more and 50% by weight or less, and the weight average molecular weight of the elastomer is in the range of 10,000 or more and 200,000 or less, various types can be used. Elastomer. For example, polystyrene-poly(ethylene/propylene) block oligomer (SEP), styrene-isoprene-styrene block oligomer (SIS), styrene-butadiene-benzene can be used. Ethylene block oligomer (SBS), styrene-butadiene-butene-styrene block oligomer (SBBS), and, such hydride, styrene-ethylene-butylene-styrene block Oligomer (SEBS), styrene-ethylene-propylene-styrene block oligomer (styrene-isoprene-styrene block oligomer) (SEPS), styrene-ethylene-ethylene-propylene - styrene block oligomer (SEEPS), styrene block is a reaction crosslinked type styrene-ethylene-ethylene-propylene-styrene block oligomer (Septon V9461 (manufactured by Kuraray Co., Ltd.)), benzene The ethylene block is a reaction-crosslinked type styrene-ethylene-butylene-styrene block oligomer (reactive polystyrene-based hard block, Septon V9827 (manufactured by Kuraray Co., Ltd.), etc., styrene The content of the unit and the weight average molecular weight are within the above ranges.

Further, among the elastomers, a hydride is more preferable. When it is a hydride, the stability to heat is improved, and it is difficult to cause deterioration such as decomposition or polymerization. Moreover, it is more excellent from the viewpoint of the solubility of the solvent of the hydrocarbon-based solvent and the acceptability of the resist solvent.

Further, among the elastomers, those having a block polymer of styrene at both ends are more preferable. High heat resistance can be exhibited by blocking styrene having high heat stability at both ends.

More specifically, the hydride of the elastomeric system styrene and the block oligomer of the conjugated diene is more preferred. The stability of heat is increased, and it is difficult to cause deterioration such as decomposition or polymerization. Also, by setting the heat to a high degree of stability Styrene, which is blocked at both ends, exhibits higher heat resistance. Furthermore, it is also preferable from the viewpoint of the solubility of the solvent of the hydrocarbon-based solvent and the acceptability of the resist solvent.

For example, "septon (trade name)" manufactured by Kuraray Co., Ltd., "hybrar (trade name) manufactured by Kuraray Co., Ltd.) is used as a commercially available product of the elastomer to be used as the adhesive of the first adhesive layer 12. ), "Tuftec (trade name)" manufactured by Asahi Kasei Co., Ltd., "DYNARON (trade name)" manufactured by JSR Co., Ltd., etc.

The content of the elastomer contained in the adhesive constituting the first adhesive layer 12 is, for example, 100 parts by weight or more, and preferably 90 parts by weight or less, and 60 parts by weight or less. It is more preferably in the range of 99 parts by weight or less, more preferably 70 parts by weight or more and 95 parts by weight or less. By being in such a range, heat resistance can be maintained, and the wafer and the support can be bonded to each other.

Also, the elastic system can mix a plurality of types. That is, the adhesive constituting the first adhesive layer 12 may contain a plurality of types of elastomers. At least one of the plurality of types of elastomers may be a constituent unit of the main chain, and may include a styrene unit. Further, at least one of the plurality of types of elastomers has a styrene unit content of 14% by weight or more and 50% by weight or less, and when the weight average molecular weight is in the range of 10,000 or more and 200,000 or less, The scope of the invention. Further, when the adhesive constituting the first adhesive layer 12 contains a plurality of types of elastomers, the content of the styrene unit is adjusted to the above range as a result of the mixing. Also. For example, Septon 4033 of septon (trade name) manufactured by Kuraray Co., Ltd. having a styrene unit content of 30% by weight, and Septon 2063 of septon (trade name) having a styrene unit content of 13% by weight, in a weight ratio of 1 When it is mixed with 1 , the styrene content of the entire elastomer contained in the adhesive composition is 21 to 22% by weight, and therefore it is 14% by weight or more. In addition, when the styrene unit is 10% by weight or 60% by weight, when it is mixed at a weight ratio of 1 to 1, it is 35% by weight, and it is within the above range. The invention may be in such a form. Further, the elastomers of the plural type of the adhesive composition of the present invention are all contained in the above range and contain styrene units, and the weight average molecular weight within the above range is optimal.

However, it is preferred to form the first adhesive layer 12 using a resin other than a photocurable resin (for example, a UV curable resin). By using a resin other than the photocurable resin, after the first adhesive layer 12 is peeled off or removed, it is possible to prevent residues from remaining around the minute unevenness of the supported substrate. In particular, it is preferable that the adhesive constituting the first adhesive layer 12 is not dissolved in a solvent but dissolved in a specific solvent. This can be removed by adding the physical force to the substrate 11 by dissolving the first adhesive layer 12 in a solvent. When the first adhesive layer 12 is removed, even if the substrate 11 whose strength is lowered, the substrate 11 is not damaged, and the first adhesive layer 12 can be easily removed.

(diluted solvent)

As a diluent solvent for forming the separation layer and the first adhesive layer, For example, linear hydrocarbons such as hexane, heptane, octane, nonane, methyl octane, decane, undecane, dodecane, and tridecane, and branches having a carbon number of 4 to 15 may be mentioned. Hydrocarbons, such as cyclohexane, cycloheptane, cyclooctane, naphthalene, decalin, tetrahydronaphthalene, etc., cyclic hydrocarbons, p-menthane, o-menthane, m-menthane, Phenyl menthane, 1,4-decanediol, 1,8-nonanediol, decane, norbornane, decane, oxane, decane, longene, geraniol, nerol, Linalool, citral, citronellol, menthol, isomenthol, neomenthol, alpha-terpineol, beta-terpineol, gamma-terpineol, terpineol-1-ol, pine oil En-4-ol, dihydro rosin alcohol acetate, 1,4-ether, 1,8-equivalent, borneol, fragrant celery, ionone, flavonoids, camphor, d-limonene, l - terpene solvents such as limonene and dipentene; lactones such as γ-butyrolactone; acetone, methyl ethyl ketone, cyclohexanone (CH), methyl-n-pentanone, methyl isoprene a ketone such as a ketone or a 2-heptanone; a polyvalent alcohol such as ethylene glycol, diethylene glycol, propylene glycol or dipropylene glycol; ethylene glycol monoacetic acid An ester-bonding compound such as diethylene glycol monoacetate, propylene glycol monoacetate or dipropylene glycol monoacetate; monomethyl ether, monoethyl ether, monopropyl ether having the above polyvalent alcohol or a compound of the foregoing ester combination a derivative of a polyvalent alcohol such as a monoalkyl ether such as monobutyl ether or an ether-bonded compound such as monophenyl ether (such as propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl) Alkyl ether (PGME) is preferred; such as a cyclic ether of dioxane, or methyl lactate, ethyl lactate (EL), methyl acetate, ethyl acetate, butyl acetate, butyl methoxyacetate, An ester of methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, methyl ethoxy propionate, etc.; anisole, ethyl benzyl ether, ethyl benzyl ether cresyl methyl ether, Diphenyl ether, dibenzyl ether, phenyl ether, An aromatic organic solvent such as butyl phenyl ether.

(other ingredients)

The adhesive constituting the first adhesive layer may include other substances having a mixture property without impairing the properties of the essence. For example, various additives such as an additional resin, a plasticizer, an adhesion aid, a stabilizer, a colorant, a thermal polymerization inhibiting agent, and a surfactant which are properties for improving the adhesive properties can be further used.

[Adhesive peripheral part removal engineering 1]

In the treatment method of one embodiment, after the first adhesive application process, the outer peripheral portion of the first adhesive layer 12 is removed before the first attachment process.

Thereby, the overcoated adhesive can be removed. For this reason, in the first attachment process, the first adhesive layer 12 can be prevented from overflowing from the outer peripheral portion of the laminated body 50 and excessively attached to the first support plate 13. Therefore, in the subsequent separation process, after the light of the separation layer 14 is irradiated, the first support plate 13 can be separated from the laminated body 100 without imparting excessive force.

As shown in FIG. 1(c), the outer peripheral portion of the adhesive layer is removed in the first adhesive layer forming process, and the adhesive layer 12 is formed on one surface of the substrate 11, and then the substrate 11 is removed. The construction of the first adhesive layer 12 of the outer peripheral portion. Therefore, in the subsequent first attachment process, when the substrate 11 and the first support sheet 13 are bonded, the first adhesive layer 12 is appropriately prevented from overflowing from the laminate 50. Therefore, after the second In the attaching process, the first adhesive layer 12 can be prevented from overflowing from the laminated body 100.

As a method of removing the first adhesive layer 12 formed on the outer peripheral portion of the substrate 11, a known method can be used, and although not particularly limited, for example, for the outer peripheral portion of the first adhesive layer 12, a solution is prepared. It is also possible to carry out the spraying or to supply the solution using a dispensing nozzle. Further, spraying, supplying, and the like of the solution can be performed while rotating the substrate 11.

However, the solution of the first adhesive layer 12 may be selected depending on the type of the adhesive, and is not particularly limited. For example, a solvent used as the above-mentioned diluent solvent may be used, and in particular, a linear shape may be used. Carbonized hydrogen, a cyclic hydrocarbon such as a hydrocarbon having 4 to 15 carbon atoms, a cyclic hydrocarbon such as a monodecene or a diterpene (terpene).

[First separation layer formation project]

As shown in (d) and (e) of FIG. 1, the first separation layer forming process is performed on one surface of the first support plate 13, and a process of forming the separation layer 14 which is deteriorated by irradiation with light is formed. However, the first adhesive layer coating process and the first separation layer forming engineering system may be completed before the start of the first attachment process described below, and the order of implementing the two projects is not limited, and the two projects may be implemented in parallel. .

(first support board 13)

The first support plate 13 supports the support of the substrate 11. First support board 13, attached to the substrate 11 via the first adhesive layer 12.

The first support plate 13 is required to have the necessary strength to prevent the substrate 11 from being damaged or deformed during the process of thinning, transporting, or mounting the substrate 11, and to pass the light that deteriorates the separation layer 14. In view of the above, the first support plate 13 is exemplified by glass, enamel, and acrylic resin.

(separation layer 14)

The separation layer 14 is a layer formed by absorbing a material that is deteriorated by light irradiated through the first support plate 13 .

Further, the laser beam that emits the light that is incident on the separation layer 14 can be appropriately selected in accordance with the material constituting the separation layer 14, and a laser that can illuminate the wavelength ray that deteriorates the material constituting the separation layer 14 can be selected.

The separation layer 14 is provided on the surface of the first support plate 13 via the first adhesive layer 12 and bonded to the substrate 11 side.

The thickness of the separation layer 14 is preferably, for example, 0.05 μm or more and 50 μm or less, more preferably 0.3 μm or more and 1 μm or less. When the thickness of the separation layer 14 converges in the range of 0.05 μm or more and 50 μm or less, the desired deterioration of the separation layer 14 can be caused by short-time light irradiation and low-energy light irradiation. Further, the thickness of the separation layer 14 is particularly preferably in the range of 1 μm or less from the viewpoint of productivity.

However, another layer may be formed between the separation layer 14 and the first support plate 13. At this time, the other layers are made of light-transmitting material. It can be constructed. Thereby, it is possible to appropriately add a layer which imparts good properties to the laminate in order not to hinder the incidence of light to the separation layer 14. Due to the kind of material constituting the separation layer 14, the wavelength of light used is also different. Therefore, the materials constituting the other layers need not be transmitted through all of the light, and may be selected from materials which are permeable to light having a wavelength which can deteriorate the material constituting the separation layer 14.

Further, it is preferable that the separation layer 14 is formed only of a material having a structure for absorbing light, and a material having no structure for absorbing light may be added without impairing the essential characteristics of the present invention, and the separation layer 14 may be formed. . Further, it is preferable that the surface on the side of the first adhesive layer 12 of the separation layer 14 is flat (no unevenness is formed), whereby the separation layer 14 can be easily formed, and when it is attached, it can be performed. Evenly attached.

The separation layer 14 may also be deteriorated by absorbing light from laser irradiation. That is, in order to deteriorate the separation layer 14, the light irradiated to the separation layer 14 may be irradiated from a laser. Examples of the laser that emits light that illuminates the separation layer 14 include solid lasers such as YAG lasers, ruby lasers, glass lasers, YVO ₄ lasers, LD lasers, and fiber lasers. Laser lasers such as liquid lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers, semiconductor lasers, free electron lasers, etc., or other non-laser light. The laser light that emits the light that is incident on the separation layer 14 can be appropriately selected in accordance with the material constituting the separation layer 14, and a laser that can illuminate the wavelength ray that deteriorates the material constituting the separation layer 14 can be selected.

(fluorocarbon)

The separation layer 14 can be made of a fluorocarbon. The separation layer 14 is made of a fluorocarbon and is deteriorated by absorbing light, and as a result, the strength or adhesiveness before receiving light irradiation is lost. Thereby, the first support plate 13 and the substrate 11 can be easily separated by applying a slight external force (for example, raising the first support plate 13 or the like) to break the separation layer 14. The fluorocarbon constituting the separation layer 14 is appropriately formed into a film by a plasma CVD (Chemical Vapor Deposition) method.

The fluorocarbon absorbs light having a wavelength within a specific range depending on the kind. By irradiating the separation layer with the wavelength light of the range absorbed by the fluorocarbon of the separation layer 14, the fluorocarbon can be appropriately deteriorated. However, it is preferable that the light absorption rate of the separation layer 14 is 80% or more.

As the light irradiated to the separation layer 14, corresponding to the wavelength at which the fluorocarbon can be absorbed, for example, a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, a fiber laser or the like can be suitably used. Laser lasers such as solid lasers, pigment lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers, semiconductor lasers, free electron lasers, etc. Or non-laser light. The wavelength at which the fluorocarbon can be deteriorated is not limited thereto, and for example, a range of 600 nm or less can be used.

(The polymer having a light absorbing structure contained in the repeating unit)

The separation layer 14 contains a structure having light absorbability in the repeat The unit of polymer can also be. The polymer is degraded by irradiation with light. The deterioration of the polymer is produced by absorbing the irradiated light by the above configuration. The separation layer 14 loses strength or adhesion before receiving light irradiation as a result of deterioration of the polymer. Thereby, the first support plate 13 and the substrate 11 can be easily separated by applying a slight external force (for example, raising the first support plate 13 or the like) to break the separation layer 14.

The above structure having light absorbing property absorbs light and causes a chemical structure in which a polymer containing the structure is deteriorated as a repeating unit. This structure is, for example, a radical of a conjugated π-electron system in which a benzene ring, a condensed ring or a heterocyclic ring which is substituted or non-substituted is formed. In more detail, the structure may be a cardo structure, or a diphenyl ketone structure present in the side chain of the above polymer, a diphenyl hydrazine structure, a diphenyl fluorene structure (double benzoquinone structure) ), biphenyl structure or benzidine structure.

When the above structure exists in the side chain of the above polymer, the configuration can be expressed by the following formula.

(wherein R is independently independent and is an alkyl group, an aryl group, a halogen, a hydroxyl group, a keto group, an anthranylene group, a fluorenyl group or an N(R ¹ )(R ² ) group, (here, R ¹ And R ² each independently, is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms), Z is not present, or -CO-, -SO ₂ -, -SO- or -NH-, n is 0 or 1 An integer of ~5.)

Further, the polymer contains, for example, a repeating unit represented by any one of (a) to (d) in the following formula, or a structure represented by (e) or (f) is included in the main chain. .

(wherein l is an integer of 1 or more, m is 0 or an integer of 1 to 2, and X is in (a) to (e), and any of the formulas represented by the above "Chemical 2" is (f) ), the above-mentioned "of 2" shown in the formula according to any one of, or absence, Y ₁ and Y ₂ independently of each system, is, based CO- or -SO ₂ -.l preferably 10 or less The integer.)

Examples of the benzene ring, the condensed ring and the hetero ring represented by the above "Chemical Formula 2" include a phenyl group, a substituted phenyl group, a benzyl group, a substituted benzyl group, a naphthalene group, and a substituted naphthalene. 蒽, substitution 蒽, 蒽醌, substitution 蒽醌, acridine, replacement acridine, azobenzene, substituted azobenzene, hydrazine, substituted hydrazine, fluorenone, substituted fluorenone, carbazole, substituted carbazole, N - alkyl carbazole, diphenylfuran, substituted diphenylfuran, phenanthrene, substituted phenanthrene, anthracene and substituted hydrazine. When the exemplified substituent further has a substituent group, the substituent group may be, for example, selected from the group consisting of an alkyl group, an aryl group, a halogen atom, an alkoxy group, a nitro group, an aldehyde group, a nitrile group, a decylamino group, a dialkylamino group, Amidino, quinone imine, carboxylic acid, carboxylic acid ester, sulfonic acid, sulfonate, alkylamino and arylamine groups.

In the above-mentioned "Chemical Formula 2", as the substituent having the fifth substituent of the two phenyl groups, and Z being -SO ₂ -, bis(2,4-dihydroxyphenyl)fluorene is exemplified. , bis(3,4-dihydroxyphenyl)fluorene, bis(3,5-dihydroxyphenyl)fluorene, bis(3,6-dihydroxyphenyl)fluorene, bis(4-hydroxyphenyl)fluorene, Bis(3-hydroxyphenyl)fluorene, bis(2-hydroxyphenyl)fluorene, and bis(3,5-dimethyl-4-hydroxyphenyl)hydrazine.

In the above-mentioned "Chemical Formula 2", as the substituent having the fifth substituent of the two phenyl groups, and Z being -SO-, the bis(2,3-dihydroxyphenyl) afluorene may be mentioned. , bis(5-chloro-2,3-dihydroxyphenyl)arylene, bis(2,4-dihydroxyphenyl)anthracene, bis(2,4-dihydroxy-6-methylphenyl) Amidene, bis(5-chloro-2,4-dihydroxyphenyl)anthracene, bis(2,5-dihydroxyphenyl)anthracene, bis(3,4-dihydroxyphenyl)anthracene, Bis(3,5-dihydroxyphenyl)arylene, bis(2,3,4-trihydroxyphenyl)anthracene, bis(2,3,4-trihydroxy-6-methylphenyl) afluorene , bis(5-chloro-2,3,4-trihydroxyphenyl)arylene, bis(2,4,6-trihydroxyphenyl)anthracene, bis(5-chloro-2,4,6 - Trihydroxyphenyl) anthracene and the like.

In the above-mentioned "Chemical 2", the substituent has two phenyl groups. The case of the substitution group of 5 and the Z system-C(=O)- can be exemplified by 2,4-dihydroxydiphenyl ketone, 2,3,4-trihydroxydiphenyl ketone, 2, 2 ',4,4'-tetrahydroxydiphenyl ketone, 2,2',5,6'-tetrahydroxydiphenyl ketone, 2-hydroxy-4-methoxydiphenyl ketone, 2- Hydroxy-4-octyloxydiphenyl ketone, 2-hydroxy-4-dodecyloxydiphenyl ketone, 2,2'-dihydroxy-4-methoxydiphenyl ketone, 2 ,6-dihydroxy-4-methoxydiphenyl ketone, 2,2'-dihydroxy-4,4'-dimethoxydiphenyl ketone, 4-amino-2'-hydroxy Phenyl ketone, 4-dimethylamino-2'-hydroxydiphenyl ketone, 4-diethylamino-2'-hydroxydiphenyl ketone, 4-dimethylamino-4 '-Methoxy-2'-hydroxydiphenyl ketone, 4-dimethylamino-2',4'-dihydroxydiphenyl ketone, and 4-dimethylamino-3', 4'-dihydroxydiphenyl ketone and the like.

When the above structure is present in the side chain of the polymer, the ratio of the polymer containing the above-mentioned structure to the above-mentioned polymer is such that the light transmittance of the separation layer 14 is in the range of 0.001% or more and 10% or less. When the ratio is converged in such a range and the polymer is prepared, the separation layer 14 sufficiently absorbs light and can be surely and rapidly deteriorated. That is, it is easy to remove the first support plate 13 from the laminated body 100, and it is possible to shorten the irradiation time required for the removal.

The above structure is capable of absorbing light having a wavelength of a desired range depending on the selection of the kind. For example, it is more preferable that the wavelength of the light absorbable by the above structure is in the range of 100 nm or more and 2000 nm or less. Within this range, the wavelength of the light absorbable by the above structure is on the shorter wavelength side, for example, in the range of 100 nm or more and 500 nm or less. For example, the above structure It is preferred to modify the polymer containing the structure by absorbing ultraviolet light having a wavelength in the range of about 300 nm or more and 370 nm or less.

The light absorbing structure of the above structure is, for example, from a high pressure mercury lamp (wavelength: 254 nm or more, 436 nm or less), KrF excimer laser (wavelength: 248 nm), ArF excimer laser (wavelength: 193 nm), F2 excimer laser (wavelength) : 157 nm), XeCl laser (wavelength: 308 nm), XeF laser (wavelength: 351 nm) or solid UV laser (wavelength: 355 nm), or g line (wavelength: 436 nm), h line (wavelength: 405 nm) or i line (wavelength: 365 nm) or the like.

The separation layer 14 contains a polymer having the above structure as a repeating unit, but the separation layer 14 may further contain components other than the above polymer. Examples of the component include a filler, a plasticizer, and a component which can improve the peelability of the first support sheet 13. These components can be suitably selected from conventionally known materials or materials which do not hinder or promote the light absorption and the deterioration of the polymer.

(inorganic matter)

The separation layer 14 can be made of an inorganic substance. The separation layer 14 is made of an inorganic substance and is deteriorated by absorbing light, and as a result, the strength or adhesiveness before receiving light irradiation is lost. Thereby, the first support plate 13 and the substrate 11 can be easily separated by applying a slight external force (for example, raising the first support plate 13 or the like) to break the separation layer 14.

The inorganic material may be modified by absorbing light, and for example, one or more inorganic substances selected from the group consisting of a metal, a metal compound, and carbon may be used as appropriate. The metal compound means a compound containing a metal atom, and may be, for example, a metal oxide or a metal nitride. Examples of such an inorganic substance are not limited thereto, and are selected from the group consisting of gold, silver, copper, iron, nickel, aluminum, titanium, chromium, SiO ₂ , SiN, Si ₃ N ₄ , TiN, and carbon. One or more inorganic substances. However, the carbon system includes the concept of a carbon allotrope, and may be, for example, diamond, fullerene, diamond-like carbon, carbon nanotube, or the like.

The inorganic substance absorbs light having a wavelength in a specific range via this type. By irradiating the separation layer with the wavelength light of the range absorbed by the inorganic substance of the separation layer 14, the inorganic substance can be appropriately modified.

As the light which is irradiated to the separation layer 14 of the inorganic substance, YAG laser, ruby laser, glass laser, YVO ₄ laser, LD laser, fiber laser, etc. can be used depending on the wavelength at which the inorganic substance can absorb. Thunder of solid lasers, pigment lasers, liquid lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers, semiconductor lasers, free electron lasers, etc. Light or non-laser light.

The inorganic material-separated layer 14 can be formed on the first support plate 13 by a known technique such as sputtering, chemical vapor deposition (CVD), electroplating, plasma CVD, or spin coating. The thickness of the separation layer 14 formed of the inorganic material is not particularly limited, and the film thickness of the light to be used can be sufficiently absorbed, and for example, the film thickness in the range of 0.05 μm or more and 10 μm or less is Better. Further, an adhesive may be applied to both surfaces or a single surface of the inorganic film (for example, a metal film) formed of the inorganic material constituting the separation layer 14 and attached to the first support plate 13 and the substrate 11.

However, when a metal film is used as the separation layer 14, depending on the film quality of the separation layer 14, the type of the laser light source, the laser output, etc., reflection of the laser or charging of the film may occur. For this reason, it is preferable to provide the anti-reflection film or the anti-static film on the upper or lower side of the separation layer 14 to achieve countermeasures such as the above.

(a compound having an infrared absorbing structure)

The separation layer 14 may be formed by a compound having an infrared absorbing structure. This compound is modified by absorption of infrared rays. The separation layer 14 loses strength or adhesion before receiving infrared radiation as a result of deterioration of the compound. Thereby, the first support plate 13 and the substrate 11 can be easily separated by applying a slight external force (for example, lifting the support or the like) to break the separation layer 14.

The compound which has a structure having an infrared absorbing property or a structure having infrared absorbing properties may be, for example, an alkane or an olefin (vinyl group, cis, trans, vinylidene, trisubstituted, tetrasubstituted, conjugated, Algae, cyclic formula, alkyne (one substitution, two substitution), monocyclic aromatic (benzene, one substitution, two substitution, three substitution), alcohol and phenol (free OH, intramolecular hydrogen bonding, molecule Inter-hydrogen bonding, saturated second stage, saturated third stage, unsaturated second stage, unsaturated third stage), acetal, ketal, aliphatic ether, aromatic ether, vinyl ether, oxirane ring Ether, peroxide ether, ketone, dialkylcarbonyl, aromatic carbonyl, 1,3-diketone enol, o-hydroxyaryl ketone, dialkyl aldehyde group, aromatic aldehyde group, carboxylic acid (two Quantity, carboxylic acid anion), formic acid ester, acetate, conjugated ester, non-conjugated ester, aromatic ester, lactone (β-, γ-, δ-), aliphatic oxychloride, aromatic chlorine Oxide, acid anhydride (conjugated, non-conjugated, cyclic, acyclic), first-grade guanamine, second-grade guanamine, indoleamine, first-grade amine (aliphatic) Aromatic), second-grade amine group (aliphatic, aromatic), tertiary amine group (aliphatic, aromatic), first-grade amine salt, second-grade amine salt, tertiary amine salt, ammonium ion , aliphatic nitrile, aromatic nitrile, carbodiimide, aliphatic isonitrile, aromatic isonitrile, isocyanate, thiocyanate, aliphatic isothiocyanate, aromatic isothiocyanate, aliphatic nitrate Base compound, aromatic nitro compound, nitroamine, nitrosamine, nitrate, nitrite, nitro group (aliphatic, aromatic, mono-, di-dimer), mercaptan and thiophenol and sulfur Sulfur compound such as hydroxy acid, thiocarbonyl, hydrazine, hydrazine, sulfonium chloride, first-stage sulfonamide, second-stage sulfonamide, sulfate, carbon-halogen combination, Si-A ¹ binding (A ¹ H, C, O or halogen), PA ² binding (A ² system H, C or O), or Ti-O bonding.

Examples of the structure including the above-described carbon-halogen bond include -CH ₂ Cl, -CH ₂ Br, -CH ₂ I, -CF ₂ -, -CF ₃ , -CH=CF ₂ , -CF=CF ₂ , Aryl fluoride and aryl chloride.

Examples of the structure including the Si-A ¹ bond described above include SiH, SiH ₂ , SiH ₃ , Si-CH ₃ , Si-CH ₂ -, Si-C ₆ H ₅ , SiO-aliphatic, Si-OCH ₃ , Si—OCH ₂ CH ₃ , Si—OC ₆ H ₅ , Si—O—Si, Si—OH, SiF, SiF ₂ , and SiF ₃ . As the structure including the Si-A ¹ bond, it is preferable to form a siloxane chain and a sesquiterpene skeleton.

Examples of the structure including the above PA ² combination include PH, PH ₂ , P-CH ₃ , P-CH ₂ -, PC ₆ H ₅ , A ³ ₃ -PO (A ³ aliphatic or aromatic), A ⁴ O) ₃ -PO (A ⁴ alkyl group), P-OCH ₃ , P-OCH ₂ CH ₃ , P-OC ₆ H ₅ , POP, P-OH, and O=P-OH.

The above structure is capable of absorbing infrared rays having a wavelength of a desired range depending on the selection of the kind. Specifically, the wavelength of the infrared ray that can be absorbed by the above-described structure is, for example, in the range of 1 μm or more and 20 μm or less, and can be suitably absorbed in the range of 2 μm or more and 15 μm or less. Further, when the above structure is Si-O bonding, Si-C bonding, and Ti-O bonding, it may be in the range of 9 μm or more and 11 μm or less. However, the wavelength of the infrared light that can be absorbed by each configuration can be easily understood by the practitioner. For example, as an absorption band for each structure, refer to the non-patent literature: SILVERSTEIN. BASSLER. MORRILL is described in "Quality of Organic Compounds (5th Edition) - Combination of MS, IR, NMR, and UV-" (published in 1992) on pages 146 to 151.

The compound having the structure having the infrared absorbing property formed in the separation layer 14 is not particularly limited as long as it is soluble in the solvent and solidified to form a solid layer for coating. However, in order to effectively deteriorate the compound of the separation layer 14, the first support plate 13 and the substrate 11 can be easily separated, and the absorption of infrared rays by the separation layer 14 is large, that is, the transmittance of infrared rays when the separation layer 14 is irradiated with infrared rays is low. It is better. Specifically, the transmittance of the infrared ray of the separation layer 14 is preferably less than 90%, and the transmittance of infrared rays is preferably less than 80%.

In the case of the compound having a siloxane skeleton, for example, a repeating unit represented by the following chemical formula (3) and a copolymer of the repeating unit represented by the following chemical formula (4) can be used. A resin or a resin of a repeating unit represented by the following chemical formula (3) and a copolymer of a repeating unit derived from an acrylic compound.

(In the chemical formula (4), R ³ is hydrogen, an alkyl group having 10 or less carbon atoms, or an alkoxy group having 10 or less carbon atoms.)

Among them, as the compound having a siloxane skeleton, t-butyl styrene of a repeating unit represented by the above chemical formula (3) and a repeating unit of the following chemical formula (5) is preferable. The TBST)-dimethyloxane copolymer is more preferably a repeating unit represented by the above chemical formula (3) and a repeating unit represented by the following chemical formula (5), and a 1:1 containing TBST-dimethylene. A base oxyalkylene copolymer.

In addition, as the compound having a sesquiterpene skeleton, for example, a repeating unit represented by the following chemical formula (6) and a resin of a repeating unit copolymer represented by the following chemical formula (7) can be used.

(In the chemical formula (6), R ⁴ is hydrogen or an alkyl group having 1 or more carbon atoms and 10 or less, and in the chemical formula (7), R ⁵ is an alkyl group having 1 or more carbon atoms and 10 or less carbon atoms or a phenyl group.

As a compound having a sesquiterpene oxyalkylene skeleton, it is possible to use Japanese Patent Laid-Open Publication No. 2007-258663 (published on Oct. 4, 2007) and JP-A-2010-120901 (2010) Each of the sesquiterpene oxides disclosed in Japanese Laid-Open Patent Publication No. 2009-263316 (published on Nov. 12, 2009) and JP-A-2009-263596 (published on Nov. 12, 2009) Resin.

In particular, the compound having a sesquiterpene oxide skeleton is preferably a repeating unit represented by the following chemical formula (8) and a copolymer of the repeating unit represented by the following chemical formula (9), more preferably The repeating unit represented by the chemical formula (8) and the repeating unit represented by the following chemical formula (9) are copolymers of 7:3.

The polymer having a sesquioxane skeleton may be a random structure, a ladder structure, or a cage structure, and any of the structures may be used.

Further, examples of the compound containing Ti-O bond include, for example, (i) tetra-i-propoxytitanium, tetra-n-butoxytitanium, tetrakis(2-ethylhexyloxy)titanium, and Titanium alkoxide such as titanium-i-propoxyethyl hexanediol; (ii) di-i-propoxy group. Chelating titanium such as titanium (acetonitrile acetonate) titanium and propyl dioxy titanium bis (acetic acid ethyl acetate); (iii) iC ₃ H ₇ O-[-Ti(OiC ₃ H ₇ ) ₂ -O -] _n -iC ₃ H ₇ , and nC ₄ H ₉ O-[-Ti(OnC ₄ H ₉ ) ₂ -O-] _n -nC ₄ H ₉ and other titanium polymers; (iv) tri-n-butoxy Deuteration of base titanium monostearic acid, titanium stearate, di-i-propoxy titanium diisostearate, and (2-n-butoxycarbonylbenzoic acid) tributoxide titanium Titanium; (v) di-n-butoxy. A water-soluble titanium compound such as a screw (triethanolamine) titanium or the like.

Among them, as a compound containing Ti-O, with di-n-butoxy. Bis(triethanolamine)titanium (Ti(OC ₄ H ₉ ) ₂ [OC ₂ H ₄ N(C ₂ H ₄ OH) ₂ ] ₂ ) is preferred.

Although the separation layer 14 contains a compound having an infrared absorbing structure, the separation layer 14 may further contain components other than the above compounds. Examples of the component include a filler, a plasticizer, and a component which can improve the peelability of the first support sheet 13. These components can be suitably selected from conventionally known substances or materials which do not hinder or promote the absorption of infrared rays and the deterioration of the compound by the above structure.

(infrared absorbing material)

The separation layer 14 may contain an infrared absorbing material. The separation layer 14 is composed of an infrared absorbing material and is deteriorated by absorbing light, and as a result, the strength or adhesiveness before receiving light irradiation is lost. Thereby, the first support plate 13 and the substrate 11 can be easily separated by applying a slight external force (for example, raising the first support plate 13 or the like) to break the separation layer 14.

The infrared ray absorbing material may be modified by absorbing infrared rays. For example, carbon black, iron particles, or aluminum particles may be used as appropriate. The infrared absorbing material absorbs light having a wavelength in a specific range depending on the kind. By irradiating the separation layer 14 with the wavelength light of the range absorbed by the infrared absorbing material of the separation layer 14, the infrared absorbing material can be appropriately deteriorated.

(first attached project)

As shown in FIG. 1(f), in the first attachment process, the first support plate 13 and the substrate 11 are attached via the first adhesive layer 12. In the first attachment process, the first adhesive layer 12 is overlapped with the separation layer 14 on the first support plate by heating one of the pair of plate members under reduced pressure, and the substrate 11 is placed next to each other. It is also possible to bond with the first support plate 13. Thereby, the laminated body 50 can be formed. However, in the first attachment process, the attachment temperature, the attachment pressure, and the attachment time of the attachment substrate 11 and the first support plate 13 may be adjusted in accordance with the type of the first adhesive.

The laminate 50 formed by the first attachment process is a laminate in which the substrate 11 and the first adhesive layer 12, the separation layer 14, and the first support plate 13 are laminated in this order. In the process of laminating the second support plate 23 to the laminate 50, the laminate 50 supports the substrate 11 via the first support plate 13, and the substrate 11 can be prevented from being damaged.

[Adhesive removal part of the outer part of the work 2]

As shown in (g) of FIG. 1, in the processing method of one embodiment, after the first attaching process, the outer peripheral portion of the first adhesive layer is removed before the second attaching process.

Thereby, in the first attachment process, the first adhesive layer 12 that overflows when the substrate 11 and the first support plate 13 are bonded can be appropriately removed. When the laminated body 50 is formed, the outer periphery of the first adhesive layer 12 is removed from the laminated body 50, and the laminated body formed from the subsequent engineering can be prevented. 100 overflows too much adhesive layer.

In the outer peripheral portion removal process 2 of the adhesive, the same solution as the outer peripheral portion of the adhesive is removed, and the outer peripheral portion of the first adhesive layer 12 overflowing from the laminated body 50 is removed by the same method. . Here, it is preferable to remove the outer peripheral portion of the substrate 11 of the first adhesive layer 12 from the end portion of the outer periphery of the substrate toward the inner side in a width of 0.0 mm or more and 1.0 mm or less. Further, when the first adhesive layer 12 is formed on the first support plate 13, the outer peripheral portion of the first adhesive layer 12 formed on the first support plate 13 may be removed. Here, the outer peripheral portion of the first support plate 13 of the first adhesive layer 12 is removed from the end portion of the outer periphery of the first support plate 13 toward the inner side, preferably in a range of 0.0 mm or more and 1.0 mm or less. It is better. Thereby, in the subsequent second attachment process, the overflow of the first adhesive layer can be suppressed. Further, it is possible to prevent the end portion of the substrate 11 from being excessively exposed from the first adhesive layer, and in the subsequent processes, it is possible to prevent the end portion of the substrate from being chipped.

However, in the present embodiment, the outer peripheral portion of the adhesive removal process 2 is performed before the thinning process of (a) of Fig. 2, but is not limited thereto. The outer peripheral portion removal process 2 of the adhesive can be carried out after the thinning process of (a) of FIG. 2 as long as the laminate 50 is formed.

(thinning project)

As shown in FIG. 2(a), in the processing method according to the embodiment, after the first attaching process, before the second attaching process, the first support for thinning the backing substrate 11 is further included. Thin chemical on the side of the board 13 Cheng. The thinning process is performed by polishing the substrate 11 via a grinding machine or the like, for example. Thereby, the substrate 11 can be made to have a specific thickness.

[Second Adhesive Coating Engineering]

In the processing method according to the embodiment, the adhesive is applied to at least one of the substrate 11 and the second support plate (second support) to form the second adhesive layer 22 before the second attachment process. The second layer of adhesive coating works.

As shown in FIG. 2(b), in one embodiment, the second adhesive layer 22 is applied onto the substrate 11 which is thinned by thinning. However, the second adhesive layer 22 is attached to the substrate 11 and is subjected to a method used in the first adhesive layer coating process such as spin coating. Further, in the processing method of the present invention, the substrate 11 of the laminate 50 and the second support sheet may be bonded together via the second adhesive layer 22. Therefore, the second adhesive layer coating process may be an embodiment in which the second support sheet is coated with an adhesive.

(second adhesive layer 22)

The second adhesive layer 22 is the substrate 11 and the second support plate 23 to which the laminate 50 is adhered. Here, in order to obtain the method of forming the second adhesive layer 22, the thickness of the second adhesive layer 22, and the type of adhesive used as the second adhesive for forming the second adhesive layer 22, The glass transition temperature and the like are the same as those of the first adhesive layer 12 described above. However, such matters are in the first adhesive layer 12 and the second adhesive layer 22 Can be the same or different.

In particular, the second adhesive layer 22 may be formed using the same adhesive as the first adhesive layer 12, or may be formed using an adhesive different from the first adhesive layer 12. Here, when the adhesive forming the second adhesive layer 22 is different from the adhesive forming the first adhesive layer 12, the melting point of the adhesive forming the second adhesive layer 22 is formed first. It is preferred that the adhesive of the adhesive layer 12 has a lower melting point. Thereby, in the second attachment process, the laminate 100 can be formed at a lower temperature. Therefore, in the second attachment process, the melting of the first adhesive layer 12 can be prevented.

[Adhesive peripheral part removal engineering 3]

As shown in FIG. 2(c), in the processing method of one embodiment, after the second adhesive coating process, the first adhesive layer 12 and the second layer are removed before the second attachment process. The outer peripheral portion of the adhesive layer 22.

Thereby, in the second attachment process, the first adhesive layer 12 and the second adhesive layer 22 can be appropriately prevented from overflowing from the laminate 100.

In the outer peripheral portion removal process 3 of the adhesive, the same solution as the outer portions of the adhesive is removed, and the outer peripheral portion of the second adhesive layer 22 formed on the substrate 11 is removed by the same method. can. Here, the base of the first adhesive layer 12 is removed from the end portion of the outer periphery of the substrate 11 toward the inner side, preferably 0.0 mm or more, 3.0 mm or less, more preferably 0.5 mm or more and 1.5 mm or less. The outer peripheral portion of the plate 11 is preferred. Further, the width of the outer peripheral portion of the second adhesive layer 12 to be removed may be appropriately adjusted in accordance with the type of the adhesive, the amount of the coating, the type of the substrate, and the like. Further, when the second adhesive layer 22 is formed on the second support plate 23, the outer peripheral portion of the second adhesive layer 22 formed on the second support plate 23 may be removed. Here, the first adhesive layer is removed from the end portion of the outer periphery of the second support plate 23 toward the inner side, preferably 0.0 mm or more, 3.0 mm or less, more preferably 0.5 mm or more and 1.5 mm or less. The outer peripheral portion of the second support board 23 of 12 is preferable.

Further, by removing the outer peripheral portion of the first adhesive layer 12 and then the second attachment process, the overflow of the first adhesive layer 12 can be appropriately suppressed, and the end portion of the substrate 11 can be prevented from being adhered from the first adhesive. The layer is excessively exposed to produce debris.

Further, the adhesive agent forming the second adhesive layer 22 is prevented from adhering to the first support sheet 13 of the laminate 100 by removing the outer peripheral portion of the second adhesive layer 22. Therefore, in the subsequent separation process, after the light of the separation layer 14 is irradiated, the first support plate 13 can be separated from the laminated body 100 without imparting excessive force.

[Second separation layer formation project]

As shown in (d) and (e) of FIG. 2, the second separation layer forming process is performed on one surface of the first support plate 13 to form a separation layer 24 which is deteriorated by irradiation with light. However, the second adhesive layer coating process and the second separation layer forming engineering are completed before the start of the second attachment process described below. However, the order in which the two projects are implemented is not limited, and the two projects may be implemented in parallel.

(second support board 23)

The second support plate 23 supports the support of the substrate 11. The second support plate 23 is attached to the substrate 11 via the second adhesive layer 22.

For example, in the process of transporting the substrate 11 or flip chip mounting, the second support plate 23 is required to have the necessary strength to prevent the substrate 11 from being damaged or deformed, and is transmitted through the light for separating the layer 14 . In view of the above, the second support plate 23 is the same as the first support plate 13, and examples thereof include glass, enamel, and acrylic resin.

Further, the second support plate forms the separation layer 24. Here, the separation layer 24 is formed of a material which is oxidized by the light irradiated through the second support plate 23, and can be formed of the same material as the separation layer 14 formed on the first support plate 13.

(second attachment project)

As shown in FIG. 2(f), in the second attachment process, the substrate 11 of the second support plate 23 and the laminate 50 is attached via the separation layer 24 and the second adhesive layer 22.

In the second attachment process, the second adhesive layer 22 of the substrate 11 formed on the laminate 50 is overlapped with the separation layer 24 formed on the second support plate 23 by heating one of the pair of plate members. It is also possible to fit together. Thereby, the laminated body 100 can be formed. However, the second In the attaching process, the bonding temperature, the attaching pressure, and the attaching time of the attaching substrate 11 and the second supporting plate 23 may be adjusted in accordance with the type of the second adhesive layer 22.

[Adhesive peripheral part removal engineering 4]

As shown in FIG. 2(g), in the processing method according to the embodiment, after the second attachment process, at least one of the outer peripheral portions of the first and second adhesive layers is removed before the separation process.

In the outer peripheral portion removal process 4 of the adhesive, the first adhesive layer 12 or the second overflowing from the laminate 100 is removed by the same method using the same solution as the outer peripheral portion of the adhesive removal process 1 to 3. The outer part of the adhesive layer can be used. Further, in the outer peripheral portion removing process 4 of the adhesive, the first adhesive layer 12 or the second one is appropriately removed corresponding to the extent that the first adhesive layer 12 or the second adhesive layer 22 overflows from the laminated body 100. The outer peripheral portion of the adhesive layer 22 may be sufficient. Thereby, the excess first adhesive layer 12 adhering to the first support plate 13 can be removed. Therefore, in the subsequent separation process, after the light of the separation layer 14 is irradiated, the first support plate 13 can be separated from the laminated body 100 without imparting excessive force. Further, the excess second adhesive layer 22 adhering to the outer peripheral portion of the laminated body 100 is removed, and the substrate 11 is appropriately supported by the second support sheet 23 via the second adhesive layer 22. Further, the first support plate 13 is separated, and after the substrate 11 supported by the second support plate 23 is subjected to a desired process, after the light is applied to the separation layer 24, the substrate 11 can be separated from the second support plate 23 without applying excessive force. .

(Layer 100)

The outline of the laminate 100 formed by the processing method of one embodiment will be described with reference to Fig. 3(a). Fig. 3 (a) is a schematic view showing a laminate 100 formed by a processing method according to an embodiment of the present invention.

As shown in FIG. 3(a), the laminate 100 is such that the first support plate 13, the first adhesive layer 12, the substrate 11, the second adhesive layer 22, the separation layer 24, and the second support plate 23 are This sequence is a layered laminate. Here, as shown in FIG. 3(a), the laminate 100 removes the outer peripheral portions of the first adhesive layer 12 and the second adhesive layer 22. Further, a separation layer 14 is formed between the first support plate 13 and the first adhesive layer 12.

[Separation Engineering]

The separation process included in the processing method of one embodiment will be described with reference to Fig. 4 . Fig. 4 (a) is a schematic view showing a cross section of the laminate 100.

As shown in FIG. 4(b), in the separation process included in the processing method of one embodiment, the laser light that has deteriorated the separation layer 14 is irradiated onto the separation layer 14.

In the separation process, it is not necessary to dissolve the first adhesive layer 12 of the laminate 100 via the solution. For this reason, the first adhesive sheet 22 can be separated from the laminated body 100 without dissolving the second adhesive layer 22. also, By irradiating light through the first support plate 13, the separation layer 14 of the laminate 100 can be deteriorated (Fig. 4 (c)). Therefore, the first support plate 13 can be separated from the laminated body 100 without applying a large force to the laminated body 100 ((d) of Fig. 4). Therefore, when the first support plate 13 is separated from the laminated body 100, separation between the substrate 11 and the second support plate 23 can be prevented. For this reason, the substrate 11 can be appropriately supported by the second support plate 23 in a subsequent process such as flip chip mounting.

In addition, after the work such as flip chip mounting, the second support plate 23 is irradiated with light on the separation layer 24, and the separation layer 24 is degraded, whereby the substrate 11 can be separated from the second support plate 23 without applying excessive force.

[Other implementations]

The treatment method of the present invention is not limited to the above embodiment. For example, the coating amount of the adhesive forming the first adhesive layer 12 and the adhesive forming the second adhesive layer 22 can be an embodiment in which the peripheral portion of the adhesive is not removed.

That is, in the outer peripheral portion of the adhesive removal process 1 to 4, the second adhesive layer 22 corresponds to the coating amount of the first adhesive layer 12, the first adhesive layer 12 overflowing from the laminate 50, and the second adhesive layer 22. The coating amount, the degree of overflow of the second adhesive layer 22 from the laminate 100, and the like may be appropriately selected or not.

Here, in the outer peripheral portion removal process 1 to 4 of the adhesive, the process 3 is removed through the outer peripheral portion of the adhesive, and the first adhesive layer 12 and the second adhesive layer 22 are removed by one process to be most effective. The rate is the highest priority, and the removal of the outer part, 1, 2, and 4 can be performed arbitrarily. Further, only the outer peripheral portion removing process 2 or only the outer peripheral portion removing works 2 and 3 may be performed.

The layered body 100' which does not perform the peripheral portion removal process of the adhesive will be described with reference to Fig. 3(b). As shown in Fig. 3(b), in the laminated body 100', the separation layer 14 is also formed on the first support plate 13. Therefore, in the separation process, the separation layer 14 is irradiated with light through the first support plate 13, and the separation layer 14 can be deteriorated. Therefore, the first support plate 13 can be separated from the laminated body 100'.

Further, in the processing method of still other embodiments, the separation layer 24 may not be formed in the second support plate 23. In other words, the substrate 11 and the second support plate 23 may be laminated via the second adhesive layer 22 to form a laminate. In the present embodiment, after the substrate 11 is subjected to a work such as flip chip mounting, the second support plate 23 and the substrate 11 may be dissolved and separated by removing the solvent used in the outer peripheral portion of the adhesive. Here, in the second support plate, when the through hole is provided in the thickness direction, when the substrate 11 is peeled off from the second support plate, the solvent can flow between the support plate and the substrate via the hole. To this end, the solvent can be efficiently contacted to the second adhesive layer 22 to more effectively dissolve the second adhesive layer 22. For this reason, the substrate 11 can be easily peeled off from the second support sheet.

Further, in still another embodiment, the first adhesive layer coating process does not apply the adhesive to the substrate 11, and passes through the side of the separation layer 14 of the first support plate 13 on which the separation layer 14 is formed. The adhesive may be applied to form a first adhesive layer. Also, the second adhesive layer coating In the engineering system, an adhesive is applied to the substrate 11 of the laminate 50, and an adhesive is applied to the second support plate to form a second adhesive layer.

The present invention is not limited to the above embodiments, and various modifications can be made in the scope of the claims. The embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the present invention. The technical scope of the invention.

[Examples] [Evaluation of Separation of First Support Board]

As Examples 1 to 9, the first support sheet, the separation layer, the first adhesive layer, the wafer substrate, and the second layer were formed by changing the combination of the adhesive compositions A to C and the conditions of the attachment process. A laminate of the adhesive layer and the second support sheet is used to evaluate the separation of the first support sheets of the respective laminates.

(formation of laminate)

Examples 1 to 9 were formed according to the conditions described in Table 1 through the following procedures.

First, the preparation of the adhesive compositions A to C for forming the first or second adhesive layer is carried out. The contents of the adhesive compositions A to C are as follows.

Adhesive composition A: TZNR (registered trademark)-A4005 (manufactured by Tokyo Toka Chemical Industry Co., Ltd.)

Adhesive composition B: TZNR (registered trademark) - A4009 (manufactured by Tokyo Yinghua Industrial Co., Ltd.)

Adhesive composition C: TZNR (registered trademark) - A4012 (manufactured by Tokyo Yinghua Industrial Co., Ltd.)

Next, as shown in Table 1, the adhesive composition A to C was spin-coated on a semiconductor wafer substrate (12 inches, 矽) to have a film thickness of 50 μm (the first adhesive layer coating project) ), baking at a temperature of 90 ° C, 160 ° C, and 220 ° C for 4 minutes to form a first adhesive layer.

Next, as a first support plate, a 12-inch glass support plate (thickness: 700 μm) was used, and a separation layer (first separation layer forming process) was formed on the first support plate. As a condition for the formation of the first separation layer, the separation was carried out by using a C ₄ F ₈ CVD method under the conditions of a flow rate of 400 sccm, a pressure of 700 mTorr, a high-frequency power of 2,500 W, and a film formation temperature of 240 ° C. A layer of a fluorocarbon film (thickness: 1 μm) was formed on the first support plate.

Next, under vacuum, according to the first attachment temperature condition and the adhesion pressure condition described in Table 1, in the respective embodiments, the first support plate, the separation layer, the first adhesive layer, and the wafer substrate are sequentially applied in this order. Laminated to fit the laminate (first attachment project).

Next, the back surface of the wafer substrate was subjected to a thinning (50 μm) treatment (thinning process) by a grinding apparatus manufactured by DISCO Corporation. Further, in each of the examples, the adhesive composition was spin-coated with a film thickness of 50 μm on the surface of the wafer substrate thinned (the second adhesive layer coating process). Each was baked at a temperature of 90 ° C, 160 ° C, and 220 ° C for 4 minutes.

Then, the laminates of the examples 6 to 9 were rotated at 1,500 rpm, and the TZNR (registered trademark) HC thinner (manufactured by Tokyo Ohka Kogyo Co., Ltd.) was passed through the EBR nozzle. The supply amount of /min is supplied for 5 to 15 minutes, and the outer peripheral portion of the second adhesive layer is removed (the outer peripheral portion of the adhesive is removed). However, in the "width (mm) of the periphery of the adhesive outside the adhesive" in Table 1, "-" indicates that the second adhesive layer is not applied. In part, the length of each length from the end of the wafer substrate to the end of the second adhesive layer is such a length, indicating removal of the outer peripheral portion of the second adhesive layer.

Then, under the vacuum, according to the second attachment temperature condition and the adhesion pressure condition described in Table 1, the surface of the wafer substrate side of each laminate and the second support sheet are adhered via the second adhesive layer. Laminated body (second attachment project).

With respect to the laminates of Examples 1 to 9 formed as described above, the separation of the light was applied to the separation layer via the first support plate. As a condition for the separation process, the laminates of the respective embodiments are each from the first support plate side such that the wavelength of the laser light is 532 nm, the diameter of the laser light is 180 μm, and the irradiation range of the laser pulse is at the center of each other. The distance between the electrodes was 180 μm and the scanning speed was 7200 mm/s, and laser light irradiation (separation engineering) was performed at a repetition frequency of 40 kHz. Thereafter, the separation property of the laminate from the first support plate was evaluated for each laminate.

(result)

With respect to any of the laminates of Examples 1 to 9, the first support plate can be separated by the self-weight of the laminate without requiring a large force.

[Industrial availability]

The present invention can be widely used, for example, in the manufacturing process of a miniaturized semiconductor device.

Claims (6)

A processing method comprising: affixing a substrate to a surface of the first separation layer of a first support provided with a first separation layer that is modified by irradiation of light, via a first adhesive layer After the first attachment process and the first attachment process, the substrate is placed on the surface facing away from the first support surface of the substrate, via the second adhesive layer and the second separation layer. The second adhesive layer, the second separation layer, and the second support are attached to the first separation layer after the second attachment process of the second support and the second attachment process The first separation layer is deteriorated by irradiation of light, and the separation of the first support from the substrate is separated. The method according to claim 1, further comprising applying an adhesive to at least one of the substrate and the second support to form a second adhesive layer before the second attachment process The second adhesive layer coating process; after the second adhesive coating process, the outer portions of the first adhesive layer and the second adhesive layer are removed prior to the second attachment process. The method according to claim 1 or 2, further comprising applying an adhesive to at least one of the first support and the substrate to form a first adhesive layer before the first attachment process An adhesive coating process; after the first adhesive coating process, the outer peripheral portion of the first adhesive layer is removed prior to the first attachment process. The processing method described in claim 1 or 2 of the patent application, After the second attachment process, at least one of the outer peripheral portions of the first and second adhesive layers is removed before the separation process. The processing method according to claim 1 or 2, wherein, after the first attaching process, before the second attaching process, further comprising thinning the surface of the first support facing away from the substrate Chemical engineering. The processing method according to the first or second aspect of the invention, wherein, in the separating process, the laser light which modifies the first separation layer is irradiated onto the first separation layer.