TW201702617A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

To provide an electronic component conveyance device and an electronic component inspection device with which it is possible to increase the number of electronic components conveyed per unit time. An electronic component conveyance device comprises a conveyance unit capable of arranging a plurality of electronic components and conveying the same, a supply grasping unit capable of grasping the plurality of electronic components and arranging the same in the conveyance unit, and a supply recovery grasping unit for grasping the plurality of electronic components and supplying and recovering the same, the electronic component grasping pitch of the supply grasping unit being adjusted to be the same as the electronic component grasping pitch of the conveyance unit, the electronic component grasping pitch of the supply recovery grasping unit being larger than the electronic component grasping pitch of the conveyance, the supply grasping unit arranging the plurality of electronic components in the conveyance unit, the supply recovery gasping unit removing the plurality of electronic components from the conveyance unit separately in multiple operations.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

An electronic component inspection apparatus for inspecting electrical characteristics of an electronic component such as an IC device has been known, and an electronic component transportation apparatus for transporting an IC component to a holding portion of an inspection section is assembled in the electronic component inspection apparatus. . At the time of inspection of the IC device, the IC device is placed in the holding portion, and a plurality of probe pins provided in the holding portion are brought into contact with the respective terminals of the IC device.

The electronic component conveying device includes a member such as a dip panel that heats or cools the IC device in advance to be adjusted to check the temperature of the IC device, and a supply shuttle that transports the IC device after the temperature of the dip panel is adjusted to In the vicinity of the inspection unit, the first device transfer head transports the IC device between the tray and the dip plate in which the IC device is disposed, and the IC device between the dip plate and the supply shuttle; the recovery shuttle is transported after inspection The IC device; the second device transfer head that carries the IC device between the supply shuttle and the inspection unit, and the IC device between the inspection unit and the recovery shuttle; and the third device transfer head that performs the recovery shuttle Transfer of IC devices between the trays of the IC devices configured to be recycled.

The first device transfer head, the second device transfer head, and the third device transfer head respectively include a plurality of hand components that hold the IC device. Further, each of the hand components includes a suction nozzle for adsorbing the IC device, and the IC device 90 is held by adsorption by the suction nozzle. Further, the supply shuttle and the recovery shuttle each have a plurality of pockets for the IC device, and the inspection portion has a plurality of holding portions for the IC device.

Further, Patent Document 1 discloses a device handling apparatus for an IC processing machine in which the adsorption head interval 90 of each adsorption head 81 of the multiple adsorption head 80 is adjustable.

In the device transport apparatus for an IC processor, the adsorption head interval 90 is set to N times the device housing pocket interval 202 of the custom tray 100, and a plurality of test devices (DUTs) are adsorbed/liberated at one time.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 8-264993

In the conventional electronic component conveying apparatus, the distance between the holding portions of the inspection portion and the distance between the pockets of the supply shuttle are set to be the same. In this case, as long as the distance between the pockets of the supply shuttle is less than the maximum pitch of the nozzle of the hand assembly of the first device transport head, the distance between the nozzles of the hand assembly of the first device transport head can be adjusted to The distance from the pocket of the supply shuttle is the same, and all of the hand components of the first device transfer head simultaneously dispose the IC device in the pocket of the supply shuttle.

However, when the distance between the pockets of the supply shuttle is larger than the maximum distance of the nozzle of the hand assembly of the first device transfer head, all the hand components of the first device transfer head cannot simultaneously dispose the IC device in the concave of the supply shuttle. The hole, and thus the first device transfer head, divides the IC device into a plurality of pockets disposed in the supply shuttle. Therefore, the number of IC devices transported per unit time is reduced. The same applies to the third device transfer head.

Further, in the device transport apparatus for an IC processor described in Patent Document 1, the multi-head adsorption head 80 is formed to adsorb/liberate a plurality of test devices in the custom tray 100 at one time, but the patent is applied. In Document 1, a plurality of holding portions are not described in the inspection portion, and a plurality of devices to be tested are arranged in a manner. Therefore, in the device transport apparatus for an IC processor described in Patent Document 1, the number of IC devices that are transported per unit time can not be increased. the amount.

An object of the present invention is to provide an electronic component transport apparatus and an electronic component inspection apparatus which can increase the number of electronic components that are transported per unit time.

The present invention has been made to solve at least a part of the above problems, and can be realized as the following aspects or application examples.

[Application Example 1]

An electronic component transporting apparatus according to the present invention includes: a transporting unit that can arrange and transport a plurality of electronic components; and a supply holding unit that can hold a plurality of the electronic components and be disposed in the transporting unit; and supply and collect and hold a plurality of the electronic components can be supplied and recovered, and the electronic component holding pitch of the supply holding portion can be adjusted to be the same as the electronic component arrangement pitch of the transporting portion; and the electronic component for supplying and recycling the retaining portion The holding pitch is larger than the electronic component arrangement pitch of the transport unit; the supply holding unit places a plurality of the electronic components on the transport unit; and the supply/recovery unit extracts the plurality of electronic components from the transport unit in a plurality of times.

Thereby, the number of electronic parts transported per unit time can be increased.

[Application Example 2]

In the electronic component conveying apparatus of the present invention, it is preferable that the supply holding portion collectively arranges the plurality of electronic components in the conveying portion.

Thereby, the number of electronic parts transported per unit time can be increased.

[Application Example 3]

In the electronic component conveying apparatus of the present invention, it is preferable that the supply and collection holding portion is self-sustained until the electronic component is placed for a shorter period of time than when the supply holding portion is held until the electronic component is placed.

Thereby, the number of electronic parts transported per unit time can be increased.

[Application Example 4]

In the electronic component conveying apparatus of the present invention, it is preferable that the supply holding portion is movable in a direction in which a plurality of the electronic components are arranged and in a direction orthogonal to a direction in which the plurality of electronic components are arranged.

Thereby, the electronic component can be easily held.

[Application 5]

An electronic component transport apparatus according to the present invention includes: a transport unit that can arrange and transport a plurality of electronic components; and a recovery holding unit that can hold a plurality of the electronic components disposed in the transport unit from the transport unit And a supply recovery holding portion that can hold and recover a plurality of the electronic components, and the electronic component holding pitch of the recovery holding portion can be adjusted to be the same as the electronic component arrangement pitch of the transfer portion; The electronic component holding pitch of the recovery holding portion is larger than the electronic component arrangement pitch of the transfer portion; the supply recovery holding portion divides the plurality of electronic components into the transfer portion in plural times; and the recovery and retention portion divides the plurality of electronic components from the plurality of electronic components. The transfer unit is taken out.

Thereby, the number of electronic parts transported per unit time can be increased.

[Application Example 6]

In the electronic component conveying device of the present invention, it is preferable that the recycling and holding portion is A plurality of the above electronic components are collectively taken out from the transfer unit.

Thereby, the number of electronic parts transported per unit time can be increased.

[Application Example 7]

In the electronic component conveying apparatus of the present invention, it is preferable that the supply/retention holding portion is self-sustained until the electronic component is placed for a shorter period of time than when the recovery holding portion is held until the electronic component is placed.

Thereby, the number of electronic parts transported per unit time can be increased.

[Application Example 8]

In the electronic component conveying apparatus of the present invention, it is preferable that the recovery holding portion is movable in a direction in which a plurality of the electronic components are arranged and in a direction orthogonal to a direction in which the plurality of electronic components are arranged.

Thereby, the electronic component can be easily held.

[Application Example 9]

In the electronic component conveying apparatus of the present invention, it is preferable that a direction in which the plurality of electronic components are disposed in the conveying portion is the same as a conveying direction of the conveying portion.

Thereby, the time required for the supply/recovery holding portion to be placed or the electronic component to be taken out can be shortened.

[Application Example 10]

In the electronic component conveying apparatus of the present invention, preferably, when the electronic component is disposed or taken out from the supply/recovery holding portion, the supply/recovery holding portion is movable in a direction orthogonal to a direction in which the plurality of electronic components are disposed. The transport unit can be moved in a direction in which a plurality of the electronic components are arranged.

Thereby, the time required for the supply/recovery holding portion to be placed or the electronic component to be taken out can be shortened.

[Application Example 11]

In the electronic component conveying device of the present invention, it is preferable that the electronic component conveying device is disposed in the conveying portion The distance between the plurality of electronic components is a, and when the distance between the plurality of electronic components held by the supply and recovery holding portion is b, b/a is an integer of 2 or more.

Thereby, the electronic component can be disposed or taken out a minimum number of times when the electronic component is placed or taken out in the supply and recovery holding portion.

[Application Example 12]

In the electronic component transport apparatus of the present invention, it is preferable that the electronic component transporting unit has a holding portion that can hold the electronic component, and the supply/recovery holding unit can press the electronic component to the holding portion.

Thereby, the electronic component can be electrically connected to the probe pin provided in the holding portion by pressing the electronic component by the inspection holding portion.

[Application Example 13]

In the electronic component conveying apparatus of the present invention, it is preferable that two of the supply and collection holding portion and the conveying portion are provided.

Thereby, the two conveying units and the two supply and collection holding units are time-added to each other, and the number of electronic parts that are transported per unit time can be further increased.

[Application Example 14]

An electronic component inspection apparatus according to the present invention includes: a transfer unit that can arrange and transport a plurality of electronic components; and a supply holding portion that can hold a plurality of the electronic components and is disposed in the transfer unit; and supplies a recovery and retention unit a plurality of the electronic components can be supplied and recovered, and an inspection unit that inspects the electronic components; and the electronic component holding pitch of the supply holding portion can be adjusted to be the same as the electronic component arrangement pitch of the transporting portion The electronic component holding pitch of the supply recovery holding portion is larger than the electricity of the conveying portion The sub-part arrangement spacing; the supply holding unit disposing the plurality of electronic components on the transport unit; and the supply-recovery holding unit extracts the plurality of electronic components from the transport unit in a plurality of times.

Thereby, the number of electronic parts transported per unit time can be increased. Thereby, the time during which the inspection unit is not operated can be reduced, and the number of inspections of the electronic parts per unit time can be increased.

[Application Example 15]

An electronic component inspection device according to the present invention includes a transfer unit that can arrange and transport a plurality of electronic components, and a recovery holding portion that can hold a plurality of the electronic components disposed in the transfer portion from the transfer portion Taking out; supplying a recovery holding portion that can hold and collect a plurality of the electronic components; and an inspection portion that inspects the electronic component; and the electronic component holding pitch of the recovery holding portion can be adjusted to be the same as the transfer portion The electronic component arrangement pitch is the same; the electronic component holding pitch of the supply recovery holding portion is larger than the electronic component arrangement pitch of the transfer portion; and the supply recovery holding portion divides the plurality of electronic components into the transfer portion in plural times; The holding unit takes out a plurality of the electronic components from the transport unit.

Thereby, the number of electronic parts transported per unit time can be increased. Thereby, the time during which the inspection unit is not operated can be reduced, and the number of inspections of the electronic parts per unit time can be increased.

[Application Example 16]

In the electronic component inspection device of the present invention, it is preferable that the supply/recovery holding unit supplies the electronic component to the inspection unit and collects the same from the inspection unit.

Thereby, the electronic component can be supplied to the inspection unit by the supply recovery and holding unit to perform inspection, and after the inspection, the electronic component can be recovered from the inspection unit by the supply recovery and retention unit.

1‧‧‧Inspection device (electronic parts inspection device)

1-1~1-7‧‧‧Steps

2-1~2-7‧‧‧Steps

6‧‧‧Operation Department

11A‧‧‧1st pallet transport mechanism

11B‧‧‧2nd tray transport mechanism

12‧‧‧ Temperature adjustment section (dip sheet)

13‧‧‧1st device transport head

14‧‧‧Device Supply Department (Supply Shuttle)

15‧‧‧3rd pallet transport mechanism

16‧‧‧Inspection Department

17‧‧‧2nd device transport head

18‧‧‧Device Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧3rd device transport head

21‧‧‧6th tray transport mechanism

22A‧‧‧4th tray transport mechanism

22B‧‧‧5th pallet transport mechanism

61‧‧‧ Input Department

62‧‧‧Display Department

80‧‧‧Control Department

90‧‧‧IC devices

131‧‧‧Hand components

132‧‧‧ nozzle

141‧‧ ‧ pocket

161‧‧‧ Keeping Department

175‧‧‧Hand components

176‧‧ ‧ nozzle

181‧‧‧ recess

200‧‧‧Tray

201‧‧‧Hand components

202‧‧‧ nozzle

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

P1~P6‧‧‧ spacing

P11~P16‧‧‧ spacing

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention.

Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1.

Fig. 3 is a plan view showing a main part of an inspection portion of the electronic component inspection device shown in Fig. 1.

Fig. 4 is a cross-sectional view showing a main portion of an inspection portion of the electronic component inspection device shown in Fig. 1.

Fig. 5 is a cross-sectional view showing a main portion of a device supply portion of the electronic component inspection device shown in Fig. 1.

Fig. 6 is a cross-sectional view showing the main part of the device recovery portion of the electronic component inspection device shown in Fig. 1.

Fig. 7 is a cross-sectional view showing a main part of a second device transfer head of the electronic component inspection device shown in Fig. 1.

Fig. 8 is a cross-sectional view showing a main part of a first device transfer head of the electronic component inspection device shown in Fig. 1.

Fig. 9 is a cross-sectional view showing a main part of a third device transfer head of the electronic component inspection device shown in Fig. 1.

10(a) and 10(b) are views for explaining the operation of the electronic component inspection device shown in Fig. 1 and the prior electronic component inspection device.

11(a) and 11(b) are views for explaining the operation of the electronic component inspection device shown in Fig. 1 and the prior electronic component inspection device.

12(a) and 12(b) are views for explaining the operation of the electronic component inspection device shown in Fig. 1 and the prior electronic component inspection device.

13(a) and 13(b) are views for explaining the operation of the electronic component inspection device shown in Fig. 1 and the prior electronic component inspection device.

14(a) and 14(b) are views for explaining the operation of the electronic component inspection device shown in Fig. 1 and the prior electronic component inspection device.

15(a) and 15(b) are views for explaining the operation of the electronic component inspection device shown in Fig. 1 and the prior electronic component inspection device.

16(a) and 16(b) are views for explaining the operation of the electronic component inspection device shown in Fig. 1 and the prior electronic component inspection device.

Fig. 17 is a graph showing the time required for the operation of the electronic component inspection device shown in Fig. 1 and the prior electronic component inspection device.

Fig. 18 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention.

Hereinafter, the electronic component conveying device and the electronic component inspection device according to the present invention will be described in detail based on the embodiments shown in the additional drawings.

<First embodiment>

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention. Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1. Fig. 3 is a plan view showing a main part of an inspection portion of the electronic component inspection device shown in Fig. 1. Fig. 4 is a cross-sectional view showing a main portion of an inspection portion of the electronic component inspection device shown in Fig. 1. Fig. 5 is a cross-sectional view showing a main portion of a device supply portion of the electronic component inspection device shown in Fig. 1. Fig. 6 is a cross-sectional view showing the main part of the device recovery portion of the electronic component inspection device shown in Fig. 1. Fig. 7 is a cross-sectional view showing a main part of a second device transfer head of the electronic component inspection device shown in Fig. 1. Figure 8 is a view showing the first device of the electronic component inspection device shown in Figure 1. A cross-sectional view of the main part of the head. Fig. 9 is a cross-sectional view showing a main part of a third device transfer head of the electronic component inspection device shown in Fig. 1. 10 to 16 are views for explaining the operation of the electronic component inspection device shown in Fig. 1 and the prior electronic component inspection device. Fig. 17 is a graph showing the time required for the operation of the electronic component inspection device shown in Fig. 1 and the prior electronic component inspection device. Fig. 18 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention.

In the following, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis (the same applies to FIG. 18). Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is also referred to as "X-direction", the direction parallel to the Y-axis is also referred to as "Y-direction", and the direction parallel to the Z-axis is also referred to as "Z-direction". Further, the direction of the arrow of each of the X-axis, the Y-axis, and the Z-axis is referred to as a positive side, and the direction opposite to the arrow is referred to as a negative side. Further, the upstream side of the transport direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Moreover, the "level" as used in the present specification is not limited to a complete level, and includes a state of being slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as the electronic component is not hindered from being transported.

In the following, for convenience of explanation, the upper side in FIGS. 4 to 9 is referred to as "upper" or "upper", the lower side is referred to as "lower" or "lower", and the lower side is referred to as "right", and the left side is referred to as "right". "left".

In addition, in FIGS. 10 to 16, for the sake of easy understanding, the same reference numerals as those of the inspection apparatus 1 of the present embodiment are also attached to the previous inspection apparatus.

The inspection device (electronic component inspection device) 1 shown in Figure 1 is used for detection. Test (hereinafter referred to as "inspection"), such as BGA (Ball Grid Array) package or LGA (Land Grid Array) package IC device, LCD (Liquid Crystal Display), A device for electrical characteristics of electronic components such as CIS (CMOS Image Sensor). In addition, in the following, for convenience of explanation, as an example of using the IC device as the above-mentioned electronic component for inspection, Description will be made and the IC device will be referred to as "IC device 90".

As shown in FIG. 1, the inspection apparatus 1 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, and a device collection area (hereinafter simply referred to as "recycling area") A4. And the tray removal area A5. These regions are separated from each other by a wall portion or a gate or the like (not shown). Therefore, the supply region A2 is the first chamber R1 which is defined by a wall portion or a gate, and the inspection region A3 is the second chamber R2 which is defined by a wall portion or a gate, and the recovery region A4 is a wall portion or The third room R3 is drawn from the gate and other areas. Further, each of the first chamber R1 (supply region A2), the second chamber R2 (inspection region A3), and the third chamber R3 (recovery region A4) is configured to ensure airtightness and heat insulation. Thereby, the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible. Further, the first chamber R1 and the second chamber R2 can be controlled to a specific humidity and a specific temperature.

The IC device 90 sequentially passes through the above-described respective areas from the tray supply area A1 to the tray removal area A5, and is inspected in the inspection area A3 in the middle. In this manner, the inspection apparatus 1 is configured to include an electronic component transport apparatus that transports the IC device 90 in each area and that has the control unit 80, an inspection unit 16 that performs inspection in the inspection area A3, and an inspection control that is not shown. unit. Further, in the inspection apparatus 1, the electronic component conveying apparatus is constituted by a configuration other than the inspection unit 16 and the inspection control unit.

The tray supply area A1 supplies an area of the tray 200 in which a plurality of IC devices 90 in an unchecked state are arranged. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 supplies a plurality of IC devices 90 from the tray 200 of the tray supply area A1 to the area of the inspection area A3. In addition, the first tray transport mechanism 11A and the second tray transport mechanism 11B of the transport trays 200 are provided so as to straddle the tray supply area A1 and the supply area A2.

In the supply region A2, a temperature adjustment unit (dip sheet) 12, a first device transfer head (supply holding portion) 13, and a third tray transfer mechanism as arrangement portions for arranging the IC device 90 are provided. 15.

The temperature adjustment unit 12 heats or cools a plurality of IC devices 90, and adjusts (controls) them to a device suitable for inspecting the temperature of the IC device 90. That is, the temperature adjustment unit 12 is a temperature control member (member) that can dispose the IC device 90 and perform both heating and cooling of the IC device 90. In the configuration shown in FIG. 1, two temperature adjustment portions 12 are disposed and fixed in the Y direction. In addition, the IC device 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the first tray transport mechanism 11A is transported to any of the temperature adjustment units 12 and placed thereon.

The first device transfer head 13 is supported in the supply region A2 so as to be movable in the X direction (first direction), the Y direction (third direction), and the Z direction (second direction). Thereby, the first device transfer head 13 can carry the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and the IC between the temperature adjustment unit 12 and the device supply unit 14 to be described later. Transfer of device 90.

As shown in FIG. 8, the first device transfer head 13 has a plurality of hand assemblies 131 as holding portions for holding the IC device 90. The number of the hand units 131 is not particularly limited as long as it is plural, and in the present embodiment, eight cases will be described as one example. Further, since eight hand units 131 are arranged in a matrix in the X direction and two in the Y direction, in FIG. 8, only four hand units 131 arranged in one line in the X direction can be seen. Since the configuration of each hand unit 131 is the same, one hand unit 131 will be representatively described below. In addition, in the description of the operation, four hand components 131 that can be seen are representatively described. The hand assembly 131 is provided with a suction nozzle 132 and is held by the adsorption IC device 90. In other words, the hand unit 131 is configured such that the IC device 90 is placed at the front end of the suction nozzle 132, and the air (fluid) is sucked by a pump (not shown) to set the inner cavity of the suction nozzle 132 to a negative pressure state. The front end of the suction nozzle 132 holds (adsorbs and holds) the IC device 90. Further, by supplying air (fluid) to another pump (not shown), the negative pressure state of the inner cavity of the suction nozzle 132 is released, and the IC device 90 held by the suction nozzle 132 is released.

Moreover, the distance between the hand components 131 (electronic component holding pitch) P5 can be adjusted, and appropriate Ground adjustment. In the present embodiment, in the inspection unit 16 and the device supply unit 14, the distance P5 between the hand units 131 is adjusted (set) to the distance between the holding portions 161 of the inspection unit 16 (electronic component arrangement pitch) P1 and the second device. The distance between the nozzles 176 of the hand assembly 175 of the transfer head 17 (the electronic component holding pitch) P4 (b) is 1/2, and the distance from the pocket 141 of the device supply portion 14 (electronic component arrangement pitch) P2 (a) The same situation will be explained.

The third tray transport mechanism 15 is a mechanism that transports the empty tray 200 in the state in which the entire IC device 90 is removed in the X direction. Then, after the transfer, the empty tray 200 is transported back to the tray supply area A1 from the supply area A2 by the second tray transfer mechanism 11B.

The inspection area A3 is an area in which the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14 that is a transport unit (supply transport unit) that can transport and transport the IC device 90, an inspection unit 16, and a second device transfer head (supply recovery and retention unit) 17 are provided. And a device collection unit (recycling shuttle) 18 that is a transport unit (recycling and transport unit) that can transport and transport the IC device 90.

The device supply unit 14 includes a layout plate on which the IC device 90 is disposed, and a device supply unit body that is movable in the X direction, and the layout plate is detachably provided to the device supply unit body. The device supply unit 14 transports the temperature-adjusted (temperature-controlled) IC device 90 to a device in the vicinity of the inspection unit 16, and is movably supported between the supply region A2 and the inspection region A3 in the X direction. The IC device 90 on the temperature adjustment unit 12 is transferred to the device supply unit 14 by the first device transfer head 13 and placed thereon. Further, in the device supply unit 14, as in the temperature adjustment unit 12, a plurality of IC devices 90 can be heated or cooled to be adjusted to check the temperature of the IC device 90.

As will be described in more detail in the device supply unit 14, as shown in FIG. 5, a recess (electronic component placement portion) 141 as a plurality of recesses for housing (disposing) the IC device 90 is provided on the upper surface of the device supply portion 14. . Each IC device 90 is housed in each of the pockets 141, and is disposed in the device supply portion 14.

The shape, size (dimension), and arrangement (position) of each of the pockets 141 are set according to the shape, size (size) of the IC device 90 to be inspected, and the arrangement of the holding portion 161 of the inspection portion 16. In the present embodiment, the case where the distance P2 between the pockets 141 is set to be 1/2 of the distance P1 between the holding portions 161 of the inspection portion 16 and the nozzle 176 of the hand assembly 175 is 1/2 of the distance P4.

Further, the magnitude relationship between the pitch P2 (a), the pitch P1, and the pitch P4 (b) is not particularly limited as long as the pitch P1 and the pitch P4 are larger than the pitch P2, but P1/P2 and P4(b)/P2(a) It is preferably an integer of 2 or more.

Further, in the present embodiment, as viewed in the Z direction in Fig. 1, the outside of the recess 141 has a shape corresponding to the outer shape of the IC device 90, that is, a quadrangular shape.

In addition, the number of the pockets 141 is not particularly limited as long as it is plural, and in the present embodiment, eight (4 × 2) cases are described as one example. Further, since eight pockets 141 are arranged in a matrix in the X direction and two in the Y direction, in FIG. 5, only four pockets 141 in the X direction are arranged in one row. In addition, in the description of the operation, four pockets 141 that can be seen are representatively described.

Inspection Department 16 is inspected. The components of the electrical characteristics of the IC device 90 are tested, i.e., the components of the IC device 90 are maintained while the IC device 90 is being inspected. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90 in a state of holding the IC device 90. Then, the terminal of the IC device 90 is electrically connected (contacted) to the probe pin, and the inspection of the IC device 90 is performed via the probe pin. The inspection of the IC device 90 is performed based on a program stored in the memory unit of the inspection control unit provided in the test unit (not shown) connected to the inspection unit 16. Further, in the inspection unit 16, similarly to the temperature adjustment unit 12, a plurality of IC devices 90 may be heated or cooled to be adjusted to check the temperature of the IC device 90.

As will be described in more detail in the inspection unit 16, as shown in FIGS. 3 and 4, a holding portion (electronic component placement portion) as a plurality of concave portions for housing (holding) the IC device 90 is provided on the upper surface of the inspection portion 16. 161. Each IC device 90 is housed in each of the holding portions 161, and is disposed in the inspection portion 16.

The shape, size (dimension), and arrangement (position) of each holding portion 161 are set in accordance with the shape, size (size), and the like of the IC device 90 to be inspected. In the present embodiment, the holding portion 161 is provided. The distance P1 is set to be the same as the distance P4 between the nozzles 176 of the hand assembly 175 of the second device transfer head 17.

Further, in the present embodiment, the IC device 90 has a quadrangular shape as viewed from the Z direction in Fig. 1 (in a plan view), and therefore, the holding portion 161 has a shape corresponding to the shape of the IC device 90, that is, a square shape.

In addition, the number of the holding portions 161 is not particularly limited as long as it is plural, and in the present embodiment, eight cases will be described as one example. Further, eight holding portions 161 are arranged in a matrix in four in the X direction and two in the Y direction. In the description of the operation, four holding portions 161 which are arranged in one line in the X direction are typically described.

The second device transfer head 17 is supported in the inspection area A3 so as to be movable in the Y direction and the Z direction. Further, the second device transfer head 17 can transport the IC device 90 on the device supply unit 14 carried in from the supply region A2 to the inspection unit 16, and can carry the IC device 90 on the inspection unit 16 to the IC device 90. The device recovery unit 18 is placed and placed. When the IC device 90 is inspected, the second device transfer head 17 presses the IC device 90 toward the inspection unit 16, whereby the IC device 90 is brought into contact with the inspection portion 16. Thereby, the terminal of the IC device 90 is electrically connected to the probe pin of the inspection portion 16 as described above.

As shown in FIG. 7, the second device transfer head 17 has a plurality of hand assemblies 175 as holding portions for holding the IC device 90. The number of the hand components 175 is not particularly limited as long as it is plural, and in the present embodiment, eight cases will be described as one example. Further, four hand members 175 are arranged in a matrix in the X direction and two in the Y direction. Therefore, in FIG. 7, only four hand members 175 arranged in one line in the X direction can be seen. Since the configuration of each hand unit 175 is the same, one hand unit 175 will be representatively described below. In addition, in the description of the operation, four hand components 175 that can be seen are representatively described. The hand assembly 175 is provided with a suction nozzle 176 to hold the IC device 90 by adsorption. That is, the hand unit 175 is configured to dispose the IC device 90 at the front end portion of the suction nozzle 176, and suck the air (fluid) by driving a pump (not shown) to set the inner cavity of the suction nozzle 176 to a negative pressure state. The front end of the suction nozzle 176 is held (sucked Attached to the IC device 90. Further, by supplying air (fluid) to another pump (not shown), the negative pressure state of the inner cavity of the suction nozzle 176 is released, and the IC device 90 held by the suction nozzle 176 is released.

Moreover, the distance P1 between the hand components 175 (electronic component holding pitch) P4 and the holding portion 161 of the inspection portion 16 is set to be the same.

Further, in each of the hand units 175, a plurality of IC devices 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and can be adjusted to check the temperature of the IC device 90.

The device recovery unit 18 includes a layout plate on which the IC device 90 is disposed, and a device collection unit body that is movable in the X direction, and the layout plate is detachably provided in the device collection unit body. The device recovery unit 18 is a device that transports the IC device 90 after the inspection by the inspection unit 16 to the collection area A4, and is movably supported between the inspection area A3 and the collection area A4 in the X direction. The IC device 90 on the inspection unit 16 is transported to the device recovery unit 18 by the second device transfer head 17, and placed.

As will be described in more detail in the device recovery unit 18, as shown in FIG. 6, a recess (electronic component placement portion) 181 as a plurality of recesses for housing (disposing) the IC device 90 is provided on the upper surface of the device recovery portion 18. . Each IC device 90 is housed in each of the pockets 181, and is disposed in the device collecting portion 18.

The shape, size (dimension), and arrangement (position) of each of the pockets 181 are set according to the shape, size (size) of the IC device 90 to be inspected, and the arrangement of the holding portion 161 of the inspection portion 16. In the present embodiment, the distance between the pockets 181 (electronic component arrangement pitch) P3 is set to be 1/2 of the distance P1 between the holding portions 161 of the inspection portion 16 and the nozzle 176 of the hand assembly 175. Description.

Further, the magnitude relationship between the pitch P3 (a), the pitch P1, and the pitch P4 (b) is not particularly limited as long as the pitch P1 and the pitch P4 are larger than the pitch P3, but P1/P3 and P4(b)/P3(a) It is preferably an integer of 2 or more.

Further, in the present embodiment, as viewed in the Z direction in Fig. 1, the outside of the recess 181 has a shape corresponding to the outer shape of the IC device 90, that is, a square shape.

In addition, the number of the pockets 181 is not particularly limited as long as it is plural, and in the present embodiment, eight (4 × 2) cases are described as one example. Further, since eight pits 181 are arranged in a matrix in the X direction and two in the Y direction, in FIG. 6, only four pockets 181 arranged in one line in the X direction can be seen. In addition, in the description of the operation, four pockets 181 that can be seen are representatively described.

The recovery area A4 is the area of the IC device 90 after the end of the inspection. In the collection area A4, a recovery tray 19, a third device transfer head (recovery holding unit) 20, and a sixth tray transfer mechanism 21 are provided. Further, an empty tray 200 is also prepared in the collection area A4.

The recovery tray 19 is fixed in the collection area A4, and in the configuration shown in Fig. 1, three are arranged in the X direction. Further, three empty trays 200 are also arranged in the X direction. Then, the IC device 90 moved to the device recovery unit 18 of the recovery area A4 is transported to any of the recovery trays 19 and the empty trays 200, and placed thereon. Thereby, the IC device 90 is recovered and classified for the inspection result.

The third device transfer head 20 is supported in the recovery area A4 so as to be movable in the X direction, the Y direction, and the Z direction. Thereby, the third device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

As shown in FIG. 9, the third device transfer head 20 has a plurality of hand assemblies 201 as holding portions for holding the IC device 90. The number of the hand units 201 is not particularly limited as long as it is plural, and in the present embodiment, eight cases will be described as one example. Further, four hand units 201 are arranged in a matrix in the X direction and two in the Y direction. Therefore, in FIG. 9, only four hand units 201 arranged in one line in the X direction can be seen. Since the configuration of each hand unit 201 is the same, one hand unit 201 will be representatively described below. In addition, in the description of the operation, four hand components 201 that can be seen are representatively described. The hand assembly 201 is provided with a suction nozzle 202 to hold the IC device 90 by adsorption. In other words, the hand unit 201 is configured to discharge the air (fluid) by driving a pump (not shown) by disposing the IC device 90 at the front end of the nozzle 202, thereby setting the inner cavity of the nozzle 202 to a negative pressure state. The front end of the nozzle 202 is held (sucked Attached to the IC device 90. Further, by supplying air (fluid) to another pump (not shown), the negative pressure state of the inner cavity of the suction nozzle 202 is released, and the IC device 90 held by the suction nozzle 202 is released.

Further, the distance between the hand assemblies 201 (electronic component holding pitch) P6 is adjustable and has been appropriately adjusted. In the present embodiment, in the inspection unit 16 and the device collection unit 18, the distance P6 between the hand units 201 is adjusted (set) to the hand assembly of the distance P1 between the holding portions 161 of the inspection unit 16 and the second device transfer head 17. The case where the nozzles 176 of 175 are spaced apart by 1/2 of P4 and the distance from the pocket 181 of the device collecting portion 18 is the same as P3(a) will be described.

The sixth tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 in the X direction. Then, after the transfer, the tray 200 is placed at the position where the IC device 90 is collected, and any one of the above three empty trays 200 can be obtained.

The tray removal area A5 is an area in which the trays 200 of the plurality of IC devices 90 in which the inspection completion state is arranged are collected and removed. In the tray removal area A5, a plurality of trays 200 can be stacked.

Moreover, the fourth tray conveyance mechanism 22A and the fifth tray conveyance mechanism 22B of the transfer tray 200 are provided so as to straddle the collection area A4 and the tray removal area A5. The fourth tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism that transports the tray 200 for collecting the empty space of the IC device 90 from the tray removal area A5 to the collection area A4.

The inspection control unit of the tester performs inspection of electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory unit (not shown).

Further, as shown in FIG. 2, the inspection apparatus 1 includes a control unit 80, and an operation unit 6 that is electrically connected to the control unit 80 and performs each operation of the inspection apparatus 1. The control unit 80 controls, for example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, the temperature adjustment unit 12, the first device transport head 13, the device supply unit 14, the third tray transport mechanism 15, the inspection unit 16, and the second Device transfer head 17, device recovery unit 18, third device transfer head 20, and sixth tray transfer mechanism 21. Driving of each of the fourth tray transport mechanism 22A, the fifth tray transport mechanism 22B, and the display unit 62.

Further, the operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard, a mouse, and the like. In addition, the input unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. The operation of the operation unit 6 of the operator (operator) is performed by, for example, the operation input unit 61 moving the cursor to the position of each operation button (icon) displayed on the display unit 62, and selecting (clicking).

In addition, the input unit 61 is not limited to the above-described components, and examples thereof include a mechanical operation button such as a push button. In addition, the operation unit 6 is not limited to the above-described components, and examples thereof include a device such as a touch panel that can perform input and image display. Further, the display unit 62 of the operation unit 6 constitutes a notification unit.

Next, an operation when the IC device 90 is transported by the inspection apparatus 1 will be described.

Moreover, in order to facilitate understanding, the operation of the conventional inspection apparatus for transporting the IC device 90 will be described.

The premise is that the distance P1 between the holding portions 161 of the inspection portion 16 of the inspection device 1 and the suction nozzle 176 of the hand assembly 175 of the second device transfer head 17 are larger than the hand assembly 131 of the first device transfer head 13 by P4. The maximum distance between the nozzles 132 and the distance P5 from the nozzles 202 of the hand assembly 201 of the third device transport head 20 is the maximum distance between the nozzles 202. In this case, the inspection device 1 can increase the average unit time transport of the IC device 90. The number.

First, the dimensions of the respective portions of the inspection apparatus 1 of the present embodiment are set to be the same as the distance P1 between the holding portion 161 of the inspection portion 16 and the nozzle 176 of the hand assembly 175 of the second device transfer head 17 as described above. . Further, P1 and P4 are set to, for example, 60 mm.

Further, the distance P1 between the pockets 141 of the device supply portion 14, the distance P3 between the pockets 181 of the device recovery portion 18, the distance P5 between the nozzles 132 of the hand assembly 131 of the first device transfer head 13, and the third device transfer head. The nozzles 202 of the 20 hand assembly 201 are the same distance P6, and the spacing is the same P2, P3, P5, and P6 are 1/2 of the pitches P1 and P4. Further, P2, P3, P5, and P6 are set to, for example, 30 mm.

On the other hand, the dimensions of the respective portions of the previous inspection device are as shown in Fig. 10(b), and the distance between the pockets 141 of the device supply portion 14 is P12, the distance between the holding portions 161 of the inspection portion 16 is P11, and the device recovery portion is The distance P18 between the pockets 181 of 18 and the nozzle 176 of the hand assembly 175 of the second device transfer head 17 are set to be the same. Further, P11, P12, P13, and P14 are set to, for example, 60 mm.

Moreover, the distance between the nozzle 132 of the hand assembly 131 of the first device transfer head 13 and the nozzle 202 of the hand assembly 201 of the third device transfer head 20 are the same as P16, and the pitches P15 and P16 are the pitch P11. 1/2 of P12, P13 and P14. Further, P15 and P16 are set to, for example, 30 mm.

First, the operation of the previous inspection apparatus will be described.

[Step 2-1]

In the conventional inspection apparatus, as shown in FIG. 10(b), the first device transfer head 13 is held by the IC device 90 disposed in the temperature adjustment unit 12 by the respective hand units 131, and is moved to the positive side in the Z direction, and The X direction and the Y direction move in at least one direction, that is, move to the upper side of the device supply portion 14, and then move to the negative side in the Z direction, and the two IC devices 90 of the four IC devices 90 are disposed in the device supply portion 14. Two of the four pockets 141 are 141. The time required for this step 2-1 is set to "1". In addition, the above-mentioned required time is not marked with a unit such as "second", but is displayed as a relative value, and is not a strict value, but is a rough value.

[Step 2-2]

Next, as shown in FIG. 11(b), the first device transfer head 13 moves to the positive side in the Z direction, moves to the positive side in the X direction, and then moves to the negative side in the Z direction, and arranges the remaining two IC devices 90. The remaining two pockets 141 of the device supply portion 14. The time required for this step 2-2 is "1". As described above, in the conventional inspection apparatus, the first device transfer head 13 divides the four (multiple) IC devices 90 held in two times (multiple times) in the respective pockets of the device supply portion 14. 141.

[Step 2-3]

Next, as shown in FIG. 12(b), the device supply unit 14 is moved to the positive side in the X direction, that is, to the lower side of the second device transfer head 17. The time required for this step 2-3 is "0.5".

[Step 2-4]

Next, as shown in FIG. 13(b), the second device transfer head 17 moves to the negative side in the Z direction, and each of the IC devices 90 disposed in the device supply portion 14 is held (extracted) by the respective hand units 175, and is directed to Z. The positive side of the direction moves, and moves to the negative side in the Y direction, that is, moves to the upper side of each of the holding portions 161 of the inspection portion 16 of each IC device 90, and then moves to the negative side in the Z direction, and the IC devices 90 are placed in the inspection portion. Each of the holding portions 161 of 16. The time required for this step 2-4 is "0.5". In the previous inspection apparatus, the second device transfer head 17 collectively takes out the four IC devices 90 from the respective pockets 141 of the device supply unit 14 and collectively arranges them in the respective holding portions 161 of the inspection unit 16.

In addition, the IC device 90 is inspected by the inspection unit 16 while the IC device 90 is pressed toward the respective holding portions 161 by the second device transfer head 17.

[Step 2-5]

Next, as shown in FIG. 14(b), the second device transfer head 17 holds the IC device 90 disposed in each of the holding portions 161 of the inspection unit 16 by the respective hand units 175, and moves to the positive side in the Z direction, and to Y. The positive side of the direction moves, that is, moves above the device recovery portion 18, and then moves to the negative side in the Z direction, and the IC devices 90 are placed in the respective recesses 181 of the device recovery portion 18. The time required for this step 2-5 is "0.5". As described above, in the conventional inspection apparatus, the second device transfer head 17 collectively takes out the four IC devices 90 from the respective holding portions 161 of the device inspection portion 16 and collectively arranges them in the respective pockets 181 of the device recovery portion 18.

[Step 2-6]

Next, as shown in Fig. 15 (b), the device recovery portion 18 moves to the positive side in the X direction.

Then, the third device transport head 20 moves in at least one of the X direction and the Y direction, That is, it moves to the upper side of the device recovery portion 18 and then moves to the negative side in the Z direction, and by the four hand components 201 of the four hand assemblies 201, 2 of the four IC devices 90 disposed in the device recovery portion 18 are held. IC devices 90. The time required for this step 2-6 is "1".

[Step 2-7]

Next, as shown in FIG. 16(b), the third device transfer head 20 moves to the positive side in the Z direction, moves to the positive side in the X direction, and then moves to the negative side in the Z direction, and holds the remaining two of the device recovery portions 18. IC device 90. The time required for this step 2-7 is "1". As described above, in the conventional inspection apparatus, the third device transfer head 20 divides the four IC devices 90 disposed in the device recovery unit 18 into two.

Further, next, the third device transport head 20 transports each of the IC devices 90 to any one of the collection tray 19 and the empty tray 200 based on the detection result.

Here, the time from the second device transfer head 17 being self-sustained to the configuration of the IC device 90 is shorter than the time from when the first device transfer head 13 is held to the configuration IC device 90. One of the reasons is that the first device transfer head 13 moves in the X direction not only in the Z direction but also in the second device when the IC device 90 is placed in the device supply unit 14 in the first device transfer head 13 . When the head 17 takes out the IC device 90 from the device supply unit 14 and when the IC device 90 is placed in the device recovery unit 18, the second device transfer head 17 moves in the Z direction, but in the X direction, the device supply unit 14 and the device are recovered. The part 18 moves.

Similarly, the second device transfer head 17 is self-sustained until the IC device 90 is disposed for a shorter period of time than when the third device transfer head 20 is self-sustained to the configuration IC device 90. One of the reasons is that the third device transfer unit 20 moves not only in the Z direction but also in the X direction with respect to the third device transfer head 20 when the IC device 90 is placed in the device recovery unit 18, and the second device When the transfer head 17 takes out the IC device 90 from the device supply unit 14 and when the IC device 90 is placed in the device recovery unit 18, the second device transfer head 17 moves in the Z direction, but in the X direction, the device supply unit 14 and the device The recovery unit 18 moves.

However, in the previous inspection apparatus, 4 ICs will be transferred with respect to the second device transfer head 17. The device 90 is taken out from the respective holding portions 161 of the inspection unit 16 and collectively disposed in the respective pockets 181 of the device recovery portion 18, and the first device transfer head 13 divides the four IC devices 90 held in the second configuration. In the respective pockets 141 of the device supply unit 14, the third device transfer head 20 divides the four IC devices 90 disposed in the device recovery unit 18 into two. That is, the number of operations of the second device transfer head 17 having a shorter time required is one time at the time of supply of the IC device 90, and once during the recovery of the IC device 90, that is, two times in total (steps 2-4, steps) 2-5), but the number of operations of the first device transfer head 13 and the third device transfer head 20 which take a long time is two times, that is, a total of four times (step 2-1, step 2-2, step 2-6, steps 2-7). Therefore, in the prior inspection apparatus, the time required for the transfer of the IC device 90 becomes long, and the number of IC devices 90 that are transported per unit time is small.

Next, the operation of the inspection apparatus 1 of the present embodiment will be described.

[Step 1-1]

In the inspection apparatus of the present embodiment, as shown in FIG. 10(a), the first device transfer head 13 is held by the IC device 90 disposed in the temperature adjustment unit 12 by the respective hand units 131, and is moved to the positive side in the Z direction. Further, it moves in at least one direction of the X direction and the Y direction, that is, moves above the device supply portion 14, and then moves to the negative side in the Z direction, and the IC devices 90 are placed in the respective pockets 141 of the device supply portion 14. The time required for this step 1-1 is "1". As described above, in the inspection apparatus 1, the first device transfer head 13 collectively arranges the four (plural) IC devices 90 held in the respective pockets 141 of the device supply unit 14.

[Step 1-2]

Next, as shown in FIG. 11(a), the device supply unit 14 moves to the positive side in the X direction, that is, to the lower side of the second device transfer head 17.

Then, the second device transfer head 17 is moved to the negative side in the Z direction, and 2 of the four IC devices 90 disposed in the device supply portion 14 are held (extracted) by the two hand members 175 of the four hand units 175. IC devices 90. The time required for this step 1-2 is "0.5".

[Step 1-3]

Then, as shown in FIG. 12(a), the second device transfer head 17 moves to the positive side in the Z direction, and the device supply portion 14 moves to the positive side in the X direction, and then the second device transfer head 17 moves to the negative side in the Z direction. The remaining two IC devices 90 disposed in the device supply portion 14 are held by the remaining two hand components 175. The time required for this step 1-3 is "0.5". As described above, in the inspection apparatus 1, the second device transfer head 17 takes out four (plural) IC devices 90 twice (multiple times) from the respective pockets 141 of the device supply unit 14.

[Step 1-4]

Then, as shown in FIG. 13(a), the second device transfer head 17 moves to the positive side in the Z direction, and moves to the negative side in the Y direction, that is, moves to the respective IC devices 90 above the respective holding portions 161 of the inspection portion 16. Then, it moves to the negative side in the Z direction, and each IC device 90 is placed in each holding portion 161 of the inspection unit 16. The time required for this step 1-4 is "0.5". As described above, in the inspection apparatus 1 , the second device transfer head 17 collectively arranges the four IC devices 90 in the respective holding portions 161 of the inspection unit 16 .

In addition, the IC device 90 is inspected by the inspection unit 16 while the IC device 90 is pressed toward the respective holding portions 161 by the second device transfer head 17.

[Step 1-5]

Next, as shown in FIG. 14(a), the second device transfer head 17 holds the IC device 90 disposed in each of the holding portions 161 of the inspection unit 16 by the respective hand units 175, and moves to the positive side in the Z direction, and to Y. The positive side of the direction moves, that is, moves above the device recovery portion 18, and then moves to the negative side in the Z direction, and two of the four IC devices 90 are disposed in the four pockets 181 of the device recovery portion 18. 2 pockets 181. The time required for this step 1-5 is "0.5".

[Step 1-6]

Then, as shown in Fig. 15 (a), the second device transfer head 17 moves to the positive side in the Z direction, and the device recovery portion 18 moves to the positive side in the X direction, and then the second device transfer head 17 moves to the negative side in the Z direction. The remaining two IC devices 90 are disposed in the remaining two pockets 181 of the device recovery portion 18. The time required for this step 1-6 is "0.5". Thus, in the inspection device 1, the second device The transfer head 17 divides the four IC devices 90 into the respective recesses 181 of the device recovery portion 18 twice.

[Step 1-7]

Next, as shown in Fig. 16 (a), the device recovery portion 18 is moved to the positive side in the X direction.

Then, the third device transport head 20 moves in at least one of the X direction and the Y direction, that is, moves to the upper side of the device recovery portion 18, and then moves to the negative side in the Z direction, and is held by the respective hand components 201. Each IC device 90 of the recovery unit 18 is used. The time required for this step 1-6 is "1". As described above, in the inspection apparatus 1, the third device transfer head 20 collectively takes out the four IC devices 90 disposed in the device collection unit 18.

Further, next, the third device transport head 20 transports each of the IC devices 90 to any one of the collection tray 19 and the empty tray 200 based on the detection result.

In the inspection apparatus 1, the second device transfer head 17 divides the four IC devices 90 into two recesses 141 of the device supply unit 14 twice, and divides the four IC devices 90 into two parts for device recovery. In the recesses 181 of the portion 18, the first device transfer head 13 collectively arranges the four IC devices 90 held in the respective pockets 141 of the device supply portion 14, and the third device transfer head 20 is disposed in the device. The four IC devices 90 of the recycling unit 18 are collectively held. That is, the number of operations of the second device transfer head 17 having a shorter time required is two times in the supply of the IC device 90, and two times in the recovery of the IC device 90, that is, four times in total (steps 1-2, steps). 1-3, Step 1-5, Step 1-6), but the number of operations of the first device transfer head 13 and the third device transfer head 20 which take a long time is one time, that is, a total of two times (steps) 1-1, steps 1-7). Therefore, in the inspection apparatus 1, the time required for the transfer of the IC device 90 becomes short, and the number of IC devices 90 that are transported per unit time can be increased.

The above results are shown in the graph of Fig. 17. The horizontal axis of Fig. 17 is the steps 1-1 to 1-7 of the inspection apparatus 1 of the present embodiment, and the steps 2-1 to 2-7 of the operation of the previous inspection apparatus, and the vertical axis is the present embodiment. The time required for each step 1-1 to 1-7 of the inspection apparatus 1 (required time), and the steps 2-1 to 2-7 required for the operation of the previous inspection apparatus time.

As shown in FIG. 17, in the inspection apparatus 1 of the present embodiment, the time required for steps 1-2 and 1-6 is shortened to the time required for steps 2-2 and 2-6 of the previous inspection apparatus, respectively. In half, it can be seen from this that in the inspection apparatus 1, the time required for the conveyance of the IC device 90 is shortened as compared with the previous inspection apparatus.

As described above, according to the inspection apparatus 1, the number of IC devices 90 that are transported per unit time can be increased.

Thereby, the time during which the inspection unit 16 is not operated can be reduced, and the number of inspections of the IC device 90 of the average unit time can be increased.

<Second embodiment>

Fig. 18 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention.

In the following, the second embodiment will be described, but the differences from the above-described first embodiment will be mainly described, and the description of the same matters will be omitted.

As shown in FIG. 18, in the inspection apparatus 1 of the second embodiment, the device supply unit 14, the device collection unit 18, and the second device transfer head 17 are arranged in the Y direction. Thereby, the number of IC devices 90 that are transported per unit time can be increased, so that the number of inspections of the IC device 90 of the average unit time can be increased.

Further, since there are two device supply units 14, they can be supplemented with each other in time. Similarly, since there are two device recovery units 18, they can be supplemented with each other in time. Similarly, since there are two second device transfer heads 17, Can be supplemented with each other in time. Thereby, the number of IC devices 90 that are transported per unit time can be further increased, so that the number of inspections of the IC device 90 of the average unit time can be further increased.

According to the second embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

As described above, the electronic component transporting apparatus and the electronic component inspection apparatus of the present invention are Although the embodiment is illustrated in the drawings, the present invention is not limited thereto, and the configuration of each unit may be replaced with any one of the components having the same function. Further, any other constituents may be added.

Furthermore, the present invention may be combined with any two or more of the configurations (characteristics) of the above embodiments.

16‧‧‧Inspection Department

161‧‧‧ Keeping Department

P1‧‧‧ spacing

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Claims (16)

An electronic component conveying apparatus comprising: a conveying unit that can arrange and transport a plurality of electronic components; and a supply holding unit that can hold a plurality of the electronic components and is disposed in the conveying unit; and a supply recovery holding unit The plurality of electronic components can be held and supplied for recovery; and the electronic component holding pitch of the supply holding portion can be adjusted to be the same as the electronic component arrangement pitch of the transporting portion; and the electronic component holding of the supply and recovery holding portion is retained. The pitch is larger than the electronic component arrangement pitch of the transport unit; the supply retaining unit places a plurality of the electronic components on the transport unit; and the supply/recovery unit extracts the plurality of electronic components from the transport unit in a plurality of times. The electronic component transport apparatus according to claim 1, wherein the supply holding unit collectively arranges the plurality of electronic components in the transport unit. The electronic component transporting apparatus according to claim 1 or 2, wherein the supply and recovery holding portion is self-sustained until the electronic component is disposed for a shorter period of time than when the supply holding portion is self-sustained until the electronic component is disposed. The electronic component transporting apparatus according to any one of claims 1 to 3, wherein the supply holding portion is movable in a direction in which a plurality of the electronic components are arranged and in a direction orthogonal to a direction in which the plurality of electronic components are arranged. An electronic component conveying device characterized by comprising: a conveying portion configurable and conveying a plurality of electronic components; a recovery holding unit that can hold a plurality of the electronic components disposed in the transport unit and take out from the transport unit; and supply and collect a retaining unit that can hold and collect a plurality of the electronic components, and supply and collect the plurality of electronic components; The electronic component holding pitch of the recovery holding portion can be adjusted to be the same as the electronic component arrangement pitch of the transfer portion; the electronic component holding pitch of the supply and recovery holding portion is larger than the electronic component arrangement pitch of the transfer portion; and the supply recovery holding portion is plural Each of the electronic components is disposed in the transfer unit at a plurality of times, and the recovery and retention unit takes out the plurality of electronic components from the transfer unit. The electronic component transport apparatus according to claim 5, wherein the recovery holding unit takes out a plurality of the electronic components in a total amount from the transport unit. The electronic component transporting apparatus according to claim 5 or 6, wherein the supply and recovery holding portion is self-sustained until the electronic component is disposed for a period of time shorter than the time during which the recovery holding portion is self-sustained until the electronic component is disposed. The electronic component transporting apparatus according to any one of claims 5 to 7, wherein the recovery holding portion is movable in a direction in which a plurality of the electronic components are arranged and in a direction orthogonal to a direction in which the plurality of electronic components are arranged. The electronic component transporting apparatus according to any one of claims 1 to 8, wherein a direction in which the plurality of electronic components are disposed in the transporting portion is the same as a transporting direction of the transporting section. The electronic component transporting apparatus according to any one of claims 1 to 9, wherein, in the case where the electronic component is disposed or taken out in the supply and recovery holding portion, the supply and recovery holding portion may be disposed in a direction of arranging the plurality of electronic components positive Moving in the direction of intersection, the transport unit can be moved in a direction in which a plurality of the electronic components are arranged. The electronic component conveying apparatus according to any one of claims 1 to 10, wherein the plurality of electronic components held by the supply and recovery holding portion are set to a between the plurality of electronic components disposed in the conveying portion When the distance between b is set to b, b/a is an integer of 2 or more. The electronic component conveying apparatus according to any one of claims 1 to 11, comprising: a holding portion that can hold the electronic component; and the supply and collection holding portion can press the electronic component to the holding portion. The electronic component conveying apparatus according to any one of claims 1 to 12, wherein the supply and collection holding unit and the conveying unit are provided separately. An electronic component inspection device comprising: a transfer unit that can arrange and transport a plurality of electronic components; and a supply holding portion that can hold a plurality of the electronic components and is disposed in the transfer unit; and supplies a recovery and retention unit; The electronic component can be supplied and recovered by the plurality of electronic components, and the inspection unit can inspect the electronic component; and the electronic component holding pitch of the supply holding portion can be adjusted to be the same as the electronic component arrangement pitch of the transporting portion; The electronic component holding pitch of the supply-recovery holding portion is larger than the electronic component arrangement pitch of the transporting portion; the supply holding portion is configured to arrange a plurality of the electronic components in the transporting portion; and the supply-recovering and retaining portion divides the plurality of electronic components into plural It is taken out from the above-mentioned conveyance part. An electronic component inspection device characterized by comprising: a transport unit that can arrange and transport a plurality of electronic components, and a recovery holding unit that can hold a plurality of the electronic components disposed in the transport unit and take out the transport unit; and supply and collect the plurality of electronic components; The electronic component is held and supplied and recovered; and the inspection unit checks the electronic component; and the electronic component holding pitch of the recovery holding portion is adjusted to be the same as the electronic component arrangement pitch of the transfer portion; and the supply recovery holding portion The electronic component holding pitch is larger than the electronic component arrangement pitch of the transport unit; the supply/recovery unit divides the plurality of electronic components into the transport unit in plural times; and the recovery and retention unit divides the plurality of electronic components from the transport unit. take out. The electronic component inspection apparatus according to claim 14 or 15, wherein the supply/recovery holding unit supplies the electronic component to the inspection unit and collects the same from the inspection unit.