JP2018141699A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device with which, when setting the operation of a conveyance unit, it is possible to make the setting easily and accurately.SOLUTION: Provided is an electronic component conveyance device comprising a conveyance unit for conveying an electronic component and a display unit that allows selection of a sequential setting mode for displaying a second setting screen after displaying a first setting screen. The first setting screen accepts first information for the electronic component to be conveyed by the conveyance unit, and the second setting screen accepts second information, different from the first information, for the electronic component to be conveyed by the conveyance unit.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an IC handler for conveying an IC device, that is, an electronic component conveyance. An apparatus is incorporated (for example, see Patent Document 1).

  In the electronic component transport apparatus described in Patent Document 1, various data inputs and various operation instruction inputs are performed on an operation screen displayed on the panel display. Further, when operating the operation screen, a help screen can be displayed on the panel display as needed. The help screen includes detailed information about the content explanation of the items included in the operation screen.

Japanese Patent Laid-Open No. 11-38084

  However, in the electronic component inspection apparatus described in Patent Document 1, even if the help screen is displayed, an operator unfamiliar with the operation screen, that is, a beginner of the operator, puts various data on items included in the operation screen. You may not be able to enter them in the correct order.

  Such an object is achieved by the present invention described below.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

The electronic component transport apparatus of the present invention includes a transport unit that transports an electronic component,
A display unit capable of selecting a sequential setting mode for displaying the second setting screen after displaying the first setting screen;
With
The first setting screen can receive first information for transporting the electronic component by the transport unit;
The second setting screen can receive second information different from the first information for transporting the electronic component by the transport unit.

  Thereby, when setting the operation | movement which conveys an electronic component with respect to a conveyance part, a setting mode can be selected sequentially. In this sequential setting mode, the first setting screen and the second setting screen for operation setting of the transport unit are displayed in this order. For example, when the operator is a beginner, the operator confirms the first setting screen and the second setting screen in accordance with the first setting screen and the second setting screen displayed in order on the display unit. The first information and the second information can be confirmed and input. Thereby, the operation setting of the transport unit is performed in the correct order without omission.

In the electronic component transport device of the present invention, a mounting portion on which the electronic component is mounted is installed,
It is preferable to include an imaging unit that can capture an image of the placement unit.

  Thereby, prior to the conveyance of the electronic component, the image of the placement unit can be captured by the imaging unit. Based on this captured image, the transport unit can be accurately moved to a target position (for example, an electronic component to be transported). And the conveyance part can hold | grip an electronic component correctly from on a mounting part in this movement destination. Or conversely, the transport unit can accurately release the electronic component onto the placement unit.

  In the electronic component conveying apparatus of the present invention, it is preferable that the imaging unit is mounted on the conveying unit.

  Thereby, prior to the conveyance of the electronic component, the image of the placement unit can be captured by the imaging unit. Based on this captured image, the transport unit can be accurately moved to a target position (for example, an electronic component to be transported). And the conveyance part can hold | grip an electronic component correctly from on a mounting part in this movement destination. Or conversely, the transport unit can accurately release the electronic component onto the placement unit.

  In the electronic component transport device of the present invention, at least one of the first information and the second information is information for transporting the electronic component by the transport unit based on the image of the placement unit. Is preferred.

  Thereby, the electronic component can be smoothly transported based on the image of the placement unit.

In the electronic component transport device of the present invention, the placement unit includes a plurality of recesses in which the electronic component is housed and arranged in a matrix.
At least one of the first information and the second information is:
Information for designating the recess as a reference in plan view when the transport unit grips the electronic component or releases the gripped electronic component,
Information for displaying the captured image of the recess serving as a reference when the transport unit grips the electronic component or releases the gripped electronic component,
Information for designating the concave portion that serves as a reference for the height with respect to the placement unit when the transport unit grips the electronic component or releases the gripped electronic component,
Either the information for designating the surface of the placement unit, which is a reference for the height when the transport unit grips the electronic component or releases the gripped electronic component. Is preferred.

  Such first information and second information become information necessary to quickly and accurately hold and release the electronic component as the distance between the pitches of the adjacent concave portions becomes smaller. As a result, the electronic component can be quickly and accurately grasped and released.

In the electronic component transport apparatus according to the aspect of the invention, the first information may be used to specify the concave portion that is a reference in a plan view when the transport unit grips the electronic component or releases the gripped electronic component. Information,
It is preferable that the second information is information for displaying a captured image of the recess serving as a reference when the transport unit grips the electronic component or releases the gripped electronic component.

  Since it is difficult to obtain a captured image of the recess unless the recess is specified, the order of such information is effective.

In the electronic component transport apparatus according to the aspect of the invention, the first information displays a captured image of the recess serving as a reference when the transport unit grips the electronic component or releases the gripped electronic component. Information,
The second information is information for designating a surface of the mounting portion that serves as a height reference when the transport unit grips the electronic component or releases the gripped electronic component. Is preferred.

  If the captured image of the concave portion is not obtained, it is difficult to grasp around the concave portion of the mounting portion, that is, where the upper surface of the mounting portion exists, and thus the order of such information is effective.

In the electronic component transport apparatus according to the aspect of the invention, the first information may be the concave portion that serves as a height reference with respect to the placement unit when the transport unit grips the electronic component or releases the gripped electronic component. Is information to specify
The second information is information for designating a surface of the mounting portion that serves as a height reference when the transport unit grips the electronic component or releases the gripped electronic component. Is preferred.

  If you do not specify the height reference recess, it will be difficult to grasp the positional relationship between the specified recess and the specified location on the top surface of the mounting part. The order of is valid.

  In the electronic component conveying apparatus of the present invention, it is preferable that the first setting screen includes a second setting screen display operation unit that displays the second setting screen.

  Thus, the first setting screen remains displayed on the display unit until the second setting screen display operation unit is operated. Therefore, for example, a time for sufficiently checking or inputting the first information is obtained. It can be secured sufficiently.

  In the electronic component transport device of the present invention, the first setting screen includes at least one check box, and when all the check boxes are checked, the second setting screen display operation unit can be operated. It is preferable that

  As a result, it is possible to prevent check omission for the check box.

  In the electronic component transport device of the present invention, it is preferable that the sequential setting mode includes a third setting screen.

  Thereby, for example, the third setting screen can be an image having a different function from the first setting screen and the second setting screen.

  In the electronic component transport device of the present invention, the display unit includes a third setting screen display operation unit that displays the third setting screen without displaying the first setting screen or the second setting screen. Preferably it is done.

  Thereby, the confirmation and input of the first information and the second information can be omitted.

  In the electronic component conveying apparatus of the present invention, it is preferable that the batch setting mode in which the first setting screen and the second setting screen are displayed side by side can be selected.

  Thereby, for example, when the operator is an expert, it is considered that the operation setting of the transport unit can be performed more quickly if the batch setting mode is selected than the sequential setting mode.

  In the electronic component conveying apparatus of the present invention, it is preferable that a mode selection operation unit capable of selecting either the sequential setting mode or the batch setting mode is displayed on the display unit.

  Thereby, the operator of the electronic component conveying apparatus can select either the sequential setting mode or the batch setting mode in accordance with the proficiency level of operating the electronic component inspection apparatus. For example, when the operator is an expert, the batch setting mode can be selected. Conversely, when the operator is a beginner, it is preferable to sequentially select the setting mode.

  In the electronic component conveying apparatus of the present invention, it is preferable that the sequential setting mode includes a batch setting mode transition operation unit capable of shifting to the batch setting mode from the middle of the sequential setting mode.

  Thereby, the sequential setting mode can be stopped halfway, and the input of the first information, the second information, etc. can be performed again in the batch setting mode.

  In the electronic component conveying apparatus of the present invention, it is preferable that the batch setting mode includes a sequential setting mode transition operation unit capable of shifting from the batch setting mode to the sequential setting mode.

  Thereby, the batch setting mode can be stopped, and the input of the first information, the second information, etc. can be performed again in the sequential setting mode.

In the electronic component transport device of the present invention, it can be connected to an inspection unit for inspecting the electronic component,
A supply region in which the electronic component before inspection is transported and supplied to the inspection unit;
A collection area in which the electronic component after the inspection is transported and recovered from the inspection section;
The sequential setting mode is preferably set for the supply area and the collection area.

  As a result, various conditions required for the operation of the transport unit in the supply area can be set in an accurate order without omission. Similarly, various conditions required for the operation of the transport unit in the collection area can be set in an accurate order without omission.

An electronic component inspection apparatus of the present invention includes a transport unit that transports an electronic component,
A display unit capable of selecting a sequential setting mode for displaying the second setting screen after displaying the first setting screen;
An inspection unit for inspecting the electronic component;
With
The first setting screen can receive first information for transporting the electronic component by the transport unit;
The second setting screen can receive second information different from the first information for transporting the electronic component by the transport unit.

  Thereby, when setting the operation | movement which conveys an electronic component with respect to a conveyance part, a setting mode can be selected sequentially. In this sequential setting mode, the first setting screen and the second setting screen for operation setting of the transport unit are displayed in this order. For example, when the operator is a beginner, the operator confirms the first setting screen and the second setting screen in accordance with the first setting screen and the second setting screen displayed in order on the display unit. The first information and the second information can be confirmed and input. Thereby, the operation setting of the transport unit is performed in the correct order without omission.

  Further, the electronic component can be transported to the inspection unit, and thus the inspection for the electronic component can be performed by the inspection unit. Moreover, the electronic component after inspection can be conveyed from the inspection unit.

FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 4 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 5 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 6 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 7 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 8 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 9 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 10 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 11 shows a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 12 shows a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 13 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 14 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 15 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 16 shows a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 17 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 18 shows a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 19 shows a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 20 shows a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 21 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 22 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 23 shows a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 24 shows a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

  Hereinafter, with reference to FIGS. 1-24, 1st Embodiment of the electronic component conveying apparatus and electronic component inspection apparatus of this invention is described. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as an “X direction (first direction)”, a direction parallel to the Y axis is also referred to as a “Y direction (second direction)”, and a direction parallel to the Z axis is referred to as “ Also referred to as “Z direction (third direction)”. The direction in which the arrow in each direction is directed is called “positive”, and the opposite direction is called “negative”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered.

The electronic component conveying apparatus 10 of the present invention has the appearance shown in FIG. 1 and has the arrangement (configuration) shown in FIG. The electronic component transport apparatus 10 is a handler and can select a device transport head 13 (transport unit 25) that transports electronic components and a sequential setting mode in which a second setting screen is displayed after the first setting screen is displayed. And a monitor 300 (display unit). The first setting screen displayed on the monitor 300 can accept the first information for conveying the electronic component by the device conveying head 13 (conveying unit 25), and the second setting screen can be received by the conveying unit 25. Second information different from the first information for conveying the parts can be received.
As a result, as described later, when setting an operation for conveying an electronic component while performing imaging by the imaging unit 131 to the device conveyance head 13 (conveyance unit 25) on which the imaging unit 131 is mounted, A setting mode can be selected. In this sequential setting mode, the first setting screen and the second setting screen for setting the operation of the device transport head 13 are displayed in this order. For example, when the operator is a beginner, the operator confirms the first setting screen and the second setting screen one by one according to the first setting screen and the second setting screen that are displayed in order on the monitor 300. The first information and the second information can be confirmed and input. Thereby, the operation setting of the device transport head 13 is performed in the correct order without omission.

As shown in FIG. 2, the electronic component inspection apparatus 1 of the present invention includes an electronic component transport apparatus 10 and further includes an inspection unit 16 that inspects the electronic component. In other words, the electronic component inspection apparatus 1 of the present invention can select the device transfer head 13 (transfer unit 25) for transferring electronic components and the sequential setting mode for displaying the second setting screen after displaying the first setting screen. A monitor 300 (display unit) and an inspection unit 16 for inspecting electronic components are provided. The first setting screen displayed on the monitor 300 can accept the first information for transporting the electronic component by the device transport head 13 (transport unit 25), and the second setting screen is displayed on the device transport head 13 ( Second information different from the first information can be received for transporting the electronic component by the transport unit 25).
Thereby, the electronic component inspection apparatus 1 which has the advantage of the electronic component conveying apparatus 10 mentioned above is obtained. Further, the electronic component can be transported to the inspection unit 16, and therefore, the inspection unit 16 can inspect the electronic component. In addition, the inspected electronic component can be transported from the inspection unit 16.
Hereinafter, the configuration of each unit will be described in detail.

  As shown in FIGS. 1 and 2, an electronic component inspection apparatus 1 incorporating an electronic component transport apparatus 10 transports electronic components such as an IC device that is a BGA (Ball Grid Array) package, for example. This is an apparatus for inspecting and testing the electrical characteristics of parts (hereinafter simply referred to as “inspection”). In the following, for convenience of explanation, the case where an IC device is used as the electronic component will be described as a representative, and this will be referred to as “IC device 90”. In this embodiment, the IC device 90 has a flat plate shape.

  In addition to the above-mentioned IC devices, for example, “LSI (Large Scale Integration)”, “CMOS (Complementary MOS)”, “CCD (Charge Coupled Device)”, or “modules” in which a plurality of IC devices are packaged. IC "," quartz device "," pressure sensor "," inertial sensor (acceleration sensor) "," gyro sensor "," fingerprint sensor ", and the like.

The electronic component inspection apparatus 1 (electronic component transport apparatus 10) includes a tray supply area A1, a device supply area A2 (supply area), an inspection area A3, a device collection area A4 (collection area), and a tray removal area A5. These regions are divided by each wall as will be described later. Then, the IC device 90 passes through the respective areas in the direction of the arrow α ₉₀ from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the electronic component inspection apparatus 1 includes the electronic component transport apparatus 10 including the transport unit 25 that transports the IC device 90 (electronic component) so as to pass through each region, and the inspection unit 16 that performs inspection in the inspection region A3. And a control unit 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 is the front side, and the inspection area A3 is arranged, that is, in FIG. The upper side is used as the back side.

  In addition, the electronic component inspection apparatus 1 is preinstalled (installed) with what is called a “Change Kit (also referred to as“ C / K ”)” that is exchanged for each type of IC device 90. The change kit includes a mounting member (mounting unit) on which the IC device 90 (electronic component) is mounted, and the mounting member includes a first member disposed in the device supply region A2. There are one mounting member and a second mounting member disposed in the device recovery area A4.Examples of the first mounting member include a temperature adjustment unit 12, a device supply unit 14, and a rotary stage 27, which will be described later. Examples of the second mounting member include a device collection unit 18 and a rotary stage 28, which will be described later, and the mounting member on which the IC device 90 is mounted includes a change kit as described above. Apart from the user There are also the tray 200, the recovery tray 19, and the inspection unit 16. The tray 200 arranged in the device supply area A2 can be referred to as a first placement member, and is arranged in the device collection area A4. The tray 200 and the recovery tray 19 can be said to be second mounting members.

  The tray supply area A1 is a material supply unit to which a tray 200 in which a plurality of untested IC devices 90 are arranged is supplied. The tray supply area A1 can also be said to be a mounting area in which a plurality of trays 200 can be stacked and mounted. In the present embodiment, each tray 200 has a plurality of recesses (pockets) arranged in a matrix. One IC device 90 can be stored in each recess.

The device supply area A2 is an area in which each IC device 90 (electronic component) before inspection on the tray 200 conveyed from the tray supply area A1 is conveyed and supplied to the inspection area A3 (inspection unit 16). Note that tray transport mechanisms 11A and 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply region A1 and the device supply region A2. The tray transport mechanism 11A is a part of the transport unit 25, and moves the tray 200 together with the IC device 90 placed on the tray 200 in the positive direction in the Y direction, that is, in the direction of the arrow _{α11A in} FIG. be able to. As a result, the IC device 90 can be stably fed into the device supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200 in the negative direction in the Y direction, that is, in the direction of the arrow _α11B in FIG. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

  The device supply area A2 includes a temperature adjustment unit (soak plate (English notation: soak plate, Chinese notation (example): soaking plate)) 12, a device transfer head 13, a tray transfer mechanism 15, and a rotary stage 27. And are provided. Further, a device supply unit 14 that moves so as to straddle the device supply area A2 and the inspection area A3 is also provided.

  The temperature adjustment unit 12 is a mounting member on which a plurality of IC devices 90 are mounted, and is referred to as a “soak plate” that can heat or cool the mounted IC devices 90 in a lump. With this soak plate, the IC device 90 before being inspected by the inspection unit 16 can be heated or cooled in advance and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any one of the temperature adjustment units 12. In addition, the temperature adjustment unit 12 as the mounting member can be stably adjusted with respect to the IC device 90 on the temperature adjustment unit 12 by being fixed. Further, the temperature adjusting unit 12 is grounded (grounded).

The device transport head 13 is a gripping part that grips the IC device 90, and is supported so as to be movable in the X direction and the Y direction within the device supply region A2, and is also supported so as to be movable in the Z direction. The device transport head 13 is also a part of the transport unit 25, and transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, the temperature adjustment unit 12, and a device described later. The IC device 90 can be transported to and from the supply unit 14. In FIG. 2, the movement of the device transport head 13 in the X direction is indicated by an arrow α _13X , and the movement of the device transport head 13 in the Y direction is indicated by an arrow α _13Y .

  The device supply unit 14 is a mounting member on which the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 is mounted. The “supply shuttle plate” can transport the IC device 90 to the vicinity of the inspection unit 16. Or it is simply called a “supply shuttle”. The device supply unit 14 can also be a part of the transport unit 25.

The device supply 14 as mounting member, between the examination region A3 and the device supply region A2 X direction, i.e., are reciprocally movably supported along an arrow alpha ₁₄ direction. As a result, the device supply unit 14 can stably transport the IC device 90 from the device supply region A2 to the vicinity of the inspection unit 16 in the inspection region A3. After 90 is removed by the device transport head 17, it can return to the device supply area A2 again.

  In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction. The device supply unit 14 on the Y direction negative side is referred to as “device supply unit 14A”, and the device supply unit on the Y direction positive side. 14 may be referred to as “device supply unit 14B”. Then, the IC device 90 on the temperature adjustment unit 12 is transported to the device supply unit 14A or the device supply unit 14B in the device supply region A2. Further, like the temperature adjustment unit 12, the device supply unit 14 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 14. As a result, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be transported to the vicinity of the inspection unit 16 in the inspection region A3 while maintaining the temperature adjustment state. The device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

A rotation stage 27 is disposed between the device supply unit 14A and the device supply unit 14B. The rotary stage 27 is supported so as to be rotatable in the direction of the arrow α ₂₇ around the Z axis. When the IC device 90 is placed on the device supply unit 14, the IC device 90 can be placed by changing (changing) the attitude of the IC device 90, that is, the orientation of the IC device 90 around the Z axis. The device 90 can be temporarily placed on the rotary stage 27. By rotating the rotary stage 27 in this mounted state, the posture of the IC device 90 can be changed. The IC device 90 whose posture has been changed is transported to the device supply unit 14 by the device transport head 13 in the same posture.

Tray transporting mechanism 15, the positive side of the X direction empty tray 200 in a state where all of the IC devices 90 is removed in the device supply area A2, i.e., a mechanism for conveying the arrow alpha ₁₅ direction. After this transport, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 for inspecting the IC device 90 and a device transport head 17 are provided.

The device transport head 17 is a part of the transport unit 25, and can hold the IC device 90 in which the temperature adjustment state is maintained and transport the IC device 90 in the inspection area A3. The device transport head 17 is supported so as to be reciprocally movable in the Y direction and the Z direction in the inspection area A3, and is a part of a mechanism called an “index arm”. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the device supply region A2 onto the inspection unit 16. In FIG. 2, the reciprocating movement of the device transport head 17 in the Y direction is indicated by an arrow α _17Y . The device transport head 17 is supported so as to be reciprocally movable in the Y direction, but is not limited thereto, and may be supported so as to be reciprocally movable in the X direction. In the configuration shown in FIG. 2, two device transport heads 17 are arranged in the Y direction. The device transport head 17 on the Y direction negative side is referred to as “device transport head 17A”, and the device on the Y direction positive side. The transport head 17 may be referred to as “device transport head 17B”. The device transport head 17A can take charge of transporting the IC device 90 from the device supply unit 14A to the test unit 16 in the inspection area A3, and the device transport head 17B is a device of the IC device 90 in the test area A3. Transport from the supply unit 14B to the inspection unit 16 can be performed.

  Further, the device transport head 17 is configured to be able to heat or cool the gripped IC device 90 in the same manner as the temperature adjustment unit 12. Thereby, the temperature adjustment state in the IC device 90 can be continuously maintained from the device supply unit 14 to the inspection unit 16.

  The inspection unit 16 can be connected to the electronic component transport apparatus 10, and in the connected state, the IC device 90 that is an electronic component is placed, and the electrical characteristics of the IC device 90 are inspected. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90. Then, the IC device 90 can be inspected when the terminals of the IC device 90 and the probe pins are electrically connected, that is, contacted. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. Note that, similarly to the temperature adjustment unit 12, the inspection unit 16 can also heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for the inspection.

  The device collection area A4 is an area that has been inspected in the inspection area A3 and has been inspected, that is, a plurality of IC devices 90 (electronic components) after inspection are transported from the inspection section 16 and collected. In the device recovery area A4, a recovery tray 19, a device transfer head 20, a tray transfer mechanism 21, and a rotary stage 28 are provided. Further, a device collection unit 18 that moves so as to straddle the inspection area A3 and the device collection area A4 is also provided. An empty tray 200 is also prepared in the device collection area A4.

  The device collection unit 18 is a mounting member on which the IC device 90 that has been inspected by the inspection unit 16 is placed and can transport the IC device 90 to the device collection region A4. It is simply called the “recovery shuttle”. The device collection unit 18 can also be a part of the transport unit 25.

The device collecting unit 18, between the examination region A3 and the device collection area A4 X-direction, i.e., are reciprocally movably supported along the arrow alpha ₁₈ direction. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the device collection unit 18 on the Y direction negative side is referred to as “device collection unit 18 </ b> A”. In other words, the device collection unit 18 on the Y direction positive side may be referred to as a “device collection unit 18B”. Then, the IC device 90 on the inspection unit 16 is transported to and placed on the device collection unit 18A or the device collection unit 18B. The IC device 90 is transported from the inspection unit 16 to the device recovery unit 18A by the device transport head 17A, and the transport from the inspection unit 16 to the device recovery unit 18B is performed by the device transport head 17B. The device collection unit 18 is also grounded, like the temperature adjustment unit 12 and the device supply unit 14.

  The collection tray 19 is a placement member on which the IC device 90 inspected by the inspection unit 16 is placed, and is fixed so as not to move in the device collection area A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the device collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. It becomes. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

  Three empty trays 200 are also arranged along the X direction. This empty tray 200 also serves as a placement member on which the IC device 90 inspected by the inspection unit 16 is placed. Then, the IC device 90 on the device recovery unit 18 that has moved to the device recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

The device transport head 20 is supported so as to be movable in the X direction and the Y direction within the device collection area A4, and further has a portion that is also movable in the Z direction. The device transport head 20 is a part of the transport unit 25, and can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In FIG. 2, the movement of the device transport head 20 in the X direction is indicated by an arrow α _20X , and the movement of the device transport head 20 in the Y direction is indicated by an arrow α _20Y .

Tray transfer mechanism 21, X-direction empty tray 200 is conveyed from the tray removal area A5 in the device collection region within A4, i.e., a mechanism for conveying the arrow alpha ₂₁ direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

A rotary stage 28 is disposed between the device collection unit 18A and the device collection unit 18B. Rotating stage 28 is rotatably supported in an arrow alpha ₂₈ direction around the Z axis. When the IC device 90 is placed on the empty tray 200, for example, when it is desired to return the IC device 90 to its original state, i.e., to return to the state before the posture change by the rotary stage 27, the IC device 90 The device 90 can be temporarily placed on the rotary stage 28. By rotating the rotary stage 28 in this mounted state, the posture of the IC device 90 can be returned to the original state. The IC device 90 whose posture has been returned is transported to the empty tray 200 by the device transport head 20 in the same posture.

Further, a tray transport mechanism 22A and a tray transport mechanism 22B that transport the trays 200 one by one in the Y direction are provided so as to straddle the device recovery area A4 and the tray removal area A5. The tray transport mechanism 22A is a part of the transport unit 25, and is a moving unit that can reciprocate the tray 200 in the Y direction, that is, the direction of the arrow α _22A . Thereby, the inspected IC device 90 can be transported from the device collection area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can move the empty tray 200 for collecting the IC device 90 in the positive direction in the Y direction, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device collection area A4.

  For example, the control unit 800 includes a tray transport mechanism 11A, a tray transport mechanism 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport. Control the operation of each part such as the head 17, the device collection unit 18, the device transport head 20, the tray transport mechanism 21, the tray transport mechanism 22A, the tray transport mechanism 22B, the rotary stage 27, and the rotary stage 28. Can do.

  The operator can set or confirm the operating conditions of the electronic component inspection apparatus 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the electronic component inspection apparatus 1. As shown in FIG. 1, a mouse table 600 on which a mouse is placed is provided on the right side of the tray removal area A5 in the drawing. This mouse is used when operating the screen displayed on the monitor 300.

  In addition, an operation panel 700 is arranged on the lower right side of FIG. The operation panel 700 instructs the electronic component inspection apparatus 1 to perform a desired operation separately from the monitor 300.

  Further, the signal lamp 400 can notify the operating state of the electronic component inspection apparatus 1 and the like by a combination of colors that emit light. The signal lamp 400 is disposed on the electronic component inspection apparatus 1. Note that the electronic component inspection apparatus 1 has a built-in speaker 500, and the operational state of the electronic component inspection apparatus 1 can also be notified by the speaker 500.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the device supply area A2 are separated by a first partition 231 and the device supply area A2 and the inspection area A3 are separated by a second partition 232. The inspection area A3 and the device collection area A4 are separated by a third partition wall 233, and the device collection area A4 and the tray removal area A5 are separated by a fourth partition wall 234. The device supply area A2 and the device collection area A4 are also partitioned by the fifth partition wall 235.

  The outermost exterior of the electronic component inspection apparatus 1 is covered with a cover. Examples of the cover include a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

As described above, the tray 200 (placement unit) on which the IC device 90 (electronic component) is placed is installed in the device supply area A2. In the tray 200, a plurality of recesses for storing the IC devices 90 one by one are arranged in a matrix. For example, depending on the size of the IC device 90, the pitch-to-pitch distance between adjacent recesses may be extremely narrow. In this case, the device transport head 13 may fail to grip the IC device 90 from the tray 200. For this reason, as shown in FIG. 2, the electronic component inspection apparatus 1 (electronic component transport apparatus 10) has an image of the concave portion of the tray 200 (mounting portion) in order to accurately hold the IC device 90 from the tray 200. Is provided. The imaging unit 131 is mounted on the device transport head 13 (transport unit 25). Note that the imaging unit 131 is configured by, for example, a CCD (Charge Coupled Device) camera, and is arranged facing the negative side in the Z direction.
In the electronic component inspection apparatus 1, an image of the concave portion of the tray 200 is captured by the imaging unit 131 prior to gripping the IC device 90. Based on this captured image, the device transport head 13 can be accurately moved to the target position, that is, the IC device 90 that is the object to be grasped. The device transport head 13 can accurately hold the IC device 90 at this destination.
In addition, as described above, the tray 200 (mounting unit) on which the IC device 90 (electronic component) is mounted is also installed in the device collection area A4. Similarly to the above, when the pitch-to-pitch distance between adjacent recesses is extremely narrow, the device transport head 20 may fail to accurately release the IC device 90 to the tray 200. For this reason, as shown in FIG. 2, the electronic component inspection apparatus 1 (electronic component transport apparatus 10) has an image of the concave portion of the tray 200 (mounting portion) in order to accurately release the IC device 90 from the tray 200. An image pickup unit 201 capable of picking up images is provided. The imaging unit 201 is mounted on the device transport head 20 (transport unit 25). The imaging unit 201 is also configured with a CCD (Charge Coupled Device) camera, for example, like the imaging unit 131, and is arranged facing the negative side in the Z direction.
In the electronic component inspection apparatus 1, an image of the concave portion of the tray 200 is captured by the imaging unit 201 prior to the release of the IC device 90. Based on this captured image, the device transport head 20 can be accurately moved to the target position, that is, the recess in which the IC device 90 is to be accommodated. Then, at this destination, the device transport head 20 can release the IC device 90.

  In the electronic component inspection apparatus 1, when using the imaging unit 131 and the imaging unit 201 as described above, it is necessary to set various conditions for the electronic component inspection apparatus 1. For this setting, either the sequential setting mode (first mode) or the batch setting mode (second mode) is selected and used. The sequential setting mode is a mode in which various conditions are sequentially displayed on the monitor 300, that is, in a wizard format (interactive format). The batch setting mode is a mode in which various conditions can be collectively displayed on the monitor 300.

  As described above, the electronic component transport apparatus 10 can be connected to the inspection unit 16 that inspects the IC device 90 (electronic component). In addition, the electronic component transport apparatus 10 includes a device supply area A2 (supply area) where the IC device 90 (electronic component) before inspection is transported and supplied to the inspection unit 16, and an IC device 90 (electronic component) after inspection. Includes a device collection area A4 (collection area) that is conveyed from the inspection unit 16 and collected. The sequential setting mode is set for the device supply area A2 (supply area) and the device collection area A4 (collection area). Accordingly, various conditions when using the imaging unit 131 in the device supply area A2 can be set in an accurate order without omission. Also, various conditions when using the imaging unit 201 in the device collection area A4 can be set in an accurate order without omission. Similar to the sequential setting mode, the batch setting mode is set for the device supply area A2 and the device collection area A4.

  Hereinafter, the sequential setting mode and the batch setting mode in the device supply area A2 will be described as a representative. Each form shown in FIG. 3 to FIG. 24 is appropriately displayed on the monitor 300 before, during, or after execution of the sequential setting mode and the batch setting mode. The “form” may also be referred to as “screen”, “dialog”, “window”, or the like.

  First, the form FM1 shown in FIG. Form FM1 is a main screen. The form FM1 includes a button group BT100, a first item group IT110, a second item group IT120, a third item group IT130, a fourth item group IT140, and a fifth item group IT150. .

  The button group BT100 includes an “end” button BT101, a “shutdown” button BT102, a “product type setting” button BT103, a “unit setting” button BT104, and a “maintenance” button. A BT 105, a “user-defined” button BT 106, and a “calculator” button BT 107 are included.

  The first item group IT110 includes an item IT111 for setting “user selection”, an item IT112 for setting “temperature mode”, an item IT113 for setting “tester connection”, and an item IT114 for setting “transport mode”. “Start mode” setting item IT 115, “pin setting” setting item IT 116, “device rotation” setting item IT 117, “setting data” setting item IT 118, and “test site” A setting item IT119 is included.

  The second item group IT120 includes an item IT121 for setting “supply shuttle”, an item IT122 for setting “hot plate (temperature adjustment unit)”, an item IT123 for setting “arm 2”, and “arm 1”. An item IT124 for setting, an item IT125 for setting “socket heater”, and an item IT126 for setting “socket air” are included.

  The third item group IT130 includes, as a “supply / storage counter”, an item IT131 for “supply” confirmation, an item IT132 for “total” confirmation, an item IT133 for “good / defective products”, and “storage 1”. “Containment 3 · Fixed 1 to Fixed 3” confirmation item IT134 is included.

  The fourth item group IT140 includes, as “contact counters”, an item IT141 for setting “general”, an item IT142 for setting “by product type”, an item IT143 for setting “% by product type”, and “arm 1. The item IT144 for confirmation of “arm 2” is included.

  The fifth item group IT150 includes a “socket” confirmation item IT151 as the “tester category”.

  Next, when the button BT103 of the button group BT100 is operated, the form FM2 is displayed so as to overlap the form FM1, as shown in FIG. Form FM2 is an icon menu. The form FM2 includes a “setup” button BT201, a “tray form” button BT202, a “plate form” button BT203, a “tray assignment” button BT204, and a “temperature offset” button. Button BT205, "Contact" button BT206, "Tester I / F" button BT207, "Bin setting" button BT208, "Double device" button BT209, and "Cleaning" Button BT210, "yield" button BT211, "QA sampling" button BT212, "FIFO function" button BT213, "supply correction" button BT214, and "collection correction" Button BT215 and a button BT216 for "Exit" are included. .

  Next, when the button BT214 of the form FM2 is operated, the monitor 300 (display unit) displays a selection screen that can select either the sequential setting mode or the batch setting mode, that is, the form FM3 (mode selection shown in FIG. 5). Operation section) is displayed. Thus, the operator can select either the sequential setting mode or the batch setting mode in accordance with the proficiency level for operating the electronic component inspection apparatus 1. For example, when the operator is an expert, the batch setting mode can be selected. Conversely, when the operator is a beginner, it is preferable to sequentially select the setting mode.

  The form FM3 includes a “sequential setting” button BT301 and a “normal setting (batch setting)” button BT302. On the right side of the button BT301, an explanation EX311 “Set according to instructions in order.” Is displayed. On the right side of the button BT302, an explanation EX312 “Display a normal setting screen” is displayed. If the button BT301 is selected, that is, if it is operated, the sequence proceeds to the setting mode (see FIGS. 6 to 23). On the other hand, if the button BT302 is selected, the process proceeds to the batch setting mode (see FIG. 24). The form FM3 also includes a “cancel” button BT303.

  Here, a case where the button BT301 is selected will be described first.

  When the button BT301 is selected, a form FM4 shown in FIG. 6 is displayed. Form FM4 is a screen for confirming that the sequential setting mode is to be performed, and an explanation EX401 of “setting is performed with the following configuration” is displayed.

  The form FM4 includes an item IT411 for confirming “device size”, an item IT412 for confirming “handling”, an item IT413 for confirming “tray form”, an item IT414 for confirming “plate form”, and “ An item IT415 for confirming the “rotation stage” is included.

  The form FM4 includes a “next” button BT421 and a “cancel” button BT422.

  Next, when the contents of the items IT411 to IT415 of the form FM4 are confirmed and the button BT421 is operated, the form FM5 shown in FIG. 7 is displayed. The form FM5 is a screen for confirming a place to be imaged by the imaging unit 131, and an explanation EX501 “Select a tray to be set and C / K.” Is displayed.

  The form FM5 includes a check box CB511 for selecting “supply tray (tray 200 in the device supply area A2)”, a check box CB512 for selecting “height detection”, and a “supply shuttle” selection. A check box CB 513, a check box CB 514 for selecting “height detection”, a check box CB 515 for selecting “hot plate”, and a check box CB 516 for selecting “height detection” are included. In FIG. 7, as an example, all check boxes are checked.

  The form FM5 includes a “next” button BT521 and a “cancel” button BT522.

  Next, when the button BT521 of the form FM5 is operated, a form FM6 shown in FIG. 8 is displayed. The form FM6 is a screen for instructing preparation of necessary members in the device supply area A2, and an explanation EX601 of “Prepare and check the tray, C / K, and device” is displayed.

  This form FM6 includes a check box CB611 for selecting “supply tray”, a check box CB612 for selecting “supply shuttle”, and a check box CB613 for selecting “hot plate”. Below the check box CB611, “Extract the device into the tray [row, column]: set the tray in the loader: pocket [2, 2] (from top left)” EX602 Is displayed. Below the check box CB612, an explanation EX603 of “Please attach the supply shuttle 1. Insert the device into the designated [pocket] of the supply shuttle 1 .: Pocket [Aa]” is displayed. Below the check box CB613, "Please attach the hot plate 1. Deliver the device to the pocket [row, column] of the hot plate 1. Pocket [4, 1] (from top left)" EX604 is displayed.

  The form FM6 includes a “previous” button BT621, a “next” button BT622, and a “cancel” button BT623.

  Next, preparation is performed in accordance with instructions of explanation EX602, explanation EX603, and explanation EX604, and as shown in FIG. 9, check boxes CB611, CB612, and CB613 are checked. The state shown in FIG. 9, that is, the state where all the check boxes are checked is an example.

  Next, when the button BT622 of the form FM6 is operated, a form FM7 shown in FIG. 10 is displayed. Form FM7 is a screen for confirming the start of the position detection of the supply tray imaged by the imaging unit 131, and registers “position detection” of “supply tray”. "EX 701" is displayed. The form FM7 includes a “skip” button BT721, a “next” button BT722, and a “cancel” button BT723.

  Next, when the button BT722 of the form FM7 is operated, a form FM8 shown in FIG. 11 is displayed. The form FM8 is a screen for selecting a pocket of the supply tray (a concave portion of the tray 200) to be imaged by the imaging unit 131.

  The form FM8 includes a model drawing MD801 simulating a supply tray, a button BT811 for selecting “4 pockets”, a button BT812 for selecting “6 pockets”, a button BT813 for selecting “9 pockets”, and “12 A button “BT814” for selecting “pocket” and a button BT815 for selecting “15 pocket” are included. In the model drawing MD801 in FIG. 11, the black pocket is the selected pocket. As an example, the button BT812 is operated and six pockets are selected.

  The form FM8 includes a “next” button BT816 and a “cancel” button BT817.

  Next, when the button BT816 of the form FM8 is operated, a form FM9 shown in FIG. 12 is displayed. Form FM9 is a screen for teaching the electronic component inspection apparatus 1 where the supply tray pocket is located, and "Specify an area surrounding the supply tray pocket and its surrounding shape." Explanation EX901 is displayed.

  On this form FM9, a real image IM911 actually captured (in real time) by the imaging unit 131 is displayed. The operator operates the mouse on the mouse table 600 to overlay the marker IM913 on the pocket IM912 in the real image IM911. In this state, the “next” button BT921 included in the form FM9 is operated. Thereby, teaching is performed. The form FM9 also includes a “cancel” button BT922.

  In addition, the form FM9 includes an item IT931 for setting “an area to be cut out (an area surrounding a pocket and its surrounding shape)” and an item IT932 for setting a “shutter speed”.

  When the button BT921 of the form FM9 is operated, a form FM10 shown in FIG. 13 is displayed. The form FM10 is a screen for confirming whether or not the pocket for which teaching has been performed is suitable, and an explanation EX1001 of “Do you want to register this image?” Is displayed.

  In addition, one representative pocket model image IM1011 is displayed on the form FM10. This model image IM1011 is a reference image obtained by synthesizing the captured images of the six pockets selected by the form FM8 and imaged by the imaging unit 131. The electronic component inspection apparatus 1 can accurately detect the concave portion in which the IC device 90 is stored by comparing this reference image with the actual image of the concave portion of the tray 200 imaged by the imaging unit 131. Thereby, the device transport head 13 can be accurately moved to the IC device 90 housed in the recess.

  The form FM10 includes an “OK” button BT1021 and a “Cancel” button BT1022. When the teaching pocket is suitable, the button BT1021 is operated.

  After the button BT1021 is operated, the form FM11 shown in FIG. 14 is displayed. The form FM11 is a screen for confirming the start of detection of the height of the supply tray imaged by the imaging unit 131, and registers “height detection” of “supply tray”. "EX1101" is displayed. Further, the form FM11 includes a “skip” button BT1121, a “next” button BT1122, and a “cancel” button BT1123.

  Next, when the button BT1122 of the form FM11 is operated, a form FM12 shown in FIG. 15 is displayed. The form FM12 is a screen for selecting a pocket (a concave portion of the tray 200) for detecting the height of the supply tray imaged by the imaging unit 131.

  The form FM12 includes a model drawing MD1201 simulating a supply tray, a button BT1211 for selecting “4 pockets”, a button BT1212 for selecting “6 pockets”, a button BT1213 for selecting “9 pockets”, and “12 A button “BT1214” for selecting “pocket” and a button BT1215 for selecting “15 pocket” are included. In the model drawing MD1201 in FIG. 15, the black pocket is the selected pocket, and as an example, the button BT1213 is operated and nine pockets are selected.

  Further, the form FM12 includes a “next” button BT1216 and a “cancel” button BT1217.

  Next, when the button BT1216 of the form FM12 is operated, a form FM13 shown in FIG. 16 is displayed. Form FM13 is a screen for teaching the electronic component inspection apparatus 1 where the height of the supply tray is to be detected. Explanation of “Specify a flat surface on which the supply tray suction nozzle can be lowered”. EX1301 is displayed.

  On the form FM13, a real image IM1311 actually captured by the imaging unit 131 (in real time) is displayed. The operator operates the mouse on the mouse table 600 to move the marker IM1313 in the real image IM1311 and instructs the height detection position of the supply tray by the marker IM1313. In this state, the “next” button BT1321 included in the form FM13 is operated. Thereby, teaching is performed. In the electronic component inspection apparatus 1, the height detection position of the supply tray is used as a height reference when the device transport head 13 grips (sucks) the IC device 90. As a result, the device transport head 13 can accurately grip the IC device 90 housed in the recess.

  The form FM13 also includes a “cancel” button BT1322 and an item IT1331 for “height detection position”.

  When the button BT1321 of the form FM13 is operated, a form FM14 shown in FIG. 17 is displayed. The form FM14 is a screen for confirming whether or not the height detection position of the supply tray subjected to teaching is suitable, and an explanation EX1401 of “Are you sure you want to update the height?” Is displayed. Yes.

  Further, the form FM14 includes a “YES” button BT1421 and a “NO” button BT1422. When the height detection position of the supply tray subjected to teaching is suitable, the button BT1421 is operated.

  After the operation of button BT1421, form FM15 shown in FIG. 18 is displayed. The form FM15 is a screen for confirming the start of the position detection of the supply shuttle imaged by the imaging unit 131, and registers “position detection” of “supply shuttle”. "EX1501" is displayed. Further, the form FM15 includes a “skip” button BT1521, a “next” button BT1522, and a “cancel” button BT1523. Here, as an example, the button BT1521 is operated. When the button BT1522 is operated, forms similar to those after the form FM8 are sequentially displayed so as to be suitable for the supply shuttle.

  After the operation of button BT1521, form FM16 shown in FIG. 19 is displayed. The form FM16 is a screen for confirming the start of position detection of the hot plate imaged by the imaging unit 131, and registers “position detection” of “hot plate”. "EX1601" is displayed. The form FM16 includes a “skip” button BT1621, a “next” button BT1622, and a “cancel” button BT1623. Here, as an example, the button BT1621 is operated. When the button BT1622 is operated, forms similar to those after the form FM8 are sequentially displayed so as to be suitable for a hot plate.

  After the button BT1621, the form FM17 shown in FIG. 20 is displayed. Form FM17 is a screen for selecting whether to hold IC device 90 based on the above-described captured image with respect to each IC device 90 or to a plurality of IC devices 90 at once. Select “Correction mode”. "EX1701" is displayed.

The form FM17 includes a button BT1711 for “individual correction” and a button BT1712 for “collective correction”.
On the right side of the button BT1711, an explanation EX1702 is displayed, which indicates that “the position correction amount is individually calculated for each pocket and conveyed. A highly accurate correction effect can be obtained”. On the right side of the button BT 1712, an explanation EX 1703 of “Calculate and carry one correction amount for each tray and C / K. A large drop in throughput can be suppressed” is displayed.

  The form FM17 also includes a “next” button BT1713 and a “cancel” button BT1714. Here, as an example, the button BT1711 is operated, and then the button BT1713 is operated.

  After the button BT1713 is operated, the form FM18 shown in FIG. 21 is displayed. The form FM18 is a screen for selecting the timing at which imaging by the imaging unit 131 is performed, and an explanation EX1801 of “Please select the detection timing” is displayed.

  Form FM18 includes an imaging timing selection item IT1821 for "tray" and an imaging timing selection item IT1822 for "C / K".

  The form FM18 also includes an imaging timing explanation EX1802. In FIG. 21, as explanation EX1802, “Only at the start of operation: Executed only once at the start of operation. Fixed time interval: Executed at the start of operation and periodically thereafter at specified time intervals. Every tray load: Operation It will run at the beginning and each time the tray is loaded. "

  The form FM18 also includes a “next” button BT1811 and a “cancel” button BT1812.

  After the button BT1811 is operated, a form FM19 shown in FIG. 22 is displayed. Form FM19 is a screen for designating an interval between the device transport head 13 and the IC device when gripping the IC device 90, and an explanation EX1901 of "Please specify the clearance with the nozzle at the time of pick-up and release." It is displayed.

  The form FM19 includes an item IT1921 for setting an interval with the IC device 90 on the “tray”, an item IT1922 for setting an interval with the IC device 90 on the “shuttle”, and an IC device 90 on the “hot plate”. And an interval setting item IT1924 for the IC device 90 on the “rotary stage”.

  The form FM19 also includes an image IM1931 depicting the positional relationship between the device transport head 13 and the IC device 90.

  The form FM19 also includes a “next” button BT1911 and a “cancel” button BT1912.

  After the button BT 1911 is operated, the form FM20 shown in FIG. 23 is displayed. The form FM20 is a screen for sequentially completing the setting mode, and an explanation EX2001 of “Setting is complete. Remove the used tray and device.” Is displayed. The form FM20 includes a “close” button BT2011. Explanation The button BT2011 can be operated by removing the tray or device according to the instruction of EX2001.

  As described above, when setting the operation for transporting the IC device 90 while performing image capturing by the image capturing unit 131 to the device transport head 13 (transport unit 25) on which the image capturing unit 131 is mounted, the sequential setting mode is set. Can be selected. In this sequential setting mode, each form (form FM4 to form FM20) for setting the operation of the device transport head 13 is sequentially displayed. For example, when the operator is a beginner, the operator can check and input various conditions according to the forms displayed in order on the monitor 300, that is, by checking the form one by one. Thereby, the operation setting of the device transport head 13 is performed in the correct order without omission.

  When the “normal setting (batch setting)” button BT302 is operated on the form FM3 shown in FIG. 5, a form FM21 shown in FIG. 24 is displayed. Form FM21 is a screen for performing a batch setting mode.

  The form FM21 includes a check box CB2101 for selecting whether to use the imaging unit 131, a tab TB2102 for setting various conditions for the “supply tray”, and a tab TB2103 for setting various conditions for the “supply shuttle”. And a tab TB 2104 for setting various conditions for the “hot plate”.

  When the check box CB2101 is checked, the imaging unit 131 can be used. On the right side of the check box CB 2101, an explanation EX 2105 of “Enable transport correction” is displayed.

  The tab TB2102 includes an item IT2111 corresponding to the contents of the form FM8, the form FM9, and the form FM10, and an item IT2112 corresponding to the contents of the form FM12 and the form FM13. By setting or selecting the item IT2111 and the item IT2112, various conditions for the electronic component inspection apparatus 1 when using the imaging unit 131 can be set collectively. When the tab TB2103 is selected, the same setting as the “supply tray” can be set for the “supply tray”, and when the tab TB2104 is selected, the “hot plate” is set with “ The same setting as the “supply tray” is possible.

  The form FM21 includes an item IT2113 corresponding to the contents of the form FM17, an item IT2114 corresponding to the contents of the form FM18, and an item IT2115 corresponding to the contents of the form FM19.

  Further, the form FM21 includes a “sequential setting” button BT2121, an “OK” button BT2122, a “cancel” button BT2123, and an “apply” button BT2124.

  When setting the operation for transporting the IC device 90 to the device transport head 13 (transport unit 25) on which the image capturing unit 131 is mounted while capturing an image by the image capturing unit 131, the sequential setting mode described above is used. In addition, the batch setting mode can be selected. In this collective setting mode, all the operation settings of the device transport head 13 can be performed on the form FM21. For example, when the operator is an expert, it is considered that the operation setting of the device transport head 13 can be quickly performed when the batch setting mode is selected rather than the sequential setting mode.

By the way, in the sequential setting mode, for example, when the form FM5 shown in FIG. 7 is the “first setting screen”, the form FM6 shown in FIG. 8 (FIG. 9) displayed after the display of the first setting screen is displayed as “second setting screen”. Screen ". Hereinafter, the case where the first setting screen is the form FM5 and the second setting screen is the form FM6 may be referred to as “case 1”.
The form FM5 as the first setting screen can accept information (hereinafter referred to as “first information”) for conveying the IC device 90 (electronic component) by the device conveyance head 13 (conveyance unit 25), that is, input. Is possible. Examples of the first information include a check box CB511, a check box CB512, a check box CB513, a check box CB514, a check box CB515, and a check box CB516 included in the form FM5.
Form FM6 which is the second setting screen displays information (hereinafter referred to as “second information”) different from the first information for transporting IC device 90 (electronic component) by device transport head 13 (transport section 25). It is possible to accept. The second information includes a check box CB611, a check box CB612, and a check box CB613 that are included in the form FM6.

  In case 1, the form FM5 as the first setting screen includes a button BT521 as a second setting screen display operation unit for displaying the form FM6 as the second setting screen. Thereby, until the button BT521 is operated, the form FM5 remains displayed on the monitor 300. Therefore, for example, sufficient time for sufficiently checking or inputting the first information can be secured. .

  In case 1, the form FM5 as the first setting screen has at least one check box (in the configuration shown in FIG. 7, check box CB511, check box CB512, check box CB513, check box CB514, check box CB515, check box). When all the check boxes are checked, the button BT521, which is the second setting screen display operation unit, can be operated. As a result, it is possible to prevent check omission for the check box.

For example, when the form FM6 shown in FIG. 8 (FIG. 9) is a “first setting screen”, the form FM8 shown in FIG. 11 displayed after the first setting screen is displayed is called a “second setting screen”. Can do. Hereinafter, the case where the first setting screen is the form FM6 and the second setting screen is the form FM8 may be referred to as “case 2”.
The first information on the form FM6 that is the first setting screen includes a check box CB611, a check box CB612, and a check box CB613 that are included in the form FM6.
The second information on the form FM8 which is the second setting screen includes the model drawing MD801 included in the form FM8, the button BT811, the button BT812, the button BT813, the button BT814, and the button BT815. .

For example, when the form FM8 shown in FIG. 11 is a “first setting screen”, the form FM9 shown in FIG. 12 displayed after the first setting screen is displayed can be called a “second setting screen”. Hereinafter, the case where the first setting screen is the form FM8 and the second setting screen is the form FM9 may be referred to as “case 3”.
The first information on the form FM8 that is the first setting screen includes the model drawing MD801 included in the form FM8, the button BT811, the button BT812, the button BT813, the button BT814, and the button BT815. .
The second information on the form FM9 that is the second setting screen includes a marker IM913, an item IT931, and an item IT932 included in the form FM9.

  In case 3, the form FM8 as the first setting screen includes a button BT816 as a second setting screen display operation unit for displaying the form FM9 as the second setting screen. As a result, the form FM8 remains displayed on the monitor 300 until the button BT816 is operated. Therefore, for example, sufficient time for sufficiently checking or inputting the first information can be secured. .

For example, when the form FM9 shown in FIG. 12 is a “first setting screen”, the form FM12 shown in FIG. 15 displayed after the first setting screen is displayed can be called a “second setting screen”. Hereinafter, the case where the first setting screen is the form FM9 and the second setting screen is the form FM12 may be referred to as “case 4”.
The first information on the form FM9 that is the first setting screen includes a marker IM913, an item IT931, and an item IT932 included in the form FM9.
The second information on the form FM12 that is the second setting screen includes the model drawing MD1201, the button BT1211, the button BT1212, the button BT1213, the button BT1214, and the button BT1215 included in the form FM12. .

For example, when the form FM12 shown in FIG. 15 is a “first setting screen”, the form FM13 shown in FIG. 16 displayed after the first setting screen is displayed can be called a “second setting screen”. Hereinafter, the case where the first setting screen is the form FM12 and the second setting screen is the form FM13 may be referred to as “case 5”.
The first information on the form FM12 that is the first setting screen includes the model drawing MD1201, the button BT1211, the button BT1212, the button BT1213, the button BT1214, and the button BT1215 included in the form FM12. .
The second information on the form FM13 that is the second setting screen includes a marker IM1313 included in the form FM13 and an item IT1331.

  In case 5, the form FM12 as the first setting screen includes a button BT1216 as a second setting screen display operation unit for displaying the form FM13 as the second setting screen. Thus, until the button BT1216 is operated, the form FM12 remains displayed on the monitor 300. Therefore, for example, sufficient time for sufficiently checking or inputting the first information can be secured. .

For example, when the form FM9 shown in FIG. 12 is a “first setting screen”, the form FM13 shown in FIG. 16 displayed after the first setting screen is displayed can be called a “second setting screen”. Hereinafter, the case where the first setting screen is the form FM9 and the second setting screen is the form FM13 may be referred to as “case 6”.
The first information on the form FM9 that is the first setting screen includes a marker IM913, an item IT931, and an item IT932 included in the form FM9.
The second information on the form FM13 that is the second setting screen includes a marker IM1313 included in the form FM13 and an item IT1331.

For example, when the form FM17 shown in FIG. 20 is a “first setting screen”, the form FM18 shown in FIG. 21 displayed after the first setting screen is displayed can be called a “second setting screen”. Hereinafter, the case where the first setting screen is the form FM17 and the second setting screen is the form FM18 may be referred to as “case 7”.
Examples of the first information on the form FM17 that is the first setting screen include a button BT1711 and a button BT1712 included in the form FM17.
The second information on the form FM18 that is the second setting screen includes an item IT1821 and an item IT1822 included in the form FM18.

  In the case 7, the form FM17 as the first setting screen includes a button BT1713 as a second setting screen display operation unit for displaying the form FM18 as the second setting screen. Thereby, until the button BT1713 is operated, the form FM17 remains displayed on the monitor 300. Therefore, for example, sufficient time for sufficiently checking or inputting the first information can be secured. .

For example, when the form FM18 shown in FIG. 21 is a “first setting screen”, the form FM19 shown in FIG. 22 displayed after the first setting screen is displayed can be called a “second setting screen”. Hereinafter, the case where the first setting screen is the form FM18 and the second setting screen is the form FM19 may be referred to as “case 8”.
Examples of the first information on the form FM18 that is the first setting screen include an item IT1821 and an item IT1822 included in the form FM18.
Examples of the second information on the form FM19 that is the second setting screen include an item IT1921, an item IT1922, an item IT1923, and an item IT1924 included in the form FM19.

  In case 8, the form FM18 as the first setting screen includes a button BT1811 as a second setting screen display operation unit for displaying the form FM19 as the second setting screen. Thus, until the button BT1811 is operated, the form FM18 remains displayed on the monitor 300. Therefore, for example, a sufficient time for sufficiently checking or inputting the first information can be secured. .

  Then, since the first setting screen and the second setting screen are, for example, Case 1 to Case 8, the image is picked up by the image pickup unit 131 to the device transport head 13 on which the image pickup unit 131 is mounted. When setting the operation of transporting the device 90, the operation setting can be easily and accurately performed.

  Further, at least one of the first information and the second information as described above is based on the captured image (image) of the tray 200 (mounting unit) by the imaging unit 131, and the device transport head 13 (transport unit 25). Is information for transporting the IC device 90 (electronic component), that is, information necessary for transport. In the present embodiment, both of the first information and the second information are information necessary for the conveyance. However, the present invention is not limited to this, and one of the first information and the second information is the relevant information. It may be information necessary for conveyance. With such information, the IC device 90 can be smoothly transported based on the captured image.

The tray 200 (mounting unit) accommodates the IC device 90 (electronic component) and has a plurality of recesses arranged in a matrix. Further, at least one of the first information and the second information is information necessary for transporting the IC device 90 based on the captured image as described above, and in particular,
Information A: Reference (XY coordinate) in plan view when the device transport head 13 (transport unit 25) grips the IC device 90 (electronic component) or releases the gripped IC device 90 (electronic component) Or information to specify the recess
Information B: Displays a captured image of a recess that serves as a reference when the device transport head 13 (transport unit 25) grips the IC device 90 (electronic component) or releases the gripped IC device 90 (electronic component). Information to do
Information C: When the device transport head 13 (transport unit 25) grips the IC device 90 (electronic component) or releases the gripped IC device 90 (electronic component), the height relative to the tray 200 (mounting unit) Or information for designating the recess that is the standard
Information D: Tray 200 (reference height) when the device transport head 13 (transport unit 25) grips the IC device 90 (electronic component) or releases the gripped IC device 90 (electronic component). It is preferable that the information is for designating the surface of the (mounting portion), that is, the upper surface (front surface) in the present embodiment. Such information A, information B, information C, and information D become information necessary to quickly and accurately hold and release the IC device 90 as the pitch distance between the adjacent concave portions becomes smaller. . As a result, the IC device 90 can be held and released quickly and accurately.

  And as a combination which makes any one of information A, information B, information C, and information D "first information" and "second information", the following combinations are preferable.

  The first information is information A, that is, in plan view, when the device transport head 13 (transport unit 25) grips the IC device 90 (electronic component) or releases the gripped IC device 90 (electronic component). This is information for designating the concave portion of the tray 200 as a reference (in the XY coordinates). The second information is information B, that is, a reference when the device transport head 13 (transport unit 25) grips the IC device 90 (electronic component) or releases the gripped IC device 90 (electronic component). This is information for displaying a captured image of the concave portion of the tray 200. Such a combination is possible in “Case 3” in which the first setting screen is the form FM8 and the second setting screen is the form FM9. If the concave portion of the tray 200 is not designated, it is difficult to obtain a captured image of the concave portion of the tray 200. Therefore, the order of such first information “information A” → second information “information B” is valid. Become.

  The first information is information B, that is, a reference when the device transport head 13 (transport unit 25) grips the IC device 90 (electronic component) or releases the gripped IC device 90 (electronic component). This is information for displaying a captured image of the concave portion of the tray 200. The second information is information D, that is, the height of the device transport head 13 (transport unit 25) when the IC device 90 (electronic component) is gripped or the gripped IC device 90 (electronic component) is released. This is information for designating the surface of the reference tray 200 (mounting portion), that is, the upper surface (front surface) in this embodiment. Such a combination is possible in “Case 6” in which the first setting screen is the form FM9 and the second setting screen is the form FM13. If the captured image of the concave portion is not obtained, it is difficult to grasp the area around the concave portion of the tray 200, that is, where the upper surface of the tray 200 exists. Therefore, such first information “information B” → second The order of information “information D” is valid.

  The first information is information C, that is, the tray 200 (when the device transport head 13 (transport unit 25) grips the IC device 90 (electronic component) or releases the gripped IC device 90 (electronic component). This is information for designating the concave portion of the tray 200 that serves as a reference for the height with respect to the (mounting portion). The second information is information D, that is, the height of the device transport head 13 (transport unit 25) when the IC device 90 (electronic component) is gripped or the gripped IC device 90 (electronic component) is released. This is information for designating the surface of the reference tray 200 (mounting portion), that is, the upper surface (front surface) in this embodiment. Such a combination is possible in “Case 5” in which the first setting screen is the form FM12 and the second setting screen is the form FM13. Unless the concave portion of the tray 200 serving as the height reference is designated, it is difficult to grasp the positional relationship between the designated concave portion and the designated portion on the upper surface of the tray 200 serving as the height reference. The order of “first information“ information C ”→ second information“ information D ”is valid.

  The sequential setting mode includes a third setting screen. The third setting screen is not particularly limited. For example, the form FM7 shown in FIG. 10, the form FM11 shown in FIG. 14, the form FM15 shown in FIG. 18, and the form FM16 shown in FIG. The form FM7 includes a “skip” button BT721, the form FM11 includes a “skip” button BT1121, the form FM15 includes a “skip” button BT1521, and the form FM16 Includes a button BT1621 for "skip". For example, by operating the button BT721 of the form FM7, the display of the form FM8 that is the first setting screen and the form FM8 that is the second setting screen in the case 3 can be omitted, and the user can jump to the form FM11. In this manner, the monitor 300 (display unit) displays the button BT721 as a third setting screen display operation unit that displays the third setting screen without displaying the first setting screen or the second setting screen. The Thereby, the confirmation and input of the first information and the second information can be omitted.

  As described above, the form FM4 shown in FIG. 6 includes the “cancel” button BT422. The form FM5 shown in FIG. 7 includes a “cancel” button BT522. A form FM6 shown in FIG. 8 (FIG. 9) includes a “cancel” button BT623. The form FM7 shown in FIG. 10 includes a “cancel” button BT723. A form FM8 shown in FIG. 11 includes a “cancel” button BT817. A form FM9 shown in FIG. 12 includes a “cancel” button BT922. A form FM10 shown in FIG. 13 includes a “cancel” button BT1022. The form FM11 shown in FIG. 14 includes a “cancel” button BT1123. The form FM12 shown in FIG. 15 includes a “cancel” button BT1217. The form FM13 shown in FIG. 16 includes a “cancel” button BT1322. A form FM15 shown in FIG. 18 includes a “cancel” button BT1523. A form FM16 shown in FIG. 19 includes a “cancel” button BT1623. The form FM17 shown in FIG. 20 includes a “cancel” button BT1714. A form FM18 shown in FIG. 21 includes a “cancel” button BT1812. A form FM19 shown in FIG. 22 includes a “cancel” button BT1912. Then, regardless of which “cancel” button is operated, the batch setting mode, that is, the form FM21 shown in FIG. 24 can be shifted from the middle of the sequential setting mode. As described above, the sequential setting mode includes a “cancel” button as a batch setting mode transition operation unit capable of shifting to the batch setting mode from the middle of the sequential setting mode. Accordingly, the operator can stop the sequential setting mode in the middle, and input the first information and the second information again in the batch setting mode. Note that the first information, the second information, and the like until the “cancel” button is operated in the sequential setting mode may be stored in the control unit 800 or may not be stored.

  As shown in FIG. 24, the form FM21 that is the collective setting mode includes the item IT2111, the item IT2112, the item IT2113, the item IT2114, and the item IT2115 as described above. Any one of these items can be arbitrarily referred to as a “first setting screen” and a “second setting screen”. In the form FM21, the first setting screen and the second setting screen are displayed side by side. As described above, the electronic component inspection apparatus 1 can select the batch setting mode in which the first setting screen and the second setting screen are displayed side by side. For example, when the operator is an expert, it is considered that the operation setting of the device transport head 13 can be quickly performed when the batch setting mode is selected rather than the sequential setting mode.

  The form FM21 which is the batch setting mode includes a button BT2121 as a sequential setting mode transition operation unit capable of shifting from the batch setting mode to the sequential setting mode. Accordingly, the operator can stop the batch setting mode and redo input of the first information and the second information in the sequential setting mode. Note that the first information and the second information until the button BT2121 is operated in the batch setting mode may be stored in the control unit 800 or may not be stored.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  In the embodiment, the sequential setting mode and the batch setting mode are examples in which the IC device is gripped from the tray based on the imaging result of the imaging unit in the device supply area. The IC device may be gripped from the rotary stage. This is similarly applicable to the device collection area.

DESCRIPTION OF SYMBOLS 1 ... Electronic component inspection apparatus, 10 ... Electronic component conveyance apparatus, 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 13 ... Device conveyance head, 131 ... Imaging part, 14 ... Device supply part, 14A ... Device supply unit, 14B ... Device supply unit, 15 ... Tray transfer mechanism, 16 ... Inspection unit, 17 ... Device transfer head, 17A ... Device transfer head, 17B ... Device transfer head, 18 ... Device recovery unit, 18A ... Device recovery , 18B ... Device collection unit, 19 ... Collection tray, 20 ... Device conveyance head, 201 ... Imaging unit, 21 ... Tray conveyance mechanism, 22A ... Tray conveyance mechanism, 22B ... Tray conveyance mechanism, 231 ... First partition 232 2nd partition, 233 ... 3rd partition, 234 ... 4th partition, 235 ... 5th partition, 241 ... Front cover, 242 ... Id cover, 243 ... side cover, 244 ... rear cover, 245 ... top cover, 25 ... transport section, 27 ... rotary stage, 28 ... rotary stage, 90 ... IC device, 200 ... tray, 300 ... monitor, 301 ... display screen, 400 ... Signal lamp, 500 ... Speaker, 600 ... Mouse stand, 700 ... Control panel, 800 ... Control unit, A1 ... Tray supply area, A2 ... Device supply area, A3 ... Inspection area, A4 ... Device collection area, A5 ... Tray removal Area, BT100 ... button group, BT101 ... button, BT102 ... button, BT103 ... button, BT104 ... button, BT105 ... button, BT106 ... button, BT107 ... button BT201 ... button, BT202 ... button, BT203 ... button, BT204 ... button, BT205 ... Bota , BT206 ... button, BT207 ... button, BT208 ... button, BT209 ... button, BT210 ... button, BT211 ... button, BT212 ... button, BT213 ... button, BT214 ... button, BT215 ... button, BT216 ... button, BT301 ... button, BT302 ... button, BT303 ... button, BT421 ... button, BT422 ... button, BT521 ... button, BT522 ... button, BT621 ... button, BT622 ... button, BT623 ... button, BT811 ... button, BT812 ... button, BT813 ... button, BT814 ... button , BT815 ... button, BT816 ... button, BT817 ... button, BT921 ... button, BT922 ... button, BT1021 ... button, BT1022 ... button, BT1121 ... button , BT1122 ... button, BT1123 ... button, BT1211 ... button, BT1212 ... button, BT1213 ... button, BT1214 ... button, BT1215 ... button, BT1216 ... button, BT1217 ... button, BT1321 ... button, BT1322 ... button, BT1421 ... button, BT1422 ... button, BT1521 ... button, BT1522 ... button, BT1523 ... button, BT1621 ... button, BT1622 ... button, BT1623 ... button, BT1711 ... button, BT1712 ... button, BT1713 ... button, BT1714 ... button, BT1811 ... button, BT1812 ... button , BT1911 ... button, BT1912 ... button, BT2011 ... button, BT2121 ... button, BT2122 ... button, BT 123 ... button, BT2124 ... button, CB511 ... check box, CB512 ... check box, CB513 ... check box, CB514 ... check box, CB515 ... check box, CB516 ... check box, CB611 ... check box, CB612 ... check box, CB613 ... Check box, CB2101 ... Check box, EX311 ... Description, EX312 ... Description, EX401 ... Description, EX501 ... Description, EX601 ... Description, EX602 ... Description, EX603 ... Description, EX604 ... Description, EX701 ... Description, EX901 ... Description, EX1001 ... Description, EX1101 ... Description, EX1301 ... Description, EX1501 ... Description, EX1601 ... Description, EX1701 ... Description, EX1702 ... Description, EX 703 ... Description, EX1801 ... Description, EX1802 ... Description, EX1901 ... Description, EX2001 ... Description, EX2105 ... Description, FM1 ... Form, FM2 ... Form, FM3 ... Form, FM4 ... Form, FM5 ... Form, FM6 ... Form, FM7 ... Form, FM8 ... Form, FM9 ... Form, FM10 ... Form, FM11 ... Form, FM12 ... Form, FM13 ... Form, FM14 ... Form, FM15 ... Form, FM16 ... Form, FM17 ... Form, FM18 ... Form, FM19 ... Form, FM20 ... Form, FM21 ... Form, IM911 ... Real image, IM912 ... Pocket, IM913 ... Marker, IM1011 ... Model image, IM1311 ... Real image, IM1313 ... Marker, IM1931 ... Image image, IT110 ... first item group, IT111 ... item, IT112 ... item, IT113 ... item, IT114 ... item, IT115 ... item, IT116 ... item, IT117 ... item, IT118 ... item, IT119 ... item, IT120 ... second Item group, IT121 ... item, IT122 ... item, IT123 ... item, IT124 ... item, IT125 ... item, IT126 ... item, IT130 ... third item group, IT131 ... item, IT132 ... item, IT133 ... item, IT134 ... item, IT140 ... 4th item group, IT141 ... item, IT142 ... item, IT143 ... item, IT144 ... item, IT150 ... 5th item group, IT151 ... item, IT411 ... item, IT412 ... item, IT413 ... item, IT414 ... item, IT415 ... item, IT931 Item, IT932 ... Item, IT1331 ... Item, IT1821 ... Item, IT1822 ... Item, IT1921 ... Item, IT1922 ... Item, IT1923 ... Item, IT1924 ... Item, IT2111 ... Item, IT2112 ... Item, IT2113 ... Item, IT2114 ... Item, IT2115 ... item, MD801 ... model drawings, MD1201 ... model drawings, TB2102 ... tab, TB2103 ... tab, TB2104 ... tab, α _{11A ...} arrow, α _{11B ...} arrow, α _{13X ...} arrow, α _{13Y ...} arrow, α _{14 ...} arrow , Α ₁₅ ... arrow, α _17Y ... arrow, α ₁₈ ... arrow, α _20X ... arrow, α _20Y ... arrow, α ₂₁ ... arrow, α _22A ... arrow, α _22B ... arrow, α ₂₇ ... arrow, α ₂₈ ... arrow , Α ₉₀ ... Arrow

Claims (18)

A transport unit for transporting electronic components;
A display unit capable of selecting a sequential setting mode for displaying the second setting screen after displaying the first setting screen;
With
The first setting screen can receive first information for transporting the electronic component by the transport unit;
The second setting screen is capable of receiving second information different from the first information for transporting the electronic component by the transport unit. A placement unit on which the electronic component is placed is installed,
The electronic component conveying apparatus according to claim 1, further comprising an imaging unit capable of capturing an image of the placement unit.   The electronic component transport apparatus according to claim 2, wherein the imaging unit is mounted on the transport unit.   The electronic component conveyance according to claim 2, wherein at least one of the first information and the second information is information for conveying the electronic component by the conveyance unit based on an image of the placement unit. apparatus. The mounting portion includes a plurality of recesses in which the electronic component is housed and arranged in a matrix.
At least one of the first information and the second information is:
Information for designating the recess as a reference in plan view when the transport unit grips the electronic component or releases the gripped electronic component,
Information for displaying the captured image of the recess serving as a reference when the transport unit grips the electronic component or releases the gripped electronic component,
Information for designating the concave portion that serves as a reference for the height with respect to the placement unit when the transport unit grips the electronic component or releases the gripped electronic component,
4. The information for designating a surface of the placement unit, which serves as a height reference when the transport unit grips the electronic component or releases the gripped electronic component. Item 3. The electronic component carrying device according to Item 2. The first information is information for designating the recess as a reference in plan view when the transport unit grips the electronic component or releases the gripped electronic component,
The said 2nd information is information for displaying the picked-up image of the said recessed part used as the reference | standard when the said conveyance part hold | grips the said electronic component or releases the held said electronic component. Electronic component transport device. The first information is information for displaying a captured image of the recess serving as a reference when the transport unit grips the electronic component or releases the gripped electronic component,
The second information is information for designating a surface of the mounting portion as a reference of height when the transport unit grips the electronic component or releases the gripped electronic component. Item 6. The electronic component carrying device according to Item 5. The first information is information for designating the concave portion to be a reference for a height with respect to the placement unit when the transport unit grips the electronic component or releases the gripped electronic component,
The second information is information for designating a surface of the mounting portion as a reference of height when the transport unit grips the electronic component or releases the gripped electronic component. Item 6. The electronic component carrying device according to Item 5.   The electronic component conveying apparatus according to claim 1, wherein the first setting screen includes a second setting screen display operation unit that displays the second setting screen.   10. The electronic device according to claim 9, wherein the first setting screen includes at least one check box, and the second setting screen display operation unit can be operated when all the check boxes are checked. Parts transport device.   The electronic component carrying device according to claim 1, wherein the sequential setting mode includes a third setting screen.   The electronic device according to claim 11, wherein the display unit displays a third setting screen display operation unit that displays the third setting screen without displaying the first setting screen or the second setting screen. Parts transport device.   The electronic component transport apparatus according to claim 1, wherein the electronic component transport apparatus is selectable in a batch setting mode in which the first setting screen and the second setting screen are displayed side by side.   The electronic component conveying apparatus according to claim 13, wherein a mode selection operation unit capable of selecting either the sequential setting mode or the batch setting mode is displayed on the display unit.   14. The electronic component conveying apparatus according to claim 13, wherein the sequential setting mode includes a batch setting mode transition operation unit capable of shifting to the batch setting mode from the middle of the sequential setting mode.   14. The electronic component conveying apparatus according to claim 13, wherein the batch setting mode includes a sequential setting mode transition operation unit capable of shifting from the batch setting mode to the sequential setting mode. It can be connected to an inspection unit for inspecting the electronic component,
A supply region in which the electronic component before inspection is transported and supplied to the inspection unit;
A collection area in which the electronic component after the inspection is transported and recovered from the inspection section;
The electronic component conveying apparatus according to claim 1, wherein the sequential setting mode is set for the supply area and the collection area. A transport unit for transporting electronic components;
A display unit capable of selecting a sequential setting mode for displaying the second setting screen after displaying the first setting screen;
An inspection unit for inspecting the electronic component;
With
The first setting screen can receive first information for transporting the electronic component by the transport unit;
The second setting screen is capable of accepting second information different from the first information for transporting the electronic component by the transport unit.

Images