TWI618164B - Electronic component transfer device and electronic component inspection device - Google Patents

Abstract

The present invention provides an electronic component transfer device and an electronic component inspection device capable of setting electronic components to each of a first temperature and a second temperature.

The electronic component transfer device includes: a first transfer portion that transfers electronic components, and the electronic components can be set to a first temperature; and a second transfer portion, which transfers the electronic components, and can set the electronic components to the same The first temperature is different from the second temperature.

Description

Electronic component transfer device and electronic component inspection device

The present invention relates to an electronic component transfer device and an electronic component inspection device.

Conventionally, there has been known an electronic component inspection device that detects the electrical characteristics of electronic components such as IC devices. In this electronic component inspection device, an electronic component transfer device for transferring an IC device to a holding portion of an inspection portion is assembled. During the inspection of the IC device, the IC device is arranged on the holding portion, and a plurality of probe pins provided on the holding portion are brought into contact with each terminal of the IC device. The inspection of such IC devices includes a low temperature inspection performed by cooling the IC device to a specific temperature, and a high temperature inspection performed by heating the IC device to a specific temperature.

In addition, Patent Document 1 describes an IC sorter (IC Handler) having two transfer arms for holding and holding the IC device when the IC device is inspected.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 8-105937

However, in the device described in Patent Document 1, it is impossible to perform both low-temperature inspection and high-temperature inspection of IC devices.

Further, in the device described in Patent Document 1, an IC device placed on a specific position of an electronic part placement section on which an IC device is placed and carried is held by a transfer robot, but it cannot be placed on the electronic part. Other positions of the mounting section.

The present invention has been made to solve at least a part of the problems described above, and can be implemented as the following forms or application examples.

[Application Example 1] The electronic component transfer device of this application example includes a first transfer unit that transfers electronic components, and the electronic components can be set to a first temperature; and The second transfer unit may transfer the electronic component, and the electronic component may be set to a second temperature different from the first temperature.

Therefore, when the electronic component is inspected, it can be performed at each of the first temperature and the second temperature. In addition, the number of temperature switching setting steps of the first temperature and the second temperature can be reduced, or the waiting time required to stabilize the temperature can be reduced.

[Application Example 2] In the electronic component transfer device according to the above application example, it is preferable that the first transfer section includes a first electronic component placement section that can mount and move the electronic component, and that the electronic component can be transferred. The first temperature is set to the first temperature; and the first electronic component holding portion can hold and move the electronic component, and the electronic component can be set to the first temperature; and The second transporting section includes a second electronic component mounting section that can mount and move the electronic component, and that the electronic component can be set to the second temperature; and a second electronic component holding section that can hold and move the electronic component. The electronic component may be set to the second temperature.

Therefore, when the electronic component is inspected, it can be performed at each of the first temperature and the second temperature.

[Application Example 3] The electronic component transfer device of the above application example preferably includes an electronic component mounting section that can mount and move the electronic component, and that has an electronic component that can be set to the first temperature. A first electronic component mounting portion temperature setting portion, a second electronic component mounting portion temperature setting portion that can set the electronic component to the second temperature, and an electronic component holding portion that can hold and move the electronic component, And has The electronic component is a temperature setting unit of a first electronic component holding portion at the first temperature, and a temperature setting portion of a second electronic component holding portion at which the electronic component can be set at the second temperature; the first transfer portion includes the above The first electronic component mounting portion temperature setting portion and the first electronic component holding portion temperature setting portion; and the second transporting portion includes the second electronic component mounting portion temperature setting portion and the second electronic component holding portion. Temperature setting section.

Thereby, the electronic component can be transported to a specific position by the electronic component mounting portion and the electronic component holding portion.

In addition, the electronic component can be set to the first temperature by the first electronic component holding portion temperature setting portion and the first electronic component placing portion temperature setting portion, and the second electronic component holding portion temperature setting portion and the second electronic component holding portion can be set to the first temperature. The electronic component mounting section temperature setting section sets the electronic component to a second temperature.

[Application Example 4] In the electronic component transfer device according to the application example described above, it is preferable that the electronic component placement section includes a plurality of the electronic component placement sections and includes the plurality of electronic component holding sections.

Therefore, when the electronic component is inspected, it can be performed at each of the first temperature and the second temperature.

[Application Example 5] In the electronic component transfer device of the application example described above, it is preferable that after the electronic component is transferred by the first transfer unit, the electronic component is transferred by the second transfer unit.

Accordingly, when the first temperature is lower than the second temperature, the electronic component is transported to a specific position in a state set to the second temperature, thereby preventing dew condensation on the electronic component.

[Application Example 6] In the electronic component transfer device of the application example described above, the first temperature is preferably lower than the second temperature.

Thereby, after the electronic parts are transferred by the first transfer unit, the electronics are transferred by the second transfer unit. In the case of a component, the electronic component is transported to a specific position in a state of being set to the second temperature, thereby preventing condensation of the electronic component.

[Application Example 7] In the electronic component transfer device of the above application example, when the inspection of the electronic component is performed at the first temperature and the inspection is satisfactory, the inspection of the electronic component is performed at the second temperature. .

With this, when the first temperature is lower than the second temperature, the electronic component is inspected at the second temperature thereafter, and when the electronic component is transported to a specific position, condensation of the electronic component can be prevented.

[Application Example 8] The electronic component transfer device of the above application example is characterized by including: a first transfer section that transfers electronic components, and that the electronic components can be set to a first temperature; a second transfer section that transfers the electronic components And the electronic component may be set to a second temperature different from the first temperature; and an inspection unit that inspects the electronic component.

Thereby, the inspection of electronic components can be performed at each of the first temperature and the second temperature. In addition, it is possible to reduce the number of temperature switching setting steps of the first temperature and the second temperature, or to reduce the waiting time required to stabilize the temperature.

[Application Example 9] In the electronic component transporting device of this application example, it is preferable that a first temperature setting section capable of setting the electronic component to the first temperature is provided in the inspection section, and the electronic component can be provided in the inspection section. The second temperature setting unit is set to the second temperature.

Thereby, the inspection of electronic components can be performed at each of the first temperature and the second temperature.

[Application Example 10] The electronic component transfer device of this application example is characterized by including an electronic component mounting section having a first mounting section on which the electronic components are mounted, and a second mounting section on which the electronic components are mounted. The electronic component can be transported; and an electronic component holding portion that can hold the electronic component from the first placing portion and place the electronic component on the second placing portion; and the second placing portion is different from the first placing portion. 1 placing section.

Therefore, when the inspection of electronic parts is performed, for example, firstly, the electronic parts are placed on the first placing section, and the electronic parts after the inspections under the specific conditions are completed are placed on the second placing section, and the inspection is performed. The other previous electronic parts are placed on the first placement section.

Therefore, since different inspection conditions can be set, the degree of inspection freedom can be improved, which is particularly advantageous for small batches. In addition, it is possible to reduce the number of setting steps for changing the inspection conditions, or to reduce the waiting time required for the inspection conditions (for example, temperature conditions) to stabilize.

In addition, the electronic components can be inspected under two different conditions without the need to temporarily recover the electronic components, and the two electronic components can be inspected simultaneously under different conditions. This can increase output.

[Application Example 11] In the electronic component transporting device of Application Example 10, it is preferable that the first mounting section and the second mounting section are arranged side by side along the moving direction of the electronic component mounting section.

Thereby, the electronic component holding portion can move the electronic component placement portion to place the electronic component placed on the first placement portion on the second placement portion.

[Application Example 12] In the electronic component transporting device of Application Example 10 or 11, it is preferable that the electronic component mounting portion has a third mounting portion on which the electronic component is mounted, and the third mounting portion is different from the above. The first placing section and the second placing section.

With this, the electronic component holding portion can place the electronic component placed on the second placing portion on the third placing portion. Thereby, the electronic components can be inspected under three different conditions without the need to temporarily recover the electronic components. Moreover, the three electronic components can be inspected at the same time under different conditions, which can increase the output.

[Application Example 13] In the electronic component transfer device of Application Example 12, it is preferable that the electronic component holding portion can hold the electronic component from the second placing portion and place the electronic component on the third placing portion.

Thereby, the electronic components can be inspected under three different conditions without the need to temporarily recover the electronic components. Moreover, the three electronic components can be inspected at the same time under different conditions, which can increase the output.

[Application Example 14] In the electronic component transporting device of any one of Application Examples 10 to 13, it is preferable that the electronic component holding portion includes a first holding portion holding the electronic component and a second holding portion holding the electronic component. A holding portion; and the first holding portion is different from the second holding portion.

Thereby, the electronic component holding portion can hold the electronic component placed on the first placing portion by the first holding portion, and the second holding portion can hold the electronic component placed on the second placing portion.

[Application Example 15] In the electronic component conveying device of Application Example 14, it is preferable that the first holding portion and the second holding portion are arranged side by side along the moving direction of the electronic component placing portion.

Thereby, the electronic component holding portion can hold the electronic component placed on the first placing portion by the first holding portion, and the second holding portion can hold the electronic component placed on the second placing portion.

[Application Example 16] In the electronic component transfer device of Application Example 14 or 15, it is preferable that the temperature of the first holding portion is different from the temperature of the second holding portion.

Thereby, the electronic components can be inspected under two different temperature conditions without temporarily recovering the electronic components, and the two electronic components can be inspected simultaneously under different temperature conditions.

[Application Example 17] In the electronic component transfer device of Application Example 14 or 15, the temperature of the first holding portion is preferably lower than the temperature of the second holding portion.

Thereby, the electronic components can be inspected under two different temperature conditions without temporarily recovering the electronic components, and the two electronic components can be inspected simultaneously under different temperature conditions.

[Application Example 18] In the electronic component transfer device of any one of Application Examples 14 to 17, it is preferable that the electronic component holding portion has a third holding portion that holds the electronic component, and the third holding portion is different from the above. The first holding portion and the second holding portion.

Thereby, without temporarily recovering the electronic parts, the inspection can be performed at three different temperature conditions, and at the same time, the three electronic parts can be inspected at different temperature conditions.

[Application Example 19] In the electronic component transfer device of Application Example 18, the temperature of the third holding portion is preferably different from the temperature of the first holding portion and the temperature of the second holding portion.

Thereby, without temporarily recovering the electronic parts, the inspection can be performed at three different temperature conditions, and at the same time, the three electronic parts can be inspected at different temperature conditions.

[Application Example 20] In the electronic component transfer device of Application Example 18, the temperature of the third holding portion is preferably higher than the temperature of the first holding portion and the temperature of the second holding portion.

Thereby, without temporarily recovering the electronic parts, the inspection can be performed at three different temperature conditions, and at the same time, the three electronic parts can be inspected at different temperature conditions.

[Application Example 21] The electronic component inspection device of this application example is characterized by including an electronic component mounting section including a first mounting section on which electronic components are mounted, and a second mounting section on which the electronic components are mounted. And the electronic component can be transported; the electronic component holding portion can hold the electronic component from the first placing portion and place the electronic component on the second placing portion; and an inspection portion that inspects the electronic component; and The second mounting section is different from the first mounting section. The first mounting section is configured to mount the electronic components before being inspected by the inspection section, and the second mounting section is disposed after being inspected by the inspection section. The above electronic parts.

Therefore, when the inspection of electronic parts is carried out, for example, firstly, they are placed on the first placing section, and the electronic parts after the inspection under the specific conditions are placed on the second placing section, The other electronic components before the inspection are placed in the first placing section.

Therefore, since the inspection conditions can be set differently, the degree of inspection freedom can be improved, which is particularly useful in the case of small batches. In addition, it is possible to reduce the number of setting steps for changing the inspection conditions, or to reduce the waiting time required for the inspection conditions (for example, temperature conditions) to stabilize.

In addition, the electronic components can be inspected under two different conditions without the need to temporarily recover the electronic components, and the two electronic components can be inspected simultaneously under different conditions. This can increase output.

1‧‧‧Inspection device (electronic parts inspection device)

1c‧‧‧Inspection device (electronic parts inspection device)

6‧‧‧Operation Department

11A‧‧‧The first pallet transfer mechanism

11B‧‧‧Second pallet transfer mechanism

12a‧‧‧The first temperature adjustment unit (the first soaking plate)

12b‧‧‧Second temperature adjustment unit (second soaking plate)

12c‧‧‧The first temperature adjustment unit

12d‧‧‧The second temperature adjustment unit

13‧‧‧ supply device transfer head

14a‧‧‧ 1st device supply unit (1st supply shuttle)

14b‧‧‧Second device supply unit (second supply shuttle)

14c‧‧‧The first device supply department

14d‧‧‧Second Device Supply Department

15‧‧‧3rd pallet transfer mechanism

16‧‧‧ Inspection Department

17a‧‧‧The first inspection device transfer head (first electronic parts holding section)

17b‧‧‧Second inspection device transfer head (second electronic parts holding section)

17c‧‧‧The first inspection device transfer head

17d‧‧‧ 2nd inspection device transfer head

18a‧‧‧The first device recovery section (the first recovery shuttle)

18b‧‧‧Second device recovery section (second recovery shuttle)

18c‧‧‧The first device recycling department

18d‧‧‧Second Device Recycling Department

19‧‧‧Recycling tray

20‧‧‧Recycling device transfer head

21‧‧‧The 6th pallet transfer mechanism

22A‧‧‧4th pallet transfer mechanism

22B‧‧‧5th pallet transfer mechanism

41‧‧‧cooling mechanism

42‧‧‧cooling mechanism

43‧‧‧cooling mechanism

44‧‧‧cooling mechanism

45‧‧‧cooling mechanism

51‧‧‧Heating mechanism

52‧‧‧Heating mechanism

53‧‧‧Heating mechanism

54‧‧‧Heating mechanism

61‧‧‧Display

62‧‧‧Display

80‧‧‧Control Department

90‧‧‧IC device

131‧‧‧hand unit

141‧‧‧ Device Supply Department

142‧‧‧Configuration board

145‧‧‧Dent

146‧‧‧Device supply section 1st temperature setting section

147‧‧‧ Device supply section Second temperature setting section

161‧‧‧ Inspection Department

162‧‧‧holding member

163‧‧‧ Holding Department

166‧‧‧The first temperature setting unit

167‧‧‧Second temperature setting unit

171a‧‧‧First Unit

171b‧‧‧Second hand unit

171c‧‧‧First Unit

171d‧‧‧Second hand unit

172‧‧‧hand unit body

173‧‧‧ holding member

176‧‧‧ Device transfer head first temperature setting section

176c‧‧‧Hand unit first temperature setting section (the first robot arm temperature setting section)

177‧‧‧ Device transfer head second temperature setting section

178c‧‧‧Hand unit third temperature setting section (third robot arm temperature setting section)

181‧‧‧Device Recovery Department

182‧‧‧Configuration board

185‧‧‧Dent

200‧‧‧tray

201‧‧‧hand unit

261‧‧‧The first placement section

262‧‧‧ 2nd placement section

263‧‧‧3rd placement section

264‧‧‧The fourth placement section

271‧‧‧The first holding section

272‧‧‧The second holding section

273‧‧‧The third holding section

274‧‧‧The fourth holding section

801‧‧‧Memory Department

901‧‧‧The first IC device (IC device)

902‧‧‧ 2nd IC device (IC device)

903‧‧‧The third IC device (IC device)

904‧‧‧ 4th IC device (IC device)

905‧‧‧The fifth IC device (IC device)

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ Inspection area

A4‧‧‧device recycling area (recycling area)

A5‧‧‧Tray removal area

R1‧‧‧Room 1

R2‧‧‧Room 2

R3‧‧‧Room 3

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

FIG. 1A is a schematic plan view showing a first embodiment of the electronic component inspection apparatus of the present invention.

FIG. 1B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head in FIG. 1A.

FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. 1A.

Fig. 3 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 4 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 5 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 6 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 7 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 8 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 9 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

FIG. 10 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 11 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 12A is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

FIG. 12B is a plan view illustrating the first inspection device transfer head and the second inspection device transfer head of FIG. 12A.

Fig. 13 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

Fig. 14 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

Fig. 15 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

FIG. 16 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

FIG. 17 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

Fig. 18 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

Fig. 19 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

FIG. 20A is a schematic plan view showing a fourth embodiment of the electronic component inspection apparatus of the present invention.

FIG. 20B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head of FIG. 20A.

FIG. 21 is a block diagram of the electronic component inspection apparatus shown in FIG. 20A.

Fig. 22A is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

22B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head of FIG. 22A.

Fig. 23 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 24 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 25 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 26 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 27 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 28 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 29 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 30 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 31 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 32 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 33 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 34 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 35 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 36 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 37 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 38 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 39 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 40 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 41 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 42 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 43 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 44 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 45 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 46 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 47 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 48 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

FIG. 49 is a plan view schematically showing a first inspection device transfer head and an inspection unit according to a fifth embodiment of the electronic component inspection apparatus of the present invention.

Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the embodiments shown in the attached drawings.

In the following, for convenience of explanation, for example, as shown in FIG. 1A and FIG. 20A, three axes that are orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. The direction parallel to the X axis is also referred to as "X direction", the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". In addition, the directions of the arrow signs of the X-axis, Y-axis, and Z-axis are referred to as positive sides, and the directions opposite to the arrow signs are referred to as negative sides. In addition, the upstream side in the direction of conveyance of electronic components is referred to as "upstream side", and the downstream side is referred to as "downstream side". In addition, the so-called "horizontal" in the description of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic components, it also includes a state inclined slightly (for example, less than about 5 °) with respect to the level.

The inspection devices (electronic part inspection devices) 1 and 1c described below are used for inspection / Test (hereinafter referred to as "inspection") IC devices such as BGA (Ball grid array) package or LGA (Land grid array) package, or LCD (Liquid Crystal Display), CIS (CMOS Image Sensor: CMOS image sensor) and other electrical components of electronic components. In the following, for convenience of explanation, a case where an IC device is used as the aforementioned electronic component to be inspected will be described as a representative, and it will be referred to as "IC device 90".

<First Embodiment>

FIG. 1A is a schematic plan view showing a first embodiment of the electronic component inspection apparatus of the present invention. FIG. 1B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head in FIG. 1A. FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. 1A.

In addition, in FIG. 1A, the first inspection device transfer head and the second inspection device transfer head overlap with other members, so they are indicated by two-dot chain lines. When describing the first inspection device transfer head and the second inspection device transfer head, FIG. 1B describes the first inspection device transfer head and the second inspection device transfer head.

As shown in FIG. 1A, the inspection device 1 is divided into a tray supply area A1, a device supply area (hereinafter referred to as "supply area") A2, an inspection area A3, a device recovery area (hereinafter referred to as "recycling area") A4, and tray removal. Area A5. These areas are separated from each other by a wall portion or a partition, etc., which are not shown. The supply area A2 is a first room R1 divided by a wall portion or a partition, and the inspection area A3 is a second room R2 divided by a wall portion or a partition. The recovery area A4 is a wall portion or a partition. The third room R3, such as a partition. The first room R1 (supply area A2), the second room R2 (inspection area A3), and the third room R3 (recovery area A4) are each configured to ensure airtightness or thermal insulation. Thereby, the first room R1, the second room R2, and the third room R3 can maintain the humidity or temperature as much as possible, respectively. The inside of the first room R1 and the second room R2 are controlled to a specific humidity and a specific temperature, respectively.

The IC device 90 is sequentially inspected from the tray supply area A1 to the tray removal area A5, passing through the above-mentioned areas in the inspection area A3 in the middle. In this way, the inspection device 1 includes The following are: an electronic component conveying device that conveys IC devices 90 in each area and has a control section 80; an inspection section 16 that performs inspections in an inspection area A3; and an inspection control section (not shown). In addition, in the inspection apparatus 1, the electronic component transfer apparatus is comprised by the structure other than the inspection part 16 and the inspection control part.

The tray supply area A1 is an area for supplying the trays 200 in which the plurality of IC devices 90 are arranged in an unchecked state. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3, respectively. In addition, a first tray transfer mechanism 11A and a second tray transfer mechanism 11B are provided to transfer the tray 200 one by one across the tray supply area A1 and the supply area A2.

In the supply area A2, a first temperature adjustment portion (a first soaking plate) 12a, which is a first placement portion on which the IC device 90 is placed, and a second temperature adjustment, which is a second placement portion on which the IC device 90 is placed, are provided. Unit (second soaking plate) 12b, supply device transfer head 13, and third tray transfer mechanism 15.

The first temperature adjustment unit 12a is a device (temperature control member) that cools a plurality of IC devices 90 and adjusts (controls) the temperature of the IC devices 90 to a temperature (first temperature) suitable for inspection (low temperature inspection). The second temperature adjustment unit 12b is a device (temperature control member) that heats a plurality of IC devices 90 and adjusts (controls) the temperature of the IC devices 90 to a temperature (second temperature) suitable for inspection (high temperature inspection). The first temperature adjustment section 12a and the second temperature adjustment section 12b are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in (carried in) from the tray supply area A1 by the first tray transfer mechanism 11A is carried and placed on the first temperature adjustment section 12a or the second temperature adjustment section 12b. The first temperature is lower than the second temperature (the first temperature is different from the second temperature).

The supply device transfer head 13 is supported in the supply area A2 so as to be movable in the X direction, the Y direction, and the Z direction. Thereby, the supply device transfer head 13 can transfer the IC device 90 between the tray 200 carried in from the tray supply area A1 and the first temperature adjustment portion 12a or the second temperature adjustment portion 12b, and the first temperature adjustment portion 12a. Or the second temperature adjustment unit 12b and The IC device 90 is transported between the first device supply portion 14a or the second device supply portion 14b. The supply device transfer head 13 includes a plurality of hand units 131 as holding parts capable of holding the IC device 90. Each of the hand units 131 is provided with a suction nozzle similarly to the first hand unit 171a described later, and can hold the IC device. 90 and hold. In addition, in each hand unit 131 of the supply device transfer head 13, the temperature of the IC device 90 can be adjusted so that the IC device 90 can be cooled or heated in the same manner as the first temperature adjustment portion 12a or the second temperature adjustment portion 12b. It is constructed in a manner suitable for the inspection temperature.

The third tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all the IC devices 90 have been removed in the X direction. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transfer mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, a first device supply portion (a first electronic component placement portion) (a first supply shuttle) 14a, which is a first placement portion, is provided (an IC device 90 can be placed (positioned) and transported). (Movable); the second mounting section, which is the second device supply section (second electronic component mounting section) (second supply shuttle) 14b, can mount (arrange) the IC device 90 and carry (movable); Inspection section 16; first inspection device transfer head (first electronic parts holding section) 17a; second inspection device transfer head (second electronic parts holding section) 17b; placement section which is the first device recovery section (first (Recycling shuttle) 18a, which can mount and transport IC devices 90; and a second component recovery section (second recycling shuttle) 18b, which is a mounting section, which can mount and transport IC devices 90.

The first device supply unit 14 a and the second device supply unit 14 b are devices that transport the IC devices 90 before the inspection after temperature adjustment (temperature control) to the inspection unit 16, respectively.

The first device supply unit 14a and the second device supply unit 14b each include a layout plate 142 on which the IC device 90 is placed (arranged), and a device supply unit body 141 that is movable in the X direction. On the upper surface of the configuration plate 142, a plurality of recesses 145 are provided, which are recesses for accommodating (holding) the IC device 90. In the configuration shown in the figure, a total of eight recesses 145 are arranged in a matrix in the form of four in the X direction and two in the Y direction. This layout plate 142 is detachably provided in the device supply unit 体 141. The first device supply portion 14a and the second device supply portion 14b are supported so as to be movable between the supply area A2 and the inspection area A3 in the X direction, respectively. The first device supply portion 14a and the second device supply portion 14b are arranged along the Y direction. The IC device 90 on the first temperature adjustment portion 12a or the second temperature adjustment portion 12b is transferred by the supply device transfer head 13. The first device supply unit 14a or the second device supply unit 14b is transported and placed. The first device supply unit 14a can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for inspection, similarly to the first temperature adjustment unit 12a. The second device supply unit 14b is similar to the second temperature adjustment unit 12b in that it can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (second temperature) suitable for inspection.

The first component supply portion 14a and the second component supply portion 14b constitute an electronic component mounting portion (supply shuttle).

The inspection section 16 is a unit that inspects / tests the electrical characteristics (performs an electrical inspection) of the IC device 90, that is, a component that holds the IC device 90 when inspecting the IC device 90.

The inspection section 16 includes a holding member 162 that holds the IC device 90 and an inspection section body 161 that supports the holding member 162. The holding member 162 is detachably provided in the inspection unit body 161.

On the upper surface of the holding member 162 of the inspection section 16, there are provided a plurality of holding portions 163, which are concave portions for accommodating (holding) the IC device 90. In addition, in the configuration shown in the figure, a total of eight holding portions 163 are arranged in a matrix in the form of four in the X direction and two in the Y direction. The IC device 90 is housed in the holding portion 163 and is thereby placed (mounted) on the inspection portion 16.

Further, probe pins are provided at positions corresponding to the respective holding portions 163 of the inspection portion 16 in a state where the IC device 90 is held on the holding portion 163 and are electrically connected to the terminals of the IC device 90. In addition, the terminals of the IC device 90 are electrically connected (contacted) with the probe pins, and the inspection of the IC device 90 is performed through the probe pins. The inspection of the IC device 90 is performed based on a program stored in a memory section of an inspection control section provided in a tester (not shown) connected to the inspection section 16.

It should be noted that among the eight holding portions 163 of the inspection portion 16, the four holding portions 163 on the lower side in FIG. 1A are similar to the first temperature adjustment portion 12 a, and are configured to cool the IC device 90 and connect the IC device. The first temperature setting unit 166 adjusts the temperature of the element 90 (settable) to a temperature (first temperature) suitable for inspection. In addition, the four holding portions 163 on the upper side of the eight holding portions 163 of the inspection portion 16 in FIG. 1A are configured to heat the IC device 90 and adjust the temperature of the IC device 90 similarly to the second temperature adjusting portion 12b ( The second temperature setting unit 167 can be set to a temperature (second temperature) suitable for inspection.

The first inspection device transfer head 17a and the second inspection device transfer head 17b are supported so as to be movable in the Y direction and the Z direction in the inspection area A3, respectively. The first inspection device transfer head 17a and the second inspection device transfer head 17b are arranged in the Y direction. The first inspection device transfer head 17 a can transport and place the IC devices 90 on the first device supply section 14 a carried in from the supply area A2 and place them on the inspection section 16, and can transport the IC devices 90 on the inspection section 16. And placed on the first device recovery unit 18a. Similarly, the second inspection device transfer head 17b can transfer and place the IC devices 90 on the second device supply section 14b carried in from the supply area A2 and place them on the inspection section 16, and the IC on the inspection section 16 can The device 90 is transported and placed on the second device recovery unit 18b. When inspecting the IC device 90, the first inspection device transfer head 17a and the second inspection device transfer head 17b press the IC device 90 toward the inspection portion 16, respectively, and thereby the IC device 90 is brought into contact with Examination Department 16. Accordingly, as described above, the terminals of the IC device 90 are electrically connected to the probe pins of the inspection unit 16.

As shown in FIG. 1B, the first inspection device transfer head 17 a includes a plurality of first hand units (first holding portions) 171 a capable of holding the IC device 90. In the configuration shown in the figure, the first hand unit 171a is arranged in a matrix form with a total of eight in the X direction and two in the Y direction. Similarly, the second inspection device transfer head 17 b includes a plurality of second hand units (second holding portions) 171 b capable of holding the IC device 90. In addition, in the configuration shown in the figure, a total of eight second hand units 171b are arranged in a matrix in the form of four in the X direction and two in the Y direction.

Since the configurations of each of the first-hand units 171a and each of the second-hand units 171b are the same, a description will be given below using one first-hand unit 171a as a representative. The first hand unit 171 a includes a holding member 173 that holds the IC device 90 and a hand unit body 172 that supports the holding member 173. Holding member 173 The hand unit body 172 is detachably provided. The first hand unit 171a includes a suction nozzle, and holds the IC device 90 by suction.

In addition, each of the first hand units 171a of the first inspection device transfer head 17a is the same as the first temperature adjustment unit 12a, and each of the IC devices 90 is cooled, and the IC devices 90 can be adjusted (settable) to a temperature suitable for inspection. (1st temperature).

In addition, each of the second hand units 171b of the second inspection device transfer head 17b can heat the IC device 90 and adjust (settable) the IC device 90 to a temperature suitable for inspection, similarly to the second temperature adjustment section 12b. (2nd temperature).

The first inspection device transfer head 17a and the second inspection device transfer head 17b constitute an electronic component holding portion.

The first device recovery unit 18a and the second device recovery unit 18b are devices that transport the IC devices 90 that have been inspected by the inspection unit 16 to the recovery area A4, respectively.

The first device recovery unit 18a and the second device recovery unit 18b each include a layout plate 182 on which the IC device 90 is placed (arranged), and a device recovery unit body 181 that is movable in the X direction. On the upper surface of the configuration plate 182, there are provided a plurality of recesses 185 for receiving (holding) the IC device 90. In the configuration shown in the figure, a total of eight recesses 185 are arranged in a matrix in the form of four in the X direction and two in the Y direction. The arrangement plate 182 is detachably attached to the device recovery portion main body 181. The first device recovery unit 18a and the second device recovery unit 18b are supported to be movable between the inspection area A3 and the recovery area A4 in the X direction, respectively. The first device recovery unit 18a and the second device recovery unit 18b are arranged along the Y direction. The IC device 90 on the inspection unit 16 is transported and placed in the first inspection unit 18a by the first inspection device transfer head 17a, or is transported and placed by the second inspection device transfer head 17b. In the second device recovery section 18b.

In this embodiment, the first device recovery unit 18a and the first device supply unit 14a are configured to move independently from each other, but the invention is not limited to this. For example, the first device recovery unit 18a and the first device The device supply unit 14a is connected or integrated to move the first device recovery unit 18a and the first device supply unit 14a together. Similarly, in this embodiment In this state, the second device recovery unit 18b and the second device supply unit 14b are configured to move independently from each other, but the invention is not limited to this. For example, the second device recovery unit 18b and the second device supply unit 14b may be connected. Alternatively, the second device recovery unit 18b and the second device supply unit 14b are integrally moved.

The recovery area A4 is an area in which the IC devices 90 having been inspected are recovered. In the collection area A4, a collection tray 19, a collection device transfer head 20, and a sixth tray transfer mechanism 21 are provided. An empty tray 200 is also provided in the collection area A4.

The collection trays 19 are fixed in the collection area A4. In the present embodiment, three collection trays 19 are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. Then, the IC device 90 on the first device recovery section 18 a or the second device recovery section 18 b moved to the recovery area A4 is transported and placed in any one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified based on the results of each inspection.

The recovery device transfer head 20 is supported to be movable in the X direction, the Y direction, and the Z direction within the recovery area A4. Thereby, the recovery device transfer head 20 can transfer the IC device 90 from the first device recovery unit 18 a or the second device recovery unit 18 b to the recovery tray 19 or the empty tray 200. In addition, the recycling device transfer head 20 has a plurality of hand units 201 as holding parts capable of holding the IC device 90. Each hand unit 201 is provided with a suction nozzle similar to the first hand unit 171a, and can hold and hold the IC device by suction. 90.

The sixth tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction. Furthermore, after the transfer, the empty tray 200 is placed at a position where the IC device 90 is recycled, that is, it may become any of the three empty trays 200 described above.

The tray removal area A5 is an area for collecting and removing the trays 200 in which the plurality of IC devices 90 in the inspected state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked.

Furthermore, a fourth tray transfer mechanism 22A and a fifth tray transfer mechanism 22B are provided to transfer the tray 200 one by one so as to span the recovery area A4 and the tray removal area A5. No. 4 The disk transfer mechanism 22A is a mechanism that transfers the tray 200 on which the IC devices 90 having been inspected are loaded from the recovery area A4 to the tray removal area A5. The fifth tray transfer mechanism 22B is a mechanism that transfers the empty tray 200 for collecting the IC devices 90 from the tray removal area A5 to the collection area A4.

The inspection control unit of the tester performs, for example, an (electrical) inspection of the electrical characteristics of the IC device 90 arranged in the inspection unit 16 based on a program stored in a memory unit (not shown).

As shown in FIG. 2, the inspection device 1 includes a control unit 80, an operation unit 6 electrically connected to the control unit 80 and performing each operation of the inspection device 1, and cooling mechanisms 41, 42, 43, and 44 for cooling the IC device 90. And heating mechanisms 51, 52, 53 and 54 for heating the IC device 90.

The control unit 80 includes a memory unit 801 that stores various information (data), for example, controls the first tray transfer mechanism 11A, the second tray transfer mechanism 11B, the first temperature adjustment unit 12a, the second temperature adjustment unit 12b, and the supply device transfer. Head 13, first device supply unit 14a, second device supply unit 14b, third tray transport mechanism 15, first inspection device transport head 17a, second inspection device transport head 17b, first device recovery unit 18a, first 2 Device recovery unit 18b, recovery device transfer head 20, sixth tray transfer mechanism 21, fourth tray transfer mechanism 22A, fifth tray transfer mechanism 22B, display portion 62, cooling mechanism 41 to 44, heating mechanism 51 to 54, etc. The drive of each department.

In addition, the operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays various information (data) such as an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. The display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. The operation of the operation unit 6 by the operator (operator) is performed by, for example, operating the input unit 61, moving the cursor to the position of each operation button (icon) displayed on the display unit 62, and selecting (clicking).

The input unit 61 is not limited to the above-mentioned configuration, and for example, a mechanical operation button such as a push button may be enumerated. The operation unit 6 is not limited to the above. The constituents described above may, for example, enumerate devices such as a touch panel that can display input and information.

The cooling mechanism 41 cools the first temperature adjustment section 12a, and cools the IC device 90 by the first temperature adjustment section 12a. The cooling mechanism 42 cools the first device supply unit 14a, and the IC device 90 is cooled by the first device supply unit 14a. The cooling mechanism 43 cools the first inspection device transfer head 17a, and cools the IC device 90 by the first inspection device transfer head 17a. In addition, the cooling mechanism 44 cools the four holding parts 163 of the eight holding parts 163 of the inspection part 16 in the lower side in FIG. 1A, that is, the first temperature setting part 166, and cools the IC device by the first temperature setting part 166. 90.

The cooling mechanisms 41 to 44 are not particularly limited. For example, it is possible to enumerate the flow of a refrigerant (for example, a low-temperature gas such as nitrogen generated by liquid nitrogen) into a tube disposed in or near a cooling object. Cooling devices, and Peltier elements.

In addition, the heating mechanism 51 heats the second temperature adjustment portion 12b, and the IC device 90 is heated by the second temperature adjustment portion 12b. The heating mechanism 52 heats the second device supply unit 14b, and the IC device 90 is heated by the second device supply unit 14b. The heating mechanism 53 heats the second inspection device transfer head 17b, and the second inspection device transfer head 17b heats the IC device 90. In addition, the heating mechanism 54 heats the four holding portions 163 on the upper side of the eight holding portions 163 of the inspection portion 16 in FIG. 1A, that is, the second temperature setting portion 167, and the IC device 90 is heated by the second temperature setting portion 167. .

The heating means 51 to 54 are not particularly limited, and examples thereof include heaters having electric heating wires and the like.

In such an inspection device 1, each of a low-temperature inspection performed by cooling the IC device 90 to a specific temperature and a high-temperature inspection performed by heating the IC device 90 at a specific temperature can be performed in parallel.

In the case of a low-temperature inspection, the IC device 90 cooled by the first temperature adjustment unit 12a is transported by the first device supply unit 14a and cooled, and then held by the first hand unit 171a of the first inspection device transport head 17a The IC device 90 is cooled. After that, with the first inspection device The component transfer head 17 a transfers the IC device 90 and holds the IC device 90 at the first temperature setting unit 166 of the inspection unit 16 to perform a low-temperature inspection.

When a high-temperature inspection is performed, the IC device 90 heated by the second temperature adjustment unit 12b is transported by the second device supply unit 14b and heated, and then the second hand unit of the second inspection device transport head 17b is transported and heated. 171b holds the IC device 90 and heats it. Then, the IC device 90 is transported by the second inspection device transfer head 17 b, and the IC device 90 is held in the second temperature setting section 167 of the inspection section 16 to perform a high-temperature inspection.

The first device supply unit 14a, the first inspection device transfer head 17a, and the like constitute a first transfer unit that can transfer the IC device 90, and adjust the IC device 90 to a first temperature. Further, the second device supply unit 14b, the second inspection device transfer head 17b, and the like constitute a second transfer unit that can transfer the IC device 90, and adjust the IC device 90 to a second temperature.

As described above, according to the inspection device 1, each of the low-temperature inspection and the high-temperature inspection of the IC device 90 can be performed, and the convenience is high.

In addition, since the low-temperature inspection and the high-temperature inspection can be performed in parallel, the throughput can be increased.

<Second Embodiment>

3 to 11 are diagrams for explaining the operation of the second embodiment of the electronic component inspection device of the present invention.

In addition, in FIG. 3 to FIG. 11, since the first inspection device transfer head and the second inspection device transfer head overlap with other members, they are indicated by two-dot chain lines.

Hereinafter, the second embodiment will be described, but the differences from the first embodiment described above will be mainly described, and descriptions of the same items will be omitted.

In the inspection device 1 of the second embodiment, the IC device 90 is firstly subjected to a low-temperature inspection, and secondly, a high-temperature inspection is performed. Thereafter, the IC device 90 that has completed the inspection is transferred (recovered) to the recovery area A4. Therefore, in the case of performing a low-temperature inspection and a high-temperature inspection, the throughput can be increased. In addition, since the IC device 90 is transported to the recovery area A4 not in a low temperature state, but in a high temperature state, dew condensation of the IC device 90 can be prevented. The following explains the inspection equipment. Set to 1.

First, as shown in FIG. 3, the IC device 90 is disposed in the four recesses 145 on the upper side in FIG. 3 of the first device supply portion 14 a and is cooled. In addition, the IC device 90 may be disposed in the four recesses 145 on the lower side in FIG. 3 of the first device supply portion 14a.

Next, as shown in FIG. 4, the IC device 90 is cooled by the first device supply unit 14 a and is transported to a position corresponding to the inspection unit 16.

Next, as shown in FIG. 5, the IC device 90 is held and cooled by the first hand unit 171a of the first inspection device transfer head 17a.

Next, as shown in FIG. 6, the first inspection device transfer head 17 a cools the IC device 90 and transports it to the first temperature setting unit 166 of the inspection unit 16 to perform a low-temperature inspection.

After the low-temperature inspection, a high-temperature inspection is performed, and high-temperature inspection is performed for all IC devices 90 that have completed the low-temperature inspection. However, it is preferable to perform high-temperature inspection only on IC devices 90 that pass the low-temperature inspection, and it is not necessary to perform inspection on unqualified IC devices 90 Check for high temperatures. This can shorten the time required for high-temperature inspection.

Next, as shown in FIG. 7, the IC device 90 is held and heated by the second hand unit 171 b of the second inspection device transfer head 17 b. Here, the state in which the IC device 90 is held by the first hand unit 171a of the first inspection device transfer head 17a may be maintained. The second device supply unit 14 b is moved to a position corresponding to the inspection unit 16.

Next, as shown in FIG. 8, the IC device 90 is heated by the second inspection device transfer head 17b, and is transported to a position corresponding to the second device supply portion 14b while being disposed in the recess 145 thereof. Then, the IC device 90 is heated to a specific temperature by the second device supply unit 14b.

Next, as shown in FIG. 9, the second hand unit 171 b of the second inspection device transfer head 17 b holds and heats the IC device 90 while transferring it to the second temperature setting unit 167 of the inspection unit 16. High temperature check. The second device recovery unit 18b moves to and inspects The position corresponding to the section 16.

Next, as shown in FIG. 10, the IC device 90 is transported to a position corresponding to the second device recovery unit 18 b by the second inspection device transport head 17 b and is disposed in the recess 185. As shown in FIG. 11, the IC device 90 is transported to the recovery area A4 by the second device recovery unit 18 b. The transfer of the IC device 90 to the collection area A4 is performed by the first device collection unit 18a.

As described above, according to the inspection device 1, each of the low-temperature inspection and the high-temperature inspection of the IC device 90 can be performed, and the convenience is high.

Furthermore, in the case of performing low-temperature inspection and high-temperature inspection on one IC device 90, the low-temperature inspection and high-temperature inspection can be performed without temporarily recovering the IC device 90, thereby increasing the output.

<Third Embodiment>

FIGS. 12A to 19 are diagrams for explaining the operation of the third embodiment of the electronic component inspection apparatus of the present invention.

In addition, in FIGS. 12A to 19, the first inspection device transfer head and the second inspection device transfer head overlap with other members, so they are indicated by two-dot chain lines. In describing the first inspection device transfer head and the second inspection device transfer head in FIG. 12A, the first inspection device transfer head and the second inspection device transfer head are described in FIG. 12B.

Hereinafter, the third embodiment will be described, but the differences from the first embodiment described above will be mainly described, and descriptions of the same items will be omitted.

As shown in FIGS. 12A and 12B, in the inspection device 1 of the third embodiment, among the eight first hand units 171a of the eight first hand units 171a of the first inspection device transfer head 17a, the four fourth The one-hand unit 171a constitutes the first temperature setting section (the first electronic component holding section temperature setting section) 176 of the device transfer head, which can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature suitable for inspection. (1st temperature). 12A and 12B of the eight first-hand units 171a of the eighth first-hand unit 171a of the first inspection device transfer head 17a are configured as four first-hand units 171a. Device transfer head second temperature setting section (second electronic component holding section temperature setting section) 177, which can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature suitable for inspection (second temperature) .

Similarly, the eight second hand units 171b of the second inspection device transfer head 17b of FIG. 12A and the lower four second hand units 171b of FIG. 12B constitute the first temperature setting unit of the device transfer head (first electronic The component holding portion temperature setting portion) 176 can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for inspection. In addition, the eight second hand units 171b of the second inspection device transfer head 17b of FIG. 12A and the upper four second hand units 171b in FIG. 12B constitute the second temperature setting unit of the device transfer head (second electronic component holding The internal temperature setting unit) 177 can heat the IC device 90 to adjust (settable) the temperature of the IC device 90 to a temperature (second temperature) suitable for inspection.

12A and 12B of the eight recesses 145 of the first device supply section 14a constitute the first temperature setting section of the device supply section (the temperature setting section of the first electronic component mounting section). 146), which can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for inspection. 12A and 12B of the eight recesses 145 of the first device supply section 14a constitute the second temperature setting section of the device supply section (temperature setting section of the second electronic component mounting section). 147, which can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (second temperature) suitable for inspection.

Similarly, the four recesses 145 of the eight recesses 145 of the second device supply section 14b in FIG. 12A and FIG. 12B constitute the first temperature setting section of the device supply section (temperature setting of the first electronic component mounting section) 146), which can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for inspection. 12A and 12B of the eight recesses 145 of the second device supply portion 14b constitute the second temperature setting portion of the device supply portion (the temperature setting portion of the second electronic component mounting portion) 147, which can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (second temperature) suitable for inspection.

The first temperature setting unit 146 of the device supply unit and the first temperature setting of the device transfer head The unit 176 and the like constitute the first transfer unit that transfers the IC device 90, and the IC device 90 can be set to the first temperature. In addition, the second temperature setting unit 147 of the device supply unit, the second temperature setting unit 177 of the device transfer head, and the like configure the IC device 90 to be transported, and the IC device 90 can be set to the second temperature transport unit of the second temperature.

In this inspection device 1, the IC device 90 is firstly subjected to a low-temperature inspection, and secondly, a high-temperature inspection is performed. After that, the IC device 90 that has completed the inspection is transferred (recovered) to the recovery area A4. Therefore, in the case of performing low-temperature inspection and high-temperature inspection, the output can be increased. In addition, since the IC device 90 is transported to the recovery area A4 not in a low temperature state, but in a high temperature state, dew condensation of the IC device 90 can be prevented. Hereinafter, the operation of the inspection device 1 will be described. Here, the case where the first low-temperature inspection and the high-temperature inspection of the IC device 90 during the above-mentioned low-temperature inspection and high-temperature inspection are performed by the first device supply unit 14a and the first inspection device transfer head 17a will be described as a representative. Instructions.

First, as shown in FIG. 12A and FIG. 12B, the IC device 90 is disposed in the device supply section first temperature setting section 146 of the first device supply section 14 a and is cooled.

Next, as shown in FIG. 13, the IC device 90 is cooled by the first device supply unit 14 a and is transported to a position corresponding to the inspection unit 16.

Next, as shown in FIG. 14, the IC device 90 is held and cooled by the first temperature setting unit 176 of the device transfer head of the first inspection device transfer head 17 a and transferred to the first temperature setting unit of the inspection unit 16. 166 and perform a low temperature inspection.

Although the high temperature inspection can be performed after the low temperature inspection, and all IC devices 90 that have completed the low temperature inspection can also be subjected to the high temperature inspection, it is preferable to perform the high temperature inspection only on the IC devices 90 that pass the low temperature inspection, and it is not necessary to perform the high temperature inspection The IC device 90 performs a high-temperature inspection. This can shorten the time required for high-temperature inspection.

Next, as shown in FIG. 15, the IC device 90 is transported to a position corresponding to the first device supply unit 14 a by the first inspection device transfer head 17 a and is disposed in the device supply unit second temperature setting unit 147. The second temperature setting unit 147 of the device supply unit heats the IC device 90 to a specific temperature. It is also possible to omit the second temperature by the device supply section. The setting unit 147 heats the IC device 90, and the IC device 90 is heated only by the device transfer head second temperature setting unit 177 of the first inspection device transfer head 17a described later.

Next, as shown in FIG. 16, the IC device 90 is held and heated by the device transfer head second temperature setting unit 177 of the first inspection device transfer head 17 a, and as shown in FIG. 17, the IC device 90 is transferred to The second temperature setting unit 167 of the inspection unit 16 performs a high-temperature inspection. The first device recovery unit 18 a moves to a position corresponding to the inspection unit 16.

Next, as shown in FIG. 18, the IC device 90 is transported to a position corresponding to the first device recovery unit 18 a by the first inspection device transport head 17 a and is disposed in the recess 185 thereof. Thereafter, as shown in FIG. 19, the IC device 90 is transported to the recovery area A4 by the first device recovery unit 18 a.

As described above, the case where the low-temperature inspection and the high-temperature inspection of the IC device 90 are performed by the first device supply unit 14a and the first inspection device transfer head 17a has been described, but the second device transport unit 14b and the second inspection device transfer head 17b are performed in the same manner.

In addition, the low-temperature inspection and the high-temperature inspection performed by the IC device 90 by the first device supply unit 14a and the first inspection device transfer head 17a, and the second inspection unit 14b and the second inspection may be performed in parallel. The low-temperature inspection and the high-temperature inspection performed by the device transfer head 17b for transferring the IC device 90. This can increase output.

As described above, according to the inspection device 1, each of the low-temperature inspection and the high-temperature inspection of the IC device 90 can be performed, and the convenience is high.

Furthermore, in the case of performing a low-temperature inspection and a high-temperature inspection on one IC device 90, the low-temperature inspection and high-temperature inspection can be performed without temporarily recovering the IC device 90, thereby increasing the throughput.

In the second and third embodiments, the low-temperature inspection is performed first, and then the high-temperature inspection is performed. However, the present invention is not limited to this, but the high-temperature inspection may be performed first, and the low-temperature inspection may be performed thereafter.

<Fourth Embodiment>

FIG. 20A is a schematic plan view showing a fourth embodiment of the electronic component inspection device of the present invention. FIG. 20B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head of FIG. 20A. FIG. 21 is a block diagram of the electronic component inspection apparatus shown in FIG. 20A. 22 to 48 are diagrams for explaining the operation of the electronic component inspection device shown in FIG. 20A.

In FIG. 20A, the first inspection device transfer head and the second inspection device transfer head overlap with other members, and therefore are shown by two-dot chain lines (the same applies to FIGS. 22A to 48). 20A, when the first inspection device transfer head and the second inspection device transfer head are described, the first inspection device transfer head and the second inspection device transfer head are described in FIG. 20B (FIG. 22A also shows FIG. 22A). Similarly, it is described in FIG. 22B).

In addition, in FIG. 22A to FIG. 48, only components necessary for the description of the operation of the electronic component inspection device are described.

The inspection device 1c is configured to perform low-temperature inspection for cooling the IC device 90 to a specific temperature (first temperature), high-temperature inspection for heating the IC device 90 to a specific temperature (third temperature), and Normal temperature check at normal temperature (second temperature). The first temperature is lower than the second temperature, and the second temperature is lower than the third temperature.

As shown in FIGS. 20A and 20B, the inspection device 1c is divided into a tray supply area A1, a device supply area (hereinafter referred to as "supply area") A2, an inspection area A3, a device recovery area (hereinafter referred to as "recycling area") A4, and Tray removal area A5. These areas are separated from each other by a wall portion or a partition, etc., which are not shown. The supply area A2 is a first room R1 divided by a wall portion or a partition, and the inspection area A3 is a second room R2 divided by a wall portion or a partition. The recovery area A4 is a wall portion or a partition. The third room R3, such as a partition. The first room R1 (supply area A2), the second room R2 (inspection area A3), and the third room R3 (recovery area A4) are each configured to ensure airtightness and thermal insulation. Thereby, the first room R1, the second room R2, and the third room R3 can maintain the humidity or temperature as much as possible, respectively. The inside of the first room R1 and the second room R2 are controlled to a specific humidity and a specific temperature, respectively.

The IC device 90 is sequentially inspected from the tray supply area A1 to the tray removal area A5, passing through the above-mentioned areas in the inspection area A3 in the middle. In this way, the inspection device 1c includes the following: an electronic component transporting device that transports the IC device 90 in each area and has a control unit 80; an inspection unit 16 that performs an inspection in the inspection area A3; and an inspection (not shown) Control department. In addition, the inspection device 1c has a configuration other than the inspection unit 16 and the inspection control unit, and constitutes an electronic component transfer device.

The tray supply area A1 is an area for supplying the trays 200 in which the plurality of IC devices 90 are arranged in an unchecked state. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3, respectively. In addition, a first tray transfer mechanism 11A and a second tray transfer mechanism 11B are provided to transfer the tray 200 one by one across the tray supply area A1 and the supply area A2.

In the supply area A2, a first temperature adjustment portion (a first soaking plate) 12c, which is a first placement portion on which the IC device 90 is placed, and a second temperature adjustment, which is a second placement portion on which the IC device 90 is placed, are provided. Unit (second soaking plate) 12d, supply device transfer head 13, and third tray transfer mechanism 15.

The first temperature adjustment section 12c and the second temperature adjustment section 12d are devices (temperature control means) that cool or heat a plurality of IC devices 90, respectively, and adjust (control) the temperature of the IC devices 90 to a temperature suitable for inspection. The first temperature adjustment section 12c and the second temperature adjustment section 12d are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in (carried in) from the tray supply area A1 by the first tray transfer mechanism 11A is carried and placed on the first temperature adjustment section 12c or the second temperature adjustment section 12d. In this embodiment, a case where the first temperature adjustment section 12c and the second temperature adjustment section 12d are each applied to a device for cooling the IC device 90 will be described.

The supply device transfer head 13 is supported in the supply area A2 so as to be movable in the X direction, the Y direction, and the Z direction. Thereby, the supply device conveying head 13 can be provided between the tray 200 carried in from the tray supply area A1 and the first temperature adjustment section 12c or the second temperature adjustment section 12d. The IC device 90 is transported, and the IC device 90 is transported between the first temperature adjustment section 12c or the second temperature adjustment section 12d and the first device supply section 14c or the second device supply section 14d described later. The supply device transfer head 13 includes a plurality of hand units 131 as a robot arm (holding portion) capable of holding the IC device 90. Each hand unit 131 is similar to the first hand unit 171c described later, and has a suction nozzle. The IC device 90 is held by adsorption. In addition, each hand unit 131 of the supply device transfer head 13 may be configured to cool or heat the IC device 90, and adjust the temperature of the IC device 90 to a temperature suitable for inspection.

The third tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all the IC devices 90 have been removed in the X direction. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transfer mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, a first electronic component mounting section (electronic component mounting section), that is, a first device supply section (first shuttle) (first supply shuttle) 14c is provided, which can be mounted (arranged) ) The IC device 90 is transported (movable); the second electronic component mounting section (electronic component mounting section), that is, the second device supply section (second shuttle) (second supply shuttle) 14d, can be mounted thereon. (Arrangement) IC device 90 is transported (movable); inspection section 16; first electronic component holding section (electronic component holding section), that is, the first inspection device transportation head (first robotic arm) 17c; second electronic The part holding part (electronic part holding part), that is, the second inspection device transfer head (second robot arm) 17d; the placement part is the first device recovery part (first recovery shuttle) 18c, which can mount and transport the IC Device 90; and a second device recovery section (second recovery shuttle) 18d, which is a mounting section, which can mount and transport the IC device 90.

The first device supply unit 14 c and the second device supply unit 14 d are each a device that transports the IC device 90 before inspection to the vicinity of the inspection unit 16.

The first device supply unit 14c and the second device supply unit 14d each include a layout plate 142 on which the IC device 90 is placed (arranged), and a device supply unit body 141 that is movable in the X direction. A concave portion accommodating (holding) the IC device 90 is provided on an upper surface of the configuration plate 142, that is, a plurality of concave cavities 145. In the illustrated configuration, the number of the recesses 145 is four in the X direction and two in the Y direction. A total of eight are arranged in a matrix. The arrangement plate 142 is detachably provided on the device supply unit body 141. The first device supply portion 14c and the second device supply portion 14d are supported so as to be movable between the supply area A2 and the inspection area A3 in the X direction, respectively. The first device supply unit 14c and the second device supply unit 14d are arranged along the Y direction, and the IC device 90 on the first temperature adjustment unit 12c or the second temperature adjustment unit 12d is transferred by the supply device transfer head 13, The first device supply unit 14c or the second device supply unit 14d is transported and placed.

Here, as shown in FIG. 22A, among the eight recesses 145 of the first device supply portion 14c, the two recesses 145 on the left in FIG. 22A are the first mounting portions 261, and the second group from the left in FIG. 22A The two pockets 145 are the second placement portion 262, and the two pockets 145 in the third group from the left in FIG. 22A are the third placement portion 263. The two pockets 145 on the right in FIG. Mounting section 264. The first placement portion 261, the second placement portion 262, the third placement portion 263, and the fourth placement portion 264 are arranged side by side in the X direction. The same applies to the second device supply unit 14d.

The first device supply unit 14c and the second device supply unit 14d may be configured to cool or heat the IC device 90 and adjust (set) the temperature of the IC device 90 to a temperature suitable for inspection.

In this case, for example, the first mounting portion 261 of the first device supply portion 14c constitutes the first temperature setting portion of the device supply portion, which can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to Temperature suitable for low-temperature inspection (first temperature).

The second placement section 262 constitutes a second temperature setting section of the device supply section, and does not cool or heat the IC device 90. Instead, the temperature of the IC device 90 is set (settable) for normal temperature inspection. Temperature (second temperature). In addition, the second mounting portion 262 may be configured to, for example, cool and heat the IC device 90, and the temperature of the IC device 90 may be adjusted to a temperature suitable for normal temperature inspection by the cooling or heating.

The third placement section 263 constitutes a third temperature setting section of the device supply section, and can heat the IC device 90 to adjust (settable) the temperature of the IC device 90 to a temperature suitable for high-temperature inspection (third temperature). . In addition, of the eight placement sections of the first device supply section 14C, the right side in FIG. 22A Although the two fourth mounting portions 264 are not used in this embodiment, they may be configured to be used.

The inspection unit 16 is a unit that inspects / tests the electrical characteristics (performs electrical inspection) of the IC device 90, that is, the components that hold the IC device 90 when inspecting the IC device 90.

As shown in FIG. 20A, the inspection section 16 includes a holding member 162 that holds the IC device 90 and an inspection section body 161 that supports the holding member 162. The holding member 162 is detachably provided in the inspection unit body 161.

On the upper surface of the holding member 162 of the inspection section 16, there are provided a plurality of holding portions 163, which are concave portions for accommodating (holding) the IC device 90. In the configuration shown in the figure, the holding portions 163 are arranged in a matrix form with a total of eight in the X direction and two in the Y direction. The IC device 90 is housed in the holding portion 163 and is thereby placed (mounted) on the inspection portion 16.

Further, at positions corresponding to the respective holding portions 163 of the inspection portion 16, there are provided probe pins which are electrically connected to the terminals of the IC device 90 while the IC device 90 is held by the holding portion 163. In addition, the terminals of the IC device 90 are electrically connected (contacted) with the probe pins, and the inspection of the IC device 90 is performed through the probe pins. The inspection of the IC device 90 is performed based on a program stored in a memory section of an inspection control section provided in a tester (not shown) connected to the inspection section 16.

Also, as shown in FIG. 22A, the two holding portions 163 on the left side in FIG. 22A of the eight holding portions 163 of the inspection portion 16 constitute a coolable IC device 90, and the temperature of the IC device 90 can be adjusted (settable) as appropriate The first temperature setting unit 166 is the temperature (first temperature) of the low-temperature inspection.

22A from the left of the eight holding sections 163 of the inspection section 16 form the second holding section 163 of the second group from the left. The second temperature setting section 167 does not cool or heat the IC device 90. The temperature of the IC device 90 is set (settable) to a temperature (second temperature) suitable for normal temperature inspection. The second temperature setting unit 167 may be configured to cool and heat the IC device 90, for example, and adjust the IC device 90 to a temperature suitable for normal temperature inspection by the cooling or heating.

In addition, among the eight holding portions 163 of the inspection portion 16, two holding portions 163 in the third group from the left in FIG. 22A constitute a third temperature setting portion 168, which can heat the IC device 90 and adjust the IC device 90 ( (Settable) is the temperature (third temperature) suitable for high-temperature inspection.

It should be noted that, among the eight holding portions 163 of the inspection portion 16, the two holding portions 163 on the right side in FIG. 22A in FIG. 22A are not used in this embodiment, but may be used.

As shown in FIGS. 20A and 20B, the first inspection device transfer head 17c and the second inspection device transfer head 17d are supported so as to be movable in the Y direction and the Z direction in the inspection area A3, respectively. The first inspection device transfer head 17c and the second inspection device transfer head 17d are arranged along the Y direction. The first inspection device transfer head 17c can transport and place the IC devices 90 on the first device supply section 14c carried in the supply area A2, and place them on the inspection section 16, and can transport the IC devices 90 on the inspection section 16 And placed on the first device recovery section 18c. Similarly, the second inspection device transfer head 17d can transport and place the IC device 90 on the second device supply portion 14d carried in the supply area A2 and place it on the inspection portion 16, and the IC on the inspection portion 16 can be placed thereon. The device 90 is transported and placed on the second device recovery unit 18d. When the IC device 90 is inspected, the first inspection device transfer head 17c and the second inspection device transfer head 17d press the IC device 90 toward the inspection unit 16, respectively, thereby bringing the IC device 90 into contact with the inspection. Department 16. Accordingly, as described above, the terminals of the IC device 90 are electrically connected to the probe pins of the inspection unit 16.

The first inspection device transfer head 17c includes a plurality of first hand units 171c capable of holding the IC device 90. In addition, in the configuration shown in the figure, a total of eight first hand units 171c are arranged in a matrix in the form of four in the X direction and two in the Y direction. Similarly, the second inspection device transfer head 17d includes a plurality of second hand units 171d that can hold the IC device 90. In the configuration shown in the figure, a total of eight second hand units 171d are arranged in a matrix, with four in the X direction and two in the Y direction.

Since the configurations of each of the first-hand units 171c and each of the second-hand units 171d are the same, a description will be given below using one first-hand unit 171c as a representative. As shown in FIG. 22B, the first hand unit 171c includes a holding member 173 that holds the IC device 90, and a processing unit body that supports the holding member 173. 172. The holding member 173 is detachably provided in the hand unit body 172. The first hand unit 171c includes a suction nozzle, and can hold the IC device 90 by suction.

As shown in FIG. 22B, of the eight first hand units 171c of the first inspection device transfer head 17c, the two first hand units 171c on the left side in FIG. 22B are the first holding portions 271 and constitute the first hand unit The temperature setting unit (first robot arm temperature setting unit) 176c can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for low-temperature inspection.

In addition, of the eight first hand units 171c of the eighth first hand unit 171c of the first inspection device, the two first hand units 171c of the second group from the left in FIG. 22B are the second holding portions 272, constituting the second temperature of the hand unit The setting section 177c does not cool or heat the IC device 90, but sets (can set) the temperature of the IC device 90 to a temperature (second temperature) suitable for normal temperature inspection. In addition, the second holding portion 272 (the second unit temperature setting unit 177c of the hand unit) may be configured to cool and heat the IC device 90, for example, and adjust the temperature of the IC device 90 to be suitable for normal temperature inspection by cooling or heating. Of temperature.

In addition, of the eight first hand units 171c of the first inspection device transfer head 17c, two first hand units 171c in the third group from the left in FIG. 22B are the third holding portions 273, and constitute the third temperature of the hand unit The setting unit (third robot arm temperature setting unit) 178c can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (third temperature) suitable for high-temperature inspection.

Furthermore, of the eight first-hand units 171c of the first inspection device transfer head 17c, the two first-hand units 171c on the right in FIG. 22B in FIG. 22B are the fourth holding portions 274, which are not used in this embodiment. But it can also be used.

The first holding portion 271, the second holding portion 272, the third holding portion 273, and the fourth holding portion 274 are arranged side by side in the X direction.

The same applies to the second inspection device transfer head 17d.

In addition, in FIG. 23 to FIG. 38, if the first holding portion 271 is indicated by "○", it overlaps with other components and is difficult to be seen. Therefore, two portions shared with the first unit temperature setting portion 176c of the hand unit are used. The dotted chain line indicates it. The same applies to the second holding portion 272, the third holding portion 273, and the fourth holding portion 274.

As shown in FIG. 20A, each of the first device recovery unit 18 c and the second device recovery unit 18 d is a device that transports the IC device 90 that has been inspected by the inspection unit 16 to the recovery area A4.

The first device recovery unit 18c and the second device recovery unit 18d each include a layout plate 182 on which the IC device 90 is placed (arranged), and a device recovery unit body 181 that is movable in the X direction. On the upper surface of the configuration plate 182, there are provided a plurality of recesses 185 for receiving (holding) the IC device 90. In the configuration shown in the figure, a total of eight recesses 185 are arranged in a matrix in the form of four in the X direction and two in the Y direction. The arrangement plate 182 is detachably attached to the device recovery portion main body 181. The first device recovery unit 18c and the second device recovery unit 18d are supported to be movable between the inspection area A3 and the recovery area A4 in the X direction, respectively. The first device recovery unit 18c and the second device recovery unit 18d are arranged along the Y direction. The IC device 90 on the inspection unit 16 is transported and placed in the first inspection unit 18c by the first inspection device transfer head 17c, or is transported and placed by the second inspection device transfer head 17d. In the second device recovery section 18d.

In addition, in FIG. 20A, in order to facilitate the distinction between the first device recovery section 18c and the first device supply section 14c, they are illustrated independently of each other, but the first device recovery section 18c and the first device supply section 14c may be configured as such As shown in the figure, they can move independently of each other, and the first device recovery unit 18c and the first device supply unit 14c can be connected or integrated to move the first device recovery unit 18c and the first device supply unit 14c as a whole. The same applies to the second device recovery unit 18d and the second device supply unit 14d.

The recovery area A4 is an area where the IC device 90 that has been inspected is recovered. In the collection area A4, a collection tray 19, a collection device transfer head 20, and a sixth tray transfer mechanism 21 are provided. An empty tray 200 is also provided in the collection area A4.

The collection trays 19 are fixed in the collection area A4. In the present embodiment, three collection trays 19 are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. Then, the IC device 90 on the first device recovery section 18c or the second device recovery section 18d moved to the recovery area A4. Any one of the collection tray 19 and the empty tray 200 is transported and placed. As a result, the IC device 90 is collected and classified based on the results of each inspection.

The recovery device transfer head 20 is supported to be movable in the X direction, the Y direction, and the Z direction within the recovery area A4. Thereby, the recovery device transfer head 20 can transfer the IC device 90 from the first device recovery unit 18c or the second device recovery unit 18d to the recovery tray 19 or the empty tray 200. The recycling device transfer head 20 includes a plurality of hand units 201 as robot arms (holding portions) capable of holding the IC device 90. Each hand unit 201 is provided with a suction nozzle similar to the first hand unit 171c. The IC device 90 is adsorbed and held.

The sixth tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction. After the transfer, the empty tray 200 is disposed at the position where the IC device 90 is collected, that is, it may become any of the three empty trays 200 described above.

The tray removal area A5 is an area for collecting and removing the trays 200 in which the plurality of IC devices 90 in the inspected state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked.

In addition, a fourth tray conveyance mechanism 22A and a fifth tray conveyance mechanism 22B are provided to move the tray 200 one by one so as to span the recovery area A4 and the tray removal area A5. The fourth tray transfer mechanism 22A is a mechanism that transfers the tray 200 on which the IC devices 90 having been inspected are loaded from the recovery area A4 to the tray removal area A5. The fifth tray transfer mechanism 22B is a mechanism that transfers the empty tray 200 for collecting the IC devices 90 from the tray removal area A5 to the collection area A4.

The inspection control unit of the tester performs, for example, inspection of electrical characteristics (electricity) of the IC device 90 arranged in the inspection unit 16 based on a program stored in a memory unit (not shown).

As shown in FIG. 21, the inspection device 1 c includes a control unit 80, an operation unit 6 which is electrically connected to the control unit 80 and performs each operation of the inspection device 1 c, and cooling mechanisms 41, 42, 43, 44 that cool the IC device 90. And 45, and heating mechanisms 51, 52, and 53 for heating the IC device 90.

The control unit 80 includes a memory unit 801 that stores various information (data), for example, controls the first tray transfer mechanism 11A, the second tray transfer mechanism 11B, the first temperature adjustment unit 12c, the second temperature adjustment unit 12d, and the supply device transfer. Head 13, first device supply unit 14c, second device supply unit 14d, third tray transport mechanism 15, first inspection device transport head 17c, second inspection device transport head 17d, first device recovery unit 18c, first 2 Device recovery unit 18d, recovery device transfer head 20, sixth tray transfer mechanism 21, fourth tray transfer mechanism 22A, fifth tray transfer mechanism 22B, display portion 62, cooling mechanism 41 to 45, heating mechanism 51 to 53, etc. The drive of each department.

In addition, the operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays various information (data) such as an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. The display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. The operation of the operation unit 6 by the operator (operator) is performed by, for example, operating the input unit 61, moving the cursor to the position of each operation button (icon) displayed on the display unit 62, and selecting (clicking) it.

The input unit 61 is not limited to the above-mentioned configuration, and for example, a mechanical operation button such as a push button may be enumerated. In addition, the operation unit 6 is not limited to the one described above, and for example, a device capable of displaying input and information such as a touch panel may be enumerated.

The cooling mechanism 41 cools the first temperature adjustment unit 12c, and cools the IC device 90 by the first temperature adjustment unit 12c. The cooling mechanism 42 cools the second temperature adjustment portion 12d, and cools the IC device 90 by the second temperature adjustment portion 12d. The cooling mechanism 43 cools the first holding portion 271 (the first unit temperature setting portion 176c) of the first inspection device transfer head 17c, and cools the IC device 90 by the first holding portion 271. The cooling mechanism 44 cools the first holding portion 271 (the first temperature setting portion 176c of the hand unit) of the second inspection device transfer head 17d, and cools the IC device 90 by the first holding portion 271. In addition, the cooling mechanism 45 cools the two holding parts 163 on the left side in FIG. 22A of the eight holding parts 163 of the inspection part 16, that is, the first temperature setting part 166, and cools the IC device 90 by the first temperature setting part 166. .

The cooling mechanisms 41 to 45 are not particularly limited. For example, the cooling mechanism (e.g., a low-temperature gas such as nitrogen generated by liquid nitrogen) can be enumerated to flow in a tube disposed in or near a cooling object. Cooling devices, and Peltier elements.

The heating mechanism 51 heats the third holding portion 273 (the third unit temperature setting portion 178c of the hand unit) of the first inspection device transfer head 17c, and heats the IC device 90 by the third holding portion 273. The heating mechanism 52 heats the third holding portion 273 (the third unit temperature setting portion 178c of the hand unit) of the second inspection device transfer head 17d, and heats the IC device 90 by the third holding portion 273. In addition, the heating mechanism 53 heats the eight holding sections 163 of the inspection section 16 from the left in the third group from the left in the third group of two holding sections 163, that is, the third temperature setting section 168. The third temperature setting section 168 168heats the IC device 90.

The heating means 51 to 53 are not particularly limited, and examples thereof include heaters having electric heating wires and the like.

Next, the operation of the inspection device 1c will be described. Here, the case where the IC device 90 is transported by the first device supply unit 14c, the first inspection device transfer head 17c, and the first device recovery unit 18c will be representative. Be explained.

The IC device 90 to be inspected is sequentially transferred to the inspection unit 16 by the first device supply unit 14c and the first inspection device transfer head 17c. Here, the first (first) unit to be inspected (transported) The IC device 90 is referred to as "the first IC device 901" or "IC device 901", and the second IC device 90 to be inspected is referred to as the "second IC device 902" or "IC device 902". The three IC devices 90 to be inspected are referred to as "third IC device 903" or "IC device 903", and the fourth IC devices 90 to be inspected are referred to as "4th IC device 904" or "IC device 904" ", The fifth IC device 90 to be inspected is referred to as" the fifth IC device 905 "or" IC device 905 ". In addition, when the first, second, third, fourth, fifth, etc. are not distinguished, they are referred to as "IC device 90". In FIGS. 22A to 48, the IC device 901 is represented by “I”, the IC device 902 is represented by “II”, the IC device 903 is represented by “III”, and the IC device 904 is represented by “IV”. The IC device 905 is represented by "V".

First, as shown in FIG. 22A and FIG. 22B, the first IC device 901 is placed (arranged) on the first placement portion 261 of the first device supply portion 14c via the supply device transfer head 13. That is, the IC device 901 before inspection is mounted on the first mounting portion 261. Preferably, the IC device 901 is cooled in advance by the first temperature adjustment portion 12c or the second temperature adjustment portion 12d, but it may not be cooled. The same applies to the IC device 902 and the IC device 903 described later.

Next, as shown in FIG. 23, the IC device 901 is transported to a position corresponding to the first temperature setting section 166 of the inspection section 16 by the first device supply section 14c, that is, the first load of the first device supply section 14c The first temperature setting section 166 of the setting section 261 and the inspection section 16 are arranged side by side in the Y direction.

Next, the IC device 901 is held and cooled by the first holding portion 271 of the first inspection device transfer head 17c.

Next, as shown in FIG. 24, the IC device 901 held by the first holding portion 271 is cooled by the first holding portion 271 and is transferred to the first temperature setting portion 166 of the inspection portion 16. Next, the IC device 901 is subjected to a low-temperature inspection.

In addition, although the IC device 901 is preset to perform normal temperature inspection after that, and all the IC devices 901 that have completed the low temperature inspection can also be subjected to the normal temperature inspection, it is preferable to perform the normal temperature only on the IC devices 901 that pass the low temperature inspection. For inspection, there is no need to perform normal temperature inspection on unqualified IC devices 901. Thereby, unnecessary inspection can be omitted.

On the other hand, as shown in FIG. 25, in order to receive the second IC device 902, the first device supply unit 14c moves to the negative side in the X direction.

Next, as shown in FIG. 26, the second IC device 902 is placed on the first placement section 261 of the first device supply section 14c by the supply device transfer head 13.

Next, as shown in FIG. 27, the first device supply portion 14c moves to the positive side in the X direction and stops at the second placement portion 262 of the first device supply portion 14c and the first temperature setting portion 166 of the inspection portion 16 along the Y Position side by side.

Next, as shown in FIG. 28, the IC device 901 held by the first holding portion 271 of the first inspection device transfer head 17c is transferred and placed in the second placement portion 262 of the first device supply portion 14c, and It is placed on the second placing portion 262. That is, the IC device 901 after the low-temperature inspection is mounted on the second mounting portion 262.

Next, as shown in FIG. 29, the first device supply portion 14 c moves to the positive side in the X direction and stops at the first placement portion 261 of the first device supply portion 14 c and the first temperature setting portion 166 of the inspection portion 16 along the Y The second mounting portion 262 and the second temperature setting portion 167 are aligned side by side in the Y direction.

Next, the second IC device 902 is held and cooled by the first holding portion 271 of the first inspection device transfer head 17c, and at the same time, the first IC device 901 is held by the second holding portion 272.

Next, as shown in FIG. 30, the IC device 902 held by the first holding portion 271 is cooled by the first holding portion 271 and is transferred to the first temperature setting portion 166 of the inspection portion 16. The IC device 901 held by the second holding portion 272 is transported to the second temperature setting portion 167 of the inspection portion 16 by the second holding portion 272. Thereafter, the IC device 901 is subjected to a normal temperature inspection, and the IC device 902 is subjected to a low temperature inspection.

In addition, although the IC device 901 is preset to be subjected to a high-temperature inspection after that, and all the IC devices 901 that have completed the normal-temperature inspection can also be subjected to a high-temperature inspection, it is preferable to perform the high-temperature inspection only on the IC devices 901 that pass the normal-temperature inspection. It is not necessary to perform a high-temperature inspection on unqualified IC devices 901. In addition, although the IC device 902 is preset to perform normal temperature inspection after that, and all the IC devices 902 that have completed the low temperature inspection can also be subjected to the normal temperature inspection, it is preferable to perform the normal temperature only on the IC devices 902 that pass the low temperature inspection. For inspection, there is no need to perform normal temperature inspection on the failed IC device 902. Thereby, unnecessary inspection can be omitted.

On the other hand, as shown in FIG. 31, in order to receive the third IC device 903, the first device supply unit 14c moves to the negative side in the X direction.

Next, as shown in FIG. 32, the third IC device 903 is a supply device transfer head 13 is placed on the first placement portion 261 of the first device supply portion 14c.

Next, as shown in FIG. 33, the first device supply portion 14c moves to the positive side in the X direction and stops at the second placement portion 262 of the first device supply portion 14c and the first temperature setting portion 166 of the inspection portion 16 along Y Position side by side.

Next, as shown in FIG. 34, the IC device 902 held by the first holding portion 271 of the first inspection device transfer head 17c is transported and placed on the second placement portion 262 of the first device supply portion 14c, and is placed Similarly, the IC device 901 held by the second holding portion 272 is placed on the second placing portion 262, and is placed on the third placing portion 263 and placed on the third placing portion 263. . That is, the IC device 902 after the low-temperature inspection is placed on the second placement portion 262, and the IC device 901 after the normal-temperature inspection is placed on the third placement portion 263.

Next, as shown in FIG. 35, the first device supply portion 14 c moves to the positive side in the X direction, and stops at the first placement portion 261 of the first device supply portion 14 c and the first temperature setting portion 166 of the inspection portion 16 along the Y The second mounting portion 262 and the second temperature setting portion 167 are arranged side by side in the Y direction, and the third mounting portion 263 and the third temperature setting portion 168 are arranged side by side in the Y direction.

Next, the third IC device 903 is held and cooled by the first holding portion 271 of the first inspection device transfer head 17c, and the second IC device 902 is held by the second holding portion 272, and at the same time, The first IC device 901 is held and heated by the third holding portion 273.

Next, as shown in FIG. 36, the IC device 903 held by the first holding portion 271 is cooled by the first holding portion 271, and is transferred to the first temperature setting portion 166 of the inspection portion 16, and at the same time The IC device 902 held by the second holding portion 272 is transported to the second temperature setting portion 167 of the inspection portion 16 by the second holding portion 272, and at the same time, the IC device 902 held by the third holding portion 272 is The IC device 901 is heated by the third holding portion 273 and is transported to the third temperature setting portion 168. Thereafter, the IC device 901 is subjected to a normal temperature inspection, the IC device 902 is subjected to a low temperature inspection, and the IC device 903 is subjected to a low temperature inspection.

In addition, although the IC device 902 is preset to be subjected to a high-temperature inspection after that, and all IC devices 902 that have completed the normal-temperature inspection can also be subjected to a high-temperature inspection, it is preferable to perform the inspection only at the normal temperature. The qualified IC device 902 is checked for high temperature, and the unqualified IC device 902 is not required to be checked for high temperature. In addition, although the IC device 903 is preset to be subjected to normal temperature inspection at a later time, and all the IC devices 903 that have completed the low temperature inspection can also be subjected to the normal temperature inspection, it is preferable to perform the normal temperature only on the IC devices 903 that pass the low temperature inspection. For inspection, there is no need to perform normal temperature inspection on the failed IC device 903. Thereby, unnecessary inspection can be omitted.

On the other hand, as shown in FIG. 37, in order to receive the IC device 901 that has completed the inspection, the first device recovery unit 18 c moves toward the negative side in the X direction, that is, the position corresponding to the inspection unit 16.

Next, as shown in FIG. 37, the IC device 901 is transported to a position corresponding to the first device recovery section 18c by the first inspection device transfer head 17c, and is placed on the eighth of the first device recovery section 18c. Of the three pockets 185, the third pocket 185 is from the left in FIG. Thereafter, as shown in FIG. 38, the IC device 901 is transferred to the collection area A4 by the first device collection unit 18c.

In the same manner as described above, the first device supply unit 14c then moves to the negative side of the X direction to receive the fourth IC device 904, and then moves to the positive side of the X direction. As shown in FIG. 39, it is transported by the first inspection device The IC device 903 held by the first holding portion 271 of the head 17c is placed on the second placing portion 262 of the first device supply portion 14c and is placed on the second placing portion 262; similarly, by the second holding The IC device 902 held by the portion 272 is placed on the third placement portion 263 and is placed on the third placement portion 263.

Next, as shown in FIG. 40, the first device supply portion 14c moves to the positive side in the X direction and stops at the first placement portion 261 of the first device supply portion 14c and the first temperature setting portion 166 of the inspection portion 16 along Y Position side by side.

Next, the fourth IC device 904 is held and cooled by the first holding portion 271 of the first inspection device transfer head 17c, and the third IC device 903 is held by the second holding portion 272, and at the same time, The second IC device 902 is held and heated by the third holding portion 273.

Next, as shown in FIG. 41, the IC device 904 held by the first holding portion 271 is cooled by the first holding portion 271, and is transferred to the first temperature setting portion 166 of the inspection portion 16, and at the same time The IC device 903 held by the second holding portion 272 is the second holding portion 272 is transferred to the second temperature setting section 167 of the inspection section 16, and at the same time, the IC device 902 held by the third holding section 273 is heated by the third holding section 273, and is transferred to the third Temperature setting section 168. Thereafter, the IC device 902 is subjected to a high temperature inspection, the IC device 903 is subjected to a normal temperature inspection, and the IC device 904 is subjected to a low temperature inspection.

On the other hand, as shown in FIG. 42, in order to receive the IC device 902 that has completed the inspection, the first device recovery unit 18 c moves to the negative side in the X direction, that is, a position corresponding to the inspection unit 16.

Next, as shown in FIG. 42, the IC device 902 is transported to a position corresponding to the first device recovery section 18c by the first inspection device transfer head 17c, and is placed on the eighth part of the first device recovery section 18c. Of the recesses 185, the third recess 185 from the left is shown in FIG. Thereafter, as shown in FIG. 43, the IC device 902 is transported to the recovery area A4 by the first device recovery unit 18c.

In the same manner as described above, the first device supply unit 14c then moves to the negative side of the X direction to receive the fifth IC device 905, and then moves to the positive side of the X direction. As shown in FIG. 44, it is transported by the first inspection device. The IC device 904 held by the first holding portion 271 of the head 17c is placed and placed on the second placing portion 262 of the first device supply portion 14c; similarly, by the second holding The IC device 903 held by the portion 272 is placed on the third placement portion 263 and is placed on the third placement portion 263.

Next, as shown in FIG. 45, the first device supply portion 14c moves to the positive side in the X direction and stops at the first placement portion 261 of the first device supply portion 14c and the first temperature setting portion 166 of the inspection portion 16 along the Y Position side by side.

Next, the fifth IC device 905 is held and cooled by the first holding portion 271 of the first inspection device transfer head 17c, and the fourth IC device 904 is held by the second holding portion 272, and at the same time, The third IC device 903 is held and heated by the third holding portion 273.

Next, as shown in FIG. 46, the IC device 905 held by the first holding portion 271 is cooled by the first holding portion 271 and is transferred to the first temperature setting portion 166 of the inspection portion 16. The IC device 904 held by the second holding portion 272 is transported to the second temperature setting portion 167 of the inspection portion 16 by the second holding portion 272, and at the same time, by the third fixing portion The IC device 903 held by the holding portion 273 is heated by the third holding portion 273 and is transferred to the third temperature setting portion 168. Thereafter, the IC device 903 is subjected to a high temperature inspection, the IC device 904 is subjected to a normal temperature inspection, and the IC device 905 is subjected to a low temperature inspection.

On the other hand, as shown in FIG. 47, in order to receive the IC device 903 that has completed the inspection, the first device recovery unit 18 c moves to the negative side in the X direction, that is, a position corresponding to the inspection unit 16.

Next, as shown in FIG. 47, the IC device 903 is transported to a position corresponding to the first device recovery unit 18c by the first inspection device transport head 17c, and is placed on the eighth of the first device recovery unit 18c. Of the recesses 185, the third recess 185 from the left is shown in FIG. 47. Thereafter, as shown in FIG. 48, the IC device 903 is transferred to the collection area A4 by the first device collection unit 18c.

Repeat the same operation afterwards.

Here, as described above, in a case where the normal temperature inspection is performed only on the IC device 90 that passed the low temperature inspection, and only the IC device 90 that passes the low temperature inspection and the normal temperature inspection is subjected to the high temperature inspection, for example, in the IC device When the 902 fails in the normal temperature inspection (passed in the low temperature inspection), the IC device 902 is placed in the eight recesses 185 of the first device recovery section 18c. The second one from the left in FIG. 37 The pocket 185 is transferred to the collection area A4 by the first device collection unit 18c. When the IC device 903 fails the low-temperature inspection, the IC device 903 is placed in the left recess 185 in FIG. 37 of the eight recesses 185 of the first device recovery section 18c. The first device recovery unit 18c is transported to the recovery area A4. In this case, an IC device 90 that failed the low temperature inspection is placed in the left cavity 185 in FIG. 37 of the eight recesses 185 in the first device recovery section 18c; from left in FIG. 37 From the second cavity 185, the IC device 90 that passed the low temperature inspection and failed the normal temperature inspection is placed; in FIG. 37, the third cavity 185 from the left is placed under the low temperature inspection And IC device 90 that passed the normal temperature inspection and failed the high temperature inspection.

The above has described the case where the IC device 90 is transported by the first device supply unit 14c, the first inspection device transfer head 17c, and the first device recovery unit 18c, but it can also be recovered by the second device. Section 14d, second inspection device transfer head 17d, and second device recovery section 18d does the same.

In addition, the inspection performed by the IC device 90 by the first device supply unit 14c, the first inspection device transfer head 17c, and the first device recovery unit 18c, and the inspection by the second device supply unit 14d, The inspection performed by the second device transport head 17d and the second device recovery unit 18d transporting the IC device 90. According to this, the output can be increased.

As described above, according to the inspection device 1c, each of the low temperature inspection, the normal temperature inspection, and the high temperature inspection of the IC device 90 can be performed, and the convenience is high.

In addition, when performing low temperature inspection, normal temperature inspection, and high temperature inspection on one IC device 90, the low temperature inspection, normal temperature inspection, and high temperature inspection can be performed without temporarily recovering the IC device 90, thereby increasing the output. .

Furthermore, the normal temperature inspection of the first IC device 901 and the low temperature inspection of the second IC device 902 are performed simultaneously, and the high temperature inspection of the first IC device 901 and the normal temperature inspection of the second IC device 902 are performed simultaneously. 3. The low temperature inspection of the third IC device 903 can increase the output.

In addition, the inspection order of the IC device 90 is the low temperature inspection first, the second item is the normal temperature inspection, and the third item is the high temperature inspection. Since the IC device 90 is not transported to the recovery area A4 in a high temperature state, it is transported in a high temperature state. Condensation on the IC device 90 can be prevented.

In addition, there is a normal temperature inspection between the low temperature inspection and the high temperature inspection. Therefore, since the IC device 90 rises to a high temperature after it becomes a normal temperature temporarily, instead of rising from a low temperature to a high temperature, an excessively rapid temperature change of the IC device 90 can be suppressed.

The order of low-temperature inspection, normal-temperature inspection, and high-temperature inspection is not limited to this embodiment, and may be any order.

In addition, although any of the low-temperature inspection, the normal-temperature inspection, and the high-temperature inspection may be omitted, it is preferable to perform the low-temperature inspection. In other words, it is desirable not to omit the low-temperature inspection.

<Fifth Embodiment>

Fig. 49 is a schematic view showing a fifth embodiment of the electronic component conveying device according to the present invention; Top view of the first inspection device transfer head and inspection unit.

Hereinafter, the fifth embodiment will be described, but the differences from the fourth embodiment will be mainly described, and the description of the same items will be omitted.

As shown in FIG. 49, in the inspection device 1c of the fifth embodiment, among the eight holding portions 163 of the inspection portion 16, two holding portions 163 on the left in FIG. 49 constitute a first temperature setting portion 281, which cools the IC device. The temperature of the IC device 90 can be adjusted (settable) to a temperature (first temperature) suitable for low-temperature inspection.

In addition, among the eight holding portions 163 of the inspection portion 16, two holding portions 163 in the second group from the left in FIG. 49 constitute a second temperature setting portion 282, which heats the IC device 90 so that the temperature of the IC device 90 can be increased. Adjust (settable) to a temperature (second temperature) suitable for high temperature inspection.

Also, among the eight holding portions 163 of the inspection portion 16, two holding portions 163 in the third group from the left in FIG. 49 constitute a first temperature setting portion 283, which cools the IC device 90 and adjusts the temperature of the IC device 90 (Can be set) A temperature (first temperature) suitable for low temperature inspection.

Among the eight holding portions 163 of the inspection portion 16, two holding portions 163 on the right in FIG. 49 constitute a second temperature setting portion 284, which heats the IC device 90 to adjust (settable) the temperature of the IC device 90 to Temperature suitable for high-temperature inspection (second temperature).

That is, the inspection unit 16 includes a first unit 285 including a first temperature setting unit 281 and a second temperature setting unit 282 and a second unit 286 including a first temperature setting unit 283 and a second temperature setting unit 284. Side by side in the X direction.

Furthermore, of the eight first hand units 171c of the first inspection device transfer head 17c, the two first hand units 171c on the left in FIG. 49 in FIG. 49 are the first holding portions 291 and constitute the first temperature setting portion of the hand unit (the 1 Robot arm temperature setting unit) 251, which cools the IC device 90 and adjusts (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for low-temperature inspection.

The eight first hand units 171c of the eighth first hand unit 171c of the first inspection device are shown in FIG. 49 from the left. The two first hand units 171c in the second group are the second holding portions 292, and constitute the second temperature of the hand unit. Setting section 252 (second robot arm temperature setting section), which heats the IC device 90 to enable the IC device The temperature adjustment (settable) of 90 is a temperature (second temperature) suitable for high temperature inspection.

In addition, the eight first hand units 171c of the eighth first hand unit 171c of the first inspection device transfer device 2 from the third group from the left in FIG. 49. The two first processing units 171c are the first holding portions 293 and constitute the first temperature of the hand unit The setting unit (first robot arm temperature setting unit) 253 cools the IC device 90 and can adjust (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for low-temperature inspection.

Furthermore, of the eight first hand units 171c of the first inspection device transfer head 17c, the two first hand units 171c on the right in FIG. 49 of FIG. 49 are the second holding portions 294 and constitute the second temperature setting portion of the hand unit (the 2 Robot arm temperature setting unit) 254, which heats the IC device 90 to adjust (settable) the temperature of the IC device 90 to a temperature (second temperature) suitable for high-temperature inspection.

That is, in the first inspection device transfer head 17c, the first holding unit 291 (the first unit temperature setting unit 251) and the second holding unit 292 (the second unit temperature setting unit 252) are first. The unit 295 and the second unit 296 composed of the first holding portion 293 (hand unit first temperature setting portion 253) and the second holding portion 294 (hand unit second temperature setting portion 254) are arranged side by side in the X direction.

The first unit 295 and the second unit 296 perform the same operations, and the operations are the same as when the normal temperature inspection is omitted in the fourth embodiment. As a result, the output can be doubled compared to the case of one unit.

The same applies to the second inspection device transfer head 17d.

The inspection device 1c according to the fifth embodiment described above can also exhibit the same effects as the fourth embodiment described above.

In addition, in the present embodiment, the inspection unit 16, the first inspection device transfer head 17c, and the second inspection device transfer head 17d each have the above-mentioned number of units, but may be three or more.

In the fourth embodiment, a plurality of units may be provided for the inspection unit 16, the first inspection device transfer head 17c, and the second inspection device transfer head 17d, as in the present embodiment.

Although the electronic component transfer device and the electronic component inspection device of the present invention have been described based on the illustrated embodiment, the present invention is not limited to this. The structure can be replaced with an arbitrary structure that can perform the same function. Moreover, you may add another arbitrary structure.

In addition, the present invention may be a combination of any two or more configurations (features) in each of the above embodiments.

1‧‧‧Inspection device (electronic parts inspection device)

11A‧‧‧The first pallet transfer mechanism

11B‧‧‧Second pallet transfer mechanism

12a‧‧‧The first temperature adjustment unit (the first soaking plate)

12b‧‧‧Second temperature adjustment unit (second soaking plate)

13‧‧‧ supply device transfer head

14a‧‧‧ 1st device supply unit (1st supply shuttle)

14b‧‧‧Second device supply unit (second supply shuttle)

15‧‧‧3rd pallet transfer mechanism

16‧‧‧ Inspection Department

17a‧‧‧The first inspection device transfer head

17b‧‧‧ 2nd inspection device transfer head

18a‧‧‧The first device recovery section (the first recovery shuttle)

18b‧‧‧Second device recovery section (second recovery shuttle)

19‧‧‧Recycling tray

20‧‧‧Recycling device transfer head

21‧‧‧The 6th pallet transfer mechanism

22A‧‧‧4th pallet transfer mechanism

22B‧‧‧5th pallet transfer mechanism

80‧‧‧Control Department

90‧‧‧IC device

131‧‧‧hand unit

141‧‧‧ Device Supply Department

142‧‧‧Configuration board

145‧‧‧Dent

161‧‧‧ Inspection Department

162‧‧‧holding member

163‧‧‧ Holding Department

166‧‧‧The first temperature setting unit

167‧‧‧Second temperature setting unit

181‧‧‧Device Recovery Department

182‧‧‧Configuration board

185‧‧‧Dent

200‧‧‧tray

201‧‧‧hand unit

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ Inspection area

A4‧‧‧device recycling area (recycling area)

A5‧‧‧Tray removal area

R1‧‧‧Room 1

R2‧‧‧Room 2

R3‧‧‧Room 3

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Claims (9)

An electronic parts conveying device, comprising: a first conveying part that conveys electronic parts, and that the electronic parts can be set to a first temperature; and a second conveying part that conveys the electronic parts, and can convey the electronic parts. The component is set to a second temperature different from the first temperature. For example, the electronic component transfer device according to claim 1, wherein the first transfer portion includes: a first electronic component placement portion that can mount and move the electronic component, and the electronic component can be set to the first temperature; and The first electronic component holding portion can hold and move the electronic component, and the electronic component can be set to the first temperature; and the second transporting portion includes a second electronic component holding portion that can mount, The electronic component can be moved and the electronic component can be set to the second temperature; and a second electronic component holding section can hold and move the electronic component and set the electronic component to the second temperature. For example, the electronic component transfer device of claim 1 includes an electronic component mounting section that can mount and move the electronic component, and has a first electronic component mounting section that can set the electronic component to the first temperature. A temperature setting unit, and a second electronic component placement unit temperature setting unit that can set the electronic component to the second temperature; and an electronic component holding unit that can hold and move the electronic component, and has the electronic component The first electronic component holding portion temperature setting portion set to the first temperature, and the second electronic component holding portion temperature setting portion to set the electronic component to the second temperature; the first transfer portion includes the first electronic component. Temperature setting part and upper part of part mounting part The first electronic component holding portion temperature setting portion; and the second transport portion includes the second electronic component holding portion temperature setting portion and the second electronic component holding portion temperature setting portion. For example, the electronic component transfer device of claim 3 includes: a plurality of the above-mentioned electronic component placement portions; and includes a plurality of the above-mentioned electronic component holding portions. The electronic component transfer device according to any one of claims 1 to 4, wherein after the electronic component is transferred by the first transfer unit, the electronic component is transferred by the second transfer unit. The electronic component transfer device according to any one of claims 1 to 4, wherein the first temperature is lower than the second temperature. In the case of the electronic component transfer device according to any one of claims 1 to 4, when the inspection of the electronic component is performed at the first temperature and the inspection is qualified, the inspection of the electronic component is performed at the second temperature. An electronic component inspection device, comprising: a first conveying section that conveys electronic components, wherein the electronic component can be set to a first temperature; and a second conveying section that conveys the electronic components, and can convey the electronic components. The second temperature is different from the first temperature; and an inspection unit that inspects the electronic components. The electronic component inspection device according to claim 8, wherein the inspection unit is provided with a first temperature setting unit capable of setting the electronic component to the first temperature and a second temperature setting unit capable of setting the electronic component to the second temperature. Temperature setting section.