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TW200832059A - Photosensitive resin composition and photosensitive element using the same - Google Patents

Photosensitive resin composition and photosensitive element using the same Download PDF

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Publication number
TW200832059A
TW200832059A TW96139508A TW96139508A TW200832059A TW 200832059 A TW200832059 A TW 200832059A TW 96139508 A TW96139508 A TW 96139508A TW 96139508 A TW96139508 A TW 96139508A TW 200832059 A TW200832059 A TW 200832059A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
acid
meth
compound
Prior art date
Application number
TW96139508A
Other languages
English (en)
Chinese (zh)
Other versions
TWI356279B (ja
Inventor
Shuuichi Itagaki
Katsunori Tsuchiya
Takeshi Ohashi
Tetsuya Yoshida
Satoshi Ootomo
Kyouko Ozawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200832059A publication Critical patent/TW200832059A/zh
Application granted granted Critical
Publication of TWI356279B publication Critical patent/TWI356279B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW96139508A 2006-10-24 2007-10-22 Photosensitive resin composition and photosensitive element using the same TW200832059A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006288720 2006-10-24
JP2007082003 2007-03-27

Publications (2)

Publication Number Publication Date
TW200832059A true TW200832059A (en) 2008-08-01
TWI356279B TWI356279B (ja) 2012-01-11

Family

ID=39324452

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96139508A TW200832059A (en) 2006-10-24 2007-10-22 Photosensitive resin composition and photosensitive element using the same

Country Status (4)

Country Link
JP (1) JP4586922B2 (ja)
KR (1) KR100997603B1 (ja)
TW (1) TW200832059A (ja)
WO (1) WO2008050653A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4986024B2 (ja) * 2006-10-24 2012-07-25 日立化成工業株式会社 感光性樹脂組成物及び感光性エレメント
JP5082566B2 (ja) * 2006-11-01 2012-11-28 日立化成工業株式会社 感光性樹脂組成物、感光性フィルム、レジストパターンの形成方法及びプリント配線板
JP2010169810A (ja) * 2009-01-21 2010-08-05 Hitachi Chem Co Ltd 感光性樹脂組成物及びそれを用いた感光性エレメント
JP2011247996A (ja) * 2010-05-25 2011-12-08 Kaneka Corp 新規な感光性樹脂組成物及びその利用
JP5751929B2 (ja) * 2010-06-21 2015-07-22 新日鉄住金化学株式会社 ブラックレジスト用感光性樹脂組成物及びカラーフィルター遮光膜
JP5611769B2 (ja) * 2010-10-29 2014-10-22 株式会社カネカ 新規な白色感光性樹脂組成物及びその利用
JP2012099734A (ja) * 2010-11-04 2012-05-24 Kaneka Corp 白色カバーレイフィルム
JP5745885B2 (ja) * 2011-02-16 2015-07-08 株式会社カネカ 新規な白色感光性樹脂組成物及びその利用
JP5734773B2 (ja) 2011-03-25 2015-06-17 富士フイルム株式会社 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
JP6181907B2 (ja) * 2011-11-15 2017-08-16 互応化学工業株式会社 カルボキシル基含有樹脂及びソルダーレジスト用樹脂組成物
JP7307877B2 (ja) * 2018-02-05 2023-07-13 Jsr株式会社 配線部材
JP7400658B2 (ja) * 2019-09-13 2023-12-19 信越化学工業株式会社 レジスト材料及びパターン形成方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11288090A (ja) * 1998-04-03 1999-10-19 Hitachi Chem Co Ltd 感光性樹脂組成物
JP2002040633A (ja) * 2000-07-24 2002-02-06 Toshiba Chem Corp ハロゲンフリーの感光性樹脂組成物
JP2006131743A (ja) * 2004-11-05 2006-05-25 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、プリント配線板
JP4878597B2 (ja) * 2005-04-13 2012-02-15 株式会社タムラ製作所 感光性樹脂組成物、プリント配線板、および半導体パッケージ基板

Also Published As

Publication number Publication date
JP4586922B2 (ja) 2010-11-24
KR20090046935A (ko) 2009-05-11
JPWO2008050653A1 (ja) 2010-02-25
KR100997603B1 (ko) 2010-11-30
TWI356279B (ja) 2012-01-11
WO2008050653A1 (fr) 2008-05-02

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