[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

TW200739165A - Lens module of camera and its fabricating method - Google Patents

Lens module of camera and its fabricating method

Info

Publication number
TW200739165A
TW200739165A TW095112761A TW95112761A TW200739165A TW 200739165 A TW200739165 A TW 200739165A TW 095112761 A TW095112761 A TW 095112761A TW 95112761 A TW95112761 A TW 95112761A TW 200739165 A TW200739165 A TW 200739165A
Authority
TW
Taiwan
Prior art keywords
camera
lens
fabricating method
lens module
substrate
Prior art date
Application number
TW095112761A
Other languages
Chinese (zh)
Inventor
Zheng-Hun Yang
Guang-Yang Chen
sen-fa Yang
zhen-hong Tu
Original Assignee
Chicony Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chicony Electronic Co Ltd filed Critical Chicony Electronic Co Ltd
Priority to TW095112761A priority Critical patent/TW200739165A/en
Priority to JP2007042616A priority patent/JP2007282195A/en
Priority to KR1020070030659A priority patent/KR20070101125A/en
Publication of TW200739165A publication Critical patent/TW200739165A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305Affixing by adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10674Flip chip
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/049Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Lens Barrels (AREA)

Abstract

A kind of lens module of camera, which contains a lens set with a cavity room; a lens set is used to link up the lens; a sheet glass is located underneath the cavity room of the lens set; a substrate with a hole having an alignment to the lens cavity of room and the substrate is located in the bottom surface of the lens set; and an image sensing chip to link with the bottom surface for aligning the hole of substrate. The fabricating method for camera module is provided in this invention.
TW095112761A 2006-04-11 2006-04-11 Lens module of camera and its fabricating method TW200739165A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW095112761A TW200739165A (en) 2006-04-11 2006-04-11 Lens module of camera and its fabricating method
JP2007042616A JP2007282195A (en) 2006-04-11 2007-02-22 Camera lens module and manufacturing method therefor
KR1020070030659A KR20070101125A (en) 2006-04-11 2007-03-29 Camera lens module and manufacturing method for the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095112761A TW200739165A (en) 2006-04-11 2006-04-11 Lens module of camera and its fabricating method

Publications (1)

Publication Number Publication Date
TW200739165A true TW200739165A (en) 2007-10-16

Family

ID=38683140

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112761A TW200739165A (en) 2006-04-11 2006-04-11 Lens module of camera and its fabricating method

Country Status (3)

Country Link
JP (1) JP2007282195A (en)
KR (1) KR20070101125A (en)
TW (1) TW200739165A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102313959A (en) * 2007-11-21 2012-01-11 Lg伊诺特有限公司 Camera module

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416193B (en) * 2007-12-31 2013-11-21 Hon Hai Prec Ind Co Ltd Method for testing elements assembly of lens module
TWI512961B (en) * 2013-08-16 2015-12-11 Azurewave Technologies Inc Image-sensing module for reducing its whole thickness and method of manufacturing the same
CN106817522A (en) * 2015-12-01 2017-06-09 安徽昌硕光电子科技有限公司 The structure of photographing module
KR102033313B1 (en) * 2016-03-02 2019-10-18 주식회사 탑 엔지니어링 Equipment for manufacturing camera module
WO2021128178A1 (en) * 2019-12-26 2021-07-01 诚瑞光学(常州)股份有限公司 Lens module and terminal device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3127584B2 (en) * 1992-06-23 2001-01-29 ソニー株式会社 Semiconductor device using resin hollow package
JP2001250889A (en) * 2000-03-06 2001-09-14 Matsushita Electric Ind Co Ltd Mounting structure of optical element and its manufacturing method
JP3600147B2 (en) * 2000-10-12 2004-12-08 三洋電機株式会社 Mounting method of solid-state image sensor
JP2003059952A (en) * 2001-08-16 2003-02-28 Sony Corp Semiconductor device, semiconductor device chip and production method therefor
JP2004080704A (en) * 2002-08-22 2004-03-11 Toshiba Corp Imaging apparatus and its manufacturing method
JP2004173028A (en) * 2002-11-21 2004-06-17 Olympus Corp Solid-state image pickup device
JP4174664B2 (en) * 2003-01-14 2008-11-05 セイコーエプソン株式会社 OPTICAL MODULE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE
JP2004274165A (en) * 2003-03-05 2004-09-30 Seiko Epson Corp Optical module, its manufacturing method and electronic apparatus
JP2005316127A (en) * 2004-04-28 2005-11-10 Matsushita Electric Ind Co Ltd Camera module
JP2005353810A (en) * 2004-06-10 2005-12-22 Seiko Precision Inc Photodetector, range finder, camera module and manufacturing method thereof
JP2006074464A (en) * 2004-09-02 2006-03-16 Seiko Epson Corp Optical module and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102313959A (en) * 2007-11-21 2012-01-11 Lg伊诺特有限公司 Camera module

Also Published As

Publication number Publication date
JP2007282195A (en) 2007-10-25
KR20070101125A (en) 2007-10-16

Similar Documents

Publication Publication Date Title
TW200727501A (en) Image sensor module and method for manufacturing the same
TW200739165A (en) Lens module of camera and its fabricating method
WO2009036478A3 (en) Printed circuit board element and method for the production thereof
TWI348205B (en) A method of direct bonding two substrates used in electronics, optics, or optoelectronics
WO2010139342A8 (en) Lens and method for manufacturing same
TW200731518A (en) Semiconductor device and manufacturing method of the same
WO2011066421A3 (en) Systems, methods, and devices for sealing led light sources in a light module
SG136921A1 (en) Optical coupling structure
WO2009022469A1 (en) Aligning apparatus, bonding apparatus, laminated substrate manufacturing apparatus, exposure apparatus and aligning method
EP2100908A4 (en) Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
EP2040910A4 (en) Calendering process for making an optical film
EP2284586A3 (en) Manufacturing method of optical sensor module and optical sensor module obtained thereby
WO2008149948A1 (en) Spectroscopic module
JP2007079090A5 (en)
TWI339641B (en) Method for attaching film for glass substrate
EP2023409B8 (en) Semiconductor light emitting module and device and method of manufacturing the same
TW200620644A (en) Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
FI20085735A (en) A method for manufacturing a lens module and a lens produced by the method
WO2007142789A3 (en) Shallow semiconductor sensor with fluorescent molecule layer that eliminates optical and electronic crosstalk
EP1982561A4 (en) Method for manufacturing on a film substrate at a temperature above its glass transition
TW200742738A (en) Glass-molded compound lens and manufacturing method thereof
TW200629886A (en) Image sensor with embedded optical element
WO2008090945A1 (en) Optical sheet, and mounting method and optical module using the optical sheet
WO2008146644A1 (en) Imaging device and method for manufacturing the imaging device, and portable information terminal and imaging apparatus having the imaging device mounted thereon
WO2009004265A3 (en) Transparent film comprising a base film and a coating