TW200739165A - Lens module of camera and its fabricating method - Google Patents
Lens module of camera and its fabricating methodInfo
- Publication number
- TW200739165A TW200739165A TW095112761A TW95112761A TW200739165A TW 200739165 A TW200739165 A TW 200739165A TW 095112761 A TW095112761 A TW 095112761A TW 95112761 A TW95112761 A TW 95112761A TW 200739165 A TW200739165 A TW 200739165A
- Authority
- TW
- Taiwan
- Prior art keywords
- camera
- lens
- fabricating method
- lens module
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 3
- 239000005357 flat glass Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Lens Barrels (AREA)
Abstract
A kind of lens module of camera, which contains a lens set with a cavity room; a lens set is used to link up the lens; a sheet glass is located underneath the cavity room of the lens set; a substrate with a hole having an alignment to the lens cavity of room and the substrate is located in the bottom surface of the lens set; and an image sensing chip to link with the bottom surface for aligning the hole of substrate. The fabricating method for camera module is provided in this invention.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095112761A TW200739165A (en) | 2006-04-11 | 2006-04-11 | Lens module of camera and its fabricating method |
JP2007042616A JP2007282195A (en) | 2006-04-11 | 2007-02-22 | Camera lens module and manufacturing method therefor |
KR1020070030659A KR20070101125A (en) | 2006-04-11 | 2007-03-29 | Camera lens module and manufacturing method for the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095112761A TW200739165A (en) | 2006-04-11 | 2006-04-11 | Lens module of camera and its fabricating method |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200739165A true TW200739165A (en) | 2007-10-16 |
Family
ID=38683140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095112761A TW200739165A (en) | 2006-04-11 | 2006-04-11 | Lens module of camera and its fabricating method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2007282195A (en) |
KR (1) | KR20070101125A (en) |
TW (1) | TW200739165A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102313959A (en) * | 2007-11-21 | 2012-01-11 | Lg伊诺特有限公司 | Camera module |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI416193B (en) * | 2007-12-31 | 2013-11-21 | Hon Hai Prec Ind Co Ltd | Method for testing elements assembly of lens module |
TWI512961B (en) * | 2013-08-16 | 2015-12-11 | Azurewave Technologies Inc | Image-sensing module for reducing its whole thickness and method of manufacturing the same |
CN106817522A (en) * | 2015-12-01 | 2017-06-09 | 安徽昌硕光电子科技有限公司 | The structure of photographing module |
KR102033313B1 (en) * | 2016-03-02 | 2019-10-18 | 주식회사 탑 엔지니어링 | Equipment for manufacturing camera module |
WO2021128178A1 (en) * | 2019-12-26 | 2021-07-01 | 诚瑞光学(常州)股份有限公司 | Lens module and terminal device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3127584B2 (en) * | 1992-06-23 | 2001-01-29 | ソニー株式会社 | Semiconductor device using resin hollow package |
JP2001250889A (en) * | 2000-03-06 | 2001-09-14 | Matsushita Electric Ind Co Ltd | Mounting structure of optical element and its manufacturing method |
JP3600147B2 (en) * | 2000-10-12 | 2004-12-08 | 三洋電機株式会社 | Mounting method of solid-state image sensor |
JP2003059952A (en) * | 2001-08-16 | 2003-02-28 | Sony Corp | Semiconductor device, semiconductor device chip and production method therefor |
JP2004080704A (en) * | 2002-08-22 | 2004-03-11 | Toshiba Corp | Imaging apparatus and its manufacturing method |
JP2004173028A (en) * | 2002-11-21 | 2004-06-17 | Olympus Corp | Solid-state image pickup device |
JP4174664B2 (en) * | 2003-01-14 | 2008-11-05 | セイコーエプソン株式会社 | OPTICAL MODULE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE |
JP2004274165A (en) * | 2003-03-05 | 2004-09-30 | Seiko Epson Corp | Optical module, its manufacturing method and electronic apparatus |
JP2005316127A (en) * | 2004-04-28 | 2005-11-10 | Matsushita Electric Ind Co Ltd | Camera module |
JP2005353810A (en) * | 2004-06-10 | 2005-12-22 | Seiko Precision Inc | Photodetector, range finder, camera module and manufacturing method thereof |
JP2006074464A (en) * | 2004-09-02 | 2006-03-16 | Seiko Epson Corp | Optical module and its manufacturing method |
-
2006
- 2006-04-11 TW TW095112761A patent/TW200739165A/en unknown
-
2007
- 2007-02-22 JP JP2007042616A patent/JP2007282195A/en active Pending
- 2007-03-29 KR KR1020070030659A patent/KR20070101125A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102313959A (en) * | 2007-11-21 | 2012-01-11 | Lg伊诺特有限公司 | Camera module |
Also Published As
Publication number | Publication date |
---|---|
JP2007282195A (en) | 2007-10-25 |
KR20070101125A (en) | 2007-10-16 |
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