JP2004173028A - Solid-state image pickup device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device which has yield improved by hermetical sealing wherein an adhesive or a sealing resin is prevented from protruding to a light reception area of the solid-state image pickup device, a high reliability by preventing degradation of imaging characteristics, and satisfactory heat dissipation characteristics. <P>SOLUTION: A solid-state imaging device 1 is electrically connected to a wiring pattern 4 formed on one surface of a substrate 3 having an opening part 12 opposed to a light receiving area 11, with a projecting electrode 7 between them by an adhesive 8. A light-transmissive member 5 is made to adhere to the other surface of the substrate so as to seal the opening part, and a sealing member 6 having a recessed part allowing the solid-state imaging device to be stored therein is made to adhere to the substrate from the rear side of the solid-state imaging device so as to surround it to hermetically seal the solid-state imaging device, and thus the solid-state imaging device is constituted. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a solid-state imaging device mounting technique, and more particularly to a solid-state imaging device configured by applying a thin structure to a solid-state imaging device in a hermetically sealed manner.
[0002]
[Prior art]
[Patent Document 1] Japanese Patent Application Laid-Open No. 8-148666
2. Description of the Related Art In recent years, solid-state imaging devices such as CCDs and CMOS sensors have been mounted on personal computers, mobile phones, and the like in addition to digital cameras, and there has been an increasing demand for smaller and thinner mounting forms. .
[0004]
In order to satisfy these requirements, for example, a solid-state imaging device with a microlens as disclosed in Japanese Patent Application Laid-Open No. 8-148666 has been proposed. FIG. 4 shows the configuration of this solid-state imaging device. In FIG. 4, reference numeral 101 denotes a solid-state imaging device provided with a microlens 102. The solid-state imaging device 101 is formed on one surface of a substrate 103 made of a flexible substrate or the like having an opening facing the light receiving area. The wiring pattern 104 is electrically connected to the wiring pattern 104 by an adhesive 108 such as an anisotropic conductive adhesive through a protruding electrode 107 on the solid-state imaging device 101 so that the other surface of the substrate 103 closes the opening. The translucent member 105 is adhered, and a space is provided between the microlens 102 formed on the surface of the solid-state imaging device 101 and the translucent member 105. That is, the light receiving area of the solid-state imaging device 101 is airtightly sealed.
[0005]
In the solid-state imaging device configured as described above, it is possible to reduce the size and thickness of the solid-state imaging device, to prevent dew condensation on the imaging region (light receiving area) and to prevent deterioration of the imaging characteristics, and to ensure reliability. It has advantages.
[0006]
[Problems to be solved by the invention]
However, the above-mentioned conventional solid-state imaging device also has the following problem. That is, the solid-state imaging device having the conventionally proposed structure is configured so that the entire periphery of the surface of the solid-state imaging device 101 is bonded with an adhesive 108 such as an anisotropic conductive adhesive so as to surround the light receiving area. The adhesive 108 such as an anisotropic conductive adhesive may ooze into the light receiving area. In particular, when the electrode pads of the solid-state imaging device 101 are arranged in only two directions, It is necessary to apply an adhesive 108 such as an anisotropic conductive adhesive also in two directions where no electrode pad is provided. In this case, since there is no wiring pattern on the substrate 103 in this direction, the adhesive 108 easily flows out. It was difficult to secure the yield.
[0007]
That is, the structure of the conventionally proposed solid-state imaging device has a problem in that the yield decreases due to seepage of the adhesive 108 such as an anisotropic conductive adhesive into the light receiving area. Also, there is a problem that the imaging characteristics are deteriorated due to the influence of the exuded adhesive. Further, the small and thin structure as described above has a drawback that the solid-state image sensor 101 has poor heat dissipation because there is no package of ceramic or the like. Particularly, a large problem occurs when a CCD which consumes a large amount of current is used as the image sensor. Met.
[0008]
The present invention has been made to solve the above-mentioned problems in the conventionally proposed solid-state imaging device, and prevents the adhesive or the sealing resin from seeping into the light-receiving area of the solid-state imaging device, thereby improving the yield. It is another object of the present invention to provide a solid-state imaging device having high reliability by preventing deterioration of imaging characteristics and further having good heat radiation characteristics.
[0009]
The invention according to claim 1 is to prevent deterioration of imaging characteristics due to seepage of a solid-state imaging device such as an adhesive or a sealing resin into a light receiving area, and to achieve high yield and high yield. An object is to provide a reliable solid-state imaging device. Another object of the present invention is to provide a solid-state imaging device having good heat radiation characteristics.
[0010]
[Means for Solving the Problems]
In order to solve the above problem, the invention according to claim 1 has a solid-state imaging device and an opening facing a light receiving area of the solid-state imaging device, and a wiring pattern formed on one surface is provided with a projection electrode interposed therebetween. A solid-state imaging device comprising: a substrate to which the solid-state imaging device is electrically connected; and a translucent member adhered to the other surface of the substrate so as to seal the opening. A sealing member having a recess capable of accommodating the solid-state image sensor is adhered to the substrate from the back side of the solid-state image sensor so as to surround the solid-state image sensor and hermetically sealed.
[0011]
In the solid-state imaging device configured as described above, the back surface side of the solid-state imaging device is configured to be hermetically sealed by the sealing member. It is possible to realize a solid-state imaging device with high yield and high reliability by preventing adverse effects on imaging characteristics due to seepage of the agent or the sealing resin into the light receiving area.
[0012]
According to a second aspect of the present invention, in the solid-state imaging device according to the first aspect, the sealing member is a heat radiating member, and is adhered to a back surface of the solid-state imaging device.
[0013]
As described above, by using the sealing member as a heat radiating member and bonding the sealing member to the back surface of the solid-state imaging device, it is possible to realize a solid-state imaging device having more heat radiation effect in addition to the operation and effect of the solid-state imaging device according to claim 1. Become. Further, by selecting a sealing member, it is possible to increase the mechanical strength of the solid-state imaging device.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
(First Embodiment)
Next, an embodiment of the present invention will be described. FIG. 1 is a sectional view showing a first embodiment of a solid-state imaging device according to the present invention, and FIG. 2 is a plan view schematically showing a microlens with a light-transmitting member removed. In both figures, reference numeral 1 denotes a solid-state imaging device provided with a microlens 2, and the solid-state imaging device 1 faces a light receiving area 11 of the solid-state imaging device 1 via a protruding electrode 7 formed on an electrode pad. An adhesive 8 such as an anisotropic conductive adhesive is used to electrically connect to a wiring pattern 4 formed on one surface of a substrate 3 such as a flexible substrate having an opening 12. A light-transmitting member 5 is adhered to the other surface with an adhesive 9 so as to cover the opening 12. Further, a sealing member 6 having a recess capable of accommodating the solid-state imaging device 1 is bonded to the substrate 3 with a sealing adhesive 10 from the back side of the solid-state imaging device 1 so as to surround the solid-state imaging device 1. Thus, the solid-state imaging device 1 is hermetically sealed. At this time, the back surface of the solid-state imaging device 1 and the sealing member 6 are not bonded and have a gap.
[0015]
As described above, since the sealing member 6 is adhered to the substrate 3 so as to surround the solid-state imaging device 1 from the back surface side of the solid-state imaging device 1, the hermetic sealing is performed. When bonding to the wiring pattern 4, only the periphery of the protruding electrode 7 on the electrode pad may be bonded with the adhesive 8. That is, the adhesive 8 is intended to maintain the electrical connection between the protruding electrode 7 on the solid-state imaging device 1 and the wiring pattern 4 on the substrate 3, and the adhesive 8 is provided between the solid-state imaging device 1 and the substrate 3. Therefore, the amount of the adhesive that sticks out of the light receiving area 11 of the solid-state imaging device 1 is not required.
[0016]
Here, the substrate 3 is not limited to a flexible substrate, but may be a hard substrate made of ceramic, glass fiber reinforced epoxy resin, metal, or the like. The translucent member 5 may be made of not only glass but also a transparent resin such as vinyl chloride or acrylic, or an optical member such as a low-pass filter, an IR cut filter, a lens, and a prism. As the sealing member 6, ceramic, glass fiber reinforced epoxy resin, metal or the like can be considered. As the protruding electrode 7, a stud bump made of Au, Cu, or the like formed by a wire bonding method, a bump made of Au, Ag, Cu, In, solder, or the like formed by a plating method, as well as a metal ball or a surface. A metal-plated resin ball or a conductive adhesive patterned by printing or the like may be used.
[0017]
According to the solid-state imaging device thus configured, the solid-state imaging device 1 is hermetically sealed for adhesion or sealing by the light-transmitting member 5 on the front surface side of the solid-state imaging device and the sealing member 6 from the rear surface side. When the solid-state imaging device 1 is bonded to the substrate 3, the adhesive 8 such as an anisotropic conductive adhesive is applied only in the vicinity of the electrode pad of the solid-state imaging device 1, that is, the solid-state imaging via the protruding electrode 7. It may be formed only at the bonding portion between the element 1 and the wiring pattern 4 of the substrate 3, and the amount of the adhesive can be reduced to the minimum necessary. Needless to say, application of a sealing resin or the like is not required. Therefore, it is possible to prevent the adhesive 8 from seeping into the light receiving area 11, prevent the imaging characteristics of the solid-state imaging device 1 from deteriorating, and realize a solid-state imaging device with high yield and high reliability.
[0018]
In particular, when mounting a solid-state image sensor having only two electrode pads, as shown in the illustrated example, the area to which the adhesive is applied is limited to two directions. The prevention of the deterioration of the characteristics becomes more remarkable.
[0019]
(Second embodiment)
Next, a second embodiment will be described. FIG. 3 shows a cross-sectional view of the solid-state imaging device according to the present embodiment. Here, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. In this embodiment, as shown in FIG. 3, the heat-radiating / sealing member 13 made of a heat-radiating member is bonded to the substrate 3 and, at the same time, to the back surface of the solid-state imaging device 1 with an adhesive 14. The other configuration and structure are the same as those of the first embodiment.
[0020]
Here, as the heat dissipation / sealing member 13, a metal such as Al 2, Cu 3, brass, SUS, 42 alloy, and Kovar having high thermal conductivity is preferable. Alternatively, a substrate having a metal core may be used. For bonding to the back surface of the solid-state imaging device 1, an adhesive having high thermal conductivity is preferable. However, it is used for bonding the heat-radiating sealing member 13 of epoxy, phenol, silicon or the like to the substrate 3. It may be shared with the sealing adhesive 10.
[0021]
In this manner, by adhering the heat dissipation / sealing member 13 as a heat dissipation member to the back surface of the solid-state imaging device 1, even if the solid-state imaging device 1 generates heat, the heat is radiated by the heat dissipation / sealing member 13. A good solid-state imaging device can be realized. In addition, by using metal as the heat-radiating / sealing member 13, the mechanical strength of the solid-state imaging device can be increased.
[0022]
In each of the above embodiments, an adhesive is used in the electrical connection between the solid-state imaging device and the wiring pattern of the substrate, that is, the electrical connection between the protruding electrode on the electrode pad of the solid-state imaging device and the wiring pattern of the substrate. However, if the connection strength between the protruding electrode and the wiring pattern is sufficient (for example, if the protruding electrode is formed by solder bumps, it is fused and connected to the wiring pattern, so that sufficient mechanical strength is obtained). However, an adhesive is not necessarily required. This adhesive is intended to ensure electrical connection between the protruding electrodes on the solid-state imaging device and the wiring pattern of the substrate, and is not intended to seal between the solid-state imaging device and the substrate. .
[0023]
【The invention's effect】
As described above with reference to the embodiment, according to the first aspect of the present invention, it is possible to prevent the adhesive or the sealing resin from seeping into the light receiving area, to prevent the deterioration of the imaging characteristics, and to reduce the size. Thus, a thin, high-yield and highly reliable solid-state imaging device can be obtained. According to the second aspect of the present invention, it is possible to obtain a solid-state imaging device having a higher heat radiation effect than the solid-state imaging device according to the first aspect.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a first embodiment of a solid-state imaging device according to the present invention.
FIG. 2 is a partially omitted plan view of the first embodiment shown in FIG.
FIG. 3 is a sectional view showing a second embodiment of the present invention.
FIG. 4 is a cross-sectional view showing a conventionally proposed solid-state imaging device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Solid-state image sensor 2 Microlens 3 Substrate 4 Wiring pattern 5 Translucent member 6 Sealing member 7 Protruding electrode 8 Adhesive 9 Adhesive 10 Adhesive 11 Light receiving area 12 Substrate opening 13 Heat dissipation / sealing member 14 Adhesive

Claims (2)

A solid-state imaging device, a substrate having an opening facing the light receiving area of the solid-state imaging device, and a substrate to which the solid-state imaging device is electrically connected via a protruding electrode to a wiring pattern formed on one surface; A solid-state imaging device having a light-transmitting member bonded to the other surface of the substrate so as to seal the opening, wherein the solid-state imaging device includes a sealing member having a recess capable of accommodating the solid-state imaging device. A solid-state imaging device, which is adhered to the substrate so as to surround the solid-state imaging device from the back side of the device and hermetically sealed. The solid-state imaging device according to claim 1, wherein the sealing member is a heat radiation member, and is adhered to a back surface of the solid-state imaging device.

Images