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TW200634652A - Double-sided electronic module for hybrid smart card - Google Patents

Double-sided electronic module for hybrid smart card

Info

Publication number
TW200634652A
TW200634652A TW094146597A TW94146597A TW200634652A TW 200634652 A TW200634652 A TW 200634652A TW 094146597 A TW094146597 A TW 094146597A TW 94146597 A TW94146597 A TW 94146597A TW 200634652 A TW200634652 A TW 200634652A
Authority
TW
Taiwan
Prior art keywords
bonding pads
module
double
smart card
electronic module
Prior art date
Application number
TW094146597A
Other languages
English (en)
Inventor
Virgile Meireles
Pierre Benato
Original Assignee
Ask Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ask Sa filed Critical Ask Sa
Publication of TW200634652A publication Critical patent/TW200634652A/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
TW094146597A 2004-12-28 2005-12-27 Double-sided electronic module for hybrid smart card TW200634652A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0413951A FR2880160B1 (fr) 2004-12-28 2004-12-28 Module electronique double face pour carte a puce hybride

Publications (1)

Publication Number Publication Date
TW200634652A true TW200634652A (en) 2006-10-01

Family

ID=34953958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146597A TW200634652A (en) 2004-12-28 2005-12-27 Double-sided electronic module for hybrid smart card

Country Status (7)

Country Link
US (1) US20060139901A1 (zh)
EP (1) EP1834352A1 (zh)
CN (1) CN100527161C (zh)
FR (1) FR2880160B1 (zh)
HK (1) HK1116919A1 (zh)
TW (1) TW200634652A (zh)
WO (1) WO2006070140A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI608423B (zh) * 2011-07-12 2017-12-11 Ask股份有限公司 具有經強化電子模組之混合接觸－非接觸式的智慧卡

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005093645A1 (fr) * 2004-03-25 2005-10-06 Bauer, Eric Procede de fabrication d'une etiquette electronique et etiquette electronique obtenue par ledit procede
KR100723491B1 (ko) * 2005-07-14 2007-05-30 삼성전자주식회사 범용 인쇄 회로 기판 및 이를 사용한 스마트 카드
GB0805780D0 (en) * 2008-03-31 2008-04-30 Royal Bank Of Scotland Plc The Processor card arrangement
FR2936075B1 (fr) * 2008-09-12 2010-12-31 Arjowiggins Licensing Sas Structure comportant au moins deux dispositifs a microcircuit integre a communication sans contact
FR2948796A1 (fr) * 2009-07-28 2011-02-04 Ask Sa Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication
KR101736862B1 (ko) * 2010-06-29 2017-05-17 엘지전자 주식회사 이동 단말기의 케이스, 이를 구비하는 이동 단말기 및 이동 단말기의 케이스 제조 방법
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
CN103473593B (zh) * 2012-06-05 2018-10-19 德昌电机(深圳)有限公司 智能卡、智能卡接触垫载板及其制造方法
FR3013504B1 (fr) 2013-11-18 2022-06-10 Interplex Microtech Procede de fabrication d'un support d'une puce electronique, support de puce et ensemble de tels supports
EP2892012A1 (fr) 2014-01-06 2015-07-08 Gemalto SA Module électronique, son procédé de fabrication, et dispositif électronique comprenant un tel module
US9390365B2 (en) 2014-04-10 2016-07-12 American Banknote Corporation Integrated circuit module for a dual-interface smart card
FR3021145B1 (fr) * 2014-05-14 2018-08-31 Linxens Holding Procede de fabrication d'un circuit pour module de carte a puce et circuit pour module de carte a puce
US9965716B2 (en) 2015-08-14 2018-05-08 Capital One Services, Llc Two-piece transaction card construction
EP3159831B1 (en) * 2015-10-21 2018-10-03 Nxp B.V. Dual-interface ic card
CN106935515A (zh) * 2015-12-29 2017-07-07 无锡华润安盛科技有限公司 引线框架及其制造方法、基于该引线框架的芯片封装方法
CN107025481B (zh) * 2016-02-02 2021-08-20 上海伯乐电子有限公司 柔性印制电路板及应用其的智能卡模块和智能卡
FR3049739B1 (fr) * 2016-03-30 2021-03-12 Linxens Holding Procedes de fabrication de cartes a puce et de supports d’antenne pour carte a puce
DE102016106698A1 (de) * 2016-04-12 2017-10-12 Infineon Technologies Ag Chipkarte und Verfahren zum Herstellen einer Chipkarte
FR3051063B1 (fr) 2016-05-06 2021-02-12 Linxens Holding Procede de fabrication de cartes a puce et carte a puce obtenue par ce procede
FR3063555B1 (fr) * 2017-03-03 2021-07-09 Linxens Holding Carte a puce et procede de fabrication d’une carte a puce
WO2019045638A1 (en) * 2017-08-28 2019-03-07 Smartflex Technology Pte Ltd INTEGRATED CIRCUIT MODULES AND INTELLIGENT CARDS INCORPORATING THEM
FR3086099B1 (fr) * 2018-09-18 2022-12-16 Smart Packaging Solutions Procede de fabrication d'un module a carte et le module obtenu
FR3086098B1 (fr) * 2018-09-18 2020-12-04 Smart Packaging Solutions Procede de fabrication d'un module electronique pour objet portatif
US11003979B1 (en) * 2019-10-18 2021-05-11 Capital One Service, LLC Multi-faced payment card with partitioned dual smart chips and antennae
CN111626395A (zh) * 2020-05-29 2020-09-04 东信和平科技股份有限公司 一种双界面安全芯片卡及制作方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250600A (en) * 1992-05-28 1993-10-05 Johnson Matthey Inc. Low temperature flexible die attach adhesive and articles using same
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5837153A (en) * 1997-01-15 1998-11-17 Kawan; Joseph C. Method and system for creating and using a logotype contact module with a smart card
WO1998033143A1 (de) * 1997-01-28 1998-07-30 Siemens Aktiengesellschaft Trägerelement zum einbau in kombi-chipkarten und kombi-chipkarte
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
IL122250A (en) * 1997-11-19 2003-07-31 On Track Innovations Ltd Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
DE19809073A1 (de) * 1998-03-04 1999-09-16 Orga Kartensysteme Gmbh Chipmodul und Verfahren zur Herstellung einer Chipkarte
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
FR2786009B1 (fr) * 1998-11-16 2001-01-26 Gemplus Card Int Procede de fabrication d'une carte a puce hybride par impression double face
FR2801707B1 (fr) * 1999-11-29 2002-02-15 A S K Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux
US6853087B2 (en) * 2000-09-19 2005-02-08 Nanopierce Technologies, Inc. Component and antennae assembly in radio frequency identification devices
DE10234659A1 (de) * 2002-07-26 2004-02-12 Infineon Technologies Ag Verbindungsanordnung, zugehörige Verwendung und zugehöriges Herstellungsverfahren
JP2006507569A (ja) * 2002-09-17 2006-03-02 アクサルト ソシエテ アノニム ハイブリッドカード
ATE414957T1 (de) * 2003-03-06 2008-12-15 Axalto Sa Auf spule prüfbares doppelschnittstellenmikromodul

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI608423B (zh) * 2011-07-12 2017-12-11 Ask股份有限公司 具有經強化電子模組之混合接觸－非接觸式的智慧卡

Also Published As

Publication number Publication date
CN100527161C (zh) 2009-08-12
HK1116919A1 (en) 2009-01-02
CN101095220A (zh) 2007-12-26
FR2880160A1 (fr) 2006-06-30
FR2880160B1 (fr) 2007-03-30
EP1834352A1 (fr) 2007-09-19
WO2006070140A1 (fr) 2006-07-06
US20060139901A1 (en) 2006-06-29

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