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SE7504646L - Sett att belegga en yta med en metall. - Google Patents

Sett att belegga en yta med en metall.

Info

Publication number
SE7504646L
SE7504646L SE7504646A SE7504646A SE7504646L SE 7504646 L SE7504646 L SE 7504646L SE 7504646 A SE7504646 A SE 7504646A SE 7504646 A SE7504646 A SE 7504646A SE 7504646 L SE7504646 L SE 7504646L
Authority
SE
Sweden
Prior art keywords
cover
metal
way
Prior art date
Application number
SE7504646A
Other languages
English (en)
Inventor
J T Kennedy
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE7504646L publication Critical patent/SE7504646L/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00—Photosensitive materials
    • G03C1/72—Photosensitive compositions not covered by the groups G03C1/005 - G03C1/705
    • G03C1/725—Photosensitive compositions not covered by the groups G03C1/005 - G03C1/705 containing inorganic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
SE7504646A 1974-05-02 1975-04-22 Sett att belegga en yta med en metall. SE7504646L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/466,314 US3950570A (en) 1974-05-02 1974-05-02 Method of depositing a metal on a surface

Publications (1)

Publication Number Publication Date
SE7504646L true SE7504646L (sv) 1975-11-03

Family

ID=23851297

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7504646A SE7504646L (sv) 1974-05-02 1975-04-22 Sett att belegga en yta med en metall.

Country Status (8)

Country Link
US (1) US3950570A (sv)
JP (1) JPS50152713A (sv)
BE (1) BE828510A (sv)
DE (1) DE2518520A1 (sv)
FR (1) FR2269586B1 (sv)
GB (1) GB1512403A (sv)
NL (1) NL7505154A (sv)
SE (1) SE7504646L (sv)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993799A (en) * 1974-10-04 1976-11-23 Surface Technology, Inc. Electroless plating process employing non-noble metal hydrous oxide catalyst
US4035500A (en) * 1976-06-04 1977-07-12 Western Electric Company, Inc. Method of depositing a metal on a surface of a substrate
US4091125A (en) * 1976-11-08 1978-05-23 Delgadillo Joseph A Circuit board and method for producing same
US4096043A (en) * 1977-07-11 1978-06-20 Western Electric Company, Inc. Method of selectively depositing a metal on a surface of a substrate
DE2847298A1 (de) * 1978-10-27 1980-05-08 Schering Ag Verfahren zur herstellung von metallmustern auf einem isolierenden traegerstoff
DE3760813D1 (en) * 1986-01-30 1989-11-23 Ciba Geigy Ag Polymeric compositions containing a dissolved dibenzal acetone palladium complex
US4781788A (en) * 1986-12-29 1988-11-01 Delco Electronics Corporation Process for preparing printed circuit boards
US4910118A (en) * 1987-03-30 1990-03-20 The Mead Corporation Method and photosensitive material for forming metal patterns employing microcapsules
US4882200A (en) * 1987-05-21 1989-11-21 General Electric Company Method for photopatterning metallization via UV-laser ablation of the activator
JPH0465815A (ja) * 1990-07-06 1992-03-02 Matsushita Electric Ind Co Ltd パターン作成方法
US20040248403A1 (en) * 2003-06-09 2004-12-09 Dubin Valery M. Method for forming electroless metal low resistivity interconnects
KR100904251B1 (ko) * 2008-01-28 2009-06-25 한국생산기술연구원 폴리머 표면에 귀금속촉매의 선택적 흡착방법
US20110303644A1 (en) * 2010-06-09 2011-12-15 Arlington Plating Company Methods for Plating Plastic Articles
JP7185999B2 (ja) * 2017-10-06 2022-12-08 上村工業株式会社 無電解パラジウムめっき液

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2427443A (en) * 1943-06-04 1947-09-16 Dick Co Ab Light-sensitive layer and processes of making and exposing it
US3791340A (en) * 1972-05-15 1974-02-12 Western Electric Co Method of depositing a metal pattern on a surface

Also Published As

Publication number Publication date
US3950570A (en) 1976-04-13
DE2518520A1 (de) 1975-11-13
JPS50152713A (sv) 1975-12-09
FR2269586B1 (sv) 1978-02-03
GB1512403A (en) 1978-06-01
NL7505154A (nl) 1975-11-04
FR2269586A1 (sv) 1975-11-28
BE828510A (fr) 1975-08-18

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