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JPS50152713A - - Google Patents

Info

Publication number
JPS50152713A
JPS50152713A JP50052124A JP5212475A JPS50152713A JP S50152713 A JPS50152713 A JP S50152713A JP 50052124 A JP50052124 A JP 50052124A JP 5212475 A JP5212475 A JP 5212475A JP S50152713 A JPS50152713 A JP S50152713A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50052124A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50152713A publication Critical patent/JPS50152713A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00—Photosensitive materials
    • G03C1/72—Photosensitive compositions not covered by the groups G03C1/005 - G03C1/705
    • G03C1/725—Photosensitive compositions not covered by the groups G03C1/005 - G03C1/705 containing inorganic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
JP50052124A 1974-05-02 1975-05-01 Pending JPS50152713A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/466,314 US3950570A (en) 1974-05-02 1974-05-02 Method of depositing a metal on a surface

Publications (1)

Publication Number Publication Date
JPS50152713A true JPS50152713A (ja) 1975-12-09

Family

ID=23851297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50052124A Pending JPS50152713A (ja) 1974-05-02 1975-05-01

Country Status (8)

Country Link
US (1) US3950570A (ja)
JP (1) JPS50152713A (ja)
BE (1) BE828510A (ja)
DE (1) DE2518520A1 (ja)
FR (1) FR2269586B1 (ja)
GB (1) GB1512403A (ja)
NL (1) NL7505154A (ja)
SE (1) SE7504646L (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019069965A1 (ja) * 2017-10-06 2019-04-11 上村工業株式会社 無電解パラジウムめっき液

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993799A (en) * 1974-10-04 1976-11-23 Surface Technology, Inc. Electroless plating process employing non-noble metal hydrous oxide catalyst
US4035500A (en) * 1976-06-04 1977-07-12 Western Electric Company, Inc. Method of depositing a metal on a surface of a substrate
US4091125A (en) * 1976-11-08 1978-05-23 Delgadillo Joseph A Circuit board and method for producing same
US4096043A (en) * 1977-07-11 1978-06-20 Western Electric Company, Inc. Method of selectively depositing a metal on a surface of a substrate
DE2847298A1 (de) * 1978-10-27 1980-05-08 Schering Ag Verfahren zur herstellung von metallmustern auf einem isolierenden traegerstoff
DE3760813D1 (en) * 1986-01-30 1989-11-23 Ciba Geigy Ag Polymeric compositions containing a dissolved dibenzal acetone palladium complex
US4781788A (en) * 1986-12-29 1988-11-01 Delco Electronics Corporation Process for preparing printed circuit boards
US4910118A (en) * 1987-03-30 1990-03-20 The Mead Corporation Method and photosensitive material for forming metal patterns employing microcapsules
US4882200A (en) * 1987-05-21 1989-11-21 General Electric Company Method for photopatterning metallization via UV-laser ablation of the activator
JPH0465815A (ja) * 1990-07-06 1992-03-02 Matsushita Electric Ind Co Ltd パターン作成方法
US20040248403A1 (en) * 2003-06-09 2004-12-09 Dubin Valery M. Method for forming electroless metal low resistivity interconnects
KR100904251B1 (ko) * 2008-01-28 2009-06-25 한국생산기술연구원 폴리머 표면에 귀금속촉매의 선택적 흡착방법
US20110303644A1 (en) * 2010-06-09 2011-12-15 Arlington Plating Company Methods for Plating Plastic Articles

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2427443A (en) * 1943-06-04 1947-09-16 Dick Co Ab Light-sensitive layer and processes of making and exposing it
US3791340A (en) * 1972-05-15 1974-02-12 Western Electric Co Method of depositing a metal pattern on a surface

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019069965A1 (ja) * 2017-10-06 2019-04-11 上村工業株式会社 無電解パラジウムめっき液
JP2019070173A (ja) * 2017-10-06 2019-05-09 上村工業株式会社 無電解パラジウムめっき液

Also Published As

Publication number Publication date
US3950570A (en) 1976-04-13
DE2518520A1 (de) 1975-11-13
FR2269586B1 (ja) 1978-02-03
GB1512403A (en) 1978-06-01
NL7505154A (nl) 1975-11-04
SE7504646L (sv) 1975-11-03
FR2269586A1 (ja) 1975-11-28
BE828510A (fr) 1975-08-18

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