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PL1775353T3 - Urządzenie powlekające i sposób eksploatacji urządzenia powlekającego - Google Patents

Urządzenie powlekające i sposób eksploatacji urządzenia powlekającego

Info

Publication number
PL1775353T3
PL1775353T3 PL05020153T PL05020153T PL1775353T3 PL 1775353 T3 PL1775353 T3 PL 1775353T3 PL 05020153 T PL05020153 T PL 05020153T PL 05020153 T PL05020153 T PL 05020153T PL 1775353 T3 PL1775353 T3 PL 1775353T3
Authority
PL
Poland
Prior art keywords
coating apparatus
operating
coating
Prior art date
Application number
PL05020153T
Other languages
English (en)
Inventor
Oliver Heimel
Original Assignee
Applied Mat Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Mat Gmbh & Co Kg filed Critical Applied Mat Gmbh & Co Kg
Publication of PL1775353T3 publication Critical patent/PL1775353T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
PL05020153T 2005-09-15 2005-09-15 Urządzenie powlekające i sposób eksploatacji urządzenia powlekającego PL1775353T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05020153A EP1775353B1 (de) 2005-09-15 2005-09-15 Beschichtungsanlage und Verfahren zum Betrieb einer Beschichtungsanlage

Publications (1)

Publication Number Publication Date
PL1775353T3 true PL1775353T3 (pl) 2009-04-30

Family

ID=37651151

Family Applications (1)

Application Number Title Priority Date Filing Date
PL05020153T PL1775353T3 (pl) 2005-09-15 2005-09-15 Urządzenie powlekające i sposób eksploatacji urządzenia powlekającego

Country Status (8)

Country Link
US (1) US20070056844A1 (pl)
EP (1) EP1775353B1 (pl)
JP (2) JP4625787B2 (pl)
KR (1) KR20070120928A (pl)
CN (1) CN1932072B (pl)
DE (1) DE502005005634D1 (pl)
PL (1) PL1775353T3 (pl)
TW (1) TWI340177B (pl)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9175383B2 (en) * 2008-01-16 2015-11-03 Applied Materials, Inc. Double-coating device with one process chamber
ES2774167T3 (es) * 2008-09-02 2020-07-17 Oerlikon Surface Solutions Ag Pfaeffikon Dispositivo de revestimiento para el revestimiento de un sustrato, así como un procedimiento para el revestimiento de un sustrato
KR101097737B1 (ko) * 2009-03-31 2011-12-22 에스엔유 프리시젼 주식회사 박막 증착 장치와 박막 증착 방법 및 박막 증착 시스템
KR101119853B1 (ko) * 2009-05-07 2012-02-28 에스엔유 프리시젼 주식회사 박막 증착 장치 및 이를 구비하는 박막 증착 시스템
CN101956173B (zh) * 2009-07-20 2013-06-05 鸿富锦精密工业（深圳）有限公司 使用承载组件的镀膜装置
KR101036123B1 (ko) * 2010-06-10 2011-05-23 에스엔유 프리시젼 주식회사 박막 증착 장치
EP2855727A1 (en) * 2012-06-01 2015-04-08 Applied Materials, Inc. Method for sputtering for processes with a pre-stabilized plasma
KR102115476B1 (ko) 2013-02-28 2020-05-27 삼성디스플레이 주식회사 스퍼터링 장치
DE102013221029A1 (de) * 2013-10-16 2015-04-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Herstellung uniformer Schichten auf bewegten Substraten und derart hergestellte Schichten
CN108300974B (zh) * 2018-04-28 2019-01-25 深圳市正和忠信股份有限公司 Pvd滚镀装置及方法
JP7158098B2 (ja) * 2018-07-31 2022-10-21 キヤノントッキ株式会社 成膜装置、および、電子デバイスの製造方法
JP7328744B2 (ja) * 2018-07-31 2023-08-17 キヤノントッキ株式会社 成膜装置、および、電子デバイスの製造方法
CN110220048A (zh) * 2019-04-18 2019-09-10 厦门阿匹斯智能制造系统有限公司 一种磁场角度可调的磁钢

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1366608A (en) * 1972-11-14 1974-09-11 Materials Research Corp Target mounting device for sequential sputtering
US4042128A (en) * 1975-11-26 1977-08-16 Airco, Inc. Substrate transfer apparatus for a vacuum coating system
ATE13561T1 (de) * 1980-08-08 1985-06-15 Battelle Development Corp Zylindrische magnetron-zerstaeuberkathode.
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
JPS61235562A (ja) * 1985-04-11 1986-10-20 Fujitsu Ltd マグネトロンスパツタ装置
US4904362A (en) * 1987-07-24 1990-02-27 Miba Gleitlager Aktiengesellschaft Bar-shaped magnetron or sputter cathode arrangement
JPH01205071A (ja) * 1988-02-12 1989-08-17 Nippon Telegr & Teleph Corp <Ntt> 多層膜形成装置
US4865710A (en) * 1988-03-31 1989-09-12 Wisconsin Alumni Research Foundation Magnetron with flux switching cathode and method of operation
WO1992001081A1 (en) * 1990-07-06 1992-01-23 The Boc Group, Inc. Method and apparatus for co-sputtering and cross-sputtering homogeneous films
JP3516949B2 (ja) * 1990-08-10 2004-04-05 バイラテック・シン・フィルムズ・インコーポレイテッド 回転マグネトロンスパッタリングシステムにおけるアーク抑制のためのシールディング
US5292419A (en) * 1990-12-20 1994-03-08 Leybold Aktiengesellschaft Sputtering unit
DE4040856A1 (de) * 1990-12-20 1992-06-25 Leybold Ag Zerstaeubungsanlage
DE69227313T2 (de) * 1991-04-29 1999-04-08 Scientific-Industrial Enterprise Novatech, Moscow Verfahren und vorrichtung zur behandlung von bauteilen in einem gasentladungsplasma
DE4126236C2 (de) * 1991-08-08 2000-01-05 Leybold Ag Rotierende Magnetron-Kathode und Verwendung einer rotierenden Magnetron-Kathode
GB9121665D0 (en) * 1991-10-11 1991-11-27 Boc Group Plc Sputtering processes and apparatus
JPH11302841A (ja) * 1998-04-24 1999-11-02 Victor Co Of Japan Ltd スパッタ装置
DE69937948D1 (de) * 1999-06-21 2008-02-21 Bekaert Advanced Coatings N V Magnetron mit beweglicher Magnetanordnung zur Kompensation des Erosionsprofils
US6290821B1 (en) * 1999-07-15 2001-09-18 Seagate Technology Llc Sputter deposition utilizing pulsed cathode and substrate bias power
JP4066044B2 (ja) * 2002-11-08 2008-03-26 信行 高橋 成膜方法及びスパッタ装置

Also Published As

Publication number Publication date
CN1932072B (zh) 2010-05-12
EP1775353A1 (de) 2007-04-18
US20070056844A1 (en) 2007-03-15
KR20070120928A (ko) 2007-12-26
TWI340177B (en) 2011-04-11
EP1775353B1 (de) 2008-10-08
JP2010163695A (ja) 2010-07-29
JP4778098B2 (ja) 2011-09-21
DE502005005634D1 (de) 2008-11-20
JP2007077493A (ja) 2007-03-29
JP4625787B2 (ja) 2011-02-02
TW200712233A (en) 2007-04-01
CN1932072A (zh) 2007-03-21

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