KR960011552A - 공작물의 절단방법 및 장치 - Google Patents
공작물의 절단방법 및 장치 Download PDFInfo
- Publication number
- KR960011552A KR960011552A KR1019950031625A KR19950031625A KR960011552A KR 960011552 A KR960011552 A KR 960011552A KR 1019950031625 A KR1019950031625 A KR 1019950031625A KR 19950031625 A KR19950031625 A KR 19950031625A KR 960011552 A KR960011552 A KR 960011552A
- Authority
- KR
- South Korea
- Prior art keywords
- cutting workpiece
- workpiece
- cutting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
- B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6-233593 | 1994-09-28 | ||
JP6233593A JP3053336B2 (ja) | 1994-09-28 | 1994-09-28 | スライシング方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960011552A true KR960011552A (ko) | 1996-04-20 |
KR100189392B1 KR100189392B1 (ko) | 1999-06-01 |
Family
ID=16957495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950031625A KR100189392B1 (ko) | 1994-09-28 | 1995-09-25 | 공작물의 절단방법 및 장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5902171A (ko) |
JP (1) | JP3053336B2 (ko) |
KR (1) | KR100189392B1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19905750B4 (de) * | 1999-02-11 | 2005-07-21 | Siltronic Ag | Innenlochsäge und Verfahren zum Schutz der Spannkante und zur Reinigung des Sägeblatts einer Innenlochsäge |
JP4635617B2 (ja) * | 2005-01-18 | 2011-02-23 | 株式会社Sumco | 切断装置及びその制御方法並びにシリコン単結晶の切断方法 |
JP5284700B2 (ja) | 2007-11-09 | 2013-09-11 | 花王株式会社 | 発熱具 |
US8376809B2 (en) * | 2009-02-25 | 2013-02-19 | Sumco Corporation | Cylindrical grinder and cylindrical grinding method of ingot |
CN104075648A (zh) * | 2014-07-01 | 2014-10-01 | 宁波狮球通风机电有限公司 | 铁冰冻电机机壳定子档相对轴孔同心度合格检测仪 |
KR101757732B1 (ko) * | 2015-07-02 | 2017-07-26 | 주식회사 피플파이 | 훈증 및 아로마테라피 효과가 있는 핫팩 |
KR102039663B1 (ko) * | 2017-09-05 | 2019-11-01 | 삼성중공업 주식회사 | 절삭툴 및 이를 포함하는 가공 장치 |
CN113787231B (zh) * | 2021-08-23 | 2022-07-01 | 宁波韵升股份有限公司 | 一种能够保证加工垂直度的内圆切片机 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3640645A1 (de) * | 1986-11-28 | 1988-06-09 | Wacker Chemitronic | Verfahren zum zersaegen von kristallstaeben oder -bloecken vermittels innenlochsaege in duenne scheiben |
JP2655677B2 (ja) * | 1988-04-26 | 1997-09-24 | トーヨーエイテック株式会社 | スライシングマシン |
US5025593A (en) * | 1988-01-18 | 1991-06-25 | Mazda Motor Corporation | Slicing machine and control method thereof |
DE3906091A1 (de) * | 1989-02-27 | 1990-08-30 | Wacker Chemitronic | Verfahren zum zersaegen von stabfoermigen werkstuecken in scheiben mittels innenlochsaege, sowie innenlochsaegen zu seiner durchfuehrung |
JPH06106524A (ja) * | 1992-09-24 | 1994-04-19 | Tokyo Seimitsu Co Ltd | 半導体ウエハのスライシング方法 |
-
1994
- 1994-09-28 JP JP6233593A patent/JP3053336B2/ja not_active Expired - Fee Related
-
1995
- 1995-09-25 KR KR1019950031625A patent/KR100189392B1/ko not_active IP Right Cessation
-
1997
- 1997-08-26 US US08/918,923 patent/US5902171A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100189392B1 (ko) | 1999-06-01 |
JP3053336B2 (ja) | 2000-06-19 |
JPH0890551A (ja) | 1996-04-09 |
US5902171A (en) | 1999-05-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20031205 Year of fee payment: 6 |
|
LAPS | Lapse due to unpaid annual fee |