KR20220028170A - Shingled solar cell module - Google Patents

Abstract

A high-efficiency configuration for a solar module includes solar cells that are electrically coupled to each other in a shingled manner to form super cells, which efficiently use the area of the solar module, reduce series resistance, and improve module efficiency. can be arranged to increase. The front surface metallization patterns on the solar cells can be configured to enable single step stencil printing, which is made possible by the overlapping configuration of solar cells in the super cells. A solar power system may include two or more such high voltage solar cell modules electrically connected in parallel to each other and to an inverter. Solar cell cutting tools and solar cell cutting methods apply a vacuum between bottom surfaces of a solar cell wafer and the curved support surface to bend the solar cell wafer against a curved support surface, thereby cutting a plurality of solar cells. The solar cell wafer is cut along one or more prefabricated scribe lines to provide An advantage of these cutting tools and cutting methods is that they do not require physical contact with the top surfaces of the solar cell wafer. Solar cells are fabricated with reduced charge recombination losses at the edges of the solar cell, for example without cleaved edges that promote charge recombination. The solar cells may have narrow rectangular geometries and advantageously be employed in shingled (overlapping) arrangements to form super cells.

Description

SHINGLED SOLAR CELL MODULE

The present invention relates generally to solar cell modules in which the solar cells are arranged in a shingled manner.

This international patent application is filed on November 4, 2014 in U.S. Patent Application Serial No. 14/530,405, entitled "Shingled Solar Cell Module", filed on October 31, 2014. U.S. Patent Application Serial No. 14/532,293, entitled "Shingled Solar Cell Module"), U.S. Patent Application No. 14/536,486, filed November 7, 2014 (Invention of Title: "Shingled Solar Cell Module"), U.S. Patent Application Serial No. 14/539,546, filed November 12, 2014, entitled "Shingled Solar Cell Module" )"), U.S. Patent Application Serial No. 14/543,580, filed November 17, 2014 (titled "Shingled Solar Cell Module"), filed November 19, 2014 U.S. Patent Application No. 14/548,081 entitled "Shingled Solar Cell Module"), U.S. Patent Application No. 14/550,676 filed on November 21, 2014, entitled "Shingled Solar Cell Module"), U.S. Patent Application Serial No. 14/552,761, filed November 25, 2014, entitled "Shingled Solar Cell Module" ), U.S. Patent Application Serial No. 14/560,577, filed December 4, 2014 (titled "Shingled Solar Cell Module"), U.S. Patent Application filed December 10, 2014 Application No. 14/566,278 entitled "Shingled Solar Cell Module"), US Patent Application No. 14/565,820 filed December 10, 2014 entitled " "Shingled Solar Cell Module"), U.S. Patent Application Serial No. 14/572,206, filed December 16, 2014, entitled "Shingled Solar Cell Module" , U.S. Patent Application Serial No. 14/577,593, filed December 19, 2014 (titled "Shingled Solar Cell Module"), U.S. Patent Application filed December 30, 2014 No. 14/586,025 entitled “Shingled Solar Cell Module”, U.S. Patent Application Serial No. 14/585,917, filed December 30, 2014, entitled “Shingled Solar Cell Module” "Shingled Solar Cell Module"), U.S. Patent Application Serial No. 14/594,439, filed January 12, 2015 (titled "Shingled Solar Cell Module"), 2015 U.S. Patent Application No. 14/605,695, filed January 26, 2014 (titled "Shingled Solar Cell Module"), U.S. Provisional Patent Application No., filed March 27, 2014 62/003,223 entitled "Shingled Solar Cell Module"), U.S. Provisional Patent Application Serial No. 62/036,215, filed August 12, 2014, entitled "Shingled Solar Cell Module" "Shingled Solar Cell Module"), U.S. Provisional Patent Application No. 62/042,615, filed August 27, 2014, entitled "Shingled Solar Cell Module"; U.S. Provisional Patent Application No. 62/048,858, entitled "Shingled Solar Cell Module", filed September 11, 2014, October 2014 U.S. Provisional Patent Application No. 62/064,260, filed on October 15, titled "Shingled Solar Cell Module", U.S. Provisional Patent Application No. 62/, filed October 16, 2014 064,834 (Title of the Invention: "Shingled Solar Cell Module"), U.S. Patent Application Serial No. 14/674,983, filed March 31, 2015 (Title of the Invention: "Employing Hidden Tabs") "Shingled Solar Cell Panel Employing Hidden Taps", U.S. Provisional Patent Application No. 62/081,200, filed November 18, 2014, entitled "Solar Cell Panel Employing Hidden Taps ( Solar Cell Panel Employing Hidden Taps"), U.S. Provisional Patent Application No. 62/113,250, filed February 6, 2015 (Title of the Invention: "Shingled Solar Cell Panel Employing with Hidden Taps) Hidden Taps)"), U.S. Provisional Patent Application No. 62/082,904, filed on November 21, 2014, entitled "High Voltage Solar Panel", on January 15, 2015 U.S. Provisional Patent Application No. 62/103,816 filed on February 4, 2015 (Title of the Invention: "High Voltage Solar Panel"), U.S. Provisional Patent Application No. 62/111,757 filed on February 4, 2015 (Invention) Titled: "High Voltage Solar Panel"), U.S. Provisional Patent Application No. 62/134,176, filed March 17, 2015, entitled "Solar Cell Cutting Apparatus and Methods ( Solar Cell Cleaving Tools and Methods), U.S. Provisional Patent Application No. 62/150,426, filed April 21, 2015, entitled "Stencil" "Shingled Solar Cell Panel Comprising Stencil-Printed Cell Metallization", U.S. Provisional Patent Application No. 62/035,624, filed August 11, 2014, entitled : "Solar Cells with Reduced Edge Carrier Recombination", U.S. Design Patent Application 29/506,415, filed October 15, 2014, on October 20, 2014 U.S. Design Patent Application No. 29/506,755, filed November 5, 2014 U.S. Design Patent Application No. 29/508,323, filed November 19, 2014 U.S. Design Patent Application No. 29/509,586, filed November 19, 2014; and U.S. Design Patent Application No. 29/509,588, filed on November 19, 2014, with priority rights. Each of the above patent applications listed above is hereby incorporated by reference in its disclosure for all purposes.

Alternative sources of energy are being required to meet all of the growing global energy needs. Solar energy resources are sufficient in many geographic areas to meet these needs in part by the supply of power generated by solar (eg, photovoltaic) cells.

Disclosed herein are high efficiency deployments of solar cells within a solar cell module and methods of making such solar modules.

In one aspect, a solar module includes a series connected string of N≧25 rectangular or substantially rectangular solar cells having a breakdown voltage greater than about 10 volts. wherein said solar cells are overlapping and one or more super cells comprising two or more of said solar cells arranged in line with long sides of adjacent solar cells that are conductively bonded to each other with an electrically and thermally conductive adhesive; grouped into super cells). A single solar cell or group of <N solar cells in the string of solar cells is not individually electrically connected in parallel to a bypass diode. The safe and reliable operation of the solar module is enabled by effective heat conduction along the super cells through the combined and overlapping portions of adjacent solar cells, resulting in hot spots in reverse biased solar cells. Prevents or reduces the formation of hot spots. The super cells can be encapsulated in, for example, a thermoplastic olefin polymer sandwiched between glass front and back sheets, further improving the module's robustness against thermal damage. In some variations, N is ≥30, ≥50 or ≥100.

In another aspect, a super cell is a rectangular or rectangular shape having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, respectively. and a plurality of silicon solar cells having a substantially rectangular front surface (sun side) and rear surfaces. Each solar cell has an electrically conductive front surface metallization pattern having at least one front surface contact pad positioned adjacent the first long side and at least one back surface contact positioned adjacent the second long side. and an electrically conductive backside metallization pattern having a pad. The silicon solar cells overlap and first and second long sides of the adjacent silicon solar cells overlap to electrically connect the silicon solar cells in series and adjacent silicon solar cells overlap and conductively bonded to each other with a conductive adhesive bonding material. arranged in line with the front and back contact pads on the poles. The front surface metallization pattern of each silicon solar cell is configured to substantially confine the conductive adhesive bonding material to the at least one front surface contact pads prior to curing of the conductive adhesive bonding material during fabrication of the super cell. including a barrier to

In another aspect, a super cell has a rectangular or substantially rectangular front surface (sun side) having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, respectively. ) and a plurality of silicon solar cells having a rear surface. Each solar cell has an electrically conductive front surface metallization pattern having at least one front surface contact pad positioned adjacent the first long side and at least one back surface contact pad positioned adjacent the second long side. and an electrically conductive backside metallization pattern. The silicon solar cells overlap and first and second long sides of the adjacent silicon solar cells overlap to electrically connect the silicon solar cells in series and adjacent silicon solar cells overlap and conductively bonded to each other with a conductive adhesive bonding material. arranged in line with the front and back contact pads on the poles. The back surface metallization pattern of each silicon solar cell includes a barrier configured to substantially confine the conductive adhesive bonding material to the at least one back surface contact pads prior to curing the conductive adhesive bonding material during fabrication of the super cell. do.

In another aspect, a method of making a string of solar cells includes one or more along a plurality of lines parallel to a long edge of each wafer to form a plurality of rectangular silicon solar cells each having a qualitatively equal length along its long axis. and dicing the above pseudo square silicon wafers. The method also includes arranging the rectangular silicon solar cells in line with long sides of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series. The plurality of rectangular silicon solar cells are each lacking at least one rectangular solar cell having two chamfered corners corresponding to corners or portions of corners of the pseudo square wafer and each lacking chamfered corners. one or more square silicon solar cells. The spacing between parallel lines along which the pseudo-square wafer is dice is equal to the width orthogonal to the long axis of the square silicon solar cells having the chamfered edges. Each of the plurality of square silicon solar cells in the string of solar cells is exposed to light in operation of the string of solar cells such that they are selected to compensate for the chamfered corners by making them larger than a width orthogonal to the long axis of the cells. has a front surface of substantially the same area.

In another aspect, a super cell includes a plurality of silicon solar cells arranged in line with ends of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series. at least one of the silicon solar cells has chamfered corners corresponding to corners or portions of corners of a pseudo-square silicon wafer on which it was diced, wherein at least one of the silicon solar cells lacks chamfered corners; Each of the silicon solar cells has a front surface of substantially equal area that is exposed to light during operation of the string of solar cells.

In another aspect, a method of making two or more super cells comprises a first plurality of rectangular silicon solar cells each having chamfered corners corresponding to corners or portions of corners of pseudo square silicon wafers and each dicing one or more pseudo square silicon wafers to form a second plurality of rectangular silicon solar cells having a first length spanning the entire width of the pseudo square silicon wafers and lacking chamfered corners; do. The method also includes the method from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells each having a second length shorter than the first length and lacking chamfered corners. and removing the chamfered edges. The method includes adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells in series to form a solar cell string having a width equal to the first length. arranging the second plurality of rectangular silicon solar cells in line with long sides of the arranging the third plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells conductively coupled to each other to electrically connect in series.

In another aspect, a method of making two or more super cells includes a chamfer and a first plurality of rectangular silicon solar cells having chamfered corners corresponding to corners or portions of corners of pseudo square silicon wafers. dicing one or more pseudo square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a second plurality of rectangular silicon solar cells lacking treated corners, the first plurality of arranging the first plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the rectangular silicon solar cells in series; and arranging the second plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells in series including the steps of

In another aspect, a super cell comprises a plurality of silicon solar cells arranged in line in a first direction with ends of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series, and conductively coupled to a front or back surface of an end of the silicon solar cells at a plurality of discrete locations arranged along the second direction, with its long axis oriented parallel to a second direction orthogonal to the first direction and running at least the full width of the end solar cell in the second direction, having a thickness less than or equal to about 100 microns measured orthogonal to the front or back surface of the end silicon solar cell, and about 0.012 Ohm provide resistance to current flow in the second direction that is less than or equal to, and provide for differential expansion in the second direction between the end silicon solar cell and the interconnect for a temperature range of about -40°C to about 85°C It includes an extended flexible electrical interconnect that provides flexibility to accommodate.

The flexible electrical interconnect may have, for example, a conductor thickness of less than or equal to about 30 microns measured orthogonal to the front and back surfaces of the end silicon solar cell. The electrical interconnect may extend past the super cell in the second direction to provide electrical interconnection for at least a second super cell positioned parallel to and adjacent to a quaternary super cell in a solar module. Additionally or alternatively, the flexible electrical interconnect may extend in the first direction past the super cell to provide electrical interconnection to a second super cell positioned parallel to and in line with the super cell in a solar module. there is.

In another aspect, a solar module includes a plurality of super cells arranged in two or more parallel rows spanning the width of the module to form a front surface of the module. Each super cell includes a plurality of silicon solar cells arranged in line with ends of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. At least an end of a first super cell adjacent an edge of the module in a first row is coupled to a front surface of the second super cell at a plurality of discrete locations with an electrically conductive adhesive bonding material, the edge of the module of a second super cell adjacent the same edge of the module in a second row through a flexible electrical interconnect, at least a portion of which is folded around an end of the super cell and hidden from view from the front of the module. electrically connected to the end.

In another aspect, a method of making a super cell includes laser cutting one or more scribe lines on each one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells. scribing, applying an electrically conductive adhesive bonding material to the one or more scribed silicon solar cells at one or more locations adjacent the long side of each rectangular area, each long side separating the silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells having a portion of the electrically conductive adhesive bonding material disposed on its front surface adjacent to the arranging silicon solar cells in line with the long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween; and curing the electrically conductive bonding material to bond adjacent and overlapping rectangular silicon solar cells to each other and electrically connect them in series.

In another aspect, a method of making a super cell comprises laser scribing one or more scribe lines on each one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells. applying an electrically conductive adhesive bonding material to portions of top surfaces of the one or more silicon solar cells to bend the one or more silicon solar cells against a curved supporting surface applying a vacuum between the bottom surfaces of one or more silicon solar cells and the curved support surface, thereby each having a plurality having a portion of the electrically conductive adhesive bonding material disposed on its front surface adjacent the long side cutting the one or more silicon solar cells along the stripe lines to provide rectangular silicon solar cells of arranging in line with the long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner as part of coupling and electrically connecting them in series.

In another aspect, a method of making a solar module includes assembling a plurality of super cells, each super cell overlapping in a shingled manner and aligned with ends on long sides of adjacent rectangular silicon solar cells. It includes a plurality of rectangular silicon solar cells arranged as The method also includes curing an electrically conductive bonding material disposed between the overlapping ends of the adjacent rectangular silicon solar cells by applying heat and pressure to the super cells to cure the adjacent overlapping rectangular silicon solar cells. assembling the cells and electrically connecting them in series. The method also includes arranging and interconnecting the super cells in a desired solar module configuration in a stack of layers comprising an encapsulant, and the stack of layers to form a laminated structure. applying heat and pressure to the

Some variations of the method apply heat and pressure to the super cells prior to applying heat and pressure to the stack of layers to form the laminated structure to cure or partially cure the electrically conductive bonding material. by curing, forming super cells that are cured or partially cured as an intermediate product prior to forming the laminated structure. In some variations, as each additional rectangular silicon solar cell is added to a super cell during assembly of the super cell, the electrically conductive adhesive bonding material between the newly added solar cell and its adjacent and overlapping solar cell is optional. Another rectangular silicon solar cell of , cured or partially cured before being added to the super cell. Optionally, some variations include curing or partially curing the electrically conductive bonding material in the super cell in the same step.

When the super cells are formed as partially cured intermediate products, the method comprises completing curing of the electrically conductive bonding material while applying heat and pressure to the stack of layers to form the laminated structure. may include steps.

Some variations of the method apply heat and pressure to the stack of layers to form the laminated structure without forming super cells that are cured or partially cured as an intermediate product prior to forming the laminated structure. and curing the electrically conductive bonding material.

The method may include dicing one or more standard sized silicon solar cells into smaller area rectangular shapes to provide the rectangular silicon solar cells. The electrically conductive adhesive bonding material is applied to the one or more silicon solar cells prior to dicing the one or more silicon solar cells to provide the rectangular silicon solar cells with a pre-applied electrically conductive adhesive bonding material. can be applied to Optionally, the electrically conductive adhesive bonding material may be applied to the rectangular silicon solar cells after dicing the one or more silicon solar cells to provide the rectangular silicon solar cells.

In one aspect, a solar module includes a plurality of super cells arranged in two or more parallel rows. Each super cell includes a plurality of rectangular or substantially rectangular silicon solar cells arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. A solar panel also includes a first hidden tap contact pad and the first hidden tap contact pad positioned on the back surface of a first solar cell positioned at an intermediate position along a first one of the super cells. and a first electrical interconnect conductively coupled to the The first electrical interconnect includes a stress relief feature to accommodate differential thermal expansion between the interconnect and the silicon solar cell to which it is coupled. The term "stress relieving feature" as used herein for an interconnect, for example, a thickness (eg, very thin) of the interconnect and/or a kink to the ductility of the interconnect. ), loops or slots. For example, the stress relieving feature may be that the interconnect is formed from a very thin copper ribbon.

wherein the solar module includes a second hidden tab contact pad positioned on a back surface of a second solar cell positioned adjacent the first solar cell at an intermediate position along a second of the super cells in an adjacent super cell row. and the first hidden tap contact pad is electrically connected to the second hidden tap contact pad through the first electrical interconnect. In such cases, the first electrical interconnect may extend across a gap between the first super cell and the second super cell and may be conductively coupled to the second hidden tap contact pad. . Optionally, the electrical connection between the first and second hidden tap contact pads is conductively coupled to the second hidden tap contact pad and electrically coupled to (eg, conductively coupled to) the first electrical interconnect. ) may include other electrical interconnects. Each interconnection scheme can optionally extend across additional rows of super cells. For example, each interconnect scheme may selectively extend across the entire width of the module to interconnect the solar cells in each row via the hidden tap contact pads.

The solar module includes a second hidden tap contact pad positioned on a rear surface of a second solar cell positioned at another intermediate position along a first one of the super cells, a second hidden tap contact pad conductively coupled to the second hidden tap contact pad 2 electrical interconnects and a bypass diode electrically connected in parallel with the solar cells positioned between the first hidden tap contact pad and the second hidden tap contact pad by the first and second electrical interconnects; may include

In any of the above variations, the first hidden tap contact pad is one of a plurality of hidden tap contact pads arranged on a back surface of the first solar cell in a row running parallel to the long axis of the first solar cell. wherein the first electrical interconnect is conductively coupled to each of the plurality of hidden contacts and substantially transverses a length of the first solar cell along the long axis. Additionally or alternatively, the first hidden tap contact pad may be one of a plurality of hidden tap contact pads arranged on the back surface of the first solar cell in a row running orthogonal to the long axis of the first solar cell. can In the latter case, the row of hidden tap contact pads may be positioned adjacent to a short edge of the first solar cell, for example. The first hidden tap contact pad may be one of a plurality of hidden tap contact pads arranged in a two-dimensional array on the rear surface of the first solar cell.

Optionally, in any of the preceding variations the first hidden tab contact pad can be positioned adjacent a long side of the back surface of the first solar cell, and wherein the first electrical interconnect extends along the long axis of the solar cell. thus not extending substantially inwardly from the hidden tap contact pad, the back surface metallization pattern on the first solar cell is preferably less than or equal to about 5 ohms per square, or less than about 2.5 ohms per square for the interconnect. It provides a conductive passage with a sheet resistance that is less than or equal to the sheet resistance. In such cases, the first interconnect may include, for example, two tabs positioned on opposite sides of the stress relief feature, one of the tabs to the first hidden tap contact pad. It can be electrically coupled. The two tabs may be of different lengths.

In any of the above variations, the first electrical interconnect confirms a desired alignment with the first hidden tap contact pad, confirms a desired alignment with an edge of the first super cell, or the first hidden tap contact alignment features identifying the desired alignment with the pad and the desired alignment with the edge of the first super cell.

In another aspect, a solar module comprises a glass front sheet, a back sheet, and a plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet. include Each super cell includes a plurality of rectangular or substantially rectangular silicon solar cells arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. A first flexible electrical interconnect is rigidly conductively coupled to a first of the super cells. The flexible conductive bonds between the overlapping solar cells form the super cells and the glass in a direction parallel to the rows for a temperature range of about -40°C to about 100°C without damaging the solar module to the super cells. It provides mechanical compliance that accommodates mismatches in thermal expansion between the front sheets. The tight conductive bond between the first super cell and the first flexible electrical interconnect is such that the first flexible electrical interconnect is resistant to the columns for a temperature range of about -40°C to about 180°C without damaging the solar module. to accommodate a mismatch in thermal expansion between the first super cell and the first flexible electrical interconnect in an orthogonal direction.

The conductive bonds between overlapping and adjacent solar cells in a super cell may use a different conductive adhesive than the conductive bonds between the super cell and the flexible electrical interconnect. The conductive bonding on one side of at least one solar cell in the super cell may use a different conductive adhesive than the conductive bonding on the other side. The conductive adhesive that forms a tight bond between the super cell and the flexible electrical interconnect may be, for example, solder. In some variations, the conductive bonds between overlapping solar cells in a super cell are formed of a conductive adhesive other than solder, and the conductive bond between the super cell and the flexible electrical interconnect is formed of solder.

In some variations using two different conductive adhesives as described above, both conductive adhesives may be cured in the same processing step (eg, at the same temperature, at the same pressure, and/or at the same time interval). can

Conductive bonds between the overlapping and adjacent solar cells can accommodate differential motion between each cell and the glass front substrate, for example greater than or equal to about 15 microns.

Conductive bonds between the overlapping and adjacent solar cells may be, for example, a thickness orthogonal to the solar cells of less than or equal to about 50 microns and greater than or equal to about 1.5 W/(meter-K) of the solar cells. It may have a thermal conductivity orthogonal to .

The first flexible electrical interconnect can withstand thermal expansion or contraction of the first flexible interconnect, for example greater than or equal to about 40 microns.

A portion of the first flexible electrical interconnect conductively coupled to the super cell may be like a ribbon formed of copper, for example less than or equal to about 30 microns or less than about 50 microns to the aspect to which it is coupled. It may have a thickness orthogonal to the surface of the battery. The first flexible electrical interconnect is not coupled to the solar cell and may include an essentially conductive copper portion that provides a higher conductivity than a portion of the first flexible electrical interconnect that is conductively coupled to the solar cell. The first flexible electrical interconnect has a thickness orthogonal to the surface of the solar cell to which it is coupled less than or equal to about 30 microns, or less than or equal to about 50 microns and in a direction orthogonal to the flow of current through the interconnect. It may have a width greater than or equal to about 10 mm in the plane of the surface of the cell. The first flexible electrical interconnect may be conductively coupled to a conductor proximate the solar cell that provides a higher conductivity than the first electrical interconnect.

In another aspect, a solar module includes a plurality of super cells arranged in two or more parallel rows. Each super cell has a plurality of rectangular or substantially rectangular silicon solar cells arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled directly to each other to electrically connect the silicon solar cells in series. . A hidden tap contact pad that does not conduct effective current in normal operation is located on the back surface of the first solar cell positioned intermediately along the first one of the super cells in the first one of the rows of super cells. The hidden tap contact pad is electrically connected in parallel to at least a second solar cell in a second one of the rows of super cells.

The solar module may include an electrical interconnect coupled to the hidden tap contact pad and electrically interconnecting the hidden tap contact pad to the second solar cell. In some variations, the electrical interconnect does not substantially span the length of the first solar cell, and wherein the backside metallization pattern on the first solar cell has a sheet resistance greater than or equal to about 50 ohms per square. A conductive path is provided for the tab contact pad.

The plurality of super cells may be arranged in three or more parallel rows across a width of the solar module orthogonal to the rows, and the hidden tap contact pad electrically connects all rows of super cells in parallel. electrically connected to a hidden tap contact pad on at least one solar cell in each row of the super cells to connect. In such variations, the solar module has at least one bus connection to at least one of the hidden tap contact pads, or to an interconnect between hidden tap contact pads, that is connected to a bypass diode or other electronic device. may include

The solar module may include a flexible electrical interconnect conductively coupled to the hidden tap contact pad to electrically connect it to the second solar cell. A portion of the flexible electrical interconnect that is conductively coupled to the hidden tap contact pad is, for example, a ribbon formed of copper and is less than or equal to about 50 microns orthogonal to the surface of the solar cell to which it is coupled. may have a thickness. The conductive coupling between the hidden tap contact pad and the flexible electrical interconnect can allow the flexible electrical interconnect to withstand a mismatch in thermal expansion between the first solar cell and the flexible interconnect, without damaging the solar module and about - to accommodate relative motion between the first solar cell and the second solar cell resulting from thermal expansion for a temperature range of 40°C to about 180°C.

In some variations, in operation of the solar module the first hidden tap contact pad may conduct a current greater than a current generated in any single one of the solar cells.

Typically, the front surface of the first solar cell overlying the first hidden tap contact pad is not occupied by contact pads or any other interconnect features. Typically, any area of the front surface of a first solar cell that is not overlapped by a portion of an adjacent solar cell in the first super cell is not occupied by contact pads or any other interconnect features.

In some variations, most of the cells in each super cell do not have hidden tap contact pads. In these variations, cells having hidden tap contact pads may have a larger light collection area than cells not having hidden tap contact pads.

In another aspect, a solar module includes a glass front sheet, a back sheet, and a plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet. Each super cell comprises a plurality of rectangular or substantially rectangular silicon solar cells arranged in line with long sides of adjacent silicon solar cells overlapping and flexibly conductively coupled directly to each other to electrically connect the silicon solar cells in series. provide them A first flexible electrical interconnect is rigidly conductively coupled to a first of the super cells. The flexible conductive bonds between the overlapping solar cells are formed of a first conductive adhesive and have a shear modulus less than or equal to about 800 megapascals. The rigid conductive bond between the first super cell and the first flexible electrical interconnect is formed of a second conductive adhesive and has a shear modulus of greater than or equal to about 2000 megaPascals.

The first conductive adhesive may have, for example, a glass transition temperature of less than or equal to about 0°C.

In some variations, the first conductive adhesive and the second conductive adhesive are different, and both of the conductive adhesives may be cured in the same treatment process.

In some variations, the conductive bonds between the overlapping adjacent solar cells have a thickness orthogonal to the solar cells less than or equal to about 50 microns and greater than or equal to about 1.5 W/(meter-K). It may have a thermal conductivity orthogonal to the solar cells.

In one aspect, a solar module includes a number N greater than or equal to about 250 rectangular or substantially rectangular silicon solar cells arranged as a plurality of series-connected super cells in two or more parallel rows. Each super cell comprises a plurality of silicon solar cells arranged in line with long sides of adjacent silicon solar cells overlapping and conductively bonded to each other with an electrically and thermally conductive adhesive to electrically connect the silicon solar cells within the super cell in series. Solar cells are provided. The super cells are electrically connected to provide a high direct current voltage greater than or equal to about 90 volts.

In one variation, the solar module includes one or more flexible electrical interconnects arranged to electrically connect the plurality of super cells in series to provide a high direct current voltage. The solar module may include an inverter that converts the high DC voltage into an AC voltage, and may include module level power electronics. The module level power electronics can sense the high DC voltage and operate the module at an optimal current-voltage power point.

In another variation, the solar module is electrically coupled to individual pairs of adjacent series connected rows of super cells and electrically series one or more pairs of pairs of rows of super cells to provide the high direct current voltage. and module level power electronics having an inverter that converts the high DC voltage into an AC voltage. Optionally, the module level power electronics may sense a voltage across each individual pair of columns of super cells and operate each individual pair of columns of super cells at an optimal current-voltage power point. Optionally, the module level power electronics can switch the respective pair of columns of super cells from the circuit providing the high direct current voltage when the voltage across the pair of columns is below a threshold value.

In another variation, the solar module is electrically coupled to each respective row of super cells, electrically connecting two or more rows of super cells in series to provide the high direct current voltage, the high direct current and module level power electronics having an inverter that converts the voltage to an alternating voltage. Optionally, the module level power electronics can sense the voltage across each individual row of super cells and operate each individual row of super cells at an optimal current-voltage power point. Optionally, the module level power electronics may switch an individual row of super cells from the circuit providing the high direct current voltage when the voltage across the row of super cells is below a threshold.

In another variation, the solar module is electrically connected to each individual super cell, electrically connecting two or more of the super cells in series to provide the high direct voltage, and alternating the high direct voltage It includes module level power electronics having an inverter that converts it to voltage. Optionally, the module level power electronics can sense the voltage across each individual super cell and operate each individual super cell at an optimal current-voltage power point. Optionally, the module level power electronics can switch the individual super cell from the circuit providing the high direct current voltage when the voltage across the super cell is below a threshold.

In another variant, each super cell in the module is electrically divided into a plurality of segments by hidden taps. The solar module is electrically connected to each segment of each super cell through the hidden taps, and electrically connects two or more segments in series to provide the high DC voltage, and converts the high DC voltage to an AC voltage. It includes module level power electronics with an inverter to convert. Optionally, the module level power electronics can sense the voltage across each segment of each super cell and operate each individual segment at an optimal current-voltage power point. Optionally, the module level power electronics can switch the individual segment from the circuit providing the high direct current voltage when the voltage across the segment is below a threshold.

In any of the above variations, the optimal current-voltage power point may be a maximum current-voltage power point.

In any of the above variations, the module level power electronics may lack a direct current to direct current boost component.

In any of the above variations, N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

In any of the above variations, the high direct voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, or about greater than or equal to 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

In another aspect, a solar photovoltaic system includes an inverter and two or more solar modules electrically connected in parallel. Each solar module includes a number N greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. each solar cell in each module comprises two or more of said silicon solar cells arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect said silicon solar cells in series do. In each module, the super cells are electrically connected to provide a high voltage direct current module output greater than or equal to about 90 volts. The inverter is electrically connected to the two or more solar modules to convert their high voltage direct current output to alternating current.

Each solar module may include one or more flexible electrical interconnects arranged to electrically connect the super cells in the solar module in series to provide a high voltage direct current output of the solar module.

The photovoltaic system may include at least a third photovoltaic module electrically connected in series with a first of the two or more photovoltaic modules electrically connected in parallel. In such cases, the third solar module may include a number N' greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. there is. Each super cell in the third photovoltaic module is a group of silicon solar cells in the module arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. Includes two or more. In the third solar module the super cells are electrically connected to provide a high voltage direct current module output greater than or equal to about 90 volts.

Variants comprising a third photovoltaic module electrically connected in series with a first of the two or more photovoltaic modules as described above also include the two or more photovoltaic modules electrically connected in parallel. and at least a fourth solar module electrically connected in series with the second. The fourth solar module may include a number N″ greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. Each super cell in a solar module has two or more of the silicon solar cells in the module arranged in line with the long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. In the fourth solar module the super cells are electrically connected to provide a high voltage direct current module output greater than or equal to about 90 volts.

The solar power system has fuses and/or disconnects arranged to prevent a short circuit occurring within any of the solar modules from dissipating power generated within the other solar modules. It may include diodes (blocking diodes).

The photovoltaic system may include positive and negative buses to which the two or more photovoltaic modules are electrically connected in parallel, and to which the inverter is omnisciently connected. Optionally, the solar power system may include a combiner box in which the two or more solar modules are electrically connected by separate conductors. the combiner box electrically connects the solar modules in parallel and fuses and/or arranged to prevent a short circuit occurring in any of the solar modules from dissipating power generated in the other solar modules and/or Blocking diodes may optionally be included.

The inverter may be configured to operate the solar modules at a direct voltage above a established minimum value to avoid reverse biasing the solar modules.

The inverter may be configured to recognize a reverse bias condition occurring within one or more of the solar modules and operate the solar modules at a voltage that avoids the reverse bias condition.

The solar power system may be located on the roof top.

In any of the above variations, N, N' and N" are greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, or about 400 greater than or equal to, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than about 700 or equal to. N, N' and N" may have the same or different values.

In any of the above variations, the high direct current voltage provided by the solar module is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or about 300 volts. greater than or equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, greater than or equal to about 600 volts there is.

In another aspect, a solar power system comprises a first solar cell comprising a number N of rectangular or substantially rectangular silicon solar cells greater than or equal to about 150 arranged as a plurality of super cells in two or more parallel rows. contains modules. Each super cell includes a plurality of silicon solar cells arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. The system also includes an inverter. The inverter may be, for example, a microinverter integrated with the first solar module. The super cells in the first solar module are electrically connected to provide a high direct current voltage greater than or equal to about 90 volts to the inverter that converts direct current to alternating current.

The first solar module may include one or more flexible electrical interconnects arranged to electrically connect super cells in the solar module in series to provide a high voltage direct current output of the solar module.

The photovoltaic system may include at least a second photovoltaic module electrically connected in series to the first photovoltaic module. The second solar module may include a number N' greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. Each super cell in the second solar module is a group of silicon solar cells in the module arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. Includes two or more. In the second solar module the super cells are electrically connected to provide a high voltage direct current module output greater than or equal to about 90 volts.

The inverter (eg, microinverter) may lack a DC to DC boost component.

In any of the above variations, N and N' are greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than about 400, or equal to, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, greater than or equal to about 700 there is. N and N' may have the same or different values.

In any of the above variations, the high direct current voltage provided by the solar module is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or about 300 volts. greater than or equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, greater than or equal to about 600 volts there is.

In another aspect, a solar module includes a number N greater than or equal to about 250 rectangular or substantially rectangular silicon solar cells arranged as a plurality of series-connected super cells in two or more parallel rows. Each super cell has a plurality of overlapping, electrically and thermally conductive adhesives arranged in line with long sides of adjacent silicon solar cells directly coupled to each other conductively to electrically connect the silicon solar cells in the super cell in series. silicon solar cells. The solar module includes no more than one bypass diode per 25 solar cells. The electrically and thermally conductive adhesive is applied to the solar cells with a thickness orthogonal to the solar cells less than or equal to about 50 microns between adjacent solar cells and greater than or equal to about 1.5 W/(meter-K). Form bonds with orthogonal thickness thermal conductivity.

The super cells may be encapsulated in a thermoplastic olefin layer between the front and back sheets. The super cells and their encapsulants may be interposed between glass front and back sheets.

The solar module may be, for example, no more than one bypass diode per 30 solar cells, or no more than one bypass diode per 50 solar cells, or no more than one bypass diode per 100 solar cells. may include The solar module, for example, does not include a bypass diode, or only a single bypass diode, or not more than three bypass diodes, or not more than six bypass diodes, or It may include bypass diodes that do not cross the column.

Conductive bonds between the overlapping solar cells are aligned with the super cells and the glass front surface in a direction parallel to the row for a temperature range of about -40°C to about 100°C without damaging the solar module for the super cells. Mechanical compliance can optionally be provided to accommodate mismatches in thermal expansion between the sheets.

In any of the above variations, N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

In any of the above variations, the super cells are greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, or about 360 volts. be electrically connected to provide a high direct current voltage greater than or equal to, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts. can

The solar energy system includes a solar module of any of the preceding variations and an inverter electrically connected to the solar module and configured to convert a DC output from the solar module to provide an AC output (eg For example, a microinverter) may be included. The inverter may lack a DC to DC component. The inverter may be configured to operate the solar module at a DC voltage above a set minimum voltage to avoid reverse biasing of the solar cell. The minimum voltage value may depend on temperature. The inverter may be configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition. For example, the inverter may be configured to operate the solar module in a region of a local maximum of a voltage-current output curve of the solar module to avoid the reverse bias condition.

Disclosed herein are solar cell cleaving tools and solar cell cleaving methods.

In one aspect, a method of manufacturing solar cells comprises advancing a solar cell wafer along a curved surface and between the curved surface and a bottom surface of the solar cell wafer to bend the solar cell wafer relative to the curved surface. and applying a vacuum to, thereby cutting the solar cell wafer along one or more pre-prepared scribe lines to separate a plurality of solar cells from the solar cell wafer. The solar cell wafer, for example, may be continuously processed along the curved surface. Optionally, the solar cell may proceed along the curved surface in separate movements.

The curved surface may be, for example, a curved portion of an upper surface of a vacuum manifold that applies the vacuum to the bottom surface of the solar cell wafer. The vacuum applied to the bottom surface of the solar cell wafer by the vacuum manifold may be changed along the direction of progress of the solar cell wafer, for example, of the vacuum manifold from which the solar cell wafer is subsequently cut. It can be the strongest in the area.

The method may include transferring the solar cell wafer to a perforated belt along a curved upper surface of the vacuum manifold, wherein the vacuum is applied to the underside of the solar cell wafer through perforations in the perforated belt. is authorized The perforations are such that leading and trailing edges of the solar cell wafer along the direction of travel of the solar cell wafer must lie on top of at least one perforation in the belt, so that by the vacuum It can optionally be arranged to be pulled towards a curved surface, but this is not required.

The method advances the solar cell wafer along a flat area of the upper surface of the vacuum manifold to reach a curved transition area of the upper surface of the vacuum manifold having a first curvature, and then the solar cell wafer is advancing the solar cell wafer into a cut region of an upper surface of the vacuum manifold to be subsequently cut, wherein the cut area of the vacuum manifold has a second curvature that is sharper than the first curvature. The method may further include advancing the cleaved solar cells into a post-cleavage region of the vacuum manifold having a third curvature that is sharper than the curvature.

In any of the above variations, the method comprises opposing ends of each scribe line to provide an asymmetrical stress distribution along each scribe line that promotes generation and propagation of a single cleaving crack along each scribe line. The method may further include applying a stronger vacuum between the solar cell wafer and the curved surface at one end of each scribe line. Optionally or additionally, in any of the above variations the method comprises vacuuming the scribe lines on the solar cell wafer such that for each scribe line one end reaches a curved cut region of the vacuum manifold before the other end. orienting at an angle with respect to the manifold.

In any of the above variations, the method can include removing the cleaved solar cells from the curved surface before the edges of the cleaved solar cells are contacted. For example, the method may include removing the cells in a direction tangential or approximately tangential to a curved surface of the manifold at a rate greater than the rate of progression of the cells along the manifold. can This may be implemented, for example, with a tangentially arranged moving belt or any other suitable mechanism.

In any of the above variants, the method comprises scribing the scribe lines onto the solar cell wafer and prior to cutting the solar cell wafer along the scribe lines a top or bottom surface of the solar cell wafer. may include applying an electrically conductive adhesive bonding material to the portions. Each of the resulting cleaved solar cells may then include a portion of the electrically conductive adhesive bonding material disposed along the cleaved edge of its top or bottom surface. The scribe lines may be formed before or after the electrically conductive adhesive bonding material is applied using any suitable scribing method. The scribe lines may be formed by, for example, laser scribing.

In any of the above variations, the solar cell wafer may be a square or pseudo square silicon solar cell wafer.

In another aspect, a method of making a string of solar cells includes electrically conductive adhesive bonding disposed between a plurality of rectangular solar cells in line with long sides of adjacent rectangular solar cells overlapping in a shingled manner. arranging with a material, and curing the electrically conductive bonding material to bond adjacent and overlapping rectangular solar cells to each other and electrically connecting them in series. The solar cells may be manufactured, for example, by any of the variants of the method for manufacturing solar cells described above.

In one aspect, a method of making a string of solar cells includes forming a back surface metallization pattern on each of the one or more square solar cells, and on each of the one or more square solar cells. stencil printing the complete front surface metallization pattern using a single stencil in a single stencil printing step. These steps may be performed in either order and, where appropriate, may be performed simultaneously. "Full front surface metallization pattern" means that after the stencil printing step no additional metallization material needs to be deposited on the front surface of the square solar cell to complete the formation of the front surface metallization. The method also includes forming two or more rectangular solar cells of each square to form a plurality of rectangular solar cells each having a complete front surface metallization pattern and a back surface metallization pattern from the one or more square solar cells. Separating the solar cells, arranging the plurality of rectangular solar cells in line with long sides of adjacent rectangular solar cells overlapping in a shingled manner, and each of the adjacent and overlapping rectangular solar cells conductively bonding the rectangular solar cells in a pair with an electrically conductive bonding material disposed therebetween so that a front surface metallization pattern of one of the rectangular solar cells in the pair is applied to those of the rectangular solar cells in the pair. and electrically connecting the plurality of rectangular solar cells in series by electrically connecting to the other back surface metallization pattern.

The stencil is attached to other portions of the stencil such that all portions of the stencil defining one or more features of a front surface metallization pattern on the one or more square solar cells lie within the plane of the stencil during stencil printing. It may be configured to be limited by physical connections to

The front surface metallization pattern on each rectangular solar cell may include, for example, a plurality of fingers oriented orthogonal to long sides of the rectangular solar cell, wherein the fingers in the front surface metallization pattern are They are not physically connected to each other by the front surface metallization pattern.

Disclosed herein are solar cells, methods for making such solar cells, and super The use of such solar cells in shingled (overlapping) arrangements to form cells is disclosed.

In one aspect, a method of manufacturing a plurality of solar cells comprises depositing one or more front surface amorphous silicon layers on a front surface of a crystalline silicon wafer, the crystalline silicon on an opposite side of the crystalline silicon wafer from the front surface. depositing one or more rear surface amorphous silicon layers on a rear surface of a wafer, the one or more front surface amorphous silicon layers to form one or more front surface trenches in the one or more front surface amorphous silicon layers Depositing a front surface passivating layer over the one or more front surface amorphous silicon layers and in the front surface trenches, one or more front surface amorphous silicon layers in the one or more rear surface amorphous silicon layers patterning the one or more rear surface amorphous silicon layers to form rear surface trenches, and depositing a rear surface passivating layer over the one or more rear surface amorphous silicon layers and in the rear surface trenches. Each of the one or more rear surface trenches is formed in line with a corresponding one of the front surface trenches. The method further includes cleaving the crystalline silicon wafer in one or more cleavage planes, each cleavage plane centered or substantially centered on the other pair of corresponding front and back surface trenches. In operation of the resulting solar cells the front surface amorphous silicon layers are illuminated with light.

In some variations only the front trenches are formed and the back trenches are not formed. In other variations, only the rear surface trenches are formed and the front surface trenches are not formed.

The method includes forming the one or more front surface trenches through the front surface amorphous silicon layer to reach the front surface of the crystalline silicon wafer and/or the one or more rear surface amorphous to reach the rear surface of the crystalline silicon wafer. and forming the one or more backside trenches through the silicon layers.

The method may include forming the front side passivating layer and/or forming the back side passivating layer with a transparent conductive oxide.

A pulsed laser or diamond tip may be used to initiate the cut point (eg, 100 microns long). A CW laser and cooling nozzle may be used to subsequently induce high compressive and tensile thermal stresses and guide complete cut propagation within the crystalline silicon wafer to separate the crystalline silicon wafer in the one or more cut planes. . Optionally, the crystalline silicon wafer may be mechanically cut in the one or more cutting planes. Any suitable cleavage methods may be used.

The one or more front surface amorphous crystalline silicon layers may form an n-p junction with the crystalline silicon wafer, in which case it may be desirable to cut the crystalline silicon wafer from its back side. Optionally, the one or more backside amorphous crystalline silicon layers may form an n-p junction with the crystalline silicon wafer, in which case it may be desirable to cut the crystalline silicon wafer from its front side.

In another aspect, a method of fabricating a plurality of solar cells includes forming one or more trenches in a first surface of a crystalline silicon wafer, the one or more amorphous silicon layers on the first surface of the crystalline silicon wafer. depositing a passivating layer on the one or more amorphous silicon layers in the trenches and on a first surface of the crystalline silicon wafer, from the first surface to an opposite side of the crystalline silicon wafer depositing one or more amorphous silicon layers on a second surface of the crystalline silicon wafer on a side surface, and cutting the crystalline silicon wafer in one or more cutting planes, each cutting plane comprising the centered or substantially centered on the others of one or more trenches.

The method may include forming the passivating layer with a transparent conductive oxide.

A laser may be used to induce thermal stress in the crystalline silicon wafer to cut the crystalline silicon wafer in the one or more cutting planes. Optionally, the crystalline silicon wafer may be mechanically cut in the one or more cutting planes. Any suitable cleavage method may be used.

The one or more front surface amorphous crystalline silicon layers may form an n-p junction with the crystalline silicon wafer. Optionally, the one or more back surface amorphous crystalline silicon layers may form an n-p junction with the crystalline silicon wafer.

In another aspect, a solar panel includes a plurality of super cells, each super cell in line with ends of adjacent solar cells overlapping and conductively coupled to each other in a shingled manner to electrically connect the solar cells in series. A plurality of solar cells are arranged. Each solar cell comprises a crystalline silicon base, one or more first surface amorphous silicon layers disposed on a first surface of the crystalline silicon base to form an np junction, from the first surface to an opposing surface of the crystalline silicon base. one or more second surface amorphous silicon layers disposed on a second surface of the crystalline silicon base on a side surface, and edges of the first surface amorphous silicon layers, edges of the second surface amorphous silicon layers, or and passivating layers for preventing charge recombination at edges of the first surface amorphous silicon layers and edges of the second surface amorphous silicon layers. The passivating layers may include a transparent conductive oxide.

The solar cells may be formed, for example, by any of the methods summarized above or disclosed herein.

These and other embodiments, features and advantages of the present invention will become more apparent to those skilled in the art upon reference to the following more detailed description of the invention in conjunction with the accompanying drawings, which are first briefly described.

1 shows a cross-sectional view of a string of series connected solar cells arranged in a shingled fashion with ends of adjacent solar cells overlapping to form a shingled super cell.
2A shows a diagram of a front (solar side) and front surface metallization pattern of an exemplary rectangular solar cell that may be used to form shingled super cells.
2B and 2C show diagrams of front (solar side) and front surface metallization patterns of two exemplary rectangular solar cells with rounded corners that may be used to form shingled super cells.
2D and 2E show diagrams of backside and exemplary backside metallization patterns for the solar cell shown in FIG. 2A.
2F and 2G show views of the backside and exemplary backside metallization patterns for the solar cells shown in FIGS. 2B and 2C , respectively.
2H shows a diagram of a front (solar side) and front surface metallization pattern of another exemplary rectangular solar cell that may be used to form shingled super cells. The front surface metallization pattern includes discrete contact pads each surrounded by a barrier configured to prevent an uncured conductive adhesive bonding material deposited on the contact pads from flowing away from the contact pads. .
FIG. 2I shows a cross-sectional view of the solar cell of FIG. 2H and identifies details of the front surface metallization pattern shown in the enlarged views of FIGS. 2J and 2K including contact pads and portions of a barrier surrounding the contact pads. .
Fig. 2j shows an enlarged view of the detail from Fig. 2i;
FIG. 2K shows an enlarged view of the detail of FIG. 2I with an uncured conductive adhesive bonding material substantially confined to the location of discrete contact pads by a barrier.
FIG. 2L shows a diagram of a backside and an exemplary backside metallization pattern for the solar cell of FIG. 2H. The backside metallization pattern includes discrete contact pads each surrounded by a barrier configured to prevent an uncured conductive adhesive bonding material deposited on the contact pads from flowing away from the contact pads. .
FIG. 2M shows a cross-sectional view of the solar cell of FIG. 2L and identifies details of the back surface metallization pattern shown in the enlarged view of FIG. 2N including contact pads and a barrier surrounding the contact pads.
FIG. 2N shows an enlarged view of the detail from FIG. 2M .
2O illustrates another variation of a metallization pattern comprising a barrier configured to prevent an uncured, conductive, adhesive bonding material from flowing away from a contact pad. The barrier is adjacent to one side of the contact pad and is larger than the contact pad.
FIG. 2P shows another variation of the metallization pattern of FIG. 2O with a barrier adjacent at least two sides of a contact pad.
2Q shows diagrams of backside and example backside metallization patterns for another example rectangular solar cell. The backside metallization pattern includes a continuous contact pad running substantially the length of the long side of the solar cell along the edge of the solar cell. The contact pad is surrounded by a barrier configured to prevent an uncured conductive adhesive bonding material deposited on the contact pad from flowing away from the contact pad.
2R shows a diagram of a front (solar side) and front surface metallization pattern of another exemplary rectangular solar cell that may be used to form shingled super cells. The front surface metallization pattern includes discrete contact pads arranged in a row along the edge of the solar cell and a long, thin conductor parallel to the row of contact pads and running therefrom into the substrate. The elongated, thin conductor forms a barrier configured to prevent an uncured conductive adhesive bonding material deposited on the contact pads from flowing off the contact pads and onto the active area of the solar cell.
3A shows that a pseudo-square silicon solar cell of standard size and shape can be split (eg, cut or shredded) into rectangular solar cells of two different lengths that can be used to form shingled super cells. A drawing illustrating an exemplary method is shown.
3B and 3C show diagrams illustrating another example method by which a pseudo-square silicon solar cell can be separated into rectangular solar cells. 3B shows a front side and an exemplary front side metallization pattern of the wafer. 3C shows the backside and an exemplary backside metallization pattern of the wafer.
3D and 3E show diagrams illustrating an example method in which a square silicon solar cell can be separated into rectangular solar cells. 3D shows a front side and an exemplary front side metallization pattern of the wafer. 3E shows a backside and an exemplary backside metallization pattern of the wafer.
4A shows a partial view of the front surface of an exemplary rectangular super cell comprising rectangular solar cells as shown in FIG. 2A , arranged in a shingled fashion as shown in FIG. 1 ;
4B and 4C are exemplary rectangular solar cells arranged in a shingled fashion as shown in FIG. 1 , for example “chevron” rectangular solar cells with chamfered corners as shown in FIG. 2B ; A front view and a back view of the super cell are shown, respectively.
5A shows a diagram of an exemplary rectangular solar module comprising a plurality of rectangular shingled super cells, the long side of each super cell having a length that is approximately half the length of the short sides of the module. The pairs of super cells are arranged end-to-end to form rows with the long sides of the super cells parallel to the short sides of the module.
5B shows a diagram of another exemplary rectangular solar module comprising a plurality of rectangular shingled super cells, the long side of each super cell having approximately the same length as the length of the short sides of the module. The super cells are arranged with their long sides parallel to the short sides of the module.
5C shows a diagram of another exemplary rectangular solar module comprising a plurality of rectangular shingled super cells, wherein a long side of each super cell has a length approximately equal to the length of the long side of the module. The super cells are arranged with their long sides parallel to the sides of the module.
5D shows a diagram of an exemplary rectangular solar module comprising a plurality of rectangular shingled super cells, with a long side of each super cell having a length that is approximately half the length of the long sides of the module. The pairs of super cells are arranged end-to-end to form rows with the long sides of the super cells parallel to the long sides of the module.
5E shows a diagram of another exemplary rectangular solar module, similar in configuration to the case of FIG. 5C, wherein all solar cells from which the super cells are formed are the corners of pseudo-square wafers from which the solar cells were separated. Chevron solar cells with chamfered corners corresponding to .
5F shows a diagram of another exemplary rectangular solar module, similar in configuration to that of FIG. 5C, wherein all solar cells from which the super cells are formed are arranged to reproduce the shapes of the pseudo-square wafers from which they were separated. It includes a mixture of chevron and square solar cells.
5G is diagrams of another exemplary rectangular solar module similar in configuration to that of FIG. 5E except that adjacent chevron solar cells in a super cell are arranged as mirror images of each other such that their overlapping edges are of equal length; show
6 shows an exemplary arrangement of three rows of super cells interconnected by flexible electrical interconnects to place the super cells in series with each other within each row, and to place the rows in parallel with each other. These could be, for example, three rows in the solar module of FIG. 5D .
7A shows example flexible interconnects that may be used to interconnect super cells in series or parallel. Some of the examples show patterning to increase their flexibility (mechanical compliance) along their long axes, along their short axes, or along their long axes and their short axes. 7A illustrates example stress-relieving long interconnect configurations that may be used as interconnects to front or back surface super cell terminal contacts or in hidden taps to super cells as described herein. 7B-1 and 7B-2 illustrate examples of out-of-plane stress relief features. 7B-1 and 7B-2 show an example elongated interconnect configuration that includes out-of-plane stress relief features and can be used in hidden taps to super cells or as interconnects to front or back super cell terminal contacts; .
FIG. 8A is a cross-sectional view of the exemplary solar module of FIG. 5D showing detail A from FIG. 5D, showing cross-sectional details of flexible electrical interconnects coupled to back terminal contacts of rows of super cells.
FIG. 8B shows detail C from FIG. 5D and is a cross-sectional view of the exemplary solar module of FIG. 5D showing cross-sectional details of flexible electrical interconnects coupled to front (sunside) terminal contacts of rows of super cells; am.
8C is a cross-sectional view of the exemplary solar module of FIG. 5D showing detail D from FIG. 5D , showing cross-sectional details of flexible interconnects arranged to interconnect super cells in rows in series.
8D-8G show additional examples of electrical interconnects coupled to a front terminal contact of a super cell at the end of a row of super cells adjacent the edge of the solar module. The exemplary interconnects are configured to have a small foot print on the front surface of the module.
9A depicts diagrams of another exemplary square solar module comprising six rectangular shingled super cells, the long side of each super cell having a length approximately equal to the length of the long side of the module. The super cells are arranged in six rows electrically connected in parallel with each other and electrically connected in parallel with a bypass diode disposed in a junction box on the rear surface of the solar module. Electrical connections between the super cells and the bypass diode are made through ribbons embedded in the module's laminate structure.
9B shows a diagram of another exemplary rectangular solar module comprising six rectangular shingled super cells, the long side of each super cell having a length approximately equal to the length of the long side of the module. The super cells are arranged in six rows electrically connected in parallel with each other and electrically connected in parallel with bypass diodes disposed in a junction box on the back side near the edge of the solar module. A second junction box is located on the back surface near the opposite end of the solar module. Electrical connection between the super cells and the bypass diode is made through an external cable between the junction boxes.
9C illustrates an exemplary glass-glass rectangular solar module comprising six rectangular shingled super cells, the long side of each super cell having a length approximately equal to the length of the long side of the module. The super cells are arranged in six columns electrically connected to each other in parallel. Two junction boxes are mounted on opposite edges of the module, maximizing the active area of the module.
9D is a side view of the solar module illustrated in FIG. 9C ;
9E shows another example solar module comprising six rectangular shingled super cells, each super cell having a length approximately equal to the length of the long side of the module. The super cells are arranged in six rows with three pairs of rows individually coupled to a power management device on the solar module.
9F shows another example solar module comprising six rectangular shingled super cells, with a long side of each super cell having a length approximately equal to the length of the long side of the module. The super cells are arranged in six rows, with each row individually connected to a power management device on the solar module.
9G and 9H show other examples of configurations for module level power management using shingled super cells.
10A shows an exemplary schematic electrical circuit diagram for a solar module as illustrated in FIG. 5B .
10B-1 and 10B-2 show exemplary physical layouts for various electrical interconnects for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 10A.
11A shows an exemplary schematic electrical circuit diagram of a solar module as illustrated in FIG. 5A .
11B-1 and 11B-2 show exemplary physical layouts for various electrical interconnects for a solar module as illustrated in FIG. 5A with the schematic electrical circuit diagram of FIG. 11A .
11C-1 and 11C-2 show another example physical layout for various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic electrical circuit diagram of FIG. 11A.
12A shows another exemplary schematic electrical circuit diagram for a solar module as illustrated in FIG. 5A .
12B-1 and 12B-2 show exemplary physical layouts for various electrical interconnects for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 12A.
12C-1 , 12C-2, and 12C-3 show another example physical layout for various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 12A; .
13A shows another exemplary schematic circuit diagram for a solar module as illustrated in FIG. 5A .
13B shows another exemplary schematic circuit diagram for a solar module as illustrated in FIG. 5B .
13C-1 and 13C-2 show exemplary physical layouts for various electrical interconnects for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 13A. The slightly modified physical layout of FIGS. 13C-1 and 13C-2 is suitable for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 13B .
14A shows a diagram of another exemplary rectangular solar module comprising a plurality of rectangular shingled super cells, the long side of each super cell having a length approximately equal to half the length of the short side of the module; have The pairs of super cells are arranged end-to-end to form rows with the long sides of the super cells parallel to the short sides of the module.
14B shows an exemplary schematic circuit diagram for a solar module as illustrated in FIG. 14A .
14C-1 and 14C-2 show exemplary physical layouts for various electrical interconnects for a solar module as illustrated in FIG. 14A with the schematic circuit diagram of FIG. 14B.
15 shows another exemplary physical layout for various electrical interconnections for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 10A .
16 shows an exemplary arrangement of a smart switch interconnecting two solar modules in series.
17 shows a flow diagram of an exemplary method of making a solar module with super cells.
18 shows a flow diagram of another exemplary method of making a solar module with super cells.
19A-19D show example arrangements in which super cells may be cured with heat and pressure.
20A-20C schematically illustrate an example apparatus that may be used to cut scribed solar cells. The device may be particularly advantageous when used to cut scribed super cells to which a conductive adhesive bonding material has been applied.
21 is an example with dark lines that may be used in solar modules comprising parallel rows of super cells to reduce the visible contrast between the super cells and the portions of the back sheet visible from the front of the module. The white back sheet "zebra striped" is shown.
22A shows a top view of a conventional module utilizing traditional ribbon connections under hot spot conditions. 22B also shows a top view of a module utilizing thermal diffusion in accordance with embodiments under hot spot conditions.
23A-23B show examples of super cell string layouts with chamfered cells.
Figures 24-25 show simplified cross-sectional views of arrays including a plurality of modules assembled in shingled configurations.
26 shows a rear (shading) view of a solar module illustrating an exemplary electrical interconnection of the front (sunside) terminal electrical contacts of a shingled super cell to a junction box on the back of the module.
27 depicts views of the back side (shading) of a solar module illustrating an exemplary electrical interconnection of two or more shingled super cells in parallel, wherein the front (solar side) terminal electrical contacts of the super cells are connected to each other. and connected to the junction box on the back of the module.
28 depicts a rear view (shading) view of a solar module illustrating another exemplary electrical interconnection of two or more shingled super cells in parallel, wherein the front (solar side) terminal electrical contacts of the super cells are connected to each other and to a junction box on the back of the module.
29 is a fragmentary cross-sectional and perspective view of two super cells illustrating the use of a flexible interconnect interposed between overlapping ends of adjacent super cells to electrically connect the super cells in series and to provide an electrical connection to a junction box; shows
29A shows an enlarged view of the region of interest of FIG. 29 .
30A shows an exemplary super cell having electrical interconnects coupled to its front and back terminal contacts; 30B shows two of the super cells of FIG. 30A interconnected in parallel.
31A-31C show diagrams of example backside metallization patterns that may be employed to create hidden taps in super cells as described herein.
32-33 show examples of the use of hidden taps with interconnects that run approximately the full width of the super cell.
34A-34C show examples of interconnects coupled to super cell back (FIG. 34A) and front side (FIG. 34B-34C) terminal contacts.
35-36 show examples of the use of hidden tabs with short interconnects that cross the gap between adjacent super cells, but do not extend substantially inwardly along the long axis of rectangular solar cells.
37A-1 through 37F-3 show example configurations for short hidden tap interconnects that include in-plane stress relief features.
38A-1 through 38B-2 show example configurations for short hidden tap interconnects that include out-of-plane stress relief features.
39A-1 and 39A-2 show example configurations for short hidden tap interconnects that include alignment features. 39B-1 and 39B-2 show an example configuration for short hidden tap interconnects with asymmetric tap lengths.
40 and 42A-44B show example solar module layouts employing hidden taps.
41 shows an example electrical circuit diagram for the solar module layouts of FIGS. 40 and 42A-44B .
45 depicts current flow in an exemplary solar module with bypass diodes in a conductive state.
46A-46B show the relative motion between solar module components resulting from thermal cycling in a direction parallel to the rows of super cells and perpendicular to the rows of super cells in the solar module, respectively.
47A-47B show another exemplary solar module layout and corresponding electrical circuit diagrams each employing hidden taps.
48A-48B show additional solar cell module layouts employing hidden taps in combination with built-in bypass diodes.
49A-49B show block diagrams for a solar module providing a conventional DC voltage to a microinverter and a high voltage solar module as described herein providing a high DC voltage to a microinverter, respectively;
50A-50B show an exemplary physical layout and electrical circuit diagrams, eg, high voltage solar modules including bypass diodes.
51A-55B show an example configuration for module level power management of high voltage solar modules including shingled super cells.
56 shows an exemplary arrangement of six super cells in six parallel rows with the ends of adjacent rows being interconnected in series and offset by flexible electrical interconnects.
57A schematically illustrates a photovoltaic system comprising a plurality of high DC voltage shingled solar cell modules electrically connected in parallel to each other and to a string inverter.
57B shows the photovoltaic system of FIG. 57A disposed on a roof top.
58A-58D can be used to prevent a high DC voltage shingled solar cell module having a short circuit from dissipating significant power generated within other high DC voltage shingled solar cell modules electrically connected in parallel. The arrangement of current-limiting fuses and blocking diodes is shown.
59A-59B illustrate exemplary arrangements in which two or more high DC voltage shingled solar cell modules are electrically connected in parallel within a combiner box that may include current limiting fuses and blocking diodes.
60A-60B show plots of current versus voltage and power versus voltage for a plurality of high DC voltage shingled solar cell modules each electrically connected in parallel. The diagrams in FIG. 60A are for the exemplary case in which there are no modules comprising a reverse biased solar cell. The diagrams of FIG. 60B are for an exemplary case where some of the modules include one or more reverse biased solar cells.
61A illustrates an example of a solar module using about one bypass diode per super cell. 61C illustrates an example of a solar module using bypass diodes in an intrinsic configuration. 61B illustrates an example configuration for a bypass diode connected between two neighboring super cells using a flexible electrical interconnect.
62A-62B schematically illustrate side and top views of different exemplary cutting instruments, respectively.
63A schematically illustrates the use of an exemplary asymmetric vacuum arrangement to control the generation and propagation of cracks along scribe lines when cutting a wafer. 63B schematically illustrates the use of an exemplary symmetrical vacuum arrangement that provides less control of the cut in addition to the arrangement of FIG. 63A.
64 schematically illustrates a top view of a portion of an exemplary vacuum manifold that may be used in the cutting mechanism of FIGS. 62A-62B .
65A and 65B provide schematic illustrations of top and perspective views, respectively, of the exemplary vacuum manifold of FIG. 64 overlaid by a perforated belt.
66 schematically illustrates a side view of an exemplary vacuum manifold that may be used in the cutting mechanism of FIGS. 62A-62B .
67 schematically illustrates a cleaved solar cell overlying an exemplary arrangement of a perforated belt and vacuum manifold.
68 schematically illustrates the relative positions and orientations of a cleaved solar cell and an uncut portion of a standard size wafer from which the solar cell was cleaved in an exemplary cleaving process.
69A-69G schematically illustrate apparatus and methods in which cleaved solar cells may be subsequently removed from a cleaving tool.
70A-70C provide orthographic projections of another variation of the exemplary cutting mechanism of FIGS. 62A-62B.
71A and 71B provide perspective views of the exemplary cutting mechanism of FIGS. 70A-70C at two different stages of the cutting process.
72A-74B illustrate details of the perforated belts and vacuum manifolds of the exemplary cutting tool of FIGS. 70A-70C .
75A-75G illustrate details of some example hole patterns that may be used for perforated vacuum belts in the example cutting tool of FIGS. 10A-10C .
76 shows an exemplary front surface metallization pattern on a rectangular solar cell.
77A-77B show example backside metallization patterns on rectangular solar cells.
78 depicts an exemplary front surface metallization pattern on a square solar cell that can be diced to form a plurality of rectangular solar cells each having the front surface metallization pattern shown in FIG. 76 .
79 depicts an exemplary back surface metallization pattern on a square solar cell that can be diced to form a plurality of rectangular solar cells each having the back surface metallization pattern shown in FIG. 77A.
80 is a schematic diagram of a conventionally sized HIT solar cell diced into narrow strip solar cells using conventional cleavage methods that result in cleaved edges that promote charge recombination.
81A-81J schematically illustrate the steps of an exemplary method of dicing a conventionally sized HIT solar cell into narrow solar cell strips lacking cleaved edges that promote charge recombination.
82A-82J schematically illustrate steps in another exemplary method of dicing a conventionally sized HIT solar cell into narrow solar cell strips lacking cleaved edges that promote charge recombination.

The following detailed description should be understood with reference to the drawings in which like reference numerals refer to like elements throughout different drawings. The drawings, which are not necessarily to scale, illustrate alternative embodiments and are not intended to limit the scope of the invention. The detailed description illustrates the principles of the invention by way of example and not limitation. This description will clearly enable those skilled in the art to make and use the invention, and to select several embodiments, adaptations, variations, and selections of the invention, including what is presently believed to be the best mode for carrying out the invention. fields and uses will be described.

As used in this specification and the appended claims, the singular expressions "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. Also, the term "parallel" means "parallel or substantially parallel" and avoids minor deviations from parallel geometries rather than requiring any parallel arrangements described herein to be exactly parallel. It is intended to cover The term "orthogonal" means "orthogonal or substantially orthogonal," so that any orthogonal arrangements described herein encompass minor deviations from orthogonal geometries rather than requiring exactly orthogonal ones. It is intended The term "square" means "square or substantially square", and has shapes of squares, such as chamfered (eg, rounded or otherwise truncated). It is intended to cover minor deviations from substantially square shapes with corners. The term "rectangular" means "rectangular or substantially rectangular" and has rectangular shapes, for example substantially rectangular with chamfered (eg, rounded or otherwise truncated) corners. It is intended to cover minor deviations from the shapes of

Disclosed herein are high efficiency shingled arrangements of silicon solar cells in solar cell modules, as well as front and rear surfaces for solar cells that may be used in such arrangements. Metallization patterns and interconnects are disclosed. Also disclosed herein are methods for manufacturing such solar modules. The solar cell modules may advantageously be employed under “one sun” (unfocused) illumination and may have physical dimensions and electrical specifications that allow them to replace conventional silicon solar cell modules.

1 is a diagram of series connected solar cells 10 arranged in a shingled manner with ends of adjacent solar cells overlapping and electrically connected to form a super cell 100 . A cross-sectional view of a string is shown. Each solar cell 10 has a semiconductor diode structure and electrical contacts to the semiconductor diode structure by a current generated in the solar cell 10 that can be provided to an external load when illuminated by light. include

In the examples described herein, each solar cell 10 has a front (sun side) and back (shaded side) metal that provides electrical contacts to opposite sides of an np junction. A crystalline silicon solar cell having metallization patterns, wherein the front surface metallization pattern is disposed on a semiconductor layer of n-type conductivity, and the back surface metallization pattern is disposed on a semiconductor layer of p-type conductivity. However, any other suitable solar cells employing any other suitable material system, diode structure, physical dimensions, or electrical contact arrangement may be used instead of or in addition to solar cells 10 in the solar modules described herein. can be used For example, the front surface (sun side) metallization pattern may be disposed on a semiconductor layer of p-type conductivity, and the back surface (light blocking side) metallization pattern may be disposed on a semiconductor layer of n-type conductivity. can be

Referring back to FIG. 1 , adjacent solar cells 10 in a super cell 100 are electrically conductive so that they electrically connect the front surface metallization pattern of one solar cell to the rear surface metallization pattern of an adjacent solar cell. conductively bonded to each other in the overlapping regions by an adult bonding material. Suitable electrically conductive conductive bonding materials may include, for example, electrically conductive adhesives and electrically conductive adhesive films and adhesive tapes, and conventional solders. Advantageously, the electrically conductive bonding material accommodates stress resulting from a mismatch between the coefficient of thermal expansion (CTE) of the electrically conductive bonding material and the coefficient of thermal expansion (eg, CTE of silicon) of the solar cells. provides mechanical compliance to the coupling between adjacent solar cells. To provide such mechanical compliance, in some variations the electrically conductive bonding material is selected to have a glass transition temperature less than or equal to about 0°C. To further reduce and accommodate stress parallel to the overlapping edges of the solar cells resulting from a CTE mismatch, the electrically conductive bonding material is optionally in a continuous line extending substantially the length of the edges of the solar cells. rather than at discrete locations along the overlapping regions of the solar cells.

The thickness of the electrically conductive between adjacent and overlapping solar cells formed by the electrically conductive bonding material and measured orthogonally to the front and back surfaces of the solar cells is, for example, about 0.1 mm or less. can be This thin coupling reduces resistive losses in the interconnections between cells, and also reduces heat along the super cell from any hot spots in the super cell that may develop during operation. enhance the flow. The thermal conductivity of the bond between the solar cells can be, for example, ≥ about 1.5 watts/(meter-K).

2A shows a front view of an exemplary rectangular solar cell 10 that may be used in a super cell 100 . Other shapes for the solar cell 10 may also be suitably used. In the illustrated example, the front surface metallization pattern of the solar cell 10 is positioned adjacent to one edge of the long sides of the solar cell 10 , and for substantially the length of the long sides of the solar cell 10 , the long side a bus bar 15 running parallel to and orthogonally attached to the bus bar, the short side of the solar cell 10 relative to each other and substantially for the length of the short sides It includes fingers 20 running parallel to the poles.

In the example of FIG. 2A , solar cell 10 has a length of about 156 mm, a width of about 26 mm and thus an aspect ratio (length of short side/length of long side) of about 1:6. Six such solar cells can be fabricated on a silicon wafer of standard 156 mm x 156 mm dimensions and separated (dice) to provide solar cells as illustrated below. In other variations, Eight solar cells 10 can be fabricated from a standard silicon wafer with dimensions of about 19.5 mm by 156 mm and thus an aspect ratio of about 1:8 More generally, the solar cells 10 include: It may have, for example, aspect ratios from about 1:2 to about 1:20, and may be fabricated from standard size wafers or from wafers of any other suitable dimensions.

3A shows that a pseudo square silicon solar cell wafer 45 of standard size and shape can be cut, shattered, or otherwise separated to form rectangular solar cells as described above. An exemplary method is shown. In this example, some full width rectangular solar cells 10L are cut from the center of the wafer, and additionally some shorter rectangular solar cells 10S are cut from the ends of the wafer, Chamfered or rounded edges are discarded. Solar cells 10L may be used to form single width shingled super cells, and solar cells 10S may be used to form narrower width shingled super cells.

Optionally, the chamfered (eg, rounded) edges may be retained on the solar cells being cut from the ends of the wafer. 2B-2C are substantially similar to the case of FIG. 2A, but of exemplary “chevron” rectangular solar cells 10 having chamfered corners retained from the wafer from which the solar cells were cut. The fronts are shown. 2B , a bus bar 15 is positioned adjacent and running parallel to the shorter of the two long sides for substantially the length of the side, at least partially at both ends around the chamfered corners of the solar cell. is further extended from 2c , the bus bar 15 is positioned adjacent the longer of the two long sides and runs parallel for substantially the length of the side. 3B-3C show a plurality of solar cells 10 having front surface metallization patterns similar to the case shown in FIG. 2A and two chamfered solar cells having front surface metallization patterns similar to the case shown in FIG. 2B . It shows a front view and a back view of a pseudo square wafer 45 that can be diced along the dashed lines shown in FIG. 3C to provide elements 10 .

In the exemplary front surface metallization pattern shown in Figure 2b, the two ends of the bus bar 15 extending around the chamfered corners of the cell are each located adjacent to the long side of the cell. It may have a width that tapers (gradually narrows) with increasing distance from a portion. Similarly, in the exemplary front surface metallization pattern shown in FIG. 3B, the two ends of a thin conductor interconnecting separate contact pads 15 are chamfered edges of the solar cell. It extends circumferentially and tapers with increasing distance from the long side of the solar cell along which the discrete contact pads are arranged. While this tapering is optional, it can advantageously reduce the use of metals and shading of the active area of the solar cell without significantly increasing resistive losses.

3D-3E show a fully square wafer 47 that can be diced along the dashed lines shown in FIG. 3E to provide a plurality of solar cells 10 having front surface metallization patterns similar to the case shown in FIG. 2A. shows the front and rear views of

Chamfered rectangular solar cells can be used to form super cells containing only chamfered solar cells. Additionally or alternatively, one or more of such chamfered rectangular solar cells may be used in combination with one or more undisturbed rectangular solar cells (eg, FIG. 2A ) to form a super cell. there is. For example, the end solar cells of a super cell may be chamfered solar cells, and the central solar cells may be unchamfered solar cells. When chamfered solar cells are used in combination with unchamfered solar cells in a super cell or more generally in a solar module, the chamfered and It may be desirable to use dimensions for solar cells that result in unchamfered solar cells. Matching the solar cell areas in this way matches the current generated in the chamfered and unchamfered solar cells, including both chamfered and unchamfered solar cells. Improves the performance of series-connected strings. The area of chamfered and non-chamfered solar cells cut from the same pseudo-square wafer is eg in a direction orthogonal to their long axes to compensate for missing corners on the chamfered solar cells. This can be matched by adjusting the positions of the lines through which the wafer is diced to make the treated solar cells slightly wider than the unchamfered solar cells.

A solar module may include only super cells formed from chamfered rectangular solar cells, or it may include only super cells formed from chamfered rectangular solar cells, or chamfered and It may include only super cells with unchamfered solar cells, or any combination of these three variants of a super cell.

In some examples, portions of a standard sized square or pseudo-square solar cell wafer (eg, wafer 45 or wafer 47 ) near the edges of the wafer are portions of the wafer positioned away from the edges. It can convert light into electricity with lower efficiency than others. To improve the efficiency of the resulting rectangular solar cells, in some variations one or more edges of the wafer are trimmed to remove less efficient portions before the wafer is diced. Portions trimmed from the edges of the wafer may have widths of, for example, from about 1 mm to about 5 mm. Also, as shown in Figures 3b and 3d, the two end solar cells 10 diced from the wafer follow their outer edges and thus their front bus bar along two of the edges of the wafer. (bus bars) (or separate contact pads) 15 . Because the bus bars (or separate contact pads) 15 in the super cells disclosed herein are typically overlapped by an adjacent solar cell, the low light conversion efficiency along these two edges of the wafer is typically the It does not affect the performance of solar cells. Accordingly, in some variations the edges of a square or pseudo-square wafer oriented parallel to the short sides of the rectangular solar cells are trimmed as described above, but oriented parallel to the long sides of the rectangular solar cells. The edges of the wafer are not. In other variations, one, two, three or four edges of a square wafer (eg, wafer 47 in FIG. 3D ) are trimmed as described above. In other variations, one, two, three or four of the long edges of the pseudo-square wafer are trimmed as described above.

Solar cells with a long and narrow aspect ratio and smaller areas than that of a standard 156 mm×156 mm solar cell are advantageously employed to reduce I ² R resistive output losses in the solar cell modules disclosed herein as illustrated can be In particular, the reduced area of solar cells 10 compared to standard sized silicon solar cells reduces the current generated within the solar cell, thereby reducing resistive output loss in the solar cell and a series connected string of such solar cells. directly reduce Also, arranging these rectangular solar cells in a super cell 100 such that current flows parallel to the short sides of the solar cells through the super cell so that the current reaches the fingers 20 in the front surface metallization pattern. It can reduce the distance that must flow through the semiconductor material to do so, and can reduce the required length of the fingers, which can also reduce the resistive output loss.

As mentioned above, coupling overlapping solar cells 10 within their overlapping regions to connect the solar cells in series is advantageous compared to conventional tabbed series connected strings of solar cells adjacent to each other. Reduces the length of electrical connections between solar cells. This also reduces resistive output losses.

Referring again to FIG. 2A , in the illustrated example the front surface metallization pattern on the solar cell 10 includes an optional bypass conductor 40 parallel to and spaced apart from the bus bar 15 . (Such a bypass conductor can also be optionally used in the metallization patterns shown in Figs. 2b-2c, 3b and 3d, and is also combined with separate contact pads 15 rather than a continuous bus bar. 2q). The bypass conductor 40 interconnects the fingers 20 to electrically bypass cracks that may form between the bus bar 15 and the bypass conductor 40 . These cracks, which may cut the fingers 20 at locations near the bus bar 15 , may otherwise separate regions of the solar cell 10 from the bus bar 15 . The bypass conductor provides an optional electrical path between these broken fingers and the bus bar. The illustrated example shows a bypass conductor 40 positioned parallel to the bus bar 15 , extending approximately the entire length of the bus bar, and interconnecting all the fingers 20 . Such an arrangement may be desirable, but not required. When present, the bypass conductor need not run parallel to the bus bar and need not extend the entire length of the bus bar. Also, a bypass conductor interconnects at least two fingers, but need not interconnect all fingers. Two or more short bypass conductors may be used in place of the longer bypass conductors, for example. Any suitable arrangement of bypass conductors may be used. The use of such bypass conductors was filed on February 13, 2012, the disclosure of which is incorporated herein by reference, in U.S. Patent Application Serial No. 13/371,790 entitled "Metals That Can Compensate or Prevent Cracking" Solar Cell With Metallization Compensating For Or Preventing Cracking").

The exemplary front surface metallization pattern of FIG. 2A also includes an optional end conductor 42 interconnecting the fingers 20 at their distal ends opposite from the bus bar 15 (such an end conductor It can also optionally be used in the metallization patterns shown in FIGS. 2B-2C, 3B and 3D and 2Q). The width of the conductor 42 may be approximately equal to the width of the finger 20 , for example. Conductor 42 interconnects fingers 20 to electrically bypass cracks that may form between bypass conductor 40 and conductor 42, thus electrically isolated by such cracks. A current path is provided for the bus bar 15 for areas of the solar cell 10 that can be used.

Although some of the illustrated examples show a front bus bar 15 extending substantially the length of the long sides of the solar cell 10 with a uniform width, this is not required. For example, as previously suggested, the front bus bars 15 may be arranged in line with each other, for example along the side of the solar cell 10 as shown in FIGS. 2H , 2Q and 3B , for example. It may be replaced by two or more separate front contact pads 15 that may be used. These separate contact pads may optionally be interconnected, for example, by thinner conductors running therebetween as shown in the aforementioned figures. In such variations, the width of the contact pads, measured orthogonal to the long side of the solar cell, may be, for example, about 2 to about 20 times the width of the thin conductors interconnecting the contact pads. There may be a separate (eg, small) contact pad for each finger in the front surface metallization pattern, or each contact pad may be coupled to two or more fingers. The front contact pads 15 may be, for example, square, or may have a rectangular shape extending parallel to the edge of the solar cell. Front contact pads 15 have widths orthogonal to the long side of the solar cell of, for example, about 1 mm to about 1.5 mm and at the long side of the solar cell, for example, about 1 mm to about 10 mm. It may have parallel lengths. The distance between the contact pads 15 measured parallel to the long side of the solar cell may be, for example, about 3 mm to about 30 mm.

Alternatively, the solar cell 10 may lack both the front bus bar 15 and the separate front contact pads 15 , and may include only the fingers 20 in the front surface metallization pattern. In these variants, current-collecting functions, which could otherwise be performed by the front bus bar 15 or contact pads 15 , connect the two solar cells 10 to the overlapping configuration described above. This may be done instead, or in part, by the conductive material used to bond to each other.

Solar cells lacking both the bus bar 15 and the contact pads 15 may include the bypass conductor 40 or may not include the bypass conductor 40 . When the bus bar 15 and contact pads 15 are not present, a bypass conductor 40 is formed between the bypass conductor and a portion of the front surface metallization pattern conductively coupled to the overlapping solar cell. It can be arranged to bypass cracks that become

The front surface metallization patterns comprising a bus bar or discrete contact pads 15, fingers 20, bypass conductor 40 (if present) and end conductor 42 (if present) may be, for example, It can be formed, for example, from silver paste, which is conventionally used and deposited for these purposes by conventional screen printing methods. Optionally, the front surface metallization patterns may be formed from electroplated copper. Any other suitable materials and processes may also be used. In variants where the front surface metallization pattern is formed of silver, the use of separate front surface contact pads 15 rather than a bus bar 15 continuous along the edge of the cell reduces the amount of silver on the solar cell. , which advantageously reduces costs. In variants in which the front surface metallization pattern is formed from copper or from other conductors less expensive than silver, a continuous bus bar 15 can be employed without cost problems.

2D-2G, 3C and 3E show exemplary backside metallization patterns for a solar cell. In these examples, the backside metallization patterns include discrete backside contact pads 25 arranged along one of the long edges of the backside of the solar cell and a metal contact covering substantially all of the remaining backside of the solar cell. 30) is included. In a shingled super cell, contact pads 25 are separate contact pads arranged to electrically connect two solar cells in series, for example on a bus bar or along an edge of the top surface of an adjacent and overlapping solar cell. is coupled to For example, each discrete back surface contact pad 25 may be aligned with a corresponding discrete front surface contact pad 15 on the front surface of the overlapping solar cell, and is electrically conductive only applied to the discrete contact pads. may be bound by an adult binding agent. The separate contact pads 25 can be, for example, square ( FIG. 2D ) or have a rectangular shape extending parallel to the edge of the solar cell ( FIGS. 2E-2G , 3C , 3E ). can have Contact pads 25 have widths orthogonal to the long side of the solar cell of, for example, from about 1 mm to about 5 mm and parallel to the long side of the solar cell, for example, from about 1 mm to about 10 mm. It can have one length. The distance between the contact pads 25 measured parallel to the long side of the solar cell may be, for example, about 3 mm to about 30 mm.

Contact 30 may be formed, for example, from aluminum and/or from electroplated copper. The formation of the aluminum back contact 30 typically provides a back surface field that reduces back surface recombination in the solar cell, thus improving solar cell efficiency. Where contacts 30 are formed from copper rather than aluminum, contacts 30 may be used in combination with other passivation schemes (eg, aluminum oxide) to similarly reduce backside recombination. The separate contact pads 25 may be formed from, for example, silver paste. The use of discrete silver contact pads 25 rather than a continuous silver contact pad along the edge of the cell may reduce the amount of silver in the backside metallization pattern, which may advantageously reduce cost.

Also, when the solar cells rely on the backside electric field provided by the formation of aluminum contacts to reduce backside recombination, the use of discrete silver contacts rather than continuous silver contacts can improve solar cell efficiency. This is because the silver back contacts do not provide a back electric field and thus tend to promote carrier recombination and create an insoluble (inert) volume in the solar cells over the silver contacts. In conventional ribbon-tabbed solar cell strings, these dead volumes are typically obscured by ribbons and/or bus bars on the front side of the solar cell, thus resulting in any loss of efficiency. no additional losses However, in the solar cells and super cells disclosed herein, the volume of the solar cell above the back side silver contact pads 25 is typically not obscured by any front side metallization, resulting from the use of silver back side metallization. Any undissolved volumes that become will reduce the efficiency of the cell. The use of discrete silver contact pads 25 rather than continuous silver contact pads along the edge of the backside of the solar cell thus reduces the volume of any corresponding insoluble areas and increases the efficiency of the solar cell.

In variants that do not rely on a backside electric field to reduce backside recombination, the backside metallization pattern may extend the length of the solar cell rather than discrete contact pads 25 , as shown for example in FIG. 2q . An extended continuous bus bar 25 may be employed. Such a bus bar 25 may be formed of, for example, tin or silver.

Other variations of the backside metallization patterns may employ separate tin contact pads 25 . Modifications of the rear surface metallization patterns may employ finger contacts similar to those shown in the front surface metallization patterns of FIGS. 2A-2C , and may lack contact pads and bus bars.

Although the specific example solar cells shown in the figures are described as having specific combinations of front and back surface metallization patterns, more generally any suitable combination of front and back surface metallization patterns may be used. For example, one suitable combination is a silver front surface metallization pattern comprising discrete contact pads 15 , fingers 20 and an optional bypass conductor 40 , and an aluminum contact 30 and separate A back surface metallization pattern including silver contact pads 25 may be employed. Other suitable combinations include a copper front surface metallization pattern comprising a continuous bus bar (15), fingers (20) and an optional bypass conductor (40), and a continuous bus bar (25) and copper contacts (30). A back surface metallization pattern including

In the super cell fabrication process (described in more detail below), the electrically conductive bonding material used to bond adjacent and overlapping solar cells within a super cell is applied at the edge of the front or back surface of the solar cell ( It may be distributed only onto contact pads (separate or continuous) and not onto surrounding portions of the solar cell. This reduces the use of materials and can reduce or accommodate the stress resulting from the CTE mismatch between the electrically conductive bonding material and the solar cell as described above. However, during or after deposition and prior to curing, portions of the electrically conductive bonding material may tend to diffuse beyond the contact pads and onto surrounding portions of the solar cell. For example, a bonding resinous portion of the electrically conductive bonding material may be pulled from a contact pad onto textured or porous adjacent portions of the solar cell surface by capillary forces. Also, during the deposition process, a portion of the conductive bonding material may deflect the contact pad and instead deposit on and possibly diffuse from adjacent portions of the solar cell surface. Such diffusion and/or incorrect deposition of the conductive bonding material can weaken the bonding between the overlapping solar cells and damage the portions of the solar cells onto which the conductive bonding material has been dispersed or incorrectly deposited. can do it Such diffusion of the electrically conductive bonding material may, for example, form a dam or barrier near or around each contact pad to hold the electrically conductive bonding material substantially in place. It can be reduced or prevented with a metallization pattern.

2H-2K, for example, the front surface metallization pattern may include separate contact pads 15, fingers 20 and barriers 17, each barrier ( 17) surrounds a corresponding contact pad 15 and functions as a dam to form a moat between the contact pad and the barrier. Portions 19 of uncured conductive adhesive bonding material 18 that flow out or leave the contact pads when dispersed onto the solar cell are secured to the moats by barriers 17 . may be limited. This prevents further diffusion of the conductive adhesive bonding material from the contact pads onto surrounding portions of the cells. The barriers 17 may be formed, for example, from the same material (eg, silver) as the fingers 20 and contact pads 15 , for example about 10 microns to about 40 microns in height. may have widths, for example, from about 30 microns to about 100 microns. The moat formed between the barrier 17 and the contact pad 15 may have a width of, for example, about 100 microns to about 2 mm. Although the illustrated examples include only a single barrier 17 around each front contact pad 15, in other variations two or more of these barriers may be located concentrically around each contact pad, for example. . The front contact pad and barriers around one or more thereof may form a shape similar to, for example, a “bulls-eye” target. As shown in FIG. 2H , for example, barriers 17 may be interconnected with thin conductors interconnecting fingers 20 and contact pads 15 .

Similarly, as shown in Figures 2L-2N, for example, the backside metallization pattern (eg, silver) separate back contact pads 25 , substantially all of the backside of the solar cell. a covering (eg, aluminum) contact 30 , and (eg, silver) barriers 27 , each barrier 27 surrounding a corresponding rear contact pad 25 , said It acts as a dam forming a moout between the contact pad and the barrier. A portion of the contact 30 may fill the moat as illustrated. Portions of uncured conductive adhesive bonding material that flow out of or leave contact pads 25 when dispersed onto the solar cell may be confined to the moats by barriers 27 . . This prevents further diffusion of the conductive adhesive bonding material from the contact pads onto peripheral portions of the cell. The barriers 27 may have heights of, for example, from about 10 microns to about 40 microns, and may have widths, for example, from about 50 microns to about 500 microns. The moat formed between the barrier 27 and the contact pad 25 may have a width of, for example, about 100 microns to about 2 mm. Although the illustrated examples include only a single barrier 27 around each backside contact pad 25, in other variations two or more of these barriers may be disposed concentrically, for example around each contact pad. . The back contact pad and barriers around one or more thereof may form a shape similar to, for example, a “bulls-eye” target.

A continuous bus bar or contact pad running substantially the length of the edge of the solar cell may also be surrounded by a barrier preventing diffusion of the conductive adhesive bonding material. For example, FIG. 2q shows such a barrier 27 surrounding the rear bus bar 25 . The front bus bar (eg, bus bar 15 in FIG. 2A ) may similarly be surrounded by a barrier. Similarly, a row of front or back contact pads may be surrounded by such barriers as a group rather than individually surrounded by separate barriers.

Rather than surrounding bus bars or one or more contact pads as previously described, a feature of the front or back surface metallization pattern includes the bus bar or contact pads positioned between a barrier and an edge of the solar cell. It is possible to form the barrier running substantially the length of the solar cell parallel to the overlapping edge of the cell. A barrier like this can serve two purposes as a bypass conductor (described above). For example, in FIG. 2R , bypass conductor 40 is a barrier that tends to prevent the uncured conductive adhesive bonding material on contact pads 15 from diffusing onto the active area of the front surface of the solar cell. provides A similar arrangement can be used for backside metallization patterns.

Barriers to diffusion of the conductive adhesive bonding material may be spaced apart from the contact pads or bus bars to form a moat as described above, although this is not required. These barriers may replace adjacent contact pads or bus bars, for example as shown in FIG. 2o or FIG. 2p. In such variations, the barrier is preferably larger than the contact pad or bus bar to retain the uncured conductive adhesive bonding material on the contact pad or bus bar. Although portions of the front side metallization pattern are shown in FIGS. 2O and 2P , similar arrangements can be used for the back side metallization patterns.

Barriers to diffusion of conductive adhesive bonding material and/or moats between these barriers and contact pads or bus bars, and any conductive adhesive bonding material diffused into such moouts, may be disposed of adjacent to adjacent in the super cell. It can optionally lie within the area of the surface of the solar cell that is overlapped by the solar cell, and thus can be hidden from view and obscured from exposure to solar radiation.

Alternatively or in addition to the use of barriers as described above, the electrically conductive bonding material may be deposited using a mask or by any other suitable method that allows for accurate deposition (eg screen printing), Accordingly, reduced amounts of electrically conductive bonding material that are likely to diffuse beyond or leave the contact pads during deposition may be required.

More generally, solar cells 10 may employ any suitable front and back surface metallization patterns.

FIG. 4A shows a portion of the front surface of an exemplary rectangular super cell 100 comprising solar cells 10 as shown in FIG. 2A arranged in a shingled manner as shown in FIG. 1 . As a result of the shingling geometry, there is no physical gap between the pairs of solar cells 10 . Also, although the bus bar 15 of the solar cell 10 can be seen from one end of the super cell 100, the bus bars (or front contact pads) of the other solar cells overlap with the adjacent solar cells. hidden under the parts. As a result, the area occupied by the super cell 100 in the solar module is efficiently used. In particular, a larger portion of the area would be used to produce electricity than would be the case for conventional tabbed solar cell arrangements and solar cell arrangements that include many visible bus bars on the illustrated surface of the solar cells. can 4B-4C show front and back views, respectively, of another exemplary super cell 100 that primarily includes chamfered chevron rectangular silicon solar cells, but is otherwise similar to the case of FIG. 4A .

In the example illustrated in FIG. 4A , bypass conductors 40 are hidden by overlapping portions of adjacent cells. Optionally, solar cells comprising bypass conductors 40 may overlap similarly as shown in FIG. 4A without covering the bypass conductors.

The exposed front bus bar 15 at one end of the super cell 100 and the backside metallization of the solar cell at the other end of the super cell 100 make the super cell 100 into other super cells. and/or negative and positive (terminal) end contacts for the super cell that can be used to electrically connect to other electrical components if desired.

Adjacent solar cells in super cell 100 may overlap in any suitable amount, for example from about 1 millimeter (mm) to about 5 mm.

As shown in FIGS. 5A-5G , for example, the shingled super cells as described above can efficiently fill the area of a solar module. These solar modules can be, for example, square or rectangular. Rectangular solar modules as illustrated in FIGS. 5A-5G may have short sides, eg, having a length of about 1 meter and long sides, eg, having a length of about 1.5 meters to about 2.0 meters. can Any other suitable shapes and dimensions for the solar modules may also be used. Any suitable arrangement of super cells within a solar module may be used.

In a square or rectangular solar module, the super cells are typically arranged in rows parallel to the short side or long side of the solar module. Each column may contain one, two or more super cells arranged end-to-end. A super cell 100 forming part of such a solar module may include any suitable number of solar cells 10 and may be of any suitable length. In some variations, the super cells 100 each have a length approximately equal to the length of the short sides of the rectangular solar module of which they are a part. In other variations, the super cells 100 each have a length approximately equal to half the length of the short sides of the rectangular solar module of which they are a part. In other variations, the super cells 100 each have a length approximately equal to the length of the long sides of the rectangular solar module of which they are a part. In other variations, the super cells 100 each have a length approximately equal to half the length of the long sides of the rectangular solar module of which they are a part. The number of solar cells required to make super cells of these lengths depends of course on the dimensions of the solar module, the dimensions of the solar cells, and the amount of overlap of adjacent solar cells. Any other suitable lengths for super cells may also be used.

In variants where the super cell 100 has a length approximately equal to the length of the short sides of a rectangular solar module, the super cell has dimensions of, for example, about 19.5 millimeters (mm) times about 156 mm. 56 rectangular solar cells with an adjacent solar cell overlapping by about 3 mm. Eight such rectangular solar cells can be separated from a conventional square or pseudo square 156 mm wafer. Optionally, such a super cell may comprise, for example, 38 rectangular solar cells having dimensions of about 26 mm by about 156 mm, with adjacent solar cells overlapping by about 2 mm. . Six such rectangular solar cells can be separated from a conventional square or pseudo-square 156 mm wafer. In variants where the super cell 100 has a length approximately equal to half the length of the short sides of a rectangular solar module, the super cell has a length of, for example, about 19.5 millimeters (mm) times about 156 millimeters. It may include 28 rectangular solar cells having dimensions, adjacent solar cells overlapping by about 3 mm. Optionally, such a super cell may comprise, for example, 19 rectangular solar cells having dimensions of about 26 mm by about 156 mm, with adjacent solar cells overlapping by about 2 mm. .

In variants in which the super cell 100 has a length approximately equal to the length of the long sides of a rectangular solar module, the super cell comprises, for example, 72 pieces having dimensions of about 26 mm times about 156 mm. It may include rectangular solar cells, and adjacent solar cells may overlap by about 2 mm. In variants where the super cell 100 has a length approximately equal to half the length of the long sides of a rectangular solar module, the super cell has dimensions of, for example, about 26 mm times about 156 mm. It may contain 36 rectangular solar cells, with adjacent solar cells overlapping by about 2 mm.

5A shows an exemplary rectangular solar module 200 comprising twenty rectangular super cells 100 each having a length approximately equal to half the length of the short sides of the solar module. The super cells are arranged end-to-end in pairs to form ten rows of super cells, the rows and long sides of the super cells being oriented parallel to the short sides of the solar module. In other variations, each row of super cells may include three or more super cells. Also, a similarly constructed solar module may include more or fewer rows of super cells than shown in this example (Fig. shows a solar module comprising twenty-four rectangular super cells).

In variations in which the super cells in each row are arranged such that at least one of them has a front end contact on the end of a super cell adjacent to another super cell in the row, the gap 210 shown in FIG. 5A ) makes it possible to make electrical contact to the front end contacts (eg exposed bus bars or discrete contacts 15 ) of super cells 100 along the centerline of the solar module. For example, the two super cells in a row are arranged into one super cell having its front terminal contact along the centerline of the solar module and the other super cell having its rear terminal contact along the centerline of the solar module. can be In such an arrangement, the two super cells in a row are arranged along the centerline of the solar module and have an interconnect coupled to the front terminal contact of the one super cell and the back terminal contact of the other super cell. can be electrically connected in series by (see, for example, FIG. 8C discussed below). In variants where each row of super cells includes three or more super cells, additional gaps between super cells may exist, similarly for front end contacts positioned away from the sides of the solar module. It may be possible to make an electrical contact.

5B shows an exemplary rectangular solar module 300 comprising ten rectangular super cells 100 each having a length approximately equal to the length of the short sides of the solar module. The super cells are arranged in ten parallel rows with their long sides oriented parallel to the short sides of the module. A similarly constructed solar module may include more or fewer rows of super cells of this side length shown in this example.

FIG. 5B also shows how the solar module 200 of FIG. 5A would look when there are no gaps between adjacent super cells within the rows of super cells in the solar module 200 . The gap 210 of FIG. 5A may be eliminated, for example, by arranging the super cells such that both super cells in each row have their back end contacts along the centerline of the module. In this case, the super cells can be arranged near each other with little or no additional gaps between them since access to the front surface of the super cell is not required along the center of the module. Optionally, two super cells 100 in a row have one front end contact along the side of the module and a rear end contact along the centerlines of the module, the other having its front end contact along the centerline of the module. Adjacent ends of the super cells may be arranged overlapping with end contacts and rear end contacts thereof along opposite sides of the module. The overlapping ends of the super cells without obscuring any portion of the front surface of the solar module such that a flexible interconnect provides electrical connection to one front end contact of the super cells and the back end contact of the other super cell. may be interposed between them. For columns containing three or more super cells, a combination of these two approaches can be used.

The super cells and columns of super cells shown in 5A-5B may be interconnected, for example, by any suitable combination of series and parallel electrical connections as further described below with respect to FIGS. 10A-15 . Interconnections between super cells may be made using flexible interconnects, for example similar to that described below with respect to FIGS. 5C-5G and subsequent figures. As evidenced by many of the examples described herein, the super cells in the solar modules described herein may be coupled in series to provide an output voltage for the module substantially the same as in the case of a conventional solar module. They may be interconnected by parallel connections. In such cases, the output current from the solar module may also be substantially the same as for a conventional solar module. Optionally, as further described below, the super cells within the solar module may be interconnected to provide an output voltage from the solar module that is significantly higher than would be provided by conventional solar modules.

5C shows an exemplary rectangular solar module 350 comprising six rectangular super cells 100 each having a length approximately equal to the length of the long sides of the solar module. The super cells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the module. A similarly configured solar module may include more or fewer rows of super cells of this side length in this example. In this example (and in some of the following examples), each super cell contains 72 rectangular solar cells each having a width approximately equal to 1/6 the width of a 156 mm square or pseudo square wafer. Any other suitable number of rectangular solar cells of any other suitable dimensions may also be used. In this example, the front terminal contacts of the super cells are electrically connected to each other with flexible interconnects 400 that are positioned adjacent to and run parallel to the edge of one short side of the module. The backside terminal contacts of the super cells are similarly positioned adjacent to the edge of the other short side of the back of the solar module and electrically connected to each other by parallel running flexible interconnects. The back interconnects are hidden from view in FIG. 5C . This arrangement electrically connects the six module length super cells in parallel. Details of the flexible interconnects and their placement in these and other solar module configurations are discussed in greater detail below with respect to FIGS. 6-8G.

5D shows an exemplary rectangular solar module 360 comprising twelve rectangular super cells 100 each having a length approximately equal to half the length of the long sides of the solar module. The super cells are arranged end-to-end in pairs to form six rows of super cells, the rows and long sides of the super cells oriented parallel to the long sides of the solar module. In other variations, each row of super cells may include three or more super cells. Also, a similarly constructed solar module may include more or fewer rows of super cells shown in this example. In this example (and in some of the examples that follow), each super cell contains 36 rectangular solar cells each having a width approximately equal to one-sixth the width of a 156 mm square or pseudo-square wafer. Any other suitable number of rectangular solar cells of any other suitable dimensions may also be used. The gap 410 makes it possible to make electrical contact to the front end contacts of the super cells 100 along the centerline of the solar module. In this example, flexible interconnects 400 running parallel and positioned adjacent to the edge of one short side of the module electrically interconnect the six front terminal contacts of the super cells. Similarly, flexible interconnects running parallel and positioned adjacent to the edge of the other short side of the module behind the module electrically connect the backside terminal contacts of the other six super cells. Flexible interconnects (not shown in this figure) located along gap 410 interconnect each pair of super cells in a row in series and optionally extend laterally to interconnect adjacent rows in parallel. . This arrangement electrically connects the six rows of super cells in parallel. Optionally, in the first group of super cells a first super cell in each column is electrically connected in parallel with the first super cell in respective other columns, and wherein the second super cell in a second group of super cells comprises: electrically connected in parallel with the second super cell in each of the other columns, the two groups of super cells being electrically connected in series. The latter arrangement allows two groups of each of the super cells to be individually input in parallel with a bypass diode.

Detail A of FIG. 5D identifies the location of the cross-sectional view shown in FIG. 8A of the interconnection of the backside terminal contacts of the super cells along the edge of one short side of the module. Detail B similarly identifies the location of the cross-sectional view shown in FIG. 8B of the interconnection of the front terminal contacts of the super cells along the other short side of the module. Detail C identifies the location of the cross-sectional view shown in FIG. 8C of the series interconnection of the super cells in a row along gap 410 .

FIG. 5E is FIG. 5C except that in this example the solar cells from which the super cells are formed are all chevron solar cells with chamfered corners corresponding to the corners of the pseudo-square wafers from which the solar cells were separated. Shows an exemplary rectangular solar module 370 configured similarly to the case of .

5F is similar to the case of FIG. 5C, except that the solar cells from which the super cells are formed in this example include a mix of chevron and rectangular solar cells to reproduce the shapes of the pseudo-square wafers from which they were separated. It shows another example rectangular solar module 380 that is constructed. In the example of FIG. 5F , the chevron solar cells and the rectangular solar cells may be wider orthogonal to their long axes than the rectangular solar cells to compensate for the deviated corners on the chevron cells, thus They have the same active area exposed to solar radiation during operation of the module and thus a matching current.

5G shows the case of FIG. 5E (i.e., only chevron solar cells shows another example rectangular solar module configured similarly to (including This maximizes the length of each overlapping joint, thus enabling heat flow through the super cell.

Other configurations of rectangular solar modules may include one or more rows of super cells formed only from rectangular (unchamfered) solar cells and one or more rows of super cells formed only from chamfered solar cells. can For example, a rectangular solar module may be configured similarly to the case of FIG. 5c except that it has two outer rows of super cells each replaced by a row of super cells formed only of chamfered solar cells. . The chamfered solar cells in these rows may be arranged in mirror image pairs, for example as shown in FIG. 5G .

In the exemplary solar modules shown in FIGS. 5C-5G , the current along each row of super cells is about one-sixth the activity of the rectangular solar cells from which the super cells are formed would be of a conventional sized solar cell. Because it has an area, it is about 1/6 of that of a conventional solar module of the same area. However, since the six rows of super cells are electrically connected in parallel in these examples, the exemplary solar modules can generate the same total current as would be generated by a conventional solar module of the same area. This enables substation of the exemplary solar modules of FIGS. 5C-5G (and other examples described below) relative to conventional solar modules.

6 illustrates an exemplary arrangement of three rows of super cells interconnected with flexible electrical interconnects to place the super cells in each row in series with each other and to put the rows in parallel with each other in greater detail than FIGS. 5C-5G. . These could be, for example, three rows in the solar module of FIG. 5D . In the example of Figure 6, each super cell 100 has a flexible interconnect 400 that is conductively coupled to its front terminal contact and another flexible interconnect is conductively coupled to its back terminal contact. The two super cells in each row are electrically connected in series by a shared flexible interconnect that is conductively coupled to the front terminal contact of one super cell and the back terminal contact of the other super cell. Each flexible interconnect is positioned adjacent to and running parallel to the end of the super cell to which it is coupled, and may extend laterally beyond the super cell to conductively bond to a flexible interconnect on a super cell in an adjacent row, wherein the adjacent rows are coupled to each other. electrically connected in parallel. The dashed lines in FIG. 6 indicate portions of the flexible interconnects that are obscured from view by overlapping portions of the super cells, or portions of the super cells that are hidden from view by overlapping portions of the flexible interconnects.

Flexible interconnects 400 may be conductively bonded to the super cells, for example, with a mechanically flexible and electrically conductive bonding material as described above for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding material reduces stress parallel to the edges of the super cell resulting from a mismatch between the coefficient of thermal expansion of the electrically conductive bonding material or the interconnects and that of the super cell. or located at discrete locations along the edges of the super cell rather than in a continuous line extending substantially the length of the edge of the super cell to accommodate the

Flexible interconnects 400 may be formed from or may include, for example, thin copper sheets. Flexible interconnects 400 may be selectively patterned to increase their mechanical compliance (flexibility) both orthogonal and parallel to the edges of the super cells resulting from a mismatch between the CTE of the interconnect and the CTE of the super cells. may or may not be configurable. Such patterning may include, for example, slits, slots, or holes. The conductive portions of interconnects 400 may have a thickness of, for example, about 100 microns or less, about 50 microns or less, about 30 microns or less, or about 25 microns or less to increase the flexibility of the interconnects. The mechanical compliance of the flexible interconnect and its bonding to the super cells withstand stress resulting from CTE mismatch during the lamination process, which is described in more detail below for methods of fabricating shingled solar cell modules, and approximately It should be sufficient for the interconnected super cells to withstand the stress resulting from CTE mismatch during temperature cycling testing of -40°C to about 85°C.

Preferably, flexible interconnects 400 are less than or equal to about 0.015 Ohm, less than or equal to about 0.012 Ohm, or about 0.01 for current flow parallel to the ends of the super cells to which they are coupled. A resistance less than or equal to ohms.

7A shows some example configurations, denoted by reference numerals 400A-400T, that may be suitable for flexible interconnect 400 .

As shown in the cross-sectional views of FIGS. 8A-8C , for example, solar modules described herein typically contain super cells and a transparent front sheet 420 and a back sheet ( and a laminate structure having one or more encapsulant materials 4101 interposed therebetween 430 . The transparent front sheet may be, for example, glass. Optionally, the back sheet may also be transparent, which may allow double-sided operation of the solar module. The back sheet may be, for example, a polymer sheet. Optionally, the solar module can be a glass-to-glass module with glass on both the front and back sheets.

8A (Detail A from FIG. 5D ) is a cross-sectional view conductively coupled to a back terminal contact of a super cell near an edge of the solar module and extending inwardly below the super cell from the front of the solar module It shows an example of a flexible interconnect 400 that is hidden from view. An additional strip of encapsulant may be disposed between the interconnect 400 and the backside of the super cell as illustrated.

The cross-sectional view of FIG. 8B (detail B from FIG. 5B) shows an example of a flexible interconnect 400 conductively coupled to the front terminal contact of a super cell.

8C (Detail C from FIG. 5B) is a cross-sectional view of a shared flexible conductively coupled to the front terminal contact of one super cell and the back terminal contact of the other to electrically connect the two super cells in series. An example of an interconnect 400 is shown.

Flexible interconnects electrically connected to the front terminal contacts of the super cell may be constructed or arranged to occupy only a narrow width of the front surface of the solar module, and they may be positioned adjacent to the edge of the solar module, for example. . The area of the front surface of the module occupied by these interconnects may have a narrow width that is orthogonal to the edge of the super cell, for example ≦about 10 mm, ≦about 5 mm, or ≦about 3 mm. In the arrangement shown in FIG. 8B , for example, flexible interconnect 400 may be configured to extend beyond the end of the super cell by only this distance. 8D-8G show additional examples of arrangements in which a flexible interconnect electrically connected to the front terminal contact of a super cell may occupy only a narrow width of the front surface of the module. These arrangements enable efficient use of the front surface area of the module for generating electricity.

8D shows a flexible interconnect 400 that is conductively coupled to the terminal front contact of the super cell and is folded back of the super cell around the edge of the super cell. An insulating film 435 , which may be pre-applied on the flexible interconnect 400 , may be disposed between the flexible interconnect 400 and the back surface of the super cell.

8E shows a flexible interconnect 400 that also includes a thin and narrow ribbon 440 conductively coupled to the terminal front contact of the super cell and a thin and wide ribbon 445 extending behind the back of the super cell. An insulating film 435 , which may be previously applied on the ribbon 445 , may be disposed between the ribbon 445 and the rear surface of the super cell.

FIG. 8F shows a flexible interconnect 400 coupled to the terminal front contacts of a super cell and wound and pressed into a flattened coil occupying only a narrow width of the front surface of the solar module.

8G shows a flexible interconnect 400 comprising a thin ribbon section conductively coupled to terminal front contacts of a super cell and a thick cross-section portion positioned adjacent the super cell.

In FIGS. 8A-8G , flexible interconnects 400 may extend along the entire lengths of the edges of the super cells (eg, into the plane of the drawing), for example as shown in FIG. 6 .

Optionally, portions of flexible interconnect 400 that would otherwise be visible from the front of the module are dark colored to reduce the visible contrast between the interconnect and the super cell as perceived by a person with normal color vision. It may be covered with a film, coated or otherwise colored. For example, in FIG. 8C an optional black film or coating 425 covers portions of the interconnect 400 that would otherwise be visible from the front of the module. Otherwise, the visible portions of the interconnect 400 shown in the other figures may be covered or colored.

Conventional solar modules typically include three or more bypass diodes, each bypass diode connected in parallel with a series connected group of 18-24 silicon solar cells. This is done to limit the amount of power that can be dissipated as heat in a reverse biased solar cell. Solar cells can be reverse biased due to, for example, defects, dirty front surfaces, or uneven illumination that reduces their ability to pass current generated within the string. The heat generated in a solar cell in reverse bias depends on the voltage across the solar cell and the current through the solar cell. When the voltage across the reverse biased solar cell exceeds the breakdown voltage of the solar cell, the heat dissipated in the cell is equal to the breakdown voltage over the total current times generated in the string. will be. Silicon solar cells typically have a breakdown voltage of 16 volts-30 volts. Since each silicon solar cell generates a voltage of about 0.64 volts in operation, a string of 24 or more solar cells could produce a voltage across the reverse biased solar cell that exceeds the breakdown voltage.

In conventional solar modules where the solar cells are spaced apart from each other and interconnected by ribbons, heat is not easily transferred away from the hot solar cell. Accordingly, the power dissipated in the solar cell at the breakdown voltage could create hot spots in the solar cell causing significant thermal damage and possibly a fire. In conventional solar modules, a bypass diode is thus required for every group of 18-24 series connected solar cells to ensure that no solar cells in the string can be reverse biased above the breakdown voltage. became

The inventors have found that heat is readily transported along the silicon super cell through thin electrically and thermally conductive bonds between the adjacent and overlapping silicon solar cells. In addition, the current through a super cell in the solar modules described herein is a rectangular shape in which the super cells described herein typically each have a smaller (eg, 1/6) active area than that of a conventional solar cell. Because it is formed by shingling solar cells, it is typically smaller than through a string of conventional solar cells. Moreover, the rectangular aspect ratio of the solar cells employed herein typically provides extended areas of terminal contact between adjacent solar cells. As a result, less heat is dissipated within the solar cell reverse biased at the breakdown voltage, and the heat readily diffuses through the super cell and the solar module without creating hazardous hot spots. The inventors have thus recognized that solar modules formed from super cells as described herein may employ far fewer bypass diodes than would conventionally be considered required.

For example, in some variations of solar modules as described herein N > 25 solar cells, N > about 30 solar cells, N > about 50 solar cells, N > about 70 solar cells. Solar cells, or a super cell comprising N ≥ about 100 solar cells, may be employed without a single solar cell or group of <N solar cells in the super cell electrically connected in parallel with a bypass diode individually. . Optionally, the entire super cell of these lengths can be electrically connected in parallel with a single bypass diode. Optionally, super cells of these lengths may be employed without a bypass diode.

Some additional and optional design features may implement solar modules employing super cells as described herein that further withstand the heat dissipated within the reverse biased solar cell. Referring back to FIGS. 8A-8C , the encapsulant 4101 may be or include a thermoplastic olefin (TPO) polymer, and the TPO encapsulant is a standard ethylene-vinyl acetate (ethylene-vinyl acetate) polymer. EVA) is photo-thermal more stable than encapsulants. EVA will brown with temperature and UV light, resulting in hot spot problems created by current limiting cells. These problems are reduced or avoided with TPO encapsulants. In addition, the solar modules may have a glass-glass structure in which both the transparent front sheet 420 and the back sheet 430 are glass. Such glass-to-glass allows the solar module to operate stably at higher temperatures than would otherwise be tolerated by conventional polymer backsheets. Moreover, junction boxes may be mounted on one or more edges of a solar module rather than on the back of the solar module, wherein the junction box is mounted to the solar cells within the module thereon. An additional layer of thermal insulation could be added.

9A shows an exemplary rectangular solar module comprising six rectangular shingled super cells arranged in six rows extending the length of the long sides of the solar module. The six super cells are electrically connected in parallel to each other and to a bypass diode disposed within a junction box 490 on the backside of the solar module. Electrical connections between the super cells and the bypass diode are made via ribbons 450 embedded within the laminate structure of the module.

9B shows another exemplary rectangular solar module comprising six rectangular shingled super cells arranged in six rows extending the length of the long sides of the solar module. The super cells are electrically connected to each other in parallel. Separate anode 490P and cathode 490N terminal junction boxes are disposed on the back surface of the solar module at opposite ends of the solar module. The super cells are electrically connected in parallel with a bypass diode located within one of the junction boxes by an external cable 455 running between the junction boxes.

9C-9D are exemplary glass comprising six rectangular shingled super cells arranged in six rows extending the length of the long sides of the solar module in a lamination structure comprising glass front and back sheets; A glass rectangular solar module is shown. The super cells are electrically connected to each other in parallel. Separate anode 490P and cathode 490N terminal junction boxes are mounted on opposite edges of the solar module.

The shingled super cells provide module level power management devices (eg, DC/AC microinverters, DC/DC module power optimizers, voltage intelligence and smart switches, and related devices) enable unique opportunities for module layout. An important feature of the module level power management systems is power optimization. Super cells as described and employed herein are capable of producing higher voltages than traditional panels. In addition, the super cell module layout can further divide the module. Both higher voltages and increased division create potential benefits for power optimization.

9E shows one example configuration for module level power management using shingled super cells. In this figure, an exemplary rectangular solar module includes six rectangular shingled super cells arranged in six rows extending the length of the long sides of the solar module. The three pairs of super cells are individually coupled to the power management system 460, allowing for a more separate power optimization of the module.

9F shows another example configuration for module level power management using shingled super cells. In this figure, an exemplary rectangular solar module includes six rectangular shingled super cells arranged in six rows extending the length of the long sides of the solar module. The six super cells are individually coupled to the power management system 460, further allowing more discrete power optimization of the module.

9G shows another example for module level power management using shingled super cells. In this figure, an exemplary rectangular solar module includes six or more rectangular shingled super cells 998 arranged in six or more rows, wherein the three or more pairs of super cells are of the module. Individually coupled to a bypass diode or power management system 460 to enable even more discrete power optimization.

9H shows another example configuration for module level power management using shingled super cells. In this figure, an exemplary rectangular solar module includes six or more rectangular shingled super cells 998 arranged in rows of six or more, wherein the two super cells are each connected in series, and every pair are connected in parallel. A bypass diode or power management system 460 is connected in parallel to all pairs, allowing power optimization of the module.

In some variations, module level power management enables removal of all bypass diodes on the solar module while still eliminating the risk of hot spots. This is implemented by integrating voltage intelligence at the module level. By monitoring the voltage output of solar cell circuitry (eg, one or more super cells) within the solar module, a “smart switch” power management device can detect any solar cell circuitry in which such circuitry is in reverse bias. It can be determined whether or not batteries are included. When a reverse biased solar cell is detected, the power management device may disconnect the corresponding circuit from the electrical system using, for example, a relay switch or other component. For example, if the voltage of the monitored solar cell circuit falls below a predetermined limit (V _Limit ), then the power management device blocks this circuit while leaving the module or string of modules connected (open circuit). (open circuit) will do.

In certain embodiments, when the voltage of the circuits drops by more than a certain percentage or magnitude (eg, 20% or 10V) from one circuit to another within the same solar cell array, it will be shut off. The electronic device will detect this change based on the module-to-module communication.

Implementations of this voltage intelligence are implemented in existing module level power management solutions (eg, Enphase Energy Inc., Solaredge Technologies, Inc.), Tigo Energy, Inc. .) into ), or go through a custom circuit design.

The above V _limit One example of how the threshold voltage can be calculated is,

CellVocc _{@Low Irr & High Temp×} N _{number of cells in series} －Vrb _{Reverse breakdown voltage} ≤V _Limit , where

● CellVoc _{@Low Irr & High Temp} = open circuit voltage (lowest expected operating Voc) of a cell operating at low irradiation and high temperature,

● N _{number of cells in series} = the number of cells connected in series within each supercell to be monitored,

● Vrb _{Reverse breakdown voltage} = Reversed polarity voltage required to pass current to the cell.

This approach to module-level power management using smart switches allows, for example, more than 100 silicon solar cells to be connected in series within a single module without affecting stability or module reliability. In addition, such a smart switch can be used to limit the string voltage going to the central inverter (inverter). Longer module strings can thus be installed without allowing stability or concern with respect to voltage. The weakest module can be bypassed (turned off) when string voltages are raised to this limit.

10A, 11A, 12A, 13A, 13B, and 14B described below provide additional exemplary schematic electrical circuits for solar modules employing shingled super cells. 10b-1, 10b-2, 11b-1, 11b-2, 11c-1, 11c-2, 12b-1, 12b-2, 12c-1, 12c-2, 12C-3, 13C-1, 13C-2, 14C-1, and 14C-2 provide exemplary physical layouts corresponding to these schematic circuits. The description of the physical layouts above assumes that the front end contact of each super cell is negative polarity, and that the back end contact of each super cell is positive polarity. If the modules instead employ super cells with positive polarity front end contacts and negative polarity back end contacts, then the following discussion of physical layouts turns positive into negative and changes the orientation of the bypass diodes. It can be changed by inverting. Some of the various buses referred to in the description of these figures may be formed of, for example, the interconnects 400 described above. Other buses described in these figures may be implemented, for example, with ribbons or external cables embedded within the laminate structure of the solar module.

10A shows an exemplary electrical circuit for a solar module as illustrated in FIG. 5B , wherein the solar module comprises ten rectangular pieces each having a length approximately equal to the length of the short sides of the solar module; Super cells 100 are included. The super cells are arranged in the solar module with their long sides oriented parallel to the short sides of the module. All of the super cells are electrically connected in parallel with bypass diode 480 .

10B-1 and 10B-2 show an example physical layout for the solar module of FIG. 10A. A bus 485N connects the negative (front) end contacts of the super cells 100 to the positive terminal of a bypass diode 480 in a junction box 490 located on the backside of the module. Bus 485P connects the positive (rear) end contacts of the super cells 100 to the negative terminal of bypass diode 480 . Bus 485P may lie entirely behind the super cells. Bus 485N and/or its interconnection to the super cells occupy a portion of the front surface of the module.

11A shows an exemplary schematic electrical circuit for a solar module as illustrated in FIG. 5A , wherein the solar modules each have a length approximately equal to half the length of the short sides of the solar module; It includes rectangular super cells 100 , wherein the super cells are arranged end-to-end in pairs to form ten columns of super cells. The first super cell in each column is connected in parallel with the first super cells in the other columns, and is connected in parallel with the bypass diode 500 . A second super cell in each column is connected in parallel with the second super cells in other columns, and is connected in parallel with a bypass diode 510 . The two groups of super cells are connected in series as in the case of the two bypass diodes.

11B-1 and 11B-2 show an example physical layout for the solar module of FIG. 11A . In this layout, the first super cell in each row has its front (negative) end contacts along the first side of the module and its back (positive) end contacts along the centerline of the module, the first super cell in each row A 2 super cell has its front (negative) end contact along the centerline of the module and its back (positive) end contact along a second side of the module opposite the first side. Bus 515N connects the front (negative) end contact of the first super cell in each column to the positive terminal of bypass diode 500 . A bus 515P connects the back (positive) end contact of the second super cell in each row to the negative terminal of the bypass diode 510 . A bus 520 connects the back (positive) end contact of the first super cell in each row and the front (negative) end contact of the second super cell in each row to the negative terminal of the bypass diode 500 and It is connected to the positive terminal of the bypass diode 510 .

Bus 515P may lie entirely behind the super cells. Bus 515N and/or its interconnection to the super cells occupy a portion of the front surface of the module. Bus 520 may occupy a portion of the front surface of the module and may require a gap 210 as shown in FIG. 5A . Optionally, a bus 520 may lie entirely behind the super cells and electrically connect to the super cells with hidden interconnects interposed between overlapping ends of the super cells. In this case, the small gap 210 is required, or the gap 210 is not required.

11C-1 , 11C-2 and 11C-3 show another example physical layout for the solar module of FIG. 11A . In this layout, the first super cell in each row has its front (negative) end contacts along a first side of the module and its back (positive) end contacts along the centerline of the module, and The second super cell has its back (positive) end contact along the centerline of the module and its front (negative) end contact along a second side of the module opposite the first side. A bus 525N connects the front (negative) end contact of the first super cell in each column to the positive terminal of the bypass diode 500 . Bus 530N connects the front (negative) end contact of the second cell in each column to the negative terminal of bypass diode 500 and the positive terminal of bypass diode 510 . A bus 535P connects the back (positive) end contact of the first cell in each column to the negative terminal of the bypass diode 500 and the positive terminal of the bypass diode 510 . A bus 540P connects the back (positive) end contact of the second cell in each column to the negative terminal of the bypass diode 510 .

Bus 535P and bus 540P may lie entirely behind the super cells. Bus 525N and bus 530N and/or their interconnections to the super cells occupy a portion of the front surface of the module.

12A shows another exemplary schematic circuit diagram for a solar module as illustrated in FIG. 5A , wherein the solar modules each have a length approximately equal to half the length of the short sides of the solar module; It includes rectangular super cells 100 , which are arranged end-to-end in pairs to form ten columns of super cells. In the circuit shown in Fig. 12A, the super cells are arranged in four groups. In a first group the first super cells of the top five rows are connected in parallel to each other and to the bypass diode 545 , and in the second group the second super cells of the top five rows are connected to each other and to the bypass diode 545 . connected in parallel to bypass diode 505 , in a third group the first super cells of the lower five columns are connected in parallel to each other and to bypass diode 560 , in a fourth group the lower five columns The second super cells in the columns are connected in parallel to each other and to the bypass diode 555 . The four groups of super cells are connected in series with each other. The four bypass diodes are also connected in series.

12B-1 and 12B-2 show an example physical layout for the solar module of FIG. 12A. In this layout, a first group of super cells has its front (negative) end contacts along a first side of the module and its back (positive) end contacts along a centerline of the module, wherein the first group of super cells Group 2 has its front (negative) end contacts along the centerline of the module and its back (positive) end contacts along a second side of the module opposite the first side, the third group of super cells a group has its back (positive) end contacts along a first side of the module and its front (negative) end contacts along a centerline of the module, and a fourth group of super cells along the centerline of the module It has its back (positive) end contact and its front (negative) end contact along the second side of the module.

A bus 565N connects the front (negative) end contacts of the super cells in the first group of super cells to each other and to the positive terminal of the bypass diode 545 . Bus 570 connects the back (positive) end contacts of the super cells in the first group of super cells and front (negative) end contacts of the super cells in the second group of super cells to each other and It is connected to the negative terminal of the bypass diode 545 and the positive terminal of the bypass diode 550 . Bus 575 connects the back (positive) end contacts of the super cells in the second group of super cells and front (negative) end contacts of the super cells in the fourth group of super cells to each other and It is connected to the negative terminal of the bypass diode 550 and the positive terminal of the bypass diode 555 . Bus 580 connects the back (positive) end contacts of the super cells in the fourth group of super cells and front (negative) end contacts of the super cells in the third group of super cells to each other and It is connected to the negative terminal of the diode 555 and the positive terminal of the bypass diode 560 . A bus 585P connects the back (positive) end contacts of the super cells in the third group of super cells to each other and to the negative terminal of the bypass diode 560 .

Bus 585P and a portion of bus 575 connecting the super cells in the second group of super cells may lie entirely behind the super cells. The remainder of bus 575 and bus 565N and/or their interconnections to the super cells occupy a portion of the front surface of the module.

Bus 570 and bus 580 may occupy a portion of the front surface of the module and may require a gap 210 as shown in FIG. 5A . Optionally, they may lie entirely behind the super cells and be electrically connected to the super cells with hidden interconnects interposed between overlapping ends of the super cells. In this case, either a small gap 210 is required or no gap 210 is required.

12C-1 , 12C-2 and 12C-3 show alternative physical layouts for the solar module of FIG. 12A. This layout uses two junction boxes 490A, 490B instead of the single junction box 490 shown in Figs. 12B-1 and 12B-2, but otherwise in Figs. 12B-1 and 12B-2. equivalent to the case

13A shows another exemplary schematic circuit diagram for a solar module as illustrated in FIG. 5A , wherein the solar modules each have a length approximately equal to one-half the length of the short sides of the solar module; It includes rectangular super cells 100 , wherein the super cells are arranged end-to-end in pairs to form ten columns of super cells. In the circuit shown in Fig. 13A, the super cells are arranged in four groups. In the first group the first super cells of the top five rows are connected in parallel with each other, in the second group the second super cells of the top five rows are connected with each other, and in the third group the bottom five The first super cells of the columns are connected in parallel with each other, and in the fourth group the second super cells of the lower five columns are connected with each other in parallel. The first group and the second group are connected in series with each other, and thus are connected in parallel with the bypass diode 590 . The third group and the fourth group are connected in series with each other, and thus are connected in parallel with another bypass diode 595 . The first and second groups are connected in series with the third and fourth groups, and the two bypass diodes are also connected in series.

13C-1 and 13C-2 show an example physical layout for the solar module of FIG. 13A. In this layout, a first group of super cells has its front (negative) end contact along a first side of the module and its back (positive) end contact along a centerline of the module, and a second group of super cells a group having its front (negative) end contact along the centerline of the module and its back (positive) end contact along second sides of the module opposite the first side, the third group of super cells comprising: having its back surface (positive) end contact along the first side of the module and its front (negative) end contact along the centerline of the module, the fourth group of super cells having its back surface (positive) end contact along the centerline of the module a positive) end contact and a front (negative) end contact thereof along the second side of the module.

Bus 600 connects the front (negative) end contacts of the first group of super cells to each other and the back (positive) end contacts of the third group of super cells, the cathode of bypass diode 590 . terminal, and connected to the negative terminal of the bypass diode 595 . A bus 605 connects the back (positive) end contacts of the first group of super cells to each other and to the front (negative) end contacts of the second group of super cells. A bus 610P connects the back (positive) end contacts of the second group of super cells to each other and to the negative terminal of the bypass diode 590 . A bus 615N connects the front (negative) end contacts of the fourth group of super cells to each other and to the positive terminal of the bypass diode 595 . A bus 620 connects the front (negative) end contacts of the third group of super cells to each other and to the back (positive) end contacts of the fourth group of super cells.

Bus 610P and the portion of bus 600 connecting the super cells of the third group of super cells may lie entirely behind the super cells. The remainder of bus 600 and bus 615N and/or their interconnections to the super cells occupy a portion of the front surface of the module.

Bus 605 and bus 620 occupy a portion of the front surface of the module and require a gap 210 as shown in FIG. 5A. Optionally, they may lie entirely behind the super cells and be electrically connected to the super cells with hidden interconnects interposed between overlapping ends of the super cells. In this case, a small gap 210 is required or no gap 210 is required.

13B shows an exemplary schematic circuit diagram for a solar module as illustrated in FIG. 5B , wherein the solar module has ten rectangular superstructures having a length approximately equal to the length of the short sides of the solar module; cells 100 . The super cells are arranged in the solar module with their long sides oriented parallel to the short sides of the module. In the circuit shown in Fig. 13B, the super cells are arranged in two groups. In the first group the top five super cells are connected in parallel to each other and bypass diode 590 , and in the second group the bottom five super cells are connected in parallel to each other and bypass diode 595 . is connected to The two groups are connected in series with each other. The bypass diodes are also connected in series.

The schematic circuit of FIG. 13B is different from the case of FIG. 13A in that each row of the two super cells of FIG. 13A is replaced by a single super cell. Accordingly, the physical layout of the solar module of FIG. 13B may be as shown in FIGS. 13C-1, 13C-2, and 13C-3 because the bus 605 and the bus 620 are omitted.

14A shows an exemplary rectangular solar module 700 comprising twenty-four rectangular super cells 100 each having a length approximately equal to half the length of the short sides of the solar module. Super cells are arranged end to end in pairs to form twelve rows of super cells, the rows and long sides of the super cells being oriented parallel to the short sides of the solar module.

14B shows an exemplary schematic circuit diagram for a solar module as illustrated in FIG. 14A . In the circuit shown in Fig. 14B, the super cells are arranged in three groups. In a first group the first super cells of the top eight rows are connected in parallel to each other and to the bypass diode 705 , and in the second group the super cells of the bottom four rows are bypassed to each other and to each other Connected in parallel to diode 710 , in a third group the second super cells of the top eight columns are connected in parallel to each other and to bypass diode 715 . The three groups of super cells are connected in series. The three bypass diodes are also connected in series.

14C-1 and 14C-2 show an example physical layout for the solar module of FIG. 14B. In this layout, the first group of super cells has its front (negative) end contacts along a first side of the module and its back (positive) end contacts along the centerline of the module. In the second group of super cells, the first super cell of each lower four rows has its back (positive) end contact along the first side of the module and its front (negative) end contact along the centerline of the module. ) end contacts, the second super cell of each of the lower four rows having its front (negative) end contact along the centerline of the module and its front (negative) end contact along a second side of the module opposite the first side. It has a back (positive) end contact. The third group of solar cells has its back (positive) end contacts along the centerline of the module and its back (negative) end contacts along the second side of the module.

Bus 720N connects the front (negative) end contacts of the first group of super cells to each other and to the positive terminal of bypass diode 705 . Bus 725 connects the back (positive) end contacts of the first group of super cells to the front (negative) end contacts of the second group of super cells, the negative terminal of the bypass diode 705 and the bypass It is connected to the positive terminal of the pass diode 710 . Bus 730P connects the back (positive) end contacts of the third group of super cells to each other and to the negative terminal of bypass diode 715 . Bus 735 connects the front (negative) end contacts of the third group of super cells to each other and the back (positive) end contacts of the second group of super cells, of the bypass diode 710 . It is connected to the negative terminal and the positive terminal of the bypass diode 715 .

A portion of bus 725, bus 730P, coupled to the super cells of the first group of super cells, and a part of bus 735 coupled to super cells of the second group of super cells are the super cells as a whole. can be placed behind Bus 720N and the rest of bus 725 and bus 735 and/or their interconnections to the super cells occupy a portion of the front surface of the module.

Some of the examples described above accommodate the bypass diodes in one or more junction boxes on the backside of the solar module. However, this is not required. For example, some or all of the bypass diodes may be located in-plane with the super cells around the perimeter of the solar module, in gaps between super cells, or located behind the super cells. there is. In such cases, the bypass diodes may be disposed, for example, in a laminate structure in which the super cells are encapsulated. The positions of the bypass diodes can thus be decentralized and removed from the junction boxes, for example two that can be located on the back side of the solar module near the outer edges of the solar module. Two separate single-terminal junction boxes can replace a central junction box having both positive and negative module terminals. This approach generally reduces the current path length in ribbon conductors within the solar module and in the cabling between solar modules, which can both reduce material cost and increase module power. There is (by reducing resistive power losses).

Referring to FIG. 15 , for example, a physical layout for various electrical interconnections for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 10A is a bypass diode positioned within the super cell laminate structure. 480 and two single terminal junction boxes 490P, 490N may be employed. FIG. 15 may be understood to be the best compared to FIGS. 10B-1 and 10B-2. Other module layouts described above may be similarly modified.

The use of bypass diodes in a laminate as described above allows the power dissipated in the bypass diode forward-biased by the reduced current solar cells than would be possible in conventional sized solar cells. can be made possible by the use of reduced current (reduced area) rectangular solar cells as described above. The bypass diodes in the solar modules described herein may thus require less heat-sinking than conventional ones, and as a result can be moved out of the junction box on the backside of the module and into the laminate. .

A single solar module may include interconnects, other conductors and/or bypass diodes supporting two or more electrical configurations, for example supporting two or more of the electrical configurations described above. In such cases, the specific configuration for the operation of the solar module may be selected from two or more options comprising, for example, the use of switches and/or jumpers. Other configurations may put different numbers of super cells in series and/or parallel to provide different combinations of voltage and current outputs from the solar module. Such a solar module could thus be a factory or field that can be configured to be selected from, for example, two or more different voltage and current combinations to select between a high voltage and low current configuration and a low voltage and high current configuration. there is.

16 shows an exemplary arrangement of a smart switch module level power management device 750 between two solar modules as described above.

Referring now to FIG. 17 , an exemplary method 800 for making solar modules as disclosed herein includes the following steps. In step 810, conventionally sized solar cells (eg, 156 millimeters by 156 millimeters or 125 millimeters by 125 millimeters) are cut and/or cut to form rectangular solar cell “strips” ( See also, for example, FIGS. 3A-3E and related description). The resulting solar cell strips can be selectively tested and classified according to their current-voltage performance. Cells that match or approximately match the current-voltage performance may advantageously be used in the same super cell or in the same columns of series-connected super cells. For example, it may be advantageous for cells connected in series within a super cell or column of super cells to produce a matched or approximately matched current under the same illumination.

In step 815, super cells are assembled from the strip solar cells with a conductive adhesive bonding material disposed between overlapping portions of adjacent solar cells within the super cells. The conductive adhesive bonding material may be applied by, for example, ink jet printing or screen printing.

In step 820, heat and pressure are applied to cure or partially cure the conductive adhesive bonding material between the solar cells in the super cells. In one variant, as each additional solar cell is added to a super cell, the conductive adhesive bonding material between the newly added solar cell and its adjacent and overlapping solar cells (already part of the super cell) is applied to the next solar cell. is cured or partially cured before being added to the super cell. In another variation, two or more solar cells or all solar cells in a super cell can be positioned in a desired overlapping manner before the conductive adhesive bonding material is cured or partially cured. The super cells resulting from this step can be selectively tested and classified according to their current-voltage performance. Super cells with matched or approximately matching current-voltage performance can advantageously be used in the same row of super cells or in the same solar module. For example, it may be advantageous for super cells or columns of super cells that are electrically connected in parallel to generate matching or approximately matching voltages under the same illumination.

In step 825, the cured or partially cured super cells are arranged in a desired module configuration into a layered structure comprising an encapsulant material, a transparent front (sunside) sheet and (optionally transparent) back sheet. and are interconnected The layered structure may include, for example, a first layer of encapsulant on a glass substrate, interconnected super cells arranged under the sun side of the first layer of encapsulant, a second layer of encapsulant in a layer of super cells, and and a back sheet on the second layer of encapsulant. Any other suitable arrangement may also be used.

In lamination step 830, heat and pressure are applied to the layered structure to form a cured laminate structure.

In one variant of the method of Figure 17, the conventionally sized solar cells are separated into solar cell strips, after which the conductive adhesive bonding material is applied to each individual solar cell strip. In an optional variant, the conductive adhesive bonding material is applied to the conventionally sized solar cells prior to separation of the solar cells into solar cell strips.

In curing step 820, the conductive adhesive bonding material may be fully cured or partially cured. In the latter case, the conductive adhesive bonding material may be initially partially cured in step 820 and fully cured during a subsequent lamination step 830 to sufficiently facilitate handling and interconnection of the super cells.

In some variations, the super cell 100 assembled as an intermediate product in the method 800 is at opposite ends of the super cell and long sides of adjacent solar cells that are overlapped and conductively coupled as described above. and a plurality of rectangular solar cells (10) arranged with interconnects coupled to terminal contacts.

30A shows an exemplary super cell having electrical interconnects coupled to its front and back terminal contacts. The electrical interconnects run parallel to the terminal edges of the super cell and extend laterally past the super cell to enable electrical interconnection with an adjacent super cell.

30B shows two super cells of FIG. 30A connected in parallel. Portions of the interconnects that would otherwise be visible from the front of the module may be covered or colored to reduce the visual contrast between the interconnect and the super cells as perceived by a person with normal color vision (e.g. For example, dark). In the example illustrated in FIG. 30A, an interconnect 850 is conductively coupled to a front side terminal contact of a first polarity (eg, + or −) at one end (right side of the figure) of the super cell, and the other interconnect 850 is conductively coupled to a rear side terminal contact of opposite polarity at the other end of the super cell (left side of the figure). Similar to the other interconnects described above, interconnects 850 may be conductively bonded to the super cell with, for example, the same conductive adhesive bonding material used between solar cells, although this is not required. In the illustrated example, a portion of each interconnect 850 extends beyond the edge of the super cell 100 in a direction orthogonal to the long axis of the super cell (and parallel to the long axes of the solar cells 10 ). do. As shown in FIG. 30B , this allows two or more super cells 100 to be located loosely, and interconnects 850 of one super cell are adjacent to each other to electrically interconnect the two super cells in parallel. Overlapping and conductively coupled to the corresponding interconnects 850 on the super cell. Several of these interconnects 850 interconnected in series as described above may form a bus for the module. Such an arrangement may be suitable, for example, when individual super cells extend the full width or full length of the module (eg, FIG. 5B ). Also, interconnects 850 may be used to electrically connect the terminal contacts of two adjacent super cells in columns of super cells in series. These interconnected pairs or long strings of super cells in a row are adjacent to each other by overlapping and conductively bonding interconnects 850 in one row with interconnects 850 in an adjacent row as shown in FIG. 30B . It can be electrically connected in parallel with similarly interconnected super cells in a row.

Interconnect 850 may, for example, be die cut from a conductive sheet, and stress perpendicular and parallel to the edge of the super cell resulting from a mismatch between the CTE of the interconnect and the CTE of the super cell. can be selectively patterned to increase its mechanical compliance both orthogonal and parallel to the edge of the super cell to reduce or accommodate Such patterning may include, for example, slits, slots, or holes (not shown). The mechanical compliance of interconnect 850 and its coupling or bonding to the super cell must be sufficient for the connections to the super cell to withstand stress resulting from CTE mismatch during the lamination process described in more detail below. Interconnect 850 may be coupled to the super cell, for example, with a mechanically flexible and electrically conductive bonding material as described above for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding material reduces stress parallel to the edges of the super cell resulting from a mismatch between the coefficient of thermal expansion of the electrically conductive bonding material or the interconnects and that of the super cell. or located only at discrete locations along the edges of the super cell rather than in a continuous line extending substantially the length of the edge of the super cell to accommodate

The interconnect 850 can be cut from, for example, a thin copper sheet, and the super cells 100 are formed from solar cells having smaller areas than standard silicon solar cells, thus resulting in lower currents than is the case in the prior art. can be thinner than conventional conductive interconnects when operating in For example, interconnects 850 may be formed from a copper sheet having a thickness of about 50 microns to about 300 microns. Interconnects 850 may be thin enough and flexible to fold around and behind the edge of the super cell to which they are coupled, similar to the interconnects described above.

19A-19D illustrate some example arrangements in which heat and pressure may be applied during method 800 to cure or partially cure the conductive adhesive bonding material between adjacent solar cells within the super cells. Any other suitable arrangement may also be employed.

In FIG. 19A , heat and local pressure may be applied to one joint (overlapping region) of conductive adhesive bonding material 12 at a time to cure or partially cure conductive adhesive bonding material 12 . The super cell may be supported by the surface 1000 , and pressure may be mechanically applied to the joint from above, for example with a bar, pin or other mechanical contact. Heat may be applied to the joint, for example with hot air (or other hot gas) or an infrared lamp, or by heating the mechanical contact that applies local pressure to the joint.

In FIG. 19B , the batch of FIG. 19A can be extended to a batch process that simultaneously applies heat and local pressure to multiple connection sites within a super cell.

In FIG. 19C , an uncured super cell is sandwiched between release liners 1015 and reusable thermoplastic sheets 1020 , and supported by a surface 1000 , a carrier plate ) (1010). The thermoplastic material of the sheets 1020 is selected to melt at the temperature at which the super cells are cured. Release liners 1015 may be formed, for example, from fiberglass and PTFE, and do not adhere to the super cell after the curing process. Preferably, release liners 1015 are formed from materials having a coefficient of thermal expansion that matches or substantially matches that of the solar cells (eg, the CTE of silicon). The point is that if the CTE of the release liners differs too much from the CTE of the solar cells, then the solar cells and the release liners will lengthen by different amounts during the curing process, which causes the super cell at the connection site. This is because there will be a tendency for them to fall off in the longitudinal direction. A vacuum bladder 1005 is placed over this arrangement. The uncured super cell is heated from below, for example through surface 1000 and carrier plate 1010 , and a vacuum is created between bladder 1005 and support surface 1000 . As a result, bladder 1005 applies hydrostatic pressure to the super cell through the molten thermoplastic sheets 1020 .

In FIG. 19D , an uncured super cell is carried by a moving belt 1025 perforated through an oven 1035 that heats the super cell. A vacuum applied through the perforations in the belt draws the solar cells 10 towards the belt, thereby applying pressure to the joints between them. The conductive adhesive bonding material in these joint areas is cured as the super cell passes through the oven. Preferably, the perforated belt 1025 is formed from materials having a CTE that matches or substantially matches the CTE of the solar cells (eg, the CTE of silicon). The point is that if the CTE of the belt 1025 is too different from the CTE of the solar cells, then the solar cells and the belt will lengthen in different amounts in the oven 1035, which will cause the super This is because there will be a tendency for the cells to fall off in the longitudinal direction.

Method 800 of FIG. 17 includes distinct super cell curing and lamination steps, producing an intermediate super cell product. In contrast, in method 900 shown in FIG. 18 , the super cell curing and lamination steps are combined. In step 910, conventionally sized solar cells (eg, 156 millimeters by 156 millimeters or 125 millimeters by 125 millimeters) are cut and/or cut to form narrow rectangular solar cell strips. The resulting solar cell strips can be selectively tested and sorted.

In step 915, the solar cell strips are arranged in a desired module configuration in a layered structure comprising an encapsulant material, a transparent front (sunside) sheet and a back sheet. The solar cell strips are arranged as super cells having an uncured conductive adhesive bonding material disposed between overlapping portions of adjacent solar cells within the super cells (the conductive adhesive bonding material may be, for example, inkjet may be applied by printing or screen printing). Interconnects are arranged to electrically interconnect the uncured super cells in a desired configuration. The layered structure is, for example, a first layer of encapsulant on a glass substrate, the interconnected super cells arranged below the sun side on the first layer of encapsulant. a second layer of encapsulant in a layer of super cells, and a back sheet on the second layer of encapsulant. Any other suitable arrangement may also be used.

In lamination step 920 , heat and pressure are applied to the layered structure to cure the conductive adhesive bonding material in the super cells and form a cured laminate structure. The conductive adhesive bonding material used to bond interconnects to the super cells may also be cured in this step.

In one variant of method 900, the conventionally sized solar cells are separated into solar cell strips, after which the conductive adhesive bonding material is applied to each individual solar cell strip. In an optional variant, the conductive adhesive bonding material is applied to the conventionally sized solar cells prior to separation of the solar cells into solar cell strips. For example, a plurality of conventionally sized solar cells can be placed on a large template, a conductive adhesive bonding material can then be dispersed on the solar cells, and the solar cells are then simultaneously placed on a large fixture. (fixture) can be separated into solar cell strips. The resulting solar cell strips can then be transferred as a group and arranged in the desired module configuration as described above.

As noted above, in some variations of method 800 and method 900, the conductive adhesive bonding material is applied to the conventionally sized solar cells prior to separating the solar cells into solar cell strips. The conductive adhesive bonding material does not cure (ie, still "wet") when the conventionally sized solar cell is separated to form the solar cell strips. In some of these variations, the conductive adhesive bonding material is applied to a conventionally sized solar cell (eg, by inkjet or screen printing), and then the solar cell is cut so that a laser forms the solar cell strips. It is used for scribe lines on the solar cell that define locations where the solar cell is cut, after which the solar cell is cut along the scribe lines. In these variations, the laser power and/or distance between the scribe lines and the adhesive bonding material may be selected to avoid incidentally or partially curing the conductive adhesive bonding material with heat from the laser. there is. In other variations, a laser is used on scribe lines on a conventionally sized solar cell defining locations where the solar cell is cut to form the solar cell strips, after which the conductive adhesive bonding material is applied to the solar cell. (eg, by inkjet or screen printing), and then the solar cell is cut along the scribe lines. In the latter variants, it may be desirable to implement the step of applying the conductive adhesive bonding material without incidentally cutting or breaking the scribed solar cell during this step.

Referring again to FIGS. 20A-20C , FIG. 20A schematically illustrates a side view of an exemplary device 1050 that may be used to cut scribed solar cells to which a conductive adhesive bonding material has been applied (a conductive adhesive bonding material of scribing and application could occur in any order). In this device, a scribed conventionally sized solar cell 45 to which a conductive adhesive bonding material has been applied is carried by a perforated moving belt 1060 above the curved portion of a vacuum manifold 1070 . As the solar cell 45 passes over the curved portion of the vacuum manifold, a vacuum applied through the perforations in the belt draws the underside of the solar cell 45 against the vacuum manifold, thus Bend the battery. The radius of curvature R of the curved portion of the vacuum manifold may be selected such that the solar cell 45 bent in this way cuts the solar cell along the scribe lines. Advantageously, the solar cell 45 can be cut in this way without contacting the top surface of the solar cell 45 to which the conductive adhesive bonding material has been applied.

If it is desired for the cutting to start at one end of the scribe line (ie at one edge of the solar cell 45 ), it is for example that one end of each scribe line curves in the vacuum manifold before the other end. It can be implemented with apparatus 1050 of FIG. 20A by arranging the scribe lines oriented at an angle θ with respect to the vacuum manifold to reach a portion of As shown in FIG. 20B , for example, the solar cells may be oriented with their scribe lines oblique to the direction of travel of the belt and a manifold oriented orthogonal to the direction of travel of the belt. As another example, FIG. 20C shows cells oriented in an oblique manifold and their scribe lines orthogonal to the direction of travel of the belt.

Any other suitable apparatus may also be used to cut scribed solar cells to which the conductive adhesive bonding material has been applied to form strip solar cells having the conductive adhesive bonding material previously applied. Such a device may, for example, use rollers to apply pressure to the top surface of the solar cell to which the conductive adhesive bonding material has been applied. In these cases, it is preferable that the rollers contact only the top surface of the solar cell in areas where the conductive adhesive bonding material has not been applied.

In some variations, solar modules include super cells arranged in rows on a white or otherwise reflective back sheet such that some of the solar radiation that passes without being initially absorbed by the solar cells generates electricity. to be reflected back to the solar cells by the back sheet. The reflective backsheet may be visible through the gaps between the rows of super cells, which would result in a solar module appearing to have rows of parallel bright (eg white) lines running across its front surface. can Referring to FIG. 5B , for example, parallel and dark lines between the rows of the super cells 100 may appear as white lines when the super cells 100 are arranged on a white back sheet. there is. This may be aesthetically unsatisfactory, for example, for some uses of the solar modules on roof tops.

Referring to FIG. 21 , in order to improve the aesthetic appearance of the solar module, some variations include dark stripes 1105 located at positions corresponding to gaps between the rows of super cells arranged on the back sheet. ) employs a white back sheet 1100 containing. Stripes 1105 are wide enough so that the white portions of the back sheet cannot be seen through the gaps between the rows of super cells in the assembled module. This reduces the visual contrast between the super cells and the back sheet when perceived by a person with normal color vision. The resulting module includes a white back sheet, but may have a front face similar in appearance to, for example, the modules illustrated in FIGS. 5A-5B . Dark stripes 1105 may be created, for example, with lengths of dark tape or in any other suitable manner.

As mentioned above, the shading of individual cells in solar modules can create 'hot spots', in which case the power of unshaded cells is dissipated within the shaded cell. This dissipated power creates localized temperature spikes that can degrade the modules.

To minimize the potential severity of these hot spots, bypass diodes have conventionally been inserted as part of the module. The maximum number of cells between the bypass diodes is set to limit the maximum temperature of the module and prevent irreversible damage to the module. Standard layouts for silicon cells may utilize a bypass diode for all 20 or 24 cells whose number is determined by the typical breakdown voltage of the silicon cells. In certain embodiments, the breakdown voltage may be in the range of about 10V-50V. In certain embodiments, the breakdown voltage may be about 10V, about 15V, about 20V, about 25V, about 30V, or about 35V.

According to embodiments, shingling of strips of cut solar cells with thin thermally conductive adhesives enhances thermal contact between solar cells. This improved thermal contact enables a higher degree of thermal diffusion than traditional interconnect technologies. This thermal heat dissipation design based on shingling enables a string of solar cells longer than the twenty-four (or less) solar cells per bypass diode limited in conventional designs. This relaxation of the requirement for frequent bypass diodes due to the thermal diffusion enabled by shingling according to embodiments may provide one or more advantages. For example, it is possible to create module layouts of various solar cell string lengths that are not hidden by need to provide for a large number of bypass diodes.

According to embodiments, thermal diffusion is implemented by maintaining physical and thermal coupling with the adjacent cell. This allows for sufficient heat dissipation through the bound linking site.

In certain embodiments, this joint is maintained to a thickness of about 200 micrometers or less and runs the length of the solar cell in a segmented pattern. According to embodiments, the joint portion is about 200 micrometers or less, about 150 micrometers or less, about 125 micrometers or less, about 100 micrometers or less, about 90 micrometers or less, about 80 micrometers or less, about 70 micrometers or less, about 50 micrometers or less, or about 25 micrometers or less.

Accurate adhesive curing treatment can be important in ensuring that reliable connections are maintained while maintaining thickness to promote thermal diffusion between the bonded cells.

Allowing longer strings (eg, 24 or more cells) to run provides flexibility in the design of solar cells and modules. For example, certain embodiments may utilize strings of cleaved solar cells assembled in a shingled manner. Such configurations can utilize significantly more cells per module than conventional modules.

Without this thermal diffusion property, a bypass diode may be required for all 24 cells. When the solar cells are cut in 1/6, the bypass diodes per module can be 6 times that of a conventional module (containing 3 uncut cells), adding up to 18 diodes in total there is. Thermal diffusion thus provides a significant reduction in the number of the bypass diodes.

Moreover, for all bypass diodes, bypass circuitry is required to complete the bypass electrical path. Each diode requires two interconnection points and a conductor routed to connect them to these interconnection points. This results in complex circuitry and contributes significantly to the cost of standard layouts associated with assembling solar modules.

In contrast, thermal diffusion technology requires only one bypass diode per module or even no bypass diodes. Such a configuration simplifies the module assembly process and allows simple automated mechanisms to perform the layout manufacturing steps.

Avoiding the need for bypass protects all 24 cells, thus making the cell module easier to manufacture. Complex tap-outs in the center of the module and long parallel connections for the bypass circuitry are avoided. This thermal diffusion is achieved by creating long shingled strips of cells that run the width and/or length of the module.

In addition to providing thermal diffusion, shingling according to embodiments also reduces the amount of current dissipated within the solar cell, enabling improved hot spot performance. Specifically, the amount of current dissipated within the solar cell during hot spot conditions depends on the cell area.

Because shingling can cut cells into smaller areas, the amount of current through a cell in a hot spot condition is a function of the cut dimensions. During hot spot conditions, the current passes through the lowest resistance path, which is typically a cell level defect interface or grain boundary. Reducing this current is advantageous and minimizes reliability failures under hot spot conditions.

22A shows a top view of a conventional module 2200 utilizing traditional ribbon connections 2201 under hot spot conditions. Here, shading 2202 on one cell 2204 causes heat to be localized to that single cell.

In contrast, FIG. 22B also shows a top view of a module that utilizes thermal diffusion under hot spot conditions. Here, shading 2250 on cells 2522 generates heat inside these cells. However, this heat spreads to other electrically and thermally coupled cells 2254 within the module 2256 .

It is further noted that the benefit of reducing the dissipated current is greatly increased for polycrystalline solar cells. Such polycrystalline cells are known to perform poorly under hot spot conditions due to the high level of defect interfaces.

As indicated above, certain embodiments may employ shingling of chamfered truncated cells. In these cases, there is a thermal diffusion advantage that is reflected along the bonding line between the adjacent cell and each cell.

This maximizes the binding length of each overlapping linkage site. Since the bonding junction site is the main interface for cell-to-cell thermal diffusion, maximizing this length can ensure that optimal thermal diffusion is obtained.

23A shows one example of a super cell string layout 2300 with chamfered cells 2302 . In this configuration, the chamfered cells are oriented in the same direction, so that the conduction passages of all joined joint sites are the same (125 mm).

Shading 2306 on one cell 2304 results from reverse biasing of that cell. Heat is spread to adjacent cells. The uncoupled ends 2304a of the chamfered cell are the hottest due to the longer conduction length to the next cell.

23B shows another example of a super cell string layout 2350 with chamfered cells 2352 . In this configuration, the chamfered cells are oriented in different directions, and some of the long edges of the chamfered cells face each other. This results in conducting passages of the combined joint of two lengths of 125 mm and 156 mm.

When cell 2354 undergoes shading 2356, the configuration of FIG. 23B exhibits improved thermal diffusion along longer bond lengths. Figure 23b thus shows the thermal diffusion within the super cell with chamfered cells facing each other.

The preceding discussion has focused on assembling a plurality of solar cells (which can be cut solar cells) in a shingled manner on a common substrate. This results in the formation of a module having a single electrical interconnect-junction box (or j-box).

However, in order to amass a sufficient amount of solar energy to become available, an installation typically includes a number of such modules that are assembled together. According to embodiments, a plurality of solar cell modules may also be assembled in a shingled manner to increase the areal efficiency of the array.

In certain embodiments, a module may feature an upper conductive ribbon facing the direction of solar energy and a lower conductive ribbon facing away from the direction of solar energy.

The bottom ribbon is embedded below the cells. Thus, it does not block the incident light and does not adversely affect the areal efficiency of the module. In contrast, the top ribbon is exposed and can block incident light, adversely affecting efficiency.

According to embodiments, the modules themselves may be shingled such that the top ribbon is covered by a neighboring module. 24 shows a simplified cross-sectional view of such an arrangement 2400 , wherein the end portion 2401 of an adjacent module 2402 contributes to overlapping the top ribbon 2404 of an instant module 2406 . do. Each module itself includes a plurality of shingled solar cells 2407 .

The bottom ribbon 2408 of the instant module 2406 is embedded. It is placed on the raised side of the instant shingled module to overlap the next adjacent shingled module.

This shingled module configuration could also provide additional area on the module for other elements without adversely affecting the final exposed area of the module array. Examples of module elements that may be located within overlapping regions may include, but are not limited to, junction boxes (j-boxes) 2410 and/or bus ribbons.

25 shows another embodiment of a shingled module configuration 2500 . Here, the j-boxes 2502 , 2504 of each adjacent shingled module 2506 , 2508 are placed in a tandem arrangement 2510 to implement an electrical connection therebetween. This simplifies the construction of the array of shingled modules by eliminating wires.

In certain embodiments, the j-boxes could be reinforced and/or combined with additional structural standoffs. Such a configuration could create an integrated inclined module roof mount rack solution, where the dimensions of the junction box determine the inclination. Such an implementation may be particularly useful where the array of shingled modules is mounted on a flat roof.

When the modules comprise a glass substrate and a glass cover (glass-glass modules), the modules are the full module length without additional frame members (and thus the exposed length L resulting from the shingling) could be used for short. This shortening could allow the modules of the tilted array to withstand expected physical loads (eg, a snow load limit of 5400 Pa) without breaking under the pressure.

The use of super cell structures comprising a plurality of individual solar cells assembled in a shingled manner readily accommodates varying the length of the module to meet a specific length dictated by physical loads and other requirements. point is emphasized.

26 shows a rear (shading) view of a solar module illustrating an exemplary electrical interconnection of the front (sunside) terminal electrical contacts of a shingled super cell to a junction box on the back side of the module. The front terminal contacts of the shingled super cell may be located adjacent to an edge of the module.

26 illustrates the use of a flexible interconnect 400 in electrical contact with the front end contacts of the super cell 100 . In the illustrated example, the flexible interconnect 400 runs parallel to the end of the super cell 100 and adjacent ribbon portions 9400A and the front surface metallization pattern of the end solar cells within the super cell to which they are conductively bonded. fingers 9400B extending orthogonal to the ribbon portion to contact the ribbon portion (not shown). A ribbon conductor 9410 that is conductively coupled to interconnect 9400 connects interconnect 9400 to electrical components on the backside of the solar module of which the super cell is part (e.g., bypass diodes in a junction box and/or or module terminals) through the super cell 100 . An insulating film 9420 may be disposed between the conductor 9410 and the edge and the back surface of the super cell 100 to electrically insulate the ribbon conductor 9410 from the super cell 100 .

Interconnect 400 may optionally be folded around an edge of the super cell such that ribbon portion 9400A lies behind or partially behind the super cell. In such cases, an electrically insulating layer is typically provided between the interconnect 400 and the edge and back surfaces of the super cell 100 .

Interconnect 400 may be die cut from, for example, a conductive sheet, reducing orthogonal stress orthogonal to and parallel to the edge of the super cell resulting from a mismatch between the CTE of the interconnect and the CTE of the super cell. It can be selectively patterned to increase its mechanical compliance both orthogonal and parallel to the edges of the super cell to accommodate. Such patterning may include, for example, slits, slots, or holes (not shown). The mechanical compliance of interconnect 400 and its coupling to the super cell must be sufficient for the connection to the super cell to withstand the stresses resulting from CTE mismatch during the lamination process described in more detail below. Interconnect 400 may be coupled to a super cell, for example, with a mechanically flexible and electrically conductive bonding material as described above for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding material reduces stress parallel to the edge of the super cell resulting from a mismatch between the coefficient of thermal expansion of the electrically conductive bonding material or interconnect and that of the super cell, or to accommodate discrete locations along the edge of the super cell (eg, locations of discrete contact pads on the end solar cell) rather than as a continuous line extending substantially the length of the edge of the super cell. corresponding) can only be located.

The interconnect 400 may be cut from a thin copper sheet, for example a thin copper sheet, wherein the super cells 100 are formed from solar cells having smaller areas than standard silicon solar cells, and thus more Can be thinner than conventional conductive interconnects when operating at low currents. For example, interconnects 400 may be formed of a copper sheet having a thickness of about 50 microns to about 300 microns. Interconnect 400 may be thin enough to accommodate stresses perpendicular and parallel to the edge of the super cell resulting from a mismatch between the CTE of the interconnect and the CTE of the super cell without being patterned as described above. Ribbon conductor 9410 may be formed of, for example, copper.

27 depicts views of the back side (shading) of a solar module illustrating an exemplary electrical interconnection of two or more shingled super cells in parallel, wherein the front (solar side) terminal electrical contacts of the super cells are connected to each other. and connected to the junction box on the rear side of the module. The front terminal contacts of the shingled super cells may be located adjacent to an edge of the module.

27 illustrates the use of two flexible interconnects 400 in electrical contact with the front terminal contacts of two adjacent super cells 100 as previously described. A bus 9430 running parallel to and adjacent to the ends of the super cells 100 is conductively coupled to the two flexible interconnects to electrically connect the super cells in parallel. This scheme can be extended to interconnect additional super cells 100 in parallel if desired. Bus 9430 may be formed of a copper ribbon, for example, a copper ribbon.

Similar to that described above with respect to FIG. 26 , interconnects 400 and bus 9430 are arranged such that ribbon portions 9400A and bus 9430 lie behind or partially behind the super cells. They can be optionally folded around the edges of them. In such cases, an electrically insulating layer is typically provided between interconnects 400 and the edge and back surfaces of the super cells 100 and between the bus 9430 and the edge and back surfaces of the super cells 100 . do.

28 depicts a view of the back side (shading) of a solar module illustrating another exemplary electrical interconnection of two or more shingled super cells in parallel, wherein the front (solar side) terminal electrical contacts of the super cells are connected to each other and to a junction box on the rear side of the module. The front terminal contacts of the shingled super cells may be located adjacent to the edge of the module.

28 illustrates the use of another example flexible interconnect 9440 in electrical contact with the front end contact of the super cell 100 . In this example, flexible interconnect 9440 runs parallel to the end of super cell 100 and adjacent ribbon portion 9440A, the front surface metallization pattern of the end solar cell in the super cell to which they are conductively bonded (shown). fingers 9440B extending orthogonal to the ribbon portion to contact the ribbon portion, and fingers 9440C extending orthogonal to the ribbon portion and behind the super cell. Fingers 9440C are conductively coupled to bus 9450 . A bus 9450 runs parallel to and adjacent to the end of the super cell 100 along the back surface of the super cell 100 and may similarly be electrically connected and thus adjacent super cells to connect the super cells in parallel. It can be extended to overlap cells. A ribbon conductor 9410 conductively coupled to bus 9450 connects the super cells to electrical components on the backside of the solar module (eg, bypass diodes in a junction box and/or module terminals). electrically interconnected. Electrically insulating layers 9420 are formed between the fingers 9440C and the edge and back surfaces of the super cell 100, between the bus 9450 and the back surface of the super cell 100, and between the ribbon conductor 9410 and the It may be provided between the back surface of the super cell 100 .

Interconnect 9440 may be formed, for example, from a conductive sheet, and reduces or accommodates stresses perpendicular and parallel to the edge of the super cell resulting from a mismatch between the CTE of the interconnect and the CTE of the super cell. can be selectively patterned to increase its mechanical compliance both orthogonal to and parallel to the edges of the super cell. Such patterning may include, for example, slits, slots, or holes (not shown). The mechanical compliance of interconnect 9440 and its coupling to the super cell must be sufficient for the connection to the super cell to withstand stress resulting from CTE mismatch during the lamination process described in more detail below. Interconnect 9440 may be coupled to the super cell, for example, with a mechanically flexible and electrically conductive bonding material as described above for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding material reduces or accommodates stress parallel to the edge of the super cell resulting from a mismatch of the coefficient of thermal expansion of the electrically conductive bonding material or interconnect with that of the super cell. discrete locations along the edge of the super cell (eg, corresponding to locations of discrete contact pads on an end solar cell) rather than as a continuous line extending substantially the length of the edge of the super cell to can be located only in

Interconnect 9440 may be cut from, for example, a thin copper sheet, super cells 100 being formed from solar cells having smaller areas than standard silicon solar cells and thus with lower currents than is the case in the prior art. It can be thinner than conventional conductive interconnects when in operation. For example, interconnects 9440 may be formed of a copper sheet having a thickness of about 50 microns to about 300 microns. Interconnect 9440 may be thin enough to accommodate stresses perpendicular and parallel to the edge of the super cell resulting from a mismatch between the CTE of the interconnect and the CTE of the super cell without being patterned as described above. Bus 9450 may be formed of, for example, a copper sheet.

Fingers 9440C may be coupled to bus 9450 after fingers 9440B are coupled to the front side of super cell 100 . In such cases, the fingers 9440C may be bent away from the backside of the super cell 100 when they are coupled to the bus 9450 , for example orthogonal to the super cell 100 . Thereafter, the fingers 9440C may be bent to travel along the back surface of the super cell 100 as shown in FIG. 28 .

29 shows partial cross-sectional and perspective views of two super cells illustrating the use of a flexible interconnect between overlapping ends of adjacent super cells to electrically connect the super cells in series and to provide an electrical connection to a junction box; do. 29A shows an enlarged view of the region of interest of FIG. 29 .

29 and 29A provide electrical connections to one front end contact of the super cells and to a rear end contact of the other super cell to connect two super cells 100 in series. shows the use of an exemplary flexible interconnect 2960 to electrically interconnect and interpose in part between the overlapping ends of In the illustrated example, interconnect 2960 is obscured from view from the front of the solar module by the top of the two overlapping solar cells. In another variation, the adjacent ends of the two super cells do not overlap, and the portion of the interconnect 2960 connected to one front end contact of the two super cells is visible from the front side of the solar module. Optionally, in these variants the portion of the interconnect that would otherwise be visible from the front of the module is covered to reduce the visual contrast between the interconnect and the super cells when perceived by a person with normal color vision. may be colored or colored (eg, darkened). Interconnect 2960 extends beyond side edges of the super cells and parallel to adjacent edges of the two super cells to electrically connect the pair of super cells in parallel with pairs of similarly arranged super cells in an adjacent row. can be extended

Ribbon conductor 2970 electrically connects adjacent ends of the two super cells to electrical components on the backside of the solar module (eg, bypass diodes and/or module terminals in a junction box). It may be conductively coupled to interconnect 2960 as shown. In another variation (not shown), ribbon conductor 2970 may be electrically connected to one back contact of the overlapping super cells away from their overlapping ends instead of being conductively connected to interconnect 2960. there is. This configuration may also provide a hidden tap to one or more bypass diodes or other electrical components on the backside of the solar module.

Interconnect 2960 may be selectively die cut, for example, from a sheet of conductive material, subjecting stresses perpendicular and parallel to the edges of the super cells resulting from a mismatch between the CTE of the interconnect and the CTE of the super cells. It can be selectively patterned to increase its mechanical compliance both orthogonal and parallel to the edges of the super cells to reduce or accommodate. Such patterning may include, for example, slits, slots (as shown), or holes. The mechanical compliance of the flexible interconnect and its coupling to the super cells must be sufficient for the interconnected super cells to withstand the stress resulting from CTE mismatch during the lamination process described in detail below. The flexible interconnect may be bonded to the super cells, for example, with a mechanically flexible and electrically conductive bonding material as described above for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding material reduces stress parallel to the edge of the super cells resulting from a mismatch between the thermal expansion coefficient of the electrically conductive bonding material or the interconnect and the thermal expansion coefficient of the super cells, or to accommodate only discrete locations along the edges of the super cells rather than in a continuous line extending substantially the length of the edges of the super cells. Interconnect 2960 may be cut from a thin copper sheet, for example.

Embodiments may include one or more features described in US Patent Publication Nos. 2014/0124013 and 2014/0124014, both of which are incorporated herein by reference, the disclosures of which are for all purposes. can

Disclosed herein are high efficiency solar modules comprising silicon solar cells arranged in a shingled manner and electrically connected in series to form super cells, the super cells being arranged in physically parallel rows within the solar module. are arranged The super cells may, for example, have lengths that run essentially over the entire length or width of the solar module, or two or more super cells may be arranged end-to-end in a row. This arrangement hides the solar cell to solar cell electrical interconnections and thus can be used to create visually attractive solar modules with little or no contact between adjacent series connected solar cells.

A super cell may have any number of solar cells, including, for example, at least nineteen solar cells in some embodiments and greater than or equal to 100 silicon solar cells in certain embodiments. Electrical contacts at intermediate locations along a super cell may be desired to electrically divide the super cell into two or more series connected segments while maintaining a physically continuous super cell. These electrical connections are described herein to provide electrical tapping points that are hidden from view from the front of the solar module and thus are referred to herein as “hidden taps” in one or more of the super cells. Disclosed are the arrangements made for the back contact pads of the above silicon solar cells. The hidden tab is an electrical connection between the back of the solar cell and a conductive interconnect.

Also disclosed herein are flexible interconnects for electrically interconnecting front surface super cell terminal contact pads, rear surface super cell terminal contact pads, or hidden tap contact pads to other solar cells or other electrical components within the solar module. use is initiated.

Also disclosed herein is the use of an electrically conductive adhesive to bond flexible interconnects to the super cells with mechanically stiff bonds that force the flexible interconnects to accommodate a mismatch in thermal expansion between the flexible interconnects and the super cells; electrically coupling adjacent solar cells directly to each other within a super cell to provide mechanically flexible and electrically conductive bonds that accommodate the mismatch in thermal expansion between the super cells and the glass front sheet of the solar module The use of a conductive adhesive is disclosed. This may avoid damage to the solar module that would otherwise occur as a result of thermal cycling of the solar module.

As further described below, electrical connections to hidden tap contact pads electrically connect segments of the super cell to corresponding segments of one or more super cells in adjacent columns and/or are limited thereto. Although not used, it can be used to provide electrical connections to a solar module circuit for a variety of applications including power optimization (eg, bypass diodes, AC/DC microinverters, DC/DC converters) and reliability applications. there is.

The use of hidden tabs as described above can further enhance the aesthetic appearance of the solar module by providing a substantially all rear appearance of the solar module in combination with the hidden cell-to-cell connections, and also It is possible to increase the efficiency of the solar module by allowing a larger portion of the surface area of the module to be filled with the active areas of the solar cells.

Referring now back to the drawings for a more detailed understanding of the solar modules described herein, FIG. 1 is a shingled manner with ends of adjacent solar cells overlapping and electrically connected to form a super cell 100 . A cross-sectional view of a string of series-connected solar cells 10 arranged as Each solar cell 10 includes a semiconductor diode structure and electrical contacts to the semiconductor diode structure through which the current generated within the solar cell 10 can be provided to an external load when illuminated by light.

In the examples described herein, each solar cell 10 is a rectangular crystalline silicon solar cell having front (solar-side) and back-side (light-shielding) metallization patterns that provide electrical contact to opposite sides of an np junction. and the front surface metallization pattern is disposed on the semiconductor layer of n-type conductivity, and the back surface metallization pattern is disposed on the semiconductor layer of p-type conductivity. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements may be used as appropriate. For example, the front surface (sun side) metallization pattern may be disposed on a semiconductor layer of p-type conductivity, and the back surface (light blocking side) metallization pattern may be disposed on a semiconductor layer of n-type conductivity. there is.

Referring back to FIG. 1 , adjacent solar cells 10 in the super cell 100 are electrically conductive, electrically connecting the front surface metallization pattern of one solar cell to the rear surface metallization pattern of the adjacent solar cell. They are conductively bonded directly to each other in the areas where they overlap by means of the bonding material. Suitable electrically conductive bonding materials may include, for example, electrically conductive adhesives and electrically conductive adhesive films and adhesive tapes, and conventional solders.

31A and 31A show overlapping ends of two super cells 100 to interconnect the super cells in series by providing electrical connections to one front end contact of the super cells and a back end contact of the other. It depicts the use of an exemplary flexible interconnect 3160 partially interposed between and electrically interconnecting. In the illustrated example, interconnect 3160 is hidden from view from the front of the solar module by the top of the two overlapping solar cells. In another variation, the adjacent ends of the two super cells do not overlap, and the portion of the interconnect 3160 that connects to one front end contact of the two super cells is visible from the front side of the solar module. Optionally, in these variants the portion of the interconnect that would otherwise be visible from the front of the module is covered to reduce the visible contrast between the interconnect and the super cells when perceived by a person with normal color vision. can be colored or colored (eg darkened). Interconnect 3160 extends beyond side edges of the super cells and parallel to adjacent edges of the two super cells to connect the pairs of super cells in electrical parallel with a similarly arranged pair of super cells in an adjacent row. can be extended

Ribbon conductor 3170 electrically connects adjacent ends of the two super cells to electrical components on the backside of the solar module (eg, bypass diodes and/or module terminals in a junction box). As shown, it may be conductively connected to the interconnect 3160 . In another variation (not shown), ribbon conductor 3170 may be electrically connected to one back contact of the overlapping super cells away from their overlapping ends instead of being electrically coupled to interconnect 3160 . can This configuration may also provide a hidden tap for one or more bypass diodes or other electrical components on the backside of the solar module.

2 shows an exemplary rectangular solar module 200 comprising six rectangular super cells 100 each having a length approximately equal to the length of the long sides of the solar module. The super cells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the module. A similarly constructed solar module may include more or fewer rows of super cells of this side length than if shown in this example. In other variations, the super cells may each have a length approximately equal to the length of the short side of the rectangular solar module, with their long sides oriented parallel to the short sides of the module to be parallel It can be arranged in one column. In still other arrangements, each row may include two or more super cells electrically connected in series. The modules may have short sides, for example, having a length of about 1 meter and long sides, for example, having a length of about 1.5 meters to about 2.0 meters. Any other suitable shapes (eg, square) and dimensions for the solar modules may be used.

Each super cell in this example contains 72 rectangular solar cells each having a width approximately equal to 1/6 the width of a square or pseudo-square wafer of 156 mm. Any other suitable number of rectangular solar cells of any other suitable dimensions may also be used.

Solar cells with long and narrow aspect ratios and smaller areas than that of a standard 156 mm×156 mm solar cell are advantageously employed to reduce I ² R resistive power losses in the solar cell modules disclosed herein as illustrated can be In particular, the reduced area of solar cells 10 compared to standard sized silicon solar cells reduces the current generated within the solar cell and directly reduces resistive losses in the solar cell and series-connected string of such solar cells. reduce

A hidden tap to the back surface of a super cell may be made using, for example, electrical interconnects conductively connected to one or more hidden tap contact pads located at an edge portion of the back surface metallization pattern of the solar cell. . Optionally, a plurality of hidden tabs running substantially the entire length of the solar cell (orthogonal to the long axis of the super cell) and distributed along the length of the solar cell within the backside metallization pattern It can be implemented using interconnects that are conductively coupled to contact pads.

31A illustrates an example solar cell backside metallization pattern 3300 suitable for use with edge-connected hidden tabs. The metallization pattern comprises a series of aluminum electrical contacts 3310, a plurality of silver contact pads 3315 arranged parallel to adjacent edges of the long side of the back surface of the solar cell, and each short side of the back surface of the solar cell. and silver hidden tab contact pads 3320 arranged parallel to one adjacent edge of the sides. When the solar cell is placed in a super cell, contact pads 3315 are overlapped by and directly coupled to the front surface of an adjacent rectangular solar cell. An interconnect may be conductively coupled to one or the other of hidden tap contact pads 3320 to provide a hidden tap to the super cell (two such interconnects may be employed to provide two hidden taps if desired). there is).

In the arrangement shown in FIG. 31A , current flow for the hidden tap is through the back cell metallization and is generally parallel to the long sides of the solar cell up to the interconnect aggregation point (contact 3320 ). To enable current flow along this path, the backside metallization sheet resistance is preferably less than or equal to about 5 ohms per square, or less than or equal to about 2.5 ohms per square.

31B shows another exemplary solar cell backside metallization pattern 3301 suitable for use with hidden tabs employing a bus-like interconnect along the length of the backside of the solar cell. The metallization pattern includes a continuous aluminum electrical contact 3310, a plurality of silver contact pads 3315 arranged parallel to and adjacent to the edge of the long side of the back surface of the solar cell, and the long sides of the solar cell. and a plurality of silver hidden tab contact pads 3325 arranged in parallel rows and centered approximately on the back surface of the solar cell. An interconnect running substantially the entire length of the solar cell may be conductively coupled to hidden tap contact pads 3325 to provide a hidden tap to the super cell. Current flow to the hidden tap is primarily through an interconnect such as the bus, making the conductivity of the backside metallization pattern less critical to the hidden tap.

The location and number of hidden tap contact pads to which the hidden tap interconnect is coupled on the back surface of the solar cell affects the back surface metallization of the solar cell, the hidden tap contact pads, and the length of the current path through the interconnect. . Accordingly, the arrangement of the hidden tap contact pads may be selected to minimize resistance to current collection within the current path and through the hidden tap interconnect. In addition to the configurations shown in FIGS. 31A-31B (and FIG. 31C discussed below), suitable hidden tap contact pad arrangements may include, for example, a two-dimensional array and rows running orthogonal to the long axis of the solar cell. can In the latter case, the row of hidden tap contact pads may be positioned adjacent to a short edge of the first solar cell, for example.

31C shows another exemplary solar cell backside metallization pattern 3303 suitable for use with edge-connected hidden tabs or hidden tabs employing a bus-like interconnect along the length of the backside of the solar cell. The metallization pattern includes a continuous copper contact pad 3315 arranged parallel and adjacent to the edge of the long side of the back surface of the solar cell, a plurality of copper fingers connected to and extending orthogonally therefrom ( 3317), and a continuous copper bus hidden tab contact pad 3325 running parallel to the long sides of the solar cell and centered approximately on the backside of the solar cell. An edge-connected interconnect may be coupled to the end of the copper bus 3325 to provide a hidden tap to the super cell (either of the copper bus 3325 so that two such interconnects provide two hidden taps if desired). can be employed at the end of the Optionally, an interconnect running substantially the entire length of the solar cell may be conductively coupled to copper bus 3325 to provide a hidden tab to the super cell.

The interconnects employed to form the hidden tabs may be bonded to hidden tab contact pads in the backside metallization pattern by soldering, welding, a conductive adhesive, or any other suitable manner. For metallization patterns employing silver pads as illustrated in FIGS. 31A-31B , the interconnect may be formed of, for example, tin coated copper. Another approach is to make the hidden tab directly to the aluminum back contact 3310 with an aluminum conductor that forms an aluminum to aluminum bond, which may be formed, for example, with electrical or laser welding, soldering, or a conductive adhesive. In certain embodiments, the contacts may include annotations. In the cases described above, the backside metallization of the solar cell could lack silver contact pads (3320 (FIG. 31A) or 3325 (FIG. 31B)), whereas edge-connected or bus-like aluminum interconnects It could be coupled to the aluminum (or tin) contact 3310 at locations corresponding to these contact pads.

The differential thermal expansion between hidden tap interconnects (or interconnects to front and back super cell terminal contacts) and silicon solar cells and the resulting stress on the solar cell and interconnect can degrade the performance of the solar module. may lead to cracking and other failure modes. Accordingly, it is desirable that the hidden tabs and other interconnects be configured to accommodate this differential expansion without significant stress development. The interconnects may be formed of, for example, high ductility materials (eg, soft copper, very thin copper sheet), or materials of low coefficient of thermal expansion (eg, Kovar, Invar ( Invar) or other low thermal expansion iron-nickel alloys), formed of materials with a coefficient of thermal expansion approximately matching that of silicon, or a slit to accommodate differential thermal expansion between the interconnect and the silicon solar cell. include in-plane geometrical thermal expansion characteristics such as slots, slots, holes, or truss structures and/or such differentials as kinks, jogs, or dimples Out-of-plane geometric features that accommodate thermal expansion may be employed to provide stress and thermal expansion relief. Portions of the interconnects coupled to hidden tap contact pads (or coupled to super cell front or back terminal contact pads as described below) increase the flexibility of the interconnects, for example about 100 microns. or less, about 50 microns or less, about 30 microns or less, or about 25 microns or less.

7A, 7B-1 and 7B-2, these figures, denoted by reference numerals 400A-400U, employ stress-relieving geometric features and illustrate their use as interconnects for hidden taps. Shown are some example interconnect configurations that may be suitable for electrical connections to or from front or back super cell terminal contacts. These interconnects typically have a length approximately equal to the length of the long sides of the rectangular solar cell to which they are coupled, although they may have any other suitable length. The exemplary interconnects 400A-400T shown in FIG. 7A employ various in-plane stress relief features. Exemplary interconnect 400U, shown in the in-plane (xy) diagram of FIG. 7B-1 and the out-of-plane (xz) diagram of FIG. 7B-2, bends into a thin metal ribbon with out-of-plane stress-relieving features. 3705) is employed. Bends 3705 reduce the apparent tensile stiffness of the metal ribbon. The bends cause the ribbon material to locally flex instead of only stretching when the ribbon material is under tension. For thin ribbons, this can significantly reduce the apparent tensile stiffness, for example by 90% or more. The exact amount of apparent tensile stiffness reduction depends on several factors, including the number of bends, the geometry of the bends and the thickness of the ribbon. The interconnect may also employ a combination of in-plane and out-of-plane stress relief features.

37A-1 - 38B-2 are some examples that may be suitable for use as edge-connected interconnects for hidden taps, employing in-plane and/or out-of-plane stress relieving geometric features, discussed further below; The typical interconnect configurations are shown.

To reduce or minimize the number of conductor runs required to connect each hidden tap, a hidden tap interconnect bus may be utilized. This approach uses hidden tap interconnects to connect adjacent super cell hidden tap contact pads to each other (the electrical connections are typically positive to positive or negative to negative, ie the same polarity at each end).

For example, FIG. 32 runs substantially the entire length of solar cell 10 in first super cell 100 , conductively coupled to hidden tap contact pads 3325 arranged as shown in FIG. 31B . to the first hidden tap interconnect 3400 to be the full length of the corresponding solar cell in the super cell 100 in the adjacent row, and to the hidden tap contact pads 3325 arranged as shown in FIG. 31B . A second hidden tab interconnect 3400 is shown similarly conductively coupled. The two interconnects 3400 are arranged together and optionally adjacent or overlapping each other, and may be conductively coupled to each other or otherwise electrically coupled to form a bus interconnecting two adjacent super cells. This scheme may extend across additional rows (eg, all rows) of super cells to form parallel segments of a solar module that include segments of several adjacent super cells if desired. FIG. 33 shows a perspective view of a portion of the super cell from FIG. 32 .

35 shows super cells in adjacent columns traversing the gap between the super cells and conductively connected to a hidden tap contact pad 3320 on one super cell and another hidden tap contact pad 3320 on another super cell. An example is shown having contact pads arranged as shown in FIG. 32A, interconnected by short interconnects 3400. 36 shows a short interconnect traversing a gap between two super cells in adjacent rows, an end of a central copper bus portion of backside metallization on one super cell and a central copper bus portion of backside metallization of another super cell; A similar arrangement is shown with a copper backside metallization configured as shown in FIG. 31C conductively bonded to the adjacent end of the . In both examples, the interconnection schemes may extend across additional rows (eg, all rows) of super cells to form a parallel segment of a solar module that includes segments of several adjacent super cells if desired. there is.

37A-1 - 37F-3 show in-plane (xy) and out-of-plane (xz) views of example short hidden tap interconnects 3400 including in-plane stress relief features 3405 ( The xy plane is the plane of the solar cell backside metallization pattern). 37A-1 - 37E-2, each interconnect 3400 includes tabs 3400A, 3400B located on opposite sides of one or more in-plane stress relieving features. Exemplary in-plane stress relief features include arrangements of one, two or more hollow diamond shapes, arrangements of zig-zags, and arrangements of one, two, or more slots.

The term “in plane stress relieving feature” as used herein may also refer to the thickness or ductility of the interconnect or a portion of the interconnect. For example, the interconnect 3400 shown in FIGS. 37F-1 through 37F-3 may be a straight, flat length, thin copper ribbon or, for example, less than or equal to about 100 microns or less to increase the flexibility of the interconnect. , a copper foil having a thickness T in the xy plane that is less than or equal to about 50 microns, less than or equal to about 30 microns, or less than or equal to about 25 microns. The thickness T may be, for example, about 50 microns. The length L of the interconnect may be, for example, about 8 centimeters (cm), and the width W of the interconnect may be, for example, about 0.5 cm. 37F-3 and 37F-1 show a front view and a back view of the interconnect in the x-y plane, respectively. The front side of the interconnect faces the back side of the solar module. Because the interconnect may traverse a gap between two parallel rows of super cells in a solar module, a portion of the interconnect may be visible through the gap from the front of the solar module. Optionally, this visible portion of the interconnect may be blackened to reduce its visibility, for example coated with a black polymer layer. In the illustrated example, the front central portion 3400C of the interconnect having a length L2 of about 0.5 cm is coated with a thin black polymer layer. Typically, L2 is greater than or equal to the width of the gap between super cell rows. The black polymer layer may have a thickness of, for example, about 20 microns. Such a thin copper ribbon interconnect may also optionally employ in-plane or out-of-plane stress relief features as described above. For example, the interconnect may include out-of-plane bends that relieve stress as described above with respect to FIGS. 7B-1 and 7B-2.

38A-1 - 38B-2 show in-plane (x-y) and out-of-plane (x-z) views of example short hidden tap interconnects 3400 that include out-of-plane stress relief features 3407 . In the above examples, each interconnect 3400 includes tabs 3400A, 3400B positioned on opposite sides of one or more out-of-plane stress relieving features. Exemplary out-of-plane stress relief features include arrangements of one, two or more bends, kinks, dimples, jogs, or ridges.

The types and arrangements of stress relief features illustrated in FIGS. 37A-1 to 37E-2 and 38A-1 to 38B-2 and the interconnect ribbon thickness described above with respect to FIGS. 37F-1 to 37F-3 are also Where appropriate may be employed in long hidden tap interconnects as described above and interconnects that couple to super cell back or front terminal contacts. An interconnect may include a combination of both in-plane and out-of-plane stress relief features. The in-plane and out-of-plane stress relief features are designed to reduce or minimize strain and stress effects on the solar cell connection site, thus creating highly reliable and resilient electrical connections.

39A-1 and 39A-2 show example configurations for short hidden tap interconnects with cell contact pad alignment and super cell edge alignment features to enable automation, ease of fabrication and placement accuracy. 39B-1 and 39B-2 show an example configuration for short hidden tap interconnects having asymmetric tap lengths. Such asymmetric interconnects may be used in opposing orientations such that overlap of conductors running parallel to the long axis of the super cells is avoided (see discussion of FIGS. 42A-42B below).

Hidden tabs as described herein may form the necessary electrical connections within the module layout to provide the desired module electrical circuitry. Hidden tap connections may be made, for example, at spacings of 12, 24, 36 or 48 solar cells along the super cell, or any other suitable spacing. The spacing between hidden taps may be determined based on application.

Each super cell may typically include a front terminal contact at one end of the super cell and a back terminal contact at the other end of the super cell. In variants where the super cell traverses the length or width of the solar module, these terminal contacts are located adjacent opposite edges of the solar module.

A flexible interconnect may be conductively coupled to a front or back terminal contact of a super cell to electrically connect the super cell to other solar cells or electrical components within the module. For example, FIG. 34A shows a cross-sectional view of an exemplary solar module having an interconnect 3410 conductively coupled to a back terminal contact at the end of the super cell. Back terminal contact interconnect 3410 may be configured to increase the flexibility of the interconnect, for example, less than or equal to about 100 microns, less than or equal to about 50 microns, or about orthogonal to the surface of the solar cell to which it is coupled. It may be or include a thin copper ribbon or foil having a thickness less than or equal to 30 microns, or less than or equal to about 25 microns. The interconnect may have a width in the plane of the surface of the solar cell in a direction orthogonal to the flow of current through the interconnect to enhance conduction, for example greater than or equal to about 10 mm. As illustrated, a back terminal contact interconnect 3410 may lie behind the solar cells without a portion of the interconnect extending beyond the super cell in a direction parallel to the super cell row.

Similar interconnects may be used to connect the front terminal contacts. Optionally, to reduce the area of the front surface of the solar module occupied by the front terminal interconnects, the front interconnect comprises a thin flexible portion coupled directly to the super cell and a thicker portion providing higher conductivity can do. Such an arrangement may reduce the width of the interconnect required to achieve the desired conductivity. The thicker portion of the interconnect may be, for example, an integral part of the interconnect, or it may be a separate piece that is coupled to a thinner portion of the interconnect. For example, FIGS. 34B-34C show cross-sectional views of exemplary interconnects 3410 conductively coupled to front terminal contacts at the ends of the super cells, respectively. In both examples, the thin, flexible portion 3410A of the interconnect directly coupled to the super cell is less than or equal to about 100 microns, less than or equal to about 50 microns, or about orthogonal to the surface of the solar cell to which it is coupled. a thin copper ribbon or foil having a thickness less than or equal to 30 microns or less than or equal to about 25 microns. The thicker copper ribbon portion 3410B of the interconnect is coupled to the thinner portion 3410A to improve conductivity of the interconnect. In FIG. 34B , electrically conductive tape 3410C on the backside of thin interconnect portion 3410A couples the thin interconnect portion to the super cell and thick interconnect portion 3410B. In Figure 34C, thin interconnect portion 3410A is bonded to thick interconnect portion 3410B with an electrically conductive adhesive 3410D and to the super cell with electrically conductive adhesive 3410E. The electrically conductive adhesives 3410D and 3410E may be the same or different. The electrically conductive adhesive 3410E may be, for example, solder.

The solar modules described herein are laminate as shown in FIG. 34A having super cells and one or more encapsulant materials 3610 interposed between a transparent front sheet 3620 and a back sheet 3630 . structure may be included. The transparent front sheet may be, for example, glass. The back sheet may also be glass or any other suitable material. An additional strip of encapsulant may be disposed between the backside terminal interconnect 3410 and the backside of the super cell as illustrated.

As noted above, hidden tabs provide a modular aesthetic that is "all black." Since these connections are typically made of highly reflective conductors, they could normally show high contrast to attached solar cells. However, by making connections on the backside of the solar cells and also routing other conductors in the solar module circuit behind the solar cells, the various conductors are hidden from view. This allows for multiple connection points (hidden taps) while still retaining the "all black" look.

Hidden tabs can be used to form various module layouts. In the example of Figures 40 (physical layout) and Figure 41 (electrical schematic), a solar module includes six super cells each running the lengths of the module. Hidden tap contact pads and short interconnects 3400 divide each super cell into one third and electrically connect adjacent super cell segments in parallel, thus forming three groups of parallel connected super cell segments. Each group is connected in parallel to the other of the bypass diodes 1300A-1300C incorporated (embedded) in the laminate configuration of the module. The bypass diodes may be located, for example, directly behind super cells or between super cells. The bypass diodes may be located, for example, along a centerline of the solar module that is approximately parallel to the long sides of the solar module.

In the example of FIGS. 42A-42B (which also corresponds to the electrical circuit diagram of FIG. 41 ), a solar module includes six super cells, each running the length of the module. Hidden tap contact pads and short interconnects 3400 divide each super cell into a third and electrically connect adjacent super cell segments in parallel, thus forming three groups of parallel connected super cell segments. Each group is connected in parallel to the other of bypass diodes 1300A-1300C via bus connections 1500A-1500C, which are located behind the super cells and connect the hidden tap contact pads and short interconnects within a junction box. It is connected to the bypass diodes located on the rear side of the module.

42B provides a detailed view of the connection of short hidden tap interconnects 3400 and conductors 1500B, 1500C. As shown these conductors do not overlap each other. In the illustrated example, this enables the use of asymmetric interconnects 3400 arranged in opposite directions. An alternative approach to avoid overlapping of the conductors is to employ a first symmetric interconnect 3400 having tabs of one length and a second symmetric interconnect 3400 having tabs of a different length.

In the example of FIG. 43 (which also corresponds to the electrical schematic of FIG. 41 ), the solar module is configured except that the hidden tap interconnects 3400 form a continuous bus running substantially the entire width of the solar module. It is constructed similarly to that shown in Fig. 42A. Each bus may be a single elongated interconnect 3400 that is conductively coupled to the backside metallization of each super cell. Optionally, the bus may include multiple individual interconnects, each traversing a single super cell, conductively coupled to each other or otherwise electrically interconnected as described above with respect to FIG. 41 . 43 also shows super cell terminal interconnects 3410 forming a continuous bus along one end of the solar module to electrically connect the front terminal contacts of the super cells and the back terminal contacts of the super cells electrically. Additional super cell terminal interconnects 3410 are shown forming a continuous bus along opposite ends of the solar module to connect.

The exemplary solar module of FIGS. 44A-44B also corresponds to the electrical circuit diagram of FIG. 41 . This example employs short hidden tap interconnects 3400 as in FIG. 42A and interconnects 3410 forming contiguous buses for the super cell front and back terminal contacts as in FIG. 43 .

In the example of FIGS. 47A (physical layout) and FIG. 47B (electrical circuit diagram), a solar module includes six super cells each running the full length of the solar module. Hidden tap contact pads and short interconnects 3400 divide each super cell into two-thirds-long portions and one-thirds-long portions. Interconnects 3410 (as shown in the figure) at the lower edge of the solar module interconnect the three rows on the left in parallel to each other, interconnect the three rows on the right in parallel with each other, and The three columns are interconnected in series with the three columns on the right. This arrangement forms three groups of super cell segments connected in parallel, each super cell group having a length that is 2/3 the length of the super cell. Each group is connected in parallel with the other of bypass diodes 2000A-2000C. This arrangement provides about twice the voltage and about half the current than would be provided by the same super cells if they were instead electrically connected as shown in FIG. 41 .

As described above with reference to FIG. 34A , the interconnects coupled to the super cell backside terminal contacts may lie entirely behind the super cells and be hidden from view from the front (sun) sides of the solar module. Interconnects 3410 that couple to super cell front terminal contacts are either because they extend beyond the ends of the super cells (eg, as in FIG. 44A ), or around and below the ends of the super cells. As it is folded, it can be seen in the rear view of the solar module (eg, as in FIG. 43 ).

The use of hidden taps enables grouping of small numbers of solar cells per bypass diode. In the examples of FIGS. 48A-B , each showing a physical layout, a solar module includes six super cells, each running the length of the module. Hidden tap contact pads and short interconnects 3400 divide each super cell in fifths and electrically connect adjacent super cell segments in parallel, thus forming five groups of parallel connected super cell segments. Each group is connected in parallel with another of bypass diodes 2100A-2100E that is incorporated (embedded) into the laminate configuration of the module. The bypass diodes may be located, for example, directly behind super cells or between super cells. Super cell terminal interconnects 3410 form a continuous bus along one end of the solar module to electrically connect the front terminal contacts of the super cells, and additional super cell terminal interconnects 3410 are connected to the super cell A continuous bus is formed along opposite ends of the solar module to electrically connect their rear terminal contacts. In the example of FIG. 48A , a single junction box 2110 is electrically connected to the front and rear terminal interconnect buses by conductors 2115A, 2115B. However, since there are no diodes in the junction box, optionally ( FIG. 48b ) the long double conductors 2215A, 2115B can be eliminated, and the single junction box 2110 is, for example, of the module. It can be replaced with two single polarity (+ or -) junction boxes 2110A-2110B located at opposite edges. This eliminates resistive losses in the long return conductors.

Although the examples described herein use hidden taps to electrically divide each super cell into three or five groups of solar cells, these examples are intended to be illustrative and not restrictive. More generally, hidden taps may be used to electrically divide a super cell into more or fewer groups of solar cells than illustrated and/or more or fewer solar cells per group than illustrated.

In normal operation of the solar modules described herein without a bypass diode in a forward biased and conducting state, little or no current flows through any hidden tap contact pads. Instead, current flows through cell-to-cell conductive bonds formed between adjacent overlapping solar cells over the length of each super cell. In contrast, FIG. 45 shows the current flow when a portion of the solar module is bypassed through a forward biased bypass diode. As indicated by the arrows, in this example the current in the leftmost super cell flows along the super cell until it reaches the tapped solar cell, after which the backside metallization of the solar cell, hidden tap A contact pad (not shown), a second solar cell in the adjacent super cell via an interconnect 3400, to another hidden tap contact pad (not shown) to which the interconnect is coupled on the second solar cell, the first 2 flows through the backside metallization of the solar cell, through additional hidden tap contact pads, through interconnects and through the solar cell backside metallization to reach the bus connection 1500 and to the bypass diode. Current flow through other super cells is similar. As is evident from the example, hidden tap contact pads under these circumstances can conduct current from two or more rows of super cells, thus generating a current greater than that generated within any single solar cell within the module. can evangelize

There is typically a bus bar, contact pad, or other light blocking element (other than the front surface metallization fingers or overlapping portion of an adjacent solar cell) on the front side of the solar cell opposite the hidden tap contact pad. I never do that. Accordingly, when the hidden tap contact pad is formed of silver on a silicon solar cell, the light conversion efficiency of the solar cell in the region of the hidden tap contact pad is the back electric field at which the silver contact pad prevents back charge recombination. It can be reduced if the effect is reduced. To avoid this loss of efficiency, typically most solar cells in a super cell do not include hidden tap contact pads (eg, those requiring a hidden tap contact pad for a bypass diode circuit in some variations). Only solar cells will include such a hidden tap contact pad). In addition, in order to match current generation in solar cells including hidden tap contact pads with current generation in solar cells lacking hidden tap contact pads, solar cells including hidden tap contact pads are The hidden tap contact pads may have a larger light collection area than the solar cells lacking them.

Individual hidden tab contact pads may have rectangular dimensions of less than or equal to about 2 mm, for example less than or equal to about 5 mm.

Solar modules undergo a temperature cycle as a result of temperature changes during testing, operation and the environment in which they are installed. 46A , during this temperature cycle, the mismatch in thermal expansion between the silicon solar cells in the super cell and other parts of the module, e.g., the glass front sheet of the module, is the difference between the super cell and the module. It brings relative motion along the long axes of the super cell rows between different parts. This mismatch tends to stretch or compress the super cells and can damage the solar cells or the conductive bonds between the solar cells within the super cells. Similarly, as shown in FIG. 46B , the mismatch in thermal expansion between the solar cell and an interconnect coupled to a solar cell during a temperature cycle results in a relative motion between the interconnect and the solar cell in a direction orthogonal to the rows of super cells. causes This mismatch can deform and damage the solar cells, the interconnect, and the conductive bonding therebetween. This can happen for interconnects coupled to hidden tap contact pads and for interconnects coupled to super cell front or back terminal contacts.

Similarly, the cyclic mechanical loading of a solar module is subjected to local shear forces on the bonds between the solar cell and interconnect and at the intercell bonds within the super cell, for example during transportation or from weather (eg wind and snow). forces) can be created. These shear forces can also damage the solar module.

To prevent problems resulting from relative motion between the super cells and other parts of the solar module along the long axis of the rows of super cells, the conductive adhesive used to bond adjacent and overlapping solar cells together is Provide mechanical compliance to the super cells between overlapping solar cells without damaging the solar module between the super cells and the module in a direction parallel to the rows for a temperature range of about -40°C to about 100°C may be chosen to form a flexible conductive bond 3515 (FIG. 46A) that accommodates the mismatch in thermal expansion between the glass front sheets of The conductive adhesive may be tested under standard test conditions (ie, 25° C.), for example, less than or equal to about 100 megapascals (MPa), less than or equal to about 200 MPa, less than or equal to about 300 MPa, or about Less than or equal to 400 MPa, less than or equal to about 500 MPa, less than or equal to about 600 MPa, less than or equal to about 700 MPa, less than or equal to about 800 MPa, less than or equal to about 900 MPa, or less than about 1000 MPa may be selected to form conductive bonds having a shear modulus less than or equal to the shear modulus. The flexible conductive bonds between overlapping and adjacent solar cells can accommodate, for example, differential motion greater than or equal to about 15 microns between each cell and the glass front sheet. Suitable conductive adhesives may include, for example, ECM 1541-S3 available from Engineered Conductive Materials LLC.

The solar cells in the module may be the result of shading or some other cause to enhance the flow of heat along the super cell which reduces the risk of damaging the solar module from hot spots that may be caused during operation of the solar module. When reverse biased, the conductive bonds between overlapping adjacent solar cells are, for example, less than or equal to about 50 microns thick orthogonal to the solar cells and about 1.5 W/orthogonal to the solar cells. It can be formed with a thermal conductivity greater than or equal to (meter-K).

To avoid problems resulting from relative motion between an interconnect and the solar cell to which it is attached, the conductive adhesive used to bond the interconnect to the solar cell is such that the interconnect is at about -40°C without damage to the solar module. may be selected to form a conductive bond between the solar cell and the interconnect that is sufficiently stiff to accommodate a mismatch in thermal expansion between the solar cell and the interconnect for a temperature range of from about 180°C. Such a conductive adhesive may be tested under standard test conditions (ie, 25° C.), for example, greater than or equal to about 1800 MPa, greater than or equal to about 1900 MPa, greater than or equal to about 2000 MPa, or greater than or equal to about 2100 MPa. or greater than or equal to about 2200 MPa, greater than or equal to about 2300 MPa, greater than or equal to about 2400 MPa, greater than or equal to about 2500 MPa, greater than or equal to about 2600 MPa, greater than or equal to about 2700 MPa; greater than or equal to about 2800 MPa, greater than or equal to about 2900 MPa, greater than or equal to about 3000 MPa, greater than or equal to about 3100 MPa, greater than or equal to about 3200 MPa, greater than or equal to about 3300 MPa, or about 3400 MPa greater than or equal to, greater than or equal to about 3500 MPa, greater than or equal to about 3600 MPa, greater than or equal to about 3700 MPa, greater than or equal to about 3800 MPa, greater than or equal to about 3900 MPa, or greater than about 4000 MPa may be selected to form a conductive bond having a shear modulus equal to or equal to In such variations, the interconnect can withstand thermal expansion or contraction of the interconnect greater than or equal to, for example, about 40 microns. Suitable conductive adhesives may include, for example, Hitachi CP-450 and solders.

Accordingly, conductive bonds between overlapping and adjacent solar cells within the super cell may utilize a different conductive adhesive than the conductive bonds between the super cell and the flexible electrical interconnect. For example, the conductive bonds between the super cell and the flexible electrical interconnect may be formed of solder, and the conductive bonds between the overlapping and adjacent solar cells may be formed of a conductive adhesive other than solder. In some variations, the conductive adhesives may all be cured in a single process step, for example, in a process window of about 150°C to about 180°C.

The preceding discussion focused on assembling a plurality of solar cells (which could be cut solar cells) in a shingled manner on a common substrate. This results in the formation of modules.

However, in order to amass a sufficient amount of solar energy to become useful, a facility is usually equipped with a number of such modules which themselves are assembled together. According to embodiments, a plurality of solar cell modules may also be assembled in a shingled manner to increase the areal efficiency of the array.

In certain embodiments, a module may be characterized by a top conductive ribbon facing the direction of solar energy and a bottom conductive ribbon facing away from the direction of solar energy.

The bottom ribbon is embedded below the cells. Thus, it does not block incoming light and does not adversely affect the areal efficiency of the module. In contrast, the top ribbon is exposed and can block the incoming light and adversely affect efficiency.

According to embodiments, the modules themselves may be shingled such that the top ribbon is covered by a neighboring module. This shingled module configuration could also provide additional area on the module for other elements without adversely affecting the final exposed area of the module array. Examples of module elements that may be located within overlapping regions may include, but are not limited to, junction boxes (j-boxes) and/or bus ribbons.

In certain embodiments, the j-boxes of each adjacent shingled module are arranged in a row to implement a conductive connection therebetween. This simplifies the construction of an array of shingled modules by eliminating wiring.

In certain embodiments, the j-boxes could be reinforced and/or combined with additional structural standoffs. A configuration like this could create an integrated and tilted modular roof mount rack solution, where the dimensions of the junction box determine the tilt. Such an implementation may be particularly useful where the array of shingled modules is mounted on a flat roof.

The shingled super cells are specific for module layout for module level power management devices (eg, DC/AC microinverters, DC/DC module power optimizers, voltage intelligence and smart switches, and related devices). provide opportunities. A feature of module level power management systems is power optimization. Super cells as described and employed herein are capable of generating higher voltages than traditional panels. In addition, the super cell module layout can further divide the module. Both higher voltages and increased division create potential benefits for power optimization.

Disclosed herein are high efficiency solar modules (ie, solar panels) comprising narrow rectangular silicon solar cells electrically connected in series and arranged in a shingled manner to form super cells, the super cells comprising arranged in physically parallel rows within the solar module. The super cells may, for example, have lengths that span essentially the entire length or width of the solar module, or two or more super cells may be arranged end-to-end in a row. Each super cell may contain any number of solar cells, including, for example, at least nineteen solar cells in some variations and greater than or equal to 100 silicon solar cells in certain variations. Each solar module may have a conventional size and shape, and still contain hundreds of silicon solar cells, wherein the super cells in a single solar module are, for example, from about 90 volts (V) to about 450V or more. They may be electrically interconnected to provide more than a direct current (DC) voltage.

As will be discussed further below, this high DC voltage is subjected to a DC to DC boost (DC) prior to conversion to AC by the inverter by an inverter (eg, a microinverter located on the solar module). It enables conversion from direct current to alternating current (AC) by eliminating or reducing the need for voltage step-up. Also, as discussed further below, the high DC voltage is also DC/AC converted by a central inverter receiving a high voltage DC output from two or more high voltage shingled solar cell modules that are electrically connected in parallel with each other. Enables the use of performed batches.

Referring back to the drawings for a more detailed understanding of the solar modules described herein, FIG. 1 is a shingled fashion with ends of adjacent solar cells overlapping and electrically connected to form a super cell 100 . It shows a cross-sectional view of a string of series-connected solar cells 10 that are arranged. Each solar cell 10 includes a semiconductor diode structure and electrical contacts to the semiconductor diode structure that can be provided to an external load when the current generated by the solar cell 10 is illuminated by light.

In the examples described herein, each solar cell 10 is a rectangular crystalline silicon having front (solar-side) and back-side (light-shielding) metallization patterns that provide electrical contact to opposite sides of an np junction. a solar cell, wherein the front surface metallization pattern is disposed on a semiconductor layer of n-type conductivity, and the rear surface metallization pattern is disposed on a semiconductor layer of p-type conductivity. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements may be used as appropriate. For example, the front surface (sun side) metallization pattern may be disposed on a semiconductor layer of p-type conductivity, and the back surface (light blocking side) metallization pattern may be disposed on a semiconductor layer of n-type conductivity. there is.

Referring back to FIG. 1 , adjacent solar cells 10 in the super cell 100 electrically connect the front surface metallization pattern of one solar cell to the rear surface metallization pattern of the adjacent solar cell. conductively bonded to each other in overlapping regions by a conductive bonding material. Suitable electrically conductive bonding materials may include, for example, electrically conductive adhesives and electrically conductive adhesive films and adhesive tapes, and conventional solders.

2 shows an exemplary rectangular solar module 200 comprising six rectangular super cells 100 each having a length approximately equal to the length of the long sides of the solar module. The super cells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the module. A similarly constructed solar module may include more or fewer rows of super cells of this side length than shown in this example. In other variations, the super cells may each have a length approximately equal to the length of the short side of the rectangular solar module, with their long sides oriented parallel to the short sides of the module to form rows may be arranged parallel to each other. In another arrangement, each row may include two or more super cells electrically connected in series. The modules may have short sides, for example, having a length of about 1 meter and long sides, for example, having a length of about 1.5 meters to about 2.0 meters. Any other suitable shapes (eg, square) and dimensions for solar modules may also be used.

In some variations, the conductive bonds between the overlapping solar cells provide mechanical compliance to the super cells, allowing the heat to flow over a temperature range of about -40°C to about 100°C without damaging the solar module. accommodate the mismatch in thermal expansion between the super cells and the front sheet of the solar module in a direction parallel to

In the illustrated example each super cell has a width equal to or approximately equal to one-sixth the width of a conventionally sized 156 mm square or pseudo square silicon wafer, and is equal to or approximately equal to the width of the square or pseudo square wafer. contains 72 rectangular solar cells of the same length. More generally, the rectangular silicon solar cells employed in the solar modules described herein have lengths equal to or approximately equal to the width of, for example, a conventionally sized square or pseudo-square silicon wafer and, for example, conventional may have widths equal to or approximately equal to 1/M of the width of a square or pseudo-square wafer of size, where M is any integer ≦20. M may be, for example, 3, 4, 5, 6 or 12. M may also be greater than or equal to 20. A super cell may contain any suitable number of such rectangular solar cells.

Because the shingling approach described above involves more cells per module than the conventional case, the super cells in solar module 200 are electrically interconnected (optionally) to provide a higher than conventional voltage from a conventionally sized solar module. , which can be interconnected in series by flexible electrical interconnects) or by module level power electronics as described below. For example, a conventionally sized solar module comprising super cells made from 1/8 cut silicon solar cells may contain more than 600 solar cells per module. In comparison, a conventionally sized solar module comprising conventionally sized interconnected silicon solar cells typically contains about 60 solar cells per module. In conventional silicon solar modules, square or pseudo-square solar cells are typically interconnected by copper ribbons and spaced apart from each other to accommodate the interconnections. In such cases, cutting the conventionally sized square or pseudo-square wafers into narrow rectangles could reduce the overall amount of active solar cell area within the module, thus resulting in additional cell-to-cell interconnects required. The module power could be reduced. In contrast, the shingled arrangement in the solar modules disclosed herein hides cell-to-cell electrical interconnections beneath the active solar cell area. Accordingly, the solar modules disclosed herein provide module output because there is little or no tradeoff between the module power in the solar module and the number of solar cells (and required cell-to-cell interconnections). High output voltages can be provided without reducing power.

When all solar cells are connected in series, a shingled solar cell module as described herein can provide a DC voltage in the range of, for example, from about 90 volts to about 450 volts or more. As noted above, such a high DC voltage can be advantageous.

For example, microinverters placed near or on top of solar modules can be used for module level power optimization and DC to AC conversion. 49A-49B, a conventional microinverter 4310 receives a DC input of 25V-40V from a single solar module 4300, and an AC output of 230V to match the connected grid. to output The microinverter typically includes two main components: DC/DC boost and DC/AC inversion. The DC/DC boost is utilized to increase the DC bus voltage required for the DC/AC conversion, and is typically the most expensive and lossy (2% loss in efficiency) component. Because the solar modules described herein provide high voltage power, the need for a DC/DC boost can be reduced or eliminated ( FIG. 49B ). This may reduce the cost and increase the efficiency and reliability of the solar module 200 .

In conventional arrangements using a central (“string”) inverter rather than microinverters, conventional low DC output solar modules are electrically connected in series to each other and to the string inverter. The voltage generated by the string of solar modules is equal to the sum of the individual module voltages because the modules are connected in series. The allowed voltage range determines the maximum and minimum number of modules in the string. The maximum number of modules is determined by the module voltage and code voltage limits: for example N _max ×V _oc <600V (US residential standard) or N _max ×V _oc <1,000V (commercial standard) is set The minimum number of modules in series is set by the module voltage and the minimum operating voltage required by the string inverter: N _min ×V _mp >V _Invertermin . The minimum operating voltage V _Invertermin required by the string inverter (eg, Fronius, Powerone, or SMA inverter) is typically about 180V to about 250V. Typically, the operating voltage for the string inverter is about 400V.

A single high DC voltage shingled solar cell module as described herein can generate a voltage that is greater than a minimum operating voltage required by the string inverter and optionally at or near an optimum operating voltage for the string inverter. . As a result, the high DC voltage shingled solar cell modules described herein can be electrically connected in parallel to each other for a string inverter. This avoids string length requirements of the series connected module strings which can complicate system design and installation. Also, in a series-connected string of solar modules, the module with the lowest current is the most important feature, and the system will respond to other modules in the string as may occur for modules on different roof slopes or as a result of shade trees. The modules may not operate efficiently when accommodating other lights. The parallel high voltage module configuration described herein also avoids these problems because the current through each solar module is independent of the current through the other solar modules. In addition, these arrangements do not require module level power electronics and thus can improve the reliability of the solar modules, which can be particularly important in variants where the solar modules are placed on a roof top.

Referring now to FIGS. 50A-50B , as described above, a super cell may run approximately the full length or width of the solar module. To enable electrical connections along the length of the super cell, a hidden (from front view) electrical tapping point may be incorporated into the solar module configuration. This can be implemented by connecting an electrical conductor to the backside metallization of the solar cell at an end or intermediate location of the super cell. These hidden taps enable electrical partitioning of the super cell, bypass diodes, module level power electronics (eg, microinverters, power optimizers, voltage intelligence and smart switches, and related devices), or other Enables interconnection of super cells or segments of super cells to components. The use of hidden tabs is further described in U.S. Provisional Patent Application No. 62/081,200, U.S. Provisional Patent Application No. 62/133,205, and U.S. Patent Application No. 14/674,983, each of which is incorporated herein by reference in its entirety.

In the examples of FIGS. 50A (Exemplary Physical Layout) and 50B (Exemplary Electrical Schematic), the illustrated solar modules 200 each include six super cells 100 electrically connected in series to provide a high DC voltage. ) is included. Each super cell is electrically divided into several groups of solar cells by hidden taps 4400 , each group of solar cells electrically connected in parallel with another bypass diode 4410 . In these examples, the bypass diodes are disposed within the solar module laminate structure, ie with the solar cells in an encapsulant between a front transparent sheet and a backing sheet. Optionally, the bypass diodes may be disposed in a junction box located on the back or edge of the solar module and interconnected to the hidden taps by conductor runs.

In the examples of FIGS. 51A (physical layout) and FIG. 51B (corresponding electrical circuit diagram), the illustrated solar module 200 also includes six super cells 100 electrically connected in series to provide a high DC voltage. . In this example, the solar module is electrically divided into three pairs of series connected super cells, each pair of super cells electrically connected in parallel with another bypass diode. In this example, the bypass diodes are placed in a junction box 4500 located on the backside of the solar module. The bypass diodes could instead be located within the solar module laminate structure or edge-mounted junction box.

In the examples of FIGS. 50A-51B , in normal operation of the solar module each solar cell is forward biased and all bypass diodes are accordingly reverse biased and unconducted. However, if one or more solar cells in a group are reverse biased to a sufficiently high voltage, the bypass diode corresponding to that group will turn on and current flow through the module will be reversed by the reverse biased solar cell. will bypass the batteries. This prevents the formation of hazardous hot spots in shaded or malfunctioning solar cells.

Optionally, the bypass diode functionality may be implemented in module level power electronics, for example a microinverter disposed on or near the solar module (module level power electronics and their use as well as module level power management here). devices or systems and may be referred to as module level power management). Such module level power electronics optionally integrated with the solar module can optimize power from groups of super cells, from each super cell, or from each individual super cell segment within electrically partitioned super cells ( For example, by operating a group of super cells, a super cell, or a super cell segment at its maximum power point), thus enabling separate power optimization within the module. Since the power electronics can determine when to bypass an entire module, a specific group of super cells, one or more specific individual super cells and/or one or more specific super cell segments, the module level power electronics can may eliminate the need for any bypass diodes in the

This can be implemented, for example, by integrating voltage intelligence at the module level. By monitoring the voltage output of a solar cell circuit (eg, one or more super cells or super cell segments) within the solar module, a “smart switch” power management device may indicate that such circuitry is reverse biased. It can be determined whether the phosphorus includes any solar cells. When a reverse biased solar cell is detected, the power management device may disconnect the corresponding circuit from the electrical system using, for example, a relay switch or other component. For example, if the voltage of a monitored solar cell circuit falls below a predetermined threshold, then the power management device will shut off (open circuit) the circuit. The predetermined threshold may be, for example, a certain percentage and magnitude (eg, 20% or 10V) compared to the normal operation of the circuit. This implementation of voltage intelligence can be integrated into existing module level power electronics products (eg, from Enpas Energy, Solarage Technologies, Tigo Energy) or through custom circuit design.

52A (physical layout) and 52B (corresponding electrical circuit diagram) show an exemplary configuration for module level power management of a high voltage solar module including shingled super cells. In this example, a rectangular solar module 200 includes six rectangular shingled super cells 100 arranged in six rows extending the length of the long sides of the solar module. The six super cells are electrically connected in series to provide a high DC voltage. The module level power electronics 4600 may perform voltage sensing, power management, and/or DC/AC conversion for the entire module.

53A (physical layout) and 53B (corresponding electrical circuit diagram) show another exemplary configuration for module level power management of a high voltage solar module including shingled super cells. In this example, a rectangular solar module 200 includes six rectangular shingled super cells 100 arranged in six rows extending the length of the long sides of the solar module. The six super cells are electrically grouped into three pairs of serially connected super cells. Each pair of super cells is capable of performing voltage sensing and power optimization on the respective pairs of super cells, and serializing two or more thereof to provide a high DC voltage and/or to perform DC/AC conversion. It is individually connected to the module level power electronics 4600 connected to the

54A (physical layout) and 54B (corresponding electrical circuit diagram) show another example configuration for module level power management of a high voltage solar module including shingled super cells. In this example, a rectangular solar module 200 includes six rectangular shingled super cells 100 arranged in six rows extending the length of the long sides of the solar module. Each super cell is capable of performing voltage sensing and power optimization for said super cell, and module level power connecting two or more of them in series to provide a high DC voltage and/or perform DC/AC conversion. It is individually connected to the electronics 4600 .

55A (physical layout) and 55B (corresponding electrical circuit diagram) show another example configuration for module level power management of a high voltage solar module including shingled super cells. In this example, a rectangular solar module 200 includes six rectangular shingled super cells 100 arranged in six rows extending the length of the long sides of the solar module. Each super cell is electrically divided into two or more groups of solar cells by hidden taps 4400 . Each resulting group of solar cells is capable of performing voltage sensing and power optimization for each group of solar cells, a module cascading a plurality of groups to provide a high DC voltage and/or to perform DC/AC conversion It is individually connected to the level power electronics 4600 .

In some variations, two or more high voltage DC shingled solar cell modules as described herein are electrically connected in series to provide a high voltage DC output that is converted to AC by an inverter. The inverter may be, for example, a microinverter integrated with one of the solar modules. In these cases the microinverter can optionally be a component of a module level power management electronics that also performs additional voltage sensing and connects functions as described above. Alternatively, the inverter may be a central “string” inverter as discussed further below.

56 , stringing super cells in series into solar module adjacent rows of super cells may be offset slightly along their long axes in a staggered manner. This staggering not only saves module area (space/length) but also simplifies manufacturing while interconnecting adjacent ends of rows of super cells to the top of one super cell and the bottom of the other. 4700) to be electrically connected in series. Adjacent rows of super cells may be offset by, for example, about 5 millimeters.

Differential thermal expansion between the electrical interconnects 4700 and silicon solar cells and the resulting stress on the solar cell and interconnect can lead to cracking and other failure modes that can degrade the performance of the solar module. Accordingly, it is desirable for the interconnect to be flexible and configured to accommodate this differential expansion without significant stress development. The interconnect may be formed of, for example, very soft materials (eg, soft copper, thin copper sheet), or low coefficient of thermal expansion materials (eg, Kovar, Invar or other low thermal expansion iron-nickel). alloys) or materials having a coefficient of thermal expansion approximately matching that of silicon, such as slits, slots, holes, or truss structures that accommodate differential thermal expansion between the interconnect and the silicon solar cell. Stress and thermal expansion relief may be provided by incorporating in-plane geometrical expansion characteristics and/or employing out-of-plane geometrical features such as kinks, jogs or dimples to accommodate such differential thermal expansion. The conductive portions of the interconnects may have a thickness of, for example, about 100 microns or less, about 50 microns or less, about 30 microns or less, or about 25 microns or less to increase the flexibility of the interconnects (these solar modules The generally low current in the thin interconnects allows the use of thin and flexible conductive ribbons without excessive power loss resulting from the electrical resistance of the thin interconnects).

In some variations, conductive bonds between a super cell and a flexible electrical interconnect are such that the flexible electrical interconnect does not damage the solar module and for a temperature range of about -40°C to about 180°C, the super cell and the flexible electrical interconnect to accommodate the mismatch in thermal expansion between interconnects.

7A (discussed above) shows some example interconnect configurations employing in-plane stress-relieving geometric features denoted by reference numerals 400A-400T, and FIGS. 7B-1 and 7B-2 (also discussed above); ) shows example interconnect configurations employing out-of-plane stress-relieving geometric features, denoted by reference numerals 400U and 3705. Any or any combination of these interconnect configurations that employ stress relieving features may be suitable for electrically series interconnecting the super cells to provide a high DC voltage as desired herein.

The discussion of Figures 51A-55B has focused on module level power management with possible DC/AC conversion of high DC module voltages by module level power electronics to provide AC output from the module. As mentioned above, DC/AC conversion of high DC voltages from shingled solar cell modules as described herein may instead be performed by a central string inverter. For example, FIG. 57A shows a plurality of high DC voltages connected in electrical parallel with each other for string inverter 4815 via high DC voltage negative bus 4820 and high DC voltage positive bus 4810 . A photovoltaic system 4800 including shingled solar cell modules 200 is schematically illustrated. Typically, each solar module 200 includes a plurality of shingled super cells electrically connected in series with electrical interconnects to provide a high DC voltage as described above. The solar modules 200 may optionally include bypass diodes arranged as described above, for example. 57B shows an exemplary arrangement of a photovoltaic system 4800 on a roof top.

In some variations of photovoltaic system 4800 , two or more short series connected strings of high DC voltage shingled solar cell modules may be electrically connected in parallel with a string inverter. Referring again to FIG. 57A , for example, each solar module 200 may be replaced with a series connected string of two or more high DC voltage shingled solar cell modules 200 . This could be done, for example, by maximizing the voltage provided to the inverter while complying with regulatory standards.

Conventional solar modules typically generate about 8 amps of Isc (short circuit current), about 50 Voc (open circuit voltage), and about 35 Vmp (maximum power point voltage). As previously discussed, a high DC voltage shingled solar cell as described herein wherein each of the solar cells has an area of about 1/M of the area of a conventional solar cell and M times the conventional number of solar cells. The modules generate approximately M times higher voltage and 1/M current of conventional solar modules. As noted above, M can be any suitable integer, typically ≦20, but can be greater than or equal to 20. M may be, for example, 3, 4, 5, 6, or 12.

When M=6, the Voc for the high DC voltage shingled solar cell modules may be, for example, about 300V. Connecting two such modules in series could provide about 600V DC to the bus, following the maximum setting by US residential standards. When M=4, the Voc for the high DC voltage shingled solar cell modules may be, for example, about 200V. Connecting three such modules in series could provide about 600V DC to the bus. When M=12, the Voc for the high DC voltage shingled solar cell modules may be, for example, about 600V. It was also possible to configure the system to have bus voltages below 600V. In these variants, the high DC voltage shingled solar cell modules are arranged to provide an optimal voltage to the inverter, eg in pairs or triplets or any other suitable in a combiner box. can be linked by a bond.

The challenge resulting from the above-described parallel configuration of high DC voltage shingled solar cell modules is that if one solar module is shorted, other solar modules can potentially pass their power to the shorted module (i.e., It may drive a current through the short-circuited module and dissipate power therein), which may cause a hazard. This problem is caused by, for example, the use of blocking diodes to prevent other modules from driving current through a shorted module, the use of current limiting fuses, or combined with blocking diodes. This can be prevented by the use of current limiting fuses. 57B schematically illustrates the use of two current-limiting fuses 4830 on the positive and negative terminals of a high DC voltage shingled solar cell module 200 .

The protective arrangement of blocking diodes and/or fuses may depend on whether the inverter includes a transformer or not. Systems using an inverter including a transformer typically ground the negative conductor. Systems using transformerless inverters typically do not ground the negative conductor. For an inverter without a transformer, it may be desirable to have a current-limiting fuse connected to the positive terminal of the solar module and another current-limiting fuse connected to the negative terminal.

Blocking diodes and/or current limiting fuses may be arranged, for example, in a junction box or with each module in the module laminate. Suitable junction boxes, blocking diodes (eg in-line blocking diodes), and fuses (eg in-line fuses) are available from Shoals Technology Group. may include those that are available.

58A shows an exemplary high voltage DC shingled solar cell module including a junction box 4840 with a blocking diode 4850 connected to the positive terminal of the solar module. The junction box does not include a current-limiting fuse. This configuration can be preferably used in combination with one or more current-limiting fuses located elsewhere (eg, in a combiner box) to be connected to the positive and/or negative terminals of the solar module (eg, in a combiner box). For example, see Figure 58D below). 58B shows an exemplary high voltage DC shingled solar cell module including a junction box 4840 with a blocking diode aligned to the positive terminal of the solar module and a current limiting fuse 4830 aligned to the negative terminal of the solar module. 58C shows an exemplary high voltage DC shingled solar cell module including a junction box 4840 in which a current limiting fuse 4830 is aligned to the positive terminal of the solar module and another current limiting fuse 4830 is aligned to the negative terminal of the solar module. shows 58D is an exemplary high voltage DC shingled solar cell module including a junction box 4840 configured as in FIG. 58A and fuses located outside of the junction box aligned to the positive and negative terminals of the solar module. shows

59A-59B , as an optional example for the configurations described above, blocking diodes and/or current limiting fuses for all high DC voltage shingled solar cell modules are combined in a combiner box 4860. can be placed together in In these variations, one or more individual conductors run separately from each module to the combiner box. 59A, in one option a single conductor of one polarity (eg negative as illustrated) is shared between all modules. In another option ( FIG. 59b ), both polarities have individual conductors for each module. 59A-59B only show fuses located within the combiner box 4860, any suitable combination of fuses and/or blocking diodes may be located within the combiner box. Also, electronic devices may be implemented in the combiner box that perform other functions, such as, for example, monitoring, tracking the maximum power point and/or disconnecting individual modules or groups of modules.

Reverse bias operation of a solar module causes one or more solar cells in the solar module to be shaded or otherwise generate a small current, causing the solar module to reduce the amount of current that can be handled through the low current solar cell. This can occur when operating at a voltage-current point that drives a greater current than the solar cell. A reverse biased solar cell can get hot and create a hazardous condition. The parallel arrangement of high DC voltage shingled solar cell modules may allow the modules to be protected from reverse bias operation, for example by setting an appropriate operating voltage for the inverter, as shown in FIG. 58A . This is illustrated, for example, by FIGS. 60A- 60B .

60A shows a plot of current versus voltage 4870 and plot of power versus voltage 4880 for a parallel-connected string of about ten high DC voltage shingled solar modules. These curves were calculated for a model without solar modules that included a reverse biased solar cell. Since the solar modules are electrically connected in parallel, they all have the same operating voltage and their currents are added. Typically, the inverter will vary the load on the circuit to experience the power-voltage curve, identify a maximum on this curve, and then operate the module circuit at this point to maximize the output power.

In contrast, FIG. 60B shows a plot of current versus voltage 4890 and a plot of power versus voltage for the model system of FIG. 60A where some of the solar modules in the circuit include one or more reverse biased solar cells. (4900) is shown. The reverse biased modules are exemplary current-voltage by formation of a knee shape with a transition from about 10 amp operation at voltages of up to about 210 volts to about 16 amp operation at voltages below about 200 volts. They represent themselves within the curve. At voltages below about 210 volts, the shaded modules contain reverse biased solar cells. The reverse biased modules also exhibit themselves in the power-voltage curve by the presence of two maxima: an absolute maximum at about 200 volts and a local maximum at about 240 volts. The inverter may be configured to recognize these signals of reverse biased solar modules and may operate the solar modules at an absolute maximum or maximum power point voltage without the modules being reverse biased. In the example of FIG. 60B , the inverter may operate the modules at the maximum power point to ensure that there are no modules being reverse biased. Additionally or alternatively, a minimum operating voltage may be selected for the inverter below which it is unlikely that any modules will be reverse biased. This minimum operating voltage may be adjusted based on other variables such as ambient temperature, the operating current and calculated or measured solar module temperature, as well as other information received from external sources such as irradiance for example.

In some embodiments, the high DC voltage solar modules themselves may be shingled, with adjacent solar modules arranged in a partially overlapping manner and optionally electrically mutually in their overlapping regions. connected These shingled configurations include high voltage solar modules electrically connected in parallel that provide a high DC voltage to a string inverter, or high voltage solar modules each comprising a microinverter that converts the high DC voltage of the solar module to an AC module output. It can be used selectively for optical modules. A pair of high voltage solar modules may be shingled as described above and electrically connected in series to provide a desired DC voltage, for example.

Conventional string inverters: 1) they must be compatible with different series-connected module string lengths, 2) some modules in the string can be fully or partially shaded, and 3) changes in ambient temperature and radiation can cause the module voltage to Because they vary, they often require a fairly wide range (or 'dynamic range') of the potential input voltage. In systems employing a parallel configuration as described herein, the length of the string of parallel connected solar modules does not affect the voltage. Also, for cases where some modules are partially shaded and some are not, it may be determined (eg, as described above) to operate the system at the voltage of the unshaded modules. Therefore, the input voltage range of the inverter in a parallel configuration system may only need to accommodate factor #3 - the 'dynamic range' of temperature and radiation changes. Since this is small, for example, about 30% of the required conventional dynamic range of inverters, inverters employed in parallel configuration systems as described herein have narrow widths, for example about 250 volts and high voltages at standard conditions. It can have an MPPT (Maximum Power Point Tracking) between about 175 volts at temperature and low radiation, or, for example, about 450 volts at standard conditions and about 350 volts at high temperature and low radiation (in this case 450 volts MPPT). operation can correspond to a V _OC below 600 volts at the lowest temperature operation). Also, as described above, the inverters can receive sufficient DC voltage to be converted directly to AC without a boost phase. Accordingly, string inverters employed in parallel configuration systems as described herein may be simpler, have the lowest cost, and operate with higher efficiencies than string inverters employed in conventional systems. there is.

For both microinverters and string inverters employed in the high voltage direct current shingled solar cell modules described herein, the AC peak-to-peak It may be desirable to configure the solar module (or a short series connected string of solar modules) to provide an operating (eg, maximum power point Vmp) DC voltage above peak). For example, for 120V AC, peak-to-peak is sqrt(2)*120V=170V. Thus, the solar modules may be configured to provide a minimum Vmp of, for example, about 175V. At standard conditions Vmp can then be about 212V (assuming a negative voltage temperature coefficient of 0.35% and a maximum operating temperature of 75°C), and at the lowest temperature operating condition (eg -15°C) Vmp can then be about 242V, so Voc can be about 300V or less (depending on module charge factor). All of these numbers double for split phase 120V AC (or 240V AC), which is convenient because 600V DC is the maximum allowed in the US for many residential applications. For commercial applications that require and allow higher voltages, these numbers can be increased further.

A high voltage shingled solar cell module as described herein is >600 V _OC or >1000V _OC , in which case the module may include integrated power electronics to prevent an external voltage provided by the module from exceeding code requirements. This arrangement allows the operating V _mp to be sufficient for split phase 120V (240V, requiring about 350V) without the problem of V _OC at low temperatures in excess of 600V.

When a building's connection to the power distribution network is disconnected, for example by firefighters, the solar modules that provide electricity to the building (eg on a building roof) still have power when the sun is shining. can produce This raises concerns that these solar modules may sustain the roof's electricity at hazardous voltages after disconnection of the building from the grid. To address this concern, the high voltage, direct current shingled solar cell modules described herein may optionally include a disconnect, for example in or adjacent to a module junction box. The disconnect may be, for example, a physical disconnect or a solid state disconnect. The disconnect can be configured to be “normally off” for example, thereby disconnecting the high voltage output of the solar module from the roof circuit upon loss of a certain signal (eg, from the inverter). do. Communication for the disconnect may be over high voltage cables, for example via separate wired or wireless.

An important advantage of shingling for high voltage solar modules is heat diffusion between solar cells in a shingled super cell. The inventors have discovered that heat can be readily transferred along a silicon super cell through thin, electrically and thermally conductive bonds between adjacent and overlapping silicon solar cells. The thickness of the electrically conductive bond between adjacent and overlapping solar cells formed by the electrically conductive bonding material, measured orthogonal to the front and back surfaces of the solar cells, is, for example, about 200 microns. less than or equal to, less than or equal to about 150 microns, less than or equal to about 125 microns, less than or equal to about 100 microns, less than or equal to about 90 microns, less than or equal to about 80 microns, or , less than or equal to about 70 microns, less than or equal to about 60 microns, less than or equal to about 50 microns, or less than or equal to about 25 microns. This thin bond reduces resistive losses in the interconnections between cells and also enhances the flow of heat along the super cell from any hot spots in the super cell that may have developed during operation. The thermal conductivity of the bond between the solar cells can be, for example, ≥ about 1.5 watts/(meter-K). In addition, the rectangular aspect ratio of the solar cells employed herein typically provides extended areas of thermal contact between adjacent solar cells.

In contrast, in conventional solar modules employing ribbon interconnects between adjacent solar cells, heat generated within one solar cell does not readily diffuse through the ribbon interconnects to other solar cells in the module. does not This makes it easier for conventional solar modules to develop hot spots than the solar modules described herein.

Moreover, since the super cells described herein are typically formed by shingling rectangular solar cells each having an active area smaller (eg, 1/6) less than that of a conventional solar cell, the embodiment described herein Current through a super cell in optical modules is typically less than through a string of conventional solar cells.

As a result, less heat is dissipated in the solar cell reverse biased at the breakdown voltage in the solar modules disclosed herein, and the heat is dissipated through the super cell and the solar module without creating a hazardous hot spot. can spread easily.

Some additional and optional features may make high voltage solar modules employing super cells as described herein more tolerant of heat dissipated within a reverse biased solar cell. For example, the super cells may be encapsulated in a thermoplastic olefin (TPO) polymer. TPO encapsulants are photo-thermal more stable than standard ethylene-vinyl acetate (EVA) encapsulants. EVA will be brown in temperature and UV light, and will lead to hot spot problems created by current limiting cells. In addition, the solar modules may have a glass-glass structure in which the encapsulated super cells are interposed between a glass front sheet and a glass back sheet. This glass-to-glass structure allows safe operation at higher temperatures than would be tolerated by conventional polymer backsheets. Moreover, the junction boxes, if present, are on one or more edges of a solar module rather than behind the solar module over which the junction box could add an additional layer of thermal insulation to the solar cells in the module thereon. can be mounted on

The present inventors have thus found that high voltage solar power formed from super cells as described herein, as heat flow through the super cells may allow the module to operate without significant risk of having one or more reverse biased solar cells. It has been recognized that modules may employ far fewer bypass diodes than in conventional solar modules. For example, in some variations high voltage solar modules as described herein may include less than one bypass diode in 25 solar cells, less than one bypass diode in 30 solar cells, 50 solar cells less than one bypass diode per s, less than one bypass diode in 75 solar cells, less than one bypass diode in 100 solar cells, employing only a single bypass diode, or employing a bypass diode I never do that.

Referring now to FIGS. 61A-61C , example high voltage solar modules utilizing bypass diodes are provided. When a portion of a solar module is shaded, damage to the module can be prevented or reduced through the use of bypass diodes. For the exemplary solar module 4700 shown in FIG. 61A , ten super cells 100 are connected in series. As illustrated, the 10 super cells are arranged in parallel rows. Each super cell contains 40 series connected solar cells 10 , wherein each of the 40 solar cells is made approximately 1/6 of a square or pseudo-square, as described herein. Under normal unshaded operation, current flows from the junction box 4716 through each of the super cells 100 connected in series through connectors 4715 , after which the current flows through the junction box 4717 . comes out Optionally, a single junction box may be used in place of the separate junction boxes 4716, 4717, so that the current returns to one junction box. The example shown in FIG. 61A shows an implementation with approximately one bypass diode per super cell. As shown, a single bypass diode is electrically coupled between a pair of neighboring super cells at a point approximately midway along the super cells (eg, a single bypass diode 4901A is connected to the first electrically connected between a 22nd solar cell of a super cell and its neighboring solar cell in the second super cell, a second bypass diode 4901B is electrically connected between the second super cell and the third super cell connected to, etc.). The first and last strings of cells only have approximately half the number of solar cells in a super cell per bypass diode. For the example shown in Figure 61a, the first and last strings of cells contain only 22 cells per bypass diode. The total number of bypass diodes 11 for the variant of the high voltage solar module illustrated in FIG. 61A is equal to the number of super cells plus one additional bypass diode.

Each bypass diode may be integrated into a flex circuit, for example. Referring now to FIG. 61B , an enlarged view of the bypass diode connected region of two neighboring super cells is shown. The time point for FIG. 61B is from the non-solar side. As shown, two solar cells 10 on neighboring super cells are electrically connected using a flex circuit 4718 comprising a bypass diode 4720 . A flex circuit 4718 and a bypass diode 4720 are electrically connected to the solar cells 10 using contact pads 4719 located on the back surfaces of the solar cells (also bypassing hidden taps). See the following detailed discussion of the use of hidden contact pads to provide pass diodes). Additional bypass diode electrical connection schemes may be employed to reduce the number of solar cells per bypass diode. One example is illustrated in FIG. 61C . As shown, one bypass diode is electrically coupled between each pair of approximately intermediate neighboring super cells along the super cells. A bypass diode 4901A is electrically connected between neighboring solar cells on the first and second super cells, and a bypass diode 4901B is electrically connected between neighboring solar cells on the second and third super cells. electrically connected, a bypass diode 4901C electrically connected between neighboring solar cells on the third and fourth super cells, and so on. A second set of bypass diodes may be included to reduce the number of solar cells that will be bypassed in case of partial shading. For example, bypass diode 4902A is electrically coupled between the first and second super cells at a midpoint between bypass diodes 4901A, 4901B, and bypass diode 4902B is a bypass diode Electrically connected between the second and third super cells at the midpoint between 4901B, 4901C, etc., reducing the number of cells per bypass diode. Optionally, another set of bypass diodes can be electrically connected to further reduce the number of solar cells bypassed in case of partial shading. A bypass diode 4903A is electrically connected between the first and second super cells at a midpoint between the bypass diodes 4902A, 4901B, and a bypass diode 4903B is connected to the bypass diodes 4902B; 4901C) electrically connected between the second and third super cells, further reducing the number of cells per bypass diode. This configuration results in the inherent configuration of bypass diodes allowing small groups of cells to be bypassed during partial shading. Additional diodes may be electrically connected in this manner until a desired number of solar cells per bypass diode, for example about 8, about 6, about 4 or about 2 solar cells per bypass diode, are implemented. In some modules, about 4 solar cells per bypass diode is desirable. If desired, one or more of the bypass diodes illustrated in FIG. 61C may be incorporated into the concealed flexible interconnect as illustrated in FIG. 61B .

Solar cell and solar cell cleaving tools that can be used, for example, to cut conventionally sized square or pseudo square solar cells into a plurality of narrow rectangular or substantially rectangular solar cells. Cutting methods are disclosed. These cutting tools and methods bend the conventionally sized solar cells against the curved support surface, thereby cutting the solar cells along prefabricated scribe lines with the curved bottom surfaces of the conventionally sized solar cells. A vacuum is applied between the support surfaces. An advantage of these cutting tools and methods is that they do not require physical contact with the top surfaces of the solar cells. Accordingly, these cutting tools and methods may be employed to cut solar cells comprising soft and/or uncured materials on their upper surfaces that could be damaged by physical contact. Also, in some variations, these cutting tools and cutting methods may only require contact to portions of the bottom surfaces of the solar cells. In such variations, these cutting tools and methods may be employed to cut solar cells comprising soft and/or uncured materials on portions of their bottom surfaces not contacted by the cutting tool.

For example, one method of manufacturing a solar cell utilizing the cutting tools and methods disclosed herein comprises each of one or more conventionally sized silicon solar cells to define a plurality of rectangular regions on the silicon solar cells. laser scribing one or more scribe lines on the surface, applying an electrically conductive adhesive bonding material to portions of the top surfaces of the one or more silicon solar cells, and on the long side flexing the one or more silicon solar cells against the curved support surface to provide a plurality of rectangular silicon solar cells each comprising a portion of the electrically conductive adhesive bonding material disposed on its front surface adjacently; , thereby applying a vacuum between the curved support surface and bottom surfaces of the one or more silicon solar cells to cut the one or more silicon solar cells along the scribe lines. The conductive adhesive bonding material may be applied to the conventionally sized silicon solar cells either before or after the solar cells are laser scribed.

The resulting plurality of rectangular silicon solar cells may be arranged in line with the long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with the electrically conductive adhesive bonding material disposed therebetween. The electrically conductive bonding material may then be cured, thereby bonding adjacent and overlapping rectangular silicon solar cells to each other and electrically connecting them in series. This process forms a shingled "super cell" as described in the patent applications previously listed in "REFERENCE TO RELATED APPLICATIONS IN THE TECHNICAL FIELD".

Referring back to the drawings to further understand the cutting tools and methods disclosed herein, FIG. 20A schematically illustrates a side view of an exemplary apparatus 1050 that may be used to cut scribed solar cells. In this arrangement, a scribed conventionally sized solar cell wafer 45 is carried over a curved portion of a vacuum manifold 1070 by a perforated moving belt 1060 . As the solar cell wafer 45 passes over the curved portion of the vacuum manifold, a vacuum applied through the perforations in the belt pulls the underside of the solar cell wafer 45 against the vacuum manifold, thereby Bend the solar cell accordingly. The radius of curvature R of the curved portion of the vacuum manifold may be chosen such that bending the solar cell wafer 45 in this way cuts the solar cell along the scribe lines to form rectangular solar cells 10 . can Rectangular solar cells 10 may be used, for example, in a super cell as illustrated in FIGS. 1 and 2 . The solar cell wafer 45 can be cut by this method without contacting the upper surface of the solar cell wafer 45 to which the conductive adhesive bonding material has been applied.

The cut is, for example, by arranging with respect to the scribe lines for each scribe line to be oriented at an angle θ to the vacuum manifold such that one end reaches the curved portion of the vacuum manifold before the other end. It may be initiated preferentially at one end of the line (ie at one edge of the solar cell 45 ). As shown in FIG. 20B , for example, the solar cells may have their scribe lines at an angle to the direction of travel of the belt and the cutting edge of the curve of the manifold oriented orthogonal to the direction of travel of the belt. can be oriented with As another example, FIG. 20C shows the direction of travel of the belt and cells oriented with their scribe lines orthogonal to the cutting portion of the curve of the manifold oriented at an angle to the direction of travel of the belt.

The cutting mechanism 1050 may utilize, for example, a single perforated moving belt 1060 having a width orthogonal to its direction of travel approximately equal to the width of the solar cell wafer 45 . Optionally, instrument 1050 may include two, three, four or more perforated moving belts 1060 that may be arranged together, for example side-by-side, and optionally spaced apart from each other. The cutting mechanism 1050 may utilize a single vacuum manifold that may have a width orthogonal to the direction of travel of the solar cells, for example approximately equal to the width of the solar cell wafer 45 . Such a vacuum manifold may be employed, for example, with a single full-width perforated moving belt 1060, or with two or more such belts, for example arranged side by side and optionally spaced apart from each other. can

The cutting tool 1050 may include two or more curved vacuum manifolds arranged side by side and spaced apart from each other, each vacuum manifold having the same curvature. Such an arrangement may be employed, for example, with a single full-length perforated moving belt 1060, or with two or more such belts arranged side by side and optionally spaced apart from each other. For example, the instrument may include a perforated moving belt 1060 for each vacuum manifold. In the latter arrangement, the vacuum manifolds and their corresponding perforated moving belts may be arranged to contact the bottom of the solar cell wafer along only two narrow strips defined by the widths of the belts. In such cases, the solar cell may include the soft materials in an area of the underside of the solar cell wafer that is not contacted by the belts without risk of damaging the soft materials during the cutting process.

Any suitable arrangement of perforated moving belts and vacuum manifolds may be used within the cutting tool 1050 .

In some variations, the scribed solar cell wafers 45 are coated with an uncured conductive adhesive bonding material and/or other surfaces on their top and/or bottom surfaces prior to cutting using a cutting tool 1050 . Includes soft materials. The scribing of the solar cell wafer and application of the soft material could occur in any order.

62A illustrates a side view of another exemplary cutting instrument 5210 similar to the cutting instrument 1050 described above, and FIG. 62B illustrates a top view. In use of the cutting tool 5210 , a conventionally sized scribed solar cell wafer 45 is a parallel spaced perforated belt moving at a constant speed over a pair of corresponding parallel and spaced vacuum manifolds 5235 . located on a pair of s 5230 . The vacuum manifolds 5235 typically have the same curvature. As the wafer advances the belts above the vacuum manifolds through cleavage region 5235C, the wafer is pulled against the curved support surfaces of the vacuum manifolds by the force of the vacuum pulling against the bottom of the wafer. The cutting radius defined as is bent at the main ear. As the wafer is bent around the cut radius, the scribe lines become cracks that separate the wafer into individual rectangular solar cells. As will be explained further below, the curvature of the vacuum manifolds is such that adjacent truncated rectangular solar cells are not coplanar, and the edges of adjacent truncated rectangular solar cells are thus affected after the cleaving process has occurred. arranged so as not to contact each other. The truncated rectangular solar cells may be continuously unloaded from the perforated belts in any suitable manner, some examples of which are described below. Typically, the unloading method further separates adjacent cleaved solar cells from each other to prevent contact between them when they are subsequently coplanar.

62A-62B, each vacuum manifold comprises, for example, a flat region 5235F that provides no vacuum, a low vacuum or a high vacuum; an optional curved transition region 5235T that provides for, or transitions from, low to high vacuum along its length; a cutting region 5235C that provides a high vacuum; and a sharper radius post cleav region 5235PC that provides a low vacuum. Belts 5230 transport wafers 45 from planar region 5235F into and through transition region 5235T, and thereafter into cleavage region 5235C, where the wafers are cleaved, after which they are cleaved. Transfer the resulting cleaved solar cells 10 out of cleavage region 5235C and into the post cleavage region 5235PC.

Flat region 5235F is typically operated at a sufficiently low vacuum to confine wafers 45 to the belts and vacuum manifolds. Here the vacuum can be low (or absent) as it reduces friction and thus reduces the belt tension required, and it is easier to confine the wafers 45 to a flat surface rather than curved surfaces. The vacuum in the flat region 5235F may be, for example, about 1 inch to about 6 inches of mercury.

Transition region 5235T provides a transition curve from flat region 5235F to cleavage region 5235C. The radius of curvature or radii of curvature in transition region 5235T is greater than the radius of curvature in cut region 5235C. The curve in the transition region 5235T may be, for example, part of an ellipse, although any suitable curve may be used. Wafers 45 approaching cleavage region 5235C through transition region 5235T at a shallower change in curvature than a direct transition from a flat orientation in region 5235F to a cleaving radius in cleavage region 5235C. Having the edges of the wafers 45 contributes to ensuring that they break the vacuum without lifting, which means that the edges of the wafers 45 confine the wafers to a cutting radius within the cutting area 5235C. can make things difficult. The vacuum in the transition region 5235T may be, for example, the same as in the cleavage region 5235C, may be intermediate between the cases in regions 5235F and 5235C, or as in region 5235F and Cases within region 5235C may transition along the length of region 5235T in between. The vacuum within the transition region 5235T may be, for example, about 2 inches to about 8 inches of mercury.

Cut region 5235C may have a varying radius of curvature or optionally a constant radius of curvature. Such a constant radius of curvature may be, for example, between about 11.5 inches, about 12.5 inches, or between about 6 inches and about 18 inches. Any suitable range of curvature may be used and selected based in part on the thickness and depth of the wafer 45 and the geometry of the scribe lines within the wafer 45 . Typically, the thinner the wafer, the shorter the radius of curvature required to bend the wafer sufficiently to split it along the scribe line. The scribe lines may have a depth of, for example, from about 60 microns to about 140 microns, although any other suitable shallower or deeper scribe line depth may be used. Typically, the shallower the scribe line, the shorter the radius of curvature required to bend the wafer sufficiently to split it along the scribe line. The cross-sectional shape of the scribe line also affects the required radius of curvature. A scribe line having a wedge-shaped or wedge-shaped bottom can concentrate stress more effectively than a scribe line having a rounded shape or a rounded bottom. The scribe lines that more effectively concentrate the stress may not require scribe lines that concentrate the stress less effectively as the radius of curvature within the sharp cut region.

The vacuum in the cutting region 5235C for at least one of the two parallel vacuum manifolds is typically in the other region to ensure that the wafer is properly constrained by the cutting radius of curvature to maintain a constant bending stress. higher than the Optionally and as further described below, one manifold in this area may provide a higher vacuum than the other to better control the cut along the scribe lines.

Post cut region 5235PC typically has a sharper radius of curvature than cut region 5235C. This prevents transporting the cleaved solar cells from the belts 5230 without rubbing or contacting the cracked surfaces of adjacent cleaved solar cells (which could cause solar cell failures from cracks or other failure types). make it possible In particular, a sharper radius of curvature provides greater separation between the edges of adjacent cleaved solar cells on the belts. The vacuum in the post cleavage region 5235PC will be low since the wafers 45 have already been cut into solar cells 10 and it is no longer required to limit the solar cells to the radius of the curve of the vacuum manifolds. (eg, similar to or the same as in the flat region 5235F). The edges of the cut solar cells 10 may be lifted off the belts 5230 , for example. It may also be desirable for the cleaved solar cells 10 not to be subjected to undue stress.

The flat, transitional, cut and post cut regions of the vacuum manifolds may be distinct portions of different curves with their ends mated. For example, the upper surface of each manifold may include a flat planar portion, an elliptical portion for the transition region, an arc of a circle for the cut region, and an arc or portion of an ellipse for the post cut region. can do. Optionally, some or all of the curved portion of the upper surface of the manifold may have a continuous geometric function of increasing curvatures (decreasing diameter of the contact circle). Suitable such functions may include, but are not limited to, helical functions such as clothoids and natural logarithmic functions, for example. Closoids are curves whose curvature increases linearly along the path length of the curve. For example, in some variations the transition, cleavage and post cleavage regions are all portions of a single clothoid curve having one end connected to the flat region. In some other variations, the transition region is a clothoid curve having one end connected to the flat region and the other end connected to a cleavage region having a circular curvature. In the latter variants, the post cleavage region may have, for example, a sharper radius of circular curvature or a sharper radius of closoid curvature.

As described above and schematically illustrated in FIGS. 62B and 63A , in some variations one manifold provides a high vacuum in the cut region 5235C and the other manifold provides a low vacuum in the cut region 5235C. provide a vacuum. The high vacuum manifold completely limits the end of the wafer it supports to the curvature of the manifold, which provides sufficient stress to the end of the scribe line overlying the high vacuum manifold to initiate cracking along the scribe line. Since the low vacuum manifold does not completely limit the end of the wafer it supports to the curvature of the manifold, the bend radius of the wafer on this side is sufficient to create the necessary stress to cause a crack to begin within the scribe line. not abrupt However, the stress is high enough to propagate cracks originating at the other end of the scribe line overlying the high vacuum manifold. Without some vacuum on the "low vacuum" side to partially and sufficiently confine this end of the wafer to the curvature of the manifold, cracks that originate on the opposing "high vacuum" end of the wafer will completely span the wafer. There may be a risk of not being transmitted. In variations as described above, one manifold may selectively provide a low vacuum along its entire length from flat region 5235F through post cut region 5235PC.

As previously discussed, the asymmetric vacuum placement within the cleavage region 5235C provides an asymmetric stress along the scribe lines that control the generation and propagation of cracks along the scribe lines. Referring for example to FIG. 63B , if instead two vacuum manifolds provide equal (eg, high) vacuums within cutting region 5235C, cracks may be created at both ends of the wafer and , can propagate towards each other and meet somewhere within the central region of the wafer. Under these circumstances, there is a risk that the cracks do not connect to each other and thus create a potential mechanical break point in the resulting cleaved cells where the cracks meet.

As an alternative or additional example to the asymmetric vacuum arrangement described above, cutting may be initiated preferentially at one end of the scribe line by arranging one end of the scribe line to reach the cutting area of the manifolds before the other end. This can be done, for example, by orienting the solar cell wafers at an angle to the vacuum manifolds as described above with respect to FIG. 20B . Optionally, the vacuum manifolds may be arranged such that the cut area of one of the two manifolds follows the belt path more than the cut area of the other vacuum manifold. For example, since two vacuum manifolds with the same radius of curvature may be slightly offset in the direction of travel of the moving belt, one manifold before the solar cell wafers reach the cleavage area of the other vacuum manifold. Reach the cut region of the fold.

Referring now to FIG. 64 , in the illustrated example each vacuum manifold 5235 includes through holes 5240 arranged in a row below the center of the vacuum channel 5245 . 65A-65B , vacuum channel 5245 is recessed into the upper surface of the manifold supporting perforated belt 5230 . Each vacuum manifold also includes central pillars 5250 positioned between the through holes 5240 and arranged in line below the center of the vacuum channel 5245 . Central pillars 5250 effectively separate vacuum channel 5245 into two parallel vacuum channels on either side of the row of central pillars. The central pillars 5250 also provide support for the belt 5230 . Without the central pillars 5250 , the belt 5230 may be exposed to a longer unsupported area and potentially sucked into the through holes 5240 . This can result in a three-dimensional bending of the wafers 45 (bending perpendicular to the cutting radius to the cutting radius) which can damage the solar cells and impede the cutting process.

65A-65B and 66-67, in the illustrated example through-holes 5240 include low vacuum chamber 5260L (flat region 5235F and transition region 5235T in FIG. 62A); high vacuum chamber 5260H (cutting region 5235C in FIG. 62A) and another low vacuum chamber 5260L (post cutting region 5235PC in FIG. 62A). This arrangement provides a smooth transition between the low and high vacuum regions within the vacuum channel 5245 . As the through holes 5240 provide sufficient flow resistance. If the area corresponding to the hole is left completely open, the airflow will not be completely deflected to this one hole, and the following areas will hold a vacuum. The vacuum channel 5245 serves to ensure that the vacuum belt holes 5255 will always have a vacuum and will not be in a dead spot when positioned between the through holes 5240 .

Referring again to FIGS. 65A-65B , and also referring to FIG. 67 , the perforated belts 5230 may be used for leading and trailing, for example, a wafer 45 or a cleaved solar cell 10 . trailing) edges 527 may comprise two rows of holes 5255 optionally arranged such that the belt is always under vacuum as it travels along the manifold. In particular, the staggered arrangement of holes 5255 in the illustrated example ensures that the edges of the wafer 45 or cleaved solar cell 10 always overlap with at least one hole 5255 in each belt 5230 . This serves to prevent the edges of the wafer 45 or the cleaved solar cell 10 from being lifted off the belt 5230 and manifold 5235 . Any other suitable arrangement of holes 5255 may be used. In some variations, the arrangement of the holes 5255 does not guarantee that the edges of the wafer 45 or the cleaved solar cell 10 are always under vacuum.

In the illustrated example of a cutting tool 5210 perforated moving belts 5230 are the bottom of the solar cell wafer 45 along two narrow strips defined by the widths of the belts along the lateral edge of the solar cell wafer. only in contact with Accordingly, the solar cell wafer is, for example, uncured in the area of the underside of the solar cell wafer that is not contacted by the belts 5230 without risk of damage to the soft material during the cutting process. It may include soft materials such as adhesives.

In alternative variations, the cutting mechanism 5210 may be approximately equal to the width of the solar cell wafer 45 orthogonal to its direction of travel rather than, for example, two perforated moving belts as described above. A single perforated moving belt 5230 having a width may be utilized. Optionally, the cutting tool 5210 may include three, four, or more perforated moving belts 5230 that may be arranged side by side in parallel and may optionally be spaced apart from each other. The cutting mechanism 5210 may utilize, for example, a single vacuum manifold 5235 that may have a width approximately equal to the width of the solar cell wafer 45 orthogonal to the direction of travel of the solar cells. . Such a vacuum manifold may be employed, for example, with a single full-width perforated moving belt 5230, or with two or more such belts arranged side by side in parallel and optionally spaced apart from each other. The cutting mechanism 5210 is supported along opposite lateral edges by, for example, two curved vacuum manifolds 5235 arranged side-by-side and spaced apart from each other, each vacuum manifold having the same curvature. It may include a single perforated moving belt 5230 . The cutting tool 5210 may include three or more curved vacuum manifolds 5235 arranged in parallel and spaced apart from each other, each vacuum manifold having the same curvature. Such an arrangement may be employed, for example, with a single full-width perforated moving belt 5230, or with three or more such belts arranged side by side in parallel and optionally spaced apart from each other. The cutting mechanism may include, for example, a perforated moving belt 5230 for each vacuum manifold.

Any suitable arrangement of perforated moving belts and vacuum manifolds may be used within the cutting tool 5210 .

As described above, in some variations, the scribed solar cell wafers 45 cut with the cutting tool 5210 are bonded to an uncured conductive adhesive on their top and/or bottom surfaces prior to cutting. material and/or other soft materials. Scribing of the solar cell wafer and application of the soft material could occur in any order.

The perforated belts 5230 in the cutting tool 5210 (and the perforated belts 1060 in the cutting tool 1050) cut the solar cell wafers 45, for example, at about 40 millimeters per second (mm/sec). s) to about 2000 mm/s or more, or about 40 mm/s to about 500 mm/s or more, or about 80 mm/s or more. Cleavage of solar cell wafers 45 may be facilitated at higher speeds than at lower speeds.

Referring now to FIG. 68 , when cut there will be some separation between the leading and trailing edges 527 of adjacent cut cells 10 due to the geometry of the bending around the curve, which is the adjacent cut sun Create a wedge-shaped gap between the cells. If the cleaved cells are brought back to a flat, coplanar orientation without initially increasing the separation between cleaved cells, there is a possibility that the edges of adjacent cleaved cells could contact and damage each other. It is therefore advantageous to remove the cleaved cells from the belts 5230 (or belts 1060) while they are still supported by the curved surface.

69A-69G show that cleaved solar cells can be removed from belts 5230 (or belts 1060), with one or more additional moving belts with improved separation between the cleaved solar cells. It illustrates several devices and methods that can be delivered to objects or moving surfaces. In the example of FIG. 69A , the cleaved solar cells 10 travel faster than the belts 5230 , and thus one or more transfer belts 5265 increasing separation between the cleaved solar cells 10 . ) from the belts 5230. Transport belts 5265 may be positioned between the two belts 5230 , for example. In the example of FIG. 69B , the cut wafers 10 are separated by a sliding down slide 5270 positioned between the two belts 5230 . In this example, belts 5230 each cleaved cell 10 to release the cleaved cell onto slide 5270 while the uncut portion of wafer 45 is still held by belts 5230 . into the low vacuum (eg, non-vacuum) region of the manifolds 5235 . Providing an air cushion between the cut cell 10 and the slide 5270 helps to ensure that both the cell and the slide are not worn out during operation, and also 10) slides off the wafer 45 faster and thus allows for faster cutting belt operating speeds.

In the example of FIG. 69C , carriages 5275A in a rotating “Ferris Wheel” arrangement 5275 transport cleaved solar cells 10 from belts 5230 to one or more belts 5280 ) is transferred to

In the example of FIG. 69D , a rotating roller 5285 moves actuators 5285A to pick up the cut solar cells 10 from the belts 5230 and position them on the belts 5280 . A vacuum is applied through

In the example of FIG. 69E , carriage actuator 5290 includes a carriage 5290A and an extendable and retractable actuator 5290B mounted on the carriage. Carriage 5290A positions actuator 5290B to remove cleaved solar cell 10 from belts 5230 , followed by actuator 5290B to place cleaved solar cell on belts 5280 . ) and move it back and forth to position it.

In the example of FIG. 69F , the carriage track arrangement 5295 positions the carriages 5295A to remove the cleaved solar cells 10 from the belts 5230 , followed by the cleaved solar cells 10 . and carriages 5295A attached to a moving belt 5300 that positions the carriages 5295A to position the carriages 5295A on the belts 5280, the latter of which is caused by the path of the belt 5230. It occurs as it falls off or is pulled from the belt 5280 .

In the example of FIG. 69G , the inverted vacuum belt arrangement 5305 is vacuumed through one or more moving perforated belts to transport the cleaved solar cells 10 from the belts 5230 to the belts 5280 . to authorize

70A-70C provide orthogonal projections of a further variation of the exemplary instrument described above with reference to FIGS. 62A-62B and subsequent figures. This variant 5310 allows for removal of cleaved solar cells 10 from the perforated belts 5230 that transfer an uncut wafer 45 into the cleavage area of the instrument, as in the example of FIG. 69a. Transfer belts 5265 are used. The perspective views of Figures 71A-71B show this variant of the cutting mechanism at two different stages of operation. In FIG. 71A , an uncut wafer 45 is approaching the cutting area of the instrument, in FIG. 71B the wafer 45 has entered the cutting area and the two cleaved solar cells 10 are Separated from the wafer, thereafter they are further separated from each other as they are transported by transport belts 5265 .

In addition to the features described above, FIGS. 70A-71B show multiple vacuum ports 5315 on each manifold. The use of multiple ports per manifold may allow more control over the variation of the vacuum along the length of the upper surface of the manifold. For example, other vacuum ports 5315 may selectively communicate with other vacuum chambers (eg, 5260L and 5260H in FIGS. 66 and 72B ) to provide different vacuum pressures along the manifold and/or or alternatively to other vacuum pumps. 70A-70B also show the complete paths of the wheels 5325 , the top surfaces of the vacuum manifolds 5235 , and the perforated belts 5230 circulating the wheels 5320 . Belts 5230 may be driven, for example, by wheels 5320 or wheels 5325 .

72A and 72B show perspective views of a portion of a vacuum manifold 5235 overlaid with a portion of a perforated belt 5230 for the variant of FIGS. 70A-71B , and FIG. 72A is a close-up view of a portion of FIG. 72B provides 73A shows a top view of a portion of a vacuum manifold 5235 overlaid with a perforated belt 5230, and FIG. 73B is a cross-sectional view of the same vacuum manifold and perforated belt arrangement taken along line CC shown in FIG. 73A. shows As shown in FIG. 73B , the relative orientations of through holes 5240 may vary along the length of the vacuum manifold so that each through hole is orthogonal to the portion of the upper surface of the manifold directly above the through hole. are arranged 74A shows another top view of a vacuum manifold 5235 overlaid with a perforated belt 5230, with vacuum chambers 5260L and 5260H shown in partial perspective views. 74B shows a close-up view of a portion of FIG. 74A.

75A-75G show some example hole patterns that may optionally be used for perforated vacuum belts 5230 . A common characteristic of these patterns is that, at any location on the belt, the straight edge of the cleaved solar cell 10 or wafer 45 intersecting the pattern orthogonal to the long axis of the belt always has at least one hole in each belt. (5255) will overlap. The patterns may be, for example, two or more rows of staggered square or rectangular holes ( FIGS. 75A , 75D ), two or more rows of staggered circular holes ( FIGS. 75B , 75E , 75G ), two or more rows of photo slots ( FIGS. 75C , 75F ), or any other suitable arrangement of holes.

Disclosed herein are high efficiency solar modules comprising silicon solar cells arranged in an overlapping shingled manner to form super cells, and electrically connected by conductive bonds between adjacent and overlapping solar cells, the Super cells are arranged in physically parallel rows within the solar module. A super cell may contain any suitable number of solar cells. The super cells may have a length that spans substantially the entire length or width of the solar module, for example, or two or more super cells may be arranged end-to-end in a row. This arrangement hides the solar cell to solar cell electrical interconnections and thus can be used to create visually attractive solar modules with little or no contrast between adjacent series connected solar cells.

Further disclosed herein are cell metallization patterns that enable stencil printing of metallization onto the front (and optionally) back surfaces of the solar cells. As used herein, “stencil printing” of cell metallization is the application of a metallization material (eg, silver paste) onto a solar cell surface through patterned openings in an otherwise impermeable sheet of material. It refers to applying The stencil may be, for example, a patterned stainless steel sheet. The patterned openings in the stencil are entirely free of stencil material, eg, do not include any mesh or screen. The absence of a mesh or screen material within the patterned stencil openings distinguishes "stencil printing" as used herein from "screen printing". In contrast, in screen printing the metallization material is applied onto the surface of a solar cell through a screen (eg a mesh) that supports a patterned impermeable material. The pattern includes openings in the opaque material through which the metallization material is applied to the solar cell. The support screen extends over the openings in the impermeable material.

Compared to screen printing, stencil printing of cell metallization patterns includes a stencil with narrower line widths, higher aspect ratio (height to line width), better line uniformity and definition, and longer lasting stencil compared to screen. This provides numerous advantages. However, stencil printing may not print 'islands' in one pass as may be required in conventional three bus bar metallization designs. In addition, stencil printing is not limited within the plane of the stencil during printing and does not print in one pass a metallization pattern that could have required the stencil to include unsupported structures that could interfere with the placement and use of the stencil. can't For example, stencil printing could include unsupported tongues of sheet material defined by openings for the bus bar and openings for the fingers, as a single stencil for such a design could include: It may not be possible to print a metallization pattern in which parallel-arranged metallization fingers are interconnected by bus bars or other metallization features running orthogonal to the fingers in one pass. The tongues may not be constrained to other parts of the stencil to lie within the plane of the stencil during printing by means of physical connections, may be moved out of plane, and may change the placement and use of the stencil.

Accordingly, attempts at using stencils to print traditional solar cells require two passes for front-side metallization with two different stencils or a stencil printing step combined with a screen printing step, which is a per cell print step. It increases the total number of pages and also creates a 'stitching' problem where the two prints overlap and result in double height. The stitching makes the processes more complicated, and the additional printing and related steps increase the cost. Stencil printing is thus not common for solar cells.

As further described below, the front surface metallization patterns described herein may include an array of fingers (eg, parallel lines) that are not interconnected by the front surface metallization pattern. These patterns can be stencil-printed in one pass with a single stencil since the desired stencil need not include unsupported portions or structures (eg, tongues). These front surface metallization patterns do not provide substantial current spreading or electrical conduction orthogonal to the fingers as the metallization pattern itself provides for standard sized solar cells and spaced solar cells interconnected by copper ribbons. It can be detrimental for strings of solar cells that become However, the front surface metallization patterns described herein are shingled rectangular solar cells as described herein in which a portion of the front surface metallization pattern of a solar cell overlaps and conductively bonds with the back surface metallization pattern of an adjacent solar cell. It can operate in batches. This is because the overlapping backside metallization of the adjacent solar cells can provide current spreading or electrical conduction orthogonal to the fingers in the frontside metallization pattern.

Referring now to the drawings for a more detailed understanding of the solar modules described herein, FIG. 1 is a shingled fashion with ends of adjacent solar cells overlapping and electrically connected to form a super cell 100 . It shows a cross-sectional view of a string of series-connected solar cells 10 that are arranged. Each solar cell 10 includes a semiconductor diode structure and electrical contacts to the semiconductor diode structure that can be provided to an external load when the current generated in the solar cell 10 is illuminated by light.

In the examples described herein, each solar cell 10 is a rectangular crystalline silicon solar having front (solar-side) and back-side (light-shielding) metallization patterns that provide electrical contact to opposite sides of an np junction. a battery, wherein the front surface metallization pattern is disposed on a semiconductor layer of n-type conductivity, and the rear surface metallization pattern is disposed on a semiconductor layer of p-type conductivity. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements may be used as appropriate. For example, the front surface (sun side) metallization pattern may be disposed on a semiconductor layer of p-type conductivity, and the back surface (light blocking side) metallization pattern may be disposed on a semiconductor layer of n-type conductivity. there is.

Referring back to FIG. 1 , adjacent solar cells 10 in a super cell 100 are electrically conductive so that they electrically connect the metallization pattern of one front surface solar cell to the rear surface metallization pattern of an adjacent solar cell. They are directly conductively bonded to each other in the overlapping regions by an adult bonding material. Suitable electrically conductive bonding materials may include, for example, electrically conductive adhesives and electrically conductive adhesive films and adhesive tapes, and conventional solders.

Referring again to FIG. 2 , FIG. 2 illustrates an exemplary rectangular solar module 200 comprising six rectangular super cells 100 each having a length approximately equal to the length of the long sides of the solar module. show The super cells are arranged as six parallel rows with their long sides oriented parallel to the long sides of the module. A similarly configured solar module may include more or fewer rows of super cells of this side length than is shown in this example. In other variations, the super cells may each have a length approximately equal to the length of the short side of the rectangular solar module, parallel to their long sides oriented parallel to the short sides of the module. It can be arranged in columns. In another arrangement, each row may include two or more super cells that may be interconnected in series electrically, for example. The modules may have short sides, for example, having a length of about 1 meter and long sides, for example, having a length of about 1.5 meters to about 2.0 meters. Any other suitable shapes (eg, square) and dimensions for the solar modules may also be used. Each super cell in this example contains 72 rectangular solar cells each having a width of approximately 1/6 the width of a 156 millimeter (mm) square or pseudo-square wafer and a length of about 156 mm. Any other suitable number of rectangular solar cells of any other suitable may also be used.

76 shows an exemplary front surface metallization pattern on a rectangular solar cell 10 that enables stencil printing as described above. The front surface metallization pattern may be formed of, for example, silver paste. In the example of FIG. 76 , the front surface metallization pattern includes a plurality of fingers 6015 running parallel to each other, parallel to the short sides of the solar cell, and orthogonal to the long sides of the solar cell. The front surface metallization pattern also includes each contact pad 6020 positioned at the end of the finger 6015, running parallel to the edge of the long side of the solar cell and adjoining the optional contact pads 6020. includes heat. Each contact pad 6020, when present, may include an electrically conductive adhesive (ECA), solder, or other electrically conductive adhesive (ECA), solder, or other electrically conductive adhesive used to conductively bond the front surface of the illustrated solar cell to the overlapping portion of the back surface of an adjacent solar cell. Create areas for individual beads of bonding material that are conductive. The pads may have, for example, circular, square, or rectangular shapes, although any suitable pad shape may be used. As an alternative example of using individual beads of electrically conductive bonding material, a series of ECA, solder, conductive tape, or other electrically conductive bonding material disposed along the edge of the long side of the solar cell is provided. Lines or dashed lines may interconnect some or all of the fingers as well as couple the solar cells to adjacent and overlapping solar cells. Such a dashed or continuous line of electrically conductive bonding material may be used with or without conductive pads at the ends of the fingers.

The solar cell 10 may have, for example, a length of about 156 mm, a width of about 26 mm and thus an aspect ratio (length of the short side/length of the long side) of about 1:6. Six such solar cells can be fabricated on a silicon wafer of standard 156 mm x 156 mm dimensions, then separated (dice) to provide solar cells as illustrated. In other variations, eight solar cells 10 with dimensions of 19.5 mm by 156 mm and thus an aspect ratio of about 1:8 may be fabricated from a standard silicon wafer. More generally, solar cells 10 may have aspect ratios of, for example, from about 1:2 to about 1:20, and may be fabricated from standard size wafers or wafers of any other suitable dimensions. .

Referring back to FIG. 76 , the front surface metallization pattern may include, for example, about 60 to about 120 fingers, for example, about 90 fingers, per 156 mm wide cell. The fingers 6015 may have widths of, for example, from about 10 microns to about 90 microns, such as about 30 microns. Fingers 6015 may have heights orthogonal to the surface of the solar cell, for example, between about 10 microns and about 50 microns. The finger heights can be, for example, about 10 microns or more, about 20 microns or more, about 30 microns or more, about 40 microns or more, or about 50 microns or more. The pads 6020 may have diameters (circles) or lateral lengths (squares or rectangles) of, for example, about 0.1 mm to about 1 mm, such as about 0.5 mm.

The back surface metallization pattern for a rectangular solar cell 10 may be, for example, a row of discrete contact pads, a row of interconnected contact pads, or a continuum running parallel to and adjacent to the edge of the long side of the solar cell. It may include a bus bar that becomes However, such contact pads or bus bars are not required. If the front surface metallization pattern includes contact pads 6020 arranged along one edge of the long sides of the solar cell, then the row or bus bar (if present) of contact pads in the back surface metallization pattern is arranged along the edge of the other long side of the solar cell. The backside metallization pattern may further include a metal backside contact that substantially covers all of the remaining backside of the solar cell. The exemplary back side metallization pattern of FIG. 77A includes a row of discrete contact pads 6025 in combination with a metal back contact 6030 as previously described, and the exemplary back side metallization pattern of FIG. 77B is as previously described. It includes a continuous bus bar 35 coupled to the same metal back contact 6030 .

In a shingled super cell, the front surface metallization pattern of a solar cell is conductively coupled to an overlapping portion of the back surface metallization pattern of an adjacent solar cell. For example, if the solar cells include front surface metallized contact pads 6020, each contact pad 6020 may be aligned and coupled with a corresponding back surface metalized contact pad 6025 (if present) or , may be aligned and mated with a backside metallized bus bar 35 (if present), or may be coupled to a metal backside contact 6030 (if present) on the adjacent solar cell. This may be, for example, discrete portions (eg, beads) of electrically conductive bonding material disposed on each contact pad 6020 , or running parallel to the edge of the solar cell and optionally the contact It may be implemented as a dashed or continuous line of electrically conductive bonding material that electrically interconnects two or more of the pads 6020 .

If the solar cells lack front surface metallization contact pads 6020, then, for example, each front surface metallization pattern finger 6015 is aligned and mated with a corresponding rear surface metallization contact pad 6025 (if present). may be, may be coupled to a backside metallized bus bar 35 (if present), or may be coupled to a metal backside contact 6030 (if present) on the adjacent solar cell. This may be, for example, discrete portions (eg, beads) of electrically conductive bonding material disposed on the overlapping end of each finger 6015 , or running parallel to the edge of the solar cell and optionally As a result, it may be implemented as a broken line or continuous line of electrically conductive bonding material electrically interconnecting two or more of the fingers 6015 .

As described above, portions of the overlapping backside metallization of the adjacent solar cell, for example backside bus bar 35 and/or backside metal contact 6030, if present, may be connected to the finger in the front side metallization pattern. They can provide current spreading and electrical conduction orthogonal to them. In variants utilizing dashed or continuous lines of electrically conductive bonding material as described above, the electrically conductive bonding material is electrically conductive and spreads current orthogonal to the fingers in the front surface metallization pattern. can provide The overlapping back metallization and/or the electrically conductive bonding material may carry current to, for example, bypass broken fingers or other finger breaks in the front side metallization pattern.

The backside metallized contact pads 6025 and bus bar 35, if present, may be formed of silver paste, which may be applied, for example, by stencil printing, screen printing, or any other suitable method. The metal back contact 6030 may be formed of, for example, aluminum.

Any other suitable backside metallization patterns and materials may also be used.

78 shows an exemplary front surface metallization pattern on a square solar cell 6300 that can be diced to form a plurality of rectangular solar cells each having the front surface metallization pattern shown in FIG. 76 .

79 shows an exemplary back surface metallization pattern on a square solar cell 6300 that can be diced to form a plurality of rectangular solar cells each having the back surface metallization pattern shown in FIG. 77A.

The front side metallization patterns described herein may enable stencil printing of the front side metallization on a standard three printer solar cell production line. For example, the production process may include stenciling or screen printing silver paste onto the back side of a square solar cell to form back side contact pads or back side silver bus bars using a first printer, followed by printing the back side silver paste drying, followed by stenciling or screen printing the aluminum contact on the back side of the solar cell using a second printer, followed by drying the aluminum contact, followed by a single stencil step to a third printer Stencil printing of silver paste onto the front surface of the solar cell to form a complete front surface metallization pattern using a single stencil, followed by drying of the silver paste, followed by firing the solar cell may include These printing and related steps may occur in any other order where appropriate, or may be omitted.

The use of a stencil to print the front surface metallization pattern enables the production of narrower fingers than would be possible with screen printing, which may improve solar cell efficiency and reduce the use of silver and thus production costs. Stencil printing of the front surface metallization pattern in a single stencil printing step to a single stencil can be combined with, for example, screen printing to print multiple stencils or overlapping stencils to define features extending in different directions. It enables the production of a full-surface metallization pattern having a uniform height without exhibiting the stitching that would otherwise occur when used for metallization.

After front and back surface metallization patterns are formed on the square solar cells, each square solar cell can be separated into two or more rectangular solar cells. This may be done, for example, by cutting or any other suitable method followed by laser scribing. The rectangular solar cells can then be arranged in an overlapping shingled fashion and conductively coupled to each other as described above to form a super cell. Disclosed herein are methods for manufacturing solar cells with reduced charge recombination losses at the edges of the solar cell, for example without cleaved edges that promote charge recombination. The solar cells may be, for example, silicon solar cells, and more particularly may be HIT silicon solar cells. Also disclosed herein are shingled (overlapping) super cell deployments of such solar cells. The individual solar cells in such a super cell may have narrow rectangular geometries (eg, strip-like shapes) with the long sides of adjacent solar cells arranged to overlap.

A major challenge for the cost-effective implementation of high-efficiency solar cells, such as HIT solar cells, has conventionally been the need for large amounts of metal to carry large currents from one such high-efficiency solar cell to an adjacent series-connected high-efficiency solar cell. is to recognize The process of dicing these high efficiency solar cells into narrow rectangular solar cell strips followed by overlapping with conductive bonds between overlapping portions of adjacent solar cells to form a series connected string of solar cells in a super cell. The process of arranging the resulting solar cells in a (shingled) pattern offers an opportunity to reduce module cost through process simplification. This is because the tabbing process steps conventionally required to interconnect adjacent solar cells with metal ribbons can be eliminated. This shingling approach also reduces the current through the solar cells (since the individual solar cell strips can have smaller active areas than conventionally) and by reducing the current path length between adjacent solar cells. It can improve module efficiency, all of which tend to reduce resistive losses. The reduced current may also enable replacement of more expensive and less resistive conductors (eg, silver) with less expensive but more resistive conductors (eg, copper) without significant loss of performance. Also, this shingling approach can reduce the inactive module area by removing interconnect ribbons and associated contacts from the front faces of the solar cells.

Conventionally sized solar cells may have substantially square front and back surfaces with dimensions of, for example, about 156 millimeters (mm) by about 156 mm. In the shingling scheme described above, such solar cells are diced into two or more (eg, two to twenty) 156 mm long solar cell strips. A potential difficulty with this shingling approach is that dicing a conventionally sized solar cell into thin strips increases the cell edge length per active area of the solar cell compared to conventionally sized solar cells, which The recombination of the charge in the field may degrade the performance.

For example, FIG. 80 shows a HIT solar cell 7100 having front and back dimensions of about 156 mm by about 156 mm, and several solar cells having narrow rectangular front and back surfaces of dimensions of about 156 mm by about 40 mm, respectively. A schematic illustration of the process of dicing into strips 7100a, 7100b, 7100c, 7100d (the 156 mm long sides of the solar cell strips extend into the figure). In the illustrated example, HIT cell 7100 includes an n-type microcrystalline base 5105, which has, for example, a square front surface having a thickness of about 180 microns and dimensions of about 156 mm by about 156 mm; can have a back. An about 5 nanometer (nm) thick layer of intrinsic amorphous Si:H(a-Si:H) and an about 5 nm thick layer of n+ doped a-Si:H (both layers together denoted by reference numeral 7110) This is deposited on the entire surface of the crystalline silicon base 7105 . A thick film 5120 of about 65 nm thick of transparent conducting oxide (TCO) is deposited over the a-Si:H layers 7110 . Conductive metal grid lines 7130 disposed on the TCO layer 7120 provide electrical contact to the front surface of the solar cell. An about 5 nm thick layer of intrinsic a-Si:H and an about 5 nm thick layer of p+ doped a-Si:H (both layers together denoted by reference numeral 7115) form the back surface of the crystalline silicon base 7105 placed on top An about 65 nm thick film 7125 of transparent conductive oxide (TCO) is disposed on the a-Si:H layers 7115 , and conductive metal grid lines 7135 disposed on the TCO layer 7125 are Provides electrical contact to the backside of the solar cell (dimensions and materials mentioned above are intended to be illustrative rather than limiting, and may vary as appropriate).

Still referring to FIG. 80 , when HIT solar cell 7100 is cut by conventional methods to form strip solar cells 7100a , 7100b , 7100c , 7100d , newly formed cut edges 7140 . is not passivated. These non-passivated edges contain a high density of dangling chemical bonds, which promotes charge recombination and reduces the performance of the solar cells. In particular, the cleaved surface 7145 exposing the n-p junction and the cleaved surface exposing the heavily doped front electric field (in layers 7110) are not passivated and can significantly enhance charge recombination. In addition, when conventional laser cutting or laser scribing processes are used to dic the solar cell 7100, thermal damage, such as recrystallization 7150 of amorphous silicon, may occur to the newly formed edges. there is. As a result of the non-passivated edges and the thermal damage, new edges formed on the cleaved solar cells 7100a, 7100b, 7100c, 7100d when conventional manufacturing processes are used are the short- circuit) current, the open circuit voltage and the pseudo-charge rate of the solar cells can be expected to decrease. This leads to a significant reduction in the performance of the solar cells.

The formation of the recombination-promoting edges during dicing of a conventionally sized HIT solar cell into narrower solar cell strips can be avoided in the manner illustrated in FIGS. 85A-85J . This method involves the use of the conventionally sized solar cell 7100 to electrically separate the pn junction and the heavily doped front electric field from the cleaved edges that could otherwise act as recombination sites for minority carriers. Use isolation trenches on the front and back surfaces. The trench edges are not defined by conventional cleavage, but are instead defined by chemical etching or laser patterning, followed by deposition of a passivation layer such as TCO which passivates both the front and back trenches. Compared to the heavily doped regions, the base doping is low enough such that the likelihood of electrons in the junction reaching unpassivated cleaved edges of the base is low. In addition, a kerf-free wafer dicing technique, thermal laser separation (TLS) can be used to cut the wafers, avoiding potential thermal damage.

In the example illustrated in Figures 85A-85J, the starting material is an as-cut wafer of n-type monocrystalline silicon of about 156 mm square, for example about 1 ohm-centimeter to about 3 ohm-centimeter. It may have a bulk resistivity, for example about 180 microns thick (wafer 7105 forms the base of the solar cells).

Referring to FIG. 81A , the as-cut wafer 7105 is typically texture etched, acid washed, cleaned, and dried.

Next, in FIG. 81b an intrinsic a-Si:H layer about 5 nm thick and a doped n+ a-Si:H layer about 5 nm thick (both layers are together denoted by reference numeral 7110) are, for example, Deposited on the front surface of the wafer 7105 by, for example, plasma enhanced chemical vapor deposition (PECVD) at a temperature of about 150° C. to about 200° C.

Next, in FIG. 81c an intrinsic a-Si:H layer about 5 nm thick and a doped p+ a-Si:H layer about 5 nm thick (both layers together denoted by reference numeral 7115) are, for example, It is deposited on the backside of the wafer 7105 by, for example, PECVD, at a temperature of about 150° C. to about 200° C.

Next, in FIG. 81D , the front a-Si:H layers 7110 are patterned to form isolation trenches 7112 . Isolation trenches 7112 typically penetrate layers 7110 to reach wafer 7105 and may have widths, for example, from about 100 microns to about 1000 microns, for example about 200 microns. Typically, the trenches have the smallest width that can be used depending on the accuracy of the patterning technique and subsequently applied cutting techniques. The patterning of the trenches 7112 may be accomplished using, for example, laser patterning or chemical etching (eg, inkjet wet patterning).

Next, in FIG. 81E , the back a-Si:H layers 7115 are patterned to form isolation trenches 7117 . Similar to isolation trenches 7112 , isolation trenches 7117 typically penetrate layers 7115 to reach wafer 7105 , for example from about 100 microns to about 1000 microns, for example may have widths of about 200 microns. The patterning of the trenches 7117 may be implemented using, for example, laser patterning or chemical etching (eg, inkjet wet patterning). Each trench 7117 is aligned with a corresponding trench 7112 on the front side of the structure.

Next, in FIG. 81F a TCO layer 7120 approximately 65 nm thick is deposited over the patterned front surface a-Si:H layers 7110 . This can be done, for example, by physical vapor deposition (PVD) or by ion plating. A TCO layer 7120 fills the trenches 7112 in the a-Si:H layers 7110 and coats the outer edges of the layers 7110 , thereby passivating the surfaces of the layers 7110 . The TCO layer 7120 also functions as an anti-reflective coating.

Next, in FIG. 81G a thick TCO layer 7125 of about 65 nm is deposited over the patterned backside a-Si:H layers 7115 . This can be done, for example, by PVD or by ion plating. A TCO layer 7125 fills the trenches 7117 in the a-Si:H layers 7115 and coats the outer edges of the layers 115 , thus passivating the surfaces of the layers 7115 . The TCO layer 7125 also functions as an anti-reflective coating.

Next, in FIG. 81H conductive (eg, metal) front grid lines 7130 are screen printed onto the TCO layer 7120 . The grid lines 7130 may be formed of, for example, low-temperature silver pastes.

Next, in FIG. 81I conductive (eg, metal) backside grid lines 7135 are screen printed onto the TCO layer 7125 . The grid lines 7135 may be formed of, for example, low temperature silver pastes.

Next, after deposition of grid lines 7130 and grid lines 7135 , the solar cell is cured at a temperature of, for example, about 200° C. for about 30 minutes.

Next, in FIG. 81J , the solar cell is separated into solar cell strips 7155a, 7155b, 7155c, 7155d by dicing the solar cell at the center of the trenches. Dicing may be accomplished using conventional laser scribing and mechanical cutting in the centers of the trenches to cut the solar cell in line with the trenches. Optionally, dicing is a thermal laser separation process (e.g., Xenoptic Corporation) in which laser induced heating at the centers of the trenches induces mechanical stress that results in cleavage of the solar cell conforming to the trenches. as developed by Jenoptik AG). The latter approach may avoid thermal damage to the edges of the solar cells.

The resulting strip solar cells 7155a-7155d differ from the strip solar cells 7100a-7100d shown in FIG. 80 . In particular, the edges of the a-Si:H layers 7110 and a-Si:H layers 7115 in the solar cells 7140a-7140d are formed by etching or laser patterning, not by mechanical cutting. Also, the layers 7110 and the edges of layers 7115 in solar cells 7155a-7155d are passivated by the TCO layer. As a result, solar cells 7140a-7140d lack cleaved edges that promote the charge recombination present in solar cells 7100a-7100d.

The method described with respect to FIGS. 81A- 81J is intended to be illustrative rather than limiting. Steps described as being performed in specific orders may be performed in other orders or in parallel as appropriate. Steps and material layers may be omitted, added or substituted where appropriate. For example, if copper plated metallization is used, then additional patterning and seed layer deposition steps may be included in the process. Also, in some variations, only the front surface a-Si:H layers 7110 are patterned to form isolation trenches, and isolation trenches are not formed in the rear surface a-Si:H layers 7115 . In other variations, only the back side a-Si:H layers 7115 are patterned to form isolation trenches, and no isolation trenches are formed in the front side a-Si:H layers 7115 . As in the examples of Figures 81a-j, dicing takes place in the centers of the trenches in these variants as well.

82A- The formation of edges that promote recombination during dicing of a conventionally sized HIT solar cell into narrow solar cell strips also uses isolation trenches similar to that employed in the method described with respect to FIGS. 81A- 81J . This can be avoided by the method illustrated in FIG. 82J.

82A, the starting material in this example is again a wafer 7105 as cut, which is again about 156 mm square n-type monocrystalline silicon, for example about 1 ohm-centimeter to about 3 ohm- It can have a bulk resistivity of centimeters, and can be, for example, about 180 microns thick.

82B , trenches 7160 are formed in the front surface of the wafer 7105 . These trenches may have depths of, for example, about 80 microns to about 150 microns, such as about 90 microns, and may have widths, for example, about 10 microns to about 100 microns. Isolation trenches 7160 define the geometry of the solar cell strips formed from wafer 7105 . As described below, wafer 7105 will be cut to match these trenches. The trenches 7160 may be formed, for example, by conventional laser wafer scribing.

Next, in Figure 82C, wafer 7105 is typically texture etched, acid washed, cleaned, and dried. The etch typically removes damage initially present in as-cut wafer 7105 surfaces or caused during formation of trenches 7160 . The etch may also widen and deepen trenches 7160 .

Next, in FIG. 82D an intrinsic a-Si:H layer about 5 nm thick and a doped n+ a-Si:H layer about 5 nm thick (both layers together denoted by reference numeral 7110) are, for example, about It is deposited on the front surface of the wafer 7105 by PECVD, for example, at a temperature of 150° C. to about 200° C.

Next, in Fig. 82E, an intrinsic a-Si:H layer about 5 nm thick and a doped p+ a-Si:H layer about 5 nm thick (both layers together denoted by reference numeral 7115) are, for example, It is deposited on the backside of the wafer 7105 by, for example, PECVD, at a temperature of about 150° C. to about 200° C.

Next, in FIG. 82F , a TCO layer 7120 approximately 65 nm thick is deposited over the front surface a-Si:H layers 7110 . This can be done, for example, by physical vapor deposition (PVD) or by ion plating. The TCO layer 7120 may fill the trenches 7160 and typically coat the walls and floors of the trenches 7160 and the outer edges of the layers 7110, thereby passivating the coated surfaces. . The TCO layer 7120 also functions as an anti-reflective coating.

Next, in FIG. 82G a thick TCO layer 7125 of about 65 nm is deposited on the back side a-Si:H layers 7115 . This can be done, for example, by PVD or by ion plating. A TCO layer 7125 passivates the surfaces (eg, including the outer edges) of the layers 7115 and also functions as an anti-reflective coating.

Next, in FIG. 82H conductive (eg, metal) front grid lines 7130 are screen printed onto the TCO layer 7120 . The grid lines 7130 may be formed of, for example, low-temperature silver pastes.

Next, in FIG. 82I conductive (eg, metal) backside grid lines 7135 are screen printed onto the TCO layer 7125 . The grid lines 7135 may be formed of, for example, low temperature silver pastes.

Next, after deposition of grid lines 7130 and grid lines 7135 , the solar cell is cured at a temperature of, for example, about 200° C. for about 30 minutes.

Next, in FIG. 82J the solar cell is separated into solar cell strips 7165a, 7165b, 7165c, 7165d by dicing the solar cell in the trenches. Dicing may be accomplished using conventional mechanical cutting in the center of the trenches to cut the solar cell in line with the trenches. Alternatively, dicing may be implemented using, for example, a thermal laser separation process as described above.

The resulting strip solar cells 7165a-7165d differ from the strip solar cells 7100a-7100d shown in FIG. 80 . In particular, the edges of the a-Si:H layers 7110 in the solar cells 7165a-7165d are formed by etching and not by mechanical cutting. Also, the edges of the layers 7110 in the solar cells 7165a-7165d are passivated by the TCO layer. As a result, solar cells 7165a-7165d lack cleaved edges that promote charge recombination present within solar cells 7100a-7100d.

The method described with respect to FIGS. 82A-82J is intended to be illustrative rather than limiting. Steps described as being performed in a particular order may be performed in other orders or in parallel as appropriate. Steps and materials and layers may be omitted, added or substituted where appropriate. For example, if copper plated metallization is used, then additional patterning and seed layer deposition steps may be included in the process. Also, in some variations, trenches 7160 may be formed on the back side of the wafer 7105 rather than on the front side of the wafer 7105 .

81A-81J and 86A-86J are applicable to both n-type and p-type HIT solar cells. The solar cells can be either a front emitter or a back emitter. It may be desirable to apply a separation process to the side without the emitter. Also, the use of isolation trenches and passivation layers as described above to reduce recombination on cleaved wafer edges can be applied to other solar cell designs and solar cells using a material system other than silicon.

Referring again to FIG. 1 , a string of series-connected solar cells 10 formed by the methods described above is shingled with ends of adjacent solar cells overlapping and electrically connected to form a super cell 100 . It can be advantageously arranged in a deed manner. In a super cell 100, adjacent solar cells 10 are separated by an electrically conductive bonding material that electrically connects the front surface metallization pattern of one solar cell to the rear surface metallization pattern of the adjacent solar cell. They are conductively coupled to each other in the overlapping regions. Suitable electrically conductive bonding materials may include, for example, electrically conductive adhesives and electrically conductive adhesive films and adhesive tapes, and conventional solders.

Referring again to FIGS. 5A-5B , FIG. 5A is an exemplary rectangular solar cell comprising twenty rectangular super cells 100 each having a length approximately equal to half the length of the short sides of the solar module. A module 200 is shown. Super cells are arranged end-to-end in pairs to form ten rows of super cells, the rows and long sides of the super cells being oriented parallel to the short sides of the solar module. In other variations, each row of super cells may include three or more super cells. Also, in other variations, super cells may be arranged end-to-end in rows, the rows and long sides of the super cells may be oriented parallel to the long sides of a rectangular solar module, or a square sun It may be oriented parallel to the side of the optical module. Moreover, a solar module may include more or fewer super cells and more or fewer rows of super cells than is shown in this example.

In variants in which the super cells in each row are arranged such that at least one of them has a front end contact on the end of the super cell adjacent the other super cell in the row, the optional gap shown in FIG. 5A ( 210 may be present to enable electrical contact to the front end contacts of the super cells 100 along the centerline of the solar module. In variants where each row of super cells includes three or more super cells, additional optional gaps between the super cells similarly provide electrical contact to front end contacts located away from the sides of the solar module. may exist to enable

5B shows another exemplary rectangular solar module 300 comprising ten rectangular super cells 100 each having a length approximately equal to the length of the short sides of the solar module. The super cells are arranged with their long sides oriented parallel to the short sides of the module. In other variations, the super cells may have lengths approximately equal to the length of the long sides of a rectangular solar module and be oriented with their long sides parallel to the long sides of the solar module. can The super cells may also have lengths approximately equal to the length of the sides of a square solar module and may be arranged with their long sides oriented parallel to the side of the solar module. In addition, the solar module may include super cells of this side length more or less than shown in this example.

FIG. 5B also shows how the solar module 200 of FIG. 5A would look when there is no gap between adjacent super cells in rows of super cells in the solar module 200 . Any other suitable arrangement of super cells 100 within a solar module may also be used.

The following enumerated paragraphs provide additional, non-limiting aspects of the invention.

1. Solar module,

A series connected string of rectangular or substantially rectangular solar cells having an average breakdown voltage of at least about 10 volts of N≧25, wherein the solar cells are adjacent to each other conductively bonded to each other with an overlapping and electrically and thermally conductive adhesive. grouped into one or more super cells comprising two or more of said solar cells arranged in line with long sides of said solar cells;

A single solar cell or group of <N solar cells in the string of solar cells is not individually electrically connected in parallel with a bypass diode.

2. The solar module of clause 1, wherein N is an integer greater than or equal to 30.

3. The solar module of clause 1, wherein N is an integer greater than or equal to 50.

4. The solar module of clause 1, wherein N is an integer greater than or equal to 100.

5. The solar module of clause 1, wherein the adhesive has a thickness less than or equal to about 0.1 mm orthogonal to the solar cells between adjacent solar cells and about 1.5 w/m/k orthogonal to the solar cells Form bonds with greater or equal thermal conductivity.

6. The solar module of clause 1, wherein the solar cells of N are grouped into a single super cell.

7. The solar module of clause 1, wherein said super cells are encapsulated with a polymer.

7A. The solar module of clause 7, wherein the polymer comprises a thermoplastic olefin polymer.

7B. The solar module of clause 7, wherein the polymer is interposed between the glass front sheet and the back sheet.

7C. The solar module of clause 7B, wherein the back sheet comprises glass.

8. The solar module of clause 1, wherein said solar cells are silicon solar cells.

9. Solar module,

a super cell substantially transversing the entire length or width of the solar module parallel to the edge of the solar module, wherein the super cells overlap and adjacent adjacent cells conductively bonded to each other with an electrically and thermally conductive adhesive. a series connected string of N rectangular or substantially rectangular solar cells having a breakdown voltage of at least about 10 volts arranged in line with the long sides of the solar cells;

A single solar cell or group of <N solar cells in the super cell is not individually electrically connected in parallel with a bypass diode.

10. In the solar module of item 9, N>24.

11. The solar module of clause 9, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

12. The solar module of clause 9, wherein the super cells are encapsulated in a thermoplastic olefin polymer interposed between glass front and back sheets.

13. Super Cell,

A plurality of silicon solar cells, each silicon solar cell comprising:

a rectangular or substantially rectangular front surface and a rear surface having shapes defined by first and second oppositely located parallel long sides and two oppositely located short sides, wherein at least portions of the front surfaces are exposed to solar radiation during operation of the string of solar cells;

an electrically conductive front surface metallization pattern disposed on the front surface and comprising at least one front surface contact pad positioned adjacent the first long side;

an electrically conductive backside metallization pattern disposed on the backside and comprising at least one backside contact pad positioned adjacent the second long side;

The silicon solar cells are lined up with first and second long sides of overlapping adjacent silicon solar cells, overlapping to electrically connect the silicon solar cells in series, and adjacently conductively bonded with a conductive adhesive bonding material. disposed in line with front and back contact pads on silicon solar cells;

The front surface metallization pattern of each silicon solar cell comprises a barrier configured to substantially confine the conductive adhesive bonding material to at least one front surface contact pad prior to curing the conductive adhesive bonding material during fabrication of the super cell. .

14. The super cell of clause 13, wherein for each pair of adjacent and overlapping silicon solar cells, the barrier on the front side of one of the silicon solar cells is overlapped and hidden by a portion of the other silicon solar cell, thus The conductive adhesive bonding material is substantially confined to overlapping regions of the front surface of the silicon solar cell prior to curing of the conductive adhesive bonding material during fabrication of the super cell.

15. The super cell of clause 13, wherein the barrier comprises at least one front surface contact pad positioned between the continuous conductive line and a first long side of the solar cell, wherein the barrier comprises substantially the entire length of the first long side. A continuous conductive line running parallel to

16. The super cell of clause 15, wherein the front surface metallization pattern comprises fingers electrically connected to the at least one front surface contact pads and running orthogonal to the first long side, the continuous conductive line comprising: Electrically interconnect the fingers to provide multiple conductive paths from each finger to at least one front contact pad.

17. The super cell of clause 13, wherein the front surface metallization pattern comprises a plurality of discrete contact pads arranged in parallel rows and adjacent to the first long side, and wherein the barrier is electrically conductive during fabrication of the super cell. and a plurality of features forming separate barriers for each discrete contact pad that substantially confine the conductive adhesive bonding material to the discrete contact pads prior to curing the adhesive bonding material.

18. The super cell of clause 17, wherein the separated barriers are adjacent to and greater than their corresponding distinct contact pads.

19. Super Cell,

a plurality of silicon solar cells, each silicon solar cell comprising:

Rectangular or substantially rectangular front and back surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, wherein at least some of the front surfaces are exposed to solar radiation during operation of the string of solar cells;

an electrically conductive front surface metallization pattern disposed on the front surface and comprising at least one front surface contact pad positioned adjacent the first long side;

an electrically conductive backside metallization pattern disposed on the backside and comprising at least one backside contact pad positioned adjacent the second long side;

The silicon solar cells overlap and adjacent silicon solar cells with front and back contact pads on adjacent silicon solar cells overlapping and conductively bonded to each other with a conductive adhesive bonding material to electrically connect the silicon solar cells in series. arranged in line with the first and second long sides of the

The back surface metallization pattern of each silicon solar cell comprises a barrier configured to substantially confine the conductive adhesive bonding material to the at least one back surface contact pads prior to curing the conductive adhesive bonding material during fabrication of the super cell. include

20. The super cell of clause 19, wherein the back surface metallization pattern comprises one or more discrete contact pads arranged in a parallel row and adjacent to the second long side, wherein the barrier comprises: and a plurality of features forming separate barriers for each discrete contact pad substantially confining the conductive adhesive bonding material to the discrete contact pads prior to curing of the conductive adhesive bonding material.

21. The super cell of clause 20, wherein the separating barriers abut their corresponding distinct contact pads. bigger than that

22. A method of making a string of solar cells, the method comprising:

dicing one or more pseudo square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a plurality of rectangular silicon solar cells each having a substantially equal length along its long axis; and

arranging the rectangular silicon solar cells in line with long sides of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series;

The plurality of rectangular silicon solar cells comprises at least one rectangular solar cell having two chamfered corners corresponding to corners or portions of the corners of the pseudo-square wafer; Silicon solar cells each lack chamfered edges;

The spacing between the parallel lines along which the pseudo-square wafer is diced is a width orthogonal to the long axis of the rectangular silicon solar cells comprising chamfered corners and the rectangular silicon lacking chamfered corners. Compensating for the chamfered corners by making them larger than a width orthogonal to the long axis of the solar cells so that each of the plurality of rectangular silicon solar cells in the string of solar cells is exposed to light in operation of the string of solar cells. It is chosen to have a front surface with substantially the same area.

23. A string of solar cells is

a plurality of silicon solar cells arranged in line with ends of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series;

at least one of the silicon solar cells has chamfered corners corresponding to corners or portions of corners of a pseudo-square silicon wafer from which it was diced, wherein at least one of the silicon solar cells lacks chamfered corners; Each of the silicon solar cells has a front surface of substantially equal area that is exposed to light during operation of the string of solar cells.

24. A method of making two or more strings of solar cells, the method comprising:

A first plurality of rectangular silicon solar cells comprising chamfered corners corresponding to corners or portions of corners of the pseudo square silicon wafers and each first length being equal to the entire width of the pseudo square silicon wafers. dicing one or more pseudo square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a second plurality of rectangular silicon solar cells spanning and lacking chamfered corners;

the chamfered edge from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells each having a second length shorter than the first length and lacking chamfered edges removing them;

Long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells in series to form a solar cell string having a width equal to the first length. arranging the second plurality of rectangular silicon solar cells in line with the ; and

Long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the third plurality of rectangular silicon solar cells in series to form a solar cell string having a width equal to the second length. arranging the third plurality of rectangular silicon solar cells in line with the

25. A method of making two or more strings of solar cells, the method comprising:

A first plurality of rectangular silicon solar cells comprising chamfered corners corresponding to corners or portions of corners of pseudo square silicon wafers and a second plurality of rectangular silicon solar cells lacking chamfered corners dicing one or more pseudo square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form

arranging the first plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the first plurality of rectangular silicon solar cells in series to do; and

arranging the second plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells in series including the steps of

26. A method of making a solar module, the method comprising:

A plurality of rectangular silicon solar cells from a plurality of pseudo square silicon wafers comprising chamfered corners corresponding to corners of the pseudo square silicon wafers and a plurality of rectangular silicon solar cells lacking chamfered corners. dicing each of a plurality of pseudo square silicon wafers along a plurality of lines parallel to a long edge of the wafer to form cells;

a first embodiment comprising only rectangular silicon solar cells each lacking chamfered corners arranged in line with long sides of the silicon solar cells overlapping and conductively bonded to each other to electrically connect the silicon solar cells in series. 1 arranging at least some of the rectangular silicon solar cells lacking chamfered corners to form a plurality of super cells;

a first embodiment comprising only rectangular silicon solar cells each comprising chamfered corners arranged in line with long sides of the silicon solar cells overlapping and conductively bonded to each other to electrically connect the silicon solar cells in series. 2 arranging at least some of the rectangular silicon solar cells comprising chamfered corners to form a plurality of super cells; and

arranging the super cells in parallel rows of substantially equal length super cells to form the front surface of the solar module.

27. The solar module of clause 26, wherein two of the rows of super cells adjacent parallel opposed edges of the solar module include only super cells from the second plurality of super cells, a super cell All other columns of s include only super cells from the first plurality of super cells.

28. The solar module of clause 27, wherein the solar module comprises a total of six rows of super cells.

29. Super Cell,

a plurality of silicon solar cells arranged in line in a first direction with ends of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series; and

Conductive on the front or back side of that of an end of the silicon solar cells at three or more distinct locations arranged along the second direction and having its long axis oriented parallel to a second direction orthogonal to the first direction and running at least the full width of the end solar cell in the second direction, having a conductor thickness less than or equal to about 100 microns measured orthogonal to the front or back surface of the end silicon solar cell, and about 0.012 ohms. provide resistance to current flow in the second direction less than or equal to, and provide for differential expansion between the interconnect and the end silicon solar cell in the second direction for a temperature range of about -40°C to about 85°C and an extended and flexible electrical interconnect configured to provide flexibility to receive.

30. The super cell of clause 29, wherein the dielectric electrical interconnect has a conductor thickness less than or equal to about 30 microns measured orthogonal to the front and back surfaces of the end silicon solar cell.

31. The super cell of clause 29, wherein the flexible electrical interconnect is in the second direction past the super cell to provide electrical interconnection for at least a second super cell positioned parallel to and adjacent to the super cell in a solar module. is extended to

32. The super cell of clause 29, wherein the flexible electrical interconnect comprises:

extend past the super cell in the first direction to provide electrical interconnection to at least a second super cell positioned parallel to and in line with the super cell in the solar module.

33. Solar modules,

a plurality of super cells arranged in two or more parallel rows spanning the width of the module to form a front face of the module, each super cell overlapping and conductive to each other to electrically connect silicon solar cells in series having a plurality of silicon solar cells arranged in line with ends of adjacent silicon solar cells to be coupled;

At least an end of a first super cell adjacent an edge of the module in a first row is coupled to a front surface of the first super cell at a plurality of discrete locations with an electrically conductive adhesive bonding material, the edge of the module a second super adjacent to the same edge of the modules in a second row through a flexible electrical interconnect that runs parallel to, at least partially folded around the end of the first super cell and is hidden from view from the front of the module electrically connected to the end of the cell.

34. The solar module of clause 33, wherein surfaces of the flexible electrical interconnect on a front surface of the module are covered or colored to reduce visual contrast with the super cells.

35. The solar module of clause 33, wherein two or more parallel rows of super cells are arranged on a white back sheet to form a front surface of the solar module illuminated by solar radiation during operation of the solar module wherein the white back sheet comprises darkened stripes having positions and widths corresponding to the width and positions of the gaps between the parallel rows of super cells, the white portions of the back sheets comprising the gaps between the rows not visible through them

36. A method of making a string of solar cells, the method comprising:

laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells;

applying an electrically conductive adhesive bonding material to the one or more scribed silicon solar cells at one or more locations adjacent the long side of each rectangular area;

separating the silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells each comprising a portion of the electrically conductive adhesive bonding material disposed on its front surface adjacent its long side;

arranging the plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween; ; and

curing the electrically conductive bonding material to bond adjacent and overlapping rectangular silicon solar cells to each other and to electrically connect them in series.

37. A method of making a string of solar cells, the method comprising:

laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells, each solar cell having a top surface and an opposing surface It has a bottom that is positioned so as to be;

applying an electrically conductive adhesive bonding material to portions of the top surfaces of the one or more silicon solar cells;

applying a vacuum between the bottom surfaces of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against a curved support surface, each disposed on its front surface along its long side cutting the one or more silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells including a portion of the electrically conductive adhesive bonding material;

arranging the plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween; comprising;

curing the electrically conductive bonding material, bonding adjacent and overlapping rectangular silicon solar cells to each other, and electrically connecting them in series.

38. The method of clause 37, wherein the electrically conductive adhesive bonding material is applied to the one or more silicon solar cells, followed by one or more scribe on each of the one or more silicon solar cells. laser scribing the lines.

9. The method of clause 37, further comprising laser scribing the one or more scribe lines on each of the one or more silicon solar cells, and then applying the electrically conductive adhesive bonding material to the one or more and applying the above silicon solar cells.

40. Solar modules,

a plurality of super cells arranged in two or more parallel rows to form the front face of the solar module, each super cell being adjacent to an overlapping and conductively coupled to each other to electrically connect silicon solar cells in series a plurality of silicon solar cells arranged in line with ends of the silicon solar cells, each super cell having a front end contact at one end of the super cell and a back end of opposite polarity at an opposite end of the super cell including contacts;

The first row of super cells comprises a first super cell arranged with its front end contact adjacent and parallel to a first edge of the solar module, the solar module extending and running parallel to a first edge, conductively coupled to a front end contact of the first super cell, and occupies only a narrow portion of the front surface of the solar module adjacent the first edge of the solar module; and a first flexible electrical interconnect no wider than about one centimeter measured orthogonal to a first edge of the optical module.

41. The solar module of clause 40, wherein a portion of the first flexible electrical interconnect extends around an end of the first super cell closest to the first edge of the solar module and behind the first super cell.

42. The solar module of clause 40, wherein the first flexible interconnect comprises a thin ribbon portion conductively coupled to a front end contact of the first super cell and a thick portion running parallel to the first edge of the solar module. include

43. The solar module of clause 40, wherein the first flexible interconnect comprises a thin ribbon portion conductively coupled to a front end contact of the first super cell and a coil running parallel to a first edge of the solar module; colied) includes a ribbon portion.

44. The solar module of clause 40, wherein the second row of super cells comprises a second super cell arranged with its front end contact adjacent and parallel to a first edge of the solar module, the first The front end contact of the super cell is electrically connected to the front end contact of the second super cell via the first flexible electrical interconnect.

45. The solar module of clause 40, wherein the back end contact of the first super cell is positioned adjacent and parallel to a second edge of the solar module opposite from the first edge of the solar module, and extends and the and a second flexible electrical interconnect running parallel to a second edge of the solar module, conductively coupled to a back end contact of the first super cell, and overlying generally behind the super cells.

46. In the solar module of clause 45,

the second row of super cells is arranged with its front end contacts adjacent and parallel to the first edge of the solar module and its rear end contacts positioned adjacent and parallel to the second edge of the solar module. contains 2 super cells;

the front end contact of the first super cell is electrically connected to the front end contact of the second super cell via the first flexible electrical interconnect;

The back end contact of the first super cell is electrically connected to the back end contact of the second super cell via the second flexible electrical interconnect.

47. In the solar module of clause 40,

a second arranged in the first row of super cells in series with the first super cell and having a back end contact thereof adjacent a second edge of the solar module opposite a first edge of the solar module super cell; and

and a second flexible electrical interconnect extending generally and running parallel to a second edge of the solar module, conductively coupled to a back end contact of the first super cell, and overlying generally behind the super cells.

48. In the solar module of clause 47,

The second row of super cells includes a third super cell and a fourth super cell arranged in series, the front end contact of the third super cell adjacent a first edge of the solar module, the fourth super cell a back end contact of the cell is adjacent a second edge of the solar module;

the front end contact of the first super cell is electrically connected to the front end contact of the third super cell through the first flexible electrical interconnect, and the back end contact of the second super cell comprises the second flexible electrical interconnect. electrically connected to the rear end contact of the fourth super cell through the

49. The solar module of clause 40, wherein the super cells comprise darkened stripes having positions and widths corresponding to positions and widths of gaps between parallel rows of super cells. and the white portions of the back sheets are not visible through the gaps between the rows.

50. The solar module of clause 40, wherein all portions of the first flexible electrical interconnect located on a front surface of the solar module are covered or colored to reduce visible contrast with the super cells.

51. In the solar module of clause 40,

Each silicon solar cell,

Rectangular or substantially rectangular front and back surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, at least a portion of the front surfaces; are exposed to solar radiation during operation of the string of solar cells;

an electrically conductive front surface metallization disposed on the front surface and comprising a plurality of fingers running orthogonal to the long sides and a plurality of discrete front surface contact pads positioned in a row adjacent the first long side a pattern, each front contact pad electrically connected to at least one of the fingers;

an electrically conductive backside metallization pattern disposed on the backside and comprising a plurality of discrete backside contact pads positioned in a row adjacent the second long side;

Within each super cell the silicon solar cells are aligned and overlapping with separate front surface contact pads corresponding to first and second long sides of adjacent silicon solar cells to electrically connect the silicon solar cells in series; arranged in a line with separate back surface contact pads on adjacent silicon solar cells that overlap and are conductively bonded to each other with a conductive adhesive bonding material.

52. The solar module of clause 51, wherein the front surface metallization pattern of the silicon solar cell comprises a plurality of thin conductors electrically interconnecting adjacent discrete front surface contact pads, each thin conductor comprising one of the thin conductors of the solar cells. thinner than the width of the discrete contact pads measured perpendicular to the long sides.

53. The solar module of clause 51, wherein the conductive adhesive bonding material is characterized by features of the front surface metallization pattern forming one or more barriers adjacent the discrete front contact pads. substantially limited to their positions.

54. The solar module of clause 51, wherein the conductive adhesive bonding material is configured to position the discrete back surface contact pads by way of the back surface metallization pattern features forming one or more barriers adjacent the discrete back surface contact pad. are practically limited to

55. A method of making a solar module, the method comprising:

assembling a plurality of super cells, each super cell having a plurality of rectangular silicon solar cells arranged in a row at ends on long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner and;

An electrically conductive bonding material disposed between the overlapping ends of the adjacent rectangular silicon solar cells is cured by applying heat and pressure to the super cells to bond adjacent and overlapping rectangular silicon solar cells to each other. coupling and electrically connecting them in series;

arranging and interconnecting the super cells in a desired solar module configuration as a stack of layers comprising an encapsulant;

and applying heat and pressure to the stack of layers to form a laminated structure.

56. The method of clause 55, wherein heat and pressure are applied to the super cells prior to applying heat and pressure to the stack of layers to form the laminated structure to cure or partially cure the electrically conductive bonding material. and forming cured or partially cured super cells as an intermediate product prior to forming the laminated structure.

57. The method of clause 56, wherein each additional rectangular silicon solar cell is added to the super cell during assembly of the super cell, wherein the electrically conductive adhesive bond between the newly added solar cell and its adjacent and overlapping solar cell A rectangular silicon solar cell of different material is cured or partially cured before being added to the super cell.

58. The method of clause 56, comprising curing or partially curing all of the electrically conductive bonding material in the super cell in the same step.

59. In the method of clause 56,

prior to applying heat and pressure to the super cells prior to applying heat and pressure to the stack of layers to form the laminated structure to partially cure the electrically conductive bonding material, thereby forming the laminated structure. forming partially cured super cells as intermediate products; and

and completing curing of the electrically conductive bonding material while applying heat and pressure to the stack of layers to form the laminated structure.

60. The method of clause 55, wherein heat and pressure are applied to the stack of layers to form the laminated structure without forming cured or partially cured super cells as an intermediate product prior to forming the laminated structure. while curing the electrically conductive bonding material.

61. The method of clause 55, comprising dicing one or more silicon solar cells into rectangular shapes to provide the rectangular silicon solar cells.

62. The method of clause 61, wherein the electrically conductive adhesive bonding material is applied prior to dicing the one or more silicon solar cells to provide rectangular silicon solar cells having a pre-applied electrically conductive adhesive bonding material. and applying to one or more silicon solar cells.

63. The method of clause 62, wherein the electrically conductive adhesive bonding material is applied to the one or more silicon solar cells, and thereafter, one or more lines on each of the one or more silicon solar cells. using a laser to scribe the cells, then cutting the one or more silicon solar cells along the scribe lines.

64. The method of clause 62, further comprising using a laser to scribe one or more lines on each of the one or more silicon solar cells, and then applying the electrically conductive adhesive bonding material to the one or more applying to silicon solar cells, and then cutting the one or more silicon solar cells along the scribe lines.

65. The method of clause 62, wherein the electrically conductive adhesive bonding material is applied to a top surface of each of the one or more silicon solar cells and to an oppositely located bottom surface of each of the one or more silicon solar cells. applying a vacuum between the bottom surfaces of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against the curved support surface, thereby and cutting the one or more silicon solar cells accordingly.

66. The method of clause 61, further comprising applying the electrically conductive adhesive bonding material to the rectangular silicon solar cells after dicing the one or more silicon solar cells to provide the rectangular silicon solar cells. includes

67. The method of clause 55, wherein the conductive adhesive bonding material has a glass transition temperature less than or equal to about 0°C.

1A. solar modules,

a plurality of super cells arranged in two or more parallel rows to form the front surface of the solar module, each super cell being adjacent to an overlapping and conductively coupled to each other to electrically connect silicon solar cells in series a plurality of silicon solar cells arranged in line with ends of the silicon solar cells, each super cell having a front end contact at one end of the super cell and a back end of opposite polarity at an opposite end of the super cell having a contact;

The first row of super cells has a first super cell arranged with a front end contact adjacent and parallel to a first edge of the solar module, the solar module comprising:

a narrow surface of the front surface of the solar module that extends and runs parallel to a first edge of the solar module, conductively coupled to a front end contact of the first super cell, and adjacent the first edge of the solar module and a first flexible electrical interconnect occupying only a portion and not wider than about one centimeter measured orthogonal to a first edge of the solar module.

2A. The solar module of clause 1A, wherein a portion of the first flexible electrical interconnect extends around an end of the first super cell closest to the first edge of the solar module and behind the first super cell.

3A. The solar module of clause 1A, wherein the first flexible interconnect comprises a thin ribbon portion conductively coupled to a front end contact of the first super cell and a thicker portion running parallel to the first edge of the solar module. do.

4A. The solar module of clause 1A, wherein the first flexible interconnect comprises a thin ribbon portion conductively coupled to a front end contact of the first super cell and a coiled ribbon portion running parallel to the first edge of the solar module. include

5A. The solar module of clause 1A, wherein the second row of super cells comprises second super cells arranged with their front end contacts adjacent and parallel to the first edge of the solar module, the first super cell The front end contact of is electrically connected to the front end contact of the second super cell through the first flexible electrical interconnect.

6A. The solar module of clause 1A, wherein the back end contact of the first super cell is positioned adjacent and parallel to a second edge of the solar module opposite a first edge of the solar module, and a second flexible electrical interconnect extending and running parallel to a second edge, conductively coupled to a back end contact of the first super cell, and overlying generally behind the super cells.

7A. In the solar module of clause 6A,

the second row of super cells is arranged with its front end contacts adjacent and parallel to the first edge of the solar module and its rear end contacts positioned adjacent and parallel to the second edge of the solar module. contains 2 super cells;

the front end contact of the first super cell is electrically connected to the front end contact of the second super cell via the first flexible electrical interconnect;

The back end contact of the first super cell is electrically connected to the back end contact of the second super cell through the second flexible electrical interconnect.

8A. In the solar module of clause 1A,

a second super cell arranged in a first row of super cells in series with the first super cell and having a back end contact adjacent a second edge of the solar module opposite a first edge of the solar module; and

and a second flexible electrical interconnect extending and running parallel to a second edge of the solar module, conductively coupled to a back end contact of the first super cell, and overlying generally behind the super cells.

9A. In the solar module of clause 8A,

The second row of super cells is in series with a front end contact of a third super cell adjacent a first edge of the solar module and a back end contact of a fourth super cell adjacent a second edge of the solar module the third super cell and the fourth super cell arranged as

the front end contact of the first super cell is electrically connected to the front end contact of the third super cell through the first flexible electrical interconnect, and the back end contact of the second super cell comprises the second flexible electrical interconnect. and electrically connected to the rear end contact of the fourth super cell via

10A. The solar module of clause 1A, wherein there are no electrical interconnections between the super cells that reduce active areas of the front surface of the module away from outer edges of the solar module.

11A. The solar module of clause 1A, wherein at least one pair of super cells is arranged in a row with one back end contact of the pair of super cells adjacent to another back end contact of the pair of super cells in a row. do.

12A. In the solar module of clause 1A,

at least one pair of super cells arranged in a row in a row with adjacent ends of the two super cells having end contacts of opposite polarity;

adjacent ends of the pair of super cells overlap;

Super cells in the pair of super cells are electrically connected in series by a flexible electrical interconnect that is interposed between their overlapping ends and does not block the front side.

13A. The solar module of clause 1A, wherein the super cells are arranged on a white backing sheet having parallel darkened stripes having positions and widths corresponding to the positions and widths of gaps between the parallel rows of super cells. and the white portions of the back sheets are not visible through the gaps between the rows.

14A. The solar module of clause 1A, wherein all portions of the first flexible electrical interconnect located on a front surface of the solar module are covered or colored to reduce visible contrast with the super cells.

15A. In the solar module of clause 1A,

Each silicon solar cell is

Rectangular or substantially rectangular front and back surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, wherein at least some of the front surfaces are exposed to solar radiation during operation of the string of solar cells;

an electrically conductive front surface metallization pattern disposed on the front surface, the electrically conductive front surface metallization pattern having a plurality of fingers running orthogonal to the long sides and a plurality of discrete front surface contact pads positioned in a row adjacent the first long side wherein each front contact pad is electrically connected to at least one of the fingers;

an electrically conductive backside metallization pattern disposed on the backside and having a plurality of discrete backside contact pads positioned in a row adjacent the second long side;

Within each super cell the silicon solar cells are aligned, overlapping with first and second long sides of overlapping adjacent silicon solar cells with a conductive adhesive bonding material to electrically connect the silicon solar cells in series. arranged in line with corresponding discrete front surface contact pads and discrete back surface contact pads on adjacent silicon solar cells that are conductively coupled to each other.

16A. The solar module of clause 15A, wherein the front surface metallization pattern of each silicon solar cell comprises a plurality of thin conductors electrically interconnecting adjacent discrete front surface contact pads, each thin conductor comprising a long surface of the solar cells. thinner than the width of the discrete contact pads measured orthogonal to the sides.

17A. The solar module of clause 15A, wherein the conductive adhesive bonding material is substantially limited to locations of the discrete front surface contact pads by features of the front surface metallization pattern forming barriers around each discrete front surface contact pad. do.

18A. The solar module of clause 15A, wherein the conductive adhesive bonding material is substantially limited to locations of the discrete back surface contact pads by features of the back surface metallization pattern forming barriers around each discrete back surface contact pad. do.

19A. The solar module of clause 15A, wherein said discrete back surface contact pads are discrete silver back surface contact pads, and wherein said back surface metallization pattern of each silicon solar cell except for said discrete silver back surface contact pads is in an adjacent silicon solar cell. do not include silver contacts at any location lying under a portion of the front surface of the solar cell that is not overlapped by

20A. solar modules,

a plurality of super cells, each super cell having a plurality of silicon solar cells arranged in line with ends of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series; ;

Each silicon solar cell is

Rectangular or substantially rectangular front and back surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, wherein at least some of the front surfaces are exposed to solar radiation during operation of the string of solar cells;

an electrically conductive front surface metallization pattern disposed on the front surface, the electrically conductive front surface metallization pattern having a plurality of fingers running orthogonal to the long sides and a plurality of discrete front surface contact pads positioned in a row adjacent the first long side including,

each front contact pad electrically connected to at least one of the fingers;

an electrically conductive backside metallization pattern disposed on the backside and having a plurality of discrete backside contact pads positioned in a row adjacent the second long side;

The silicon solar cells in each super cell are overlapping and first and second long sides of adjacent silicon solar cells and aligned, overlapping and conductive to each other with a conductive adhesive bonding material to electrically connect the silicon solar cells in series. arranged in line with corresponding discrete front surface contact pads and discrete back surface contact pads on adjacent silicon solar cells coupled to each other;

The super cells are arranged in a single row or two or more parallel rows substantially transverse to the length or width of the solar module to form a front surface of the solar module that is illuminated by solar radiation during operation of the solar module. are arranged as

21A. The solar module of clause 20A, wherein the discrete back surface contact pads are discrete silver back surface contact pads, and wherein the back surface metallization pattern of each silicon solar cell except for the discrete silver back contact pads is in an adjacent silicon solar cell. do not include silver contacts at any location lying under a portion of the front surface of the solar cell that is not overlapped by

22A. The solar module of clause 20A, wherein the front surface metallization pattern of each silicon solar cell comprises a plurality of thin conductors electrically interconnecting adjacent discrete front surface contact pads, each thin conductor comprising a long surface of the solar cells. thinner than the width of the discrete contact pads measured orthogonal to the sides.

23A. The solar module of clause 20A, wherein the conductive adhesive bonding material is substantially limited to locations of the discrete front surface contact pads by features of the front surface metallization pattern forming barriers around each discrete front surface contact pad. do.

24A. The solar module of clause 20A, wherein the conductive adhesive bonding material is substantially limited to locations of the discrete back surface contact pads by features of the back surface metallization pattern forming barriers around each discrete back surface contact pad. do.

25A. super cell,

a plurality of silicon solar cells, each silicon solar cell comprising:

Rectangular or substantially rectangular front and back surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, wherein at least portions of the front surfaces are exposed to solar radiation during operation of the string of solar cells;

an electrically conductive front surface metallization pattern disposed on the front surface, the electrically conductive front surface metallization pattern having a plurality of fingers running orthogonal to the long sides and a plurality of discrete front surface contact pads positioned in a row adjacent the first long side wherein each front contact pad is electrically connected to at least one of the fingers;

an electrically conductive backside metallization pattern disposed on the backside and having a plurality of discrete silver backside contact pads positioned in a row adjacent the second long side;

The silicon solar cells are arranged to electrically connect the silicon solar cells in series and first and second long sides of the overlapping and adjacent silicon solar cells and adjacent adjacent silicon solar cells overlapping and conductively bonded to each other with a conductive adhesive bonding material. arranged in line with separate front contact pads and separate back contact pads on the silicon solar cells.

26A. The solar module of clause 25A, wherein said discrete back surface contact pads are discrete silver back surface contact pads, and wherein said back surface metallization pattern of each silicon solar cell except for said discrete silver back surface contact pads is in an adjacent silicon solar cell. do not include silver contacts at any location lying under a portion of the front surface of the solar cell that is not overlapped by

27A. The string of solar cells of clause 25A, wherein the front surface metallization pattern comprises a plurality of thin conductors electrically interconnecting adjacent discrete front surface contact pads, each thin conductor orthogonal to the long sides of the solar cells. It is thinner than the width of the separate contact pads, which is measured to

28A. The string of solar cells of clause 25A, wherein the conductive adhesive bonding material is substantially limited to locations of the discrete front surface contact pads by features of the front surface metallization pattern forming barriers around each discrete front surface contact pad. do.

29A. The string of solar cells of clause 25A, wherein the conductive adhesive bonding material is substantially limited to locations of the discrete back surface contact pads by features of the back surface metallization pattern forming barriers around each discrete back surface contact pad. do.

30A. The string of solar cells of clause 25A, wherein the conductive adhesive bonding material has a glass transition less than or equal to about 0°C.

31A. In the method of making a solar module, the method comprises:

assembling a plurality of super cells, each super cell having a plurality of rectangular silicon solar cells arranged in line with ends on long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner; and;

Heat and pressure are applied to the super cells to cure an electrically conductive bonding material disposed between overlapping ends of the adjacent rectangular silicon solar cells, thereby bonding adjacent and overlapping rectangular silicon solar cells to each other. and electrically connecting them in series;

arranging and interconnecting the super cells within a desired solar module configuration in a stack of layers comprising an encapsulant;

and applying heat and pressure to the stack of layers to form a laminated structure.

32A. The method of clause 31A, wherein heat and pressure are applied to the super cells prior to applying heat and pressure to the stack of layers to form the laminated structure to cure or partially cure the electrically conductive bonding material. curing to form cured or partially cured super cells as an intermediate product prior to forming the laminated structure.

33A. The method of clause 32A, wherein each additional rectangular silicon solar cell is added to the super cell during assembly of the super cell, the electrically conductive adhesive bond between the newly added solar cell and its adjacent and overlapping solar cells A rectangular silicon solar cell of different material is cured or partially cured before being added to the super cell.

34A. The method of clause 32A, comprising curing or partially curing all of the electrically conductive bonding material in the super cell in the same step.

35A. In the method of clause 32A,

Applying heat and pressure to the super cells to partially cure the electrically conductive bonding material prior to applying heat and pressure to the stack of layers to form the laminated structure, thereby forming the laminated structure. forming partially cured super cells as intermediate products prior to and

fully curing the electrically conductive bonding material while applying heat and pressure to the stack of layers to form the laminated structure.

36A. The method of clause 31A, wherein the electrically conductive while applying heat and pressure to the stack of layers to form the laminated structure without forming partially cured super cells as an intermediate product prior to forming the laminated structure. and curing the adult binding material.

37A. The method of clause 31A, comprising dicing one or more silicon solar cells into rectangular shapes to provide the rectangular silicon solar cells.

38A. The method of clause 37A, wherein the electrically conductive adhesive bonding material is applied to the one or more silicon solar cells prior to dicing the one or more silicon solar cells to provide rectangular silicon solar cells having a pre-applied electrically conductive adhesive bonding material. and further applied to silicon solar cells.

39A. The method of clause 38A, wherein the electrically conductive adhesive bonding material is applied to the one or more silicon solar cells, and then scribes one or more lines on each of the one or more silicon solar cells. using a laser to do so, and then cutting the one or more silicon solar cells along the scribe lines.

40A. The method of clause 38A, further comprising using a laser to scribe one or more lines onto the one or more silicon solar cells, and then applying the electrically conductive adhesive bonding material to the one or more silicon solar cells. and then cutting the one or more silicon solar cells along the scribe lines.

41A. The method of clause 38A, wherein the electrically conductive adhesive bonding material is applied to a top surface of each of the one or more silicon solar cells and is not applied to an oppositely located bottom surface of each of the one or more silicon solar cells. and applying a vacuum between the bottom surfaces of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against a curved support surface, thereby flexing the one or more silicon solar cells along the scribe lines. and cutting one or more silicon solar cells.

42A. The method of clause 37A, comprising applying the electrically conductive adhesive bonding material to the rectangular silicon solar cells after dicing the one or more silicon solar cells to provide the rectangular silicon solar cells. do.

43A. The method of clause 31A, wherein the conductive adhesive bonding material has a glass transition temperature less than or equal to about 0°C.

44A. In the method of making a super cell, the method comprises:

laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells, wherein the long side of each rectangular region is applying an electrically conductive adhesive bonding material at one or more locations adjacent to the one or more scribed silicon solar cells;

separating the silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells each comprising a portion of the electrically conductive adhesive bonding material disposed on its front surface adjacent its long side; and;

arranging the plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween; includes;

curing the electrically conductive bonding material, thereby bonding adjacent and overlapping rectangular silicon solar cells, and electrically connecting them in series.

45A. In the method of making a super cell, the method comprises:

laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells, each solar cell having a top surface and an opposing surface It has a bottom that is positioned so as to be;

applying an electrically conductive adhesive bonding material to portions of the top surfaces of the one or more silicon solar cells;

applying a vacuum between the bottom surfaces of the one or more silicon solar cells and the curved support surface to flex the one or more silicon solar cells against a curved support surface, thereby respectively adjoining the long side thereof cutting the one or more silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells comprising a portion of the electrically conductive adhesive bonding material disposed on the front surface;

arranging the plurality of rectangular silicon solar cells in line on the long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween; includes;

curing the electrically conductive bonding material, bonding adjacent and overlapping rectangular silicon solar cells to each other, and electrically connecting them in series.

46A. In the method of making a super cell, the method comprises:

dicing one or more pseudo square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a plurality of rectangular silicon solar cells each having a substantially equal length along its long axis; and

arranging the rectangular silicon solar cells in line with long sides of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series;

The plurality of rectangular silicon solar cells comprises at least one rectangular solar cell having two chamfered corners corresponding to corners or portions of corners of the pseudo square wafer and one lacking chamfered corners; or more rectangular silicon solar cells;

The spacing between parallel lines along which the pseudo-square wafer is dice is equal to the width orthogonal to the true axis of the rectangular silicon solar cells having the chamfered corners. selected so that each of the plurality of rectangular silicon solar cells in the string of solar cells has a front surface of substantially equal area exposed to light during operation of the string of solar cells by making it greater than a width orthogonal to the long axis of the cells. do.

47A. super cell,

a plurality of silicon solar cells arranged in line with portions of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series;

at least one of the silicon solar cells has chamfered corners corresponding to corners or portions of corners of a pseudo-square silicon wafer into which it is diced, wherein at least one of the silicon solar cells lacks chamfered corners; Each of the silicon solar cells has a front surface of substantially equal area that is exposed to light during operation of the string of solar cells.

48A. A method of making two or more super cells, the method comprising:

a first plurality of rectangular silicon solar cells each having chamfered corners corresponding to corners or portions of corners of the pseudo square silicon wafers and a second length each over the entire length of the pseudo square silicon wafers dicing one or more pseudo square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a second plurality of rectangular silicon solar cells having chamfered edges;

the chamfered edge from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells each having a second length shorter than the second length and lacking chamfered edges removing them;

Long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells in series to form a solar cell string having a width equal to the first length. arranging the second plurality of rectangular silicon solar cells in line with the ; and

Long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the third plurality of rectangular silicon solar cells in series to form a solar cell string having a width equal to the second length. arranging the third plurality of rectangular silicon solar cells in line with the

49A. A method of making two or more super cells, the method comprising:

A first plurality of rectangular silicon solar cells having chamfered corners corresponding to corners or portions of corners of pseudo square silicon wafers and a second plurality of rectangular silicon solar cells lacking chamfered corners dicing one or more pseudo square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form

arranging the first plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the first plurality of rectangular silicon solar cells in series to do; and

arranging the second plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells in series including the steps of

50A. solar modules,

a series connected string of rectangular or substantially rectangular solar cells of N≧25 having an average breakdown voltage of greater than about 10 volts, the solar cells overlapping and conductively bonded to each other with an electrically and thermally conductive adhesive; grouped into one or more super cells each having two or more of said solar cells arranged in line with the long sides of adjacent solar cells;

A single solar cell or group of <N solar cells in the string of solar cells is not individually electrically connected in parallel with a bypass diode.

51A. In the solar module of clause 50A, N is an integer greater than or equal to 30.

52A. In the solar module of clause 50A, N is an integer greater than or equal to 50.

53A. In the solar module of clause 50A, N is an integer greater than or equal to 100.

54A. The solar module of clause 50A, wherein the adhesive has a thickness orthogonal to the solar cells less than or equal to about 0.1 mm and a thermal conductivity orthogonal to the solar cells greater than or equal to about 1.5 w/m/k Forms bonds between adjacent solar cells.

55A. The solar module of clause 50A, wherein the solar cells of N are grouped into a single super cell.

56A. The solar module of clause 50A, wherein said solar cells are silicon solar cells.

57A. solar modules,

adjacent solar cells overlapping and conductively bonded to each other with an electrically and thermally conductive adhesive, comprising super cells spanning substantially the entire length or width of the solar module parallel to an edge of the solar module; a series connected string of N rectangular or substantially rectangular solar cells having an average breakdown voltage greater than about 10 volts arranged in line with the long sides of the cells;

A single solar cell or group of <N solar cells in the super cell is not individually electrically connected in parallel with a bypass diode.

58A. In the solar module of clause 57A, N>24.

59A. The solar module of clause 57A, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

60A. super cell,

a plurality of silicon solar cells, each silicon solar cell comprising:

Rectangular or substantially rectangular front and back surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, wherein at least portions of the front surfaces are exposed to solar radiation during operation of the string of solar cells;

an electrically conductive front surface metallization pattern disposed on the front surface and having at least one front surface contact pad positioned adjacent the first long side;

an electrically conductive backside metallization pattern disposed on the backside and having at least one backside contact pad positioned adjacent the second long side;

The silicon solar cells overlap and first and second long sides of the adjacent silicon solar cells and adjacent silicon solar cells overlap and conductively bonded to each other with a conductive adhesive bonding material to electrically connect the silicon solar cells in series. arranged in line with the front and back contact pads on the fields;

The front surface metallization pattern of each silicon solar cell includes a barrier that substantially confines the conductive adhesive bonding material to the at least one front surface contact pads prior to curing of the conductive adhesive bonding material during fabrication of the super cell. .

61A. The super cell of clause 60A, wherein for each pair of adjacent and overlapping silicon solar cells, a barrier on the front side of one of the silicon solar cells overlaps and conceals a portion of the other silicon solar cell, the super cell Substantially confine the conductive adhesive bonding material to overlapping regions of the front surface of the silicon solar cell prior to curing of the conductive adhesive bonding material during fabrication of

62A. The super cell of clause 60A, wherein the barrier comprises a continuous conductive line running parallel to or running about substantially the entire length of the first long side, and wherein the at least one front surface contact pad comprises the continuous conductive line and the solar cell. located between the first long sides of the cell.

63A. The super cell of clause 62A, wherein the front surface metallization pattern comprises fingers electrically coupled to the at least one front surface contact pads and running orthogonal to the first long side, wherein the continuous conductive line comprises each finger Electrically interconnect the fingers to provide multiple conductive paths from to the at least one front surface contact pads.

64A. The super cell of clause 60A, wherein the front surface metallization pattern comprises a plurality of discrete contact pads arranged in parallel rows and adjacent to the first long side, and wherein the barrier comprises the conductive adhesive bonding material during manufacture of the super cell. and a plurality of features forming discrete barriers for each discrete contact pad to substantially confine the conductive adhesive bonding material to the discrete contact pads prior to curing of the conductive adhesive bonding material.

65A. The super cell of clause 64A, wherein the separated barriers are adjacent to and larger than their corresponding distinct contact pads.

66A. super cell,

a plurality of silicon solar cells, each silicon solar cell comprising:

Rectangular or substantially rectangular front and back surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, wherein at least portions of the front surfaces are exposed to solar radiation during operation of the string of solar cells;

an electrically conductive front surface metallization pattern disposed on the front surface and having at least one front surface contact pad positioned adjacent the first long side;

an electrically conductive backside metallization pattern disposed on the backside and having at least one backside contact pad positioned adjacent the second long side;

The silicon solar cells overlap and front and back contact on first and second sides of adjacent silicon solar cells and adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. arranged in line with the pads;

The backside metallization pattern of each silicon solar cell is

and a barrier configured to substantially confine the conductive adhesive bonding material to the at least one back surface contact pads prior to curing the conductive adhesive bonding material during fabrication of the super cell.

67A. The super cell of clause 66A, wherein the back surface metallization pattern comprises one or more discrete contact pads arranged in a parallel row adjacent and parallel to the second long sides, the barrier being the conductive during fabrication of the super cell. and a plurality of features forming separate barriers to each of the discrete contact pads that substantially confine the conductive adhesive bonding material to the discrete contact pads prior to curing the adhesive bonding material.

68A. The super cell of clause 67A, wherein the separating barriers are adjacent to and greater than their corresponding distinct contact pads.

69A. A method of making a string of solar cells, the method comprising:

dicing one or more pseudo square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a plurality of rectangular silicon solar cells each having a substantially equal length along its long axis; and

arranging the rectangular silicon solar cells in line with long sides of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series;

The plurality of rectangular silicon solar cells include at least one rectangular solar cell having two chamfered corners corresponding to corners or portions of corners of the pseudo-square wafer and one each lacking chamfered corners. or more rectangular silicon solar cells;

The spacing between parallel lines along which the pseudo-square wafer is dice is equal to the width orthogonal to the true axis of the rectangular silicon solar cells with chamfered corners. made greater than a width orthogonal to the long axis of the solar cells, so that each of the plurality of rectangular silicon solar cells in the string of solar cells has a front surface of substantially equal area exposed to light during operation of the string of solar cells selected to compensate for the chamfered edges.

70A. A string of solar cells is

a plurality of silicon solar cells arranged in line with ends of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series;

at least one of the silicon solar cells has chamfered corners corresponding to corners or portions of corners of the pseudo-square silicon wafer on which it was diced, wherein at least one of the silicon solar cells lacks chamfered corners; Each of the silicon solar cells has a front surface of substantially equal area that is exposed to light during operation of the string of solar cells.

71A. A method of making two or more strings of solar cells, the method comprising:

a first plurality of rectangular silicon solar cells each having chamfered corners corresponding to corners or portions of corners of the pseudo square silicon wafers and a first length each over the entire length of the pseudo square silicon wafers dicing one or more pseudo square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a second plurality of rectangular silicon solar cells having chamfered corners;

the chamfered edge from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells each having a second length shorter than the first length and lacking chamfered edges removing them;

Long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells in series to form a solar cell string having a width equal to the first length. arranging the second plurality of rectangular silicon solar cells in line with the ; and

Long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the third plurality of rectangular silicon solar cells in series to form a solar cell string having a width equal to the second length. arranging the third plurality of rectangular silicon solar cells in line with the

72A. A method of making two or more strings of solar cells, the method comprising:

A first plurality of rectangular silicon solar cells having chamfered corners corresponding to corners or portions of corners of pseudo square silicon wafers and a second plurality of rectangular silicon solar cells lacking chamfered corners dicing one or more pseudo square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form

arranging the first plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the first plurality of rectangular silicon solar cells in series to do; and

arranging the second plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells in series including the steps of

73A. In the method of making a solar module, the method comprises:

a plurality of rectangular silicon solar cells from a plurality of pseudo square silicon wafers having chamfered corners corresponding to corners of the pseudo square silicon wafers and a plurality of rectangular silicon solar cells lacking chamfered corners. dicing a plurality of pseudo square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form cells;

Rectangular silicon lacking the chamfered corners to electrically connect the silicon solar cells in series to form a first plurality of super cells each having only rectangular silicon solar cells lacking the chamfered corners arranging at least some of the solar cells in line with long sides of the silicon solar cells overlapping and conductively coupled to each other;

Rectangular silicon with chamfered corners to electrically connect the silicon solar cells in series to form a second plurality of super cells each having only rectangular silicon solar cells with chamfered corners arranging at least some of the solar cells in line with long sides of the silicon solar cells overlapping and conductively coupled to each other; and

arranging the super cells in parallel rows of super cells of substantially the same length to form the front surface of the solar module, each row comprising only super cells from the first plurality of super cells or the second 2 Have only super cells from a plurality of super cells.

74A. The solar module of clause 73A, wherein two of the rows of super cells adjacent parallel and opposite edges of the solar module include only super cells from the second plurality of super cells, the super cell All other columns of s include only super cells from the first plurality of super cells.

75A. The solar module of clause 74A, wherein the solar module comprises a total of six rows of super cells.

76A. super cell,

a plurality of silicon solar cells arranged in line in a first direction with ends of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series; and

Conductive on the front or back side of that of an end of the silicon solar cells at three or more distinct locations arranged along the second direction and having its long axis oriented parallel to a second direction orthogonal to the first direction and running at least the full width of the end solar cell in the second direction, having a conductor thickness less than or equal to about 100 microns measured orthogonal to the front or back surface of the end silicon solar cell, and about 0.012 ohms. provide resistance to current flow in the second direction that is less than or equal to, and accommodate differential expansion in the second direction between the end silicon solar cell and interconnect for temperatures between about -40°C and about 85°C extended flexible electrical interconnects that provide the flexibility to

77A. The super cell of clause 76A, wherein the flexible electrical interconnect has a conductor thickness less than or equal to about 30 microns measured orthogonal to a front or back surface of the end silicon solar cell.

78A. The super cell of clause 76A, wherein the flexible electrical interconnect extends beyond the super cell in the second direction for electrical interconnection to at least a second super cell positioned parallel to and adjacent to the super cell in a solar module. .

79A. The super cell of clause 76A, wherein the flexible electrical interconnect extends past the super cell in the first direction for electrical interconnection to at least a second super cell positioned parallel to and in line with the super cell in a solar module. .

80A. solar modules,

a plurality of super cells arranged in two or more parallel rows across a width of the module to form a front surface of the module, each super cell being superimposed and conductive to one another to electrically connect silicon solar cells in series having a plurality of silicon solar cells arranged in line with ends of adjacent silicon solar cells coupled to each other;

At least an end of a first super cell adjacent an edge of the module in a first row is coupled to the front surface of the first super cell at a plurality of discrete locations with an electrically conductive adhesive bonding material, wherein at the edge of the module a second super running parallel, at least a portion of which is folded around an end of the first super cell, and adjacent the same edge of the module in a second row via a flexible electrical interconnect that is hidden from view from the front of the module electrically connected to the end of the cell.

81A. The solar module of clause 80A, wherein surfaces of the flexible electrical interconnect on a front surface of the module are covered or colored to reduce visible contrast with the super cells.

82A. The solar module of clause 80A, wherein two or more parallel rows of super cells are arranged on a white backing sheet to form a front surface of the solar module illuminated by solar radiation during operation of the solar module, The white back sheet comprises parallel darkened stripes having locations and widths corresponding to the locations and widths of the gaps between the parallel rows of super cells, the white portions of the back sheets comprising the gaps between the rows not visible through them

83A. A method of making a string of solar cells, the method comprising:

laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells;

applying an electrically conductive adhesive bonding material to the one or more scribed silicon solar cells at one or more locations adjacent the long side of each rectangular region;

separating the silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells each having a portion of the electrically conductive adhesive bonding material disposed on its front surface along its long sides;

arranging the plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween; ; and

curing the electrically conductive bonding material, bonding adjacent and overlapping rectangular silicon solar cells to each other, and electrically connecting them in series.

84A. A method of making a string of solar cells, the method comprising:

laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells, each solar cell having a top surface and an opposing surface It has a bottom that is positioned so as to be;

applying an electrically conductive adhesive bonding material to portions of the top surfaces of the one or more silicon solar cells;

applying a vacuum between the bottom surfaces of the one or more silicon solar cells and the curved support surface to flex the one or more silicon solar cells against a curved support surface, thereby respectively adjoining the long side thereof cutting the one or more silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells having a portion of the electrically conductive adhesive bonding material disposed on the front surface;

arranging the plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween; comprising;

curing the electrically conductive bonding material, bonding adjacent and overlapping rectangular silicon solar cells to each other, and electrically connecting them in series.

85A. The method of clause 84A, wherein the electrically conductive adhesive bonding material is applied to the one or more silicon solar cells, and thereafter, the one or more scribe line on each of the one or more silicon solar cells. laser scribing them.

86A. The method of clause 84A, further comprising laser scribing the one or more scribe lines on each of the one or more silicon solar cells, and then applying the electrically conductive adhesive bonding material to the one or more silicon solar cells. applying to solar cells.

1B. The device is

comprising a series coupled string of at least 25 solar cells connected in parallel with a common bypass diode, each solar cell having a breakdown voltage greater than about 10 volts, and having a long series of overlapping and adhesively conductively bonded adjacent solar cells. Grouped into a super cell with the solar cells arranged with the sides.

2B. The apparatus as in clause 1B, wherein N is an integer greater than or equal to 30.

3B. The apparatus as in clause 1B, wherein N is an integer greater than or equal to 50.

4B. The apparatus as in clause 1B, wherein N is an integer greater than or equal to 100.

5B. The apparatus as in clause 1B, wherein the adhesive has a thickness less than or equal to about 0.1 mm and a thermal conductivity greater than or equal to about 1.5 W/m/K.

6B. The apparatus as in clause 1B, wherein the N solar cells are grouped into a single super cell.

7B. The apparatus as in clause 1B, wherein the N solar cells are grouped into a plurality of super cells on the same backing.

8B. The apparatus as in clause 1B, wherein the solar cells are silicon solar cells.

9B. The apparatus as in clause 1B, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

10B. The apparatus as in clause 1B, wherein the solar cells comprise a feature configured to limit diffusion of the adhesive.

11B. The apparatus as in clause 1B, wherein the feature comprises a raised feature.

12B. The apparatus as in clause 10B, wherein said feature comprises metallization.

13B. The apparatus as in clause 12B, wherein said metallization comprises a line running the entire length of said first long side, said apparatus further comprising at least one contact pad positioned between said line and said first long side. include

14B. In the same device as in point 13B,

said metallization further comprising fingers electrically connected to said at least one contact pad and running orthogonal to said first long side;

The conductive line interconnects the fingers.

15B. The apparatus as in clause 10B, wherein the feature is on the front side of the solar cell.

16B. The apparatus as in clause 10B, wherein the feature is on the back side of the solar cell.

17B. The apparatus as in clause 10B, wherein the feature comprises a recessed feature.

18B. The device as in clause 10B, wherein said feature is hidden by an adjacent solar cell of said super cell.

19B. The apparatus as in clause 1B, wherein the first solar cell of the super cell has chamfered edges and the second solar cell of the super cell lacks chamfered edges, the first solar cell and the second A solar cell has the same area exposed to light.

20B. The apparatus as in clause 1B, further comprising a flexible electrical interconnect having a long axis parallel to a second direction orthogonal to the first direction, wherein the flexible electrical interconnect is conductively coupled to the surface of the solar cell and has two dimensions to accommodate the thermal expansion of the solar cell.

21B. The apparatus as in clause 20B, wherein the flexible electrical interconnect has a thickness less than or equal to about 100 microns to provide a resistance of less than or equal to about 0.012 ohms.

22B. The apparatus as in clause 20B, wherein the surface comprises a back surface.

23B. The apparatus as in clause 20B, wherein the flexible electrical interconnect is in contact with another super cell.

24B. The apparatus as in clause 23B, wherein the other super cell is in-line with the super cell.

25B. The apparatus as in clause 23B, wherein the other super cell is adjacent to the super cell.

26B. The apparatus as in clause 20B, wherein the first portion of the interconnect is folded around an edge of the super cell such that the remaining second interconnect portion is on the backside of the super cell.

27B. The apparatus as in clause 20B, wherein the flexible electrical interconnect is electrically coupled to a bypass diode.

28B. The apparatus as in clause 1B, wherein the plurality of super cells are arranged in two or more parallel rows on a back sheet to form a solar module front surface, the back sheet being white and corresponding to gaps between the super cells. darkened stripes of a position and width that are

29B. The apparatus as in clause 1B, wherein the super cell comprises at least one pair of cell strings coupled to a power management system.

30B. In the same device as in point 1B,

in electrical communication with the super cell;

receive a voltage output of the super cell;

determine whether the solar cell is reverse biased based on the voltage;

and a power management device configured to disconnect the reverse biased solar cell from the super cell module circuit.

31B. The apparatus as in clause 1B, wherein the super cell is disposed on the first backing to form a first module having a top conductive ribbon on a first side facing the direction of solar energy, the apparatus comprising:

another super cell disposed on a second backing to form a second module having a bottom ribbon on a second side facing away from the direction of solar energy;

The second module overlaps and engages a portion of the first module comprising the top ribbon.

32B. The apparatus as in clause 31B, wherein the second module is coupled to the first module by an adhesive.

33B. The apparatus as in clause 31B, wherein the second module is coupled with the first module by a matching arrangement.

34B. The apparatus as in clause 31B, further comprising a junction box overlapped by the second module.

35B. The apparatus as in clause 34B, wherein the second module is coupled with the first module by a matching arrangement.

36B. The apparatus as in clause 35B, wherein the matching arrangement is between the junction box and another junction box on the second module.

37B. The apparatus as in clause 31B, wherein the first backing comprises glass.

38B. The apparatus as in clause 31B, wherein the first backing comprises something other than glass.

39B. The apparatus as in clause 1B, wherein the solar cell comprises a chamfered portion cut from a larger piece.

40B. The apparatus as in clause 39B, wherein the super cell further comprises another solar cell having a chamfered portion, the long side of the solar cell being in electrical contact with the long side of the other solar cell having a similar length.

1C1. Way,

forming a super cell comprising a series-connected string of at least N≧25 solar cells on the same backing, each solar cell having a breakdown voltage greater than about 10 volts and adjacent to each other overlapping and conductively bonded with an adhesive arranged with the long sides of the solar cells;

It involves connecting each super cell with at most a single bypass diode.

2C1. In the same manner as in clause 1C1, N is an integer greater than or equal to 30.

3C1. In the same manner as in clause 1C1, N is an integer greater than or equal to 50.

4C1. In the same manner as in clause 1C1, N is an integer greater than or equal to 100.

5C1. The method as in clause 1C1, wherein the adhesive has a thickness less than or equal to about 0.1 mm and a thermal conductivity greater than or equal to about 1.5 w/m/k.

6C1. The method as in clause 1C1, wherein the solar cells are silicon solar cells.

7C1. The method as in clause 1C1, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

8C1. The method as in clause 1C1, wherein the first solar cell of the super cell has chamfered edges and the second solar cell of the super cell lacks chamfered edges, the first solar cell and the second A solar cell has the same area exposed to light.

9C1. The method as in clause 1C1, further comprising utilizing features on the surface of the solar cell to limit diffusion of the adhesive.

10C1. The method as in clause 9C1, wherein the feature comprises a protruding feature.

11C1. The method as in clause 9C1, wherein said characteristic comprises metallization.

12C1. The method as in clause 11C1, wherein the metallization comprises a line running the entire length of the first long side, and at least one contact pad is positioned between the line and the first long side.

13C1. In the same way as in point 12C1,

said metallization further comprising fingers electrically connected to said at least one contact pad and running orthogonal to said first long side;

The conductive line interconnects the fingers.

14C1. The method as in clause 9C1, wherein the feature is on the front side of the solar cell.

15C1. The method as in clause 9C1, wherein the feature is on the back side of the solar cell.

16C1. The method as in clause 9C1, wherein the feature comprises a recessed feature.

17C1. The method as in clause 9C1, wherein the feature is hidden by an adjacent solar cell of the super cell.

18C1. The method as in clause 1C1, further comprising forming another super cell on the same backing.

19C1. In the same way as in point 1C1,

conductively coupling a flexible electrical interconnect having a long axis parallel to a second direction orthogonal to the first direction to a surface of the solar cell; and

causing the flexible electrical interconnect to accommodate thermal expansion of the solar cell in two dimensions.

20C1. The method as in clause 19C1, wherein the flexible electrical interconnect has a thickness less than or equal to about 100 microns to provide a resistance of less than or equal to about 0.012 ohms.

21C1. The method as in clause 19C1, wherein the surface comprises a back surface.

22C1. The method as in clause 19C1, further comprising contacting another super cell with the flexible electrical interconnect.

23C1. The method as in clause 22C1, wherein the other super cell is arranged in line with the super cell.

24C1. The method as in clause 22C1, wherein the other super cell is adjacent to the super cell.

25C1. The method as in clause 19C1, further comprising folding the first portion of the interconnect around an edge of the super cell such that the remaining second interconnect portion is on the backside of the super cell.

26C1. The method as in clause 19C1, further comprising electrically coupling the flexible electrical interconnect to a bypass diode.

27C1. In the same way as in point 1C1,

arranging a plurality of super cells in two or more parallel rows on the same backing to form a solar module front face, wherein the back sheet is white, a position and width corresponding to gaps between the super cells darkened stripes of

28C1. The method as in clause 1C1, further comprising coupling at least one pair of cell strings to a power management system.

29C1. In the same way as in point 1C1,

electrically connecting a power management device to the super cell;

causing the power management to receive the voltage output of the super cell;

causing the power management device to determine whether a solar cell is in reverse bias based on the voltage; and

causing the power management device to disconnect the reverse biased solar cell from the super cell module circuit.

30C1. The method as in clause 1C1, wherein the super cell is disposed on the backing to form a first module having a top conductive ribbon on a first side facing a direction of solar energy, the method comprising:

placing another super cell on another backing to form a second module having a bottom ribbon on a second side facing away from the direction of solar energy;

The second module overlaps and engages a portion of the first module comprising the top ribbon.

31C1. The method as in clause 30C1, wherein the second module is coupled to the first module by an adhesive.

32C1. The method as in clause 30C1, wherein the second module is coupled to the first module by a matching arrangement.

33C1. The method as in clause 30C1, further comprising overlapping a junction box with the second module.

34C1. The method as in clause 33C1, wherein the second module is coupled to the first module by a matching arrangement.

35C1. The method as in clause 34C1, wherein the matching arrangement is between the junction box and another junction box on the second module.

36C1. The method as in clause 30C1, wherein the backing comprises glass.

37C1. The method as in clause 30C1, wherein said backing comprises other than glass.

38C1. In the same way as in point 30C1,

electrically connecting a relay switch in series between the first module and the second module;

sensing the voltage output of the first module by a controller; and

activating the relay switch with the controller, wherein the output voltage drops below a limit.

39C1. The method as in clause 1C1, wherein the solar cell comprises a chamfered portion cut from a larger piece.

40C1. The method as in clause 39C1, wherein forming the super cell comprises placing a long side of the solar cell in electrical contact with a long side of a similar length of another solar cell having a chamfered portion.

1C2. The device is

A solar module comprising: a solar module having a front surface comprising a first series connected string of at least 19 solar cells grouped into a first super cell arranged with long sides of adjacent solar cells overlapping and adhesively conductively bonded; and

and a ribbon conductor electrically connected to the back contact of the first super cell to provide a hidden tap to the electrical component.

2C2. The apparatus as in clause 1C2, wherein the electrical component comprises a bypass diode.

3C2. The apparatus as in clause 2C2, wherein the bypass diode is located on the back surface of the solar module.

4C2. The apparatus as in clause 3C2, wherein the bypass diode is located outside the junction box.

5C2. The apparatus as in clause 4C2, wherein said junction box comprises a single terminal.

6C2. The apparatus as in clause 3C2, wherein the bypass diode is located near an edge of the solar module.

7C2. In the device as in clause 2C2, the bypass diode is located within the laminate structure.

8C2. The apparatus as in clause 7C2, wherein said first super cell is encapsulated within said laminate structure.

9C2. The apparatus as in clause 2C2, wherein said bypass diode is positioned around a perimeter of said solar module.

10C2. The apparatus as in clause 1C2, wherein the electrical component comprises a module terminal, junction box, power management system, smart switch, relay, voltage sensing controller, central inverter, DC/AC microinverter, or DC/DC module power optimizer. include

11C2. The apparatus as in clause 1C1, wherein said electrical component is located on a back surface of said solar module.

12C2. The apparatus as in clause 1C1, wherein the solar module further comprises a second series connected string of at least 19 solar cells grouped into a second super cell having a first end electrically connected in series to the first super cell. include

13C2. The apparatus as in clause 12C2, wherein the second super cell overlaps the first super cell and is electrically connected in series with a conductive adhesive.

14C2. The apparatus as in clause 12C2, wherein the back contact is located away from the first end.

15C2. The apparatus as in clause 12C2, further comprising a flexible interconnect between the first end and the first super cell.

16C2. The apparatus as in clause 15C2, wherein the flexible interconnect extends beyond side edges of the first and second super cells to electrically connect the first and second super cells in parallel with another super cell.

17C2. The apparatus as in clause 1C2, wherein the adhesive has a thickness less than or equal to about 0.1 mm and a thermal conductivity greater than or equal to about 1.5 w/m/k.

18C2. The apparatus as in clause 1C2, wherein the solar cells are silicon solar cells having a breakdown voltage greater than about 10V.

19C2. The apparatus as in clause 1C2, wherein the first super cell has a length in the direction of current flow of at least about 500 mm.

20C2. The apparatus as in clause 1C2, wherein the solar cell of the first super cell comprises a feature configured to limit diffusion of the adhesive.

21C2. The apparatus as in clause 20C2, wherein said feature comprises a protruding feature.

22C2. The apparatus as in clause 21C2, wherein said feature comprises metallization.

23C2. The apparatus as in clause 22C2, wherein said metallization comprises a conductive line running the entire length of said first long side, said apparatus comprising at least one contact pad positioned between said line and said first long side. include more

24C2. In the same device as in point 23C2,

said metallization further comprising fingers electrically connected to said at least one contact pad and running orthogonal to said first long side;

The conductive line interconnects the fingers.

25C2. The apparatus as in clause 20C2, wherein said feature is on a front side of said solar cell.

26C2. The device as in clause 20C2, wherein the feature is on the back side of the solar cell.

27C2. The apparatus as in clause 20C2, wherein the feature comprises a recessed feature.

28C2. The device as in clause 20C2, wherein said feature is hidden by an adjacent solar cell of said first super cell.

29C2. The apparatus as in clause 1C2, wherein the solar cell of the first super cell comprises a chamfered portion.

30C2. The apparatus as in clause 29C2, wherein the first super cell further comprises another solar cell comprising a chamfered portion, the long side of the solar cell electrically contacting the long side of another solar cell having a similar length. do.

31C2. The apparatus as in clause 29C2, wherein the first super cell further comprises a solar cell lacking chamfered edges, wherein the solar cell and the other solar cell have the same area exposed to light.

32C2. In the same device as in point 1C2,

the first super cell is aligned with the second super cell in parallel rows on the front side of a backing sheet;

The backing sheet is white and includes darkened sprites of positions and widths corresponding to gaps between the first super cell and the second super cell.

33C2. The apparatus as in clause 1C2, wherein the first super cell comprises at least one pair of strings coupled to a power management system.

34C2. The device as in clause 1C2, in electrical communication with the first super cell;

receive a voltage output of the first super cell;

determine whether a solar cell of the first super cell is reverse biased based on the voltage;

and a power management device configured to disconnect the reverse biased solar cell from the super cell module circuit.

35C2. The apparatus as in clause 34C2, wherein the power management device comprises a relay.

36C2. The apparatus as in clause 1C2, wherein the first super cell is disposed on a first backing to form a module having a top conductive ribbon on a first side facing a direction of solar energy, the apparatus comprising:

another super cell disposed on a second backing to form another module having a bottom ribbon on a second side facing away from the direction of solar energy;

The other module overlaps and engages a portion of the module comprising the top ribbon.

37C2. The apparatus as in clause 36C2, wherein the other module is coupled to the module by an adhesive.

38C2. The apparatus as in clause 36C2, wherein the other module is coupled to the module by a matching arrangement.

39C2. The apparatus as in clause 36C2, further comprising a junction box overlapped by the other module.

40C2. The apparatus as in clause 39C2, wherein the other module is coupled to the module by a matching arrangement positioned between the junction box and the other junction box on the other solar module.

1C3. The device is

a first super cell disposed on a front surface of the solar module, the first super cell having a plurality of solar cells each having a breakdown voltage greater than about 10V;

a first ribbon conductor electrically connected with a back contact of the first super cell to provide a first hidden tab to an electrical component;

a second super cell disposed on the front surface of the solar module, the second super cell having a plurality of solar cells each having a breakdown voltage greater than about 10V; and

and a second ribbon conductor in electrical connection with the back contact of the second super cell to provide a second hidden tab.

2C3. The apparatus as in clause 1C3, wherein said electrical component comprises a bypass diode.

3C3. The apparatus as in clause 2C3, wherein the bypass diode is located on the backside of the solar module.

4C3. The apparatus as in clause 3C3, wherein the bypass diode is located outside the junction box.

5C3. The apparatus as in clause 4C3, wherein said junction box comprises a single terminal.

6C3. The apparatus as in clause 3C3, wherein the bypass diode is located near an edge of the solar module.

7C3. The apparatus as in clause 2C3, wherein the bypass diode is located within the laminate structure.

8C3. The apparatus as in clause 7C3, wherein said first super cell is encapsulated within said laminate structure.

9C3. The apparatus as in clause 8C3, wherein the bypass diode is positioned around the perimeter of the solar module.

10C3. The apparatus as in clause 1C3, wherein the first super cell is connected in series with the second super cell.

11C3. In the same device as in point 10C3,

the first super cell and the second super cell form a first pair;

The device further includes two additional super cells in a second pair connected in parallel with the first pair.

12C3. The apparatus as in clause 10C3, wherein the second hidden tab is connected to the electrical component.

13C3. The apparatus as in clause 12C3, wherein said electrical component comprises a bypass diode.

14C3. The apparatus as in clause 13C3, wherein said first super cell comprises no less than 19 solar cells.

15C3. The apparatus as in clause 12C3, wherein the electrical component comprises a power management system.

16C3. The apparatus as in clause 1C3, wherein the electrical component comprises a switch.

17C3. The apparatus as in clause 16C3, further comprising a voltage sensing controller in communication with the switch.

18C3. The apparatus as in clause 16C3, wherein the switch is in communication with a central inverter.

19C3. The apparatus as in clause 1C3, wherein the electrical component comprises:

receive a voltage output of the first super cell;

determine whether a solar cell of the first super cell is reverse biased based on the voltage;

and a power management device configured to disconnect the reverse biased solar cell from a super cell module circuit.

20C3. The apparatus as in clause 1, wherein the electrical component comprises an inverter.

21C3. The apparatus as in clause 20C3, wherein said inverter comprises a DC/AC microinverter.

22C3. The apparatus as in clause 1C3, wherein the electrical component comprises a solar module terminal.

23C3. The apparatus as in clause 22C3, wherein the solar module terminal is a single solar module terminal in a junction box.

24C3. The apparatus as in clause 1C3, wherein said electrical component is located on the backside of the solar module.

25C3. The apparatus as in clause 1C3, wherein the back contact is positioned away from an end of the first super cell overlapping the second super cell.

26C3. The apparatus as in clause 1C3, wherein the first super cell has a length in the direction of current flow of at least about 500 mm.

27C3. The apparatus as in clause 1C3, wherein the solar cell of the first super cell comprises a feature configured to limit diffusion of the adhesive.

28C3. The apparatus as in clause 27C3, wherein the feature comprises a protruding feature.

29C3. The apparatus as in clause 28C3, wherein said feature comprises metallization.

30C3. The apparatus as in clause 27C3, wherein the feature comprises a recessed feature.

31C3. The apparatus as in clause 27C3, wherein the feature is on the back side of the solar cell.

32C3. The apparatus as in clause 27C3, wherein the feature is hidden by an adjacent solar cell of the first super cell.

33C3. The apparatus as in clause 1C3, wherein the solar cell of the first super cell comprises a chamfered portion.

34C3. The apparatus as in clause 33C3, wherein the first super cell further comprises another solar cell having a chamfered portion, the long side of the solar cell being in electrical contact with the long side of the other solar cell having a similar length. .

35C3. The apparatus as in clause 33C3, wherein the first super cell further comprises another solar cell lacking chamfered edges, wherein the solar cell and the other solar cell have the same area exposed to light.

36C3. In the same device as in point 1C3,

the first super cell is arranged with the second super cell in parallel rows on the front side of the backing sheet;

The backing sheet is white and includes darkened stripes of positions and widths corresponding to gaps between the first super cell and the second super cell.

37C3. The apparatus as in clause 1C3, wherein the first super cell is disposed on a first backing to form a module having a top conductive ribbon on a front side of the module facing a direction of solar energy, the apparatus comprising:

a third super cell disposed on the second backing to form another module having a bottom ribbon on a second side facing away from the direction of the talan energy;

The other module overlaps and engages a portion of the module comprising the top ribbon.

38C3. The apparatus as in clause 37C3, wherein the other module is joined to the module by an adhesive.

39C3. The apparatus as in clause 37C3, further comprising a junction box overlapped by the other module.

40C3. The apparatus as in clause 39C3, wherein the other module is coupled to the other module by a matching arrangement between the junction box and the other junction box on the other module.

1C4. The device is

a solar module having a front surface comprising a first series connected string of solar cells grouped into a first super cell arranged with sides of adjacent solar cells overlapping and adhesively bonded to each other; and

and a solar cell surface feature configured to define the adhesive.

2C4. The apparatus as in clause 1C4, wherein the solar cell surface feature comprises a recessed feature.

3C4. The device as in clause 1C4, wherein the solar cell surface features include protruding features.

4C4. The device as in clause 3C4, wherein said protruding feature is on the front face of the solar cell.

5C4. The apparatus as in clause 4C4, wherein said protruding features comprise a metallization pattern.

6C4. The apparatus as in clause 5C4, wherein the metallization pattern comprises conductive lines running parallel to and substantially along a long side of the solar cell.

7C4. The apparatus as in clause 6C4, further comprising a contact pad between the conductive line and the long side.

8C4. In the same device as in Matter 7C4,

the metallization pattern further comprises a plurality of fingers;

The conductive line electrically interconnects the fingers to provide multiple conductive paths from each finger to the contact pad.

9C4. The apparatus as in clause 7C4, further comprising a plurality of discrete contact pads arranged in subparallel rows and adjacent to the long side, wherein the metallization pattern comprises a plurality of discrete contact pads confining the adhesive to the discrete contact pads. formed barriers.

10C4. The apparatus as in clause 8C4, wherein the plurality of discrete barriers abut corresponding discrete contact pads.

11C4. The apparatus as in clause 8C4, wherein the plurality of discrete barriers are greater than corresponding discrete contact pads.

12C4. The device as in clause 1C4, wherein said solar cell surface features are hidden by overlapping sides of another solar cell.

13C4. The device as in clause 12C4, wherein said other solar cell is part of said super cell.

14C4. The device as in clause 12C4, wherein said other solar cell is part of another super cell.

15C4. The device as in clause 3C4, wherein said protruding feature is on the back surface of the solar cell.

16C4. The apparatus as in clause 15C4, wherein said protruding features comprise a metallization pattern.

17C4. The apparatus as in clause 16C4, wherein the metallization pattern forms a plurality of discrete barriers to confine the adhesive to a plurality of discrete contact pads located on a front surface of another solar cell overlapped by the solar cell. .

18C4. The apparatus as in clause 17C4, wherein the plurality of discrete barriers abut corresponding discrete contact pads.

19C4. The apparatus as in clause 17C4, wherein the plurality of discrete barriers are greater than corresponding discrete contact pads.

20C4. The apparatus as in clause 1C1, wherein each solar cell of the super cell has a breakdown voltage of 10V or greater.

21C4. The apparatus as in clause 1C1, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

22C4. The apparatus as in clause 1C1, wherein the solar cell of the super cell comprises a chamfered portion.

23C4. The apparatus as in clause 22C4, wherein the super cell further comprises another solar cell having a chamfered portion, the long side of the solar cell being in electrical contact with the long side of the other solar cell having a similar length.

24C4. The apparatus as in clause 22C4, wherein the super cell further comprises another solar cell lacking chamfered edges, wherein the solar cell and the other solar cell have the same area exposed to light.

25C4. The apparatus as in clause 1C4, wherein the super cell is arranged with a second super cell on the front side of the first backing sheet to form a first module.

26C4. The apparatus as in clause 25C4, wherein the backing sheet is white and includes darkened stripes of a location and width corresponding to gaps between the first super cell and the second super cell.

27C4. The apparatus as in clause 25C4, wherein the first module has a substantially conductive ribbon on a front surface of the first module facing the direction of solar energy, the apparatus comprising:

a third super cell disposed on a second backing to form a second module having a bottom ribbon on a second module side facing away from the solar energy;

The second module overlaps and engages a portion of the first module comprising the top ribbon.

28C4. The apparatus as in clause 27C4, wherein the second module is coupled to the first module by an adhesive.

29C4. The apparatus as in clause 27C4, further comprising a junction box overlapped by the second module.

30C4. The apparatus as in clause 29C4, wherein the second module is coupled to the first module by a matching arrangement between the junction box and another junction box on the second module.

31C4. The apparatus as in clause 29C4, wherein the junction box accommodates a single module terminal.

32C4. The apparatus as in clause 27C4, further comprising a switch between the first module and the second module.

33C4. The apparatus as in clause 32C4, further comprising a voltage sensing controller in communication with the switch.

34C4. The apparatus as in clause 27C4, wherein the super cell comprises no less than nineteen solar cells individually electrically connected in parallel with a single bypass diode.

35C4. The apparatus as in clause 34C4, wherein the single bypass diode is located near the edge of the first module.

36C4. The apparatus as in clause 34C4, wherein said single bypass diode is located within a laminate structure.

37C4. The apparatus as in clause 36C4, wherein said super cell is encapsulated within said laminate structure.

38C4. The apparatus as in clause 34C4, wherein the single bypass diode is positioned around the perimeter of the first module.

39C4. The apparatus as in clause 25C4, wherein the super cell and the second super cell comprise a pair individually coupled to a power management device.

40C4. In the same device as in point 25C4,

receive a voltage output of the super cell;

determine whether a solar cell of the super cell is reverse biased based on the voltage;

and a power management device configured to disconnect the reverse biased solar cell from a super cell module circuit.

1C5. The device is

a first series connected of silicon solar cells grouped into a first super cell comprising a first silicon solar cell having chamfered corners and arranged with a side overlapping a second silicon solar cell and conductively bonded with an adhesive It includes a solar module having a front surface including a string.

2C5. The apparatus as in clause 1C5, wherein the second silicon solar cell lacks chamfered edges, and each silicon solar cell of the first super cell has substantially the same front surface area exposed to light.

3C5. In the same device as in point 2C5,

the first silicon solar cell and the second silicon solar cell have the same length;

A width of the first silicon solar cell is greater than a width of the second silicon solar cell.

4C5. The apparatus as in clause 3C5, wherein said length reproduces the shape of a pseudo-square wafer.

5C5. The apparatus as in clause 3C5, wherein said length is 156 mm.

6C5. The apparatus as in clause 3C5, wherein said length is 125 mm.

7C5. The apparatus as in clause 3C5, wherein an aspect ratio between the width and length of the first solar cell is from about 1:2 to about 1:20.

8C5. The apparatus as in clause 3C5, wherein the first silicon solar cell overlaps the second silicon solar cell by about 1 mm to about 5 mm.

9C5. The apparatus as in clause 3C5, wherein the first super cell comprises at least nineteen silicon solar cells each having a breakdown voltage greater than about 10 volts.

10C5. The apparatus as in clause 3C5, wherein the first super cell has a length in the direction of current flow of at least about 500 mm.

11C5. In the same device as in Matter 3C5,

the first super cell is connected in parallel with a second super cell on the front side;

The front surface includes a white backing featuring darkened stripes of a location and width corresponding to gaps between the first super cell and the second super cell.

12C5. The apparatus as in clause 1C5, wherein the second silicon solar cell includes chamfered edges.

13C5. The apparatus as in clause 12C5, wherein the long side of the first silicon solar cell overlaps the long side of the second silicon solar cell.

14C5. The apparatus as in clause 12C5, wherein the long side of the first silicon solar cell overlaps the short side of the second silicon solar cell.

15C5. A device as in clause 1C5, wherein the front surface comprises:

a first row comprising the first super cell comprised of solar cells with chamfered corners; and

a second row connected in parallel with the first super cell and comprising a second series connected string of silicon solar cells grouped into a second super cell comprising solar cells lacking chamfered corners; The length of the second row is substantially equal to the length of the first row.

16C5. The apparatus as in clause 15C5, wherein the first row is adjacent to a module edge and the second row is not adjacent to the module edge.

17C5. The apparatus as in clause 15C5, wherein the first super cell comprises at least nineteen solar cells each having a breakdown voltage greater than about 10 volts, and wherein the first super cell comprises at least about 500 mm in a direction of current flow. has the length of

18C5. The apparatus as in clause 15C5, wherein the front side comprises a white backing characterizing darkened stripes of a location and width corresponding to gaps between the first super cell and the second super cell.

19C5. The apparatus as in clause 1C5, further comprising a metallization pattern on the front side of the second solar cell.

20C5. The apparatus as in clause 19C5, wherein the metallization pattern comprises a tapered portion extending around a chamfered edge.

21C5. The apparatus as in clause 19C5, wherein said metallization pattern comprises protruding features to limit diffusion of said adhesive.

22C5. The apparatus as in clause 19C5, wherein the metallization pattern comprises:

a plurality of discrete contact pads;

fingers electrically connected to the plurality of discrete contact pads; and

and conductive lines interconnecting the fingers.

23C5. The apparatus as in clause 22C5, wherein the metallization pattern forms a plurality of discrete barriers confining the adhesive to the discrete contact pads.

24C5. The apparatus as in clause 23C5, wherein the plurality of discrete barriers are larger than and adjacent to corresponding discrete contact pads.

25C5. The apparatus as in clause 1C5, further comprising: a flexible electrical interconnect conductively coupled to a surface of the first solar cell to accommodate thermal expansion of the first solar cell in two dimensions.

26C5. The apparatus as in clause 25C5, wherein the first portion of the interconnect is folded around an edge of the first super cell such that the remaining second interconnect is on a backside of the first super cell.

27C5. The apparatus as in clause 1C5, wherein the module has a top conductive ribbon on the front side facing the direction of solar energy, the apparatus comprising:

a second super cell disposed on the front surface, the other module further comprising a bottom ribbon on the other module facing away from the solar energy;

The second module overlaps and engages a portion of the first module comprising the top ribbon.

28C5. The apparatus as in clause 27C5, wherein the other module is coupled to the module by an adhesive.

29C5. The apparatus as in clause 27C5, further comprising a junction box overlapped by the other module.

30C5. The apparatus as in clause 29C5, wherein the other module is coupled to the other module by a matching arrangement between the junction box and the other junction box on the other module.

31C5. The apparatus as in clause 29C5, wherein the junction box accommodates a single module terminal.

32C5. The apparatus as in clause 27C5, further comprising a switch between the module and the other module.

33C5. The apparatus as in clause 32C5, further comprising a voltage sensing controller in communication with the switch.

34C5. The apparatus as in clause 27C5, wherein the first super cell comprises no less than nineteen solar cells electrically coupled with a single bypass diode.

35C5. The apparatus as in clause 34C5, wherein the single bypass diode is located near the edge of the first module.

36C5. The apparatus as in clause 34C5, wherein said single bypass diode is located within a laminate structure.

37C5. The apparatus as in clause 36C5, wherein said super cell is encapsulated within said laminate structure.

38C5. The apparatus as in clause 34C5, wherein the single bypass diode is positioned around the perimeter of the first module.

39C5. The apparatus as in clause 27C5, wherein the first super cell and the second super cell comprise a pair coupled to a power management device.

40C5. In the same device as in point 27C5,

receive a voltage output of the first super cell;

determine whether a solar cell of the first super cell is reverse biased based on the voltage;

and a power management device configured to disconnect the reverse biased solar cell from a super cell module circuit.

1C6. The device is

a first series connected of silicon solar cells grouped into a first super cell comprising a first silicon solar cell having chamfered corners and arranged with a side overlapping a second silicon solar cell and conductively bonded with an adhesive It includes a solar module having a front surface including a string.

2C6. The apparatus as in clause 1C6, wherein the second silicon solar cell lacks chamfered edges, and each silicon solar cell of the first super cell has substantially the same front surface area exposed to light.

3C6. In the same device as in point 2C6,

the first silicon solar cell and the second silicon solar cell have the same length;

A width of the first silicon solar cell is greater than a width of the second silicon solar cell.

4C6. The apparatus as in clause 3C6, wherein said length reproduces the shape of a pseudo-square wafer.

5C6. The apparatus as in clause 3C6, wherein said length is 156 mm.

6C6. The apparatus as in clause 3C6, wherein said length is 125 mm.

7C6. The apparatus as in clause 3C6, wherein an aspect ratio between the width and the length of the first solar cell is from about 1:2 to about 1:20.

8C6. The apparatus as in clause 3C6, wherein the first silicon solar cell overlaps the second silicon solar cell by about 1 mm to about 5 mm.

9C6. The apparatus as in clause 3C6, wherein the first super cell comprises at least nineteen silicon solar cells each having a breakdown voltage greater than about 10 volts.

10C6. The apparatus as in clause 3C6, wherein the first super cell has a length in the direction of current flow of at least about 500 mm.

11C6. In the same device as in point 3C6,

the first super cell is connected in parallel with a second super cell on the front side;

The front side includes a white backing featuring darkened stripes of a location and width corresponding to gaps between the first and second super cell.

12C6. The apparatus as in clause 1C6, wherein the second silicon solar cell includes chamfered edges.

13C6. The apparatus as in clause 12C6, wherein the long side of the first silicon solar cell overlaps the long side of the second silicon solar cell.

14C6. The apparatus as in clause 12C6, wherein the long side of the first silicon solar cell overlaps the short side of the second silicon solar cell.

15C6. A device as in clause 1C6, wherein the front surface comprises:

a first row comprising the first super cell comprised of solar cells with chamfered corners; and

and a second row having a second series connected string of silicon solar cells coupled in parallel with the super cell and grouped into a second super cell comprising solar cells lacking chamfered edges; The length of the second row is substantially equal to the length of the first row.

16C6. The apparatus as in clause 15C6, wherein the first row is adjacent to a module edge and the second row is not adjacent to the module edge.

17C6. The apparatus as in clause 15C6, wherein the first super cell comprises at least nineteen solar cells each having a breakdown voltage greater than about 10 volts, and wherein the first super cell comprises at least about 500 mm in a direction of current flow. has the length of

18C6. The apparatus as in clause 1C6, wherein the front side comprises a white backing featuring darkened stripes of a location and width corresponding to gaps between the first super cell and the second super cell.

19C6. The apparatus as in clause 1C6, further comprising a metallization pattern on the front side of the second solar cell.

20C6. The apparatus as in clause 19C6, wherein the metallization pattern comprises a tapered portion extending around a chamfered edge.

21C6. The apparatus as in clause 19C6, wherein said metallization pattern comprises protruding features to limit diffusion of said adhesive.

22C6. The apparatus as in clause 19C6, wherein the metallization pattern comprises:

a plurality of discrete contact pads;

fingers electrically connected to the plurality of discrete contact pads; and

and conductive lines interconnecting the fingers.

23C6. The apparatus as in clause 22C6, wherein the metallization pattern forms a plurality of discrete barriers to confine the adhesive to the discrete contact pads.

24C6. The apparatus as in clause 23C6, wherein the plurality of discrete barriers are adjacent to and greater than corresponding discrete contact pads.

25C6. The apparatus as in clause 1C6, further comprising: a flexible electrical interconnect conductively coupled to a surface of the first solar cell to accommodate thermal expansion of the first solar cell in two dimensions.

26C6. The apparatus as in clause 25C6, wherein the first portion of the interconnect is folded around an edge of the first super cell such that the remaining second interconnect is on a backside of the first super cell.

27C6. The device as in clause 1C6, wherein the module has a top conductive ribbon on its front side facing the direction of solar energy, the device comprising:

a second super cell disposed on the front side, the other module having a bottom ribbon on the other module facing away from the solar energy;

The second module overlaps a portion of the first module comprising the top ribbon and is conductively coupled.

28C6. The apparatus as in clause 27C6, wherein the other module is coupled to the module by an adhesive.

29C6. The apparatus as in clause 27C6, further comprising a junction box overlapped by the other module.

30C6. The apparatus as in clause 29C6, wherein the other module is coupled to the module by a matching arrangement between the junction box and the other junction box on the other module.

31C6. The apparatus as in clause 29C6, wherein the junction box accommodates a single module terminal.

32C6. The apparatus as in clause 27C6, further comprising a switch between the module and the other module.

33C6. The apparatus as in clause 32C6, further comprising a voltage sensing controller in communication with the switch.

34C6. The apparatus as in clause 27C6, wherein the first super cell comprises no less than nineteen solar cells electrically coupled with a single bypass diode.

35C6. The apparatus as in clause 34C6, wherein the single bypass diode is located near the edge of the first module.

36C6. The apparatus as in clause 34C6, wherein said single bypass diode is located within a laminate structure.

37C6. The apparatus as in clause 36C6, wherein said super cell is encapsulated within said laminate structure.

38C6. The apparatus as in clause 34C6, wherein the single bypass diode is positioned around the perimeter of the first module.

39C6. The apparatus as in clause 27C6, wherein the first super cell and the second super cell comprise a pair coupled to a power management device.

40C6. In the same device as in point 27C6,

receive a voltage output of the first super cell;

determine whether a solar cell of the first super cell is reverse biased based on the voltage;

and a power management device configured to disconnect the reverse biased solar cell from a super cell module circuit.

1C7. The device is

at least nineteen solar cells grouped into a super cell comprising a first silicon solar cell each having a breakdown voltage greater than about 10V, the first silicon solar cell being arranged with an end overlapping the second silicon solar cell and conductively bonded with an adhesive; A solar module having a front surface including a first series-connected string; and

and an interconnect conductively coupled to the solar cell surface.

2C7. The apparatus as in clause 1C7, wherein the solar cell surface comprises rear surfaces of the first silicon solar cell.

3C7. The apparatus as in clause 2C7, further comprising a ribbon conductor electrically connecting the super cell to an electrical component.

4C7. The apparatus as in clause 3C7, wherein the ribbon conductor is conductively coupled to the solar cell surface away from the overlapping end.

5C7. The apparatus as in clause 4C7, wherein the electrical component is on the backside of the solar module.

6C7. The apparatus as in clause 4C7, wherein the electrical component comprises a junction box.

7C7. The apparatus as in clause 6C7, wherein the junction box is in a consistent arrangement with another junction box on another module overlapped by the module.

8C7. The apparatus as in clause 4C7, wherein the electrical component comprises a bypass diode.

9C7. The apparatus as in clause 4C7, wherein the electrical component comprises a module terminal.

10C7. The apparatus as in clause 4C7, wherein the electrical component comprises an inverter.

11C7. The apparatus as in clause 10C7, wherein said inverter comprises a DC/AC microinverter.

12C7. The apparatus as in clause 11C7, wherein the DC/AC microinverter is on the backside of the solar module.

13C7. The apparatus as in clause 4C7, wherein the electrical component comprises a power management device.

14C7. The apparatus as in clause 13C7, wherein the power management device comprises a switch.

15C7. The apparatus as in clause 14C7, further comprising a voltage sensing controller in communication with the switch.

16C7. A device as in clause 13C7, wherein the power management device comprises:

receive a voltage output of the super cell;

determine whether a solar cell of the super cell is reverse biased based on the voltage;

and disconnect the reverse biased solar cell from the super cell module circuit.

17C7. The apparatus as in clause 16C7, wherein the power management device is in electrical communication with a central inverter.

18C7. The apparatus as in clause 13C7, wherein the power management device comprises a DC/DC module power optimizer.

19C7. The apparatus as in clause 3C7, wherein the interconnect is interposed between the super cell on the front side and another super cell.

20C7. The apparatus as in clause 3C7, wherein the ribbon conductor is conductively coupled to the interconnect.

21C7. The apparatus as in clause 3C7, wherein the interconnect provides a resistance to current flow of less than or equal to about 0.012 ohms.

22C7. The apparatus as in clause 3C7, wherein the interconnect is configured to accommodate differential thermal expansion between the first silicon solar cell and the interconnect for a temperature range of about -40°C to about 85°C.

23C7. The apparatus as in clause 3C7, wherein the thickness of the interconnect is less than or equal to about 100 microns.

24C7. The apparatus as in clause 3C7, wherein the thickness of the interconnect is less than or equal to about 30 microns.

25C7. The apparatus as in clause 3C7, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

26C7. The apparatus as in clause 3C7, further comprising another super cell on the front side of the module.

27C7. The apparatus as in clause 26C7, wherein the interconnect connects the other super cell in series with the super cell.

28C7. The apparatus as in clause 26C7, wherein the interconnect connects the other super cell in parallel with the super cell.

29C7. The apparatus as in clause 26C7, wherein the front side comprises a white backing characterizing darkened stripes of a location and width corresponding to gaps between the super cell and the other super cell.

30C7. The apparatus as in clause 3C7, wherein the interconnect comprises a pattern.

31C7. The apparatus as in clause 3C7, wherein the pattern comprises slits, slots and/or holes.

32C7. The apparatus as in clause 3C7, wherein a portion of said interconnect is dark.

33C7. In the same device as in Matter 3C7,

the first silicon solar cell includes chamfered edges;

the second silicon solar cell lacks chamfered edges;

Each silicon solar cell of the super cell has substantially the same front surface area exposed to light.

34C7. In the same device as in Matter 3C7,

the first silicon solar cell includes chamfered edges;

the second silicon solar cell includes chamfered edges;

and a side having a long side overlapping the long side of the second silicon solar cell.

35C7. The apparatus as in clause 3C7, wherein said interconnect forms a bus.

36C7. The device as in clause 3C7, wherein the interconnect is conductively coupled to the solar cell surface at the bonding site to be bonded.

37C7. The apparatus as in clause 3C7, wherein the first portion of the interconnect is folded around an edge of the super cell such that the remaining second portion is located on the backside of the super cell.

38C7. The apparatus as in clause 3C7, further comprising a metallization pattern on the front surface comprising a line running along a long side, wherein the apparatus further comprises a plurality of discrete contact pads positioned between the line and the long side. include

39C7. In the same device as in point 38C7,

said metallization further comprising fingers electrically connected to respective discrete contact pads and running orthogonal to said long side;

The conductive line interconnects the fingers.

40C7. The apparatus as in clause 38C7, wherein said metallization pattern comprises protruding features to limit diffusion of said adhesive.

1C8. The device is

an adjacent silicon solar cell comprising a plurality of super cells arranged in rows on a front surface of the solar module, each super cell having a breakdown voltage of at least 10V, overlapping and conductively coupled to electrically connect the silicon solar cells in series at least nineteen silicon solar cells arranged in line with the ends of the cells;

The end of the first super cell adjacent the module edge in the first row is electrically connected to the end of the second super cell adjacent the module edge in the second row via a flexible electrical interconnect coupled to the front surface of the first super cell. connected

2C8. The apparatus as in clause 1C8, wherein a portion of the flexible electrical interconnect is covered by a dark film.

3C8. The apparatus as in clause 2C8, wherein the solar module front side comprises a backing sheet exhibiting reduced visible contrast with the flexible electrical interconnect.

4C98. The device as in clause 1C8, wherein a portion of said flexible electrical interconnect is colored.

5C8. The apparatus as in clause 4C8, wherein the solar module front side comprises a backing sheet exhibiting reduced visible contrast with the flexible electrical interconnect.

6C8. The apparatus as in clause 1C8, wherein the solar module front side comprises a white backing sheet.

7C8. The apparatus as in clause 6C8, further comprising darkened stripes corresponding to gaps between the columns.

8C8. The apparatus as in clause 6C8, wherein the n-type semiconductor layer of the silicon solar cell faces the backing sheet.

9C8. In the same device as in point 1C8,

the solar module front side includes a back sheet;

The backsheet, the flexible electrical interconnect, the first super cell, and the encapsulant include a laminated structure.

10C8. The device as in clause 9C8, wherein the encapsulant comprises a thermoplastic polymer.

11C8. The apparatus as in clause 10C8, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

12C8. The apparatus as in clause 9C8, further comprising a windshield sheet.

13C8. The apparatus as in clause 12C8, wherein the back sheet comprises glass.

14C8. The apparatus as in clause 1C8, wherein the flexible electrical interconnect is coupled at a plurality of distinct locations.

15C8. The apparatus as in clause 1C8, wherein the flexible electrical interconnect is joined with an electrically conductive adhesive bonding material.

16C8. The device as in clause 1C8, further comprising a bonding portion to be bonded.

17C8. The apparatus as in clause 1C8, wherein said flexible electrical interconnect runs parallel to said module edge.

18C8. The apparatus as in clause 1C8, wherein a portion of the flexible electrical interconnect is folded around and hidden around the first super cell.

19C8. The apparatus as in clause 1C8, further comprising a ribbon conductor electrically coupling the first super cell to an electrical component.

20C8. The apparatus as in clause 19C8, wherein the ribbon conductor is conductively connected to the flexible electrical interconnect.

21C8. The apparatus as in clause 19C8, wherein the ribbon conductor is conductively coupled to the solar cell surface away from the overlapping end.

22C8. The apparatus as in clause 19C8, wherein said electrical component is on the backside of the solar module.

23C8. The apparatus as in clause 19C8, wherein the electrical component comprises a junction box.

24C8. The apparatus as in clause 23C8, wherein said junction box is arranged to coincide with another junction box on the front side of another solar module.

25C8. The apparatus as in clause 23C8, wherein the junction box comprises a single terminal junction box.

26C8. The apparatus as in clause 19C8, wherein said electrical component comprises a bypass diode.

27C8. The apparatus as in clause 19C8, wherein the electrical component comprises a switch.

28C8. In the same device as in point 27C8,

receive a voltage output of the first super cell;

determine whether a solar cell of the first super cell is reverse biased based on the voltage;

and a voltage sensing controller configured to communicate with the switch to disconnect the reverse biased solar cell from the super cell module circuit.

29C8. The apparatus as in clause 1C8, wherein the first super cell is in series with the second super cell.

30C8. In the same device as in point 1C8,

the first silicon solar cell of the first super cell includes chamfered edges;

the second silicon solar cell of the first super cell lacks chamfered edges;

Each silicon solar cell of the first super cell has substantially the same front surface area exposed to light.

31C8. In the same device as in point 1C8,

the first silicon solar cell of the first super cell includes chamfered edges;

the second silicon solar cell of the first super cell includes chamfered edges;

The long side of the first silicon solar cell overlaps the long side of the second silicon solar cell.

32C8. The apparatus as in clause 1C8, wherein the silicon solar cell of the first super cell comprises a strip having a length of about 156 mm.

33C8. The apparatus as in clause 1C8, wherein the silicon solar cell of the first super cell comprises a strip having a length of about 125 mm.

34C8. The apparatus as in clause 1C8, wherein the silicon solar cell of the first super cell comprises a strip having an aspect ratio between a width and a length of about 1:2 to about 1:20.

35C8. The device as in clause 1C8, wherein the overlapping and adjacent silicon solar cells of the first super cell are conductively bonded with an adhesive, the device further comprising a feature configured to limit diffusion of the adhesive.

36C8. The apparatus as in clause 35C8, wherein said feature comprises a moat.

37C8. The apparatus as in clause 36C8, wherein the moout is formed by a metallization pattern.

38C8. The apparatus as in clause 37C8, wherein the metallization pattern comprises a line running along a long side of the silicon solar cell, the apparatus further comprising a plurality of discrete contact pads positioned between the line and the long side. include

39C8. The apparatus as in clause 37C8, wherein the metallization pattern is located on a front surface of a silicon solar cell of the first super cell.

40C8. The apparatus as in clause 37C8, wherein the metallization pattern is located on a back surface of a silicon solar cell of the second super cell.

1C9. The device is

A solar cell having a front surface comprising series connected silicon solar cells grouped into a first super cell comprising a first truncated strip having a front surface metallization pattern along a first outer edge overlapped by a second cleaved strip contains modules.

2C9. The apparatus as in clause 1C9, wherein the first truncated strip and the second truncated strip have a length that reproduces the shape of the wafer from which the first truncated strip is divided.

3C9. The apparatus as in clause 2C9, wherein said length is 156 mm.

4C9. The apparatus as in clause 2C9, wherein said length is 125 mm.

5C9. The apparatus as in clause 2C9, wherein an aspect ratio between the width of the first cut strip and the length is from about 1:2 to about 1:20.

6C9. The apparatus as in clause 2C9, wherein the first cut strip comprises a first chamfered edge.

7C9. The apparatus as in clause 6C9, wherein the first chamfered edge is along the first outer edge.

8C9. The apparatus as in clause 6C9, wherein the first chamfered edge does not follow the first outer edge.

9C9. The apparatus as in clause 6C9, wherein the second cut strip comprises a second chamfered edge.

10C9. The apparatus as in clause 9C9, wherein the overlapping edge of the second cut strip comprises the second chamfered edge.

11C9. The apparatus as in clause 9C9, wherein the overlapping edge of the second cut strip does not include the second chamfered edge.

12C9. The apparatus as in clause 6C9, wherein said length reproduces the shape of a pseudo-square wafer into which said first cut strip is divided.

13C9. The apparatus as in clause 6C9, wherein the width of the first truncated strip is different from the width of the second truncated strip such that the first truncated strip and the second truncated strip have approximately the same area.

14C9. The apparatus as in clause 1C9, wherein the second cut strip overlaps the first cut strip by about 1 mm-5 mm.

15C9. The apparatus as in clause 1C9, wherein the front surface metallization pattern comprises bus bars.

16C9. The apparatus as in clause 15C9, wherein the bus bar comprises a tapered portion.

17C9. The apparatus as in clause 1C9, wherein the front surface metallization pattern comprises discrete contact pads.

18C9. In the same device as in Matt 17C9,

the second cut strip is bonded to the first cut strip by an adhesive;

The discrete contact pads further include features to limit adhesive diffusion.

19C9. The apparatus as in clause 18C9, wherein said feature comprises a moat.

20C9. The apparatus as in clause 1C9, wherein the front surface metallization pattern comprises a bypass conductor.

21C9. The apparatus as in clause 1C9, wherein the front surface metallization pattern comprises a finger.

22C9. The apparatus as in clause 1C9, wherein the first cut strip further comprises a backside metallization pattern along a second outer edge opposite the first outer edge.

23C9. The apparatus as in clause 22C9, wherein the backside metallization pattern comprises a contact pad.

24C9. The apparatus as in clause 22C9, wherein the backside metallization pattern comprises a bus bar.

25C9. The apparatus as in clause 1C9, wherein the super cell comprises at least nineteen silicon cleaved strips each having a breakdown voltage greater than about 10 volts.

26C9. The apparatus as in clause 1C9, wherein the super cell is connected to another super cell on the front side of the module.

27C9. The apparatus as in clause 26C9, wherein the module front side comprises a white backing featuring darkened stripes corresponding to gaps between the super cell and the other super cell.

28C9. In the same device as in point 26C9,

the solar module front side includes a back sheet;

The backsheet, the interconnect, the super cell and the encapsulant include a laminated structure.

29C9. The device as in clause 28C9, wherein the encapsulant comprises a thermoplastic polymer.

30C9. The apparatus as in clause 26C9, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

31C9. The apparatus as in clause 26C9, further comprising an interconnect between the super cell and the other super cell.

32C9. The apparatus as in clause 31C9, wherein a portion of the interconnect is covered by a dark film.

33C9. The device as in clause 31C9, wherein a portion of said interconnect is colored.

34C9. The apparatus as in clause 31C9, further comprising a ribbon conductor electrically connecting the super cell to an electrical component.

35C9. The apparatus as in clause 34C9, wherein the ribbon conductor is conductively coupled to the backside of the first cut strip.

36C9. The apparatus as in clause 34C9, wherein the electrical component comprises a bypass diode.

37C9. The apparatus as in clause 34C9, wherein the electrical component comprises a switch.

38C9. The apparatus as in clause 34C9, wherein the electrical component comprises a junction box.

39C9. The apparatus as in clause 38C9, wherein said junction box is placed in an overlapping and conforming arrangement with another junction box.

40C9. The apparatus as in clause 26C9, wherein said super cell and said another super cell are connected in series.

1C10. Way,

laser scribing a scribe line on a silicon wafer to define a solar cell area;

applying an electrically conductive adhesive bonding material to the top surface of the scribed silicon wafer adjacent the long side of the solar cell region; and

separating the silicon wafer along the scribe line to provide a solar cell strip comprising a portion of the electrically conductive adhesive bonding material disposed adjacent a long side of the solar cell strip.

2C10. The method as in clause 1C10, wherein the separating further comprises providing the silicon wafer with the metallization pattern to create the solar cell strip having a metallization pattern along the long side.

3C10. The method as in clause 2C10, wherein the metallization pattern comprises bus bars or discrete contact pads.

4C10. The method as in clause 2C10, wherein said providing comprises printing said metallization pattern.

5C10. The method as in clause 2C10, wherein said providing comprises electroplating said metallization pattern.

6C10. The method as in clause 2C10, wherein the metallization pattern comprises features configured to limit diffusion of the electrically conductive adhesive bonding material.

7C10. The method as in clause 6C10, wherein the feature comprises a moat.

8C10. The method as in clause 1C10, wherein said applying comprises printing.

9C10. The method as in clause 1C10, wherein said applying comprises depositing using a mask.

10C10. The method as in clause 1C10, wherein the length of the long side of the solar cell strip reproduces the shape of the wafer.

11C10. The method as in clause 10C10, wherein said length is 156 mm or 125 mm.

12C10. The method as in clause 10C10, wherein an aspect ratio between the width and the length of the solar cell strip is from about 1:2 to about 1:20.

13C10. In the method as in item 1C10, the separating comprises:

applying a vacuum between the bottom surface of the wafer and the curved support surface to bend the solar cell region against a curved support surface, thereby cutting the silicon wafer along the scribe line.

14C10. In the same way as in point 1C10,

arranging a plurality of solar cell strips in line with long sides of overlapping adjacent solar cell strips and a portion of the electrically conductive adhesive bonding material disposed therebetween; and

curing the electrically conductive bonding material to bond adjacent and overlapping solar cell strips to each other and to electrically connect them in series.

15C10. The method as in clause 14C10, wherein curing comprises applying heat.

16C10. The method as in clause 14C10, wherein said curing comprises applying pressure.

17C10. The method as in clause 14C10, wherein arranging comprises forming a layered structure.

18C10. The method as in clause 17C10, wherein said curing comprises applying heat and pressure to said layered structure.

19C10. The method as in clause 17C10, wherein the layered structure comprises an encapsulant.

20C10. The method as in clause 19C10, wherein the encapsulant comprises a thermoplastic polymer.

21C10. The method as in clause 20C10, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

22C10. The method as in clause 17C10, wherein the layered structure comprises a backing sheet.

23C10. In the same way as in point 22C10,

the backing sheet is white;

The layered structure further includes darkened stripes.

24C10. The method as in clause 14C10, wherein arranging comprises arranging at least nineteen solar cell strips in a row.

25C10. The method as in clause 24C10, wherein each of said at least nineteen solar cell strips has a breakdown voltage of at least 10V.

26C10. The method as in clause 24C10, further comprising placing at least nineteen solar cell strips in communication with the single bypass diode.

27C10. The method as in clause 26C10, further comprising forming a ribbon conductor between the single bypass diode and one of the at least nineteen solar cell strips.

28C10. The method as in clause 27C10, wherein the single bypass diode is located within a junction box.

29C10. The method as in clause 28C10, wherein the junction box is on the back side of the solar module in a matching arrangement with another junction box of another solar module.

30C10. The method as in clause 14C10, wherein the overlapping cell strips of the plurality of solar cell strips overlap the solar cell strips by about 1 mm-5 mm.

31C10. The method as in clause 14C10, wherein the solar cell strip comprises a first chamfered edge.

32C10. The method as in clause 31C10, wherein a long side of an overlapping solar cell strip of the plurality of solar cell strips does not include a second chamfered edge.

33C10. The method as in clause 32C10, wherein a width of the solar cell strip is greater than a width of the overlapping solar cell strips such that the solar cell strip and the overlapping solar cell strip have approximately the same area.

34C10. The method as in clause 31C10, wherein a long side of an overlapping solar cell strip of the plurality of solar cell strips comprises a second chamfered edge.

35C10. The method as in clause 34C10, wherein a long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the cell strip comprising the first chamfered edge.

36C10. The method as in clause 34C10, wherein a long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the cell strip that does not include the first chamfered edge.

37C10. The method as in clause 14C10, further comprising connecting the plurality of solar cell strips with another plurality of solar cell strips utilizing an interconnect.

38C10. The method as in clause 37C10, wherein a portion of the interconnect is covered with a dark film.

39C10. The method as in clause 37C10, wherein a portion of said interconnect is colored.

40C10. The method as in clause 37C10, wherein the plurality of solar cell strips are connected in series with the other plurality of solar cell strips.

1C11. Way,

providing a silicon wafer having a length;

scribing a scribe line on the silicon wafer to define a solar cell area;

applying an electrically conductive adhesive bonding material to the surface of the silicon wafer; and

separating the silicon wafer along the scribe line to provide a solar cell strip comprising a portion of the electrically conductive adhesive bonding material disposed adjacent a long side of the solar cell strip.

2C11. The method as in clause 1C11, wherein said scribing comprises laser scribing.

3C11. The method as in clause 1C11, comprising laser scribing the scribe line and thereafter applying the electrically conductive adhesive bonding material.

4C11. The method as in clause 2C11, comprising applying the electrically conductive adhesive bonding material to the wafer and thereafter laser scribing the scribe line.

5C11. In the same way as in point 4C11,

said applying comprises applying an uncured electrically conductive adhesive bonding material;

The laser scribing includes avoiding curing the uncured conductive adhesive bonding material with heat from the laser.

6C11. The method as in clause 5C11, wherein said avoiding comprises selecting a laser output and/or a distance between the scribe line and the uncured conductive adhesive bonding material.

7C11. The method as in clause 1C11, wherein said applying comprises printing.

8C11. The method as in clause 1C11, wherein said applying comprises depositing using a mask.

9C11. The method as in clause 1C11, wherein said scribe line and said electrically conductive adhesive bonding material are on said surface.

10C11. In the method as in item 1C11, the separating comprises:

applying a vacuum between the surface of the wafer and the curved support surface to bend the solar cell region relative to the curved support surface, thereby cutting the silicon wafer along the scribe line.

11C11. The method as in clause 10C11, wherein said separating comprises arranging said scribe line at an angle to a vacuum manifold.

12C11. The method as in clause 1C11, wherein the separating comprises using a roller to apply pressure to the wafer.

13C11. The method as in clause 1C11, wherein said providing further comprises providing said metallization pattern to said silicon wafer such that said separating creates a solar cell strip having a metallization pattern along said long side. .

14C11. The method as in clause 13C11, wherein the metallization pattern comprises bus bars or discrete contact pads.

15C11. The method as in clause 13C11, wherein said providing comprises printing said metallization pattern.

16C11. The method as in clause 13C11, wherein said providing comprises electroplating said metallization pattern.

17C11. The method as in clause 13C11, wherein the metallization pattern comprises features configured to limit diffusion of the electrically conductive adhesive bonding material.

18C11. The method as in clause 1C11, wherein the length of the long side of the solar cell strip reproduces the shape of the wafer.

19C11. The method as in clause 18C11, wherein said length is 156 mm or 125 mm.

20C11. The method as in clause 18C11, wherein an aspect ratio of the width of the solar cell strip and the length of the shear is from about 1:2 to about 1:20.

21C11. In the same way as in point 1C11,

arranging a plurality of solar cell strips in line with long sides of overlapping and adjacent solar cell strips and a portion of the electrically conductive adhesive bonding material disposed therebetween; and

curing the electrically conductive bonding material, thereby bonding adjacent and overlapping solar cell strips to each other and electrically connecting them in series.

22C11. In the same way as in point 21C11,

the arranging includes forming a layered structure;

The curing step includes application of heat and/or pressure to the layered structure.

23C11. The method as in clause 22C11, wherein the layered structure comprises a thermoplastic olefin polymer encapsulant.

24C11. A method as in clause 22C11, wherein the layered structure comprises:

white backing sheet; and

darkened stripes on the white backing sheet.

25C11. In the same way as in point 22C11,

a plurality of wafers are provided on a template;

the conductive adhesive bonding material is dispensed onto the plurality of wafers;

The plurality of wafers are cells that are simultaneously separated into a plurality of solar cell strips by a fixture.

26C11. The method as in clause 25C11, further comprising transporting the plurality of solar cell strips as a group, wherein arranging includes arranging the plurality of solar cell strips into a module.

27C11. The method as in clause 21C11, wherein the arranging comprises arranging at least nineteen solar cell strips having a breakdown voltage of at least 10V in series with only a single bypass diode.

28C11. The method as in clause 27C11, further comprising forming a ribbon conductor between the single bypass diode and one of the at least nineteen solar cell strips.

29C11. The method as in clause 28C11, wherein the single bypass diode is positioned within a first junction box of a first solar module in a matching arrangement with a second junction box of a second solar module.

30C11. The method as in clause 27C11, further comprising forming a ribbon conductor between the smart switch and one of the at least nineteen solar cell strips.

31C11. The method as in clause 21C11, wherein the overlapping cell strips of the plurality of solar cell strips overlap the solar cell strips by about 1 mm-5 mm.

32C11. The method as in clause 21C11, wherein the solar cell strip comprises a first chamfered edge.

33C11. The method as in clause 32C11, wherein a long side of an overlapping solar cell strip of the plurality of solar cell strips does not include a second chamfered edge.

34C11. The method as in clause 33C11, wherein the width of the solar cell strip is greater than the overlapping solar cell strip such that the solar cell strip and the overlapping solar cell strip have approximately the same area.

35C11. The method as in clause 32C11, wherein a long side of an overlapping solar cell strip of the plurality of solar cell strips comprises a second chamfered edge.

36C11. The method as in clause 35C11, wherein a long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the cell strip comprising the first chamfered edge.

37C11. The method as in clause 35C11, wherein a long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the cell strip that does not include the first chamfered edge.

38C11. The method as in clause 21C11, further comprising connecting the plurality of solar cell strips with another plurality of solar cell strips utilizing an interconnect.

39C11. The method as in clause 38C11, wherein a portion of the interconnect is covered or colored by a dark film.

40C11. The method as in clause 38C11, wherein the plurality of solar cell strips are connected in series with the other plurality of solar cell strips.

1C12. Way,

providing a silicon wafer having a length;

scribing a scribe line on the silicon wafer to define a solar cell area;

separating the silicon wafer along the scribe line to provide a solar cell strip; and

disposed adjacent to the long side of the solar cell strip

and applying an electrically conductive adhesive bonding material.

2C12. The method as in clause 1C12, wherein said scribing comprises laser scribing.

3C12. The method as in clause 1C12, wherein said applying comprises screen printing.

4C12. The method as in clause 1C12, wherein said applying comprises inkjet printing.

5C12. The method as in clause 1C12, wherein said applying comprises depositing using a mask.

6C12. The method as in clause 1C12, wherein the separating comprises applying a vacuum between the surface of the wafer and the curved surface.

7C12. The method as in clause 6C12, wherein said curved surface comprises a vacuum manifold and said separating comprises orienting said scribe line at an angle relative to said vacuum manifold.

8C12. The method as in clause 7C12, wherein said angle is a right angle.

9C12. The method as in clause 7C12, wherein said angle is an angle other than a right angle.

10C12. The method as in clause 6C12, wherein said vacuum is applied through a moving belt.

11C12. In the same way as in point 1C12,

arranging in line with adjacent solar cell strips overlapping the electrically conductive adhesive bonding material disposed therebetween; and

The method further includes curing the electrically conductive bonding material to bond adjacent and overlapping solar cell strips electrically connected in series.

12C12. The method as in clause 11C12, wherein the arranging comprises forming a layered structure comprising an encapsulant, the method further comprising laminating the layered structure.

13C12. The method as in clause 12C12, wherein said curing occurs at least in part during said laminating.

14C12. The method as in clause 12C12, wherein said curing step occurs separately from said laminating step.

15C12. The method as in clause 12C12, wherein said laminating comprises applying a vacuum.

16C12. The method as in clause 15C12, wherein said vacuum is applied to a bladder.

17C12. The method as in clause 15C12, wherein said vacuum is applied to the belt.

18C12. The method as in clause 12C12, wherein the encapsulant comprises a thermoplastic olefin polymer.

19C12. The method as in clause 12C12, wherein the layered structure comprises:

white backing sheet; and

darkened stripes on the white backing sheet.

20C12. The method as in clause 11C12, wherein said providing comprises providing said metallization pattern to said silicon wafer such that said separating creates a solar cell strip having a metallization pattern along said long side.

21C12. The method as in clause 20C12, wherein the metallization pattern comprises bus bars or discrete contact pads.

22C12. The method as in clause 20C12, wherein said providing comprises printing or electroplating said metallization pattern.

23C12. The method as in clause 20C12, wherein said arranging comprises limiting diffusion of said electrically conductive adhesive bonding material using a characteristic of said metallization pattern.

24C12. The method as in clause 23C12, wherein the feature is on the front side of the solar cell strip.

25C12. The method as in clause 23C12, wherein the feature is on the back side of the solar cell strip.

26C12. The method as in clause 11C12, wherein the length of the long side of the solar cell strip reproduces the shape of the wafer.

27C12. The method as in clause 26C12, wherein said length is 156 mm or 125 mm.

28C12. The method as in clause 26C12, wherein an aspect ratio between the width and the length of the solar cell strip is from about 1:2 to about 1:20.

29C12. The method as in clause 11C12, wherein the arranging comprises arranging at least nineteen solar cell strips having a breakdown voltage of at least 10V in line with only a single bypass diode as the first super cell.

30C12. The method as in clause 29C12, further comprising applying the electrically conductive adhesive bonding material between the first super cell and the interconnect.

31C12. The method as in clause 30C12, wherein the interconnect connects the first super cell with a second super cell in parallel.

32C12. The method as in clause 30C12, wherein the interconnect connects the first super cell in series with a second super cell.

33C12. The method as in clause 29C12, further comprising forming a ribbon conductor between the first super cell and the single bypass diode.

34C12. The method as in clause 33C12, wherein the single bypass diode is positioned within a first junction box of a first solar module in a matching arrangement with a second junction box of a second solar module.

35C12. The method as in clause 11C12, wherein the solar cell strip comprises a first chamfered edge.

36C12. The method as in clause 35C12, wherein the long sides of the overlapping solar cell strips of the plurality of solar cell strips do not include a second chamfered edge.

37C12. The method as in clause 36C12, wherein a width of the solar cell strip is greater than a width of the overlapping solar cell strips such that the solar cell strip and the overlapping solar cell strip have approximately the same area.

38C12. The method as in clause 35C12, wherein a long side of an overlapping solar cell strip of the plurality of solar cell strips comprises a second chamfered edge.

39C12. The method as in clause 38C12, wherein a long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the cell strip comprising the first chamfered edge.

40C12. The method as in clause 38C12, wherein a long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the cell strip that does not include the first chamfered edge.

1C13. The device is

a semiconductor wafer having a first surface having a first metallization pattern along a first outer edge and a second metallization pattern along a second outer edge opposite the first outer edge, the semiconductor wafer comprising: It further includes a first scribe line between the first metallization pattern and the second metallization pattern.

2C13. The apparatus as in clause 1C13, wherein the first metallization pattern comprises separate contact pads.

3C13. The apparatus as in clause 1C13, wherein the first metallization pattern is directed away from the first outer edge toward the second metallization pattern. a first finger.

4C13. The apparatus as in clause 3C13, wherein the first metallization pattern further comprises a bus bar running along the first outer edge and intersecting the first finger.

5C13. The apparatus as in clause 4C13, wherein the second metallization pattern comprises:

a second finger pointing away from the second outer edge toward the first metallization pattern; and

and a second bus bar extending along the second outer edge and intersecting the second finger.

6C13. The device as in clause 3C13, further comprising an electrically conductive adhesive running along the first outer edge and in contact with the first finger.

7C13. The apparatus as in clause 3C13, wherein the first metallization pattern further comprises a first bypass conductor.

8C13. The apparatus as in clause 3C13, wherein the first metallization pattern further comprises a first end conductor.

9C13. The apparatus as in clause 1C13, wherein the first metallization pattern comprises silver.

10C13. The apparatus as in clause 9C13, wherein the first metallization pattern comprises silver paste.

11C13. The apparatus as in clause 9C13, wherein the first metallization pattern comprises discrete contacts.

12C13. The apparatus as in clause 1C13, wherein said first metallization pattern comprises tin, aluminum, or other conductor less expensive than silver.

13C13. The apparatus as in clause 1C13, wherein the first metallization pattern comprises copper.

14C13. The apparatus as in clause 13C13, wherein the first metallization pattern comprises electroplated copper.

15C13. The apparatus as in clause 13C13, further comprising a passivation scheme to reduce recombination.

16C13. In the same device as in point 1C13,

a third metallization pattern on a first surface of the semiconductor wafer not proximate to the first outer edge or the second outer edge; and

and a second scribe line between the third metallization pattern and the second metallization pattern, wherein the first scribe line is between the first metallization pattern and the third metallization pattern.

17C13. The apparatus as in clause 16C13, wherein a ratio of a first width defined between the first scribe line and the second scribe line divided by the length of the semiconductor wafer is from about 1:2 to about 1:20.

18C13. The apparatus as in clause 17C13, wherein said length is about 156 mm or about 125 mm.

19C13. The apparatus as in clause 17C13, wherein the semiconductor wafer includes chamfered edges.

20C13. In the same device as in point 19C13,

the first scribe line is defined by the first outer edge, the area of a first rectangle comprising two chamfered corners and the first metallization pattern, the area of the first rectangle being in the product of the length having a corresponding area and a second width greater than the first width minus the combined area of the two chamfered edges;

the second scribe line is defined by the first scribe line, the second rectangular area comprising the third metallization pattern without chamfered edges, the second rectangular area being the product of the length and an area corresponding to the first width.

21C13. The apparatus as in clause 16C13, wherein the third metallization pattern comprises a finger facing the second metallization pattern.

22C13. The apparatus as in clause 1C13, further comprising a third metallization pattern on a second surface of the semiconductor wafer opposite the first surface.

23C13. The apparatus as in clause 22C13, wherein the third metallization pattern comprises a contact pad proximate a location of the first scribe line.

24C13. The apparatus as in clause 1C13, wherein the first scribe line is formed by a laser.

25C13. The apparatus as in clause 1C13, wherein the first scribe line is in the first surface.

26C13. The apparatus as in clause 1C13, wherein the first metallization pattern comprises features configured to limit diffusion of the electrically conductive adhesive.

27C13. The apparatus as in clause 26C13, wherein the feature comprises a protruding feature.

28C13. The apparatus as in clause 27C13, wherein the first metallization pattern comprises a contact pad, and wherein the feature comprises a larger dam adjacent the contact pad.

29C13. The apparatus as in clause 26C13, wherein the feature comprises a recessed feature.

30C13. The apparatus as in clause 29C13, wherein the recessed feature comprises a moat.

31C13. The apparatus as in clause 26C13, further comprising the electrically conductive adhesive in contact with the first metallization pattern.

32C13. The apparatus as in clause 31C13, wherein the electrically conductive adhesive is printed.

33C13. The apparatus as in clause 1C13, wherein the semiconductor wafer comprises silicon.

34C13. The apparatus as in clause 33C13, wherein the semiconductor wafer comprises crystalline silicon.

35C13. The device as in clause 33C13, wherein said first surface is of n-type conductivity.

36C13. The device as in clause 33C13, wherein said first surface is of p-type conductivity.

37C13. In the same device as in point 1C13,

the first metallization pattern is 5 mm or less from the first outer edge;

The second metallization pattern is 5 mm or less from the second outer edge.

38C13. The apparatus as in clause 1C13, wherein the semiconductor wafer includes chamfered edges and the first metallization pattern includes a tapered portion extending around the chamfered edges.

39C13. The apparatus as in clause 38C13, wherein the tapered portion comprises a bus bar.

40C13. The apparatus as in clause 38C13, wherein the tapered portion comprises a conductor connecting the discrete contact pads.

1C14. Way,

scribing a first scribe line on the wafer; and

and utilizing a vacuum to separate the wafer along the first scribe line to provide a solar cell strip.

2C14. The method as in clause 1C14, wherein said scribing comprises laser scribing.

3C14. The method as in clause 2C14, wherein said separating comprises applying said vacuum between a surface of said wafer and a curved surface.

4C14. The method as in clause 3C14, wherein the curved surface comprises a vacuum manifold.

5C14. The method as in clause 4C14, wherein the wafer is supported on a moving belt up to the vacuum manifold, and the vacuum is applied through the belt.

6C14. The method as in item 5C14, wherein the separating comprises:

orienting the first scribe line at an angle relative to the vacuum manifold; and

and starting cutting at one end of the first scribe line.

7C14. The method as in clause 6C14, wherein said angle is substantially perpendicular.

8C14. The method as in clause 6C14, wherein said angle is substantially other than a right angle.

9C14. The method as in clause 3C14, further comprising applying an uncured electrically conductive adhesive bonding material.

10C14. The method as in clause 9C14, wherein the first scribe line and the uncured electrically conductive adhesive bonding material are on the same surface of the wafer.

11C14. The method as in clause 10C14, wherein the laser scribing comprises selecting a laser output and/or a distance between the first scribe line and the uncured conductive adhesive bonding material by selecting the uncured conductive adhesive bonding material. Avoid curing

12C14. The method as in clause 10C14, wherein said same surface is opposed to a wafer surface supported by a belt that moves said wafer to said curved surface.

13C14. The method as in clause 12C14, wherein said curved surface comprises a vacuum manifold.

14C14. The method as in clause 9C14, wherein said applying occurs after said scribing.

15C14. The method as in clause 9C14, wherein said applying step occurs after said separating step.

16C14. The method as in clause 9C14, wherein said applying comprises screen printing.

17C14. The method as in clause 9C14, wherein said applying comprises inkjet printing.

18C14. The method as in clause 9C14, wherein said applying comprises depositing using a mask.

19C14. The method as in clause 3C14, wherein the first scribe line comprises:

a first metallization pattern on the surface of the wafer along a first outer edge; and

between a second metallization pattern on the surface of the wafer along a second outer edge.

20C14. The method as in clause 19C14, wherein the wafer further comprises a third metallization pattern on a surface of the semiconductor wafer not proximate to the first outer edge and the second outer edge, the method comprising:

scribing a second scribe line between the third metallization pattern and the second metallization pattern such that the first scribe line is between the first metallization pattern and the third metallization pattern; and

and separating the wafer along the second scribe line to provide another solar cell strip.

21C14. The method as in clause 20C14, wherein a distance between the first scribe line and the second scribe line defines an aspect ratio of about 1:2 to about 1:20 to a length of the wafer having about 125 mm or about 156 mm. form the width.

22C14. The method as in clause 19C14, wherein the first metallization pattern comprises a finger facing the second metallization pattern.

23C14. The method as in clause 22C14, wherein the first metallization pattern further comprises a bus bar intersecting the finger.

24C14. The method as in clause 23C14, wherein the bus bar is within 5 mm of the first outer edge.

25C14. The method as in clause 22C14, further comprising an uncured electrically conductive adhesive bonding material in contact with the finger.

26C14. The method as in clause 19C14, wherein the first metallization pattern comprises separate contact pads.

27C14. The method as in clause 19C14, further comprising printing or electroplating the first metallization pattern on the wafer.

28C14. In the same way as in point 3,

arranging the solar cell strip in a first super cell comprising at least nineteen solar cell strips each having a breakdown voltage of at least 10V, wherein the long sides of adjacent solar cell strips are disposed between the electrical overlaid with a conductive adhesive bonding material;

and curing the electrically conductive bonding material to bond adjacent and overlapping solar cell strips electrically connected in series.

29C14. The method as in clause 28C14, wherein the arranging comprises forming a layered structure comprising an encapsulant, the method further comprising laminating the layered structure.

30C14. The method as in clause 29C14, wherein said curing occurs at least in part during said laminating step.

31C14. The method as in clause 29C14, wherein said curing occurs separately from said laminating.

32C14. The method as in clause 29C14, wherein the encapsulant comprises a thermoplastic olefin polymer.

33C14. A method as in clause 29C14, wherein the layered structure comprises:

white backing sheet; and

darkened stripes on the white backing sheet.

34C14. The method as in clause 28C14, wherein said arranging comprises limiting diffusion of said electrically conductive adhesive bonding material using a metallization pattern feature.

35C14. The method as in clause 34C14, wherein the metallization pattern feature is on the front side of the solar cell strip.

36C14. The method as in clause 34C14, wherein the metallization pattern feature is on the back surface of the solar cell strip.

37C14. The method as in clause 28C14, further comprising applying an electrically conductive adhesive bonding material between the interconnect directly connecting the first super cell and the second super cell.

38C14. The method as in clause 28C14, further comprising forming a ribbon conductor between the first super cell and a single bypass diode, wherein the single bypass diode is coupled to a second junction box of a second solar module and located within a first junction box of a first solar module in a matching arrangement.

39C14. In the same way as in point 28C14,

the solar cell strip includes a first chamfered edge;

a long side of the overlapping solar cell strip of the plurality of solar cell strips does not include a second chamfered edge;

The width of the solar cell strip is greater than the width of the overlapping solar cell strip such that the solar cell strip and the overlapping solar cell strip have approximately the same area.

40C14. In the same way as in point 28C14,

the solar cell strip includes a first chamfered edge;

a long side of the overlapping solar cell strip of the plurality of solar cell strips includes a second chamfered edge;

A long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the solar cell strip that does not include the first chamfered edge.

1C15. Way,

forming a first metallization pattern along a first outer edge of a first surface of the semiconductor wafer;

forming a second metallization pattern along a second outer edge of the first surface, the second outer edge being opposite the first outer edge;

and forming a first scribe line between the first metallization pattern and the second metallization pattern.

2C15. In the same way as in point 1C15,

the first metallization pattern includes a first finger facing the second metallization pattern;

The second metallization pattern includes a second finger facing the first metallization pattern.

3C15. In the same way as in point 2C15,

the first metallization pattern further includes a first bus bar intersecting the first finger and positioned within 5 mm of the first outer edge;

The second metallization pattern includes a second bus bar intersecting the second finger and positioned within 5 mm of the second outer edge.

4C15. In the same way as in point 3C15,

forming, on the first surface, a third metallization pattern not along the first outer edge or not along the second outer edge, the third metallization pattern comprising:

a third bus bar parallel to the first bus bar; and

a third finger facing the second metallization pattern;

forming a second scribe line between the third metallization pattern and the second metallization pattern, wherein the first scribe line is between the first metallization pattern and the third metallization pattern .

5C15. The method as in clause 4C15, wherein the first scribe line and the second scribe line are separated by a width having a ratio to the length of the semiconductor wafer of from about 1:2 to about 1:20.

6C15. The method as in clause 5C15, wherein the length of the semiconductor wafer is about 156 mm or about 125 mm.

7C15. The method as in clause 4C15, wherein the semiconductor wafer includes chamfered edges.

8C15. In the same way as in point 7C15,

the first scribe line is defined by a first outer edge, a first solar cell region includes two chamfered edges and the first metallization pattern, wherein the first solar cell region is a length of the semiconductor wafer having a first area corresponding to the product and a first width minus the combined area of the two chamfered edges;

the second scribe line is defined by the first scribe line, a second solar cell region includes the third metallization pattern without chamfered edges, and wherein the second solar cell region is the product of the length It has a second area corresponding to and a second width narrower than the first width, so that the first area and the second area are substantially the same.

9C15. The method as in clause 8C15, wherein said length is about 156 mm or about 125 mm.

10C15. The method as in clause 4C15, wherein forming the first scribe line and forming the second scribe line comprise laser scribing.

11C15. The method as in clause 4C15, wherein forming the first metallization pattern, forming the second metallization pattern, and forming the third metallization pattern comprises printing.

12C15. The method as in clause 11C15, wherein forming the first metallization pattern, forming the second metallization pattern and forming the third metallization pattern comprises screen printing.

13C15. The method as in clause 11C15, wherein forming the first metallization pattern comprises forming a plurality of contact pads comprising silver.

14C15. The method as in clause 4C15, wherein forming the first metallization pattern, forming the second metallization pattern and forming the third metallization pattern comprises electroplating.

15C15. The method as in clause 14C15, wherein the first metallization pattern, the second metallization pattern and the third metallization pattern comprise copper.

16C15. The method as in clause 4C15, wherein the first metallization pattern comprises aluminum, tin, silver, copper and/or a conductor less expensive than silver.

17C15. The method as in clause 4C15, wherein the semiconductor wafer comprises silicon.

18C15. The method as in clause 17C15, wherein the semiconductor wafer comprises crystalline silicon.

19C15. The method as in clause 4C15, further comprising forming a fourth metallization pattern on the second surface of the semiconductor wafer between 5 mm of the location of the first outer edge and the second scribe line.

20C15. The method as in clause 4C15, wherein the first surface has a first conductivity type and the second surface has a second conductivity type opposite the first conductivity type.

21C15. The method as in clause 4C15, wherein the fourth metallization pattern comprises a contact pad.

22C15. The method as in clause 3C15, further comprising applying a conductive adhesive to the semiconductor wafer.

23C15. The method as in clause 22C15, further comprising applying the conductive adhesive in contact with the first finger.

24C15. The method as in clause 23C15, wherein applying the conductive adhesive comprises depositing using screen printing or a mask.

25C15. The method as in clause 3C15, further comprising separating the semiconductor wafer along the first scribe line to form a first solar cell strip comprising the first metallization pattern.

26C15. The method as in clause 25C15, wherein said separating comprises applying a vacuum to said first scribe line.

27C15. The method as in clause 26C15, further comprising placing the semiconductor wafer on a belt moving to the vacuum.

28C15. The method as in clause 25C15, further comprising applying a conductive adhesive to the first solar cell strip.

29C15. In the same way as in point 25C15,

arranging the first solar cell strip in a first super cell comprising at least nineteen solar cell strips each having a breakdown voltage of at least 10V, the long sides of adjacent solar cell strips being interposed therebetween overlaid with the conductive adhesive being disposed;

The method further includes curing the conductive adhesive to bond adjacent and overlapping solar cell strips electrically connected in series.

30C15. The method as in clause 29C15, wherein the arranging comprises forming a layered structure comprising an encapsulant, the method further comprising laminating the layered structure.

31C15. The method as in clause 30C15, wherein said curing step occurs at least in part during said laminating step.

32C15. The method as in clause 30C15, wherein the curing step occurs separately from the laminating step.

33C15. The method as in clause 30C15, wherein the encapsulant comprises a thermoplastic olefin polymer.

34C15. The method as in clause 30C15, wherein the layered structure comprises:

white backing sheet; and

darkened stripes on the white backing sheet.

35C15. The method as in clause 29C15, wherein said arranging comprises limiting diffusion of said conductive adhesive with a metallization pattern feature.

36C15. The method as in clause 35C15, wherein the metallization pattern feature is on the front surface of the first solar cell strip.

37C15. The method as in clause 29C15, further comprising applying the conductive adhesive between an interconnect connecting the first super cell and the second super cell in series.

38C15. The method as in clause 29C15, further comprising forming a ribbon conductor between a single bypass diode and the first super cell, wherein the single bypass diode is coupled to a second junction box of a second solar module and located within a first junction box of a first solar module in a matching arrangement.

39C15. In the same way as in point 29C15,

the first solar cell strip includes a first chamfered edge;

the long side of the overlapping solar cell strip of the first super cell does not include a second chamfered edge;

A width of the first solar cell strip is greater than a width of the overlapping solar cell strip such that the first solar cell strip and the overlapping solar cell strip have approximately the same area.

40C15. In the same way as in point 29C15,

the first solar cell strip includes a first chamfered edge;

the long side of the overlapping solar cell strip of the first super cell includes a second chamfered edge;

The long side of the overlapping solar cell strip overlaps the long side of the first solar cell strip that does not include the first chamfered edge.

1C16. Way,

a first row of bus bars or contact pads arranged parallel to and adjacent to a first outer edge of the wafer and a second row of bus bars or contact pads arranged parallel to and adjacent to a second outer edge of the wafer opposite and parallel to the first edge of the wafer preparing or providing a silicon wafer having a front surface metallization pattern comprising a row of bus bars or contact pads;

separating the silicon wafer along one or more scribe lines parallel to first and second outer edges of the wafer to form a plurality of rectangular solar cells, the first bus bar or contact pad; the row of rectangular solar cells is arranged parallel to and adjacent the long outer edge of the first of the rectangular solar cells, and the second row of bus bars or contact pads is parallel to the long outer edge of the second one of the rectangular solar cells. and arranged adjacently;

arranging the rectangular solar cells in line with long sides of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series to form a super cell;

The first row of bus bars or contact pads on a first one of the rectangular solar cells is overlapped and conductively coupled by the bottom surface of an adjacent rectangular solar cell within the super cell.

2C16. The method as in clause 1C16, wherein the second row of bus bars or contact pads on a second one of the rectangular solar cells is overlapped and conductively coupled by a bottom surface of an adjacent rectangular solar cell within the super cell. do.

3C16. The method as in clause 1C16, wherein the silicon wafer is a square or pseudo-square silicon wafer.

4C16. The method as in clause 3C16, wherein the silicon wafer comprises sides of a length of about 125 mm or a length of about 156 mm.

5C16. The method as in clause 3C16, wherein the ratio of the length to width of each rectangular solar cell is from about 2:1 to about 20:1.

6C16. The method as in clause 1C16, wherein the silicon wafer is a crystalline silicon wafer.

7C16. The method as in clause 1C16, wherein the first row of bus bars or contact pads and the second row of bus bars or contact pads convert light into electricity less efficiently than central regions of the silicon wafer. located within the edge regions of

8C16. The method as in clause 1C16, wherein the front surface metallization pattern includes a first plurality of parallel fingers electrically connected to the first row of bus bars or contact pads and extending inwardly from a first outer edge of the wafer; and and a second plurality of parallel fingers electrically connected to the second bus bar or row of contact pads and extending inwardly from a second outer edge of the wafer.

9C16. The method as in clause 1C16, wherein the front surface metallization pattern is at least a third bus bar or contact pad positioned between and oriented parallel to the first row of bus bars or contact pads and the second row of bus bars or contact pads. and a third plurality of parallel fingers oriented orthogonally to and electrically connected to the third row of bus bars or contact pads, wherein the third row of bus bars or contact pads comprises the plurality of rectangular solar cells. After the silicon wafer is separated to form the cells arranged parallel to and adjacent to the long outer edge of a third of the rectangular solar cells.

10C16. The method as in clause 1C16, comprising applying a conductive adhesive to the first row of bus bars or contact pads to conductively couple the first rectangular solar cell to an adjacent solar cell.

11C16. The method as in clause 10C16, wherein the metallization pattern comprises a barrier configured to limit diffusion of the conductive adhesive.

12C16. A method as in clause 10C16, comprising applying said conductive adhesive by screen printing.

13C16. A method as in clause 10C16, comprising applying said conductive adhesive by inkjet printing.

14C16. The method as in clause 10C16, wherein the conductive adhesive is applied prior to formation of the scribe lines in the silicon wafer.

15C16. The method as in clause 1C16, wherein separating the silicon wafer along the one or more scribe lines comprises between a bottom surface of the silicon wafer and the curved support surface to bend the silicon wafer against a curved support surface. applying a vacuum, thereby cutting the silicon wafer along the one or more scribe lines.

16C16. In the same way as in point 1C16,

The silicon wafer is a pseudo-square silicon wafer comprising chamfered corners, wherein one or more of the rectangular solar cells are one of the chamfered corners after separation of the silicon wafer to form a plurality of rectangular solar cells. or more;

The spacing between the scribe lines makes the width orthogonal to the long axis of the rectangular solar cells comprising chamfered corners greater than the width orthogonal to the long axis of the rectangular solar cells lacking the chamfered corners; As selected to compensate for the treated corners, each of the plurality of rectangular solar cells in the super cell has a front surface of substantially equal area that is exposed to light in operation of the super cell.

17C16. The method as in clause 1C16, comprising arranging the super cells in a layered structure between a transparent front sheet and a back sheet and laminating the layered structure.

18C16. The method as in clause 17C16, wherein laminating the layered structure comprises curing of a conductive adhesive disposed between the adjacent rectangular solar cells in the super cell to conductively connect the adjacent rectangular solar cells to each other. complete

19C16. The method as in clause 17C16, wherein the super cell is arranged in the layered structure in one of two or more parallel rows of super cells, and wherein the back sheet is positioned in the gaps between the two or more rows of super cells. As it is a white sheet comprising parallel darkened stripes having positions and widths corresponding to fields and widths, the white portions of the back sheet are not visible through the gaps between the rows of super cells in the assembled module.

20C16. The method as in clause 17C16, wherein the front sheet and the back sheet are glass sheets, and the super cell is encapsulated in a thermoplastic olefin layer interposed between the glass sheets.

21C16. The method as in clause 1C16, comprising arranging the super cell within a first module comprising a junction box in a configuration consistent with a second junction box of a second solar module.

1D. solar modules,

a plurality of super cells arranged in two or more parallel rows, each super cell having long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series; a plurality of rectangular or substantially rectangular silicon solar cells arranged in a line;

a first hidden tab contact pad positioned on the back surface of a first solar cell positioned intermediately along the first of the super cells;

a first electrical interconnect conductively coupled to the first hidden tap contact pad;

The first electrical interconnect has a stress relief feature that accommodates differential thermal expansion between the interconnect and the silicon solar cell to which it is coupled.

2D. clause 1D and in the solar module, comprising: a second hidden tab contact pad positioned on a back surface of a second solar cell positioned adjacent to the first solar cell at an intermediate position along a second of the super cells; , the first hidden tap contact pad is electrically connected to the second hidden tap contact pad through the first electrical interconnect.

3D. Clause 2D and the solar module, wherein the first electrical interconnect extends across a gap between the first super cell and the second super cell and is conductively coupled to the second hidden tap contact pad.

4D. clause 1D and the solar module, wherein a second hidden tap contact pad positioned on a back surface of a second solar cell positioned at another intermediate location along the first of the super cells, conductive to the second hidden tap contact pad electrically connected by a second electrical interconnect coupled to Includes a bypass diode.

5D. clause 1D and the solar module, wherein the first hidden tap contact pad comprises a plurality of hidden tap contact pads arranged on a rear surface of the first solar cell in a row running parallel to the long axis of the first solar cell. wherein the first electrical interconnect is conductively coupled to each of the plurality of hidden contacts and substantially transverses a length of the first solar cell along the long axis.

6D. The solar module and in clause 1D, wherein the first hidden tap contact pad is positioned adjacent a short side of a back surface of the first solar cell, and wherein the first electrical interconnect is along a long axis of the solar cell. and the back surface metallization pattern on the first solar cell provides a conductive path for the interconnect having a sheet resistance equal to or less than about 5 ohms per square.

7D. In clause 6D and in the solar module, the sheet resistance is less than or equal to about 2.5 ohms per square.

8D. Clause 6D and the solar module, wherein the first interconnect comprises two tabs positioned on opposite sides of the stress relief feature, one of the tabs to the first hidden tab contact pad. conductively coupled.

9D. In clause 8D and in the solar module, the two tabs are of different lengths.

10D. Clause 1D and the solar module, wherein the first electrical interconnect includes alignment features that identify a desired alignment with the first hidden tap contact pad.

11D. Clause 1D and the solar module, wherein the first electrical interconnect includes alignment features that identify a desired alignment of an edge of the first super cell.

12D. Clause 1D and the solar module, wherein the solar module is arranged in a shingled fashion overlapping with another solar module electrically connected in the overlapping area.

13D. solar modules,

a glass front sheet;

a back seat;

a plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet, each super cell overlapping and flexibly conductively coupled to each other to electrically connect silicon solar cells in series a plurality of rectangular or substantially rectangular silicon solar cells arranged in line with the long sides of adjacent silicon solar cells;

a first flexible electrical interconnect is rigidly conductively coupled to a first of the super cells;

The flexible conductive bonds between overlapping solar cells form the super cells and the glass front surface in a direction parallel to the rows for a temperature range of about -40°C to about 100°C without damaging the solar module to the super cells. provide mechanical compliance to accommodate mismatches in thermal expansion between sheets;

A tight conductive bond between the first super cell and the first flexible electrical interconnect is such that the first flexible electrical interconnect is orthogonal to the rows for a temperature range of about -40°C to about 180°C without damage to the solar module. direction to accommodate a mismatch in thermal expansion between the first super cell and the first flexible interconnect.

14D. Clause 13D and the solar module, wherein the conductive bonds between the overlapping and adjacent solar cells in a super cell use a different conductive adhesive than the conductive bonds between the super cell and the flexible electrical interconnect.

15D. In clause 14D and in the solar module, the conductive adhesives may all be cured in the same processing step.

16D. Clause 13D and the solar module, wherein the conductive bond on one side of the at least one solar cell in the super cell uses a different conductive adhesive than the conductive bond on the other side.

17D. In clause 16D and in the solar module, the conductive adhesives may all be cured in the same processing step.

18D. Clause 13D and the solar module, wherein the conductive bonds between overlapping and adjacent solar cells accommodate differential motion between each cell and the glass front sheet greater than or equal to about 15 microns.

19D. Clause 13D and the solar module, wherein the conductive bonds between the overlapping and adjacent solar cells are less than or equal to about 50 microns and a thickness orthogonal to the solar cells and greater than or equal to about 1.5 W/(meter rK). It has a thermal conductivity orthogonal to the solar cells.

20D. Clause 13D and the solar module, wherein the first flexible electrical interconnect withstands thermal expansion or contraction of the first flexible interconnect greater than or equal to about 40 microns.

21D. clause 13D and the solar module, wherein the portion of the first flexible electrical interconnect conductively coupled to the super cell is like a ribbon formed of copper and is less than or equal to about 50 microns to the surface of the solar cell to which it is coupled. has a thickness orthogonal to

22D. Clause 21D and the solar module, wherein the portion of the first flexible electrical interconnect conductively coupled to the super cell is like a ribbon formed of copper and is less than or equal to about 30 microns the surface of the solar cell to which it is coupled. has a thickness orthogonal to

23D. The solar module and in clause 21D, wherein the first flexible electrical interconnect is not coupled to the solar cell, and the copper of the required conductivity provides a higher conductivity than a portion of the first flexible electrical interconnect conductively coupled to the solar cell. includes part.

24D. Clause 21D and the solar module, wherein the first flexible electrical interconnect has a width greater than or equal to about 10 mm in the plane of the surface of the solar cell in a direction orthogonal to the flow of current through the interconnect.

25D. Clause 21D and the solar module, wherein the first flexible electrical interconnect is conductively coupled to a conductor proximate the solar cell that provides a higher conductivity than the first electrical interconnect.

26D. Clause 13D and the solar module, wherein the solar module is arranged in a shingled manner overlapping another solar module electrically connected in the overlapping area.

27D. solar modules,

a plurality of super cells arranged in two or more parallel rows, each super cell having long sides of adjacent silicon solar cells overlapping and conductively coupled directly to each other to electrically connect the silicon solar cells in series a plurality of rectangular or substantially rectangular silicon solar cells arranged in line with;

a hidden tap contact pad positioned on the back surface of the first solar cell that does not conduct an effective current in normal operation;

The first solar cell is positioned at an intermediate position along a first of the super cells within a first of the rows of super cells, and the hidden tap contact pad is at least within a second of the rows of super cells. It is electrically connected in parallel with the second solar cell.

28D. clause 27D and the solar module, comprising an electrical interconnect coupled to the hidden tap contact pad and electrically interconnecting the hidden tap contact pad to the second solar cell, wherein the electrical interconnect comprises the Over substantially no length, the backside metallization pattern of the first solar cell provides conductive pathways to the hidden tab contact pad having a sheet resistance equal to or less than about 5 ohms per square.

29D. Clause 27D and the solar module, wherein the plurality of super cells are arranged in three or more rows spanning a width of the solar module orthogonal to the rows, and wherein the hidden tap contact pad electrically connects the rows of super cells. electrically connected to a hidden contact pad on at least one solar cell in each row of super cells to connect in parallel to at least one for at least one of the hidden tap contact pads or to an interconnect between hidden tap contact pads. The bus connection is connected to a bypass diode or other electronic device.

30D. Clause 27D and the solar module, comprising: a flexible electrical interconnect conductively coupled to the hidden tab contact pad for electrically connecting to the second solar cell;

a portion of the flexible electrical interconnect conductively coupled to the hidden tab contact pad is like a ribbon formed of copper and has a thickness orthogonal to the surface of the solar cell to which it is coupled is less than or equal to about 50 microns;

The conductive bond between the hidden tap contact pad and the flexible electrical interconnect is such that the flexible electrical interconnect withstands a mismatch of thermal expansion between the first solar cell and the flexible interconnect, and is within a temperature range of about −40° C. to about −40° C. without damage to the solar module. to accommodate relative motion between the first solar cell and the second solar cell resulting from thermal expansion for a temperature range of about 180°C.

31D. Clause 27D and the solar module, wherein in operation of the solar module the first hidden tap contact pad is capable of conducting a current greater than a current generated within any single one of the solar cells.

32D. Clause 27D and the solar module, wherein the front surface of the first solar cell overlying the first hidden tab contact pad is not occupied by contact pads or any other interconnect features.

33D. Clause 27D and the solar module, wherein any area of the front surface of the first solar cell that is not overlapped by a portion of an adjacent solar cell in the first super cell is by contact pads or any other interconnect features. not occupied by

34D. In clause 27D and in the solar module, most of the cells within each super cell do not have hidden tap contact pads.

35D. Clause 34D and the solar module, wherein cells having hidden tap contact pads have a larger light collection area than cells not having hidden tap contact pads.

36D. Clause 27D and the solar module, wherein the solar module is arranged in a shingled manner overlapping another solar module electrically connected in the overlapping area.

37D. solar modules,

a glass front sheet;

a back seat;

a plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet, each super cell overlapping to electrically connect silicon solar cells in series and flexibly conductive directly to each other a plurality of rectangular or substantially rectangular silicon solar cells arranged in line with long sides of adjacent silicon solar cells to be joined;

a first flexible electrical interconnect rigidly conductively coupled to a first of the super cells;

the flexible conductive bonds between the overlapping solar cells are formed of a first conductive adhesive and have a shear modulus of less than or equal to about 800 megaPascals;

The rigid conductive bond between the first super cell and the first flexible electrical interconnect is formed of a second conductive adhesive and has a shear modulus of greater than or equal to about 2000 megaPascals.

38D. The solar module as in clause 37D, wherein the first conductive adhesive and the second conductive adhesive are different, and the conductive adhesives can both be cured in the same processing step.

39D. The solar module as in clause 37D, wherein the conductive bonds between the overlapping adjacent solar cells are less than or equal to about 50 microns thick orthogonal to the solar cells and greater than about 1.5 W/(meter-K). has a thermal conductivity orthogonal to the solar cells such as

40D. A solar module as in clause 37D, wherein the solar module is arranged in a shingled manner overlapping with other solar modules electrically connected in the overlapping area.

1E. A solar module includes a number N greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows, each super cell comprising a plurality of silicon solar cells arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled to electrically connect in series; The super cells are electrically connected to provide a high direct current voltage greater than or equal to about 90 volts.

2E. The solar module as in clause 1E, comprising one or more flexible electrical interconnects arranged to electrically connect the plurality of super cells in series to provide the high direct current voltage.

3E. The solar module as in clause 2E, comprising module level power electronics comprising an inverter to convert said high direct voltage to alternating voltage.

4E. The solar module as in clause 3E, wherein the module level power electronics sense the high DC voltage and operate the module at an optimal current-voltage power point.

5E. The solar module as in clause 1E, wherein the one or more pairs of pairs of rows of super cells are electrically coupled to respective pairs of adjacent series-connected rows of super cells to provide the high direct voltage. It is connected in series and includes module level power electronics having an inverter that converts the high DC voltage into an AC voltage.

6E. The solar module as in clause 5E, wherein the module level power electronics sense a voltage across each respective pair of rows of super cells, wherein each respective pair of rows of super cells at an optimal current-voltage power point. to operate

7E. The solar module as in clause 6E, wherein the module level power electronics switches the respective pair of rows of super cells from the circuit providing the high direct voltage when the voltage across the pair of rows is below a threshold. do.

8E. The solar module as in clause 1E, electrically coupled to each respective row of super cells, electrically connecting two or more rows of super cells in series to provide the high direct current voltage, the high direct current and module level power electronics having an inverter that converts the voltage to an alternating voltage.

9E. The solar module as in clause 8E, wherein the module level power electronics sense the voltage across each individual row of super cells and operate each individual row of super cells at an optimal current-voltage power point.

10E. The solar module as in clause 9E, wherein the module level power electronics switches the respective pair of rows of super cells from the circuit providing the high direct voltage when the voltage across the pair of rows is below a threshold. do.

11E. The solar module as in clause 1E, electrically coupled to each individual super cell, electrically connecting two or more of said super cells in series to provide said high direct voltage, said high direct voltage to alternating current It includes module level power electronics having an inverter that converts it to voltage.

12E. The solar module as in clause 11E, wherein the module level power electronics sense the voltage across each individual super cell and operate each individual super cell at an optimal current-voltage power point.

13E. The solar module as in clause 12E, wherein the module level power electronics switches the individual super cell from the circuit providing the high direct current voltage when the voltage across the super cell is below a threshold.

14E. The solar module as in clause 1E, wherein each super cell is electrically divided into a plurality of segments by hidden taps, wherein the solar module is electrically connected to each segment of each super cell through the hidden taps. and module-level power electronics having an inverter connected to the inverter, electrically connecting two or more segments in series to provide the high DC voltage, and converting the high DC voltage into an AC voltage.

15E. The solar module as in clause 14E, wherein the module level power electronics sense the voltage across each individual segment of each super cell and operate each individual segment at an optimal current-voltage power point.

16E. The solar module as in clause 15E, wherein the module level power electronics switches the individual segment from the circuit providing the high direct current voltage when the voltage across the segment is below a threshold.

17E. The solar module as in clause 4E, clause 6E, clause 9E, clause 12E or clause 15E, wherein the optimal current-voltage power point is a maximum current-voltage power point.

18E. The solar module as in any of clauses 3E- clause 17E, wherein the module level power electronics lack a direct current to direct current boost component.

19E. The solar module as in any of clauses 1E- clause 18E, wherein N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350; greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than about 700 greater than or equal to

20E. The solar module as in any of clauses 1E- 19E, wherein the high direct voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or about 300 volts. greater than or equal to volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts .

21E. A solar photovoltaic system is

two or more solar modules electrically connected in parallel; and

an inverter;

Each solar module includes a number N greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows, each super cell in each module being two or more of said silicon solar cells in said module arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series; the super cells are electrically connected to provide a high voltage direct current module output greater than or equal to about 90 volts;

The inverter is electrically connected to the two or more solar modules to convert their high voltage direct current output to alternating current.

22E. The solar power system of clause 21E, wherein each solar module comprises one or more flexible electrical interconnects arranged to electrically connect super cells in the solar module in series to provide a high voltage direct current output of the solar module. include

23E. The solar power system of clause 21E, comprising at least a third solar module electrically connected in series with a first of the two or more solar modules electrically connected in parallel, the third solar module comprising: a number N' greater than or equal to about 150, arranged as a plurality of super cells in two or more parallel rows, rectangular or substantially rectangular silicon solar cells, wherein each super cell in the third solar module comprises said two or more silicon solar cells in the module arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series, the third aspect Within the optical module the super cells are electrically connected to provide a high voltage direct current module output greater than or equal to about 90 volts.

24E. The solar power system of clause 23E, comprising at least a fourth solar module electrically connected in series with a second of the two or more solar modules electrically connected in parallel, the fourth solar module comprising: a number N" greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows, wherein each super cell in the fourth solar module comprises said two or more silicon solar cells in the module arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series, the fourth aspect Within the optical module the super cells are electrically connected to provide a high voltage direct current module output greater than or equal to about 90 volts.

25E. The solar power system of clauses 21E-24E, comprising fuses arranged to prevent a short circuit occurring in any of the solar modules from dissipating power generated in the other solar modules.

26E. The solar power system of any of clauses 21E-25E, wherein the interruption is arranged to prevent a short circuit occurring within any of the solar modules from dissipating power generated within others of the solar modules. including diodes.

27E. The solar power system of any of clauses 21E-26E, wherein the two or more solar modules are electrically connected in parallel, and the inverter comprises positive and negative buses to which the inverter is electrically connected.

28E. The solar power system of any of clauses 21E-26E, comprising a coupler box to which the two or more solar modules are electrically connected by a separate conductor, the combiner box electrically connecting the solar modules connected in parallel with

29E. The solar power system of clause 28E, wherein the combiner box comprises fuses arranged to prevent a short circuit occurring within any of the solar modules dissipating power generated within the other solar modules.

30E. The solar power system of clause 28E or clause 29E, wherein the combiner box is arranged to prevent a short circuit occurring within any of the solar modules from dissipating power generated within others of the solar modules. blocking diodes.

31E. The solar power system of any of clauses 21E- 30E, wherein the inverter is configured to operate the solar modules at a direct current voltage above a minimum value set to avoid reverse biasing the module.

32E. The solar power system of any of clauses 21E- 30E, wherein the inverter is configured to recognize a reverse bias condition and operate the solar modules at a voltage that avoids the reverse bias condition.

33E. The solar module of any of clauses 21E-32E, wherein N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, or about 400 greater than or equal to, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than about 700 it's like

34E. The solar module of any of clauses 21E-33E, wherein the high direct voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or greater than about 300 volts. greater than or equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

35E. The solar power system of any of clauses 21E-34E, located on the roof top.

36E. solar power system,

A first solar module comprising a number N greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows, each super cell comprising: a plurality of silicon solar cells arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series;

an inverter;

The super cells are electrically connected to provide a high direct current voltage greater than or equal to about 90 volts to the inverter that converts direct current to alternating current.

37E. The solar power system of clause 36E, wherein the inverter is a microinverter integrated with the first solar module.

38E. The solar power system of clause 36E, wherein the first solar module is one or more flexible electrical modules arranged to be electrically connected in series to super cells in the solar module to provide a high voltage direct current output of the solar module. interconnects.

39E. The solar power system of any of clauses 36E-38E, comprising at least a second solar module electrically connected in series to the first solar module, the second solar module comprising two or more parallel solar modules. A number N' greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in rows, wherein each super cell in the second solar module electrically connects the silicon solar cells. two or more of silicon solar cells in the module arranged in line with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to connect in series with each other; The super cells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts.

40E. The solar module of any of clauses 36E-39E, wherein the inverter lacks a direct current to direct current boost component.

41E. The solar module of any of clauses 36E-40E, wherein N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, or about 400 greater than or equal to, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than about 700 it's like

42E. The solar module of any of clauses 36E-41E, wherein the high direct current voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or greater than about 300 volts. or equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

43E. solar modules,

A number N greater than or equal to about 250 rectangular or substantially rectangular silicon solar cells arranged as a plurality of series-connected super cells in two or more parallel rows, wherein each super cell is a silicon solar cell within the super cell. a plurality of silicon solar cells arranged in line with long sides of adjacent silicon solar cells overlapping and conductively bonded to each other with an electrically and thermally conductive adhesive to electrically connect them in series;

no more than one bypass diode per 25 solar cells;

The electrically and thermally conductive adhesive is applied to the solar cells with a thickness orthogonal to the solar cells less than or equal to about 50 microns between adjacent solar cells and greater than or equal to about 1.5 W/(meter-K). Form bonds with orthogonal thermal conductivity.

44E. The solar module of clause 43E, wherein the super cells are encapsulated in a thermoplastic olefin layer between the front and back sheets.

45E. The solar module of clause 43E, wherein said super cells are encapsulated between said front and back sheets.

46E. The solar module of clause 43E, wherein no more than one bypass diode per 30 solar cells, or no more than one bypass diode per 50 solar cells, or no more than one bypass diode per 100 solar cells, or Either a single bypass diode or no bypass diode is included.

47E. The solar module of clause 43E, wherein the solar module contains no bypass diodes, only a single bypass diode, or no more than three bypass diodes, or no more than six bypass diodes, or no more than a row bypass. including diodes.

48E. The solar module of clause 43E, wherein the conductive bonds between the overlapping solar cells are in a direction parallel to the rows for a temperature range of about -40°C to about 100°C without damaging the solar module to the super cells. provide mechanical compliance to accommodate the mismatch in thermal expansion between the super cells and the glass front sheet.

49E. The solar module of any of clauses 43E-48E, wherein N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, or about 500 greater than or equal to, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, greater than or equal to about 700.

50E. The solar module of any of clauses 43E-49E, wherein the super cells are greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or greater than about 300 volts. High direct current voltage greater than or equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts electrically connected to provide

51E. solar energy system,

The solar module of clause 43E; and

and an inverter electrically coupled to the solar module and configured to convert a DC output from the solar module to provide an AC output.

52E. The solar energy system of clause 51E, wherein said inverter lacks a DC to DC boost component.

53E. The solar energy system of clause 51E, wherein the inverter is configured to operate the solar module at a direct current voltage above a set minimum value to avoid reverse biasing the solar cell.

54E. The solar energy system of clause 53E, wherein said minimum voltage value is temperature dependent.

55E. The solar energy system of clause 51E, wherein the inverter is configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.

56E. The solar energy system of clause 55E, wherein the inverter is configured to operate the solar module in a maximal region of a voltage-current output curve of the solar module to avoid the reverse bias condition.

57E. The solar energy system of any of clauses 51E-56E, wherein the inverter is a microinverter integrated with the solar module.

1F. A method of manufacturing solar cells, the method comprising:

advancing the solar cell wafer along a curved surface; and

applying a vacuum between the curved surface and a bottom surface of the solar cell wafer to bend the solar cell wafer against the curved surface, thereby separating the plurality of solar cells from the solar cell wafer in advance of one or more and cutting the solar cell wafer along prepared scribe lines.

2F. The method of clause 1F, wherein the curved portion of the upper surface of the vacuum manifold applies the vacuum to the lower surface of the solar cell wafer.

3F. The method of clause 2F, wherein the vacuum applied to the bottom surface of the solar cell wafer by the vacuum manifold is changed along a direction of travel of the solar cell wafer, and in the region of the vacuum manifold where the solar cell wafer is cut become strong

4F. The method of clause 2F or clause 3F, comprising: transferring the solar cell wafer to a perforated belt along a curved upper surface of the vacuum manifold, wherein the vacuum passes through the perforations in the perforated belt. It is applied to the bottom surface of the wafer.

5F. The method of clause 4F, wherein the perforations in the belt are arranged such that leading and trailing edges of the solar cell wafer lie over the at least one perforation in the belt along a direction of travel of the solar cell wafer.

6F. The method of any of clauses 2F- 5F, wherein the solar cell wafer is advanced along a planar region of the top surface of the vacuum manifold to reach a curved transition region of the top surface of the vacuum manifold having a first curvature and thereafter advancing the solar cell wafer into a cut region of an upper surface of the vacuum manifold where the solar cell wafer is cut, wherein the cut area of the vacuum manifold is sharper than the first curvature. have curvature.

7F. The method of clause 6F, wherein the curvature of the transition region is defined by a continuous geometric function of increasing curvature.

8F. The method of clause 7F, wherein the curvature of the cut region is defined by a continuous geometric function of increasing curvature.

9F. The method of clause 6F, comprising advancing into a post cut region of the vacuum manifold having a third curvature that is steeper than the second curvature.

10F. The method of clause 9F, wherein the curvatures of the transition region, the cut region and the post cut region of the curve are defined by a continuous geometric function of increasing curvature.

11F. The method of clause 7F, clause 8F, or clause 10F, wherein the continuous geometric function of increasing curvature is a clothoid.

12F. The method of any of clauses 1F- 11F, wherein each scribe line rather than opposite ends of each scribe line provides an asymmetrical stress distribution along each scribe line that promotes generation and propagation of a single cutting crack along each scribe line. and applying a stronger vacuum between the solar cell wafer and the curved surface at one end of the scribe line.

13F. The method of any of clauses 1F- 12F, comprising removing the cleaved solar cells from the curved surface, wherein the edges of the cleaved solar cells are prior to removal of the solar cells from the curved surface. not in contact with

14F. The method of any of clauses 1F-13F, comprising:

laser scribing onto the solar cell wafer; and

applying an electrically conductive adhesive bonding material to portions of a top surface of the solar cell wafer prior to cutting the solar cell wafer along the scribe lines;

Each cleaved solar cell includes a portion of the electrically conductive adhesive bonding material disposed along a cleaved edge of its top surface.

15F. The method of clause 14F, comprising laser scribing the scribe lines and thereafter applying the electrically conductive adhesive bonding material.

16F. The method of clause 14F, comprising applying the electrically conductive adhesive bonding material and thereafter laser scribing the scribe lines.

17F. A method of making a string of solar cells from cleaved solar cells manufactured by the method of any of clauses 14F-16F, wherein the cleaved solar cells are rectangular, the method comprising:

arranging the plurality of rectangular solar cells in line with long sides of adjacent rectangular solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween; and

curing the electrically conductive bonding material, bonding adjacent and overlapping rectangular solar cells, and electrically connecting them in series.

18F. The method of any of clauses 1F-17F, wherein the solar cell wafer is a square or pseudo-square silicon solar cell wafer.

1G. A method of making a string of cells, the method comprising:

forming a back surface metallization pattern on each of the one or more square solar cells;

stencil printing a complete front surface metallization pattern using a single stencil in a single stencil printing step on each of the one or more square solar cells;

Each square solar cell is divided into two or more rectangular solar cells to form a plurality of rectangular solar cells each having a complete front surface metallization pattern and a back surface metallization pattern from the one or more square solar cells. separating;

arranging the plurality of rectangular solar cells in a line with long sides of adjacent rectangular solar cells overlapping in a shingled manner; and

Electrically connecting the rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells with one front side metallization pattern of rectangular solar cells in the pair with the other back side metallization pattern of rectangular solar cells in the pair. and electrically connecting the plurality of rectangular solar cells in series by conductively bonding to each other with an electrically conductive bonding material disposed therebetween to connect to each other.

2G. The method of clause 1G, wherein all portions of the stencil defining one or more features of a front surface metallization pattern on the one or more square solar cells lie within the plane of the stencil during stencil printing. Limited by physical connections to parts.

3G. The method of clause 1G, wherein the front surface metallization pattern on each rectangular solar cell comprises a plurality of fingers oriented orthogonal to long sides of the rectangular solar cell, wherein the fingers in the front surface metallization pattern comprise the front surface They are not physically connected to each other by the metallization pattern.

4G. The method of clause 3G, wherein the fingers have widths from about 10 microns to about 90 microns.

5G. The method of clause 3G, wherein the fingers have widths between about 10 microns and about 50 microns.

6G. The method of clause 3G, wherein the fingers have widths between about 10 microns and about 30 microns.

7G. The method of clause 3G, wherein the fingers have heights orthogonal to the front surface of the rectangular solar cell of from about 10 microns to about 50 microns.

8G. The method of clause 3G, wherein the fingers have heights orthogonal to the front surface of the rectangular solar cell of about 30 microns or more.

9G. The method of clause 3G, wherein the front surface metallization pattern on each rectangular solar cell comprises a plurality of contact pads parallel and adjacent an edge of a long side of the rectangular solar cell, each contact pad having an end of a corresponding finger. is located in

10G. The method of clause 3G, wherein the back surface metallization pattern on each rectangular solar cell comprises a plurality of contact pads arranged in a row parallel and adjacent to an edge of a long side of the rectangular solar cell, wherein the Each pair of solar cells has respective said back contact pads on one of the pair of rectangular solar cells aligned and electrically connected with corresponding fingers in a front surface metallization pattern on the other of the rectangular solar cells in the pair. is arranged with

11G. The method of clause 3G, wherein the back surface metallization pattern on each rectangular solar cell comprises a bus bar running parallel and adjacent to an edge of a long side of the rectangular solar cell, each of the adjacent and overlapping rectangular solar cells The pair is arranged with a bus bar on one of the pair of rectangular solar cells overlapping and electrically connected with fingers in the front surface metallization pattern on the other of the rectangular solar cells in the pair.

12G. In the method of the matter 3G,

the front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged parallel to and adjacent to an edge of a long side of the rectangular solar cell, each contact pad located at an end of a corresponding finger;

the back surface metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged in rows parallel and adjacent to the edge of a long side of the rectangular solar cell;

Each pair of adjacent, overlapping rectangular solar cells overlaps and is electrically connected with a contact pad in a front surface metallization pattern on the other rectangular solar cells in the pair and each said back surface on one of the pair of rectangular solar cells. arranged with contact pads.

13G. The method of clause 12G, wherein the rectangular solar cells in each pair of adjacent overlapping rectangular solar cells are formed by discrete portions of electrically conductive bonding material disposed between the overlapping front and back contact pads. conductively coupled to each other.

14G. The method of clause 3G, wherein the rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells comprise one front surface metallization pattern of the pair of rectangular solar cells and the other of the pair of rectangular solar cells. conductively coupled to each other by discrete portions of electrically conductive bonding material between the overlapping ends of the fingers in the backside metallization pattern.

15G. The method of clause 3G, wherein the rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells comprise one front surface metallization pattern of the pair of rectangular solar cells and the other of the pair of rectangular solar cells. are conductively coupled to each other by a dashed or continuous line of electrically conductive bonding material between overlapping ends of the fingers in the backside metallization pattern, wherein the dashed or continuous line of electrically conductive bonding material represents the finger electrically interconnect one or more of them.

16G. In the method of the matter 3G,

the front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged parallel to and adjacent to an edge of a long side of the rectangular solar cell, each contact pad located at an end of a corresponding finger;

The rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells are arranged in one of the front surface metallization patterns of the pair of rectangular solar cells and the rear surface metallization pattern in the other of the rectangular solar cells pair. conductively coupled to each other by discrete portions of electrically conductive bonding material disposed between the contact pads.

17G. In the method of the matter 3G,

the front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged parallel to and adjacent to an edge of a long side of the rectangular solar cell, each contact pad located at an end of a corresponding finger;

The rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells have contacts in one front side metallization pattern of the pair of rectangular solar cells and the other back side metallization pattern of the pair of rectangular solar cells. conductively coupled to each other by dashed or continuous lines of electrically conductive bonding material between pads, wherein the dashed or continuous line of electrically conductive bonding material electrically interconnects one or more of the fingers connect

18G. The method of any of clauses 1G-17G, wherein the front surface metallization pattern is formed of a silver paste.

1H. A method of manufacturing a plurality of solar cells, the method comprising:

depositing one or more front surface amorphous silicon layers on the front surface of a crystalline silicon wafer, wherein the front surface amorphous silicon layers are illuminated by light in operation of the solar cells;

depositing one or more rear surface amorphous silicon layers on a rear surface of the crystalline silicon wafer on an opposite side of the crystalline silicon wafer from the front surface;

patterning the one or more front surface amorphous silicon layers to form one or more front surface trenches in the one or more front surface amorphous silicon layers;

depositing a front surface passivation layer over the one or more front surface amorphous silicon layers and in the front surface trenches;

patterning the one or more rear surface amorphous silicon layers to form one or more rear surface trenches in the one or more rear surface amorphous silicon layers, wherein each of the one or more rear surface trenches comprises the front surface trench. formed in line with their counterparts;

depositing a backside passivation layer over the one or more backside amorphous silicon layers and within the backside trenches;

cleaving the crystalline silicon wafer in one or more cleavage planes, each cleavage plane centered or substantially centered on a different pair of corresponding front and back trenches.

2H. The method of clause 1H, comprising forming the one or more front surface trenches through the front surface amorphous silicon layers to reach the front surface of the crystalline silicon wafer.

3H. The method of clause 1H, comprising forming the one or more rear surface trenches through the one or more rear surface amorphous silicon layers to reach the rear surface of the crystalline silicon wafer.

4H. The method of clause 1H, comprising forming said front side passivation layer and said back side passivation layer from a transparent conductive oxide.

5H. The method of clause 1H, comprising using a laser to induce thermal stress in the crystalline silicon wafer to cut the crystalline silicon wafer in the one or more cutting planes.

6H. The method of clause 1H, comprising mechanically cutting the crystalline silicon wafer in the one or more cutting planes.

7H. The method of clause 1H, wherein said one or more front surface amorphous crystalline silicon layers form an n-p junction with said crystalline silicon wafer.

8H. The method of clause 7H, comprising cutting the crystalline silicon wafer from its backside.

9H. The method of clause 1H, wherein said one or more back surface amorphous crystalline silicon layers form an n-p junction with said crystalline silicon wafer.

10H. The method of clause 9H, comprising cutting the crystalline silicon wafer from its front side.

11H. A method of manufacturing a plurality of solar cells, the method comprising:

forming one or more trenches in a first surface of a crystalline silicon wafer;

depositing one or more amorphous silicon layers on the first surface of the crystalline silicon wafer;

depositing a passivation layer in the trenches and on one or more amorphous silicon layers on the first surface of the crystalline silicon wafer;

depositing one or more amorphous silicon layers on a second surface of the crystalline silicon wafer on an opposite edge of the crystalline silicon wafer from the first surface; and

cleaving the crystalline silicon wafer in one or more cleavage planes, each cleavage plane centered or substantially centered in the other of the one or more trenches.

12H. The method of clause 11H, comprising forming said passivation layer from a transparent conductive material.

13H. The method of clause 11H, comprising using a laser to induce thermal stress in the crystalline silicon wafer to cut the crystalline silicon wafer in the one or more cutting planes.

14H. The method of clause 11H, comprising mechanically cutting the crystalline silicon wafer in the one or more cutting planes.

15H. The method of clause 11H, wherein the one or more first surface amorphous crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

16H. The method of clause 11H, wherein the one or more second surface amorphous crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

17H. The method of clause 11H, wherein the first surface of the crystalline silicon wafer is illuminated by light in operation of the solar cells.

18H. The method of clause 11H, wherein the second surface of the crystalline silicon wafer is illuminated by light in operation of the solar cells.

19H. Solar panel (solar panel),

comprising a plurality of super cells, each super cell having a plurality of solar cells arranged in line with the requirements of adjacent solar cells overlapping and conductively coupled to each other in a shingled manner to electrically connect the solar cells in series and;

Each solar cell comprises a crystalline silicon base, one or more first surface amorphous silicon layers disposed on a first surface of the crystalline silicon base to form an np junction, a layer of the crystalline silicon base from the first surface. one or more second surface amorphous silicon layers disposed on a second surface of the crystalline silicon base on an opposite side, and edges of the first surface amorphous silicon layers, edges of the second surface amorphous silicon layers , or passivation layers for preventing charge recombination at edges of the first surface amorphous silicon layers and edges of the second surface amorphous silicon layers.

20H. The solar cell panel of clause 19H, wherein said passivation layers comprise a transparent conductive oxide.

21H. The solar panel of clause 19H, wherein the super cells are arranged in a single row, or in two or more parallel rows, to form a front side of the solar panel that is illuminated by solar radiation during operation of the solar panel.

Z1. solar modules,

A number N greater than or equal to about 250 rectangular or substantially rectangular silicon solar cells arranged as a plurality of series-connected super cells in two or more parallel rows, wherein each super cell is a silicon solar cell within the super cell. a plurality of silicon solar cells arranged in line with long sides of adjacent silicon solar cells overlapping to electrically connect them in series and conductively bonded directly to each other with an electrically and thermally conductive adhesive;

one or more bypass diodes;

Each pair of adjacent parallel rows in the solar module is conductively coupled to a backside electrical contact on a centrally located solar cell in one row of the pair, and is conductively coupled to a back surface electrical contact on an adjacent solar cell in the other row of the pair. Electrically connected by a bypass diode conductively coupled to the backside electrical contact.

Z2. The solar module of clause Z1, wherein each pair of adjacent parallel rows is conductively coupled to a backside electrical contact on the solar cells in the other row of the pair, wherein the electrically connected by at least one other bypass diode conductively coupled to the backside electrical contact.

Z3. The solar module of clause Z2, wherein each pair of adjacent parallel rows is conductively coupled to a backside electrical contact on a solar cell in the other row of the pair, wherein the electrically connected by at least one other bypass diode conductively coupled to the backside electrical contact.

Z4. The solar module of clause Z1, wherein the electrically and thermally conductive adhesive has a thickness orthogonal to the solar cells less than or equal to about 50 microns between adjacent solar cells and less than about 1.5 W/(meter-K). Form bonds with thermal conductivity orthogonal to the solar cells greater than or equal to.

Z5. The solar module of clause Z1, wherein the super cells are encapsulated in a thermoplastic olefin layer between front and back glass sheets.

Z6. The solar module of clause Z1, wherein the conductive bonds between the overlapping solar cells are in a direction parallel to the rows for a temperature range of about -40°C to about 100°C without damaging the solar module to the super cells. provide mechanical compliance to accommodate the mismatch in thermal expansion between the super cells and the glass front sheet.

Z7. The solar module of any of clauses Z1-Z6, wherein N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, or about 500 greater than or equal to, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, greater than or equal to about 700.

Z8. The solar module of any of clauses Z1-Z7, wherein the super cells are greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or greater than about 300 volts. electrically to provide a high direct current voltage greater than or equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts. connected

Z9. solar energy system,

Part Z1 solar module; and

and an inverter electrically coupled to the solar module and configured to convert a DC output from the solar module to provide an AC output.

Z10. The solar energy system of clause Z9, wherein said inverter lacks a DC to DC boost component.

Z11. The solar energy system of clause Z9, wherein the inverter is configured to operate the solar module at a direct current voltage above a minimum voltage set to avoid reverse biasing the solar cell.

Z12. The solar energy system of clause Z11, wherein said minimum voltage value is temperature dependent.

Z13. The solar energy system of clause Z9, wherein the inverter is configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.

Z14. The solar energy system of clause Z13, wherein the inverter is configured to operate the solar module in a maximal region of a voltage-current output curve of the solar module to avoid the reverse bias condition.

Z15. The solar energy system of any of clauses Z9-Z14, wherein said inverter is a microinverter integrated with said solar module.

The invention disclosed herein is illustrative and not restrictive. Other modifications will be apparent to those skilled in the art in view of the present invention and are intended to be included within the scope of the appended claims.

Claims (20)

In the solar module,
a plurality of super cells arranged in physically parallel rows, each super cell arranged with opposite edges of adjacent and overlapping cleavable silicon solar cells, each super cell being cleavable a plurality of cleavable crystalline silicon solar cells conductively coupled to each other to electrically connect the crystalline silicon solar cells in series;
a bus electrical conductor running along a centerline of the solar module within a gap between adjacent first and second super cells of the plurality of super cells;
a bypass diode coupled to the bus electrical conductor;
one or more interconnects connecting in parallel the two super cells of the plurality of super cells at an intermediate position along the two super cells, the one or more interconnects comprising the two super cells electrically connecting one intermediate solar cell to the other adjacent intermediate solar cell of the two super cells,
wherein the bus electrical conductor runs along the centerline in plane with the first and second super cells and is connected to the bypass diode in the region between the first and second super cells. The solar module of claim 1, wherein the super cells are electrically connected in parallel. 2. The method of claim 1, further comprising one or more second interconnects connecting a third super cell of the plurality of super cells in parallel to the two super cells at the intermediate position along the two super cells; and said one or more second interconnects electrically connect an intermediate solar cell of said third super cell to said one intermediate solar cell of said two super cells. 2. The photovoltaic system of claim 1, wherein the two super cells are the first and second super cells, and wherein the one or more interconnects span a gap between the adjacent first and second super cells. module. 4. The solar module of claim 3, wherein said one or more interconnects run orthogonal to said bus electrical conductor. The solar module of claim 1 , wherein the bypass diode is disposed in-plane with the first and second super cells in a gap between the first and second super cells. 2. The method of claim 1, further comprising: an additional bypass diode coupled to the bus electrical conductor in the region between the first and second super cells, the bypass diode and the additional bypass diode each of the other sections. and is arranged to bypass said other sections of each said first super cell and said second super cell when one is in a reverse bias state. The solar module of claim 7 , wherein the bypass diode and the further bypass diode are disposed in-plane with the first and second super cells in a gap between the first and second super cells. . The solar module of claim 1 , wherein the bypass diode is disposed along a peripheral edge of the solar module. The solar module of claim 1 , wherein the first and second super cells are disposed in adjacent parallel rows of the plurality of super cells. 11. The method of claim 10,
the solar module is rectangular with two parallel short sides and two parallel long sides;
A photovoltaic module, characterized in that the center line of the photovoltaic module runs parallel to the long sides of the photovoltaic module. The solar module of claim 10 , wherein each row contains only a single super cell running the length of the long sides of the solar module. The method of claim 1 , wherein the first and second super cells are located in the same row of the plurality of super cells, and the gap running along a centerline of the solar module includes the adjacent first and second super cells. A solar module, characterized in that it crosses the heat. 14. The method of claim 13,
the solar module is rectangular with two parallel short sides and two parallel long sides;
A photovoltaic module, characterized in that the center line of the photovoltaic module runs parallel to the short sides of the photovoltaic module. In the solar module,
a plurality of super cells arranged in two or more physically parallel rows, each super cell arranged with opposing edges of adjacent and overlapping cleavable silicon solar cells, each super cell a plurality of cleavable crystalline silicon solar cells conductively coupled to each other to electrically connect the cleavable crystalline silicon solar cells of the cell in series;
a bus electrical conductor running along a centerline of the solar module within a gap between adjacent first and second super cells of the plurality of super cells, the bus electrical conductor comprising the first and second super cells and runs along the centerline in a plane;
connecting means for connecting the bus electrical conductor to a bypass diode;
one or more interconnects connecting in parallel the first and second super cells of the plurality of super cells at an intermediate location along the two super cells;
and said one or more interconnects electrically connect an intermediate solar cell of one of said two super cells to an adjacent intermediate solar cell of another of said two super cells. In the solar module,
comprising a plurality of super cells arranged in physically parallel rows, each super cell arranged with opposite edges of adjacent and overlapping cleavable silicon solar cells, each super cell being cleavable a plurality of cleavable crystalline silicon solar cells conductively coupled to each other to electrically connect the crystalline silicon solar cells in series;
one or more interconnects connecting the plurality of super cells at an intermediate location along the plurality of super cells, wherein the one or more interconnects are in one or more column gaps between adjacent columns of the super cells. draped over;
a bus electrical conductor running along a centerline of the solar module between two adjacent rows of super cells to be coupled to a bypass diode and within an in-plane centerline gap, wherein the centerline gap is along the centerline of the module; Solar module, characterized in that in progress. 17. The super cell of claim 16, wherein the bus electrical conductor occupies a portion of the front surface of the solar module, whereby the centerline gap between two adjacent rows of the super cells is required and in addition to the centerline gap A solar module, characterized in that the rows of the solar modules are arranged in close proximity to each other with small or gaps between them or with no additional gaps. 18. The method of claim 17, wherein said bus electrical conductor comprises a plurality of conductor segments to couple a plurality of bypass diodes, each said bypass diode comprising a respective said super A solar module, characterized in that it is arranged to bypass said other section of cells. 19. The method of claim 18, wherein each of the super cells has a first bypass section and a second bypass section, and wherein the first and second bypass sections of a first of the super cells comprise a second of the super cells. adjacent each of the first and second bypass sections of a solar module of claim 1 . The solar module of claim 1, wherein said one or more interconnects electrically connect hidden tap contact pads on back surfaces of said adjacent intermediate solar cells of said two super cells.

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