JP2023171674A - Wood shingle solar cell module - Google Patents

Abstract

To provide highly efficient placement of a solar cell within a solar cell module and a method of making such a solar module.SOLUTION: A solar cell module includes solar cells 10 that conduct and join each other in a wood shingle shape to form a supercell. The configuration can be arranged to efficiently use the area of a solar module, reduce series resistance, and increase the module efficiency. The solar cell 10 may have a narrow rectangular geometry and may be advantageously employed in a wood shingle (overlapping) arrangement to form a supercell.SELECTED DRAWING: Figure 1

Description

[Cross reference to related applications]
This international patent application is based on US patent application Ser. The title of the invention is "Shingled Solar Cell Module" and the filing date is November 4, 2014), and U.S. patent application Ser. U.S. Patent Application No. 14/539,546 (titled "Shingled Solar Cell Module", filed November 12, 2014), U.S. Patent Application No. 14/543,580 (invention No. 14/548,081 (named "Shingled Solar Cell Module", filed date November 17, 2014), U.S. Patent Application No. 14/548,081 (named "Shingled Solar Cell Module", filed date November 17, 2014) 19th), U.S. Patent Application No. 14/550,676 (title of the invention “Shingled Solar Cell Module”, filing date November 21, 2014), U.S. Patent Application No. 14/552,761 (invention U.S. patent application Ser. U.S. Patent Application No. 14/566,278 (titled "Shingled Solar Cell Module", filed December 10, 2014), U.S. Patent Application No. 14/565,820 (titled is “Shingled Solar Cell Module,” filed on December 10, 2014), and U.S. patent application Ser. ), U.S. Patent Application No. 14/577,593 (titled "Shingled Solar Cell Module", filed December 19, 2014), U.S. Patent Application No. 14/586,025 (titled "Shingled Solar Cell Module", filed December 19, 2014), "Shingled Solar Cell Module," filed on December 30, 2014), U.S. Patent Application No. 14/585,917 (Title of invention: "Shingled Solar Cell Module," filed on December 30, 2014) , U.S. Patent Application No. 14/594,439 (titled "Shingled Solar Cell Module", filed January 12, 2015); "Shingled Solar Cell Module", filed on January 26, 2015), U.S. Provisional Patent Application No. 62/003,223 (title of the invention "Shingled Solar Cell Module", filed on May 27, 2014) , U.S. Provisional Patent Application No. 62/036,215 (title of the invention "Shingled Solar Cell Module", filing date August 12, 2014), U.S. Provisional Patent Application No. 62/042,615 (title of the invention is “Shingled Solar Cell Module,” filed on August 27, 2014), and U.S. Provisional Patent Application No. 62/048,858 (Title of the invention is “Shingled Solar Cell Module,” filed on September 11, 2014). (Japan), U.S. Provisional Patent Application No. 62/064,260 (title of the invention “Shingled Solar Cell Module”, filing date October 15, 2014), U.S. Provisional Patent Application No. 62/064,834 (Invention No. 14/674,983 (title of the invention is "Shingled Solar Cell Panel Employing Hidden Taps", filing date is October 16, 2014), 2015 (March 31, 2014), U.S. Provisional Patent Application No. 62/081,200 (titled "Solar Cell Panel Employing Hidden Taps," filed November 18, 2014), U.S. Provisional Patent Application No. No. 113,250 (title of the invention is "Shingled Solar Cell Panel Employing Hidden Taps", filing date is February 6, 2015), U.S. Provisional Patent Application No. 62/082,904 (title of the invention is "High Voltage Solar "High Voltage Solar Panel", filed on November 21, 2014), U.S. Provisional Patent Application No. 62/103,816 (titled "High Voltage Solar Panel", filed on January 15, 2015), Patent Application No. 62/111,757 (title of the invention is “High Voltage Solar Panel”, filing date is February 4, 2015), U.S. Provisional Patent Application No. 62/134,176 (title of the invention is “Solar Cell Cleaving Tools and Methods”, filed March 17, 2015), U.S. Provisional Patent Application No. 62/150,426 (titled “Shingled Solar Cell Panel Composing Stencil-Print”) d Cell Metallization”, the filing date is (April 21, 2015), U.S. Provisional Patent Application No. 62/035,624 (titled "Solar Cells with Reduced Edge Carrier Recombination," filed August 11, 2014), U.S. Design Application No. 29 /506,415 (filed October 15, 2014), U.S. Design Application No. 29/506,755 (filed October 20, 2014), and U.S. Design Application No. 29/508,323 (filed October 20, 2014). U.S. Design Application No. 29/509,586 (filed November 19, 2014), and U.S. Design Application No. 29/509,588 (filed November 19, 2014) November 19th). Each of the patent applications in the above list is incorporated herein by reference in its entirety for all purposes.

The present invention generally relates to a solar cell module in which solar cells are arranged in a shingled manner.

Alternative energy sources are needed to meet the ever-increasing global energy demand. Solar energy sources are sufficient in many geographic areas to meet such demands, in part by providing solar (eg, photovoltaic) battery-generated electricity.

Highly efficient placement of solar cells within solar modules and methods of making such solar modules are disclosed herein.

In one embodiment, a solar module includes a series-connected string of N (≧25) rectangular or nearly rectangular solar cells having an average breakdown voltage greater than about 10 volts. The plurality of solar cells described above are grouped to form one or more supercells, and each supercell is in a state in which the long sides of adjacent solar cells overlap and are conductively bonded to each other by an electrically and thermally conductive adhesive. having two or more of the solar cells arranged side by side. No single solar cell or group of fewer than N solar cells in the string of solar cells is individually electrically connected in parallel with the bypass diode. Safe and reliable operation of solar modules effectively prevents or reduces the formation of hot spots in reverse-biased solar cells along the supercell through the joining overlap of adjacent solar cells. This is facilitated by good heat conduction. The supercell may, for example, be encapsulated within a thermoplastic olefin polymer sandwiched between a glass front sheet and a back sheet, which further increases the robustness of the module with respect to thermal damage. In some variations, N≧30, ≧50, or ≧100.

In other aspects, the supercell is rectangular or substantially rectangular having a shape defined by oppositely positioned parallel first and second long sides and two oppositely positioned short sides. It includes a plurality of silicon solar cells each having a front (solar side) and a back surface. Each solar cell has an electrically conductive front metallization pattern including at least one front contact pad positioned adjacent the first long side and at least one rear side metallization pattern positioned adjacent the second long side. and an electrically conductive backside metallization pattern including contact pads. The plurality of silicon solar cells are arranged such that the first long side and the second long side of the adjacent silicon solar cells overlap each other, and the contact pads on the front and rear surfaces of the adjacent silicon solar cells overlap each other to conduct conduction. The adjacent silicon solar cells are electrically connected in series and arranged side by side by being conductively bonded to each other using an adhesive bonding agent. The front surface metallization pattern of each silicon solar cell substantially transfers the conductive adhesive adhesive to the at least one front contact pad prior to curing of the conductive adhesive adhesive during fabrication of the supercell. Includes a barrier configured to contain.

In other aspects, the supercell is rectangular or substantially rectangular having a shape defined by oppositely positioned parallel first and second long sides and two oppositely positioned short sides. It includes a plurality of silicon solar cells each including a front (solar side) and a back side. Each solar cell has an electrically conductive front metallization pattern including at least one front contact pad positioned adjacent the first long side and at least one rear side metallization pattern positioned adjacent the second long side. and an electrically conductive backside metallization pattern including contact pads. The plurality of silicon solar cells are arranged such that the first long side and the second long side of the adjacent silicon solar cells overlap each other, and the contact pads on the front and rear surfaces of the adjacent silicon solar cells overlap each other to conduct conduction. The adjacent silicon solar cells are electrically connected in series and arranged side by side by being conductively bonded to each other using an adhesive bonding agent. The backside metallization pattern of each silicon solar cell substantially transfers the conductive adhesive adhesive to the at least one backside contact pad prior to curing of the conductive adhesive adhesive during fabrication of the supercell. Includes a barrier configured to contain.

In another aspect, a method of making a solar cell string comprises: aligning one or more pseudo-square silicon wafers along a plurality of lines parallel to a long edge of each pseudo-square silicon wafer; dicing to form a plurality of rectangular silicon solar cells each having substantially the same length along a longitudinal axis. The method also includes arranging the plurality of rectangular silicon solar cells side by side with the long sides of adjacent solar cells overlapping and conductively bonded to each other, electrically connecting the adjacent solar cells in series. The plurality of rectangular silicon solar cells include at least one rectangular solar cell including two chamfered corners corresponding to a plurality of corners or a part of a plurality of corners of the pseudo square wafer; and one or more rectangular silicon solar cells. The spacing between the parallel lines along which the dicing of the pseudo-square wafer is carried out is the width perpendicular to the long axis of the rectangular silicon solar cell, including the chamfered corners, but not having the chamfered corners. selected to compensate for the chamfered corners by being larger than the width perpendicular to the long axis of the plurality of rectangular silicon solar cells, thereby making each of the plurality of rectangular silicon solar cells in the solar cell string , having a front surface whose area exposed to light during operation of the solar cell string is substantially the same.

In another embodiment, a supercell includes a plurality of silicon solar cells arranged side by side with the ends of the adjacent solar cells overlapping and conductively bonded to each other, electrically connecting the adjacent solar cells in series. include. At least one of the plurality of silicon solar cells has a chamfered corner corresponding to the plurality of corners or a part of the plurality of corners of the pseudo square silicon wafer to be diced, and at least one of the plurality of silicon solar cells having a front surface having substantially the same area exposed to light during operation of the solar cell string, at least one of which does not have chamfered corners; have

In other embodiments, a method of making two or more supercells includes forming one or more supercells of one or more pseudo-square silicon wafers along a plurality of lines parallel to a long edge of each pseudo-square silicon wafer. A first plurality of rectangular silicon solar cells that are obtained by dicing a pseudo-square silicon wafer and include chamfered corners corresponding to corners or portions of the corners of the one or more pseudo-square silicon wafers; and a second plurality of rectangular silicon solar cells each having a first length extending across the width of the one or more pseudo-square silicon wafers and having no chamfered corners. . The method includes removing the chamfered corners from each of the first plurality of rectangular silicon solar cells, each having a second length shorter than the first length and having chamfered corners. and forming a third plurality of rectangular silicon solar cells that do not include the solar cells. The method is
The second plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other so that the second plurality of rectangular silicon solar cells are electrically connected in series. forming a solar cell string having a width equal to the first length;
The third plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other to electrically connect the third plurality of rectangular silicon solar cells in series. and forming a solar cell string having a width equal to the second length.

In other aspects,
A method of creating two or more supercells, the method comprising:
The one or more pseudo-square silicon wafers are diced along a plurality of lines parallel to the long edges of each of the one or more pseudo-square silicon wafers to obtain the one or more pseudo-square silicon wafers. a first plurality of rectangular silicon solar cells having chamfered corners corresponding to the plurality of corners or a portion of the plurality of corners; and a second plurality of rectangular silicon solar cells having no chamfered corners. a step of forming;
The first plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other to electrically connect the first plurality of rectangular silicon solar cells in series. process and
The second plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other to electrically connect the second plurality of rectangular silicon solar cells in series. Including process and.

In other embodiments, the supercell is
a plurality of silicon solar cells arranged in a line in a first direction with end portions of adjacent silicon solar cells overlapping and conductively bonded to each other to electrically connect the adjacent silicon solar cells in series;
comprising an elongated flexible electrical interconnect;
a long axis of the elongate flexible electrical interconnect is oriented parallel to a second direction perpendicular to the first direction;
The elongated flexible electrical interconnect described above is
conductively bonded to the front or rear surface of an edge silicon solar cell among the plurality of silicon solar cells at a plurality of discontinuous positions arranged along the second direction;
extending in the second direction over at least the entire width of the solar cell at the end;
a conductor thickness measured perpendicular to the front or back surface of the silicon solar cell at the end is less than or equal to about 100 microns;
providing a resistance to current flow in the second direction of less than or equal to about 0.012 ohms;
and configured to provide flexibility to accommodate differential expansion in the second direction between the end silicon solar cell and the interconnect in a temperature range of about −40° C. to about 85° C. ing.

The flexible electrical interconnect may, for example, have a conductor thickness of less than or equal to about 30 microns, measured perpendicular to the front and back surfaces of the edge silicon solar cell. . The flexible electrical interconnect extends beyond the supercell in the second direction to provide electrical connection to at least a second supercell positioned parallel to and adjacent to the supercell within the solar module. may provide interconnection. Additionally or alternatively, the flexible electrical interconnect extends beyond the supercell in the first direction to provide a second flexible electrical interconnect positioned parallel to and alongside the supercell within the solar module. It may provide electrical interconnection to the supercell.

In other embodiments, a solar module includes a plurality of supercells arranged in two or more parallel rows extending across the width of the solar module to form a front surface of the solar module. Each supercell includes a plurality of silicon solar cells arranged side by side with the ends of the adjacent silicon solar cells overlapping and conductively bonded to each other, electrically connecting the adjacent silicon solar cells in series. At least the edge of the first supercell adjacent to the edge of the solar module in the first row is
bonded to the front surface of the first supercell with an electrically conductive adhesive bonding agent at a plurality of discrete locations;
extending parallel to the edge of the solar module;
at least a portion is folded around the edge of the first supercell and is hidden from view from the front of the solar module;
Via a flexible electrical interconnect,
An electrical connection is made to an edge of a second supercell adjacent to the same edge of the solar module in a second row.

In other embodiments, a method of making a supercell comprises:
laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the one or more silicon solar cells;
applying an electrically conductive adhesive adhesive to the scribed silicon solar cell(s) at one or more locations adjacent to the long sides of each rectangular region;
The one or more silicon solar cells are separated along the one or more scribe lines to form a plurality of rectangles each including a portion of the electrically conductive adhesive bonding agent disposed on the front surface adjacent to the long side. A process for providing a silicon solar cell;
arranging the plurality of rectangular silicon solar cells side by side with the long sides of adjacent rectangular silicon solar cells overlapping each other in a shingled pattern with a portion of the electrically conductive adhesive bonding agent interposed therebetween;
curing the electrically conductive bonding agent, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and electrically connecting them in series.

In other embodiments, a method of making a supercell comprises:
laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the one or more silicon solar cells;
applying an electrically conductive adhesive bonding agent to a portion of the top surface of the one or more silicon solar cells;
drawing a vacuum between the bottom surface of the one or more silicon solar cells and a curved support surface to bend the one or more silicon solar cells toward the curved support surface, thereby bending the one or more silicon solar cells toward the curved support surface; cleaving the one or more silicon solar cells along the scribe line to provide a plurality of rectangular silicon solar cells each including a portion of the electrically conductive adhesive bonding agent disposed on the front side adjacent the long side; The process of
arranging the plurality of rectangular silicon solar cells side by side with the long sides of adjacent rectangular silicon solar cells overlapping each other in a shingled pattern with a portion of the electrically conductive adhesive bonding agent interposed therebetween;
curing the electrically conductive bonding agent, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and electrically connecting them in series.

In another aspect, a method of making a solar module includes a plurality of rectangular silicon solar cells arranged side by side with ends on the long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner. The method includes a step of assembling a plurality of supercells, each of which has a plurality of supercells. The method also includes heating and pressurizing the plurality of supercells to cure an electrically conductive bonding agent disposed between the overlapping ends of adjacent rectangular silicon solar cells, thereby forming adjacent overlapping supercells. It involves bonding rectangular silicon solar cells together and electrically connecting them in series. The method also
arranging and interconnecting the plurality of supercells in a desired solar module configuration within a layer stack including an encapsulant;
heating and pressurizing the layer stack to form a laminate structure.

Some variations of the method include heating and pressurizing the plurality of supercells to form the electrically conductive binder prior to heating and pressurizing the layer stack to form the laminate structure. curing or partially curing, thereby forming a cured or partially cured supercell as an intermediate product prior to formation of the laminate structure. In some variations, as each additional rectangular silicon solar cell is added to the supercell during supercell assembly, the newly added solar cell and its adjacent overlapping solar cell The electrically conductive adhesive bond between the cells is cured or partially cured before any other rectangular silicon solar cells are added to the supercell. Alternatively, some variations include curing or partially curing all of the electrically conductive binders in the supercell in the same step.

If the supercell is formed as a partially cured intermediate product, the method includes heating and pressurizing the layer stack while completing the curing of the electrically conductive binder to form the laminate structure. may include.

Some variations of the method include applying the electrically conductive bond while heating and pressurizing the layer stack without forming a cured or partially cured supercell as an intermediate product prior to forming the laminate structure. The method includes a step of curing the agent to form a laminated structure.

The method may include dicing one or more standard size silicon solar cells into a plurality of rectangular areas of smaller area to provide the plurality of rectangular silicon solar cells. The electrically conductive adhesive bonding agent is applied to the one or more silicon solar cells prior to dicing the one or more silicon solar cells to have a pre-applied electrically conductive adhesive bonding agent. A plurality of rectangular silicon solar cells may be provided. Alternatively, the electrically conductive adhesive adhesive may be applied to the rectangular silicon solar cell after dicing the one or more silicon solar cells to provide the rectangular silicon solar cell.

In one aspect, a solar module includes a plurality of supercells arranged in two or more parallel rows. Each supercell consists of a plurality of rectangular or nearly rectangular silicon cells arranged side by side with the long sides of the adjacent silicon solar cells overlapping and directly conductively bonded to each other to electrically connect the adjacent silicon solar cells in series. Including solar cells. Solar panels also
a first hidden tap contact pad located on a rear surface of a first solar cell located at an intermediate position along a first supercell of the plurality of supercells;
a first electrical interconnect conductively bonding to the first hidden tap contact pad. The first electrical interconnect includes stress relief features that accommodate differential thermal expansion between the interconnect and the silicon solar cell to which it joins. The term "stress relief features" as used herein with respect to an interconnect includes, for example, geometric features such as kinks, loops, or slots, the thickness of the interconnect (e.g., very thin), and and/or may refer to the ductility of the interconnect. For example, a stress relief feature may be that the interconnect is formed from a very thin copper ribbon.

The solar module is
a second hidden tap contact pad located on a rear surface of a second solar cell located adjacent to the first solar cell at an intermediate location along a second of the plurality of supercells in an adjacent supercell row; may include,
The first hidden tap contact pad may be electrically connected to the second hidden tap contact pad through the first electrical interconnect. In such a case, the first electrical interconnect may extend across a gap between the first supercell and the second supercell and conductively bond to the second hidden tap contact pad. Alternatively, the electrical connection between the first hidden tap contact pad and the second hidden tap contact pad is a conductive bond to the second hidden tap contact pad and an electrical connection (e.g., a conductive bond) to the first electrical interconnect. may include other electrical interconnections. Either interconnection scheme may optionally extend across additional supercell rows. For example, either interconnection scheme may optionally extend across the entire width of the module to interconnect each row of solar cells via hidden tap contact pads.

solar module is
a second hidden tap contact pad located on the rear surface of a second solar cell located at another intermediate location along the first supercell of the plurality of supercells;
a second electrical interconnect conductively bonded to the second hidden tap contact pad;
a bypass diode electrically connected by the first electrical interconnect and the second electrical interconnect in parallel with the solar cell located between the first hidden tap contact pad and the second hidden tap contact pad; may be included.

In any of the above variations, the first hidden tap contact pad comprises a plurality of hidden tap contacts arranged on the rear surface of the first solar cell in a row extending parallel to the long axis of the first solar cell. can be one of the pads;
The first electrical interconnect is conductively bonded to each of the plurality of hidden contacts and extends substantially the length of the first solar cell along the longitudinal axis. Additionally or alternatively, the first hidden contact pad is one of a plurality of hidden tap contact pads disposed on the rear surface of the first solar cell in a row extending perpendicular to the long axis of the first solar cell. obtain. In the latter case, the row of hidden tap contact pads may be located adjacent to the short edge of the first solar cell, for example. The first hidden contact pad may be one of a plurality of hidden tap contact pads arranged in a two-dimensional array on the back side of the first solar cell.

Alternatively, in any of the above variations, the first hidden tap contact pad may be located adjacent to a short side of the rear surface of the first solar cell;
the first electrical interconnect does not extend substantially inwardly from the hidden tap contact pad along the longitudinal axis of the solar cell;
The interconnection wherein the back metallization pattern on the first solar cell preferably has a sheet resistance of less than or equal to about 5 ohms/square, or less than or equal to about 2.5 ohms/square. provide a conductive path to In such a case, the first interconnect may include, for example, two tabs located on opposite sides of the stress relief feature;
One of the two tabs may be conductively bonded to the first hidden tap contact pad. The two tabs may be of different lengths.

In any of the above variations, the first electrical interconnect specifies a desired alignment with the first hidden tap contact pad or a desired alignment with an edge of the first supercell. or specifying a desired alignment with the first hidden tap contact pad and an edge of the first supercell.

In other embodiments, the solar module includes a front sheet of glass, a back sheet, and a plurality of supercells arranged in two or more parallel rows between the front sheet of glass and the back sheet. including. Each supercell consists of a plurality of rectangular or approximately rectangular cells arranged side by side with the long sides of the adjacent silicon solar cells overlapping and flexibly directly conductive bonded to each other to electrically connect the adjacent silicon solar cells in series. It has a rectangular silicon solar cell. A first flexible electrical interconnect provides a rigid conductive bond to a first supercell of the plurality of supercells. The plurality of flexible conductive junctions between overlapping solar cells can conduct the plurality of supercells in a direction parallel to the plurality of rows in a temperature range of about -40°C to about 100°C without damaging the solar module. and the glass front sheet provide mechanical compliance to the plurality of supercells to accommodate thermal expansion mismatch between the supercells and the glass front sheet. The strong conductive bond between the first supercell and the first flexible electrical interconnect allows the first flexible electrical interconnect to operate in a temperature range of about -40° C. to about 180° C. without damaging the solar module. A connection is adapted to accommodate thermal expansion mismatch between the first supercell and the first flexible electrical interconnect in a direction perpendicular to the plurality of rows.

The plurality of conductive joints between overlapping adjacent solar cells within a supercell may utilize a different conductive adhesive than the plurality of conductive joints between the supercell and the flexible electrical interconnect. The conductive bond on one side of at least one solar cell in a supercell may utilize a different conductive adhesive than the conductive bond on the other side. For example, the conductive adhesive that forms a strong bond between the supercell and the flexible electrical interconnect can be a solder. In some variations, the conductive joints between overlapping solar cells within the supercell are formed with a non-solder conductive adhesive, and the conductive joints between the supercell and the flexible electrical interconnect are formed with solder. is formed.

In some variations that utilize two different conductive adhesives as just described, both conductive adhesives are treated in the same processing step (e.g., at the same temperature, at the same pressure, and/or for the same amount of time). within the interval).

The plurality of conductive junctions between overlapping and adjacent solar cells may accommodate, for example, differential motion greater than or equal to about 15 microns between each cell and the glass front sheet.

The plurality of conductive junctions between overlapping and adjacent solar cells are, for example, less than or equal to about 50 microns thick in a direction perpendicular to the adjacent solar cells; The thermal conductivity in a direction perpendicular to the cell can be greater than or equal to about 1.5 W/(meter-K).

The first flexible electrical interconnect can, for example, withstand thermal expansion or contraction of the first flexible interconnect greater than or equal to about 40 microns.

The portion of the first flexible electrical interconnect that is conductively bonded to the supercell is ribbon-shaped, for example formed from copper, and has a thickness in a direction perpendicular to the surface of the solar cell to which it is bonded, for example. It may be less than or equal to 30 microns, or less than or equal to about 50 microns. The first flexible electrical interconnect has an integral conductive copper portion that is not bonded to the solar cell and provides higher conductivity than the portion of the first flexible electrical interconnect that is conductively bonded to the solar cell. It is possible. The first flexible electrical interconnect has a thickness of less than or equal to about 30 microns in a direction perpendicular to the surface of the solar cell to which it is joined, or less than or equal to about 50 microns. , the width in the plane of the surface of the solar cell in a direction perpendicular to the flow of current through the interconnect may be greater than or equal to about 10 mm. The first flexible electrical interconnect may be conductively bonded to a conductor proximate the solar cell that provides higher conductivity than the first electrical interconnect.

In other embodiments, a solar module includes a plurality of supercells arranged in two or more parallel rows. Each supercell consists of a plurality of rectangular or nearly rectangular silicon cells arranged side by side with the long sides of the adjacent silicon solar cells overlapping and directly conductively bonded to each other to electrically connect the adjacent silicon solar cells in series. Including solar cells. a hidden tap contact pad that does not conduct substantial current in normal operation at an intermediate location along the first supercell of the plurality of supercells in the first row of the two or more parallel rows of supercells; It is located on the rear surface of the first solar cell located at. The hidden tap contact pad electrically connects in parallel to at least a second solar cell in a second row of the two or more parallel rows of supercells.

The solar module may include an electrical interconnect that joins the hidden tap contact pad and electrically interconnects the hidden tap contact pad to the second solar cell. In some variations, the electrical interconnect does not substantially extend the length of the first solar cell;
A backside metallization pattern on the first solar cell provides a conductive path to the hidden tap contact pads having a sheet resistance less than or equal to about 5 ohms/square.

the plurality of supercells may be arranged in three or more parallel rows extending across the width of the solar module perpendicular to the plurality of rows;
The hidden tap contact pads electrically connect to hidden contact pads on at least one solar cell in each row of the three or more parallel rows of supercells to All parallel rows are electrically connected in parallel. In such variations, the solar module includes at least one connecting bypass diode or other electronic device to at least one of the hidden tap contact pads or to an interconnect between the hidden tap contact pads. May include bus connections.

The solar module may include a flexible electrical interconnect conductively bonded to the hidden tap contact pad to electrically connect it to the second solar cell. The portion of the flexible electrical interconnect that is conductively bonded to the hidden tap contact pad is ribbon-shaped, for example made of copper, and has a thickness of approximately May be less than or equal to 50 microns. The conductive bond between the hidden tap contact pad and the flexible electrical interconnect allows the flexible electrical interconnect to operate at temperatures ranging from about -40°C to about 180°C without damaging the solar module. , to withstand thermal expansion mismatch between the first solar cell and the flexible interconnect and to accommodate relative motion between the first solar cell and the second solar cell resulting from thermal expansion; obtain.

In some variations, in operation of the solar module, the first hidden contact pad may conduct a current that is greater than the current produced by any one of the plurality of solar cells.

Typically, the front surface of the first solar cell overlying the first hidden tap contact pad is not occupied by contact pads or any other interconnect features. Typically, any area of the front surface of the first solar cell that is not overlapped by a portion of an adjacent solar cell in the first supercell is occupied by contact pads or any other interconnect feature. do not have.

In some variations, within each supercell, most of the plurality of cells do not have hidden tap contact pads. In such variations, the cells with hidden tap contact pads may have a larger light collection area than the cells without hidden tap contact pads.

In other embodiments, the solar module includes a front sheet of glass, a back sheet, and a plurality of supercells arranged in two or more parallel rows between the front sheet of glass and the back sheet. including. Each supercell consists of a plurality of rectangular or approximately rectangular cells arranged side by side with the long sides of the adjacent silicon solar cells overlapping and flexibly directly conductive bonded to each other to electrically connect the adjacent silicon solar cells in series. It has a rectangular silicon solar cell. A first flexible electrical interconnect provides a rigid conductive bond to a first supercell of the plurality of supercells. The flexible conductive bond between overlapping solar cells is formed from a first conductive adhesive and has a stiffness modulus of less than or equal to about 800 megapascals. The strong conductive bond between the first supercell and the first flexible electrical interconnect is formed from a second conductive adhesive and has a stiffness modulus greater than or equal to about 2000 megapascals.

The first conductive adhesive may, for example, have a glass transition temperature of less than or equal to about 0°C.

In some variations, unlike the first conductive adhesive and the second conductive adhesive, both conductive adhesives can be cured in the same processing step.

In some variations, the plurality of conductive junctions between overlapping and adjacent solar cells have a thickness of less than or equal to about 50 microns in a direction perpendicular to the solar cells; Thermal conductivity in the direction is greater than or equal to about 1.5 W/(meter-K).

In one aspect, a solar module includes N rectangular or nearly rectangular silicon solar cells (a number greater than or equal to about 150) arranged as a plurality of supercells in two or more parallel rows. Each supercell includes a plurality of silicon solar cells arranged side by side with the long sides of the adjacent silicon solar cells overlapping and conductively bonded to each other to electrically connect the adjacent silicon solar cells in series. The supercell is electrically connected to provide a high DC voltage greater than or equal to about 90 volts.

In one variation, the solar module includes one or more flexible electrical interconnects arranged to electrically connect the plurality of supercells in series to provide the high DC voltage. Solar modules may include module-level power electronics including an inverter that converts the high DC voltage to an AC voltage. The module level power electronics can sense the high DC voltage and operate the module at an optimal current-voltage power point.

In other variations, the solar module is
a module level electrically connected to a plurality of individual adjacent series-connected supercell row pairs, one or more of the plurality of supercell row pairs being electrically connected in series to provide the high DC voltage; power electronics,
and an inverter that converts the high DC voltage into AC voltage. Optionally, the module level power electronics may sense the voltage across each individual supercell row pair and operate each individual supercell row pair at an optimal current-voltage power point. Optionally, if the voltage across an individual supercell row pair falls below a threshold, the module level power electronics may switch out the row pair from the circuitry providing the high DC voltage.

In another variation, the solar module is electrically connected to each individual supercell row, and two or more of the plurality of supercell rows are electrically connected in series to provide the high DC voltage. level power electronics,
and an inverter that converts the high DC voltage into AC voltage. Optionally, the module level power electronics may sense the voltage across each individual supercell row and operate each individual supercell row at an optimal current-voltage power point. Optionally, if the voltage across an individual supercell row falls below a threshold, the module level power electronics may switch out the supercell row from the circuitry providing the high DC voltage.

In other variations, the solar module provides module-level power with electrical connections to each individual supercell, and two or more of the plurality of supercells electrically connected in series to provide the high DC voltage. electronics and
and an inverter that converts the high DC voltage into AC voltage. Optionally, the module level power electronics may sense the voltage across each individual supercell and operate each individual supercell at an optimal current-voltage power point. Optionally, if the voltage across an individual supercell falls below a threshold, the module level power electronics may switch out the supercell from the circuitry providing the high DC voltage.

In another variation, each supercell within the module is electrically segmented into multiple segments by multiple hidden taps. The solar module has module-level power electronics electrically connected to each segment of each supercell through the plurality of hidden taps and electrically connecting two or more segments in series to provide the high DC voltage. including,
It includes an inverter that converts the high DC voltage into AC voltage. Optionally, the module level power electronics may sense the voltage across each individual segment of each supercell and operate each individual segment at an optimal current-voltage power point. Optionally, if the voltage across an individual segment falls below a threshold, the module level power electronics may switch out the segment from the circuit providing the high DC voltage.

In any of the above variations, the optimal current-voltage power point may be the maximum current-voltage power point.

In any of the above variants, the module level power electronics may not have a DC-DC boost component.

In any of the above variations, N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, about greater than or equal to 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or or greater than or equal to about 700.

In any of the above variations, the high DC voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than about 300 volts. , or equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or about 600 volts The voltage may be higher or equal to that.

In other embodiments, a solar power generation system includes two or more solar modules electrically connected in parallel and an inverter. Each solar module includes N rectangular or nearly rectangular silicon solar cells (a number greater than or equal to about 150) arranged as a plurality of supercells in two or more parallel rows. Each supercell in each module is arranged side by side with the long sides of adjacent silicon solar cells overlapping and conductively bonded to each other, electrically connecting the adjacent silicon solar cells in series. The plurality of silicon solar cells includes two or more silicon solar cells. Within each module, supercells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts. The inverter electrically connects the two or more solar modules to convert their high voltage DC output to AC.

Each solar module may include one or more flexible electrical interconnects arranged to electrically connect the plurality of supercells within the solar module in series to provide a high voltage DC output of the solar module.

The solar power generation system may include at least a third solar module electrically connected in series with a first solar module among two or more solar modules electrically connected in parallel. In such a case, the third solar module comprises N' (a number greater than or equal to about 150) rectangular or nearly rectangular silicon cells arranged as a plurality of supercells in two or more parallel rows. May include solar cells. Each super cell in the third solar module is arranged side by side with the long sides of the adjacent silicon solar cells overlapping and conductively bonded to each other so that the adjacent silicon solar cells are electrically connected in series. including two or more silicon solar cells among the plurality of silicon solar cells within the plurality of silicon solar cells. Within the third solar module, the supercell is electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts.

As just described, a variant comprising a third solar module of the two or more solar modules electrically connected in series with the first solar module is a variant of the two or more solar modules electrically connected in parallel. It may also include at least a fourth solar module electrically connected in series with the second solar module. The fourth solar module may include N'' (a number greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows. . Each super cell in the fourth solar module is arranged side by side with the long sides of the adjacent silicon solar cells overlapping and conductively bonded to each other, electrically connecting the adjacent silicon solar cells in series. including two or more silicon solar cells among the plurality of silicon solar cells within the plurality of silicon solar cells. Within the fourth solar module, the supercell is electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts.

The solar power generation system is configured such that a short circuit occurring in any one of the two or more solar modules dissipates the power generated in the other of the two or more solar modules. may include a plurality of fuses and/or blocking diodes arranged to prevent the

The solar power generation system may include a positive bus and a negative bus to which the two or more solar modules are electrically connected in parallel and to which the inverter is electrically connected. Alternatively, the solar power generation system may include a combiner box to which the two or more solar modules are electrically connected by separate conductors. The combiner box electrically connects the solar modules in parallel and optionally allows a short circuit occurring in any one of the two or more solar modules mentioned above to dissipate the power generated in the other solar modules. may include a plurality of fuses and/or blocking diodes arranged to prevent

The inverter may be configured to operate the two or more solar modules at a DC voltage higher than a set minimum value to avoid reverse biasing the solar modules.

The inverter may be configured to recognize a reverse bias condition occurring in one or more of the solar modules and operate the solar module at a voltage that avoids the reverse bias condition.

A solar power system may be located on the roof.

In any of the above variations, N, N', and N'' are greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, about 350 greater than or equal to, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600 It can be equal to, greater than or equal to about 650, or greater than or equal to about 700. N, N', and N'' may have the same or different values.

In any of the above variations, the high DC voltage provided by the solar module is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts. equal to, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts The voltage may be equal to or greater than or equal to about 600 volts.

In other embodiments, the photovoltaic system comprises N (greater than or equal to about 150) rectangular or substantially rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows. a first solar module including a first solar module; Each supercell includes a plurality of silicon solar cells arranged side by side with the long sides of the adjacent silicon solar cells overlapping and conductively bonded to each other to electrically connect the adjacent silicon solar cells in series. The system also includes an inverter. The inverter may be, for example, a microinverter integrated with the first solar module. The plurality of supercells in the first solar module are electrically connected to provide a high DC voltage greater than or equal to about 90 volts to the inverter that converts the DC to AC.

A first solar module may include one or more flexible electrical interconnects arranged to electrically connect the plurality of supercells in the solar module in series to provide a high voltage DC output of the solar module. .

The solar power generation system may include at least a second solar module electrically connected in series with the first solar module. The second solar module may include N' (a number greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows. Each super cell in the second solar module is arranged side by side with the long sides of the adjacent silicon solar cells overlapping and conductively bonded to each other, electrically connecting the adjacent silicon solar cells in series. including two or more silicon solar cells among the plurality of silicon solar cells within the plurality of silicon solar cells. Within the second solar module, the supercell is electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts.

The inverter (eg, microinverter) may not have a DC-DC boost component.

In any of the above variations, N and N' are greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350. equal to, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, less than about 650 It can be greater than or equal to, or greater than or equal to about 700. N, N' may have the same or different values.

In any of the above variations, the high DC voltage provided by the solar module is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts. equal to, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts The voltage may be equal to or greater than or equal to about 600 volts.

In other embodiments, the solar module comprises N (greater than or equal to about 250) rectangular or substantially rectangular silicon solar cells arranged as a plurality of series-connected supercells in two or more parallel rows. Contains batteries. Each supercell includes a plurality of silicon solar cells, with the long sides of adjacent silicon solar cells overlapping and directly conductively bonded to each other by an electrically and thermally conductive adhesive. Silicon solar cells are arranged side by side in a series electrical connection. The solar module comprises less than one bypass diode per 25 solar cells. The electrically and thermally conductive adhesive has a thickness of less than or equal to about 50 microns perpendicular to the plurality of solar cells and a thermal conductivity perpendicular to the plurality of solar cells of about 50 microns. Forming multiple junctions between adjacent solar cells that are higher than or equal to 1.5 W/(meter-K).

The plurality of supercells may be encapsulated within a thermoplastic olefin layer between a front sheet and a back sheet. The supercells and their encapsulants may be sandwiched between front and back sheets of glass.

A solar module may include, for example, less than one bypass diode per 30 solar cells, or less than one bypass diode per 50 solar cells, or less than one bypass diode per 100 solar cells. The solar module may, for example, have no bypass diodes, or only a single bypass diode, or no more than 3 bypass diodes, or no more than 6 bypass diodes, or no more than 10 bypass diodes.

A plurality of conductive junctions between overlapping solar cells is optional, and said plurality of conductive junctions in a direction parallel to said plurality of rows can be operated at temperatures ranging from about -40°C to about 100°C without damaging said solar module. The plurality of supercells may be provided with mechanical compliance that accommodates a thermal expansion mismatch between the supercells and the glass front sheet.

In any of the above variations, N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, about It can be greater than or equal to 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

In any of the above variations, the plurality of supercells are electrically connected to a voltage greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts. equal to, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts A high DC voltage equal to or greater than or equal to about 600 volts may be provided.

solar energy system
A solar module of any of the above variations,
an inverter (e.g., a microinverter) electrically connected to the solar module and configured to convert DC output from the solar module to provide AC output. The inverter may not have a DC-DC boost component. The inverter may be configured to operate the solar module at a DC voltage higher than a set minimum value to avoid reverse biasing the solar cells. The minimum voltage value may be temperature dependent. The inverter may be configured to recognize reverse bias conditions and operate the solar module at a voltage that avoids the reverse bias conditions. For example, the inverter may be configured to operate the solar module in a local maximum region of the solar module's voltage-current output curve to avoid the reverse bias condition.

This specification discloses a solar cell cleaving tool and a solar cell cleaving method.

In one embodiment, a method of manufacturing a solar cell includes:
a step of advancing the solar cell wafer along a curved surface;
A vacuum is drawn between the curved surface and the bottom surface of the solar cell wafer to bend the solar cell wafer toward the curved surface, thereby causing the solar cell wafer to bend the solar cell wafer toward the curved surface, thereby causing the solar cell wafer to bend the solar cell wafer toward the curved surface, thereby causing the solar cell wafer to bend the solar cell wafer toward the curved surface. cleaving the cell wafer to separate a plurality of solar cells from the solar cell wafer. The solar cell wafer can be continuously advanced along a curved surface, for example. Alternatively, the solar cells may be advanced along a curved surface in discrete movements.

The curved surface may be, for example, a curved portion of a top surface of a vacuum manifold that draws the vacuum against the bottom surface of the solar cell wafer. The vacuum drawn against the bottom surface of the solar cell wafer by the vacuum manifold may vary along the direction of movement of the solar cell wafer, e.g. The strongest and best in the area.

The method includes transporting the solar cell wafer by a perforated belt along the curved top surface of the vacuum manifold, wherein the vacuum is applied to the solar cell wafer through a plurality of perforations in the perforated belt. It may include the step of being drawn against the bottom surface. The plurality of perforations is optional, such that the leading and trailing edges of the solar cell wafer along the direction of movement of the solar cell wafer lie over at least one perforation of the perforated belt, so that the vacuum It may be arranged on the belt so as to be pulled towards it, but this is not necessary.

The method includes advancing the solar cell wafer along a flat region of the top surface of the vacuum manifold to a transition curved region of the top surface of the vacuum manifold having a first curvature; advancing the solar cell wafer into a cleavage region of the upper surface of the vacuum manifold, where the solar cell wafer is sequentially cleaved, the cleavage region of the vacuum manifold having a second curvature higher than the first curvature; process. The method may further include advancing the plurality of cleaved solar cells into a post-cleave region of the vacuum manifold having a third curvature greater than the second curvature.

In any of the above variations, the method includes drawing a stronger vacuum between the solar cell wafer and the curved surface at one end of each scribe line and then at the opposite end of each scribe line. , providing an asymmetric stress distribution along each scribe line that promotes nucleation and propagation of a single cleavage tear along each scribe line. Alternatively, or in addition, in any of the above-mentioned variants, the method comprises arranging the solar cell wafer such that for each scribe line, one end reaches the curved cleavage region of the vacuum manifold before the other end. Orienting the upper scribe line at an angle relative to the vacuum manifold.

In any of the above variations, the method may include removing the cleaved solar cells from the curved surface before the edges of the cleaved solar cells touch. For example, the method may include removing the battery in a direction tangential or approximately tangential to a curved surface of the manifold at a rate faster than the rate of movement of the battery along the manifold. This may be achieved, for example, by tangentially arranged moving belts or by any other suitable mechanism.

In any of the above variations, the method includes the steps of: scribing scribe lines on the solar cell wafer; applying an electrically conductive adhesive adhesive to the portion. Each of the resulting cleaved solar cells may then include a portion of an electrically conductive adhesive binder disposed along the cleavage edges on its top or bottom surface. The scribe line may be formed using any suitable scribing method before or after the electrically conductive adhesive adhesive is applied. The scribe line may be formed by laser scribing, for example.

In any of the above variations, the solar cell wafer may be a square or pseudo-square silicon solar cell wafer.

In another aspect, a method of making a solar cell string includes arranging a plurality of rectangular solar cells such that the long sides of adjacent rectangular solar cells are shingled with an electrically conductive adhesive bonding agent therebetween. and curing the electrically conductive bonding agent thereby bonding the adjacent overlapping rectangular solar cells to each other and electrically connecting them in series. The solar cell may be manufactured, for example, by any of the variants of the method for manufacturing a solar cell described above.

In one aspect, a method of making a solar cell string includes forming a backside metallization pattern on each square solar cell of one or more square solar cells;
stencil printing a complete front metallization pattern on each square solar cell of the one or more square solar cells in a single stencil printing process. These steps may be performed in any order or simultaneously if appropriate. A "complete front metallization pattern" means that after the stencil printing process, no additional metallization material needs to be deposited on the front side of the square solar cell to complete the formation of the front metallization. The method also
A plurality of rectangular solar cells each including a complete front side metallization pattern and a backside metallization pattern, with each square solar cell separated into two or more rectangular solar cells, forming from square solar cells;
arranging the plurality of rectangular solar cells side by side with the long sides of adjacent rectangular solar cells overlapping each other in a shingled pattern;
conductively bonding the rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells to each other with an electrically conductive bonding agent interposed therebetween, the process comprising: one of the rectangular solar cells included in the pair; The front metallization pattern of the rectangular solar cells of the pair is electrically connected to the back metallization pattern of the other rectangular solar cell of the pair, thereby connecting the plurality of rectangular solar cells in series. including the process of making an electrical connection to the

The stencil defines one or more features of the front metallization pattern on the one or more square solar cells, and the stencil is arranged such that all portions of the stencil lie in the plane of the stencil during stencil printing. It may be configured to be secured by physical connection to other portions of the stencil.

The front metallization pattern on each rectangular solar cell may, for example, include a plurality of fingers oriented in a direction perpendicular to the long sides of the rectangular solar cell, wherein the plurality of fingers in the front metallization pattern are None are physically connected to each other by the front metallization pattern.

This specification describes, for example, solar cells that do not have cleaved edges to promote carrier recombination and reduce carrier recombination losses at the edges of the solar cell, methods for manufacturing such solar cells, and supercell formation. The use of such solar cells in a shingled (overlapping) arrangement is disclosed.

In one aspect,
The method for manufacturing multiple solar cells is
depositing one or more front amorphous silicon layers on the front side of the crystalline silicon wafer;
depositing one or more backside amorphous silicon layers on the back side of the crystalline silicon wafer opposite the front side of the crystalline silicon wafer;
patterning the one or more front amorphous silicon layers to form one or more front trenches in the one or more front amorphous silicon layers;
depositing a front passivate layer on the one or more front amorphous silicon layers and in the one or more front trenches;
patterning the one or more backside amorphous silicon layers to form one or more backside trenches in the one or more backside amorphous silicon layers;
depositing a backside passivate layer on the one or more backside amorphous silicon layers and within the one or more backside trenches. Each of the one or more backside trenches is formed alongside a corresponding one of the frontside trenches. The method includes cleaving the crystalline silicon wafer at one or more cleavage planes, each cleavage plane being centered or substantially centered on a different pair of corresponding front and back trenches. , further comprising a step. In operation of the resulting solar cell, the front amorphous silicon layer will be illuminated by light.

In some variations, only front trenches are formed and no back trenches are formed. In other variations, only back trenches are formed and no front trenches are formed.

The method includes forming the one or more front side trenches to penetrate the front side amorphous silicon layer to reach the front side of the crystalline silicon wafer, and/or forming the one or more back side trenches. and penetrating the one or more backside amorphous silicon layers to reach the backside of the crystalline silicon wafer.

The method may include forming the front passivate layer and/or the back passivate layer from a transparent conductive oxide.

A pulsed laser or a diamond tip may be used to initiate the cleavage point (eg, approximately 100 microns long). A CW laser and a cooling nozzle are sequentially used to separate the crystalline silicon wafer at one or more cleavage planes by inducing high compressive and stretching thermal stresses and inducing complete cleavage propagation within the crystalline silicon wafer. It can be done. Alternatively, the crystalline silicon wafer can be mechanically cleaved in one or more cleavage planes. Any suitable cleavage method may be used.

The front side amorphous crystalline silicon layer or layers may form an n-p junction with the crystalline silicon wafer, in which case it may be preferable to cleave the crystalline silicon wafer from its back side. Alternatively, the one or more backside amorphous crystalline silicon layers may form an n-p junction with a crystalline silicon wafer, in which case it may be preferable to cleave the crystalline silicon wafer from its front side.

In other embodiments, a method of manufacturing a plurality of solar cells comprises:
forming one or more trenches in a first surface of a crystalline silicon wafer;
depositing one or more amorphous silicon layers on the first surface of the crystalline silicon wafer;
depositing a passivate layer in the one or more trenches of the first surface of the crystalline silicon wafer and on the one or more amorphous silicon layers;
depositing one or more amorphous silicon layers on a second surface of the crystalline silicon wafer opposite the first surface of the crystalline silicon wafer;
cleaving the crystalline silicon wafer at one or more cleavage planes, each cleavage plane being centered or substantially centered on a different one of the one or more trenches; Contains and .

The method may include forming the passivate layer from a transparent conductive oxide.

A laser may be used to induce thermal stress in the crystalline silicon wafer to cleave the crystalline silicon wafer at the one or more cleavage planes. Alternatively, the crystalline silicon wafer can be mechanically cleaved in one or more cleavage planes. Any suitable cleavage method may be used.

The one or more front amorphous crystalline silicon layers may form an np junction with the crystalline silicon wafer. Alternatively, the one or more backside amorphous crystalline silicon layers may form an np junction with the crystalline silicon wafer.

In another embodiment, the solar panel includes a plurality of solar panels arranged side by side with the ends of the adjacent solar cells shingled and conductively bonded to each other, electrically connecting the adjacent solar cells in series. The supercell includes a plurality of supercells, each having solar cells. Each solar cell is
a crystalline silicon substrate;
one or more first surface amorphous silicon layers disposed on the first surface of the crystalline silicon substrate to form an n-p junction;
one or more second surface amorphous silicon layers disposed on a second surface of the crystalline silicon substrate opposite the first surface of the crystalline silicon substrate;
at the edge of the one or more first surface amorphous silicon layers, at the edge of the one or more second surface amorphous silicon layers, or at the edge of the one or more first surface amorphous silicon layers and the one or more a plurality of passivating layers to prevent carrier recombination at the edges of the second surface amorphous silicon layer. The plurality of passivating layers may include a transparent conductive oxide.

Solar cells may be formed, for example, by any of the methods summarized above or otherwise disclosed herein.

These and other embodiments, features, and advantages of the invention will become apparent to those skilled in the art upon reference to the following more detailed description of the invention, taken in conjunction with the accompanying drawings, which are first briefly described. , becomes more obvious.

Figure 3 shows a cross-sectional view of a string of series-connected solar cells arranged in a shingled arrangement, with the ends of adjacent solar cells overlapping to form a shingled supercell. FIG. 2 shows an illustration of the front (sun side) side and front metallization pattern of an exemplary rectangular solar cell that may be used to form a shingled supercell. FIG. 2 shows an illustration of the front (sun side) side and front metallization pattern of two exemplary rectangular solar cells including rounded corners that may be used to form a shingled supercell. FIG. 2 shows an illustration of the front (sun side) side and front metallization pattern of two exemplary rectangular solar cells including rounded corners that may be used to form a shingled supercell. FIG. 2B shows an illustration of the backside of the solar cell shown in FIG. 2A and an exemplary backside metallization pattern. FIG. 2B shows an illustration of the backside of the solar cell shown in FIG. 2A and an exemplary backside metallization pattern. FIG. 2B shows an illustration of the backside of the solar cell shown in FIGS. 2B and 2C, respectively, and an exemplary backside metallization pattern. FIG. 2B shows an illustration of the backside of the solar cell shown in FIGS. 2B and 2C, respectively, and an exemplary backside metallization pattern. FIG. 7 shows an illustration of the front (sun side) side and front metallization pattern of another exemplary rectangular solar cell that may be used to form a shingled supercell. The front metallization pattern includes discrete contact pads, each of the discrete contact pads having an uncured conductive adhesive adhesive deposited thereon flowing away from the contact pad. surrounded by a barrier configured to prevent Figure 2H shows a cross-sectional view of the solar cell of Figure 2H, identifying details of the front metallization pattern shown in the enlarged views of Figures 2J and 2K, including the contact pad and a portion of the barrier surrounding the contact pad. 2I shows an enlarged view of the detail of FIG. 2I; FIG. 2I shows an enlarged view of the detail of FIG. 2I with uncured conductive adhesive adhesive substantially confined at the discontinuous contact pad locations by the barrier; FIG. 2H shows an illustration of a backside and an exemplary backside metallization pattern for the solar cell of FIG. 2H. FIG. The backside metallization pattern includes discrete contact pads, each of the discrete contact pads having an uncured conductive adhesive adhesive deposited thereon flowing away from the contact pad. surrounded by a barrier configured to prevent Figure 2L shows a cross-sectional view of the solar cell of Figure 2L, identifying details of the backside metallization pattern shown in the enlarged view of Figure 2N, including the contact pad and a portion of the barrier surrounding the contact pad. 2M shows an enlarged view of the detail of FIG. 2M; FIG. FIG. 7 illustrates another variation of a metallization pattern that includes a barrier configured to prevent uncured conductive adhesive adhesive from flowing away from a contact pad. The barrier abuts one side of the contact pad and is higher than the contact pad. 2O shows another variation of the metallization pattern of FIG. 2O, with the barrier abutting at least two sides of the contact pad. FIG. 7 shows an illustration of a backside and an exemplary backside metallization pattern for another exemplary rectangular solar cell. The backside metallization pattern includes continuous contact pads that extend substantially the length of the long side of the solar cell along the edges of the solar cell. The contact pad is surrounded by a barrier configured to prevent uncured conductive adhesive adhesive deposited on the contact pad from flowing away from the contact pad. FIG. 7 shows an illustration of the front (sun side) side and front metallization pattern of another exemplary rectangular solar cell that may be used to form a shingled supercell. The front metallization pattern includes discontinuous contact pads arranged in rows along the edge of the solar cell and long thin conductors extending parallel to and inward from the rows of contact pads. The long thin conductor forms a barrier configured to prevent uncured conductive adhesive adhesive deposited on the contact pad thereof from flowing away from the contact pad and onto the active area of the solar cell. . Separating (e.g., cutting or folding) pseudo-square silicon solar cells of standard size and shape to result in rectangular solar cells of two different lengths that can be used to form shingled supercells. 1 shows a diagram illustrating an exemplary method of obtaining. FIG. 12 shows a diagram illustrating another exemplary method in which a pseudo-square silicon solar cell may be separated into a rectangular solar cell. FIG. 3B shows the front side of the wafer and an exemplary front side metallization pattern. FIG. 3C shows the backside of the wafer and an exemplary backside metallization pattern. FIG. 12 shows a diagram illustrating another exemplary method in which a pseudo-square silicon solar cell may be separated into a rectangular solar cell. FIG. 3B shows the front side of the wafer and an exemplary front side metallization pattern. FIG. 3C shows the backside of the wafer and an exemplary backside metallization pattern. FIG. 2 shows a diagram illustrating an exemplary method in which square silicon solar cells may be separated into rectangular solar cells. FIG. 3D shows the front side of the wafer and an exemplary front side metallization pattern. FIG. 3E shows the backside of the wafer and an exemplary backside metallization pattern. FIG. 2 shows a diagram illustrating an exemplary method in which square silicon solar cells may be separated into rectangular solar cells. FIG. 3D shows the front side of the wafer and an exemplary front side metallization pattern. FIG. 3E shows the backside of the wafer and an exemplary backside metallization pattern. 2B shows a fragmentary front view of an exemplary rectangular supercell including a plurality of rectangular solar cells, such as those shown in FIG. 2A, arranged in a shingled configuration as shown in FIG. 1; FIG. A front view of an exemplary rectangular supercell including a plurality of "chevron" rectangular solar cells arranged in a shingled configuration as shown in FIG. 1 and including a plurality of chamfered corners, e.g. as shown in FIG. 2B; Each shows a back view. A front view of an exemplary rectangular supercell including a plurality of "chevron" rectangular solar cells arranged in a shingled configuration as shown in FIG. 1 and including a plurality of chamfered corners, e.g. as shown in FIG. 2B; Each shows a back view. FIG. 3 shows a diagram of an exemplary rectangular solar module. The rectangular solar module includes a plurality of rectangular shingled supercells each having a long side approximately half the length of a short side of the module. Pairs of supercells are arranged end-to-end to form rows with the long sides of the supercells parallel to the short sides of the same module. FIG. 6 shows a diagram of another exemplary rectangular solar module. The rectangular solar module includes a plurality of rectangular shingled supercells each having a long side approximately the same length as a short side of the module. The supercells are arranged with their long sides parallel to the short sides of the module. FIG. 6 shows a diagram of another exemplary rectangular solar module. The rectangular solar module includes a plurality of rectangular shingled supercells each having a long side approximately the same length as the long side of the module. The supercells are arranged with their long sides parallel to the sides of the module. FIG. 3 shows a diagram of an exemplary rectangular solar module. The rectangular solar module includes a plurality of rectangular shingled supercells each having a long side approximately half the length of the long side of the module. Pairs of supercells are arranged end-to-end to form rows with the long sides of the supercells parallel to the long sides of the modules. 5C shows a diagram of another exemplary rectangular solar module whose configuration is similar to that of FIG. 5C; FIG. In that configuration, all of the solar cells forming the supercell are chevron solar cells that include chamfered corners that correspond to the corners of the pseudo-square wafer from which the solar cells were separated. 5C shows a diagram of another exemplary rectangular solar module whose configuration is similar to that of FIG. 5C; FIG. In that configuration, the solar cells forming the supercell include a mix of chevron and rectangular solar cells arranged to reproduce the shape of the pseudo-square wafer from which it was separated. 5E shows a diagram of another exemplary rectangular solar module whose configuration is similar to that of FIG. 5E; FIG. The difference is that adjacent chevron solar cells in a supercell are arranged as mirror images of each other such that their overlapping edges are of the same length. FIG. 6 shows an exemplary arrangement of three supercell rows in which the supercells in each row are in series with each other and interconnected by flexible electrical interconnects so that the rows are in parallel with each other. These may be, for example, the three rows in the solar module of FIG. 5D. 2 illustrates an example flexible interconnect that may be used to interconnect supercells in series or in parallel. Some of these examples exhibit patterning that increases their flexibility (mechanical compliance) along their long axis, along their short axis, or along their long and short axes. There is. FIG. 7A shows an exemplary stress relief long interconnect configuration that may be used in hidden taps to supercells or as interconnects to front or backside supercell end contacts as described herein. . 3 illustrates an example of an out-of-plane stress relaxation feature. 7B-1 and 7B-2 are exemplary long interconnects that include out-of-plane stress relief features and may be used in hidden taps to supercells or as interconnects to front or back supercell end contacts. Show the configuration. 3 illustrates an example of an out-of-plane stress relaxation feature. 7B-1 and 7B-2 are exemplary long interconnects that include out-of-plane stress relief features and may be used in hidden taps to supercells or as interconnects to front or back supercell end contacts. Show the configuration. Detail A from FIG. 5D is shown. 5D is a cross-sectional view of the exemplary solar module of FIG. 5D, showing cross-sectional details of flexible electrical interconnects that join backside terminal contacts of multiple supercell rows; FIG. Detail C from FIG. 5D is shown. 5D is a cross-sectional view of the exemplary solar module of FIG. 5D, showing cross-sectional details of the flexible electrical interconnect that joins the front (solar) side end contacts of multiple supercell rows; FIG. Detail B from FIG. 5D is shown. 5D is a cross-sectional view of the exemplary solar module of FIG. 5D showing cross-sectional details of flexible interconnects arranged to serially interconnect two supercells in a row; FIG. FIG. 7 shows additional examples of electrical interconnects that join front end contacts of supercells at the ends of supercell rows adjacent to the edge of the solar module; FIG. The exemplary interconnects are configured to have a small footprint on the front of the module. FIG. 7 shows additional examples of electrical interconnects that join front end contacts of supercells at the ends of supercell rows adjacent to the edge of the solar module; FIG. The exemplary interconnects are configured to have a small footprint on the front of the module. FIG. 7 shows additional examples of electrical interconnects that join front end contacts of supercells at the ends of supercell rows adjacent to the edge of the solar module; FIG. The exemplary interconnects are configured to have a small footprint on the front of the module. FIG. 7 shows additional examples of electrical interconnects that join front end contacts of supercells at the ends of supercell rows adjacent to the edge of the solar module; FIG. The exemplary interconnects are configured to have a small footprint on the front of the module. FIG. 6 shows a diagram of another exemplary rectangular solar module. The rectangular solar module includes six rectangular shingled supercells each having a long side approximately the same length as the long side of the module. The supercells are arranged in six rows that are electrically connected in parallel with each other and with bypass diodes placed in the junction box on the back side of the solar module. Electrical connection between the supercell and the bypass diode is established through ribbons embedded in the module's stacked structure. FIG. 6 shows a diagram of another exemplary rectangular solar module. The rectangular solar module includes six rectangular shingled supercells each having a long side approximately the same length as the long side of the module. The supercells are arranged in six rows in electrical connection in parallel with each other and in parallel with bypass diodes placed on the backside of the solar module and in a junction box near the edge of the solar module. A second junction box is located on the same backside near the opposite edge of the solar module. Electrical connection between the supercell and the bypass diode is established through an external cable between the junction boxes. 1 shows a diagram of an exemplary glass-to-glass rectangular solar module. FIG. The rectangular solar module includes six rectangular shingled supercells each having a long side approximately the same length as the long side of the module. The supercells are arranged in six rows electrically connected to each other in parallel. Two junction boxes are mounted on opposite edges of the module to maximize the active area of the module. Figure 9C shows a side view of the solar module illustrated in Figure 9C. 2 illustrates another example solar module. The solar module includes six rectangular shingled supercells, each having a long side approximately the same length as the long side of the solar module. The supercells are arranged in six rows with three pairs of rows individually connected to power management devices on the solar module. 2 illustrates another example solar module. The solar module includes six rectangular shingled supercells, each having a long side approximately the same length as the long side of the solar module. The supercells are arranged in six rows with each row individually connected to a power management device on the solar module. FIG. 7 illustrates another embodiment of a module-level power management structure using shingled supercells. FIG. 7 illustrates another embodiment of a module-level power management structure using shingled supercells. FIG. 5B shows an exemplary schematic electrical diagram of a solar module as illustrated in FIG. 5B. 5B shows an exemplary physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 10A; FIG. 5B shows an exemplary physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 10A; FIG. 5A shows an exemplary schematic electrical diagram of a solar module as illustrated in FIG. 5A. FIG. 11A illustrates an exemplary physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic electrical diagram of FIG. 11A; FIG. 11A illustrates an exemplary physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic electrical diagram of FIG. 11A; FIG. 11A illustrates another example physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic electrical circuit diagram of FIG. 11A; FIG. 11A illustrates another example physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic electrical circuit diagram of FIG. 11A; FIG. 5A shows another exemplary schematic circuit diagram of a solar module as illustrated in FIG. 5A. 5A illustrates an example physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 12A; FIG. 5A illustrates an example physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 12A; FIG. 12A illustrates another example physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 12A. 12A illustrates another example physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 12A. 12A illustrates another example physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 12A. 5A shows another exemplary schematic circuit diagram of a solar module as illustrated in FIG. 5A. 5B shows another exemplary schematic circuit diagram of a solar module as illustrated in FIG. 5B. 13A illustrates an exemplary physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 13A; FIG. Slightly modified, the physical layout of FIGS. 13C-1 and 13C-2 is suitable for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 13B. 13A illustrates an exemplary physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 13A; FIG. Slightly modified, the physical layout of FIGS. 13C-1 and 13C-2 is suitable for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 13B. FIG. 6 shows a diagram of another exemplary rectangular solar module. The rectangular solar module includes a plurality of rectangular shingled supercells each having a long side approximately half the length of a short side of the module. Pairs of supercells are arranged end-to-end to form rows with the long sides of the supercells parallel to the short sides of the same module. 14B shows an exemplary schematic circuit diagram of a solar module as illustrated in FIG. 14A. 14B shows an example physical layout of various electrical interconnections for a solar module as illustrated in FIG. 14A with the schematic circuit diagram of FIG. 14B. 14B shows an example physical layout of various electrical interconnections for a solar module as illustrated in FIG. 14A with the schematic circuit diagram of FIG. 14B. 5B illustrates another example physical layout of various electrical interconnections for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 10A; FIG. 1 shows an exemplary arrangement of smart switches interconnecting two solar modules in series. 1 shows a flowchart of an exemplary method of making solar modules with supercells. 3 shows a flowchart of another exemplary method of making solar modules with supercells. FIG. 4 shows an exemplary arrangement in which a supercell may be cured by heat and pressure. FIG. 4 shows an exemplary arrangement in which a supercell may be cured by heat and pressure. FIG. 4 shows an exemplary arrangement in which a supercell may be cured by heat and pressure. FIG. 4 shows an exemplary arrangement in which a supercell may be cured by heat and pressure. 1 schematically illustrates an exemplary apparatus that may be used to cleave a scribed solar cell. The apparatus may be particularly advantageous when used to cleave scribed supercells to which a conductive adhesive binder has been applied. 1 schematically illustrates an exemplary apparatus that may be used to cleave a scribed solar cell. The apparatus may be particularly advantageous when used to cleave scribed supercells to which a conductive adhesive binder has been applied. 1 schematically illustrates an exemplary apparatus that may be used to cleave a scribed solar cell. The apparatus may be particularly advantageous when used to cleave scribed supercells to which a conductive adhesive binder has been applied. In solar modules containing multiple parallel supercell rows, dark lines can be used to reduce the visual contrast between the supercells and the portion of the backsheet that is visible from the front of the module. FIG. 7 illustrates an exemplary white backsheet with "zebra-like stripes." 1 shows a top view of a conventional module utilizing traditional ribbon connections in a hotspot condition; FIG. FIG. 3 shows a top view of a module utilizing thermal diffusion according to an embodiment, also in a hotspot condition. Figure 3 shows an example layout of a string of supercells with beveled cells. Figure 3 shows an example layout of a string of supercells with beveled cells. Figure 2 shows a simplified cross-sectional view of an array including a plurality of modules assembled in a shingled configuration. Figure 2 shows a simplified cross-sectional view of an array including a plurality of modules assembled in a shingled configuration. Figure 3 shows a view of the back (shadow) side of the module illustrating an exemplary electrical interconnection of the front (solar side) side end electrical contacts of the shingled supercell to the junction box on the back side of the solar module; . Exemplary electrical example of two or more shingled supercells in parallel, with the front (solar side) end electrical contacts of the supercells connected to each other and to a junction box on the back side of the solar module. Figure 3 shows a view of the back (shadow) side of the module illustrating the interconnections. Other exemplary embodiments of two or more shingled supercells in parallel, with the front (solar side) side terminal electrical contacts of the supercells connected to each other and to a junction box on the back side of the solar module. 2 shows a view of the back (shadow) side of the module illustrating the electrical interconnections; FIG. Fragmentation of two supercells illustrating the use of a flexible interconnect sandwiched between the overlapping ends of adjacent supercells to electrically connect the supercells in series and provide electrical connection to a junction box. A cross-sectional view and a perspective view are shown. An enlarged view of the target area of FIG. 29 is shown. FIG. 7 illustrates an exemplary supercell with electrical interconnects joined to front and back end contacts; FIG. 30B shows two of the supercells of FIG. 30A interconnected in parallel. FIG. 6 shows an illustration of an example backside metallization pattern that may be employed to form a hidden tap to a supercell as described herein. FIG. 6 shows an illustration of an example backside metallization pattern that may be employed to form a hidden tap to a supercell as described herein. FIG. 6 shows an illustration of an example backside metallization pattern that may be employed to form a hidden tap to a supercell as described herein. Figure 3 shows an example of the use of hidden taps with interconnects extending approximately the entire width of a supercell. Figure 3 shows an example of the use of hidden taps with interconnects extending approximately the entire width of a supercell. Examples of interconnects that join the supercell backside (FIG. 34A) end contacts and frontside (FIGS. 34B-34C) end contacts are shown. Examples of interconnects that join the supercell backside (FIG. 34A) end contacts and frontside (FIGS. 34B-34C) end contacts are shown. Examples of interconnects that join the supercell backside (FIG. 34A) end contacts and frontside (FIGS. 34B-34C) end contacts are shown. An example of the use of hidden taps having short interconnects extending into the gap between adjacent supercells but not extending substantially inward along the long axis of a rectangular solar cell is shown. An example of the use of hidden taps having short interconnects extending into the gap between adjacent supercells but not extending substantially inward along the long axis of a rectangular solar cell is shown. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes an out-of-plane stress relief feature. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes an out-of-plane stress relief feature. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes an out-of-plane stress relief feature. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes an out-of-plane stress relief feature. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes alignment features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect that includes alignment features. FIG. 7 illustrates an example configuration of a short hidden tap interconnect including asymmetric tab lengths. FIG. 7 illustrates an example configuration of a short hidden tap interconnect including asymmetric tab lengths. 2 illustrates an example solar module layout employing hidden taps. 2 illustrates an example solar module layout employing hidden taps. 2 illustrates an example solar module layout employing hidden taps. 2 illustrates an example solar module layout employing hidden taps. 2 illustrates an example solar module layout employing hidden taps. 2 illustrates an example solar module layout employing hidden taps. 40 and 42A-44B show exemplary electrical schematics for the solar module layouts of FIGS. 42A-44B. 2 illustrates current flow in a conductive state in an exemplary solar module with a bypass diode. FIG. 6 illustrates relative motion between solar module components resulting from thermal cycling in a direction parallel to the plurality of supercell rows and in a direction perpendicular to the plurality of supercell rows within the solar module, respectively. FIG. 6 illustrates relative motion between solar module components resulting from thermal cycling in a direction parallel to the plurality of supercell rows and in a direction perpendicular to the plurality of supercell rows within the solar module, respectively. 2A and 2B illustrate other example solar module layouts employing hidden taps, and corresponding electrical schematics, respectively. 2A and 2B illustrate other example solar module layouts employing hidden taps, and corresponding electrical schematics, respectively. Figure 3 illustrates an additional solar module layout that employs hidden taps in combination with recessed bypass diodes. Figure 3 illustrates an additional solar module layout that employs hidden taps in combination with recessed bypass diodes. 1A and 1B respectively show block diagrams of a solar module that provides a conventional DC voltage to a microinverter and a high voltage solar module as described herein that provides a high DC voltage to a microinverter. 1A and 1B respectively show block diagrams of a solar module that provides a conventional DC voltage to a microinverter and a high voltage solar module as described herein that provides a high DC voltage to a microinverter. 1 illustrates an example physical layout and electrical schematic of an example high voltage solar module incorporating bypass diodes. 1 illustrates an example physical layout and electrical schematic of an example high voltage solar module incorporating bypass diodes. 1 illustrates an example structure for module-level power management of a high voltage solar module including a shingled supercell. 1 illustrates an example structure for module-level power management of a high voltage solar module including a shingled supercell. 1 illustrates an example structure for module-level power management of a high voltage solar module including a shingled supercell. 1 illustrates an example structure for module-level power management of a high voltage solar module including a shingled supercell. 1 illustrates an example structure for module-level power management of a high voltage solar module including a shingled supercell. 1 illustrates an example structure for module-level power management of a high voltage solar module including a shingled supercell. 1 illustrates an example structure for module-level power management of a high voltage solar module including a shingled supercell. 1 illustrates an example structure for module-level power management of a high voltage solar module including a shingled supercell. 1 illustrates an example structure for module-level power management of a high voltage solar module including a shingled supercell. 1 illustrates an example structure for module-level power management of a high voltage solar module including a shingled supercell. FIG. 6 shows an exemplary arrangement of six supercells in six parallel rows with the ends of adjacent rows offset and interconnected in series by flexible electrical interconnects. 1 schematically illustrates a photovoltaic system comprising a plurality of high DC voltage shingled solar modules in parallel with each other and electrically connected to a string inverter. 57B shows the photovoltaic system of FIG. 57A positioned on a roof. Preventing a high DC voltage shingle solar module with a short circuit from dissipating significant amounts of power generated by other high DC voltage shingle solar modules to which it is parallel electrically connected. Figure 2 shows an arrangement of current limiting fuses and blocking diodes that may be used. Preventing a high DC voltage shingle solar module with a short circuit from dissipating significant amounts of power generated by other high DC voltage shingle solar modules to which it is parallel electrically connected. Figure 2 shows an arrangement of current limiting fuses and blocking diodes that may be used. Preventing a high DC voltage shingle solar module with a short circuit from dissipating significant amounts of power generated by other high DC voltage shingle solar modules to which it is parallel electrically connected. Figure 2 shows an arrangement of current limiting fuses and blocking diodes that may be used. Preventing a high DC voltage shingle solar module with a short circuit from dissipating significant amounts of power generated by other high DC voltage shingle solar modules to which it is parallel electrically connected. Figure 2 shows an arrangement of current limiting fuses and blocking diodes that may be used. FIG. 6 illustrates an example arrangement in which two or more high DC voltage shingled solar modules are electrically connected in parallel within a combiner box that may include a current limiting fuse and a blocking diode. FIG. 6 illustrates an example arrangement in which two or more high DC voltage shingled solar modules are electrically connected in parallel within a combiner box that may include a current limiting fuse and a blocking diode. 2A and 2B show current vs. voltage and power vs. voltage plots, respectively, of a plurality of high DC voltage shingled solar modules electrically connected in parallel. The plot of FIG. 60A is for the exemplary case in which none of the modules include reverse biased solar cells. The plot of FIG. 60B is for an exemplary case where some of the modules include one or more reverse biased solar cells. 2A and 2B show current vs. voltage and power vs. voltage plots, respectively, of a plurality of high DC voltage shingled solar modules electrically connected in parallel. The plot of FIG. 60A is for the exemplary case in which none of the modules include reverse biased solar cells. The plot of FIG. 60B is for an exemplary case where some of the modules include one or more reverse biased solar cells. 2 illustrates an example of a solar module that utilizes approximately one bypass diode per supercell. 1 illustrates an example of a solar module that utilizes nested bypass diodes. 2 illustrates an example configuration of a bypass diode connecting between two neighboring supercells using a flexible electrical interconnect; FIG. 3 schematically illustrates a side view and a top view, respectively, of another exemplary cleaving tool; FIG. 3 schematically illustrates a side view and a top view, respectively, of another exemplary cleaving tool; FIG. 2 schematically illustrates the use of an exemplary asymmetric vacuum arrangement to control tear nucleation and propagation along a scribe line when cleaving a wafer. 63A schematically illustrates the use of an exemplary symmetrical vacuum arrangement that provides a lower degree of control of cleavage than the arrangement of FIG. 63A. 62A-62B schematically illustrates a top view of a portion of an exemplary vacuum manifold that may be used in the cleaving tool of FIGS. 62A-62B. 65 provides a schematic illustration of a top and perspective view, respectively, of the exemplary vacuum manifold of FIG. 64 overlying a perforated belt; FIG. 65 provides a schematic illustration of a top and perspective view, respectively, of the exemplary vacuum manifold of FIG. 64 overlying a perforated belt; FIG. 62A-62B schematically illustrates a side view of an exemplary vacuum manifold that may be used in the cleaving tool of FIGS. 62A-62B. 1 schematically illustrates a cleaved solar cell overlying an exemplary arrangement of perforated belts and vacuum manifolds; 3 schematically illustrates the relative position and orientation of a cleaved solar cell and an uncleaved portion of a standard size wafer from which the solar cell is cleaved in an exemplary cleavage process; FIG. 1 schematically illustrates an apparatus and method by which cleaved solar cells can be continuously removed from a cleavage tool. 1 schematically illustrates an apparatus and method by which cleaved solar cells can be continuously removed from a cleavage tool. 1 schematically illustrates an apparatus and method by which cleaved solar cells can be continuously removed from a cleavage tool. 1 schematically illustrates an apparatus and method by which cleaved solar cells can be continuously removed from a cleavage tool. 1 schematically illustrates an apparatus and method by which cleaved solar cells can be continuously removed from a cleavage tool. 1 schematically illustrates an apparatus and method by which cleaved solar cells can be continuously removed from a cleavage tool. 1 schematically illustrates an apparatus and method by which cleaved solar cells can be continuously removed from a cleavage tool. 62A-62B provide orthogonal views of another variation of the exemplary cleaving tool of FIGS. 62A-62B; FIG. 62A-62B provide orthogonal views of another variation of the exemplary cleaving tool of FIGS. 62A-62B; FIG. 62A-62B provide orthogonal views of another variation of the exemplary cleaving tool of FIGS. 62A-62B; FIG. 70A-70C provide perspective views of the exemplary cleaving tool of FIGS. 70A-70C at two different stages of the cleaving process. 70A-70C provide perspective views of the exemplary cleaving tool of FIGS. 70A-70C at two different stages of the cleaving process. 70A-70C illustrate details of the perforated belt and vacuum manifold of the example cleaving tool of FIGS. 70A-70C; FIG. 70A-70C illustrate details of the perforated belt and vacuum manifold of the example cleaving tool of FIGS. 70A-70C; FIG. 70A-70C illustrate details of the perforated belt and vacuum manifold of the example cleaving tool of FIGS. 70A-70C; FIG. 70A-70C illustrate details of the perforated belt and vacuum manifold of the example cleaving tool of FIGS. 70A-70C; FIG. 70A-70C illustrate details of the perforated belt and vacuum manifold of the example cleaving tool of FIGS. 70A-70C; FIG. 70A-70C illustrate details of the perforated belt and vacuum manifold of the example cleaving tool of FIGS. 70A-70C; FIG. 10A-10C illustrate details of several example hole patterns that may be used for the perforated vacuum belt in the example cleaving tool of FIGS. 10A-10C; FIG. 10A-10C illustrate details of several example hole patterns that may be used for the perforated vacuum belt in the example cleaving tool of FIGS. 10A-10C; FIG. 10A-10C illustrate details of several example hole patterns that may be used for the perforated vacuum belt in the example cleaving tool of FIGS. 10A-10C; FIG. 10A-10C illustrate details of several example hole patterns that may be used for the perforated vacuum belt in the example cleaving tool of FIGS. 10A-10C; FIG. 10A-10C illustrate details of several example hole patterns that may be used for the perforated vacuum belt in the example cleaving tool of FIGS. 10A-10C; FIG. 10A-10C illustrate details of several example hole patterns that may be used for the perforated vacuum belt in the example cleaving tool of FIGS. 10A-10C; FIG. 10A-10C illustrate details of several example hole patterns that may be used for the perforated vacuum belt in the example cleaving tool of FIGS. 10A-10C; FIG. FIG. 3 shows an exemplary front metallization pattern on a rectangular solar cell. FIG. 3 shows an exemplary backside metallization pattern on a rectangular solar cell. FIG. 3 shows an exemplary backside metallization pattern on a rectangular solar cell. 77 illustrates an exemplary front metallization pattern on a square solar cell that can be diced to form a plurality of rectangular solar cells each having the front metallization pattern shown in FIG. 76. 77A depicts an exemplary backside metallization pattern on a square solar cell that can be diced to form a plurality of rectangular solar cells each having the backside metallization pattern shown in FIG. 77A. FIG. 2 is a schematic diagram showing a conventional sized HIT solar cell being diced into narrow strip solar cells using conventional cleavage methods, resulting in cleaved edges that promote carrier recombination. 1 schematically illustrates the steps of an exemplary method for dicing a conventional sized HIT solar cell into narrow solar cell strips without cleavage edges to promote carrier recombination. 1 schematically illustrates the steps of an exemplary method for dicing a conventional sized HIT solar cell into narrow solar cell strips without cleavage edges to promote carrier recombination. 1 schematically illustrates the steps of an exemplary method for dicing a conventional sized HIT solar cell into narrow solar cell strips without cleavage edges to promote carrier recombination. 1 schematically illustrates the steps of an exemplary method for dicing a conventional sized HIT solar cell into narrow solar cell strips without cleavage edges to promote carrier recombination. 1 schematically illustrates the steps of an exemplary method for dicing a conventional sized HIT solar cell into narrow solar cell strips without cleavage edges to promote carrier recombination. 1 schematically illustrates the steps of an exemplary method for dicing a conventional sized HIT solar cell into narrow solar cell strips without cleavage edges to promote carrier recombination. 1 schematically illustrates the steps of an exemplary method for dicing a conventional sized HIT solar cell into narrow solar cell strips without cleavage edges to promote carrier recombination. 1 schematically illustrates the steps of an exemplary method for dicing a conventional sized HIT solar cell into narrow solar cell strips without cleavage edges to promote carrier recombination. 1 schematically illustrates the steps of an exemplary method for dicing a conventional sized HIT solar cell into narrow solar cell strips without cleavage edges to promote carrier recombination. 1 schematically illustrates the steps of an exemplary method for dicing a conventional sized HIT solar cell into narrow solar cell strips without cleavage edges to promote carrier recombination. 2 schematically illustrates the steps of another exemplary method for dicing conventional sized HIT solar cells into narrow solar cell strips without cleavage edges to promote carrier recombination. 2 schematically illustrates the steps of another exemplary method for dicing conventional sized HIT solar cells into narrow solar cell strips without cleavage edges to promote carrier recombination. 2 schematically illustrates the steps of another exemplary method for dicing conventional sized HIT solar cells into narrow solar cell strips without cleavage edges to promote carrier recombination. 2 schematically illustrates the steps of another exemplary method for dicing conventional sized HIT solar cells into narrow solar cell strips without cleavage edges to promote carrier recombination. 2 schematically illustrates the steps of another exemplary method for dicing conventional sized HIT solar cells into narrow solar cell strips without cleavage edges to promote carrier recombination. 2 schematically illustrates the steps of another exemplary method for dicing conventional sized HIT solar cells into narrow solar cell strips without cleavage edges to promote carrier recombination. 2 schematically illustrates the steps of another exemplary method for dicing conventional sized HIT solar cells into narrow solar cell strips without cleavage edges to promote carrier recombination. 2 schematically illustrates the steps of another exemplary method for dicing conventional sized HIT solar cells into narrow solar cell strips without cleavage edges to promote carrier recombination. 2 schematically illustrates the steps of another exemplary method for dicing conventional sized HIT solar cells into narrow solar cell strips without cleavage edges to promote carrier recombination. 2 schematically illustrates the steps of another exemplary method for dicing conventional sized HIT solar cells into narrow solar cell strips without cleavage edges to promote carrier recombination.

The following detailed description should be read with reference to the drawings, in which the same reference numbers refer to like elements throughout the different drawings. The drawings, which are not necessarily to scale, depict selected embodiments and are not intended to limit the scope of the invention. The detailed description illustrates the principles of the invention by way of example, and not by way of limitation. This description will clearly enable any person skilled in the art to make and use the invention, and it describes several embodiments of the invention, including what is presently believed to be the best mode of carrying out the invention. , adaptations, variations, alternatives, and uses are described.

As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Additionally, the term "parallel" means "parallel or substantially parallel" and does not require that any parallel arrangement described herein be exactly parallel. It is intended to encompass some deviation from a geometry that is parallel, rather than parallel. The term "vertical" means "vertical or substantially vertical" and requires that any vertical arrangement described herein be exactly vertical. It is intended to encompass some deviation from a geometry that is not perpendicular. The term "square" means "being square or nearly square" and includes some deviation from a square shape, such as beveled (e.g., rounded or otherwise is intended to encompass shapes that are approximately square, including corners (cut). The term "rectangular" means "rectangular or nearly rectangular" and includes some deviations from a rectangular shape, such as chamfered (e.g. rounded or otherwise is intended to encompass shapes that are generally rectangular, including corners (cut).

This specification discloses a highly efficient shingled arrangement of silicon solar cells in a solar module, and front and back side metallization patterns and interconnects for the solar cells that can be used in such an arrangement. do. This specification also discloses a method for manufacturing such a solar module. Solar modules can be advantageously employed under "single sun" (decentralized) irradiation and have physical dimensions and electrical characteristics that allow them to be used in place of conventional silicon solar modules. It can have certain characteristics.

FIG. 1 shows a cross-sectional view of a string of series-connected solar cells 10 arranged in a shingled configuration, with the ends of adjacent solar cells overlapping and electrically connected to form a supercell 100 . Each solar cell 10 includes a semiconductor diode structure and a plurality of electrical contacts to the semiconductor diode structure. Thereby, the current generated within the solar cell 10 when the solar cell 10 is irradiated with light can be provided to an external load.

In the examples described herein, each solar cell 10 is made of crystalline silicon having a metallization pattern on the front (sun side) and back (shadow side) sides that provides electrical contact on opposite sides of the n-p junction. The solar cell has a front metallization pattern disposed on a semiconductor layer of n-type conductivity and a back metallization pattern disposed on a semiconductor layer of p-type conductivity. However, any other suitable material system, diode structure, physical dimensions, or electrical contact arrangement may be employed in place of, or in addition to, the solar cells 10 in the solar modules described herein. Any suitable solar cell may be used. For example, a front (sun side) metallization pattern may be disposed on a semiconductor layer of p-type conductivity, and a back (shadow side) side metallization pattern may be disposed on a semiconductor layer of n-type conductivity.

Referring again to FIG. 1, in the supercell 100, adjacent solar cells 10 electrically connect the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cell in the area where they overlap. They are conductively bonded to each other by an electrically conductive bonding agent. Suitable electrically conductive bonding agents may include, for example, electrically conductive adhesives, electrically conductive adhesive films and tapes, and conventional solders. Preferably, the electrically conductive adhesive has a mechanical compliance that accommodates stresses resulting from a mismatch between the coefficient of thermal expansion (CTE) of the electrically conductive adhesive and the CTE of the solar cell (e.g., the CTE of silicon). is provided to the junction between adjacent solar cells. To provide such mechanical compliance, in some variations, the electrically conductive binder is selected to have a glass transition temperature of less than or equal to about 0°C. To further reduce and accommodate stresses in the direction parallel to the overlapping edges of the solar cell resulting from CTE mismatch, the electrically conductive bonding agent may optionally extend substantially the length of the edge of the solar cell. It may be applied only at multiple discrete locations along the overlapping region of the solar cell, rather than in a continuous line extending over the area.

The thickness of the electrically conductive bond between adjacent overlapping solar cells formed by the electrically conductive bonding agent, measured perpendicular to the front and back surfaces of the solar cells, can be, for example, less than about 0.1 mm. Such thin junctions reduce resistive losses in the interconnections between cells and also encourage heat flow along the supercell from any hot spots within the supercell that may appear during operation. . The thermal conductivity of the junction between solar cells can be, for example, ≧about 1.5 Watt/(meter K).

FIG. 2A shows the front side of an exemplary rectangular solar cell 10 that may be used in supercell 100. Other shapes may be used for solar cell 10 as appropriate. In the illustrated example, the front metallization pattern of the solar cell 10 is positioned adjacent to one edge of the long sides of the solar cell 10 and parallel to the long side for substantially the length of the long side. The solar cell 10 includes a bus bar 15 extending in a direction perpendicular to the bus bar, and a plurality of fingers 20 extending substantially along the length of the short sides of the solar cell 10 and parallel to the short sides.

In the example of FIG. 2A, the solar cell 10 has a length of about 156 mm and a width of about 26 mm, so the aspect ratio (short side length/long side length) is about 1:6. be. Six such solar cells may be prepared on a standard 156 mm x 156 mm dimension silicon wafer and then separated (diced) to provide multiple solar cells as shown. In another variant, eight solar cells 10 with dimensions of approximately 19.5 mm x 156 mm and thus an aspect ratio of approximately 1:8 may be prepared from a standard silicon wafer. More generally, solar cell 10 may have an aspect ratio of, for example, from about 1:2 to about 1:20, and may be prepared from a standard size wafer or from a wafer of any other suitable size.

FIG. 3A shows an exemplary pseudo-square silicon solar cell wafer 45 of standard size and shape that may be cut, broken, or otherwise divided to form a plurality of rectangular solar cells as just described. Show how. In this example, several full-width rectangular solar cells 10L are cut from the central portion of the wafer, and in addition, several shorter rectangular solar cells 10S are cut from the edges of the wafer, with a chamfer of the wafer. Corners that are rounded or rounded are discarded. Solar cells 10L may be used to form one wide shingled supercell, and solar cells 10S may be used to form a narrower shingled supercell.

Alternatively, chamfered (eg, rounded) corners may be left on the solar cells cut from the edge of the wafer. 2B and 2C illustrate the front side of an exemplary "chevron" rectangular solar cell 10 substantially similar to that of FIG. 2A, but including chamfered corners left from the wafer from which the solar cell was cut. . In FIG. 2B, the busbar 15 is positioned adjacent to the shorter of the two long sides, extends substantially the length of the same side parallel to the same side, and further extends at least partially at both ends. , extending around the chamfered corners of the solar cell. In FIG. 2C, the bus bar 15 is positioned adjacent to the longer of the two long sides and extends in parallel to the longer side over substantially the length of the same side. 3B and 3C show a plurality of solar cells 10 diced along the dashed line shown in FIG. 3C and having a front metallization pattern similar to that shown in FIG. 2A and a front metallization pattern similar to that shown in FIG. 2B. FIG. 4 shows front and back views of a pseudo-square wafer 45 that may be provided with two beveled solar cells 10 having a pattern.

In the exemplary front metallization pattern shown in FIG. 2B, the two ends of the busbar 15 extending around the chamfered corners of the cell are each located adjacent to the long side of the cell. It may have a width that gradually decreases (gradually narrows) as the distance from the portion increases. Similarly, in the exemplary front metallization pattern shown in FIG. 3B, the two ends of the thin conductor interconnecting the discontinuous contact pads 15 extend around the chamfered corners of the solar cell and The contact pads are disposed along and gradually become smaller with increasing distance from the long side of the solar cell. Although such a gradual reduction in width is optional, it may advantageously reduce the use of metal and reduce shading of the active area of the solar cell without substantially increasing resistive losses. .

3D and 3E are front views and front views of a complete square wafer 47 that can be diced along the dashed lines shown in FIG. 3E to provide a plurality of solar cells 10 having a front side metallization pattern similar to that shown in FIG. 2A. A back view is shown.

Chamfered rectangular solar cells can be used to form supercells that include only beveled solar cells. Additionally or alternatively, one or more such beveled rectangular solar cells may be combined with one or more non-beveled rectangular solar cells (e.g., FIG. 2A) to form a supercell. It can be used as For example, the end solar cells of a supercell may be beveled solar cells, and the middle solar cells may be non-bevelled solar cells. When chamfered solar cells are used in combination with non-chamfered solar cells within a supercell, or more generally within a solar module, the resulting beveled and non-chamfered solar cells It may be desirable to use solar cell dimensions such that the front surface area exposed to light during operation of the solar cell is the same for all solar cells. By matching the areas of the solar cells in this way, the currents produced by the beveled and non-beveled solar cells are matched, which means that the current produced by the beveled and non-bevelled solar cells Improving the performance of series connected strings containing both batteries. The area of a chamfered solar cell and the area of a non-chamfered solar cell cut from the same pseudo-square wafer are different, for example, by adjusting the position of the line along which the dicing of the wafer is done, can be matched by making the width perpendicular to the long axis of the solar cell slightly wider than the unchamfered solar cell to compensate for the missing corners on the beveled solar cell.

The solar module may include only supercells formed exclusively from non-bevelled rectangular solar cells, or may include only supercells formed from beveled rectangular solar cells, or may include only supercells formed exclusively from beveled rectangular solar cells, or may include only supercells formed exclusively from beveled rectangular solar cells, or may include only supercells formed exclusively from beveled rectangular solar cells, or may include only supercells formed exclusively from beveled rectangular solar cells, or It may include only supercells that include cells and unbevelled solar cells, or it may include any combination of these three variants of supercells.

In some cases, portions of a standard-sized square or pseudo-square solar cell wafer (e.g., wafer 45 or wafer 47) near the edges of the wafer are more oriented than portions of the wafer located further from those edges. It can convert light into electricity with low efficiency. To improve the efficiency of the resulting rectangular solar cells, in some variations one or more edges of the wafer are trimmed to remove low efficiency portions before the wafer is diced. The portion trimmed from the edge of the wafer can be, for example, about 1 mm to about 5 mm in width. Additionally, as shown in FIGS. 3B and 3D, the two edge solar cells 10 to be diced from the wafer have their front busbars (or discontinuous contact pads) 15 along their outer edges. , thus can be oriented along two of the edges of the wafer. Within the supercells disclosed herein, busbars (or discontinuous contact pads) 15 typically have low light intensity along their two edges of the wafer because adjacent solar cells overlap. Conversion efficiency typically does not affect solar cell performance. As a result, in some variations, the edges of a square or pseudo-square wafer oriented parallel to the short sides of a rectangular solar cell are trimmed as just described, but parallel to the long sides of a rectangular solar cell. The edges of the wafer that are oriented are not trimmed. In other variations, one, two, three, or four edges of a square wafer (eg, wafer 47 in FIG. 3D) are trimmed as just described. In other variations, one, two, three, or four of the long edges of the pseudo-square wafer are trimmed as just described.

A solar cell having a long and narrow aspect ratio, as shown, and having an area smaller than the area of a standard 156 mm x 156 mm solar cell, is used in the solar modules disclosed herein ^. It may be advantageously employed to reduce R resistance power losses. In particular, the reduced area of the solar cell 10 compared to a standard size silicon solar cell reduces the current generated in the solar cell and within the series connected string of such solar cells. directly reduces resistive power losses. In addition, by arranging such rectangular solar cells in a supercell such that the current passes through the supercell 100 parallel to the short sides of the solar cell, the current flows through the semiconductor to reach the fingers 20 of the front metallization pattern. The distance that must flow through the material may be reduced, reducing the required finger length, which may also reduce resistive power losses.

As mentioned above, bonding overlapping solar cells 10 to each other in the overlapping regions to electrically connect the overlapping solar cells in series is compared to conventionally tabbed series connected strings of solar cells. shorten the length of electrical connections between adjacent solar cells. This also reduces resistive power losses.

Referring again to FIG. 2A, in the illustrated example, the front metallization pattern on the solar cell 10 includes an optional bypass conductor 40 that extends parallel to and separate from the busbars 15. (Such bypass conductors may also optionally be used in the metallization patterns shown in Figures 2B-2C, 3B and 3D, and also shown in Figure 2Q in combination with discontinuous contact pads 15 rather than continuous busbars. ) Bypass conductor 40 interconnects fingers 20 to electrically bypass any gaps that may form between bus bar 15 and bypass conductor 40. Such a tear, which may cut the finger 20 close to the busbar 15 , may otherwise separate the area of the solar cell 10 from the busbar 15 . Bypass conductors provide an alternative electrical path between such disconnected fingers and the bus bar. The illustrated example shows a bypass conductor 40 positioned parallel to the busbar 15 and extending approximately the entire length of the busbar and interconnecting every finger 20. Although this arrangement may be preferred, it is not required. If present, the bypass conductor need not run parallel to the busbar and need not extend the entire length of the busbar. Further, the bypass conductor interconnects at least two fingers, but need not interconnect all fingers. For example, two or more short bypass conductors may be used in place of a longer bypass conductor. Any suitable arrangement of bypass conductors may be used. The use of such bypass conductors is described in U.S. patent application Ser. Explained in detail. That patent application is incorporated herein by reference in its entirety.

The exemplary front metallization pattern of FIG. 2A also includes an optional end conductor 42 that interconnects the fingers 20 at the distal end of the fingers 20 opposite the busbar 15. (Such end conductors may also optionally be used in the metallization patterns shown in FIGS. 2B-2C, 3B and 3D and 2Q.) The width of conductor 42 may be approximately the same as the width of finger 20, for example. The conductor 42 interconnects the fingers 20 to electrically bypass any gaps that may form between the bypass conductor 40 and the conductor 42 and thereby otherwise prevent electrical interference caused by such gaps. Provides a current path to the busbar 15 for areas of the solar cell 10 that may be separated.

Although some of the illustrated examples show the front busbar 15 being of uniform width and extending substantially the length of the long side of the solar cell 10, this is not required. For example, as mentioned above, the front busbars 15 may include two or more front busbars 15 that may be arranged alongside each other, e.g. along the sides of the solar cell 10, e.g. as shown in FIGS. It can be replaced with a front discontinuous contact pad 15. Such discontinuous contact pads may optionally be interconnected by thinner conductors extending between them, for example as shown in the figures just mentioned. In such variations, the width of the contact pads, measured perpendicular to the long sides of the solar cell, can be, for example, about 2 to about 20 times the width of the thin conductor interconnecting the contact pads. There may be a separate (eg, small) contact pad for each finger in the front metallization pattern, or each contact pad may connect to two or more fingers. The front contact pad 15 may, for example, be square or have an elongated rectangular shape parallel to the edge of the solar cell. The front contact pad 15 may have a width in a direction perpendicular to the long side of the solar cell, for example, from about 1 mm to about 1.5 mm, and a length in a direction parallel to the long side of the solar cell, for example, It can be about 1 mm to about 10 mm. The spacing between contact pads 15, measured in a direction parallel to the long sides of the solar cell, can be, for example, about 3 mm to about 30 mm.

Alternatively, the solar cell 10 may not have both the front busbar 15 and the discontinuous front contact pad 15 and only include fingers 20 in the front metallization pattern. In such a variant, the current collection function that would otherwise be performed by the front busbar 15 or the contact pads 15 is instead used to join the two solar cells 10 together in the overlapping configuration described above. may be implemented, or partially implemented, by conductive materials used in

A solar cell that does not have both busbars 15 and contact pads 15 may or may not include bypass conductors 40 . In the absence of bus bar 15 and contact pad 15, bypass conductor 40 is arranged to bypass the gap formed between the bypass conductor and the portion of the front metallization pattern that conductively joins the overlapping solar cell. can be done.

A front metallization pattern comprising busbars or discontinuous contact pads 15, fingers 20, bypass conductors 40 (if present) and end conductors 42 (if present) may be used for such purposes, e.g. It may be formed from conventional silver paste and deposited by conventional screen printing methods, for example. Alternatively, the front metallization pattern may be formed from electroplated copper. Any other suitable materials and processes may also be used. In a variant where the front metallization pattern is formed from silver, the amount of silver on the solar cell can be reduced by using discontinuous front contact pads 15 along the edges of the cell rather than continuous busbars 15. is reduced, which can advantageously lower costs. In variants where the front metallization pattern is formed from copper or other conductors cheaper than silver, a continuous bus 15 can be employed without cost penalty.

2D to 2G, 3C and 3E show exemplary backside metallization patterns for solar cells. In these examples, the backside metallization pattern covers substantially all of the remaining backside of the solar cell with discontinuous backside contact pads 25 located along one of the long edges of the backside of the solar cell. A metal contact portion 30 is included. In a shingled supercell, the contact pads 25 connect two solar cells, for example by joining to busbars placed along the edges of the top surfaces of adjacent and overlapping solar cells, or to discontinuous contact pads. Electrically connect batteries in series. For example, each discrete backside contact pad 25 is aligned with a corresponding discrete front contact pad 15 on the front side of the overlapping solar cell, with an electrically conductive adhesive applied only to the discrete contact pads. Can be joined. The discontinuous contact pads 25 may, for example, be square (FIG. 2D) or have an elongated rectangular shape parallel to the edges of the solar cell (FIGS. 2E-2G, 3C, 3E). The contact pad 25 may have a width in a direction perpendicular to the long side of the solar cell of about 1 mm to about 5 mm, and a length in a direction parallel to the long side of the solar cell of about 1 mm to about 5 mm, for example. It can be about 10 mm. The spacing between contact pads 25, measured in a direction parallel to the long sides of the solar cell, can be, for example, about 3 mm to about 30 mm.

Contacts 30 may be made of aluminum and/or electroplated copper, for example. Formation of the aluminum back contact 30 typically provides a back field that reduces back recombination within the solar cell, thereby increasing solar cell efficiency. If contact 30 is formed from copper rather than aluminum, contact 30 may be used in combination with other passivating schemes (eg, aluminum oxide) to similarly reduce backside recombination. Discontinuous contact pads 25 may be formed from silver paste, for example. By using discontinuous rather than continuous silver contact pads 25 along the edges of the cell, the amount of silver in the backside metallization pattern is reduced, which is a cost advantage. can be lowered.

Furthermore, to reduce back-face recombination, solar cells rely on the back-field provided by the formation of aluminum contacts, using discontinuous rather than continuous silver contacts. By doing so, solar cell efficiency can be improved. This is because the silver backside contact does not provide a backfield and therefore tends to promote carrier recombination and create dead (non-working) volume in the solar cell above the silver contact. Traditionally ribbon-tabbed solar cell strings have their dead volume typically shadowed by the ribbon and/or busbar in front of the solar cell and therefore did not result in any additional efficiency loss. . However, within the solar cells and supercells disclosed herein, the volume of the solar cell above the back side silver contact pads 25 is typically not shadowed by any front side metallization and is Any dead volume resulting from the use of metallization reduces the efficiency of the cell. Therefore, by using discontinuous rather than continuous silver contact pads 25 along the backside edge of the solar cell, the volume of any corresponding dead zone is reduced and the efficiency of the solar cell is increased. It increases.

In variations that do not rely on the backfield to reduce backside recombination, the backside metallization pattern extends the length of the solar cell rather than discontinuous contact pads 25, as shown for example in FIG. 2Q. A continuous busbar 25 may be employed. Such a busbar 25 may be made of tin or silver, for example.

Other variations of the backside metallization pattern may employ discontinuous tin contact pads 25. A variation of the back metallization pattern may employ finger contacts similar to those shown in the front metallization pattern of FIGS. 2A-2C, without the contact pads and busbars.

Although the particular exemplary solar cell shown in the drawings is described as having a particular combination of front and back metallization patterns, more generally any suitable combination of front and back metallization patterns may be used. can be used. For example, one suitable combination is a silver front metallization pattern that includes discontinuous contact pads 15, fingers 20, and optional bypass conductors 40, and discontinuous aluminum contacts 30. A backside metallization pattern including silver contact pads 25 may be employed. Other suitable combinations include a copper front metallization pattern including continuous busbars 15, fingers 20 and optional bypass conductors 40, and continuous busbars 25 and copper contacts 30. A backside metallization pattern may be employed.

In the supercell fabrication process (described in more detail below), the electrically conductive bonding agent used to bond adjacent and overlapping solar cells within a supercell is located at the front or back edge of the solar cell. It may be distributed only on the contact pads (continuous or continuous) and not on the peripheral part of the solar cell. This may reduce material usage and, as explained above, reduce or accommodate stresses resulting from CTE mismatch between the electrically conductive binder and the solar cell. However, during or after deposition and before curing, some of the electrically conductive bonding agent may tend to spread beyond the contact pads and onto the surrounding portions of the solar cell. For example, the bound resin portion of the electrically conductive binder may be drawn away from the contact pad and onto adjacent portions of the solar cell surface that are rough or have many small holes due to capillary forces. Additionally, during the deposition process, some of the conductive bonding agent may come off the contact pads and instead be deposited on and possibly spread out from multiple adjacent portions of the solar cell surface. I might put it away. This spreading and/or incorrect deposition of conductive bonding material may weaken the bond between overlapping solar cells, and may weaken the bond between overlapping solar cells, causing the conductive bonding agent to spread over or incorrectly deposit solar cells. may cause damage to the section. Such spreading of the electrically conductive adhesive is reduced by, for example, a metallization pattern that forms a dam or barrier near or around each contact pad to keep the electrically conductive adhesive substantially in place. or can be prevented.

As shown in FIGS. 2H-2K, for example, the front metallization pattern acts as a dam, with each barrier 17 enclosing a corresponding discontinuous contact pad 15 and forming a moat between that contact pad and that barrier. may include contact pads 15, fingers 20, and barriers 17. Portions 19 of uncured conductive adhesive adhesive 18 that flow away from or become dislodged from the contact pads when dispensed onto the solar cell may be trapped in a moat by barrier 17. This further prevents the conductive adhesive adhesive from spreading from the contact pad onto the surrounding portions of the cell. Barrier 17 may, for example, be formed from the same material (e.g., silver) as fingers 20 and contact pads 15, and may have a height, e.g., from about 10 microns to about 40 microns, and a width, e.g., from about 30 microns to about 40 microns. It can be about 100 microns. The moat formed between barrier 17 and contact pad 15 may have a width, for example, from about 100 microns to about 2 mm. Although the illustrated example includes only a single barrier 17 around each front contact pad 15, in other variations two or more such barriers may be used, e.g. can be positioned concentrically. The front contact pad and its surrounding barrier or barriers may, for example, form a shape similar to a "bull's eye" target. As shown in FIG. 2H, for example, barrier 17 may interconnect with fingers 20 and with thin conductors interconnecting contact pads 15.

Similarly, as shown in FIGS. 2L-2N, for example, the backside metallization pattern includes discontinuous backside contact pads 25 (e.g., of silver) and covers substantially all of the remaining backside of the solar cell (e.g., , aluminum) and a barrier 27 (for example made of silver) surrounding a corresponding back contact pad 25 and acting as a dam forming a moat between that contact pad and itself. obtain. As shown, a portion of the contact portion 30 may fill the moat. A portion of the uncured conductive adhesive adhesive that flows away from or becomes dislodged from the contact pad 25 when dispensed onto the solar cell may be trapped in a moat by the barrier 27. This further prevents the conductive adhesive adhesive from spreading from the contact pad onto the surrounding portions of the cell. Barrier 27 may, for example, have a height of about 10 microns to about 40 microns, and a width of, for example, about 50 microns to about 500 microns. The moat formed between barrier 27 and contact pad 25 may have a width, for example, from about 100 microns to about 2 mm. Although the illustrated example includes only a single barrier 27 around each backside contact pad 25, in other variations two or more such barriers may be included, e.g. can be positioned concentrically. The backside contact pad and its surrounding barrier or barriers may form a shape similar to a "bull's eye" target, for example.

A continuous busbar or contact pad that extends substantially the length of the edge of the solar cell may also be surrounded by a barrier that prevents the spread of the conductive adhesive adhesive. For example, FIG. 2Q shows such a barrier 27 surrounding the backside busbar 25. The front busbar (eg, busbar 15 in FIG. 2A) may be surrounded by a barrier as well. Similarly, rows of front or back contact pads may be surrounded as a group by such barriers rather than being surrounded by separate barriers individually.

As just described, rather than surrounding the busbar or contact pad(s), the front metallization pattern or the back metallization pattern feature allows the busbar or contact pad to be positioned between the barrier and the overlapping edges of the solar cell. When held together, a barrier may be formed that extends substantially the length of the solar cell in a direction parallel to the edges of the solar cell. Such a barrier may serve a dual role as a bypass conductor (as described above). For example, in FIG. 2R, bypass conductor 40 provides a barrier that helps prevent uncured conductive adhesive adhesive on contact pad 15 from spreading onto the front active area of the solar cell. A similar arrangement can be used for the backside metallization pattern.

The barrier to the spread of the conductive adhesive adhesive may form a moat, as just described, away from the contact pads or busbars, but this is not required. Such a barrier may alternatively abut contact pads or busbars, for example as shown in FIG. 2O or 2P. In such variations, the barrier is preferably higher than the contact pads or busbars to keep uncured conductive adhesive adhesive on the contact pads or busbars. Although FIGS. 2O and 2P show a portion of the front metallization pattern, a similar arrangement can be used for the back metallization pattern.

A barrier to the spread of conductive adhesive adhesive and/or a moat between such barrier and the contact pad or bus bar, and any conductive adhesive adhesive spread within such moat, optionally Adjacent solar cells within a cell may lie in areas of the solar cell surface that overlap and thus may be hidden from view and shielded from exposure to solar radiation.

Alternatively, or in addition to the use of a barrier as just described, the electrically conductive bonding agent can be deposited using a mask or by any other suitable method (e.g. screen printing) to precisely A lower amount of electrically conductive bonding agent may be required, allowing for more flexible deposition and thus less likely to spread beyond the contact pad or become detached from the contact pad during deposition.

More generally, solar cell 10 may employ any suitable front and back metallization pattern.

FIG. 4A shows a portion of the front side of an exemplary rectangular supercell 100 including solar cells 10 as shown in FIG. 2A, arranged in a shingled configuration as shown in FIG. 1. As a result of the shingled geometry, there is no physical gap between pairs of solar cells 10. Additionally, the busbars 15 of the solar cells 10 at one end of the supercell 100 are visible, while the busbars (or front contact pads) of other solar cells are hidden beneath the overlapping portions of adjacent solar cells. As a result, supercell 100 efficiently uses the area it occupies within the solar module. In particular, a larger portion of that area carries electricity compared to conventionally tabbed solar cell arrangements and solar cell arrangements that include a large number of visible busbars on the illuminated surface of the solar cell. It can be used to generate. 4B-4C illustrate front and back views, respectively, of another exemplary supercell 100 that includes a plurality of primarily bevelled chevron rectangular silicon solar cells, but is otherwise similar to that of FIG. 4A. It shows.

In the example illustrated in FIG. 4A, bypass conductor 40 is hidden in the overlapping portion of adjacent cells. Alternatively, solar cells including bypass conductors 40 may be overlapped, similar to that shown in FIG. 4A, without covering the bypass conductors.

The exposed front busbar 15 at one end of the supercell 100 and the backside metallization of the solar cell at the other end of the supercell 100 connect the supercell to other supercells and/or other electrical components as desired. The supercell is provided with negative and positive (terminal) end contacts that can be used to electrically connect the supercell.

Adjacent solar cells within supercell 100 may overlap by any suitable amount, eg, about 1 millimeter (mm) to about 5 mm.

As shown in FIGS. 5A-5G, for example, shingled supercells such as those just described can efficiently fill the area of a solar module. Such solar modules may be square or rectangular, for example. Rectangular solar modules such as those illustrated in FIGS. 5A-5G have short sides that are, for example, about 1 meter in length and long sides that are, for example, about 1.5 to about 2.0 meters in length. It is possible. Any other suitable shape and size for solar modules may also be used. Any suitable arrangement of supercells within a solar module may be used.

Within a square or rectangular solar module, supercells are typically arranged in rows parallel to the short or long sides of the solar module. Each row may include one, two, or more supercells arranged end-to-end. A supercell 100 forming part of such a solar module may include any suitable number of solar cells 10 and may be of any suitable length. In some variations, supercells 100 each have a length approximately equal to the length of a short side of the rectangular solar module of which they are a part. In another variation, the supercells 100 each have a length approximately equal to half the length of the short side of the rectangular solar module of which they are a part. In another variation, the supercells 100 each have a length approximately equal to the length of a long side of the rectangular solar module of which they are a part. In another variation, the supercells 100 each have a length approximately equal to half the length of the long side of the rectangular solar module of which they are a part. The number of solar cells needed to make a supercell of these lengths depends, of course, on the dimensions of the solar module, the dimensions of the solar cells, and the amount of overlap between adjacent solar cells. Any other suitable length for the supercell may also be used.

In a variation in which the length of the supercell 100 is approximately equal to the length of the short side of the rectangular solar module, the supercell comprises, for example, 56 rectangular solar modules having dimensions of about 19.5 millimeters (mm) by about 156 mm. The cells may include approximately 3 mm of overlap between adjacent solar cells. Eight such rectangular solar cells can be separated from a conventional square or pseudo-square 156 mm wafer. Alternatively, such a supercell may include, for example, 38 rectangular solar cells having dimensions of about 26 mm by about 156 mm, with adjacent solar cells overlapping by about 2 mm. Six such rectangular solar cells can be separated from a conventional square or pseudo-square 156 mm wafer. In a variation in which the length of the supercell 100 is approximately equal to the length of half the short side of a rectangular solar module, the supercell may have dimensions of, for example, approximately 19.5 millimeters (mm) by approximately 156 mm. Rectangular solar cells may be included with adjacent solar cells overlapping by about 3 mm. Alternatively, such a supercell may include, for example, 19 rectangular solar cells having dimensions of about 26 mm by about 156 mm, with adjacent solar cells overlapping by about 2 mm.

In a variation in which the length of the supercell 100 is approximately equal to the length of the long side of a rectangular solar module, the supercell includes, for example, 72 rectangular solar cells having dimensions of approximately 26 millimeters (mm) by approximately 156 mm. , adjacent solar cells may include about 2 mm of overlap. In a variant in which the length of the supercell 100 is approximately equal to half the length of the long side of a rectangular solar module, the supercell comprises, for example, 36 rectangular solar cells having dimensions of approximately 26 mm by approximately 156 mm. Approximately 2 mm of adjacent solar cells may be included in an overlapping manner.

FIG. 5A shows an exemplary rectangular solar module 200 that includes twenty rectangular supercells 100, each having a length approximately equal to half the short side of the solar module. The supercells are arranged end-to-end in pairs to form ten supercell rows with the long sides of the supercells oriented parallel to the short sides of the solar module. It is formed in a state that In other variations, each supercell row may include three or more supercells. Also, similarly configured solar modules may include more or fewer supercell rows than shown in this example. (For example, FIG. 14A shows a solar module that includes 24 rectangular supercells arranged in 12 rows of 2 supercells each.)

In a variation where the supercells 100 in each row are arranged such that at least one of the supercells in each row has a front edge contact on the edge of the supercell adjacent to other supercells in that row, FIG. 5A A gap 210, shown in Figure 1, facilitates electrical contact with the supercell's front edge contacts (eg, exposed busbars or discontinuous contacts 15) along the centerline of the solar module. For example, two supercells in a row have one supercell with a front end contact along the centerline of the solar module and the other supercell with a back end contact along the centerline of the solar module. It can be placed in such a state. In such an arrangement, the two supercells in a row join to the front end contact of one supercell and to the back end contact of the other supercell, located along the centerline of the solar module. A series electrical connection may be made by an interconnect. (See, e.g., FIG. 8C, discussed below.) In variations where each supercell row includes three or more supercells, additional gaps between supercells may be present, as well as Electrical contact may be facilitated with front edge contacts located away from the sides.

FIG. 5B shows an exemplary rectangular solar module 300 that includes ten rectangular supercells 100, each having a length approximately equal to the length of the short side of the solar module. The supercells are arranged in ten parallel rows with their long sides oriented parallel to the short sides of the module. A similarly constructed solar module may include more or fewer rows of supercells of such side lengths than shown in this example.

5B also shows how the solar module 200 of FIG. 5A would look if there were no gaps between adjacent supercells in the multiple supercell rows within the solar module 200. Gap 210 in FIG. 5A can be eliminated, for example, by arranging the supercells such that both supercells in each row have back edge contacts along the centerline of the module. In this case, there is no need to access the front surfaces of the supercells along the center of the module, so that the supercells can be placed substantially abutting each other with little or no additional gap between them. Alternatively, two supercells 100 in a row may have one having a front edge contact along the edge of the module, a back edge contact along the centerline of the module, and one having a back edge contact along the module's centerline. Adjacent ends of the supercell can be placed overlapping, with a front end contact along the centerline and a back end contact along the opposite edge of the module. The flexible interconnect is sandwiched between the overlapping edges of the supercells without shading any part of the front side of the solar module, so that the front edge contact of one supercell and the back side of the other supercell An electrical connection may be provided to the end contacts. For rows containing three or more supercells, these two approaches can be used in combination.

The supercells and multiple supercell rows shown in FIGS. 5A-5B may be interconnected by any suitable combination of series and parallel electrical connections, for example, as further described below with respect to FIGS. 10A-15. Interconnections between supercells may be established using flexible interconnects, for example, as described below with respect to FIGS. 5C-5G and subsequent figures. As illustrated by many of the examples described herein, the supercells in the solar modules described herein are interconnected by a combination of series and parallel connections to those of conventional solar modules. may provide the module with an output voltage that is substantially the same as . In such cases, the output current from the solar module may also be substantially the same as that of a conventional solar module. Alternatively, as discussed further below, supercells within a solar module may be interconnected to provide a substantially higher output voltage from the solar module than provided by conventional solar modules.

FIG. 5C shows an exemplary rectangular solar module 350 that includes six rectangular supercells 100, each having a length approximately equal to the length of the long side of the solar module. The supercells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the module. A similarly constructed solar module may include more or fewer rows of supercells of such side lengths than shown in this example. In this example (and in some of the following examples) each supercell includes 72 rectangular solar cells each having a width equal to approximately 1/6 of the width of a 156 mm square or pseudo-square wafer. Any other suitable number of rectangular solar cells of any other suitable size may also be used. In this example, the front end contacts of the supercell electrically connect to each other with the flexible interconnect 400 positioned adjacent to and extending parallel to one short edge of the module. The back end contacts of the supercell are similarly connected to each other by flexible interconnects located at the rear of the solar module adjacent to and extending parallel to the other short edge. The interconnects on the back side are hidden from view in Figure 5C. This arrangement electrically connects six module length supercells in parallel. Details of flexible interconnects and their placement in this and other solar module configurations are described in more detail below with respect to FIGS. 6-8G.

FIG. 5D shows an exemplary rectangular solar module 360 that includes twelve rectangular supercells 100, each having a length approximately equal to half the length of the long side of the solar module. The supercells are arranged end-to-end in pairs to form six supercell rows with the rows and the long sides of the supercells oriented parallel to the long sides of the solar module. It is formed in a state that In other variations, each supercell row may include three or more supercells. Also, similarly configured solar modules may include more or fewer supercell rows than shown in this example. In this example (and in some of the following examples) each supercell includes 36 rectangular solar cells each having a width equal to approximately 1/6 of the width of a 156 mm square or pseudo-square wafer. Any other suitable number of rectangular solar cells of any other suitable size may also be used. Gap 410 facilitates establishing electrical contact to the front edge contact of supercell 100 along the centerline of the solar module. In this example, a flexible interconnect 400 located adjacent to and extending parallel to one short edge of the module electrically interconnects the front end contacts of six of the supercells. Similarly, flexible interconnects located at the rear of the module adjacent to and extending parallel to the other short edge of the module electrically connect the back end contacts of the other six supercells. . Flexible interconnects (not shown in this figure) positioned along gap 410 interconnect each pair of supercells in a row in series and optionally extend laterally to connect adjacent interconnect lines in parallel. This arrangement electrically connects six supercell rows in parallel. Optionally, within the first group of supercells, the first supercell in each row is electrically connected in parallel with the first supercell in each row of the other rows; The two supercells are electrically connected in parallel with a second supercell in each of the other rows, and the two groups of supercells are electrically connected in series. The latter arrangement allows each of the two groups of supercells to be individually paralleled with a bypass diode.

Detail A in FIG. 5D identifies the location of the cross-sectional view shown in FIG. 8A of the supercell back end contact interconnections along one short edge of the module. Detail B similarly locates the cross-sectional view shown in FIG. 8B of the supercell front end contact interconnections along the other short edge of the module. Detail C identifies the cross-sectional view shown in FIG. 8C of the series interconnection of supercells in rows along gap 410.

FIG. 5E shows a diagram of an exemplary rectangular solar module 370 configured similar to that of FIG. 5C. The difference is that in this example, all of the solar cells forming the supercell are chevron solar cells with chamfered corners that correspond to the corners of the pseudo-square wafer from which the solar cells were separated.

FIG. 5F shows another exemplary rectangular solar module 380 configured similar to that of FIG. 5C. The difference is that in this example, the solar cells forming the supercell include a mix of chevron solar cells and rectangular solar cells arranged to reproduce the shape of the pseudo-square wafer from which it was separated. In the example of FIG. 5F, the chevron solar cell and the rectangular solar cell have the same active area exposed to solar radiation during operation of the module, and therefore the currents are matched. The cells are wider in the direction perpendicular to their long axis and can compensate for the missing corners on the chevron cells.

FIG. 5G shows another exemplary rectangular solar module configured similarly to that of FIG. 5E (i.e., including only chevron solar cells). The difference is that in the solar module of FIG. 5G, adjacent chevron solar cells in a supercell are arranged as mirror images of each other such that their overlapping edges are of the same length. This maximizes the length of each overlapping connection, thereby facilitating heat flow through the supercell.

Other configurations of rectangular solar modules include one or more supercell rows formed only from rectangular (non-beveled) solar cells and one or more supercell rows formed only from beveled solar cells. cell rows. For example, a rectangular solar module may be constructed similar to that of FIG. 5C, except with two outer supercell rows each replaced with a supercell row formed only of beveled solar cells. The beveled solar cells in those rows may be arranged as mirror image pairs, for example, as shown in FIG. 5G.

In the exemplary solar modules shown in FIGS. 5C-5G, the rectangular solar cells that form the supercells have an active area that is approximately 1/6 of the active area of a conventionally sized solar cell, so that along each supercell row, The current generated is approximately 1/6 of the current in a conventional solar module of the same area. However, in these examples, because the six supercell rows are electrically connected in parallel, the exemplary solar module may produce a total current equal to the total current produced by a conventional solar module of the same area. This facilitates replacing conventional solar modules with the exemplary solar modules of FIGS. 5C-5G (and other examples discussed below).

FIG. 6 shows, in more detail than FIGS. 5C-5G, an exemplary arrangement of three supercell rows interconnecting by flexible electrical interconnects such that the supercells in each row are in series with each other and the rows are in parallel with each other. show. These may be, for example, the three rows in the solar module of FIG. 5D. In the example of FIG. 6, each supercell 100 has a flexible interconnect 400 conductively bonded to its front end contact and another flexible interconnect conductively bonded to its back end contact. The two supercells in each row are electrically connected in series by a shared flexible interconnect that conductively joins the front end contact of one supercell to the back end contact of the other supercell. Each flexible interconnect is positioned adjacent to and extends parallel to the edge of the supercell to which it joins, and extends laterally beyond the supercell in an adjacent row. Conductive bonds may be made to the flexible interconnects to electrically connect adjacent rows in parallel. The dotted line in FIG. 6 indicates the portion of the flexible interconnect that is hidden from view by the overlying portion of the supercell, or the portion of the supercell that is hidden from view by the portion that is overlying the flexible interconnect. Some are depicted.

The flexible interconnect 400 may be conductively bonded to the supercell, for example, by a mechanically compliant electrically conductive bonding agent as described above for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding agent is located only at discrete locations along the edge of the supercell, rather than in a continuous line extending substantially the length of the edge of the supercell. May reduce or accommodate stresses in a direction parallel to the edges of the supercell resulting from a mismatch between the coefficient of thermal expansion of the conductive bond or interconnect and the coefficient of thermal expansion of the supercell. obtain.

Flexible interconnect 400 may be formed from or include a thin copper plate, for example. The flexible interconnect 400 is optionally patterned or otherwise configured to increase mechanical compliance (flexibility) both perpendicular and parallel to the edges of the supercell. Stresses in directions perpendicular and parallel to the edges of the supercell resulting from a mismatch between the CTE of the interconnect and the CTE of the supercell may be reduced or accommodated. Such patterning may include, for example, slits, slots, or holes. The plurality of conductive portions of interconnect 400 have a thickness, for example, less than about 100 microns, less than about 50 microns, less than about 30 microns, or less than about 25 microns, to increase the flexibility of the interconnect. obtain. The mechanical compliance of the flexible interconnect and its bonding to the supercell is determined by the interconnecting supercell during the lamination process described in more detail below regarding how to fabricate shingled solar modules. It must be sufficient to withstand stress resulting from CTE mismatch and to withstand stress resulting from CTE mismatch during temperature cycling tests between about -40°C and about 85°C.

Preferably, the flexible interconnects 400 have a resistance to current flow in a direction parallel to the edges of the supercells to which they connect less than or equal to about 0.012 ohms, less than or equal to about 0.015 ohms. less than or equal to or less than or equal to about 0.01 ohm.

FIG. 7A shows several example configurations, identified by reference numbers 400A-400T, that may be suitable for flexible interconnect 400.

As shown in the cross-sectional views of FIGS. 8A-8C, for example, solar modules described herein typically include a supercell and one or more encapsulant materials 4101 with a transparent front sheet 420 and a back It includes a laminated structure sandwiched between the sheet 430 and the sheet 430 . The transparent front sheet can be, for example, glass. Optionally, the backsheet may also be transparent, which may enable bifacial operation of the solar module. The back sheet can be, for example, a polymer sheet. Alternatively, the solar module may be a glass-glass module where both the front and back sheets are glass.

The cross-sectional view of FIG. 8A (detail A from FIG. 5D) shows the conductive bond to the back end contact of the supercell near the edge of the solar module, hidden from view from the front of the solar module, and inside below the supercell. An example of an extended flexible interconnect 400 is shown. An additional strip of encapsulant may be placed between the interconnect 400 and the backside of the supercell as shown.

The cross-sectional view of FIG. 8B (Detail B from FIG. 5B) shows an example of a flexible interconnect 400 conductively bonding to the front end contact of the supercell.

The cross-sectional view of FIG. 8C (detail C from FIG. 5B) shows two supercells electrically coupled in series with the front end contact of one supercell and the back end contact of the other supercell. 4 shows an example of a shared flexible interconnect 400 that connects.

The flexible interconnects that electrically connect to the front end contacts of the supercell may be constructed or arranged to occupy only a narrow width of the front side of the solar module, which may be located, for example, adjacent the edges of the solar module. The area on the front side of the module occupied by such interconnects may be narrow, for example, ≦about 10 mm, ≦about 5 mm, or ≦about 3 mm in width in a direction perpendicular to the edges of the supercell. In the arrangement shown in FIG. 8B, for example, flexible interconnect 400 may be configured to extend beyond the edge of the supercell by such a distance or less. 8D-8G illustrate additional examples of arrangements in which the flexible interconnects that electrically connect to the front end contacts of the supercell may occupy only a narrow width of the front side of the module. Such an arrangement facilitates efficient use of the front surface area of the module for electricity generation.

FIG. 8D shows a flexible interconnect 400 conductively bonded to the distal front contact of the supercell and folded around the edge of the supercell to the back of the supercell. An insulating film 435, which may be pre-coated on the flexible interconnect 400, may be disposed between the flexible interconnect 400 and the backside of the supercell.

FIG. 8E shows a flexible interconnect 400 that includes a thin narrow ribbon 440 conductively bonded to the distal front surface contact of the supercell and to a thin wide ribbon 445 extending behind the backside of the supercell. An insulating film 435, which may be pre-coated on the ribbon 445, may be disposed between the ribbon 445 and the backside of the supercell.

FIG. 8F shows a flexible interconnect 400 that is joined to the terminal front contact of the supercell and is rolled and pressed into a flat coil that occupies only the narrow width of the front face of the solar module.

FIG. 8G shows a flexible interconnect 400 that includes a thin ribbon section conductively bonding to the distal front contact of the supercell and a thicker cross-sectional portion located adjacent to the supercell.

8A-8G, flexible interconnect 400 may extend along the entire length of the edge of the supercell (eg, toward the page of the drawing), as shown in FIG. 6, for example.

Optionally, a portion of the flexible interconnect 400 that would otherwise be visible from the front of the module may be covered with a dark film or coating, or otherwise colored, to provide normal color vision. This can reduce the visible contrast between the interconnect and the supercell as perceived by a person with . For example, in FIG. 8C, an optional black film or coating 425 covers a portion of interconnect 400 that would otherwise be visible from the front of the module. Portions of interconnect 400 that are otherwise visible in other figures may similarly be covered or colored.

Conventional solar modules typically include three or more bypass diodes, with each bypass diode connected in parallel with a series-connected group of 18 to 24 silicon solar cells. This is done to limit the amount of power that can be dissipated as heat in a reverse biased solar cell. Solar cells may become reverse biased due to, for example, defects, dirty front surfaces, or uneven illumination that reduce the ability to pass the current generated in the strings. The heat produced by a reverse biased solar cell depends on the voltage across the solar cell and the current flowing through the solar cell. If the voltage across a reverse biased solar cell exceeds the breakdown voltage of the solar cell, the heat dissipated within the cell will be equal to the breakdown voltage times the total current produced in the string. . Silicon solar cells typically have a breakdown voltage of 16 to 30 volts. Since each silicon solar cell produces a voltage of about 0.64 volts in operation, a string of more than 24 solar cells can produce a voltage above the breakdown voltage on a reverse biased solar cell.

In traditional solar modules, where the solar cells are separated from each other and interconnected by ribbons, it is not easy to transfer heat away from the hot solar cells. As a result, the power dissipated in a solar cell subjected to a breakdown voltage can create hot spots within the solar cell, causing significant thermal damage and possibly ignition. Therefore, in a conventional solar module, a bypass diode is installed in each group of 18 to 24 series-connected solar cells to ensure that no solar cell in the string can be reverse biased above its breakdown voltage. is necessary.

Applicants have discovered that heat is easily transferred along silicon supercells through thin electrically and thermally conductive junctions between adjacent and overlapping silicon solar cells. Additionally, the supercells described herein are typically shingled with rectangular solar cells, each having an active area (e.g., 1/6) smaller than the active area of a conventional solar cell. Because the current flow through the supercells in the solar modules described herein is typically less than the current flow through a string of conventional solar cells. Furthermore, the rectangular aspect ratio of the solar cells typically employed herein increases the area of thermal contact between adjacent solar cells. As a result, less heat is dissipated in reverse-biased solar cells at breakdown voltage, and heat spreads more easily through supercells and solar modules without creating dangerous hot spots. Applicants have therefore found that solar modules formed from supercells such as those described herein can employ far fewer bypass diodes than previously thought necessary.

For example, in some variations of solar modules as described herein, N>25 solar cells, N≧about 30 solar cells, N≧about 50 solar cells, N≧about 70 solar cells, solar cells, or a supercell containing N≧about 100 solar cells, in which a single solar cell, or a group of fewer than N solar cells, is individually electrically connected in parallel with a bypass diode within the supercell. You can be hired without having to do anything. Optionally, the entire supercell of these lengths may be electrically connected in parallel with a single bypass diode. Optionally, supercells of these lengths may be employed without bypass diodes.

Several additional and optional design features make solar modules employing supercells as described herein more resistant to heat dissipated in reverse biased solar cells. It can be taken as a thing. Referring again to FIGS. 8A-8C, the encapsulant 4101 can be or include a thermoplastic olefin (TPO) polymer. TPO encapsulants are more photothermally stable than standard ethylene vinyl acetate (EVA) encapsulants. EVA browns with temperature and UV light, leading to problems with hot spots caused by batteries limiting current. These issues are alleviated or avoided with TPO encapsulation. Additionally, the solar module may have a glass-glass construction where both the transparent front sheet 420 and back sheet 430 are glass. Such glass-to-glass allows solar modules to safely operate at higher temperatures than traditional polymer backsheets can withstand. Furthermore, the junction box may be mounted on one or more edges of the solar module rather than at the rear of the solar module. Here the junction box would add an additional layer of thermal isolation to the module solar cells above it.

FIG. 9A shows an exemplary rectangular solar module including six rectangular shingled supercells arranged in six rows extending the length of the long sides of the solar module. The six supercells are electrically connected in parallel to each other and to bypass diodes located in a junction box 490 on the backside of the solar module. Electrical connection between the supercell and the bypass diode is established through ribbons 450 embedded in the module's stacked structure.

FIG. 9B shows another exemplary rectangular solar module including six rectangular shingled supercells arranged in six rows extending the length of the long sides of the solar module. Supercells are electrically connected to each other in parallel. Separate positive terminal junction boxes 490P and negative terminal junction boxes 490N are disposed on the backside of the solar module at opposing ends of the solar module. The supercell is electrically connected in parallel to a bypass diode located in one of the junction boxes by an external cable 455 extending between the junction boxes.

Figures 9C-9D show six rectangular shingled supercells arranged in six rows extending the length of the long side of the solar module in a stacked structure including front and back sheets of glass. 1 illustrates an exemplary glass-to-glass rectangular solar module including a glass-to-glass rectangular solar module. Supercells are electrically connected to each other in parallel. Separate positive terminal junction boxes 490P and negative terminal junction boxes 490N are attached to opposing edges of the solar module.

The shingled supercell is unique for module layout with respect to module-level power management devices (e.g., DC/AC microinverters, DC/DC module power optimizers, voltage intelligence and smart switches, and related devices). create opportunities. The main feature of module-level power management systems is power optimization. Supercells, such as those described and employed herein, can generate higher voltages than traditional panels. In addition, the supercell module layout may further divide the modules. Both higher voltage and further partitioning create potential benefits for power optimization.

FIG. 9E shows one example structure for module-level power management using shingled supercells. In this figure, an exemplary rectangular solar module includes six rectangular shingled supercells arranged in six rows extending the length of the long side of the solar module. The three pairs of supercells are individually connected to a power management system 460, which allows for more individualized power optimization of the module.

FIG. 9F shows another example structure for module-level power management using shingled supercells. In this figure, an exemplary rectangular solar module includes six rectangular shingled supercells arranged in six rows extending the length of the long side of the solar module. The six supercells are individually connected to a power management system 460, which allows even more individualized power optimization of the modules.

FIG. 9G shows another example structure for module-level power management using shingled supercells. In this figure, an exemplary rectangular solar module includes six or more rectangular shingled supercells 998 arranged in six or more rows. Here, three or more supercell pairs are individually connected to a bypass diode or power management system 460 to enable even more individualized power optimization of the module.

FIG. 9H shows another example structure for module-level power management using shingled supercells. In this figure, an exemplary rectangular solar module includes six or more rectangular shingled supercells 998 arranged in six or more rows. Here, every two supercells are connected in series, and all pairs are connected in parallel. A bypass diode or power management system 460 is connected in parallel with all pairs, allowing power optimization of the module.

In some variations, module-level power management makes it possible to eliminate all bypass diodes on the solar module while still eliminating the risk of hot spots. This is achieved by integrating voltage intelligence at the module level. By monitoring the voltage output of a solar cell circuit (e.g., one or more supercells) within a solar module, a "smart switch" power management device determines whether the circuit contains any reverse-biased solar cells. I can do it. If a reverse biased solar cell is detected, the power management device can disconnect the corresponding circuit from the electrical system using, for example, a relay switch or other component. For example, if the voltage of a monitored solar cell circuit falls below a predetermined threshold (V _Limit ), the power management device shuts off that circuit while ensuring that the module or string of modules remains connected. (open the circuit).

In certain embodiments, when a circuit's voltage drops by more than a certain percentage or magnitude (eg, 20% or 10V) than other circuits in the same solar array, that circuit will be shut off. The electronic equipment will detect this change based on inter-module communication.

Such voltage intelligence embodiments can be incorporated into existing module-level power management solutions (e.g., from Enphase Energy Inc., Solaredge Technologies, Inc., Tigo Energy, Inc.) or through custom circuit design. obtain.

An example of how the V _Limit threshold voltage may be calculated is:
CellVoc _{@Low Irr & High Temp} ×N _{number of cells in series} -Vrb _{Reverse breakdown voltage} ≦V _Limit
It is. here,
●CellVoc _{@Low Irr & High Temp} = Open circuit voltage of a cell operating at low irradiance and high temperature (lowest expected operating Voc).
●N _{number of cells in series} = number of cells connected in series within each supercell being monitored.
●Vrb _{Reverse breakdown voltage} = Reverse polarity voltage required to pass current through the battery.

This approach to module-level power management using smart switches allows for example more than 100 silicon solar cells to be connected in series within a single module without affecting the safety or reliability of the module. may be possible. In addition, such smart switches can be used to limit string voltage towards the central inverter. Therefore, longer strings of modules can be installed without safety or tolerance concerns about overvoltage. If the string voltage increases against the limit, the weakest module can be bypassed (switched off).

10A, 11A, 12A, 13A, 13B and 14B, discussed below, provide additional exemplary electrical schematic diagrams for solar modules employing shingled supercells. Figures 10B-1, 10B-2, 11B-1, 11B-2, 11C-1, 11C-2, 12B-1, 12B-2, 12C-1, 12C-2, 12C-3, 13C-1, 13C -2, 14C-1 and 14C-2 provide exemplary physical layouts corresponding to their schematic circuit diagrams. The physical layout description assumes that the front edge contact of each supercell has a negative polarity and the back edge contact of each supercell has a positive polarity. If the module instead employs a supercell with a front end contact having a positive polarity and a back end contact having a negative polarity, the following description of the physical layout may include swapping the positive and negative poles, and This can be changed by reversing the orientation of the bypass diodes. Some of the various buses mentioned in the descriptions of these figures may be formed, for example, in the interconnect 400 described above. Other buses described in these figures may be implemented, for example, with ribbons embedded in the stacked structure of the solar module or with external cables.

FIG. 10A is an exemplary schematic electrical diagram of a solar module as illustrated in FIG. 5B, including ten rectangular supercells 100, each having a length approximately equal to the length of the short side of the solar module. shows. The supercells are placed in the solar module with their long sides oriented parallel to the short sides of the module. All of the supercells are electrically connected in parallel with a bypass diode 480.

10B-1 and 10B-2 illustrate example physical layouts of the solar module of FIG. 10A. Bus 485N connects the negative (front) end contact of supercell 100 to the positive terminal of bypass diode 480 in junction box 490 located on the back side of the module. Bus 485P connects the positive (back) end contact of supercell 100 to the negative terminal of bypass diode 480. Bus 485P may lie entirely behind the supercell. Bus 485N and/or its interconnections to the supercell occupy a portion of the front of the module.

FIG. 11A is an exemplary schematic electrical diagram of a solar module such as that illustrated in FIG. The circuit diagram shows supercells arranged end-to-end in pairs to form ten supercell rows. The first supercell in each row is connected in parallel with the first supercells in other rows and in parallel with the bypass diode 500. The second supercell in each row is connected in parallel with the second supercells in other rows and in parallel with bypass diodes 510. The two groups of supercells are connected in series like two bypass diodes.

11B-1 and 11B-2 illustrate example physical layouts of the solar module of FIG. 11A. In this layout, the first supercell in each row has its front (negative) end contact along the first side of the module, its back (positive) end contact along the centerline of the module, and The second supercell has a front (negative) end contact along the centerline of the module, and a back (positive) end contact along the second side of the module opposite the first side. . Bus 515N connects the front (negative) end contact of the first supercell of each row to the positive terminal of bypass diode 500. Bus 515P connects the back (positive) end contact of the second supercell in each row to the negative terminal of bypass diode 510. Bus 520 connects the back (positive) end contact of the first supercell in each row and the front (negative) end contact of the second supercell in each row to the negative terminal of bypass diode 500 and the positive terminal of bypass diode 510. do.

Bus 515P may lie entirely behind the supercell. Bus 515N and/or its interconnections to the supercell occupy part of the front side of the module. The bus 520 occupies a portion of the front of the module and may require a gap 210 as shown in FIG. 5A. Alternatively, bus 520 may lie entirely behind the supercell and electrically connect to the supercell with hidden interconnects sandwiched between overlapping ends of the supercell. In such cases, little or no gap 210 is required.

11C-1, 11C-2, and 11C-3 illustrate other exemplary physical layouts of the solar module of FIG. 11A. In this layout, the first supercell in each row has its front (negative) end contact along the first side of the module, its back (positive) end contact along the centerline of the module, and the first supercell in each row. In the 2 supercell, the back surface (positive electrode) end contact portion is along the center line of the module, and the front surface (negative electrode) end contact portion is along the second side of the module opposite to the first side. Bus 525N connects the front (negative) end contact of the first supercell of each row to the positive terminal of bypass diode 500. Bus 530N connects the front (negative) end contact of the second battery in each row to the negative terminal of bypass diode 500 and the positive terminal of bypass diode 510. Bus 535P connects the back (positive) end contact of the first battery in each row to the negative terminal of bypass diode 500 and the positive terminal of bypass diode 510. Bus 540P connects the back (positive) end contact of the second battery in each row to the negative terminal of bypass diode 510.

Bus 535P and bus 540P may lie entirely behind the supercell. Bus 525N and bus 530N and/or their interconnections to the supercell occupy a portion of the front side of the module.

FIG. 12A shows another exemplary embodiment of a solar module such as that illustrated in FIG. A schematic circuit diagram is shown in which supercells are arranged end-to-end in pairs to form ten supercell rows. In the circuit shown in FIG. 12A, the supercells are arranged in four groups. In the first group, the top five rows of first supercells are connected in parallel with each other and with bypass diodes 545. In the second group, the top five rows of second supercells are connected in parallel with each other and with bypass diodes 505. In the third group, the first supercells of the bottom five rows are connected in parallel with each other and with bypass diodes 560. In the fourth group, the second supercells in the bottom five rows are connected in parallel with each other and with bypass diodes 555. Those four groups of supercells are connected in series with each other. A fourth bypass diode is also in series.

12B-1 and 12B-2 illustrate example physical layouts of the solar module of FIG. 12A. In this layout, the first group of supercells have their front (negative) end contacts along the first side of the module, the back (positive) end contacts along the centerline of the module, and the second group of supercells have their front (negative) end contacts along the first side of the module; The supercell has a front (negative) end contact along the center line of the module, a back (positive) end contact along the second side of the module opposite the first side, and a third group. The supercells in the fourth group have the back (positive) end contact along the first side of the module, the front (negative) end contact along the centerline of the module, and the fourth group of supercells have the back (positive) end contact along the module centerline. The positive (positive) end contact is along the centerline of the module, and the front (negative) end contact is along the second side of the module.

Bus 565N connects the front (negative) end contacts of the supercells in the first group of supercells to each other and to the positive terminal of bypass diode 545. The bus 570 connects the back side (positive electrode) end contacts of the supercells included in the first group of supercells and the front side (negative electrode) end contacts of the supercells included in the second group of supercells to each other. to the negative terminal and to the positive terminal of bypass diode 550. The bus 575 connects the back side (positive electrode) end contact portions of the supercells included in the second group of supercells and the front side (negative electrode) end contact portions of the supercells included in the fourth group of supercells to each other. to the negative terminal and to the positive terminal of bypass diode 555. The bus 580 connects the back side (positive electrode) end contact portions of the supercells included in the fourth group of supercells and the front side (negative electrode) end contact portions of the supercells included in the third group of supercells to each other and the bypass diode 555. to the negative terminal and to the positive terminal of bypass diode 560. Bus 585P connects the back (positive) end contacts of the supercells included in the third group of supercells to each other and to the negative terminal of bypass diode 560.

Bus 585P and the portion of bus 575 that connects to the supercells of the second group of supercells may lie entirely behind the supercells. The remaining portions of bus 575 and bus 565N and/or their interconnections to the supercell occupy a portion of the front of the module.

Buses 570 and 580 occupy a portion of the front of the module and may require a gap 210 as shown in FIG. 5A. Alternatively, they may lie entirely behind the supercell and electrically connect to the supercell with hidden interconnects sandwiched between overlapping ends of the supercell. In such cases, little or no gap 210 is required.

12C-1, 12C-2 and 12C-3 illustrate alternative physical layouts of the solar module of FIG. 12A. This layout uses two junction boxes 490A and 490B instead of the single junction box 490 shown in Figures 12B-1 and 12B-2, but is otherwise equivalent to that of Figures 12B-1 and 12B-2. It is.

FIG. 13A shows another exemplary embodiment of a solar module such as that illustrated in FIG. A schematic circuit diagram is shown in which supercells are arranged end-to-end in pairs to form ten supercell rows. In the circuit shown in FIG. 13A, the supercells are arranged in four groups. In the first group, the top five rows of first supercells are connected in parallel to each other. In the second group, the top five rows of second supercells are connected in parallel to each other. In the third group, the first supercells in the bottom five rows are connected in parallel to each other. In the fourth group, the bottom five rows of second supercells are connected in parallel to each other. The first group and the second group are connected in series with each other and therefore in parallel with the bypass diode 590. The third group and the fourth group are connected in series with each other and therefore in parallel with other bypass diodes 595. The first group and the second group are connected in series with the third group and the fourth group, and the two bypass diodes are also connected in series.

13C-1 and 13C-2 illustrate example physical layouts of the solar module of FIG. 13A. In this layout, the first group of supercells have their front (negative) end contacts along the first side of the module, the back (positive) end contacts along the centerline of the module, and the second group of supercells have their front (negative) end contacts along the first side of the module; The supercell has a front (negative) end contact along the center line of the module, a back (positive) end contact along the second side of the module opposite the first side, and a The three groups of supercells have their back (positive) end contacts along the first side of the module, their front (negative) end contacts along the centerline of the module, and the fourth group of supercells have , the back surface (positive electrode) end contact portion is along the center line of the module, and the front surface (negative electrode) end contact portion is along the second side of the module.

Bus 600 connects the front (negative) end contacts of the first group of supercells to each other, to the back (positive) end contacts of the third group of supercells, to the positive terminal of bypass diode 590 , and to the positive terminal of bypass diode 595 . Connect to negative terminal. Bus 605 connects the back (positive) end contacts of the first group of supercells to each other and to the front (negative) end contacts of the second group of supercells. Bus 610P connects the back (positive) end contacts of the second group of supercells to each other and to the negative terminal of bypass diode 590. Bus 615N connects the front (negative) end contacts of the fourth group of supercells to each other and to the positive terminal of bypass diode 595. Bus 620 connects the front (negative) end contacts of the third group of supercells to each other and to the back (positive) end contacts of the fourth group of supercells.

Bus 610P and the portion of bus 600 that connects to the supercells included in the third group of supercells may lie entirely behind the supercells. The remaining portions of bus 600 and bus 615N and/or their interconnections to the supercell occupy a portion of the front of the module.

Bus 605 and bus 620 occupy a portion of the front of the module and require a gap 210 as shown in Figure 5A. Alternatively, they may lie entirely behind the supercell and electrically connect to the supercell with hidden interconnects sandwiched between overlapping ends of the supercell. In such cases, little or no gap 210 is required.

FIG. 13B shows an exemplary schematic electrical diagram of a solar module such as that illustrated in FIG. Contains a rectangular supercell 100. The supercells are placed in the solar module with their long sides oriented parallel to the short sides of the module. In the circuit shown in FIG. 13B, the supercells are arranged in two groups. In the first group, the top five supercells are connected in parallel with each other and with bypass diode 590, and in the second group, the bottom five supercells are connected in parallel with each other and with bypass diode 595. Connect to. The two groups are connected in series with each other. A bypass diode is also connected in series.

The schematic circuit of FIG. 13B differs from that of FIG. 13A in that each row of the two supercells of FIG. 13A is replaced with a single supercell. As a result, the physical layout of the solar module of FIG. 13B may be as shown in FIGS. 13C-1, 13C-2, and 13C-3, with bus 605 and bus 620 omitted.

FIG. 14A shows an exemplary rectangular solar module 700 that includes 24 rectangular supercells 100, each having a length approximately equal to half the short side of the solar module. The supercells were arranged end-to-end in pairs to form 12 supercell rows with the long sides of the supercells oriented parallel to the short sides of the solar module. It is formed in the state.

FIG. 14B shows an exemplary schematic circuit diagram of a solar module as illustrated in FIG. 14A. In the circuit shown in FIG. 14B, the supercells are arranged in three groups. In the first group, the top eight rows of first supercells are connected in parallel with each other and with bypass diodes 705, and in the second group, the bottom four rows of supercells are connected with each other and in parallel with bypass diodes 705. In the third group, the top eight rows of second supercells are connected in parallel with each other and with bypass diodes 715 . The three groups of supercells are connected in series. Three bypass diodes are also in series.

14C-1 and 14C-2 illustrate example physical layouts of the solar module of FIG. 14B. In this layout, the first group of supercells have front (negative) end contacts along the first side of the module and back (positive) end contacts along the centerline of the module. In the second group of supercells, the first supercell in each of the four bottom rows has a back (positive) end contact along the first side of the module and a front (negative) end contact. The second supercell included in each of the four bottom rows has its front (negative) end contact along the module centerline, and its back (positive) end contact A contact portion is along a second side of the module opposite the first side. In the third solar cell group, the back surface (positive electrode) end contact portion is along the center line of the module, and the back surface (negative electrode) end contact portion is along the second side of the module.

Bus 720N connects the front (negative) end contacts of the first group of supercells to each other and to the positive terminal of bypass diode 705. Bus 725 connects the back (positive) end contacts of the first group of supercells to the front (negative) end contacts of the second group of supercells, the negative terminal of bypass diode 705 , and the positive terminal of bypass diode 710 . Connect to the terminal. Bus 730P connects the back (positive) end contacts of the third group of supercells to each other and to the negative terminal of bypass diode 715. Bus 735 connects the front (negative) end contacts of the third group of supercells to each other, to the back (positive) end contacts of the second group of supercells, to the negative terminal of bypass diode 710 , and to the negative terminal of bypass diode 715 . Connect to positive terminal.

The portion of bus 725 that connects to the supercells included in the first group of supercells, the bus 730P, and the portion of bus 735 that connects to the supercells that are included in the second group of supercells are as follows: It can lie behind the supercell. Bus 720N, the remaining portions of bus 725 and bus 735, and/or their interconnections to the supercell occupy a portion of the front side of the module.

Some of the examples described above house bypass diodes in one or more junction boxes on the backside of the solar module. However, this is not necessary. For example, some or all of the bypass diodes may be positioned around the solar module or in-plane with the supercells in the gaps between the supercells, or positioned behind the supercells. In such a case, the bypass diode may be arranged in a stacked structure in which the supercell is encapsulated, for example. Therefore, the location of the bypass diodes is distributed and removed from the junction box, located in the central junction box containing both the positive module terminal and the negative module terminal, for example on the back side of the solar module near the outer edge of the solar module. This may facilitate replacement with two separate single-terminal junction boxes obtained. This technique typically shortens the length of current paths in ribbon conductors within solar modules and in cable runs between solar modules, both of which reduce material costs and reduce resistive power losses. ) can increase the power of the module.

Referring to FIG. 15, the physical layout of the various electrical interconnections of a solar module, such as that illustrated in FIG. 5B with the schematic circuit diagram of FIG. 10A, includes bypass diodes 480 located within the supercell stack structure. and two single terminal junction boxes 490P and 490N may be employed. FIG. 15 may be best understood by comparison with FIGS. 10B-1 and 10B-2. The layouts of other modules described above may be similarly modified.

The use of in-stack bypass diodes as just described may be facilitated by the use of reduced current (reduced area) rectangular solar cells as described above. This is because with a reduced current solar cell, the power dissipated in the forward biased bypass diode may be lower than the power that would be dissipated with a conventionally sized solar cell. Therefore, the bypass diodes in the solar modules described herein may absorb less heat than before and, as a result, can be moved out of the junction box on the back side of the module and into the stack.

A single solar module may support two or more electrical configurations, e.g., interconnects, other conductors, and/or such that a single solar module may support two or more electrical configurations as described above. A bypass diode may be included. In such cases, the particular configuration for operation of the solar module may be selected from two or more alternatives, for example in conjunction with the use of switches and/or jumpers. Between different configurations, the number of supercells in series and/or parallel may vary to provide different combinations of voltage and current output from the solar module. Such solar modules can therefore be configured to choose between two or more different voltage and current combinations, e.g. between a high voltage and low current configuration and a low voltage and high current configuration. It may be configurable at the factory or in the field to do so.

FIG. 16 shows an example placement of a smart switch module level power management device 750, as described above, between two solar modules.

Referring now to FIG. 17, an exemplary method 800 for making a solar module as disclosed herein includes the following steps. At step 810, conventional sized solar cells (eg, 156 mm x 156 mm or 125 mm x 125 mm) are cut and/or cleaved to form a plurality of narrow rectangular solar cell "strips." (See also, eg, FIGS. 3A-3E and related discussion above). The resulting solar cell strips can optionally be tested and sorted according to current-voltage performance. Batteries with matched or nearly matched current-voltage performance may advantageously be used within the same supercell or within the same row of series-connected supercells. For example, cells connected in series within a supercell or within a supercell row may advantageously produce matched or approximately matched currents under the same illumination.

At step 815, a supercell is assembled from the strip solar cells with a conductive adhesive adhesive disposed between overlapping portions of adjacent solar cells within the supercell. Conductive adhesive binders can be applied by, for example, inkjet printing or screen printing.

At step 820, heat or pressure is applied to cure or partially cure the conductive adhesive bond between the solar cells within the supercell. In one variant, when each additional solar cell is added to a supercell, between the newly added solar cell and its adjacent and overlapping solar cell (which is already part of the supercell) The conductive adhesive adhesive is allowed to cure or partially cure before the next solar cell is added to the supercell. In other variations, more than two solar cells, or all solar cells in a supercell, may be positioned in a desired overlapping manner before the conductive adhesive adhesive is cured or partially cured. The supercells resulting from this process can optionally be tested and sorted according to current-voltage performance. Supercells with matched or approximately matched current-voltage performance may advantageously be used within the same supercell row or within the same solar module. For example, it may be advantageous for supercells or multiple supercell rows electrically connected in parallel to produce matched or approximately matched voltages under the same illumination.

In step 825, the cured or partially cured supercell is assembled in a desired modular configuration within a layered structure including an encapsulant material, a transparent front (solar side) sheet, and an (optionally transparent) back sheet. arranged and interconnected. The layered structure may include, for example, a first layer of encapsulant on a glass substrate, interconnecting supercells placed solar side down on the first layer of encapsulant, and a second layer of encapsulant on the layer of supercells. , and a backsheet on the second layer of encapsulant. Any other suitable arrangement may also be used.

In a lamination step 830, heat and pressure are applied to the layered structure to form a hardened layered structure.

In one variation of the method of FIG. 17, conventional sized solar cells are separated into a plurality of solar cell strips, and a conductive adhesive bonding agent is then applied to each individual solar cell strip. In an alternative variation, a conductive adhesive adhesive is applied to conventional sized solar cells before the solar cells are separated into multiple solar cell strips.

In the curing step 820, the conductive adhesive adhesive may be fully cured or only partially cured. In the latter case, the conductive adhesive binder may first be partially cured in step 820 sufficiently to facilitate supercell handling and interconnection, and fully cured during the subsequent lamination step 830.

In some variations, the supercell 100 assembled as an intermediate product in the method 800 has the long sides of adjacent solar cells overlapping and conductively bonded as described above, and the plurality of interconnects forming the supercell includes a plurality of rectangular solar cells 10 disposed with opposing ends of the solar cells 10 joined to terminal contacts.

FIG. 30A shows an exemplary supercell with electrical interconnects joined to front and back end contacts. Electrical interconnects extend parallel to the distal edges of the supercells and extend laterally beyond the supercells to facilitate electrical interconnections with adjacent supercells.

FIG. 30B shows two of the supercells of FIG. 30A interconnecting in parallel. Portions of the interconnects that would otherwise be visible from the front of the module may be covered or colored (e.g., darkened) so that the interconnects are perceived by a person with normal color vision. This can reduce the visible contrast between the connection and the supercell. In the example illustrated in FIG. 30A, interconnect 850 is conductively bonded to a front end contact of a first polarity (e.g., + or -) at one end of the supercell (on the right side of the drawing) and to the other interconnect. Connection 850 conductively joins the opposite polarity rear end contact at the other end of the supercell (on the left side of the drawing). Similar to the other interconnects described above, interconnect 850 may be conductively bonded to the supercell using, for example, the same conductive adhesive bond between the solar cells, although this is not required. In the illustrated example, a portion of each interconnect 850 extends beyond the edge of supercell 100 in a direction perpendicular to the long axis of the supercell (and parallel to the long axis of solar cell 10). do. As shown in FIG. 30B, this allows two or more supercells 100 to overlap and conductively bond the interconnects 850 of one supercell to the corresponding interconnects 850 on an adjacent supercell. , allowing two supercells to be positioned side by side in electrical interconnection in parallel. Several such interconnects 850 interconnecting in series as just described may form a bus for the module. This arrangement may be suitable, for example, if the individual supercells extend across the entire width or length of the module (eg, FIG. 5B). Additionally, interconnect 850 may be used to electrically connect end contacts of two adjacent supercells in series in a supercell row. Pairs or longer strings of such interconnecting supercells within a row overlap the interconnects 850 of one row with the interconnects 850 of an adjacent row, similar to those shown in FIG. 30B. Conductive junctions may provide electrical connections in parallel with similarly interconnecting supercells in adjacent rows.

Interconnect 850 may be die-cut from a conductive sheet, for example, and optionally patterned to increase its mechanical compliance in directions both perpendicular and parallel to the supercell edges to Stresses in directions perpendicular and parallel to the edges of the supercell resulting from a mismatch between the CTE of the connection and the CTE of the supercell may be reduced or accommodated. Such patterning may include, for example, slits, slots, or holes (not shown). The mechanical compliance of interconnect 850 and its bond or bonds to the supercell ensures that the connection to the supercell withstands stresses resulting from CTE mismatch during the lamination process described in more detail below. should be sufficient to ensure that The interconnect 850 may be bonded to the supercell by, for example, a mechanically compliant electrically conductive bonding agent as described above for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding agent is located only at discrete locations along the edge of the supercell, rather than in a continuous line extending substantially the length of the edge of the supercell. May reduce or accommodate stresses in a direction parallel to the edges of the supercell resulting from a mismatch between the coefficient of thermal expansion of the conductive bond or interconnect and the coefficient of thermal expansion of the supercell. obtain.

Interconnects 850 may be cut from a thin copper plate, for example, and may be compared to conventional May be thinner than conductive interconnects. For example, interconnect 850 may be formed from a copper plate with a thickness of about 50 microns to about 300 microns. Interconnects 850, like the interconnects described above, can be thin enough and highly flexible to allow folding around and behind the edges of the supercells to which they join.

19A-19D illustrate some example arrangements in which heat and pressure may be applied during method 800 to cure or partially cure the conductive adhesive bond between adjacent solar cells in a supercell. . Any other suitable arrangement may also be employed.

In FIG. 19A, heat and localized pressure are applied to cure or partially cure the conductive adhesive bonding agent 12, one joint (overlapping area) at a time. The supercell may be supported by a surface 1000 and pressure may be applied mechanically to the connections from above, for example by bars, pins or other mechanical contacts. Heating may be applied to the connection, for example by hot air (or other hot gas), by an infrared light bulb, or by heating mechanical contacts that apply localized pressure to the connection. It can be done.

In FIG. 19B, the arrangement of FIG. 19A is extended to a batch process in which multiple connections within the supercell are simultaneously heated and locally pressurized.

In FIG. 19C, an uncured supercell is sandwiched between a release liner 1015 and a reusable thermoplastic sheet 1020 and positioned on a carrier plate 1010 supported by a surface 1000. The thermoplastic material of sheet 1020 is selected to melt at the temperature at which the supercells are cured. Release liner 1015 may be formed from fiberglass and PTFE, for example, and will not stick to the supercell after the curing process. Preferably, the release liner 1015 is formed from a material having a CTE that matches or substantially matches the coefficient of thermal expansion (eg, the CTE of silicon) of the solar cell. This is because if the CTE of the release liner is too different from the CTE of the solar cell, the solar cell and release liner will lengthen by different amounts during the curing process, which will cause the supercell to lengthen at the junction. This is because they will tend to be pulled apart in the horizontal direction. A vacuum bladder 1005 overlies this arrangement. The uncured supercell is heated from below, for example through surface 1000 and carrier plate 1010, and a vacuum is drawn between bladder 1005 and support surface 1000. As a result, the bladder 1005 applies static pressure against the supercell through the molten thermoplastic sheet 1020.

In FIG. 19D, the uncured supercell is conveyed by a perforated moving belt 1025 through an oven 1035 that heats the supercell. The vacuum drawn through the perforations in the belt pulls the solar cells 10 towards the belt, thereby applying pressure to the connection between them. The conductive adhesive bonding agent at those joints is cured as the supercell passes through an oven. Preferably, perforated belt 1025 is formed from a material having a CTE that matches or substantially matches the CTE of a solar cell (eg, the CTE of silicon). This is because if the CTE of the belt 1025 is too different from the CTE of the solar cell, the solar cell and the belt will be lengthened by different amounts in the oven 1035, which will cause the supercell to be lengthwise at the junction. This is because there will be a tendency to pull them away from each other.

The method 800 of FIG. 17 includes separate supercell curing and lamination steps to produce an intermediate supercell product. In contrast, in the method 900 shown in FIG. 18, the supercell curing and lamination steps are combined. At step 910, conventional sized solar cells (eg, 156 mm x 156 mm or 125 mm x 125 mm) are cut and/or cleaved to form a plurality of narrow rectangular solar cell strips. The resulting solar cell strips may optionally be tested and screened.

At step 915, the solar cell strips are arranged and interconnected in a desired modular configuration of a layered structure including an encapsulant material, a transparent front (solar side) sheet, and a back sheet. The solar cell strips are arranged as a supercell with an uncured conductive adhesive adhesive disposed between overlapping portions of adjacent solar cells within the supercell. (The conductive adhesive adhesive may be applied by, for example, inkjet printing or screen printing.) Interconnects are placed to electrically interconnect the uncured supercells in the desired configuration. The layered structure may include, for example, a first layer of encapsulant on a glass substrate, interconnecting supercells placed solar side down on the first layer of encapsulant, and a second layer of encapsulant on the layer of supercells. , and a backsheet on the second layer of encapsulant. Any other suitable arrangement may also be used.

In a lamination step 920, heat and pressure are applied to the layered structure to cure the conductive adhesive binder within the supercell and form a cured layered structure. The conductive adhesive bonding agent used to bond the interconnects to the supercell may also be cured in this step.

In one variation of method 900, conventional sized solar cells are separated into a plurality of solar cell strips, and a conductive adhesive bonding agent is then applied to each individual solar cell strip. In an alternative variation, a conductive adhesive binder is applied to conventional sized solar cells before the solar cells are separated into multiple solar cell strips. For example, multiple conventional sized solar cells are placed on a large template, a conductive adhesive bonding agent is then dispensed onto the solar cells, and then the solar cells are simultaneously attached to multiple solar cells by a large fixture. It can be separated into battery strips. The resulting solar cell strips can then be transported as a group and arranged into the desired modular configuration as described above.

As mentioned above, in some variations of method 800 and method 900, a conductive adhesive bonding agent is applied to conventional sized solar cells before the solar cells are separated into a plurality of solar cell strips. Ru. When conventional sized solar cells are separated to form multiple solar cell strips, the conductive adhesive binder is in an uncured state (ie, not yet "dry"). In some of these variations, a conductive adhesive adhesive is applied to a conventionally sized solar cell (e.g., by inkjet or screen printing) and then a laser is used to scribe lines onto the solar cell. , defining locations where the solar cells are to be cleaved to form solar cell strips, and then the solar cells are cleaved along the scribe lines. In these variations, the laser power and/or the distance between the scribe lines and the adhesive adhesive are selected to avoid inadvertently curing or partially curing the conductive adhesive adhesive with heat from the laser. obtain. In another variation, a laser is used to scribe lines onto conventionally sized solar cells to define the locations where the solar cells will be cleaved to form solar cell strips, followed by conductive adhesive bonding. The agent is applied to the solar cell (eg, by inkjet or screen printing), and then the solar cell is cleaved along the scribe lines. In the latter variant, it may be preferable to accomplish the step of applying the conductive adhesive adhesive without inadvertently cleaving or breaking the scribed solar cell during this step.

Referring again to FIGS. 20A-20C, FIG. 20A schematically illustrates a side view of an exemplary apparatus 1050 that may be used to cleave a scribed solar cell to which a conductive adhesive bonding agent has been applied. . (The scribing and the application of the conductive adhesive bonding agent may occur in any order.) In the present apparatus, the scribed conventional size solar cell 45 with the conductive adhesive bonding agent applied is placed in a vacuum manifold. It is carried over the curved portion of 1070 by a perforated moving belt 1060. As the solar cell 45 passes over the curved portion of the vacuum manifold, the vacuum drawn through the perforations in the belt pulls the bottom surface of the solar cell 45 against the vacuum manifold, thereby bending the solar cell. The radius of curvature R of the curved portion of the vacuum manifold may be selected to cleave the solar cell along the scribe line by bending the solar cell 45 in this manner. Advantageously, the solar cell 45 can be cleaved by this method without contacting the top surface of the solar cell 45 to which the conductive adhesive adhesive has been applied.

If cleavage is preferably initiated at one end of the scribe line (i.e. one edge of the solar cell 45), this means that for each scribe line, one end reaches the curved part of the vacuum manifold before the other end. This can be accomplished, for example, in apparatus 1050 of FIG. 20A by arranging the scribe line to be oriented at an angle θ relative to the vacuum manifold. For example, as shown in FIG. 20B, the solar cells are oriented with their scribe lines at an angle to the direction of belt movement and to the manifold oriented perpendicular to the direction of belt movement. It can be done. As another example, FIG. 20C shows a cell oriented with the scribe line perpendicular to the direction of belt movement and a manifold oriented at an angle.

Any other suitable apparatus may also be used to cleave a scribed solar cell to which a conductive adhesive binder has been applied to form a strip solar cell having a pre-applied conductive adhesive binder. obtain. Such a device may, for example, use a roller to apply pressure to the top surface of a solar cell to which a conductive adhesive adhesive has been applied. In such cases, the roller preferably touches the top surface of the solar cell only in areas where no conductive adhesive binder is applied.

In some variations, the solar module is configured such that a portion of the solar radiation that is not initially absorbed by the solar cells and passes through the solar cells is reflected by the back sheet and returned into the solar cells to generate electricity. The supercells may include supercells arranged in multiple rows on a white or otherwise reflective backsheet. The reflective backsheet is visible through the gaps between the supercell rows, and as a result of this, the solar module has a plurality of parallel bright (e.g., white) lines extending across its front surface. It may appear to have rows. Referring to FIG. 5B, for example, the parallel dark lines extending between the rows of supercells 100 appear to be white lines if the supercells 100 are placed on a white backsheet. Maybe. This may be aesthetically unpleasant for some applications of solar modules, such as rooftop applications.

Referring to FIG. 21, to improve the aesthetic appearance of the solar module, some variations include a plurality of supercells located at positions corresponding to the gaps between the rows of supercells to be placed on the backsheet. A white rear sheet 1100 including dark stripes 1105 is employed. The stripes 1105 are wide enough so that the white portion of the backsheet is not visible through the gaps between the supercell rows in the assembled module. This reduces the visual contrast between the supercell and the backsheet as perceived by a person with normal color vision. The resulting module includes a white rear sheet, but may have a front surface similar in appearance to that of the module illustrated in FIGS. 5A-5B, for example. Dark stripes 1105 may be produced, for example, with multiple lengths of dark tape or in any other suitable manner.

As previously mentioned, shading of individual cells within a solar module can create "hot spots" where power from unshaded cells is dissipated in the shaded cells. This dissipated power creates local temperature spikes that can degrade the module.

To minimize the potential severity of these hot spots, bypass diodes are traditionally inserted as part of the module. The maximum number of cells between bypass diodes is set to limit the maximum temperature of the module and prevent irreversible damage to the module. A standard layout for silicon cells may utilize one bypass diode for every 20 or 24 cells, with this number determined by the typical breakdown voltage of silicon cells. In certain embodiments, the breakdown voltage can range between about 10-50V. In certain embodiments, the breakdown voltage can be about 10V, about 15V, about 20V, about 25V, about 30V, or about 35V.

According to embodiments, the thermal contact between the solar cells is improved by shingling a strip of cut solar cells with a thin thermally conductive adhesive. This enhanced thermal contact allows for a higher degree of heat dissipation than traditional interconnect techniques. Such a thermal heat dissipation design based on shingling allows longer solar cell lengths than the 24 (or fewer) solar cells per bypass diode, which is a limitation for traditional designs. It becomes possible to use strings of solar cells. The thermal spread facilitated by shingling in accordance with embodiments may thus ease the requirements for providing bypass diodes at short spacings, which may provide one or more advantages. For example, this allows the creation of module layouts of varying solar cell string lengths without being hampered by the need to provide multiple bypass diodes.

According to embodiments, thermal spreading is achieved by maintaining physical and thermal bonding with adjacent cells. This allows sufficient heat dissipation through the bonded connections.

In certain embodiments, this connection is maintained at a thickness of about 200 micrometers or less and extends the length of the solar cell in a segmented pattern. Depending on the embodiment, the connection has a thickness of about 200 micrometers or less, about 150 micrometers or less, about 125 micrometers or less, about 100 micrometers or less, It may be about 90 micrometers or thinner, about 80 micrometers or thinner, about 70 micrometers or thinner, about 50 micrometers or thinner, or about 25 micrometers or thinner.

Precise adhesive curing may be important to ensure that a reliable connection is maintained while the thickness remains thin to promote heat dissipation between mating cells.

The possibility of longer strings (eg, more than 24 cells) provides flexibility in solar cell and module design. For example, in certain embodiments, strings of cut solar cells assembled in a shingled manner may be utilized. Such a configuration may utilize substantially more batteries per module than conventional modules.

Without thermal diffusivity, one bypass diode would be required for every 24 cells. When solar cells are disconnected by 1/6, the number of bypass diodes per module is 6 times that of a conventional module (consisting of 3 undisconnected cells), for a total of 18 diodes. Will. Heat spreading therefore allows a significant reduction in the number of bypass diodes.

Furthermore, a bypass circuit is required for each bypass diode to complete the bypass electrical path. Each diode requires two interconnection points and the routing of conductors to connect them to such interconnection points. This creates complex circuits and leads to significant costs associated with assembling solar modules, which are greater than the costs of standard layouts.

In contrast, thermal spreading techniques require only one bypass diode per module, or even no bypass diode at all. Such a configuration streamlines the module assembly process and allows simple automated tools to perform the layout manufacturing process.

Therefore, avoiding the need for bypass protection for every 24 cells makes manufacturing the battery module easier. Complex tap-outs in the middle of the module and long parallel connections for bypass circuits are avoided. This heat spreading is implemented by creating long shingled strips of multiple cells that extend across the width and/or length of the module.

In addition to providing thermal heat dissipation, shingling according to embodiments also allows for improved hot spot performance by reducing the magnitude of current dissipated within the solar cell. shall be. Specifically, the amount of current dissipated within a solar cell during a hotspot condition depends on the area of the cell.

Because shingling allows cells to be cut into smaller areas, the amount of current passing through one cell in a hot spot condition is a function of the size cut. During hot spot conditions, current flows through the path of lowest resistance, which is usually defective interfaces or grain boundaries at the cell level. Reducing this current is advantageous and minimizes reliability risk failures in hot spot conditions.

FIG. 22A shows a top view of a conventional module 2200 utilizing traditional ribbon connections 2201 in a hotspot condition. Here, as a result of the shadow 2202 on one cell 2204, heat will be concentrated on that single cell.

In contrast, FIG. 22B shows a top view of a module that utilizes thermal diffusion, also in a hotspot condition. Here, the shadow 2250 on the battery 2252 generates heat within that battery. However, this heat is dissipated to other electrically and thermally bonded cells 2254 within module 2256.

Furthermore, the advantage of reduced dissipated current is multiplied several times in polycrystalline solar cells. Such polycrystalline cells are known to perform poorly in hot spot conditions due to high levels of defective interfaces.

As indicated above, certain embodiments may employ shingling of beveled and cut cells. In such cases, there is a benefit of similar heat spreading along the bond line between each cell and the adjacent cell.

This maximizes the joint length of each overlapping joint. Since the bonded joint is the primary interface for heat spread between cells, maximizing its length may ensure optimal heat spread.

FIG. 23A shows an example of a supercell string layout 2300 that includes a beveled battery 2302. In this configuration, the chamfered cells are oriented in the same direction, so the conduction paths of all bonded connections are the same (125 mm).

As a result of the shadow 2306 on one cell 2304, that cell is reverse biased. Heat spreads to adjacent cells. The non-bonded end 2304a of the beveled cell will be the hottest due to the longer conduction length to the neighboring cell.

FIG. 23B shows another example of a supercell string layout 2350 that includes beveled cells 2352. In this configuration, the beveled cells are oriented in different directions, and some of the long edges of the beveled cells face each other. This results in two conductive path lengths for the joined connections: 125 mm and 156 mm.

When cell 2354 is shaded 2356, the configuration of FIG. 23B exhibits improved heat spread along the longer junction length. Thus, FIG. 23B shows heat spread within a supercell with beveled cells facing each other.

The above description has focused on assembling multiple solar cells (which may be cut solar cells) in a shingled manner on a common substrate. This results in the formation of a module with a single electrical interconnect-junction box (or j-box).

However, in order to collect sufficient amounts of solar energy to be useful, installations typically include a large number of such modules that will themselves be assembled together. According to embodiments, multiple solar modules may also be assembled in a shingled manner to increase the area efficiency of the array.

In certain embodiments, a module may include an upper conductive ribbon facing toward the direction of solar energy and a lower conductive ribbon facing away from the direction of solar energy.

The lower ribbon is buried beneath the battery. Therefore, it does not block the incident light and does not adversely affect the area efficiency of the module. In contrast, the upper ribbon is exposed and blocks incoming light, which can adversely affect efficiency.

According to embodiments, the modules themselves are shingled, so that the upper ribbon can be covered by neighboring modules. FIG. 24 shows a simplified cross-sectional view of such an arrangement 2400 in which the ends 2401 of adjacent modules 2402 serve to overlap the upper ribbon 2404 of the instant module 2406. Each module itself includes a plurality of shingled solar cells 2407 .

The lower ribbon 2408 of the module 2406 under consideration is buried. It is located on the raised side of the shingled module under consideration in order to overlap the neighboring adjacent shingled module.

This shingled module configuration may also provide additional area on the module for other elements without adversely affecting the final exposed area of the module array. Examples of modular elements that may be located in overlapping regions may include, but are not limited to, a junction box (j-box) 2410 and/or a bus ribbon.

FIG. 25 shows another embodiment of a shingled modular configuration 2500. Here, the J-boxes 2502, 2504 of each adjacent shingled module 2506 and 2508 are in a mating arrangement 2510 to achieve an electrical connection therebetween. This simplifies the construction of the array of shingled modules by eliminating wiring.

In certain embodiments, the j-box may be reinforced with and/or combined with additional structural standoffs. Such a configuration may create an integrated, tilted, modular roof-mounted rack solution where the dimensions of the junction box determine the tilt. Such embodiments may be particularly useful when the array of shingled modules is attached to a flat roof.

If the module includes a glass substrate and a glass cover (glass-to-glass module), the module reduces the overall module length (and thus the exposed length L resulting from shingling). can be used without additional frame members. Such shortening would allow the modules of the tilted array to withstand expected physical loads (eg, the snow load limit of 5400 Pa) without buckling due to strain.

Emphasizing that, by using a supercell structure containing multiple individual solar cells assembled in a shingled manner, the modules can be tailored to specific lengths necessitated by physical loads and other demands. This makes it possible to easily adapt to changes in length.

FIG. 26 illustrates an exemplary electrical interconnection of the front (solar) side terminal electrical contacts of a shingled supercell to the junction box on the back side of the solar module, on the back (shadow) side of the module. Show the diagram. The front end contact of the shingled supercell may be located adjacent the edge of the module.

FIG. 26 illustrates the use of a flexible interconnect 400 to electrically contact the front end contacts of supercell 100. In the illustrated example, the flexible interconnect 400 has a ribbon portion 9400A extending parallel to and adjacent to the edge of the supercell 100, and a ribbon portion 9400A extending in a direction perpendicular to the ribbon portion to which the supercell is conductively bonded. a finger 9400B that contacts the front metallization pattern (not shown) of the inner edge of the solar cell. A ribbon conductor 9410 conductively bonding to the interconnect 9400 passes behind the supercell 100 to connect the interconnect 9400 to an electrical component on the backside of the solar module of which the supercell forms a part (e.g., a junction box). electrical connections to module terminals and/or bypass diodes) within the module. An insulating film 9420 may be disposed between the conductor 9410 and the edges and backside of the supercell 100 to electrically isolate the ribbon conductor 9410 from the supercell 100.

Interconnect 400 may optionally be folded around the edge of the supercell such that ribbon portion 9400A lies behind, or partially behind, the supercell. In such cases, an electrically insulating layer is typically provided between the interconnects 400 and the edges and backside of the supercell 100.

Interconnect 400 may be die-cut from a conductive sheet, for example, and optionally patterned to increase its mechanical compliance in directions both perpendicular and parallel to the edges of the supercell so that it Stresses in directions perpendicular and parallel to the edges of the supercell resulting from a mismatch between the CTE of the connection and the CTE of the supercell may be reduced or accommodated. Such patterning may include, for example, slits, slots, or holes (not shown). The mechanical compliance of interconnect 400 and its bond to the supercell is sufficient such that the connection to the supercell can withstand stresses resulting from CTE mismatch during the lamination process, which will be described in more detail below. It should be. The interconnect 400 may be bonded to the supercell by, for example, a mechanically compliant electrically conductive bonding agent as described above for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding agent is applied not in a solid line extending substantially the length of the edge of the supercell (e.g. corresponding to discontinuous contact pad locations on the edge solar cells). supercells that result from a mismatch between the coefficient of thermal expansion of the electrically conductive bond or interconnect and the coefficient of thermal expansion of the supercell, located only at discrete locations along the edges of the supercell. may reduce or accommodate stresses in a direction parallel to the edges of the

Interconnects 400 may be cut from thin copper sheets, for example, and may be cut from conventional May be thinner than conductive interconnects. For example, interconnect 400 may be formed from a copper plate with a thickness of about 50 microns to about 300 microns. Even if the interconnect 400 were not patterned as described above, the interconnects 400 would not be patterned in the directions perpendicular to the supercell edges and It can be thin enough to accommodate stresses in parallel directions. Ribbon conductor 9410 may be formed from copper, for example.

Figure 27 shows two or more parallel shingled supercells with their front (solar side) end electrical contacts connected to each other and to the junction box on the back side of the solar module. FIG. 3 shows a back (shadow) view of the module illustrating example electrical interconnections. The front end contact of the shingled supercell may be located adjacent the edge of the module.

FIG. 27 illustrates the use of two flexible interconnects 400, as just described, to electrically contact the front end contacts of two adjacent supercells 100. Buses 9430 extending parallel to and adjacent the edges of supercell 100 conductively bond to the two flexible interconnects to electrically connect the supercells in parallel. This scheme may be extended to interconnect additional supercells 100 in parallel, if desired. Bus 9430 may be formed from a copper ribbon, for example.

Similar to those described above with respect to FIG. 26, interconnect 400 and bus 9430 are optionally configured such that ribbon portion 9400A and bus 9430 lie behind, or partially behind, the supercell. can break around the edges of the supercell. In such cases, electrically insulating layers are typically provided between interconnects 400 and the edges and backside of supercell 100 and between buses 9430 and the edges and backside of supercell 100. Ru.

Figure 28 shows two or more parallel shingled supercells with their front (solar side) end electrical contacts connected to each other and to the junction box on the back side of the solar module. FIG. 6 shows a back (shadow) view of the module illustrating other example electrical interconnections. The front end contact of the shingled supercell may be located adjacent the edge of the module.

FIG. 28 illustrates the use of another exemplary flexible interconnect 9440 to electrically contact the front edge contacts of supercell 100. In this example, the flexible interconnect 9440 has a ribbon portion 9440A that extends parallel to and adjacent to the edge of the supercell 100 and a ribbon portion 9440A that extends in a direction perpendicular to the ribbon portion to conductively bond the edge within the supercell. a finger 9440B that contacts the front metallization pattern (not shown) of the solar cell, and a finger 9440C that extends in a direction perpendicular to the ribbon portion and at the rear of the supercell. Finger 9440C conductively couples to bus 9450. Bus 9450 extends along the backside of supercell 100, parallel to and adjacent to the edges of supercell 100, and extends to overlap adjacent supercells to which it may have similar electrical connections. , thereby allowing supercells to be connected in parallel. A ribbon conductor 9410 conductively bonding to bus 9450 electrically interconnects the supercell to electrical components on the back side of the solar module (eg, module terminals and/or bypass diodes in a junction box). An electrically insulating film 9420 is provided between the finger 9440C and the edge and backside of the supercell 100, between the bus 9450 and the backside of the supercell 100, and between the ribbon conductor 9410 and the backside of the supercell 100. can be done.

Interconnect 9440 can be die-cut from a conductive sheet, for example, and optionally patterned to increase its mechanical compliance in both perpendicular and parallel directions to the supercell edges to Stresses in directions perpendicular and parallel to the edges of the supercell resulting from a mismatch between the CTE of the connection and the CTE of the supercell may be reduced or accommodated. Such patterning may include, for example, slits, slots, or holes (not shown). The mechanical compliance of the interconnect 9440 and its bond to the supercell is sufficient such that the connection to the supercell can withstand stresses resulting from CTE mismatch during the lamination process described in more detail below. It should be. The interconnect 9440 may be bonded to the supercell by, for example, a mechanically compliant electrically conductive bonding agent as described above for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding agent is applied not in a solid line extending substantially the length of the edge of the supercell (e.g. corresponding to discontinuous contact pad locations on the edge solar cells). supercells that result from a mismatch between the coefficient of thermal expansion of the electrically conductive adhesive or interconnect and the coefficient of thermal expansion of the supercell, located only at discrete locations along the edges of the supercell. may reduce or accommodate stresses in a direction parallel to the edges of the

Interconnects 9440 may be cut from a thin copper plate, for example, and may be compared to conventional May be thinner than conductive interconnects. For example, interconnect 9440 may be formed from a copper plate with a thickness of about 50 microns to about 300 microns. Even if the interconnects 9440 were not patterned as described above, the interconnects 9440 would not be patterned in the directions perpendicular to the supercell edges and It may be thin enough to accommodate stresses in parallel directions. Bus 9450 may be formed from a copper ribbon, for example.

Finger 9440C may join bus 9450 after finger 9440B joins the front side of supercell 100. In such a case, fingers 9440C may be bent away from the backside of supercell 100, such as perpendicular to supercell 100, when joining bus 9450. Finger 9440C may then be bent and extend along the backside of supercell 100, as shown in FIG. 28.

FIG. 29 illustrates the use of flexible interconnects sandwiched between the overlapping ends of adjacent supercells to electrically connect the supercells in series and provide electrical connection to a junction box. Figure 3 shows a fragmentary cross-sectional and perspective view of the cell. FIG. 29A shows an enlarged view of the target area of FIG. 29.

29 and 29A are shown partially sandwiched between the overlapping ends of two supercells 100 and electrically interconnecting the ends to the front edge contact of one of the supercells and the supercell of the other supercell. The use of an exemplary flexible interconnect 2960 is shown to provide electrical connections to the back edge contacts of the cells, thereby interconnecting the supercells in series. In the illustrated example, interconnect 2960 is hidden from view from the front of the solar module by the upper of the two overlapping solar cells. In other variations, the adjacent ends of the two supercells do not overlap and the portion of the interconnect 2960 that connects to the front end contact of one of the two supercells is visible from the front of the solar module. It can be done. Optionally, in such variations, portions of the interconnect that would otherwise be visible from the front of the module are covered or colored (e.g., darkened) to provide normal color vision. This can reduce the visible contrast between the interconnect and the supercell as perceived by a person with a supercell. Interconnects 2960 extend beyond the side edges of the two supercells and parallel to adjacent edges of the supercells to connect the supercells in parallel with similarly disposed pairs of supercells in adjacent rows. Pairs of cells may be electrically connected.

Ribbon conductors 2970 conductively bond to interconnects 2960 as shown to connect adjacent ends of the two supercells to electrical components on the backside of the solar module (e.g., module terminals in a junction box and and/or a bypass diode). In another variation (not shown), the ribbon conductor 2970, instead of being conductively bonded to the interconnect 2960, makes an electrical connection to the backside contact of one of the overlapping supercells away from their overlapping ends. It is possible. That configuration may also provide one or more bypass diodes or hidden taps to other electrical components on the back side of the solar module.

Interconnect 2960 can optionally be die-cut, for example, from a conductive sheet and optionally patterned to increase its mechanical compliance in both directions perpendicular and parallel to the edges of the supercell. , may reduce or accommodate stresses in directions perpendicular and parallel to the edges of the supercell resulting from a mismatch between the CTE of the interconnect and the CTE of the supercell. Such patterning may include, for example, slits, slots (as shown), or holes. The mechanical compliance of the flexible interconnect and its bond or bonds to the supercell ensures that the interconnecting supercell withstands stresses resulting from CTE mismatch during the lamination process, which will be described in more detail below. should be sufficient to ensure that The flexible interconnect may be bonded to the supercell, for example, by a mechanically compliant electrically conductive bonding agent as described above for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding agent is located only at discrete locations along the edge of the supercell, rather than in a continuous line extending substantially the length of the edge of the supercell. May reduce or accommodate stresses in a direction parallel to the edges of the supercell resulting from a mismatch between the coefficient of thermal expansion of the conductive bond or interconnect and the coefficient of thermal expansion of the supercell. obtain. Interconnect 2960 may be cut from a thin copper plate, for example.

Embodiments may include one or more features described in the following US patent publication documents: U.S. Patent Publication No. 2014/0124013, and U.S. Patent Publication No. 2014/0124014. Both are incorporated herein by reference in their entirety for all purposes.

This specification describes silicon solar cells arranged in a shingled configuration and electrically connected in series to form supercells with the supercells arranged in multiple physically parallel rows within a solar module. A highly efficient solar module is disclosed. The supercells may have a length that spans essentially the entire length or width of the solar module, for example, or two or more supercells may be arranged end-to-end in a row. . This arrangement hides the electrical interconnections between solar cells and thus creates a visually appealing solar module with little or no contrast between adjacent series-connected solar cells. It can be used for.

A supercell can include any number of solar cells, including at least 19 solar cells in some embodiments, and, in certain embodiments, for example, greater than or equal to 100 silicon solar cells. Electrical contacts at intermediate locations along the supercell are used to electrically segment the supercell into two or more series-connected segments while maintaining a physically continuous supercell. may be desirable. The specification herein provides that such electrical connections are established with the back contact pads of one or more silicon solar cells in the supercell and are hidden from view from the front of the solar module, thus referred to herein as "hidden". Discloses an arrangement providing electrical tap connection points called "taps". A hidden tap is an electrical connection between the back side of a solar cell and a conductive interconnect.

This specification describes a flexible interconnect that electrically interconnects a front supercell termination contact pad, a backside supercell termination contact pad, or a hidden tap contact pad to other solar cells or to other electrical components within a solar module. Also discloses the use of parts.

In addition, the present disclosure provides a machine for directly bonding adjacent solar cells to each other within a supercell to accommodate thermal expansion mismatch between the supercell and the glass front sheet of the solar module. The use of electrically conductive adhesives to provide electrically compliant conductive bonds to flexible interconnects with mechanically rigid bonds that accommodate the thermal expansion mismatch between the flexible interconnect and the supercell. A connection is disclosed in combination with the use of an electrically conductive adhesive to join the supercell. This may avoid damage to the solar module that could otherwise occur as a result of thermal cycling of the solar module.

As described further below, the electrical connections to the hidden tap contact pads electrically connect the segments of the supercells in parallel with corresponding segments of one or more supercells in adjacent rows, and/or or electrical connections to solar module circuitry for a variety of applications including, but not limited to, power optimization (e.g., bypass diodes, AC/DC microinverters, DC/DC converters) and reliability applications. can be used to provide

The use of hidden taps as just described, in combination with hidden battery-to-cell connections, can further enhance the aesthetic appearance of the solar module by providing the solar module with a substantially all-black appearance, thereby improving the solar cell's appearance. Efficiency of the solar module may also be increased by allowing the active area to fill a larger portion of the module's surface area.

Turning now to the drawings for a more detailed understanding of the solar modules described herein, FIG. 1 shows a cross-sectional view of a string of series-connected solar cells 10 arranged in a shingled configuration. Each solar cell 10 includes a semiconductor diode structure and a plurality of electrical contacts to the semiconductor diode structure. Thereby, the current generated within the solar cell 10 when the solar cell 10 is irradiated with light can be provided to an external load.

In the examples described herein, each solar cell 10 has a rectangular shape with a metallization pattern on the front (sun side) and back (shadow side) sides that provides electrical contact on opposite sides of the n-p junction. A crystalline silicon solar cell, in which the front metallization pattern is disposed on a semiconductor layer of n-type conductivity and the backside metallization pattern is disposed on a semiconductor layer of p-type conductivity. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements may be used as appropriate. For example, a front (sun side) metallization pattern may be disposed on a semiconductor layer of p-type conductivity, and a back (shadow side) side metallization pattern may be disposed on a semiconductor layer of n-type conductivity.

Referring again to FIG. 1, in the supercell 100, adjacent solar cells 10 electrically connect the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cell in the area where they overlap. They are directly conductively bonded to each other by an electrically conductive bonding agent. Suitable electrically conductive bonding agents may include, for example, electrically conductive adhesives, electrically conductive adhesive films and tapes, and conventional solders.

31AA and 31A are shown partially sandwiched between the overlapping ends of two supercells 100 and electrically interconnecting the ends to the front edge contact of one of the supercells and to the front edge contact of the other supercell. FIG. 12 illustrates the use of an exemplary flexible interconnect 3160 to provide electrical connections to the backside edge contacts of the supercells, thereby interconnecting the supercells in series. In the illustrated example, the interconnect 3160 is hidden from view from the front of the solar module by the top one of the two overlapping solar cells. In another variation, the adjacent ends of the two supercells do not overlap and the portion of the interconnect 3160 that connects to the front end contact of one of the two supercells is visible from the front of the solar module. It can be done. Optionally, in such variants, portions of the interconnect that would otherwise be visible from the front of the module are covered or colored (e.g., darkened) to provide normal color vision. This can reduce the visible contrast between the interconnect and the supercell as perceived by a person with . Interconnects 3160 extend beyond the side edges of the two supercells and parallel to adjacent edges of the supercells to connect the supercells in parallel with similarly disposed pairs of supercells in adjacent rows. Pairs of cells may be electrically connected.

Ribbon conductors 3170 conductively bond to interconnects 3160 as shown to connect adjacent ends of the two supercells to electrical components on the backside of the solar module (e.g., module terminals in a junction box and and/or a bypass diode). In another variation (not shown), the ribbon conductor 3170, instead of being conductively bonded to the interconnect 3160, makes an electrical connection to the backside contact of one of the overlapping supercells away from their overlapping ends. It is possible. That configuration may also provide one or more bypass diodes or hidden taps to other electrical components on the backside of the solar module.

2A-2R illustrate an exemplary rectangular solar module 200 that includes six rectangular supercells 100, each having a length approximately equal to the length of a long side of the solar module. The supercells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the module. A similarly constructed solar module may include more or fewer rows of supercells of such side lengths than shown in this example. In another variation, the supercells each have a length approximately equal to the length of the short sides of the rectangular solar module and are arranged in parallel rows with their long sides oriented parallel to the short sides of the module. may be placed. In yet other arrangements, each row may include two or more supercells electrically interconnected in series. The module may have a short side that is, for example, about 1 meter in length and a long side that is, for example, about 1.5 to about 2.0 meters in length. Any other suitable shape (eg, square) and size for the solar module may also be used.

Each supercell in this example includes 72 rectangular solar cells each having a width equal to approximately 1/6 the width of a 156 mm square or pseudo-square wafer. Any other suitable number of rectangular solar cells of any other suitable size may also be used.

A solar cell having a long and narrow aspect ratio, as shown, and having an area smaller than the area of a standard 156 mm x 156 mm solar cell, is used in the solar modules disclosed herein ^. It may be advantageously employed to reduce R resistance power losses. In particular, the small area of solar cell 10 compared to standard-sized silicon solar cells reduces the current produced in the solar cell and reduces the resistance within that solar cell and within the series-connected string of such solar cells. Directly reduce power losses.

Hidden taps to the backside of the supercell may be established, for example, using electrical interconnects that conductively bond to one or more covert tap contact pads located only at the edge portions of the solar cell's backside metallization pattern. . Alternatively, hidden taps can be established using interconnects that extend substantially the entire length of the solar cell (perpendicular to the long axis of the supercell), extending to the length of the solar cell in the backside metallization pattern. conductive bonding to a plurality of hidden tap contact pads distributed along the line.

FIG. 31A shows an exemplary solar cell backside metallization pattern 3300 suitable for use with edge-connecting covert taps. The metallization pattern consists of a continuous aluminum electrical contact 3310, a plurality of silver contact pads 3315 arranged parallel to and adjacent to the long edge of the back side of the solar cell, and a plurality of silver contact pads 3315 placed along the short edge of the back side of the solar cell. including hidden silver tap contact pads 3320 each disposed parallel to one adjacent edge of the pads. When the solar cells are arranged in a supercell, the front surfaces of adjacent rectangular solar cells overlap and are directly connected to the contact pads 3315. The interconnect may be conductively bonded to one or the other of the hidden tap contact pads 3320 to provide a hidden tap to the supercell. (If desired, two such interconnects may be employed to provide two hidden taps.)

In the arrangement shown in FIG. 31A, current flow to the hidden tap passes through the back cell metallization generally parallel to the long sides of the solar cell to the interconnect gathering point (contact 3320). To encourage current flow along this path, the resistance of the back metallization sheet is preferably less than or equal to about 5 ohms/square, or less than or equal to about 2.5 ohms/square.

FIG. 31B shows another exemplary solar cell backside metallization pattern 3301 suitable for use with hidden taps that employs bus-like interconnects along the length of the solar cell backside. The metallization pattern includes a continuous aluminum electrical contact 3310, a plurality of silver contact pads 3315 disposed parallel to and adjacent to the long edge of the back side of the solar cell, and includes a plurality of hidden silver tap contact pads 3325 arranged in parallel rows and approximately centered on the back side of the solar cell. Interconnects extending substantially the entire length of the solar cell may conductively bond to hidden tap contact pads 3325 to provide hidden taps to the supercell. Current flow to the hidden tap is primarily through the bus-like interconnect, making the conductivity of the backside metallization pattern less important to the hidden tap.

The location and number of hidden tap contact pads to which a hidden tap interconnect on the back side of the solar cell joins affects the length of the current path through the back side metallization of the solar cell, the hidden tap contact pad, and the interconnect. give. As a result, the placement of the hidden tap contact pads may be selected to minimize resistance to current collection in the current path to and through the hidden tap interconnect. In addition to the configurations shown in FIGS. 31A-31B (and FIG. 31C, discussed below), suitable hidden tap contact pad arrangements may include, for example, two-dimensional arrays and rows extending perpendicular to the long axis of the solar cell. . In the latter case, the row of hidden tap contact pads may be located adjacent to the short edge of the first solar cell, for example.

FIG. 31C shows other exemplary solar cells suitable for use with either edge-connecting hidden taps along the length of the back side of the solar cell or hidden taps employing bus-like interconnects. Rear metallization pattern 3303 is shown. The metallization pattern includes a continuous copper contact pad 3315 disposed parallel to and adjacent to the long edge of the back side of the solar cell, a plurality of continuous copper contact pads 3315 connected to the contact pad 3315 and extending perpendicularly from the contact pad 3315. copper fingers 3317 and a continuous copper bus hidden tap contact pad 3325 extending parallel to the long sides of the solar cell and located approximately in the center of the back surface of the solar cell. An edge-connecting interconnect may be joined to the end of the copper bus 3325 to provide a hidden tap to the supercell. (If desired, two such interconnects may be employed at each end of the copper bus 3325 to provide two hidden taps.) Interconnects extending from the top can be conductively bonded to the copper bus 3325 to provide hidden taps to the supercell.

The interconnects employed to form the hidden taps may be joined to the hidden tap contact pads in the back metallization pattern by soldering, welding, conductive adhesive, or any other suitable manner. For metallization patterns employing silver pads as illustrated in FIGS. 31A-31B, the interconnects may be formed from tin-coated copper, for example. Other approaches include directly connecting the aluminum back contacts 3310 with aluminum conductors forming an aluminum-to-aluminum bond, which may be formed by electrical or laser welding, soldering, or conductive adhesives, for example. The goal is to establish a hidden tap. In certain embodiments, the contact portion may include tin. In the case just described, the backside metallization of the solar cell may not have silver contact pads 3320 (FIG. 31A) or 3325 (FIG. 31B), but may have edge-connected or bus-like aluminum contact pads. interconnects may be bonded to aluminum (or tin) contacts 3310 at locations corresponding to their contact pads.

Differential thermal expansion between hidden tap interconnects (or interconnects to front or back supercell end contacts) and silicon solar cells, and the resulting differences between solar cells and interconnects. Stress can lead to tears and other forms of failure that can reduce solar module performance. As a result, hidden taps and other interconnects are desirably configured to accommodate such differential expansion without exhibiting substantial stress. The interconnects may be made of materials with a low coefficient of thermal expansion (e.g. Kovar, Invar, or other low thermal expansion Accommodate the differential thermal expansion between the interconnect and the silicon solar cell by being formed from an iron-nickel alloy) or from a material with a coefficient of thermal expansion approximately matching that of silicon and/or out-of-plane geometries such as kinks, jogs, or dimples to accommodate such differential thermal expansion. Features may be employed to provide stress and thermal expansion mitigation. The portion of the interconnect that joins the hidden tap contact pad (or joins the front or back end contact pad of a supercell as described below) has a thickness, e.g., less than about 100 microns, about It may be less than 50 microns, less than about 30 microns, or less than about 25 microns to increase the flexibility of the interconnect.

Referring again to FIGS. 7A, 7B-1 and 7B-2, these drawings employ stress-relieving geometry features for use as hidden tap interconnects or for front or back supercell terminations. 4 shows several exemplary interconnect configurations, identified by reference numbers 400A-400U, that may be suitable for electrical connection to contacts. The lengths of these interconnects are typically approximately equal to the length of the long sides of the rectangular solar cells to which they are joined, but may be any other suitable length. The exemplary interconnects 400A-400T shown in FIG. 7A employ various in-plane stress relief features. The exemplary interconnect 400U shown in the in-plane (xy) view of FIG. 7B-1 and the out-of-plane (xz) view of FIG. A bent portion 3705 is adopted. The bends 3705 reduce the apparent tensile stiffness of the ribbon metal. The bends allow the ribbon material to bend locally instead of only lengthening when the ribbon is under tension. For thin ribbons, this can substantially reduce the apparent tensile stiffness by, for example, 90% or more. The exact amount of reduction in apparent tensile stiffness depends on several factors, including the number of bends, bend geometry, and ribbon thickness. The interconnects may also employ a combination of in-plane and out-of-plane stress relief features.

37A-1 through 38B-2, discussed further below, employ in-plane and/or out-of-plane stress-relieving geometric features and may be suitable for use as edge-connecting interconnects for concealed taps. Figure 3 shows some example interconnect configurations that may be possible.

Hidden tap interconnect buses may be utilized to reduce or minimize the number of extended conductors required to connect each hidden tap. In this approach, hidden tap contact pads of adjacent supercells are connected to each other by using hidden tap interconnects. (The electrical connections are typically positive-to-positive or negative-to-negative, ie, the same polarity on each end.)

For example, FIG. 32 shows a first hidden tap interconnect extending substantially the entire width of the solar cell 10 in the first supercell 100 and conductively bonding to a hidden tap contact pad 3325 arranged as shown in FIG. 31B. 3400 and a second hidden tap interconnect extending across the width of the corresponding solar cell in the supercell 100 in an adjacent row and similarly conductively bonding to a hidden tap contact pad 3325 located as shown in FIG. 31B. 3400. The two interconnects 3400 are arranged side by side and optionally abutting or overlapping each other, conductively bonded to each other, or in other cases electrically connected to the two adjacent superstructures. A bus may be formed to interconnect the cells. This scheme can be extended over additional rows of supercells (e.g., all rows) if desired to form parallel segments of solar modules containing multiple segments of several adjacent supercells. It is possible. FIG. 33 shows a perspective view of a portion of the supercell of FIG. 32.

FIG. 35 shows that supercells in adjacent rows span the gap between them to covert tap contact pads 3320 on one supercell and to other covert tap contact pads 3320 on the other supercell. An example is shown in which interconnections are made by short interconnects 3400 that conductively bond to. Here, the contact pads are arranged as shown in FIG. Figure 36 shows that a short interconnect spans the gap between two supercells in adjacent rows and connects to the end of the central copper bus portion of the backside metallization on one supercell and on the other supercell. A similar arrangement is shown with conductive bonding to adjacent ends of the central copper bus portion of the back metallization of the cell. Here, the copper rear metallization is configured as shown in FIG. 31C. In both of these examples, the interconnection scheme is extended across additional rows of supercells (e.g., all rows) as desired to connect multiple segments of several adjacent supercells. Parallel segments of solar modules may be formed including:

37A-1 through 37F-3 show in-plane (xy) and out-of-plane (xz) views of an exemplary short hidden tap interconnect 3400 that includes an in-plane stress relief feature 3405. (The xy plane is the plane of the back metallization pattern of the solar cell.) In the examples of FIGS. 37A-1 through 37E-2, each interconnect 3400 includes one or more opposing in-plane stress relief features. Includes tabs 3400A and 3400B positioned on mating sides. Exemplary in-plane stress relief features include one, two, or more hollow diamond-shaped arrangements, zigzags, and one, two, or more slot arrangements.

As used herein, the term "in-plane stress relief feature" can also refer to the thickness or ductility of an interconnect, or a portion of an interconnect. For example, the interconnect 3400 shown in FIGS. 37F-1 through 37F-3 has a straight, flat length in which the thickness T in the xy plane is, for example, less than or equal to about 100 microns. Formed from a thin copper ribbon or foil that is less than or equal to about 50 microns, less than or equal to about 30 microns, or less than or equal to about 25 microns to increase the flexibility of the interconnect. enhance Thickness T may be, for example, about 50 microns. The length L of the interconnect can be, for example, about 8 centimeters (cm), and the width W of the interconnect can be, for example, about 0.5 cm. Figures 37F-3 and 37F-1 show front and back views of the interconnect in the xy plane, respectively. The front side of the interconnect faces the back side of the solar module. The interconnects may span the gap between two parallel supercell rows within the solar module so that a portion of the interconnects may be visible through the gap from the front of the solar module. Optionally, the visible portion of the interconnect may be blackened, eg coated with a black polymer layer, to reduce its visibility. In the illustrated example, the front central portion 3400C of the interconnect, which has a length L2 of approximately 0.5 cm, is coated with a thin black polymer layer. Typically, L2 is greater than or equal to the width of the gap between supercell rows. The black polymer layer can be, for example, about 20 microns thick. Such thin copper ribbon interconnects may optionally also employ in-plane or out-of-plane stress relief features as described above. For example, the interconnect may include stress-relieving out-of-plane bends as described above in connection with FIGS. 7B-1 and 7B-2.

38A-1 through 38B-2 show in-plane (xy) and out-of-plane (xz) views of an exemplary short hidden tap interconnect 3400 that includes an out-of-plane stress relief feature 3407. In these examples, each interconnect 3400 includes tabs 3400A and 3400B positioned on opposite sides of one or more out-of-plane stress relief features. Exemplary out-of-plane stress relief features include an arrangement of one, two, or more bends, kinks, dimples, jogs, or ridges.

The type and arrangement of stress relief features illustrated in FIGS. 37A-1 through 37E-2 and 38A-1 through 38B-2, and the interconnections described above in connection with FIGS. 37F-1 through 37F-3. Ribbon thicknesses may also be employed as appropriate in the long hidden tap interconnects as described above and in the interconnects that join to the back or front end contacts of the supercell. The interconnect may include a combination of both in-plane and out-of-plane stress relief features. In-plane and out-of-plane stress relief features are designed to reduce or minimize the effects of strain and stress on the solar cell connections, thereby forming reliable and resilient electrical connections.

39A-1 and 39A-2 are illustrations of short hidden tap interconnects that include battery contact pad alignment and supercell edge alignment features to improve automation, ease of manufacture, and placement accuracy. This shows a typical configuration. 39B-1 and 39B-2 illustrate example configurations of short hidden tap interconnects that include asymmetric tab lengths. Such asymmetric interconnects may be used in opposite orientations to avoid overlapping conductors running parallel to the long axis of the supercell. (See description of Figures 42A-42B below.)

Hidden taps as described herein may make the electrical connections needed in the layout of the module to provide the desired module electrical circuitry. Hidden tap connections may be established, for example, at intervals of 12, 24, 36, or 48 solar cells along the supercell, or at any other suitable interval. The spacing between hidden taps may be determined depending on the application.

Each supercell typically includes a front end contact at one end of the supercell and a back end contact at the other end of the supercell. In variants where the supercell spans the length or width of the solar module, these end contacts are located adjacent to opposing edges of the solar module.

Flexible interconnects may be conductively bonded to the front or back end contacts of the supercell to electrically connect the supercell to other solar cells or to other electrical components within the module. For example, FIG. 34A shows a cross-sectional view of an exemplary solar module with an interconnect 3410 conductively bonded to a backside terminal contact at the end of the supercell. The back end contact interconnect 3410 has, for example, a thickness of less than or equal to about 100 microns, less than or equal to about 50 microns, in a direction perpendicular to the surface of the solar cell to which it joins. Copper ribbons or foils less than or equal to about 30 microns, less than or equal to about 25 microns, or thin may be included to increase the flexibility of the interconnect. The interconnects may have a width in the plane of the surface of the solar cell in a direction perpendicular to the flow of current through the interconnects, for example, greater than or equal to about 10 mm to improve conductivity. As shown, the back end contact interconnect 3410 may lie behind the solar cell with no portion of the interconnect extending beyond the supercell in a direction parallel to the supercell rows.

Similar interconnects may be used to connect to the front end contacts. Alternatively, to reduce the area on the front side of the solar module occupied by the front end interconnects, the front interconnects provide a thin flexible section that joins directly to the supercell and provides higher conductivity. thicker portions. This arrangement reduces the interconnect width required to achieve the desired conductivity. The thicker portion of the interconnect, for example, may be an integral part of the interconnect or may be a separate piece that joins the thinner portion of the interconnect. For example, FIGS. 34B-34C each show cross-sectional views of exemplary interconnects 3410 that conductively bond to front end contacts at the ends of the supercell. In both examples, the thin flexible portion 3410A of the interconnect that joins directly to the supercell has a thickness of less than about 100 microns perpendicular to the surface of the solar cell to which it joins. or equal to, less than or equal to about 50 microns, less than or equal to about 30 microns, or less than or equal to about 25 microns. The thicker copper ribbon portion 3410B of the interconnect joins the thinner portion 3410A to improve the conductivity of the interconnect. In FIG. 34B, electrically conductive tape 3410C on the back side of thin interconnect section 3410A joins the thin interconnect section to the supercell and to thick interconnect section 3410B. In FIG. 34C, thin interconnect portion 3410A is bonded to thick interconnect portion 3410B by electrically conductive adhesive 3410D and to the supercell by electrically conductive adhesive 3410E. Electrically conductive adhesives 3410D and 3410E can be the same or different. Electrically conductive adhesive 3410E can be, for example, solder.

The solar modules described herein include a laminate structure as shown in FIG. 34A with a supercell and one or more encapsulant materials 3610 sandwiched between a transparent front sheet 3620 and a back sheet 3630. obtain. The transparent front sheet can be, for example, glass. The backsheet may also be glass or any other suitable material. An additional strip of encapsulant may be placed between the backside terminal interconnect 3410 and the backside of the supercell as shown.

As mentioned above, hidden taps add beauty to an "all black" module. Since these connections are typically established with highly reflective conductors, they will usually have high contrast to the attached solar cells. However, by forming connections on the back side of the solar cell, and by routing other conductors in the solar module circuit behind the solar cell, various conductors are hidden from view. This allows for multiple connection points (hidden taps) while still maintaining the "all black" look.

Hidden taps may be used to form the layout of various modules. In the example of FIG. 40 (physical layout) and FIG. 41 (electrical schematic), the solar module includes six supercells, each extending the length of the module. Hidden tap contact pads and short interconnects 3400 segment each supercell into thirds and electrically connect adjacent supercell segments in parallel, thereby providing three groups of parallel-connecting supercells. A segment is formed. Each group is connected in parallel with a different one of the bypass diodes 1300A-1300C incorporated within (embedded within) the stack structure of the module. Bypass diodes may be located, for example, directly behind the supercells or between supercells. The bypass diode may be located, for example, approximately along the centerline of the solar module, parallel to the long sides of the solar module.

In the example of FIGS. 42A-42B (which also corresponds to the electrical schematic of FIG. 41), the solar module includes six supercells, each extending the length of the module. Hidden tap contact pads and short interconnects 3400 segment each supercell into thirds and electrically connect adjacent supercell segments in parallel, thereby providing three groups of parallel-connecting supercells. A segment is formed. Each group connects bypass diodes 1300A-1300C through bus connections 1500A-1500C located at the back of the supercell and connecting hidden tap contact pads and short interconnects to bypass diodes located at the back of the module in the junction box. Connect in parallel with a different one of them.

FIG. 42B provides a detailed view of the connection between short hidden tap interconnect 3400 and conductors 1500B and 1500C. As depicted, these conductors do not overlap each other. In the illustrated example, this is made possible by the use of asymmetric interconnects 3400 arranged in opposite orientations. An alternative approach to avoiding overlapping conductors is to employ a first symmetrical interconnect 3400 with tabs of one length and a second symmetrical interconnect 3400 with tabs of different lengths.

In the example of FIG. 43 (which also corresponds to the electrical circuit diagram of FIG. 41), the solar module is configured similar to that shown in FIG. 42A. The difference is that the hidden tap interconnect 3400 forms a continuous bus that extends substantially the entire width of the solar module. Each bus may be a single long interconnect 3400 that conductively bonds to the backside metallization of each supercell. Alternatively, the bus can include multiple buses, each spanning a single supercell, conductively bonded to each other, or otherwise electrically interconnected as described above in connection with FIG. may include individual interconnects. FIG. 43 shows supercell end interconnects 3410 that form a continuous bus along one end of the solar module to electrically connect the front end contacts of the supercell, and along the opposite end of the solar module. Also shown is an additional supercell end interconnect 3410 that forms a continuous bus to electrically connect the backside end contacts of the supercell.

The exemplary solar module of FIGS. 44A-44B also corresponds to the electrical circuit diagram of FIG. 41. This example includes a short hidden tap interconnect 3400 as in FIG. 42A and an interconnect 3410 as in FIG. 43 that forms a continuous bus for the supercell front and back end contacts. adopt.

In the example of FIG. 47A (physical layout) and FIG. 47B (electrical schematic), the solar module includes six supercells, each extending the length of the solar module. Hidden tap contact pads and short interconnects 3400 segment each supercell into a 2/3 length section and a 1/3 length section. Interconnects 3410 on the lower edge (as depicted in the drawing) of the solar module connect the three rows on the left hand side parallel to each other, the three rows on the right hand side parallel to each other, and the three rows on the left hand side parallel to each other. interconnect in series with three rows of This arrangement forms three groups of parallel connected supercell segments, each having a length of 2/3 of the supercell length. Each group is connected in parallel with a different one of bypass diodes 2000A-2000C. This arrangement provides approximately twice the voltage and approximately half the current that would be provided by the same supercells if they were instead electrically connected as shown in FIG. do.

As described above with reference to FIG. 34A, the interconnects that join the supercell backside terminal contacts may lie entirely at the rear of the supercell and be hidden from view from the front (sun) side of the solar module. The interconnect 3410 that joins the supercell front end contact may be visible in the back view of the solar module (eg, as in FIG. 43). because they extend beyond the edge of the supercell (as in FIG. 44A, for example), or because they fold around and below the edge of the supercell. It is.

The use of hidden taps facilitates grouping fewer solar cells per bypass diode. In the example of Figures 48A-48B (each showing a physical layout), the solar module includes six supercells, each extending the length of the module. Hidden tap contact pads and short interconnects 3400 segment each supercell into fifths and electrically connect adjacent supercell segments in parallel, thereby creating five groups of parallel-connecting supercell segments. is formed. Each group is connected in parallel with a different one of the bypass diodes 2100A-2100E incorporated within (embedded within) the stack structure of the module. Bypass diodes may be located, for example, directly behind the supercells or between supercells. A supercell end interconnect 3410 forms a continuous bus along one end of the solar module to electrically connect the front end contacts of the supercell, and additional supercell end interconnects 3410 form a continuous bus along one end of the solar module to forming a continuous bus along the opposite edge of the supercell to electrically connect the back end contacts of the supercell. In the example of FIG. 48A, a single junction box 2110 electrically connects to the front and back terminal interconnect buses by conductors 2115A and 2115B. However, since there are no diodes in the junction box, alternatively (FIG. 48B) the long return conductors 2215A and 2115B can be removed and a single junction box 2110 is used, e.g. unipolar (+ or -) junction boxes 2110A-2110B. This eliminates resistive losses in long return conductors.

Although the examples described herein use hidden taps to electrically segment each supercell into groups of three or five solar cells, these examples are intended to be illustrative and not limiting. has been done. More generally, the hidden taps can be superimposed so that there are more or less solar cell groups than shown and/or more or less solar cells per group than shown. It can be used to electrically segment cells.

In normal operation of the solar module described herein, without the bypass diode being forward biased and conducting, little or no current flows through any hidden tap contact pads. Instead, current flows through the length of each supercell through intercell conductive junctions formed between adjacent and overlapping solar cells. In contrast, FIG. 45 shows the current flow when a portion of the solar module is bypassed through a forward biased bypass diode. As indicated by the arrow, in this example, the current in the left-most supercell flows along that supercell until it reaches the solar cell that taps, and then the back metallization of that solar cell. A hidden tap contact pad (not shown), an interconnect 3400 to a second solar cell in an adjacent supercell, and another hidden tap contact pad (not shown) to which the same interconnect joins on the second solar cell. (not shown), through the second solar cell back metallization, through additional hidden tap contact pads, interconnects, and through the solar cell back metallization to the bus connection 1500 to the bypass diode. reach. Current flow through the other supercells is similar. As is clear from the illustration, under such circumstances the hidden tap contact pads will conduct current from two or more supercell rows and therefore in any single solar cell in the module. Can conduct a current greater than the generated current.

Typically, there are no busbars, contact pads, or other light-blocking elements (other than front metallization fingers or overlapping portions of adjacent solar cells) on the front side of the solar cell opposite the hidden tap contact pad. As a result, if a hidden tap contact pad is formed from silver on a silicon solar cell, the light conversion efficiency of the solar cell within the area of the hidden tap contact pad is such that the silver contact pad prevents backside carrier recombination. It can be reduced if the influence of the back field is reduced. To avoid this efficiency loss, typically most solar cells in supercells do not include hidden tap contact pads. (For example, in some variations, only solar cells that require hidden tap contact pads for bypass diode circuits will include such hidden tap contact pads. In order to match the current production of a solar cell to that of a solar cell without hidden tap contact pads, solar cells with hidden tap contact pads have a larger light collection area than solar cells without hidden tap contact pads. may have.

An individual hidden tap contact pad may have rectangular dimensions, for example, less than or equal to about 2 mm by less than or equal to about 5 mm.

Solar modules undergo thermal cycling as a result of temperature changes in the environment in which they are installed during operation and during testing. During such temperature cycling, as a result of thermal expansion mismatch between the silicon solar cells in the supercell and other parts of the module, e.g., the glass front sheet of the module, as shown in FIG. 46A, , there will be relative movement between the supercell and those other parts of the module along the long axis of the supercell row. This mismatch tends to stretch or compress the supercell and can damage the solar cells or conductive junctions between solar cells within the supercell. Similarly, as shown in FIG. 46B, during temperature cycling, multiple supercell rows and perpendicular , a relative movement between the interconnect and the solar cell will occur. This mismatch can stretch and damage the solar cells, interconnects, and conductive junctions between them. This can occur for interconnects that bond to hidden tap contact pads and for interconnects that bond to supercell front or back end contacts.

Similarly, cyclic mechanical loads on solar modules, e.g. during transportation or from the weather (e.g. wind and snow), can be applied at cell-to-cell junctions within supercells and at interconnections with solar cells. localized shear forces can be generated at the joints between the parts. These shear forces can also damage solar modules.

A conductive adhesive used to join adjacent and overlapping solar cells together to prevent problems arising from relative motion between the supercell and the rest of the solar module along the long axis of the supercell row. The agent inhibits thermal expansion between the supercell and the module's glass front sheet in a direction parallel to the rows at temperatures ranging from about -40°C to about 100°C without damaging the solar module. may be chosen to form a flexible conductive junction 3515 (FIG. 46A) between the overlapping solar cells that provides the supercell with mechanical compliance that accommodates the mismatch in solar cells. The conductive adhesive has, for example, less than or equal to about 100 megapascals (MPa), less than or equal to about 200 MPa, less than or equal to about 300 MPa, under standard test conditions (i.e., 25° C.). less than or equal to about 400 MPa, less than or equal to about 500 MPa, less than or equal to about 600 MPa, less than or equal to about 700 MPa, less than or equal to about 800 MPa, about 900 MPa The conductive joint may be selected to have a stiffness lower than or equal to, or less than or equal to about 1000 MPa. The plurality of flexible conductive junctions between overlapping and adjacent solar cells can accommodate differential motion of greater than or equal to about 15 microns between each cell and the glass front sheet, for example. Suitable conductive adhesives may include, for example, ECM 1541-S3 available from Engineered Conductive Materials LLC.

Supercell, which reduces the risk of damage to the solar module from hot spots that can occur during operation of the solar module if the solar cells in the solar module are reverse biased as a result of shading or for some other reason. For example, a solar cell with a thickness perpendicular to the solar cell of less than or equal to about 50 microns and a thermal conductivity perpendicular to the solar cell of about 1.5 W/ Conductive junctions between overlapping and adjacent solar cells can be formed that are higher than or equal to (meter-K).

To prevent problems arising from relative motion between the interconnect and the solar cell to which it is bonded, the conductive adhesive used to bond the interconnect to the solar cell may damage the solar module. The solar cells and interconnects are sufficiently rigid to accommodate thermal expansion mismatches between the solar cells and the interconnects at temperatures ranging from about -40°C to about 180°C without may be selected to form a conductive junction between. The conductive adhesive has a conductive adhesive, for example, greater than or equal to about 1800 MPa, greater than or equal to about 1900 MPa, greater than or equal to about 2000 MPa, about higher than or equal to 2100 MPa, higher than or equal to about 2200 MPa, higher than or equal to about 2300 MPa, higher than or equal to about 2400 MPa, higher than or equal to about 2500 MPa, higher than about 2600 MPa, or equal to, greater than or equal to about 2700 MPa, greater than or equal to about 2800 MPa, greater than or equal to about 2900 MPa, greater than or equal to about 3000 MPa, greater than or equal to about 3100 MPa, about 3200 MPa higher than or equal to, higher than or equal to about 3300 MPa, higher than or equal to about 3400 MPa, higher than or equal to about 3500 MPa, higher than or equal to about 3600 MPa, higher than or equal to about 3700 MPa The conductive joint may be selected to have a stiffness modulus equal to, greater than or equal to about 3800 MPa, greater than or equal to about 3900 MPa, or greater than or equal to about 4000 MPa. In such variations, the interconnects can withstand thermal expansion or contraction of the interconnects, for example, greater than or equal to about 40 microns. Suitable conductive adhesives may include, for example, Hitachi CP-450 and solder.

Accordingly, the conductive joints between overlapping adjacent solar cells within a supercell may utilize a different conductive adhesive than the conductive joints between the supercell and the flexible electrical interconnect. For example, conductive joints between supercells and flexible electrical interconnects may be formed from solder, and conductive joints between overlapping and adjacent solar cells may be formed from non-solder conductive adhesives. In some variations, both conductive adhesives can be cured in a single process step, eg, in a process window of about 150<0>C to about 180<0>C.

The above description has focused on assembling multiple solar cells (which may be cut solar cells) in a shingled manner on a common substrate. As a result of this, a module is formed.

However, in order to collect sufficient amounts of solar energy to be useful, installations typically include a large number of such modules that will themselves be assembled together. According to embodiments, multiple solar modules may also be assembled in a shingled manner to increase the area efficiency of the array.

In certain embodiments, a module may include an upper conductive ribbon facing in the direction of solar energy and a lower conductive ribbon facing away from the direction of solar energy.

The lower ribbon is buried beneath the battery. Therefore, it does not block the incident light and does not adversely affect the area efficiency of the module. In contrast, the upper ribbon is exposed and blocks incoming light, which can adversely affect efficiency.

According to embodiments, the modules themselves are shingled, so that the upper ribbon can be covered by neighboring modules. This shingled module configuration may also provide additional area on the module for other elements without adversely affecting the final exposed area of the module array. Examples of modular elements that may be located in overlapping regions may include, but are not limited to, junction boxes (j-boxes) and/or bus ribbons.

In certain embodiments, the J-boxes of each adjacent shingled module are arranged in a mating manner to achieve an electrical connection therebetween. This simplifies the construction of the array of shingled modules by eliminating wiring.

In certain embodiments, the j-box may be reinforced with and/or combined with additional structural standoffs. Such a configuration may create an integrated, tilted, modular roof-mounted rack solution where the dimensions of the junction box determine the tilt. Such embodiments may be particularly useful when the array of shingled modules is attached to a flat roof.

The shingled supercell is unique for module layout with respect to module-level power management devices (e.g., DC/AC microinverters, DC/DC module power optimizers, voltage intelligence and smart switches, and related devices). create opportunities. The main feature of module-level power management systems is power optimization. Supercells, such as those described and employed herein, can generate higher voltages than traditional panels. In addition, the supercell module layout may further divide the modules. Both higher voltage and further partitioning create potential benefits for power optimization.

Herein, narrow rectangles arranged in a shingled manner and electrically connected in series form a supercell with the supercells arranged in multiple physically parallel rows within a solar module. A highly efficient solar module (i.e., solar panel) that includes silicon solar cells is disclosed. The supercells may have a length that spans essentially the entire length or width of the solar module, for example, or two or more supercells may be arranged end-to-end in a row. . Each supercell may include, for example, in some variations at least 19 solar cells, and in certain variations greater than or equal to 100 silicon solar cells. may include several solar cells. Each solar module has a conventional size and shape, yet contains several hundred silicon solar cells, such that the supercells within a single solar module are electrically interconnected, e.g. It may be possible to provide direct current (DC) voltages from (V) to about 450V or higher.

As explained further below, this high DC voltage requires direct current to alternating current (AC) conversion by an inverter (e.g., a microinverter located on a solar module) before DC-to-AC conversion by the inverter. Facilitates by eliminating or reducing the need for DC boost (increasing DC voltage). Also, as explained further below, the high DC voltage is the high voltage DC output from two or more high voltage shingled solar modules electrically connected in parallel to each other. It also facilitates the use of an arrangement carried out by a central inverter.

Turning now to the drawings for a more detailed understanding of the solar modules described herein, FIG. 1 shows a cross-sectional view of a string of series-connected solar cells 10 arranged in a shingled configuration. Each solar cell 10 includes a semiconductor diode structure and a plurality of electrical contacts to the semiconductor diode structure. Thereby, the current generated within the solar cell 10 when the solar cell 10 is irradiated with light can be provided to an external load.

In the examples described herein, each solar cell 10 has a rectangular shape with a metallization pattern on the front (sun side) and back (shadow side) sides that provides electrical contact on opposite sides of the n-p junction. A crystalline silicon solar cell, in which the front metallization pattern is disposed on a semiconductor layer of n-type conductivity and the backside metallization pattern is disposed on a semiconductor layer of p-type conductivity. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements may be used as appropriate. For example, a front (sun side) metallization pattern may be disposed on a semiconductor layer of p-type conductivity, and a back (shadow side) side metallization pattern may be disposed on a semiconductor layer of n-type conductivity.

Referring again to FIG. 1, in the supercell 100, adjacent solar cells 10 electrically connect the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cell in the area where they overlap. They are conductively bonded to each other by an electrically conductive bonding agent. Suitable electrically conductive bonding agents may include, for example, electrically conductive adhesives, electrically conductive adhesive films and tapes, and conventional solders.

2A-2R illustrate an exemplary rectangular solar module 200 that includes six rectangular supercells 100, each having a length approximately equal to the length of a long side of the solar module. The supercells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the module. A similarly constructed solar module may include more or fewer rows of supercells of such side lengths than shown in this example. In another variation, the supercells each have a length approximately equal to the length of the short sides of the rectangular solar module and are arranged in parallel rows with their long sides oriented parallel to the short sides of the module. may be placed. In yet other arrangements, each row may include two or more supercells electrically interconnected in series. The module may have a short side that is, for example, about 1 meter in length and a long side that is, for example, about 1.5 to about 2.0 meters in length. Any other suitable shape (eg, square) and size for the solar module may also be used.

In some variations, the conductive junctions between the overlapping solar cells are connected in a direction parallel to the rows at temperatures ranging from about -40°C to about 100°C without damaging the solar module. Provides a plurality of supercells with mechanical compliance that accommodates the thermal expansion mismatch between the supercells and the solar module's glass front sheet.

Each supercell in the illustrated example has a width equal to or approximately equal to one-sixth of the width of a conventionally sized 156 mm square or pseudo-square silicon wafer and a length of a square or pseudo-square wafer. Contains 72 rectangular solar cells equal or approximately equal in width. More generally, the rectangular silicon solar cells employed in the solar modules described herein have a length equal to or approximately equal to, for example, the width of a conventionally sized square or pseudo-square silicon wafer; For example, it may have a width equal to or approximately equal to 1/M of the width of a conventionally sized square or pseudo-square wafer. M is any integer that is ≦20. M may be 3, 4, 5, 6 or 12, for example. M may be greater than 20. A supercell may include any suitable number of such rectangular solar cells.

The supercells within solar module 200 can be interconnected in series by electrical interconnects (optionally, flexible electrical interconnects) or by module-level power electronics as described below to create a conventional sized solar module. Therefore, it is possible to provide a higher voltage than before. This is because the shingling approach just described incorporates more batteries per module than previously. For example, conventional sized solar modules, including supercells made from silicon solar cells cut into 1/8 pieces, can contain over 600 solar cells per module. In comparison, conventional sized solar modules that include conventionally interconnected silicon solar cells of conventional size typically include about 60 solar cells per module. Within conventional silicon solar modules, square or pseudo-square solar cells are typically interconnected by copper ribbons and separated from each other to accommodate the interconnects. In such cases, cutting a conventionally sized square or pseudo-square wafer into narrow rectangles would reduce the total amount of active solar cell area within the module and therefore reduce the additional required The battery-to-battery interconnects will cause a drop in module power. In contrast, within the solar modules disclosed herein, the shingled arrangement hides the cell-to-cell electrical interconnections beneath the active solar cell area. As a result, the solar modules described herein have little or no trade-off between module power and the number of solar cells (and required intercell interconnections) within the solar module. , can provide high output voltage without reducing module output power.

When all solar cells are connected in series, a shingled solar module as described herein may provide a DC voltage in the range of, for example, about 90 volts to about 450 volts, or higher. . As mentioned above, this high DC voltage can be advantageous.

For example, microinverters placed on or near solar modules can be used for module-level power optimization and DC-AC conversion. 49A-49B, conventionally, a microinverter 4310 receives a 25V to 40V DC input from a single solar module 4300 and outputs a 230V AC output to match the grid to which it connects. Microinverters typically include two major components, a DC/DC boost and a DC/AC inversion. DC/DC boost is utilized to increase the DC bus voltage required for DC/AC conversion and is typically the most costly and lossy component (2% efficiency loss). Since the solar modules described herein provide high voltage output, the need for DC/DC boost may be reduced or eliminated (FIG. 49B). This may reduce the cost of solar module 200 and increase efficiency and reliability.

In conventional arrangements using central ("string") inverters rather than microinverters, conventional low DC output solar modules are electrically connected in series to each other and to the string inverters. The voltage produced by a string of solar modules is equal to the sum of the individual module voltages since they are connected in series. The allowed voltage range determines the maximum and minimum number of modules in the string. The maximum number of modules is set by the module voltage and prescribed voltage limits. For example, N _max ×V _oc <600V (residential standards in the US) or N _max ×V _oc <1,000V (commercial standards). The minimum number of modules in series is set by the module voltage and the minimum operating voltage required by the string inverter. N _min ×V _mp > V _Invertermin . The minimum operating voltage (V _Invertermin ) required by a string inverter (eg, a Fronius, Powerone, or SMA inverter) is typically between about 180V and about 250V. Typically, the optimal operating voltage for string inverters is about 400V.

A single high DC voltage shingled solar module as described herein can operate at a voltage greater than the minimum operating voltage required by the string inverter, optionally at the optimum operating voltage of the string inverter. , or close to it. As a result, the high DC voltage shingled solar modules described herein may be electrically connected to string inverters in parallel with each other. This avoids string length requirements for strings of series-connected modules that can complicate system design and installation. Also, in a series-connected string of solar modules, the module with the lowest current will dominate, and the system will be able to connect different If the modules are exposed to different irradiations, they cannot operate efficiently. The parallel high voltage module configuration described herein may also avoid these problems since the current through each solar module is independent of the current through other solar modules. Furthermore, such an arrangement does not require module-level power electronics and may therefore improve the reliability of the solar module, which is particularly important in variants where the solar module is placed on the roof. could be.

Referring now to FIGS. 50A-50B, as explained above, a supercell can extend approximately the entire length or width of a solar module. Hidden (from front view) electrical tap connection points can be integrated into the solar module structure to enable electrical connections along the length of the supercell. This can be achieved by connecting electrical conductors to the back metallization of the solar cell at the ends of the supercell or at intermediate locations. Such hidden taps allow for electrical segmentation of the supercell, allowing bypass diodes, module-level power electronics (e.g., microinverters, power optimizers, voltage intelligence, and smart switches and related devices) or other components. The use of hidden taps is further described in US Provisional Application No. 62/081,200, US Provisional Application No. 62/133,205, and US Application No. 14/674,983. Each of these is incorporated herein by reference in its entirety.

In the examples of FIG. 50A (example physical layout) and FIG. 50B (example electrical schematic), the illustrated solar modules 200 each include six solar modules electrically connected in series to provide a high DC voltage. Includes a supercell 100. Each supercell is electrically segmented by hidden taps 4400 into several solar cell groups, with each solar cell group electrically connected in parallel with a different bypass diode 4410. In these examples, the bypass diode is placed within the stacked structure of the solar module, ie, the solar cells are within the encapsulation between the front transparent sheet and the backing sheet. Alternatively, the bypass diode may be placed in a junction box located on the backside or edge of the solar module and interconnected to the hidden tap by an extending conductor.

In the example of FIG. 51A (physical layout) and FIG. 51B (corresponding electrical circuit diagram), the illustrated solar module 200 also includes six supercells 100 electrically connected in series to provide a high DC voltage. In this example, the solar module is electrically segmented into three pairs of supercells connected in series with each pair of supercells electrically connected in parallel with a different bypass diode. In this example, the bypass diode is placed in a junction box 4500 located at the rear of the solar module. The bypass diode may alternatively be located within the stacked structure of the solar module or in an edge-mounted junction box.

In the example of FIGS. 50A-51B, in normal operation of the solar module, each solar cell is forward biased and therefore all bypass diodes are reverse biased and non-conducting. However, if one or more solar cells in a group are reverse biased with a sufficiently high voltage, the bypass diode corresponding to that group will be in the ON state and the current flow through the module will be reverse biased. It would bypass the solar cells. This prevents dangerous hot spots from forming in shadowed or failing solar cells.

Alternatively, the bypass diode functionality may be achieved in module-level power electronics, such as a microinverter placed on or near the solar module. (Module-level power electronics, and their use may also be referred to herein as module-level power management devices or systems, and module-level power management. Such modules optionally integrated with solar modules power electronics from the supercell group (e.g., by operating a supercell group, a supercell, or a supercell segment within an electrically segmented supercell at its maximum power point). The power from each supercell or from each individual supercell segment may be optimized, thereby allowing individual power optimization within the module. or when to bypass specific individual supercells and/or one or more specific supercell segments, the module level power electronics may eliminate the need for any bypass diodes within the module. It can be lost.

This can be achieved, for example, by integrating voltage intelligence at the module level. By monitoring the voltage output of a solar cell circuit (e.g., one or more supercells, or a segment of a supercell) within a solar module, a "smart switch" determines whether the circuit contains any reverse-biased solar cells. ” The power management device can determine. If a reverse biased solar cell is detected, the power management device can disconnect the corresponding circuit from the electrical system using, for example, a relay switch or other component. For example, if the voltage of a monitored solar cell circuit falls below a predetermined threshold, the power management device will shut off (open the circuit) that circuit. The predetermined threshold may be, for example, a certain percentage or magnitude (eg, 20% or 10V) compared to normal operation of the circuit. Examples of such voltage intelligence may be incorporated into existing module-level power electronics products (e.g., from Enphase Energy Inc., Solaredge Technologies, Inc., Tigo Energy, Inc.) or through custom circuit design. obtain.

52A (physical layout) and FIG. 52B (corresponding electrical schematic) illustrate example structures for module-level power management of high voltage solar modules that include shingled supercells. In this example, the rectangular solar module 200 includes six rectangular shingled supercells 100 arranged in six rows extending the length of the long sides of the solar module. The six supercells are electrically connected in series to provide high DC voltage. Module-level power electronics 4600 may perform voltage sensing, power management, and/or DC/AC conversion for the entire module.

53A (physical layout) and FIG. 53B (corresponding electrical schematic) illustrate other exemplary structures for module-level power management of high voltage solar modules including shingled supercells. In this example, the rectangular solar module 200 includes six rectangular shingled supercells 100 arranged in six rows extending the length of the long sides of the solar module. The six supercells are electrically grouped into three pairs of supercells connected in series. Each pair of supercells individually performs voltage sensing and power optimization for individual pairs of supercells, two or more of which may be connected in series to provide a high DC voltage, and and/or connect to module-level power electronics 4600 that may perform DC/AC conversion.

54A (physical layout) and FIG. 54B (corresponding electrical schematic) illustrate other exemplary structures for module-level power management of high voltage solar modules including shingled supercells. In this example, the rectangular solar module 200 includes six rectangular shingled supercells 100 arranged in six rows extending the length of the long sides of the solar module. Each supercell individually performs voltage sensing and power optimization for each supercell, two or more of which may be connected in series to provide a high DC voltage, and/or Connects to module level power electronics 4600 that can perform AC conversion.

55A (physical layout) and FIG. 55B (corresponding electrical schematic) illustrate other exemplary structures for module-level power management of high voltage solar modules including shingled supercells. In this example, the rectangular solar module 200 includes six rectangular shingled supercells 100 arranged in six rows extending the length of the long side of the solar module. Each supercell is electrically segmented by hidden taps 4400 into two or more solar cell groups. Each resulting solar cell group may perform voltage sensing and power optimization for each solar cell group individually, and multiple such groups may be connected in series to provide a high DC voltage, and/or Connects to module level power electronics 4600 that can perform DC/AC conversion.

In some variations, two or more high voltage DC shingled solar modules as described herein are electrically connected in series to provide a high voltage that is converted to AC by an inverter. Provides DC output. The inverter may be, for example, a microinverter integrated with one of the solar modules. In such cases, the microinverter may optionally be a component of module-level power management electronics that also performs additional sensing and connectivity functions as described above. Alternatively, the inverter may be a central "string" inverter as described further below.

As shown in Figure 56, when stringing multiple supercells in series within a solar module, adjacent supercell rows are slightly offset from each other in a staggered manner along their long axes. It can be done. This offset from each other saves module area (space/length) and streamlines manufacturing while placing adjacent ends of the supercell rows on top of one supercell and on top of the other supercell. An interconnect 4700 that joins the bottom of the circuit allows a series electrical connection. Adjacent supercell rows may be offset by about 5 millimeters, for example.

The differential thermal expansion between the electrical interconnect 4700 and the silicon solar cell, and the resulting stress on the solar cell and the interconnect, can lead to cracks and other defects that can reduce solar module performance. It can lead to the form of As a result, it is desirable that the interconnect be flexible and configured to accommodate such differential expansion without exhibiting substantial stress. The interconnects may be made of materials with a low coefficient of thermal expansion (e.g. Kovar, Invar, or other low thermal expansion Accommodate the differential thermal expansion between the interconnect and the silicon solar cell by being formed from an iron-nickel alloy) or from a material with a coefficient of thermal expansion approximately matching that of silicon and/or out-of-plane geometries such as kinks, jogs, or dimples to accommodate such differential thermal expansion. Features may be employed to provide stress and thermal expansion mitigation. The conductive portions of the interconnects may have a thickness, for example, less than about 100 microns, less than about 50 microns, less than about 30 microns, or less than about 25 microns to increase the flexibility of the interconnects. (The generally low current in these solar modules allows the use of thin, flexible, conductive ribbons without excessive power losses resulting from the electrical resistance of thin interconnects.)

In some variations, the conductive bond between the supercell and the flexible electrical interconnect can withstand temperatures ranging from about −40° C. to about 180° C. without damaging the solar module. , to accommodate thermal expansion mismatch between the supercell and the flexible electrical interconnect.

FIG. 7A (also discussed above) illustrates several exemplary interconnect configurations, identified by reference numbers 400A-400T, that employ in-plane stress-relaxing geometry features, and FIG. 7B-1 and 7B-2 illustrate exemplary interconnect configurations identified by reference numbers 400U and 3705 that employ out-of-plane stress relief geometry features. Any one of these interconnect configurations, or any combination thereof, employing stress relief features electrically interconnects supercells such as those described herein in series to provide high DC voltages. It may be suitable for

The discussion related to FIGS. 51A-55B has focused on module-level power management, possibly using DC/AC conversion of high DC module voltages by module-level power electronics to provide AC output from the module. As mentioned above, DC/AC conversion of high DC voltages from shingled solar modules as described herein may alternatively be performed by a central string inverter. For example, FIG. 57A shows an optical system including a plurality of high DC voltage shingled solar modules 200 electrically connected to each other in parallel to a string inverter 4815 via a high DC voltage negative bus 4820 and a high DC voltage positive bus 4810. 4 schematically illustrates an electromotive force system 4800. Typically, each solar module 200 includes a plurality of shingled supercells electrically connected in series with electrical interconnects to provide a high DC voltage, as described above. Solar module 200 may optionally include a bypass diode arranged, for example, as described above. FIG. 57B shows an example placement of a photovoltaic system 4800 on a roof.

In some variations of the photovoltaic system 4800, two or more short series-connected strings of high DC voltage shingled solar modules may be electrically connected in parallel with a string inverter. Referring again to FIG. 57A, for example, each solar module 200 may be replaced with a series connected string of two or more high DC voltage shingled solar modules 200. This may be done, for example, to maximize the voltage provided to the inverter while complying with regulatory standards.

Conventional solar modules typically produce about 8 Amps Isc (short circuit current), about 50 Voc (open circuit voltage), and about 35 Vmp (maximum power point voltage). As described above, the present invention includes M times as many solar cells as conventional (each having an area of about 1/M compared to the area of a conventional solar cell). Such high DC voltage shingled solar modules produce roughly M times higher voltage and 1/M lower current compared to conventional solar modules. As mentioned above, M can be any suitable integer, typically ≦20, but may be greater than 20. M can be 3, 4, 5, 6 or 12, for example.

For M=6, the Voc of the high DC voltage shingled solar module may be, for example, about 300V. Connecting two such modules in series will provide approximately 600V DC to the bus. This complies with the maximum values set by US residential standards. For M=4, the Voc of the high DC voltage shingled solar module may be, for example, about 200V. Connecting three such modules in series would provide approximately 600V DC to the bus. For M=12, the Voc of the high DC voltage shingled solar module may be, for example, about 600V. It is also possible to configure systems with bus voltages below 600V. In such variants, the high DC voltage shingled solar modules are arranged in pairs, or in sets of three, for example in a combiner box, or in any other suitable combination. can be connected to provide the optimum voltage to the inverter.

The challenge that arises from the parallel configuration of high DC voltage shingled solar modules described above is that if a short circuit occurs in one solar module, the other solar modules can potentially (ie, driving current through the shorted module and dissipating the power in the shorted module), creating a hazard. This problem can be addressed, for example, by the use of blocking diodes placed to prevent other modules from driving current through the shorted module, by the use of current-limiting fuses, or by the use of current-limiting fuses in combination with blocking diodes. This can be avoided by using . FIG. 57B schematically illustrates the use of two current limiting fuses 4830 on the positive and negative terminals of the high DC voltage shingled solar module 200.

The placement of blocking diodes and/or fuses for protection purposes may depend on whether the inverter includes a transformer. Systems using inverters that include transformers typically ground the negative conductor. Systems using transformerless inverters typically do not ground the negative conductor. For transformerless inverters, it may be preferable to have a current limiting fuse in line with the positive terminal of the solar module and another current limiting fuse in line with the negative terminal.

Blocking diodes and/or current limiting fuses can be mounted, for example, with each module in a junction box or in a module stack. Suitable junction boxes, blocking diodes (eg, side-by-side blocking diodes), and fuses (eg, side-by-side fuses) may include those available from Shoals Technology Group.

FIG. 58A shows an exemplary high voltage DC shingled solar module that includes a junction box 4840 in which a blocking diode 4850 is aligned with the positive terminal of the solar module. The junction box does not contain current limiting fuses. This configuration may be preferably used in combination with one or more current limiting fuses located elsewhere (e.g. in the combiner box) and alongside the positive and/or negative terminals of the solar module (e.g. See Figure 58D). FIG. 58B shows an exemplary high voltage DC shingled solar module that includes a junction box 4840 in which a blocking diode is aligned with the positive terminal of the solar module and a current limiting fuse 4830 is aligned with the negative terminal. FIG. 58C shows an exemplary high voltage DC shingled solar module including a junction box 4840 in which a current limiting fuse 4830 is aligned with the positive terminal of the solar module and another current limiting fuse 4830 is aligned with the negative terminal. shows. FIG. 58D shows an exemplary high voltage DC shingle structure including a junction box 4840 configured as in FIG. 58A and a fuse located outside the junction box in line with the positive and negative terminals of the solar module. The figure shows a shaped solar cell module.

59A-59B, as an alternative to the configuration described above, all blocking diodes and/or current limiting fuses of a high DC voltage shingled solar module are mounted together in a combiner box 4860. may be placed. In these variations, one or more individual conductors extend separately from each module to the combiner box. In one option, as shown in Figure 59A. A single conductor of one polarity (eg, negative as shown) is shared between all modules. In another option (FIG. 59B), both polarities have individual conductors for each module. Although FIGS. 59A-59B only show fuses located within the combiner box 4860, any suitable combination of fuses and/or blocking diodes may be located within the combiner box. Additionally, electronics may be implemented within the combiner box to perform other functions, such as, for example, monitoring, tracking maximum power points, and/or disconnecting individual modules or groups of modules.

Reverse-biased operation of a solar module occurs when one or more solar cells within the solar module are shadowed or otherwise produce a small current, and the solar module This can occur if the voltage-current point is being operated to drive a larger current through the solar cell at a lower current than is possible. Reverse biased solar cells can heat up and create a dangerous situation. For example, a parallel arrangement of high DC voltage shingled solar modules as shown in FIG. 58A may allow the modules to be protected from reverse bias operation by setting the appropriate operating voltage of the inverter. This is illustrated, for example, in FIGS. 60A-60B.

FIG. 60A shows a current vs. voltage plot 4870 and a power vs. voltage plot 4880 for a parallel connected string of approximately 10 high DC voltage shingled solar modules. These curves were calculated for a model in which the solar modules did not contain any reverse biased solar cells. Since the solar modules are electrically connected in parallel, they all have the same operating voltage and their currents are summed. Typically, an inverter probes a power-voltage curve by varying the load on the circuit, identifies the maximum pole on that curve, and then operates the module circuit at that point to maximize the output power. become

In contrast, FIG. 60B shows a current vs. voltage plot 4890 and power of the model system of FIG. 60A for the case where some of the solar modules in the circuit include one or more reverse biased solar cells. A plot 4900 of voltage versus voltage is shown. The reverse biased module transitions in an exemplary current-voltage curve from about 10 amp operation at voltages down to about 210 volts to about 16 amp operation at voltages less than about 200 volts. Appears through the formation of shapes. At voltages less than about 210 volts, shaded modules include reverse biased solar cells. A reverse biased module also manifests itself in the power-voltage curve by the presence of two maxima, an absolute maximum at about 200 volts and a local maximum at about 240 volts. The inverter may be configured to recognize such indications of a reverse biased solar module and operate the solar module at an absolute maximum or local maximum power point voltage where no module is reverse biased. In the example of FIG. 60B, the inverter may operate the modules at local maximum power points to ensure that no modules are reverse biased. Additionally or alternatively, a minimum operating voltage may be selected for the inverter below which any module is unlikely to be reverse biased. The minimum operating voltage may be adjusted based on other parameters such as environmental temperature, operating current and calculated or measured solar module temperature and other information received from external sources, such as radiance.

In some embodiments, the high DC voltage solar modules themselves are arranged with adjacent solar modules in a partially overlapping manner and optionally electrically interconnected in their overlapping regions. Can be shingled. Such a shingled configuration may optionally be used for electrically connecting high-voltage solar modules in parallel, providing high DC voltage to string inverters, or for micro-inverters converting the high DC voltage of the solar modules to AC module output. may be used in conjunction with high voltage solar modules, each comprising: Pairs of high voltage solar modules may, for example, be shingled as just described and electrically connected in series to provide the desired DC voltage.

Traditional string inverters often require that 1) they must be able to accommodate different string lengths of modules connected in series, and 2) some modules within a string must be fully or partially 3) changes in environmental temperature and radiation will change the module voltage, so it is necessary to have a fairly wide range of potential input voltages (or "dynamic range"). In systems employing a parallel structure as described in , the length of the string of parallel-connected solar modules has no effect on the voltage.Furthermore, some modules are partially shaded, and some If one is not shaded, one can decide to operate the system at the voltage of the non-shaded module (e.g. as explained above). Therefore, the input voltage of the inverter in a parallel construction system The range may only need to accommodate the "dynamic range" of element #3 "temperature and radiation changes", which is smaller, e.g. about the traditional dynamic range required for an inverter. 30%, so inverters employed with parallel construction systems such as those described herein can operate within a narrower range, e.g., between about 250 volts at normal conditions and about 175 volts at high temperatures and low emissions. or, for example, about 450 volts at standard conditions and about 350 volts at high temperature and low radiation (in which case 450 volt MPPT (maximum power point tracking) operation corresponds to a V _OC of less than 600 volts at the lowest temperature operation In addition, as explained above, the inverter can receive sufficient DC voltage to convert directly to AC without a boost stage. , string inverters employed with parallel construction systems such as those described herein are simpler, have lower cost, and may operate with higher efficiency than string inverters employed in conventional systems.

For both microinverters and string inverters employed with the high voltage DC shingled solar modules described herein, the solar module (or short It may be preferable to configure the series-connected strings to provide a DC voltage that operates in excess of AC peak-to-peak (eg, maximum power point Vmp). For example, for 120V AC, peak-to-peak is sqrt(2)*120V=170V. Thus, a solar module may be configured to provide a minimum Vmp of about 175V, for example. Under normal conditions, Vmp may be approximately 212V (assuming a negative voltage temperature coefficient of 0.35%, and a maximum operating temperature of 75°C), and at the lowest temperature operating condition (e.g. -15°C), Vmp is , about 242V (depending on the module fill factor), and thus may be Voc below about 300V. For single-phase 120V AC (or 240V AC), all of these numbers double, since 600V DC is the maximum allowed in the United States for many residential applications. It's convenient. For commercial applications that require and allow higher voltages, these numbers can be even higher.

High voltage shingled solar modules as described herein may be configured to operate at >600 V _OC or >1000 V _OC , in which case the module provides It may include integrated power electronics to prevent external voltages from exceeding specified requirements. Such an arrangement may allow operation V _mp to be sufficient for single phase 120V (240V, approximately 350V required) without the problem of V _OC exceeding 600V at low temperatures.

If a building's connection to the power grid is severed, for example by firefighters, the solar modules that provide electricity to the building (e.g. on the roof of the building) will still generate electricity as long as the sun is shining. You can. A concern raised by this is that such solar modules could leave the roof "inhabited" with dangerous voltages after the building is disconnected from the electrical grid. To address this concern, the high voltage DC shingled solar modules described herein may optionally include a disconnect switch, such as within or adjacent the module junction box. The disconnector may be, for example, a physical disconnector or a solid-state disconnector. The disconnector may be configured, for example, to be in a "normally OFF state" to disconnect the high voltage output of the solar module from the roof circuit when it no longer receives a particular signal (e.g., from an inverter). Communication to the disconnector may occur, for example, on a high voltage cable, through a separate wire, or wirelessly.

An important advantage of shingling high voltage solar modules is the diffusion of heat between the solar cells within the shingled supercell. Applicants have discovered that heat can be easily transferred along a silicon supercell through thin electrically and thermally conductive junctions between adjacent and overlapping silicon solar cells. The thickness of the electrically conductive bond between adjacent overlapping solar cells formed by the electrically conductive bonding agent, measured perpendicular to the front and back surfaces of the solar cells, is, for example, less than or equal to about 200 microns. or less than or equal to about 150 microns, or less than or equal to about 125 microns, or less than or equal to about 100 microns, or less than or equal to about 90 microns, or greater than about 80 microns. Thickness less than or equal to, or less than or equal to about 70 microns, or less than or equal to about 60 microns, or less than or equal to about 50 microns, or less than or equal to about 25 microns. It can be. Such thin junctions reduce resistive losses in the interconnections between the cells and also encourage heat flow along the supercell from any hot spots within the supercell that may appear during operation. . The thermal conductivity of the junction between solar cells can be, for example, ≧about 1.5 Watt/(meter K). Furthermore, the rectangular aspect ratio of the solar cells typically employed herein increases the area of thermal contact between adjacent solar cells.

In contrast, in conventional solar modules that employ ribbon interconnects between adjacent solar cells, heat generated in one solar cell is transferred through those ribbon interconnects to other solar cells in the module. It does not spread easily to. This makes conventional solar modules more susceptible to hot spots than the solar modules described herein.

Additionally, the supercells described herein are typically shingled with rectangular solar cells, each having an active area (e.g., 1/6) smaller than the active area of a conventional solar cell. Because the current flow through the supercells in the solar modules described herein is typically less than the current flow through a string of conventional solar cells.

As a result, less heat is dissipated in the solar modules disclosed herein in reverse-biased solar cells at breakdown voltage, allowing supercells and solar modules to be dissipated without creating dangerous hot spots. Heat can easily diffuse through.

Several additional and optional features make high voltage solar modules employing supercells as described herein even more resistant to heat dissipated in reverse biased solar cells. It may have the following. For example, supercells can be encapsulated within thermoplastic olefinic (TPO) polymers. TPO encapsulants are more photothermally stable than standard ethylene vinyl acetate (EVA) encapsulants. EVA browns with temperature and UV light, leading to problems with hot spots caused by batteries limiting current. Additionally, the solar module may have a glass-to-glass structure in which the encapsulated supercell is sandwiched between a front sheet of glass and a back sheet of glass. Such glass-to-glass construction allows solar modules to safely operate at higher temperatures than traditional polymer backsheets can withstand. Furthermore, if present, the junction box may be mounted on one or more edges of the solar module rather than at the rear of the solar module. Here the junction box would add an additional layer of thermal isolation to the module solar cells above it.

Applicants therefore note that heat flow through the supercell may enable the module to operate without the substantial risks associated with reverse biased solar cell or cells; We recognize that high voltage solar modules formed from supercells such as those described in this paper may employ far fewer bypass diodes than are employed within conventional solar modules. For example, in some variations, high voltage solar modules as described herein include less than one bypass diode per 25 solar cells, less than one bypass diode per 30 solar cells, less than one bypass diode per 30 solar cells, and less than one bypass diode per 30 solar cells. less than 1 bypass diode per 5 solar cells, less than 1 bypass diode per 75 solar cells, less than 1 bypass diode per 100 solar cells, only a single bypass diode may be employed, or It is not necessary to use a bypass diode.

Referring now to FIGS. 61A-61C, an exemplary high voltage solar module that utilizes bypass diodes is provided. The use of bypass diodes may prevent or reduce damage to the module if part of the solar module is in shadow. For the exemplary solar module 4700 shown in FIG. 61A, ten supercells 100 are connected in series. As shown, the ten supercells are arranged in parallel rows. Each supercell includes 40 series-connected solar cells 10, each of which is made of approximately 1/6 square or pseudo-square, as described herein. It is being In normal unshadowed operation, current flows into and out of junction box 4716 through each of the series connected supercells 100 through connector 4715 and then flows out through junction box 4717. Optionally, a single junction box may be used instead of separate junction boxes 4716 and 4717 so that the current returns to one junction box. The example shown in FIG. 61A shows an implementation using approximately one bypass diode per supercell. As shown, a single bypass diode makes an electrical connection between a pair of neighboring supercells at approximately midpoints along the supercell (e.g., a single bypass diode 4901A connects the first supercell A second bypass diode 4901B is electrically connected between the 22nd solar cell in the second supercell and a neighboring solar cell in the second supercell. connect, etc.). The first battery string and the last battery string have only approximately half the number of solar cells in the supercell per bypass diode. For the example shown in FIG. 61A, the first battery string and the last battery string include only 22 batteries per bypass diode. For the high voltage solar module variant illustrated in FIG. 61A, the total number of bypass diodes (11) is equal to the number of supercells plus one additional bypass diode.

Each bypass diode may be incorporated into a flex circuit, for example. Referring now to FIG. 61B, a close-up view of the bypass diode connection areas of two neighboring supercells is shown. The view in FIG. 61B is viewed from the side that is not exposed to sunlight. As shown, two solar cells 10 on neighboring supercells are electrically connected using a flex circuit 4718 that includes a bypass diode 4720. Flex circuit 4718 and bypass diode 4720 electrically connect to solar cell 10 using contact pads 4719 located on the backside of the solar cell. (See also further discussion below on the use of hidden contact pads to provide hidden taps for bypass diodes.) Additional bypass diode electrical connection schemes reduce the number of solar cells per bypass diode. can be adopted. An example is illustrated in FIG. 61C. As shown, one bypass diode makes an electrical connection between each pair of neighboring supercells approximately midway along the supercells. A bypass diode 4901A provides an electrical connection between neighboring solar cells on the first and second supercells, a bypass diode 4901B provides an electrical connection between neighboring solar cells on the second and third supercells, and a bypass diode 4901B provides an electrical connection between neighboring solar cells on the second and third supercells. 4901C makes an electrical connection between neighboring solar cells on the third and fourth supercells, and so on. A second set of bypass diodes may be included to reduce the number of solar cells that would be bypassed if partial shading occurs. For example, bypass diode 4902A is electrically connected between the first supercell and the second supercell at a midpoint between bypass diode 4901A and bypass diode 4901B, and bypass diode 4902B is electrically connected between the second supercell and the second supercell. 3 supercells, electrical connection at the midpoint between bypass diode 4901B and bypass diode 4901C, etc., thereby reducing the number of cells per bypass diode. Optionally, yet another set of bypass diodes may be electrically connected to further reduce the number of solar cells that are bypassed in the event of partial shading. A bypass diode 4903A is electrically connected between the first supercell and the second supercell at an intermediate point between the bypass diode 4902A and the bypass diode 4901B, and a bypass diode 4903B is electrically connected between the second supercell and the third supercell. An electrical connection is made to the cells at a midpoint between bypass diode 4902B and bypass diode 4901C, which further reduces the number of cells per bypass diode. This configuration results in a nested configuration of bypass diodes that allows small groups of cells to be bypassed during partial shading. Additional diodes are electrically connected in this manner until the desired number of solar cells per bypass diode is achieved, e.g., about 8, about 6, about 4, or about 2 per bypass diode. It is possible. In some modules, about four solar cells per bypass diode is desirable. If desired, one or more of the bypass diodes illustrated in FIG. 61C may be incorporated into a hidden flexible interconnect as illustrated in FIG. 61B.

This specification discloses solar cell cleaving tools and solar cell cleaving methods that can be used, for example, to separate conventionally sized square or pseudo-square solar cells into a plurality of narrow rectangular or near-rectangular solar cells. . These cleaving tools and methods draw a vacuum between the bottom of a conventionally sized solar cell and a curved support surface to bend the conventionally sized solar cell toward the curved support surface, thereby cleaving the pre-prepared Cleave the solar cell along the scribe line. An advantage of these cleaving tools and methods is that they do not require physical contact with the top surface of the solar cell. As a result, these cleaving tools and methods can be employed to cleave solar cells that include soft and/or uncured materials on the top surface that can be damaged by physical contact. Additionally, in some variations, these cleaving tools and methods may require contact with only a portion of the bottom surface of the solar cell. In such variations, these cleaving tools and methods may be employed to cleave solar cells that include soft and/or uncured material on the portion of the bottom surface that is not contacted by the cleaving tool.

For example, one solar cell manufacturing method utilizing the cleavage tools and methods disclosed herein includes:
laser scribing one or more scribe lines on each of the one or more conventional sized silicon solar cells to define a plurality of rectangular regions on the one or more silicon solar cells;
applying an electrically conductive adhesive adhesive to a portion of the top surface of the one or more silicon solar cells;
Applying a vacuum between the bottom surface of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells toward the curved support surface, thereby bending the one or more silicon solar cells along the one or more scribe lines. cleaving the one or more silicon solar cells to provide a plurality of rectangular silicon solar cells each including a portion of an electrically conductive adhesive adhesive disposed on the front side adjacent the long side. The conductive adhesive bonding agent can be applied to conventional sized silicon solar cells either before or after the solar cells are laser scribed.

The resulting plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells shingled with a portion of the electrically conductive adhesive bonding agent in between. can be done. The electrically conductive bonding agent may then be cured, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and electrically connecting them in series. This process forms shingled "supercells" as described in the patent applications listed in the "Cross Reference to Related Applications" section above.

To better understand the cleaving tools and methods disclosed herein, turning now to the drawings, FIG. 20A depicts a side view of an exemplary apparatus 1050 that may be used to cleave scribed solar cells. Illustrated schematically. In this apparatus, a scribed conventional size solar cell wafer 45 is carried over a curved portion of a vacuum manifold 1070 by a perforated moving belt 1060 . As the solar cell wafer 45 passes over the curved portion of the vacuum manifold, the vacuum drawn through the perforations in the belt pulls the bottom surface of the solar cell wafer 45 against the vacuum manifold, thereby bending the solar cell. The radius of curvature R of the curved portion of the vacuum manifold may be selected such that by bending the solar cell wafer 45 in this manner, the solar cell is cleaved along the scribe line to form a rectangular solar cell 10. Rectangular solar cells 10 may be used, for example, in supercells as illustrated in FIGS. 1 and 2. The solar cell wafer 45 may be cleaved by this method without contacting the top surface of the solar cell wafer 45 to which the conductive adhesive bonding agent has been applied.

For each scribe line, cleave the scribe line such that one end reaches the curved part of the vacuum manifold before the other end, e.g., by positioning the scribe line to be oriented at an angle θ to the vacuum manifold. may be initiated preferentially at one end of the scribe line (ie at one edge of the solar cell 45). For example, as shown in FIG. 20B, the solar cells are aligned with the curved cleavage portion of the manifold with their scribe lines oriented relative to the direction of belt movement and perpendicular to the direction of belt movement. Can be oriented at an angle. As another example, FIG. 20C shows a battery oriented with the scribe line perpendicular to the direction of belt movement and a curved cleavage portion of the manifold oriented at an angle to the direction of belt movement. shows.

The cleaving tool 1050 may, for example, utilize a single perforated moving belt 1060 having a width in a direction perpendicular to its direction of movement that is approximately equal to the width of the solar cell wafer 45 . Alternatively, the tool 1050 may include, for example, two, three, four, or more perforated moving belts 1060 that can be arranged side by side in parallel and optionally spaced apart from each other. Cleavage tool 1050 may utilize, for example, a single vacuum manifold that may have a width in a direction perpendicular to the direction of solar cell movement approximately equal to the width of solar cell wafer 45. Such a vacuum manifold may be employed, for example, with a single full-width perforated moving belt 1060, or with, for example, two or more such belts arranged side by side in parallel and optionally spaced apart from each other. obtain.

The cleaving tool 1050 may include two or more curved vacuum manifolds, each having the same curvature, arranged side by side and parallel and spaced apart from each other. Such an arrangement may be employed, for example, with a single full-width perforated moving belt 1060, or with two or more such belts arranged side by side, parallel, and optionally spaced from each other. For example, the tool may include a perforated moving belt 1060 for each vacuum manifold. In the latter arrangement, the vacuum manifolds and their corresponding perforated moving belts may be arranged to contact the bottom of the solar cell wafer along only two narrow strips defined by the width of the belts. In such a case, the solar cell may contain soft material in the area of the bottom side of the solar cell wafer that is not contacted by the belt and there is no risk of damage to the soft material during the cleaving process.

Any suitable arrangement of perforated moving belts and vacuum manifolds may be used in the cleaving tool 1050.

In some variations, the scribed solar cell wafers 45 are coated with an uncured conductive adhesive adhesive and/or other soft adhesive on their top and/or bottom surfaces prior to cleaving using the cleaving tool 1050. Including materials. The scribing of the solar cell wafer and the application of the soft material may occur in either order.

FIG. 62A schematically illustrates a side view and FIG. 62B schematically illustrates a top view of another exemplary cleaving tool 5210 similar to the cleaving tool 1050 described above. In use of the cleaving tool 5210, a conventionally sized scribed solar cell wafer 45 is moved at a constant speed over a pair of parallel, spaced apart vacuum manifolds 5235, with a corresponding pair of parallel, spaced apart perforated belts 5230. placed on top. Vacuum manifold 5235 typically has the same curvature. As the wafer moves with the belt over the vacuum manifold through the cleaving region 5235C, the wafer is bent about the cleaving region defined by the curved support surface of the vacuum manifold due to the vacuum force pulling on the bottom of the wafer. As the wafer is bent around the cleavage area, the scribe lines become fissures that separate the wafer into individual rectangular solar cells. As explained further below, the curvature of the vacuum manifold is such that adjacent cleaved rectangular solar cells are not in the same plane and the edges of adjacent cleaved rectangular solar cells end up after the cleaving process has occurred. placed so that they do not touch each other. The cleaved rectangular solar cells may be sequentially unloaded from the perforated belt by any suitable method, some exemplary of which are described below. Typically, the method of unloading also separates adjacent cleaved solar cells from each other and prevents them from coming into contact with each other if they subsequently lie in the same plane.

62A-62B, each vacuum manifold has, for example, a flat region 5235F that draws no vacuum, or a low or high vacuum, and an optional low or high vacuum along its length. It may include a curved transition region 5235T that draws or transitions from a low vacuum to a high vacuum, a cleavage region 5235C that draws a high vacuum, and a post-cleavage region 5235PC of a smaller radius that draws a low vacuum. Belt 5230 transports wafer 45 from flat region 5235F into and through transition region 5235T, and then into cleaving region 5235C, where the wafer cleaves, and then transports wafer 45 from flat region 5235F into and through transition region 5235T, and then into cleaving region 5235C, where the wafer is cleaved, and then the resulting cleaved sun. The battery 10 is transported out of the cleavage area 5235C and into the post-cleavage area 5235PC.

Flat region 5235F typically operates at a low enough vacuum to hold wafer 45 to the belt and vacuum manifold. Here the vacuum may be low (or non-existent) to reduce friction and therefore the required belt tension, and because it is easier to hold the wafer 45 on a flat surface than on a curved surface. . The vacuum at flat region 5235F can be, for example, about 1 to about 6 inches of mercury.

Transition region 5235T provides a curvature that transitions from flat region 5235F to cleavage region 5235C. The radius of curvature or radii of curvature at transition region 5235T is greater than the radius of curvature at cleave region 5235C. The curvature at transition region 5235T may be, for example, part of an ellipse, but any suitable curvature may be used. Rather than a direct transition from a flat orientation in region 5235F to a cleavage range in cleavage region 5235C, moving wafer 45 closer to cleavage region 5235C with a smaller change in curvature through transition region 5235T causes the edge of wafer 45 to lift. , helps to ensure that the vacuum is not lost and the wafer becomes difficult to stay within the cleavage region 5235C. The vacuum at transition region 5235T can be, for example, the same as that at cleavage region 5235C, intermediate between the vacuum at regions 5235F and 5235C, or between the vacuum at region 5235F and the vacuum at region 5235C. , may transition along the length of region 5235T. The vacuum in transition region 5235T can be, for example, about 2 to about 8 inches of mercury.

Cleavage region 5235C may have a varying radius of curvature, or optionally a constant radius of curvature. Such a constant radius of curvature can be, for example, about 11.5 inches, about 12.5 inches, or between about 6 inches and about 18 inches. Any suitable range of curvature may be used and selected based in part on the thickness of the wafer 45 and the depth and geometry of the scribe line in the wafer 45. Typically, the thinner the wafer, the shorter the radius of curvature required to bend the wafer sufficiently to tear the wafer along the scribe line. The scribe lines may have a depth of, for example, about 60 microns to about 140 microns, although any other suitable shallower or deeper scribe line depths may be used. Typically, the shallower the scribe, the shorter the radius of curvature required to bend the wafer sufficiently to tear the wafer along the scribe line. The cross-sectional shape of the scribe line also affects the required radius of curvature. A scribe line that has a wedge shape or a wedge-shaped bottom can concentrate stress more effectively than a scribe line that has a rounded shape or a rounded bottom. A scribe line that concentrates stress more effectively may not require as small a radius of curvature within the cleavage region as a scribe line that concentrates stress less effectively.

For at least one of the two parallel vacuum manifolds, the vacuum in the cleavage region 5235C is typically higher than the vacuum in other regions to ensure that the wafer is properly held within the cleave radius of curvature; Maintain constant bending stress. Optionally, and as discussed further below, one manifold may draw a higher vacuum than the other in this region to better control tearing along the scribe line. The vacuum at cleavage region 5235C can be, for example, about 4 to about 15 inches of mercury, or about 4 to about 26 inches of mercury.

Post-cleave region 5235PC typically has a smaller radius of curvature than cleave region 5235C. This avoids rubbing or touching the cracked surfaces of adjacent cleaved solar cells, which can cause solar cell failure from tears or other forms of failure. It becomes easier to transport the cleaved solar cells from the belt 5230. In particular, a smaller radius of curvature results in greater separation between the edges of adjacent cleaved solar cells on the belt. Since the wafer 45 has already been cleaved into multiple solar cells 10 and the solar cells no longer need to be held in the curved radius of the vacuum manifold, the vacuum in the post-cleave region 5235PC may be low ( eg, similar or the same as that in flat region 5235F). The edges of the cleaved solar cell 10 can be lifted away from the belt 5230, for example. Additionally, it may be desirable not to place undue stress on the cleaved solar cell 10.

The flat region, transition region, cleave region, and post-cleave region of the vacuum manifold can be discrete portions of different curves with coincident ends. For example, the top surface of each manifold may include a flat planar portion, a portion of an ellipse for the transition region, an arc of a circle for the cleavage region, and another arc of a circle or portion of an ellipse for the post-cleavage region. may include. Alternatively, some or all of the curved portion of the top surface of the manifold may include a continuous geometric function of increasing curvature (shortening contact circle diameter). Suitable such functions may include, for example, but are not limited to, helical functions such as clothoids, and natural logarithm functions. A clothoid is a curved line whose curvature increases linearly along the length of the curved path. For example, in some variations, the transition region, cleave region, and post-cleave region are all part of a single clothoid curve whose one end coincides with the flat region. In some other variations, the transition region is a clothoid curve with one end coinciding with a flat region and the other end coinciding with a cleavage region having circular curvature. In the latter variant, the post-cleavage region may have, for example, a higher radial circular curvature or a higher radial clothoidal curvature.

In some variations, one manifold applies a high vacuum in the cleavage region 5235C and the other manifold applies a high vacuum in the cleavage region 5235C, as described above and schematically illustrated in FIGS. 62B and 63A. Draw a low vacuum at. The high vacuum manifold clamps the edge of the wafer it supports entirely into the curvature of the manifold, and this causes the edge of the scribe line that lies above the high vacuum manifold to initiate a tear along the scribe line. by providing sufficient stress. Because the low-vacuum manifold does not keep the edge of the wafer it supports entirely in the curvature of the manifold, the bending radius of the wafer on that side is insufficient to create the stress necessary to initiate a tear at the scribe line. is not small enough. However, the stress is high enough to propagate a tear initiated at the other end of the scribe line overlying the high vacuum manifold. Without some vacuum on the "low vacuum" side to partially and fully clamp that end of the wafer into the curvature of the manifold, a tear that started at the opposite "high vacuum" end of the wafer would run across the entire wafer. There may be a risk that the virus will not spread. In a variation as just described, one manifold may optionally draw a low vacuum along its entire length from flat region 5235F to post-cleavage region 5235PC.

The asymmetric vacuum arrangement at the cleavage region 5235C, as just described, provides an asymmetric stress along the scribe line that controls the nucleation and propagation of the fissure along the scribe line. For example, referring to FIG. 63B, if the two vacuum manifolds instead pulled equal (e.g., high) vacuums at the cleavage region 5235C, the tear would nucleate at opposite ends of the wafer and propagate toward each other, causing We might meet somewhere. Under these circumstances, the tears may not line up with each other, and there is therefore a risk that they create potential mechanical failure points in the resulting cleaved battery where the tears meet.

As an alternative to, or in addition to, the asymmetric vacuum arrangement described above, cleavage can be preferentially achieved by arranging one end of the scribe line to reach the cleavage area of the manifold before the other end. Can be started at one end of the line. This may be accomplished, for example, by orienting the solar cell wafer at an angle relative to the vacuum manifold, as described above in connection with FIG. 20B. Alternatively, the vacuum manifolds may be located further along the belt path, with the cleave region of one of the two manifolds being further along the belt path than the cleave region of the other vacuum manifold. For example, two vacuum manifolds having the same curvature may be connected to a moving belt such that the solar cell wafer reaches the cleavage region of one manifold before reaching the cleavage region of the other vacuum manifold. It can be slightly offset in the direction of movement.

Referring now to FIG. 64, in the illustrated example, each vacuum manifold 5235 includes through holes 5240 arranged side by side below the center of a vacuum channel 5245. As shown in FIGS. 65A-65B, vacuum channels 5245 are recessed into the top surface of the manifold that supports perforated belt 5230. Each vacuum manifold also includes a central post 5250 located between the through holes 5240 and arranged side by side below the center of the vacuum channel 5245. The center column 5250 effectively separates the vacuum channels 5245 into two parallel vacuum channels on either side of the rows of center columns. Center post 5250 also provides support for belt 5230. Without the center post 5250, the belt 5230 would be exposed to a longer unsupported area and could be drawn toward the through hole 5240. As a result of this, the wafer 45 may be bent in three dimensions (bending through the cleavage area and bending in a direction perpendicular to the cleavage area), which can damage the solar cells and inhibit the cleaving process. It is possible.

As shown in FIGS. 65A-65B and 66-67, in the illustrated example, the through-hole 5240 connects the low vacuum chamber 5260L (flat region 5235F and transition region 5235T in FIG. 62A) and the high vacuum chamber (5260H ( cleave region 5235C in FIG. 62A) and communicates with another low vacuum chamber 5260L (post-cleavage region 5235PC in FIG. 62A). The through-holes 5240 provide a transition in which if the region to which a hole corresponds remains fully open, the air flow will not be completely biased toward that hole, thereby allowing other regions to maintain a vacuum. Provide sufficient flow resistance. Vacuum channels 5245 help ensure that vacuum belt holes 5255 always have a vacuum and do not become dead spots when positioned between through holes 5240.

Referring again to FIGS. 65A-65B and also to FIG. 67, perforated belt 5230 is configured such that, for example, the leading and trailing edges 527 of wafer 45 or cleaved solar cells 10 are always exposed as the belt travels along the manifold. It may include two rows of holes 5255 optionally arranged to be evacuated. In particular, the staggered arrangement of the plurality of holes 5255 in the illustrated example ensures that the edge of the wafer 45 or cleaved solar cell 10 always overlaps at least one hole 5255 of each belt 5230. . This helps prevent the edges of wafer 45 or cleaved solar cells 10 from lifting away from belt 5230 and manifold 5235. Any other suitable arrangement of holes 5255 may also be used. In some variations, the arrangement of the plurality of holes 5255 does not ensure that the edges of the wafer 45 or cleaved solar cell 10 are always evacuated.

The perforated moving belt 5230 in the illustrated example of the cleaving tool 5210 cuts the solar cell wafer 45 only along two narrow strips defined by the width of the belt along the lateral edges of the solar cell wafer. touch the bottom of the As a result, the solar cell wafer may contain soft materials, such as uncured adhesive, in areas of the bottom surface of the solar cell wafer that are not contacted by belt 5230, reducing the risk of damage to those soft materials during the cleaving process. does not occur.

In an alternative variant, the cleaving tool 5210 is not two perforated moving belts as just described, but has a width in the direction perpendicular to its direction of movement, for example approximately equal to the width of the solar cell wafer 45. A single perforated transfer belt 5230 may be utilized. Alternatively, the cleaving tool 5210 may include three, four, or more perforated moving belts 5230 that can be arranged side by side in parallel and optionally spaced apart from each other. Cleavage tool 5210 may utilize, for example, a single vacuum manifold 5235 that may have a width in a direction perpendicular to the direction of solar cell movement approximately equal to the width of solar cell wafer 45. Such a vacuum manifold may be employed, for example, with a single full width perforated moving belt 5230, or with two or more such belts arranged side by side in parallel and optionally spaced from each other. The cleaving tool 5210 can e.g. be a single perforation supported along opposing lateral edges by two curved vacuum manifolds 5235, each having the same curvature, arranged side by side and parallel and spaced apart from each other. A moving belt 5230 may be included. The cleaving tool 5210 may include three or more curved vacuum manifolds 5235, each having the same curvature, arranged in parallel and spaced apart from each other. Such an arrangement may be employed, for example, with a single full width perforated moving belt 5230, or with three or more such belts arranged side by side in parallel and optionally spaced apart from each other. The cleaving tool may include, for example, a perforated moving belt 5230 for each vacuum manifold.

Any suitable arrangement of perforated moving belts and vacuum manifolds may be used in the cleaving tool 5210.

As mentioned above, in some variations, the scribed solar cell wafers 45 that are cleaved by the cleaving tool 5210 have an uncured conductive adhesive bond on their top and/or bottom surfaces prior to cleaving. and/or other soft materials. The scribing of the solar cell wafer and the application of the soft material may occur in either order.

The perforated belt 5230 in the cleaving tool 5210 (and the perforated belt 1060 in the cleaving tool 1050) moves at a speed, e.g., from about 40 millimeters per second (mm/s) to about 2000 mm/s or faster, or , about 40 mm/s to about 500 mm/s or faster, or about 80 mm/s or faster. Cleaving the solar cell wafer 45 may be easier to perform at a faster speed than at a slower speed.

Referring now to FIG. 68, when cleaved, there is some separation between the leading edges 527 and trailing edges 527 of adjacent cleaved cells 10 due to the geometry of the bends around the bend. This forms a wedge-shaped gap between adjacent cleaved solar cells. If the cleaved cells are allowed to return to a flat, coplanar orientation without first increasing the separation between the cleaved cells, the edges of adjacent cleaved cells may touch each other and cause damage. There is sex. Therefore, it is advantageous to remove cleaved cells from belt 5230 (or belt 1060) while they are still supported by the curved surface.

69A-69G illustrate how many cleaved solar cells can be removed from belt 5230 (or belt 1060) and delivered to one or more additional moving belts or surfaces with increased separation between the cleaved solar cells. 1 schematically illustrates such an apparatus and method. In the example of FIG. 69A, cleaved solar cells 10 are collected from belt 5230 by one or more transport belts 5265 that travel faster than belt 5230, thus increasing the separation between cleaved solar cells 10. Transport belt 5265 may be positioned between two belts 5230, for example. In the example of FIG. 69B, the cleaved wafer 10 is separated by sliding down a slide 5270 positioned between two belts 5230. In this example, belt 5230 advances each cleaved cell 10 into a low vacuum (e.g., no vacuum) region of manifold 5235 to cleave it with the uncleaved portion of wafer 45 still held by belt 5230. Release the discharged battery onto slide 5270. Providing an air cushion between the cleaved battery 10 and the slide 5270 helps ensure that both the battery and slide do not wear out during this operation, and also helps ensure that the cleaved battery 10 does not wear out. can slide faster away from the wafer 45, thereby allowing faster cleavage belt operating speeds.

In the example of FIG. 69C, a carriage 5275A of a rotating "ferris wheel" arrangement 5275 transports cleaved solar cells 10 from belt 5230 to one or more belts 5280.

In the example of FIG. 69D, rotating roller 5285 applies a vacuum through actuator 5285A to pick up the cleaved solar cells 10 from belt 5230 and place them onto belt 5280.

In the example of FIG. 69E, carriage actuator 5290 includes a carriage 5290A and a retractable actuator 5290B mounted on the carriage. The carriage 5290A translates back and forth to position the actuator 5290B to remove the cleaved solar cell 10 from the belt 5230, and then positions the actuator 5290B to place the cleaved solar cell on the belt 5280.

In the example of FIG. 69F, carriage track arrangement 5295 positions carriage 5295A to remove cleaved solar cells 10 from belt 5230, and then positions carriage 5295A to place cleaved solar cells 10 on belt 5280. It includes a carriage 5295A attached to a moving belt 5300 for placing. The latter action occurs when the carriage falls off or separates from belt 5280 due to the path of belt 5230.

In the example of FIG. 69G, an inverted vacuum belt arrangement 5305 draws vacuum through one or more moving perforated belts to convey cleaved solar cells 10 from belt 5230 to belt 5280.

70A-70C provide orthogonal views of additional variations of the exemplary tools described above with reference to FIGS. 62A-62B and subsequent figures. This variation 5310 uses a transport belt 5265 to remove the cleaved solar cells 10 from a perforated belt 5230 that transports the uncleaved wafer 45 into the cleaving region of the tool, as in the example of FIG. 69A. . The perspective views of Figures 71A-71B show this variation of the cleaving tool in two different stages of operation. In FIG. 71A, an uncleaved wafer 45 is approaching the cleavage region of the tool, and in FIG. 71B, the wafer 45 has entered the cleavage region and two cleaved solar cells 10 have been separated from the wafer; Thereafter, they are further separated from each other as they are transported by the transport belt 5265.

In addition to the previously described features, FIGS. 70A-71B show multiple vacuum ports 5315 on each manifold. Using multiple ports per manifold may allow a greater degree of control over the variation of vacuum along the length of the top surface of the manifold. For example, different vacuum ports 5315 may optionally communicate with different vacuum chambers (e.g., 5260L and 5260H in FIGS. 66 and 72B) and/or optionally connect with different vacuum pumps. may provide a plurality of different vacuum pressures along the manifold. 70A-70B also show the entire path of the perforated belt 5230 looping around the wheel 5325, the top surface of the vacuum manifold 5235, and the wheel 5320. Belt 5230 may be driven by either wheel 5320 or wheel 5325, for example.

72A and 72B show a perspective view of a portion of vacuum manifold 5235 overlying a portion of perforated belt 5230, with FIG. 72A approaching the portion of FIG. 72B for the variation of FIGS. 70A-71B. Provide a diagram. 73A shows a top view of a portion of vacuum manifold 5235 overlying perforated belt 5230, and FIG. 73B shows the same vacuum manifold and perforated belt taken along line CC shown in FIG. 73A. A cross-sectional view of the arrangement is shown. As shown in FIG. 73B, the relative orientation of the through holes 5240 extends along the length of the vacuum manifold such that each through hole is oriented perpendicular to the portion of the top surface of the manifold directly above the through hole. can vary along the way. FIG. 74A shows another top view of a portion of vacuum manifold 5235 overlying perforated belt 5230, with vacuum chambers 5260L and 5260H shown in partial perspective. Figure 74B shows a close-up view of a portion of Figure 74A.

75A-75G illustrate several exemplary perforation patterns that may optionally be used in perforated vacuum belt 5230. A common feature of these patterns is that a straight edge of a wafer 45 or cleaved solar cell 10 across the pattern in a direction perpendicular to the long axis of the belt at any location on the belt always This means that it will overlap one hole 5255. The pattern may include, for example, two or more rows of square or rectangular holes offset from each other (Figs. 75A, 75D), two or more rows of circular holes offset from each other (Figs. 75B, 75E, 75G), two or more rows of angled slots (FIGS. 75C, 75F), or any other suitable arrangement of holes.

Herein, supercells are arranged in multiple physically parallel rows within a solar module, arranged in an overlapping shingle configuration and electrically connected in series by conductive junctions between adjacent and overlapping solar cells. A highly efficient solar module is disclosed that includes a silicon solar cell that forms a supercell in a supercell state. A supercell may include any suitable number of solar cells. The supercells may have a length that spans essentially the entire length or width of the solar module, for example, or two or more supercells may be arranged end-to-end in a row. . This arrangement hides the electrical interconnections between solar cells and thus creates a visually appealing solar module with little or no contrast between adjacent series-connected solar cells. It can be used for

This specification further discloses a cell metallization pattern that facilitates stencil printing of metallization onto the front (and optionally) back side of a solar cell. As used herein, "stencil printing" of cell metallization refers to applying metallization material (e.g., silver paste) onto the solar cell surface through patterned openings in an otherwise impermeable sheet of material. refers to the application of The stencil can be, for example, a patterned stainless steel sheet. The patterning openings of the stencil are entirely free of stencil material, eg, no mesh or screen. The absence of mesh or screen material in the patterned stencil openings distinguishes "stencil printing" from "screen printing" as used herein. In contrast, in screen printing, the metallization material is applied to the solar cell surface through a screen (eg, a mesh) that supports a patterned impermeable material. The pattern includes openings in the opaque material through which the metallization material is applied to the solar cell. A supporting screen extends across the opening in the impermeable material.

Compared with screen printing, stencil printing of battery metallization patterns results in narrower line width, higher aspect ratio (line height to width), and better line uniformity and clarity. stencils offer a number of advantages including longer lifespan compared to screens. However, stencil printing cannot print "islands" in one pass as would be required in conventional three busbar metallization designs. Additionally, stencil printing may require that the stencil include unsupported structures that are not secured to lie in the plane of the stencil during printing, which may inhibit placement and use of the stencil. The metallization pattern cannot be printed in one pass. For example, stencil printing cannot print in a single pass a metallization pattern in which parallelly arranged metallized fingers are interconnected by bus bars or other metallized features that extend perpendicular to the fingers. This is because a single stencil for such a design would include an unsupported tongue of sheet material defined by openings for the busbars and openings for the fingers. The tongues will not be held in place by physical connections to other parts of the stencil so that they lie in the plane of the stencil during printing, and can drift out of plane, distorting the placement and use of the stencil. Highly sexual.

As a result, attempts to use stencils to print traditional solar cells require two passes for front metallization with two different stencils or by a stencil printing process combined with a screen printing process. , this increases the total number of printing steps per cell and also creates the problem of "stitching" where two prints overlap and are twice as tall. Stitching further complicates the process, and the additional printing steps and associated steps increase cost. Therefore, stencil printing is not common for solar cells.

As discussed further below, the front metallization pattern described herein may include an array of fingers (eg, parallel lines) that are not connected to each other by the front metallization pattern. These patterns can be stenciled in one pass with a single stencil since the required stencil does not need to include unsupported portions or structures (eg, tongues). Such front metallization patterns can be disadvantageous for standard sized solar cells and for strings of solar cells in which separate solar cells are interconnected by copper ribbons. This is because the metallization pattern itself does not provide substantial current spreading or conduction in a direction perpendicular to the fingers. However, the front metallization pattern described herein overlaps a portion of the front metallization pattern of a solar cell with the back metallization pattern of an adjacent solar cell, and a portion of the front metallization pattern of the solar cell overlaps with the back metallization pattern of the adjacent solar cell. A shingled arrangement of rectangular solar cells, such as those described herein, may work well. This is because the overlapping back side metallization of adjacent solar cells may allow current spreading and conduction in a direction perpendicular to the fingers in the front side metallization pattern.

Turning now to the drawings for a more detailed understanding of the solar modules described herein, FIG. 1 shows a cross-sectional view of a string of series-connected solar cells 10 arranged in a shingled configuration. Each solar cell 10 includes a semiconductor diode structure and a plurality of electrical contacts to the semiconductor diode structure. Thereby, the current generated within the solar cell 10 when the solar cell 10 is irradiated with light can be provided to an external load.

In the examples described herein, each solar cell 10 has a rectangular shape with a metallization pattern on the front (sun side) and back (shadow side) sides that provides electrical contact on opposite sides of the n-p junction. A crystalline silicon solar cell, in which the front metallization pattern is disposed on a semiconductor layer of n-type conductivity and the backside metallization pattern is disposed on a semiconductor layer of p-type conductivity. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements may be used as appropriate. For example, a front (sun side) metallization pattern may be disposed on a semiconductor layer of p-type conductivity, and a back (shadow side) side metallization pattern may be disposed on a semiconductor layer of n-type conductivity.

Referring again to FIG. 1, in the supercell 100, adjacent solar cells 10 electrically connect the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cell in the area where they overlap. They are directly conductively bonded to each other by an electrically conductive bonding agent. Suitable electrically conductive bonding agents may include, for example, electrically conductive adhesives, electrically conductive adhesive films and tapes, and conventional solders.

Referring back to FIGS. 2A-2R, FIGS. 2A-2R illustrate an exemplary rectangular solar module 200 that includes six rectangular supercells 100, each having a length approximately equal to the length of the long side of the solar module. . The supercells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the module. A similarly constructed solar module may include more or fewer rows of supercells of such side lengths than shown in this example. In another variation, the supercells each have a length approximately equal to the length of the short sides of the rectangular solar module and are arranged in parallel rows with their long sides oriented parallel to the short sides of the module. may be placed. In yet other arrangements, for example, each row may include two or more supercells that may be electrically interconnected in series. The module may have a short side that is, for example, about 1 meter in length and a long side that is, for example, about 1.5 to about 2.0 meters in length. Any other suitable shape (eg, square) and size for the solar module may also be used. Each supercell in this example includes 72 rectangular solar cells each having a width equal to approximately 1/6 of the width of a 156 millimeter (mm) square or pseudo-square wafer and a length of approximately 156 mm. Any other suitable number of rectangular solar cells of any other suitable size may also be used.

FIG. 76 shows an exemplary front metallization pattern on a rectangular solar cell 10 that facilitates stencil printing as described above. The front metallization pattern may be formed from a silver paste, for example. In the example of FIG. 76, the front metallization pattern includes a plurality of fingers 6015 that extend parallel to each other, parallel to the short sides of the solar cell, and perpendicular to the long sides of the solar cell. The front metallization pattern also includes an optional row of multiple contact pads 6020 extending parallel to and adjacent to the long edges of the solar cell, with each contact pad 6020 located at the end of a finger 6015. If present, each contact pad 6020 includes an electrically conductive adhesive (ECA), solder, or other material used to conductively bond the front side of the illustrated solar cell to an overlapping portion of the back side of an adjacent solar cell. forming areas for individual beads of electrically conductive adhesive. The pad may be, for example, circular, square, or rectangular, but any suitable pad shape may be used. As an alternative to using individual beads of electrically conductive adhesive, solid or dashed ECAs, solder, conductive tape, or other electrically conductive adhesives placed along the long edges of the solar cell. Agents may interconnect some or all of the fingers and may also bond solar cells to adjacent overlapping solar cells. Such dashed or solid electrically conductive adhesives may be used in combination with conductive pads at the ends of the fingers or without such conductive pads.

For example, the solar cell 10 may have a length of about 156 mm and a width of about 26 mm, and thus have an aspect ratio (short side length/long side length) of about 1:6. Six such solar cells may be prepared on a standard 156 mm x 156 mm dimension silicon wafer and then separated (diced) to provide multiple solar cells as shown. In another variant, eight solar cells 10 with dimensions of approximately 19.5 mm x 156 mm and thus an aspect ratio of approximately 1:8 may be prepared from a standard silicon wafer. More generally, solar cell 10 may have an aspect ratio of, for example, from about 1:2 to about 1:20, and may be prepared from a standard size wafer or from a wafer of any other suitable size.

Referring again to FIG. 76, the front metallization pattern may include, for example, about 60 to about 120 fingers, such as about 90 fingers, per cell with a width of 156 mm. Fingers 6015 can have a width, for example, from about 10 to about 90 microns, such as about 30 microns. The fingers 6015 can have a height perpendicular to the surface of the solar cell, for example, from about 10 to about 50 microns. The height of the fingers may be, for example, about 10 microns or greater, about 20 microns or greater, about 30 microns or greater, about 40 microns or greater, or about 50 microns or greater. obtain. The diameter (circle) or side length (square or rectangle) of pad 6020 can be, for example, about 0.1 mm to about 1 mm, such as about 0.5 mm.

The backside metallization pattern of the rectangular solar cell 10 may be, for example, a plurality of discontinuous rows of contact pads, a plurality of interconnecting rows of contact pads, or a continuous row of contact pads extending parallel to and adjacent to the long edges of the solar cell. may include standard busbars. However, such contact pads or busbars are not required. If the front metallization pattern includes contact pads 6020 located along one of the long sides of the solar cell, the rows of contact pads or bus bars (if present) in the back metallization pattern include It is placed along the other long edge of the solar cell. The backside metallization pattern may further include a metal back contact covering substantially all of the remaining backside of the solar cell. The example backside metallization pattern of FIG. 77A includes a plurality of rows of discontinuous contact pads 6025 in combination with metal back contacts 6030 as just described, and the example backside metallization pattern of FIG. 77B includes: It includes a continuous busbar 35 in combination with a metal back contact 6030 as just described.

In a shingled supercell, the front metallization pattern of a solar cell is conductively bonded to an overlapping portion of the back metallization pattern of an adjacent solar cell. For example, if the solar cell includes front metallized contact pads 6020, each contact pad 6020 is aligned with and joins a corresponding back metallized contact pad 6025 (if present) or back metallized bus bar 35 (if present). (if present) or may be bonded to a metal back contact 6030 (if present) on an adjacent solar cell. This may include, for example, a discontinuity of electrically conductive adhesive disposed on each contact pad 6020 that extends parallel to the edges of the solar cell and optionally electrically interconnects two or more of the contact pads 6020. This can be accomplished by electrically conductive bonding material (eg, beads) or by dashed or solid lines of electrically conductive bonding material.

If the solar cell does not have front side metallized contact pads 6020, for example, each front side metallized pattern finger 6015 may be aligned and joined with a corresponding back side metallized contact pad 6025 (if present), or It may be bonded to the metallized busbar 35 (if present) or to a metal back contact 6030 (if present) on an adjacent solar cell. This may include, for example, an electrically conductive adhesive disposed on the overlapping ends of each finger 6015 that extends parallel to the edges of the solar cell and optionally electrically interconnects two or more of the fingers 6015. This can be accomplished by discontinuous sections (eg, beads) or by dashed or solid lines of electrically conductive bonding material.

As discussed above, portions of the overlapping backside metallization of adjacent solar cells, such as backside busbars 35 and/or backside metallization 6030, if present, are aligned in a direction perpendicular to the fingers in the frontside metallization pattern. may enable current spreading and conduction. In variations utilizing dashed or solid electrically conductive adhesives as described above, the electrically conductive adhesive allows for current spreading and conduction in a direction perpendicular to the fingers in the front metallization pattern. It can be done. The overlapping back metallization and/or electrically conductive bonding material may, for example, carry current by bypassing broken fingers or other finger discontinuities in the front metallization pattern.

If present, backside metallized contact pads 6025 and bus bars 35 may be formed from, for example, silver paste that may be applied by stencil printing, screen printing, or any other suitable method. Metal back contact 6030 may be formed from aluminum, for example.

Any other suitable backside metallization patterns and materials may also be used.

FIG. 78 shows an exemplary front metallization pattern for a square solar cell 6300 that can be diced to form a plurality of rectangular solar cells each having the front metallization pattern shown in FIG. 76.

FIG. 79 shows an exemplary backside metallization pattern of a square solar cell 6300 that can be diced to form a plurality of rectangular solar cells each having the backside metallization pattern shown in FIG. 77A.

The front metallization patterns described herein may enable stencil printing of the front metallization on a standard three-printer solar cell manufacturing line. For example, the manufacturing process includes using a first printer to stencil or screen print a silver paste on the back side of the square solar cell to form a back contact pad or a back silver bus bar, drying the back silver paste, A second printer is used to stencil or screen print aluminum contacts on the back side of the solar cell, the aluminum contacts are dried, and a third printer is used to print a single stencil in a single stencil step. The method may include stencil printing a silver paste onto the front side of the solar cell to form a complete front metallization pattern, drying the silver paste, and firing the solar cell. These printing steps and related steps may occur in any other order or may be omitted as appropriate.

Printing the front metallization pattern using a stencil allows the production of narrower fingers than is possible with screen printing, which improves solar cell efficiency and reduces the use of silver and therefore manufacturing costs. can be reduced. By stencil printing the front metallization pattern in a single stencil printing step with a single stencil, overlapping the prints to define features of uniform height, e.g. extending in different directions. Additionally, it is possible to produce front metallization patterns without exhibiting stitching, which can occur when stencil printing is used in combination with multiple stencils or screen printing.

After the front and back metallization patterns are formed on the square solar cells, each square solar cell can be separated into two or more rectangular solar cells. This may be achieved, for example, by laser scribing followed by cleavage, or by any other suitable method. The rectangular solar cells may then be arranged in overlapping shingles and conductively bonded to each other to form a supercell, as described above. This specification discloses, for example, a method for manufacturing solar cells that are free of cleavage edges that promote carrier recombination and reduce carrier recombination losses at the edges of the solar cell. The solar cell may be, for example, a silicon solar cell, more specifically a HIT silicon solar cell. This specification also discloses a shingled (overlapping) supercell arrangement of such solar cells. The individual solar cells within such a supercell may have a narrow rectangular geometry (eg, a strip-like shape) with the long sides of adjacent solar cells arranged to overlap.

A major challenge for cost-effective implementation of high-efficiency solar cells such as HIT solar cells is the large number of large currents carried from one such high-efficiency solar cell to adjacent series-connected high-efficiency solar cells. This is a conventionally recognized necessity for metals. Such high-efficiency solar cells are diced into multiple narrow rectangular solar cell strips, and the resulting solar cells are then stacked together (with conductive junctions between the overlapping portions of adjacent solar cells). Arranging in a shingled pattern to form series-connected solar cell strings within a supercell provides an opportunity to reduce module cost through process simplification. This is because it eliminates the tabbing process steps traditionally required to interconnect adjacent solar cells with metal ribbons. This shingling technique reduces the current flow through the solar cells (because individual solar strips can have a smaller area than a traditional working area) and the distance between adjacent solar cells. Module efficiency can also be increased by shortening the current path length, both of which help reduce resistive losses. The reduction in current also allows cheaper but more resistive conductors (e.g. copper) to be replaced with more expensive but less resistive conductors (e.g. silver) without any substantial loss in performance. It is also possible to use it instead of . Additionally, this shingling approach may reduce non-active module area by removing interconnect ribbons and associated contacts from the front side of the solar cell.

A conventional sized solar cell may have generally square front and back sides having dimensions of, for example, about 156 millimeters (mm) by about 156 mm. In the shingling scheme just described, such solar cells are diced into two or more (eg 2 to 20) 156 mm long solar cell strips. A potential difficulty with this shingling method is that dicing conventionally sized solar cells into thin strips increases the cell edge length per working area of the solar cell compared to conventionally sized solar cells. This means that the edges become longer and this can degrade performance due to carrier recombination at the edges.

For example, Figure 80 shows several solar cell strips (7100a, 7100b, 7100c, and 7100d) each having a front and back side that is a narrow rectangle with dimensions of about 156 mm by about 40 mm. Figure 2 schematically illustrates dicing of a HIT solar cell 7100 with back side dimensions of approximately 156 mm x approximately 156 mm. (The long 156 mm side of the solar cell strip extends into the page.) In the illustrated example, the HIT cell 7100 can be, for example, about 180 microns thick and has dimensions of about 156 mm by about Includes an n-type single crystal substrate 5105 that may have front and back square sides of 156 mm. An approximately 5 nanometer (nm) thick layer of intrinsic amorphous Si:H (a-Si:H) and an approximately 5 nm thick layer of n+ doped a-Si:H (both layers are referenced together). 7110) is disposed on the front side of the crystalline silicon substrate 7105. An approximately 65 nm thick film 5120 of transparent conductive oxide (TCO) is disposed on the a-Si:H layer 7110. Conductive metal grid lines 7130 disposed on the TCO layer 7120 provide electrical contact to the front side of the solar cell. An approximately 5 nm thick layer of intrinsic a-Si:H and an approximately 5 nm thick layer of p+ doped a-Si:H (both layers designated together by reference numeral 7115) are deposited on a crystalline silicon substrate 7105. It is placed on the back of the . A transparent conductive oxide (TCO) film 7125 approximately 65 nm thick is disposed on the a-Si:H layer 7115, and conductive metal grid lines 7135 disposed on the TCO layer 7125 form a solar cell. makes electrical contact to the back side of the (The dimensions and materials mentioned above are intended to be exemplary rather than limiting, and may be modified as appropriate.)

Still referring to FIG. 80, when HIT solar cell 7100 is cleaved by conventional methods to form strip solar cells 7100a, 7100b, 7100c and 7100d, the newly formed cleavage edges 7140 are not passivated. These unpassivated edges contain a high density of dangling chemical bonds that promote carrier recombination and degrade solar cell performance. In particular, the cleaved surface 7145 exposing the np junction and the cleaved surface exposing the heavily doped front field (in layer 7110) are not passivated and can substantially promote carrier recombination. Additionally, if a conventional laser cutting or laser scribing process is used to dice the solar cell 7100, thermal damage, such as recrystallization 7150 of amorphous silicon, may occur on the newly formed edges. As a result of the unpassivated edges and thermal damage, the new edges formed on the cleaved solar cells 7100a, 7100b, 7100c and 7100d would reduce the short circuit current of the solar cells if conventional manufacturing processes were used. , open circuit voltage, and spurious fill factor can be expected to be reduced. This combination leads to a substantial reduction in the performance of the solar cell.

The formation of edges that promote recombination during dicing of conventional sized HIT solar cells into narrower solar cell strips can be avoided by the method illustrated in FIGS. 81A-81J. The method uses isolation trenches on the front and back sides of a conventionally sized solar cell 7100 to isolate the pn junction and the heavily doped front surface from the cleavage edges that might otherwise act as recombination sites for minority carriers. Electrically separate the fields. The edges of the trenches are not defined by conventional cleaving, but instead by chemical etching or laser patterning, followed by the deposition of a passivating layer, such as TCO, which passivates both the front and back trenches. Compared to the heavily doped region, the doping of the substrate is sufficiently low that the probability of electrons at the junction reaching the unpassivated cut edge of the substrate is low. Additionally, a kerfless wafer dicing technique, Thermal Laser Separation (TLS), can be used to cut the wafer, thereby avoiding potential thermal damage.

In the example illustrated in FIGS. 81A-81J, the starting material is approximately 156 mm square with a bulk resistance of, for example, about 1 to about 3 ohm centimeters, and a thickness of, for example, about 180 microns. This is an n-type single crystal silicon as-cut wafer. (Wafer 7105 forms the substrate of the solar cell.)

Referring to FIG. 81A, an as-cut wafer 7105 is conventionally texture etched, acid cleaned, rinsed, and dried.

Next, in FIG. 81B, an intrinsic a-Si:H layer with a thickness of about 5 nm and a doped n+a-Si:H layer with a thickness of about 5 nm (both layers are designated together by the reference numeral 7110). is deposited on the front side of the wafer 7105 at a temperature of, for example, about 150° C. to about 200° C., for example, by plasma enhanced chemical vapor deposition (PECVD).

Next, in FIG. 81C, an intrinsic a-Si:H layer about 5 nm thick and a doped p+ a-Si:H layer about 5 nm thick (both layers are designated together at reference number 7115). is deposited on the backside of wafer 7105, eg, by PECVD, at a temperature of, eg, about 150° C. to about 200° C.

Next, in FIG. 81D, the previous a-Si:H layer 7110 is patterned to form isolation trenches 7112. Isolation trenches 7112 typically extend through layer 7110 to wafer 7105 and can be, for example, about 100 microns to about 1000 microns wide, such as about 200 microns wide. Typically, the trench has the narrowest width that can be used depending on the accuracy of the patterning technique and the subsequently applied cleaving technique. Patterning of trenches 7112 may be accomplished using, for example, laser patterning or chemical etching (eg, inkjet wet patterning).

Next, in FIG. 81E, the back a-Si:H layer 7115 is patterned to form isolation trenches 7117. Similar to isolation trench 7112, isolation trench 7117 typically extends through layer 7115 to wafer 7105 and can have a width, for example, from about 100 microns to about 1000 microns, such as about 200 microns. . Patterning of trenches 7117 can be accomplished using, for example, laser patterning or chemical etching (eg, inkjet wet patterning). Each trench 7117 is aligned with a corresponding trench 7112 on the front side of the structure.

Next, in FIG. 81F, a TCO layer 7120 with a thickness of about 65 nm is deposited on the patterned previous a-Si:H layer 7110. This can be achieved, for example, by physical vapor deposition (PVD) or by ion plating. TCO layer 7120 fills trench 7112 in a-Si:H layer 7110 and coats the outer edge of layer 7110, thereby passivating the surface of layer 7110. TCO layer 7120 also functions as an anti-reflective coating.

Next, in FIG. 81G, a TCO layer 7125 with a thickness of about 65 nm is deposited on the patterned back a-Si:H layer 7115. This can be achieved, for example, by PVD or by ion plating. TCO layer 7125 fills trench 7115 in a-Si:H layer 7117 and coats the outer edge of layer 115, thereby passivating the surface of layer 7115. TCO layer 7125 also functions as an anti-reflective coating.

Next, in FIG. 81H, conductive (eg, metallic) front grid lines 7130 are screen printed onto the TCO layer 7120. Grid lines 7130 may be formed from cold silver paste, for example.

Next, in FIG. 81I, conductive (eg, metallic) backside grid lines 7135 are screen printed onto the TCO layer 7125. Grid lines 7135 may be formed from cold silver paste, for example.

Next, after deposition of grid lines 7130 and grid lines 7135, the solar cell is cured at a temperature of about 200° C., for example, for about 30 minutes.

Next, in FIG. 81J, the solar cells are separated into solar cell strips 7155a, 7155b, 7155c, and 7155d by dicing the solar cells in the center of the trench. Dicing can be accomplished, for example, by cleaving the solar cell along the trench using conventional laser scribing and mechanical cleavage at the center of the trench. Alternatively, dicing can be accomplished using a Thermal Laser Separation process (e.g., as developed by Jenoptik AG) in which laser-induced heating in the center of the trench creates mechanical stresses that lead to cleavage of the solar cell along the trench. can be done. The latter approach may avoid thermal damage to the edges of the solar cell.

The resulting strip solar cells 7155a-7155d are different from the strip solar cells 7100a-7100d shown in FIG. 80. In particular, the edges of a-Si:H layer 7110 and a-Si:H layer 7115 in solar cells 7140a-7140d are formed by etching or laser patterning rather than by mechanical cleavage. Additionally, the edges of layers 7110 and 7115 in solar cells 7155a-7155d are passivated by a TCO layer. As a result, solar cells 7140a-7140d do not have cleavage edges present in solar cells 7100a-7100d that promote carrier recombination.

The methods described in connection with FIGS. 81A-81J are intended to be illustrative rather than limiting. Steps described as being performed in a particular order may be performed in other orders or in parallel, as appropriate. Steps and material layers may be omitted, added, or replaced as appropriate. For example, if copper plated metallization is used, additional patterning or seed layer deposition steps may be included in the process. Furthermore, in some variations, only the front a-Si:H layer 7110 is patterned to form isolation trenches, and no isolation trenches are formed in the back a-Si:H layer 7115. In another variation, only the back a-Si:H layer 7115 is patterned to form isolation trenches and no isolation trenches are formed in the front a-Si:H layer 7115. In these variations, as in the examples of Figures 81A-81J, dicing also occurs in the center of the trench.

The formation of recombinant edges during dicing of conventional sized HIT solar cells into narrower solar cell strips may be employed in the method described in connection with FIGS. 81A-81J. It may also be avoided by the method illustrated in FIGS. 82A-82J, which also uses isolation trenches.

Referring to FIG. 82A, in this example, the starting material is again about 156 mm square with a bulk resistance that can be, for example, about 1 to about 3 ohm centimeters, and a thickness that can be, for example, about 180 microns. This is an n-type single crystal silicon as-cut wafer 7105.

Referring to FIG. 82B, trenches 7160 are formed in the front side of wafer 7105. These trenches may have a depth of, for example, about 80 microns to about 150 microns, such as about 90 microns, and a width of, for example, about 10 microns to about 100 microns. Isolation trenches 7160 define the geometry of the solar cell strips that will be formed from wafer 7105. Wafer 7105 will be cleaved along these trenches as described below. These trenches 7160 may be formed by conventional laser wafer scribing, for example.

Next, in FIG. 82C, the wafer 7105 is conventionally texture etched, acid cleaned, rinsed, and dried. Etching typically removes damage originally present on the surface of as-cut wafer 7105 or caused during formation of trench 7160. Etching may also widen and deepen trench 7160.

Next, in FIG. 82D, an intrinsic a-Si:H layer with a thickness of about 5 nm and a doped n+a-Si:H layer with a thickness of about 5 nm (both layers are designated together by the reference numeral 7110). is deposited, for example, by PECVD, on the front side of the wafer 7105 at a temperature of, for example, about 150° C. to about 200° C.

Next, in FIG. 82E, an intrinsic a-Si:H layer with a thickness of about 5 nm and a doped p+ a-Si:H layer with a thickness of about 5 nm (both layers are designated together at reference number 7115). is deposited on the backside of wafer 7105, eg, by PECVD, at a temperature of, eg, about 150° C. to about 200° C.

Next, in FIG. 82F, a TCO layer 7120 with a thickness of about 65 nm is deposited on the previous a-Si:H layer 7110. This can be achieved, for example, by physical vapor deposition (PVD) or by ion plating. TCO layer 7120 may fill trench 7160 and typically coat the walls and bottom of trench 7160 and the outer edges of layer 7110, thereby passivating the coated surface. TCO layer 7120 also functions as an anti-reflective coating.

Next, in FIG. 82G, a TCO layer 7125 with a thickness of about 65 nm is deposited on the back a-Si:H layer 7115. This can be achieved, for example, by PVD or by ion plating. TCO layer 7125 passivates the surface (eg, including the outer edge) of layer 7115 and also functions as an anti-reflective coating.

Next, in FIG. 82H, conductive (eg, metal) front grid lines 7130 are screen printed onto the TCO layer 7120. Grid lines 7130 may be formed from cold silver paste, for example.

Next, in FIG. 82I, conductive (eg, metallic) backside grid lines 7135 are screen printed onto the TCO layer 7125. Grid lines 7135 may be formed from cold silver paste, for example.

Next, after deposition of grid lines 7130 and grid lines 7135, the solar cell is cured at a temperature of about 200° C., for example, for about 30 minutes.

Next, in FIG. 82J, the solar cells are separated into solar cell strips 7165a, 7165b, 7165c, and 7165d by dicing the solar cells in the center of the trench. Dicing can be accomplished, for example, by cleaving the solar cell along the trench using conventional mechanical cleavage at the center of the trench. Alternatively, dicing may be accomplished using, for example, a Thermal Laser Separation process as described above.

The resulting strip solar cells 7165a-7165d are different from the strip solar cells 7100a-7100d shown in FIG. 80. In particular, the edges of the a-Si:H layer 7110 in solar cells 7165a-7165d are formed by etching rather than mechanical cleaving. Additionally, the edges of layer 7110 in solar cells 7165a-7165d are passivated by a TCO layer. As a result, solar cells 7165a-7165d do not have cleavage edges present in solar cells 7100a-7100d, which promote carrier recombination.

The methods described in connection with FIGS. 82A-82J are intended to be illustrative rather than limiting. Steps described as being performed in a particular order may be performed in other orders or in parallel, as appropriate. Steps and material layers may be omitted, added, or replaced as appropriate. For example, if copper plated metallization is used, additional patterning or seed layer deposition steps may be included in the process. Furthermore, in some variations, trenches 7160 may be formed on the back side of wafer 7105 rather than the front side of wafer 7105.

The methods described above in connection with FIGS. 81A-81J and 86A-86J are applicable to both n-type and p-type HIT solar cells. Solar cells can be front emitter or back emitter. It may be preferable to apply the separation process on the side without the emitter. Furthermore, the use of isolation trenches and passivation layers as described above to reduce recombination on the cleaved wafer edge is applicable to other solar cell designs and solar cells using material systems other than silicon. be.

Referring again to FIG. 1, a string of a plurality of series-connected solar cells 10 formed by the method described above advantageously has the ends of adjacent solar cells overlapping and electrically connected to form a supercell 100. It can be arranged in a shingled manner with the roof in place. In a supercell 100, adjacent solar cells 10 are connected to each other by an electrically conductive bonding agent that electrically connects the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cell in the area where they overlap. Conductive bonding. Suitable electrically conductive bonding agents may include, for example, electrically conductive adhesives, electrically conductive adhesive films and tapes, and conventional solders.

Referring again to FIGS. 5A-5B, FIG. 5A shows an exemplary rectangular solar module 200 that includes 20 rectangular supercells 100, each having a length approximately equal to half the short side of the solar module. . The supercells were arranged end-to-end in pairs to form ten supercell rows with the long sides of the supercells oriented parallel to the short sides of the solar module. It is formed in the state. In other variations, each supercell row may include three or more supercells. Also, in other variations, the supercells are arranged in rows, with the long sides of the rows and supercells oriented parallel to the long sides of a rectangular solar module, or oriented parallel to the sides of a square solar module. It can be arranged end-to-end in a state where it is connected end-to-end. Additionally, the solar module may include more or fewer supercells and more or fewer supercell rows than shown in this example.

In a variation where the supercells 100 in each row are arranged such that at least one of the supercells in each row has a front edge contact on the edge of the supercell adjacent to other supercells in that row, FIG. 5A An optional gap 210 shown in may be present to facilitate electrical contact with the front edge contact of the supercell along the centerline of the solar module. In variants where each supercell row includes three or more supercells, additional optional gaps between supercells may be present, as well as front edge contacts located away from the sides of the solar module. may facilitate electrical contact with the

FIG. 5B shows another exemplary rectangular solar module 300 that includes ten rectangular supercells 100, each having a length approximately equal to the length of the short side of the solar module. The supercells are arranged with their long sides oriented parallel to the short sides of the module. In another variation, the supercells can have a length approximately equal to the length of the long sides of a rectangular solar module and be oriented with their long sides parallel to the long sides of the solar module. The supercells may also have a length approximately equal to the side length of a square solar module and be oriented with their long sides parallel to the sides of the solar module. Additionally, the solar module may include supercells of more or fewer such side lengths than shown in this example.

FIG. 5B also shows what solar module 200 would look like if there were no gaps between adjacent supercells in the multiple supercell rows in solar module 200 of FIG. 5A. Any other suitable arrangement of supercells 100 within a solar module may also be used.

The enumerated paragraphs below provide additional non-limiting aspects of the disclosure.

1. a series-connected string of N (≧25) rectangular or substantially rectangular solar cells having an average breakdown voltage greater than about 10 volts, the rectangular or substantially rectangular solar cells being connected into one or more supercells; The one or more supercells each include a plurality of solar cells arranged side by side with the long sides of adjacent solar cells overlapping and conductively bonded to each other by an electrically and thermally conductive adhesive. comprising a series connected string of rectangular or substantially rectangular solar cells, including two or more of the cells;
A solar module, wherein no single solar cell or group of fewer than N solar cells in said string of solar cells is individually electrically connected in parallel with a bypass diode.

2. The solar module of clause 1, wherein N is greater than or equal to 30.

3. The solar module of clause 1, wherein N is greater than or equal to 50.

4. The solar module of clause 1, wherein N is greater than or equal to 100.

5. The adhesive has a thickness of less than or equal to about 0.1 mm in a direction perpendicular to the plurality of solar cells, and a thermal conductivity of about 1.5 W// in a direction perpendicular to the plurality of solar cells. 2. The solar module of clause 1, forming a plurality of junctions between adjacent solar cells of greater than or equal to m/k.

6. 2. The solar module of clause 1, wherein the N solar cells are grouped into a single supercell.

7. 2. The solar module of item 1, wherein the plurality of supercells are encapsulated within a polymer.

7A. 8. The solar module according to item 7, wherein the polymer includes a thermoplastic olefin polymer.

7B. 8. The solar module of item 7, wherein the polymer is sandwiched between a front sheet and a back sheet of glass.

7C. 7B. The solar module of item 7B, wherein the back sheet comprises glass.

8. Item 2. The solar module according to Item 1, wherein the plurality of solar cells are silicon solar cells.

9. A solar module,
a supercell extending substantially the entire length or width of the solar module parallel to the edges of the solar module, the supercell comprising an electrically and thermally conductive adhesive in which the long sides of adjacent solar cells overlap; a supercell comprising a series-connected string of N rectangular or substantially rectangular solar cells having an average breakdown voltage of greater than about 10 volts arranged side by side in conductive contact with each other;
A solar module, wherein no single solar cell or group of fewer than N solar cells in the supercell is individually electrically connected in parallel with a bypass diode.

10. The solar module according to item 9, wherein N>24.

11. 10. The solar module of clause 9, wherein the length of the supercell in the direction of current flow is at least about 500 mm.

12. 10. The solar module of clause 9, wherein the plurality of supercells are encapsulated within a thermoplastic olefin polymer sandwiched between a glass front sheet and a back sheet.

13. A supercell,
Equipped with multiple silicon solar cells,
Each silicon solar cell
Front and rear surfaces of a rectangular or substantially rectangular shape having a shape defined by oppositely positioned parallel first and second long sides and two oppositely positioned short sides, the front side front and rear surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
an electrically conductive front metallization pattern disposed on the front surface and including at least one front contact pad positioned adjacent the first long side;
an electrically conductive back metallization pattern disposed on the back surface and including at least one back contact pad positioned adjacent the second long side;
The plurality of silicon solar cells are arranged such that the first long side and the second long side of the adjacent silicon solar cells overlap each other, and the contact pads on the front and rear surfaces of the adjacent silicon solar cells overlap each other to conduct conduction. The adjacent silicon solar cells are electrically connected in series and arranged side by side by being conductively bonded to each other using a sticky adhesive bonding agent,
The front metallization pattern of each silicon solar cell substantially confines the conductive adhesive adhesive to at least one front contact pad prior to curing of the conductive adhesive adhesive during fabrication of the supercell. A supercell containing a barrier configured as follows.

14. For each pair of adjacent and overlapping silicon solar cells, the barrier on the front surface of one of the silicon solar cells is overlapped by a portion of the other silicon solar cell, and the barrier is partially concealing and thereby substantially encapsulating the conductive adhesive adhesive in the overlapping region of the front surface of the silicon solar cell prior to curing of the conductive adhesive adhesive during fabrication of the supercell. , the supercell according to item 13.

15. The barrier includes a continuous conductive line extending substantially the entire length of the first long side parallel to the first long side, and the at least one front contact pad includes a continuous conductive line extending substantially the entire length of the first long side; Item 14. The supercell according to item 13, which is located between the first long side and the first long side of the solar cell.

16. The front metallization pattern includes the fingers electrically connected to the at least one front contact pad and extending in a direction perpendicular to the first long side, and the continuous conductive line electrically interconnects the plurality of fingers. 16. The supercell of clause 15, wherein the supercell provides a plurality of conductive paths from each finger to at least one front contact pad.

17. The front surface metallization pattern includes a plurality of discrete contact pads arranged in rows adjacent and parallel to the first long side, and the barrier includes a plurality of discrete contact pads arranged in rows adjacent and parallel to the first long side; prior to curing of the conductive adhesive adhesive during cell manufacture, comprising a plurality of features forming a plurality of discrete barriers that substantially confine the conductive adhesive adhesive to the discontinuous contact pads; The supercell according to item 13.

18. 18. The supercell of clause 17, wherein the plurality of distinct barriers abut and are higher than their corresponding discontinuous contact pads.

19. A supercell,
Equipped with multiple silicon solar cells,
Each silicon solar cell
Front and rear surfaces of a rectangular or substantially rectangular shape having a shape defined by oppositely positioned parallel first and second long sides and two oppositely positioned short sides, the front side front and rear surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
an electrically conductive front metallization pattern disposed on the front surface and including at least one front contact pad positioned adjacent the first long side;
an electrically conductive back metallization pattern disposed on the back surface and including at least one back contact pad positioned adjacent the second long side;
The plurality of silicon solar cells are arranged such that the first long side and the second long side of the adjacent silicon solar cells overlap each other, and the contact pads on the front and rear surfaces of the adjacent silicon solar cells overlap each other to conduct conduction. The adjacent silicon solar cells are electrically connected in series and arranged side by side by being conductively bonded to each other using a sticky adhesive bonding agent,
The backside metallization pattern of each silicon solar cell substantially transfers the conductive adhesive adhesive to the at least one backside contact pad prior to curing of the conductive adhesive adhesive during fabrication of the supercell. A supercell containing a barrier configured to contain.

20. The back metallization pattern includes one or more discrete contact pads arranged in rows adjacent and parallel to the second long side, and the barrier includes for each discrete contact pad: Prior to curing of the conductive adhesive binder during fabrication of the supercell, a plurality of features forming a plurality of discrete barriers substantially confine the conductive adhesive binder to the discontinuous contact pads. 20. The supercell according to item 19, comprising:

21. 21. The supercell of clause 20, wherein the plurality of distinct barriers abut and are higher than their corresponding discontinuous contact pads.

22. A method of making a solar cell string, the method comprising:
dicing the one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edges of each of the pseudo-square silicon wafers so that the dicing is substantially the same along the long axis; forming a plurality of rectangular silicon solar cells each having a length;
arranging the plurality of rectangular silicon solar cells side by side with the long sides of the adjacent solar cells overlapping and conductively bonded to each other to electrically connect the adjacent solar cells in series;
The plurality of rectangular silicon solar cells include at least one rectangular solar cell including two chamfered corners corresponding to a plurality of corners or a part of a plurality of corners of the pseudo square wafer; one or more rectangular silicon solar cells, each of which does not have
The spacing between the parallel lines along which the dicing of the pseudo-square wafer is carried out is the width perpendicular to the long axis of the rectangular silicon solar cell, including the chamfered corners, but not having the chamfered corners. selected to compensate for the chamfered corners by being larger than the width perpendicular to the long axis of one or more rectangular silicon solar cells, thereby making it possible to each having a front surface having substantially the same area exposed to light in operation of the solar cell string.

23. A solar cell string,
A plurality of silicon solar cells arranged side by side with end portions of adjacent solar cells overlapping and conductively bonded to each other to electrically connect the adjacent solar cells in series;
At least one of the plurality of silicon solar cells has a chamfered corner corresponding to the plurality of corners or a part of the plurality of corners of the pseudo square silicon wafer to be diced, and at least one of the plurality of silicon solar cells having a front surface having substantially the same area exposed to light during operation of the solar cell string, at least one of which does not have chamfered corners; A solar cell string.

24. A method of making two or more solar cell strings, comprising:
The one or more pseudo-square silicon wafers are diced along a plurality of lines parallel to the long edges of each of the one or more pseudo-square silicon wafers to obtain the one or more pseudo-square silicon wafers. a first plurality of rectangular silicon solar cells comprising chamfered corners corresponding to the corners, or a portion of the plurality of corners; and a first plurality of rectangular silicon solar cells extending across the entire width of the one or more pseudo-square silicon wafers; forming a second plurality of rectangular silicon solar cells each having a length and having no chamfered corners;
The chamfered corners are removed from each of the first plurality of rectangular silicon solar cells, each having a second length shorter than the first length, and a first plurality of rectangular silicon solar cells having no chamfered corners. 3. forming a plurality of rectangular silicon solar cells;
The second plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series. forming a solar cell string having a width equal to the first length;
The third plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the third plurality of rectangular silicon solar cells are electrically connected in series. forming a solar cell string having a width equal to the second length.

25. A method of making two or more solar cell strings, comprising:
The one or more pseudo-square silicon wafers are diced along a plurality of lines parallel to the long edges of each of the one or more pseudo-square silicon wafers to obtain the one or more pseudo-square silicon wafers. a first plurality of rectangular silicon solar cells having chamfered corners corresponding to the plurality of corners or a portion of the plurality of corners; and a second plurality of rectangular silicon solar cells having no chamfered corners. a step of forming;
The first plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the first plurality of rectangular silicon solar cells are electrically connected in series. process and
The second plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series. A method comprising a process and.

26. A method of making a solar module,
Chamfered corners corresponding to the corners of the plurality of pseudo-square silicon wafers are obtained by dicing the wafer along a plurality of lines parallel to the long edges of each of the plurality of pseudo-square silicon wafers. and a plurality of rectangular silicon solar cells without chamfered corners from the plurality of pseudo square silicon wafers;
At least some of the plurality of rectangular silicon solar cells that do not have chamfered corners are arranged, and the long sides of the plurality of rectangular silicon solar cells overlap and are conductively bonded to each other to form the plurality of rectangular silicon solar cells. forming a first plurality of supercells each including only rectangular silicon solar cells without chamfered corners arranged side by side in series electrical connection;
At least some of the plurality of rectangular silicon solar cells including the chamfered corners are arranged, the long sides of the plurality of rectangular silicon solar cells overlap and are conductively bonded to each other, and the plurality of rectangular silicon solar cells are connected in series. forming a second plurality of supercells each including only rectangular silicon solar cells with chamfered corners arranged side by side in electrical connection;
a plurality of parallel supercell rows of substantially equal length, each row containing only a plurality of supercells from said first plurality of supercells or only a plurality of supercells from said second plurality of supercells; and forming a front surface of the solar module by arranging the plurality of supercells on the solar module.

27. Two of the plurality of supercell rows adjacent to parallel opposing edges of the solar module contain only supercells from the second plurality of supercells and do not contain all other supercell rows. 27. The solar module of clause 26, wherein the cell row includes only supercells from the first plurality of supercells.

28. 28. The solar module of clause 27, wherein the solar module includes a total of six supercell rows.

29. a plurality of silicon solar cells arranged in a line in a first direction with end portions of adjacent silicon solar cells overlapping and conductively bonded to each other to electrically connect the adjacent silicon solar cells in series;
comprising an elongated flexible electrical interconnect;
a long axis of the elongate flexible electrical interconnect is oriented parallel to a second direction perpendicular to the first direction;
The elongated flexible electrical interconnect described above is
conductively bonded to the front or rear surface of an edge silicon solar cell among the plurality of silicon solar cells at three or more discontinuous positions arranged along the second direction;
extending in the second direction over at least the entire width of the solar cell at the end;
a conductor thickness measured perpendicular to the front or back surface of the silicon solar cell at the end is less than or equal to about 100 microns;
providing a resistance to current flow in the second direction of less than or equal to about 0.012 ohms;
and configured to provide flexibility to accommodate differential expansion in the second direction between the end silicon solar cell and the interconnect in a temperature range of about −40° C. to about 85° C. Supercell.

30. The supercell of paragraph 29, wherein the flexible electrical interconnect has a conductor thickness of less than or equal to about 30 microns, measured perpendicular to the front and back surfaces of the edge silicon solar cell. .

31. The flexible electrical interconnect extends beyond the supercell in the second direction to provide electrical connection to at least a second supercell positioned parallel to and adjacent to the supercell within the solar module. 30. A supercell according to clause 29, providing interconnection.

32. The flexible electrical interconnect extends beyond the supercell in the first direction to provide electrical interconnection to a second supercell positioned parallel to and alongside the supercell within the solar module. 30. The supercell of item 29, which provides.

33. A solar module,
arranged in two or more parallel rows extending across the width of the solar module to form the front face of the solar module, with the ends of adjacent silicon solar cells overlapping and conductively bonded to each other to comprising a plurality of supercells each containing a plurality of silicon solar cells arranged side by side with the silicon solar cells electrically connected in series;
At least the edge of the first supercell adjacent to the edge of the solar module in the first row is
bonded to the front surface of the first supercell with an electrically conductive adhesive bonding agent at a plurality of discrete locations;
extending parallel to the edge of the solar module;
at least a portion is folded around the edge of the first supercell and is hidden from view from the front of the solar module;
Via a flexible electrical interconnect,
electrically connecting to an edge of a second supercell adjacent to the same edge of the solar module in a second row;
solar module.

34. 34. The solar module of clause 33, wherein a surface of the flexible electrical interconnect on the front side of the solar module is coated or colored to reduce visible contrast to the supercell.

35. the two or more parallel rows of supercells are arranged on a white rear sheet to form the front surface of the solar module that will be illuminated by solar radiation during operation of the solar module;
the white backsheet includes a plurality of parallel dark-colored stripes having positions and widths corresponding to positions and widths of gaps between two or more parallel rows of the supercells;
34. The solar module of clause 33, wherein white portions of the backsheets are not visible through the gaps between two or more parallel rows of the supercells.

36. A method of making a solar cell string, the method comprising:
laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the one or more silicon solar cells;
applying an electrically conductive adhesive adhesive to the scribed silicon solar cell(s) at one or more locations adjacent to the long sides of each rectangular region;
a plurality of rectangles, each including a portion of the electrically conductive adhesive bonding agent disposed on the front surface adjacent to the long side, separating the one or more silicon solar cells along the one or more scribe lines; A process for providing a silicon solar cell;
arranging the plurality of rectangular silicon solar cells side by side with the long sides of adjacent rectangular silicon solar cells overlapping each other in a shingled pattern with a portion of the electrically conductive adhesive bonding agent interposed therebetween;
curing the electrically conductive bonding agent, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and electrically connecting them in series.

37. A method of making a solar cell string, the method comprising:
laser scribing one or more scribe lines on each silicon solar cell of the one or more silicon solar cells each having a top surface and an oppositely positioned bottom surface to form the one or more silicon solar cells; defining a plurality of rectangular regions on the battery;
applying an electrically conductive adhesive bonding agent to a portion of the top surface of the one or more silicon solar cells;
drawing a vacuum between the bottom surface of the one or more silicon solar cells and a curved support surface to bend the one or more silicon solar cells toward the curved support surface, thereby bending the one or more silicon solar cells toward the curved support surface; cleaving the one or more silicon solar cells along the scribe line to provide a plurality of rectangular silicon solar cells each including a portion of the electrically conductive adhesive bonding agent disposed on the front side adjacent the long side; The process of
arranging the plurality of rectangular silicon solar cells side by side with the long sides of adjacent rectangular silicon solar cells overlapping each other in a shingled pattern with a portion of the electrically conductive adhesive bonding agent interposed therebetween;
curing the electrically conductive bonding agent, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and electrically connecting them in series.

38. applying the electrically conductive adhesive bonding agent to the one or more silicon solar cells, and then laser scribing the one or more scribe lines on each silicon solar cell of the one or more silicon solar cells; 38. The method according to item 37, comprising:

39. laser scribing the one or more scribe lines on each of the one or more silicon solar cells, and then applying the electrically conductive adhesive bonding agent to the one or more silicon solar cells; 38. The method according to item 37, comprising:

40. A solar module,
a plurality of supercells arranged in two or more parallel rows forming the front surface of the solar module, each supercell having ends of adjacent silicon solar cells overlapping and conductively bonded to each other; It has a plurality of silicon solar cells arranged side by side with adjacent silicon solar cells electrically connected in series,
each supercell has a front edge contact at one end of the supercell and a back edge contact of opposite polarity at the opposite end of the supercell;
a first supercell row includes a first supercell disposed with a front edge contact adjacent and parallel to a first edge of the solar module;
The solar module is elongated parallel to the first edge of the solar module, conductively bonded to the front end contact of the first supercell, and adjacent to the first edge of the solar module. a first flexible electrical interconnect occupying only a narrow portion of the front surface of the solar module having a width of about 1 centimeter or less as measured perpendicular to the first edge of the solar module.

41. A portion of the first flexible electrical interconnect extends around the edge of the first supercell closest to the first edge of the solar module and behind the first supercell. Solar module described in.

42. Clause 40, wherein the first flexible interconnect includes a thin ribbon portion conductively bonded to the front edge contact of the first supercell and a thicker portion extending parallel to the first edge of the solar module. Solar module described in.

43. The first flexible interconnect includes a thin ribbon portion conductively bonded to the front edge contact of the first supercell and a coiled ribbon portion extending parallel to the first edge of the solar module. , the solar module according to item 40.

44. a second supercell row including a second supercell disposed with a front edge contact adjacent and parallel to the first edge of the solar module, the front edge contact of the first supercell; 41. The solar module of clause 40, wherein the portion electrically connects to the front end contact of the second supercell via the first flexible electrical interconnect.

45. the rear end contact portion of the first supercell is located adjacent to and parallel to a second edge of the solar module opposite to the first edge of the solar module;
a second flexible electrical interconnect extending elongated parallel to the second edge of the solar module and conductively bonded to the rear end contact of the first supercell and lying entirely behind the supercell; 40. The solar module according to item 40.

46. A second supercell row has a front end contact adjacent to and parallel to the first edge of the solar module, and a back end contact adjacent to the second edge of the solar module. , and a second supercell arranged in parallel;
the front edge contact of the first supercell is electrically connected to the front edge contact of the second supercell via the first flexible electrical interconnect;
46. The solar module of clause 45, wherein the back end contact of the first supercell electrically connects to the back end contact of the second supercell via the second flexible electrical interconnect.

47. a first supercell row disposed in series with the first supercell with a rear end contact adjacent a second edge of the solar module opposite the first edge of the solar module; 2 supercells and
a second flexible electrical interconnect extending elongated parallel to the second edge of the solar module and conductively bonded to the rear end contact of the first supercell and lying entirely behind the supercell; The solar module according to item 40.

48. a second supercell row, wherein a front end contact of a third supercell is adjacent to the first edge of the solar module and a rear end contact of a fourth supercell is adjacent to the second edge of the solar module; the third supercell and the fourth supercell arranged in series in a state,
The front edge contact of the first supercell is electrically connected to the front edge contact of the third supercell via the first flexible electrical interconnect, and the back edge contact of the second supercell is electrically connected to the front edge contact of the third supercell through the first flexible electrical interconnect. 48. The solar module of clause 47, wherein the portion electrically connects to the back end contact of the fourth supercell via the second flexible electrical interconnect.

49. The plurality of supercells have a white rear surface including a plurality of parallel dark colored stripes having a position and width corresponding to the position and width of the plurality of gaps between the two or more parallel rows of supercells. placed on the sheet,
41. The solar module of clause 40, wherein white portions of the backsheets are not visible through the gaps between two or more parallel rows of the supercells.

50. Solar according to paragraph 40, wherein all parts of the first flexible electrical interconnect located on the front side of the solar module are covered or colored to reduce visible contrast to the supercell. module.

51. Each silicon solar cell
Front and rear surfaces of a rectangular or substantially rectangular shape having a shape defined by oppositely positioned parallel first and second long sides and two oppositely positioned short sides, the front side front and rear surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
a plurality of fingers disposed on the front surface and extending perpendicularly to the first long side and the second long side; and a plurality of discontinuous front contact pads positioned in rows adjacent the first long side. an electrically conductive front metallization pattern, each front contact pad electrically connecting to at least one of the plurality of fingers;
an electrically conductive back metallization pattern disposed on the back surface and including a plurality of discrete back contact pads positioned in rows adjacent the second long side;
In each supercell, the plurality of silicon solar cells are arranged such that the first long side and the second long side of the adjacent silicon solar cells overlap each other, and the corresponding distal sides of the adjacent silicon solar cells overlap each other. A continuous front contact pad and a discontinuous back contact pad are aligned with each other, overlapped, and conductively bonded by a conductive adhesive bonding agent to place the adjacent silicon solar cells side by side in series electrical connection. 41. The solar module according to item 40.

52. The front metallization pattern of each silicon solar cell includes a plurality of thin conductors electrically interconnecting adjacent discontinuous front contact pads, each thin conductor being perpendicular to the long side of the plurality of solar cells. 52. The solar module of clause 51, wherein the solar module is thinner than the width of the plurality of discrete contact pads measured in a direction.

53. The conductive adhesive adhesive is connected to the plurality of discontinuous front contact pads by features of the front metallization pattern forming one or more barriers adjacent to the plurality of discontinuous front contact pads. 52. The solar module of clause 51, wherein the solar module is substantially confined to the plurality of locations.

54. The conductive adhesive adhesive is coupled to the plurality of discontinuous back contact pads by features of the back metallization pattern forming one or more barriers adjacent to the plurality of discontinuous back contact pads. 52. The solar module of clause 51, wherein the solar module is substantially confined to the plurality of locations.

55. A process of assembling a plurality of supercells, the process comprising assembling a plurality of rectangular silicon solar cells arranged side by side with the ends of the long sides of adjacent rectangular silicon solar cells overlapping each other in a shingling pattern. The supercell includes a step of heating and pressurizing the plurality of supercells to harden the electrically conductive bonding agent disposed between the overlapping ends of adjacent rectangular silicon solar cells, thereby bonding overlapping rectangular silicon solar cells to each other and electrically connecting them in series;
arranging and interconnecting the plurality of supercells in a desired solar module configuration within a layer stack including an encapsulant;
heating and pressurizing the layer stack to form a laminated structure.

56. Curing or partially curing the electrically conductive binder by heating and pressurizing the plurality of supercells prior to heating and pressurizing the layer stack to form the laminated structure; 56. The method of clause 55, comprising the step of forming a cured or partially cured supercell as an intermediate product, thereby forming a cured or partially cured supercell before forming the laminate structure.

57. As each additional rectangular silicon solar cell is added to the supercell during supercell assembly, the electrical connection between the newly added solar cell and its adjacent overlapping solar cell 57. The method of clause 56, wherein the conductive adhesive adhesive is cured or partially cured before other rectangular silicon solar cells are added to the supercell.

58. 57. The method of clause 56, comprising curing or partially curing all of the electrically conductive binders in a supercell in the same step.

59. partially curing the electrically conductive binder by heating and pressurizing the plurality of supercells prior to heating and pressurizing the layer stack to form the laminate structure; forming a partially cured supercell as an intermediate product prior to forming the laminate structure; heating and pressurizing the layer stack while completing the curing of the electrically conductive binder; 57. The method according to item 56, comprising: forming the layered structure.

60. Prior to formation of the laminate structure, the electrically conductive binder is cured while heating and pressurizing the layer stack without forming cured or partially cured supercells as an intermediate product to form the laminate structure. 56. The method of paragraph 55, comprising the step of forming.

61. 56. The method of clause 55, comprising dicing one or more silicon solar cells into a plurality of rectangular shapes to provide the plurality of rectangular silicon solar cells.

62. applying the electrically conductive adhesive adhesive to the one or more silicon solar cells prior to dicing the one or more silicon solar cells; 62. The method of paragraph 61, comprising providing a rectangular silicon solar cell of.

63. applying the electrically conductive adhesive bonding agent to the one or more silicon solar cells and then using a laser to scribe one or more lines onto each silicon solar cell of the one or more silicon solar cells; and then cleaving the one or more silicon solar cells along the one or more scribed lines.

64. scribing one or more lines onto each of the one or more silicon solar cells using a laser, and then applying the electrically conductive adhesive bonding agent to the one or more silicon solar cells; 63. The method of clause 62, further comprising cleaving the one or more silicon solar cells along the one or more scribed lines.

65. The electrically conductive adhesive bonding agent is applied to the top surface of each silicon solar cell of the one or more silicon solar cells, and is positioned opposite to each other of each silicon solar cell of the one or more silicon solar cells. It does not apply to the bottom surface that has been
A vacuum is drawn between the bottom surface of the one or more silicon solar cells and a curved support surface to bend the one or more silicon solar cells toward the curved support surface, thereby forming a plurality of scribe lines. 63. The method of clause 62, comprising cleaving the one or more silicon solar cells along.

66. dicing the one or more silicon solar cells to provide the plurality of rectangular silicon solar cells, and then applying the electrically conductive adhesive binder to the plurality of rectangular silicon solar cells. 61.

67. 56. The method of paragraph 55, wherein the conductive adhesive binder has a glass transition temperature of less than or equal to about 0<0>C.

1A. A solar module,
a plurality of supercells arranged in two or more parallel rows forming a front surface of the solar module;
Each supercell has a plurality of silicon solar cells arranged side by side with the ends of the adjacent silicon solar cells overlapping and conductively bonded to each other to electrically connect the adjacent silicon solar cells in series. ,
each supercell has a front edge contact at one end of the supercell and a back edge contact of opposite polarity at the opposite end of the supercell;
a first supercell row includes a first supercell disposed with a front edge contact adjacent and parallel to a first edge of the solar module;
The solar module is elongated parallel to the first edge of the solar module, conductively bonded to the front end contact of the first supercell, and adjacent to the first edge of the solar module. a first flexible electrical interconnect occupying only a narrow portion of the front surface of the solar module having a width of about 1 centimeter or less as measured perpendicular to the first edge of the solar module.

2A. A portion of the first flexible electrical interconnect extends around the edge of the first supercell closest to the first edge of the solar module and behind the first supercell. Solar module described in.

3A. Item 1A, wherein the first flexible interconnect includes a thin ribbon portion conductively bonding to the front edge contact of the first supercell and a thicker portion extending parallel to the first edge of the solar module. Solar module described in.

4A. The first flexible interconnect includes a thin ribbon portion conductively bonded to the front edge contact of the first supercell and a coiled ribbon portion extending parallel to the first edge of the solar module. , the solar module according to item 1A.

5A. a second supercell row including a second supercell disposed with a front edge contact adjacent and parallel to the first edge of the solar module, the front edge contact of the first supercell; The solar module of clause 1A, wherein the portion electrically connects to the front end contact of the second supercell via the first flexible electrical interconnect.

6A. the rear end contact portion of the first supercell is located adjacent to and parallel to a second edge of the solar module opposite to the first edge of the solar module;
a second flexible electrical interconnect extending parallel to the second edge of the elongate solar module and conductively bonded to the rear end contact of the first supercell and lying entirely behind the supercell; The solar module according to item 1A.

7A. A second supercell row has a front end contact adjacent to and parallel to the first edge of the solar module, and a back end contact adjacent to the second edge of the solar module. , and a second supercell arranged in parallel;
the front edge contact of the first supercell is electrically connected to the front edge contact of the second supercell via the first flexible electrical interconnect;
6A. The solar module of clause 6A, wherein the back end contact of the first supercell electrically connects to the back end contact of the second supercell via the second flexible electrical interconnect.

8A. a first supercell row disposed in series with the first supercell with a rear end contact adjacent a second edge of the solar module opposite the first edge of the solar module; 2 supercells and
a second flexible electrical interconnect extending elongated parallel to the second edge of the solar module and conductively bonded to the rear end contact of the first supercell and lying entirely behind the supercell; The solar module according to item 1A.

9A. A second supercell row has a front end contact of a third supercell adjacent to the first edge of the solar module, and a rear end contact of a fourth supercell adjacent to the second edge of the solar module. the third supercell and the fourth supercell arranged in series in a state,
The front edge contact of the first supercell is electrically connected to the front edge contact of the third supercell via the first flexible electrical interconnect, and the back edge contact of the second supercell is electrically connected to the front edge contact of the third supercell through the first flexible electrical interconnect. 8A. The solar module of clause 8A, wherein the portion electrically connects to the back end contact of the fourth supercell via the second flexible electrical interconnect.

10A. 1A. The solar module of clause 1A, wherein there is no electrical interconnection between the plurality of supercells in a direction away from the outer edges of the solar module, reducing the active area of the front surface of the solar module.

11A. At least one pair of supercells are arranged in a row with a back contact end of one supercell included in the pair of supercells being adjacent to a back contact end of another supercell included in the pair of supercells. The solar module according to item 1A, wherein the solar module is arranged.

12A. at least one pair of supercells are arranged side by side in a row with adjacent ends of the two supercells having end contacts of opposite polarity;
said adjacent ends of said pair of supercells overlap;
1A. The solar module of clause 1A, wherein the two supercells of the supercell pair are electrically connected in series by a flexible interconnect sandwiched between their overlapping ends and not shading the front surface.

13A. The plurality of supercells have a white backing comprising a plurality of parallel dark-colored stripes having positions and widths corresponding to the positions and widths of the plurality of gaps between two or more parallel rows of the supercells. placed on the sheet,
1A. The solar module of clause 1A, wherein white portions of the backing sheets are not visible through the gaps between two or more parallel rows of the supercells.

14A. 1A, wherein all portions of the first flexible electrical interconnect located on the front side of the solar module are covered or colored to reduce visible contrast to the supercell. module.

15A. Each silicon solar cell
Front and rear surfaces of a rectangular or substantially rectangular shape having a shape defined by oppositely positioned parallel first and second long sides and two oppositely positioned short sides, the front side front and rear surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
a plurality of fingers disposed on the front surface and extending perpendicularly to the first long side and the second long side; and a plurality of discontinuous front contact pads positioned in rows adjacent the first long side. an electrically conductive front metallization pattern, each front contact pad electrically connecting to at least one of the plurality of fingers;
an electrically conductive back metallization pattern disposed on the back surface and including a plurality of discrete back contact pads positioned in rows adjacent the second long side;
In each supercell, the plurality of silicon solar cells are arranged such that the first long side and the second long side of the adjacent silicon solar cells overlap each other, and the corresponding distal sides of the adjacent silicon solar cells overlap each other. A continuous front contact pad and a discontinuous back contact pad are aligned with each other, overlapped, and conductively bonded by a conductive adhesive bonding agent to place the adjacent silicon solar cells side by side in series electrical connection. The solar module according to item 1A, which is

16A. The front metallization pattern of each silicon solar cell includes a plurality of thin conductors electrically interconnecting adjacent discontinuous front contact pads, each thin conductor being perpendicular to the long side of the plurality of solar cells. 15A. The solar module of clause 15A, wherein the solar module is thinner than the width of the plurality of discrete contact pads measured in a direction.

17A. The conductive adhesive bonding agent is located at the plurality of locations of the plurality of discontinuous front contact pads by features of the front metallization pattern forming a plurality of barriers around each discontinuous front contact pad. 15A. The solar module of clause 15A, wherein the solar module is substantially contained.

18A. The conductive adhesive bonding agent is located at the plurality of locations of the plurality of discrete rear contact pads due to features of the back metallization pattern forming a plurality of barriers around each discrete rear contact pad. 15A. The solar module of clause 15A, wherein the solar module is substantially contained.

19A. The plurality of discontinuous back contact pads are a plurality of discontinuous silver back contact pads, and except for the plurality of discontinuous silver back contact pads, the back metallization pattern of each silicon solar cell is: 15A. The solar module of clause 15A, wherein the solar module does not include a silver contact at any location underlying a portion of the front surface of the solar cell where adjacent silicon solar cells do not overlap.

20A. A solar module,
A plurality of supercells, a plurality of silicon solar cells arranged side by side with end portions of adjacent silicon solar cells overlapping and conductively bonded to each other to electrically connect the adjacent silicon solar cells in series. comprising a plurality of supercells, each supercell having
Each silicon solar cell
Front and rear surfaces of a rectangular or substantially rectangular shape having a shape defined by oppositely positioned parallel first and second long sides and two oppositely positioned short sides, the front side front and rear surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
a plurality of fingers disposed on the front surface and extending perpendicularly to the first long side and the second long side; and a plurality of discontinuous front contact pads positioned in rows adjacent the first long side. an electrically conductive front metallization pattern, each front contact pad electrically connecting to at least one of the plurality of fingers;
an electrically conductive back metallization pattern disposed on the back surface and including a plurality of discrete back contact pads positioned in rows adjacent the second long side;
In each supercell, the plurality of silicon solar cells are arranged such that the first long side and the second long side of the adjacent silicon solar cells overlap each other, and the corresponding distal sides of the adjacent silicon solar cells overlap each other. A continuous front contact pad and a discontinuous back contact pad are aligned with each other, overlapped, and conductively bonded by a conductive adhesive bonding agent to place the adjacent silicon solar cells side by side in series electrical connection. has been
The plurality of supercells are arranged in a single row extending substantially the length or width of the solar module, or in two or more parallel rows, so as to avoid sunlight during operation of the solar module. A solar module forming the front surface of said solar module which is to be illuminated by radiation.

21A. The plurality of discontinuous back contact pads are a plurality of discontinuous silver back contact pads, and except for the plurality of discontinuous silver back contact pads, the back metallization pattern of each silicon solar cell is: 20A. The solar module of clause 20A, which does not include silver contacts at any location underlying the portion of the front surface of the solar cell where adjacent silicon solar cells do not overlap.

22A. The front metallization pattern of each silicon solar cell includes a plurality of thin conductors electrically interconnecting adjacent discontinuous front contact pads, each thin conductor being perpendicular to the long side of the plurality of solar cells. 20A, wherein the solar module is thinner than the width of the plurality of discrete contact pads, measured in a direction.

23A. The conductive adhesive bonding agent is located at the plurality of locations of the plurality of discontinuous front contact pads by features of the front metallization pattern forming a plurality of barriers around each discontinuous front contact pad. 20A. The solar module of clause 20A, wherein the solar module is substantially encapsulated.

24A. The conductive adhesive bonding agent is located at the plurality of locations of the plurality of discrete rear contact pads due to features of the back metallization pattern forming a plurality of barriers around each discrete rear contact pad. 20A. The solar module of clause 20A, wherein the solar module is substantially encapsulated.

25A. A supercell,
Equipped with multiple silicon solar cells,
Each silicon solar cell
Front and rear surfaces of a rectangular or substantially rectangular shape having a shape defined by oppositely positioned parallel first and second long sides and two oppositely positioned short sides, the front side front and rear surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
a plurality of fingers disposed on the front surface and extending perpendicularly to the first long side and the second long side; and a plurality of discontinuous front contact pads positioned in rows adjacent the first long side. an electrically conductive front metallization pattern, each front contact pad electrically connecting to at least one of the plurality of fingers;
an electrically conductive back metallization pattern disposed on the back surface and including a plurality of discrete silver back contact pads positioned in rows adjacent the second long side;
The plurality of silicon solar cells are arranged such that the first long side and the second long side of the adjacent silicon solar cells overlap and are connected to corresponding discontinuous front contact pads on the adjacent silicon solar cells. and discontinuous back contact pads aligned with each other, overlapping, and conductively bonded by a conductive adhesive bonding agent to electrically connect the adjacent silicon solar cells in series. .

26A. The plurality of discontinuous back contact pads are a plurality of discontinuous silver back contact pads, and except for the plurality of discontinuous silver back contact pads, the back metallization pattern of each silicon solar cell is: 25A. The solar module of clause 25A, wherein the solar module does not include a silver contact at any location underlying a portion of the front surface of the solar cell where adjacent silicon solar cells do not overlap.

27A. the front metallization pattern includes a plurality of thin conductors electrically interconnecting adjacent discontinuous front contact pads, each thin conductor measured perpendicular to the long side of the plurality of solar cells; 25A, wherein the solar cell string is thinner than the width of the plurality of discontinuous contact pads.

28A. The conductive adhesive bonding agent is located at the plurality of locations of the plurality of discontinuous front contact pads by features of the front metallization pattern forming a plurality of barriers around each discontinuous front contact pad. 25A. The solar cell string of clause 25A, wherein the solar cell string is substantially encapsulated.

29A. The conductive adhesive bonding agent is located at the plurality of locations of the plurality of discrete rear contact pads due to features of the back metallization pattern forming a plurality of barriers around each discrete rear contact pad. 25A. The solar cell string of clause 25A, wherein the solar cell string is substantially encapsulated.

30A. 25A. The solar cell string of clause 25A, wherein the conductive adhesive binder has a glass transition less than or equal to about 0<0>C.

31A. A process of assembling a plurality of supercells, the process comprising assembling a plurality of rectangular silicon solar cells arranged side by side with the ends of the long sides of adjacent rectangular silicon solar cells overlapping each other in a shingling pattern. The supercell includes a step of heating and pressurizing the plurality of supercells to harden the electrically conductive bonding agent disposed between the overlapping ends of adjacent rectangular silicon solar cells, thereby bonding overlapping rectangular silicon solar cells to each other and electrically connecting them in series;
arranging and interconnecting the plurality of supercells in a desired solar module configuration within a layer stack including an encapsulant;
heating and pressurizing the layer stack to form a laminated structure.

32A. Curing or partially curing the electrically conductive binder by heating and pressurizing the plurality of supercells prior to heating and pressurizing the layer stack to form the laminated structure; , thereby forming a cured or partially cured supercell as an intermediate product prior to formation of the laminate structure.

33A. As each additional rectangular silicon solar cell is added to the supercell during supercell assembly, the electrical connection between the newly added solar cell and its adjacent overlapping solar cell 32A. The method of paragraph 32A, wherein the conductive adhesive binder is cured or partially cured before other rectangular silicon solar cells are added to the supercell.

34A. 32A. The method of paragraph 32A, comprising curing or partially curing all of the electrically conductive binders in a supercell in the same step.

35A. partially curing the electrically conductive binder by heating and pressurizing the plurality of supercells prior to heating and pressurizing the layer stack to form the laminate structure; forming a partially cured supercell as an intermediate product prior to forming the laminate structure; heating and pressurizing the layer stack while completing the curing of the electrically conductive binder; 32A. The method according to Item 32A, comprising: forming the layered structure.

36A. Prior to formation of the laminate structure, the electrically conductive binder is cured while heating and pressurizing the layer stack without forming cured or partially cured supercells as an intermediate product to form the laminate structure. 31A. The method of paragraph 31A, comprising forming.

37A. 31A. The method of clause 31A, comprising dicing one or more silicon solar cells into a plurality of rectangular shapes to provide the plurality of rectangular silicon solar cells.

38A. applying the electrically conductive adhesive adhesive to the one or more silicon solar cells prior to dicing the one or more silicon solar cells; 37A. The method of paragraph 37A, comprising providing a rectangular silicon solar cell of.

39A. applying the electrically conductive adhesive bonding agent to the one or more silicon solar cells and then using a laser to scribe one or more lines onto each silicon solar cell of the one or more silicon solar cells; and then cleaving the one or more silicon solar cells along the one or more scribed lines.

40A. scribing one or more lines onto each of the one or more silicon solar cells using a laser, and then applying the electrically conductive adhesive bonding agent to the one or more silicon solar cells; and then cleaving the one or more silicon solar cells along the one or more scribed lines.

41A. The electrically conductive adhesive bonding agent is applied to the top surface of each silicon solar cell of the one or more silicon solar cells, and is positioned opposite to each other of each silicon solar cell of the one or more silicon solar cells. does not apply to the bottom surface
A vacuum is drawn between the bottom surface of the one or more silicon solar cells and a curved support surface to bend the one or more silicon solar cells toward the curved support surface, thereby forming a plurality of scribe lines. 38A. The method of paragraph 38A, comprising cleaving the one or more silicon solar cells along.

42A. dicing the one or more silicon solar cells to provide the plurality of rectangular silicon solar cells, and then applying the electrically conductive adhesive binder to the plurality of rectangular silicon solar cells. 37A.

43A. 31A. The method of paragraph 31A, wherein the conductive adhesive binder has a glass transition temperature of less than or equal to about 0<0>C.

44A. A method of creating a supercell,
laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the one or more silicon solar cells;
applying an electrically conductive adhesive adhesive to the scribed silicon solar cell(s) at one or more locations adjacent to the long sides of each rectangular region;
The one or more silicon solar cells are separated along the one or more scribe lines to form a plurality of rectangles each including a portion of the electrically conductive adhesive bonding agent disposed on the front surface adjacent to the long side. A process for providing a silicon solar cell;
arranging the plurality of rectangular silicon solar cells side by side with the long sides of adjacent rectangular silicon solar cells overlapping each other in a shingled pattern with a portion of the electrically conductive adhesive bonding agent interposed therebetween;
curing the electrically conductive bonding agent, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and electrically connecting them in series.

45A. A method of creating a supercell,
laser scribing one or more scribe lines on each silicon solar cell of the one or more silicon solar cells each having a top surface and an oppositely positioned bottom surface to form the one or more silicon solar cells; defining a plurality of rectangular regions on the battery;
applying an electrically conductive adhesive adhesive to a portion of the top surface of the one or more silicon solar cells;
drawing a vacuum between the bottom surface of the one or more silicon solar cells and a curved support surface to bend the one or more silicon solar cells toward the curved support surface, thereby bending the one or more silicon solar cells toward the curved support surface; cleaving the one or more silicon solar cells along the scribe line to provide a plurality of rectangular silicon solar cells each including a portion of the electrically conductive adhesive bonding agent disposed on the front side adjacent the long side; The process of
arranging the plurality of rectangular silicon solar cells side by side with the long sides of adjacent rectangular silicon solar cells overlapping each other in a shingled pattern with a portion of the electrically conductive adhesive bonding agent interposed therebetween;
curing the electrically conductive bonding agent, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and electrically connecting them in series.

46A. A method of creating a supercell,
dicing the one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edges of each of the pseudo-square silicon wafers so that the one or more pseudo-square silicon wafers are substantially the same along the long axis; forming a plurality of rectangular silicon solar cells each having a length;
arranging the plurality of rectangular silicon solar cells side by side with the long sides of the adjacent solar cells overlapping and conductively bonded to each other so that the adjacent solar cells are electrically connected in series;
The plurality of rectangular silicon solar cells include at least one rectangular solar cell including two chamfered corners corresponding to a plurality of corners or a part of a plurality of corners of the pseudo square wafer; one or more rectangular silicon solar cells, each of which does not have one or more rectangular silicon solar cells;
The spacing between the parallel lines along which the dicing of the pseudo square wafer is carried out is the width perpendicular to the long axis of the rectangular silicon solar cell, including the chamfered corners, but not having the chamfered corners. selected to compensate for the chamfered corners by having a width greater than a width perpendicular to the long axis of one or more rectangular silicon solar cells, such that one or more of the plurality of rectangular silicon solar cells in the solar cell string each having a front surface having substantially the same area exposed to light in operation of the solar cell string.

47A. A supercell,
A plurality of silicon solar cells arranged side by side with end portions of adjacent solar cells overlapping and conductively bonded to each other to electrically connect the adjacent solar cells in series;
At least one of the plurality of silicon solar cells has a chamfered corner corresponding to the plurality of corners or a part of the plurality of corners of the pseudo square silicon wafer to be diced, and at least one of the plurality of silicon solar cells having a front surface having substantially the same area exposed to light during operation of the solar cell string, at least one of which does not have chamfered corners; Supercell.

48A. A method of creating two or more supercells, the method comprising:
The one or more pseudo-square silicon wafers are diced along a plurality of lines parallel to the long edges of each of the one or more pseudo-square silicon wafers to obtain the one or more pseudo-square silicon wafers. a first plurality of rectangular silicon solar cells comprising chamfered corners corresponding to the corners, or a portion of the plurality of corners; and a first plurality of rectangular silicon solar cells extending across the entire width of the one or more pseudo-square silicon wafers; forming a second plurality of rectangular silicon solar cells each having a length and having no chamfered corners;
The chamfered corners are removed from each of the first plurality of rectangular silicon solar cells, each having a second length shorter than the first length, and a first plurality of rectangular silicon solar cells having no chamfered corners. 3. forming a plurality of rectangular silicon solar cells;
The second plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series. forming a solar cell string having a width equal to the first length;
The third plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the third plurality of rectangular silicon solar cells are electrically connected in series. forming a solar cell string having a width equal to the second length.

49A. A method of creating two or more supercells, the method comprising:
The one or more pseudo-square silicon wafers are diced along a plurality of lines parallel to the long edges of each of the one or more pseudo-square silicon wafers to obtain the one or more pseudo-square silicon wafers. a first plurality of rectangular silicon solar cells having chamfered corners corresponding to the plurality of corners or a portion of the plurality of corners; and a second plurality of rectangular silicon solar cells having no chamfered corners. a step of forming;
The first plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the first plurality of rectangular silicon solar cells are electrically connected in series. process and
The second plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series. A method comprising a process and.

50A. a series-connected string of N (≧25) rectangular or substantially rectangular solar cells having an average breakdown voltage greater than about 10 volts, the rectangular or substantially rectangular solar cells being connected in series to form one or more supercells; The one or more supercells each include a plurality of solar cells arranged side by side with the long sides of adjacent solar cells overlapping and conductively bonded to each other by an electrically and thermally conductive adhesive. comprising a series connected string of rectangular or substantially rectangular solar cells, including two or more of the cells;
A solar module, wherein no single solar cell or group of fewer than N solar cells in said string of solar cells is individually electrically connected in parallel with a bypass diode.

51A. 50A, wherein N is greater than or equal to 30.

52A. 50A, wherein N is greater than or equal to 50.

53A. 50A, wherein N is greater than or equal to 100.

54A. The adhesive has a thickness of less than or equal to about 0.1 mm in a direction perpendicular to the plurality of solar cells, and a thermal conductivity of about 1.5 w/w in a direction perpendicular to the plurality of solar cells. 50A. The solar module of paragraph 50A, forming a plurality of junctions between adjacent solar cells of greater than or equal to m/k.

55A. 50A. The solar module of clause 50A, wherein the N solar cells are grouped into a single supercell.

56A. The solar module according to Item 50A, wherein the plurality of solar cells are silicon solar cells.

57A. A solar module,
a supercell extending substantially the entire length or width of the solar module parallel to the edges of the solar module, the supercell comprising an electrically and thermally conductive adhesive in which the long sides of adjacent solar cells overlap; a supercell comprising a series-connected string of N rectangular or substantially rectangular solar cells having an average breakdown voltage of greater than about 10 volts arranged side by side in conductive contact with each other;
A solar module, wherein no single solar cell or group of fewer than N solar cells in the supercell is individually electrically connected in parallel with a bypass diode.

58A. 57A, wherein N>24.

59A. 57A. The solar module of paragraph 57A, wherein the length of the supercell in the direction of current flow is at least about 500 mm.

60A. A supercell,
Equipped with multiple silicon solar cells,
Each silicon solar cell
Front and rear surfaces of a rectangular or substantially rectangular shape having a shape defined by oppositely positioned parallel first and second long sides and two oppositely positioned short sides, the front side front and rear surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
an electrically conductive front metallization pattern disposed on the front surface and including at least one front contact pad positioned adjacent the first long side;
an electrically conductive back metallization pattern disposed on the back surface and including at least one back contact pad positioned adjacent the second long side;
The plurality of silicon solar cells are arranged such that the first long side and the second long side of the adjacent silicon solar cells overlap each other, and the contact pads on the front and rear surfaces of the adjacent silicon solar cells overlap each other to conduct conduction. The adjacent silicon solar cells are electrically connected in series and arranged side by side by being conductively bonded to each other using a sticky adhesive bonding agent,
The front surface metallization pattern of each silicon solar cell substantially transfers the conductive adhesive adhesive to the at least one front contact pad prior to curing of the conductive adhesive adhesive during fabrication of the supercell. A supercell containing a barrier configured to contain.

61A. For each pair of adjacent and overlapping silicon solar cells, the barrier on the front surface of one of the silicon solar cells is overlapped by a portion of the other silicon solar cell, and the barrier is partially concealing and thereby substantially encapsulating the conductive adhesive binder in an overlapping region of the front surface of the silicon solar cell prior to curing of the conductive adhesive binder during fabrication of the supercell. , the supercell according to paragraph 60A.

62A. The barrier includes a continuous conductive line extending substantially the entire length of the first long side parallel to the first long side, and the at least one front contact pad includes a continuous conductive line extending substantially the entire length of the first long side; The supercell according to item 60A, which is located between the first long side of the solar cell.

63A. The front metallization pattern includes the fingers electrically connected to the at least one front contact pad and extending in a direction perpendicular to the first long side, and the continuous conductive line electrically interconnects the plurality of fingers. 62A, wherein the supercell provides multiple conductive paths from each finger to at least one front contact pad.

64A. The front surface metallization pattern includes a plurality of discrete contact pads arranged in rows adjacent and parallel to the first long side, and the barrier includes a plurality of discrete contact pads arranged in rows adjacent and parallel to the first long side; prior to curing of the conductive adhesive adhesive during cell manufacture, comprising a plurality of features forming a plurality of discrete barriers that substantially confine the conductive adhesive adhesive to the discontinuous contact pads; Supercell according to paragraph 60A.

65A. 64A. The supercell of clause 64A, wherein the plurality of distinct barriers abut and are taller than their corresponding discontinuous contact pads.

66A. A supercell,
Equipped with multiple silicon solar cells,
Each silicon solar cell
Front and rear surfaces of a rectangular or substantially rectangular shape having a shape defined by oppositely positioned parallel first and second long sides and two oppositely positioned short sides, the front side front and rear surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
an electrically conductive front metallization pattern disposed on the front surface and including at least one front contact pad positioned adjacent the first long side;
an electrically conductive back metallization pattern disposed on the back surface and including at least one back contact pad positioned adjacent the second long side;
The plurality of silicon solar cells are arranged such that the first long side and the second long side of the adjacent silicon solar cells overlap each other, and the contact pads on the front and rear surfaces of the adjacent silicon solar cells overlap each other to conduct conduction. The adjacent silicon solar cells are electrically connected in series and arranged side by side by being conductively bonded to each other using a sticky adhesive bonding agent,
The backside metallization pattern of each silicon solar cell substantially transfers the conductive adhesive adhesive to the at least one backside contact pad prior to curing of the conductive adhesive adhesive during fabrication of the supercell. A supercell containing a barrier configured to contain.

67A. The back metallization pattern includes one or more discrete contact pads arranged in rows adjacent and parallel to the second long side, and the barrier includes for each discrete contact pad: Prior to curing of the conductive adhesive binder during fabrication of the supercell, a plurality of features forming a plurality of discrete barriers substantially confine the conductive adhesive binder to the discontinuous contact pads. 66A.

68A. 67A. The supercell of clause 67A, wherein the plurality of distinct barriers abut and are taller than their corresponding discontinuous contact pads.

69A. A method of making a solar cell string, the method comprising:
dicing the one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edges of each of the pseudo-square silicon wafers so that the dicing is substantially the same along the long axis; forming a plurality of rectangular silicon solar cells each having a length;
arranging the plurality of rectangular silicon solar cells side by side with the long sides of the adjacent solar cells overlapping and conductively bonded to each other to electrically connect the adjacent solar cells in series;
The plurality of rectangular silicon solar cells include at least one rectangular solar cell including two chamfered corners corresponding to a plurality of corners or a part of a plurality of corners of the pseudo square wafer; one or more rectangular silicon solar cells, each of which does not have
The spacing between the parallel lines along which the dicing of the pseudo-square wafer is carried out is the width perpendicular to the long axis of the rectangular silicon solar cell, including the chamfered corners, but not having the chamfered corners. selected to compensate for the chamfered corners by being larger than the width perpendicular to the long axis of one or more rectangular silicon solar cells, thereby making it possible to each having a front surface having substantially the same area exposed to light in operation of the solar cell string.

70A. A solar cell string,
A plurality of silicon solar cells arranged side by side with end portions of adjacent solar cells overlapping and conductively bonded to each other to electrically connect the adjacent solar cells in series;
At least one of the plurality of silicon solar cells has a chamfered corner corresponding to the plurality of corners or a part of the plurality of corners of the pseudo square silicon wafer to be diced, and at least one of the plurality of silicon solar cells having a front surface having substantially the same area exposed to light during operation of the solar cell string, at least one of which does not have chamfered corners; A solar cell string.

71A. A method of making two or more solar cell strings, the method comprising:
The one or more pseudo-square silicon wafers are diced along a plurality of lines parallel to the long edges of each of the one or more pseudo-square silicon wafers to obtain the one or more pseudo-square silicon wafers. a first plurality of rectangular silicon solar cells comprising chamfered corners corresponding to the corners, or a portion of the plurality of corners; and a first plurality of rectangular silicon solar cells extending across the entire width of the one or more pseudo-square silicon wafers; forming a second plurality of rectangular silicon solar cells each having a length and having no chamfered corners;
The chamfered corners are removed from each of the first plurality of rectangular silicon solar cells, each having a second length shorter than the first length, and a first plurality of rectangular silicon solar cells having no chamfered corners. 3. forming a plurality of rectangular silicon solar cells;
The second plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series. forming a solar cell string having a width equal to the first length;
The third plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the third plurality of rectangular silicon solar cells are electrically connected in series. forming a solar cell string having a width equal to the second length.

72A. A method of making two or more solar cell strings, the method comprising:
The one or more pseudo-square silicon wafers are diced along a plurality of lines parallel to the long edges of each of the one or more pseudo-square silicon wafers to obtain the one or more pseudo-square silicon wafers. a first plurality of rectangular silicon solar cells having chamfered corners corresponding to the plurality of corners or a portion of the plurality of corners; and a second plurality of rectangular silicon solar cells having no chamfered corners. a step of forming;
The first plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the first plurality of rectangular silicon solar cells are electrically connected in series. process and
The second plurality of rectangular silicon solar cells are arranged side by side with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series. A method comprising a process and.

73A. A method of making a solar module,
Chamfered corners corresponding to the corners of the plurality of pseudo-square silicon wafers are obtained by dicing the wafer along a plurality of lines parallel to the long edges of each of the plurality of pseudo-square silicon wafers. and a plurality of rectangular silicon solar cells without chamfered corners from the plurality of pseudo square silicon wafers;
At least some of the plurality of rectangular silicon solar cells that do not have chamfered corners are arranged, and the long sides of the plurality of rectangular silicon solar cells overlap and are conductively bonded to each other to form the plurality of rectangular silicon solar cells. forming a first plurality of supercells each including only rectangular silicon solar cells without chamfered corners arranged side by side in series electrical connection;
At least some of the plurality of rectangular silicon solar cells including the chamfered corners are arranged, the long sides of the plurality of rectangular silicon solar cells overlap and are conductively bonded to each other, and the plurality of rectangular silicon solar cells are connected in series. forming a second plurality of supercells each including only rectangular silicon solar cells without chamfered corners arranged side by side in electrical connection;
a plurality of parallel supercell rows of substantially equal length, each row containing only a plurality of supercells from said first plurality of supercells or only a plurality of supercells from said second plurality of supercells; and forming a front surface of the solar module by arranging the plurality of supercells on the solar module.

74A. Two of the plurality of supercell rows adjacent to parallel opposing edges of the solar module contain only supercells from the second plurality of supercells and do not contain all other supercell rows. 73A. The solar module of clause 73A, wherein the cell row includes only supercells from the first plurality of supercells.

75A. 74A. The solar module of paragraph 74A, wherein the solar module includes a total of six supercell rows.

76A. a plurality of silicon solar cells arranged in a line in a first direction with end portions of adjacent silicon solar cells overlapping and conductively bonded to each other to electrically connect the adjacent silicon solar cells in series;
comprising an elongated flexible electrical interconnect;
a long axis of the elongate flexible electrical interconnect is oriented parallel to a second direction perpendicular to the first direction;
The elongated flexible electrical interconnect described above is
conductively bonded to the front or rear surface of an edge silicon solar cell among the plurality of silicon solar cells at three or more discontinuous positions arranged along the second direction;
extending in the second direction over at least the entire width of the end solar cell;
a conductor thickness measured perpendicular to the front or back surface of the silicon solar cell at the end is less than or equal to about 100 microns;
providing a resistance to current flow in the second direction of less than or equal to about 0.012 ohms;
and configured to provide flexibility to accommodate differential expansion in the second direction between the end silicon solar cell and the interconnect in a temperature range of about −40° C. to about 85° C. Supercell.

77A. The supercell of paragraph 76A, wherein the flexible electrical interconnect has a conductor thickness of less than or equal to about 30 microns, measured perpendicular to the front and back surfaces of the silicon solar cell at the end. .

78A. The flexible electrical interconnect extends beyond the supercell in the second direction to provide electrical connection to at least a second supercell positioned parallel to and adjacent to the supercell within the solar module. 76A. The supercell of paragraph 76A, which provides interconnection.

79A. The flexible electrical interconnect extends beyond the supercell in the first direction to provide electrical interconnection to a second supercell positioned parallel to and alongside the supercell within the solar module. 76A.

80A. A solar module,
arranged in two or more parallel rows extending across the width of the solar module to form the front face of the solar module, with the ends of adjacent silicon solar cells overlapping and conductively bonded to each other to comprising a plurality of supercells each containing a plurality of silicon solar cells arranged side by side with the silicon solar cells electrically connected in series;
At least the edge of the first supercell adjacent to the edge of the solar module in the first row is
bonded to the front surface of the first supercell with an electrically conductive adhesive bonding agent at a plurality of discrete locations;
extending parallel to the edge of the solar module;
at least a portion is folded around the edge of the first supercell and is hidden from view from the front of the solar module;
Via a flexible electrical interconnect,
electrically connecting to an edge of a second supercell adjacent to the same edge of the solar module in a second row;
solar module.

81A. 80A. The solar module of clause 80A, wherein a surface of the flexible electrical interconnect on the front side of the solar module is coated or colored to reduce visible contrast to the supercell.

82A. the two or more parallel rows of supercells are arranged on a white backing sheet to form the front surface of the solar module that will be illuminated by solar radiation during operation of the solar module;
the white backing sheet includes a plurality of parallel dark-colored stripes having positions and widths corresponding to positions and widths of gaps between two or more parallel rows of the supercells;
80A. The solar module of clause 80A, wherein white portions of the backing sheets are not visible through the gaps between two or more parallel rows of the supercells.

83A. A method of making a solar cell string, the method comprising:
laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the one or more silicon solar cells;
applying an electrically conductive adhesive adhesive to the scribed silicon solar cell(s) at one or more locations adjacent to the long sides of each rectangular region;
a plurality of rectangles, each including a portion of the electrically conductive adhesive bonding agent disposed on the front surface adjacent to the long side, separating the one or more silicon solar cells along the one or more scribe lines; A process for providing a silicon solar cell;
arranging the plurality of rectangular silicon solar cells side by side with the long sides of adjacent rectangular silicon solar cells overlapping each other in a shingled pattern with a portion of the electrically conductive adhesive bonding agent interposed therebetween;
curing the electrically conductive bonding agent, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and electrically connecting them in series.

84A. A method of making a solar cell string, the method comprising:
One or more scribe lines are laser scribed on each silicon solar cell of one or more silicon solar cells each having a top surface and a bottom surface positioned oppositely to each other to form a plurality of scribe lines on the silicon solar cell. defining a rectangular area of
applying an electrically conductive adhesive bonding agent to a portion of the top surface of the one or more silicon solar cells;
drawing a vacuum between the bottom surface of the one or more silicon solar cells and a curved support surface to bend the one or more silicon solar cells toward the curved support surface, thereby bending the one or more silicon solar cells toward the curved support surface; cleaving the one or more silicon solar cells along a scribe line to provide a plurality of rectangular silicon solar cells each including a portion of the electrically conductive adhesive bonding agent disposed on the front side adjacent the long side; The process of
arranging the plurality of rectangular silicon solar cells side by side with the long sides of adjacent rectangular silicon solar cells overlapping each other in a shingled pattern with a portion of the electrically conductive adhesive bonding agent interposed therebetween;
curing the electrically conductive bonding agent, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and electrically connecting them in series.

85A. applying the electrically conductive adhesive bonding agent to the one or more silicon solar cells, and then laser scribing the one or more scribe lines on each silicon solar cell of the one or more silicon solar cells; 84A.

86A. laser scribing the one or more scribe lines on each of the one or more silicon solar cells, and then applying the electrically conductive adhesive bonding agent to the one or more silicon solar cells; 84A.

1B. comprising a series connected string of at least 25 solar cells connected in parallel with a common bypass diode;
Each solar cell has a breakdown voltage greater than about 10 volts and is a supercell comprising at least 25 solar cells arranged with the long sides of adjacent solar cells overlapping and conductively bonded by an adhesive. The devices are grouped as follows.

2B. 1B, wherein N is greater than or equal to 30.

3B. 1B, wherein N is greater than or equal to 50.

4B. 1B, wherein N is greater than or equal to 100.

5B. 1B, wherein the adhesive has a thickness less than or equal to about 0.1 mm and a thermal conductivity greater than or equal to about 1.5 W/m/K.

6B. 1B, wherein the N solar cells are grouped into a single supercell.

7B. 1B, wherein the N solar cells are grouped into multiple supercells on the same backing.

8B. 1B, wherein the at least 25 solar cells are silicon solar cells.

9B. 1B, wherein the supercell has a length in the direction of current flow of at least about 500 mm.

10B. 1B. The apparatus of clause IB, wherein the at least 25 solar cells include a feature configured to contain spread of the adhesive.

11B. 10B. The apparatus of clause 10B, wherein the feature includes a raised feature.

12B. 10B. The apparatus of paragraph 10B, wherein the feature includes a metallization.

13B. The metal coating includes a line extending the entire length of the first long side,
12B. The apparatus of clause 12B, further comprising at least one contact pad located between the line and the first long side.

14B. The metallization further includes a plurality of fingers electrically connected to the at least one contact pad and extending in a direction perpendicular to the first long side;
13. The apparatus of clause 13B, wherein the conductive wire interconnects the plurality of fingers.

15B. 10B, wherein the feature is on the front side of the solar cell.

16B. 10B, wherein the feature is on the back side of the solar cell.

17B. 10B. The device of clause 10B, wherein the feature includes a recessed feature.

18B. 10B. The device of clause 10B, wherein the feature is hidden by adjacent solar cells of the supercell.

19B. The first solar cell of the supercell has a plurality of chamfered corners, and the second solar cell of the supercell has no chamfered corners, and the first solar cell and the second solar cell have a plurality of chamfered corners. and the device according to item 1B, wherein the area exposed to light is the same.

20B. further comprising a flexible electrical interconnect whose major axis is parallel to a second direction perpendicular to the first direction;
1B, wherein the flexible electrical interconnect is conductively bonded to a surface of the solar cell to accommodate thermal expansion of the solar cell in two dimensions.

21B. 20B. The apparatus of clause 20B, wherein the flexible electrical interconnect has a thickness of less than or equal to about 100 microns and provides a resistance of less than or equal to about 0.012 ohms.

22B. 20B. The device of clause 20B, wherein the surface includes a rear surface.

23B. 20B. The apparatus of paragraph 20B, wherein the flexible electrical interconnect contacts other supercells.

24B. 23B. The apparatus of clause 23B, wherein the other supercell is aligned with the supercell.

25B. 23B. The apparatus of clause 23B, wherein the other supercell is adjacent to the supercell.

26B. 20B. The apparatus of clause 20B, wherein a first portion of the interconnect is folded around an edge of the supercell such that a remaining second interconnect portion is on the back side of the supercell.

27B. 20B. The apparatus of clause 20B, wherein the flexible electrical interconnect electrically connects to a bypass diode.

28B. a plurality of supercells arranged in two or more parallel rows on a backing sheet to form a front face of the solar module;
1B, wherein the backing sheet is white and includes dark colored stripes at locations and widths corresponding to the gaps between the plurality of supercells.

29B. The apparatus of clause IB, wherein the supercell includes at least one battery string pair connected to a power management system.

30B. further comprising a power management device that performs electrical communication with the supercell;
The above power management device is
Receiving the voltage output of the above supercell,
Based on the above voltage, determine whether the solar cell is reverse biased,
1B, wherein the apparatus is configured to disconnect the reverse biased solar cell from a supercell module circuit.

31B. the supercell is disposed on a first backing to form a first module having an upper conductive ribbon on a first side facing the direction of solar energy;
further comprising another supercell disposed on a second backing forming a second module having a lower ribbon on a second side facing away from said direction of solar energy;
1B. The apparatus of clause IB, wherein the second module overlaps and joins a portion of the first module that includes the upper ribbon.

32B. 31B. The apparatus of clause 31B, wherein the second module is joined to the first module by an adhesive.

33B. 31B. The apparatus of clause 31B, wherein the second module joins the first module by a mating arrangement.

34B. 31B. The apparatus of clause 31B, further comprising a junction box on which the second module overlaps.

35B. 34B. The apparatus of clause 34B, wherein the second module joins the first module by a mating arrangement.

36B. 35B. The apparatus of clause 35B, wherein the mating arrangement is between the junction box and another junction box on the second module.

37B. 31B. The apparatus of paragraph 31B, wherein the first backing comprises glass.

38B. 31B. The device of clause 31B, wherein the first backing comprises something other than glass.

39B. 1B. The device of clause IB, wherein the solar cell includes a beveled portion cut from a larger component.

40B. The supercell further includes another solar cell having a chamfered portion,
39B. The apparatus of paragraph 39B, wherein the long side of the solar cell is in electrical contact with the long side of the other solar cell of similar length.

1C1. forming a supercell comprising a series-connected string of at least N (≧25) solar cells on the same backing, each solar cell having a breakdown voltage greater than about 10 volts and adjacent to each other; a process in which the long sides of the solar cells are arranged with their long sides overlapping and conductively bonded by an adhesive;
connecting each supercell with at most a single bypass diode.

2C1. 1C1, wherein N is greater than or equal to 30.

3C1. 1C1, wherein N is greater than or equal to 50.

4C1. 1C1, wherein N is greater than or equal to 100.

5C1. 1C1, wherein the adhesive has a thickness less than or equal to about 0.1 mm and a thermal conductivity greater than or equal to about 1.5 w/m/k.

6C1. The method according to item 1C1, wherein the plurality of solar cells are silicon solar cells.

7C1. 1C1, wherein the supercell has a length in the direction of current flow of at least about 500 mm.

8C1. The first solar cell of the supercell has a plurality of chamfered corners, and the second solar cell of the supercell has no chamfered corners, and the first solar cell and the second solar cell have a plurality of chamfered corners. The method according to item 1C1, wherein the areas exposed to light are the same.

9C1. 1C1. The method according to item 1C1, further comprising the step of using characteristics of the surface of the solar cell to contain the spread of the adhesive.

10C1. 9C1. The method of clause 9C1, wherein the feature includes an elevated feature.

11C1. 9C1. The method of clause 9C1, wherein the feature includes metallization.

12C1. The metal coating includes a line extending the entire length of the first long side,
11C1, wherein at least one contact pad is located between the line and the first long side.

13C1. The metallization further includes a plurality of fingers electrically connected to the at least one contact pad and extending in a direction perpendicular to the first long side;
12. The method of clause 12C1, wherein the conductive wire interconnects the plurality of fingers.

14C1. 9C1, wherein the feature is on the front side of the solar cell.

15C1. 9C1, wherein the feature is on the back side of the solar cell.

16C1. 9C1. The method of clause 9C1, wherein the feature includes a recessed feature.

17C1. 9C1, wherein the feature is hidden in adjacent solar cells of the supercell.

18C1. 1C1. The method of clause 1C1, further comprising forming another supercell on the same backing.

19C1. conductively bonding to the surface of the solar cell a flexible electrical interconnect whose long axis is parallel to a second direction perpendicular to the first direction;
and causing the flexible electrical interconnect to accommodate thermal expansion of the solar cell in two dimensions.

20C1. 19C1, wherein the flexible electrical interconnect has a thickness of less than or equal to about 100 microns and provides a resistance of less than or equal to about 0.012 ohms.

21C1. 19C1, wherein the surface includes a posterior surface.

22C1. 19C1, further comprising contacting another supercell with the flexible electrical interconnect.

23C1. 22C1, wherein said other supercell is aligned with said supercell.

24C1. 22C1. The method of clause 22C1, wherein the other supercell is adjacent to the supercell.

25C1. 19C1. The method of clause 19C1, further comprising folding a first portion of the interconnect around an edge of the supercell such that a remaining second interconnect portion is on the back side of the supercell.

26C1. 19C1, further comprising electrically connecting the flexible electrical interconnect to a bypass diode.

27C1. further comprising arranging a plurality of supercells in two or more parallel rows on the same backing to form a solar module front face;
1C1. The method of clause 1C1, wherein the backing sheet is white and includes dark colored stripes at locations and widths corresponding to the gaps between the plurality of supercells.

28C1. 1C1. The method of clause 1C1, further comprising connecting at least one battery string pair to a power management system.

29C1. electrically connecting a power management device to the supercell;
causing the power management device to receive the voltage output of the supercell;
causing the power management device to determine whether the solar cell is reverse biased based on the voltage;
1C1, further comprising causing the power management device to disconnect the reverse biased solar cell from supercell module circuitry.

30C1. the supercell is disposed on the backing to form a first module having an upper conductive ribbon on a first side facing the direction of solar energy;
further comprising placing another supercell on another backing to form a second module having a lower ribbon on a second side facing away from the direction of solar energy;
1C1. The method of clause 1C1, wherein the second module overlaps and joins a portion of the first module including the upper ribbon.

31C1. 30C1. The method of clause 30C1, wherein the second module is joined to the first module with an adhesive.

32C1. 30C1. The method of clause 30C1, wherein the second module is joined to the first module by a mating arrangement.

33C1. 30C1. The method of paragraph 30C1, further comprising stacking a junction box with the second module.

34C1. 33C1. The method of clause 33C1, wherein the second module is joined to the first module by a mating arrangement.

35C1. 34. The method of clause 34C1, wherein the mating arrangement is between the junction box and another junction box on the second module.

36C1. 30C1, wherein the backing comprises glass.

37C1. 30C1, wherein the backing comprises something other than glass.

38C1. electrically connecting a relay switch in series between the first module and the second module;
sensing the output voltage of the first module by a controller;
30C1, further comprising activating the relay switch by the controller when the output voltage falls below a limit.

39C1. 1C1. The method of clause 1C1, wherein the solar cell includes a beveled portion cut from a larger component.

40C1. 39C1, wherein forming the supercell comprises bringing a long side of the solar cell into electrical contact with a long side of similar length of another solar cell having a chamfered portion.

1C2. a solar cell comprising a front surface comprising a first series connected string of at least 19 solar cells grouped to form a first supercell with the long sides of adjacent solar cells overlapping and conductively bonded by an adhesive; module and
a ribbon conductor electrically connected to a backside contact of the first supercell to provide a hidden tap to an electrical component.

2C2. 1C2. The apparatus of clause 1C2, wherein the electrical component includes a bypass diode.

3C2. 2C2. The device of clause 2C2, wherein the bypass diode is located on the back side of the solar module.

4C2. 3C2. The device according to clause 3C2, wherein the bypass diode is located outside the junction box.

5C2. The apparatus of paragraph 4C2, wherein the junction box includes a single terminal.

6C2. 3C2. The apparatus of clause 3C2, wherein the bypass diode is located near an edge of the solar module.

7C2. 2C2. The device according to clause 2C2, wherein the bypass diode is positioned within the stacked structure.

8C2. 7C2. The device of clause 7C2, wherein the first supercell is encapsulated within the stacked structure.

9C2. 2C2. The apparatus of clause 2C2, wherein the bypass diode is positioned around the solar module.

10C2. 1C2, wherein the electrical components include module terminals, junction boxes, power management systems, smart switches, relays, voltage sensing controllers, central inverters, DC/AC microinverters, or DC/DC module power optimizers. equipment.

11C2. 1C1. The apparatus of clause 1C1, wherein the electrical component is located on the back side of the solar module.

12C2. The solar module further comprises a second series-connected string of at least 19 solar cells grouped to form a second supercell whose first end electrically connects the first supercell in series. The device described.

13C2. 12. The apparatus of clause 12C2, wherein the second supercell overlaps and is electrically connected in series with the first supercell by a conductive adhesive.

14C2. 12C2. The device of clause 12C2, wherein the back contact portion is located away from the first end.

15C2. 12C2. The apparatus of clause 12C2, further comprising a flexible interconnect between the first end and the first supercell.

16C2. The flexible interconnect extends beyond the side edges of the first supercell and the second supercell to electrically connect the first supercell and the second supercell in parallel with other supercells. 15C2.

17C2. 1C2, wherein the adhesive has a thickness less than or equal to about 0.1 mm and a thermal conductivity greater than or equal to about 1.5 w/m/k.

18C2. 1C2. The apparatus of clause 1C2, wherein the plurality of solar cells are silicon solar cells having a breakdown voltage greater than about 10V.

19C2. 1C2, wherein the first supercell has a length in the direction of current flow of at least about 500 mm.

20C2. 1C2. The apparatus of clause 1C2, wherein the first supercell solar cell includes a feature configured to contain spread of the adhesive.

21C2. 20C2. The apparatus of paragraph 20C2, wherein the feature includes a raised feature.

22C2. 21C2. The apparatus of paragraph 21C2, wherein the feature includes a metallization.

23C2. The metal coating includes a conductive wire extending the entire length of the first long side,
22C2. The apparatus of clause 22C2, further comprising at least one contact pad located between the conductive line and the first long side.

24C2. The metallization further includes a plurality of fingers electrically connected to the at least one contact pad and extending in a direction perpendicular to the first long side;
23. The apparatus of paragraph 23C2, wherein the conductive wire interconnects the plurality of fingers.

25C2. 20C2, wherein the feature is on the front side of the solar cell.

26C2. 20C2, wherein the feature is on the back side of the solar cell.

27C2. 20C2. The device of clause 20C2, wherein the feature includes a recessed feature.

28C2. 20C2. The apparatus of clause 20C2, wherein the feature is hidden by an adjacent solar cell of the first supercell.

29C2. 1C2. The device of clause 1C2, wherein the solar cell of the first supercell includes a chamfered portion.

30C2. The first supercell further includes another solar cell having a chamfered portion,
29C2, wherein the long side of the solar cell is in electrical contact with the long side of the other solar cell of similar length.

31C2. The first supercell further includes other solar cells that do not have chamfered corners,
29C2. The device according to item 29C2, wherein the solar cell and the other solar cell have the same area exposed to light.

32C2. the first supercells are arranged in a plurality of parallel rows on the front side of the backing sheet along with the second supercells;
1C2. The device of clause 1C2, wherein the backing sheet is white and includes a dark colored stripe at a location and width corresponding to a gap between the first supercell and the second supercell.

33C2. 1C2. The apparatus of clause 1C2, wherein the first supercell includes at least one battery string pair connected to a power management system.

34C2. further comprising a power management device in electrical communication with the first supercell;
The above power management device is
Receiving the voltage output of the first supercell,
Based on the voltage, determine whether the solar cell of the first supercell is reverse biased;
1C2, wherein the apparatus is configured to disconnect the reverse biased solar cell from a supercell module circuit.

35C2. 34C2. The apparatus of clause 34C2, wherein the power management device includes a relay.

36C2. the first supercell is disposed on a first backing to form the module having an upper conductive ribbon on a first side facing the direction of solar energy;
further comprising another supercell disposed on a second backing forming a different module having a lower ribbon on a second side facing away from said direction of said solar energy;
1C2. The apparatus of clause 1C2, wherein the different modules overlap and join a portion of the module including the upper ribbon.

37C2. 36C2. The apparatus of clause 36C2, wherein the different modules are joined to the module by an adhesive.

38C2. 36C2. The apparatus of paragraph 36C2, wherein the different modules join to the module by a mating arrangement.

39C2. 36C2. The apparatus of clause 36C2, further comprising a junction box in which the different modules overlap.

40C2. 39C2. The apparatus of clause 39C2, wherein the different modules join to the module by a mating arrangement between the junction box and another junction box on a different solar module.

1C3. a first supercell disposed in front of the solar module and having a plurality of solar cells each having a breakdown voltage greater than about 10V;
a first ribbon conductor in electrical connection with the backside contact of the first supercell to provide a first hidden tap to an electrical component;
a second supercell disposed in front of the solar module and having a plurality of solar cells each having a breakdown voltage higher than about 10V;
a second ribbon conductor in electrical connection with the backside contact of the second supercell to provide a second hidden tap.

2C3. 1C3. The apparatus of clause 1C3, wherein the electrical component includes a bypass diode.

3C3. The device according to paragraph 2C3, wherein the bypass diode is located on the back side of the solar module.

4C3. 3C3. The device according to clause 3C3, wherein the bypass diode is located outside the junction box.

5C3. 4C3. The apparatus of clause 4C3, wherein the junction box includes a single terminal.

6C3. 3. The apparatus of clause 3C3, wherein the bypass diode is located near an edge of the solar module.

7C3. 2C3. The device of clause 2C3, wherein the bypass diode is located within a stacked structure.

8C3. 7C3. The device of clause 7C3, wherein the first supercell is encapsulated within the stacked structure.

9C3. 8C3. The apparatus of clause 8C3, wherein the bypass diode is positioned around the solar module.

10C3. 1C3. The apparatus of clause 1C3, wherein the first supercell is connected in series with the second supercell.

11C3. the first supercell and the second supercell form a first pair;
10C3. The apparatus of clause 10C3, further comprising two additional supercells included in a second pair connected in parallel with the first pair.

12C3. 10C3. The apparatus of clause 10C3, wherein the second hidden tap connects to the electrical component.

13C3. 12C3. The apparatus of clause 12C3, wherein the electrical component includes a bypass diode.

14C3. 13C3, wherein the first supercell includes 19 or more solar cells.

15C3. 12C3. The apparatus of clause 12C3, wherein the electrical component includes a power management system.

16C3. 1C3. The apparatus of clause 1C3, wherein the electrical component includes a switch.

17C3. 16C3. The apparatus of clause 16C3, further comprising a voltage sensing controller in communication with the switch.

18C3. 16C3, wherein the switch is in communication with a central inverter.

19C3. The electrical component further includes a power management device;
The above power management device is
Receiving the voltage output of the first supercell,
Based on the voltage, determine whether the solar cell of the first supercell is reverse biased;
1C3, wherein the apparatus is configured to disconnect the reverse biased solar cell from a supercell module circuit.

20C3. 2. The apparatus of clause 1, wherein the electrical component includes an inverter.

21C3. 20C3, wherein the inverter includes a DC/AC microinverter.

22C3. 1C3. The apparatus of clause 1C3, wherein the electrical component includes a solar module terminal.

23C3. 22C3. The apparatus of paragraph 22C3, wherein the solar module terminal is a single solar module terminal in a junction box.

24C3. 1C3. The apparatus of clause 1C3, wherein the electrical component is located on the back side of the solar module.

25C3. 1C3. The apparatus of clause 1C3, wherein the back contact portion is located away from an edge of the first supercell that overlaps the second supercell.

26C3. 1C3, wherein the first supercell has a length in the direction of current flow of at least about 500 mm.

27C3. 1C3. The apparatus of clause 1C3, wherein the first supercell solar cell includes a feature configured to contain spread of the adhesive.

28C3. 27. The apparatus of paragraph 27C3, wherein the feature includes a raised feature.

29C3. 28C3. The apparatus of paragraph 28C3, wherein the feature includes a metallization.

30C3. 27C3. The device of paragraph 27C3, wherein the feature includes a recessed feature.

31C3. 27. The device of paragraph 27C3, wherein the feature is on the back side of the solar cell.

32C3. 27. The apparatus of paragraph 27C3, wherein the feature is hidden by an adjacent solar cell of the first supercell.

33C3. 1C3. The device of clause 1C3, wherein the solar cell of the first supercell includes a chamfered portion.

34C3. The first supercell further includes another solar cell having a chamfered portion,
33C3, wherein a long side of the solar cell is in electrical contact with a long side of the other solar cell of similar length.

35C3. The first supercell further includes other solar cells that do not have chamfered corners;
33C3. The device according to item 33C3, wherein the solar cell and the other solar cell have the same area exposed to light.

36C3. the first supercells are arranged in a plurality of parallel rows on the front side of the backing sheet along with the second supercells;
1C3. The device of clause 1C3, wherein the backing sheet is white and includes a dark colored stripe at a location and width corresponding to a gap between the first supercell and the second supercell.

37C3. the first supercell is disposed on a first backing to form the module with an upper conductive ribbon on the front side of the module facing the direction of solar energy;
further comprising a third supercell disposed on a second backing forming a different module having a lower ribbon on a second side facing away from the direction of solar energy;
1C3. The apparatus of clause 1C3, wherein the different modules overlap and join a portion of the module including the upper ribbon.

38C3. 37C3. The apparatus of clause 37C3, wherein the different modules are joined to the module by an adhesive.

39C3. 37C3. The apparatus of clause 37C3, further comprising a junction box in which the different modules overlap.

40C3. 39C3. The apparatus of clause 39C3, wherein the different modules join to the module by a mating arrangement between the junction box and another junction box on the different module.

1C4. a solar module including a front surface including a first series-connected string of solar cells grouped into a first supercell arranged with sides of adjacent solar cells overlapping and conductively bonded by an adhesive;
and a solar cell surface feature configured to encapsulate the adhesive.

2C4. 1C4, wherein the solar cell surface features include recessed features.

3C4. 1C4, wherein the solar cell surface features include raised features.

4C4. The device of paragraph 3C4, wherein the raised feature is on the front side of the solar cell.

5C4. The apparatus of paragraph 4C4, wherein the raised feature includes a metallization pattern.

6C4. 5C4. The apparatus of clause 5C4, wherein the metallization pattern extends parallel to a long side of the solar cell and includes a conductive line substantially along the long side.

7C4. 6C4. The apparatus of clause 6C4, further comprising a contact pad between the conductive line and the long side.

8C4. The metallization pattern further includes a plurality of fingers;
7C4. The apparatus of clause 7C4, wherein the conductive wire electrically interconnects the plurality of fingers to provide a plurality of conductive paths from each finger to the contact pad.

9C4. further comprising a plurality of discontinuous contact pads arranged in rows adjacent to and parallel to the long side;
7C4. The apparatus of clause 7C4, wherein the metallization pattern forms a plurality of discrete barriers to confine the adhesive to the plurality of discrete contact pads.

10C4. 8C4. The apparatus of clause 8C4, wherein the plurality of discrete barriers abut a plurality of corresponding discrete contact pads.

11C4. 8C4. The apparatus of clause 8C4, wherein the plurality of discrete barriers are taller than the plurality of corresponding discrete contact pads.

12C4. 1C4. The device according to clause 1C4, wherein the solar cell surface feature is hidden by an overlapping side of another solar cell.

13C4. 12C4, wherein the other solar cell is part of the supercell.

14C4. 12C4, wherein the other solar cell is part of another supercell.

15C4. The device of paragraph 3C4, wherein the raised feature is on the back side of the solar cell.

16C4. 15C4, wherein the raised feature comprises a metallization pattern.

17C4. The apparatus of paragraph 16C4, wherein the metallization pattern forms a plurality of discrete barriers to confine the adhesive to a plurality of discrete contact pads located in front of other solar cells over which the solar cell overlaps. .

18C4. 17C4. The apparatus of clause 17C4, wherein the plurality of discrete barriers abut a plurality of corresponding discrete contact pads.

19C4. 17C4, wherein the plurality of discrete barriers are taller than the plurality of corresponding discrete contact pads.

20C4. 1C1, wherein each solar cell of the supercell has a breakdown voltage of 10V or higher.

21C4. 1C1, wherein the supercell has a length in the direction of current flow of at least about 500 mm.

22C4. The apparatus of clause 1C1, wherein the solar cell of the first supercell includes a chamfered portion.

23C4. The supercell further includes another solar cell having a chamfered portion,
22C4, wherein the long side of the solar cell is in electrical contact with the long side of the other solar cell of similar length.

24C4. The supercell further includes other solar cells that do not have chamfered corners;
22C4, wherein the solar cell and the other solar cell have the same area exposed to light.

25C4. 1C4. The apparatus of clause 1C4, wherein the supercell is placed in front of a first backing sheet with a second supercell to form a first module.

26C4. 25C4, wherein the backing sheet is white and includes a plurality of dark colored stripes at a location and width corresponding to a gap between the supercell and the second supercell.

27C4. The first module has an upper conductive ribbon on the front side of the first module facing the direction of solar energy;
further comprising a third supercell disposed on the second backing to form a second module having a lower ribbon on the side of the second module facing away from the solar energy;
25C4, wherein the second module overlaps and joins a portion of the first module that includes the upper ribbon.

28C4. 27. The apparatus of paragraph 27C4, wherein the second module is joined to the first module by an adhesive.

29C4. 27C4. The apparatus of paragraph 27C4, further comprising a junction box on which the second module overlaps.

30C4. 29. The apparatus of clause 29C4, wherein the second module joins the first module by the mating arrangement between the junction box and another junction box on the second module.

31C4. 29. The apparatus of paragraph 29C4, wherein the junction box houses a single module terminal.

32C4. 27C4. The apparatus of clause 27C4, further comprising a switch between the first module and the second module.

33C4. 32C4. The apparatus of clause 32C4, further comprising a voltage sensing controller in communication with the switch.

34C4. 27C4. The apparatus of paragraph 27C4, wherein the supercell includes nineteen or more solar cells individually electrically connected in parallel with a single bypass diode.

35C4. 34. The apparatus of paragraph 34C4, wherein the single bypass diode is located near an edge of the first module.

36C4. 34. The apparatus of paragraph 34C4, wherein the single bypass diode is located within a stacked structure.

37C4. 36C4, wherein the supercell is encapsulated within the stacked structure.

38C4. 34. The apparatus of paragraph 34C4, wherein the single bypass diode is positioned around the first module.

39C4. 25C4. The apparatus of clause 25C4, wherein the supercell and the second supercell constitute a pair that individually connects to a power management device.

40C4. further equipped with power management devices,
The above power management device is
Receiving the voltage output of the supercell above,
Based on the voltage, determine whether the solar cell of the supercell is reverse biased,
25C4, wherein the apparatus is configured to disconnect the reverse biased solar cell from a supercell module circuit.

1C5. a solar module including a front surface including a first series-connected string of a plurality of silicon solar cells grouped into a first supercell;
The device, wherein the first supercell includes a first silicon solar cell having a plurality of chamfered corners and positioned with a side overlapping and conductively bonded to a second silicon solar cell by an adhesive.

2C5. The second silicon solar cell does not have chamfered corners,
1C5. The apparatus of clause 1C5, wherein each silicon solar cell of the first supercell has substantially the same front surface area exposed to light.

3C5. The first silicon solar cell and the second silicon solar cell have the same length,
2C5, wherein the width of the first silicon solar cell is greater than the width of the second silicon solar cell.

4C5. The apparatus according to item 3C5, wherein the length reproduces the shape of a pseudo-square wafer.

5C5. 3C5, wherein the length is 156 mm.

6C5. 3C5, wherein said length is 125 mm.

7C5. 3C5, wherein the aspect ratio between the width and the length of the first solar cell is between about 1:2 and about 1:20.

8C5. 3C5, wherein the first silicon solar cell overlaps the second silicon solar cell by about 1 mm to about 5 mm.

9C5. 3C5. The apparatus of clause 3C5, wherein the first supercell includes at least 19 silicon solar cells, each having a breakdown voltage greater than about 10 volts.

10C5. 3C5, wherein the first supercell has a length in the direction of current flow of at least about 500 mm.

11C5. The first supercell is connected in parallel with the second supercell at the front side,
3C5. The device of clause 3C5, wherein the front surface includes a white backing having a plurality of dark colored stripes at a location and width corresponding to a gap between the first supercell and the second supercell.

12C5. 1C5. The apparatus of clause 1C5, wherein the second silicon solar cell includes chamfered corners.

13C5. 12C5, wherein the long side of the first silicon solar cell overlaps the long side of the second silicon solar cell.

14C5. 12C5, wherein the long side of the first silicon solar cell overlaps the short side of the second silicon solar cell.

15C5. The above front is
a first row comprising the first supercell of a plurality of solar cells including a plurality of chamfered corners;
a second row including a second series-connected string of silicon solar cells connected in parallel with said first supercell and grouped into a second supercell of a plurality of solar cells without chamfered corners; including and
The apparatus of clause 1C5, wherein the length of the second row is substantially the same as the length of the first row.

16C5. 15C5, wherein the first row is adjacent to a module edge and the second row is not adjacent to the module edge.

17C5. the first supercell includes at least 19 solar cells each having a breakdown voltage greater than about 10 volts;
15C5, wherein the first supercell has a length in the direction of current flow of at least about 500 mm.

18C5. 15C5. The device of clause 15C5, wherein the front surface includes a white backing having a plurality of dark colored stripes at a location and width corresponding to a gap between the first supercell and the second supercell.

19C5. 1C5. The apparatus of clause 1C5, further comprising a metallization pattern on the front side of the second solar cell.

20C5. 19C5, wherein the metallization pattern includes a tapered portion extending around a chamfered corner.

21C5. 19C5, wherein the metallization pattern includes raised features that contain spread of the adhesive.

22C5. The above metal coating pattern is
a plurality of discontinuous contact pads;
a plurality of fingers electrically connected to the plurality of discontinuous contact pads;
and a conductive wire interconnecting the plurality of fingers.

23C5. 22C5. The apparatus of clause 22C5, wherein the metallization pattern forms a plurality of discrete barriers to confine the adhesive to the plurality of discrete contact pads.

24C5. 23C5. The apparatus of clause 23C5, wherein the plurality of distinct barriers abut a plurality of corresponding discontinuous contact pads and are taller than the plurality of corresponding discontinuous contact pads.

25C5. 1C5. The apparatus of clause 1C5, further comprising a flexible electrical interconnect conductively bonded to a surface of the first solar cell and accommodating thermal expansion of the first solar cell in two dimensions.

26C5. 25C5. The apparatus of paragraph 25C5, wherein the first portion of the interconnect is folded around an edge of the first supercell such that the remaining second interconnect portion is on the rear side of the first supercell.

27C5. The module has an upper conductive ribbon on the front side facing the direction of solar energy;
further comprising another module having a second supercell disposed in front thereof, the lower ribbon on the other module facing away from the solar energy;
1C5. The apparatus of clause 1C5, wherein the second module overlaps and joins a portion of the first module that includes the upper ribbon.

28C5. 27C5. The apparatus of paragraph 27C5, wherein the other module is joined to the module by an adhesive.

29C5. 27C5. The apparatus of paragraph 27C5, further comprising a junction box on which the other module overlaps.

30C5. 29. The apparatus of clause 29C5, wherein the other module joins the module by a mating arrangement between the junction box and another junction box on the other module.

31C5. 29C5. The apparatus of clause 29C5, wherein the junction box houses a single module terminal.

32C5. 27C5. The apparatus of clause 27C5, further comprising a switch between the module and the other module.

33C5. 32C5. The apparatus of clause 32C5, further comprising a voltage sensing controller in communication with the switch.

34C5. 27C5. The apparatus of clause 27C5, wherein the first supercell includes nineteen or more solar cells in electrical connection with a single bypass diode.

35C5. 34. The apparatus of paragraph 34C5, wherein the single bypass diode is located near an edge of the first module.

36C5. 34. The apparatus of paragraph 34C5, wherein the single bypass diode is located within a stacked structure.

37C5. 36C5, wherein the supercell is encapsulated within the stacked structure.

38C5. 34. The apparatus of clause 34C5, wherein the single bypass diode is positioned around the first module.

39C5. 27C5. The apparatus of clause 27C5, wherein the first supercell and the second supercell form a pair that connects to a power management device.

40C5. further equipped with power management devices,
The above power management device is
Receiving the voltage output of the first supercell,
Based on the voltage, determine whether the solar cell of the first supercell is reverse biased;
27C5, wherein the apparatus is configured to disconnect the reverse biased solar cell from a supercell module circuit.

1C6. a solar module including a front surface including a first series-connected string of silicon solar cells grouped into a first supercell;
The device, wherein the first supercell includes a first silicon solar cell having a plurality of chamfered corners and positioned with a side overlapping and conductively bonded to a second silicon solar cell by an adhesive.

2C6. The second silicon solar cell does not have chamfered corners,
1C6. The apparatus of clause 1C6, wherein each silicon solar cell of the first supercell has substantially the same front surface area exposed to light.

3C6. The first silicon solar cell and the second silicon solar cell have the same length,
2C6, wherein the width of the first silicon solar cell is greater than the width of the second silicon solar cell.

4C6. The apparatus according to item 3C6, wherein the length reproduces the shape of a pseudo-square wafer.

5C6. 3C6, wherein the length is 156 mm.

6C6. 3C6, wherein said length is 125 mm.

7C6. 3C6, wherein the aspect ratio between the width and the length of the first solar cell is between about 1:2 and about 1:20.

8C6. 3C6, wherein the first silicon solar cell overlaps the second silicon solar cell by about 1 mm to about 5 mm.

9C6. 3C6. The apparatus of clause 3C6, wherein the first supercell includes at least 19 silicon solar cells, each having a breakdown voltage greater than about 10 volts.

10C6. 3C6, wherein the first supercell has a length in the direction of current flow of at least about 500 mm.

11C6. The first supercell is connected in parallel with the second supercell at the front side,
3C6. The apparatus of clause 3C6, wherein the front surface includes a white backing having a plurality of dark colored stripes at a location and width corresponding to a gap between the first supercell and the second supercell.

12C6. 1C6. The apparatus of clause 1C6, wherein the second silicon solar cell includes chamfered corners.

13C6. 12C6, wherein the long side of the first silicon solar cell overlaps the long side of the second silicon solar cell.

14C6. 12C6, wherein the long side of the first silicon solar cell overlaps the short side of the second silicon solar cell.

15C6. The above front is
a first row comprising the first supercell of a plurality of solar cells including a plurality of chamfered corners;
a second row including a second series-connected string of silicon solar cells connected in parallel with said first supercell and grouped into a second supercell of a plurality of solar cells without chamfered corners; including and
The apparatus of clause 1C6, wherein the length of the second row is substantially the same as the length of the first row.

16C6. 15C6, wherein the first row is adjacent to a module edge and the second row is not adjacent to the module edge.

17C6. the first supercell includes at least 19 solar cells each having a breakdown voltage greater than about 10 volts;
15C6, wherein the first supercell has a length in the direction of current flow of at least about 500 mm.

18C6. 15C6. The apparatus of clause 15C6, wherein the front surface includes a white backing having a plurality of dark colored stripes at a location and width corresponding to a gap between the first supercell and the second supercell.

19C6. 1C6. The apparatus of clause 1C6, further comprising a metallization pattern on the front side of the second solar cell.

20C6. 19C6, wherein the metallization pattern includes a tapered portion extending around a chamfered corner.

21C6. 19C6, wherein the metallization pattern includes raised features that contain spread of the adhesive.

22C6. The above metal coating pattern is
a plurality of discontinuous contact pads;
a plurality of fingers electrically connected to the plurality of discontinuous contact pads;
and a conductive wire interconnecting the plurality of fingers.

23C6. 22C6. The apparatus of clause 22C6, wherein the metallization pattern forms a plurality of discrete barriers to confine the adhesive to the plurality of discrete contact pads.

24C6. 23C6. The apparatus of clause 23C6, wherein the plurality of distinct barriers abut a plurality of corresponding discrete contact pads and are taller than the plurality of corresponding discrete contact pads.

25C6. 1C6. The apparatus of clause 1C6, further comprising a flexible electrical interconnect conductively bonded to a surface of the first solar cell and accommodating thermal expansion of the first solar cell in two dimensions.

26C6. 25C6. The apparatus of paragraph 25C6, wherein the first portion of the interconnect is folded around an edge of the first supercell such that the remaining second interconnect portion is on the rear side of the first supercell.

27C6. The module has an upper conductive ribbon on the front side facing the direction of solar energy;
further comprising another module having a second supercell disposed in front thereof, the lower ribbon on the other module facing away from the solar energy;
1C6. The apparatus of clause 1C6, wherein the second module overlaps and joins a portion of the first module that includes the upper ribbon.

28C6. 27C6. The apparatus of paragraph 27C6, wherein the other module is joined to the module by an adhesive.

29C6. 27C6. The apparatus of paragraph 27C6, further comprising a junction box on which the other module overlaps.

30C6. 29C6. The apparatus of clause 29C6, wherein the other module joins the module by a mating arrangement between the junction box and another junction box on the other module.

31C6. 29C6, wherein the junction box houses a single module terminal.

32C6. 27C6. The apparatus of clause 27C6, further comprising a switch between the module and the other module.

33C6. 32C6. The apparatus of clause 32C6, further comprising a voltage sensing controller in communication with the switch.

34C6. 27C6, wherein the first supercell includes nineteen or more solar cells in electrical connection with a single bypass diode.

35C6. 34. The apparatus of paragraph 34C6, wherein the single bypass diode is located near an edge of the first module.

36C6. 34. The apparatus of paragraph 34C6, wherein the single bypass diode is located within a stacked structure.

37C6. 36C6, wherein the supercell is encapsulated within the stacked structure.

38C6. 34. The apparatus of paragraph 34C6, wherein the single bypass diode is positioned around the first module.

39C6. 27C6. The apparatus of clause 27C6, wherein the first supercell and the second supercell form a pair that connects to a power management device.

40C6. further equipped with power management devices,
The above power management device is
Receiving the voltage output of the first supercell,
Based on the voltage, determine whether the solar cell of the first supercell is reverse biased;
27C6, wherein the apparatus is configured to disconnect the reverse biased solar cell from a supercell module circuit.

1C7. A solar module having a front face comprising a first series-connected string of at least 19 solar cells, each of the at least 19 solar cells having a breakdown voltage greater than about 10V, an end connected to a second silicon solar cell; a solar module grouped into a supercell including a first silicon solar cell disposed overlying the cell and conductively bonded by an adhesive;
An apparatus comprising an interconnect conductively bonded to a surface of a solar cell.

2C7. 1C7. The device according to clause 1C7, wherein the solar cell surface includes a back surface of the first silicon solar cell.

3C7. 2C7. The apparatus of clause 2C7, further comprising a ribbon conductor electrically connecting the supercell to an electrical component.

4C7. 3C7. The apparatus of clause 3C7, wherein the ribbon conductor is conductively bonded to the solar cell surface in a direction away from the overlapping ends.

5C7. 4C7. The apparatus of clause 4C7, wherein the electrical component is on the back side of the solar module.

6C7. 4C7. The apparatus of clause 4C7, wherein the electrical component includes a junction box.

7C7. 6C7. The apparatus of clause 6C7, wherein the junction box matingly engages other junction boxes on different modules on which the module overlaps.

8C7. 4C7. The apparatus of clause 4C7, wherein the electrical component includes a bypass diode.

9C7. 4C7. The apparatus of clause 4C7, wherein the electrical components include module terminals.

10C7. 4C7. The apparatus of clause 4C7, wherein the electrical component includes an inverter.

11C7. 10C7, wherein the inverter includes a DC/AC microinverter.

12C7. The device according to item 11C7, wherein the DC/AC microinverter is on the back side of the solar module.

13C7. 4C7. The apparatus of clause 4C7, wherein the electrical component includes a power management device.

14C7. 13C7. The apparatus of clause 13C7, wherein the power management device includes a switch.

15C7. 14C7. The apparatus of clause 14C7, further comprising a voltage sensing controller in communication with the switch.

16C7. The above power management device is
Receiving the voltage output of the supercell above,
Based on the voltage, determine whether the solar cell of the supercell is reverse biased,
13C7, wherein the apparatus is configured to disconnect the reverse biased solar cell from a supercell module circuit.

17C7. 16C7, wherein the power management device is in electrical communication with a central inverter.

18C7. 13. The apparatus of clause 13C7, wherein the power management device includes a DC/DC module power optimizer.

19C7. 3C7. The apparatus of clause 3C7, wherein the interconnect is sandwiched between the supercell and another supercell on the front side of the solar module.

20C7. 3C7. The apparatus of clause 3C7, wherein the ribbon conductor is conductively bonded to the interconnect.

21C7. 3C7, wherein the interconnect provides a resistance to current flow of less than or equal to about 0.012 ohms.

22C7. The interconnect is configured to accommodate differential expansion between the first silicon solar cell and the interconnect at a temperature range between about -40°C and about 85°C. 3C7.

23C7. 3C7, wherein the thickness of the interconnect is less than or equal to about 100 microns.

24C7. The apparatus of paragraph 3C7, wherein the thickness of the interconnect is less than or equal to about 30 microns.

25C7. 3C7, wherein the supercell has a length in the direction of current flow of at least about 500 mm.

26C7. 3C7. The apparatus of clause 3C7, further comprising another supercell on the front side of the solar module.

27C7. 26C7. The apparatus of clause 26C7, wherein the interconnect connects the other supercell in series with the supercell.

28C7. 26C7. The apparatus of clause 26C7, wherein the interconnect connects the other supercell in parallel with the supercell.

29C7. 26C7. The apparatus of clause 26C7, wherein the front surface includes a white backing having a plurality of dark colored stripes at a location and width corresponding to a gap between the supercell and the other supercell.

30C7. 3C7. The apparatus of clause 3C7, wherein the interconnect includes a pattern.

31C7. 30C7. The apparatus of paragraph 30C7, wherein the pattern includes slits, slots, and/or holes.

32C7. 3C7. The apparatus of paragraph 3C7, wherein some of the interconnects are dark colored.

33C7. The first silicon solar cell includes a plurality of chamfered corners,
The second silicon solar cell does not have chamfered corners,
3C7. The apparatus of clause 3C7, wherein each silicon solar cell of the supercell has substantially the same front surface area exposed to light.

34C7. The first silicon solar cell includes a plurality of chamfered corners,
The second silicon solar cell includes a plurality of chamfered corners,
The device according to item 3C7, wherein the side includes a long side that overlaps a long side of the second silicon solar cell.

35C7. 3C7. The apparatus of clause 3C7, wherein the interconnects form a bus.

36C7. 3C7. The apparatus of clause 3C7, wherein the interconnect conductively joins the solar cell surface with a bonded connection.

37C7. 3C7. The apparatus of clause 3C7, wherein a first portion of the interconnect is folded around an edge of the supercell such that the remaining second portion is located on the rear side of the supercell.

38C7. further comprising a metallization pattern on the front surface and including a line extending along the long side;
3C7. The apparatus of clause 3C7, further comprising a plurality of discrete contact pads located between the line and the long side.

39C7. The metallization further includes a plurality of fingers extending perpendicular to the long side electrically connecting each discontinuous contact pad;
38C7. The apparatus of paragraph 38C7, wherein the conductive wire interconnects the plurality of fingers.

40C7. 38C7. The apparatus of paragraph 38C7, wherein the metallization pattern includes raised features that contain spread of the adhesive.

1C8. A plurality of supercells arranged in a plurality of rows on the front surface of the solar module, each supercell comprising adjacent silicon solar cells in series with their ends overlapping and conductively bonded. comprising a plurality of supercells comprising at least 19 silicon solar cells having a breakdown voltage of at least 10V arranged side by side in electrical connection;
An end of a first supercell adjacent a module edge in a first row is connected to a second supercell adjacent the module edge in a second row via a flexible electrical interconnect that joins the front surface of the first supercell. A device that makes an electrical connection to the end of a

2C8. 1C8. The device of clause 1C8, wherein a portion of the flexible electrical interconnect is covered by a dark-colored film.

3C8. 2C8. The apparatus of clause 2C8, wherein the solar module front side includes a backing sheet with low visual contrast to the flexible electrical interconnects.

4C98. The apparatus of paragraph 1C8, wherein a portion of the flexible electrical interconnect is colored.

5C8. 4. The apparatus of clause 4C8, wherein the solar module front side includes a backing sheet with low visual contrast to the flexible electrical interconnects.

6C8. 1C8. The apparatus of clause 1C8, wherein the front side of the solar module includes a white backing sheet.

7C8. 6C8. The apparatus of clause 6C8, further comprising a plurality of dark colored stripes corresponding to gaps between the plurality of rows.

8C8. The device of paragraph 6C8, wherein the n-type semiconductor layer of the silicon solar cell faces the backing sheet.

9C8. The front of the solar module above includes a backing sheet,
1C8. The device of clause 1C8, wherein the backing sheet, the flexible electrical interconnect, the first supercell, and the encapsulant constitute a laminate structure.

10C8. 9C8. The device of paragraph 9C8, wherein the encapsulant comprises a thermoplastic polymer.

11C8. 10C8, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

12C8. 9C8. The device of paragraph 9C8, further comprising a front sheet of glass.

13C8. The apparatus of paragraph 12C8, wherein the backing sheet comprises glass.

14C8. 1C8. The apparatus of clause 1C8, wherein the flexible electrical interconnect joins at a plurality of discrete locations.

15C8. 1C8. The apparatus of clause 1C8, wherein the flexible electrical interconnect is bonded by an electrically conductive adhesive adhesive.

16C8. 1C8. The device of clause 1C8, further comprising a bonded connection.

17C8. 1C8. The apparatus of clause 1C8, wherein the flexible electrical interconnect extends parallel to the module edge.

18C8. 1C8. The apparatus of clause 1C8, wherein a portion of the flexible electrical interconnect is folded and hidden around the first supercell.

19C8. 1C8. The apparatus of clause 1C8, further comprising a ribbon conductor electrically connecting the first supercell to an electrical component.

20C8. 19C8, wherein the ribbon conductor is conductively bonded to the flexible electrical interconnect.

21C8. 19C8. The apparatus of paragraph 19C8, wherein the ribbon conductor is conductively bonded to the solar cell surface in a direction away from the overlapping ends.

22C8. 19C8. The apparatus of paragraph 19C8, wherein the electrical component is on the back side of the solar module.

23C8. 19C8. The apparatus of paragraph 19C8, wherein the electrical component includes a junction box.

24C8. 23C8. The apparatus of clause 23C8, wherein the junction box matingly engages another junction box on the front side of another solar module.

25C8. 23C8. The apparatus of paragraph 23C8, wherein the junction box comprises a single terminal junction box.

26C8. 19C8. The apparatus of clause 19C8, wherein the electrical component includes a bypass diode.

27C8. 19C8. The apparatus of clause 19C8, wherein the electrical component includes a switch.

28C8. Further equipped with a voltage sensing controller,
The above voltage sensing controller is
Receiving the voltage output of the first supercell,
Based on the voltage, determine whether the solar cell of the first supercell is reverse biased;
27C8. The apparatus of clause 27C8, configured to communicate with the switch to disconnect the reverse biased solar cell from supercell module circuitry.

29C8. 1C8. The apparatus of clause 1C8, wherein the first supercell is in series with the second supercell.

30C8. The first silicon solar cell of the first supercell includes a plurality of chamfered corners;
The second silicon solar cell of the first supercell does not have chamfered corners;
1C8. The apparatus of clause 1C8, wherein each silicon solar cell of the first supercell has substantially the same front surface area exposed to light.

31C8. The first silicon solar cell of the first supercell includes a plurality of chamfered corners;
The second silicon solar cell of the first supercell includes a plurality of chamfered corners;
The device according to item 1C8, wherein the long side of the first silicon solar cell overlaps the long side of the second silicon solar cell.

32C8. 1C8. The apparatus of clause 1C8, wherein the first supercell silicon solar cell comprises a strip about 156 mm in length.

33C8. 1C8. The apparatus of clause 1C8, wherein the silicon solar cell of the first supercell comprises a strip about 125 mm in length.

34C8. 1C8. The apparatus of clause 1C8, wherein the silicon solar cell of the first supercell comprises a strip having an aspect ratio between width and length of between about 1:2 and about 1:20.

35C8. The overlapping adjacent silicon solar cells of the first supercell are conductively bonded by an adhesive;
1C8. The apparatus of clause 1C8, further comprising a feature configured to contain spread of the adhesive.

36C8. 35C8. The apparatus of paragraph 35C8, wherein the feature includes a moat.

37C8. 36. The apparatus of paragraph 36C8, wherein the moat is formed by a metallization pattern.

38C8. the metallization pattern includes a line extending along a long side of the silicon solar cell;
37C8. The apparatus of clause 37C8, further comprising a plurality of discrete contact pads located between the line and the long side.

39C8. 37C8. The apparatus of paragraph 37C8, wherein the metallization pattern is located on the front of the silicon solar cell of the first supercell.

40C8. 37. The apparatus of paragraph 37C8, wherein the metallization pattern is located on the back side of the silicon solar cell of the second supercell.

1C9. It features a solar module that includes a front face containing multiple silicon solar cells connected in series;
The plurality of silicon solar cells are grouped into a first supercell that includes a first cut strip having a front metallization pattern along a first outer edge overlapping a second cut strip.

2C9. 1C9. The apparatus according to item 1C9, wherein the lengths of the first cut strip and the second cut strip reproduce the shape of the wafer from which the first cut strip was divided.

3C9. 2C9, wherein the length is 156 mm.

4C9. 2C9, wherein the length is 125 mm.

5C9. The apparatus of paragraph 2C9, wherein the aspect ratio between the width of the first cut strip and the length is between about 1:2 and about 1:20.

6C9. 2C9. The apparatus of paragraph 2C9, wherein the first cut strip includes a first chamfered corner.

7C9. 6C9. The device of clause 6C9, wherein the first chamfered corner is along the first outer edge.

8C9. 6C9. The apparatus of clause 6C9, wherein the first chamfered corner does not follow the first outer edge.

9C9. The apparatus of paragraph 6C9, wherein the second cut strip includes a second chamfered corner.

10C9. The apparatus of paragraph 9C9, wherein the overlapping edges of the second cut strips include the second chamfered corners.

11C9. The apparatus of paragraph 9C9, wherein the overlapping edges of the second cut strip do not include the second chamfered corner.

12C9. The apparatus according to item 6C9, wherein the length reproduces the shape of a pseudo square wafer from which the first cut strip is divided.

13C9. 6C9. The apparatus of clause 6C9, wherein the width of the first cut strip is different from the width of the second cut strip such that the first cut strip and the second cut strip have approximately the same area.

14C9. 1C9, wherein the second cut strip overlaps the first cut strip by about 1 to 5 mm.

15C9. 1C9. The apparatus of clause 1C9, wherein the front metallization pattern includes a busbar.

16C9. 15C9. The apparatus of paragraph 15C9, wherein the busbar includes a tapered portion.

17C9. 1C9. The apparatus of clause 1C9, wherein the front metallization pattern includes discontinuous contact pads.

18C9. a second cut strip is joined to the first cut strip by an adhesive;
17C9. The apparatus of clause 17C9, wherein the discontinuous contact pad further includes adhesive spread containment features.

19C9. 18C9. The apparatus of paragraph 18C9, wherein the feature includes a moat.

20C9. 1C9. The apparatus of clause 1C9, wherein the front metallization pattern includes a bypass conductor.

21C9. 1C9. The apparatus of clause 1C9, wherein the front metallization pattern includes fingers.

22C9. 1C9. The apparatus of clause 1C9, wherein the first cut strip further includes a backside metallization pattern along a second outer edge opposite the first outer edge.

23C9. 22C9. The apparatus of paragraph 22C9, wherein the backside metallization pattern includes contact pads.

24C9. 22C9. The apparatus of paragraph 22C9, wherein the backside metallization pattern includes a busbar.

25C9. 1C9. The apparatus of clause 1C9, wherein the supercell includes at least 19 silicon cut strips each having a breakdown voltage greater than about 10 volts.

26C9. 1C9. The apparatus of clause 1C9, wherein the supercell connects with other supercells on the front side of the solar module.

27C9. 26C9. The apparatus of clause 26C9, wherein the front side of the solar module includes a white backing with a plurality of dark colored stripes corresponding to gaps between the supercell and the other supercell.

28C9. The front surface of the solar module includes a backing sheet;
26C9, wherein the backing sheet, the interconnect, the supercell, and the encapsulant constitute a laminate structure.

29C9. 28C9. The device of paragraph 28C9, wherein the encapsulant comprises a thermoplastic polymer.

30C9. 29C9, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

31C9. 26C9. The apparatus of clause 26C9, further comprising an interconnect between the supercell and the other supercell.

32C9. 31C9. The device of paragraph 31C9, wherein a portion of the interconnect is covered by a dark film.

33C9. 31C9. The apparatus of paragraph 31C9, wherein some of the interconnects are colored.

34C9. 31C9. The apparatus of paragraph 31C9, further comprising a ribbon conductor electrically connecting the supercell to an electrical component.

35C9. 34. The apparatus of paragraph 34C9, wherein the ribbon conductor is conductively bonded to the back side of the first cut strip.

36C9. 34C9. The apparatus of clause 34C9, wherein the electrical component includes a bypass diode.

37C9. 34C9. The apparatus of clause 34C9, wherein the electrical component includes a switch.

38C9. 34. The apparatus of paragraph 34C9, wherein the electrical component includes a junction box.

39C9. 38C9. The device according to paragraph 38C9, wherein the junction box overlaps and is arranged in a mating manner with another junction box.

40C9. 26C9. The apparatus of paragraph 26C9, wherein the supercell and the other supercell are connected in series.

1C10. a step of laser scribing a scribe line on a silicon wafer to define a solar cell region;
applying an electrically conductive adhesive bonding agent to the top surface of the scribed silicon wafer adjacent to the long sides of the solar cell region;
separating the silicon wafer along the scribe line to provide a solar cell strip including a portion of the electrically conductive adhesive bonding agent disposed adjacent a long side of the solar cell strip. ,Method.

2C10. The method of clause 1C10, further comprising providing the silicon wafer with the metallization pattern such that the separating step produces the solar cell strip having a metallization pattern along the long sides. .

3C10. 2C10. The method of clause 2C10, wherein the metallization pattern includes bus bars or discontinuous contact pads.

4C10. 2C10. The method of clause 2C10, wherein the providing step comprises printing the metallization pattern.

5C10. 2C10. The method of clause 2C10, wherein the providing step comprises electroplating the metallization pattern.

6C10. 2C10. The method of clause 2C10, wherein the metallization pattern includes a feature configured to contain the spread of the electrically conductive adhesive adhesive.

7C10. 6C10. The apparatus of clause 6C10, wherein the feature includes a moat.

8C10. 1C10. The method according to clause 1C10, wherein the step of applying comprises the step of printing.

9C10. 1C10. The method of paragraph 1C10, wherein the step of applying comprises depositing using a mask.

10C10. 1C10. The method of item 1C10, wherein the length of the long side of the solar cell strip reproduces the shape of the wafer.

11C10. 10C10, wherein the length is 156 mm or 125 mm.

12C10. 10C10, wherein the aspect ratio between the width of the solar cell strip and the length is between about 1:2 and about 1:20.

13C10. The separating step includes drawing a vacuum between the bottom surface of the wafer and a curved support surface and bending the solar cell region toward the curved support surface, thereby separating the silicon wafer along the scribe line. The method according to paragraph 1C10, which cleaves.

14C10. arranging a plurality of solar cell strips side by side with the long sides of adjacent solar cell strips overlapping and a portion of the electrically conductive adhesive bonding agent interposed therebetween;
and curing the electrically conductive bonding agent, thereby bonding adjacent overlapping solar cell strips to each other and electrically connecting them in series.

15C10. The method according to Item 14C10, wherein the curing step includes a heating step.

16C10. The method according to Item 14C10, wherein the curing step includes a pressurizing step.

17C10. 14. The method according to Item 14C10, wherein the arranging step includes forming a layered structure.

18C10. 17C10, wherein the curing step includes pressurizing and heating the layered structure.

19C10. 17C10, wherein the layered structure includes an encapsulant.

20C10. 19. The method of paragraph 19C10, wherein the encapsulant comprises a thermoplastic polymer.

21C10. 20C10, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

22C10. 17C10, wherein the layered structure includes a backing sheet.

23C10. The backing sheet above is white;
22C10. The method of paragraph 22C10, wherein the layered structure further comprises dark colored stripes.

24C10. 14C10, wherein the arranging step comprises arranging at least 19 solar cell strips side by side.

25C10. 24C10, wherein each of the at least 19 solar cell strips has a breakdown voltage of at least 10V.

26C10. 24C10. The method of clause 24C10, further comprising placing the at least 19 solar cell strips in communication with only a single bypass diode.

27C10. 26C10. The method of clause 26C10, further comprising forming a ribbon conductor between one of the at least 19 solar cell strips and the single bypass diode.

28C10. 27C10. The method of paragraph 27C10, wherein the single bypass diode is located within a junction box.

29C10. 28C10. The method of clause 28C10, wherein the junction box is on the rear side of a solar module in a mating arrangement with other junction boxes of different solar modules.

30C10. 14C10, wherein the overlapping cell strips of the plurality of solar cell strips overlap the solar cell strips by about 1 to 5 mm.

31C10. 14. The method of paragraph 14C10, wherein the solar cell strip includes a first chamfered corner.

32C10. 31C10. The method of paragraph 31C10, wherein the long sides of overlapping solar cell strips of the plurality of solar cell strips do not include a second chamfered corner.

33C10. 32C10. The method of paragraph 32C10, wherein the width of the solar cell strip is greater than the width of the overlapping solar cell strip, such that the solar cell strip and the overlapping solar cell strip have approximately the same area.

34C10. 31C10. The method of paragraph 31C10, wherein a long side of overlapping solar cell strips of the plurality of solar cell strips includes a second chamfered corner.

35C10. 34C10. The method of clause 34C10, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip that includes the first chamfered corner.

36C10. 34C10. The method of paragraph 34C10, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the cell strip that does not include the first chamfered corner.

37C10. 14C10. The method of clause 14C10, further comprising connecting the plurality of solar cell strips to other plurality of solar cell strips using interconnects.

38C10. 37C10, wherein a portion of the interconnect is covered by a dark film.

39C10. 37C10, wherein a portion of the interconnect is colored.

40C10. 37C10. The method of paragraph 37C10, wherein the plurality of solar cell strips are connected in series with the other plurality of solar cell strips.

1C11. providing a silicon wafer having a length;
scribing a scribe line on the silicon wafer to define a solar cell region;
applying an electrically conductive adhesive bonding agent to the surface of the silicon wafer;
separating the silicon wafer along the scribe line to provide a solar cell strip including a portion of the electrically conductive adhesive bonding agent disposed adjacent a long side of the solar cell strip. ,Method.

2C11. The method according to paragraph 1C11, wherein the scribe comprises a laser scribe.

3C11. 2C11. The method of clause 2C11, comprising laser scribing the scribe line and then applying the electrically conductive adhesive bonding agent.

4C11. 2C12. The method of clause 2C11, comprising applying the electrically conductive adhesive adhesive to the wafer and then laser scribing the scribe lines.

5C11. The applying step includes applying an uncured electrically conductive adhesive adhesive;
4C11. The method of paragraph 4C11, wherein the step of laser scribing includes the step of avoiding curing the uncured conductive adhesive adhesive with heat from the laser.

6C11. 5C11, wherein the step of avoiding comprises selecting a laser power and/or a distance between the scribe line and the uncured conductive adhesive adhesive.

7C11. The method according to item 1C11, wherein the step of applying comprises the step of printing.

8C11. 1C11. The method according to item 1C11, wherein the step of applying comprises the step of depositing using a mask.

9C11. The method of paragraph 1C11, wherein the scribe line and the electrically conductive adhesive bonding agent are on the surface.

10C11. The separating step includes drawing a vacuum between the surface of the silicon wafer and a curved support surface and bending the solar cell region toward the curved support surface, thereby causing the silicon wafer to move along the scribe line. The method according to paragraph 1C11, which cleaves.

11C11. 10C11. The method according to Item 10C11, wherein the step of separating includes the step of arranging the scribe line at an angle with respect to a vacuum manifold.

12C11. 1C11. The method according to item 1C11, wherein the step of separating includes the step of pressurizing the wafer using a roller.

13C11. Item 1C11, wherein the providing step comprises providing the silicon wafer with the metallization pattern such that the separating step produces the solar cell strip having the metallization pattern along the long sides. The method described in.

14C11. 13. The method of clause 13C11, wherein the metallization pattern includes bus bars or discontinuous contact pads.

15C11. 13. The method of paragraph 13C11, wherein said providing step comprises printing said metallization pattern.

16C11. 13. The method of paragraph 13C11, wherein the step of providing comprises electroplating the metallization pattern.

17C11. 13. The method of clause 13C11, wherein the metallization pattern includes a feature configured to contain the spread of the electrically conductive adhesive adhesive.

18C11. 1C11. The method according to item 1C11, wherein the length of the long side of the solar cell strip reproduces the shape of the wafer.

19C11. The method according to paragraph 18C11, wherein the length is 156 mm or 125 mm.

20C11. 18C11, wherein the aspect ratio between the width of the solar cell strip and the length is between about 1:2 and about 1:20.

21C11. arranging a plurality of solar cell strips side by side with the long sides of adjacent solar cell strips overlapping and a portion of the electrically conductive adhesive bonding agent interposed therebetween;
and curing the electrically conductive bonding agent, thereby bonding adjacent overlapping solar cell strips to each other and electrically connecting them in series.

22C11. The above step of arranging includes a step of forming a layered structure,
21C11. The method according to Item 21C11, wherein the curing step includes heating and/or pressurizing the layered structure.

23C11. 22C11, wherein the layered structure comprises a thermoplastic olefin polymer encapsulant.

24C11. 22C11, wherein the layered structure comprises: a white backing sheet; and dark stripes on the white backing sheet.

25C11. Multiple wafers are provided on the template,
the conductive adhesive adhesive is distributed over the plurality of wafers;
21C11. The method of clause 21C11, wherein the plurality of wafers are cells separated simultaneously into a plurality of solar cell strips by a fixture.

26C11. further comprising a step of transporting the plurality of solar cell strips as a group,
25C11. The method of paragraph 25C11, wherein the arranging step comprises arranging the plurality of solar cell strips within a module.

27C11. 21C11. The method of clause 21C11, wherein the step of arranging comprises arranging at least 19 solar cell strips side by side with only a single bypass diode and having a breakdown voltage of at least 10V.

28C11. 27C11. The method of clause 27C11, further comprising forming a ribbon conductor between one of the at least 19 solar cell strips and the single bypass diode.

29C11. 28C11. The method of clause 28C11, wherein the single bypass diode is located in a first junction box of a first solar module that is mated with a second junction box of a second solar module.

30C11. 27C11. The method of clause 27C11, further comprising forming a ribbon conductor between one of the at least 19 solar cell strips and a smart switch.

31C11. 21C11, wherein overlapping cell strips of the plurality of solar cell strips overlap the solar cell strips by about 1 to 5 mm.

32C11. 21C11. The method of paragraph 21C11, wherein the solar cell strip includes a first chamfered corner.

33C11. 32C11. The method of paragraph 32C11, wherein the long sides of overlapping solar cell strips of the plurality of solar cell strips do not include a second chamfered corner.

34C11. 33C11. The method of paragraph 33C11, wherein the width of the solar cell strip is greater than the width of the overlapping solar cell strip, such that the solar cell strip and the overlapping solar cell strip have approximately the same area.

35C11. 32C11. The method of paragraph 32C11, wherein a long side of an overlapping solar cell strip of the plurality of solar cell strips includes a second chamfered corner.

36C11. 35C11. The method of paragraph 35C11, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip that includes the first chamfered corner.

37C11. 35C11. The method of clause 35C11, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the cell strip that does not include the first chamfered corner.

38C11. 21C11. The method of clause 21C11, further comprising connecting the plurality of solar cell strips to other plurality of solar cell strips using interconnects.

39C11. 38C11. The method of clause 38C11, wherein a portion of the interconnect is covered or colored with a dark film.

40C11. 38C11. The method of paragraph 38C11, wherein the plurality of solar cell strips are connected in series with the other plurality of solar cell strips.

1C12. providing a silicon wafer having a length;
scribing a scribe line on a silicon wafer to define a solar cell area;
separating the silicon wafer along the scribe line to provide a solar cell strip;
applying an electrically conductive adhesive adhesive disposed adjacent to a long side of the solar cell strip.

2C12. The method according to Item 1C12, wherein the scribing step includes a laser scribing step.

3C12. The method according to item 1C12, wherein the step of applying comprises the step of screen printing.

4C12. The method according to item 1C12, wherein the step of applying comprises a step of inkjet printing.

5C12. 1C13. The method according to item 1C12, wherein the step of applying comprises the step of depositing using a mask.

6C12. 1C13. The method according to item 1C12, wherein the separating step includes drawing a vacuum between the surface of the wafer and the curved surface.

7C12. 6C13. The method of paragraph 6C12, wherein the curved surface includes a vacuum manifold, and the separating step comprises orienting the scribe line at an angle with respect to the vacuum manifold.

8C12. 7C12, wherein the angle is perpendicular.

9C12. 7C12, wherein the angle is other than vertical.

10C12. 6C12, wherein the vacuum is drawn through a moving belt.

11C12. arranging a plurality of solar cell strips side by side with the long sides of adjacent solar cell strips overlapping the electrically conductive adhesive bonding agent disposed therebetween;
and curing the electrically conductive bonding agent to bond adjacent, overlapping, series electrically connected solar cell strips.

12C12. 11. The method according to item 11C12, wherein the disposing step includes forming a layered structure including an encapsulant, and further comprises stacking the layered structure.

13C12. 12. The method of paragraph 12C12, wherein the curing step occurs at least partially during the laminating step.

14C12. 12. The method of paragraph 12C12, wherein the curing step occurs separately from the laminating step.

15C12. 12. The method according to item 12C12, wherein the step of laminating the layers includes a step of drawing a vacuum.

16C12. 15. The method of paragraph 15C12, wherein the vacuum is drawn against a bladder.

17C12. The method of paragraph 15C12, wherein the vacuum is drawn against the belt.

18C12. 12. The method of paragraph 12C12, wherein the encapsulant comprises a thermoplastic olefin polymer.

19C12. 12C12, wherein the layered structure comprises: a white backing sheet; and a dark colored stripe on the white backing sheet.

20C12. Paragraph 11C12, wherein the step of providing comprises providing the silicon wafer with the metallization pattern such that the separating step produces the solar cell strip having the metallization pattern along the long sides. The method described in.

21C12. 20C12, wherein the metallization pattern includes bus bars or discontinuous contact pads.

22C12. 20C12, wherein the step of providing comprises printing or electroplating the metallization pattern.

23C12. 20C12, wherein the disposing step comprises using the metallization pattern feature to contain spread of the electrically conductive adhesive adhesive.

24C12. 23C12, wherein the feature is on the front side of the solar cell strip.

25C12. 23. The method of paragraph 23C12, wherein the feature is on the back side of the solar cell strip.

26C12. 11C12. The method of paragraph 11C12, wherein the length of the long side of the solar cell strip reproduces the shape of the wafer.

27C12. 26C12, wherein the length is 156 mm or 125 mm.

28C12. 26C12, wherein the aspect ratio between the width of the solar cell strip and the length is between about 1:2 and about 1:20.

29C12. 11. The method of clause 11C12, wherein the step of arranging comprises arranging at least 19 solar cell strips with only a single bypass diode and a breakdown voltage of at least 10V as a first supercell.

30C12. 29C13. The method of clause 29C12, further comprising applying the electrically conductive adhesive adhesive between the first supercell and the interconnect.

31C12. 30C12. The method of paragraph 30C12, wherein the interconnect connects the first supercell in parallel with a second supercell.

32C12. 30C12. The method of clause 30C12, wherein the interconnect connects the first supercell in series with a second supercell.

33C12. 29C12. The method of clause 29C12, further comprising forming a ribbon conductor between the first supercell and the single bypass diode.

34C12. 33C13. The method of paragraph 33C12, wherein the single bypass diode is located in a first junction box of a first solar module that is matedly disposed with a second junction box of a second solar module.

35C12. 11. The method of paragraph 11C12, wherein the solar cell strip includes a first chamfered corner.

36C12. 35C12, wherein the long sides of overlapping solar cell strips of the plurality of solar cell strips do not include a second chamfered corner.

37C12. 36C12, wherein the width of the solar cell strip is greater than the width of the overlapping solar cell strip, such that the solar cell strip and the overlapping solar cell strip have about the same area.

38C12. 35C12. The method of paragraph 35C12, wherein a long side of an overlapping solar cell strip of the plurality of solar cell strips includes a second chamfered corner.

39C12. 38C12. The method of clause 38C12, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip that includes the first chamfered corner.

40C12. 38C12. The method of paragraph 38C12, wherein the long side of the overlapping solar cell strips of the plurality of solar cell strips overlaps a long side of the cell strip that does not include the first chamfered corner.

1C13. a semiconductor wafer having a first surface including a first metallization pattern along a first outer edge and a second metallization pattern along a second outer edge opposite the first outer edge;
The apparatus wherein the semiconductor wafer further includes a first scribe line between the first metallization pattern and the second metallization pattern.

2C13. The apparatus of clause 1C13, wherein the first metallization pattern includes discontinuous contact pads.

3C13. 1C14. The apparatus of clause 1C13, wherein the first metallization pattern includes a first finger pointing away from the first outer edge toward the second metallization pattern.

4C13. 3C14. The apparatus of clause 3C13, wherein the first metallization pattern further includes a busbar extending along the first outer edge and intersecting the first finger.

5C13. The second metal coating pattern is
a second finger pointing away from the second outer edge toward the first metallization pattern;
and a second bus bar extending along the second outer edge and intersecting the second finger.

6C13. 3C13. The apparatus of clause 3C13, further comprising an electrically conductive adhesive extending along the first outer edge and in contact with the first finger.

7C13. The apparatus of clause 3C13, wherein the first metallization pattern further includes a first bypass conductor.

8C13. 3C14. The apparatus of clause 3C13, wherein the first metallization pattern further includes a first end conductor.

9C13. The apparatus of clause 1C13, wherein the first metallization pattern comprises silver.

10C13. 9C14. The apparatus of clause 9C13, wherein the first metallization pattern comprises a silver paste.

11C13. 9C14. The apparatus of clause 9C13, wherein the first metallization pattern includes discontinuous contacts.

12C13. 14. The apparatus of clause 1C13, wherein the first metallization pattern comprises tin, aluminum, or other conductor less expensive than silver.

13C13. The apparatus of clause 1C13, wherein the first metallization pattern comprises copper.

14C13. 13. The apparatus of paragraph 13C13, wherein the first metallization pattern comprises electroplated copper.

15C13. 13. The apparatus of paragraph 13C13, further comprising a passivation scheme to reduce recombination.

16C13. a third metallization pattern on the first surface of the semiconductor wafer that is not proximate to the first outer edge or the second outer edge;
a second scribe line between the third metallization pattern and the second metallization pattern,
The apparatus of clause 1C13, wherein the first scribe line is between the first metallization pattern and the third metallization pattern.

17C13. Item 16C13, wherein the ratio of a first width defined between the first scribe line and the second scribe line divided by the length of the semiconductor wafer is between about 1:2 and about 1:20. The device described in.

18C13. 17C13, wherein the length is about 156 mm or about 125 mm.

19C13. 17. The apparatus of paragraph 17C13, wherein the semiconductor wafer includes chamfered corners.

20C13. the first scribe line, together with the first outer edge, defines a first rectangular area including two chamfered corners and the first metallization pattern;
The first rectangular area has an area corresponding to a value obtained by subtracting the combined area of the two chamfered corners from the product of the length and a second width larger than the first width. ,
the second scribe line, together with the first scribe line, defines a second rectangular area that does not include chamfered corners and includes the third metallization pattern;
19. The apparatus of paragraph 19C13, wherein the second rectangular region has an area corresponding to the product of the length and the first width.

21C13. 16. The apparatus of paragraph 16C13, wherein the third metallization pattern includes a finger pointing to the second metallization pattern.

22C13. 1C14. The apparatus of clause 1C13, further comprising a third metallization pattern on a second surface of the semiconductor wafer opposite the first surface.

23C13. 22C13. The apparatus of paragraph 22C13, wherein the third metallization pattern has a contact pad proximate the location of the first scribe line.

24C13. The apparatus according to Item 1C13, wherein the first scribe line is formed by a laser.

25C13. 1C14. The apparatus of clause 1C13, wherein the first scribe line is within the first surface.

26C13. 1C14. The apparatus of clause 1C13, wherein the first metallization pattern includes a feature configured to contain the spread of electrically conductive adhesive.

27C13. 26C13. The apparatus of paragraph 26C13, wherein the feature includes a raised feature.

28C13. 27C14. The apparatus of clause 27C13, wherein the first metallization pattern includes a contact pad, and the feature includes a dam abutting and higher than the contact pad.

29C13. 26C13. The device of paragraph 26C13, wherein the feature includes a recessed feature.

30C13. 29C13, wherein the recessed feature comprises a moat.

31C13. 26C13. The apparatus of paragraph 26C13, further comprising the electrically conductive adhesive in contact with the first metallization pattern.

32C13. The apparatus of paragraph 31C13, wherein the electrically conductive adhesive is printed.

33C13. The apparatus of clause 1C13, wherein the semiconductor wafer comprises silicon.

34C13. The apparatus of paragraph 33C13, wherein the semiconductor wafer comprises crystalline silicon.

35C13. The device of paragraph 33C13, wherein the first surface is n-type conductive.

36C13. The device of paragraph 33C13, wherein the first surface is p-type conductive.

37C13. the first metallization pattern is 5 mm or less from the first outer edge;
the second metallization pattern is 5 mm or less from the second outer edge;
The device according to paragraph 1C13.

38C13. 14. The apparatus of clause 1C13, wherein the semiconductor wafer includes a plurality of chamfered corners, and the first metallization pattern includes a tapered portion extending around the chamfered corners.

39C13. 38C13. The apparatus of paragraph 38C13, wherein the tapered portion includes a bus bar.

40C13. 38C13. The apparatus of paragraph 38C13, wherein the tapered portion includes a conductor connecting discontinuous contact pads.

1C14. scribing a first scribe line on the wafer;
separating the wafer along the first scribe line using a vacuum to provide a solar cell strip.

2C14. The method according to Item 1C14, wherein the scribing step includes a laser scribing step.

3C14. 2C14. The method according to item 2C14, wherein the separating step includes drawing the vacuum between the surface of the wafer and the curved surface.

4C14. 3C14. The method of paragraph 3C14, wherein the curved surface comprises a vacuum manifold.

5C14. the wafer is supported on a belt moving to the vacuum manifold;
The method of paragraph 4C14, wherein the vacuum is drawn through the belt.

6C14. The above separation step is
Orienting the first scribe line at an angle with respect to the vacuum manifold;
and starting cleavage at one end of the first scribe line.

7C14. 6C14, wherein the angle is substantially perpendicular.

8C14. 6C14, wherein the angle is other than substantially perpendicular.

9C14. The method of paragraph 3C14, further comprising applying an uncured electrically conductive adhesive binder.

10C14. 9C14. The method of paragraph 9C14, wherein the first scribe line and the uncured electrically conductive adhesive adhesive are on the same surface of the wafer.

11C14. In the laser scribing step, the uncured conductive adhesive adhesive is cured by selecting the laser power and/or the distance between the first scribe line and the uncured conductive adhesive adhesive. Avoid the method of paragraph 10C14.

12C14. 15. The method of paragraph 10C14, wherein the same surface is opposite a wafer surface supported by a belt that moves the wafer to the curved surface.

13C14. 12. The method of paragraph 12C14, wherein the curved surface comprises a vacuum manifold.

14C14. 9C14, wherein the applying step occurs after the scribing step.

15C14. 9C14, wherein the step of applying occurs after the step of separating.

16C14. 9C14. The method according to paragraph 9C14, wherein the step of applying comprises the step of screen printing.

17C14. 9C14. The method according to item 9C14, wherein the step of applying comprises a step of inkjet printing.

18C14. 9C14. The method according to paragraph 9C14, wherein the applying step comprises depositing using a mask.

19C14. The above first scribe line is
a first metallization pattern on the surface of the wafer along a first outer edge;
and a second metallization pattern on the surface of the wafer along a second outer edge.

20C14. The wafer further includes a third metallization pattern on the surface of the semiconductor wafer that is not proximate the first outer edge or the second outer edge;
A second scribe line is scribed between the third metallization pattern and the second metallization pattern such that the first scribe line is between the first metallization pattern and the third metallization pattern. The process of
and separating the wafer along the second scribe line to provide another solar cell strip.

21C14. The distance between the first scribe line and the second scribe line defines an aspect ratio of between about 1:2 and about 1:20 for the wafer length, which is about 125 mm or about 156 mm. The method of paragraph 20C14, forming a width.

22C14. 19. The method of paragraph 19C14, wherein the first metallization pattern includes a finger pointing to the second metallization pattern.

23C14. 22C14. The method of paragraph 22C14, wherein the first metallization pattern further includes busbars that intersect the fingers.

24C14. 23C14, wherein the busbar is within 5 mm of the first outer edge.

25C14. 22C14. The method of paragraph 22C14, further comprising an uncured electrically conductive adhesive adhesive contacting the finger.

26C14. 19. The method of paragraph 19C14, wherein the first metallization pattern includes discontinuous contact pads.

27C14. 19. The method of clause 19C14, further comprising printing or electroplating the first metallization pattern on the wafer.

28C14. a first superstructure comprising at least 19 solar cell strips each having a breakdown voltage of at least 10V, with the long sides of adjacent solar cell strips overlapping said electrically conductive adhesive adhesive disposed therebetween; placing the solar cell strip in a cell;
4. The method of clause 3, further comprising: curing the electrically conductive bonding agent to bond adjacent, overlapping, series electrically connected solar cell strips.

29C14. The disposing step includes forming a layered structure including an encapsulant,
28C14. The method according to paragraph 28C14, further comprising the step of laminating the layered structure.

30C14. 29C14, wherein the curing step occurs at least partially during the laminating step.

31C14. 29C14, wherein the curing step occurs separately from the laminating step.

32C14. 29C14, wherein the encapsulant comprises a thermoplastic olefin polymer.

33C14. 29C14, wherein the layered structure comprises: a white backing sheet; and dark colored stripes on the white backing sheet.

34C14. 28C14. The method of paragraph 28C14, wherein the disposing step comprises using the metallization pattern feature to contain spread of the electrically conductive adhesive adhesive.

35C14. 34C14, wherein the metallization pattern feature is on the front side of the solar cell strip.

36C14. 34. The method of paragraph 34C14, wherein the metallization pattern feature is on the back side of the solar cell strip.

37C14. 28C14. The method of clause 28C14, further comprising applying the electrically conductive adhesive adhesive between interconnects connecting the first supercell and a second supercell in series.

38C14. further comprising forming a ribbon conductor between the single bypass diode of the first supercell;
28C14. The method of paragraph 28C14, wherein the single bypass diode is located in a first junction box of a first solar module in a mating arrangement with a second junction box of a second solar module.

39C14. the solar cell strip includes a first chamfered corner;
The long sides of the overlapping solar cell strips among the plurality of solar cell strips do not include the second chamfered corner,
28C14. The method of paragraph 28C14, wherein the width of the solar cell strip is greater than the width of the overlapping solar cell strip such that the solar cell strip and the overlapping solar cell strip have approximately the same area.

40C14. the solar cell strip includes a first chamfered corner;
The long side of the overlapping solar cell strips among the plurality of solar cell strips includes a second chamfered corner,
28C14. The method of paragraph 28C14, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the solar cell strip that does not include the first chamfered corner.

1C15. forming a first metallization pattern along a first outer edge of a first surface of the semiconductor wafer;
forming a second metallization pattern along a second outer edge of the first surface opposite the first outer edge;
forming a first scribe line between the first metallization pattern and the second metallization pattern.

2C15. the first metallization pattern includes a first finger pointing to the second metallization pattern;
16. The method of clause 1C15, wherein the second metallization pattern includes a second finger pointing to the first metallization pattern.

3C15. The first metallization pattern further includes a first busbar intersecting the first finger and located within 5 mm of the first outer edge;
2C15. The method of clause 2C15, wherein the second metallization pattern includes a second busbar intersecting the second finger and located within 5 mm of the second outer edge.

4C15. The third metal coating pattern further includes forming a third metal coating pattern on the first surface that does not follow the first outer edge or does not align with the second outer edge.
a third bus bar parallel to the first bus bar;
a third finger pointing to the second metallization pattern;
further comprising forming a second scribe line between the third metal coating pattern and the second metal coating pattern,
The method of paragraph 3C15, wherein the first scribe line is between the first metallization pattern and the third metallization pattern.

5C15. Paragraph 4C15, wherein the first scribe line and the second scribe line are separated by a width having a ratio to the length of the semiconductor wafer that is between about 1:2 and about 1:20. the method of.

6C15. 5C15, wherein the length of the semiconductor wafer is about 156 mm or about 125 mm.

7C15. 4C15. The method of clause 4C15, wherein the semiconductor wafer includes chamfered corners.

8C15. the first scribe line, together with the first outer edge, defines a first solar cell region including two chamfered corners and the first metallization pattern;
The first solar cell region has a first area corresponding to a value obtained by subtracting the combined area of the two chamfered corners from the product of the length and first width of the semiconductor wafer. death,
the second scribe line, together with the first scribe line, defines a second solar cell region that does not include chamfered corners and includes the third metallization pattern;
Clause 7C15, wherein the second solar cell region has a second area that is approximately the same as the first area and corresponds to the product of the length and a second width that is narrower than the first width. Method.

9C15. 8C15, wherein the length is about 156 mm or about 125 mm.

10C15. The method according to Item 4C15, wherein the step of forming the first scribe line and the step of forming the second scribe line include a step of laser scribing.

11C15. 4C15. The method of paragraph 4C15, wherein forming the first metallization pattern, forming the second metallization pattern, and forming the third metallization pattern include printing.

12C15. The method according to item 11C15, wherein the step of forming the first metallization pattern, the step of forming the second metallization pattern, and the step of forming the third metallization pattern include the step of screen printing. .

13C15. 11. The method of paragraph 11C15, wherein forming the first metallization pattern comprises forming a plurality of contact pads comprising silver.

14C15. The method according to item 4C15, wherein the step of forming the first metallization pattern, the step of forming the second metallization pattern, and the step of forming the third metallization pattern include the step of electroplating. .

15C15. 14. The method of paragraph 14C15, wherein the first metallization pattern, the second metallization pattern, and the third metallization pattern include copper.

16C15. 4C15. The method of clause 4C15, wherein the first metallization pattern comprises aluminum, tin, silver, copper, and/or a conductor cheaper than silver.

17C15. 4C15. The method of paragraph 4C15, wherein the semiconductor wafer comprises silicon.

18C15. 17. The method of paragraph 17C15, wherein the semiconductor wafer comprises crystalline silicon.

19C15. 4C15. The method of clause 4C15, further comprising forming a fourth metallization pattern on the second surface of the semiconductor wafer between the first outer edge and within 5 mm of a location of the second scribe line.

20C15. 4C15. The method of paragraph 4C15, wherein the first surface has a first conductivity type and the second surface has a second conductivity type opposite to the first conductivity type.

21C15. 4C16. The method of clause 4C15, wherein the fourth metallization pattern includes contact pads.

22C15. The method of paragraph 3C15, further comprising applying a conductive adhesive to the semiconductor wafer.

23C15. 22C15. The method of clause 22C15, further comprising applying the conductive adhesive in contact with the first finger.

24C15. 23C15, wherein applying the conductive adhesive comprises screen printing or depositing using a mask.

25C15. 3C15. The method of clause 3C15, further comprising separating the semiconductor wafer along the first scribe line to form a first solar cell strip including the first metallization pattern.

26C15. 25C15. The method according to Item 25C15, wherein the step of separating includes the step of drawing a vacuum on the first scribe line.

27C15. 26C15, further comprising placing the semiconductor wafer on a belt moving to the vacuum.

28C15. 25C15, further comprising applying a conductive adhesive to the first solar cell strip.

29C15. said first supercell comprising at least 19 solar cell strips each having a breakdown voltage of at least 10V, with the long sides of adjacent solar cell strips overlapping the conductive adhesive disposed therebetween. arranging a first solar cell strip;
25C15, further comprising curing the conductive adhesive to join adjacent, overlapping, series electrically connected solar cell strips.

30C15. The disposing step includes forming a layered structure including an encapsulant,
29C15. The method according to Item 29C15, further comprising the step of laminating the layered structure.

31C15. 30C15, wherein the curing step occurs at least partially during the laminating step.

32C15. 30C15, wherein the curing step occurs separately from the laminating step.

33C15. 30C15, wherein the encapsulant comprises a thermoplastic olefin polymer.

34C15. 30C15, wherein the layered structure comprises: a white backing sheet; and dark colored stripes on the white backing sheet.

35C15. 29C15. The method of clause 29C15, wherein the step of disposing comprises the step of containing the spread of the conductive adhesive with the metallization pattern feature.

36C15. 35C15, wherein the metallization pattern feature is on the front side of the first solar cell strip.

37C15. 29C15. The method of clause 29C15, further comprising applying the conductive adhesive between interconnects connecting the first supercell and a second supercell in series.

38C15. further comprising forming a ribbon conductor between the single bypass diodes of the first supercell;
29C15. The method of paragraph 29C15, wherein the single bypass diode is located in a first junction box of a first solar module in a mating arrangement with a second junction box of a second solar module.

39C15. the first solar cell strip includes a first chamfered corner;
the long sides of the overlapping solar cell strips of the first supercell do not include the second chamfered corner;
Clause 29C15, wherein the width of the first solar cell strip is greater than the width of the overlapping solar cell strips such that the first solar cell strip and the overlapping solar cell strip have approximately the same area. Method.

40C15. the first solar cell strip includes a first chamfered corner;
a long side of the overlapping solar cell strip of the first supercell includes a second chamfered corner;
29C15, wherein the long side of the overlapping solar cell strip overlaps a long side of the first solar cell strip that does not include the first chamfered corner.

1C16. a first bus bar or contact pad row disposed parallel to and adjacent to a first outer edge of the silicon wafer; and a second bus bar or contact pad row disposed parallel to and parallel to the first outer edge of the silicon wafer; obtaining or providing the silicon wafer with a front side metallization pattern including a second row of bus bars or contact pads arranged parallel to and adjacent to the outer edge;
separating the silicon wafer along one or more scribe lines parallel to the first outer edge and the second outer edge of the silicon wafer to form a plurality of rectangular solar cells, the step of forming a plurality of rectangular solar cells; The busbar or contact pad row is arranged parallel to and adjacent to the long outer edge of the first rectangular solar cell of the plurality of rectangular solar cells, and the second busbar or contact pad row is arranged parallel to and adjacent to the long outer edge of the first rectangular solar cell of the plurality of rectangular solar cells. the second rectangular solar cell being parallel to and adjacent to the long outer edge of the second rectangular solar cell;
forming a supercell by arranging the plurality of rectangular solar cells side by side with the long sides of the adjacent solar cells overlapping and conductively bonded to each other to electrically connect the adjacent solar cells in series; Prepare,
The first bus bar or contact pad row of the first rectangular solar cell among the plurality of rectangular solar cells is conductively bonded to the bottom surfaces of adjacent rectangular solar cells in the supercell.

2C16. Item 1C16, wherein bottom surfaces of adjacent rectangular solar cells in the supercell overlap and are conductively connected to the second bus bar or contact pad row on the second rectangular solar cell among the plurality of rectangular solar cells. the method of.

3C16. 1C16. The method of paragraph 1C16, wherein the silicon wafer is a square or pseudo-square silicon wafer.

4C16. 3C16, wherein the silicon wafer has sides that are about 125 mm long or about 156 mm long.

5C16. 3C16, wherein the length to width ratio of each rectangular solar cell is between about 2:1 and about 20:1.

6C16. 1C16. The method of paragraph 1C16, wherein the silicon wafer is a crystalline silicon wafer.

7C16. The first row of busbars or contact pads and the second row of busbars or contact pads are arranged in peripheral regions of the silicon wafer that convert light into electricity with lower efficiency than central regions of the silicon wafer. 1C16, wherein the method is located in paragraph 1C16.

8C16. The front surface metallization pattern includes a first plurality of parallel fingers extending inwardly from the first outer edge of the silicon wafer electrically connecting to the first busbar or contact pad row; or a second plurality of parallel fingers extending inwardly from the second outer edge of the silicon wafer electrically connecting to a row of contact pads.

9C16. The front surface metallization pattern is oriented parallel to at least the first busbar or contact pad row and the second busbar or contact pad row, and the front side metallization pattern is oriented parallel to the first busbar or contact pad row and the second busbar or contact pad row, and or a third bus bar or contact pad row located between the contact pad row and oriented in a direction perpendicular to the third bus bar or contact pad row and electrically connected to the third bus bar or contact pad row. a third plurality of parallel fingers, the third row of bus bars or contact pads forming the plurality of rectangular solar cells after the silicon wafer is separated to form the plurality of rectangular solar cells. 1C16, wherein the third rectangular solar cell is arranged parallel to and adjacent to the long outer edge of the third rectangular solar cell.

10C16. 1C17. The method of clause 1C16, comprising applying a conductive adhesive to the first busbar or contact pad row to conductively bond the first rectangular solar cell to an adjacent solar cell.

11C16. 10C16. The method of paragraph 10C16, wherein the metallization pattern includes a barrier configured to contain the spread of the conductive adhesive.

12C16. 10C16. The method of paragraph 10C16, comprising applying the conductive adhesive by screen printing.

13C16. 10C16. The method of paragraph 10C16, comprising applying the conductive adhesive by inkjet printing.

14C16. 10C16, wherein the conductive adhesive is applied prior to forming the one or more scribe lines in the silicon wafer.

15C16. The step of separating the silicon wafer along the one or more scribe lines includes drawing a vacuum between the bottom surface of the silicon wafer and a curved support surface, and bending the silicon wafer toward the curved support surface. 1C16. The method of paragraph 1C16, thereby comprising cleaving the silicon wafer along the one or more scribe lines.

16C16. The silicon wafer is a pseudo-square silicon wafer including a plurality of chamfered corners, and after the step of separating the silicon wafer to form the plurality of rectangular solar cells, one or more of the rectangular solar cells are separated. The plurality includes one or more of the plurality of chamfered corners,
The spacing between the scribe lines is such that the width perpendicular to the long axis of the rectangular solar cell that includes a plurality of chamfered corners is greater than the width perpendicular to the long axis of the rectangular solar cell that does not have a plurality of chamfered corners. are selected to compensate for the chamfered corners by enlarging the corners so that each of the plurality of rectangular solar cells in the supercell has a substantially larger area exposed to light during operation of the supercell. The method of paragraph 1C16, having front surfaces that are the same.

17C16. 1C17. The method of paragraph 1C16, comprising placing the supercell in a layered structure between a transparent front sheet and a back sheet, and stacking the layered structure.

18C16. The step of laminating the layered structure includes completing the curing of a conductive adhesive disposed between the adjacent rectangular solar cells in the supercell to conductively bond the adjacent rectangular solar cells to each other. The method according to paragraph 17C16.

19C16. The supercells are arranged in the layered structure within one of the two or more parallel rows of supercells, and the rear sheet is arranged in the layered structure in one of the two or more parallel rows of supercells, and the rear sheet is arranged in the layered structure in one of the two or more parallel rows of supercells, and a white sheet containing a plurality of parallel dark-colored stripes with positions and widths corresponding to the width of the backsheet, such that the plurality of white portions of the backsheet are aligned with two or more of the supercells in the assembled module; 17C16, wherein the method is not visible through gaps between more parallel rows.

20C16. 17. The method of item 17C16, wherein the front sheet and the back sheet are glass sheets, and the supercell is encapsulated within a thermoplastic olefin layer sandwiched between the glass sheets.

21C16. 1C16. The method of clause 1C16, comprising placing the supercell in a first module that includes a junction box that is mated with a second junction box of a second solar module.

1D. a plurality of supercells arranged in two or more parallel rows, each supercell having long sides of adjacent silicon solar cells overlapping and directly conductively bonded to each other; a plurality of supercells having a plurality of rectangular or substantially rectangular silicon solar cells arranged side by side in series electrical connection;
a first hidden tap contact pad located on a rear surface of a first solar cell located at an intermediate position along a first supercell of the plurality of supercells;
a first electrical interconnect conductively bonded to the first hidden tap contact pad;
Equipped with
The first electrical interconnect includes stress relief features that accommodate differential thermal expansion between the interconnect and the silicon solar cell to which it joins.

2D. a second hidden tap contact pad located on a rear surface of a second solar cell located adjacent to the first solar cell at an intermediate location along a second supercell of the plurality of supercells;
The solar module of clause ID, wherein the first hidden tap contact pad electrically connects to the second hidden tap contact pad through the first electrical interconnect.

3D. The solar cell of clause 2D, wherein the first electrical interconnect extends across a gap between the first supercell and the second supercell and is conductively coupled to the second hidden tap contact pad. module.

4D. a second hidden tap contact pad located on the rear surface of a second solar cell located at another intermediate location along the first supercell of the plurality of supercells;
a second electrical interconnect conductively bonded to the second hidden tap contact pad;
a bypass diode electrically connected by the first electrical interconnect and the second electrical interconnect in parallel with the solar cell located between the first hidden tap contact pad and the second hidden tap contact pad; The solar module according to item 1D.

5D. the first hidden tap contact pad is one of a plurality of hidden tap contact pads disposed on the rear surface of the first solar cell in a row extending parallel to the long axis of the first solar cell;
The first electrical interconnect is conductively bonded to each of the plurality of hidden contacts and extends substantially along the length of the first solar cell along the longitudinal axis. solar module.

6D. the first hidden tap contact pad is located adjacent to a short side of the rear surface of the first solar cell;
the first electrical interconnect does not extend substantially inwardly from the hidden tap contact pad along the longitudinal axis of the solar cell;
The solar module of clause ID, wherein the backside metallization pattern on the first solar cell provides a conductive path to the interconnects having a sheet resistance less than or equal to about 5 ohms/square.

7D. The solar module of clause 6D, wherein the sheet resistance is less than or equal to about 2.5 ohms/square.

8D. the first interconnect includes two tabs located on opposite sides of the stress relief feature;
6D. The solar module of clause 6D, wherein one of the two tabs conductively couples to the first hidden tap contact pad.

9D. The solar module according to item 8D, wherein the two tabs have different lengths.

10D. The solar module of clause ID, wherein the first electrical interconnect includes an alignment feature that specifies a desired alignment with the first hidden tap contact pad.

11D. The solar module of clause ID, wherein the first electrical interconnect includes an alignment feature that specifies a desired alignment with an edge of the first supercell.

12D. Solar module according to clause 1D, arranged in a shingled arrangement with electrical connections to other solar modules in overlapping areas.

13D. A solar module,
A glass front sheet,
rear seat and
a plurality of supercells arranged in two or more parallel rows between the glass front sheet and the back sheet, each supercell having long sides of adjacent silicon solar cells overlapping; a plurality of supercells having a plurality of rectangular or substantially rectangular silicon solar cells arranged side by side with the adjacent silicon solar cells electrically connected in series by being flexibly and directly conductively bonded to each other;
a first flexible electrical interconnect that is firmly conductively bonded to a first supercell of the plurality of supercells;
The plurality of flexible conductive junctions between overlapping solar cells allow the plurality of supercells and the glass front sheet to operate at temperatures ranging from about -40°C to about 100°C without damaging the solar module. providing the plurality of supercells with mechanical compliance to accommodate thermal expansion mismatch in directions parallel to the two or more parallel rows between;
The strong conductive bond between the first supercell and the first flexible electrical interconnect allows the first a solar module having a flexible electrical interconnect to accommodate thermal expansion mismatch between the first supercell and the first flexible interconnect in the two or more parallel and perpendicular directions; .

14D. The plurality of conductive bonds between overlapping adjacent solar cells within a supercell utilize a different conductive adhesive than the plurality of conductive bonds between the supercell and the flexible electrical interconnect. 13D.

15D. Solar module according to paragraph 14D, wherein both conductive adhesives can be cured in the same processing step.

16D. 13D. The solar module of clause 13D, wherein the conductive bond on one side of at least one solar cell in a supercell utilizes a different conductive adhesive than the conductive bond on the other side.

17D. 16D, wherein both conductive adhesives can be cured in the same processing step.

18D. 13D, wherein the plurality of conductive junctions between overlapping and adjacent solar cells accommodate differential motion greater than or equal to about 15 microns between each cell and the glass front sheet. solar module.

19D. The plurality of conductive junctions between overlapping and adjacent solar cells have a thickness of less than or equal to about 50 microns in a direction perpendicular to the plurality of solar cells and a thickness in a direction perpendicular to the plurality of solar cells. The solar module of paragraph 13D, wherein the thermal conductivity is greater than or equal to about 1.5 W/(meter-K).

20D. 13. The solar module of clause 13D, wherein the first flexible electrical interconnect resists thermal expansion or contraction of the first flexible interconnect greater than or equal to about 40 microns.

21D. The portion of the first flexible electrical interconnect that is conductively bonded to the supercell is a ribbon formed of copper and has a thickness of approximately 13D, wherein the solar module is smaller than or equal to 50 microns.

22D. The portion of the first flexible electrical interconnect that is conductively bonded to the supercell is a ribbon formed of copper and has a thickness of approximately 21D, wherein the solar module is smaller than or equal to 30 microns.

23D. The first flexible electrical interconnect has an integral conductive copper portion that is not bonded to the solar cell and provides higher conductivity than the portion of the first flexible electrical interconnect that is conductively bonded to the solar cell. , the solar module according to item 21D.

24D. Clause 21D, wherein the first flexible electrical interconnect has a width in the plane of the surface of the solar cell in a direction perpendicular to current flow through the interconnect that is greater than or equal to about 10 mm. solar module.

25D. 21D. The solar module of clause 21D, wherein the first flexible electrical interconnect is conductively bonded to a conductor proximate the solar cell that provides higher conductivity than the first electrical interconnect.

26D. 13D, wherein the solar module is arranged in an overlapping shingle arrangement with other solar modules to which electrical connections are made in overlapping areas.

27D. a plurality of supercells arranged in two or more parallel rows, each supercell having long sides of adjacent silicon solar cells overlapping and directly conductively bonded to each other; a plurality of supercells having a plurality of rectangular or substantially rectangular silicon solar cells arranged side by side in series electrical connection;
a hidden tap contact pad located on the rear surface of the first solar cell that does not conduct substantial current in normal operation;
The first solar cell is located at an intermediate position along a first of the plurality of supercells in a first of the two or more parallel rows of supercells, and the first solar cell is located at an intermediate location along the first supercell of the plurality of supercells, and the hidden tap contact pad is electrically connected in parallel with at least a second solar cell in a second row of the two or more parallel rows of said supercells.

28D. an electrical interconnect joining the hidden tap contact pad and electrically interconnecting the hidden tap contact pad to the second solar cell;
the electrical interconnect does not extend substantially the length of the first solar cell;
27D. The solar module of clause 27D, wherein the backside metallization pattern on the first solar cell provides a conductive path to the hidden tap contact pad having a sheet resistance less than or equal to about 5 ohms/square.

29D. the plurality of supercells are arranged in the three or more parallel rows extending across the width of the solar module perpendicular to the three or more parallel rows;
The hidden tap contact pads electrically connect to hidden contact pads on at least one solar cell in each row of the three or more parallel rows of supercells to Electrically connect parallel rows in parallel,
Clause 27D, wherein at least one bus connection to at least one of the plurality of hidden tap contact pads or to an interconnect between the plurality of hidden tap contact pads connects to a bypass diode or other electronic device. Solar module described in.

30D. a flexible electrical interconnect conductively bonded to the hidden tap contact pad to electrically connect it to the second solar cell;
The portion of the flexible electrical interconnect that conductively bonds to the hidden tap contact pad is a ribbon formed of copper and has a thickness of approximately thinner than or equal to 50 microns;
The conductive bond between the hidden tap contact pad and the flexible electrical interconnect allows the flexible electrical interconnect to operate at temperatures ranging from about -40°C to about 180°C without damaging the solar module. , enduring thermal expansion mismatch between the first solar cell and the flexible interconnect and accommodating relative motion between the first solar cell and the second solar cell resulting from thermal expansion; , the solar module according to item 27D.

31D. 27D. The solar module of clause 27D, wherein in operation of the solar module, the first hidden contact pad is capable of conducting a current greater than the current produced by any one of the plurality of solar cells.

32D. 27D. The solar module of clause 27D, wherein the front surface of the first solar cell overlying the first hidden tap contact pad is not occupied by contact pads or any other interconnect features.

33D. Clause 27D, wherein any area of the front surface of the first solar cell that is not overlapped by a portion of an adjacent solar cell in the first supercell is not occupied by contact pads or any other interconnection feature. Solar module listed.

34D. 27D. The solar module of clause 27D, wherein within each supercell, most of the plurality of cells do not have hidden tap contact pads.

35D. 34D. The solar module of clause 34D, wherein the plurality of cells with hidden tap contact pads have a larger light collection area than the plurality of cells without hidden tap contact pads.

36D. 27D. Solar module according to clause 27D, arranged in an overlapping shingle arrangement with other solar modules with electrical connections in overlapping areas.

37D. A glass front sheet,
rear seat and
a plurality of supercells arranged in two or more parallel rows between said glass front sheet and said back sheet, each supercell having long sides of adjacent silicon solar cells overlapping; a plurality of supercells having a plurality of rectangular or substantially rectangular silicon solar cells arranged side by side with the adjacent silicon solar cells electrically connected in series by being flexibly and directly conductively bonded to each other;
a first flexible electrical interconnect that is firmly conductively bonded to a first supercell of the plurality of supercells;
the plurality of flexible conductive joints between overlapping solar cells are formed from a first conductive adhesive and have a stiffness modulus of less than or equal to about 800 megapascals;
the strong conductive bond between the first supercell and the first flexible electrical interconnect is formed from a second conductive adhesive and has a stiffness greater than or equal to about 2000 megapascals; solar module.

38D. 37D. The solar module of clause 37D, wherein, unlike the first conductive adhesive and the second conductive adhesive, both conductive adhesives can be cured in the same processing step.

39D. The plurality of conductive junctions between overlapping and adjacent solar cells have a thickness of less than or equal to about 50 microns in a direction perpendicular to the plurality of solar cells and a thickness in a direction perpendicular to the plurality of solar cells. The solar module of paragraph 37D, wherein the thermal conductivity is greater than or equal to about 1.5 W/(meter-K).

40D. 37D. Solar module according to clause 37D, arranged in an overlapping shingle arrangement with other solar modules with electrical connections in overlapping areas.

1E. N rectangular or substantially rectangular silicon solar cells arranged in two or more parallel rows as a plurality of supercells;
Each supercell includes a plurality of silicon solar cells arranged side by side with the long sides of the adjacent silicon solar cells overlapping and conductively bonded to each other to electrically connect the adjacent silicon solar cells in series;
The plurality of supercells are electrically connected to provide a high DC voltage greater than or equal to about 90 volts.

2E. 1E. The solar module of clause IE, comprising one or more flexible electrical interconnects arranged to electrically connect the plurality of supercells in series to provide the high DC voltage.

3E. 2E. Solar module according to clause 2E, comprising module-level power electronics including an inverter to convert the high DC voltage to an AC voltage.

4E. The solar module of clause 3E, wherein the module level power electronics senses the high DC voltage and operates the module at an optimal current-voltage power point.

5E. a module level electrically connected to a plurality of individual adjacent series-connected supercell row pairs, one or more of the plurality of supercell row pairs being electrically connected in series to provide the high DC voltage; power electronics,
The solar module according to item 1E, further comprising: an inverter that converts the high DC voltage into an AC voltage.

6E. 5E. The solar module of clause 5E, wherein the module level power electronics senses the voltage across each individual supercell row pair and operates each individual supercell row pair at an optimal current-voltage power point.

7E. The solar module of clause 6E, wherein if the voltage across an individual supercell row pair falls below a threshold, the module level power electronics switches out the row pair from the circuitry providing the high DC voltage. .

8E. module-level power electronics electrically connected to each individual supercell row and electrically connecting two or more of the plurality of supercell rows in series to provide the high DC voltage;
The solar module according to item 1E, further comprising: an inverter that converts the high DC voltage into an AC voltage.

9E. 8E. The solar module of clause 8E, wherein the module level power electronics senses the voltage across each individual supercell row and operates each individual supercell row at an optimal current-voltage power point.

10E. The solar module of clause 9E, wherein if the voltage across an individual supercell row falls below a threshold, the module level power electronics switches out the supercell row from the circuitry providing the high DC voltage. .

11E. module-level power electronics electrically connected to each individual supercell and electrically connecting two or more of the plurality of supercells in series to provide the high DC voltage;
The solar module according to item 1E, further comprising: an inverter that converts the high DC voltage into an AC voltage.

12E. 11E. The solar module of clause 11E, wherein the module level power electronics senses the voltage across each individual supercell and operates each individual supercell at an optimal current-voltage power point.

13E. 12E. The solar module of clause 12E, wherein if the voltage across an individual supercell falls below a threshold, the module level power electronics switches the supercell out of the circuitry providing the high DC voltage.

14E. Each supercell is electrically segmented into multiple segments by multiple hidden taps;
module-level power electronics electrically connecting each segment of each supercell through the plurality of hidden taps and electrically connecting two or more segments in series to provide the high DC voltage;
The solar module according to item 1E, further comprising: an inverter that converts the high DC voltage into an AC voltage.

15E. 14E. The solar module of clause 14E, wherein the module level power electronics senses the voltage across each individual segment of each supercell and operates each individual segment at an optimal current-voltage power point.

16E. 15E. The solar module of clause 15E, wherein if the voltage across an individual segment falls below a threshold, the module level power electronics switches the segment out of the circuitry providing the high DC voltage.

17E. The solar module according to any one of paragraphs 4E, 6E, 9E, 12E or 15E, wherein the optimal current-voltage power point is the maximum current-voltage power point.

18E. 17E. The solar module of any one of paragraphs 3E to 17E, wherein the module level power electronics does not have a DC-DC boost component.

19E. N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, about 450 greater than or equal to, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than about 700; or equivalent thereto, the solar module according to any one of clauses 1E to 18E.

20E. The high DC voltage may be greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, or greater than about 360 volts. greater than or equal to, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts, Item 1E The solar module according to any one of 19E to 19E.

21E. two or more solar modules electrically connected in parallel;
Equipped with an inverter and
each solar module has N (greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows;
Each supercell in each module is arranged side by side within the module with the long sides of the adjacent silicon solar cells overlapping and conductively bonded to each other, electrically connecting the adjacent silicon solar cells in series. comprising two or more of the above silicon solar cells;
In each module, the plurality of supercells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts;
The inverter is electrically connected to the two or more solar modules to convert their high voltage DC output to AC.

22E. Each solar module includes one or more flexible electrical interconnects arranged to electrically connect the plurality of supercells in the solar module in series to provide a high voltage DC output for the solar module. 21E.

23E. at least a third solar module electrically connected in series with the first solar module among the two or more solar modules electrically connected in parallel;
The third solar module has N' (greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows. ,
Each supercell in the third solar module is arranged in such a manner that the long sides of the adjacent silicon solar cells overlap and are conductively bonded to each other, electrically connecting the adjacent silicon solar cells in series. comprising two or more of the silicon solar cells arranged in
21E. The solar power generation system of clause 21E, wherein within the third solar module, the plurality of supercells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts.

24E. at least a fourth solar module electrically connected in series with the second solar module of the two or more solar modules electrically connected in parallel;
The fourth solar module has N'' (greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows. death,
Each supercell in the fourth solar module is arranged in such a manner that the long sides of the adjacent silicon solar cells overlap and are conductively bonded to each other, electrically connecting the adjacent silicon solar cells in series. comprising two or more of the silicon solar cells arranged in
23E. The solar power generation system of clause 23E, wherein within the fourth solar module, the plurality of supercells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts.

25E. From paragraph 21E, comprising a plurality of fuses arranged to prevent a short circuit occurring in any one of said two or more solar modules from dissipating the power generated in the other solar modules. 24E.

26E. Arranged to prevent a short circuit occurring in any one of the two or more solar modules from dissipating power generated in any other of the two or more solar modules. The solar power generation system according to any one of paragraphs 21E to 25E, comprising a plurality of blocking diodes.

27E. 26. The solar power generation system according to any one of clauses 21E to 26E, comprising a positive bus and a negative bus to which the two or more solar modules are electrically connected in parallel and the inverter is electrically connected.

28E. comprising a combiner box to which electrical connections are made by separate conductors of the two or more solar modules;
26. The solar power generation system of any one of clauses 21E to 26E, wherein the combiner box electrically connects the two or more solar modules in parallel.

29E. The combiner box includes a plurality of fuses arranged to prevent a short circuit in any one of the two or more solar modules from dissipating power generated in the other solar modules. The solar power generation system according to item 28E, having:

30E. The combiner box is configured such that a short circuit occurring in any one of the two or more solar modules dissipates the power generated in the other of the two or more solar modules. 28. The solar power generation system according to paragraph 28E or paragraph 29E, comprising a plurality of blocking diodes arranged to prevent

31E. Said inverter is configured to operate said two or more solar modules at a DC voltage higher than a set minimum value to avoid reverse biasing the modules. The solar power generation system described in section.

32E. The solar according to any one of paragraphs 21E to 30E, wherein the inverter is configured to recognize a reverse bias condition and operate the two or more solar modules at a voltage that avoids the reverse bias condition. Photovoltaic system.

33E. N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, about 450 greater than or equal to, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than about 700; or equivalent thereto, the solar module according to any one of clauses 21E to 32E.

34E. The high DC voltage may be greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, or greater than about 360 volts. greater than or equal to, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts, Item 21E The solar module according to any one of 33E to 33E.

35E. The solar power generation system according to any one of clauses 21E to 34E, located on a roof.

36E. N (greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged in two or more parallel rows as a plurality of supercells, each supercell having an adjacent A rectangular or substantially rectangular silicon solar cell comprising a plurality of silicon solar cells arranged side by side with the long sides of the mating silicon solar cells overlapping and conductively bonded to each other to electrically connect the adjacent silicon solar cells in series. a first solar module having a
Equipped with an inverter and
The plurality of supercells are electrically connected to provide a high DC voltage greater than or equal to about 90 volts to the inverter that converts the DC to AC.

37E. 36E. The solar power generation system of clause 36E, wherein the inverter is a microinverter integrated with the first solar module.

38E. The first solar module includes one or more flexible electrical interconnects arranged to electrically connect the plurality of supercells in the solar module in series to provide a high voltage DC output for the solar module. 36E.

39E. comprising at least a second solar module electrically connected in series with the first solar module,
The second solar module has N' (greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows. ,
Each supercell in the second solar module is arranged in such a manner that the long sides of the adjacent silicon solar cells overlap and are conductively bonded to each other, electrically connecting the adjacent silicon solar cells in series. comprising two or more of the silicon solar cells arranged in
within the second solar module, the plurality of supercells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts, as in any one of paragraphs 36E to 38E. Solar power system.

40E. 39. The solar module of any one of paragraphs 36E to 39E, wherein the inverter does not have a DC-DC boost component.

41E. N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, about 450 greater than or equal to, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than about 700; or equivalent thereto, the solar module according to any one of paragraphs 36E to 40E.

42E. The high DC voltage may be greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, or greater than about 360 volts. higher than or equal to, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts, item 36E The solar module according to any one of 41E to 41E.

43E. N rectangular or substantially rectangular silicon solar cells (a number greater than or equal to about 250) arranged as a plurality of series-connected supercells in two or more parallel rows, each supercell has a plurality of silicon solar cells, and the long sides of the adjacent silicon solar cells overlap and are directly conductively bonded to each other by an electrically and thermally conductive adhesive, so that the plurality of silicon solar cells are connected to each other in the supercell. A rectangular or substantially rectangular silicon solar cell in which the plurality of silicon solar cells are electrically connected in series and arranged side by side;
less than one bypass diode per 25 solar cells;
The electrically and thermally conductive adhesive has a thickness of less than or equal to about 50 microns perpendicular to the plurality of solar cells and a thermal conductivity perpendicular to the plurality of solar cells of about 50 microns. A solar module forming a plurality of junctions between adjacent solar cells higher than or equal to 1.5 W/(meter-K).

44E. 43. The solar module of clause 43E, wherein the plurality of supercells are encapsulated within a thermoplastic olefin layer between a front sheet and a back sheet.

45E. 43E. The solar module according to item 43E, wherein the plurality of supercells are enclosed between a glass front sheet and a rear sheet.

46E. less than one bypass diode per 30 solar cells, or less than one bypass diode per 50 solar cells, or less than one bypass diode per 100 solar cells, or only a single bypass diode 43E, comprising or without a bypass diode.

47E. 43E. The solar module of clause 43E, comprising no bypass diodes, or only a single bypass diode, or no more than 3 bypass diodes, or no more than 6 bypass diodes, or no more than 10 bypass diodes.

48E. The conductive junctions between the supercells and the glass front sheet allow the supercells and the glass front sheet to operate at temperatures ranging from about -40°C to about 100°C without damaging the solar module. 43E. The solar module of clause 43E, wherein the plurality of supercells are provided with mechanical compliance that accommodates thermal expansion mismatch in the two or more parallel directions between them.

49E. N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, about 550 The solar module of any one of paragraphs 43E to 48E, which is greater than or equal to, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700. .

50E. The plurality of supercells are electrically connected to each other at a voltage greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or greater than or equal to about 300 volts. equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than about 600 volts. 49. A solar module according to any one of paragraphs 43E to 49E, which provides a high DC voltage or an equivalent high DC voltage.

51E. The solar module according to item 43E,
an inverter electrically connected to the solar module and configured to convert DC output from the solar module to provide AC output.

52E. 51E, wherein the inverter does not have a DC-DC boost component.

53E. 51E. The solar energy system of clause 51E, wherein the inverter is configured to operate the solar module at a DC voltage higher than a set minimum value to avoid reverse biasing the solar cells.

54E. 53E. The solar energy system of paragraph 53E, wherein the minimum voltage value is temperature dependent.

55E. 51E. The solar energy system of clause 51E, wherein the inverter is configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.

56E. 55E. The solar energy system of clause 55E, wherein the inverter is configured to operate the solar module in a local maximum region of the solar module's voltage-current output curve to avoid the reverse bias condition.

57E. 56E. The solar energy system of any one of paragraphs 51E to 56E, wherein the inverter is a microinverter integrated with the solar module.

1F. a step of advancing the solar cell wafer along a curved surface;
A vacuum is drawn between the curved surface and the bottom surface of the solar cell wafer to bend the solar cell wafer toward the curved surface, thereby causing the solar cell wafer to bend the solar cell wafer toward the curved surface, thereby causing the solar cell wafer to bend the solar cell wafer toward the curved surface, thereby causing the solar cell wafer to bend the solar cell wafer toward the curved surface. cleaving a cell wafer to separate a plurality of solar cells from the solar cell wafer.

2F. 1F, wherein the curved surface is a curved portion of the top surface of a vacuum manifold that draws the vacuum against the bottom surface of the solar cell wafer.

3F. The vacuum drawn by the vacuum manifold against the bottom surface of the solar cell wafer varies along the direction of movement of the solar cell wafer and is strongest in the region of the vacuum manifold where the solar cell wafer is cleaved. , the method described in Section 2F.

4F. conveying the solar cell wafer by a perforated belt along the curved top surface of the vacuum manifold, the vacuum being applied to the bottom surface of the solar cell wafer through a plurality of perforations in the perforated belt; The method according to paragraph 2F or paragraph 3F, comprising the step of being drawn by.

5F. The plurality of perforations of the perforated belt are arranged such that a leading edge and a trailing edge of the solar cell wafer along the direction of movement of the solar cell wafer lie over at least one perforation of the perforated belt. , the method described in Section 4F.

6F. The solar cell wafer is advanced along a flat region of the top surface of the vacuum manifold until it reaches a transition curved region of the top surface of the vacuum manifold having a first curvature, and then the solar cell wafer is cleaved. advancing the solar cell wafer into a cleavage region of the upper surface of the vacuum manifold, the cleavage region of the vacuum manifold having a second curvature higher than the first curvature; The method according to any one of paragraphs 2F to 5F.

7F. 6F, wherein the curvature of the transition region is defined by a continuous geometric function of increasing curvature.

8F. 7F. The method of paragraph 7F, wherein the curvature of the cleavage region is defined by a continuous geometric function that increases the curvature.

9F. 6F. The method of item 6F, comprising advancing the plurality of cleaved solar cells into a post-cleavage region of the vacuum manifold having a third curvature higher than the second curvature.

10F. 9F. The method of clause 9F, wherein the curvatures of the transition curved region, the cleaved region, and the post-cleaved region are defined by a single continuous geometric function of increasing curvature.

11F. The method according to item 7F, item 8F, or item 10F, wherein the continuous geometric function that increases the curvature is a clothoid.

12F. At one end of each scribe line, then at the opposite end of each scribe line, draw a stronger vacuum between the solar wafer and the curved surface to create a single cleavage fissure along each scribe line. 11F. The method of any one of paragraphs 1F to 11F, comprising providing an asymmetric stress distribution along each scribe line that promotes nucleation and propagation.

13F. the step of removing the plurality of cleaved solar cells from the curved surface, the edges of the plurality of cleaved solar cells being touched before removing the solar cells from the curved surface; 12F. The method of any one of paragraphs 1F to 12F, comprising the step of:

14F. laser scribing the one or more scribe lines on the solar cell wafer;
applying an electrically conductive adhesive bonding agent to a portion of the top surface of the solar cell wafer prior to cleaving the solar cell wafer along the one or more scribe lines;
13F. The method of any one of paragraphs 1F to 13F, wherein each cleaved solar cell includes a portion of the electrically conductive adhesive adhesive disposed along the cleavage edge on the top surface thereof.

15F. 15. The method of paragraph 14F, comprising laser scribing the one or more scribe lines and then applying the electrically conductive adhesive bonding agent.

16F. 14F. The method of paragraph 14F, comprising applying the electrically conductive adhesive bonding agent and then laser scribing the one or more scribe lines.

17F. A method for producing a solar cell string from a plurality of cleaved solar cells produced by the method according to any one of Items 14F to 16F,
The plurality of cleaved solar cells mentioned above are a plurality of rectangular solar cells,
arranging the plurality of rectangular solar cells side by side with the long sides of adjacent rectangular solar cells overlapping each other in a shingled pattern with a portion of the electrically conductive adhesive bonding agent interposed therebetween;
curing the electrically conductive adhesive bonding agent, thereby bonding adjacent and overlapping rectangular solar cells to each other and electrically connecting them in series.

18F. 17F. The method of any one of paragraphs 1F to 17F, wherein the solar cell wafer is a square or pseudo-square silicon solar cell wafer.

1G. forming a backside metallization pattern on each square solar cell of the one or more square solar cells;
stencil printing a complete front metallization pattern on each square solar cell of the one or more square solar cells in a single stencil printing step;
A plurality of rectangular solar cells each including a complete front side metallization pattern and a backside metallization pattern, with each square solar cell separated into two or more rectangular solar cells; a step of forming from a solar cell;
arranging the plurality of rectangular solar cells side by side with the long sides of adjacent rectangular solar cells overlapping each other in a shingled pattern;
conductively bonding the rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells to each other with an electrically conductive bonding agent interposed therebetween, the process comprising: one of the rectangular solar cells included in the pair; The front metallization pattern of the rectangular solar cells of the pair is electrically connected to the back metallization pattern of the other rectangular solar cell of the pair, thereby connecting the plurality of rectangular solar cells in series. A method of making a solar cell string comprising the steps of making an electrical connection to a solar cell string.

2G. The rest of the stencil is such that all portions of the stencil that define one or more features of the front metallization pattern on the one or more square solar cells lie within the plane of the stencil during stencil printing. 1G.

3G. The front metallization pattern on each rectangular solar cell includes a plurality of fingers oriented perpendicular to the long sides of the rectangular solar cell, and each of the plurality of fingers in the front metallization pattern comprises: 1G, wherein the front metallization pattern does not physically connect each other.

4G. The method of paragraph 3G, wherein the plurality of fingers are about 10 microns to about 90 microns wide.

5G. The method of paragraph 3G, wherein the plurality of fingers are about 10 microns to about 50 microns wide.

6G. The method of paragraph 3G, wherein the plurality of fingers are about 10 microns to about 30 microns wide.

7G. 3G. The method of paragraph 3G, wherein the plurality of fingers have a height in a direction perpendicular to the front surface of the rectangular solar cell from about 10 microns to about 50 microns.

8G. 3G. The method of paragraph 3G, wherein the plurality of fingers have a height perpendicular to the front surface of the rectangular solar cell of about 30 microns or more.

9G. The front metallization pattern on each rectangular solar cell includes a plurality of contact pads, each located at the end of a corresponding finger, arranged parallel to and adjacent to the long edge of the rectangular solar cell. The method described in Section 3G.

10G. the backside metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged in parallel and adjacent rows to the long edges of the rectangular solar cell;
Each pair of adjacent and overlapping rectangular solar cells is such that each of the plurality of contact pads on the back side of one of the rectangular solar cells included in the pair of rectangular solar cells is connected to the contact pad of the rectangular solar cell included in the pair. 3G, wherein the fingers are aligned and placed in electrical connection with corresponding fingers in the front metallization pattern on the other rectangular solar cell.

11G. the backside metallization pattern on each rectangular solar cell includes a bus bar extending parallel to and adjacent to the long edges of the rectangular solar cell;
Each pair of adjacent and overlapping rectangular solar cells is such that the bus bar on one rectangular solar cell in the pair of rectangular solar cells is connected to the bus bar on the other rectangular solar cell in the pair. 3. The method of clause 3G, wherein the fingers are placed in overlapping electrical connection with the plurality of fingers in the front metallization pattern.

12G. the front metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged parallel to and adjacent to the long edges of the rectangular solar cell, each located at the end of a corresponding finger;
the backside metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged in parallel and adjacent rows to the long edges of the rectangular solar cell;
Each pair of adjacent and overlapping rectangular solar cells is such that each of the plurality of contact pads on the back side of one of the rectangular solar cells included in the pair of rectangular solar cells is connected to the contact pad of the rectangular solar cell included in the pair. 3G, wherein the other rectangular solar cell is placed in overlapping and electrical connection with a corresponding contact pad in the front metallization pattern on the other rectangular solar cell.

13G. The rectangular solar cells in each pair of adjacent overlapping rectangular solar cells include discontinuities in electrically conductive bonding material disposed between the overlapping front surface contact pads and the back surface contact pads. 12G.

14G. The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells include the front metallization pattern of one rectangular solar cell included in the pair of rectangular solar cells, and the front metallization pattern included in the pair of rectangular solar cells. 3G. The method of clause 3G, wherein the fingers in the backside metallization pattern of the other rectangular solar cell are conductively bonded to each other by discontinuous portions of electrically conductive bonding material disposed between overlapping ends of the plurality of fingers.

15G. The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells include the front metallization pattern of one rectangular solar cell included in the pair of rectangular solar cells, and the front metallization pattern included in the pair of rectangular solar cells. conductively bonded to each other by a dashed or solid electrically conductive bonding agent disposed between overlapping ends of the plurality of fingers in the backside metallization pattern of the other rectangular solar cell;
3G. The method of paragraph 3G, wherein the dashed or solid electrically conductive bond electrically interconnects one or more of the plurality of fingers.

16G. the front metallization pattern on each rectangular solar cell includes a plurality of contact pads, each located at the end of a corresponding finger, parallel to and adjacent to the long edge of the rectangular solar cell;
The rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells are connected to the plurality of contact pads of the front metallization pattern of one rectangular solar cell in the pair of rectangular solar cells, and the rectangular solar cells in each pair of adjacent overlapping rectangular solar cells. 3G. The method of item 3G, wherein the other rectangular solar cell in the pair of cells is conductively bonded to each other by a discontinuous portion of electrically conductive bonding material disposed between the back metallization pattern and the other rectangular solar cell in the pair.

17G. the front metallization pattern on each rectangular solar cell includes a plurality of contact pads, each located at the end of a corresponding finger, parallel to and adjacent to the long edge of the rectangular solar cell;
The rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells are connected to the plurality of contact pads of the front metallization pattern of one rectangular solar cell in the pair of rectangular solar cells, and the rectangular solar cells in each pair of adjacent overlapping rectangular solar cells. conductively bonded to each other by an electrically conductive bonding agent in the form of a broken line or solid line disposed between the other rectangular solar cell included in the pair of cells and the back metal coating pattern;
3G. The method of paragraph 3G, wherein the dashed or solid electrically conductive bond electrically interconnects one or more of the plurality of fingers.

18G. 17. The method of any one of paragraphs 1G to 17G, wherein the front metallization pattern is formed from a silver paste.

1H. A method of manufacturing a plurality of solar cells, the method comprising:
depositing one or more front amorphous silicon layers on the front side of a crystalline silicon wafer, the front amorphous silicon layers being irradiated with light in operation of the plurality of solar cells;
depositing one or more backside amorphous silicon layers on the back side of the crystalline silicon wafer opposite the front side of the crystalline silicon wafer;
patterning the one or more front amorphous silicon layers to form one or more front trenches in the one or more front amorphous silicon layers;
depositing a front passivate layer on the one or more front amorphous silicon layers and in the one or more front trenches;
patterning the one or more backside amorphous silicon layers to form one or more backside trenches in the one or more backside amorphous silicon layers, each of the one or more backside trenches , formed alongside a corresponding one of the one or more front trenches;
depositing a backside passivate layer on the one or more backside amorphous silicon layers and within the one or more backside trenches;
cleaving the crystalline silicon wafer in one or more cleavage planes, each cleavage plane being centered or substantially centered on a different pair of corresponding front and back trenches; A method of providing.

2H. 1H. The method of clause 1H, comprising forming the one or more front side trenches through the front side amorphous silicon layer to reach the front side of the crystalline silicon wafer.

3H. The method of paragraph 1H, comprising forming the one or more backside trenches to penetrate the one or more backside amorphous silicon layers to reach the backside of the crystalline silicon wafer.

4H. The method of paragraph 1H, comprising forming the front passivate layer and the back passivate layer from a transparent conductive oxide.

5H. 1H, wherein a laser is used to induce thermal stress in the crystalline silicon wafer to cleave the crystalline silicon wafer at the one or more cleavage planes.

6H. 1H, comprising mechanically cleaving the crystalline silicon wafer at the one or more cleavage planes.

7H. The method of paragraph 1H, wherein the one or more front amorphous crystalline silicon layers form an np junction with the crystalline silicon wafer.

8H. The method according to item 7H, comprising the step of cleaving the crystalline silicon wafer from the back side thereof.

9H. The method of paragraph 1H, wherein the one or more backside amorphous crystalline silicon layers form an np junction with the crystalline silicon wafer.

10H. The method according to item 9H, comprising cleaving the crystalline silicon wafer from its front side.

11H. A method of manufacturing a plurality of solar cells, the method comprising:
forming one or more trenches in a first surface of a crystalline silicon wafer;
depositing one or more amorphous silicon layers on the first surface of the crystalline silicon wafer;
depositing a passivate layer in the one or more trenches of the first surface of the crystalline silicon wafer and on the one or more amorphous silicon layers;
depositing one or more amorphous silicon layers on a second surface of the crystalline silicon wafer opposite the first surface of the crystalline silicon wafer;
cleaving the crystalline silicon wafer at one or more cleavage planes, each cleavage plane being centered or substantially centered on a different one of the one or more trenches; A method comprising and .

12H. 11H, comprising forming the passivate layer from a transparent conductive oxide.

13H. 11H, comprising using a laser to induce thermal stress in the crystalline silicon wafer to cleave the crystalline silicon wafer at the one or more cleavage planes.

14H. 11H, comprising mechanically cleaving the crystalline silicon wafer at the one or more cleavage planes.

15H. The method of paragraph 11H, wherein the one or more amorphous crystalline silicon layers on the first surface form an np junction with the crystalline silicon wafer.

16H. The method of paragraph 11H, wherein the one or more amorphous crystalline silicon layers on the second surface form an np junction with the crystalline silicon wafer.

17H. 11H, wherein the first surface of the crystalline silicon wafer is illuminated with light during operation of the plurality of solar cells.

18H. 11H, wherein the second surface of the crystalline silicon wafer is illuminated with light during operation of the plurality of solar cells.

19H. A plurality of solar cells each having a plurality of solar cells arranged side by side with the ends of the adjacent solar cells shingled and conductively bonded to each other, electrically connecting the adjacent solar cells in series. Equipped with a supercell of
Each solar cell is
a crystalline silicon substrate;
one or more first surface amorphous silicon layers disposed on the first surface of the crystalline silicon substrate to form an n-p junction;
one or more second surface amorphous silicon layers disposed on a second surface of the crystalline silicon substrate opposite the first surface of the crystalline silicon substrate;
at the edge of the one or more first surface amorphous silicon layers, at the edge of the one or more second surface amorphous silicon layers, or at the edge of the one or more first surface amorphous silicon layers and the one or more a plurality of passivating layers to prevent carrier recombination at the edges of the second surface amorphous silicon layer of the solar panel.

20H. 19H. The solar panel of paragraph 19H, wherein the plurality of passivation layers comprises a transparent conductive oxide.

21H. The plurality of supercells are arranged in a single row or in two or more parallel rows, and the front surface of the solar panel is to be illuminated by solar radiation during operation of the solar panel. 19H. The solar panel according to item 19H.

Z1. A solar module,
N rectangular or substantially rectangular silicon solar cells (a number greater than or equal to about 250) arranged as a plurality of series-connected supercells in two or more parallel rows, each supercell has a plurality of silicon solar cells, and the long sides of the adjacent silicon solar cells overlap and are directly conductively bonded to each other by an electrically and thermally conductive adhesive, so that the plurality of silicon solar cells are connected to each other in the supercell. A rectangular or substantially rectangular silicon solar cell in which the plurality of silicon solar cells are electrically connected in series and arranged side by side;
one or more bypass diodes;
Each pair of adjacent parallel rows in the solar module is conductively bonded to a backside electrical contact on the centrally located solar cell in one row of the pair and electrically connected by a bypass diode conductively bonded to a backside electrical contact on an adjacent solar cell;
solar module.

Z2. Each pair of adjacent parallel rows is conductively bonded to a backside electrical contact on a solar cell in one row of the pair and to a backside electrical contact on an adjacent solar cell in the other row of the pair. Solar module according to clause Z1, electrically connected by at least one other bypass diode conductively bonded to the solar module.

Z3. Each pair of adjacent parallel rows is conductively bonded to a backside electrical contact on a solar cell in one row of the pair and to a backside electrical contact on an adjacent solar cell in the other row of the pair. Solar module according to clause Z2, electrically connected by at least one other bypass diode conductively bonded to the solar module.

Z4. The electrically and thermally conductive adhesive has a thickness of less than or equal to about 50 microns in a direction perpendicular to the plurality of solar cells and a thermal conductivity in a direction perpendicular to the plurality of solar cells. Solar module according to paragraph Z1, forming a plurality of junctions between adjacent solar cells higher than or equal to 1.5 W/(meter-K).

Z5. The solar module according to item Z1, wherein the plurality of supercells are encapsulated within a thermoplastic olefin layer between a glass front sheet and a back sheet.

Z6. The conductive junctions between the supercells and the glass front sheet allow the supercells and the glass front sheet to operate at temperatures ranging from about -40°C to about 100°C without damaging the solar module. The solar module of clause Z1, wherein the solar module provides mechanical compliance to the plurality of supercells to accommodate thermal expansion mismatch in the two or more parallel directions between them.

Z7. N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, about 550 The solar module of any one of paragraphs Z1 to Z6, which is greater than or equal to, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700. .

Z8. The plurality of supercells are electrically connected to each other at a voltage greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or greater than or equal to about 300 volts. equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than about 600 volts. Solar module according to any one of clauses Z1 to Z7, which provides a high DC voltage or an equivalent high DC voltage.

Z9. The solar module according to item Z1,
an inverter electrically connected to the solar module and configured to convert DC output from the solar module to provide AC output.

Z10. The solar energy system of clause Z9, wherein the inverter does not have a DC-DC boost component.

Z11. The solar energy system of clause Z9, wherein the inverter is configured to operate the solar module at a DC voltage higher than a set minimum value to avoid reverse biasing the solar cells.

Z12. The solar energy system according to clause Z11, wherein the minimum voltage value is temperature dependent.

Z13. The solar energy system of clause Z9, wherein the inverter is configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.

Z14. The solar energy system of clause Z13, wherein the inverter is configured to operate the solar module in a local maximum region of the voltage-current output curve of the solar module to avoid the reverse bias condition.

Z15. Solar energy system according to any one of paragraphs Z9 to Z14, wherein the inverter is a microinverter integrated with the solar module.

This disclosure is illustrative, not limiting. Further modifications will be apparent to those skilled in the art in view of this disclosure, and such further modifications are intended to be within the scope of the appended claims.
[Item 1]
a plurality of supercells arranged in two or more parallel rows, each supercell having long sides of adjacent silicon solar cells overlapping and directly conductively bonded to each other; a plurality of supercells having a plurality of rectangular or nearly rectangular silicon solar cells arranged side by side in series electrical connection;
a hidden tap contact pad located on the rear surface of the first solar cell that does not conduct substantial current in normal operation;
The first solar cell is located at an intermediate position along a first of the plurality of supercells in a first of the two or more parallel rows of supercells, and the first solar cell is located at an intermediate location along the first supercell of the plurality of supercells, and the hidden tap contact pad is electrically connected in parallel with at least a second solar cell in a second row of the two or more parallel rows of said supercells.
[Item 2]
an electrical interconnect joining the hidden tap contact pad and electrically interconnecting the hidden tap contact pad to the second solar cell;
the electrical interconnect does not extend substantially the length of the first solar cell;
2. The solar module of item 1, wherein the backside metallization pattern on the first solar cell provides a conductive path to the hidden tap contact pad having a sheet resistance less than or equal to about 5 ohms/square.
[Item 3]
the plurality of supercells are arranged in the three or more parallel rows extending across the width of the solar module perpendicular to the three or more parallel rows;
The hidden tap contact pads electrically connect to hidden contact pads on at least one solar cell in each row of the three or more parallel rows of supercells to Electrically connect parallel rows in parallel,
Item 1, wherein at least one bus connection to at least one of the plurality of hidden tap contact pads or to an interconnect between the plurality of hidden tap contact pads connects to a bypass diode or other electronic device. Solar module described in.
[Item 4]
a flexible electrical interconnect conductively bonded to the hidden tap contact pad to electrically connect it to the second solar cell;
The portion of the flexible electrical interconnect that conductively bonds to the hidden tap contact pad is a ribbon formed of copper and has a thickness of approximately thinner than or equal to 50 microns;
The conductive bond between the hidden tap contact pad and the flexible electrical interconnect allows the flexible electrical interconnect to operate at temperatures ranging from about -40°C to about 180°C without damaging the solar module. , enduring thermal expansion mismatch between the first solar cell and the flexible interconnect and accommodating relative motion between the first solar cell and the second solar cell resulting from thermal expansion; , the solar module according to item 1.
[Item 5]
2. The solar module of item 1, wherein in operation of the solar module, the first hidden contact pad is capable of conducting a current greater than the current generated by any one of the plurality of solar cells.
[Item 6]
2. The solar module of item 1, wherein the front surface of the first solar cell overlying the first hidden tap contact pad is not occupied by contact pads or any other interconnect features.
[Item 7]
In item 1, any area of the front surface of said first solar cell that is not overlapped by a portion of an adjacent solar cell in said first supercell is not occupied by contact pads or any other interconnection feature. Solar module listed.
[Item 8]
2. The solar module of item 1, wherein within each supercell, most of the plurality of cells do not have hidden tap contact pads.
[Item 9]
9. The solar module of item 8, wherein the plurality of cells with hidden tap contact pads have a larger light collection area than the plurality of cells without hidden tap contact pads.
[Item 10]
Solar module according to item 1, arranged in an overlapping shingle arrangement with other solar modules with electrical connections in overlapping areas.
[Item 11]
A solar module,
A glass front sheet,
rear seat and
a plurality of supercells each having a plurality of rectangular or nearly rectangular silicon solar cells disposed in two or more parallel rows between the glass front sheet and the back sheet; Rectangular or substantially rectangular silicon solar cells are arranged side by side with the long sides of adjacent silicon solar cells overlapping and flexibly directly conductive bonded to each other so that the adjacent silicon solar cells are electrically connected in series. multiple supercells,
a first flexible electrical interconnect that is firmly conductively bonded to a first supercell of the plurality of supercells;
The plurality of flexible conductive junctions between overlapping solar cells allow the plurality of supercells and the glass front sheet to operate at temperatures ranging from about -40°C to about 100°C without damaging the solar module. providing the plurality of supercells with mechanical compliance to accommodate thermal expansion mismatch in directions parallel to the two or more parallel rows between;
The strong conductive bond between the first supercell and the first flexible electrical interconnect allows the first a solar module having a flexible electrical interconnect to accommodate thermal expansion mismatch between the first supercell and the first flexible interconnect in the two or more parallel and perpendicular directions; .
[Item 12]
the plurality of conductive joints between overlapping adjacent solar cells within a supercell utilize a different conductive adhesive than the plurality of conductive joints between the supercell and the flexible electrical interconnect; 11. The solar module according to item 11.
[Item 13]
Solar module according to item 12, wherein both conductive adhesives can be cured in the same processing step.
[Item 14]
12. The solar module of item 11, wherein the conductive bond on one side of at least one solar cell in a supercell utilizes a different conductive adhesive than the conductive bond on the other side.
[Item 15]
15. Solar module according to item 14, wherein both conductive adhesives can be cured in the same processing step.
[Item 16]
12. The plurality of conductive junctions between overlapping and adjacent solar cells accommodate differential motion greater than or equal to about 15 microns between each cell and the glass front sheet. solar module.
[Item 17]
The plurality of conductive junctions between overlapping and adjacent solar cells have a thickness of less than or equal to about 50 microns in a direction perpendicular to the plurality of solar cells and a thickness in a direction perpendicular to the plurality of solar cells. 12. The solar module of item 11, wherein the thermal conductivity is greater than or equal to about 1.5 W/(meter-K).
[Item 18]
12. The solar module of item 11, wherein the first flexible electrical interconnect resists thermal expansion or contraction of the first flexible interconnect greater than or equal to about 40 microns.
[Item 19]
The portion of the first flexible electrical interconnect that is conductively bonded to the supercell is a ribbon formed of copper and has a thickness of approximately Solar module according to item 11, smaller than or equal to 50 microns.
[Item 20]
The portion of the first flexible electrical interconnect that is conductively bonded to the supercell is a ribbon formed of copper and has a thickness of approximately A solar module according to item 19, smaller than or equal to 30 microns.
[Item 21]
The first flexible electrical interconnect has an integral conductive copper portion that is not bonded to the solar cell and provides higher conductivity than the portion of the first flexible electrical interconnect that is conductively bonded to the solar cell. , the solar module according to item 19.
[Item 22]
19. The first flexible electrical interconnect has a width in the plane of the surface of the solar cell in a direction perpendicular to the flow of current through the interconnect that is greater than or equal to about 10 mm. solar module.
[Item 23]
20. The solar module of item 19, wherein the first flexible electrical interconnect is conductively bonded to a conductor proximate to the solar cell that provides higher conductivity than the first electrical interconnect.
[Item 24]
12. Solar module according to item 11, arranged in an overlapping shingle arrangement with other solar modules to which it is electrically connected in overlapping areas.
[Item 25]
A glass front sheet,
rear seat and
a plurality of supercells each having a plurality of rectangular or nearly rectangular silicon solar cells disposed in two or more parallel rows between the glass front sheet and the back sheet; Rectangular or substantially rectangular silicon solar cells are arranged side by side with the long sides of adjacent silicon solar cells overlapping and flexibly directly conductive bonded to each other so that the adjacent silicon solar cells are electrically connected in series. multiple supercells,
a first flexible electrical interconnect that is firmly conductively bonded to a first supercell of the plurality of supercells;
the plurality of flexible conductive joints between overlapping solar cells are formed from a first conductive adhesive and have a stiffness modulus of less than or equal to about 800 megapascals;
the strong conductive bond between the first supercell and the first flexible electrical interconnect is formed from a second conductive adhesive and has a stiffness modulus greater than or equal to about 2000 megapascals; solar module.
[Item 26]
26. The solar module of item 25, wherein, unlike the first conductive adhesive and the second conductive adhesive, both conductive adhesives can be cured in the same processing step.
[Item 27]
The plurality of conductive junctions between overlapping and adjacent solar cells have a thickness of less than or equal to about 50 microns in a direction perpendicular to the plurality of solar cells and a thickness in a direction perpendicular to the plurality of solar cells. 26. The solar module of item 25, wherein the thermal conductivity is greater than or equal to about 1.5 W/(meter-K).
[Item 28]
26. Solar module according to item 25, arranged in a shingled arrangement with electrical connections to other solar modules in overlapping areas.
[Item 29]
a first bus bar or contact pad row disposed parallel to and adjacent to a first outer edge of the silicon wafer; and a second bus bar or contact pad row disposed parallel to and parallel to the first outer edge of the silicon wafer; obtaining or providing the silicon wafer with a front side metallization pattern including a second row of bus bars or contact pads arranged parallel to and adjacent to the outer edge;
separating the silicon wafer along one or more scribe lines parallel to the first outer edge and the second outer edge of the silicon wafer to form a plurality of rectangular solar cells, the step of forming a plurality of rectangular solar cells; The busbar or contact pad row is arranged parallel to and adjacent to the long outer edge of the first rectangular solar cell of the plurality of rectangular solar cells, and the second busbar or contact pad row is arranged parallel to and adjacent to the long outer edge of the first rectangular solar cell of the plurality of rectangular solar cells. a second rectangular solar cell arranged parallel to and adjacent to the long outer edge of the second rectangular solar cell;
arranging the plurality of rectangular solar cells side by side with the long sides of adjacent solar cells overlapping and conductively bonded to each other so that the adjacent solar cells are electrically connected in series to form a supercell; Equipped with
The first bus bar or contact pad row on the first rectangular solar cell of the plurality of rectangular solar cells is overlapping and conductively bonded to the bottom surfaces of adjacent rectangular solar cells in the supercell.
[Item 30]
Item 29, wherein bottom surfaces of adjacent rectangular solar cells in the supercell overlap and are conductively connected to the second bus bar or contact pad row on the second rectangular solar cell among the plurality of rectangular solar cells. the method of.
[Item 31]
30. The method according to item 29, wherein the silicon wafer is a square or pseudo-square silicon wafer.
[Item 32]
32. The method of item 31, wherein the silicon wafer has sides that are about 125 mm long or about 156 mm long.
[Item 33]
32. The method of item 31, wherein the length to width ratio of each rectangular solar cell is between about 2:1 and about 20:1.
[Item 34]
30. The method of item 29, wherein the silicon wafer is a crystalline silicon wafer.
[Item 35]
The first row of busbars or contact pads and the second row of busbars or contact pads are arranged in peripheral regions of the silicon wafer that convert light into electricity with lower efficiency than central regions of the silicon wafer. The method according to item 29, wherein the method is located.
[Item 36]
The front surface metallization pattern includes a first plurality of parallel fingers extending inwardly from the first outer edge of the silicon wafer electrically connecting to the first busbar or contact pad row; or a second plurality of parallel fingers extending inwardly from the second outer edge of the silicon wafer electrically connecting to a row of contact pads.
[Item 37]
The front surface metallization pattern is oriented parallel to at least the first busbar or contact pad row and the second busbar or contact pad row, and the front side metallization pattern is oriented parallel to the first busbar or contact pad row and the second busbar or contact pad row, and or a third bus bar or contact pad row located between the contact pad row and the third bus bar or contact pad row oriented in a direction perpendicular to the third bus bar or contact pad row; and a third plurality of parallel fingers connecting the third bus bar or contact pad row to the plurality of rectangular solar cells after the silicon wafer is separated to form the plurality of rectangular solar cells. The method according to item 29, wherein the third rectangular solar cell is arranged parallel to and adjacent to the long outer edge of the third rectangular solar cell.
[Item 38]
30. The method of item 29, comprising applying a conductive adhesive to the first busbar or contact pad row to conductively bond the first rectangular solar cell to an adjacent solar cell.
[Item 39]
39. The method of item 38, wherein the metallization pattern includes a barrier configured to contain the spread of the conductive adhesive.
[Item 40]
39. The method of item 38, comprising applying the conductive adhesive by screen printing.
[Item 41]
39. The method of item 38, comprising applying the conductive adhesive by inkjet printing.
[Item 42]
39. The method of item 38, wherein the conductive adhesive is applied prior to forming the one or more scribe lines in the silicon wafer.
[Item 43]
The step of separating the silicon wafer along the one or more scribe lines includes drawing a vacuum between the bottom surface of the silicon wafer and a curved support surface, and bending the silicon wafer toward the curved support surface. 30. The method of item 29, thereby comprising cleaving the silicon wafer along the one or more scribe lines.
[Item 44]
The silicon wafer is a pseudo-square silicon wafer including a plurality of chamfered corners, and after the step of separating the silicon wafer to form the plurality of rectangular solar cells, one or more of the rectangular solar cells are separated. The plurality includes one or more of the plurality of chamfered corners,
The spacing between the scribe lines is such that the width perpendicular to the long axis of the rectangular solar cell that includes a plurality of chamfered corners is greater than the width perpendicular to the long axis of the rectangular solar cell that does not have a plurality of chamfered corners. are selected to compensate for the chamfered corners by enlarging the corners so that each of the plurality of rectangular solar cells in the supercell has a substantially larger area exposed to light during operation of the supercell. 30. The method of item 29, having front surfaces that are the same.
[Item 45]
30. The method of item 29, comprising placing the supercell in a layered structure between a transparent front sheet and a back sheet, and stacking the layered structure.
[Item 46]
The step of laminating the layered structure includes completing the curing of a conductive adhesive disposed between the adjacent rectangular solar cells in the supercell to conductively bond the adjacent rectangular solar cells to each other. The method described in item 45.
[Item 47]
The supercells are arranged in the layered structure within one of the two or more parallel rows of supercells, and the rear sheet is arranged in the layered structure in one of the two or more parallel rows of supercells, and the rear sheet is arranged in the layered structure in one of the two or more parallel rows of supercells, and a white sheet containing a plurality of parallel dark-colored stripes with positions and widths corresponding to the width of the backsheet, such that the plurality of white portions of the backsheet are aligned with two or more of the supercells in the assembled module; The method according to item 45, which is not visible through gaps between more parallel rows.
[Item 48]
46. The method of item 45, wherein the front sheet and the back sheet are glass sheets, and the supercell is encapsulated within a thermoplastic olefin layer sandwiched between the glass sheets.
[Item 49]
30. The method of item 29, comprising placing the supercell in a first module that includes a junction box in mating arrangement with a second junction box of a second solar module.
[Item 50]
a step of advancing the solar cell wafer along a curved surface;
A vacuum is drawn between the curved surface and the bottom surface of the solar cell wafer to bend the solar cell wafer toward the curved surface, thereby causing the solar cell wafer to bend the solar cell wafer toward the curved surface, thereby causing the solar cell wafer to bend the solar cell wafer toward the curved surface, thereby causing the solar cell wafer to bend the solar cell wafer toward the curved surface. cleaving a cell wafer to separate a plurality of solar cells from the solar cell wafer.
[Item 51]
51. The method of item 50, wherein the curved surface is a curved portion of a top surface of a vacuum manifold that draws the vacuum against the bottom surface of the solar cell wafer.
[Item 52]
The vacuum drawn by the vacuum manifold against the bottom surface of the solar cell wafer varies along the direction of movement of the solar cell wafer and is strongest in the region of the vacuum manifold where the solar cell wafer is cleaved. , the method described in item 50.
[Item 53]
conveying the solar cell wafer by a perforated belt along the curved top surface of the vacuum manifold, the vacuum being applied to the bottom surface of the solar cell wafer through a plurality of perforations in the perforated belt; 53. The method according to item 51 or 52, comprising the step of:
[Item 54]
The plurality of perforations of the perforated belt are arranged such that a leading edge and a trailing edge of the solar cell wafer along the direction of movement of the solar cell wafer lie over at least one perforation of the perforated belt. , the method described in item 53.
[Item 55]
The solar cell wafer is advanced along a flat region of the top surface of the vacuum manifold until it reaches a transition curved region of the top surface of the vacuum manifold having a first curvature, and then the solar cell wafer is cleaved. advancing the solar cell wafer into a cleavage region of the upper surface of the vacuum manifold, the cleavage region of the vacuum manifold having a second curvature higher than the first curvature; The method according to any one of items 50 to 54.
[Item 56]
56. The method of item 55, wherein the curvature of the transition region is defined by a continuous geometric function of increasing curvature.
[Item 57]
57. The method of item 56, wherein the curvature of the cleavage region is defined by a continuous geometric function that increases the curvature.
[Item 58]
58. The method of item 57, comprising advancing the plurality of cleaved solar cells into a post-cleave region of the vacuum manifold having a third curvature higher than the second curvature.
[Item 59]
58. The method of item 57, wherein the curvatures of the transition curved region, the cleaved region, and the post-cleaved region are defined by a single continuous geometric function of increasing curvature.
[Item 60]
60. The method according to item 57, 58 or 59, wherein the continuous geometric function increasing the curvature is a clothoid.
[Item 61]
At one end of each scribe line, then at the opposite end of each scribe line, draw a stronger vacuum between the solar wafer and the curved surface to create a single cleavage fissure along each scribe line. 61. The method of any one of items 50-60, comprising providing an asymmetric stress distribution along each scribe line that promotes nucleation and propagation.
[Item 62]
the step of removing the plurality of cleaved solar cells from the curved surface, the edges of the plurality of cleaved solar cells being touched before removing the solar cells from the curved surface; 62. The method of any one of items 50-61, comprising the step of:
[Item 63]
laser scribing the one or more scribe lines on the solar cell wafer;
applying an electrically conductive adhesive bonding agent to a portion of the top surface of the solar cell wafer prior to cleaving the solar cell wafer along the one or more scribe lines;
63. The method of any one of items 50 to 62, wherein each cleaved solar cell includes a portion of the electrically conductive adhesive adhesive disposed along the cleavage edge on the top surface thereof.
[Item 64]
64. The method of item 63, comprising laser scribing the one or more scribe lines and then applying the electrically conductive adhesive bonding agent.
[Item 65]
65. The method of item 64, comprising applying the electrically conductive adhesive adhesive and then laser scribing the one or more scribe lines.
[Item 66]
A method for making a solar cell string from a plurality of cleaved solar cells produced by the method according to any one of items 63 to 65, comprising:
The plurality of cleaved solar cells mentioned above are a plurality of rectangular solar cells,
arranging the plurality of rectangular solar cells side by side with the long sides of adjacent rectangular solar cells overlapping each other in a shingled pattern with a portion of the electrically conductive adhesive bonding agent interposed therebetween;
curing the electrically conductive adhesive bonding agent, thereby bonding adjacent and overlapping rectangular solar cells to each other and electrically connecting them in series.
[Item 67]
67. The method of any one of items 50-66, wherein the solar cell wafer is a square or pseudo-square silicon solar cell wafer.
[Item 68]
forming a backside metallization pattern on each square solar cell of the one or more square solar cells;
stencil printing a complete front metallization pattern on each square solar cell of the one or more square solar cells in a single stencil printing step;
A plurality of rectangular solar cells each including a complete front side metallization pattern and a backside metallization pattern, with each square solar cell separated into two or more rectangular solar cells; a step of forming from a solar cell;
arranging the plurality of rectangular solar cells side by side with the long sides of adjacent rectangular solar cells overlapping each other in a shingled pattern;
conductively bonding the rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells to each other with an electrically conductive bonding agent interposed therebetween, the process comprising: one of the rectangular solar cells included in the pair; The front metallization pattern of the rectangular solar cells of the pair is electrically connected to the back metallization pattern of the other rectangular solar cell of the pair, thereby connecting the plurality of rectangular solar cells in series. A method of making a solar cell string, comprising the steps of making an electrical connection to a solar cell string.
[Item 69]
The rest of the stencil is such that all portions of the stencil that define one or more features of the front metallization pattern on the one or more square solar cells lie within the plane of the stencil during stencil printing. 69. The method of item 68, wherein the method is fastened by a physical connection to a portion of.
[Item 70]
The front metallization pattern on each rectangular solar cell includes a plurality of fingers oriented perpendicular to the long sides of the rectangular solar cell, and each of the plurality of fingers in the front metallization pattern comprises: 69. The method of item 68, wherein the front metallization pattern does not physically connect each other.
[Item 71]
69. The method of item 68, wherein the plurality of fingers are about 10 microns to about 90 microns wide.
[Item 72]
69. The method of item 68, wherein the plurality of fingers are about 10 microns to about 50 microns wide.
[Item 73]
69. The method of item 68, wherein the plurality of fingers are about 10 microns to about 30 microns wide.
[Item 74]
69. The method of item 68, wherein the plurality of fingers have a height perpendicular to the front surface of the rectangular solar cell from about 10 microns to about 50 microns.
[Item 75]
69. The method of item 68, wherein the plurality of fingers have a height perpendicular to the front surface of the rectangular solar cell of about 30 microns or more.
[Item 76]
The front metallization pattern on each rectangular solar cell includes a plurality of contact pads, each located at the end of a corresponding finger, arranged parallel to and adjacent to the long edge of the rectangular solar cell. The method described in item 68.
[Item 77]
the backside metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged in adjacent rows parallel to the long edges of the rectangular solar cell;
Each pair of adjacent and overlapping rectangular solar cells is such that each of the plurality of contact pads on the back side of one of the rectangular solar cells included in the pair of rectangular solar cells is connected to the contact pad of the rectangular solar cell included in the pair. 69. The method of item 68, wherein the fingers are placed in alignment and electrical connection with corresponding fingers in the front metallization pattern on the other rectangular solar cell.
[Item 78]
the backside metallization pattern on each rectangular solar cell includes a bus bar extending parallel to and adjacent to the long edges of the rectangular solar cell;
Each pair of adjacent and overlapping rectangular solar cells is such that the bus bar on one rectangular solar cell in the pair of rectangular solar cells is connected to the bus bar on the other rectangular solar cell in the pair. 69. The method of item 68, wherein the fingers are placed in overlapping electrical connection with the plurality of fingers in the front metallization pattern.
[Item 79]
the front metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged parallel to and adjacent to the long edges of the rectangular solar cell, each located at the end of a corresponding finger;
the backside metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged in adjacent rows parallel to the long edges of the rectangular solar cell;
Each pair of adjacent and overlapping rectangular solar cells is such that each of the plurality of contact pads on the back side of one of the rectangular solar cells included in the pair of rectangular solar cells is connected to the contact pad of the rectangular solar cell included in the pair. 69. The method of item 68, wherein the rectangular solar cells are placed in overlapping and electrical connection with corresponding contact pads in the front metallization pattern on the other rectangular solar cell.
[Item 80]
The rectangular solar cells in each pair of adjacent overlapping rectangular solar cells include discontinuities in electrically conductive bonding material disposed between the overlapping front surface contact pads and the back surface contact pads. 69. The method according to item 68, wherein the parts are conductively bonded to each other.
[Item 81]
The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells include the front metallization pattern of one rectangular solar cell included in the pair of rectangular solar cells, and the front metallization pattern included in the pair of rectangular solar cells. 69. The method of item 68, wherein the fingers in the backside metallization pattern of the other rectangular solar cell are conductively bonded to each other by discontinuous portions of electrically conductive bonding material disposed between overlapping ends of the fingers.
[Item 82]
The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells include the front metallization pattern of one rectangular solar cell included in the pair of rectangular solar cells, and the front metallization pattern included in the pair of rectangular solar cells. conductively bonded to each other by a dashed or solid electrically conductive bonding agent disposed between overlapping ends of the plurality of fingers in the backside metallization pattern of the other rectangular solar cell;
69. The method of item 68, wherein the dashed or solid electrically conductive adhesive electrically interconnects one or more of the plurality of fingers.
[Item 83]
the front metallization pattern on each rectangular solar cell includes a plurality of contact pads, each located at the end of a corresponding finger, parallel to and adjacent to the long edge of the rectangular solar cell;
The rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells are connected to the plurality of contact pads of the front metallization pattern of one rectangular solar cell in the pair of rectangular solar cells, and the rectangular solar cells in each pair of adjacent overlapping rectangular solar cells. 69. The method of item 68, wherein the other rectangular solar cell in the pair of cells is conductively bonded to each other by a discontinuous portion of electrically conductive bonding material disposed between the back metallization pattern and the other rectangular solar cell in the pair.
[Item 84]
the front metallization pattern on each rectangular solar cell includes a plurality of contact pads, each located at the end of a corresponding finger, parallel to and adjacent to the long edge of the rectangular solar cell;
The rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells are connected to the plurality of contact pads of the front metallization pattern of one rectangular solar cell in the pair of rectangular solar cells, and the rectangular solar cells in each pair of adjacent overlapping rectangular solar cells. conductively bonded to each other by an electrically conductive bonding agent in the form of a broken line or solid line disposed between the other rectangular solar cell included in the pair of cells and the back metal coating pattern;
69. The method of item 68, wherein the dashed or solid electrically conductive adhesive electrically interconnects one or more of the plurality of fingers.
[Item 85]
85. The method of any one of items 68-84, wherein the front metallization pattern is formed from a silver paste.
[Item 86]
N rectangular or substantially rectangular silicon solar cells (a number greater than or equal to about 250) arranged as a plurality of series-connected supercells in two or more parallel rows, each supercell has a plurality of silicon solar cells, and the long sides of the adjacent silicon solar cells overlap and are directly conductively bonded to each other by an electrically and thermally conductive adhesive, so that the plurality of silicon solar cells are connected to each other in the supercell. A rectangular or substantially rectangular silicon solar cell in which the plurality of silicon solar cells are electrically connected in series and arranged side by side;
less than one bypass diode per 25 solar cells;
The electrically and thermally conductive adhesive has a thickness of less than or equal to about 50 microns in a direction perpendicular to the plurality of solar cells and a thermal conductivity in a direction perpendicular to the plurality of solar cells. A solar module forming a plurality of junctions between adjacent solar cells higher than or equal to 1.5 W/(meter-K).
[Item 87]
87. The solar module of item 86, wherein the plurality of supercells are encapsulated within a thermoplastic olefin layer between a front sheet and a back sheet.
[Item 88]
87. The solar module according to item 86, wherein the plurality of supercells are enclosed between a front sheet and a back sheet made of glass.
[Item 89]
less than one bypass diode per 30 solar cells, or less than one bypass diode per 50 solar cells, or less than one bypass diode per 100 solar cells, or only a single bypass diode 87. The solar module of item 86, comprising or without a bypass diode.
[Item 90]
87. The solar module of item 86, comprising no bypass diodes, or only a single bypass diode, or no more than 3 bypass diodes, or no more than 6 bypass diodes, or no more than 10 bypass diodes.
[Item 91]
The conductive junctions between the supercells and the glass front sheet allow the supercells and the glass front sheet to operate at temperatures ranging from about -40°C to about 100°C without damaging the solar module. 87. The solar module of item 86, wherein the plurality of supercells are provided with mechanical compliance to accommodate thermal expansion mismatch in the two or more parallel directions between them.
[Item 92]
N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, about 550 The solar module of any one of items 86 to 91, which is greater than or equal to, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700. .
[Item 93]
The plurality of supercells are electrically connected to each other at a voltage greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or greater than or equal to about 300 volts. equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than about 600 volts. 93. A solar module according to any one of items 86 to 92, which provides a high DC voltage or an equivalent high DC voltage.
[Item 94]
The solar module described in item 86,
an inverter electrically connected to the solar module and configured to convert DC output from the solar module to provide AC output.
[Item 95]
95. The solar energy system of item 94, wherein the inverter does not have a DC-DC boost component.
[Item 96]
95. The solar energy system of item 94, wherein the inverter is configured to operate the solar module at a DC voltage higher than a set minimum value to avoid reverse biasing the solar cells.
[Item 97]
97. The solar energy system of item 96, wherein the minimum voltage value is temperature dependent.
[Item 98]
95. The solar energy system of item 94, wherein the inverter is configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.
[Item 99]
99. The solar energy system of item 98, wherein the inverter is configured to operate the solar module in a local maximum region of the solar module's voltage-current output curve to avoid the reverse bias condition.
[Item 100]
99. A solar energy system according to any one of items 94 to 99, wherein the inverter is a microinverter integrated with the solar module.
[Item 101]
a series-connected string of N (≧25) rectangular or substantially rectangular solar cells having an average breakdown voltage greater than about 10 volts, the rectangular or substantially rectangular solar cells being connected in series to form one or more supercells; The one or more supercells each include a plurality of solar cells arranged side by side with the long sides of adjacent solar cells overlapping and conductively bonded to each other by an electrically and thermally conductive adhesive. comprising a series connected string of rectangular or substantially rectangular solar cells, including two or more of the cells;
A solar module, wherein no single solar cell or group of fewer than N solar cells in said string of solar cells is individually electrically connected in parallel with a bypass diode.
[Item 102]
102. The solar module of item 101, wherein N is greater than or equal to 30.
[Item 103]
102. The solar module of item 101, wherein N is greater than or equal to 50.
[Item 104]
102. The solar module of item 101, wherein N is greater than or equal to 100.
[Item 105]
The adhesive has a thickness in a direction perpendicular to the plurality of solar cells of less than or equal to about 0.1 mm, and a thermal conductivity in a direction perpendicular to the plurality of solar cells of about 1.5 W/. 102. The solar module of item 101, forming a plurality of junctions between adjacent solar cells of greater than or equal to m/K.
[Item 106]
102. The solar module of item 101, wherein the N solar cells are grouped into a single supercell.
[Item 107]
102. The solar module of item 101, wherein the plurality of supercells are encapsulated within a polymer.
[Item 108]
108. The solar module of item 107, wherein the polymer comprises a thermoplastic olefin polymer.
[Item 109]
108. The solar module of item 107, wherein the polymer is sandwiched between a glass front sheet and a back sheet.
[Item 110]
109. The solar module of item 109, wherein the backsheet comprises glass.
[Item 111]
The solar module according to item 101, wherein the plurality of solar cells are silicon solar cells.
[Item 112]
A solar module,
a supercell extending substantially the entire length or width of the solar module parallel to the edges of the solar module, the supercell comprising an electrically and thermally conductive adhesive in which the long sides of adjacent solar cells overlap; a supercell comprising a series-connected string of N rectangular or substantially rectangular solar cells having an average breakdown voltage of greater than about 10 volts arranged side by side in conductive contact with each other;
A solar module, wherein no single solar cell or group of fewer than N solar cells in the supercell is individually electrically connected in parallel with a bypass diode.
[Item 113]
The solar module according to item 112, wherein N>24.
[Item 114]
113. The solar module of item 112, wherein the length of the supercell in the direction of current flow is at least about 500 mm.
[Item 115]
113. The solar module of item 112, wherein the plurality of supercells are encapsulated within a thermoplastic olefin polymer sandwiched between a glass front sheet and a back sheet.
[Item 116]
A solar module,
N rectangular or substantially rectangular silicon solar cells (a number greater than or equal to about 250) arranged as a plurality of series-connected supercells in two or more parallel rows, each supercell has a plurality of silicon solar cells, and the long sides of the adjacent silicon solar cells overlap and are directly conductively bonded to each other by an electrically and thermally conductive adhesive, so that the plurality of silicon solar cells are connected to each other in the supercell. A rectangular or substantially rectangular silicon solar cell in which the plurality of silicon solar cells are electrically connected in series and arranged side by side;
one or more bypass diodes;
Each pair of adjacent parallel rows in the solar module is conductively bonded to a backside electrical contact on the centrally located solar cell in one row of the pair and electrically connected by a bypass diode conductively bonded to a backside electrical contact on an adjacent solar cell;
solar module.
[Item 117]
Each pair of adjacent parallel rows is conductively bonded to a backside electrical contact on a solar cell in one row of the pair and to a backside electrical contact on an adjacent solar cell in the other row of the pair. 117. The solar module of item 116, wherein the solar module is electrically connected by at least one other bypass diode conductively bonded to the portion.
[Item 118]
Each pair of adjacent parallel rows is conductively bonded to a backside electrical contact on a solar cell in one row of the pair and to a backside electrical contact on an adjacent solar cell in the other row of the pair. 118. The solar module of item 117, wherein the solar module is electrically connected by at least one other bypass diode conductively bonded to the portion.
[Item 119]
The electrically and thermally conductive adhesive has a thickness of less than or equal to about 50 microns in a direction perpendicular to the plurality of solar cells and a thermal conductivity in a direction perpendicular to the plurality of solar cells. 117. The solar module of item 116, forming a plurality of junctions between adjacent solar cells higher than or equal to 1.5 W/(meter-K).
[Item 120]
117. The solar module of item 116, wherein the plurality of supercells are encapsulated within a thermoplastic olefin layer between a glass front sheet and a back sheet.
[Item 121]
The conductive junctions between the supercells and the glass front sheet allow the supercells and the glass front sheet to operate at temperatures ranging from about -40°C to about 100°C without damaging the solar module. 117. The solar module of item 116, wherein the plurality of supercells are provided with mechanical compliance that accommodates a thermal expansion mismatch in the two or more parallel directions between them.
[Item 122]
N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, about 550 The solar module of any one of items 116 to 121, which is greater than or equal to, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700. .
[Item 123]
The plurality of supercells are electrically connected to each other at a voltage greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or greater than or equal to about 300 volts. equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than about 600 volts. 123. A solar module according to any one of items 116 to 122, providing a high DC voltage or an equivalent high DC voltage.
[Item 124]
The solar module described in item 116,
an inverter electrically connected to the solar module and configured to convert DC output from the solar module to provide AC output.
[Item 125]
125. The solar energy system of item 124, wherein the inverter does not have a DC-DC boost component.
[Item 126]
125. The solar energy system of item 124, wherein the inverter is configured to operate the solar module at a DC voltage higher than a set minimum value to avoid reverse biasing the solar cells.
[Item 127]
127. The solar energy system of item 126, wherein the minimum voltage value is temperature dependent.
[Item 128]
125. The solar energy system of item 124, wherein the inverter is configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.
[Item 129]
129. The solar energy system of item 128, wherein the inverter is configured to operate the solar module in a local maximum region of the solar module's voltage-current output curve to avoid the reverse bias condition.
[Item 130]
129. The solar energy system according to any one of items 124 to 129, wherein the inverter is a microinverter integrated with the solar module.

Claims (5)

A solar module comprising a plurality of supercells arranged in two or more physically parallel rows, each of the plurality of supercells each including two short edges and two long edges. a plurality of crystalline silicon solar cell strips, with at least one crystalline silicon solar cell strip of each supercell being located at an intermediate portion between the two long edges on the back surface opposite the front surface that is the light receiving surface; a hidden tap contact pad extending along the two long edges and conductively bonded to the hidden tap contact pad, the two supercells having a respective hidden tap interconnect; are electrically connected by connecting the two supercells to each other, the hidden tap interconnects of the two supercells being connected via in-plane and/or out-of-plane stress relief portions;
The plurality of crystalline silicon solar cell strips are arranged such that adjacent crystalline silicon solar cell strips in the plurality of crystalline silicon solar cell strips overlap along their long edges and are electrically and thermally connected in series. A solar module arranged so as to be fitted in the overlapping portion. 2. Each of the plurality of crystalline silicon solar cell strips has a front metallization pattern that includes a plurality of fingers oriented perpendicularly to the long edges of the plurality of crystalline silicon solar cell strips. solar module. the adjacent crystalline silicon solar cell strips have a distance between the adjacent crystalline silicon solar cell strips in a direction perpendicular to the adjacent crystalline silicon solar cell strips that is less than or equal to 50 microns, and 3. The method according to claim 1 or 2, wherein the thermal conductivity in the vertical direction at the conductive junction between adjacent crystalline silicon solar cell strips is arranged to be higher than or equal to 1.5 W/(meter K). Solar module listed. 4. A solar module according to any preceding claim, further comprising less than one bypass diode per 25 crystalline silicon solar cell strips. 5. The method of claims 1 to 4 comprising a number N of crystalline silicon solar cell strips greater than or equal to 250 arranged as a plurality of supercells connected in series in said two or more physically parallel rows. The solar module according to any one of the items.