KR20180135156A - Metal composite and metal tape for shielding electromagnetic wave and electromagnetic radiation - Google Patents

Abstract

The present invention relates to a metal composite for shielding an electromagnetic wave and radiating heat and a metal tape, and more particularly, to a metal composite for shielding an electromagnetic wave and radiating heat, a composite sheet, a composite film or a metal tape using the same, and an electric and electronic component and an electric electronic product using the same, wherein the metal composite comprises a copper foil base layer and a metal layer made of at least one of nickel, cobalt, and tin on one side or both sides of the base layer, wherein the metal layer is provided on the base layer.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a metal composite for electromagnetic wave shielding and heat dissipation,

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a metal composite for electromagnetic shielding and heat radiation and a metal tape and more particularly to a thin metal shielding and heat radiation metal composite material and a metal tape which are provided in electronic equipment and effectively shield electromagnetic waves, It is about.

In recent years, electronic devices and electronic components have become more compact, slimmer, and multifunctional, and the degree of integration of electronic devices has increased, and the amount of heat generated by electronic devices operating by electrical energy has also increased. BACKGROUND ART [0002] Heat generated in electronic devices is accumulated in electronic devices to reduce the operating life of electronic devices. Therefore, there is a growing demand for heat dissipating properties that effectively dissipate and dissipate heat generated in electronic devices. In addition, electromagnetic waves generated as the directivity of the electronic device increases, and such electromagnetic waves leak to the outside through joints, adhesive portions, and the like of the electronic device and cause malfunction of other electronic devices or electronic components, It has been reported that there are harmful effects such as weakening of human immune function.

Conventional electromagnetic shielding materials are made of conductive mesh, conductive fibers, conductive rubber or the like by adding metals (iron, copper, nickel, cobalt, etc.) to plastics. This shields or reflects electromagnetic waves to avoid direct influence from electromagnetic waves However, there is a problem that the shielding ability is deteriorated when the electromagnetic environment is maintained. In addition, the electromagnetic wave shielding material has a merit only for shielding and absorbing electromagnetic waves, and has a drawback in that heat generated from the electromagnetic shielding material itself can not be efficiently dissipated.

On the other hand, Korean Patent Registration No. 10-1034456 discloses an electromagnetic wave shielding and heat insulating tape comprising pore-forming silica and organic polymer coated with an organic polymer. However, since it contains pore-forming silica, And when it is made into a sheet form, it is a problem because it has a partial physical property difference due to silica.

As a result, various studies have been made on materials having properties of effectively dissipating and dissipating heat generated from electronic devices and dissipating them, as well as effectively shielding and absorbing electromagnetic waves generated in electronic devices.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electromagnetic shielding and heat-dissipating metal complex exhibiting eco-friendly and improved thermal conductivity with little corrosion and a composite sheet, a composite film or a metal tape using the same.

Another object of the present invention is to provide an electrical component comprising the metal composite and a composite sheet, a composite film or a metal tape using the metal composite, and a further object of the present invention is to provide a metal composite and a composite sheet, And to provide the obtained electronic product.

It is a further object of the present invention to provide a method for improving the thermal conductivity by providing a long-term stability to the electromagnetic wave shielding property using a metal having low corrosion and providing a thickness range of a preferable metal layer, And a composite sheet, a composite film or a metal tape using the metal composite.

In order to achieve the above object, the present invention provides a semiconductor device comprising a copper foil base layer and a metal layer composed of at least one of nickel, cobalt and tin on one or both surfaces of the base layer, A metal composite for electromagnetic wave shielding and heat radiation and a metal tape are provided.

In the present invention, a metal layer may be provided on one side or both sides of the base layer, and a point-adhesive layer may be further formed on one or both sides of the metal layer.

In one embodiment of the present invention, the thermal conductivity of the metal complex may be between 300 W / mK and 400 W / mK, the thickness of the base layer may be between 5 μm and 300 μm, and the thickness of the metal layer may be between 0.03 μm and 10 Mu m.

The present invention also provides that the thickness of the metal layer with respect to the total thickness of the metal composite is 0.5% to 25%, and the base layer is an electrolytic copper foil or rolled copper foil.

And a plurality of protrusions protruding from the both surfaces of the base layer to the upper portion of the base layer, wherein the metal layer is provided to cover the protrusions.

The electromagnetic wave shielding and heat radiation metal tape of the present invention comprises: a copper foil base layer; A metal layer provided on one or both surfaces of the base layer and made of at least one of nickel, cobalt and tin; And a pressure-sensitive adhesive layer provided on one side or both sides of the metal layer, wherein the metal layer is provided in direct contact with the base layer, and the pressure-sensitive adhesive layer is made of an acrylic type, a silicone type, an epoxy type, a urethane type, , And a polyimide-based one.

Wherein the point adhesive layer further comprises a conductive powder, The electromagnetic wave shielding and heat radiation metal tape has a thermal conductivity of 50 W / mK to 350 W / mK, and may have a different thermal conductivity depending on the thickness of the metal layer and the thickness of the pressure-sensitive adhesive layer.

Also, the conductive powder contained in the conductive point adhesive includes at least one selected from the group consisting of Ni, Cu, Ag and Ag-coated Cu, and the conductive powder contains 0.1 to 20% by weight in the conductive point- .

The base layer may have a thickness of 5 to 300 탆, the metal layer may have a thickness of 0.03 to 10 탆, and the metal layer may have a thickness of 0.5 to 25% with respect to the total thickness of the metal tape.

The present invention may also be embodied in the form of a metal composite for electronic shielding and heat dissipation including the metal composite, a composite sheet using the same, a composite film or a metal tape, a metal tape, and electric and electronic parts using the same.

As described above, according to the present invention, it is possible to provide an electromagnetic shielding and heat-dissipating metal complex exhibiting eco-friendly and improved thermal conductivity with little corrosion, and a composite sheet, a composite film or a metal tape using the same.

Another object of the present invention is to provide a metal composite and a composite sheet, a composite film or a metal tape using the metal composite and a composite sheet using the metal composite, Can be obtained.

Further, according to the present invention, it is possible to provide a metal complex having excellent electromagnetic wave shielding property and heat dissipation property by providing a long-term stability against electromagnetic wave shielding property by using a metal with low corrosion, And a composite sheet, a composite film or a metal tape using the same.

1 shows a structure of a metal complex for electromagnetic wave shielding and heat radiation according to an embodiment of the present invention.
2 illustrates a cross-sectional view of a base layer in accordance with one embodiment of the present invention.
FIG. 3 illustrates anchoring of a protrusion according to an embodiment of the present invention. Referring to FIG.
FIG. 4 illustrates etching of a protrusion according to an embodiment of the present invention. Referring to FIG.
FIG. 5 illustrates the implementation of thermal diffusivity using a hot disk method according to an embodiment of the present invention. Referring to FIG.
Figure 6 is a photograph taken during Sn / Cu / Sn specimen measurement to measure the surface resistance according to one embodiment of the present invention.

The present invention provides a semiconductor device comprising a copper foil base layer for heat dissipation and a metal layer composed of at least one of nickel, cobalt and tin on one surface or both surfaces of the base layer, wherein the metal layer is provided in direct contact with the base layer, A heat-dissipating metal complex is provided.

In the present invention, a metal layer may be provided on one side or both sides of the base layer, and a point-adhesive layer may be further formed on one or both sides of the metal layer.

In one embodiment of the present invention, the metal composite has a thermal conductivity of 300 W / mK to 400 W / mK, and the thickness of the base layer is not particularly limited and may be varied according to need Preferably, the base layer has a thickness of 5 to 300 탆, and the thickness of the metal layer may be 0.0 to 10 탆.

In the present invention, in order to use a continuous manufacturing method by a roll-to-roll method in a method of plating a metal layer on a base layer, it is preferable to use a copper foil having a thickness of less than 300 μm. The copper foil can be produced in the form of a sheet and roll roll, but can be produced using a roll-to-roll equipment in order to efficiently mass-produce the copper foil. When the thickness of the copper foil is more than 300 탆 in the course of using the roll-to-roll equipment in manufacturing the copper foil, the driving property of the equipment is lowered and the productivity is decreased, and curl or the like is generated in the copper foil, have. If the thickness of the copper foil is less than 5 mu m, the copper foil may be torn or wrinkled due to roll-to-roll equipment, resulting in poor workability.

In one embodiment of the present invention, the thickness of the metal layer with respect to the total thickness of the metal complex may be 0.5% to 25%, and the metal complex for electromagnetic wave shielding and heat radiation has a thermal conductivity of 300W / mK to 400W / mK , And the thermal conductivity may be varied according to the thickness of the metal layer.

A method for producing a copper foil or a metal composite including the plating layer of nickel, cobalt and tin is as follows. The prepared copper foil or metal composite can be produced by including one or more of nickel, cobalt or tin on one surface or both surfaces, preferably by electrolytic or electroless plating.

In one embodiment of the invention, the plating method of nickel, cobalt and tin is possible using all known nickel, cobalt and tin plating methods. Electrolytic plating, electroless plating, and hot-dip plating. Alternatively, at least one of the nickel, cobalt, and tin may be provided on one side or both sides of the copper foil or the metal complex by vapor deposition or sputtering, but is not limited thereto.

More specifically, the novel electromagnetic wave shielding and heat-radiating metal composite according to the present invention has a structure in which a metal layer is plated on one side or both sides of the copper foil while the copper foil is used as a base layer, and the metal layer is made of at least one of nickel, tin and cobalt And the like.

The metal layer according to the present invention can be further surface treated. For example, the surface treatment may include a silane coupling treatment. When the silane coupling treatment is performed, the interface between the metal layer and the adhesive layer provided on the metal layer and the interface made of dissimilar materials The adhesion can be improved.

In one embodiment of the present invention, the base layer may include an electrolytic copper foil or a rolled copper foil, and may include a plurality of protrusions protruding from the one side or both sides of the base layer to the top of the base layer. The metal layer may be formed to cover the protrusion entirely so that the protrusion is not exposed to the outside. The protrusion may be anchoring or etching. The protrusions can increase the surface area of the contact portion in the base layer, thereby reducing the surface resistance and increasing the electrical conductivity. The metal complex may be implemented in various forms, for example, a composite sheet using the metal complex, a composite film, a metal tape, or the like.

The electromagnetic wave shielding and heat radiation metal tape of the present invention comprises: a copper foil base layer; A metal layer made of one or more of nickel, cobalt, and tin on one surface or both surfaces of the base layer; And a pressure-sensitive adhesive layer provided on one side or both sides of the metal layer, wherein the metal layer is provided in direct contact with the base layer, and the pressure-sensitive adhesive layer is made of an acrylic type, a silicone type, an epoxy type, a urethane type, , And a polyimide-based adhesive, wherein the adhesive layer comprises a conductive adhesive, and the conductive adhesive includes a conductive powder.

The electromagnetic wave shielding and heat radiation metal tape has a thermal conductivity of 50 W / mK to 350 W / mK, and may have a different thermal conductivity depending on the thickness of the metal layer and the thickness of the pressure-sensitive adhesive layer.

Also, the conductive powder contained in the conductive point adhesive includes at least one selected from the group consisting of Ni, Cu, Ag and Ag-coated Cu, and the conductive powder contains 0.1 to 20% by weight in the conductive point- .

The base layer may have a thickness of 5 to 300 탆, the metal layer may have a thickness of 0.03 to 10 탆, and the metal layer may have a thickness of 0.5 to 25% with respect to the total thickness of the metal tape.

Specifically, the metal complex and the metal tape can be used as part of electric / electronic parts or in electric / electronic products.

More specifically, the metal complex and the metal tape include the base layer and the metal layer, and the metal complex and the metal tape may be part of the electric / electronic part or used in the electric / electronic product.

The electric / electronic part of the present invention may be a battery, a motor, an IC chip, or the like, but the present invention is not limited thereto, and any type of heat dissipation may be used in the art.

The electronic product of the present invention may also be a thin film flat panel display device such as a flat panel TV, a portable electronic device such as a smart phone, a smart pad, and the like, but is not limited thereto and may be any device that requires heat dissipation in the related art.

For example, the electronic product may be a flexible display device such as a flexible television. The metal tape has excellent flexibility and can be widely used in electronic products requiring flexibility.

Hereinafter, the present invention will be described in detail with reference to examples. It will be apparent, however, to one skilled in the art that the scope of the present invention is not limited to the following embodiments in accordance with the gist of the present invention.

Formation of metal composites and metal tapes

Example  One.

The surface of the copper foil was plated with a metal layer under the following conditions. A 35 탆 thick rolled copper foil (C1100 type) was immersed in 100 g / l sulfuric acid for 5 seconds, pickled, washed with distilled water, and then coated with NiSO ₄ .6H ₂ O 300 g / l and HBO ₃ 30 g / l, a temperature of 30 ° C, a current density of 5 A / dm ² , and a pH of 3.5.

Example  2.

The surface of the copper foil was plated with a metal layer under the following conditions. (CH ₃ SO ₃ ) ₂ Sn concentration of 100 g / l on the surface of both surfaces of the copper foil after immersing the copper foil (C1100 series) having a thickness of 35 탆 in 100 g / l sulfuric acid for 5 seconds, pickling treatment, A SH ₃ concentration of 3 g / l, a CH ₃ SO ₃ H concentration of 30 g / l, a temperature of 30 ° C, a current density of 10 A / dm ² and a pH of 3.5.

Example  3.

And is, were prepared in the same manner as in Example 1, except that the zinc-coated metal used in that CoSO ₄ · 5H ₂ O.

Example  4.

50 g of ethyl acetate (Samcheon Chemical), 1.5 wt% of Ni powder and 1 wt% of a curing agent (ACKEMECHT X300) were weighed and mixed with 110 g of a 40 wt% acrylic adhesive (ACKEMECHTEK P-120H) For 30 minutes, and about 25 wt% by weight was used as the solid content. Next, a 50 탆 -thick releasable PET film (SKC SG31) was applied to a thickness of 60 탆 by using an applicator, and then dried in an oven at 110 캜 for 2 minutes to obtain a conductive pressure-sensitive adhesive layer of about 15 탆 after drying. Lastly, a 36 占 퐉 Ni / Cu / Ni rolled copper foil was transferred to a metal tape having a total thickness of 51 占 퐉.

Example  5.

The procedure of Example 4 was repeated except that the rolled copper foil was Sn / Cu / Sn.

Example  6.

The procedure of Example 4 was repeated except that the rolled copper foil was Co / Cu / Co.

Comparative Example  One.

A copper foil was prepared in the same manner as in Example 1, except that the rolled copper foil was made of unplated Cu.

Comparative Example  2.

A copper foil was prepared in the same manner as in Example 4, except that uncoated Cu was used as the rolled copper foil.

Metal tapes were prepared through the examples of the present invention, and conditions for plating each sheet were shown in Table 1 below. (See FIG. 1)

metal Plating solution Plating solution concentration (g / l) HBO ₃ concentration (g / l) Temperature (℃) Current density (A / dm2) Thickness (㎛) SH ₃  Concentration (g / l) nickel NiSO ₄ .6H ₂ O 300 30 30 5 0.5 - cobalt CoSO ₄ · 5H ₂ O 300 30 30 5 0.5 - Remark (CH ₃ SO ₃ ) ₂ Sn 100 CH ₃ SO ₃ H concentration (g / l) 30 10 0.5 3 30

The purpose of plating the nickel of the present invention is to prevent copper foil corrosion and the purpose of tin plating is to derive the low resistance value of the surface and the purpose of plating the cobalt is to treat the blackening of the surface, .

The 26 metal layers thus obtained are shown in Table 2, and they were made of metal tape.

number metal number metal One Cu 14 Ni / Co / Cu / Ni 2 Ni / Cu 15 Ni / Co / Cu / Co 3 Sn / Cu 16 Ni / Co / Cu / Sn 4 Co / Cu 17 Sn / Co / Cu / Sn 5 Ni / Cu / Ni 18 Sn / Co / Cu / Co 6 Sn / Cu / Sn 19 Sn / Co / Cu / Ni 7 Co / Cu / Co 20 Ni / Sn / Co / Cu / Ni 8 Ni / Cu / Sn 21 Ni / Sn / Co / Cu / Sn 9 Ni / Cu / Co 22 Ni / Sn / Co / Cu / Co 10 Sn / Cu / Co 23 Ni / Sn / Co / Cu / Ni / Sn 11 Ni / Sn / Cu / Ni 24 Ni / Sn / Co / Cu / Ni / Co 12 Ni / Sn / Cu / Sn 25 Ni / Sn / Co / Cu / Sn / Co 13 Ni / Sn / Cu / Co 26 Ni / Sn / Co / Cu / Ni / Sn / Co / : To distinguish one side or both sides of base layer and metal layer

Evaluation example  One. Thermal diffusivity  evaluation

The thermal diffusivity of the electromagnetic wave shielding and heat-radiating metallic tape manufactured in the examples was evaluated by the hot disk method according to the measurement standard of ISO 22007-2. The measuring instrument used was the TPS 2500S (Hot Disk, Sweden).

In the hot disk method, the analytical specimen is prepared at 70 x 70 (mm), the sample is directly contacted to the 7577 type sensor including the heater, the heating power is 0.1 W, the measuring time is 2 seconds And the thermal conductivity and thermal conductivity were calculated. In this case, a sample size of 70 x 70 (mm) 72 μm or more (measured with a specimen in the case of a lower thickness) was used, and a slab mode was used to measure a part of the measurement results as shown in Table 3 below .

number metal Thermal conductivity (W / mK ) number metal Thermal conductivity (W / mK ) One Cu 400.0 14 Ni / Co / Cu / Ni 386.9 2 Ni / Cu 395.4 15 Ni / Co / Cu / Co 386.8 3 Sn / Cu 395.2 16 Ni / Co / Cu / Sn 386.7 4 Co / Cu 395.3 17 Sn / Co / Cu / Sn 386.3 5 Ni / Cu / Ni 391.2 18 Sn / Co / Cu / Co 386.3 6 Sn / Cu / Sn 390.7 19 Sn / Co / Cu / Ni 386.7 7 Co / Cu / Co 390.8 20 Ni / Sn / Co / Cu / Ni 382.4 8 Ni / Cu / Sn 390.9 21 Ni / Sn / Co / Cu / Sn 382.2 9 Ni / Cu / Co 391.0 22 Ni / Sn / Co / Cu / Co 382.2 10 Sn / Cu / Co 390.7 23 Ni / Sn / Co / Cu / Ni / Sn 378.2 11 Ni / Sn / Cu / Ni 386.7 24 Ni / Sn / Co / Cu / Ni / Co 378.3 12 Ni / Sn / Cu / Sn 386.4 25 Ni / Sn / Co / Cu / Sn / Co 378.0 13 Ni / Sn / Cu / Co 386.7 26 Ni / Sn / Co / Cu / Ni / Sn / Co 374.1 / : To distinguish one side or both sides of base layer and metal layer

Evaluation example 2.

( 1) Electromagnetic waves  Evaluation of shielding property

The electromagnetic wave shielding characteristics of the metal tape on the electromagnetic wave shielding and heat dissipating metal composite and the metal tape manufactured in the examples were measured using a network analyzer (Agilent, E8364A). The value of a predetermined electrical signal applied to the metal tape and the value of an electrical signal reflected from the metal tape were measured and the shielding ratio was calculated from the ratio. For example, if the applied signal is fully reflected, the shielding rate is 100%. The possible metal tapes according to the present invention are shown in the examples, and the comparative examples are shown in Table 4 in which the conductive point adhesive layer alone was used, and the base layer and the conductive point adhesive layer were mixed.

number metal Surface resistance (Ω / sq) number metal Surface resistance (Ω / sq) One Cu 0.002 14 Ni / Co / Cu / Ni 0.002 2 Ni / Cu 0.002 15 Ni / Co / Cu / Co 0.003 3 Sn / Cu 0.001 16 Ni / Co / Cu / Sn 0.002 4 Co / Cu 0.003 17 Sn / Co / Cu / Sn 0.001 5 Ni / Cu / Ni 0.002 18 Sn / Co / Cu / Co 0.003 6 Sn / Cu / Sn 0.001 19 Sn / Co / Cu / Ni 0.002 7 Co / Cu / Co 0.003 20 Ni / Sn / Co / Cu / Ni 0.002 8 Ni / Cu / Sn 0.002 21 Ni / Sn / Co / Cu / Sn 0.002 9 Ni / Cu / Co 0.002 22 Ni / Sn / Co / Cu / Co 0.003 10 Sn / Cu / Co 0.002 23 Ni / Sn / Co / Cu / Ni / Sn 0.002 11 Ni / Sn / Cu / Ni 0.002 24 Ni / Sn / Co / Cu / Ni / Co 0.003 12 Ni / Sn / Cu / Sn 0.001 25 Ni / Sn / Co / Cu / Sn / Co 0.002 13 Ni / Sn / Cu / Co 0.002 26 Ni / Sn / Co / Cu / Ni / Sn / Co 0.004 / : To distinguish one side or both sides of base layer and metal layer

With respect to Table 4, the surface resistance of the metal tape before and after the plating was measured at room temperature before the occurrence of oxidation on the surface of the copper foil was measured 30 times, and the average value thereof was shown.

As a result, it has been found that the value represented by 0.001? To 0.004? Is a low level of surface resistance, and a high shielding ratio is obtained because the electrical conductivity is increased when the surface resistance is low.

( 2) Thermal diffusivity  And electromagnetic shielding Example / Comparative Example  Comparative Analysis and Evaluation

Example / Comparative Example metal Thermal conductivity (W / mK ) Surface Resistance (Ω) Shielding Effectiveness (dB) A B A B A B Example 1 Ni / Cu / Ni 391.2 391.0 0.002 0.003 82.95 81.12 Example 2 Sn / Cu / Sn 390.7 390.5 0.001 0.001 83.64 83.05 Example 3 Co / Cu / Co 390.8 390.7 0.003 0.005 81.77 80.10 Comparative Example 1 Cu 400.0 399.8 0.002 0.010 82.01 79.92 A: room temperature B: temperature 50 ° C, humidity 95% 120 hours

In the present invention, A (normal temperature) state The thermal conductivity values of Examples 1 to 3 were confirmed to be about 2.5% when they were compared with the thermal conductivity values of Comparative Example 1.

These results show that the thermal conductivity of Ni, Sn and Co is as low as 100 W / mk or less, which is lower than that of the composite of Cu with the metal, This is due to the fact that the value is high.

The thermal conductivity values of Examples 1 to 3 and the thermal conductivity values of Comparative Example 1 were not greatly changed, so that the thermal conductivity values of the raw materials themselves were not affected by surface oxidation It can be confirmed that it is maintained. Furthermore, in the case of the B state Comparative Example 1, there was no oxidation preventing layer in the surface resistance, so that the Cu surface oxidation occurred, and it was confirmed that the surface resistance value of Examples 1 to 3 was largely changed.

In addition, the shielding performance of the copper foil is superior to that of the copper foil, so both A and B states are found to be high values, and the rate of change due to surface oxidation is small. Specifically, the numerical values of Examples 1 to 3 and Comparative Example 1 were found to be EMI shielding values of 99% or more.

Therefore, in Examples 1 to 3, nickel (Ni), tin (Sn), and cobalt (Co) layers were formed on the Cu surface to prevent oxidation of the Cu surface. As a result, it is possible to suppress the increase of the surface resistance value compared to the heat radiation performance reduction width, and it is confirmed that the plating effect is excellent.

Evaluation example  3. Evaluation of change of surface resistance value of metal tape applied with conductive adhesive

Example / Comparative Example Detailed structure A (Ω) B Example 4 Ni / Cu / Ni + conductive adhesive 0.015 O Example 5 Sn / Cu / Sn + conductive adhesive 0.007 O Example 6 Co / Cu / Co + Conductive Adhesive 0.021 X Comparative Example 2 Cu + conductive adhesive 0.022 X A: room temperature B: temperature 50 ° C, humidity 95%
O: Less than 50% increase in A state surface resistance
X: B state In case of more than 100% increase in surface resistance

The present invention shows the change of the surface resistance value in the state A and the state B by coating the conductive adhesive in the layer of the metal tape by the methods of Examples 4 to 6 and Comparative Example 2. More specifically, in Examples 4 to 5, the resistance value was stable even in the state B as compared to the state A, whereas in Example 6, the resistance value was measured to be high, so that Co plating effect was insufficient. In the case of Comparative Example 2, the conductive adhesive was reacted with the oxide film formed on the Cu interface due to oxidation on the Cu surface in the state B as in Example 6, and the conductive adhesive gradually changed with time. Therefore, in the case of Comparative Example 2, it was confirmed that the rate of change of the surface resistance value was greatly increased, making it difficult to apply the conductive adhesive.

Therefore, it was confirmed that Ni> Sn> Co> Cu in the order of Ni> Sn> Co> Cu in the order of Sn> Ni> Co> Cu.

Substantially the same electromagnetic wave shielding property was obtained even when an electrolytic copper foil of the same thickness was used in place of the rolled copper foil in the production of the metal tape of the examples. The rolled copper foil is not particularly limited as long as it is commercially available.

10:
20: Anchoring
30: Etching
100: base layer.
200: metal layer

Claims (20)

A copper foil base layer; And
And a metal layer made of one or more of nickel, cobalt, and tin on one side or both sides of the base layer,
Wherein the metal layer is in direct contact with the base layer. The method according to claim 1,
The metal complex for electromagnetic wave shielding and heat dissipation according to claim 1, further comprising a metal layer on one side or both sides of the base layer, and a point adhesive layer on one or both sides of the metal layer. The method according to claim 1,
Wherein the metal composite has a thermal conductivity of 300 W / mK to 400 W / mK. The method according to claim 1,
Wherein the base layer has a thickness of 5 to 300 占 퐉. The method according to claim 1,
Wherein the metal layer has a thickness of 0.03 탆 to 10 탆. The method according to claim 1,
Wherein the thickness of the metal layer with respect to the total thickness of the metal composite body is 0.5% to 25%. The method according to claim 1,
Wherein the base layer is an electrolytic copper foil or a rolled copper foil. The method according to claim 1,
And a plurality of protrusions protruding from the both sides of the base layer to an upper portion of the base layer, wherein the metal layer covers the protrusions. 9. An electric and electronic device for shielding and heat-dissipating electromagnetic waves comprising a metal composite according to any one of claims 1 to 8. An electronic product employing the metal composite according to any one of claims 1 to 8. A copper foil base layer;
A metal layer made of one or more of nickel, cobalt, and tin on one surface or both surfaces of the base layer; And
And a pressure-sensitive adhesive layer provided on one or both surfaces of the metal layer,
Wherein the metal layer is provided in direct contact with the base layer,
Wherein the point adhesive layer is at least one selected from acrylic, silicone, epoxy, urethane, polyester, and polyimide. 12. The method of claim 11,
Wherein the pressure-sensitive adhesive layer further comprises a conductive powder. 12. The method of claim 11,
The electromagnetic wave shielding and heat radiation metal tape has a thermal conductivity of 50 W / mK to 350 W / mK,
Wherein the metal layer has a different thermal conductivity depending on the thickness of the metal layer and the thickness of the pressure-sensitive adhesive layer. 12. The method of claim 11,
Wherein the conductive paste contained in the conductive point adhesive includes at least one selected from the group consisting of Ni, Cu, Ag and Ag-coated Cu. 12. The method of claim 11,
Wherein the conductive powder comprises 0.1 wt% to 20 wt% in the conductive point adhesive. 12. The method of claim 11,
Wherein the base layer has a thickness of 5 to 300 占 퐉. 12. The method of claim 11,
Wherein the metal layer has a thickness of 0.03 mu m to 10 mu m. 12. The method of claim 11,
Wherein the thickness of the metal layer with respect to the total thickness of the metal tape is 0.5% to 25%. An electric and electronic device for shielding and radiating electromagnetic waves, comprising the metal tape according to any one of claims 11 to 18. An electronic product employing the metal tape according to any one of claims 11 to 18.

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