KR101375237B1 - The fabrication method of thin electromagnetic shield film and electromagnetic shield film thereby - Google Patents

Abstract

The present invention relates to a fabrication method of a thin electromagnetic shielding film and an electromagnetic shielding film fabricated thereby for suppressing or reflecting electromagnetic waves irradiated from electronics. The fabrication method comprises: a protective film forming step for forming a protective film with an adhesion layer that enables detachment of the protective film on a polymer film or a reinforcing film made of polymer sheet; a polymer film attaching step for attaching with the protective film by adhering a polymer film group or sheet that is thinner than the reinforcing film to an adhesion layer of the protective film; a primer layer forming step for forming a primer layer by coating the thin polymer film with crosslinking resin; and a conductive layer forming step for forming a conductive layer by forming an under-layer for plating on the primer layer through physical vapor deposition (PVD) and then forming a plated layer on the under-layer for plating, thereby acquiring uniform adhesion between a base made of the polymer film and a metal layer through the primer layer formed by coating of the crosslinking resin and etc., thus achieving high electromagnetic shielding characteristics.

Description

The fabrication method of thin electromagnetic shield film and electromagnetic shield film thereby

The present invention relates to a method for manufacturing a thin metallized film for electromagnetic wave shielding and a metallized film thereby, in detail, a thin electromagnetic wave shielding film by a protective film forming step, a polymer film laminating step, a primer layer forming step and a conductive layer forming step. The present invention relates to a method of manufacturing a thin metallized film for electromagnetic wave shielding and a metallized film thereby, to protect electromagnetic noise generated or emitted from an electronic product or static electricity flowing around the electronic product.

Due to the small size, high integration, and harmfulness of the human body due to electromagnetic waves generated from electronic equipment, electronic wiring and electric cables due to high frequency of use, electromagnetic noise generated from the outside, and instability of electronic products, And there is a growing demand for measures to achieve this appropriately. In accordance with these interests and demands, various metallized films that are used as materials for FPC (Flexible Printed Circuit) and conductive tape are being developed. Here, the term " metallized film " means that a conductive film is formed on a polymer film or a polymer coating layer.

As a conventional method for producing such a metallized film, there is a method for producing a metallized film using a rolled copper foil, which comprises laminating a rolled copper foil with a rolled copper foil with a polymer film coated with a molten polymer or an adhesive as an adhesive. This manufacturing method is a technique having a low technical barrier in terms of manufacturing technology, but is widely used because it can obtain a high adhesion force by the adhesive. Applying the thinnest 9㎛ thickness of the metal foil can produce a metallized film having a thickness of about 40㎛.

Another manufacturing method is a method of manufacturing a metallized film using a process combining a physical vacuum deposition (PVD) method and a wet plating method. This step is a step of forming a plating base layer on a polymer film by using a physical vacuum vapor deposition (PVD) method, and forming a conductive layer by an electroplating method in the wet plating method using the plating base layer, A fire film can be produced. In this process, Ni / Cr alloy is mainly used by sputtering method having high heat and kinetic energy among physical vacuum deposition methods in order to improve the adhesion between the substrate and the metal layer, which are composed of a polymer film, as a base plated layer. There is a disadvantage of uneven adhesion and a high manufacturing cost due to the sputtering process, but it is possible to manufacture a relatively thin metallized film. Taking advantage of this feature, it is used as a material for a single-sided FPC (Flexible Printed Circuit).

There is a method of producing a metallized film using only a wet plating method (an electroless plating method and an electroplating method). This manufacturing method can form a metalized film by forming a plating base layer through a pretreatment process including a surface modification process of a polymer film and a catalyst treatment process and then forming a metal layer through an electroless plating method and an electroplating method . Such a manufacturing method is characterized by a low manufacturing production unit cost, but it has problems in terms of adhesion and application problems (for example, since a circuit is formed on a printed circuit board (PCB) and is not completely etched by the metallization film, There is a problem that circuit breakage occurs (circuit migration).

When a metallized film having a thickness of 10 탆 or less is formed by using the above-described manufacturing methods, the wrinkles or the like of the metallized film due to the temperature occurring in the process of bonding the metal foil and the adhesive layer and the process of depositing the plating underlying layer using the sputtering method There is a problem such that a yield is lowered due to unevenness (coating pattern), a high production cost due to an uneven adhesion between the metal layer and the film, and the like.

Korean Patent No. 10-0990154 Korean Patent No. 10-1003317

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object thereof is to surround electromagnetic equipment generated from or emitted by electronic products such as electronic devices, electronic components, electronic wiring, and electric cables, or equipment containing electronic devices. Thin metallized film for electromagnetic shielding to solve and improve the adhesion between the non-uniform metal layer and the film, low production yield and high manufacturing production cost, which are problems of the conventional shielding film made of metallized film as a countermeasure against static electricity flowing in the To provide a method for producing and a metallized film thereby.

In order to achieve the object as described above, the method of manufacturing a thin metallized film for electromagnetic wave shielding of the present invention, in the electromagnetic shielding film manufacturing process for suppressing or reflecting electromagnetic noise emitted from an electronic product, a polymer film or a polymer sheet A protective film forming step of forming a protective film so as to form a pressure-sensitive adhesive layer on the configured reinforcing film; A polymer film laminating step of laminating a single layer or a sheet of a polymer film thinner than a reinforcing film to the adhesive layer of the protective film and laminating the protective film; A primer layer forming step of forming a primer layer by coating a crosslinkable resin on the thin polymer film; And a conductive layer forming step of forming a base layer for plating by physical vacuum deposition (PVD) on the primer layer and forming a conductive layer by plating on the base layer for plating. Doing.

In addition, the adhesive layer formed on the reinforcement film of the protective film is formed of an acrylic resin or an epoxy resin, the polymer film or sheet of the reinforcement film is polyethylene terephthalate (PET), polyimide (PI), polyamide (polyamide) ), Polyphenylene sulfide (PPS), polypropylene (PP), polyethylene (PE) made of any one material, the thickness of the polymer film or sheet of the reinforcing film is preferably 25 ~ 200㎛.

In addition, the sheet or sheet of the thin polymer film is polyethylene terephthalate (PET), polyimide (PI), polyamide (polyamide), polyphenylene sulfide (PPS), polypropylene (PP), polyethylene (PE), foaming It is preferably made of any one of polyethylene terephthalate (PET) and expanded polypropylene (PP), and the thickness of the single-piece or sheet of the thin polymer film is preferably 1 to 15 µm.

In addition, the primer layer is formed by coating with a crosslinkable resin or a crosslinked resin cured product, and the crosslinkable resin cured product obtained by adding 1 to 50% by weight of a crosslinking component to a saturated polyester resin based on 100% by weight. It is a polyester crosslinkable resin hardened | cured material, The said crosslinking component is any one of a melamine resin, a polytubular isocyanate compound, an acrylic resin, and an epoxy compound which has 1 or 2 or more polymerizable unsaturated bonds in a molecule | numerator, and the thickness of the said primer layer It is preferable that it is 0.1-4 micrometers.

In addition, the plating layer forming the conductive layer is made of electroplating or electroless plating, and when the conductive layer is formed by physical vacuum deposition (PVD) and electroplating, the base for plating by the physical vacuum deposition (PVD) After depositing a copper layer or a silver layer as a layer, it is preferable to form an electrically conductive layer by electroplating copper to the said copper layer or silver layer.

In addition, after forming the conductive layer by physical vacuum deposition (PVD) and electroless plating, it is preferable to perform electroplating with copper on the conductive layer.

In addition, it is preferable to form a nickel layer on the conductive layer by plating to prevent corrosion of the copper layer as the conductive layer.

Moreover, it is preferable that the thickness of the vapor deposition metal layer of the said base layer for plating is 5-150 nm.

Another feature is to use a thin metallized film for electromagnetic wave shielding produced by the above-described manufacturing method.

According to the method for producing a thin metallized film for electromagnetic wave shield of the present invention and the metallized film thereby, high electromagnetic wave shielding with a uniform adhesion between the substrate and the metal layer made of a polymer film by a primer layer formed by coating a crosslinkable resin or the like. There is an effect that can get the characteristics.

In addition, the electromagnetic wave shielding film of the present invention, which includes a thin metallized film having high electrical conductivity, can use the flexibility and high tensile strength, which are inherent in the polymer film. It has the effect of being able to adhere to the edge of the electric cable with high flexibility.

In addition, there is an effect that a metallized film used as an electromagnetic wave shielding film can be manufactured using a substrate made of a thin polymer film.

1 is a longitudinal sectional view showing a laminated structure of a thin metallized film for electromagnetic wave shield according to the present invention;

Hereinafter, a method of manufacturing a thin metallized film for electromagnetic wave shielding according to the present invention and a preferred embodiment of the metallized film thereby will be described in detail with reference to the accompanying drawings. It is to be understood that the present invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to inform.

First, in the present invention, in order to suppress wrinkles and unevenness (coating pattern) of the shielding film which is likely to occur during the process using a thin polymer film, a protective film made of a polymer reinforcement film and an adhesive layer and a thinner polymer film than the reinforcement film Introduce the lamination process to improve the yield of the shielding film, and to provide a separate primer layer for coating a polymer resin to improve the non-uniform adhesion between the substrate and the metal layer made of a polymer film in the shielding film uniform adhesion In order to improve the efficiency of the product, the production of the conductive layer was directly suppressed by introducing a step of directly forming the conductive layer through the substitution reaction by oxidation and reduction reaction, which is an electroless copper plating method.

1 is a longitudinal sectional view showing a laminated structure of a thin metallized film for electromagnetic wave shield according to the present invention.

The method of manufacturing a thin metallized film for electromagnetic wave shielding according to the present invention basically includes a protective film forming step of forming a reinforcing film coated with an adhesive layer, coating the protective film with a polymer film, a crosslinkable resin, and the like. It consists of a primer layer forming step and a conductive layer forming step of coating a metal by vacuum deposition and plating, as shown in Figure 1 by this manufacturing method, the protective film (1) and the primer layer (2) and The conductive layers 3 are sequentially stacked to form the thin metallized film for electromagnetic shielding of the present invention.

In the protective film forming step, the reinforcing film coated with the pressure-sensitive adhesive layer may be a polyethylene terephthalate (PET) film, a polyimide (PI) film, a polyamide film, a polyphenylene sulfide (PPS) (PP) film, a polyethylene (PE) film or the like, or a polymer sheet is used. For example, when using a polyethylene terephthalate (PET) film, it is most preferable to make the thickness into the range of 25-200 micrometers, especially the range of 38-100 micrometers. The reason is that the processability and productivity of the shielding film are deteriorated due to the flexibility of the polymer film at a thickness of 25 μm or less or the rigidity of the polymer film at a thickness of 200 μm or more.

The adhesive layer applied to the reinforcing film is required to have cohesiveness and chemical resistance of the adhesive layer in order to prevent deterioration of properties due to penetration of the plating solution occurring in the plating process. , The process characteristics that must be stripped without residues of the adhesive layer on the electronic device / electrical cable. In order to satisfy these characteristics, for example, an acrylic resin or an epoxy resin can be used as the adhesive layer.

In the lamination step of laminating a polymer film thinner than the reinforcement film by an adhesive layer applied to the reinforcement film of the protective film, the polymer film is a polyethylene terephthalate (PET) film, a polyimide (PI) film, a polyamide ( Polyfoam (polyamide) film, polyphenylene sulfide (PPS) film, polypropylene (PP) film, polyethylene (PE) film, other than the single film or sheet of polymer film, foamed polyethylene terephthalate (PET) film, polypropylene (PP) There is a film and the like, and considering the electrical insulation, heat resistance, chemical resistance, mechanical properties, etc. of the application to be used properly. As thickness of the said thin polymer film, the range of 1-15 micrometers is preferable.

As a primer layer formed by coating on a protective film base made of a polymer film, a crosslinkable resin such as an unsaturated polyester resin, a multi-tube acrylic resin, a melamine resin, and a polyurethane resin, which is generally known as a thermosetting or ultraviolet hardening resin, A cured product of a crosslinkable resin obtained by compounding such a crosslinkable resin with a saturated polyester resin, an acrylic resin or the like is used. Since the primer layer forms a dense resin layer by itself, has a low shrinkage ratio in the subsequent metal layer deposition process, and has a high chemical resistance against acidic or basic, it is difficult to remove the primer layer after the plating process for forming the conductive layer. It has uniformity and high adhesion to the adhesive force and contributes to prevention of deterioration of the conductive layer.

According to the method for producing a thin metallized film for electromagnetic wave shielding according to the present invention, among the various kinds of resins used for forming the primer layer, a cured product of a polyester-based crosslinkable resin obtained by adding a crosslinking component to a saturated polyester resin It can be said that the primer layer formed is the most preferable because a high adhesion force can be obtained with the conductive layer.

Examples of the crosslinking component added to the saturated polyester resin for obtaining a high adhesion with the conductive layer include one or more compounds selected from the group consisting of a melamine resin, a multitube isocyanate compound used in combination with an active hydrogen compound, various acrylates, A compound having two or more polymerizable unsaturated bonds. Such a crosslinking component has the effect of significantly improving the adhesion with the conductive layer even in a very small amount. The content of the crosslinking component is preferably 1 to 50% by weight, more preferably 5 to 30% by weight, based on 100% by weight of the saturated polyester resin.

The above-mentioned polyester-based crosslinkable resin was able to obtain a crosslinked resin primer layer having particularly excellent adhesion strength between the substrate of a polyethylene terephthalate (PET) film or the substrate of a polyimide (PI) film.

The crosslinkable resin (composition) as described above may be used as an organic solvent or an aqueous solution as an emulsifying solution, and may be applied / dried on a substrate made of a polymer film, and if necessary, cured by heating or ultraviolet irradiation To form a primer layer of the coated layer. For example, in the case of a polyester-based crosslinkable resin containing a thermally crosslinkable resin such as melamine resin as a crosslinking component, it is preferable to heat and crosslink at 140 to 180 占 폚. The reason is that crosslinking does not occur sufficiently at a temperature of 140 DEG C or less, and crosslinking at a temperature of 180 DEG C or more causes shrinkage of the film due to high temperature depending on the type of the substrate made of the polymer film, There is a problem that formation of a stable coating layer becomes difficult.

The thickness of the primer layer is most preferably in the range of 0.1 to 4 mu m, particularly 0.2 to 2 mu m. The reason for this is that a thickness of less than 0.1 mu m has a problem in that adhesion of the coating layer to the conductive layer is uneven due to shrinkage and unevenness of the coating layer and that the thickness of 4 mu m or more is difficult to exhibit physical properties due to insufficient crosslinking in the resin layer.

A conductive layer is formed on the primer layer (coating layer) formed as described above. The conducting layer, which serves as a conductive layer, is formed using a combination of physical vapor deposition (PVD) and wet plating methods. A ground layer for plating necessary for the plating process is formed using a physical vacuum deposition method. A concrete example can be roughly divided into a process in which a physical vacuum deposition method and an electroless plating method are combined, and a process in which a physical vacuum deposition method and an electroless plating method are combined, and a step of performing electroplating is added.

Among these processes, a combination of a physical vacuum deposition method and an electroless plating method involves depositing a metal layer having a greater metal ionization tendency than metal copper by a physical vacuum deposition method and depositing a metal layer between the metal layer and the copper ion during the electroless plating process using copper A substitution reaction is caused by oxidation and reduction reaction of the metal layer to replace the deposited metal layer to form a conductive layer formed of a copper layer. When a high electrical conductivity is required depending on the application, the conductive layer is formed by electroplating with copper on the electroless plating layer made of copper.

The substitution reaction will be described in detail. The electrons necessary for the substitution reaction are generated by cationizing the metal having a high ionization tendency. The copper ion present in the electroless plating solution by the copper accepts the electron to become the copper metal, and this reaction is defined as the substitution reaction. Since the copper plating layer can be formed directly without the surface modification step and the catalyst treatment step, which are necessary in the electroless plating step by the substitution reaction, the manufacturing cost required for forming the conductive layer by the copper plating layer can be reduced have.

As a specific example of the substitution reaction, tin metal having an ionization tendency higher than copper may be mentioned. When a metal layer is deposited on a primer layer (coating layer) using a physical vacuum deposition method and then electroless plating is performed with copper, a reaction of the following formulas (1) and (2) occurs to form a conductive layer of a copper layer . The thickness of the tin deposition layer is most preferably in the range of 5 to 150 nm, particularly in the range of 20 to 100 nm. The reason for this is that at a thickness of 5 nm or less, the tin amount (number of electrons) needed for a uniform substitution reaction is small and the substitution reaction time is long, resulting in a problem of low production efficiency. In addition, since the life of the plating solution can be shortened by a large amount of tin at a thickness of 150 nm or more, there is a problem that the manufacturing production unit cost is increased in the plating process.

Oxidation of the tin ^{Sn → Sn 2 + + 2e -} (1)

Reduction of copper Cu ² + 2e ^- → Cu (2)

In the process of electroplating the physical vacuum deposition method and the electroless plating method, a copper or silver layer having high electrical conductivity is deposited on the primer layer by physical vacuum deposition and electroless plating, Thereby forming a conductive layer.

In order to suppress the corrosion of the copper layer, which is a conductive layer, depending on the application of the primer layer, a nickel (Ni) layer is formed on the conductive layer by electroplating, and a tin Or an alloy.

Example

Hereinafter, the manufacturing method of the thin metallized film for electromagnetic wave shield of this invention according to an Example and a comparative example is demonstrated concretely.

Example 1

20 weight% of hardening | curing agents were added with respect to 100 weight% of acrylic resin, and it melt | dissolved in 100 weight% of mixed solvents of methyl ethyl ketone (MEK) / ethyl acetate, and obtained the adhesive resin solution. This adhesive resin solution was applied / dried to a polyethylene terephthalate (PET) film (50 μm) with a 100 mesh gravure coater, and then heated and heat dried at 150 ° C. for 10 minutes to form an acrylic adhesive layer having a thickness of about 10 μm on the reinforcing film. Form.

A polyethylene terephthalate (PET) film (4.5 μm) is adhered to the reinforcing film coated with the adhesive layer while applying heat to form a substrate made of a polymer film constituting a thin conductive tape.

10% by weight of melamine and 10% by weight of a curing agent are mixed with respect to 100% by weight of saturated polyester resin, and dissolved in 100% by weight of methyl ethyl ketone (MEK) / ethyl acetate mixed solvent to form a polyester-based crosslinkable resin. A primer solution was obtained. The primer solution was applied / dried to a polyethylene terephthalate (PET) film having a thickness of about 4.5 μm with a 200 mesh gravure coater, and then dried by heating at 150 ° C. for 20 seconds to form a polyester-based crosslinked primer layer having a thickness of about 0.3 μm.

A polyethylene terephthalate (PET) film coated with a primer layer as described above is placed in a vacuum evaporator and a tin deposition layer having a thickness of about 35 nm is deposited in the deposition process.

The tin-deposited polyethylene terephthalate (PET) film is subjected to an acid treatment at a room temperature of 45 ° C. or lower for 0.5 to 2 minutes using a sulfuric acid 5 to 50 ml / l solution, followed by washing with water once or three times after the acid treatment. . Contaminants in the deposited layer are removed and acid treatment is performed with the catalyst role in the plating process. Copper sulfate 5 hydroxide 0.03-0.07 mol / l, sodium hydroxide 0.1-0.5 mol / l, formaldehyde 0.03-0.15 mol / l, ethylene diamine 4 acetate 0.03-0.3 mol / l, 2,2'- dipyridyl primary alcohol 1 to 50 g / l, cyanide 0.240 mg / l, copper sulfate plating solution containing a small amount of fluorine water and benzotriazole, and electroless plating with copper at 35 to 60 ° C. for 2 to 15 minutes, then 1 to Wash with water three times. Electroless plating with copper was followed by electroplating with copper to form thicker copper layers. Copper plating 5 hydroxide 0.03-0.07 mol / l, sulfuric acid 0.1-0.5 mol / l, electroplating by copper for 2-15 minutes at 35-60 degreeC using the electroplating liquid containing surfactant, It washed with water three times and obtained the copper layer.

After plating a thick copper layer, a nickel layer is plated to suppress corrosion of the copper layer. Ammonia water was added to a plating solution containing nickel sulfate 6 hydroxide (sodium citrate dihydrate) 0.02 to 0.2 mol / l, sodium tooth phosphate monohydrate 0.02 to 0.2 mol / l, and a small amount of surfactant, so that the pH was 8.0 to 10.0. After adjusting in the range, electro-nickel plating is performed for 1-2 minutes at 35-60 degreeC. Electroless nickel plating is used to deposit thicker nickel layers. Ammonia water in a plating solution containing 0.02 to 0.2 mol / l of nickel sulfate 6 hydroxide, 0.02 to 0.2 mol / l of citric acid (or sodium citrate dihydrate), 0.02 to 0.2 mol / l of sodium sodium phosphate monohydrate, and a small amount of surfactant After adjusting the pH in the range of 8.0 to 10.0, electroless nickel plating was carried out at 35 to 60 ° C. for 1 to 2 minutes, followed by washing with water twice or three times to obtain the metal surface and the back of the polymer film. The moisture was dried to prepare a thin metallized film for electromagnetic shielding of the present invention.

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Comparative Example 1

10% by weight of melamine and 10% by weight of a curing agent are mixed with respect to 100% by weight of acrylic resin, and dissolved in 100% by weight of methyl ethyl ketone (MEK) / ethyl acetate mixed solvent to prepare a polyacrylic crosslinkable resin primer solution. Got it. The primer solution was applied / dried to a PET film having a thickness of about 4.5 μm with a 200 mesh gravure coater, and then heated / dried at 150 ° C. for 20 seconds to form a polyacrylic crosslinked primer layer having a thickness of about 0.3 μm. Subsequently, after tin deposition and electroless (electro) copper / electro nickel plating, an electromagnetic shielding film was finally prepared.

Evaluation of the adhesive force using the copper layer substrates obtained in Example 1 and Comparative Example 1 used a tape test and 90 ° Peel strength. The results are shown in Table 1 below. When 90 ° Peel strength and 0.3 N / mm or more were given, it was determined that there was adhesive force, and when it was less than 0.3 N / mm, it was judged that there was no adhesive force.

In Example 1 and Comparative Example 1, polyethylene terephthalate (PET) films are exemplified as polymer films. According to the production method according to the present invention, the same polymer resin composition was applied to the polyimide (PI) film, and the same result was obtained. The polymer resin composition used in the production method according to the present invention is applicable to polyethylene terephthalate (PET) film and polyimide (PI) film.

Examples and Comparative Examples division Suzy Hardener additive Adhesion after plating Polyester-based Acrylic Melamine-based Epoxy Example 1 ● ● ● ● Comparative Example 1 ● ● ● ×

As described above with reference to the drawings illustrating a method of manufacturing a thin metallized film for electromagnetic wave shielding and a metallized film according to the present invention as described above, the present invention is limited by the embodiments and drawings disclosed herein Of course, various modifications can be made by those skilled in the art within the scope of the technical idea of the present invention.

1: protective film 2: primer layer
3: conductive layer

Claims (15)

In the electromagnetic shielding film manufacturing process for suppressing or reflecting electromagnetic noise emitted from electronic products,
A protective film forming step of forming a protective film so as to form a pressure-sensitive adhesive layer on a reinforcement film composed of a polymer film or a polymer sheet;
A polymer film laminating step of laminating a single layer or a sheet of a polymer film thinner than a reinforcing film to the adhesive layer of the protective film and laminating the protective film;
A primer layer forming step of forming a primer layer by coating a crosslinkable resin on the thin polymer film; And
A base layer for plating is formed on the primer layer by physical vacuum deposition (PVD), and a plating layer is formed on the base layer for plating to form a conductive layer, but the plating layer forming the conductive layer is electroless plating. Or by electroless plating and electroplating, when forming the conductive layer by physical vacuum deposition (PVD) and electroless plating, to form a deposited metal layer as a base layer for plating by the physical vacuum deposition (PVD) A conductive layer forming step of forming a copper conductive layer by a substitution reaction caused by the electroless plating between an oxidation reaction of a metal having a larger ionization tendency than copper and a reduction reaction of copper used for electroless plating;
Method for producing a thin metallized film for electromagnetic shielding comprising a. The method of claim 1,
The adhesive layer formed on the reinforcement film of the protective film is a method of manufacturing a thin metallized film for electromagnetic shielding, characterized in that formed by acrylic resin or epoxy resin. The method of claim 1,
The polymer film or sheet of the reinforcing film is any one of polyethylene terephthalate (PET), polyimide (PI), polyamide (polyamide), polyphenylene sulfide (PPS), polypropylene (PP), polyethylene (PE) Method for producing a thin metallized film for electromagnetic shielding, characterized in that made of a material. The method of claim 1,
The thickness of the polymer film or sheet of the reinforcing film is a method for producing a thin metallized film for shielding electromagnetic waves, characterized in that 25 ~ 200㎛. The method of claim 1,
The single polymer or sheet of the thin polymer film is polyethylene terephthalate (PET), polyimide (PI), polyamide (polyamide), polyphenylene sulfide (PPS), polypropylene (PP), polyethylene (PE), foamed polyethylene A method for producing a thin metallized film for electromagnetic shielding, comprising any one of terephthalate (PET) and expanded polypropylene (PP). The method of claim 1,
The thickness of the single-piece or sheet of the thin polymer film is 1 ~ 15㎛ characterized in that the method for producing a thin metallized film for electromagnetic shielding. The method of claim 1,
The primer layer is formed by coating with a crosslinkable resin or a crosslinked resin cured product. 8. The method of claim 7,
The crosslinkable resin cured product is a polyester-based crosslinkable resin cured product obtained by adding 1 to 50% by weight of a crosslinking component to a saturated polyester resin based on 100% by weight of an electromagnetic shielding thin metallized film. Manufacturing method. 9. The method of claim 8,
The crosslinking component is any one of a melamine resin, a multi-tubular isocyanate compound, an acrylic resin, an epoxy compound having one or two or more polymerizable unsaturated bonds in the molecule. The method of claim 1,
The thickness of the primer layer is 0.1 to 4㎛ method for producing a thin metallized film for electromagnetic shielding. delete delete The method of claim 1,
After forming a conductive layer by physical vacuum deposition (PVD) and electroless plating, a method for producing a thin metallized film for electromagnetic shielding, characterized in that the electroplating with copper on the conductive layer. The method of claim 1,
Method for producing a thin metallized film for electromagnetic shielding, characterized in that to form a nickel layer on the conductive layer by electroplating to prevent corrosion of the copper layer as the conductive layer. A thin metallized film for shielding electromagnetic waves produced by the manufacturing method of any one of claims 1 to 10, 13 and 14.

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