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KR20150005459A - 접착제 조성물 및 접착 시트 - Google Patents

접착제 조성물 및 접착 시트 Download PDF

Info

Publication number
KR20150005459A
KR20150005459A KR1020140082411A KR20140082411A KR20150005459A KR 20150005459 A KR20150005459 A KR 20150005459A KR 1020140082411 A KR1020140082411 A KR 1020140082411A KR 20140082411 A KR20140082411 A KR 20140082411A KR 20150005459 A KR20150005459 A KR 20150005459A
Authority
KR
South Korea
Prior art keywords
weight
adhesive
parts
meth
adhesive composition
Prior art date
Application number
KR1020140082411A
Other languages
English (en)
Korean (ko)
Inventor
준이치 나카야마
리에 유토
요시오 데라다
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20150005459A publication Critical patent/KR20150005459A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020140082411A 2013-07-05 2014-07-02 접착제 조성물 및 접착 시트 KR20150005459A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013141553A JP6166605B2 (ja) 2013-07-05 2013-07-05 接着剤組成物及び接着シート
JPJP-P-2013-141553 2013-07-05

Publications (1)

Publication Number Publication Date
KR20150005459A true KR20150005459A (ko) 2015-01-14

Family

ID=52253107

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140082411A KR20150005459A (ko) 2013-07-05 2014-07-02 접착제 조성물 및 접착 시트

Country Status (4)

Country Link
JP (1) JP6166605B2 (ja)
KR (1) KR20150005459A (ja)
CN (1) CN104277744B (ja)
TW (1) TWI628249B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106085312B (zh) * 2016-07-11 2019-01-15 南通星球石墨设备有限公司 一种石墨换热器钢衬内板与纤维层粘结专用胶
JP7193401B2 (ja) 2019-03-28 2022-12-20 日東電工株式会社 粘着剤組成物、粘着剤層、及び粘着シート
CN111531240A (zh) * 2019-11-11 2020-08-14 上海隆因诺光电有限公司 一种小间距led全彩显示屏模组的焊接强度加强工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4600640B2 (ja) * 2003-11-10 2010-12-15 信越化学工業株式会社 アクリル系接着剤シート
JP4576140B2 (ja) * 2004-03-25 2010-11-04 日東電工株式会社 接着剤組成物および接着シート
JP4733444B2 (ja) * 2005-06-30 2011-07-27 日東電工株式会社 接着組成物及び接着シート
JP4975564B2 (ja) * 2007-08-31 2012-07-11 日東電工株式会社 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
JP2009084507A (ja) * 2007-10-02 2009-04-23 Hitachi Kasei Polymer Co Ltd 多層接着フィルム及びそれを用いたカバーレイフィルム、銅箔付き多層接着フィルム
KR101045262B1 (ko) * 2009-12-21 2011-06-29 제일모직주식회사 스텔스 다이싱용 반도체용 접착 조성물 및 이를 이용한 접착 필름
CN103097483B (zh) * 2010-08-27 2016-03-09 日东电工株式会社 丙烯酸类粘合剂组合物、丙烯酸类粘合剂层以及丙烯酸类粘合带

Also Published As

Publication number Publication date
JP6166605B2 (ja) 2017-07-19
CN104277744A (zh) 2015-01-14
TWI628249B (zh) 2018-07-01
JP2015013946A (ja) 2015-01-22
CN104277744B (zh) 2018-06-29
TW201506106A (zh) 2015-02-16

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