KR20120095787A - Substrate cleaning apparatus, substrate cleaning method, display manufacturing apparatus and display manufacturing method - Google Patents

Abstract

PURPOSE: A substrate cleaning apparatus, a substrate cleaning method, manufacturing equipment of a display device, and a manufacturing method using the same are provided to reduce residual contamination particles by supplying cleaning solution containing micro bubbles charged negatively to a brush and a substrate. CONSTITUTION: A substrate cleaning apparatus(1) comprises a carrying apparatus(2), a rotary brush(3), and a first cleaning solution feeding unit(6). The carrying apparatus delivers substrates(9). The rotary brush is made from materials charged with the rubbing with a substrate to the minus. The rotary brush removes the residual contamination particles on a substrate by being contacted with a substrate and rotated. The first cleaning solution feeding unit supplies cleaning solution to the rotary brush.

Description

Substrate cleaning device, substrate cleaning method, display device manufacturing device and display device manufacturing method {SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, DISPLAY MANUFACTURING APPARATUS AND DISPLAY MANUFACTURING METHOD}

The present invention relates to a substrate cleaning apparatus for cleaning a substrate such as a glass substrate or a semiconductor wafer for liquid crystal, a substrate cleaning method, a manufacturing apparatus for a display device, and a manufacturing method for a display device.

In the manufacturing process of a liquid crystal display device and a semiconductor device, it is required to wash | clean a board | substrate, such as a glass substrate for a liquid crystal, a semiconductor wafer, with high washing | cleaning degree.

As a washing | cleaning apparatus which wash | cleans a board | substrate, the thing of following patent document 1 is known, for example. The washing | cleaning apparatus of patent document 1 is equipped with the conveyance mechanism which conveys a board | substrate, the nozzle body which supplies a washing | cleaning liquid with respect to the board | substrate conveyed, and the washing | cleaning brush which contacts and rotates the board | substrate with which the washing | cleaning liquid was supplied.

Japanese Patent Laid-Open No. 2002-239485

In the case of rubbing two objects, there is a thing which is easy to be positively charged and easily to be negatively charged, and there is a relationship between "frictional charging heat" as shown in FIG. 5, and glass, nylon, metal, etc. are positive. It is easy to be charged. However, in the case of rubbing two objects which are easy to be positively charged together, for example, glass and nylon, the glass which is more likely to be positively charged is positively charged and the nylon is negatively charged.

Therefore, when the brush bristles of the rotating brush are formed of nylon, when the rotating brush contacts and rotates the glass substrate, the substrate is positively charged, and the rotating brush is negatively charged.

Contaminant particles, which are objects to be removed from the substrate by washing, are metals such as aluminum, copper, or silicon, and the metals are positively charged, and the silicon is easily charged negatively.

For this reason, when the rotary brush made of nylon is brought into contact with the substrate and rotated to remove the contaminated particles on the glass substrate, the rotary brush is negatively charged, the substrate is positively charged, and the positively charged contaminated particles The problem of electrostatic adsorption on the rotating brush occurs.

This invention is made | formed in view of the above-mentioned content, The objective is the board | substrate cleaning apparatus which can prevent electrostatic adsorption | suction of a contaminant particle to the rotating brush which wash | cleans a board | substrate, the board | substrate cleaning method, the manufacturing apparatus of a display apparatus, and a display apparatus. It is to provide a method for producing.

The 1st characteristic which concerns on embodiment of this invention is a board | substrate washing apparatus WHEREIN: It is formed from the conveyance mechanism which conveys a board | substrate, and the material negatively charged by the friction with the said board | substrate, and rotates in contact with the said board | substrate. And a first cleaning liquid supply section for supplying a cleaning brush containing a microbubble charged negatively toward the rotary brush, and a rotating brush for removing contaminant particles adhering to the substrate.

The 2nd characteristic which concerns on embodiment of this invention is formed by the conveyance mechanism which conveys a glass substrate and nylon which is negatively charged by the friction with the said board | substrate in a board | substrate washing apparatus, and contacts and rotates the said board | substrate. Thereby, it is provided with the rotating brush which removes the contaminant particle adhering to the said board | substrate, and the 1st washing | cleaning liquid supply part which supplies the washing | cleaning liquid containing negatively charged micro bubbles toward the said rotating brush.

According to a third aspect of the present invention, in a substrate cleaning method, a substrate is conveyed, and a substrate is formed of a material that is negatively charged by friction with the substrate, and the substrate is rotated in contact with the substrate. It includes a step of supplying a cleaning liquid containing a microbubble that is negatively charged toward the rotary brush to remove adhered contaminant particles.

According to a fourth aspect of the present invention, in the substrate cleaning method, a step of conveying a glass substrate and formed of nylon that is negatively charged by friction with the substrate are made by contacting and rotating the substrate. And a step of supplying a cleaning liquid containing a microbubble that is negatively charged toward the rotary brush for removing contaminant particles adhering to the substrate.

A fifth feature according to an embodiment of the present invention is a manufacturing apparatus of a display device including a substrate cleaning device for cleaning a substrate for a display device to be conveyed, wherein the substrate cleaning device is the first or second feature described above. According to the substrate cleaning apparatus.

A sixth feature according to an embodiment of the present invention is a method of manufacturing a display device having a substrate cleaning step of cleaning a substrate for display device to be conveyed, wherein the substrate cleaning step is negatively charged by friction with the substrate. And a step of supplying a cleaning liquid containing a microbubble that is negatively charged toward a rotating brush which is formed of a material that is formed into contact with the substrate and rotates in contact with the substrate to remove contaminating particles adhering to the substrate.

According to a seventh aspect of the present invention, there is provided a method of manufacturing a display device having a substrate cleaning step of cleaning a substrate made of glass for display device, wherein the substrate cleaning step is negative due to friction with the substrate. And a step of supplying a cleaning liquid containing a microbubble that is negatively charged toward a rotating brush formed of nylon charged with a negative electrode and rotating in contact with the substrate to remove contaminants adhering to the substrate. .

According to any one of the first to seventh features described above, when the substrate is cleaned using the rotary brush, adhesion of contaminant particles to the rotary brush can be prevented.

1 is a side view showing a schematic configuration of a substrate cleaning apparatus according to a first embodiment of the present invention.
2 is a block diagram showing the configuration of a control system of the substrate cleaning apparatus;
FIG. 3 is a schematic diagram illustrating a mechanism for preventing adhesion of contaminant particles to a substrate and a rotating brush by negatively charged micro bubbles during cleaning of the substrate. FIG.
4 is a flowchart illustrating an operation process of substrate cleaning.
5 is a diagram showing a relationship between frictional electrification heat between objects;
6 is a side view illustrating a schematic configuration of a substrate cleaning apparatus according to a second embodiment of the present invention.
7 is a graph showing an example of the effects of the present invention.

(First embodiment)

A first embodiment of the present invention will be described based on FIGS. 1 to 5. As shown to FIG. 1 and FIG. 2, the board | substrate cleaning apparatus 1 which concerns on 1st Embodiment has the conveyance mechanism 2, the rotating brush 3, the washing | cleaning liquid tank 4, and a micro bubble generation part. (5), the 1st cleaning liquid supply part 6, the 2nd cleaning liquid supply part 7, and the control part 8 of the microcomputer structure which control the whole board | substrate cleaning apparatus 1 are provided.

The conveyance mechanism 2 is a mechanism which conveys the board | substrate used in the manufacturing process of a liquid crystal display device or a semiconductor device, for example, the board | substrate 9 made of glass in the arrow A direction, and the some conveyance roller 10 arranged along the arrow A direction. And the conveying motor 11 which drives these conveying rollers 10 to rotation. The conveying motor 11 is connected to the control part 8, and is controlled on and off by the control part 8.

The rotating brush 3 is provided in pair in the fixed position along the conveyance direction of the board | substrate 9, and is arrange | positioned in parallel so that the conveyed board | substrate 9 may be located between both front and back. The rotary brush 3 includes a rotary shaft 3a and brush hairs 3b which are planted on the outer circumference of the rotary shaft 3a, and the brush hairs 3b are formed of nylon. To the rotating shaft 3a, the rotating motor 12 which drives the rotating brush 3 to rotate around the centerline of the rotating shaft 3a is connected. The rotary motor 12 is connected to the control part 8, and is controlled on and off by the control part 8.

In the washing | cleaning liquid tank 4, the washing | cleaning liquid containing the pure water or alkaline aqueous solution used when wash | cleaning the board | substrate 9 is stored.

The microbubble generating unit 5 is a device for generating microbubbles in the cleaning liquid, and connects the pump 13 for sucking up the cleaning liquid in the cleaning liquid tank 4, the first cleaning liquid supply part 6, and the second cleaning liquid supply part 7. It is installed in the middle of the pipe 15 to be made. The gas supply pipe 17 which supplies gas (air) is connected in the middle of the piping 16 until the washing liquid in the washing liquid tank 4 reaches the pump 13 as an upstream side of the pump 13. In the microbubble generating unit 5, pressure dissolving means for dissolving gas in the cleaning liquid by pressurizing the cleaning liquid sucked by the pump 13 and the gas supplied through the gas supply pipe 17, and the cleaning liquid in which the gas is dissolved are decompressed. The pressure reduction means which generate | occur | produces a micro bubble in a washing | cleaning liquid by this is provided. The cleaning liquid containing the microbubbles is sent out from the microbubble generating section 5, and the cleaning liquid containing the microbubbles sent out is the first cleaning liquid supply part 6 and the second cleaning liquid supply part 7 via the piping 15. From the rotary brush 3 or the substrate 9. In addition, when micro bubbles are generated by pressure reduction by the decompression means in the micro bubble generator 5, micro bubbles are triboelectrically charged negatively by cavitation.

As another form of microbubble generation part, it is provided between the pump 13, the 1st washing | cleaning liquid supply part 6, and the 2nd washing | cleaning liquid supply part 7, the pressurizing part which pressurizes a washing | cleaning liquid and gas, the 1st washing | cleaning liquid supply part 6, It may be comprised by the decompression part provided in the outlet side of the 2nd washing | cleaning liquid supply part 7, and reducing the pressurized washing | cleaning liquid.

In addition, the generation method of the micro bubbles is not limited to the above-described pressure dissolution method, but adopts a bubble generation method of a swing method that generates a cleaning solution containing micro bubbles in advance by, for example, a micro bubble generating unit, and pipes the cleaning solution. (15) may be passed through the first cleaning liquid supply part 6 and the second cleaning liquid supply part 7 to the rotary brush 3 and the substrate 9. Alternatively, the gas is entrained in the vortex of the cleaning liquid in the first cleaning supply part 6 and the second cleaning liquid supply part 7 to generate micro bubbles, and the rotary brush 3 or the substrate ( 9) may be sprayed.

The microbubble generation part 5 is connected to the control part 8, and is controlled by the control part 8 on / off. In addition, the micro bubble of this invention is a micro bubble containing the concept of micro bubble (MB), micro nano bubble (MNB), nano bubble (NB). For example, micro bubbles are bubbles having a diameter of 10 μm to several tens of μm, micro nano bubbles are bubbles having a diameter of several hundred nm to 10 μm, nano bubbles are bubbles having a diameter of several hundred nm or less, and bubbles of these sizes are It is negatively charged.

The 1st washing | cleaning liquid supply part 6 is a nozzle which supplies the washing | cleaning liquid containing the micro bubble which the washing | cleaning liquid in the washing | cleaning liquid tank 4 supplied to the microbubble generating part 5 toward the rotating brush 3, and the pump 13 Is driven and the cleaning liquid is supplied by opening the solenoid valve 14a. The pump 13 and the solenoid valve 14a are connected to the control part 8, and are controlled on and off by the control part 8.

The 2nd cleaning liquid supply part 7 is a board | substrate 9 which positions the cleaning liquid containing the micro bubble which the cleaning liquid in the cleaning liquid tank 4 supplied to the micro bubble generation part 5 in the contact position with the rotating brush 3. It is a nozzle to supply toward the surface of the board | substrate 9, and is provided in the upstream and downstream side of the rotating brush 3 along the conveyance direction of the board | substrate 9 so as to oppose the front and back both sides of the board | substrate 9. The washing liquid is supplied by driving the pump 13 and opening the solenoid valve 14b. The pump 13 and the solenoid valve 14b are connected to the control part 8, and are controlled on and off by the control part 8.

FIG. 3 shows that when the glass substrate 9 is brought into contact with the rotary brush 3 made of nylon, and the cleaning liquid is supplied to clean the substrate 9, the contaminated particles removed from the substrate 9 are removed from the substrate 9. And a mechanism which prevents electrostatic adsorption | suction and reattachment to the rotating brush 3 by the micro bubble charged negatively. In addition, although micro-nano bubbles are demonstrated as an example of the micro bubble generate | occur | produced in a washing | cleaning liquid here, it is the same also in a nano bubble, a micro bubble, etc.

FIG. 3A illustrates a state before the substrate 9 and the rotary brush 3 come into contact with each other by supplying a cleaning liquid containing no microbubbles at the time of cleaning the substrate 9. Both the substrate 9 and the rotary brush 3 are positively charged, and the positively charged contaminant particles (eg, Al particles) removed from the substrate 9 and suspended in the cleaning liquid are the substrate 9 and the rotation. Repulsion with respect to the brush (3). On the other hand, negatively contaminated particles (eg, Si particles) that are removed from the substrate 9 and suspended in the cleaning liquid are electrostatically adsorbed on the substrate 9 or the rotary brush 3.

FIG. 3B illustrates a state in which the substrate 9 and the rotary brush 3 come into contact with each other and are rubbed from the state shown in FIG. 3A. When the substrate 9 and the rotary brush 3 are in contact with each other and rubbed, the substrate 9 remains in a positively charged state based on the “frictional electrification heat” shown in FIG. 5, but the rotary brush 3 ) Is negatively charged. As a result, positively charged contaminant particles (eg, Al particles) removed from the substrate 9 and suspended in the cleaning liquid are electrostatically adsorbed by the rotary brush 3, removed from the substrate 9, and suspended in the cleaning liquid. The negatively charged contaminating particles (eg, Si particles) are electrostatically adsorbed on the substrate 9.

FIG. 3C supplies a cleaning liquid containing micro nano bubbles, which are micro bubbles that are negatively charged at the time of cleaning the substrate 9, and the substrate 9 and the rotary brush 3 come into contact with each other to cause friction. It shows the state. The negatively charged micro bubbles adhere to the surface of the positively charged substrate 9 or the surface of positively charged contaminant particles (eg, Al particles) that are removed from the substrate 9 and suspended in the cleaning liquid. do. As a result, the polluted particles (for example, Al particles) having negatively charged microbubbles adhered to the surface are prevented from being electrostatically adsorbed to the substrate 9 or the rotary brush 3 to be reattached. In addition, negatively charged contaminant particles (eg, Si particles) that are removed from the substrate 9 and suspended in the cleaning solution are rotated of the substrate 9 or the negative polarity to which the microbubbles charged negatively on the surface are attached. Electrostatic adsorption to the brush 3 is prevented from reattaching.

Therefore, when cleaning the substrate 9 using the rotary brush 3, by supplying the cleaning liquid containing the microbubbles that are negatively charged, contaminant particles removed from the substrate 9 and suspended in the cleaning liquid are supplied to the substrate ( 9) and the electrostatic adsorption to the rotary brush 3 can be prevented from reattaching, and the cleaning degree of the board | substrate 9 can be improved.

The cleaning process of the board | substrate 9 is demonstrated based on the flowchart of FIG. First, it is determined whether or not the cleaning operation has started (step S1), and when the start button is turned on and the cleaning operation has started (YES in step S1), the conveying motor 11 is driven (step S2), and microbubbles The generating part 5 is driven (step S3), and the cleaning liquid is supplied from the first cleaning liquid supply part 6 and the second cleaning liquid supply part 7 (step S4).

When the conveying motor 11 is driven, the conveying roller 10 is rotationally driven and the conveyance of the board | substrate 9 is attained. In addition, when the micro bubble generator 5 is driven, generation of micro bubbles in the cleaning liquid in the micro bubble generator 5 starts. The cleaning liquid containing micro bubbles is supplied from the first cleaning liquid supply part 6 toward the rotating brush 3, and from the second cleaning liquid supply part 7 of the rotating brush 3 along the conveying direction of the substrate 9. The cleaning liquid containing the micro bubbles is supplied toward the upstream side and the downstream side. In addition, supply of these washing | cleaning liquids starts before the board | substrate 9 is conveyed to the contact position with the rotating brush 3.

After the cleaning operation starts, it is judged whether or not the substrate 9 has been conveyed to the contact position with the rotary brush 3 (step S5), and when the substrate 9 is conveyed to the contact position with the rotary brush 3, The supply of the cleaning liquid from the first cleaning liquid supply part 6 is stopped and the supply of the cleaning liquid from the second cleaning liquid supply part 7 is continued (step S6).

Here, since supply of the washing | cleaning liquid from the 1st washing | cleaning liquid supply part 6 to the rotating brush 3 is started before the board | substrate 9 is conveyed to the contact position with the rotating brush 3, it contacts with the board | substrate 9, and rubs. The negatively charged microbubbles are attached to the rotating brush 3 that is positively charged. For this reason, when the pollutant particle (for example, Si particle) negatively charged by the rotation brush 3 contacting the board | substrate 9 is removed from the board | substrate 9, the said polluted particle is carried out to the rotation brush 3 Reattachment can be prevented reliably.

In addition, the chamber and the internal components of the cleaning apparatus are often formed of vinyl chloride, which is easy to be negatively charged. The chamber of the cleaning apparatus is started by supplying the cleaning liquid from the first cleaning liquid supply part 6 to the rotating brush 3 before the substrate 9 is conveyed to the contact position with the rotating brush 3 and negatively charging the rotating brush. B. Contamination particles (negatively charged) such as vinyl chloride peeled off from internal components can be prevented from being electrostatically adsorbed to the rotary brush 3.

In this embodiment, when the board | substrate 9 is conveyed to the contact position with the rotating brush 3, supply of the washing | cleaning liquid from the 2nd washing | cleaning liquid supply part 7 will continue, and the cleaning liquid from the 1st washing | cleaning liquid supply part 6 will be The supply is stopped. For this reason, the consumption amount of a washing | cleaning liquid can be reduced. As described above, the rotary brush 3 is negatively charged when it is in contact with the substrate 9. Therefore, even when the supply of the cleaning liquid from the first cleaning liquid supply part 6 is stopped, the negatively charged contaminant particles are prevented from adhering to the rotary brush 3. In addition, when the flow velocity and flow rate of the cleaning liquid supplied from the second cleaning liquid supply unit 7 are set such that the cleaning liquid touches the substrate 9 and then bounces toward the rotating brush 3, the cleaning liquid is supplied to the rotating brush 3. The same state as that of continuing is obtained.

In addition, only the cleaning liquid is supplied from the first cleaning liquid supply part 6 without supplying the cleaning liquid from the second cleaning liquid supply part 7 until the substrate 9 is conveyed to the contact position with the rotary brush 3. When the substrate 9 is conveyed to the contact position with the rotary brush 3, the supply of the cleaning liquid from the first cleaning liquid supply part 6 may be stopped and the cleaning liquid supply from the second cleaning liquid supply part 7 may be started. .

In addition, after the cleaning by the rotary brush 3 is finished, the cleaning liquid from the second cleaning liquid supply part 7 is once stopped, and then, in the period until the next substrate 9 reaches the rotary brush 3, the first is performed. The supply of the cleaning liquid including the microbubbles negatively charged from the cleaning liquid supply part 6 is resumed, and the rotating brush 3 which is positively charged is continuously controlled to be negatively charged while it is not in contact with the substrate 9. Also good. As described above, during this time, it is possible to prevent the electrostatic adsorption of the contaminating particles (negatively charged) such as vinyl chloride peeled off from the chamber of the cleaning apparatus or the internal components to the rotary brush 3.

In addition, supply of the cleaning liquid from the 1st cleaning liquid supply part 6 may continue after the board | substrate 9 is conveyed to the contact position with the rotating brush 3. Thereby, washing | cleaning precision can be improved.

In addition, the supply amount of the cleaning liquid may be changed in accordance with the rotation speed of the rotary brush 3, so that the supply amount may be increased when the rotation speed is high, and may be decreased when the rotation speed is slow. As a result, the supply amount of the cleaning liquid can be optimized.

In this embodiment, although the case where the 2nd washing | cleaning to-be-supplied part 7 is provided in the upstream and downstream of the rotating brush 3 along the conveyance direction of the board | substrate 9 was demonstrated as an example, it may be any one only. good. Thereby, the consumption amount of a washing | cleaning liquid can be reduced.

In addition, in this embodiment, although the case where the rotating brush 3, the 1st washing | cleaning liquid supply part 6, and the 2nd washing | cleaning liquid supply part 7 were arrange | positioned on both the upper and lower sides of the board | substrate 9 conveyed was demonstrated as an example, a process is carried out. It may be only one according to the needs of the.

(Second Embodiment)

A second embodiment of the present invention will be described based on FIGS. 6 and 7. In addition, the same code | symbol is attached | subjected to the component same as the component demonstrated in 1st Embodiment, and the overlapping description is abbreviate | omitted.

The board | substrate cleaning apparatus 21 of 2nd Embodiment is provided as a part of the manufacturing apparatus which manufactures the liquid crystal display which is a display apparatus, The manufacturing apparatus of this display apparatus is a TFT circuit for liquid crystal drive on the board | substrate 9, and Each cell unit on a substrate 9 on which a light distribution film is formed on a substrate 9 on which a manufacturing apparatus (not shown) for manufacturing an electrode pattern, a TFT circuit, an electrode pattern, and the like is formed, and an alignment film are formed. A seal forming apparatus (not shown) for forming a frame-shaped seal surrounding the display region, and a liquid crystal supply apparatus (not shown) for depositing a liquid crystal material on the display region of each cell unit of the substrate 9 on which the seal is formed. ), A substrate bonding apparatus (not shown) for joining the substrate 9 on which the liquid crystal material is deposited with another substrate, a seal curing apparatus (not shown) for curing the seal after bonding the substrate, and the like and in each manufacturing apparatus. Interstitial The board | substrate washing | cleaning apparatus 21 which performs brush washing in the required point of a substrate movement process is provided.

The board | substrate cleaning apparatus 21 is provided with the conveyance mechanism 22, the brush washing | cleaning part 23, the pure water washing | cleaning part 24, and the drying part 25. As shown in FIG. The board | substrate 9 to be wash | cleaned is conveyed in order of the brush washing | cleaning part 23, the pure water washing | cleaning part 24, and the drying part 25, as shown by arrow B. FIG.

The conveyance mechanism 22 is equipped with the some conveyance roller 26 which conveys the board | substrate 9, and the conveyance motor (not shown) which drives these conveyance rollers 26 rotationally.

The brush cleaning unit 23 includes the rotary brush 3, the first cleaning liquid supply unit 27, the second cleaning liquid supply units 28a and 28b, the cleaning liquid tank 4, and the microbubble generating unit 5. And a control unit (not shown) for controlling the entire pump cleaning unit 23 and the brush cleaning unit 23.

In this board | substrate cleaning apparatus 21, when the board | substrate 9 conveyed by the conveyance mechanism 22 is conveyed to the brush washing | cleaning part 23, a washing | cleaning liquid will rotate from the 2nd washing | cleaning liquid supply part 28a, and the rotating brush 3 is carried out. It is supplied to the board | substrate 9 conveyed to the contact position with.

Moreover, the cleaning liquid supplied from the 1st cleaning liquid supply part 27 and the 2nd cleaning liquid supply parts 28a and 28b by the brush cleaning part 23 turns into the cleaning liquid containing micro bubbles by the micro bubble generation part 5, The cleaning liquid containing this microbubble is supplied toward the rotating brush 3 or the substrate 9.

Supply of this cleaning liquid is performed simultaneously with the conveyance to the brush washing | cleaning part 23 of the board | substrate 9, or from before conveyance, and the negatively charged micro bubble is attached to the rotating brush 3 which is positively charged.

In the brush cleaning unit 23, the positively charged contaminant particles are attracted by a microbubble negatively charged so as to surround the contaminant particles, and are in a state of acting as a substance having a negative potential in appearance. For this reason, by attaching the micro bubbles charged negatively, re-adhesion to the surface of the rotating brush 3 and board | substrate 9 which became negative polarity is prevented. On the other hand, the negatively charged contaminant particles are prevented from reattaching to the rotary brush 3 of negative polarity or the substrate 9 to which the microbubbles that are negatively charged are attached.

In this embodiment, in the cleaning method of the board | substrate 9 supplied by the single wafer type, about the case where a cleaning liquid is supplied simultaneously from the 1st cleaning liquid supply part 27 and the 2nd cleaning liquid supply parts 28a and 28b at the time of supplying a cleaning liquid. Although it demonstrated, when the rotating brush 3 is in contact with the board | substrate 9, since the rotating brush 3 is negatively charged, the negatively charged polluted particle is prevented from adhering to the rotating brush 3. Therefore, the supply of the cleaning liquid from the first cleaning liquid supply part 27 may be stopped. By this stop, the consumption amount of the cleaning liquid can be reduced.

In this case, when cleaning by the rotating brush 3 is complete | finished, when supply of the cleaning liquid from the 2nd cleaning liquid supply parts 28a and 28b is stopped once, and the next board | substrate 9 will reach the rotating brush 3, The supply of the cleaning liquid including the microbubbles charged negatively from the first cleaning liquid supply part 27 is resumed in the period up to that, and the positively charged rotary brush 3 is negatively provided while not being in contact with the substrate 9. You may control so that it may continue to charge. Thus, the consumption amount of the washing | cleaning liquid can be reduced by switching supply of the washing | cleaning liquid to the rotating brush 3, and supply stop as needed.

In addition, the supply timing of a cleaning liquid may be made to start supply from all the nozzles simultaneously with the start of conveyance of the board | substrate 9 like 1st Embodiment, and at the timing which the board | substrate 9 and the brush 3 contact. , Start and stop may be controlled.

Moreover, the 2nd washing | cleaning liquid supply part 28a which comprises the brush washing | cleaning part 23 of this embodiment has a mechanism which switches a washing | cleaning liquid supply direction to the board | substrate 9 direction and the rotating brush 3 direction, The same effect can be acquired by switching the washing | cleaning liquid supply direction from the 2nd washing | cleaning liquid supply part 28a, without using 1 washing | cleaning liquid supply part 27. FIG.

In addition, in this embodiment, although the case where there is one rotation brush 3 was demonstrated as an example, in order to respond to the contamination state of the board | substrate 9, speeding up a board | substrate conveyance speed, etc., you may provide a plurality of rotation brushes 3. .

In the pure water cleaning unit 24 continuous to the brush cleaning unit 23, pure water is supplied to the substrate 9 conveyed from the supply unit 29 having a cleaning effect such as pure water shower, megasonic shower, and two-fluid body. Thus, the contaminant particles which could not be removed by the brush cleaning unit 23 are removed. At this time, a large amount of pure water supplied from the pure water cleaning unit 24 is removed from the substrate 9 in the brush cleaning unit 23 and the contaminant particles on the substrate 9 which are prevented from being reattached due to the effect of micro bubbles. It can be easily washed off.

The board | substrate 9 from which the contaminant particle was removed by the brush washing | cleaning part 23 and the pure water washing | cleaning part 24 is conveyed to the drying part 25, and ejects the air etc. which were pressurized by the pump 30, and the board | substrate 9 ) The air is removed by the air knife 31 which removes the above water and then dried. The moisture-removed and dried substrate 9 is conveyed by the conveyance mechanism 22 to the next process for manufacturing a display apparatus, for example, the process of forming an electrode pattern on the substrate 9.

In addition, in this embodiment, although the case where the cleaning of the board | substrate 9 is performed with respect to the board | substrate 9 before forming an electrode pattern was demonstrated as an example, the same washing | cleaning effect is performed also about the board | substrate 9 after forming an electrode pattern. Could get

7 is a graph showing an example of the effects of the present invention.

As an example of a display device, in the manufacturing process of a liquid crystal display, the board | substrate cleaning effect by application of this invention was tested in the board | substrate cleaning process in the manufacturing process of the thin film transistor which drive a liquid crystal display (hereinafter abbreviated as TFT). Is shown in Figs. 7A and 7B.

Using 680 x 880 x 0.7 t (mm) as a glass substrate, 5 lot cleaning experiments were carried out with 20 sheets in one lot, and the cleaning effect by the application and non-application of the present invention was compared.

FIG.7 (a) rotates using the board | substrate cleaning apparatus demonstrated in detail in 2nd Embodiment in the accommodating washing | cleaning process (cleaning process before forming an electrode pattern) of a glass substrate which is the first washing | cleaning process of a TFT process. The cleaning liquid containing no micro bubbles charged negatively toward the brush 3 and the cleaning liquid containing the micro bubbles are always supplied from the first cleaning liquid supply part 27 and the second cleaning liquid supply parts 28a and 28b. In one case (the cleaning liquid supply part is always ON), and when the rotary brush 3 is in contact with the substrate 9, the supply of the cleaning liquid including the microbubble from the first cleaning liquid supply part 27 is stopped, and the second cleaning liquid supply part ( It is the result of comparing the average value of the number of the contaminant particle | grains which remained on the board | substrate 9 after washing | cleaning in the case of supplying the washing | cleaning liquid containing microbubbles only from 28a and 28b (cleaning liquid supply part ON / OFF control).

In addition, FIG. 7 (b) shows a metal film serving as a gate electrode on a glass substrate after receiving cleaning by a thin film formation method such as vacuum deposition, sputtering, or the like, and uses the substrate after patterning the electrode in a photo process. In addition, as mentioned above, it is a comparison result of the average value of the number of residual contaminant particles when the washing experiment to which this embodiment is applied is performed. In addition, in the case of FIG.7 (b), pure water was used for the washing | cleaning liquid.

In FIG. 7A, as the contaminant particles removed from the substrate 9 in the cleaning before forming the electrode pattern, dust, artificial organic matter, glass debris, and the like adhering at the time of handling the substrate 9 can be considered. ) To the rotary brush 3 and to the substrate 9 by the charge effect of the microbubbles charged negatively to the contaminated particles adhered to the substrate 9 and rubbed onto the substrate 9 or reattached after removal. As a result of the reduced adhesion, it was confirmed that the number of contaminant particles remaining on the substrate 9 after cleaning was reduced.

In FIG.7 (b), although the particle | grains removed from the board | substrate 9 by washing | cleaning after electrode pattern formation include electrode metal powder, a resist residue, etc., it is a contamination particle compared with the experiment result of cleaning before electrode pattern formation. It is considered that the residual number of is more likely to be reduced, and is due to the effect of preventing reattachment of the electrode metal powder having a clear polarity.

In addition, even when the cleaning method is supplied to the energy saving method of turning off the first cleaning solution supply unit 27 only when the cleaning method is supplied to the substrate 9 by the rotary brush 3, the same level of improvement effect can be obtained. It can be seen that.

Regardless of the result of implementation before or after the formation of the electrode pattern, residual contaminant particles can be reduced by supplying a cleaning liquid containing negatively charged microbubbles to the rotating brush 3 or the substrate 9, The usefulness of this embodiment was confirmed.

As a result, in the production process of the liquid crystal display, the residual contaminated particles after the substrate cleaning step of performing the brush cleaning at the required point of the substrate moving step in each manufacturing apparatus and between the apparatuses in the manufacturing apparatus group of the display apparatus described in detail in the foregoing description. Since the number of occurrence points, such as poor TFT performance due to disconnection of electrode wiring, leakage between electrodes, poor insulation of an insulating film, and poor display due to the insertion of foreign matters in the substrate bonding process, can be greatly reduced. In addition, the repair work time performed as an improvement in yield and countermeasures can be shortened, and the production efficiency can be improved.

Moreover, although this embodiment demonstrated the manufacturing process of a liquid crystal display in detail, it is also effective also in the manufacturing processes, such as a substrate cleaning process, such as a plasma display and an organic electroluminescent display, and a Si wafer, a thin film solar cell.

(Other Embodiments)

In the first embodiment, a case where the first cleaning liquid supply part 6, which is the cleaning liquid supply part dedicated to the rotary brush 3, and the second cleaning liquid supply part 7, which is the cleaning liquid supply part dedicated to the substrate 9, is provided as an example, Although the form demonstrated the case where the 1st cleaning liquid supply part 27 which is the cleaning liquid supply part dedicated to the rotating brush 3, and the 2nd cleaning liquid supply parts 28a and 28b which are the cleaning liquid supply parts dedicated to the board | substrate 9 were demonstrated as an example, The cleaning liquid supply part may be provided, and the cleaning liquid supply direction of the cleaning liquid supply part may be provided so as to be switchable. By changing the supply direction of the cleaning liquid, it is possible to have a configuration having two aspects of the supply of the cleaning liquid to the rotating brush 3 and the supply of the cleaning liquid to the substrate 9, where the substrate 9 is in contact with the rotating brush 3. The board | substrate 9 located in the contact position with the rotating brush 3, when the board | substrate 9 is conveyed in the contact position with the rotating brush 3, and supplies the washing | cleaning liquid to the rotating brush 3 until it conveys to the toner. The cleaning liquid toward the side.

Here, with respect to the consumption amount of the cleaning liquid, for example, under the conditions of supplying the cleaning liquid for 10 L / min from each of the three system cleaning liquid supply units (27, 28a, 28b of the sixth, seventh and second embodiments of the first embodiment). At the time of contact between the rotary brush 3 and the substrate 9, a cleaning liquid of about 10 L / min is unnecessary by a method of stopping the cleaning liquid supplied to the rotary brush 3, and a cleaning liquid is provided by providing a single cleaning liquid supply unit. In the case of changing the supply direction of, the supply of the cleaning liquid at 20 L / min can be omitted.

In addition, with respect to the supply amount of the cleaning liquid, for example, each of the liquid supply amounts of the three system cleaning liquid supply units (27, 28a, 28b of the sixth, seventh and second embodiments of the first embodiment), that is, the liquid supply from the three nozzles, You may differ, respectively.

While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and its modifications are included in the scope and spirit of the invention, and are included in the invention described in the claims and their equivalent ranges.

Claims (17)

A conveyance mechanism for conveying the substrate,
A rotating brush formed of a material that is negatively charged by friction with the substrate and removing contaminant particles adhering to the substrate by rotating in contact with the substrate;
First cleaning liquid supply unit for supplying a cleaning liquid containing negatively charged micro bubbles toward the rotary brush
Substrate cleaning apparatus comprising a. A conveyance mechanism for conveying a glass substrate;
A rotary brush which is formed of nylon which is negatively charged by friction with the substrate and removes contaminant particles adhering to the substrate by rotating in contact with the substrate;
First cleaning liquid supply unit for supplying a cleaning liquid containing negatively charged micro bubbles toward the rotary brush
Substrate cleaning apparatus comprising a. The substrate cleaning apparatus according to claim 1 or 2, wherein the first cleaning liquid supply unit supplies the cleaning liquid to the rotating brush before the substrate is conveyed to a contact position with the rotating brush. The second cleaning liquid supply unit according to claim 1 or 2, further comprising a second cleaning liquid supply unit for supplying the cleaning liquid toward the substrate located at a contact position with the rotary brush, in addition to the first cleaning liquid supply unit.
When the substrate is conveyed to the contact position with the rotary brush, the first cleaning liquid supply unit stops the supply of the cleaning liquid, and the second cleaning liquid supply unit supplies the cleaning liquid, The said 1st washing | cleaning liquid supply part is provided so that the washing | cleaning liquid supply direction can be changed, The said washing | cleaning liquid is made to the said rotating brush until the said board | substrate is conveyed to the contact position with the said rotating brush. And when the substrate is conveyed to the contact position with the rotary brush, the cleaning liquid supply direction is switched to supply the cleaning liquid toward the substrate located at the contact position with the rotary brush. Device. Conveying the substrate;
A cleaning liquid formed of a material that is negatively charged by friction with the substrate, and includes a microbubble that is negatively charged toward a rotating brush that removes contaminant particles adhered to the substrate by rotating in contact with the substrate. Process to supply
Substrate cleaning method comprising a. A process of conveying a glass substrate,
A microbubble is formed by a nylon that is negatively charged by friction with the substrate, and is negatively charged toward a rotating brush that removes contaminant particles attached to the substrate by rotating in contact with the substrate. Process to supply cleaning liquid
Substrate cleaning method comprising a. The substrate cleaning method according to claim 6 or 7, wherein the supply of the cleaning liquid to the rotary brush is performed before the substrate is conveyed to the contact position with the rotary brush. The said cleaning liquid is provided to the said board | substrate located in the contact position with the said rotary brush, The rotation of Claim 6 or 7 when the said board | substrate is conveyed to the contact position with the said rotary brush. The cleaning method of the substrate, characterized by stopping supply of the cleaning liquid toward the brush and supplying the cleaning liquid toward the substrate. The said cleaning liquid is supplied to the said rotating brush until the supply direction of the said cleaning liquid is switched and the said board | substrate is conveyed to the contact position with the said rotating brush, The said board | substrate rotates the said Claim 8 or 7 When conveyed to the contact position with a brush, the said cleaning liquid is supplied toward the said board | substrate located in the contact position with the said rotary brush, The board | substrate cleaning method characterized by the above-mentioned. In the manufacturing apparatus of the display apparatus provided with the board | substrate washing apparatus which wash | cleans the board | substrate for display apparatuses conveyed,
The said substrate cleaning apparatus is a substrate cleaning apparatus of Claim 1 or 2, The manufacturing apparatus of the display apparatus characterized by the above-mentioned. In the manufacturing method of the display apparatus which has a board | substrate washing | cleaning process which wash | cleans the board | substrate for display apparatuses conveyed,
The substrate cleaning step is formed of a material that is negatively charged by friction with the substrate, and is negatively charged toward a rotating brush that removes contaminant particles adhered to the substrate by rotating in contact with the substrate. A process for manufacturing a display device, comprising the step of supplying a cleaning liquid containing microbubbles. In the manufacturing method of the display apparatus which has a board | substrate washing process which wash | cleans the board | substrate made of glass for display apparatuses conveyed,
The substrate cleaning step is formed of nylon that is negatively charged by friction with the substrate, and is negatively charged toward a rotating brush that removes contaminant particles adhering to the substrate by rotating in contact with the substrate. A process for manufacturing a display device, comprising the step of supplying a cleaning liquid containing a fine microbubble. The manufacturing method of the display apparatus of Claim 12 or 13 which supplies the said cleaning liquid to the said rotating brush before the said board | substrate is conveyed to the contact position with the said rotating brush. The said cleaning liquid is provided to the said board | substrate located in the contact position with the said rotary brush, The rotation of Claim 12 or 13, when the said board | substrate is conveyed to the contact position with the said rotary brush. And stopping the supply of the cleaning liquid toward the brush and supplying the cleaning liquid toward the substrate. 14. The substrate according to claim 12 or 13, wherein the substrate is in contact with the rotary brush by changing the cleaning liquid supply direction from a second cleaning liquid supply unit for supplying the cleaning liquid toward the substrate positioned at the contact position with the rotary brush. Until it is conveyed to a contact position, when the said washing | cleaning liquid is supplied to the said rotating brush, and the said board | substrate is conveyed to the contacting position with the said rotating brush, it changes a cleaning liquid supply direction and is located in the contact position with the said rotating brush. And supplying the cleaning liquid from the second cleaning liquid supply part toward the substrate. The display apparatus according to claim 12 or 13, wherein the substrate cleaning step is performed for the substrate before forming the electrode pattern and for the substrate after forming the electrode pattern. Manufacturing method.

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