CN203955646U - Wafer cleaning device - Google Patents
Wafer cleaning device Download PDFInfo
- Publication number
- CN203955646U CN203955646U CN201420381228.5U CN201420381228U CN203955646U CN 203955646 U CN203955646 U CN 203955646U CN 201420381228 U CN201420381228 U CN 201420381228U CN 203955646 U CN203955646 U CN 203955646U
- Authority
- CN
- China
- Prior art keywords
- wafer
- cleaning device
- cleaning
- roller
- cleaning brush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model proposes a kind of wafer cleaning device, comprising: the cleaning fluid that is positioned at wash chamber provides unit, the cleaning brush contacting with crystal column surface and the rotary unit contacting with crystal round fringes, and rotary unit can change the position of wafer.The utility model adds a rotary unit in wafer cleaning device, can drive wafer to be rotated to horizontal level by vertical position, drive cleaning brush to rotate accordingly simultaneously, thereby realize the switching to wafer vertically cleans and level is cleaned, carry out when level is cleaned saving cleaning fluid, reach the object reducing costs, and the utility model can also meet different cleaning demands.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of wafer cleaning device.
Background technology
In semiconductor fabrication process, the cleannes of crystal column surface are the key factors that affects semiconductor device reliability.Therefore, cleaning is most important and one of technique the most frequently wherein.In conventional semiconductor technology, for example: deposition, plasma etching, spin coating photoresist, photoetching, plating etc., all likely can introduce and pollute and/or particle at crystal column surface, cause the cleannes of crystal column surface to decline, make the semiconductor devices yield of manufacture low.In general,, in the whole manufacturing process of semiconductor devices, the processing step up to 20% is cleaning.The object of cleaning is the pollution to semiconductor devices for fear of micro ion and metal impurities, thereby improves performance and the qualification rate of semiconductor devices.
In the manufacturing process of current semiconductor devices, often adopt cmp to carry out the general planarization processing of metal or dielectric film.In chemical mechanical milling tech, can use lapping liquid, the particle of for example aluminium oxide or gas or colloidal silica and so on, and be used in surfactant, aggressive agent and other additives of cmp processing.After cmp is processed, produce by the particle of lapping liquid, the reaction that is added into chemicals in lapping liquid and lapping liquid the pollutant (Residue) that thing forms and can stay on the surface of wafer.These pollutants must all clean up before entering next technique, to avoid reducing the reliability of semiconductor devices, and device were caused to introducing defect.
Please refer to Fig. 1 and Fig. 2, Fig. 1 and Fig. 2 are the structural representation of cleaning device in prior art; Described device comprises spray bar (Spray bar) 10, nozzle 11, cleaning brush (Brush) 20 and roller (Roller) 30, wherein, described nozzle 11 is arranged in described spray bar 10, for wafer 40 is sprayed to cleaning fluid etc., described wafer 40 is vertically placed, and held up by 3 rollers 30, two surfaces of wafer 40 are clamped by two cleaning brush 20, wafer 40 is driven and can be carried out rotation by roller 30, and cleaning brush 20 also can clean two surfaces of wafer 40 in rotation.
But, it is constant that cleaning device of the prior art is merely able to keep wafer 40 to be positioned at same position, and for example vertical position adopts this kind of cleaning way can cause on the one hand the waste of cleaning fluid, also cannot meet on the other hand multiple cleaning demand, for example, wafer be carried out to the cleaning of horizontal level.
Utility model content
The purpose of this utility model is to provide a kind of wafer cleaning device, can carry out horizontal or vertical cleaning to wafer, when meeting multiple cleaning demand, can also save cleaning fluid.
To achieve these goals, the utility model proposes a kind of wafer cleaning device, comprise: wash chamber, cleaning fluid provide unit, cleaning brush and in order to change the rotary unit of wafer position, described cleaning fluid provides unit to be positioned at described wash chamber, described cleaning brush contacts with crystal column surface, and described rotary unit contacts with described crystal round fringes.
Optionally, described rotary unit comprises several rollers, middle shaft rotation motor, CD-ROM drive motor, roller assembly and conveyer belt, described roller is evenly arranged on the edge of described wafer, described middle shaft rotation motor is connected with described cleaning brush, roller assembly respectively, described roller is connected with described roller assembly, and described conveyer belt is connected with roller with described CD-ROM drive motor.
Optionally, described roller is four, and four rolling is arranged at crystal round fringes uniformly.
Optionally, described middle shaft rotation motor, CD-ROM drive motor, roller assembly and conveyer belt are all arranged at outside described wash chamber.
Optionally, described roller assembly is provided with connecting axle, and described middle shaft rotation motor is connected by described connecting axle with described roller assembly.
Optionally, described cleaning brush is provided with axis, and described middle shaft rotation motor is connected by described axis with described cleaning brush.
Optionally, described cleaning fluid provides unit to comprise spray bar and multiple nozzle, and described multiple nozzles are evenly arranged in described spray bar.
Optionally, described spray bar is connected with a cleaning liquid source.
Optionally, described spray bar is two, in the time that wafer is vertically placed described in two spray bar lay respectively at the both sides of described wafer.
Optionally, described cleaning brush is two, is close to respectively with two surfaces of described wafer.
Compared with prior art, the beneficial effects of the utility model are mainly reflected in: in wafer cleaning device, add a rotary unit, can drive wafer to be rotated to horizontal level by vertical position, drive cleaning brush to rotate accordingly simultaneously, thereby realize the switching to wafer vertically cleans and level is cleaned, carry out when level is cleaned saving cleaning fluid, reach the object reducing costs, and the utility model can also meet different cleaning demands.
Brief description of the drawings
Fig. 1 and Fig. 2 are the structural representation of cleaning device in prior art;
Fig. 3 is the front view of wafer cleaning device in the utility model one embodiment;
Fig. 4 is the side view of wafer cleaning device in the utility model one embodiment;
Fig. 5 is the structural representation of rotary unit in the utility model one embodiment;
Fig. 6 is the top view that in the utility model one embodiment, wafer level is placed;
In figure, spray bar-10, nozzle-11, cleaning brush-20, roller-30, wafer-40, spray bar-100, nozzle-110, cleaning fluid-120, cleaning brush-200, roller-300, roller assembly-310, wafer-400, middle shaft rotation motor-500, wash chamber 510, CD-ROM drive motor-600, conveyer belt-610.
Detailed description of the invention
Below in conjunction with schematic diagram, wafer cleaning device of the present utility model is described in more detail, wherein represent preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the utility model chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example, according to about system or about the restriction of business, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
In the following passage, with way of example, the utility model is more specifically described with reference to accompanying drawing.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Please refer to Fig. 3 and Fig. 4, in the present embodiment, a kind of wafer cleaning device has been proposed, comprise: wash chamber 510 (in order to facilitate view, only illustrate a side), cleaning fluid provide unit, cleaning brush 200 and rotary unit, and cleaning fluid provides unit to be positioned at wash chamber 510, cleaning brush 200 and wafer 400 Surface Contacts, the EDGE CONTACT of rotary unit and wafer 400, and can change the position of wafer 400, for example wafer is rotated to the position to horizontal positioned from the position of vertical placement.
Please refer to Fig. 5, in the present embodiment, rotary unit comprises several rollers 300, middle shaft rotation motor 500, CD-ROM drive motor 600, roller assembly 310 and conveyer belt 610, roller 300 is evenly arranged on the edge of wafer 400, middle shaft rotation motor 500 is connected with cleaning brush 200, roller assembly 310 respectively, roller 300 is connected with roller assembly 310, and conveyer belt 610 is connected with roller 300 with CD-ROM drive motor 600.
Concrete, roller 300 is four, as shown in Figure 6, four rolling 300 is positioned at respectively wafer 400 edges uniformly, better to fix wafer 400, prevents flake, avoids causing wafer 400 to damage.Please refer to Fig. 5, roller assembly 310 is provided with connecting axle, middle shaft rotation motor 500 is connected by connecting axle with roller assembly 310, in addition, cleaning brush 200 is provided with axis, and middle shaft rotation motor 500 is connected by axis with cleaning brush 200, and middle shaft rotation motor 500 can rotate, it can pass through axis, connecting axle drives cleaning brush 200, the 310 occurrence positions rotations of roller assembly, for example, rotate to horizontal direction from vertical direction.
In the present embodiment, cleaning brush 200 is two, be close to the two sides of wafer 400 respectively, be that wafer 400 is between two cleaning brush 200, because roller 300 is connected with roller assembly 310, wafer 400 is fixed between cleaning brush 200 and edge is fixed by roller 300, therefore, in the time that axis rotation motor 500 rotarily drives cleaning brush 200, the 310 occurrence positions rotation of roller assembly, it can drive wafer 400 to rotate accordingly, thereby realize, wafer 400 is rotated to the object to horizontal level by vertical position.
In the present embodiment, middle shaft rotation motor 500, CD-ROM drive motor 600, roller assembly 310 and conveyer belt 610 are all arranged at outside wash chamber 510, CD-ROM drive motor 600 drives roller 300 to carry out rotation by conveyer belt 610, thereby can drive wafer 400 to carry out rotation, simultaneously, in order to reach better cleaning performance, cleaning brush 200 is also rotated along the direction of wafer 400 rotations, reaches the effect on cleaning wafer 400 whole surfaces.
As shown in Figure 4, cleaning fluid provides unit to comprise spray bar 100 and multiple nozzle 110, multiple nozzles 110 are evenly arranged in spray bar 100, spray bar 100 is two, in the time that wafer 400 is vertically placed, spray bar 100 lays respectively at the both sides of wafer 400, can all carry out cleaning fluid 120 to wafer 400 both side surface sprays, be conducive to 400 liang of surfaces of wafer to be cleaned, under normal circumstances, wafer cleaning device also comprises a cleaning liquid source (scheming not shown), cleaning liquid source is connected with spray bar 100, provides cleaning fluid 120 for cleaning.
Visible, the wafer cleaning device proposing in the present embodiment can be realized wafer 400 by the mutual switching between vertical placement and horizontal positioned by rotary unit, vertically place and clean and can all clean wafer 400 both side surface, and horizontal positioned can cleaning wafer 400 a side surface, but can save a large amount of cleaning fluid 120, reach the object reducing costs.Therefore the wafer cleaning device, the utility model proposes can meet different cleaning demands.
To sum up, in the wafer cleaning device providing at the utility model embodiment, in wafer cleaning device, add a rotary unit, can drive wafer to be rotated to horizontal level by vertical position, drive cleaning brush to rotate accordingly simultaneously, thereby realize the switching that wafer vertically cleans and level is cleaned, carry out when level is cleaned saving cleaning fluid, reach the object reducing costs, and the utility model can also meet different cleaning demands.
Above are only preferred embodiment of the present utility model, the utility model is not played to any restriction.Any person of ordinary skill in the field; not departing from the scope of the technical solution of the utility model; the technical scheme that the utility model is disclosed and technology contents make any type of variations such as replacement or amendment that are equal to; all belong to the content that does not depart from the technical solution of the utility model, within still belonging to protection domain of the present utility model.
Claims (10)
1. a wafer cleaning device, it is characterized in that, comprise: wash chamber, cleaning fluid provide unit, cleaning brush and in order to change the rotary unit of wafer position, described cleaning fluid provides unit to be positioned at described wash chamber, described cleaning brush contacts with crystal column surface, and described rotary unit contacts with described crystal round fringes.
2. wafer cleaning device as claimed in claim 1, it is characterized in that, described rotary unit comprises several rollers, middle shaft rotation motor, CD-ROM drive motor, roller assembly and conveyer belt, described roller is evenly arranged on the edge of described wafer, described middle shaft rotation motor is connected with described cleaning brush, roller assembly respectively, described roller is connected with described roller assembly, and described conveyer belt is connected with roller with described CD-ROM drive motor.
3. wafer cleaning device as claimed in claim 2, is characterized in that, described roller is four, and four rolling is arranged at crystal round fringes uniformly.
4. wafer cleaning device as claimed in claim 3, is characterized in that, described middle shaft rotation motor, CD-ROM drive motor, roller assembly and conveyer belt are all arranged at outside described wash chamber.
5. wafer cleaning device as claimed in claim 4, is characterized in that, described roller assembly is provided with connecting axle, and described middle shaft rotation motor is connected by described connecting axle with described roller assembly.
6. wafer cleaning device as claimed in claim 4, is characterized in that, described cleaning brush is provided with axis, and described middle shaft rotation motor is connected by described axis with described cleaning brush.
7. wafer cleaning device as claimed in claim 1, is characterized in that, described cleaning fluid provides unit to comprise spray bar and multiple nozzle, and described multiple nozzles are evenly arranged in described spray bar.
8. wafer cleaning device as claimed in claim 7, is characterized in that, described spray bar is connected with a cleaning liquid source.
9. wafer cleaning device as claimed in claim 7, is characterized in that, described spray bar is two, in the time that wafer is vertically placed described in two spray bar lay respectively at the both sides of described wafer.
10. wafer cleaning device as in one of claimed in any of claims 1 to 9, is characterized in that, described cleaning brush is two, is close to respectively with two surfaces of described wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420381228.5U CN203955646U (en) | 2014-07-10 | 2014-07-10 | Wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420381228.5U CN203955646U (en) | 2014-07-10 | 2014-07-10 | Wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203955646U true CN203955646U (en) | 2014-11-26 |
Family
ID=51916287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420381228.5U Expired - Fee Related CN203955646U (en) | 2014-07-10 | 2014-07-10 | Wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203955646U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105983546A (en) * | 2015-02-13 | 2016-10-05 | 中芯国际集成电路制造(上海)有限公司 | Wafer cleaning method |
| CN110571137A (en) * | 2019-09-27 | 2019-12-13 | 西安奕斯伟硅片技术有限公司 | Wafer processing method and processing device |
| CN111383955A (en) * | 2018-12-25 | 2020-07-07 | 夏泰鑫半导体(青岛)有限公司 | Roller for cleaning wafer and cleaning device with roller |
| CN113327873A (en) * | 2021-05-28 | 2021-08-31 | 华海清科股份有限公司 | Wafer cleaning device and wafer cleaning method |
| CN113976467A (en) * | 2021-10-22 | 2022-01-28 | 西安奕斯伟材料科技有限公司 | System for be used for selecting separately silicon chip |
-
2014
- 2014-07-10 CN CN201420381228.5U patent/CN203955646U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105983546A (en) * | 2015-02-13 | 2016-10-05 | 中芯国际集成电路制造(上海)有限公司 | Wafer cleaning method |
| CN111383955A (en) * | 2018-12-25 | 2020-07-07 | 夏泰鑫半导体(青岛)有限公司 | Roller for cleaning wafer and cleaning device with roller |
| CN110571137A (en) * | 2019-09-27 | 2019-12-13 | 西安奕斯伟硅片技术有限公司 | Wafer processing method and processing device |
| CN113327873A (en) * | 2021-05-28 | 2021-08-31 | 华海清科股份有限公司 | Wafer cleaning device and wafer cleaning method |
| CN113976467A (en) * | 2021-10-22 | 2022-01-28 | 西安奕斯伟材料科技有限公司 | System for be used for selecting separately silicon chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203955646U (en) | Wafer cleaning device | |
| CN104275317B (en) | Substrate cleaning apparatus and substrate cleaning method | |
| CN105983546A (en) | Wafer cleaning method | |
| KR20120095787A (en) | Substrate cleaning apparatus, substrate cleaning method, display manufacturing apparatus and display manufacturing method | |
| CN102446755B (en) | Method for reducing particle defects after chemically mechanical polishing | |
| CN105619239A (en) | Scratching-preventing chemical mechanical grinding device and chemical mechanical grinding method thereof | |
| CN102441843A (en) | Built-in cleaning structure and method for CMP (chemical mechanical polishing) machine table | |
| CN103909474A (en) | System and Method for CMP Station Cleanliness | |
| CN104347466A (en) | Wafer bearing apparatus | |
| CN110976414A (en) | Ultra-high clean cleaning process for semiconductor aluminum alloy parts | |
| CN106158618A (en) | The minimizing technology of leftover after chemical mechanical grinding | |
| CN203765443U (en) | Composite copper-plated grinding machine | |
| CN201898118U (en) | Wafer cleaning device | |
| CN110957208A (en) | Wafer edge washing method and wafer washing device | |
| CN202003963U (en) | Wafer cleaning device | |
| CN103862364A (en) | Grinding pad, grinding machine table and grinding method | |
| JP2015015284A (en) | Substrate cleaning device and substrate cleaning method | |
| CN102437021A (en) | Cleaning method in chemical mechanical polishing | |
| CN103223637A (en) | Chemical machinery polishing device | |
| CN111048442A (en) | Substrate cleaning member and substrate cleaning apparatus | |
| CN206567987U (en) | Cleaning device and mechanical grinding device | |
| CN111009484B (en) | Wafer cleaning device and wafer cleaning method | |
| CN102513917B (en) | Chemically mechanical polishing preprocess method | |
| CN101944476A (en) | Wafer washing method | |
| KR101213967B1 (en) | Wafer cleaning apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141126 Termination date: 20190710 |