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KR102708464B1 - 반사 방지재 - Google Patents

반사 방지재 Download PDF

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Publication number
KR102708464B1
KR102708464B1 KR1020187018574A KR20187018574A KR102708464B1 KR 102708464 B1 KR102708464 B1 KR 102708464B1 KR 1020187018574 A KR1020187018574 A KR 1020187018574A KR 20187018574 A KR20187018574 A KR 20187018574A KR 102708464 B1 KR102708464 B1 KR 102708464B1
Authority
KR
South Korea
Prior art keywords
group
resin composition
porous filler
curable
epoxy
Prior art date
Application number
KR1020187018574A
Other languages
English (en)
Korean (ko)
Other versions
KR20180103862A (ko
Inventor
나오후미 다카바야시
Original Assignee
주식회사 다이셀
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 다이셀 filed Critical 주식회사 다이셀
Publication of KR20180103862A publication Critical patent/KR20180103862A/ko
Application granted granted Critical
Publication of KR102708464B1 publication Critical patent/KR102708464B1/ko

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/22Expanded, porous or hollow particles
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/22Expanded, porous or hollow particles
    • C08K7/24Expanded, porous or hollow particles inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • H01L33/56
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/013Additives applied to the surface of polymers or polymer particles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Led Device Packages (AREA)
KR1020187018574A 2016-01-15 2017-01-11 반사 방지재 KR102708464B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2016-006638 2016-01-15
JP2016006638 2016-01-15
JP2016173980 2016-09-06
JPJP-P-2016-173980 2016-09-06
PCT/JP2017/000666 WO2017122691A1 (ja) 2016-01-15 2017-01-11 反射防止材

Publications (2)

Publication Number Publication Date
KR20180103862A KR20180103862A (ko) 2018-09-19
KR102708464B1 true KR102708464B1 (ko) 2024-09-24

Family

ID=59310940

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187018574A KR102708464B1 (ko) 2016-01-15 2017-01-11 반사 방지재

Country Status (5)

Country Link
JP (1) JP7127989B2 (zh)
KR (1) KR102708464B1 (zh)
CN (1) CN108369985B (zh)
TW (1) TWI739790B (zh)
WO (1) WO2017122691A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109804276A (zh) * 2016-10-11 2019-05-24 株式会社大赛璐 抗反射材料
EP3743466B1 (en) * 2018-01-23 2021-11-17 Worlée-Chemie GmbH Binder composition and use thereof
CN114262530A (zh) * 2022-01-06 2022-04-01 山西日盛达太阳能科技股份有限公司 一种减反射镀膜溶液、制备方法和光伏玻璃及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009037046A (ja) * 2007-08-02 2009-02-19 Nof Corp 液晶ディスプレイ用防眩性フィルム及びそれを備える液晶ディスプレイ
JP2012151466A (ja) * 2010-12-28 2012-08-09 Nichia Chem Ind Ltd 発光装置
WO2013099193A1 (ja) 2011-12-26 2013-07-04 コニカミノルタ株式会社 Led装置用封止剤、led装置、及びled装置の製造方法
JP2015511254A (ja) 2012-02-01 2015-04-16 スリーエム イノベイティブ プロパティズ カンパニー ナノ構造化材料及び同材料を製造する方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3862413B2 (ja) * 1998-05-12 2006-12-27 富士フイルムホールディングス株式会社 反射防止膜およびそれを用いた画像表示装置
JP4010299B2 (ja) * 2001-06-20 2007-11-21 日亜化学工業株式会社 半導体発光装置とその形成方法
US7119031B2 (en) * 2004-06-28 2006-10-10 Micron Technology, Inc. Methods of forming patterned photoresist layers over semiconductor substrates
CN100394215C (zh) * 2005-05-26 2008-06-11 财团法人工业技术研究院 三维纳米多孔薄膜及其制造方法
JP4275718B2 (ja) 2006-01-16 2009-06-10 パナソニック株式会社 半導体発光装置
JP5082259B2 (ja) 2006-02-28 2012-11-28 日亜化学工業株式会社 つや消し保護部材およびその保護部材を有する発光装置
JP5154773B2 (ja) * 2006-07-19 2013-02-27 リンテック株式会社 反射防止フィルム
JP2011068811A (ja) * 2009-09-28 2011-04-07 Sekisui Chem Co Ltd 光半導体装置用封止剤及び光半導体装置
CN103459469B (zh) 2011-03-30 2015-09-09 旭化成化学株式会社 有机聚硅氧烷、其制造方法和含有有机聚硅氧烷的固化性树脂组合物
KR20120129643A (ko) * 2011-05-20 2012-11-28 동우 화인켐 주식회사 방현성 반사방지 코팅용 조성물, 이를 이용한 방현성 반사방지 필름, 편광판 및 표시장치
TW201509962A (zh) * 2012-06-15 2015-03-16 Mitsubishi Rayon Co 活性能量線硬化性樹脂組成物以及光透射性物品活性能量線硬化性樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009037046A (ja) * 2007-08-02 2009-02-19 Nof Corp 液晶ディスプレイ用防眩性フィルム及びそれを備える液晶ディスプレイ
JP2012151466A (ja) * 2010-12-28 2012-08-09 Nichia Chem Ind Ltd 発光装置
WO2013099193A1 (ja) 2011-12-26 2013-07-04 コニカミノルタ株式会社 Led装置用封止剤、led装置、及びled装置の製造方法
JP2015511254A (ja) 2012-02-01 2015-04-16 スリーエム イノベイティブ プロパティズ カンパニー ナノ構造化材料及び同材料を製造する方法

Also Published As

Publication number Publication date
KR20180103862A (ko) 2018-09-19
TW201731986A (zh) 2017-09-16
WO2017122691A1 (ja) 2017-07-20
TWI739790B (zh) 2021-09-21
CN108369985B (zh) 2022-04-29
JPWO2017122691A1 (ja) 2018-11-01
CN108369985A (zh) 2018-08-03
JP7127989B2 (ja) 2022-08-30

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