KR101977771B1 - Apparatus for treating substrate - Google Patents

Abstract

The present invention provides an apparatus for liquid-treating a substrate. The substrate processing apparatus includes a substrate supporting member on which a substrate is mounted; A processing vessel surrounding a substrate support member; A nozzle for discharging the treatment liquid to the substrate; An imaging unit for acquiring an ejection image of the nozzle; And an illumination member for irradiating light toward the processing container.

Description

[0001] Apparatus for treating substrate [0002]

The present invention relates to an apparatus for liquid-treating a substrate.

Various processes such as photolithography, etching, ashing, thin film deposition, and cleaning process are performed on the semiconductor device and the flat panel display panel. Among these processes, the photolithography is performed sequentially with the application, the exposure, and the development process. The coating step is a step of applying a photosensitive liquid such as a resist to the surface of the substrate. The exposure process is a process for exposing a circuit pattern on a substrate having a photosensitive film formed thereon. The developing step is a step of selectively developing the exposed region of the substrate.

The coating process is a process of applying a photosensitive liquid such as a photoresist on a substrate, and forms a coating film on the entire upper surface of the substrate. Such a coating film should be uniformly formed over its entire area, and its thickness is controlled by the supply amount. Therefore, the formation of the sensitizing solution on the nozzle or the shedding phenomenon may cause a fatal process failure.

Therefore, a module for inspecting the chemical liquid discharge state is provided in the apparatus for performing the coating process. 1 is a cross-sectional view showing an apparatus for performing a general coating process.

Referring to FIG. 1, in the coating process facility, the chemical liquid dispensing inspection module uses a spot light or a bar illumination at a long distance.

The conventional chemical liquid discharge inspection module of this type has the following problems.

First, since the bowl 1 has been moved upwards to the position of the chemical liquid soot, the light 7 and the camera 6 should be installed at a higher level than the bowl 1. [ In this case, an irradiation angle of the illumination light 7 is generated, which makes it difficult to obtain an optimal image. Further, installation positions are limited due to issues such as interference between the illumination 7 and the bowl 1, contamination, and the like. And the distance from the ejection tip of the nozzle 4, which is an object to be inspected, is distant, resulting in insufficient brightness, and it is difficult to obtain an optimum image.

In order to solve such a problem, a method of installing a camera and illumination in the arm 8 directly supporting the nozzle 4 has been proposed. 2, the camera 6 and the illumination 7 are positioned adjacent to the nozzle 4 in the arm 8. Accordingly, the camera 6, the illumination 7, and the nozzle 4 are moved together, and the camera 6, the illumination 7, and the nozzle 4 can maintain a certain distance.

However, due to the weight of the camera 6, the illumination 7 and the nozzle 4, the arm 8 is sagged. This causes the photosensitive liquid to be discharged in an undesired direction, resulting in a process failure. This is because the distance between the nozzle 4 and the substrate is 5 mm, and the nozzle 4 and the substrate can be rubbed against each other. In addition, in the process of supplying the photosensitive liquid onto the substrate, a part of the photosensitive liquid adheres to the camera 6 and the illumination 7, which is mistaken as a contamination of the nozzle 4.

During the movement of the nozzle 4 and the discharge of the photosensitive liquid, vibration is generated in the nozzle 4 and the arm 8. Noise is generated in the picked-up image obtained while the vibration is generated, and it is difficult to check the state of the nozzle 4 accurately.

Korean Published Patent 2006-0037266

An object of the present invention is to provide a substrate processing apparatus capable of shooting an optimal image for inspecting a chemical liquid discharge state.

An object of the present invention is to provide a substrate processing apparatus capable of irradiating light toward a nozzle at a position close to the nozzle.

 The problems to be solved by the present invention are not limited thereto, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a substrate processing apparatus including: a substrate supporting member on which a substrate is mounted; A processing vessel surrounding a substrate support member; A nozzle for discharging the treatment liquid to the substrate; An imaging unit for acquiring an ejection image of the nozzle; And an illumination member for irradiating light toward the processing container.

In addition, the processing vessel may be made of a transparent or translucent material having a reflector or diffuser function so that light irradiated from the illumination member is indirectly irradiated to the nozzle.

The processing vessel may further include: a side wall; And an upper wall extending inwardly from an upper end of the side wall, wherein the illumination member is capable of irradiating light toward the upper wall.

The illumination member may be disposed at an acute angle with respect to an outer surface of the upper wall.

Further, the upper wall may have an end portion having a curved cross-section.

In addition, the upper wall may have an end portion having a polygonal cross section.

In addition, the top wall may have an end section whose cross section is inclined toward the nozzle.

Further, the upper wall may further include a reflection member for reflecting the light of the illumination member on the inner side.

Further, the treatment liquid may include a sensitizing solution, and the light may include infrared rays.

According to the embodiment of the present invention, the processing container itself has a remarkable effect of obtaining an optimal image by irradiating light toward the nozzle.

According to the embodiment of the present invention, the illumination member irradiates the processing container with light, so that the installation position of the illumination member has a remarkable effect without a great limitation.

According to the embodiment of the present invention, even with a small number of illumination members, the nozzle has a remarkable effect of irradiating light at 360 °.

1 is a cross-sectional view showing an apparatus for performing a general coating process.
2 is a sectional view showing an apparatus for shooting a nozzle in general.
3 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present invention.
4 is a cross-sectional view of the facility of FIG.
Fig. 5 is a cross-sectional view of the facility of Fig. 3 viewed from the BB direction.
6 is a cross-sectional view of the equipment of FIG. 3 viewed from the CC direction.
Fig. 7 is a plan view showing the substrate processing apparatus of Fig. 3;
8 is a cross-sectional view showing the substrate processing apparatus of Fig.
9 is a view showing a chemical liquid discharge inspection module.
10 is a view showing a first modification of the processing container.
11 is a view showing a second modification of the processing container.
12 is a view showing a third modification of the processing container.
13 is a view showing a fourth modification of the processing container.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

The facilities of this embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the apparatus of this embodiment can be used to perform a coating process and a developing process on a substrate, which is connected to an exposure apparatus. Hereinafter, a case where a wafer is used as a substrate will be described as an example.

3 is a view of the apparatus of FIG. 3 viewed from the direction AA, FIG. 5 is a view of the apparatus of FIG. 3 viewed from the BB direction, FIG. 6 is a view of the apparatus of FIG. 3 In the CC direction.

3 to 6, the substrate processing apparatus 1 includes a load port 100, an index module 200, a first buffer module 300, a coating and developing module 400, a second buffer module 500 An exposure pre- and post-processing module 600, and an interface module 700.

The load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module 700, Are sequentially arranged in one direction in a single direction.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, 700 are referred to as a first direction 12 and a direction perpendicular to the first direction 12 as viewed from above is referred to as a second direction 14 and a direction in which the first direction 12 and the second And a direction perpendicular to the direction 14 is referred to as a third direction 16.

The substrate W is moved in a state accommodated in the cassette 20. At this time, the cassette 20 has a structure that can be sealed from the outside. For example, as the cassette 20, a front open unified pod (FOUP) having a door at the front can be used.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, 700 will be described in detail.

The load port 100 has a mounting table 120 on which the cassette 20 accommodating the substrates W is placed. A plurality of mounts 120 are provided, and the mounts 200 are arranged in a line along the second direction 14. [ In Fig. 2, four placement tables 120 are provided.

The index module 200 transfers the substrate W between the cassette 20 placed on the table 120 of the load port 100 and the first buffer module 300. The index module 200 has a frame 210, an index robot 220, and a guide rail 230. The frame 210 is provided generally in the shape of an inner rectangular parallelepiped and is disposed between the load port 100 and the first buffer module 300. The frame 210 of the index module 200 may be provided at a lower height than the frame 310 of the first buffer module 300 described later. The index robot 220 and the guide rail 230 are disposed within the frame 210. The index robot 220 is moved in the first direction 12, the second direction 14 and the third direction 16 so that the hand 221 that directly handles the substrate W can be moved and rotated in the first direction 12, the second direction 14, . The index robot 220 has a hand 221, an arm 222, a support 223, and a pedestal 224. The hand 221 is fixed to the arm 222. The arm 222 is provided with a stretchable structure and a rotatable structure. The support base 223 is disposed along the third direction 16 in the longitudinal direction. The arm 222 is coupled to the support 223 to be movable along the support 223. The support 223 is fixedly coupled to the pedestal 224. The guide rails 230 are provided so that their longitudinal direction is arranged along the second direction 14. The pedestal 224 is coupled to the guide rail 230 so as to be linearly movable along the guide rail 230. Further, although not shown, the frame 210 is further provided with a door opener for opening and closing the door of the cassette 20.

The first buffer module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of an inner rectangular parallelepiped and is disposed between the index module 200 and the application and development module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located within the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially disposed in the third direction 16 from below. The second buffer 330 and the cooling chamber 350 are located at a height corresponding to the coating module 401 of the coating and developing module 400 described later and the coating and developing module 400 at a height corresponding to the developing module 402. [ The first buffer robot 360 is spaced apart from the second buffer 330, the cooling chamber 350 and the first buffer 320 by a predetermined distance in the second direction 14.

The first buffer 320 and the second buffer 330 temporarily store a plurality of substrates W, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed within the housing 331 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 332. The housing 331 is constructed so that the index robot 220, the first buffer robot 360 and the developing robot 482 of the developing module 402 described later mount the substrate W on the support 332 in the housing 331 (Not shown) in the direction in which the index robot 220 is provided, in the direction in which the first buffer robot 360 is provided, and in the direction in which the developing robot 482 is provided, so that the developing robot 482 can carry it in or out. The first buffer 320 has a structure substantially similar to that of the second buffer 330. The housing 321 of the first buffer 320 has an opening in a direction in which the first buffer robot 360 is provided and in a direction in which the application unit robot 432 located in the application module 401 described later is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different. According to one example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support base 363. The hand 361 is fixed to the arm 362. The arm 362 is provided in a stretchable configuration so that the hand 361 is movable along the second direction 14. The arm 362 is coupled to the support 363 so as to be linearly movable along the support 363 in the third direction 16. The support base 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support member 363 may be provided longer in the upward or downward direction. The first buffer robot 360 may be provided so that the hand 361 is simply driven in two directions along the second direction 14 and the third direction 16.

The cooling chamber 350 cools the substrate W, respectively. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate W is placed and a cooling means 353 for cooling the substrate W. [ As the cooling means 353, various methods such as cooling with cooling water and cooling using a thermoelectric element can be used. In addition, the cooling chamber 350 may be provided with a lift pin assembly (not shown) for positioning the substrate W on the cooling plate 352. The housing 351 is provided with an index robot 220 so that the developing robot 482 provided in the index robot 220 and a developing module 402 to be described later can carry the substrate W into or out of the cooling plate 352 (Not shown) in the direction provided and the direction in which the developing robot 482 is provided. Further, the cooling chamber 350 may be provided with doors (not shown) for opening and closing the above-described opening.

The application and development module 400 performs a process of applying a photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The application and development module 400 has a generally rectangular parallelepiped shape. The coating and developing module 400 has a coating module 401 and a developing module 402. The application module 401 and the development module 402 are arranged so as to be partitioned into layers with respect to each other. According to one example, the application module 401 is located on top of the development module 402.

The application module 401 includes a process of applying a photosensitive liquid such as a photoresist to the substrate W and a heat treatment process such as heating and cooling for the substrate W before and after the resist application process. The application module 401 has a resist application chamber 410, a bake chamber 420, and a transfer chamber 430. The resist application chamber 410, the bake chamber 420, and the transfer chamber 430 are sequentially disposed along the second direction 14. [ The resist application chamber 410 and the bake chamber 420 are positioned apart from each other in the second direction 14 with the transfer chamber 430 interposed therebetween. A plurality of resist coating chambers 410 are provided, and a plurality of resist coating chambers 410 are provided in the first direction 12 and the third direction 16, respectively. In the figure, six resist coating chambers 410 are provided. A plurality of bake chambers 420 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, six bake chambers 420 are provided. Alternatively, however, the bake chamber 420 may be provided in a greater number.

The transfer chamber 430 is positioned in parallel with the first buffer 320 of the first buffer module 300 in the first direction 12. In the transfer chamber 430, a dispenser robot 432 and a guide rail 433 are positioned. The transfer chamber 430 has a generally rectangular shape. The applicator robot 432 is connected to the bake chambers 420, the resist application chambers 400, the first buffer 320 of the first buffer module 300, and the first buffer module 500 of the second buffer module 500 And transfers the substrate W between the cooling chambers 520. The guide rails 433 are arranged so that their longitudinal directions are parallel to the first direction 12. The guide rails 433 guide the applying robot 432 to move linearly in the first direction 12. The applicator robot 432 has a hand 434, an arm 435, a support 436, and a pedestal 437. The hand 434 is fixed to the arm 435. The arm 435 is provided in a stretchable configuration so that the hand 434 is movable in the horizontal direction. The support 436 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 435 is coupled to the support 436 so as to be linearly movable in the third direction 16 along the support 436. The support 436 is fixedly coupled to the pedestal 437 and the pedestal 437 is coupled to the guide rail 433 so as to be movable along the guide rail 433.

The resist coating chambers 410 all have the same structure. However, the types of the photoresist used in each of the resist coating chambers 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist. The resist coating chamber 410 is provided with a substrate processing apparatus 800 for applying a photoresist on the substrate W. [

The substrate processing apparatus 800 is subjected to a liquid coating process. The substrate processing apparatus 800 will be described in detail later.

3 to 6, the bake chamber 420 heat-treats the substrate W. As shown in FIG. For example, the bake chambers 420 may be formed by a prebake process for heating the substrate W to a predetermined temperature to remove organic substances and moisture on the surface of the substrate W, A soft bake process is performed after coating the substrate W on the substrate W, and a cooling process for cooling the substrate W after each heating process is performed. The bake chamber 420 has a cooling plate 421 or a heating plate 422. The cooling plate 421 is provided with a cooling means 423 such as a cooling water or a thermoelectric element. The heating plate 422 is also provided with a heating means 424, such as a hot wire or a thermoelectric element. The cooling plate 421 and the heating plate 422 may be provided in a single bake chamber 420, respectively. Optionally, some of the bake chambers 420 may include only the cooling plate 421, and the other portions may include only the heating plate 422.

The developing module 402 includes a developing process for supplying a developing solution to obtain a pattern on the substrate W to remove a part of the photoresist and a heat treatment process such as heating and cooling performed on the substrate W before and after the developing process .

The development module 402 has a development chamber 460, a bake chamber 470, and a transfer chamber 480. The development chamber 460, the bake chamber 470, and the transfer chamber 480 are sequentially disposed along the second direction 14. The development chamber 460 and the bake chamber 470 are positioned apart from each other in the second direction 14 with the transfer chamber 480 therebetween.

A plurality of developing chambers 460 are provided, and a plurality of developing chambers 460 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, six development chambers 460 are provided. A plurality of bake chambers 470 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, six bake chambers 470 are provided. Alternatively, however, the bake chamber 470 can be provided in greater numbers.

The transfer chamber 480 is positioned in parallel with the second buffer 330 of the first buffer module 300 in the first direction 12. In the transfer chamber 480, the developing robot 482 and the guide rail 483 are positioned. The delivery chamber 480 has a generally rectangular shape. The development robot 482 is connected to the bake chambers 470 and the development chambers 460 and the second buffer 330 and the cooling chamber 350 of the first buffer module 300 and the second buffer module 500, And the second cooling chamber 540 of the second cooling chamber 540. The guide rail 483 is arranged such that its longitudinal direction is parallel to the first direction 12. The guide rail 483 guides the developing robot 482 to linearly move in the first direction 12. The developing sub-robot 482 has a hand 484, an arm 485, a supporting stand 486, and a pedestal 487. The hand 484 is fixed to the arm 485. The arm 485 is provided in a stretchable configuration to allow the hand 484 to move in a horizontal direction. The support 486 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 485 is coupled to the support 486 such that it is linearly movable along the support 486 in the third direction 16. The support table 486 is fixedly coupled to the pedestal 487. The pedestal 487 is coupled to the guide rail 483 so as to be movable along the guide rail 483.

The development chambers 460 all have the same structure. However, the types of developers used in the respective developing chambers 460 may be different from each other. The development chamber 460 removes a region of the photoresist on the substrate W where light is irradiated. At this time, the area of the protective film irradiated with the light is also removed. Depending on the type of selectively used photoresist, only the areas of the photoresist and protective film that are not irradiated with light can be removed.

The development chamber 460 has a container 461, a support plate 462, and a nozzle 463. The container 461 has a cup shape with its top opened. The support plate 462 is located in the container 461 and supports the substrate W. The support plate 462 is rotatably provided. The nozzle 463 supplies the developer onto the substrate W placed on the support plate 462. The nozzle 463 has a circular tube shape and can supply developer to the center of the substrate W. [ Alternatively, the nozzle 463 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 463 may be provided with a slit. Further, the developing chamber 460 may further be provided with a nozzle 464 for supplying a cleaning liquid such as deionized water to clean the surface of the substrate W to which the developer is supplied.

The bake chamber 470 heat-treats the substrate W. For example, the bake chambers 470 may include a post-bake process for heating the substrate W before the development process is performed, a hard bake process for heating the substrate W after the development process is performed, And a cooling step for cooling the wafer. The bake chamber 470 has a cooling plate 471 or a heating plate 472. The cooling plate 471 is provided with a cooling means 473 such as a cooling water or a thermoelectric element. Or the heating plate 472 is provided with a heating means 474 such as a hot wire or a thermoelectric element. The cooling plate 471 and the heating plate 472 may be provided in one bake chamber 470, respectively. Optionally, some of the bake chambers 470 may have only a cooling plate 471, while the other may have only a heating plate 472. [

As described above, in the application and development module 400, the application module 401 and the development module 402 are provided to be separated from each other. In addition, the application module 401 and the development module 402 may have the same chamber arrangement as viewed from above.

The second buffer module 500 is provided as a path through which the substrate W is transferred between the coating and developing module 400 and the pre- and post-exposure processing module 600. The second buffer module 500 performs a predetermined process on the substrate W such as a cooling process or an edge exposure process. The second buffer module 500 includes a frame 510, a buffer 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560 I have. The frame 510 has a rectangular parallelepiped shape. The buffer 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560 are located within the frame 510. The buffer 520, the first cooling chamber 530, and the edge exposure chamber 550 are disposed at a height corresponding to the application module 401. The second cooling chamber 540 is disposed at a height corresponding to the development module 402. The buffer 520, the first cooling chamber 530, and the second cooling chamber 540 are sequentially arranged in a row along the third direction 16. The buffer 520 is disposed along the first direction 12 with the transfer chamber 430 of the application module 401. [ The edge exposure chamber 550 is spaced a certain distance in the second direction 14 from the buffer 520 or the first cooling chamber 530.

The second buffer robot 560 carries the substrate W between the buffer 520, the first cooling chamber 530, and the edge exposure chamber 550. A second buffer robot 560 is positioned between the edge exposure chamber 550 and the buffer 520. The second buffer robot 560 may be provided in a structure similar to that of the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform a subsequent process on the wafers W that have been processed in the application module 401. The first cooling chamber 530 cools the substrate W processed in the application module 401. The first cooling chamber 530 has a structure similar to the cooling chamber 350 of the first buffer module 300. The edge exposure chamber 550 exposes its edge to the wafers W that have undergone the cooling process in the first cooling chamber 530. The buffer 520 temporarily stores the substrate W before the substrates W processed in the edge exposure chamber 550 are transported to the preprocessing module 601 described later. The second cooling chamber 540 cools the wafers W before the wafers W processed in the post-processing module 602 described below are conveyed to the developing module 402. The second buffer module 500 may further have a buffer added to the height corresponding to the development module 402. In this case, the wafers W processed in the post-processing module 602 may be temporarily stored in the added buffer and then transferred to the developing module 402. [

The pre- and post-exposure processing module 600 may process a process of applying a protective film for protecting the photoresist film applied to the substrate W during liquid immersion exposure, when the exposure apparatus 900 performs the liquid immersion exposure process. In addition, the pre- and post-exposure processing module 600 may perform a process of cleaning the substrate W after exposure. In addition, when the coating process is performed using the chemically amplified resist, the pre- and post-exposure processing module 600 can process the post-exposure bake process.

The pre-exposure post-processing module 600 has a pre-processing module 601 and a post-processing module 602. The pre-processing module 601 performs a process of processing the substrate W before the exposure process, and the post-process module 602 performs a process of processing the substrate W after the exposure process. The pre-processing module 601 and the post-processing module 602 are arranged so as to be partitioned into layers with respect to each other. According to one example, the preprocessing module 601 is located on top of the post-processing module 602. The preprocessing module 601 is provided at the same height as the application module 401. The post-processing module 602 is provided at the same height as the developing module 402. The pretreatment module 601 has a protective film application chamber 610, a bake chamber 620, and a transfer chamber 630. The protective film application chamber 610, the transfer chamber 630, and the bake chamber 620 are sequentially disposed along the second direction 14. The protective film application chamber 610 and the bake chamber 620 are positioned apart from each other in the second direction 14 with the transfer chamber 630 therebetween. A plurality of protective film application chambers 610 are provided and are arranged along the third direction 16 to form layers. Alternatively, a plurality of protective film application chambers 610 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of bake chambers 620 are provided and are disposed along the third direction 16 to form layers. Alternatively, a plurality of bake chambers 620 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 630 is positioned in parallel with the first cooling chamber 530 of the second buffer module 500 in the first direction 12. In the transfer chamber 630, a pre-processing robot 632 is located. The transfer chamber 630 has a generally square or rectangular shape. The preprocessing robot 632 is connected between the protective film application chambers 610, the bake chambers 620, the buffer 520 of the second buffer module 500 and the first buffer 720 of the interface module 700, The substrate W is transferred. The preprocessing robot 632 has a hand 633, an arm 634, and a support 635. The hand 633 is fixed to the arm 634. The arm 634 is provided with a retractable structure and a rotatable structure. The arm 634 is coupled to the support 635 so as to be linearly movable along the support 635 in the third direction 16.

The protective film applying chamber 610 applies a protective film for protecting the resist film on the substrate W during liquid immersion exposure. The protective film application chamber 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 has a cup shape with its top opened. The support plate 612 is located in the housing 611 and supports the substrate W. [ The support plate 612 is rotatably provided. The nozzle 613 supplies a protective liquid for forming a protective film onto the substrate W placed on the supporting plate 612. The nozzle 613 has a circular tube shape and can supply the protective liquid to the center of the substrate W. [ Alternatively, the nozzle 613 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 613 may be provided with a slit. In this case, the support plate 612 may be provided in a fixed state. The protective liquid includes a foamable material. The protective liquid may be a photoresist and a material having a low affinity for water. For example, the protective liquid may contain a fluorine-based solvent. The protective film application chamber 610 supplies the protective liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 612.

The bake chamber 620 heat-treats the substrate W coated with the protective film. The bake chamber 620 has a cooling plate 621 or a heating plate 622. The cooling plate 621 is provided with a cooling means 623 such as a cooling water or a thermoelectric element. Or heating plate 622 is provided with a heating means 624, such as a hot wire or a thermoelectric element. The heating plate 622 and the cooling plate 621 may be provided in a single bake chamber 620, respectively. Optionally, some of the bake chambers 620 may have only the heating plate 622, while others may only have the cooling plate 621.

The post-processing module 602 has a cleaning chamber 660, a post-exposure bake chamber 670, and a delivery chamber 680. The cleaning chamber 660, the transfer chamber 680, and the post-exposure bake chamber 670 are sequentially disposed along the second direction 14. Accordingly, the cleaning chamber 660 and the post-exposure baking chamber 670 are positioned apart from each other in the second direction 14 with the transfer chamber 680 therebetween. A plurality of cleaning chambers 660 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of cleaning chambers 660 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of post-exposure bake chambers 670 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of post-exposure bake chambers 670 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 680 is positioned in parallel with the second cooling chamber 540 of the second buffer module 500 in the first direction 12 as viewed from above. The transfer chamber 680 has a generally square or rectangular shape. A post processing robot 682 is located in the transfer chamber 680. The post-processing robot 682 is connected to the cleaning chambers 660, post-exposure bake chambers 670, the second cooling chamber 540 of the second buffer module 500, and the second And transfers the substrate W between the buffers 730. The postprocessing robot 682 provided in the postprocessing module 602 may be provided with the same structure as the preprocessing robot 632 provided in the preprocessing module 601. [

The cleaning chamber 660 cleans the substrate W after the exposure process. The cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. The housing 661 has a cup shape with an open top. The support plate 662 is located in the housing 661 and supports the substrate W. [ The support plate 662 is rotatably provided. The nozzle 663 supplies the cleaning liquid onto the substrate W placed on the support plate 662. As the cleaning liquid, water such as deionized water may be used. The cleaning chamber 660 supplies the cleaning liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 662. Optionally, while the substrate W is rotating, the nozzle 663 may move linearly or rotationally from the central region of the substrate W to the edge region.

The post-exposure bake chamber 670 heats the substrate W subjected to the exposure process using deep UV light. The post-exposure baking step heats the substrate W and amplifies the acid generated in the photoresist by exposure to complete the property change of the photoresist. The post-exposure bake chamber 670 has a heating plate 672. The heating plate 672 is provided with a heating means 674 such as a hot wire or a thermoelectric element. The post-exposure bake chamber 670 may further include a cooling plate 671 therein. The cooling plate 671 is provided with a cooling means 673 such as a cooling water or a thermoelectric element. Further, a bake chamber having only the cooling plate 671 may be further provided.

As described above, the pre-processing module 601 and the post-processing module 602 in the pre-exposure processing module 600 are provided to be completely separated from each other. In addition, the transfer chamber 630 of the preprocessing module 601 and the transfer chamber 680 of the post-processing module 602 are provided in the same size and can be provided so as to completely overlap each other when viewed from above. Further, the protective film application chamber 610 and the cleaning chamber 660 may be provided to have the same size as each other and be provided so as to completely overlap with each other when viewed from above. Further, the bake chamber 620 and the post-exposure bake chamber 670 are provided in the same size, and can be provided so as to completely overlap each other when viewed from above.

The interface module 700 transfers the substrate W between the exposure pre- and post-processing module 600 and the exposure apparatus 900. The interface module 700 has a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, the second buffer 730, and the interface robot 740 are located within the frame 710. The first buffer 720 and the second buffer 730 are spaced apart from each other by a predetermined distance and are stacked on each other. The first buffer 720 is disposed higher than the second buffer 730. The first buffer 720 is positioned at a height corresponding to the preprocessing module 601 and the second buffer 730 is positioned at a height corresponding to the postprocessing module 602. The first buffer 720 is arranged in a line along the first direction 12 with the transfer chamber 630 of the preprocessing module 601 while the second buffer 730 is arranged in the postprocessing module 602, Are arranged in a line along the first direction 12 with the transfer chamber 630 of the transfer chamber 630. [

The interface robot 740 is spaced apart from the first buffer 720 and the second buffer 730 in the second direction 14. The interface robot 740 carries the substrate W between the first buffer 720, the second buffer 730 and the exposure apparatus 900. The interface robot 740 has a structure substantially similar to that of the second buffer robot 560.

The first buffer 720 temporarily stores the substrates W processed in the preprocessing module 601 before they are transferred to the exposure apparatus 900. The second buffer 730 temporarily stores the processed substrates W in the exposure apparatus 900 before they are transferred to the post-processing module 602. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed within the housing 721 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 722. The housing 721 is movable in the direction in which the interface robot 740 is provided and in the direction in which the interface robot 740 and the preprocessing robot 632 transfer the substrate W to and from the support table 722, 632 are provided with openings (not shown) in the direction in which they are provided. The second buffer 730 has a structure substantially similar to that of the first buffer 720. However, the housing 4531 of the second buffer 730 has an opening (not shown) in the direction in which the interface robot 740 is provided and in a direction in which the postprocessing robot 682 is provided. The interface module may be provided with only buffers and robots as described above without providing a chamber to perform a predetermined process on the wafer.

FIG. 7 is a plan view showing the substrate processing apparatus of FIG. 3, and FIG. 8 is a sectional view showing the substrate processing apparatus of FIG.

7 and 8, the substrate processing apparatus 800 includes a housing 810, an airflow providing unit 820, a substrate supporting unit 830, a processing vessel 850, a lift unit 890, (840), and a chemical liquid discharge inspection module (880).

The housing 810 is provided in a rectangular tubular shape having a space 812 therein. An opening (not shown) is formed at one side of the housing 810. The opening serves as an inlet through which the substrate W is carried in and out. The opening is provided with a door, and the door opens and closes the opening. When the substrate processing process is performed, the door is closed to seal the inner space 812 of the housing 810. An inner exhaust port 814 and an outer exhaust port 816 are formed on the lower surface of the housing 810. The airflow formed in the housing 810 is exhausted to the outside through the inner exhaust port 814 and the outer exhaust port 816. According to one example, the airflow provided in the processing vessel 850 is exhausted through the inner exhaust port 814, and the airflow provided outside the processing vessel 850 can be exhausted through the outer exhaust port 816.

The airflow providing unit 820 forms a downward flow in the inner space of the housing 810. The airflow providing unit 820 includes an airflow supply line 822, a fan 824, and a filter 826. The airflow supply line 822 is connected to the housing 810. The air supply line 822 supplies external air to the housing 810. The filter 826 links the air provided from the airflow supply line 822 to the filter 826. The filter 826 removes impurities contained in the air. The fan 824 is mounted on the upper surface of the housing 810. The fan 824 is located in a central region in the upper surface of the housing 810. The fan 824 forms a downward flow in the inner space of the housing 810. When air is supplied to the fan 824 from the airflow supply line 822, the fan 824 supplies air in a downward direction.

The substrate support unit 830 supports the substrate W in the inner space of the housing 810. The substrate support unit 830 rotates the substrate W. The substrate support unit 830 includes a spin chuck 832, a rotation axis 834, and a driver 836. The spin chuck 832 is provided with a substrate support member 832 for supporting the substrate. The spin chuck 832 is provided to have a circular plate shape. The substrate W contacts the upper surface of the spin chuck 832. The spin chuck 832 is provided so as to have a smaller diameter than the substrate W. [ According to one example, the spin chuck 832 can vacuum-suck the substrate W and chuck the substrate W. Alternatively, the spin chuck 832 may be provided with an electrostatic chuck for chucking the substrate W using static electricity. The spin chuck 832 can also chuck the substrate W by physical force.

The rotation shaft 834 and the driver 836 are provided as rotation drive members 834 and 836 for rotating the spin chuck 832. [ The rotating shaft 834 supports the spin chuck 832 below the spin chuck 832. The rotary shaft 834 is provided such that its longitudinal direction is directed up and down. The rotation shaft 834 is provided so as to be rotatable about its central axis. The driver 836 provides a driving force such that the rotation shaft 834 is rotated. For example, the driver 836 may be a motor capable of varying the rotational speed of the rotating shaft.

The liquid supply unit 840 supplies the treatment liquid and the pre-wet liquid onto the substrate W. The liquid supply unit 840 includes a guide member 846, a vertical axis 847, an arm 848, and a treatment nozzle 844.

The guide member 846 includes a guide rail 846 that moves the arm 848 in the horizontal direction. The guide rail 846 is located on one side of the processing vessel 850. The guide rail 846 is provided such that its longitudinal direction is directed to the horizontal direction. According to one example, the longitudinal direction of the guide rail 846 may be provided so as to be directed in a direction parallel to the first direction.

The guide rail 846 is provided with a vertical axis 847. The vertical axis 847 is provided in a bar shape whose longitudinal direction faces the third direction 16. The lower end of the vertical shaft 847 is provided on the guide rail. The vertical axis 847 is linearly movable by a driving member (not shown) provided in the guide rail 846. The vertical axis 847 can be linearly moved along the longitudinal direction of the guide rail 846. For example, the driving member (not shown) may be a linear motor. An arm 848 is provided on one side of the vertical axis 847.

The arm 848 is provided in a bar shape. The arm 848 has a longitudinal direction perpendicular to the vertical axis 847. The longitudinal direction of the arm 848 is provided so as to face the direction perpendicular to the guide rail. A treatment nozzle 844 is fixedly coupled to one end of the arm 848, and the other end is installed on a vertical axis 847. The treatment nozzles 844 are arranged in a direction parallel to the longitudinal direction of the guide rails 846 when viewed from above.

The treatment liquid may be a photosensitive liquid such as a photoresist. Although a single processing nozzle 844 is described as being installed in the arm 848 in this embodiment, a plurality of processing nozzles 844 may be provided, each of which may be arranged in a line in the arm 848. Each treatment nozzle 844 can discharge a different kind of sensitizing solution.

The processing vessel 850 is located in the interior space 812 of the housing 810. The processing vessel 850 provides a processing space therein. The processing vessel 850 is provided so that the upper portion thereof has an open cup shape. The processing vessel 850 includes an inner cup 852 and an outer cup 862.

The inner cup 852 is provided in the shape of a circular plate surrounding the rotation shaft 834. The inner cup 852 is positioned to overlap the inner vent 814 when viewed from above. The upper surface of the inner cup 852 is provided such that its outer and inner regions are inclined at different angles from each other. According to one example, the outer region of the inner cup 852 is oriented downwardly away from the substrate support unit 830, and the inner region is oriented in an upward sloping direction away from the substrate support unit 830 Lt; / RTI > A point where the outer region and the inner region of the inner cup 852 meet with each other is vertically provided in correspondence with the side end portion of the substrate W. [ The upper surface area of the inner cup 852 is provided to be rounded. The upper surface area of the inner cup 852 is provided downwardly concave. The upper surface area of the inner cup 852 may be provided in a region where the processing liquid flows.

The outer cup 862 is provided to have a cup shape that encloses the substrate support unit 830 and the inner cup 852. The outer cup 862 has a bottom wall 864, a side wall 866, and a top wall 870. The bottom wall 864 is provided to have a circular plate shape having a hollow. A collection line 865 is formed in the bottom wall 864. The recovery line 865 recovers the treatment liquid supplied on the substrate W. [ The treatment liquid recovered by the recovery line 865 can be reused by an external liquid recovery system. The side wall 866 is provided to have a circular tubular shape surrounding the substrate supporting unit 830. The side wall 866 extends in a vertical direction from the side edge of the bottom wall 864. The side wall 866 extends upwardly from the bottom wall 864.

The top wall 870 extends from the top of the side wall 866 inward of the outer cup 862. [ The upper wall 870 is provided so as to approach the substrate supporting unit 830 as it goes up. The upper wall 870 is provided to have a ring shape. The upper end of the upper wall 870 is positioned higher than the substrate W supported on the substrate supporting unit 830. [

The top wall 870 may be made of a transparent or semi-transparent material. The upper wall 870 has a reflector or diffuser function to indirectly direct the light provided from the illumination member toward the treatment nozzle 844. [ The upper wall 870 includes an outer surface 872 corresponding to an incident surface on which light is incident from the illumination member, an inner surface 874 through which part of the light incident on the upper wall 870 passes, And an exit surface 876 through which light is emitted toward the treatment nozzle 844. [

The lifting unit 890 lifts the inner cup 852 and the outer cup 862, respectively. The elevating unit 890 includes an inside moving member 892 and an outside moving member 894. The inner moving member 892 lifts the inner cup 852 and the outer moving member 894 moves the outer cup 862 up and down.

The chemical solution discharge test module 880 may include a camera 882, an illumination member 884, and a control unit 889. [

The camera 882 photographs the state of the treatment nozzle 844 or the liquid state discharged from the treatment nozzle 844. [ 9 is a view showing a chemical liquid discharge inspection module.

Referring to Fig. 9, a camera 882 is installed above the processing vessel 850. Fig. The photographing direction of the camera 910 is provided to face the processing nozzle.

The illumination member 884 provides illumination for the camera 882 to capture the condition of the treatment nozzles 844 and the liquid conditions dispensed from the treatment nozzles 844. According to one example, the light source of the illumination member 884 used for photographing may be a laser including infrared rays.

The illumination member 884 is positioned adjacent the top wall 870 of the processing vessel 850. In this embodiment, the two illumination members 930 are arranged at intervals of 180 degrees. However, the illumination members are not limited thereto and may be disposed at equal intervals of three or more. The light irradiation direction of the illumination member 884 is provided so as to face the upper wall 870 of the processing vessel 850. The illumination member 884 may be arranged such that the light irradiation angle forms an acute angle K with respect to the outer surface 872 of the upper wall 870. [ Light from the illumination member 884 is incident on the outer surface 872 of the top wall 870. A portion of the light incident on the outer surface 982 of the top wall 870 is transmitted through the top wall 870 to the inner surface 874 of the top wall 870 while the other portion is scattered and diffused within the top wall 870 And is emitted through the exit surface 876 and the outer surface 872 of the upper wall 870. As described above, in the present invention, the upper wall 870 of the processing vessel 850 functions as a single illumination function, so that it can provide light toward the processing nozzle 844 that discharges the processing liquid from above the substrate.

The controller 889 compares the captured image obtained from the camera 882 with the set image to determine the status and liquid status of the process nozzle 844. [ According to one example, if the photographing area includes the inner area of the processing nozzle 844, the controller 889 can determine the degree of the quarts of the processing liquid and the presence or absence of bubbles in the processing liquid. Further, when the photographing area includes the discharge end of the treatment nozzle 844, the controller 889 can determine the liquid flow and the liquid flow in the treatment nozzle 844. [ Further, if the photographing area includes an area between the discharge end of the processing nozzle 844 and the substrate W, the controller 889 can determine the liquid dropping while the processing liquid is being discharged.

10 is a view showing a first modification of the processing container.

As shown in FIG. 10, the upper wall 870a of the processing vessel is provided with a substantially similar structure and function as the upper wall 870 shown in FIG. 9, and a modification will now be described focusing on differences from the present embodiment .

The top wall 870a may be shaped to have a curved cross section of the exit surface 876a to enhance diffusion of light to the treatment nozzle 844. [

11 is a view showing a second modification of the processing container.

11, the upper wall 870b of the processing vessel is provided with a configuration and function substantially similar to the upper wall 870 shown in FIG. 9, and a modification will now be described focusing on differences from the present embodiment .

The upper wall 870b may have a polygonal cross section of the exit surface 876b to enhance the diffusion of the light irradiated to the treatment nozzle 844. [

12 is a view showing a third modification of the processing container.

12, the upper wall 870c of the processing vessel is provided with a structure and function substantially similar to the upper wall 870 shown in FIG. 9, and a modification will now be described focusing on differences from the present embodiment .

Upper wall 870c may be shaped to have an end face of exit face 876c inclined toward the nozzle to enhance diffusion of light to the processing nozzle 844. [

13 is a view showing a fourth modification of the processing container.

13, the upper wall 870d of the processing vessel is provided with a structure and function that are generally similar to the upper wall 870 shown in FIG. 9, and a modification will now be described focusing on differences from the present embodiment .

The top wall 870d may include a reflective member 873 to reduce the light loss transmitted to the inner side 874. The reflective member 873 may be provided in the form of a sheet adhering to the inner surface 874 or through the surface processing of the inner surface or in the form of a coating film applied to the inner surface.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims. It will be possible.

844: Processing nozzle 847: Vertical axis
848: Arm 850: Processing vessel
880: chemical liquid discharge test module 882: camera
884:

Claims (9)

A substrate supporting member on which the substrate is mounted;
A processing enclosure surrounding the substrate support member and including a sidewall and a top wall extending inwardly from a top of the sidewall;
A nozzle for discharging the treatment liquid to the substrate;
An imaging unit for acquiring an ejection image of the nozzle; And
And an illumination member for irradiating light toward the upper wall of the processing vessel;
The upper wall
A reflector or a diffuser function so that light emitted from the illumination member is indirectly irradiated onto the nozzle,
Wherein the upper wall is provided with an exit surface through which light is emitted toward the nozzle toward the nozzle. delete delete The method according to claim 1,
The illumination member
Wherein the upper surface of the upper wall is disposed at an acute angle with respect to an outer surface of the upper wall. The method according to claim 1,
The exit surface
And the end face has an end portion shaped into a curved surface. The method according to claim 1,
The exit surface
And the end face has an end portion formed in a polygonal shape. The method according to claim 1,
The exit surface
Wherein the end face has an end inclined toward the nozzle. The method according to claim 1,
The upper wall
And a reflecting member for reflecting the light of the illumination member on an inner surface thereof. The method according to claim 1,
Wherein the treatment liquid comprises a photosensitive liquid,
Wherein the light comprises infrared light.

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