KR102119683B1 - Home port, Apparatus and Method for treating substrate with the home port - Google Patents

Abstract

Embodiments of the present invention provide an apparatus and method for liquid processing a substrate.
According to one embodiment, an apparatus for processing a substrate includes a substrate processing unit having a substrate support member supporting a substrate, a nozzle for supplying a processing liquid to the substrate, and a nozzle movement for moving the nozzle between the processing unit and the home port A liquid supply unit having a member and a home port disposed on one side of the substrate processing unit, wherein the home port includes: a body having an internal space with an open top; It includes a cover for blocking the interior space, the cover may be formed with a first opening and a second opening.
In the standby stage, the nozzle of the liquid supply unit is inserted into the first opening. In the step of checking the distance at which the processing liquid is sucked from the discharge portion, the nozzle of the liquid supply unit is located at the top of the second opening. Due to this, it is possible to prevent the contamination of the opening and the nozzle by separating the opening where the nozzle is located in the atmospheric step and the step of checking the treatment liquid suction distance.

Description

Home port, Apparatus and Method for treating substrate with the home port

The present invention relates to an apparatus and method for liquid processing a substrate.

Processes for manufacturing semiconductor devices or liquid crystal displays include various processes such as photography, etching, ashing, ion implantation, thin film deposition, and cleaning. Of these, the photo process is a process of sequentially applying, exposing and developing processes. As a coating process, a process of applying a photoresist such as photoresist on a substrate is performed.

In general, in the coating process, a process step of supplying a photoresist solution onto a substrate carried into the processing unit with a photoresist nozzle and a waiting step of waiting before the substrate is brought into the processing unit are repeatedly performed. During the standby phase, the photoresist nozzle waits in the home port. When the waiting time is long, it is possible to prevent the photoresist from adhering in the photoresist nozzle by discharging the photoresist into the home port at regular intervals.

In addition, after processing a certain time or a certain number of sheets of the substrate, the device is maintained. During maintenance, a process of inspecting the condition of the nozzle is performed. The inspection items include the suction state of the photoresist when the photoresist is discharged from the photoresist nozzle and then sucked into the nozzle.

1A is a cross-sectional view showing a typical home port. Referring to FIG. 1, the home port includes a body 2 in which a space 4 is formed. The photosensitive liquid in the inner space 4 of the body 2 is discharged. An opening 6 into which a nozzle can be inserted is formed on the upper surface of the body 2.

1B is a cross-sectional view showing a general state in the standby stage of the liquid supply unit 7. In the standby stage, the nozzle of the liquid supply unit 7 is inserted into the opening 6.

1C is a cross-sectional view showing a state of the discharge unit 8 when the nozzle 9 of the liquid supply unit 7 moves from the standby stage to the process stage. When the photosensitive liquid falls while the nozzle 9 moves, the home port and the nozzle may be contaminated, and the discharge portion of the nozzle 9 is sucked to move the processing liquid by a set distance (a).

1D is a cross-sectional view showing a state in which the liquid supply unit 7 discharges the photosensitive liquid in the step of checking the suction height of the treatment liquid. In general, in order to confirm the suction state of the treatment liquid, the photoresist nozzle includes a transparent material, and is visually checked after suction. Therefore, the discharge of the photoresist liquid from the photoresist nozzle is performed in a state where the photoresist nozzle is positioned on the top of the home port with a certain distance from the home port. Therefore, after discharging the treatment liquid, the discharge portion of the nozzle 9 is sucked to check the suction height of the treatment liquid. However, when the nozzle 9 of the liquid supply unit 7 is inserted into the opening 6 as shown in Fig. 1B, the suction height of the processing liquid cannot be confirmed. Therefore, the nozzle 9 is positioned at the top of the opening 6 to check the suction height of the treatment liquid.

In the step of checking the suction height of the processing liquid, the nozzle 9 is positioned above the opening 6 to discharge the photosensitive liquid. In this case, the opening 6 may be contaminated. Subsequently, when the nozzle 9 is inserted into the contaminated opening 6 in the standby stage, the nozzle 9 may be contaminated, and contaminants attached to the nozzle 9 during the movement of the nozzle during the subsequent process It may fall on the substrate and damage the substrate.

An object of the present invention is to provide an apparatus and method capable of preventing contamination of openings and nozzles in a home port.

The object of the present invention is not limited to this, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

Embodiments of the present invention provide an apparatus and method for liquid processing a substrate.

According to one embodiment, an apparatus for processing a substrate includes a substrate processing unit having a substrate support member supporting a substrate, a nozzle for supplying a processing liquid to the substrate, and a nozzle movement for moving the nozzle between the processing unit and the home port A liquid supply unit having a member and a home port disposed on one side of the substrate processing unit, wherein the home port includes a body having an inner space with an open top and a cover blocking the inner space, and the cover In the first opening and the second opening may be formed.

The substrate processing apparatus further includes a controller for controlling the nozzle moving member, wherein the controller is inserted into the interior space through the first opening when the nozzle waits in the home port, and the nozzle is The nozzle moving member can be controlled to be discharged through the second opening when it is located at the upper portion of the home port to discharge the treatment liquid into the interior space.

The substrate processing apparatus further includes a controller for controlling the nozzle moving member, and the home port includes a home port moving member coupled to the body to move the position of the home port, and the controller includes: When waiting in the home port, the nozzle is inserted into the interior space through the first opening, and when the nozzle is located above the home port to discharge the processing liquid into the interior space, the second opening is opened. The nozzle moving member and the home port moving member may be controlled to discharge through.

After the nozzle discharges the processing liquid through the second opening, the nozzle may be provided with a transparent material so that the processing liquid is sucked into the nozzle for a predetermined distance and the distance at which the processing liquid is sucked can be checked.

The treatment liquid may be a photosensitive liquid.

According to one embodiment, an apparatus for processing a substrate includes a substrate processing unit having a substrate support member supporting a substrate, a nozzle for supplying a processing liquid to the substrate, and a nozzle movement for moving the nozzle between the processing unit and the home port A liquid supply unit having a member and a substrate port disposed on one side of the substrate processing unit, the discharge port is discharged from the nozzle when the processing liquid is discharged to check the state of the nozzle and the home port having an internal space to wait. It may include a liquid receiving member having a receiving space for receiving the processing liquid.

The state of the nozzle may include a discharge state of the processing liquid discharged from the nozzle or a suction state of the processing liquid into the nozzle.

It is further coupled to the liquid receiving member and further includes a liquid receiving moving member for moving the position of the receiving member and a controller for controlling the moving member receiving member,

In the controller, when the liquid receiving member discharges the processing liquid from the nozzle, the receiving space is located on the upper portion of the home port, and the liquid receiving member is moved while the nozzle is located in the interior space. The liquid receiving member may be moved to a position that does not interfere with the movement of the nozzle.

The treatment liquid may be a photosensitive liquid.

According to one embodiment, a method of processing a substrate provides a first opening and a second opening communicating with the interior space of the home port on an upper surface of the home port, and the nozzle is supplied to the home port from a nozzle that supplies a processing liquid. When waiting, it is inserted through the first opening, and when discharging the processing liquid from the top of the home port to the interior space of the home port, it can be discharged through the second opening.

After discharging the treatment liquid through the second opening, the inside of the nozzle is sucked to move the treatment liquid within a predetermined distance within the nozzle, and the suction height of the treatment liquid can be confirmed.

The nozzle is provided with a transparent portion of the discharge portion, and the suction height of the processing liquid can be confirmed from the outside of the nozzle.

The suction height check of the processing liquid is performed in the maintenance step, and after the processing liquid is discharged from the processing unit to the substrate, the nozzle may wait in the interior space before the next substrate is brought into the processing unit.

The treatment liquid may be a photosensitive liquid.

According to an embodiment, a method of processing a substrate proceeds with a process of discharging a processing liquid from a nozzle to the substrate, but when the nozzle waits during the process in progress with respect to the substrates, it waits in an internal space in the home port and processes When inspecting the state of the nozzle after discharging the liquid, the processing liquid may be discharged into the receiving space of the liquid receiving member.

When the nozzle waits in the internal space in the home port, the liquid receiving member is positioned so that the nozzle does not interfere with the movement to the internal space, and when discharging the liquid to check the condition of the nozzle, the liquid receiving The member may have its accommodation space located above the home port.

The inspection of the state of the nozzle may include an inhalation state of the processing liquid to suck the inside of the nozzle to move the processing liquid at a set distance, and to confirm the suction height of the processing liquid.

The nozzle is provided with a transparent portion of the discharge portion, and the suction height of the processing liquid can be confirmed from the outside of the nozzle.

The treatment liquid may be a photosensitive liquid.

According to an embodiment of the present invention, the home port includes a cover on which the first opening and the second opening are formed. In the standby stage, the nozzle of the liquid supply unit is inserted into the first opening. When the treatment liquid confirms the suction height at the discharge portion, the nozzle of the liquid supply unit is located at the top of the second opening. In the atmospheric step and the step of checking the suction height of the treatment liquid, the opening in which the nozzle is located can be separated to prevent contamination of the opening and the nozzle.

The effects of the present invention are not limited to the above-described effects, and the effects not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

1A is a cross-sectional view showing a typical home port.
1B is a cross-sectional view showing a general state in the standby stage of the liquid supply unit.
Figure 1c is a cross-sectional view showing the appearance of the discharge portion when the nozzle of the liquid supply unit moves from the standby step to the process step.
1D is a cross-sectional view showing a state in which the liquid supply unit discharges the photosensitive liquid in the step of checking the suction height of the treatment liquid.
2 is a cross-sectional view of the substrate processing facility as viewed from the top.
3 is a cross-sectional view of the facility of FIG. 2 viewed from the direction AA.
4 is a cross-sectional view of the facility of FIG. 2 viewed from the direction BB.
5 is a cross-sectional view of the facility of FIG. 2 viewed from the CC direction.
6 is a plan view showing the application chamber of FIG. 2.
7 is a cross-sectional view showing the substrate processing unit of FIG. 6.
8 is a plan view showing the substrate processing unit of FIG. 6.
9 is a cross-sectional view showing an embodiment of a home port.
10 is a cross-sectional view showing the position of the nozzle of the liquid supply unit in the standby stage.
11 is a cross-sectional view showing a discharge portion of a liquid supply unit.
12 is a cross-sectional view showing the discharge state of the treatment liquid of the nozzle in the treatment liquid suction height confirmation step.
13 is a cross-sectional view showing a modification of the home port.
14 is a cross-sectional view showing another embodiment of a home port.
15 is a cross-sectional view showing the discharge state of the processing liquid of the nozzle in the step of checking the treatment liquid suction height of FIG. 14.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings has been exaggerated to emphasize a clearer explanation.

The equipment of this embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or flat panel display panel. In particular, the equipment of the present embodiment can be used to perform an application process and a development process on a substrate connected to an exposure apparatus. Hereinafter, a case where a wafer is used as a substrate will be described as an example.

Hereinafter, the substrate processing facility of the present invention will be described with reference to FIGS. 2 to 8.

FIG. 2 is a view of the substrate processing facility viewed from the top, FIG. 3 is a view of the facility of FIG. 2 viewed from the AA direction, FIG. 4 is a view of the facility of FIG. 2 viewed from the BB direction, and FIG. 5 is the facility of FIG. 2 It is a view seen from the CC direction.

2 to 5, the substrate processing facility 1 includes a load port 100, an index module 200, a first buffer module 300, a coating and developing module 400, and a second buffer module 500 ), before and after the exposure processing module 600, and the interface module 700. Load port 100, index module 200, first buffer module 300, application and development module 400, second buffer module 500, pre-exposure processing module 600, and interface module 700 Are sequentially arranged in one direction.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module ( The direction in which 700) is arranged is referred to as a first direction 12, and a direction perpendicular to the first direction 12 when viewed from the top is referred to as a second direction 14, and the first direction 12 and second The direction perpendicular to each of the directions 14 is referred to as a third direction 16.

The substrate W is moved in a state accommodated in the cassette 20. At this time, the cassette 20 has a structure that can be sealed from the outside. For example, a front open unified pod (FOUP) having a door in the front may be used as the cassette 20.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module ( 700) will be described in detail.

The load port 100 has a mounting table 120 on which the cassettes 20 on which the substrates W are placed are placed. A plurality of the mounting table 120 is provided, and the mounting tables 200 are arranged in a line along the second direction 14. In FIG. 1, four mounts 120 are provided.

The index module 200 transfers the substrate W between the cassette 20 placed on the mounting table 120 of the load port 100 and the first buffer module 300. The index module 200 has a frame 210, an index robot 220, and a guide rail 230. The frame 210 is generally provided in the shape of an empty rectangular parallelepiped, and is disposed between the load port 100 and the first buffer module 300. The frame 210 of the index module 200 may be provided at a lower height than the frame 310 of the first buffer module 300 described later. The index robot 220 and the guide rail 230 are disposed in the frame 210. The index robot 220 is driven by four axes so that the hand 221 that directly handles the substrate W can be moved and rotated in the first direction 12, the second direction 14, and the third direction 16. It has a possible structure. The index robot 220 has a hand 221, an arm 222, a support 223, and a pedestal 224. The hand 221 is fixed to the arm 222. The arm 222 is provided in a stretchable and rotatable structure. The support 223 is disposed in the longitudinal direction along the third direction (16). The arm 222 is coupled to the support 223 so as to be movable along the support 223. The support 223 is fixedly coupled to the pedestal 224. The guide rail 230 is provided so that its longitudinal direction is arranged along the second direction 14. The base 224 is coupled to the guide rail 230 so as to be able to move linearly along the guide rail 230. In addition, although not shown, the frame 210 is further provided with a door opener that opens and closes the door of the cassette 20.

The first buffer module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of an empty rectangular parallelepiped, and is disposed between the index module 200 and the coating and developing module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located in the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially arranged along the third direction 16 from below. The first buffer 320 is positioned at a height corresponding to the application module 401 of the application and development module 400 described later, and the second buffer 330 and the cooling chamber 350 are applied to the application and development module described later ( 400) is positioned at a height corresponding to the developing module 402. The first buffer robot 360 is positioned at a predetermined distance apart in the second buffer 330, the cooling chamber 350, and the first buffer 320 and the second direction 14.

The first buffer 320 and the second buffer 330 temporarily store a plurality of substrates W, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed within the housing 331 and are spaced apart from each other along the third direction 16. One substrate W is placed on each support 332. In the housing 331, the index robot 220, the first buffer robot 360, and the developing unit robot 482 of the developing module 402 described later attach the substrate W to the support 332 in the housing 331. It has an opening (not shown) in a direction in which the index robot 220 is provided, a direction in which the first buffer robot 360 is provided, and a direction in which the developing unit robot 482 is provided so as to be carried in or out. The first buffer 320 has a structure substantially similar to the second buffer 330. However, the housing 321 of the first buffer 320 has an opening in the direction in which the first buffer robot 360 is provided and in the direction in which the coating unit robot 432 located in the application module 401 described later is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different. According to an example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support 363. The hand 361 is fixed to the arm 362. The arm 362 is provided in a stretchable structure, allowing the hand 361 to move along the second direction 14. The arm 362 is coupled to the support 363 so as to be able to move linearly in the third direction 16 along the support 363. The support 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support 363 may be provided longer in the up or down direction. The first buffer robot 360 may be provided so that the hand 361 is only two-axis driving along the second direction 14 and the third direction 16.

The cooling chambers 350 cool the substrates W, respectively. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate W is placed and a cooling means 353 for cooling the substrate W. As the cooling means 353, various methods such as cooling by cooling water or cooling using a thermoelectric element may be used. Further, the cooling chamber 350 may be provided with a lift pin assembly (not shown) that positions the substrate W on the cooling plate 352. The housing 351 is provided with an index robot 220 so that the index robot 220 and the developing unit robot 482 provided in the developing module 402, which will be described later, can carry in or out the substrate W on the cooling plate 352. The provided direction and the developing part robot 482 has an opening (not shown) in the provided direction. Further, the cooling chamber 350 may be provided with doors (not shown) for opening and closing the above-described opening.

The coating and developing module 400 performs a process of applying a photoresist onto the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The coating and developing module 400 has a substantially rectangular parallelepiped shape. The application and development module 400 has an application module 401 and a development module 402. The application module 401 and the development module 402 are arranged to be divided into layers between each other. According to one example, the application module 401 is located on top of the development module 402.

The application module 401 includes a process of applying a photoresist such as photoresist to the substrate W and a heat treatment process such as heating and cooling of the substrate W before and after the resist application process. The application module 401 has an application chamber 410, a bake chamber 420, a transfer chamber 430, and a controller. The application chamber 410, the bake chamber 420, and the transfer chamber 430 are sequentially arranged along the second direction 14. Therefore, the application chamber 410 and the bake chamber 420 are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 430 therebetween. A plurality of application chambers 410 are provided, and are positioned to be stacked with each other in the third direction 16. The drawing shows an example in which three application chambers 410 are provided. A plurality of bake chambers 420 are provided in the first direction 12 and the third direction 16, respectively. The drawing shows an example in which six bake chambers 420 are provided. However, unlike this, the bake chamber 420 may be provided in a larger number.

The transfer chamber 430 is positioned side by side in the first direction 12 with the first buffer 320 of the first buffer module 300. In the transfer chamber 430, an applicator robot 432 and a guide rail 433 are positioned. The transport chamber 430 has a substantially rectangular shape. The applicator robot 432 includes the first cooling of the bake chambers 420, the application chambers 410, the first buffer 320 of the first buffer module 300, and the second buffer module 500 described later. The substrate W is transferred between the chambers 520. The guide rail 433 is arranged such that its longitudinal direction is parallel to the first direction 12. The guide rail 433 guides the applicator robot 432 to move linearly in the first direction 12. The applicator robot 432 has a hand 434, an arm 435, a support 436, and a pedestal 437. The hand 434 is fixed to the arm 435. The arm 435 is provided in a stretchable structure so that the hand 434 is movable in the horizontal direction. The support 436 is provided so that its longitudinal direction is arranged along the third direction 16. The arm 435 is coupled to the support 436 such that it can move linearly in the third direction 16 along the support 436. The support 436 is fixedly coupled to the pedestal 437, and the pedestal 437 is coupled to the guide rail 433 so as to be movable along the guide rail 433.

All of the application chambers 410 have the same structure. However, the types of photoresist used in each application chamber 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist. FIG. 6 is a plan view showing the application chamber of FIG. 2, and FIG. 7 is a sectional view showing the application unit of FIG. 6. 6 and 7, the application chamber 410 is provided as a rectangular cylindrical housing 810 having a space 812 therein. An opening (not shown) is formed on one side of the housing 810. The opening functions as an entrance through which the substrate W is carried in and out. A door is installed in the opening, and the door opens and closes the opening. When the substrate processing process is performed, the door closes the opening to seal the interior space 812 of the housing 810.

The housing 810 has an interior space 812 in which the substrate processing unit 800 is located. A plurality of substrate processing units 800 are positioned in the interior space 812. Each substrate processing unit 800 performs an application process for applying a treatment liquid such as a photosensitive liquid on the substrate. The substrate processing units may be sequentially arranged along the first direction 12. For example, three substrate processing units may be located in the housing 810. Each substrate processing unit includes a substrate support unit 830, a processing container 850, and a fan filter unit 820 lifting unit 890.

The substrate support unit 830 supports the substrate W in the inner space of the housing 810. The substrate support unit 830 rotates the substrate W. The substrate support unit 830 includes a spin chuck 832, a rotation shaft 834, and a driver 836. The spin chuck 832 is provided as a substrate support member 832 for supporting the substrate. The spin chuck 832 is provided to have a circular plate shape. The substrate W contacts the upper surface of the spin chuck 832. The spin chuck 832 is provided to have a smaller diameter than the substrate W. According to an example, the spin chuck 832 may vacuum the substrate W to chuck the substrate W. Optionally, the spin chuck 832 may be provided as an electrostatic chuck for chucking the substrate W using static electricity. Also, the spin chuck 832 may chuck the substrate W by physical force.

The rotation shaft 834 and the driver 836 are provided as rotation drive members 834 and 836 that rotate the spin chuck 832. The rotating shaft 834 supports the spin chuck 832 below the spin chuck 832. The rotation shaft 834 is provided so that its longitudinal direction is directed upward and downward. The rotation shaft 834 is provided to be rotatable about its central axis. The driver 836 provides a driving force so that the rotating shaft 834 is rotated. For example, the driver 836 may be a motor capable of varying the rotational speed of the rotating shaft.

The processing vessel 850 is located in the interior space 812 of the housing 810. The processing container 850 is provided to have a cup shape with an open top. The processing container 850 provides a processing space therein. The processing container 850 is provided to surround the substrate support unit 830. That is, the substrate support unit 830 is located in the processing space. The processing container 850 includes an outer cup 862 and an inner cup 852. The outer cup 862 is provided to surround the periphery of the substrate support unit 830, and the inner cup 852 is located inside the outer cup 862. Each of the outer cup 862 and the inner cup 852 is provided in an annular ring shape. The space between the outer cup 862 and the inner cup 852 functions as a recovery path 851 in which the liquid is recovered.

The inner cup 852 is provided in a circular plate shape surrounding the rotating shaft 834. When viewed from the top, the inner cup 852 is positioned to overlap the exhaust port 814. The inner cup has an inner portion and an outer portion. The upper surface of each of the inner portion and the outer portion is provided to be inclined at different angles from each other. When viewed from the top, the inner part is positioned to overlap the spin chuck. The inner portion is positioned facing the rotating shaft 836. The inner part faces upward inclined direction as it moves away from the rotation axis 836, and the outer part extends outward from the inner part. The outer part is directed toward a downward inclined direction as it moves away from the rotation axis 836. The upper end of the inner portion may coincide with the side end portion of the substrate W in the vertical direction. According to an example, the point where the outer portion meets the inner portion may be a lower position than the upper end of the inner portion. The point where the inner part and the outer part meet each other may be provided to be rounded. The outer portion may be combined with the outer cup 862 to form a recovery path 851 through which the treatment liquid is recovered.

The outer cup 862 is provided to have a cup shape surrounding the substrate support unit 830 and the inner cup 852. The outer cup 862 has a bottom portion 864, a side portion 866, and an inclined portion 870. The bottom portion 864 is provided to have a circular plate shape having a hollow. A recovery line 865 is connected to the bottom portion 864. The recovery line 865 recovers the processing liquid supplied on the substrate W. The treatment liquid recovered by the recovery line 865 can be reused by an external liquid regeneration system. The side portion 866 is provided to have an annular ring shape surrounding the substrate support unit 830. The side portion 866 extends in a vertical direction from the side end of the bottom portion 864. Side 866 extends upward from bottom 864.

The inclined portion 870 extends from the top of the side portion 866 toward the central axis of the outer cup 862. The inner surface 870a of the inclined portion 870 is provided to be inclined upward so as to approach the substrate support unit 830. The inclined portion 870 is provided to have a ring shape. During the liquid processing process of the substrate, the upper end of the inclined portion 870 is positioned higher than the substrate W supported by the substrate support unit 830.

The fan filter unit 820 is installed on the ceiling surface of the housing 810 to face the processing space. The fan filter unit 820 supplies clean air to a plurality of substrate processing units. The fan filter unit 820 forms a downdraft in the processing space of each of the substrate processing units.

The lifting unit 890 moves the inner cup 852 and the outer cup 862 respectively. The lifting unit 890 includes an inner moving member 892 and an outer moving member 894. The inner moving member 892 moves the inner cup 852 up and down, and the outer moving member 894 moves the outer cup 862 up and down.

The liquid supply unit 840 supplies a processing liquid and a free wet liquid on the substrate W. The liquid supply unit 840 includes a guide rail 846, an arm 848, a free wet nozzle 842, a processing nozzle 844, and a lifting shaft (not shown). The nozzle moving member 841 includes a guide rail 846 for moving the arm 848 in the horizontal direction, and a lifting shaft (not shown). The guide rail 846 is located on one side of the processing container 850. The guide rail 846 is provided so that its longitudinal direction faces the horizontal direction. According to an example, the longitudinal direction of the guide rail 846 may be provided to face a direction parallel to the first direction. The guide rail 846 is provided with a lifting shaft (not shown). The lifting shaft (not shown) may be moved by a linear motor provided inside the guide rail 846. The arm 848 is provided to face the longitudinal direction perpendicular to the guide rail 846 when viewed from the top. One end of the arm 848 is mounted on a lifting shaft (not shown). A free wet nozzle 842 and a processing nozzle 844 are respectively provided on the bottom surface of the other end of the arm 848. When viewed from the top, the free wet nozzle 842 and the processing nozzle 844 are arranged in a direction parallel to the longitudinal direction of the guide rail 846. Optionally, a plurality of arms 848 are provided, and each of the arms 848 may be provided with a free wet nozzle 842 and a processing nozzle 844. In addition, the arm 848 may be rotated by being coupled to a rotation axis whose longitudinal direction is toward the third direction. The arm 848 installed on the lifting shaft (not shown) and the nozzle 892 mounted thereto are movable to a process position and a standby position by a linear motor provided inside the guide rail 894.

The pre-wet nozzle 842 supplies a pre-wet liquid on the substrate W, and the processing nozzle 844 supplies a treatment liquid on the substrate W. For example, the free wet liquid may be a liquid capable of changing the surface properties of the substrate W. The free wet liquid can change the surface of the substrate W to hydrophobic properties. The pre-wet liquid is thinner, and the treatment liquid may be a photosensitive liquid such as photoresist.

Referring to FIG. 11, a discharge portion 888 is provided inside the processing nozzle 844. A pump 889 is coupled to one side of the discharge part 888. The pump 889 sucks the inside of the discharge portion 888. The discharge part 888 is provided with a transparent material, and the suction state can be visually confirmed.

Next, an embodiment of the home port 900 will be described with reference to FIGS. 8 and 9.

Referring to FIG. 8, the home port 900 is disposed on one side of the substrate processing unit 800. The arm 848 of the liquid supply unit 840 may be located on the top of the home port 900 and the substrate processing unit 800 along the guide rail 846.

Referring to FIG. 9, the home port 900 is provided as a place where the nozzle 844 waits. The home port 900 includes a body 910, a cover 920, and a controller 1000.

The body 910 has an interior space 911 with an open top. The interior space may be filled with a certain amount of solvent. The solvent may be Thinner. The nozzle 844 waiting in the home port 900 may discharge the treatment liquid at regular intervals into the interior space 911. In addition, the body 910 may include a discharge pipe capable of discharging the treatment liquid discharged from the nozzle 844 to the outside.

The cover 920 covers the upper portion of the inner space 911 of the body 910. The cover 920 prevents the processing liquid from jumping out of the home port 900 when the nozzle 892 discharges the processing liquid into the interior space 911. In addition, the cover allows the interior space to be maintained in a solvent atmosphere. A first opening 921 and a second opening 922 are formed in the cover 920. The first opening 921 and the second opening 922 communicate with the inner space 911 of the body 910. When the nozzle 844 waits in the home port 900, it is inserted into the interior space 911 through the first opening 921. When the nozzle 892 is located above the home port 910 to discharge the treatment liquid into the interior space 911, the treatment liquid is discharged into the interior space through the second opening 922.

The controller 1000 controls the nozzle moving member 893. The controller 1000 allows the nozzle 892 to be inserted into the interior space 911 through the first opening 921 when the nozzle 892 waits within the home port 900. The controller 1000 controls the linear motor such that the nozzle moves along the guide rail 846 and is positioned on the first opening 921. Then, the lifting shaft (not shown) is lowered to allow the nozzle 844 to be inserted into the first opening 921 into the interior space 911. In addition, when the nozzle 844 is located at the upper portion of the home port 900 to discharge the treatment liquid to the interior space 911, the nozzle moving member 841 is controlled to discharge the treatment liquid to the interior space through the second opening. . The controller 1000 controls the nozzle 844 to be positioned above the second opening 922 by driving a linear motor installed inside the guide rail 846.

10 to 12, a method for checking the suction height of the treatment liquid in the maintenance step will be described. The substrate processing method includes a liquid processing step and a maintenance step. In the liquid processing step, when the substrate is brought into the processing unit, the liquid is discharged, then moved to the home port, and waits until the next substrate is carried. In the maintenance phase, the condition of the nozzle is checked.

Referring to FIG. 10, the nozzle 844 of the liquid supply unit 840 is inserted into the first opening 921 of the home port 900 in the standby stage. In the state inserted into the first opening 921, the nozzle 844 discharges the processing liquid at a predetermined time interval to the interior space 911. This prevents the treatment liquid from adhering in the nozzle 844.

Referring to FIG. 11, a pump 889 is coupled to one side of the discharge part 888. When the nozzle 892 moves to the top of the substrate to perform the process, the pump 889 sucks the interior of the discharge portion 888. This is to prevent the processing liquid in the nozzle 844 from falling during the movement of the nozzle 844. The pump 889 sucks the discharge portion 888 in the nozzle to move the processing liquid by a predetermined distance (a). In the maintenance step, the state of the nozzle 844 is checked. At this time, it is checked whether the suction height of the treatment liquid coincides with the set distance (a).

Referring to FIG. 12, the nozzle 844 discharges the processing liquid from the top of the home port 900 to the interior space 911 of the home port 900. This is to check the suction height of the treatment liquid in the discharge portion (888). In addition, discharge of the processing liquid is discharged through the second opening 922. Thereafter, the pump 889 coupled to one side of the discharge portion 888 sucks the inside of the discharge portion 888 to move the treatment liquid, and checks the suction height of the treatment liquid. Checking the suction height of the treatment liquid is performed at the maintenance stage.

Next, a modified example of the substrate processing apparatus of FIG. 9 will be described with reference to FIG. 13.

The home port 900 may further include a home port moving member 950.

The home port moving member 950 is engaged with the body 910 of the home port 900 to move the position of the home port 900. The home port moving member 950 may be a member that provides driving force. For example, the home port moving member 950 may be a cylinder or a motor. The home port moving member 950 may include a guide rail.

The controller 1000 may control the home port moving member 950 and the nozzle moving member 841. The controller 1000 allows the nozzle 844 to be inserted into the interior space 911 through the first opening 921 when the nozzle 844 waits in the home port 900. The controller 1000 controls the home port moving member 950 to provide a driving force so that the nozzle 844 can be positioned above the first opening 921. Thereafter, the lifting shaft 895 is lowered to allow the nozzle 844 to be inserted into the first opening 921 into the interior space 911. In addition, the nozzle 844 is located at the top of the home port 900 to control the nozzle moving member 841 to discharge through the second opening when discharging the treatment liquid into the interior space 911. The controller 1000 provides a driving force to the linear motor of the guide rail 846 to control the nozzle 844 to be positioned on the second opening 922.

Next, another embodiment of the home port 900a will be described with reference to FIG. 14.

The home port 900a includes a body 910a, a cover 920a, a liquid receiving member 960, a liquid receiving moving member 961, and a controller 1000a. The home port 900a is disposed on one side of the substrate processing unit 800.

The body 910a has an interior space 911a with an open top. The nozzle 892 waiting in the home port 900a may discharge the treatment liquid into the internal space 911a at regular time intervals. In addition, the body 910a may include a discharge pipe capable of discharging the treatment liquid discharged from the nozzle 892 to the outside.

The cover 920a covers the upper portion of the inner space 911a of the body 910a. The cover 920a prevents the processing liquid from jumping out of the home port 900a when the nozzle 844 discharges the processing liquid into the interior space 911a. In addition, the cover allows the interior space to be maintained in a solvent atmosphere. An opening 921a is formed in the cover 920a. The opening 921a communicates with the interior space 911a of the body 910a. When the nozzle 844 waits in the home port 900a, it is inserted into the inner space 911a through the opening 921a.

The liquid receiving member 960 has a receiving space 963 for receiving the treatment liquid. The liquid receiving member receives the treatment liquid discharged from the nozzle when discharging the treatment liquid to examine the discharge state of the nozzle 892 or the suction state of the treatment liquid into the nozzle 892.

The liquid receiving member 961 is engaged with the liquid receiving member 960 to move the position of the liquid receiving member 960. For example, the liquid receiving movement member 961 may be a cylinder or a motor. The liquid receiving movement member 961 may include a guide rail.

The controller 1000a may control the liquid receiving movement member 961. The controller 1000a controls the liquid receiving member 961 so that the receiving space 963 is positioned above the home port 900a when the liquid receiving member 960 discharges the processing liquid from the nozzle 844. . During movement such that the nozzle 892 is positioned in the interior space 911a, the liquid receiving member 961 is controlled so that the liquid receiving member 960 can be moved to a position that does not interfere with the movement of the nozzle 892.

Referring to FIG. 14, in the nozzle for supplying the processing liquid, the nozzle 844 discharges the processing liquid from the upper portion of the home port 900a. This is to check the distance the processing liquid has moved in the discharge portion 888. When the liquid receiving member 960 discharges the nozzle 844 for supplying the processing liquid, the receiving space 963 of the liquid receiving member 960 is positioned above the home port 900a. The nozzle 844 discharges the processing liquid toward the accommodation space 963 of the liquid receiving member 960. Thereafter, the pump 889 coupled to one side of the discharge portion 888 sucks the inside of the discharge portion 888 to move the treatment liquid, and checks the suction height of the treatment liquid. During movement such that the nozzle 844 is located in the inner space 911a, the liquid receiving member 960 moves the liquid receiving member 960 to a position that does not interfere with the movement of the nozzle 892. The suction height of the treatment liquid is checked in the maintenance step. In addition, after the processing liquid is discharged to the substrate from the substrate processing unit 800, the nozzle 844 is waiting in the interior space 911a before the next substrate is brought into the substrate processing unit 800.

2 to 5 again, the bake chamber 420 heat-treats the substrate W. For example, the bake chambers 420 may include a pre-bake process or photoresist that removes organic substances or moisture on the surface of the substrate W by heating the substrate W to a predetermined temperature before applying the photoresist. W) performs a soft bake process or the like performed after coating on the substrate, and performs a cooling process or the like to cool the substrate W after each heating process. The baking chamber 420 has a cooling plate 421 or a heating plate 422. The cooling plate 421 is provided with cooling means 423 such as cooling water or a thermoelectric element. In addition, the heating plate 422 is provided with heating means 424 such as a hot wire or a thermoelectric element. The cooling plate 421 and the heating plate 422 may be provided in one bake chamber 420, respectively. Optionally, some of the bake chambers 420 may have only the cooling plate 421, and other portions may have only the heating plate 422.

The developing module 402 supplies a developer to obtain a pattern on the substrate W to remove a portion of the photoresist, and a heat treatment process such as heating and cooling performed on the substrate W before and after the development process It includes. The developing module 402 has a developing chamber 460, a bake chamber 470, and a transfer chamber 480. The developing chamber 460, the bake chamber 470, and the transfer chamber 480 are sequentially arranged along the second direction 14. Therefore, the development chamber 460 and the bake chamber 470 are spaced apart from each other in the second direction 14 with the transfer chamber 480 therebetween. A plurality of developing chambers 460 are provided, and a plurality of each is provided in the first direction 12 and the third direction 16. The drawing shows an example in which six developing chambers 460 are provided. A plurality of bake chambers 470 are provided in the first direction 12 and the third direction 16, respectively. The drawing shows an example in which six bake chambers 470 are provided. However, unlike this, the bake chamber 470 may be provided in a larger number.

The transfer chamber 480 is positioned side by side in the first direction 12 with the second buffer 330 of the first buffer module 300. The developer robot 482 and the guide rail 483 are located in the transfer chamber 480. The transport chamber 480 has a substantially rectangular shape. The developing unit robot 482 includes the bake chambers 470, the developing chambers 460, the second buffer 330 and the cooling chamber 350 of the first buffer module 300, and the second buffer module 500. The substrate W is transferred between the second cooling chambers 540. The guide rail 483 is arranged such that its longitudinal direction is parallel to the first direction 12. The guide rail 483 guides the developing robot 482 to move linearly in the first direction 12. The developing unit robot 482 has a hand 484, an arm 485, a support 486, and a support 487. The hand 484 is fixed to the arm 485. The arm 485 is provided in a stretchable structure so that the hand 484 is movable in the horizontal direction. The support 486 is provided so that its longitudinal direction is arranged along the third direction 16. The arm 485 is coupled to the support 486 such that it can move linearly in the third direction 16 along the support 486. The support 486 is fixedly coupled to the pedestal 487. The pedestal 487 is coupled to the guide rail 483 so as to be movable along the guide rail 483.

The developing chambers 460 all have the same structure. However, the types of the developer used in each developing chamber 460 may be different from each other. The development chamber 460 removes a region irradiated with light among photoresists on the substrate W. At this time, the light-irradiated region of the protective film is also removed. Depending on the type of the photoresist used selectively, only the region of the photoresist and the protective film that has not been irradiated can be removed.

The development chamber 460 has a housing 461, a support plate 462, and a nozzle 463. The housing 461 has a cup shape with an open top. The support plate 462 is located in the housing 461 and supports the substrate W. The support plate 462 is provided rotatably. The nozzle 463 supplies the developer onto the substrate W placed on the support plate 462. The nozzle 463 has a circular tube shape and can supply a developer to the center of the substrate W. Optionally, the nozzle 463 has a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 463 may be provided as a slit. In addition, a nozzle 464 for supplying a cleaning solution such as deionized water may be further provided in the developing chamber 460 to clean the surface of the substrate W supplied with the developer.

The baking chamber 470 of the developing module 402 heat-treats the substrate W. For example, the bake chambers 470 include a post-baking process for heating the substrate W before the development process is performed, and a hard bake process for heating the substrate W after the development process is performed, and heating after each baking process. A cooling process for cooling the substrate W is performed. The baking chamber 470 has a cooling plate 471 or a heating plate 472. The cooling plate 471 is provided with cooling means 473 such as cooling water or thermoelectric elements. Alternatively, the heating plate 472 is provided with heating means 474, such as a hot wire or thermoelectric element. The cooling plate 471 and the heating plate 472 may be provided in one bake chamber 470, respectively. Optionally, some of the bake chambers 470 may have only the cooling plate 471, and other portions may have only the heating plate 472.

The second buffer module 500 is provided as a passage through which the substrate W is transported between the coating and developing module 400 and the pre-exposure processing module 600. Further, the second buffer module 500 performs a predetermined process, such as a cooling process or an edge exposure process, on the substrate W. The second buffer module 500 includes a frame 510, a buffer 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560. Have The frame 510 has a rectangular parallelepiped shape. The buffer 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560 are located in the frame 510. The buffer 520, the first cooling chamber 530, and the edge exposure chamber 550 are disposed at a height corresponding to the application module 401. The second cooling chamber 540 is disposed at a height corresponding to the developing module 402. The buffer 520, the first cooling chamber 530, and the second cooling chamber 540 are sequentially arranged in a line along the third direction 16. When viewed from the top, the buffer 520 is disposed along the transfer chamber 430 of the application module 401 and the first direction 12. The edge exposure chamber 550 is disposed to be spaced a predetermined distance in the second direction 14 from the buffer 520 or the first cooling chamber 530.

The second buffer robot 560 transports the substrate W between the buffer 520, the first cooling chamber 530, and the edge exposure chamber 550. The second buffer robot 560 is positioned between the edge exposure chamber 550 and the buffer 520. The second buffer robot 560 may be provided with a structure similar to the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform a subsequent process on the substrates W on which the process was performed in the application module 401. The first cooling chamber 530 cools the substrate W on which the process has been performed in the application module 401. The first cooling chamber 530 has a structure similar to the cooling chamber 350 of the first buffer module 300. The edge exposure chamber 550 exposes its edges to the substrates W on which the cooling process is performed in the first cooling chamber 530. The buffer 520 temporarily stores the substrate W before the substrates W processed by the edge exposure chamber 550 are transferred to the pre-processing module 601 described below. The second cooling chamber 540 cools the substrates W before the substrates W having been processed in the post-processing module 602 described below are transferred to the developing module 402. The second buffer module 500 may further have a buffer added to a height corresponding to the developing module 402. In this case, the substrates W processed in the post-processing module 602 may be temporarily stored in the added buffer and then transferred to the developing module 402.

Before and after the exposure processing module 600, when the exposure apparatus 900 performs an immersion exposure process, a process of applying a protective film that protects the photoresist film applied to the substrate W at the time of immersion exposure may be processed. In addition, the pre- and post-exposure processing module 600 may perform a process of cleaning the substrate W after exposure. In addition, when the coating process is performed using a chemically amplified resist, the pre-exposure processing module 600 may process the bake process after exposure.

The pre-exposure processing module 600 has a pre-processing module 601 and a post-processing module 602. The pre-processing module 601 performs a process of processing the substrate W before performing the exposure process, and the post-processing module 602 performs a process of processing the substrate W after the exposure process. The pre-processing module 601 and the post-processing module 602 are arranged to be divided into layers between each other. According to one example, the pre-processing module 601 is located above the post-processing module 602. The pretreatment module 601 is provided at the same height as the application module 401. The post-processing module 602 is provided at the same height as the developing module 402. The pretreatment module 601 has a protective film application chamber 610, a bake chamber 620, and a transfer chamber 630. The protective film application chamber 610, the transfer chamber 630, and the bake chamber 620 are sequentially arranged along the second direction 14. Therefore, the protective film coating chamber 610 and the baking chamber 620 are spaced apart from each other in the second direction 14 with the transfer chamber 630 therebetween. A plurality of protective film coating chambers 610 are provided, and are disposed along the third direction 16 to form a layer with each other. Optionally, a plurality of protective film application chambers 610 may be provided in each of the first direction 12 and the third direction 16. A plurality of bake chambers 620 are provided, and are disposed along the third direction 16 to form a layer with each other. Optionally, a plurality of bake chambers 620 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 630 is positioned side by side in the first direction 12 with the first cooling chamber 530 of the second buffer module 500. The pretreatment robot 632 is located in the transfer chamber 630. The transport chamber 630 has a generally square or rectangular shape. The pre-processing robot 632 is provided between the protective film application chambers 610, the bake chambers 620, the buffer 520 of the second buffer module 500, and the first buffer 720 of the interface module 700 to be described later. The substrate W is transferred. The pre-processing robot 632 has a hand 633, an arm 634, and a support 635. The hand 633 is fixed to the arm 634. The arm 634 is provided in a stretchable and rotatable structure. The arm 634 is coupled to the support 635 such that it can move linearly in the third direction 16 along the support 635.

The protective film coating chamber 610 applies a protective film protecting the resist film on the substrate W during liquid immersion exposure. The protective film application chamber 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 has a cup shape with an open top. The support plate 612 is located in the housing 611 and supports the substrate W. The support plate 612 is rotatably provided. The nozzle 613 supplies a protective liquid for forming a protective film onto the substrate W placed on the support plate 612. The nozzle 613 has a circular tube shape and can supply a protective liquid to the center of the substrate W. Optionally, the nozzle 613 has a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 613 may be provided as a slit. In this case, the support plate 612 may be provided in a fixed state. The protective liquid contains a foamable material. As the protective liquid, a material having a low affinity with photoresist and water may be used. For example, the protective liquid may contain a fluorine-based solvent. The protective film coating chamber 610 supplies the protective liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 612.

The baking chamber 620 heat-treats the substrate W coated with the protective film. The baking chamber 620 has a cooling plate 621 or a heating plate 622. The cooling plate 621 is provided with cooling means 623 such as cooling water or a thermoelectric element. Alternatively, the heating plate 622 is provided with heating means 624 such as a hot wire or a thermoelectric element. The heating plate 622 and the cooling plate 621 may be provided in one bake chamber 620, respectively. Optionally, some of the bake chambers 620 may include only the heating plate 622, and other portions may include only the cooling plate 621.

The post-processing module 602 has a cleaning chamber 660, a post-exposure bake chamber 670, and a transfer chamber 680. The cleaning chamber 660, the transfer chamber 680, and the bake chamber 670 after exposure are sequentially arranged along the second direction 14. Therefore, the cleaning chamber 660 and the bake chamber 670 after exposure are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 680 therebetween. A plurality of cleaning chambers 660 are provided, and may be disposed along the third direction 16 to form layers with each other. Optionally, a plurality of cleaning chambers 660 may be provided in the first direction 12 and the third direction 16, respectively. After exposure, a plurality of bake chambers 670 are provided, and may be disposed along the third direction 16 to form a layer with each other. Optionally, a plurality of bake chambers 670 may be provided in the first direction 12 and the third direction 16 after exposure.

The transfer chamber 680 is positioned side by side in the first direction 12 with the second cooling chamber 540 of the second buffer module 500 when viewed from the top. The transport chamber 680 has a generally square or rectangular shape. A post-processing robot 682 is located in the transfer chamber 680. The post-processing robot 682 includes cleaning chambers 660, post-exposure bake chambers 670, a second cooling chamber 540 of the second buffer module 500, and a second of the interface module 700 described below. The substrate W is transported between the buffers 730. The post-processing robot 682 provided in the post-processing module 602 may be provided with the same structure as the pre-processing robot 632 provided in the pre-processing module 601.

The cleaning chamber 660 cleans the substrate W after the exposure process. The cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. The housing 661 has a cup shape with an open top. The support plate 662 is located in the housing 661 and supports the substrate W. The support plate 662 is rotatably provided. The nozzle 663 supplies the cleaning liquid onto the substrate W placed on the support plate 662. Water such as deionized water may be used as the cleaning solution. The cleaning chamber 660 supplies cleaning liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 662. Optionally, while the substrate W is rotated, the nozzle 663 may move linearly or rotationally from the center region of the substrate W to the edge region.

After exposure, the bake chamber 670 heats the substrate W on which the exposure process has been performed using far ultraviolet rays. The post-exposure bake process heats the substrate W to amplify the acid generated in the photoresist by exposure to complete the change in the properties of the photoresist. After exposure, the bake chamber 670 has a heating plate 672. The heating plate 672 is provided with heating means 674, such as a hot wire or thermoelectric element. After exposure, the bake chamber 670 may further include a cooling plate 671 therein. The cooling plate 671 is provided with cooling means 673, such as cooling water or a thermoelectric element. Also, a baking chamber with only the cooling plate 671 can be further provided.

As described above, in the pre- and post-exposure processing module 600, the pre-processing module 601 and the post-processing module 602 are provided to be completely separated from each other. In addition, the transfer chamber 630 of the pre-processing module 601 and the transfer chamber 680 of the post-processing module 602 are provided with the same size, and may be provided to completely overlap each other when viewed from the top. In addition, the protective film coating chamber 610 and the cleaning chamber 660 may be provided with the same size as each other, so that they can be completely overlapped with each other when viewed from the top. In addition, the bake chamber 620 and the bake chamber 670 after exposure are provided with the same size, and may be provided to completely overlap each other when viewed from the top.

The interface module 700 transfers the substrate W between the pre- and post-exposure processing modules 600 and the exposure apparatus 900. The interface module 700 has a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, the second buffer 730, and the interface robot 740 are located in the frame 710. The first buffer 720 and the second buffer 730 are spaced apart from each other by a predetermined distance, and are disposed to be stacked with each other. The first buffer 720 is disposed higher than the second buffer 730. The first buffer 720 is positioned at a height corresponding to the pre-processing module 601, and the second buffer 730 is positioned at a height corresponding to the post-processing module 602. When viewed from the top, the first buffer 720 is arranged in line along the first chamber 12 and the transfer chamber 630 of the pre-processing module 601, and the second buffer 730 is a post-processing module 602 It is positioned to be arranged in a line along the transport chamber 630 and the first direction (12).

The interface robot 740 is spaced apart from the first buffer 720 and the second buffer 730 and the second direction 14. The interface robot 740 transports the substrate W between the first buffer 720, the second buffer 730, and the exposure apparatus 900. The interface robot 740 has a structure substantially similar to the second buffer robot 560.

The first buffer 720 temporarily stores the substrates W having been processed in the pre-processing module 601 before they are moved to the exposure apparatus 900. In addition, the second buffer 730 temporarily stores the substrates W having been processed in the exposure apparatus 900 before they are moved to the post-processing module 602. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed in the housing 721 and are provided spaced apart from each other along the third direction 16. One substrate W is placed on each support 722. The housing 721 is provided with an interface robot 740 and a pre-processing robot provided with an interface robot 740 to allow the interface robot 740 and the pre-processing robot 632 to carry or carry the substrate W into the support 722 into the housing 721 ( 632) has an opening (not shown) in the direction provided. The second buffer 730 has a structure substantially similar to the first buffer 720. However, the housing 4531 of the second buffer 730 has an opening (not shown) in the direction in which the interface robot 740 is provided and in the direction in which the post-processing robot 682 is provided. As described above, only the buffers and the robot may be provided in the interface module without providing a chamber that performs a predetermined process on the substrate.

800: substrate processing unit 840: liquid supply unit
900: Home port 910: Body
920: cover 921: first opening
922: second opening 960: no sum tray

Claims (19)

In the apparatus for processing a substrate,
A substrate processing unit having a substrate support member supporting a substrate;
A nozzle that supplies a processing liquid to the substrate;
A home port disposed on one side of the substrate processing unit;
Including a controller,
The device,
And at least one of a nozzle moving member moving the nozzle between the substrate processing unit and the home port and a home port moving member moving the position of the home port,
In the home port,
The first opening and the second opening are formed at different positions from the first opening,
The controller,
In the step of liquid-processing the substrate, when the nozzle is in standby, the nozzle is inserted into the first opening,
When discharging the processing liquid in order to inspect the state of the nozzle, the nozzle moving member and the home port are moved such that the nozzle is located above the groove port to discharge the processing liquid into the interior space through the second opening. A substrate processing apparatus that controls at least one of the members. According to claim 1,
The home port,
A body having an interior space with an open top;
It includes a cover for blocking the interior space,
On the cover,
A substrate processing apparatus in which the first opening and the second opening are formed. According to claim 2,
The home port moving member is a substrate processing apparatus coupled to the body. The method according to any one of claims 1 to 3,
After the nozzle discharges the processing liquid through the second opening, the nozzle is provided with a transparent material so that the processing liquid is sucked into the nozzle at a predetermined distance and the distance at which the processing liquid is sucked can be checked. The method according to any one of claims 1 to 3,
The processing liquid is a photosensitive liquid substrate processing apparatus. In the apparatus for processing a substrate,
A substrate processing unit having a substrate support member supporting a substrate;
A nozzle that supplies a processing liquid to the substrate;
A home port disposed on one side of the substrate processing unit and having an internal space where the nozzle waits;
A liquid supply unit having a nozzle moving member for moving the nozzle between the processing unit and the home port,
And a liquid receiving member having a receiving space for receiving the treatment liquid discharged from the nozzle when discharging the treatment liquid to inspect the state of the nozzle. The method of claim 6,
The state of the nozzle is a substrate processing apparatus including a discharge state of a processing liquid discharged from the nozzle or a suction state of a processing liquid into the nozzle. The method of claim 7,
A liquid receiving moving member coupled to the liquid receiving member to move a position of the liquid receiving member; Further comprising a controller for controlling the liquid receiving member,
The controller,
When the liquid receiving member discharges the processing liquid from the nozzle, the receiving space is located on the upper portion of the home port,
A substrate processing apparatus for moving the liquid receiving member to a position where the liquid receiving member does not interfere with the movement of the nozzle during movement such that the nozzle is located in the interior space. The method according to any one of claims 6 to 8,
The processing liquid is a photosensitive liquid substrate processing apparatus. In the method of processing the substrate,
A first opening and a second opening communicating with the interior space of the home port are provided on the upper surface of the home port,
When the nozzle waits in the home port from the nozzle that supplies the processing liquid, it is inserted through the first opening,
A substrate processing method of discharging through the second opening when discharging the processing liquid from the upper portion of the groove port to the internal space of the groove port to inspect the state of the nozzle . In the method of processing the substrate,
A first opening and a second opening communicating with the interior space of the home port are provided on the upper surface of the home port,
When the nozzle waits in the home port from the nozzle that supplies the processing liquid, it is inserted through the first opening,
When discharging the processing liquid from the upper portion of the home port to the interior space of the home port, discharge through the second opening,
After discharging the processing liquid through the second opening, the inside of the nozzle is sucked to move the processing liquid within a predetermined distance within the nozzle, and a substrate processing method for checking the suction height of the processing liquid. The method of claim 11,
The nozzle, the discharge portion is provided with a transparent material, the substrate processing method of checking the suction height of the processing liquid is made from the outside of the nozzle. The method of claim 12,
Checking the suction height of the treatment liquid is made in the maintenance step,
A substrate processing method in which the nozzle waits in the interior space after discharging the processing liquid to the substrate from the substrate processing unit and before the next substrate is brought into the processing unit. The method according to any one of claims 10 to 13,
The processing liquid is a photosensitive liquid substrate processing method. In the method of processing the substrate,
Process to discharge the processing liquid from the nozzle to the substrate,
A substrate processing method for discharging the processing liquid into the receiving space of the liquid receiving member when the nozzle waits during the process of the substrates and waits within the internal space in the home port, and when inspecting the state of the nozzle after discharging the processing liquid . The method of claim 15,
When the nozzle waits in the internal space in the home port, the liquid receiving member is positioned so that the nozzle does not interfere with the movement to the internal space, and when discharging the liquid to check the condition of the nozzle, the liquid receiving The member is a substrate processing method in which the accommodation space is located above the groove port. The method of claim 16,
The state inspection of the nozzle includes a suction state of the processing liquid that sucks the inside of the nozzle to move the processing liquid by a predetermined distance and checks the suction height of the processing liquid. The method of claim 17,
The nozzle, the discharge portion is provided with a transparent material, the substrate processing method of checking the suction height of the processing liquid is made from the outside of the nozzle. The method according to any one of claims 15 to 18,
The processing liquid is a photosensitive liquid substrate processing method.

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